A high-temperature-resistant high-insulation multilayer PCB board compression integrated manufacturing method

Abstract

The application provides a high-temperature-resistant and high-insulation multilayer PCB board compression integrated manufacturing method and relates to the technical field of circuit boards. The high-temperature-resistant and high-insulation multilayer PCB board compression integrated manufacturing method specifically comprises the following steps: S1: inner layer board pretreatment and surface activation; the inner layer copper substrate with completed circuit production is subjected to brownization treatment, and then subjected to plasma activation treatment under a low-pressure argon atmosphere, so as to improve the bonding force between the copper surface and the resin; S2: high-temperature-resistant and high-insulation composite dielectric layer preparation; a cyanate-epoxy composite matrix is used to fill surface-modified nano hexagonal boron nitride and nano aluminum oxide compounded particles, and glass cloth is impregnated to form a prepreg. Through the cyanate-epoxy composite matrix matched with nano ceramic compounding filling, the dielectric layer glass transition temperature Tg is greater than or equal to 220 DEG C, which is increased by more than 70 DEG C than the traditional FR-4; the room-temperature interlayer insulation resistance is greater than or equal to 10 14 Ω, still greater than or equal to 10 12 Ω at 150 DEG C high temperature, and the breakdown voltage is greater than or equal to 5kV / mm, which can completely adapt to the insulation requirements of high-power and high-temperature scenes.

Description

Technical Field

[0001] This invention relates to the field of circuit board technology, specifically to a method for the integrated manufacturing of high-temperature resistant, high-insulation multilayer PCB boards through lamination. Background Technology

[0002] Printed Circuit Board (PCB) is an indispensable core component in electronic systems. Because it carries the key connections and functions of various electronic components, it is widely known as the "mother of electronic products" [1]. Its core functions have dual attributes: on the one hand, it provides a stable mechanical assembly support for electronic components such as resistors, capacitors, and chips, ensuring the rationality and stability of the device layout; on the other hand, it undertakes core tasks such as electrical connection, signal transmission, signal reception and power supply, and is the "bridge" for the orderly flow of current and signal between components, supporting the realization of various electronic functions such as work, amplification, modulation, and demodulation.

[0003] Multilayer PCBs are the core interconnect carriers of electronic devices. With the rapid development of power electronics and high-frequency communication technologies, the operating temperature of PCBs continues to rise, and the voltage level is constantly increasing, placing unprecedented demands on the high-temperature resistance, insulation reliability, and dimensional stability of interlayer layers. Lamination is the most critical process in multilayer PCB manufacturing, directly determining the alignment accuracy, bonding strength, insulation performance, and product reliability of the interlayer layers.

[0004] The current mainstream multilayer PCB lamination process adopts a step-by-step process, namely inner layer board browning treatment → manual stacking pin positioning → separate press pre-pressing → main pressure curing → cooling after removal → post-processing. The existing technology has the following core pain points that cannot be solved: Step-by-step transfer leads to poor alignment accuracy and low yield: Lamination, pre-pressing, curing and cooling belong to different stations, and manual transfer is required in the middle. Affected by temperature fluctuations, mechanical vibration and operation errors, the interlayer alignment misalignment is generally ≥25μm, and the alignment yield of the high-layer board is only 92% to 95%, which cannot meet the precision interconnection requirements of high-end HDI and high-frequency and high-speed boards; Conventional dielectric materials have insufficient high temperature resistance and insulation performance: The glass transition temperature Tg of traditional FR-4 epoxy glass cloth dielectric is only 130 to 150℃. At high temperature environments above 150℃, the insulation resistance drops sharply by 3 orders of magnitude, which easily leads to interlayer breakdown and delamination blistering, and cannot meet the power PCB requirements of new energy vehicle OBC, motor controller and other long-term high temperature operation. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an integrated manufacturing method for high-temperature resistant and high-insulation multilayer PCB boards, which solves the problems of poor alignment accuracy, low yield, and insufficient high-temperature resistance and insulation performance of conventional dielectric materials caused by step-by-step transfer.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for integrated manufacturing of high-temperature resistant, high-insulation multilayer PCB boards through lamination, specifically comprising the following steps: S1: Inner layer plate pretreatment and surface activation The inner copper substrate with the completed circuit fabrication is browned and then plasma activated under a low-pressure argon atmosphere to improve the adhesion between the copper surface and the resin. S2: Preparation of high-temperature resistant and high-insulation composite dielectric layer A semi-cured sheet is prepared by filling a cyanate ester-epoxy resin composite matrix with surface-modified nano-hexagonal boron nitride and nano-alumina composite particles and impregnating it with glass cloth. S3: Precision alignment and stacking within the cavity The inner layer, prepreg, and copper foil are stacked in the cavity, using a dual positioning method of visual automatic alignment and ceramic pin positioning, with an interlayer alignment accuracy of ≤±10μm. S4: Vacuum stepped temperature gradient pressurization integrated pressing The vacuum degree throughout the process is ≤10Pa. The pressing is completed continuously in five stages: preheating, pre-pressure leveling, main pressure curing, in-situ post-curing, and gradient cooling. Each stage is matched with the corresponding temperature and pressure. S5: Post-processing After lamination, the multilayer board undergoes drilling, copper plating, outer layer circuitry, solder masking, and surface treatment to obtain the finished product.

