Manufacturing method, circuit board assembly, mobile terminal, and solder paste device

Abstract

The present disclosure relates to a preparation method, a circuit board assembly, a mobile terminal and a tin paste device. The preparation method of the circuit board assembly comprises: mounting electronic devices on at least part of a plurality of circuit boards; wherein at least part of the circuit boards comprise the circuit board with a mounting cavity, and the electronic devices are mounted in the mounting cavity; and performing soldering on the plurality of circuit boards to form a circuit board assembly, so that the mounting cavity of at least one of the circuit boards in the circuit board assembly is mounted with the electronic devices on both sides along the thickness direction of the circuit board. The embodiment of the present disclosure can realize more layout of electronic devices.

Description

Technical Field

[0001] This disclosure relates to the field of mobile terminal technology, and in particular to a preparation method, circuit board assembly, mobile terminal, and solder paste equipment. Background Technology

[0002] As mobile devices become increasingly thinner, more and more are adopting ultra-thin stacking designs, further compressing the space available for PCB components. Furthermore, with the increasing functionality of mobile devices, the number of electronic devices that need to be housed on the PCB is also constantly increasing. Therefore, how to fit more electronic components into the PCB within increasingly limited space has become a pressing issue. Summary of the Invention

[0003] To overcome the problems existing in related technologies, this disclosure provides a preparation method, a circuit board assembly, a mobile terminal, and a solder paste equipment, which can lay out more electronic devices.

[0004] According to a first aspect of the present disclosure, a method for manufacturing a circuit board assembly is provided, the method comprising:

[0005] Electronic devices are mounted on at least a portion of a plurality of circuit boards; wherein at least a portion of the circuit boards includes a circuit board having a mounting cavity, and the electronic devices are mounted within the mounting cavity;

[0006] Soldering is performed on a plurality of said circuit boards to form said circuit board assembly, such that said electronic devices are mounted on both sides of the mounting cavity of at least one of said circuit boards in said circuit board assembly along the thickness direction of said circuit board.

[0007] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0008] The electronic device is mounted in at least one mounting cavity of the circuit board;

[0009] For all mounting cavities where the electronic device is installed, the electronic device is installed on each of the circuit boards with openings covering all the mounting cavities, such that the electronic device can be distributed along the thickness direction on both sides of each mounting cavity.

[0010] In some embodiments, mounting the electronic device within a mounting cavity of at least one of the circuit boards includes:

[0011] Solder paste is applied to the bottom of the mounting cavity of each of the circuit boards;

[0012] The electronic components are mounted on the solder paste positions at the bottom of the mounting cavities of each of the circuit boards.

[0013] In some embodiments, applying solder paste to the bottom of the mounting cavity of each of the circuit boards includes: applying the solder paste to the bottom of the mounting cavity of each of the circuit boards using a three-dimensional soldering process;

[0014] And / or,

[0015] Mounting the electronic components at the solder paste location at the bottom of the mounting cavity of each of the circuit boards includes mounting the electronic components at the solder paste location using a deep cavity die-casting process.

[0016] In some embodiments, the plurality of circuit boards include: a first circuit board, a second circuit board, and a third circuit board; both the first circuit board and the second circuit board have the mounting cavity;

[0017] The step of soldering multiple circuit boards to form a circuit board assembly, such that the electronic device is mounted on both sides of the mounting cavity of at least one circuit board in the circuit board assembly along the thickness direction of the circuit board, includes:

[0018] Soldering is performed on the first circuit board, the second circuit board, and the third circuit board to form a first circuit board assembly; wherein, the electronic devices are mounted on both sides of the mounting cavity of the first circuit board in the first circuit board assembly along the thickness direction;

[0019] And / or,

[0020] Soldering is performed on the first circuit board, the second circuit board, and the third circuit board to form a second circuit board assembly; wherein, the electronic devices are mounted on both sides of the mounting cavity of the second circuit board in the second circuit board assembly along the thickness direction.

[0021] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0022] The electronic device is mounted at the bottom of the mounting cavity of the first circuit board and the second circuit board;

[0023] The step of soldering the first circuit board, the second circuit board, and the third circuit board to form the first circuit board assembly includes:

[0024] Soldering is performed on the third circuit board and the installed second circuit board to form a first stacked structure;

[0025] The first circuit board, after installation, is soldered to the second circuit board of the first stacked structure to form the first circuit board assembly.

[0026] In some embodiments, the preparation method further includes:

[0027] The molten tin is applied to the first layered structure using a three-dimensional tin spraying process.

[0028] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0029] The electronic device is mounted at the bottom of the mounting cavity of the second circuit board and the third circuit board;

[0030] The step of soldering the first circuit board, the second circuit board, and the third circuit board to form a second circuit board assembly includes:

[0031] Soldering is performed on the first circuit board and the installed second circuit board to form a second stacked structure;

[0032] The second circuit board of the second stacked structure is soldered to the third circuit board after installation to form the second circuit board assembly.

[0033] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0034] A shielding structure is mounted on at least one of the circuit boards; wherein the shielding structure is at least used to isolate the electronic devices disposed on both sides of the mounting cavity of the circuit board along the thickness direction;

[0035] And / or,

[0036] A connector is mounted on at least one of the circuit boards; wherein the connector is located outside the mounting cavity.

[0037] According to a second aspect of the present disclosure, a circuit board assembly is provided, the circuit board assembly being manufactured using the preparation method described in the first aspect.

[0038] According to a third aspect of the present disclosure, a mobile terminal is provided, comprising:

[0039] Housing and circuit board assembly disposed in the housing;

[0040] The circuit board assembly is manufactured using the preparation method described in the first aspect above.

[0041] According to a fourth aspect of the present disclosure, a solder paste apparatus is provided, comprising:

[0042] Solder paste dispenser;

[0043] A driving component, connected to the solder paste needle, is used to drive the solder paste needle to apply the solder paste into the mounting cavity of at least one circuit board in the circuit board assembly, such that electronic devices are mounted on both sides of the mounting cavity of at least one circuit board along the thickness direction of the circuit board.

[0044] In some embodiments, the inner diameter of the solder paste needle is in the range of 0.05 mm to 0.08 mm;

[0045] And / or,

[0046] The length of the solder paste needle is in the range of 1.6 mm to 1.8 mm.

[0047] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0048] In this embodiment of the present disclosure, electronic devices are mounted on at least a portion of a plurality of circuit boards, electronic devices are mounted in the mounting cavity of at least one circuit board, and the plurality of circuit boards are soldered to form a circuit board assembly, such that electronic devices are mounted on both sides of the mounting cavity of at least one circuit board in the circuit board assembly along the thickness direction of the circuit board.

[0049] Thus, by installing electronic components inside the mounting cavity, the number of electronic components that can be arranged in the thickness direction of the circuit board assembly can be increased, allowing for the arrangement of more electronic components. This not only reduces the space occupied by the circuit board assembly in the mobile terminal and improves the space utilization of the circuit board assembly, but also makes the arrangement of electronic components more flexible.

