Circuit board adhesive system

Abstract

The application discloses a circuit board adhesive pasting system and relates to the technical field of circuit board processing. The circuit board adhesive pasting system comprises a feeding mechanism, a buffer mechanism, an adhesive pasting mechanism and a discharging mechanism. The feeding mechanism comprises a first conveying device. The buffer mechanism comprises a second conveying device, a lifting device and a pushing device. The second conveying device is connected with the first conveying device. At least part of the lifting device is arranged to be liftable so as to drive the circuit board to ascend to a buffer area for stacking. The pushing device is used for pushing the circuit board in the buffer area to the second conveying device. The adhesive pasting mechanism comprises a bearing structure, an adhesive tape supply assembly and an adhesive pasting device. The bearing structure is used for bearing the circuit board. The adhesive pasting device comprises a turnover structure. The turnover structure has a first position for adsorbing the adhesive tape provided by the adhesive tape supply assembly and a second position for turning over to the side of the adhesive tape facing the circuit board. The discharging mechanism is located at the downstream of the adhesive pasting mechanism. The application solves the problems of low adhesive pasting efficiency and poor precision and consistency of the manual adhesive tape pasting mode in the prior art.

Description

Technical Field

[0001] This application relates to the field of circuit board processing technology, and in particular to a circuit board adhesive application system. Background Technology

[0002] Currently, large PCBA (Printed Circuit Board Assembly) integrated circuit boards play a crucial role in the modern electronics manufacturing industry. A key step in the manufacturing process of these integrated circuit boards is solder paste printing to ensure that components can be securely soldered onto the PCB. However, large PCBAs face a significant challenge in this process—gold finger contamination. Gold fingers refer to the row of gold-plated contacts on the edge of the PCB, used to establish reliable plug-in connections and efficient signal transmission between hardware modules. Their cleanliness and functionality are essential for the stable operation of the entire system.

[0003] In existing technologies, the common method is to manually apply tape to the edges of the PCB to protect the gold fingers of the PCBA from solder paste contamination. However, manual operation is not only time-consuming and labor-intensive, but also lacks precise control, resulting in low application efficiency and making it difficult to meet the needs of large-scale production. Secondly, manual intervention can introduce human error, such as uneven tape application, misalignment, or residual impurities in the tape itself. This not only affects the performance of the gold fingers but may also cause malfunctions in subsequent production processes, or even scrap the entire PCBA. Finally, manual tape application, especially for PCBAs with complex shapes and large dimensions, often makes it difficult to ensure the accuracy and consistency of the tape application on the gold fingers. Summary of the Invention

[0004] This application provides a circuit board adhesive application system to at least solve the problems of low efficiency, poor accuracy, and poor consistency in the manual tape application method in the related art.

[0005] This application provides a circuit board adhesive application system, comprising: a feeding mechanism including a first conveying device for conveying circuit boards to an inlet; a buffer mechanism including a second conveying device, a lifting device, and a pushing device, wherein the second conveying device is connected to the first conveying device and located downstream of the first conveying device for conveying circuit boards; at least part of the lifting device is vertically movably configured to lift the circuit boards to a buffer area for stacking; the pushing device is used to push the circuit boards located at a preset height position in the buffer area onto the second conveying device; an adhesive application mechanism including a supporting structure, an adhesive tape supply assembly, and an adhesive application device, wherein the supporting structure supports the circuit boards, and the adhesive application device includes a movably configured flipping structure having a first position for adsorbing the adhesive tape provided by the adhesive tape supply assembly and a second position for flipping the tape to face the side of the circuit board; and an discharge mechanism located downstream of the adhesive application mechanism, the discharge mechanism including a third conveying device for conveying the adhesive-applied circuit boards to an discharge port.

[0006] Furthermore, the adhesive applicator also includes a pressing device, which includes: a pressing assembly having a pressing cavity, the size of which is adjustable for pressing the tape covering the side of the circuit board onto the side; and a translation assembly drivenly connected to the pressing assembly to drive the pressing assembly to move toward or away from the circuit board; wherein, when the translation assembly drives the pressing assembly to move toward the circuit board, the pressing assembly presses the tape onto the circuit board along the width direction of the circuit board.

[0007] Furthermore, the tape application mechanism also includes a base, a supporting structure, a tape supply assembly, and a tape application device, all mounted on the base. The tape supply assembly includes: a feeding device, including a spool on which the tape is wound; a tensioning device, including a retractable tensioning part for pulling or tightening the free end of the tape to unwind the tape from the spool; and a cutting device located between the feeding device and the tensioning device, including cutting shears for cutting the tape.

[0008] Furthermore, the cutting device also includes: a base; a clamping assembly disposed on the base, the clamping assembly including a first clamping member and a second clamping member disposed opposite to each other, forming a tape clamping space between the first clamping member and the second clamping member, the size of the tape clamping space being adjustable; a first driving device, the first driving device being driven connected to the cutting scissors to drive the cutting scissors to extend and retract relative to the base; wherein, the clamping assembly has a clamping state for clamping tape and a releasing state for releasing tape; when the clamping assembly is in the clamping state, the tensioning part tensions the free end of the tape, and the cutting scissors can extend to cut the tape; when the clamping assembly is in the releasing state, the tensioning part drags the free end of the tape until the tape moves into the tape clamping space.

[0009] Further, the flipping structure includes: a flipping body rotatably mounted on a base; an adsorption structure mounted on the flipping body, the adsorption structure having a vacuum adsorption surface for adsorbing adhesive tape; and a second driving device connected to the flipping body to drive the flipping body to rotate; wherein, the supporting structure and the adhesive tape supply assembly are located on both sides of the flipping structure; the flipping structure has a first position and a second position; when the flipping structure is in the first position, the vacuum adsorption surface faces the adhesive tape supply assembly to adsorb the cut adhesive tape; after the adhesive tape is adsorbed by the vacuum adsorption surface, the second driving device drives the flipping structure to rotate from the first position to the second position, and after the adhesive tape adheres to the side of the circuit board, the adsorption structure releases the adhesive tape.