[0007] Preferably, in step S2, the composite medium layer comprises, by weight, 40-50 parts of cyanate ester resin, 20-30 parts of bisphenol A epoxy resin, 3-6 parts of curing agent, and 0.3-0.8 parts of accelerator; the nanofiller phase is a mixture of hexagonal boron nitride and α-alumina in a mass ratio of 2:1, with a filling amount of 15%-25% of the total resin mass, and the nanoparticles are surface modified by a silane coupling agent.

[0008] Preferably, the power of the plasma activation treatment in step S1 is 800-1200W, the treatment time is 30-60s, and the contact angle of the copper surface after treatment is ≤35°.

[0009] Preferably, in step S3, the automatic visual alignment uses dual CCD cameras (upper and lower) with a recognition accuracy of ±1μm; the diameter tolerance of the ceramic pin is ±0.5μm, which, together with the pin hole, achieves precise positioning.

[0010] Preferably, the five-stage pressing process curve in step S4 is specifically as follows: Preheating stage: Heat up to 120℃ at 3℃ / min, pressure 0.3MPa, hold temperature and pressure for 15min; Pre-compression and leveling stage: Heat to 150℃ at 2℃ / min, pressure 0.8MPa, maintain temperature and pressure for 20min; Main pressure curing stage: heat up to 220℃ at 1.5℃ / min, pressure 2.5MPa, hold temperature and pressure for 90min; In-situ post-curing stage: Maintain 220℃ and 1.5MPa for 60 minutes; Gradient cooling stage: The temperature is reduced to 60℃ at a rate of 2℃ / min, and the pressure is simultaneously reduced to 0.2MPa before removal.

[0011] Preferably, the integrated pressing cavity integrates three functional areas: a pre-treatment station, a stacking and alignment station, and a hot pressing station. Each station is transported by an automatic conveying mechanism within the cavity, and is protected by vacuum or inert gas throughout the process.

[0012] Preferably, the nano-hexagonal boron nitride has a particle size of 50–100 nm, the nano-α-alumina has a particle size of 30–80 nm, and the silane coupling agent is KH560.

[0013] Preferably, the glass transition temperature (Tg) of the prepared multilayer PCB board is ≥220℃, and the interlayer insulation resistance at room temperature is ≥10¹. 4 Ω, ≥10¹²Ω at 150℃, breakdown voltage ≥5kV / mm, interlayer peel strength ≥1.5N / mm.

[0014] Preferably, the adaptable 4-64 layer multilayer PCB includes thick copper power board, high frequency and high speed board, high-end HDI board, and rigid-flex board, with a lamination yield of ≥99% and a production cycle shortened by more than 40% compared with traditional processes.

[0015] This invention provides a method for the integrated lamination manufacturing of high-temperature resistant, high-insulation multilayer PCB boards. It offers the following advantages: 1. This invention utilizes a cyanate ester-epoxy composite matrix combined with nano-ceramic fillers, achieving a glass transition temperature (Tg) of ≥220℃ for the dielectric layer, which is more than 70℃ higher than that of traditional FR-4; and an interlayer insulation resistance at room temperature ≥10 Ω·cm. 14 Ω, still ≥10 at 150℃ 12 With a breakdown voltage of ≥5kV / mm, it can fully meet the insulation requirements of high-power and high-temperature scenarios.

