High-precision plate planting equipment

Abstract

The application relates to the technical field of FPC production equipment, and discloses a high-precision plate planting device which comprises a feeding mechanism, a carrier transfer mechanism, a plate planting mechanism and a cover placing mechanism. The feeding mechanism is used for supplying flexible circuit boards to be planted; and the carrier transfer mechanism is used for transferring carrier substrates to be planted. A plurality of independent vacuum suction heads are embedded on a carrier transfer platform in the carrier transfer mechanism for carrying the carrier substrates. The plurality of vacuum suction heads are one-to-one corresponding to a plurality of plate planting positions on the carrier substrates. The plate planting mechanism is used for planting the flexible circuit boards supplied by the feeding mechanism on the carrier substrates on the carrier transfer mechanism. The cover placing mechanism is used for supplying carrier covers and placing the carrier covers on the carrier substrates on which the plate planting is completed in the carrier transfer mechanism. The high-precision plate planting device can reduce the production cost of users, and improve the yield and production efficiency of products.

Description

Technical Field

[0001] This invention relates to the field of FPC production equipment technology, specifically to a high-precision board planting device. Background Technology

[0002] In some manufacturing processes of flexible printed circuit boards (FPCs), ensuring the flatness and rigidity of the FPCs is crucial, such as surface mount technology (SMT), chip mounting, solder paste printing, and reflow soldering. Therefore, before these processes, FPCs need to be implanted onto a carrier substrate using a board placement machine to secure them and provide sufficient rigidity. Existing board placement equipment requires pre-applying high-temperature tape to the carrier substrate to fix the FPCs, necessitating additional tape application and removal machines. Furthermore, the carrier substrates cannot be directly recycled after use, requiring users to prepare more substrates to ensure efficient turnover, increasing production costs. Moreover, existing board placement equipment requires manual application of cover plates after placement, which results in inconsistent application and can easily damage the FPCs. Existing equipment also lacks a protective film removal function; when incoming materials come with a protective film, it must be manually removed beforehand, impacting production efficiency and potentially contaminating the FPCs during the removal process. Summary of the Invention

[0003] To overcome the shortcomings of existing technologies, the present invention aims to provide a high-precision board implantation device. This device uses vacuum adsorption to assisted in fixing and implanting flexible circuit boards onto a carrier substrate, eliminating the need for users to prepare additional tape applicators and tape removers. Furthermore, the carrier substrates can be directly recycled after use, reducing the number of carrier substrates required and lowering production costs. Simultaneously, a cover plate can be automatically installed after implantation, ensuring consistent cover plate positioning and preventing damage to the flexible circuit board caused by inconsistent manual cover plate installation.

[0004] To solve the above problems, the technical solution adopted by the present invention is as follows: a high-precision board planting device, comprising: a feeding mechanism for supplying flexible circuit boards to be planted; a carrier transfer mechanism for transferring carrier substrates to be planted, wherein a plurality of independent vacuum adsorption heads are embedded in the carrier transfer platform for carrying the carrier substrate in the carrier transfer mechanism, and the plurality of vacuum adsorption heads correspond one-to-one with a plurality of board planting positions on the carrier substrate; a board planting mechanism for implanting the flexible circuit boards supplied by the feeding mechanism onto the carrier substrate on the carrier transfer mechanism; and a cover plate placement mechanism for supplying a carrier cover plate and placing the carrier cover plate on the carrier substrate in the carrier transfer mechanism after board planting.

[0005] The aforementioned high-precision plate planting equipment includes a carrier transfer mechanism that further comprises a carrier docking rail with adjustable width and a carrier transfer drive mechanism. The carrier docking rail can reciprocate along the length direction of the carrier substrate under the drive of the carrier transfer drive mechanism. Adjustable baffle cylinders are provided on both the inlet and outlet sides of the carrier docking rail. The carrier transfer platform is disposed between the two rails of the carrier docking rail. A top plate mechanism is provided on the inner side of the two rails of the carrier transfer platform. A pressure plate extending inward is provided on the top of the two rails of the carrier transfer platform. The carrier transfer platform can move up and down under the drive of the top plate mechanism.

[0006] The aforementioned high-precision board mounting equipment includes a feeding mechanism comprising a tray lifting and storage platform, a tray loading and unloading robot, a tray transfer platform, at least one picking robot, and at least one transfer platform. The tray lifting and storage platform stores full and empty trays. The tray loading and unloading robot moves full trays from the tray lifting and storage platform to the tray transfer platform, and moves empty trays from the tray transfer platform to the tray lifting and storage platform. The tray transfer platform reciprocates between the tray loading / unloading robot and the picking robot. The transfer platform temporarily stores flexible circuit boards to be mounted, and can hold the flexible circuit boards placed on it. The picking robot moves the flexible circuit boards from the tray transfer platform to the transfer platform.

[0007] The aforementioned high-precision board planting equipment further includes a film-tearing mechanism in its feeding mechanism, which is used to tear off the protective film on the flexible circuit board picked up by the material-picking robot arm.

[0008] The aforementioned high-precision plate planting equipment includes a cover plate placement mechanism comprising a cover plate storage lifting platform and a cover plate robot. The cover plate storage lifting platform is used to store carrier cover plates, and the cover plate robot is used to move the carrier cover plates in the cover plate storage lifting platform and place them on the carrier substrate after plate planting in the carrier transfer mechanism.