[0010] Further, the pressing assembly includes: a support base connected to the translation assembly, the support base including a bottom plate, a top plate, and a first support plate, the bottom plate being connected to the top plate via the first support plate; two opposing pressing structures, each pressing structure including a connecting plate and a roller, the roller being rotatably mounted on the connecting plate, the connecting plate being located between the bottom plate and the top plate and rotatably mounted on the first support plate; a pressing cavity being formed between the two rollers; a first hooking protrusion mounted on the top plate; a second hooking protrusion mounted on the bottom plate; at least two third hooking protrusions, each connecting plate having at least one third hooking protrusion; wherein the second hooking protrusion is connected to the adjacent third hooking protrusion via a first tension spring; and / or, the first hooking protrusion is connected to the adjacent third hooking protrusion via a second tension spring.

[0011] Furthermore, the buffer mechanism also includes: a second support plate, the surface of which forms the overlapping surface of the buffer area; a holding component for clamping the circuit board located above a preset height position within the buffer area; wherein, the second conveying device includes two opposing tracks and a third driving device, the third driving device being driven connected to both tracks to drive the two tracks toward or away from each other; during the process of the lifting device driving the circuit board to rise, the third driving device drives the two tracks away from each other until the circuit board rises above the overlapping surface, at which point the third driving device drives the two tracks toward each other to return to the initial state.

[0012] Furthermore, the pushing device includes: two push blades located on both sides of the second conveying device, with the pushing direction of each push blade being parallel to the surface of the circuit board; and two fourth driving devices, each corresponding to one of the two push blades, with each fourth driving device driving its corresponding push blade to move toward the circuit board, so as to push the circuit board onto the second conveying device.

[0013] Furthermore, the circuit board adhesive application system also includes: a transfer mechanism, comprising a fourth conveying device and a first detection device, the first detection device being used to detect whether a circuit board is stored on the fourth conveying device; the fourth conveying device is connected to and located downstream of the second conveying device; a first robotic arm, used to transfer the circuit board located on the fourth conveying device to the support structure; and a control module, electrically connected to both the first detection device and the pushing device; wherein, when the first detection device does not detect a circuit board, the control module controls the pushing device to start, so as to push the circuit board buffered in the buffer area onto the second conveying device.

[0014] Furthermore, the circuit board adhesive application system also includes: a storage mechanism, comprising a fifth conveying device, a second lifting device, and a second pushing device; the fifth conveying device is connected to and located downstream of the fourth and third conveying devices for conveying circuit boards; at least part of the second lifting device is vertically detachable to lift the circuit boards to the storage area for stacking; the second pushing device is used to push the circuit boards in the storage area onto the fifth conveying device; a second detection device is used to detect the number of circuit boards or the volume occupied by the circuit boards in the storage area; a communication module; and a control module electrically connected to both the second detection device and the communication module; wherein, when the detection value of the second detection device is greater than or equal to a preset value, the control module controls the communication module to transmit signals with the AGV system so that the circuit boards can be transferred through the AGV system.

[0015] Applying the technical solution of this application, the first conveying device of the feeding mechanism can smoothly transport the circuit board to the inlet, ensuring the continuity and accuracy of subsequent processing. The buffer mechanism receives the circuit board from the first conveying device through the second conveying device, and uses the lifting device and the pushing device to realize the automatic stacking and orderly supply of the circuit board, effectively reducing the waiting time and space occupation during the circuit board processing, while ensuring the accurate and stable position of the circuit board before adhesive application. The flipping structure of the adhesive application device can accurately absorb and flip the adhesive tape to the optimal position for bonding to the side of the circuit board after the adhesive tape is provided by the adhesive tape supply assembly, thereby efficiently and accurately protecting the gold fingers without damaging the circuit board or affecting its function. The third conveying device of the discharge mechanism is responsible for smoothly conveying the circuit board after the adhesive application process to the discharge port, ensuring the integrity of the production process, facilitating the connection and management of subsequent processes, and providing convenience for the subsequent assembly, testing and packaging of the circuit board. In this way, the above process achieves the goal of automating the application of tape to the sides of the circuit board to protect the gold fingers of the circuit board. This solves the problems of low efficiency, poor accuracy and consistency of manual tape application in related technologies, improves production efficiency and product quality, avoids circuit board malfunctions caused by improper tape placement or loose adhesion, and enhances the reliability and standardization of the entire manufacturing process. Attached Figure Description

[0016] To more clearly illustrate the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional structural diagram of the circuit board adhesive application system provided in the embodiments of this application;

[0018] Figure 2 for Figure 1 A three-dimensional structural diagram of the circuit board adhesive system from another angle;

[0019] Figure 3 for Figure 2 Enlarged schematic diagram of point A in the circuit board adhesive application system;

[0020] Figure 4 for Figure 1 A partial structural diagram of the adhesive application mechanism in the circuit board adhesive application system;

[0021] Figure 5 for Figure 4 Enlarged schematic diagram of point B in the adhesive application mechanism;

[0022] Figure 6 for Figure 1 A partial structural diagram of the adhesive application mechanism of the circuit board adhesive application system from another angle.

