Hybrid cooling power module

Abstract

The application relates to the technical field of power modules, in particular to a hybrid cooling type power module, which comprises a power module, the power module comprises a module box and a mounting support, the mounting support provides support for electrical elements installed in different areas in the module box, and provides a circulating mixed cooling air duct for the liquid cooling part and the air cooling part in the module box; the liquid cooling part is arranged on the mounting support and absorbs heat to cool the electrical elements installed in the module box; the air cooling part is arranged on the mounting support, the air circulation speed in the module box is increased, and the heat absorption and cooling efficiency of the liquid cooling part is improved. The application has the advantages of reasonable structure design, high sealing performance and high heat dissipation efficiency, adopts excellent structure design and reasonable layout of a liquid cooling system and an air cooling system, and the cooling efficiency of the electrical elements is significantly improved.

Description

Technical Field

[0001] This invention relates to the field of power cabinets, and more particularly to a hybrid cooling power module. Background Technology

[0002] With the rapid development of power electronics technology, power modules are evolving towards higher power density, miniaturization, and integration. Increased power density inevitably leads to a sharp increase in heat generation per unit volume. If this heat cannot be dissipated effectively and promptly, it will directly affect the performance, reliability, and lifespan of electronic components. Therefore, efficient and reliable heat dissipation design has become a key technological bottleneck for high-power power modules.

[0003] Currently, the main methods for heat dissipation of power modules are air cooling or liquid cooling.

[0004] Traditional air-cooling technology typically involves mounting aluminum or copper heat sinks on heat-generating components and using fans to force airflow or exhaust, utilizing air convection to remove heat. To enhance heat dissipation, existing heat sinks often have fins on their surface to increase the heat exchange area. However, this open or semi-open air-cooling structure has inherent drawbacks: First, it relies on external air as the heat exchange medium. In outdoor, desert, high-dust, humid, or corrosive industrial environments, air pollutants can easily enter the power module with the airflow, adhering to the circuit board and component surfaces, leading to decreased insulation performance, short circuits, or corrosion failure, severely reducing system reliability. Second, even with the addition of dust filters, air resistance increases over time, reducing heat dissipation efficiency, and requiring regular maintenance and cleaning.

[0005] To address the environmental adaptability issues of air-cooled heat dissipation, liquid cooling technology has been developed in existing technologies. Liquid cooling uses a pump to drive coolant to flow through circulating pipes, transferring heat from the heat-generating components to a distant heat exchanger for dissipation. Because the cooling circuit can be completely sealed, liquid cooling systems can achieve extremely high protection ratings (such as IP67), effectively isolating dust and moisture from the external environment. However, pure liquid cooling systems are structurally complex, typically including multiple components such as cold plates, pipes, water pumps, and heat exchangers, resulting in large size and high cost, and requiring extremely high integration in compact power modules. Furthermore, coolant leakage can cause catastrophic damage to the entire electrical system.

[0006] In summary, existing air-cooling solutions struggle to guarantee the long-term reliability of power modules in harsh environments, while liquid-cooling solutions suffer from bulky structures, high costs, and potential leakage risks. Especially in applications requiring both high power density and high environmental protection levels (such as outdoor base station power supplies, electric vehicle on-board chargers, and mine power supplies), traditional single-mode cooling systems cannot simultaneously achieve excellent heat dissipation performance and high-level dustproof and waterproof sealing. Summary of the Invention

[0007] To address the technical problems existing in the prior art, embodiments of the present invention provide a hybrid cooling power module. The technical solution is as follows: A hybrid cooling power module includes: A power module, comprising a module box and mounting supports, wherein the mounting supports provide support for the regional installation of electrical components within the module box, and provide a circulating mixed cooling air duct for the liquid-cooled components and the air-cooled components within the module box; A liquid cooling component, which is mounted on the mounting support, absorbs heat and cools the electrical components installed inside the module box; An air-cooled component, mounted on the mounting support, increases the air circulation speed inside the module box and improves the heat absorption and cooling efficiency of the liquid-cooled component.

[0008] Preferably, the module box includes a housing, a front cover plate, and a side cover plate. The front cover plate is detachably and sealingly installed on the port of the housing, and the side cover plate is detachably and sealingly installed on the side slot of the housing, thereby improving the sealing performance of the module box.