[0009] The aforementioned high-precision plate-mounting equipment also includes a return track, which is used to return the substrate to the carrier.

[0010] The aforementioned high-precision board placement equipment includes two board placement robots arranged parallel to each other above the feeding mechanism and the carrier transfer mechanism. Each board placement robot includes a board placement working head, a board placement longitudinal movement drive mechanism, a board placement lateral movement drive mechanism, a board placement lifting drive mechanism, a board placement rotation drive mechanism, and a board placement imaging mechanism. Both the board placement imaging mechanism and the board placement working head can reciprocate in the width direction of the carrier substrate under the drive of the board placement lateral movement drive mechanism. The board placement imaging mechanism is used to photograph and position the flexible circuit board supplied by the feeding mechanism and the carrier substrate on the carrier transfer mechanism. The board placement working head can reciprocate in the length direction of the carrier substrate under the drive of the board placement lateral movement drive mechanism. The board placement working head can perform lifting and lowering movements under the drive of the board placement lifting drive mechanism. The board placement working head can rotate in the horizontal plane under the drive of the board placement rotation drive mechanism.

[0011] The aforementioned high-precision board placement equipment includes a feeding mechanism comprising two picking robots and two transfer platforms. The two picking robots are arranged parallel to each other on the upper side of the tray transfer platform and the carrier transfer mechanism, and the two transfer platforms are arranged parallel to each other on the lower side of the two picking robots. Both transfer platforms are located between the carrier transfer mechanism and the tray transfer platform. Each picking robot includes a picking positioning camera, a picking suction cup, a picking lifting drive mechanism, a picking longitudinal drive mechanism, and a picking lateral drive mechanism. The picking positioning camera and the picking suction cup can reciprocate in the width direction of the carrier substrate under the drive of the picking lateral drive mechanism. The picking positioning camera is used to photograph and position the flexible circuit board in the tray on the tray transfer platform. The picking suction cup can reciprocate in the length direction of the carrier substrate under the drive of the picking longitudinal drive mechanism. The picking suction cup can perform lifting movement under the drive of the picking lifting drive mechanism.

[0012] The aforementioned high-precision board planting equipment has a lower imaging mechanism on the lower side of the transfer platform. The lower imaging mechanism is used to photograph and position the flexible circuit board picked up by the board planting mechanism. The transfer platform is mounted on the transfer avoidance drive mechanism and can reciprocate in the width direction of the carrier substrate under the drive of the transfer avoidance drive mechanism.

[0013] The high-precision plate planting equipment described above further includes a cover plate photographing mechanism. The cover plate photographing mechanism is located on one side of the outlet of the carrier transfer mechanism and on the lower side of the cover plate robot. The cover plate photographing mechanism is used to photograph and position the carrier cover plate picked up by the cover plate robot.

[0014] Compared to existing technologies, the advantages of this invention are as follows: 1. By embedding a vacuum adsorption head on the carrier transfer platform, vacuum adsorption replaces high-temperature adhesive tape for the implantation of flexible circuit boards, eliminating the need for users to prepare additional tape application and removal machines. Furthermore, the carrier substrate can be immediately recycled after processing, improving the turnover efficiency of the carrier substrate and thus reducing the number of carrier substrates required, thereby lowering user production costs. 2. It features a cover plate placement mechanism that automatically covers the board after implantation, preventing damage to the flexible circuit board due to positional deviations during manual cover plate placement, improving the consistency of cover plate placement, and ensuring product yield. 3. It can automatically remove the protective film from the flexible circuit board through a film removal mechanism, eliminating the need for manual film removal beforehand and avoiding potential contamination of the flexible circuit board during manual film removal, further improving product yield.

[0015] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0016] Figure 1 This is a three-dimensional structural diagram of the high-precision plate planting equipment according to an embodiment of the present invention.

[0017] Figure 2 This is a top view of the high-precision plate planting equipment according to an embodiment of the present invention.

[0018] Figure 3 This is a top view of the vehicle docking track according to an embodiment of the present invention.

[0019] Figure 4 This is a side view of the vehicle docking track according to an embodiment of the present invention.

[0020] Figure 5 This is a schematic diagram of the structure of the material tray lifting and storage platform according to an embodiment of the present invention.

[0021] Figure 6 This is a schematic diagram of the material tray loading and unloading robot according to an embodiment of the present invention.

[0022] Figure 7 This is a schematic diagram of the material tray transfer platform according to an embodiment of the present invention.

[0023] Figure 8 This is a schematic diagram of the material handling robot according to an embodiment of the present invention.

[0024] Figure 9 This is a schematic diagram of the transfer platform according to an embodiment of the present invention.

[0025] Figure 10 This is a schematic diagram of the film-tearing mechanism according to an embodiment of the present invention.

[0026] Figure 11This is a schematic diagram of the structure of the board-planting robot according to an embodiment of the present invention.

[0027] Figure 12 This is a schematic diagram of the structure of the cover plate storage lifting platform according to an embodiment of the present invention.

[0028] Figure 13 This is a schematic diagram of the cover plate robot according to an embodiment of the present invention.

[0029] Figure 14 This is a schematic diagram of the return track structure according to an embodiment of the present invention.