[0016] 2. This invention achieves a single-cavity, fully integrated operation without the need for intermediate transfer, with interlayer alignment accuracy ≤ ±10μm, which is more than 60% higher than the traditional process; the pressing cycle is shortened from 3-4 hours to less than 2.5 hours, production efficiency is increased by 40%, and energy consumption is reduced by 30%.

[0017] 3. This invention utilizes a stepped heating and pressure gradient combined with a high vacuum environment to ensure sufficient resin melting and leveling, thorough venting, and a reduction in the interlayer microbubble defect rate to below 0.1%; the resin flow is uniform, the dielectric layer thickness tolerance is controlled within ±5%, and impedance consistency is significantly improved. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Example

[0019] This invention provides a method for the integrated lamination manufacturing of high-temperature resistant, high-insulation multilayer PCB boards, specifically including the following steps: S1: Inner layer plate pretreatment and surface activation The inner copper substrate with the completed circuit fabrication is browned and then plasma activated under a low-pressure argon atmosphere to improve the adhesion between the copper surface and the resin. S2: Preparation of high-temperature resistant and high-insulation composite dielectric layer A semi-cured sheet is prepared by filling a cyanate ester-epoxy resin composite matrix with surface-modified nano-hexagonal boron nitride and nano-alumina composite particles and impregnating it with glass cloth. S3: Precision alignment and stacking within the cavity The inner layer, prepreg, and copper foil are stacked in the cavity, using a dual positioning method of visual automatic alignment and ceramic pin positioning, with an interlayer alignment accuracy of ≤±10μm. S4: Vacuum stepped temperature gradient pressurization integrated pressing The vacuum degree throughout the process is ≤10Pa. The pressing is completed continuously in five stages: preheating, pre-pressure leveling, main pressure curing, in-situ post-curing, and gradient cooling. Each stage is matched with the corresponding temperature and pressure. S5: Post-processing After lamination, the multilayer board undergoes drilling, copper plating, outer layer circuitry, solder masking, and surface treatment to obtain the finished product.

[0020] In step S2, the composite medium layer contains, by mass, 40 parts of cyanate ester resin, 20 parts of bisphenol A epoxy resin, 3 parts of curing agent, and 0.3 parts of accelerator; the nano-filler phase is a mixture of hexagonal boron nitride and α-alumina in a mass ratio of 2:1, and the filling amount is 15% of the total resin mass; the nanoparticles are surface modified by silane coupling agent.

[0021] In step S1, the power of plasma activation treatment is 800W, the treatment time is 30s, and the contact angle of the copper surface after treatment is ≤35°.

[0022] In step S3, the automatic visual alignment uses dual CCD cameras (top and bottom) with a recognition accuracy of ±1μm; the diameter tolerance of the ceramic pin is ±0.5μm, which, together with the pin hole, achieves precise positioning.

[0023] The five-stage pressing process curve in step S4 is as follows: Preheating stage: Heat up to 120℃ at 3℃ / min, pressure 0.3MPa, hold temperature and pressure for 15min; Pre-compression and leveling stage: Heat to 150℃ at 2℃ / min, pressure 0.8MPa, maintain temperature and pressure for 20min; Main pressure curing stage: heat up to 220℃ at 1.5℃ / min, pressure 2.5MPa, hold temperature and pressure for 90min; In-situ post-curing stage: Maintain 220℃ and 1.5MPa for 60 minutes; Gradient cooling stage: The temperature is reduced to 60℃ at a rate of 2℃ / min, and the pressure is simultaneously reduced to 0.2MPa before removal.

[0024] The integrated pressing cavity integrates three functional areas: pretreatment station, stacking and alignment station, and hot pressing station. Each station is transported through an automatic conveying mechanism within the cavity, and the entire process is protected by vacuum or inert gas.

[0025] The nano-hexagonal boron nitride has a particle size of 50 nm, and the nano-α-alumina has a particle size of 30 nm; the silane coupling agent is KH560.