[0009] Preferably, the mounting support includes a region partition plate, a first layer plate, and a second layer plate. The region partition plate is vertically installed inside the housing, and a predetermined distance is reserved between the region partition plate and the front cover plate. The first layer plate and the second layer plate are vertically spaced and horizontally detachably installed inside the housing, respectively for installing the electrical components, and one end of the first layer plate is sealed to the region partition plate.

[0010] Preferably, the liquid cooling component includes a lower liquid cooling component and an upper liquid cooling component. The lower liquid cooling component is disposed on the housing and is used to liquid cool the electrical components mounted on the bottom surface of the housing. The upper liquid cooling component is disposed on the first layer plate and the second layer plate and is used to liquid cool the electrical components mounted on the first layer plate and the second layer plate.

[0011] Preferably, the lower liquid cooling component includes a first liquid cooling base, a first heat dissipation fin, and a first liquid cooling delivery component. The first liquid cooling base is mounted on a first circuit board on the bottom surface of the housing groove. The first heat dissipation fin is on the first liquid cooling base to increase the contact area with the air inside the housing. The first liquid cooling delivery component is connected to the first liquid cooling base through a through connection to deliver coolant into the first liquid cooling base.

[0012] Preferably, the first heat dissipation fin includes a first heat dissipation base and a first heat dissipation plate. One side of the first heat dissipation base is detachably mounted on the side of the first liquid cooling base. The first heat dissipation plate is corrugated. Multiple first heat dissipation plates are distributed at equal intervals along the vertical direction to increase the contact area with air.

[0013] Preferably, the upper liquid cooling component includes a second liquid cooler, a second liquid cooling conveyor, and a third liquid cooler. The second liquid cooler is disposed on the first layer plate and liquid cools the electrical components mounted on the first layer plate. The second liquid cooling conveyor is connected to the second liquid cooler to deliver coolant to the second liquid cooler and transfer the heat absorbed by the second liquid cooler from the electrical components and the air inside the housing to the outside. The third liquid cooler is connected to the second liquid cooler to absorb heat and cool the air flowing upward below the first layer plate.

[0014] Preferably, the second liquid cooler includes a second liquid cooling base, a second heat sink base, and a second heat sink plate. The second liquid cooling base is disposed in the liquid cooling groove on the first layered plate. The second heat sink base is detachably installed in the liquid cooling through hole. The second heat sink plate is corrugated in shape. The two ends of the second heat sink plate are respectively disposed on the inner walls of the two ends of the second heat sink base. Multiple second heat sink plates are distributed parallel to each other on the second heat sink base to increase the contact area between the upward flowing air and the second heat sink plate.

[0015] Preferably, the third liquid cooler includes a third heat sink and a third heat sink plate. One end of the third heat sink is connected to the side wall of the other end of the second liquid cooler. The third heat sink plate is disposed on the third heat sink to absorb heat and cool down the air flowing upward below the first layer plate. Two sets of the third liquid coolers are symmetrically distributed on both sides of the second liquid cooler.

[0016] Preferably, the air-cooling component includes a first cooling fan and a second cooling fan. The first cooling fan is installed in a mounting through hole on the partition plate below the first layered plate and is used to deliver air downwards from the first layered plate. The second cooling fan is installed in a mounting through hole on the partition plate above the first layered plate and is used to draw air from above the second layered plate and the third layered plate for the second cooling fan to blow.