[0050] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0051] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0052] Figure 1 This is a flowchart illustrating a method for manufacturing a circuit board assembly according to an exemplary embodiment.

[0053] Figure 2 This is a schematic diagram illustrating a first circuit board assembly manufactured by a preparation method according to an exemplary embodiment.

[0054] Figure 3 This is a schematic diagram illustrating a second circuit board assembly manufactured by a preparation method according to an exemplary embodiment.

[0055] Figure 4 This is a schematic diagram illustrating the fabrication process of a first circuit board assembly according to an exemplary embodiment.

[0056] Figure 5 This is a schematic diagram illustrating the fabrication process of a second circuit board assembly according to an exemplary embodiment.

[0057] Figure 6 This is a schematic diagram illustrating the fabrication process of a first circuit board assembly according to an exemplary embodiment.

[0058] Figure 7 This is a schematic diagram illustrating the fabrication process of a second circuit board assembly according to an exemplary embodiment.

[0059] Figure 8 This is a schematic diagram of a solder paste nozzle in a solder paste apparatus according to an exemplary embodiment.

[0060] Figure 9 This is a structural block diagram of a mobile terminal according to an exemplary embodiment. Detailed Implementation

[0061] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0062] This disclosure provides a method for manufacturing a circuit board assembly. Figure 1 This is a flowchart illustrating a method for manufacturing a circuit board assembly according to an exemplary embodiment. Figure 1 As shown, the method for manufacturing the circuit board assembly includes the following steps:

[0063] S11. Installing electronic devices on at least a portion of a plurality of circuit boards; wherein at least a portion of the circuit boards includes a circuit board having a mounting cavity, and the electronic devices are installed within the mounting cavity;

[0064] S12. Soldering multiple circuit boards to form a circuit board assembly, such that electronic devices are mounted on both sides of the mounting cavity of at least one circuit board in the circuit board assembly along the thickness direction of the circuit board.

[0065] In this embodiment of the disclosure, the preparation method is used to prepare a circuit board assembly, such that electronic devices are mounted on both sides of at least one mounting cavity in the circuit board assembly along the thickness direction of the circuit board.

[0066] In step S11, each of the multiple circuit boards can be either a printed circuit board (PCB) or a flexible printed circuit (FPC). Furthermore, the multiple circuit boards can all have different functions, or some of the circuit boards can have the same function.

[0067] For example, multiple circuit boards may include: an RF circuit board, a main circuit board, and a power supply circuit board. Alternatively, multiple circuit boards may include: two RF circuit boards and one main circuit board.

[0068] The main circuit board is used to process internal and external signals and control all functions, including display, charging, power on / off, and other applications. It also supports various electronic devices, providing electrical connections or insulation between them. The radio frequency (RF) circuit board is used to receive and transmit communication signals for electronic devices. The power supply circuit board implements power-related functions.

[0069] In this embodiment of the disclosure, at least a portion of the circuit board includes a circuit board having a mounting cavity. The circuit board having the mounting cavity may be one or more.

[0070] For example, such as Figure 2 and Figure 3 As shown, the electronic device has three circuit boards; the first circuit board 201 has a mounting cavity, and the second circuit board 202 also has a mounting cavity, that is, both circuit boards in the electronic device have mounting cavities.

[0071] In this embodiment of the disclosure, mounting electronic devices on at least a portion of a plurality of circuit boards may include: mounting electronic devices on all of the plurality of circuit boards; or mounting electronic devices on a portion of the circuit boards.

[0072] For example, such as Figure 2 and Figure 3 As shown, the electronic device includes a first circuit board 201, a second circuit board 202, and a third circuit board 203. Mounting electronic devices on at least some of the circuit boards includes: mounting electronic devices on all three circuit boards, such that after the three circuit boards are soldered to form a circuit board assembly, electronic devices are mounted on both sides of the mounting cavity of the first circuit board along the thickness direction; and / or, such that after the three circuit boards are soldered to form a circuit board assembly, electronic devices are mounted on both sides of the mounting cavity of the second circuit board along the thickness direction.

[0073] For example, embodiments of this disclosure can also install electronic devices according to actual needs. Figure 2 and Figure 3 On the first circuit board 201 and the second circuit board 202, or, electronic devices are mounted on Figure 2 and Figure 3 On the second circuit board 202 and the third circuit board 203, the present disclosure embodiments do not limit this.

[0074] In this embodiment of the disclosure, mounting electronic devices on at least a portion of a circuit board may include mounting electronic devices on at least two circuit boards having mounting cavities. Here, for circuit boards having mounting cavities, electronic devices may be mounted inside or outside the mounting cavities of one or more circuit boards.

[0075] For example, such as Figure 2 As shown, mounting electronic devices on at least a portion of a circuit board may include mounting electronic devices on a first circuit board 201 having a mounting cavity and a second circuit board 202 having a mounting cavity.

[0076] Here, IC devices 302 and resistor-capacitor-inductor devices 305 can be installed in the mounting cavity of the first circuit board 201, and IC devices 302 and resistor-capacitor-inductor devices 305 can also be installed on the side of the second circuit board 202 away from its own mounting cavity, that is, outside the mounting cavity of the second circuit board 202 itself. In this way, after the circuit board assembly is formed, electronic devices are installed on both sides of the mounting cavity of the first circuit board 201 along the thickness direction.

[0077] Of course, mounting electronic devices on at least a portion of a circuit board may also include: mounting electronic devices on circuit boards with mounting cavities and mounting electronic devices on circuit boards without mounting cavities.

[0078] For example, such as Figure 3 As shown, mounting electronic devices on at least a portion of a circuit board may include mounting electronic devices on a second circuit board 202 having a mounting cavity and a third circuit board 203 not having a mounting cavity.

[0079] Here, IC devices 302 and resistor-capacitor-inductor devices 305 can be installed in the mounting cavity of the second circuit board 202, and IC devices 302 and resistor-capacitor-inductor devices 305 can be installed on the side of the third circuit board 203 facing the second circuit board 202. Thus, after the circuit board assembly is formed, electronic devices are installed on both sides of the mounting cavity of the second circuit board 202 along the thickness direction.

[0080] In this embodiment of the disclosure, the mounting cavity of the circuit board can be formed by drilling a hole on one side of the circuit board along its thickness direction. Mounting an electronic device within the mounting cavity of at least one circuit board may include mounting the electronic device at the bottom of the mounting cavity. Here, the bottom of the mounting cavity and the opening of the mounting cavity may be positioned opposite each other along the thickness direction.

[0081] It should be noted that the process of fabricating a circuit board with mounting cavities may include: laminating copper foil onto both sides of an insulating substrate, etching circuit patterns onto the copper foil to form a core board; applying a solder resist layer to a first surface of the core board, and laminating a sheet structure onto at least a second surface of the core board to form a circuit board; and creating mounting cavities on the circuit board from the side facing the first surface to expose the solder resist layer. Thus, by exposing the pads through the solder resist openings within the mounting cavities, electronic components can be mounted within the mounting cavities of the circuit board.