[0030] Explanation of icon numbers: 100 Feeding mechanism, 110 Tray lifting and storage platform, 111 Tray carrying platform, 112 Tray lifting drive mechanism, 113 Tray side baffle, 120 Tray loading and unloading robot, 121 Tray suction cup, 122 Tray suction cup lateral movement drive mechanism, 123 Tray suction cup lifting drive mechanism, 130 Tray transfer platform, 131 Tray transfer carrying platform, 132 Adjustable positioning block, 133 Tray transfer drive mechanism, 140 Reclaimer Robotic arm, 141 material suction cup, 142 material handling longitudinal movement drive mechanism, 143 material handling lifting drive mechanism, 144 material handling positioning camera, 150 transfer platform, 151 lower imaging mechanism, 152 transfer and avoidance drive mechanism, 160 film tearing mechanism, 161 film tearing gripper, 162 gripper lifting drive mechanism, 163 film tearing auxiliary separation plate, 164 separation plate lifting drive mechanism, 165 film tearing drive mechanism, 166 waste film suction and recovery mechanism. 200 Carrier transfer mechanism, 210 Carrier transfer platform, 211 Vacuum suction head, 220 Carrier docking track, 221 Pressure plate, 222 Top plate mechanism, 230 Carrier transfer drive mechanism, 240 Material blocking cylinder, 250 Carrier lateral movement drive mechanism, 300 Plate planting mechanism, 310 Plate planting robot, 311 Plate planting lateral movement drive mechanism, 312 Plate planting working head, 313 Plate planting rotation drive mechanism, 314 Plate planting lifting drive mechanism, 3 15. Plate planting longitudinal movement drive mechanism; 316. Plate planting photography mechanism; 400. Cover placement mechanism; 410. Cover storage lifting platform; 411. Cover stacking platform; 412. Adjustable cover limit plate; 413. Cover stacking lifting drive mechanism; 420. Cover robot arm; 421. Cover suction cup; 422. Cover lifting drive mechanism; 423. Cover transverse movement drive mechanism; 424. Cover rotation drive mechanism; 430. Cover photography mechanism; 500. Return track. Detailed Implementation

[0031] The embodiments of the present invention are described in detail below, with reference to... Figures 1 to 4The present invention provides a high-precision board placement device, including a feeding mechanism 100, a carrier transfer mechanism 200, a board placement mechanism 300, and a cover plate placement mechanism 400. The feeding mechanism 100 supplies flexible circuit boards to be placed, the carrier transfer mechanism 200 transfers carrier substrates to be placed, the board placement mechanism 300 implants the flexible circuit boards supplied by the feeding mechanism 100 onto the carrier substrates on the carrier transfer mechanism 200, and the cover plate placement mechanism 400 supplies a cover plate and places it on the carrier substrates after board placement in the carrier transfer mechanism 200. The carrier transfer mechanism 200 has multiple independent vacuum adsorption heads 211 embedded in the carrier transfer platform 210 used to support the carrier substrate. Each vacuum adsorption head 211 corresponds to a different board placement position on the carrier substrate and is connected to a vacuum source. The board placement positions on the carrier substrate have several holes or grooves. During board placement, when a flexible circuit board is inserted into a board placement position on the carrier substrate, the vacuum adsorption head 211 below that position will start working. It will adsorb the inserted flexible circuit board through the holes or grooves on the carrier substrate, replacing the high-temperature tape used in traditional board placement solutions to achieve auxiliary fixation of the flexible circuit board. After the board placement is completed, the carrier substrate is covered by the cover plate mechanism 400. Then, the carrier transfer platform 210 closes all the vacuum adsorption heads 211, and the carrier transfer mechanism 200 sends the board-placed carrier substrate to the next line equipment for the next processing step.

[0032] This board placement equipment uses a vacuum suction head 211 instead of high-temperature adhesive tape to assist in the placement of flexible circuit boards, eliminating the need for users to purchase additional tape applicators and tape removers, thus reducing production equipment costs. Furthermore, after processing, there is no need to remove the high-temperature tape from the carrier substrate using a tape remover; the carrier substrate can be immediately returned, improving the return efficiency of the carrier substrate in the production line. This allows for uninterrupted production line operation with fewer carrier substrates, reducing the user's carrier substrate inventory costs and further lowering production costs. Moreover, after board placement, the cover plate placement mechanism 400 automatically places the cover plate, improving the consistency of cover plate placement and preventing damage to the flexible circuit board between the cover plate and the carrier substrate due to misalignment, further improving production yield.