[0017] The beneficial effects of the technical solutions provided in the embodiments of the present invention include at least the following: (1) The hybrid cooling power module of the present invention has a reasonable structural design, high sealing performance and high heat dissipation efficiency. It adopts an excellent liquid cooling system and air cooling system with a reasonable structural design and layout, which significantly improves the cooling efficiency of electrical components. (2) The present invention is a hybrid cooling power module. The present invention adopts a sealed module box structure to completely enclose the core electrical components of the power module inside the box, thereby achieving a high level of dustproof and waterproof performance. It can effectively isolate dust, moisture and corrosive gases in the external environment, and solve the problems of internal pollution, insulation degradation and poor reliability caused by the introduction of external air in the traditional air-cooled heat dissipation structure. At the same time, the internal heat is efficiently transferred to the outside of the sealed box through the built-in liquid cooling circulation loop, and then the heat is transferred to the water cooling system through the internal air cooling circulation. This ensures the cleanliness of the internal electrical environment and realizes the heat dissipation capacity of the sealed structure. (3) The present invention is a hybrid cooling power module. The present invention adopts a dual-cycle cooling system that combines liquid cooling and air cooling. The liquid cooling cycle is responsible for quickly dissipating the heat generated by the electrical components through heat conduction. The air cooling cycle improves the heat convection of the electrical components to the liquid cooling cycle system, further improving the cooling efficiency of the electrical components. The two cooling cycle systems work independently and complement each other. Even if the internal air cooling system fails, the liquid cooling cycle can still use the natural convection inside the box to dissipate heat, which will not immediately cause the module to overheat and fail. It provides heat dissipation redundancy and significantly improves the overall reliability and safety of the system. Attached Figure Description

[0018] Figure 1 This is the front view of the present invention; Figure 2 This is the front-end main view of the present invention; Figure 3 This is the main backend view of the present invention; Figure 4 This is a three-dimensional structural diagram of the present invention; Figure 5 For the present invention Figure 3 Schematic diagram of the three-dimensional structure in the CC direction; Figure 6 For the present invention Figure 1 Schematic diagram of the three-dimensional structure in the AA direction section; Figure 7 For the present invention Figure 1 Schematic diagram of the three-dimensional structure in the BB direction; Figure 8 This is a three-dimensional structural diagram of the first type of liquid cooler in this invention; Figure 9 This is a three-dimensional structural diagram of the second type of the first liquid cooler in this invention; Figure 10 This is a three-dimensional structural diagram of the second and third liquid coolers in this invention.

[0019] In the diagram: 1-House, 2-Front end cover, 3-Side end cover, 4-Area partition plate, 5-First layer plate, 6-Second layer plate, 7-First liquid cooling base, 8-First circuit board, 9-First heat sink, 10-First heat sink plate, 11-First delivery pipe, 12-First output pipe, 13-Second liquid cooling base, 14-Second heat sink fins, 15-Second circuit board, 16-Electrical components, 17-PFC inductor, 18-Third heat sink, 19-Third heat sink plate, 20-First cooling fan, 21-Second cooling fan, 22-Handle. Detailed Implementation

[0020] The technical solution of the present invention will now be described with reference to the accompanying drawings.

[0021] In embodiments of the present invention, words such as "exemplarily," "for example," etc., are used to indicate that something is an example, illustration, or description. Any embodiment or design described as "exemplary" in the present invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the word "exemplary" is intended to present the concept in a concrete manner. Furthermore, in embodiments of the present invention, the meaning expressed by "and / or" can be both, or either one.

[0022] In the embodiments of this invention, the terms "image" and "picture" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning. Similarly, the terms "of," "corresponding (relevant)," and "corresponding" may sometimes be used interchangeably. It should be noted that, without emphasizing the distinction between them, they convey the same meaning.

[0023] In this embodiment of the invention, sometimes a subscript such as W1 may be written in a non-subscript form such as W1. When the difference is not emphasized, the meaning they express is the same.

[0024] To make the technical problems, technical solutions and advantages of the present invention clearer, a detailed description will be given below in conjunction with the accompanying drawings and specific embodiments.

[0025] according to Figures 1-10 As shown, a hybrid cooling power module includes a power module, a liquid cooling component, and an air cooling component. Both the liquid cooling component and the air cooling component are disposed on the power module and are used to perform hybrid liquid cooling and air cooling on the electrical components 16 in the power module to significantly improve cooling efficiency.

[0026] The power module includes a module housing and mounting supports. The mounting supports provide support for the regionally mounted electrical components 16 within the module housing and provide a circulating mixed cooling airflow for the liquid-cooled and air-cooled components within the module housing, thereby significantly improving the mixed cooling efficiency of the electrical components 16.