[0082] It is understandable that mounting electronic devices in the mounting cavities of multiple circuit boards allows electronic devices to be mounted on both sides along the thickness direction in at least one mounting cavity, thus enabling the circuit board assembly to mount more electronic devices.

[0083] For example, the mounting cavity of the first circuit board 201 in the circuit board assembly has a first side and a second side along the thickness direction.

[0084] In preparation Figure 2 In the circuit board assembly process shown, IC devices 302 and resistor-capacitor-inductor devices 305 are first installed inside the mounting cavity of the first circuit board 201 of the three circuit boards; then, IC devices 302 and resistor-capacitor-inductor devices 305 are installed outside the mounting cavity of the second circuit board 202 of the three circuit boards; finally, after soldering the first circuit board 201 and the second circuit board 203 to form a circuit board assembly, the IC devices 302 and resistor-capacitor-inductor devices 305 installed on the first side of the mounting cavity of the first circuit board 201 are electronic devices installed inside the mounting cavity of the first circuit board 201; the IC devices 302 and resistor-capacitor-inductor devices 305 installed on the second side of the mounting cavity of the first circuit board 201 are electronic devices installed outside the mounting cavity of the second circuit board 202. This achieves the goal of installing electronic devices on both sides along the thickness direction inside the mounting cavity of the first circuit board 201 in the circuit board assembly.

[0085] For example, the mounting cavity of the second circuit board 202 in the circuit board assembly has a third side and a fourth side along the thickness direction.

[0086] In preparation Figure 3In the circuit board assembly process shown, IC devices 302 and resistor-capacitor-inductor devices 305 are first installed in the mounting cavity of the second circuit board 202 of the three circuit boards; then, IC devices 302 and resistor-capacitor-inductor devices 305 are installed on the third circuit board 203 of the three circuit boards; finally, after soldering the second circuit board 202 and the third circuit board 203 to form the circuit board assembly, the IC devices 302 and resistor-capacitor-inductor devices 305 installed on the third side of the mounting cavity of the second circuit board 202 are electronic devices installed in the mounting cavity of the second circuit board 202; the IC devices 302 and resistor-capacitor-inductor devices 305 installed on the fourth side of the mounting cavity of the second circuit board 202 are electronic devices installed on the third circuit board 203. This achieves the goal of installing electronic devices on both sides along the thickness direction of the mounting cavity of the second circuit board 202 in the circuit board assembly.

[0087] In step S12, after installing the electronic components, multiple circuit boards can be stacked and soldered to form a circuit board assembly.

[0088] Here, when there are two circuit boards, one circuit board with a mounting cavity can be directly stacked on top of the other circuit board, and the two circuit boards can be soldered to form a circuit board assembly.

[0089] When there are more than two circuit boards, two circuit boards can be stacked and soldered to obtain a stacked structure. Then, the stacked structure can be soldered to at least one of the remaining circuit boards in sequence to obtain a circuit board assembly.

[0090] For example, such as Figure 2 and Figure 3 As shown, the circuit board assembly includes a first circuit board 201, a second circuit board 202 and a third circuit board 203. The first circuit board 201 and the second circuit board 202 can be stacked and soldered first, second, and third circuit boards 202 can be soldered onto the third circuit board 203 to form the circuit board assembly.

[0091] In this embodiment of the present disclosure, during the stacking process, one of two adjacent circuit boards has a mounting cavity, and the other circuit board can cover the opening of the mounting cavity.

[0092] For example, such as Figure 2 and Figure 3 As shown, the opening of the mounting cavity of the first circuit board 201 faces the second circuit board 202, and the second circuit board 202 can cover the opening of the mounting cavity of the first circuit board 201.

[0093] The opening of the mounting cavity of the second circuit board 202 faces the third circuit board 203, and the third circuit board 203 can cover the opening of the mounting cavity of the second circuit board 202.

[0094] In this embodiment of the disclosure, after the circuit board assembly is formed, electronic devices may be mounted on both sides of one mounting cavity along the thickness direction, or multiple mounting cavities may be mounted on both sides of the thickness direction. This embodiment of the disclosure does not limit this.

[0095] It should be noted that the electronic device may include: active devices and / or passive devices.

[0096] Among them, such as Figure 2 and Figure 3 As shown, the passive device may include: a resistive-capacitive-inductive device 305, a shielding structure 303, and / or a connector 304. Here, the resistive-capacitive-inductive device may include a resistor, an inductor, and / or a capacitor, etc.

[0097] like Figure 2 and Figure 3 As shown, the active device may include various integrated circuit (IC) devices 302. These IC devices 302 can be mounted on the circuit board via pads 301.

[0098] Here, various types of IC devices can include: analog IC devices, digital IC devices, or mixed-signal IC devices, etc.

[0099] It should be noted that the electronic devices disposed on both sides of the mounting cavity along the thickness direction may include: resistive capacitors and / or various IC devices.

[0100] In this embodiment of the disclosure, in addition to mounting resistive capacitors and / or various IC devices on at least a portion of the circuit board, shielding structures and / or connectors may also be mounted on the circuit board.

[0101] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0102] A shielding structure is mounted on at least one of the circuit boards; wherein the shielding structure is at least used to isolate the electronic devices disposed on both sides of the mounting cavity of the circuit board along the thickness direction;

[0103] And / or,

[0104] A connector is mounted on at least one of the circuit boards; wherein the connector is located outside the mounting cavity.

[0105] In this embodiment, the shielding structure may include a shielding cover or a shielding plate. The shielding structure may be formed of metal, conductive rubber, or conductive foam, and this embodiment does not impose any limitations on this.

[0106] It should be noted that the circuit board assembly may include at least one radio frequency circuit board, and the shielding structure may be installed in the mounting cavity of at least one radio frequency circuit board to isolate electronic devices located on both sides of the mounting cavity of the radio frequency circuit board along the thickness direction of the circuit board.

[0107] For example, both the first and second circuit boards are radio frequency (RF) circuit boards; Figure 2 As shown, the shielding structure 303 can be disposed in the mounting cavity of the first circuit board 201, so that the shielding structure 303 covers the electronic devices at the bottom of the mounting cavity of the first circuit board 201.

[0108] like Figure 3 As shown, the shielding structure 303 can be disposed in the mounting cavity of the second circuit board 202, so that the shielding structure 303 covers the electronic devices at the bottom of the mounting cavity of the second circuit board 202.

[0109] In this embodiment of the disclosure, the circuit board assembly may further include a main circuit board, and a shielding structure may be installed on the main circuit board to isolate electromagnetic interference and other functions.

[0110] For example, the third circuit board can be the main circuit board. Figure 2 and Figure 3 As shown, the shielding structure 303 can be disposed on the third circuit board 203, so that the shielding structure covers the electronic devices on the side of the main circuit board away from the adjacent circuit board.

[0111] In this embodiment of the disclosure, at least one circuit board is equipped with a connector, which can be used to provide electrical connections such as control signal transmission, analog signal transmission, or power signal transmission. The connector may include board-to-board connectors, wire-to-board connectors, external interface connectors, or power connectors, etc., and this embodiment of the disclosure does not impose any limitations on this.