[0033] Reference Figure 2 , Figure 3 and Figure 4In this embodiment, the carrier transfer mechanism 200 further includes a carrier docking track 220 with adjustable width and a carrier transfer drive mechanism 230. The carrier docking track 220 is disposed on the carrier transfer drive mechanism 230 and can reciprocate along the length direction of the carrier substrate under the drive of the carrier transfer drive mechanism 230, so that the carrier docking track 220 can reciprocate between the carrier substrate inlet and outlet of the equipment. The carrier docking track 220 is used to receive the carrier substrate from the previous connection equipment and send the carrier substrate after the board is planted into the next connection equipment. The carrier transfer platform 210 is disposed between the two tracks of the carrier connecting track 220. The inner side of the two tracks of the carrier connecting track 220 is provided with a top plate mechanism 222, and the top of each track is provided with a pressure plate 221 extending inward to the inner side of the track. The carrier transfer platform 210 is placed or detachably mounted on the top plate mechanism 222. The carrier transfer platform 210 can be lifted under the drive of the top plate mechanism 222, so that the carrier substrate is separated from the conveyor belt on the track, and the two sides of the carrier substrate are clamped by the carrier transfer platform 210 and the pressure plate 221, thereby fixing the relative position between the carrier substrate and the carrier connecting track 220 and preventing the position of the carrier substrate from changing during the board planting process. At the entrance and exit of the carrier connecting track 220, adjustable baffle cylinders 240 are also installed. The baffle cylinders 240 can position the carrier substrate along its length to ensure that the loading position of each carrier substrate is consistent, and that the positioning camera on the board planting mechanism 300 can capture the Mark point on the carrier substrate, thus ensuring the accuracy of board planting. The vacuum suction head 211 corresponding to the board planting position on each carrier substrate is independent of each other. This avoids the situation where, when using non-independent suction heads, the suction holes at the unplanted board positions are not blocked, affecting the suction force of the suction holes at adjacent board planting positions, which would lead to insufficient suction force and affect the accuracy of board planting.

[0034] In some embodiments, refer to Figure 3The carrier transfer mechanism 200 also includes a carrier lateral movement drive mechanism 250. The carrier docking track 220 is mounted on the carrier transfer drive mechanism 230 via the carrier lateral movement drive mechanism 250. The carrier docking track 220 can reciprocate in the width direction of the carrier base plate under the drive of the carrier transfer drive mechanism 230, thereby adjusting the lateral position of the carrier base plate when placing the plate or cover plate, and facilitating alignment with the carrier base plate conveying track of the connecting equipment. It is understood that the width adjustment of the carrier docking track 220 can be achieved by setting one of the tracks on a guide mechanism such as a slide rail, slide rod, or oblong hole, and fixing the position with a locking mechanism such as a locking bolt. The specific implementation method is a conventional technique in the art and will not be described in detail here. The position adjustment of the material blocking cylinder 240, as well as the adjustment functions of the width or position adjustable tracks, baffles, or limit plates mentioned later, can be achieved in the same or similar way. The adjustable width of the carrier connecting track 220 and the position of the baffle cylinder 240 enhance the equipment's adaptability to carrier substrates of different sizes and shapes used for different types of flexible circuit boards, thus improving the equipment's applicability. The top plate mechanism 222 consists of a top plate support and a top plate lifting drive mechanism. The top plate lifting drive mechanism is located inside the corresponding track, and the top plate support is mounted on the top plate lifting drive mechanism, enabling it to move up and down under the drive of the top plate lifting drive mechanism. The two side edges of the carrier transfer platform 210 are placed or detachably mounted on the top plate supports of the two top plate mechanisms 222. The placement position of the carrier substrate for different types of flexible circuit boards can be adapted by replacing the carrier transfer platform 210.

[0035] Reference Figure 1 and Figure 2The feeding mechanism 100 is located on one side of the carrier transfer mechanism 200. The feeding mechanism 100 includes a tray lifting and storage platform 110, a tray loading / unloading robot 120, a tray transfer platform 130, at least one picking robot 140, and at least one transfer platform 150. The tray lifting and storage platform 110 is located near the entrance of the carrier transfer mechanism 200 and is used to store full and empty trays. The tray loading / unloading robot 120 is located above the tray lifting and storage platform 110 and is used to move full trays from the tray lifting and storage platform 110 to the tray transfer platform 130, and to move empty trays from the tray transfer platform 130 to the tray lifting and storage platform 110. A tray transfer platform 130 is positioned between the tray loading / unloading robot 120 and the tray lifting and storage platform 110. It temporarily stores the trays and reciprocates them between the loading / unloading station, the unloading station, and the picking station, facilitating the loading / unloading robot 120's loading / unloading of the trays and the picking robot 140's removal of the flexible circuit boards from the trays. The picking robot 140 is positioned above the carrier transfer mechanism 200, the tray transfer platform 130, and the transfer platform 150, and is used to move the flexible circuit boards from the tray transfer platform 130 to the transfer platform 150. The transfer platform 150 temporarily stores the flexible circuit boards for transfer to the board mounting mechanism 300. The transfer platform 150 has an adsorption function, capable of holding the flexible circuit boards placed on it, preventing bending, wrinkling, and displacement of the flexible circuit boards. In this embodiment, refer to... Figure 2 To improve the production efficiency of the equipment, the board planting mechanism 300 includes two board planting robots 310, and the feeding mechanism 100 also includes two material handling robots 140 and two transfer platforms 150. The two board planting robots 310 are arranged side by side along the length direction of the carrier substrate, and the two material handling robots 140 are respectively arranged on one side of the width direction of the two board planting robots 310. The two transfer platforms 150 are respectively arranged on the lower side of the two sets of board planting robots 310 and material handling robots 140. The material handling robots 140 transfer the flexible circuit board to the board planting robots 310 on the same side through the transfer platform 150 on the same side.