[0023] The above figures include the following reference numerals:

[0024] 10. Feeding mechanism; 11. First conveying device;

[0025] 20. Buffer mechanism; 21. Second conveying device; 211. Track; 22. Lifting device; 23. Pushing device; 231. Push knife; 232. Fourth driving device; 24. Second support plate; 25. Holding assembly;

[0026] 30. Circuit board;

[0027] 40. Adhesive application mechanism; 41. Bearing structure; 42. Adhesive tape supply assembly; 421. Feeding device; 422. Tensioning device; 4221. Tensioning part; 423. Cutting device; 4231. Cutting shears; 4232. Base; 4233. First clamping member; 4234. Second clamping member; 4235. First driving device; 43. Adhesive application device; 431. Flipping structure; 4311. Flipping body; 4312. Adsorption structure; 44. Pressing device; 441. Pressing assembly; 4411. Base plate; 4412. Top plate; 4413. First support plate; 4414. Pressing structure; 4415. First hooking protrusion; 4416. Second hooking protrusion; 4417. Third hooking protrusion; 4418. First tension spring; 442. Translation assembly; 45. Machine base;

[0028] 50. Adhesive tape;

[0029] 60. Discharge mechanism; 61. Third conveying device;

[0030] 70. Transfer mechanism; 71. Fourth conveying device;

[0031] 80. The First Robotic Arm;

[0032] 90. Storage mechanism; 100. Second robotic arm; 110. Third robotic arm. Detailed Implementation

[0033] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0034] It should be noted that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. The terms "installed," "connected," and "linked" should be interpreted broadly, for example, they can be fixed connections, detachable connections, or integral connections; they can be mechanical connections or electrical connections; they can be direct connections or indirect connections through an intermediate medium; they can be internal connections between two elements. The terms "parallel," "perpendicular," and "equal" include the described situation and situations similar to the described situation, the range of which is within an acceptable deviation range, wherein the acceptable deviation range is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism can be, for example, within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality can be, for example, a difference between the two equal items being less than or equal to 5% of either one. Those skilled in the art will understand the specific meaning of the above terms in this application based on the specific circumstances.

[0035] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0036] To address the issues of low efficiency, poor accuracy, and inconsistent application of adhesive tape in related technologies, this application provides a circuit board adhesive application system.

[0037] like Figures 1 to 6As shown, the circuit board adhesive application system includes a feeding mechanism 10, a buffer mechanism 20, an adhesive application mechanism 40, and a discharging mechanism 60. The feeding mechanism 10 includes a first conveying device 11, which conveys the circuit board 30 to the inlet. The buffer mechanism 20 includes a second conveying device 21, a lifting device 22, and a pushing device 23. The second conveying device 21 is connected to and located downstream of the first conveying device 11 for conveying the circuit board 30. At least a portion of the lifting device 22 is vertically movable to lift the circuit board 30 to the buffer area for stacking. The pushing device 23 pushes the circuit board 30 located at a preset height in the buffer area onto the second conveying device 21. The adhesive application mechanism 40 includes a support structure 41, an adhesive tape supply assembly 42, and an adhesive application device 43. The support structure 41 supports the circuit board 30. The adhesive application device 43 includes a movably configured flipping structure 431, which has a first position for adsorbing the adhesive tape 50 supplied by the adhesive tape supply assembly 42 and a second position for flipping the tape 50 to face the side of the circuit board 30. The discharge mechanism 60 is located downstream of the adhesive application mechanism 40. The discharge mechanism 60 includes a third conveying device 61, which conveys the adhesive-applied circuit board 30 to the discharge port.

[0038] Applying the technical solution of this embodiment, the first conveying device 11 of the feeding mechanism 10 can smoothly transport the circuit board 30 to the inlet, ensuring the continuity and accuracy of subsequent processing. The buffer mechanism 20 receives the circuit board 30 from the first conveying device 11 through the second conveying device 21, and uses the lifting device 22 and the pushing device 23 to realize the automatic stacking and orderly supply of the circuit board 30, effectively reducing the waiting time and space occupation in the circuit board processing process, while ensuring the accurate and stable position of the circuit board before gluing. The flipping structure 431 of the gluing device 43 can accurately absorb and flip the tape 50 to the optimal position to adhere to the side of the circuit board 30 after the tape supply assembly 42 provides the tape 50, thereby efficiently and accurately completing the protection of the gold fingers without damaging the circuit board or affecting its function. The third conveying device 61 of the discharge mechanism 60 is responsible for smoothly conveying the circuit board 30 after the gluing process to the discharge port, ensuring the integrity of the production process, facilitating the connection and management of subsequent processes, and providing convenience for the subsequent assembly, testing and packaging of the circuit board. In this way, the above process achieves the purpose of automating the application of tape 50 to the side of the circuit board 30 to protect the gold fingers of the circuit board. This solves the problems of low tape application efficiency and poor accuracy and consistency of manual tape application in related technologies, improves production efficiency and product quality, avoids circuit board malfunctions caused by improper tape placement or loose adhesion, and enhances the reliability and standardization of the entire manufacturing process.

[0039] like Figures 4 to 6As shown, the adhesive applicator 40 also includes a pressing device 44, which comprises a pressing assembly 441 and a translation assembly 442. The pressing assembly 441 has a pressing cavity, the size of which is adjustable to press the adhesive tape 50 covering the side of the circuit board 30 firmly onto the side. The translation assembly 442 is driven to the pressing assembly 441 to move the pressing assembly 441 toward or away from the circuit board 30. Specifically, when the translation assembly 442 drives the pressing assembly 441 toward the circuit board 30, the pressing assembly 441 presses the adhesive tape 50 onto the circuit board 30 along its width. Thus, by precisely controlling the coordinated movement of the pressing assembly 441 and the translation assembly 442, the adhesive tape 50 is tightly adhered to the side of the circuit board 30, thereby achieving the technical effect of enhanced protection for the gold fingers.