[0112] For example, such as Figure 2 and Figure 3 As shown, connectors can be placed on the second circuit board 202 and the third circuit board 203 so that the second circuit board 202 and the third circuit board 203 can be electrically connected.

[0113] Understandably, shielding structures can reduce electromagnetic interference between stacked electronic components, thereby providing a better working environment for them. Furthermore, the inclusion of connectors enables the circuit board assembly to have electrical connection capabilities, thus enriching its functionality.

[0114] For example, in the related art, electronic devices are either disposed on the surface of the circuit board or disposed in the opening of the mounting cavity of the other circuit board in two adjacent circuit boards. However, the problem of limited placement of electronic devices in the circuit board assembly still exists.

[0115] Based on this, in the embodiments of this disclosure, at least some of the multiple circuit boards are mounted with electronic devices, at least one circuit board is mounted with electronic devices in its mounting cavity, and the multiple circuit boards are soldered to form a circuit board assembly, such that at least one circuit board in the circuit board assembly is mounted with electronic devices on both sides of its mounting cavity along the thickness direction of the circuit board.

[0116] Thus, by installing electronic components inside the mounting cavity, the number of electronic components that can be arranged in the thickness direction of the circuit board assembly can be increased, allowing for the arrangement of more electronic components. This not only reduces the space occupied by the circuit board assembly in the mobile terminal and improves the space utilization of the circuit board assembly, but also makes the arrangement of electronic components more flexible.

[0117] For example, the Z direction can be the thickness direction of the circuit board, the X direction can be the length direction of the circuit board, and the Y direction can be the width direction of the circuit board. In the circuit board assembly of this disclosure, electronic devices can be mounted on both sides of the mounting cavity along the Z direction, allowing for the arrangement of more electronic devices in the Z direction. Furthermore, since more electronic devices can be arranged in the Z direction, the size of the circuit board assembly in the X and / or Y directions can be reduced, thereby reducing the space occupied by the circuit board assembly in the mobile terminal.

[0118] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0119] The electronic device is mounted in at least one mounting cavity of the circuit board;

[0120] For all mounting cavities where the electronic device is installed, the electronic device is installed on each circuit board with an opening covering all the mounting cavities, such that the electronic device can be distributed along the thickness direction on both sides of each mounting cavity.

[0121] In this embodiment of the disclosure, there may be one or more circuit boards with mounting cavities. If multiple circuit boards have mounting cavities, electronic devices can be mounted in the mounting cavities of all circuit boards, or electronic devices can be mounted in the mounting cavities of some circuit boards. This embodiment of the disclosure does not limit this.

[0122] It should be noted that if there is only one mounting cavity for mounting electronic components, then the electronic components can be mounted on another circuit board that covers the opening of that mounting cavity.

[0123] For example, such as Figure 2As shown, electronic devices are installed in the mounting cavity of the first circuit board 201. Then, electronic devices can be installed on the second circuit board 202, which is provided to cover the opening of the mounting cavity of the first circuit board 201, so that the electronic devices can be distributed on both sides of the mounting cavity of the first circuit board 201 along the thickness direction.

[0124] For example, such as Figure 3 As shown, electronic devices are installed in the mounting cavity of the second circuit board 202. Then, electronic devices can be installed on the third circuit board 203, which is provided to cover the opening of the mounting cavity of the second circuit board 202, so that the electronic devices can be distributed on both sides of the mounting cavity of the second circuit board 202 along the thickness direction.

[0125] If there are multiple mounting cavities for mounting electronic components, then the electronic components can be mounted on each circuit board with an opening covering the multiple mounting cavities.

[0126] For example, if electronic devices are installed in both the mounting cavity of the first circuit board and the mounting cavity of the second circuit board, then electronic devices can be installed in both the second circuit board, which is set in the opening of the mounting cavity of the first circuit board, and the third circuit board, which is set in the opening of the mounting cavity of the second circuit board. This allows the electronic devices to be distributed along the thickness direction on both sides of the mounting cavity of the first circuit board and on both sides of the mounting cavity of the second circuit board.

[0127] In this embodiment of the disclosure, mounting electronic devices within the mounting cavity may include: mounting at least one electronic device at a distance from the bottom of the mounting cavity.

[0128] For example, such as Figure 2 As shown, various IC devices 302 and / or resistor-capacitor-inductor devices 305, etc., can be installed at intervals at the bottom of the mounting cavity of the first circuit board 201.

[0129] For example, such as Figure 3 As shown, various IC devices 302 and / or resistor-capacitor-inductor devices 305, etc., can be installed at intervals at the bottom of the mounting cavity of the second circuit board 202.

[0130] In this embodiment of the disclosure, in order to better enable the electronic devices to be distributed along the thickness direction on both sides of each mounting cavity, the electronic devices can be mounted at the bottom of the mounting cavity and at the position where the circuit board covers the opening of the mounting cavity.

[0131] For example, such as Figure 2As shown, electronic components are respectively mounted at the bottom of the mounting cavity of the first circuit board 201 and at the opening of the mounting cavity of the second circuit board 202 that covers the first circuit board 201. In this way, after the first circuit board 201 and the second circuit board 202 are laminated and soldered, the electronic components can be distributed along the thickness direction on both sides of the mounting cavity of the first circuit board 201.

[0132] For example, such as Figure 3 As shown, electronic components are respectively mounted at the bottom of the mounting cavity of the second circuit board 202 and at the opening of the mounting cavity of the third circuit board 203 covering the second circuit board 202. Thus, after the second circuit board 202 and the third circuit board 203 are laminated and soldered, the electronic components can be distributed along the thickness direction on both sides of the mounting cavity of the second circuit board 202.

[0133] It is understandable that by installing electronic devices in the mounting cavity and placing electronic devices on adjacent boards, it is possible to install electronic devices on both sides of the mounting cavity along the thickness direction, thereby enabling the circuit board assembly to have more electronic devices arranged in the thickness direction.

[0134] Furthermore, with electronic components mounted on both sides of multiple mounting cavities along the thickness direction, it is possible to further arrange more electronic components on the circuit board assembly, thereby maximizing the stacking of the circuit board assembly.

[0135] In some embodiments, mounting the electronic device within a mounting cavity of at least one of the circuit boards includes:

[0136] Solder paste is applied to the bottom of the mounting cavity of each of the circuit boards;

[0137] The electronic components are mounted on the solder paste positions at the bottom of the mounting cavities of each of the circuit boards.

[0138] In other words, the embodiments of this disclosure enable electronic devices to be mounted at the bottom of the mounting cavity, thereby enabling electronic devices to be mounted on both sides of the mounting cavity along the thickness direction.

[0139] In this embodiment, the bottom of the mounting cavity and the opening of the mounting cavity are disposed opposite each other along the thickness direction. Therefore, by placing the electronic device at the bottom of the mounting cavity, electronic devices can be mounted on both sides of the mounting cavity along the thickness direction.