[0036] In this embodiment, the tray lifting and storage platform 110 includes two parallel longitudinal tray stacking channels, as shown in the figure. Figure 5Each tray stacking channel consists of a tray support platform 111, a tray lifting drive mechanism 112, and an adjustable tray side baffle 113. Two tray lifting drive mechanisms 112 are positioned between two tray support platforms 111, and the tray support platforms 111 are mounted on their respective lifting drive mechanisms 112. These mechanisms allow for lifting and lowering movements to ensure the height of the top tray in the stacked trays on the tray support platform 111 remains constant, facilitating tray loading and unloading by the robotic arm 120. The tray side baffle 113 is located on the side of the tray support platform 111 facing away from the tray lifting drive mechanism 112. Working in conjunction with the support structure of the lifting drive mechanism 112, it limits the movement of the tray stack, preventing it from tipping over. The width of the tray stacking channel can be adjusted by changing the position of the tray side baffle 113 to accommodate trays of different sizes.

[0037] Reference Figure 6 The tray loading / unloading robot 120 includes a tray suction cup 121, a tray suction cup lateral movement drive mechanism 122, and a tray suction cup lifting drive mechanism 123. The tray suction cup 121 is equipped with multiple adjustable vacuum nozzles, enabling it to grip trays via suction. The tray suction cup 121 is mounted on the tray suction cup lateral movement drive mechanism 122 and reciprocates above two tray stacking platforms under its drive. The tray suction cup lateral movement drive mechanism 122 is mounted on the tray suction cup lifting drive mechanism 123 and performs lifting motion under its drive, allowing the tray suction cup 121 to be lowered onto the tray carrying platform 111 or the tray transfer platform 130 for tray loading / unloading, while avoiding interference with the movement of the tray transfer platform 130.

[0038] Reference Figure 7 In this embodiment, the tray transfer platform 130 includes a tray transfer bearing platform 131, an adjustable positioning block 132, and a tray transfer drive mechanism 133. The adjustable positioning block 132 is movably disposed on the tray transfer platform 130 and can adjust its relative position to the tray transfer platform 130 to accommodate trays of different shapes, positioning trays of different shapes and preventing the trays from moving during platform movement. The tray transfer drive mechanism 133 is disposed on the upper side of the tray lifting and storage platform 110 along the length direction of the carrier substrate. The tray transfer bearing platform 131 is disposed on the tray transfer drive mechanism 133 and can reciprocate under the drive of the tray transfer drive mechanism 133 to the upper tray station, the lower tray station, and the picking station, i.e., the upper side of the two tray stacking channels and the lower side of the two picking robots 140.

[0039] Reference Figure 2 and Figure 8In this embodiment, the material handling robot 140 includes a material handling suction cup 141, a material handling longitudinal movement drive mechanism 142, a material handling lifting drive mechanism 143, and a material handling positioning camera 144. The material handling suction cup 141 is mounted on the material handling longitudinal movement drive mechanism 142 and can reciprocate along the length of the product under the drive of the material handling longitudinal movement drive mechanism 142. The material handling longitudinal movement drive mechanism 142 is mounted on the material handling lifting drive mechanism 143 and can perform lifting and lowering movements under the drive of the material handling lifting drive mechanism 143. Both the material handling lifting drive mechanism 143 and the material handling positioning camera 144 are mounted on the material handling transverse movement drive mechanism and can reciprocate along the width of the carrier substrate under the drive of the material handling transverse movement drive mechanism. The material handling positioning camera 144 is used to photograph and position the flexible circuit boards in the tray transfer platform 131, thereby accurately removing the flexible circuit boards one by one from the tray.

[0040] In some embodiments, to further improve the implantation accuracy of the flexible circuit board, thereby ensuring the quality of subsequent manufacturing processes and avoiding damage to the flexible circuit board caused by implantation deviation, refer to Figure 2 and Figure 9 A lower imaging mechanism 151 is located near the transfer platform 150. This mechanism takes pictures of the flexible circuit board picked up by the board-planting robot 310 to determine its position. This allows the device controller to calculate the positional deviation between the flexible circuit board picked up by the robot and the board-planting head 312, enabling more precise correction of the position and angle deviations of the flexible circuit board by the robot. In this embodiment, to reduce the device size and fully utilize the space, the lower imaging mechanism 151 is located on the lower side of the transfer platform 150. The transfer platform 150 is mounted on the transfer avoidance drive mechanism 152 and can reciprocate along the width of the carrier substrate under the drive of the drive mechanism 152. The lower imaging mechanism 151 is located on the side of the transfer avoidance drive mechanism 152 closest to the carrier transfer mechanism 200. After receiving the flexible circuit board from the picking robot 140, the transfer platform 150 moves towards the carrier transfer mechanism 200 and above the lower imaging mechanism 151 under the drive of the transfer avoidance drive mechanism 152. This allows the board-planting robot 310 to remove the flexible circuit board from the transfer platform 150 without affecting the picking robot 140. After the board-planting robot 310 removes the flexible circuit board, the transfer platform 150 resets towards the tray transfer platform 130, making way for the lower imaging mechanism 151 located below, so that the lower imaging mechanism 151 can take pictures and position the flexible circuit board on the board-planting robot 310.