[0040] In this embodiment, the pressing assembly 441 has an adjustable pressing cavity, which can be precisely adjusted according to the sides of the circuit board 30 of different sizes to ensure that the tape 50 can completely adhere to the sides of the circuit board, improving the adaptability and adhesion accuracy of the adhesive. The translation assembly 442 is driven to connect with the pressing assembly 441, enabling the pressing assembly 441 to precisely approach and move away from the circuit board 30. When the translation assembly 442 drives the pressing assembly 441 to move towards the circuit board 30, the pressing cavity of the pressing assembly 441 can uniformly press the tape 50 along the width direction of the circuit board 30, ensuring the flatness of the tape and the firmness of the adhesion. At the same time, the above settings not only improve the reliability of the circuit board gold finger protection and avoid signal transmission problems and circuit board failures caused by poor tape adhesion, but also improve the appearance quality of the product, reduce the need for post-processing, and reduce production costs and defect rate.

[0041] like Figure 4 and Figure 6 As shown, the adhesive applicator 40 also includes a base 45, on which the supporting structure 41, the tape supply assembly 42, and the tape applicator 43 are all mounted. The tape supply assembly 42 includes a feeding device 421, a tensioning device 422, and a cutting device 423. The feeding device 421 includes a spool on which the tape 50 is wound. The tensioning device 422 includes a retractable tensioning part 4221, which is used to pull or tighten the free end of the tape 50 to unwind it from the spool. The cutting device 423 is located between the feeding device 421 and the tensioning device 422. The cutting device 423 includes a cutting shear 4231, which is used to cut the tape 50. In this way, by setting up a tape supply assembly 42, a support structure 41, and an adhesive application device 43 on the base 45, and by optimizing the feeding, tensioning, and cutting processes of the tape supply assembly 42, the technical effect of precise supply and cutting of tape 50 is achieved, thereby improving the quality and efficiency of adhesive application.

[0042] In this embodiment, the feeding device 421 uses a reel to stably store the tape 50, ensuring a stable and continuous supply of tape during the application process and avoiding production stoppages caused by tape supply interruptions. The cutting shears 4231 of the cutting device 423, located between the feeding and tensioning devices, can accurately cut the tape 50 to the required length after it has been tensioned to the appropriate position, ensuring the accuracy of tape cutting and avoiding tape waste.

[0043] Specifically, the tensioning part 4221 gradually retracts from its extended state to tighten the free end of the tape 50 to a preset position, ensuring that the tape to be cut is at a set length so that the cutting scissors 4231 can cut it. After the cutting scissors 4231 finishes cutting, the tensioning part 4221 gradually extends until it tightens the free end of the next section of tape 50 to be cut. Then, the tensioning part 4221 gradually retracts from its extended state, and the above process is repeated.

[0044] like Figure 6 As shown, the cutting device 423 also includes a base 4232, a clamping assembly, and a first driving device 4235. The clamping assembly is disposed on the base 4232 and includes a first clamping member 4233 and a second clamping member 4234 disposed opposite to each other, forming a tape clamping space between the first clamping member 4233 and the second clamping member 4234. The size of the tape clamping space is adjustable. The first driving device 4235 is drivenly connected to the cutting scissors 4231 to drive the cutting scissors 4231 to extend and retract relative to the base 4232. The clamping assembly has a clamping state for clamping the tape 50 and a releasing state for releasing the tape 50. When the clamping assembly is in the clamping state, the tensioning part 4221 tensions the free end of the tape 50, and the cutting scissors 4231 can extend to cut the tape 50. When the clamping assembly is in the releasing state, the tensioning part 4221 drags the free end of the tape 50 until the tape 50 moves into the tape clamping space. In this way, the base 4232 serves as the support and fixing foundation for the cutting device. The clamping assembly, through the adjustable tape clamping space formed between the first clamping member 4233 and the second clamping member 4234, can accurately clamp the tape 50, ensuring stability during the cutting process. The first driving device 4235 is connected to the cutting scissors 4231, realizing the precise extension and retraction of the cutting scissors 4231. When the clamping assembly is in the clamping state, the tensioning part 4221 pulls the free end of the tape 50 to the set length. At this time, the cutting scissors 4231 extend, which can accurately cut the tape to the required length, avoiding waste and adhesive quality problems caused by inaccurate cutting.

[0045] In this embodiment, when the clamping assembly is in the released state, the tensioning part 4221 can drag the free end of the tape 50 until the tape is completely moved into the tape clamping space. This process not only ensures a continuous supply of tape but also ensures that the tape length is consistent before each cut, improving cutting accuracy and efficiency. After cutting, the tape, under the action of the adhesive applicator 43, can be accurately applied to the gold finger area of ​​the circuit board 30, avoiding inconsistencies and potential errors associated with manual operation, significantly improving the reliability of the circuit board gold finger protection and the automation level of the adhesive applicator process.

[0046] like Figure 4 As shown, the flipping structure 431 includes a flipping body 4311, an adsorption structure 4312, and a second driving device. The flipping body 4311 is rotatably mounted on the base 45. The adsorption structure 4312 is mounted on the flipping body 4311 and has a vacuum adsorption surface for adsorbing the tape 50. The second driving device is driven to connect to the flipping body 4311 to drive the flipping body 4311 to rotate. The supporting structure 41 and the tape supply assembly 42 are located on opposite sides of the flipping structure 431. The flipping structure 431 has a first position and a second position. When the flipping structure 431 is in the first position, the vacuum adsorption surface faces the tape supply assembly 42 to adsorb the cut tape 50. After the tape 50 is adsorbed by the vacuum adsorption surface, the second driving device drives the flipping structure 431 to rotate from the first position to the second position. After the tape 50 is adhered to the side of the circuit board 30, the adsorption structure 4312 releases the tape 50. In this way, through the precise control of the flipping body 4311 and the efficient operation of the adsorption structure 4312, the tape 50 is precisely adsorbed and flipped to adhere to the side of the circuit board 30, thereby improving the accuracy and speed of adhesive application.