[0140] It should be noted that solder paste can be applied to the bottom of the mounting cavity according to different processes. In some embodiments, applying solder paste to the bottom of the mounting cavity of each circuit board may include applying the solder paste to the bottom of the mounting cavity of each circuit board through a three-dimensional soldering process.

[0141] Here, the three-dimensional soldering process may include calibrating the position of the solder pads by combining three-dimensional visual positioning such as laser scanning or artificial intelligence image recognition, and adapting to different solder pads by dynamically adjusting the amount of solder paste output by the solder paste needle.

[0142] Understandably, applying solder paste to the bottom of the mounting cavity using a three-dimensional soldering process not only enables dispensing at the bottom of the mounting cavity but also improves dispensing accuracy.

[0143] In this embodiment of the disclosure, electronic devices can be mounted at the solder paste location at the bottom of the mounting cavity according to different processes. In some embodiments, mounting the electronic devices at the solder paste location at the bottom of the mounting cavity of each of the circuit boards includes: mounting the electronic devices to the solder paste location using a deep cavity die-casting process.

[0144] Here, the deep cavity placement process may include: calibrating the solder paste position using visual positioning methods such as cameras or laser ranging, picking up electronic components using extended nozzles or flexible nozzles, and placing the components inside the mounting cavity using extended nozzles or flexible nozzles.

[0145] Understandably, applying solder paste to the bottom of the mounting cavity through the deep cavity mounting process not only enables the mounting of electronic components at the bottom of the mounting cavity, but also improves the mounting accuracy of the electronic components.

[0146] In some embodiments, the plurality of circuit boards include: a first circuit board, a second circuit board, and a third circuit board; both the first circuit board and the second circuit board have the mounting cavity;

[0147] The step of soldering multiple circuit boards to form a circuit board assembly, such that the electronic device is mounted on both sides of the mounting cavity of at least one circuit board in the circuit board assembly along the thickness direction of the circuit board, includes:

[0148] Soldering is performed on the first circuit board, the second circuit board, and the third circuit board to form a first circuit board assembly; wherein, the electronic devices are mounted on both sides of the mounting cavity of the first circuit board in the first circuit board assembly along the thickness direction;

[0149] And / or,

[0150] Soldering is performed on the first circuit board, the second circuit board, and the third circuit board to form a second circuit board assembly; wherein, the electronic devices are mounted on both sides of the mounting cavity of the second circuit board in the second circuit board assembly along the thickness direction.

[0151] In this embodiment of the present disclosure, electronic devices can be installed in the mounting cavity of the first circuit board and at the position where the second circuit board covers the opening of the mounting cavity of the first circuit board, so that after the first circuit board assembly is formed by soldering, the electronic devices can be installed on both sides of the mounting cavity of the first circuit board in the first circuit board assembly along the thickness direction.

[0152] Electronic devices can also be installed in the mounting cavity of the second circuit board and at the opening of the mounting cavity of the third circuit board covering the second circuit board, so that after the second circuit board assembly is formed by soldering, the electronic devices can be installed on both sides of the mounting cavity of the second circuit board in the second circuit board assembly along the thickness direction.

[0153] It is understood that the embodiments of this disclosure can form different circuit board assemblies with three circuit boards and two mounting cavities, such that either electronic devices are mounted on both sides of the mounting cavity of the first circuit board along the thickness direction, or electronic devices are mounted on both sides of the mounting cavity of the second circuit board along the thickness direction. This allows for the placement of more electronic devices on the circuit board assembly while making the formation of the circuit board assembly more flexible.

[0154] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0155] The electronic device is mounted at the bottom of the mounting cavity of the first circuit board and the second circuit board;

[0156] The step of soldering the first circuit board, the second circuit board, and the third circuit board to form the first circuit board assembly includes:

[0157] Soldering is performed on the third circuit board and the installed second circuit board to form a first stacked structure;

[0158] The first circuit board, after installation, is soldered to the second circuit board of the first stacked structure to form the first circuit board assembly.

[0159] In this embodiment of the disclosure, mounting electronic devices at the bottom of the mounting cavity of the first circuit board may include: applying solder paste to the bottom of the mounting cavity of the first circuit board, and attaching electronic devices at the solder paste position at the bottom of the mounting cavity of the first circuit board.

[0160] Mounting electronic components on the second circuit board may include: mounting the electronic components at a first location in the second circuit board that covers the mounting cavity opening of the first circuit board. Thus, after the first circuit board assembly is formed, some electronic components in the second circuit board and electronic components at the bottom of the mounting cavity of the first circuit board can be distributed on both sides of the mounting cavity of the first circuit board along its thickness direction.

[0161] It should be noted that mounting electronic devices on the second circuit board may further include mounting the electronic devices at a second location on the second circuit board other than the first location. The first and second locations may be located on the same side of the second circuit board. Alternatively, the second location may be located on the opposite side of the second circuit board from the first location.

[0162] In this embodiment of the present disclosure, before forming the first stacked structure, electronic devices can be installed on the second circuit board to obtain the installed second circuit board, and then the third circuit board and the installed second circuit board are soldered to form the first stacked structure.

[0163] Here, soldering the third circuit board and the mounted second circuit board to form a first stacked structure may include: stacking the mounted second circuit board on the third circuit board, and soldering the stacked second and third circuit boards to form the first stacked structure. Here, the opening of the mounting cavity of the second circuit board may face the third circuit board.

[0164] It should be noted that, during the formation of the first stacked structure, the third circuit board may be a circuit board with electronic devices installed, or it may be a circuit board without electronic devices installed. This embodiment of the present disclosure does not limit this.

[0165] In this embodiment of the present disclosure, the first stacked structure may be tin-plated before soldering the first stacked structure and the first circuit board. In some embodiments, the fabrication method further includes:

[0166] The molten tin is applied to the first layered structure using a three-dimensional tin spraying process.

[0167] In this embodiment of the disclosure, such as Figure 4 As shown, molten solder can be applied to the second circuit board 202 in the first stacked structure obtained in step 2 first, and then the soldering between the second circuit board 202 and the first circuit board 201 in the first stacked structure can be performed in step 3.

[0168] It should be noted that applying molten tin to the first layered structure via a three-dimensional tin spraying process may include: directionally spraying molten tin onto the first layered structure using a three-dimensional tin spraying process. Of course, other tin spraying processes, such as selective tin spraying, may also be used in the embodiments of this disclosure, and this disclosure does not limit this approach.

[0169] Understandably, applying molten solder through a three-dimensional solder spraying process facilitates the soldering between the first layer structure and the second circuit board. This not only improves the performance and reliability of subsequent soldering but also eliminates the need to heat the entire circuit board, reducing damage to electronic components on the circuit board.

[0170] In this embodiment of the present disclosure, before forming the first circuit board assembly, electronic devices can be installed in the mounting cavity of the first circuit board to obtain the first circuit board after installation, and then the first circuit board after installation can be soldered to the second circuit board of the first layered structure to form the first circuit board assembly.