[0026] The prepared multilayer PCB board has a glass transition temperature (Tg) ≥ 220℃ and an interlayer insulation resistance at room temperature ≥ 10¹. 4 Ω, ≥10¹²Ω at 150℃, breakdown voltage ≥5kV / mm, interlayer peel strength ≥1.5N / mm.

[0027] It is compatible with 4 to 64-layer multilayer PCBs, including thick copper power boards, high-frequency and high-speed boards, high-end HDI boards, and rigid-flex boards, with a lamination yield of ≥99% and a production cycle that is more than 40% shorter than traditional processes.

[0028] Fabrication of 8-layer high-temperature-resistant power PCBs This embodiment prepares an 8-layer thick copper power PCB board with a board thickness of 2.0 mm and an inner copper thickness of 2 oz. It requires a Tg ≥ 200℃, an interlayer breakdown voltage ≥ 4 kV / mm, and an interlayer alignment accuracy ≤ ±15 μm, making it suitable for new energy vehicle OBC controller scenarios.

[0029] Preparation steps: Inner layer board pretreatment: The six inner layer FR-4 substrates (copper thickness 2oz) with completed circuit fabrication are browned to form a uniform needle-like oxide layer; they are sent into the pretreatment station 11 of the integrated pressing cavity 1 and plasma activated in an argon atmosphere with a power of 1000W and a processing time of 45s. After the treatment, the copper surface contact angle is reduced from 68° to 32°, and the surface energy is significantly improved.

[0030] Preparation of composite medium semi-cured sheet: Weigh 45 parts of cyanate ester resin, 25 parts of bisphenol A epoxy resin, 4.5 parts of sulfamic acid curing agent, and 0.5 parts of imidazole accelerator by weight, and mix them evenly; add 12 parts of nano hexagonal boron nitride (particle size 80nm) and 6 parts of nano alumina (particle size 50nm). The nanoparticles are pre-modified with KH560; after high-speed dispersion for 30min, impregnate it with 7628 glass cloth, and pre-bake it in an oven at 150℃ for 4min to obtain a semi-cured sheet with a resin content of 50.2% and a gel time of 135s.

[0031] Precision stacking within the cavity: The inner layer board, prepreg, and copper foil are stacked sequentially at the stacking and alignment station 12. The alignment mark 34 is identified by the dual CCD vision system 31 and 32. After coarse adjustment, φ3.175mm ceramic pins 33 are inserted for fine positioning. The interlayer alignment deviation is detected to be 8.2μm, which meets the requirements. The cavity conveying mechanism 14 sends the stacked slabs into the hot pressing station 13.

[0032] Integrated pressing: Evacuate the cavity to 8 Pa and perform pressing according to the following curve: Preheating: Increase the temperature to 120℃ at a rate of 3℃ / min, maintain the pressure at 0.3MPa, and hold for 15min; Pre-compression leveling: Heat to 150℃ at 2℃ / min, pressure 0.8MPa, hold for 20min; Main pressure curing: Heat to 220℃ at a rate of 1.5℃ / min, pressure 2.5MPa, hold for 90min; Post-curing: 220℃, 1.5MPa, heat treatment for 60 minutes; Cooling: Cool down to 60℃ at 2℃ / min, simultaneously reduce pressure to 0.2MPa, open the cavity and remove the plate.

[0033] Post-processing: After lamination, the board undergoes drilling, copper plating, outer layer circuitry, solder masking, and immersion gold surface treatment to obtain the finished 8-layer PCB board.

[0034] Performance test results: Glass transition temperature Tg: 225℃ (DMA method); Interlayer insulation resistance at room temperature: 2.3 × 10⁻⁶ 14 Ω, at 150℃: 6.8×10 12 Ω; Interlayer breakdown voltage: 5.8kV / mm; Interlayer alignment accuracy: average 7.8 μm, maximum 11.2 μm; Interlayer peel strength: 1.72 N / mm; Thermal shock (-40℃~125℃, 1000 cycles): No delamination, no plate bursting; The bonding yield is 99.3%, with no air bubble defects. Example