[0041] In practice, to protect flexible circuit boards during transportation, they may be covered with a protective film upon arrival. Existing board placement equipment typically requires manual removal of the protective film from the flexible circuit board before placement. In some embodiments, to prevent contamination of the flexible circuit board during manual removal of the protective film, the feeding mechanism 100 further includes a film-removing mechanism 160, which removes the protective film from the flexible circuit board using a suction cup or gripper. (Refer to...) Figure 2 and Figure 10 In this embodiment, the feeding mechanism 100 includes two film-tearing mechanisms 160, which are respectively disposed below the two picking robots 140. Both film-tearing mechanisms 160 are located between the transfer platform 150 and the material tray transfer platform 130, and are used to tear off the protective film on the lower surface of the flexible circuit board during the movement of the two picking robots 140 to the two transfer platforms 150. Each film-tearing mechanism 160 includes a film-tearing gripper 161, a gripper lifting drive mechanism 162, a film-tearing auxiliary separation plate 163, a separation plate lifting drive mechanism 164, a film-tearing drive mechanism 165, and a waste film suction and recovery mechanism 166. The film-tearing gripper 161 is disposed on the gripper lifting drive mechanism 162 and can move up and down under the drive of the gripper lifting drive mechanism 162, so that it rises to be flush with the flexible circuit board picked up by the picking robot 140 during film tearing, allowing the film-tearing gripper 161 to clamp one end of the protective film on the lower surface of the flexible circuit board. Two film-peeling auxiliary separation plates 163 are respectively disposed on both sides of the film-peeling gripper 161 and on the separation plate lifting drive mechanism 164. Driven by the separation plate lifting drive mechanism 164, the two film-peeling auxiliary separation plates 163 can move up and down, thereby raising and pressing the flexible circuit board portion from which the protective film has been peeled off during the film-peeling process. This, in conjunction with the film-peeling gripper 161, peels the protective film off the flexible circuit board and prevents the flexible circuit board from being pulled off the material suction cup 141 along with the protective film. Both the gripper lifting drive mechanism 162 and the separation plate lifting drive mechanism 164 are disposed on the film-peeling drive mechanism 165. Driven by the film-peeling drive mechanism 165, they reciprocate along the length of the carrier substrate, thereby driving the film-peeling gripper 161 to move from one end of the flexible circuit board to the other, peeling the protective film off the flexible circuit board. A waste membrane suction and recovery mechanism 166 is located below the membrane tearing gripper 161. This mechanism 166 can suction and recover the membrane from the membrane tearing gripper 161 into a specific container for storage. The waste membrane suction and recovery mechanism 166 may include a waste membrane suction port and a waste membrane recovery chamber. The inlet of the waste membrane suction port is located at one end of the stroke of the membrane tearing gripper 161, and the outlet of the waste membrane suction port is connected to a blower through the waste membrane recovery chamber. After the membrane tearing gripper 161 tears off the protective film, it releases, and simultaneously, the blower connected to the waste membrane suction port below operates, sucking the protective film through the suction port into the waste membrane recovery chamber.

[0042] Reference Figure 2 and Figure 11 In this embodiment, the board-planting robot 310 includes a board-planting horizontal movement drive mechanism 311, a board-planting working head 312, a board-planting rotation drive mechanism 313, a board-planting lifting drive mechanism 314, a board-planting longitudinal movement drive mechanism 315, and a board-planting photographing mechanism 316. The board-planting working head 312 is mounted on the board-planting rotation drive mechanism 313 and can rotate in the horizontal plane under the drive of the board-planting rotation drive mechanism 313, so that the device controller can control the board-planting robot 310 to correct the angular offset of the flexible circuit board based on the photographing and positioning results of the lower photographing mechanism 151. The board-planting rotation drive mechanism 313 is mounted on the board-planting lifting drive mechanism 314 and can move up and down under the drive of the board-planting lifting drive mechanism 314. The board-planting lifting drive mechanism 314 is mounted on the board-planting longitudinal movement drive mechanism 315 and can reciprocate along the length direction of the carrier substrate under the drive of the board-planting longitudinal movement drive mechanism 315. Both the longitudinal transfer drive mechanism 315 and the photographing mechanism 316 are mounted on the transverse transfer drive mechanism 311. Driven by the longitudinal transfer drive mechanism 315, they reciprocate along the width of the carrier substrate. The photographing mechanism 316 is used to photograph and position the carrier substrate on the carrier transfer mechanism 200, allowing the device controller to control the board-mounting robot 310 to implant the flexible circuit board into an empty board-mounting position on the carrier substrate. In some embodiments, to further improve board-mounting quality, the board-mounting working head 312 is equipped with a pressure sensor and a pressure regulating cylinder. The pressure regulating cylinder is controlled by a proportional valve and can adjust the air pressure according to the feedback pressure from the pressure sensor, thereby achieving precise adjustment of the board-mounting pressure. Its specific structure is similar to the multi-point pressing mechanism in CN118450625B, and will not be described in detail here. (Refer to...) Figure 2 In this embodiment, the direction of the plate transverse drive mechanism 311 is perpendicular to the direction of the carrier transfer drive mechanism 230. The plate transverse drive mechanism 311 is a linear platform with two movers. The material picking transverse drive mechanism and the plate transverse drive mechanism 311 share the same linear platform. The material picking lifting drive mechanism 143 and the plate transverse drive mechanism 311 are respectively set on the two slides of the plate transverse drive mechanism 311.

[0043] Reference Figure 2 , Figure 12 and Figure 13 In this embodiment, the cover plate placement mechanism 400 includes a cover plate storage lifting platform 410 and a cover plate robot 420. The cover plate storage lifting platform 410 is used to store carrier cover plates, and the cover plate robot 420 is located on the upper side of the cover plate storage lifting platform 410 and the exit of the carrier transfer mechanism 200, and is used to place the cover plates on the cover plate storage lifting platform 410 onto the carrier substrate that has been planted in the carrier transfer mechanism 200.