[0047] In this embodiment, the flipping body 4311 is rotatably mounted on the base 45, ensuring the flexibility and accuracy of the flipping action. The vacuum adsorption surface of the adsorption structure 4312 can stably adsorb the cut tape 50, ensuring the flatness and positioning of the tape during the transfer process. The second driving device is driven and connected to the flipping body 4311, realizing the precise rotation of the flipping structure 431, ensuring that the tape 50 smoothly transitions from the adsorption state on the tape supply assembly 42 side to the bonding state on the circuit board 30 side.

[0048] Specifically, when the flipping structure 431 is in the first position, the vacuum adsorption surface of the adsorption structure 4312 faces the tape supply assembly 42, accurately adsorbing the cut tape 50 and preventing displacement or deformation of the tape during transfer. Subsequently, the second driving device drives the flipping structure 431 to rotate to the second position. At this point, the tape 50 carried by the vacuum adsorption surface is accurately adhered to the side of the circuit board 30. Precise positioning and firm adhesion ensure effective protection of the gold finger area, while also avoiding air bubbles or uneven adhesion problems that may be introduced by manual application. After the tape 50 is adhered, the adsorption structure 4312 releases the tape 50, completing the entire application process. This setup not only improves the automation level of the application process but also enhances the application quality, ensuring the stability and reliability of the circuit board during subsequent processing and use.

[0049] like Figure 5 As shown, the pressing assembly 441 includes a support base, two opposing pressing structures 4414, a first hook-on protrusion 4415, a second hook-on protrusion 4416, and at least two third hook-on protrusions 4417. The support base is connected to the translation assembly 442. The support base includes a base plate 4411, a top plate 4412, and a first support plate 4413. The base plate 4411 is connected to the top plate 4412 via the first support plate 4413. Each pressing structure 4414 includes a connecting plate and a roller. The roller is rotatably mounted on the connecting plate, which is located between the base plate 4411 and the top plate 4412 and rotatably mounted on the first support plate 4413; a pressing cavity is formed between the two rollers. The first hook-on protrusion 4415 is mounted on the top plate 4412, and the second hook-on protrusion 4416 is mounted on the base plate 4411. Each connecting plate is provided with at least one third hook-on protrusion 4417. Specifically, the second hooking protrusion 4416 is connected to the adjacent third hooking protrusion 4417 via a first tension spring 4418; and / or, the first hooking protrusion 4415 is connected to the adjacent third hooking protrusion 4417 via a second tension spring. This arrangement enables efficient and precise pressing of the tape 50 onto the side of the circuit board, improving the automation level and yield of the adhesive application process, while also ensuring adaptability and controllability during the pressing process, thus enhancing the reliability of the adhesive application.

[0050] In this embodiment, the support base serves as the basic component of the pressing assembly 441. It forms a stable frame structure through the base plate 4411, top plate 4412, and first support plate 4413, ensuring mechanical stability during the pressing process. The connecting plates and rotatable rollers of each pressing structure 4414 allow for flexible adaptation to circuit boards of different thicknesses and sizes. Simultaneously, the pressing cavity formed between the two rollers ensures the flatness and adhesion of the tape 50 during the pressing process. The combination of the first hook protrusion 4415, the second hook protrusion 4416, and at least two third hook protrusions 4417 with a tension spring enables adaptive pressing and releasing of the pressing structure 4414. Under the action of the tension spring, even with variations in circuit board thickness, the size of the pressing cavity is adjusted to the optimal state, ensuring that the tape 50 is neither too tight, causing tape deformation, nor too loose, affecting the adhesion effect. In this way, the aforementioned adaptive pressing mechanism ensures that the tape 50 can be uniformly and stably pressed on all parts of the circuit board side, thereby improving the quality of the adhesive application and the overall performance of the circuit board.

[0051] like Figure 3 As shown, the buffer mechanism 20 also includes a second support plate 24 and a holding component 25. The surface of the second support plate 24 forms the overlapping surface of the buffer area, and the holding component 25 is used to clamp the circuit board 30 located above a preset height position within the buffer area. The second conveying device 21 includes two opposing tracks 211 and a third driving device. The third driving device is driven by both tracks 211 to move them toward or away from each other. During the process of the lifting device 22 lifting the circuit board 30, the third driving device drives the two tracks 211 away from each other until the circuit board 30 rises above the overlapping surface. Then, the third driving device drives the two tracks 211 toward each other to return to their initial state. This arrangement not only optimizes the stacking and handling process of circuit boards in the buffer mechanism, improving the storage efficiency and processing speed of the circuit boards, but also ensures the integrity and safety of the circuit boards during processing, reducing production stoppages and circuit board damage caused by improper stacking or handling errors, significantly improving the level of production automation and overall production efficiency.

[0052] In this embodiment, the second support plate 24 serves as the overlapping surface of the buffer area, providing a flat placement platform for the circuit board. The retaining component 25 effectively clamps the circuit board above a preset height, ensuring stable stacking within the buffer area and preventing damage or disorder caused by unstable stacking. This ensures efficient and safe placement and removal of the circuit board. The dynamic adjustment mechanism of the two opposing tracks 211 of the second conveying device 21 and the third drive device enables height adaptability and precise control of track spacing during circuit board transport. As the lifting device 22 raises the circuit board 30, the third drive device drives the two tracks 211 away from each other, providing sufficient space for smooth lifting of the circuit board and preventing collisions or jamming between the circuit board and the tracks, ensuring a smooth and safe lifting process. When the circuit board 30 rises above the overlapping surface, the third drive device again drives the two tracks 211 towards each other, returning to their initial state. This ensures the circuit board is stably placed on the overlapping surface, providing reliable support for subsequent buffering, adhesive application, and transport.