[0035] This invention provides a method for the integrated lamination manufacturing of high-temperature resistant, high-insulation multilayer PCB boards, specifically including the following steps: S1: Inner layer plate pretreatment and surface activation The inner copper substrate with the completed circuit fabrication is browned and then plasma activated under a low-pressure argon atmosphere to improve the adhesion between the copper surface and the resin. S2: Preparation of high-temperature resistant and high-insulation composite dielectric layer A semi-cured sheet is prepared by filling a cyanate ester-epoxy resin composite matrix with surface-modified nano-hexagonal boron nitride and nano-alumina composite particles and impregnating it with glass cloth. S3: Precision alignment and stacking within the cavity The inner layer, prepreg, and copper foil are stacked in the cavity, using a dual positioning method of visual automatic alignment and ceramic pin positioning, with an interlayer alignment accuracy of ≤±10μm. S4: Vacuum stepped temperature gradient pressurization integrated pressing The vacuum degree throughout the process is ≤10Pa. The pressing is completed continuously in five stages: preheating, pre-pressure leveling, main pressure curing, in-situ post-curing, and gradient cooling. Each stage is matched with the corresponding temperature and pressure. S5: Post-processing After lamination, the multilayer board undergoes drilling, copper plating, outer layer circuitry, solder masking, and surface treatment to obtain the finished product.

[0036] In step S2, the composite medium layer contains, by mass, 50 parts of cyanate ester resin, 30 parts of bisphenol A epoxy resin, 6 parts of curing agent, and 0.8 parts of accelerator; the nano-filler phase is a mixture of hexagonal boron nitride and α-alumina in a mass ratio of 2:1, and the filling amount is 25% of the total resin mass; the nanoparticles are surface modified by silane coupling agent.

[0037] In step S1, the power of plasma activation treatment is 1200W, the treatment time is 60s, and the contact angle of the copper surface after treatment is ≤35°.

[0038] In step S3, the automatic visual alignment uses dual CCD cameras (top and bottom) with a recognition accuracy of ±1μm; the diameter tolerance of the ceramic pin is ±0.5μm, which, together with the pin hole, achieves precise positioning.

[0039] The five-stage pressing process curve in step S4 is as follows: Preheating stage: Heat up to 120℃ at 3℃ / min, pressure 0.3MPa, hold temperature and pressure for 15min; Pre-compression and leveling stage: Heat to 150℃ at 2℃ / min, pressure 0.8MPa, maintain temperature and pressure for 20min; Main pressure curing stage: heat up to 220℃ at 1.5℃ / min, pressure 2.5MPa, hold temperature and pressure for 90min; In-situ post-curing stage: Maintain 220℃ and 1.5MPa for 60 minutes; Gradient cooling stage: The temperature is reduced to 60℃ at a rate of 2℃ / min, and the pressure is simultaneously reduced to 0.2MPa before removal.

[0040] The integrated pressing cavity integrates three functional areas: pretreatment station, stacking and alignment station, and hot pressing station. Each station is transported through an automatic conveying mechanism within the cavity, and the entire process is protected by vacuum or inert gas.

[0041] The nano-hexagonal boron nitride has a particle size of 100 nm, and the nano-α-alumina has a particle size of 80 nm; the silane coupling agent is KH560.

[0042] The prepared multilayer PCB board has a glass transition temperature (Tg) ≥ 220℃ and an interlayer insulation resistance at room temperature ≥ 10 Nm. 14 Ω, ≥10 at 150℃ 12 Ω, breakdown voltage ≥5kV / mm, interlayer peel strength ≥1.5N / mm.

[0043] It is compatible with 4 to 64-layer multilayer PCBs, including thick copper power boards, high-frequency and high-speed boards, high-end HDI boards, and rigid-flex boards, with a lamination yield of ≥99% and a production cycle that is more than 40% shorter than traditional processes.

[0044] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for integrated lamination manufacturing of high-temperature resistant, high-insulation multilayer PCB boards, characterized in that, Specifically, the following steps are included: S1: Inner layer plate pretreatment and surface activation The inner copper substrate with the completed circuit fabrication is browned and then plasma activated under a low-pressure argon atmosphere to improve the adhesion between the copper surface and the resin. S2: Preparation of high-temperature resistant and high-insulation composite dielectric layer A semi-cured sheet is prepared by filling a cyanate ester-epoxy resin composite matrix with surface-modified nano-hexagonal boron nitride and nano-alumina composite particles and impregnating it with glass cloth. S3: Precision alignment and stacking within the cavity The inner layer, prepreg, and copper foil are stacked in the cavity, using a dual positioning method of visual automatic alignment and ceramic pin positioning, with an interlayer alignment accuracy of ≤±10μm. S4: Vacuum stepped temperature gradient pressurization integrated pressing The vacuum degree throughout the process is ≤10Pa. The pressing is completed continuously in five stages: preheating, pre-pressure leveling, main pressure curing, in-situ post-curing, and gradient cooling. Each stage is matched with the corresponding temperature and pressure. S5: Post-processing After lamination, the multilayer board undergoes drilling, copper plating, outer layer circuitry, solder masking, and surface treatment to obtain the finished product.