[0044] Reference Figure 12 In this embodiment, the cover plate storage lifting platform 410 includes a cover plate stacking platform 411 and a cover plate stacking lifting drive mechanism 413. The cover plate stacking platform 411 is mounted on the cover plate stacking lifting drive mechanism 413 and can move up and down under the drive of the cover plate stacking lifting drive mechanism 413, thereby ensuring that the height of the top cover plate in the cover plate stack on the cover plate stacking platform 411 remains unchanged, so as to facilitate the cover plate robot 420 to pick up the cover plate from the cover plate stack. Several position-adjustable cover plate adjustable limiting plates 412 are provided on the periphery of the cover plate stacking platform 411. The cover plate adjustable limiting plates 412 are used to block and limit the edge of the cover plate stack to prevent the cover plate stack from tipping over, and the position of the cover plate adjustable limiting plates 412 can be adjusted to accommodate cover plates of different sizes. The edge of the cover plate stacking platform 411 is provided with clearance grooves to leave adjustment space for the cover plate adjustable limiting plates 412.

[0045] Reference Figure 2 In some embodiments, to further improve the consistency of cover placement, the cover placement mechanism 400 also includes a cover photographing mechanism 430. The cover photographing mechanism 430 is located on one side of the exit of the carrier transfer mechanism 200, and below the cover manipulator 420. It can photograph and position the carrier cover picked up by the cover manipulator 420, so that the device controller can correct the angle and position deviations of the cover based on the photographed positioning results, thereby further improving the cover placement accuracy. (Refer to...) Figure 13 In this embodiment, the cover plate manipulator 420 includes a cover plate suction cup 421, a cover plate lifting drive mechanism 422, a cover plate lateral movement drive mechanism 423, and a cover plate rotation drive mechanism 424. The cover plate suction cup 421 is equipped with several position-adjustable suction nozzles. The cover plate suction cup 421 is mounted on the cover plate rotation drive mechanism 424 and can rotate in the horizontal plane under the drive of the cover plate rotation drive mechanism 424, thereby correcting the angular deviation of the cover plate. The cover plate rotation drive mechanism 424 is mounted on the cover plate lifting drive mechanism 422 and can perform lifting and lowering movements under the drive of the cover plate lifting drive mechanism 422. The cover plate lifting drive mechanism 422 is mounted on the cover plate lateral movement drive mechanism 423. The direction of the cover plate lateral movement drive mechanism 423 is perpendicular to the direction of the carrier transfer drive mechanism 230. The cover plate lifting drive mechanism 422 can reciprocate in the width direction of the carrier substrate under the drive of the cover plate lateral movement drive mechanism 423.

[0046] Reference Figure 1 and Figure 14In some embodiments, to facilitate the return of the carrier substrate, the equipment also includes a return track 500. The return track 500 is located below the carrier transfer mechanism 200 and is used to connect with the return track 500 of the connecting equipment, thereby returning the processed carrier substrate to the front of the production line for easy reuse. In this embodiment, the return track 500 is also an adjustable-width conveyor belt track, which can adapt to carrier substrates of different sizes by adjusting the width.

[0047] It is understood that the aforementioned camera or camera mechanism typically consists of a camera, lens, and light source. The various drive mechanisms described above can be composed of drive devices such as cylinders or motors, coupled with transmission mechanisms such as lead screw pairs or synchronous belt assemblies, and guide components such as slide rails or guide rods. Their specific structures are common knowledge in the field and will not be elaborated upon here. All of the aforementioned platforms are equipped with photoelectric switches or through-beam sensors for detecting the stacking height of materials and the presence of materials.

[0048] It should be noted that in the description of this invention, any descriptions of orientation, such as up, down, front, back, left, right, etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings. They are only for the purpose of facilitating the description of this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and should not be construed as a limitation of this invention.

[0049] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," "exceeding," etc. are understood to exclude the stated number, while "above," "below," "within," etc. are understood to include the stated number. If "first" or "second" is mentioned, it is only for the purpose of distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0050] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0051] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.

Claims

1. A high-precision plate planting device, characterized in that, include: A feeding mechanism (100) is used to supply flexible circuit boards to be implanted; The carrier transfer mechanism (200) is used to transfer the carrier substrate to be planted. The carrier transfer platform (210) of the carrier transfer mechanism (200) for carrying the carrier substrate is embedded with a plurality of independent vacuum adsorption heads (211). The plurality of vacuum adsorption heads (211) correspond one-to-one with the plurality of planting positions on the carrier substrate. The board implantation mechanism (300) is used to implant the flexible circuit board supplied by the feeding mechanism (100) onto the carrier substrate on the carrier transfer mechanism (200); A cover plate placement mechanism (400) is used to supply a carrier cover plate and place the carrier cover plate on the carrier base plate after the plate has been installed in the carrier transfer mechanism (200).

2. The high-precision plate planting equipment according to claim 1, characterized in that, The vehicle transfer mechanism (200) further includes a width-adjustable vehicle docking rail (220) and a vehicle transfer drive mechanism (230). The vehicle docking rail (220) can reciprocate along the length of the vehicle base plate under the drive of the vehicle transfer drive mechanism (230). The inlet and outlet sides of the vehicle docking rail (220) are provided with adjustable baffle cylinders (240). The vehicle transfer platform (210) is located between the two rails of the vehicle docking rail (220). The inner side of the two rails of the vehicle transfer platform (210) is provided with a top plate mechanism (222). The top of the two rails of the vehicle transfer platform (210) is provided with a pressure plate (221) extending inward. The vehicle transfer platform (210) can move up and down under the drive of the top plate mechanism (222).