[0027] The module box is generally rectangular and sealed. It includes a housing 1 and a cover plate. The cover plate seals over the housing 1, providing sealed protection for the internal electrical components 16 and improving the overall dustproof and waterproof performance of the power module. The housing 1 is generally rectangular and slotted, with one end closed. The cover plate includes a front cover plate 2 and a side cover plate 3. The front cover plate 2 is detachably and sealably installed on the other end of the housing 1, and the side cover plate 3 is detachably and sealably installed on the side slot of the housing 1. This improves the sealing performance of the module box while also enhancing the ease of installation, maintenance, and inspection of the internal electrical components 16.

[0028] A handle 22 is provided on the outer side of the front cover plate 2 to facilitate the installation of the hybrid cooling power module into the power cabinet or its removal from the inside. A first sealing strip is directly provided between the front cover plate 2 and the other end of the housing 1 to improve the sealing between them. A second sealing strip is directly provided between the side cover plate 3 and the side groove of the housing 1 to improve the sealing between them.

[0029] The mounting support includes a region divider and a layered component. The region divider is vertically arranged inside the module box to divide the module box into a front region and a rear region, and the region divider is also used to install the air-cooled component. The layered component is arranged in layers inside the module box, and the layered component is located in the rear region for installing the electrical component 16 and the liquid-cooled component.

[0030] The area partition includes an area partition plate 4, which is vertically installed inside the housing 1. A predetermined distance is maintained between the area partition plate 4 and the front cover plate 2 to serve as an air duct for the air-cooled component. Further, the area partition plate 4 is provided with mounting through holes for mounting the air-cooled component. Alternatively, six mounting through holes are provided, arranged in two rows on the area partition plate 4, with three mounting through holes evenly spaced in each row. Alternatively, the distance between the mounting through holes in the lower row and the bottom surface of the groove in the housing 1 is smaller than the distance between the mounting through holes in the upper row and the side cover plate 3.

[0031] Alternatively, the area partition plate 4 is generally rectangular, with three sides sealingly connected to the bottom and side surfaces of the housing 1, respectively. Furthermore, the sides of the area partition plate 4 can be sealingly connected to the side cover plate 3 to further improve the sealing performance of the rear area. Rubber sealing gaskets are provided between the sides of the area partition plate 4 and the housing 1 and the side cover plate 3 to constrain the vibration of the air-cooled component.

[0032] The layered components include a first layer plate 5 and a second layer plate 6. The first layer plate 5 and the second layer plate 6 are vertically spaced and horizontally detachably installed within the housing 1 for mounting the electrical components. The first layer plate 5 is generally plate-shaped, and its two sides are mounted on the side walls of the housing 1 via a first mounting bracket, leaving a predetermined distance between the first layer plate 5 and the bottom surface of the housing 1's groove. The second layer plate 6 is generally plate-shaped, and its two sides are mounted on the side walls of the housing 1 via a second mounting bracket, leaving a predetermined distance between the second layer plate 6 and the first layer plate 5 below it, and also leaving a predetermined distance between the first layer plate 5 and the side cover plate 3.

[0033] Furthermore, the first layer plate 5 is located above the plurality of mounting through holes in the lower row, and one end of the first layer plate 5 is sealed to the area partition plate 4, while the other end of the first layer plate 5 is left with a predetermined distance from one end face of the housing 1, so that air below the first layer plate 5 flows upward to the top of the first layer plate 5 and the second layer plate 6 to air cool the electrical components mounted on the first layer plate 5 and the second layer plate 6.

[0034] The extended surface of the plane where the second layer plate 6 is located is tangent to the plane where the plurality of mounting through holes in the lower row are located, and the other end of the second layer plate 6 is left with a predetermined distance from one end face of the housing 1 so that the air below the first layer plate 5 flows upward to the top of the second layer plate 6 to air cool the electrical components mounted on the second layer plate 6.

[0035] The liquid cooling component includes a lower liquid cooling component and an upper liquid cooling component. The lower liquid cooling component is disposed on the housing 1 and is used to liquid cool the electrical components installed on the bottom surface of the housing 1. The upper liquid cooling component is disposed on the layered component and is used to liquid cool the electrical components installed on the layered component.

[0036] The lower liquid cooling component includes a first liquid cooler and a first liquid cooling delivery component. The first liquid cooler is disposed on the bottom surface of the tank of the housing 1 and liquid cools the electrical components installed on the bottom surface of the tank of the housing 1. The first liquid cooling delivery component is connected to the first liquid cooler and is used to deliver coolant to the first liquid cooler to transfer the heat absorbed by the first liquid cooler from the electrical components and the housing 1 to the outside.