[0171] Here, soldering the installed first circuit board to the second circuit board of the first stacked structure to form the first circuit board assembly may include: stacking the installed first circuit board on the second circuit board of the first stacked structure, and performing soldering on the stacked first circuit board and the second circuit board to form the first circuit board assembly.

[0172] For example, before forming the first circuit board assembly, a first circuit board with a mounting cavity, a second circuit board with a mounting cavity, and a third circuit board need to be prepared.

[0173] like Figure 4 As shown, the process of forming the first circuit board assembly may include: Step 1, mounting electronic devices in both the mounting cavity of the first circuit board 201 and the second circuit board 202. Figure 4 (The process of mounting electronic devices on the second circuit board is not shown in the figure); Step 2: Stack the mounted second circuit board 202 on the third circuit board 203, so that the opening of the mounting cavity of the second circuit board 202 faces the third circuit board 203; Step 3: Apply molten solder to the first stacked structure through a three-dimensional soldering process, and solder the mounted first circuit board 201 to the second circuit board 202 of the first stacked structure to form the first circuit board assembly.

[0174] It is understood that, according to the present invention, electronic devices can be mounted in the mounting cavity of the first circuit board and on the second circuit board, enabling electronic devices to be mounted on both sides of the mounting cavity of the first circuit board in the thickness direction in the first circuit board assembly. Furthermore, by first soldering the electronic devices, then soldering the third circuit board and the second circuit board to form a first laminated structure, and finally soldering the first laminated structure and the second circuit board to form the first circuit board assembly, the present invention enables the use of mature processes to manufacture the first circuit board assembly, thereby improving the reliability of the first circuit board assembly.

[0175] In some embodiments, mounting electronic devices on at least a portion of the plurality of circuit boards includes:

[0176] The electronic device is mounted at the bottom of the mounting cavity of the second circuit board and the third circuit board;

[0177] The step of soldering the first circuit board, the second circuit board, and the third circuit board to form a second circuit board assembly includes:

[0178] Soldering is performed on the first circuit board and the installed second circuit board to form a second stacked structure;

[0179] The second circuit board of the second stacked structure is soldered to the third circuit board after installation to form the second circuit board assembly.

[0180] In this embodiment of the disclosure, mounting electronic devices at the bottom of the mounting cavity of the second circuit board may include: applying solder paste to the bottom of the mounting cavity of the second circuit board, and attaching electronic devices at the solder paste position at the bottom of the mounting cavity of the second circuit board.

[0181] Mounting electronic components on a third circuit board may include mounting the electronic components at a third location on the third circuit board that covers the mounting cavity opening of the second circuit board. Thus, after the second circuit board assembly is formed, some of the electronic components on the third circuit board and the electronic components at the bottom of the mounting cavity of the second circuit board can be distributed on both sides of the mounting cavity of the second circuit board along its thickness direction.

[0182] It should be noted that mounting electronic devices on the third circuit board may further include mounting electronic devices at a fourth location on the third circuit board, other than the third location. This fourth location and the third location may be located on the same side of the third circuit board. Alternatively, the fourth location may be located on the opposite side of the third circuit board from the second location.

[0183] In this embodiment of the disclosure, before forming the second stacked structure, electronic devices can be installed on the second circuit board to obtain the installed second circuit board, and then the first circuit board and the installed second circuit board are soldered to form the second stacked structure.

[0184] Here, performing soldering on the first circuit board and the installed second circuit board to form a second stacked structure may include: stacking the first circuit board on the installed second circuit board, and performing soldering on the stacked second circuit board and the first circuit board to form a second stacked structure.

[0185] It should be noted that, in the process of forming the second stacked structure, the first circuit board may be a circuit board with electronic devices installed, or it may be a circuit board without electronic devices installed. This disclosure does not limit this.

[0186] In this embodiment of the disclosure, before forming a circuit board assembly based on the second stacked structure, electronic devices can be installed on a third circuit board to obtain an installed third circuit board, and then the second circuit board of the second stacked structure can be soldered to the installed third circuit board to form a second circuit board assembly.

[0187] Here, soldering the second circuit board of the second stacked structure to the installed third circuit board to form the second circuit board assembly may include: stacking the second circuit board of the second stacked structure on the installed third circuit board, and performing soldering on the stacked second circuit board and the third circuit board to form the circuit board assembly.

[0188] For example, such as Figure 5 As shown, the process of forming the second circuit board assembly may include: Step 1, mounting electronic devices within the mounting cavity of the second circuit board 202 and on the third circuit board 203. Figure 5 (The process of mounting electronic devices on the third circuit board is not shown in the diagram); Step 2: Stack the first circuit board 201 on the mounted second circuit board 202, such that the opening of the mounting cavity of the first circuit board 201 faces the same direction as the opening of the mounting cavity of the second circuit board 202, and form a second stacked structure by soldering the first circuit board 201 and the second circuit board 202; Step 3: Stack the second stacked structure on the third circuit board 203, such that the opening of the mounting cavity of the second circuit board 202 in the second stacked structure faces the third circuit board 203, and form the second circuit board assembly by soldering the first stacked structure and the third circuit board 203.

[0189] It is understood that, according to the present embodiment, electronic devices can be mounted in the mounting cavity of the second circuit board and on the third circuit board, so that electronic devices can be mounted on both sides of the mounting cavity of the second circuit board in the thickness direction in the second circuit board assembly.

[0190] Furthermore, the embodiments of this disclosure first weld electronic components, then weld the first circuit board and the second circuit board to form a second stacked structure, and finally weld the second stacked structure and the third circuit board to form a second circuit board assembly. This enables the fabrication of the second circuit board assembly using mature processes, thereby improving the reliability of the second circuit board assembly.

[0191] Furthermore, the embodiments of this disclosure allow for different soldering sequences to be used to form different circuit board assemblies, making the formation of circuit board assemblies more flexible.

[0192] This disclosure also proposes a circuit board assembly. For example... Figure 2 and Figure 3 As shown, the circuit board assembly is manufactured using the preparation method described in one or more of the above embodiments.

[0193] In this embodiment of the disclosure, Figure 2 The first circuit board assembly shown can be adopted Figure 6 It was prepared using the method shown. Figure 6 The preparation method shown includes the following steps:

[0194] S601, Electronic components are mounted on side A of the first circuit board;

[0195] S602, First circuit board high-temperature reflow soldering;

[0196] S603. Solder paste is applied to the mounting cavity on the B side of the first circuit board using a three-dimensional soldering process.

[0197] In this embodiment of the disclosure, the A side and the B side of the first circuit board are two sides facing each other in the thickness direction.

[0198] S604. The first circuit board mounting cavity uses a deep cavity mounting process to mount electronic components.

[0199] S605, first circuit board high-temperature reflow;

[0200] S606, First circuit board repackaging;

[0201] In this embodiment, the first circuit board can undergo visual inspection after high-temperature reflow. If the visual inspection is satisfactory, the first circuit board is split and packaged. Here, the first circuit board can be divided into smaller individual pieces using a milling cutter and then packaged individually.