[0053] like Figure 3 As shown, the pushing device 23 includes two pushers 231 and two fourth drive devices 232. The two pushers 231 are located on either side of the second conveying device 21, and the pushing direction of each pusher 231 is parallel to the surface of the circuit board 30. The two fourth drive devices 232 are arranged one-to-one with the two pushers 231, each driving its corresponding pusher 231 to move towards the circuit board 30, thus pushing the circuit board 30 onto the second conveying device 21. In this way, by precisely controlling the pushing direction and parallel movement of the pushers to the surface, the circuit board 30 is efficiently and orderly pushed from the buffer area to the conveyor line, thereby solving the technical problems of low production efficiency, circuit board damage during handling, and irregular placement caused by manual handling in traditional circuit board processing.

[0054] In this embodiment, two pushers 231 are located on both sides of the second conveying device 21, and their pushing direction is parallel to the surface of the circuit board 30. This ensures that the plane of the circuit board remains unaffected when pushing the circuit board, avoiding warping or damage during the pushing process, and guaranteeing the quality of the circuit board and the smooth progress of subsequent processes. The two fourth driving devices 232 are configured in a one-to-one correspondence with the pushers 231, which can precisely control the movement stroke and force of each pusher 231 according to the specific position of the circuit board and the conveying requirements. This ensures that the circuit board falls smoothly and accurately from the buffer area onto the second conveying device 21, avoiding misalignment or damage to the circuit board caused by excessive pushing force or directional deviation.

[0055] In this embodiment, the two push blades 231 are used alternately.

[0056] like Figure 1 and Figure 2 As shown, the circuit board bonding system also includes a transfer mechanism 70, a first robotic arm 80, and a control module. The transfer mechanism 70 includes a fourth conveying device 71 and a first detection device. The first detection device detects whether a circuit board 30 is stored on the fourth conveying device 71. The fourth conveying device 71 is connected to and located downstream of the second conveying device 21. The first robotic arm 80 transfers the circuit board 30 located on the fourth conveying device 71 to the support structure 41. The control module is electrically connected to both the first detection device and the pushing device 23. When the first detection device does not detect a circuit board 30, the control module controls the pushing device 23 to start, pushing the circuit board 30 buffered in the buffer area onto the second conveying device 21. In this way, the integrated application of the transfer mechanism 70, the first robotic arm 80 and the control module, through the coordinated operation of the fourth conveying device 71 and the first detection device, and the precise transfer of the first robotic arm 80, realizes the automated flow of the circuit board 30 from the buffer to the adhesive application station, ensuring the continuity and efficiency of the adhesive application operation, and significantly improving the intelligence level and production efficiency of the entire adhesive application system.

[0057] In this embodiment, the fourth conveying device 71 is closely connected to the second conveying device 21 and located downstream of the second conveying device. It can seamlessly receive the circuit boards 30 that are orderly delivered by the pushing device 23, ensuring a smooth transition of the circuit boards on the conveyor line. The first detection device can monitor the status of the circuit boards 30 on the fourth conveying device 71 in real time. When it detects that there are no circuit boards on the fourth conveying device, the control module responds immediately and starts the pushing device 23 to accurately push the circuit boards buffered in the buffer area onto the second conveying device 21. This avoids production line stagnation caused by untimely supply of circuit boards and ensures the continuity and high efficiency of the adhesive application operation. At the same time, the precise transfer function of the first robotic arm 80 enables the circuit boards to be automatically and error-free transferred between the fourth conveying device 71 and the supporting structure 41. This avoids circuit board damage and inaccurate positioning problems during manual handling, ensuring the accurate placement of the circuit boards at the adhesive application station and providing a solid foundation for subsequent adhesive application operations.

[0058] In this embodiment, the control module serves as the command center of the entire system. It can not only activate the pusher device 23 in a timely manner based on the feedback signal from the first detection device, but also coordinate the actions of the first robotic arm 80 to ensure that the circuit board transfer process is efficient and safe, thus realizing the fully automated control of the circuit board gluing system from the buffer to the gluing station.

[0059] like Figure 1 and Figure 2As shown, the circuit board bonding system also includes a storage mechanism 90, a second detection device, and a communication module. The storage mechanism 90 includes a fifth conveying device, a second lifting device, and a second pushing device. The fifth conveying device is connected to and located downstream of the fourth and third conveying devices 71 and 61, for conveying the circuit boards 30. At least part of the second lifting device is vertically movable to lift the circuit boards 30 to the storage area for stacking. The second pushing device pushes the circuit boards 30 in the storage area onto the fifth conveying device. The second detection device detects the number of circuit boards 30 in the storage area or the volume occupied by the circuit boards 30. The control module is electrically connected to both the second detection device and the communication module. When the detection value of the second detection device is greater than or equal to a preset value, the control module controls the communication module to transmit signals to the AGV system, so that the circuit boards 30 can be transferred via the AGV system. In this way, through the highly intelligent collaboration of the fifth conveying device, the second lifting device, and the second pushing device, the circuit board 30 is automatically transferred from the adhesive application station to the storage area. Through precise detection of the number of circuit boards or the volume occupied, as well as intelligent communication with the AGV system, the efficient and orderly storage and transfer of circuit boards are ensured, which significantly improves the intelligent management and production efficiency of the entire adhesive application system.