[0037] The first liquid cooler includes a first liquid cooling base 7 and first heat dissipation fins. The first liquid cooling base 7 is mounted on a first circuit board 8 on the bottom surface of the housing 1. The first heat dissipation fins are disposed on the first liquid cooling base 7 to increase the contact area between the first liquid cooling base 7 and the air inside the housing 1. Further, the first liquid cooling base 7 is generally in the shape of a long rectangular block. One side of the first liquid cooling base 7 is mounted on the bottom surface of the housing 1, and the first liquid cooling base 7 is mounted near the rear end of the housing 1. The electrical components are mounted on the first circuit board 8 at the front end of the bottom surface of the housing 1. Alternatively, the electrical components mounted on the bottom surface of the housing 1 may be relatively heavy (e.g., a PFC inductor 17).

[0038] The first heat dissipation fin includes a first heat dissipation base 9 and a first heat dissipation plate 10. The first heat dissipation base 9 is rectangular in shape. One side of the first heat dissipation base 9 is detachably mounted on the side of the first liquid cooling base 7. One side of the first heat dissipation plate 10 is vertically fixed on the other side of the first heat dissipation base 9.

[0039] Furthermore, the first heat sink 10 is corrugated, and multiple first heat sinks 10 are distributed at equal intervals along the vertical direction to further increase the contact area between the first heat sink 10 and the air. Multiple first heat sink fins are provided as needed, and these fins are distributed on the side of the first liquid cooling base 7 to meet the requirement that some electrical components be installed in the first liquid cooling base 7.

[0040] The first liquid-cooled delivery component includes a first delivery pipe 11 and a first output pipe 12. One end of the first delivery pipe 11 is connected to a first liquid-cooled hole port on one end face of the first liquid-cooled base 7. One end of the first output pipe 12 is connected to a second liquid-cooled hole port on one end face of the first liquid-cooled base 7 (the other end of the first liquid-cooled hole extends along the other end of the first liquid-cooled base 7 and is connected to the other end of the second liquid-cooled hole). The other ends of the first delivery pipe 11 and the first output pipe 12 are both connected to a liquid-cooled pump.

[0041] The upper liquid cooling component includes a second liquid cooler, a second liquid cooling conveyor, and a third liquid cooler. The second liquid cooler is disposed on the first layer plate 5 and liquid cools the electrical components installed on the first layer plate 5. The second liquid cooling conveyor is connected to the second liquid cooler to deliver coolant to the second liquid cooler and transfer the heat absorbed by the second liquid cooler from the electrical components and the air inside the housing 1 to the outside. The third liquid cooler is connected to the second liquid cooler to absorb heat and cool the air below the first layer plate 5 as it flows upward through the third liquid cooler and enters the space above the first layer plate 5 and the second layer plate 6.

[0042] The second liquid cooler includes a second liquid cooling base 13 and second heat dissipation fins 14. The second liquid cooling base 13 is disposed within a liquid cooling groove on the first layered plate 5, and the second heat dissipation fins 14 are mounted on the second liquid cooling base 13. The fins absorb heat and cool the air flowing upwards from below the first layered plate 5 and above the second layered plate 6. Further, the second liquid cooling base 13 is generally rectangular and thick, with one end embedded in the liquid cooling groove. The second heat dissipation fins 14 are mounted in liquid cooling through holes at the other end of the second liquid cooling base 13. It should be noted that a second circuit board 15 is disposed on the top surface of the second liquid cooling base 13 and on the first layered plate 5, and electrical components are mounted on the second circuit board 15.

[0043] The second heat dissipation fin 14 includes a second heat dissipation base and a second heat dissipation plate. The second heat dissipation base is generally rectangular and can be detachably installed within the liquid cooling through hole. The second heat dissipation plate is generally corrugated and its two ends are fixedly mounted on the inner walls of both ends of the second heat dissipation base. Multiple second heat dissipation plates are distributed parallel to each other on the second heat dissipation base to increase the contact area between the upward-flowing air and the second heat dissipation plate. Alternatively, the vertical width of the second heat dissipation plate is greater than the thickness of the second liquid cooling base 13.