[0202] S607, Electronic components are mounted on side A of the second circuit board;

[0203] S608, second circuit board high-temperature reflow;

[0204] S609, Second circuit board repackaging;

[0205] S610, SMT process on side A of the third circuit board;

[0206] In this embodiment of the disclosure, the SMT process may include at least solder paste printing, electronic component placement, and soldering to fix the electronic components.

[0207] S611, Electronic components are mounted on the B side of the third circuit board;

[0208] In this embodiment of the disclosure, solder paste can also be printed on side B of the third circuit board to facilitate soldering with the second circuit board.

[0209] S612, the third circuit board, and the second circuit board are stacked together;

[0210] S613, high-temperature reflow, forming the first layered structure;

[0211] S614. The first layer structure is applied with molten tin using a three-dimensional tin spraying process.

[0212] S615, the first circuit board and the first laminated structure are stacked together;

[0213] In this embodiment of the disclosure, the first circuit board is laminated and soldered onto the second circuit board of the first stacked structure.

[0214] S616, high-temperature reflow, forming the first circuit board assembly;

[0215] S617, Packaging.

[0216] In this embodiment of the disclosure, Figure 3 The second circuit board assembly shown can be adopted Figure 7 It was prepared using the method shown. Figure 7 The preparation method shown includes the following steps:

[0217] S701, Electronic components are mounted on side A of the first circuit board;

[0218] S702, High-temperature reflow of the first circuit board;

[0219] S703, First circuit board repackaging;

[0220] S704. Solder paste is applied to the mounting cavity on side A of the second circuit board using a three-dimensional soldering process.

[0221] S705, second circuit board high-temperature reflow;

[0222] S706, Electronic components are mounted on the B side of the second circuit board;

[0223] S707, the second circuit board and the first circuit board are stacked together;

[0224] S708, high-temperature reflow, forming a second-layer structure;

[0225] S709, separate packaging;

[0226] S710, SMT process on side A of the third circuit board.

[0227] S711, Solder paste is printed and electronic components are mounted at different locations on the B side of the third circuit board;

[0228] In this embodiment of the disclosure, solder paste is printed on side B of the third circuit board to facilitate soldering with the second stacked structure.

[0229] S712, the third circuit board, and the second stacked structure are stacked together;

[0230] In this embodiment of the disclosure, the second circuit board of the second stacked structure is soldered to the third circuit board.

[0231] S713, high-temperature reflow, forming the second circuit board assembly.

[0232] It is understandable that the circuit board assembly is manufactured by a specific method. By installing electronic devices within the mounting cavity of the circuit board assembly, the possibility of arranging electronic devices in the thickness direction of the circuit board assembly can be increased, allowing for the placement of more electronic devices in the thickness direction of the circuit board assembly. This not only makes the placement of electronic devices more flexible but also reduces the space occupied by the circuit board assembly in the mobile terminal, thereby improving the space utilization rate of the circuit board assembly.

[0233] This disclosure also proposes a mobile terminal. The mobile terminal includes a housing and a circuit board assembly disposed on the housing; the circuit board assembly is manufactured using one or more of the methods described above.

[0234] In this embodiment of the disclosure, the mobile terminal may include a smartphone, laptop, tablet computer, or smart wearable device (such as a smartwatch or smart bracelet), etc., and this embodiment of the disclosure does not limit it.

[0235] The housing of the aforementioned mobile terminal may include a mid-frame and a border, the mid-frame being located within the area enclosed by the border, and the circuit board assembly being disposed on the mid-frame and located within the area enclosed by the border.

[0236] It is understood that the mobile terminal includes a circuit board assembly made using one or more of the above-described embodiments, which can increase the possibility of arranging electronic devices in the thickness direction of the circuit board assembly, enabling the arrangement of more electronic devices. This not only makes the arrangement of electronic devices more flexible, but also reduces the space occupied by the circuit board assembly in the mobile terminal and improves the space utilization rate of the circuit board assembly.

[0237] This disclosure also proposes a solder paste apparatus. For example... Figure 8 As shown, it includes:

[0238] Solder paste dispenser 801 is used to dispense solder paste.

[0239] A driving component, connected to the solder paste needle, is used to drive the solder paste needle 801 to apply the solder paste into the mounting cavity of the circuit board in the circuit board assembly, such that electronic devices are mounted on both sides of the mounting cavity of at least one circuit board along the thickness direction of the circuit board.

[0240] In this embodiment of the disclosure, the solder paste nozzle can be used to control the shape of the solder paste ejected (e.g., dots, lines, and surfaces). The inner diameter of the solder paste nozzle can be used to influence the diameter of the solder paste.

[0241] In some embodiments, the inner diameter of the solder paste needle is in the range of 0.05 mm to 0.08 mm;

[0242] And / or,

[0243] The length of the solder paste needle is in the range of 1.6 mm to 1.8 mm.

[0244] Understandably, adjusting the inner diameter and length of the solder paste nozzle can improve solder paste output and dispensing accuracy.

[0245] For example, when mounting 01005 packaged devices, which are the smallest standard packaged passive devices in the electronics industry, the pads can be set to be 0.17 mm long and 0.2 mm wide, the solder paste diameter is 0.2 mm, and the soldering accuracy is ±0.03 micrometers. The solder paste nozzle inner diameter can be 0.08 mm and the solder paste nozzle length can be 1.8 mm.

[0246] Figure 9 This is a structural block diagram of a mobile terminal according to an exemplary embodiment. For example, the mobile terminal 900 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness device, personal digital assistant, etc.

[0247] Reference Figure 9 The mobile terminal 900 may include one or more of the following components: processing component 902, memory 904, power supply component 906, multimedia component 908, audio component 910, input / output (I / O) interface 912, sensor component 914, and communication component 916.

[0248] Processing component 902 typically controls the overall operation of mobile terminal 900, such as operations associated with at least one of display, telephone call, data communication, camera operation, and recording operation. Processing component 902 may include one or more processors 920 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 902 may include one or more modules to facilitate interaction between processing component 902 and other components. For example, processing component 902 may include a multimedia module to facilitate interaction between multimedia component 908 and processing component 902.

[0249] Memory 904 is configured to store various types of data to support operation on mobile terminal 900. Examples of such data include at least one of the following: instructions for any application or method operating on mobile terminal 900, contact data, phonebook data, messages, pictures, and videos. Memory 904 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as Static Random Access Memory (SRAM), Electrically Erasable Programmable Read Only Memory (EEPROM), Erasable Programmable Read-Only Memory (EPROM), Programmable Read Only Memory (PROM), Read-Only Memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0250] The power supply component 906 provides power to various components of the mobile terminal 900. The power supply component 906 may include at least one of the following: a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the mobile terminal 900.

[0251] Multimedia component 908 includes a screen that provides an output interface between mobile terminal 900 and the user. In some embodiments, the screen may include a Liquid Crystal Display (LCD) and a Touch Panel (TP). If the screen includes a Touch Panel, the screen can be implemented as a touchscreen to receive input signals from the user. The Touch Panel includes one or more touch sensors to sense touches, swipes, and gestures on the Touch Panel. The touch sensors can sense not only the boundaries of touch or swipe actions but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 908 includes a front-facing camera and / or a rear-facing camera. When mobile terminal 900 is in an operating mode, such as shooting mode or video mode, the front-facing camera and / or rear-facing camera can receive external multimedia data. Each front-facing camera and rear-facing camera can be a fixed optical lens system or have focal length and optical zoom capabilities.