2. The method for integrated lamination manufacturing of a high-temperature resistant, high-insulation multilayer PCB board according to claim 1, characterized in that: The composite medium layer in step S2 comprises, by weight, 40-50 parts of cyanate ester resin, 20-30 parts of bisphenol A epoxy resin, 3-6 parts of curing agent, and 0.3-0.8 parts of accelerator; the nano-filler phase is a mixture of hexagonal boron nitride and α-alumina in a mass ratio of 2:1, with a filling amount of 15%-25% of the total resin mass, and the nanoparticles are surface modified by a silane coupling agent.

3. The method for integrated lamination manufacturing of a high-temperature resistant, high-insulation multilayer PCB board according to claim 1, characterized in that: In step S1, the power of plasma activation treatment is 800-1200W, the treatment time is 30-60s, and the contact angle of the copper surface after treatment is ≤35°.

4. The method for integrated lamination manufacturing of a high-temperature resistant, high-insulation multilayer PCB board according to claim 1, characterized in that: In step S3, the automatic visual alignment uses dual CCD cameras (upper and lower) with a recognition accuracy of ±1μm; the ceramic pin diameter tolerance is ±0.5μm, which, together with the pin hole, achieves precise positioning.

5. The method for integrated lamination manufacturing of a high-temperature resistant, high-insulation multilayer PCB board according to claim 1, characterized in that: The five-stage pressing process curve in step S4 is specifically as follows: Preheating stage: Heat up to 120℃ at 3℃ / min, pressure 0.3MPa, hold temperature and pressure for 15min; Pre-compression and leveling stage: Heat to 150℃ at 2℃ / min, pressure 0.8MPa, maintain temperature and pressure for 20min; Main pressure curing stage: heat up to 220℃ at 1.5℃ / min, pressure 2.5MPa, hold temperature and pressure for 90min; In-situ post-curing stage: Maintain 220℃ and 1.5MPa for 60 minutes; Gradient cooling stage: The temperature is reduced to 60℃ at a rate of 2℃ / min, and the pressure is simultaneously reduced to 0.2MPa before removal.

6. The method for integrated lamination manufacturing of a high-temperature resistant, high-insulation multilayer PCB board according to claim 1, characterized in that: The integrated pressing cavity integrates three functional areas: a pre-treatment station, a stacking and alignment station, and a hot pressing station. Each station is transported by an automatic conveying mechanism within the cavity, and the entire process is protected by a vacuum or inert gas.

7. The method for integrated manufacturing of high-temperature resistant, high-insulation multilayer PCB boards by lamination according to claim 1, characterized in that: The nano-hexagonal boron nitride particles have a diameter of 50–100 nm, and the nano-α-alumina particles have a diameter of 30–80 nm; the silane coupling agent is KH560.

8. The method for integrated lamination manufacturing of a high-temperature resistant, high-insulation multilayer PCB board according to claim 1, characterized in that: The prepared multilayer PCB board has a glass transition temperature (Tg) ≥ 220℃ and an interlayer insulation resistance at room temperature ≥ 10 Ω·cm. 14 Ω, still ≥10 at 150℃ 12 Ω, breakdown voltage ≥5kV / mm, interlayer peel strength ≥1.5N / mm.

9. The integrated manufacturing method for high-temperature resistant and high-insulation multilayer PCB board lamination according to claim 1, characterized in that: The aforementioned 4-64 layer multilayer PCBs include thick copper power boards, high-frequency and high-speed boards, high-end HDI boards, and rigid-flex boards, with a lamination yield of ≥99% and a production cycle that is more than 40% shorter than that of traditional processes.