[0044] The second liquid-cooled conveying component includes a second conveying pipe and a second output pipe. One end of the second conveying pipe is connected to a third liquid-cooling hole on the other end face of the second liquid-cooled base 13. One end of the second output pipe is connected to a fourth liquid-cooling hole on the other end face of the first liquid-cooled base 7 (the other end of the third liquid-cooling hole extends along one end of the second liquid-cooled base 13 and is connected to the fourth liquid-cooling hole). The other ends of the second conveying pipe and the second output pipe are both connected to the liquid-cooled pump.

[0045] The third liquid cooler includes a third heat sink 18 and a third heat sink 19. One end of the third heat sink 18 is connected to the side wall of the other end of the second liquid cooler base 13. The third heat sink 19 is disposed on the third heat sink 18 to absorb heat and cool the air flowing upward from below the first layered plate 5 through the third liquid cooler and then entering the space above the first layered plate 5 and the second layered plate 6 (the air below flows upward through the third heat sink 19). Furthermore, two sets of the third liquid cooler are provided, symmetrically distributed on both sides of the second liquid cooler base 13.

[0046] The third heat sink 18 is generally rectangular in shape. The width of the third heat sink 18 is no greater than the distance from the other end of the first layered plate 5 to one end face of the housing 1, and the length of the third heat sink 18 is no greater than the distance from the side of the second liquid cooling base 13 to the groove wall of the housing 1. One end of the third heat sink 18 is detachably mounted on the side of the second liquid cooling base 13, and the other end is detachably mounted on one side groove wall of the housing 1. The third heat sink 19 is generally corrugated in shape, and its two ends are respectively fixed to the inner walls of both ends of the third heat sink 18. Multiple third heat sinks 19 are parallel to each other and spaced horizontally on the third heat sink 18 to increase the contact area between the upward-flowing air and the third heat sink 19. Alternatively, the vertical width of the third heat sink 19 is greater than the thickness of the second liquid cooling base 13.

[0047] Two sets of upper liquid cooling components are provided, one set on each of the first layer plate 5 and the second layer plate 6, respectively, to absorb and cool the first layer plate 5 and the second layer plate 6, and to absorb and cool the upward-flowing air. The installation method of the other set of upper liquid cooling components on the second layer plate 6 is the same as that of the first set of upper liquid cooling components on the second layer plate 6.

[0048] The air-cooled component includes a first cooling fan 20 and a second cooling fan 21. The first cooling fan 20 is installed in the mounting through holes in the lower row for supplying air to the area below the first layered plate 5. The second cooling fan 21 is installed in the mounting through holes in the upper row for drawing air from the area above the second layered plate 6 and the third layered plate.

[0049] Furthermore, multiple first cooling fans 20 are provided, and each of the multiple first cooling fans 20 is installed one by one in the multiple mounting through holes in the lower row. Multiple second cooling fans 21 are provided, and each of the multiple second cooling fans 21 is installed one by one in the multiple mounting through holes in the upper row.

[0050] It should be noted that the airflow direction caused by the air-cooling component within the housing 1 is as follows: the first cooling fan 20 blows air downwards to the right of the first layered plate 5. The air below the first layered plate 5 absorbs heat from the electrical components on the bottom surface of the housing 1 and then transfers heat to the first liquid cooler. The air then flows upwards through the second and third liquid coolers to the first layered plate 5. A portion of the air enters between the first layered plate 5 and the second layered plate 6 to absorb heat and cool the electrical components on the first layered plate 5, while another portion of the air enters above the second layered plate 6 to absorb heat and cool the electrical components thereon. The air on the first layered plate 5 and the second layered plate 6 is drawn to the left by the second cooling fan 21 into the pre-reserved air duct between the area partition plate 4 and the front cover plate 2, where it is blown to the right by the first cooling fan 20 to form an air-cooling circulation within the housing 1.

[0051] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A hybrid cooling power module, characterized in that, include: A power module, comprising a module box and mounting supports, wherein the mounting supports provide support for the regional installation of electrical components within the module box, and provide a circulating mixed cooling air duct for the liquid-cooled components and the air-cooled components within the module box; A liquid cooling component, which is mounted on the mounting support, absorbs heat and cools the electrical components installed inside the module box; An air-cooled component, mounted on the mounting support, increases the air circulation speed inside the module box and improves the heat absorption and cooling efficiency of the liquid-cooled component.