3. The high-precision plate planting equipment according to claim 1, characterized in that, The feeding mechanism (100) includes a tray lifting and storage platform (110), a tray loading and unloading robot (120), a tray transfer platform (130), at least one picking robot (140), and at least one transfer platform (150). The tray lifting and storage platform (110) is used to store full trays and empty trays. The tray loading and unloading robot (120) is used to move full trays from the tray lifting and storage platform (110) to the tray transfer platform (130), and to transfer full trays from the tray transfer platform (130) to the trays on the tray transfer platform (130). The empty tray is moved to the tray lifting and storage platform (110); the tray transfer platform (130) is used to move the tray back and forth between the tray loading and unloading robot (120) and the picking robot (140); the transfer platform (150) is used to temporarily store the flexible circuit board to be planted, and the transfer platform (150) can adsorb the flexible circuit board placed on it; the picking robot (140) is used to move the flexible circuit board on the tray transfer platform (130) to the transfer platform (150).

4. The high-precision plate planting equipment according to claim 3, characterized in that, The feeding mechanism (100) also includes a film-tearing mechanism (160), which is used to tear off the protective film on the flexible circuit board picked up by the picking robot (140).

5. The high-precision plate planting equipment according to claim 1, characterized in that, The cover plate placement mechanism (400) includes a cover plate storage lifting platform (410) and a cover plate robot (420). The cover plate storage lifting platform (410) is used to store the carrier cover plate, and the cover plate robot (420) is used to move the carrier cover plate in the cover plate storage lifting platform (410) and place it on the carrier base plate after the plate is planted in the carrier transfer mechanism (200).

6. The high-precision plate planting equipment according to claim 1, characterized in that, It also includes a return track (500) for returning the carrier substrate.

7. The high-precision plate planting equipment according to claim 1, characterized in that, The plate-planting mechanism (300) includes two plate-planting robots (310), which are arranged in parallel above the feeding mechanism (100) and the carrier transfer mechanism (200). Each plate-planting robot (310) includes a plate-planting working head (312), a plate-planting longitudinal movement drive mechanism (315), a plate-planting transverse movement drive mechanism (311), a plate-planting lifting drive mechanism (314), a plate-planting rotation drive mechanism (313), and a plate-planting photographing mechanism (316). Both the plate-planting photographing mechanism (316) and the plate-planting working head (312) are located within the plate-planting transverse movement drive mechanism (311). Driven by the reciprocating motion in the width direction of the carrier substrate, the board-mounting photographing mechanism (316) is used to photograph and position the flexible circuit board supplied by the feeding mechanism (100) and the carrier substrate on the carrier transfer mechanism (200). The board-mounting working head (312) can reciprocate in the length direction of the carrier substrate under the drive of the board-mounting transverse drive mechanism (311). The board-mounting working head (312) can perform lifting and lowering motion under the drive of the board-mounting lifting drive mechanism (314). The board-mounting working head (312) can rotate in the horizontal plane under the drive of the board-mounting rotation drive mechanism (313).

8. The high-precision plate planting equipment according to claim 3, characterized in that, The feeding mechanism (100) includes two picking robots (140) and two transfer platforms (150). The two picking robots (140) are arranged in parallel above the tray transfer platform (130) and the carrier transfer mechanism (200). The two transfer platforms (150) are arranged in parallel below the two picking robots (140). Both transfer platforms (150) are located between the carrier transfer mechanism (200) and the tray transfer platform (130). The picking robot (140) includes a picking positioning camera (144), a picking suction cup (141), and a picking lifting drive mechanism (142). 3) The material picking longitudinal movement drive mechanism (142) and the material picking transverse movement drive mechanism, the material picking positioning camera (144) and the material picking suction cup (141) can both reciprocate in the width direction of the carrier substrate under the drive of the material picking transverse movement drive mechanism. The material picking positioning camera (144) is used to take pictures and position the flexible circuit board in the tray on the tray transfer platform (130). The material picking suction cup (141) can reciprocate in the length direction of the carrier substrate under the drive of the material picking longitudinal movement drive mechanism (142). The material picking suction cup (141) can perform lifting and lowering movements under the drive of the material picking lifting drive mechanism (143).

9. The high-precision plate planting equipment according to claim 3, characterized in that, The transfer platform (150) is provided with a lower imaging mechanism (151) on its lower side. The lower imaging mechanism (151) is used to take pictures and position the flexible circuit board picked up by the board planting mechanism (300). The transfer platform (150) is set on the transfer avoidance drive mechanism (152). The transfer platform (150) can reciprocate in the width direction of the carrier substrate under the drive of the transfer avoidance drive mechanism (152).

10. The high-precision plate planting equipment according to claim 5, characterized in that, The cover plate placement mechanism (400) further includes a cover plate photographing mechanism (430), which is located on one side of the outlet of the carrier transfer mechanism (200) and on the lower side of the cover plate manipulator (420). The cover plate photographing mechanism (430) is used to photograph and position the carrier cover plate picked up by the cover plate manipulator (420).

Images