[0060] In this embodiment, the docking design of the fifth conveying device with the fourth conveying device 71 and the third conveying device 61 enables seamless transfer of circuit boards between the gluing, inspection, and storage stations, ensuring efficient transfer of circuit boards between various process stages. The lifting capability of the second lifting device allows for dynamic adjustment of the stacking height of the circuit boards 30 according to the actual situation in the storage area, avoiding space waste and management inconvenience caused by improper circuit board stacking, and ensuring stable stacking and maximizing storage density. Simultaneously, the second pushing device smoothly and orderly pushes the circuit boards in the storage area onto the fifth conveying device, achieving automated transfer of circuit boards from the storage area to subsequent processes, avoiding circuit board damage and process interruptions that may occur due to manual handling. The integrated use of the second inspection device allows for real-time monitoring of the number or volume of circuit boards in the storage area. When the inspection value reaches or exceeds a preset threshold, the control module immediately responds, triggering signal transmission between the communication module and the AGV system. Through the automated transfer of the AGV system, not only are safety hazards and management problems caused by excessive circuit board accumulation avoided, but the continuous and efficient operation of the gluing system is also ensured, reducing production bottlenecks caused by circuit board backlog.

[0061] Specifically, the control module, as the core of the entire system, not only activates the second pushing device and communication module in a timely manner based on feedback signals from the second detection device, ensuring efficient flow and safe management of circuit boards within the storage area, but also communicates intelligently with the AGV system to coordinate the AGV's transfer timing and route planning, achieving fully automated control of the entire process from adhesive application to storage and transfer of circuit boards. In summary, this technical solution, through the intelligent integration of the storage mechanism 90, the second detection device, and the communication module, achieves a high degree of automation in the storage and transfer stations of the circuit board adhesive application system.

[0062] like Figure 1 As shown, the circuit board adhesive application system also includes a second robotic arm 100 and a third robotic arm 110. The second robotic arm 100 is used to transfer circuit boards located in the storage area, and the third robotic arm 110 is capable of transferring circuit boards on the first conveying device 11.

[0063] As can be seen from the above description, the embodiments of the present invention achieve the following technical effects:

[0064] The first conveyor of the feeding mechanism smoothly transports circuit boards to the inlet, ensuring the continuity and accuracy of subsequent processing. The buffer mechanism receives circuit boards from the first conveyor via a second conveyor, utilizing a lifting and pushing device to automatically stack and orderly supply the boards, effectively reducing waiting time and space occupation during processing, while ensuring the accurate and stable positioning of the circuit boards before adhesive application. The flipping structure of the adhesive application device precisely absorbs and flips the adhesive tape provided by the tape supply assembly to the optimal position for application to the side of the circuit board, thus efficiently and accurately protecting the gold fingers without damaging the circuit board or affecting its function. The third conveyor of the unloading mechanism smoothly transports the circuit boards after adhesive application to the unloading port, ensuring the integrity of the production process, facilitating the connection and management of subsequent processes, and providing convenience for subsequent assembly, testing, and packaging of the circuit boards. In this way, the above process achieves the goal of automating the application of tape to the sides of the circuit board to protect the gold fingers of the circuit board. This solves the problems of low efficiency, poor accuracy and consistency of manual tape application in related technologies, improves production efficiency and product quality, avoids circuit board malfunctions caused by improper tape placement or loose adhesion, and enhances the reliability and standardization of the entire manufacturing process.

[0065] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the method and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A circuit board adhesive application system, characterized in that, include: The feeding mechanism (10) includes a first conveying device (11) for conveying the circuit board (30) to the inlet; The buffer mechanism (20) includes a second conveying device (21), a lifting device (22), and a pushing device (23). The second conveying device (21) is connected to the first conveying device (11) and located downstream of the first conveying device (11) for conveying the circuit board (30). At least a portion of the lifting device (22) is vertically and vertically configured to lift the circuit board (30) to the buffer area for stacking. The pushing device (23) is used to push the circuit board (30) located at a preset height position in the buffer area onto the second conveying device (21). The adhesive applicator (40) includes a support structure (41), an adhesive tape supply assembly (42), and an adhesive applicator (43). The support structure (41) is used to support the circuit board (30). The adhesive applicator (43) includes a movably configured flip structure (431). The flip structure (431) has a first position for adsorbing the adhesive tape (50) supplied by the adhesive tape supply assembly (42) and a second position for flipping the adhesive tape (50) to the side of the circuit board (30) facing the adhesive tape (50). The discharge mechanism (60) is located downstream of the adhesive applicator (40). The discharge mechanism (60) includes a third conveying device (61) for conveying the finished adhesive-applied circuit board (30) to the discharge port.

2. The circuit board adhesive application system according to claim 1, characterized in that, The adhesive applicator (40) further includes a pressing device (44), which comprises: The pressing assembly (441) has a pressing cavity whose size is adjustable for pressing the tape (50) covering the side of the circuit board (30) onto the side. Translation component (442), which is drivenly connected to the pressing component (441) to drive the pressing component (441) to move toward or away from the circuit board (30); When the translation component (442) drives the pressing component (441) to move toward the circuit board (30), the pressing component (441) presses the tape (50) onto the circuit board (30) along the width direction of the circuit board (30).

3. The circuit board adhesive application system according to claim 1, characterized in that, The adhesive applicator (40) further includes a base (45), on which the supporting structure (41), the adhesive tape supply assembly (42), and the adhesive applicator (43) are all mounted; the adhesive tape supply assembly (42) includes: The feeding device (421) includes a reel on which the tape (50) is wound; The tensioning device (422) includes a retractable tensioning part (4221) for dragging or tightening the free end of the tape (50) to unwind the tape (50) from the reel; A cutting device (423) is located between the feeding device (421) and the tensioning device (422). The cutting device (423) includes a cutting shear (4231) for cutting the tape (50).