2. The hybrid cooling power module according to claim 1, characterized in that, The module box includes a housing, a front cover plate, and a side cover plate. The front cover plate is detachably and sealingly installed on the port of the housing, and the side cover plate is detachably and sealingly installed on the side slot of the housing, thereby improving the sealing performance of the module box.

3. The hybrid cooling power module according to claim 2, characterized in that, The mounting support includes a zone partition plate, a first layer plate, and a second layer plate. The zone partition plate is vertically installed inside the housing, and a predetermined distance is reserved between the zone partition plate and the front cover plate. The first layer plate and the second layer plate are vertically spaced and horizontally detachably installed inside the housing, respectively for installing the electrical components, and one end of the first layer plate is sealed to the zone partition plate.

4. The hybrid cooling power module according to claim 3, characterized in that, The liquid cooling component includes a lower liquid cooling component and an upper liquid cooling component. The lower liquid cooling component is disposed on the housing and is used to liquid cool the electrical components mounted on the bottom surface of the housing. The upper liquid cooling component is disposed on the first layer plate and the second layer plate and is used to liquid cool the electrical components mounted on the first layer plate and the second layer plate.

5. The hybrid cooling power module according to claim 4, characterized in that, The lower liquid cooling component includes a first liquid cooling base, a first heat dissipation fin, and a first liquid cooling delivery component. The first liquid cooling base is mounted on a first circuit board on the bottom surface of the housing groove. The first heat dissipation fin is on the first liquid cooling base to increase the contact area with the air inside the housing. The first liquid cooling delivery component is connected to the first liquid cooling base to deliver coolant into the first liquid cooling base.

6. The hybrid cooling power module according to claim 5, characterized in that, The first heat dissipation fin includes a first heat dissipation base and a first heat dissipation plate. One side of the first heat dissipation base is detachably mounted on the side of the first liquid cooling base. The first heat dissipation plate is in the shape of a corrugated plate. Multiple first heat dissipation plates are distributed at equal intervals along the vertical direction to increase the contact area with air.

7. The hybrid cooling power module according to any one of claims 4-6, characterized in that, The upper liquid cooling component includes a second liquid cooler, a second liquid cooling conveyor, and a third liquid cooler. The second liquid cooler is disposed on the first layer plate and liquid cools the electrical components mounted on the first layer plate. The second liquid cooling conveyor is connected to the second liquid cooler to deliver coolant to the second liquid cooler and transfer the heat absorbed by the second liquid cooler from the electrical components and the air inside the housing to the outside. The third liquid cooler is connected to the second liquid cooler to absorb heat and cool the air flowing upward below the first layer plate.

8. The hybrid cooling power module according to claim 7, characterized in that, The second liquid cooler includes a second liquid cooling base, a second heat sink base, and a second heat sink plate. The second liquid cooling base is disposed in the liquid cooling groove on the first layered plate. The second heat sink base is detachably installed in the liquid cooling through hole. The second heat sink plate is corrugated in shape. The two ends of the second heat sink plate are respectively disposed on the inner walls of the two ends of the second heat sink base. Multiple second heat sink plates are distributed parallel to each other on the second heat sink base to increase the contact area between the upward flowing air and the second heat sink plate.

9. The hybrid cooling power module according to claim 8, characterized in that, The third liquid cooler includes a third heat sink and a third heat sink plate. One end of the third heat sink is connected to the side wall of the other end of the second liquid cooler. The third heat sink plate is disposed on the third heat sink to absorb heat and cool down the air flowing upward below the first layer plate. Two sets of the third liquid coolers are symmetrically distributed on both sides of the second liquid cooler.

10. The hybrid cooling power module according to any one of claims 4-6, characterized in that, The air-cooling component includes a first cooling fan and a second cooling fan. The first cooling fan is installed in a mounting through hole on the partition plate below the first layered plate and is used to deliver air downwards from the first layered plate. The second cooling fan is installed in a mounting through hole on the partition plate above the first layered plate and is used to draw air from above the second layered plate and the third layered plate for the second cooling fan to blow.

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