[0252] Audio component 910 is configured to output and / or input audio signals. For example, audio component 910 includes a microphone (MIC) configured to receive external audio signals when mobile terminal 900 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 904 or transmitted via communication component 916. In some embodiments, audio component 910 also includes a speaker for outputting audio signals.

[0253] I / O interface 912 provides an interface between processing component 902 and peripheral interface modules, such as keyboards, click wheels, and buttons. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0254] Sensor assembly 914 includes one or more sensors for providing state assessments of various aspects of mobile terminal 900. For example, sensor assembly 914 can detect the on / off state of mobile terminal 900, the relative positioning of components, such as the display and keypad of mobile terminal 900, changes in position of mobile terminal 900 or one of its components, the presence or absence of user contact with mobile terminal 900, orientation or acceleration / deceleration of mobile terminal 900, and temperature changes of mobile terminal 900. Sensor assembly 914 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 914 may also include an optical sensor, such as a complementary metal-oxide-semiconductor (CMOS) or charge-coupled device (CCD) image sensor, for use in imaging applications. In some embodiments, sensor assembly 914 may also include, but is not limited to, at least one of the following: an accelerometer, a gyroscope, a magnetometer, a pressure sensor, and a temperature sensor.

[0255] Communication component 916 is configured to facilitate wired or wireless communication between mobile terminal 900 and other devices. Mobile terminal 900 can access wireless networks based on communication standards, such as Wi-Fi, 4G, 5G, or combinations thereof. In one exemplary embodiment, communication component 916 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 916 also includes a Near Field Communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wide Band (UWB), Bluetooth (BT), and other technologies.

[0256] In an exemplary embodiment, the mobile terminal 900 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0257] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0258] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A method for manufacturing a circuit board assembly, characterized in that, The preparation method includes: Electronic devices are mounted on at least a portion of a plurality of circuit boards; wherein at least a portion of the circuit boards includes a circuit board having a mounting cavity, and the electronic devices are mounted within the mounting cavity; Soldering is performed on a plurality of said circuit boards to form said circuit board assembly, such that said electronic devices are mounted on both sides of the mounting cavity of at least one of said circuit boards in said circuit board assembly along the thickness direction of said circuit board.

2. The preparation method according to claim 1, characterized in that, The mounting of electronic devices on at least a portion of a plurality of circuit boards includes: The electronic device is mounted in at least one mounting cavity of the circuit board; For all mounting cavities where the electronic device is installed, the electronic device is installed on each of the circuit boards with openings covering all the mounting cavities, such that the electronic device can be distributed along the thickness direction on both sides of each mounting cavity.

3. The preparation method according to claim 2, characterized in that, The mounting of the electronic device within at least one mounting cavity of the circuit board includes: Solder paste is applied to the bottom of the mounting cavity of each of the circuit boards; The electronic components are mounted on the solder paste positions at the bottom of the mounting cavities of each of the circuit boards.

4. The preparation method according to claim 3, characterized in that, The step of applying solder paste to the bottom of the mounting cavity of each of the circuit boards includes: applying the solder paste to the bottom of the mounting cavity of each of the circuit boards through a three-dimensional soldering process; And / or, Mounting the electronic components at the solder paste location at the bottom of the mounting cavity of each of the circuit boards includes mounting the electronic components at the solder paste location using a deep cavity die-casting process.

5. The preparation method according to any one of claims 1 to 4, characterized in that, The plurality of circuit boards include: a first circuit board, a second circuit board, and a third circuit board; both the first circuit board and the second circuit board have the mounting cavity; The step of soldering multiple circuit boards to form a circuit board assembly, such that the electronic device is mounted on both sides of the mounting cavity of at least one circuit board in the circuit board assembly along the thickness direction of the circuit board, includes: Soldering is performed on the first circuit board, the second circuit board, and the third circuit board to form a first circuit board assembly; wherein, the electronic devices are mounted on both sides of the mounting cavity of the first circuit board in the first circuit board assembly along the thickness direction; And / or, Soldering is performed on the first circuit board, the second circuit board, and the third circuit board to form a second circuit board assembly; wherein, the electronic devices are mounted on both sides of the mounting cavity of the second circuit board in the second circuit board assembly along the thickness direction.

6. The preparation method according to claim 5, characterized in that, The mounting of electronic devices on at least a portion of a plurality of circuit boards includes: The electronic device is mounted at the bottom of the mounting cavity of the first circuit board and the second circuit board; The step of soldering the first circuit board, the second circuit board, and the third circuit board to form the first circuit board assembly includes: Soldering is performed on the third circuit board and the installed second circuit board to form a first stacked structure; The first circuit board, after installation, is soldered to the second circuit board of the first stacked structure to form the first circuit board assembly.

7. The preparation method according to claim 6, characterized in that, The preparation method further includes: The molten tin is applied to the first layered structure using a three-dimensional tin spraying process.

8. The preparation method according to claim 5, characterized in that, The mounting of electronic devices on at least a portion of a plurality of circuit boards includes: The electronic device is mounted at the bottom of the mounting cavity of the second circuit board and the third circuit board; The step of soldering the first circuit board, the second circuit board, and the third circuit board to form a second circuit board assembly includes: Soldering is performed on the first circuit board and the installed second circuit board to form a second stacked structure; The second circuit board of the second stacked structure is soldered to the third circuit board after installation to form the second circuit board assembly.

9. The preparation method according to any one of claims 1 to 4, characterized in that, The mounting of electronic devices on at least a portion of a plurality of circuit boards includes: A shielding structure is mounted on at least one of the circuit boards; wherein the shielding structure is at least used to isolate the electronic devices disposed on both sides of the mounting cavity of the circuit board along the thickness direction; And / or, A connector is mounted on at least one of the circuit boards; wherein the connector is located outside the mounting cavity.

10. A circuit board assembly, characterized in that, The circuit board assembly is manufactured using the preparation method described in any one of claims 1 to 9.

11. A mobile terminal, characterized in that, include: Housing and circuit board assembly disposed in the housing; The circuit board assembly is manufactured using the preparation method described in any one of claims 1 to 9.

12. A solder paste equipment, characterized in that, include: Solder paste dispenser; A driving component, connected to the solder paste needle, is used to drive the solder paste needle to apply the solder paste into the mounting cavity of at least one circuit board in the circuit board assembly, such that electronic devices are mounted on both sides of the mounting cavity of at least one circuit board along the thickness direction of the circuit board.

13. The solder paste equipment according to claim 12, characterized in that, The inner diameter of the solder paste needle is in the range of 0.05 mm to 0.08 mm; And / or, The length of the solder paste needle is in the range of 1.6 mm to 1.8 mm.

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