4. The circuit board adhesive application system according to claim 3, characterized in that, The cutting device (423) further includes: seat(4232); A clamping assembly is disposed on the base (4232). The clamping assembly includes a first clamping member (4233) and a second clamping member (4234) disposed opposite to each other. A tape clamping space is formed between the first clamping member (4233) and the second clamping member (4234). The size of the tape clamping space is adjustable. A first driving device (4235) is drivingly connected to the cutting scissors (4231) to drive the cutting scissors (4231) to extend and retract relative to the base (4232); The clamping assembly has a clamping state for clamping the tape (50) and a releasing state for releasing the tape (50). When the clamping assembly is in the clamping state, the tensioning part (4221) tensions the free end of the tape (50), and the cutter (4231) can extend to cut the tape (50). When the clamping assembly is in the releasing state, the tensioning part (4221) drags the free end of the tape (50) until the tape (50) moves into the tape clamping space.

5. The circuit board adhesive application system according to claim 3, characterized in that, The flip structure (431) includes: The flip-over body (4311) is rotatably mounted on the base (45); An adsorption structure (4312) is disposed on the flipping body (4311), the adsorption structure (4312) having a vacuum adsorption surface, the vacuum adsorption surface being used to adsorb the tape (50). The second driving device is connected to the flipping body (4311) to drive the flipping body (4311) to rotate; The supporting structure (41) and the tape supply assembly (42) are located on both sides of the flipping structure (431); the flipping structure (431) has a first position and a second position; when the flipping structure (431) is in the first position, the vacuum adsorption surface faces the tape supply assembly (42) to adsorb the cut tape (50); after the tape (50) is adsorbed by the vacuum adsorption surface, the second driving device drives the flipping structure (431) to rotate from the first position to the second position, and after the tape (50) is adhered to the side of the circuit board (30), the adsorption structure (4312) releases the tape (50).

6. The circuit board adhesive application system according to claim 2, characterized in that, The pressing assembly (441) includes: A support base is connected to the translation component (442). The support base includes a bottom plate (4411), a top plate (4412), and a first support plate (4413). The bottom plate (4411) is connected to the top plate (4412) through the first support plate (4413). Two opposing pressing structures (4414) are provided, each pressing structure (4414) including a connecting plate and a roller, the roller being rotatably disposed on the connecting plate, the connecting plate being located between the bottom plate (4411) and the top plate (4412) and rotatably disposed on the first support plate (4413); the pressing cavity is formed between the two rollers; The first hooking protrusion (4415) is provided on the top plate (4412); The second hooking protrusion (4416) is provided on the base plate (4411); At least two third hooking protrusions (4417) are provided on each of the connecting plates. The second hook protrusion (4416) is connected to the third hook protrusion (4417) adjacent to it via a first tension spring (4418); and / or, the first hook protrusion (4415) is connected to the third hook protrusion (4417) adjacent to it via a second tension spring.

7. The circuit board adhesive application system according to claim 1, characterized in that, The caching mechanism (20) also includes: The second support plate (24) has a plate surface that forms the overlapping surface of the buffer area; A retaining component (25) is used to hold the circuit board (30) located above the preset height position within the buffer area. The second conveying device (21) includes two oppositely arranged tracks (211) and a third driving device. The third driving device is driven to both tracks (211) to drive the two tracks (211) to move toward or away from each other. During the process of the lifting device (22) driving the circuit board (30) to rise, the third driving device drives the two tracks (211) to move away from each other until the circuit board (30) rises above the overlapping surface, at which point the third driving device drives the two tracks (211) to move towards each other to return to the initial state.

8. The circuit board adhesive application system according to claim 1, characterized in that, The feeding device (23) includes: Two push blades (231) are located on both sides of the second conveying device (21), and the pushing direction of each push blade (231) is parallel to the surface of the circuit board (30); Two fourth drive devices (232) are arranged one-to-one with the two push blades (231). Each fourth drive device (232) drives its corresponding push blade (231) to move toward the circuit board (30) so as to push the circuit board (30) onto the second conveying device (21).

9. The circuit board adhesive application system according to claim 1, characterized in that, The circuit board adhesive application system also includes: The transfer mechanism (70) includes a fourth conveying device (71) and a first detection device, the first detection device being used to detect whether a circuit board (30) is stored on the fourth conveying device (71); the fourth conveying device (71) is connected to the second conveying device (21) and is located downstream of the second conveying device (21); A first robotic arm (80) is used to transfer a circuit board (30) located on the fourth conveying device (71) to the support structure (41); The control module is electrically connected to both the first detection device and the feeding device (23); When the first detection device does not detect the circuit board (30), the control module controls the pusher (23) to start, so as to push the circuit board (30) buffered in the buffer area onto the second conveyor (21) through the pusher (23).

10. The circuit board adhesive application system according to claim 9, characterized in that, The circuit board adhesive application system also includes: The storage mechanism (90) includes a fifth conveying device, a second lifting device, and a second pushing device. The fifth conveying device is connected to and located downstream of the fourth conveying device (71) and the third conveying device (61) for conveying the circuit board (30). The second lifting device is at least partially liftable to lift the circuit board (30) to the storage area for stacking. The second pushing device is used to push the circuit board (30) in the storage area onto the fifth conveying device. The second detection device is used to detect the number of circuit boards (30) in the storage area or the volume occupied by the circuit boards (30); Communication module; The control module is electrically connected to both the second detection device and the communication module; When the detection value of the second detection device is greater than or equal to a preset value, the control module controls the communication module to transmit signals with the AGV system so as to transfer the circuit board (30) through the AGV system.

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