Circuit board assembly and display module

Abstract

The application discloses a circuit board assembly and a display module, and belongs to the technical field of display. The circuit board assembly comprises a circuit board body, a shielding cover, a protective glue body and a plurality of electronic devices. After the uncured glue is injected into the shielding cover, the adjacent electronic devices are provided with a flow guide part, and the flow guide part divides the originally wide gap between the adjacent electronic devices into two narrow gaps, that is, the gap between the electronic device and the adjacent flow guide part is small, the capillary action between the electronic device and the adjacent flow guide part is effectively enhanced, the glue can be well diffused in the shielding cover, the protective glue body formed after the glue is cured can be sealed around each electronic component, water vapor erosion of the electronic component is prevented, and the impact resistance of the electronic component is enhanced.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a circuit board assembly and a display module. Background Technology

[0002] Organic light-emitting diode (OLED) displays have attracted increasing attention in recent years due to their advantages such as self-illumination, high efficiency, vibrant colors, thinness, energy saving, and flexibility.

[0003] For circuit boards in display devices, the component area of ​​the circuit board is typically covered by a shielding cover, which is soldered onto the circuit board. The edge of the shielding cover has a dispensing opening, through which adhesive can be injected into the shielding cover and diffuse within it, thus encapsulating the electronic components.

[0004] However, the adhesive cannot spread to the electronic components located far from the dispensing opening, thus failing to effectively protect these components. Summary of the Invention

[0005] This application provides a circuit board assembly and a display module. It solves the problem that adhesives in existing circuit board assemblies cannot effectively protect electronic components. The technical solution is as follows: On the one hand, a circuit board assembly is provided, including: a circuit board body, a shielding cover, a protective colloid, and multiple electronic components; One side of the circuit board body has a device area; The plurality of electronic devices are electrically connected to the circuit board body within the device area; The edges of the shield are distributed around the device area and connected to the circuit board body; the shield covers the plurality of electronic devices; the shield has a drainage portion on the side facing the device area, and the drainage portion is located between adjacent electronic devices in a direction parallel to the circuit board body; The protective colloid fills the interior of the shield, and a portion of the protective colloid is located between the drainage portion and the electronic device.

[0006] Optionally, the plurality of electronic devices include: a main electronic device and a plurality of auxiliary electronic devices; the plurality of auxiliary electronic devices are arranged at least at intervals along a first direction and arranged on the same side of the main electronic device along a second direction; the first direction and the second direction intersect and are both parallel to the circuit board body; The drainage portion is distributed at least in the second direction between the plurality of secondary electronic devices and the main electronic device.

[0007] Optionally, the drainage portion includes: a first drainage portion and a plurality of second drainage portions; the first drainage portion is distributed between the plurality of auxiliary electronic devices and the main electronic device in the second direction; in the first direction, the plurality of second drainage portions and the plurality of auxiliary electronic devices are arranged alternately.

[0008] Optionally, in the second direction, the side of the secondary electronic device facing away from the primary electronic device is less than 1 mm away from the inner wall of the adjacent shield.

[0009] Optionally, the drainage portion further includes: a third drainage portion; the third drainage portion is distributed in the second direction on the side of the plurality of secondary electronic devices opposite to the main electronic device; The second drainage portion is fixedly connected to the first drainage portion and the third drainage portion on both sides in the second direction, respectively.

[0010] Optionally, in the second direction, the third drainage portion has a first gap between the side opposite to the first drainage portion and the inner wall of the adjacent shield, and the width of the first gap is less than 1 mm.

[0011] Optionally, in the second direction, there is a second gap between the first drainage portion and the main electronic device, and the width of the second gap is less than 1 mm; And / or, in the first direction, there is a third gap between any adjacent third drain portion and the auxiliary electronic device, and the third gap is less than 1 mm; And / or, in the second direction, there is a fourth gap between the first drainage portion and the auxiliary electronic device, and the fourth gap is less than 1 mm; And / or, in the case where the drainage portion includes a third drainage portion, in the second direction, there is a fifth gap between the third drainage portion and the sub-electronic device, and the fifth gap is less than 1 mm.

[0012] Optionally, the circuit board body is a flexible circuit board; the main electronic device is a touch chip; and at least some of the multiple secondary electronic devices are capacitors.

[0013] Optionally, the shielding cover includes: a top plate and a side plate connected together; the side plate is distributed around the outer edge of the top plate, and the side plate has a dispensing port for the protective colloid to flow in before curing; the drainage part is fixedly connected to the side of the top plate facing the circuit board body, and the drainage part and the plurality of electronic devices are all distributed in the area enclosed by the side plate; In the direction perpendicular to the circuit board body, the height of the drainage portion is less than the vertical distance between the top plate and the circuit board body, and the vertical distance between the side of the drainage portion away from the top plate and the circuit board body is less than 1 mm.

[0014] On the other hand, a display module is provided, including: a display panel, and a circuit board assembly electrically connected to the display panel, wherein the circuit board assembly is any of the circuit board assemblies described above.

[0015] The beneficial effects of the technical solutions provided in this application include at least the following: After the uncured adhesive is injected into the shielding cover, the drainage section between adjacent electronic components divides the originally wide gap between them into two narrower gaps. In other words, the gap between the electronic component and the adjacent drainage section is smaller, which effectively enhances the capillary effect between the electronic component and the adjacent drainage section. The adhesive can diffuse better within the shielding cover, so that the protective colloid formed after the adhesive cures can encapsulate each electronic component, prevent moisture from corroding the electronic component, and enhance the impact resistance of the electronic component. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a top view of a circuit board assembly; Figure 2 yes Figure 1 A schematic diagram of the film structure of the circuit board assembly at point A-A' is shown. Figure 3 This is a top view of a circuit board assembly provided in an embodiment of this application; Figure 4 yes Figure 3 The diagram shows the film structure of the resistor plate assembly at point B-B'. Figure 5 This is a schematic diagram of the film layer structure of a circuit board assembly provided in an embodiment of this application; Figure 6 This is a top view of another circuit board assembly provided in an embodiment of this application; Figure 7 yes Figure 6 The diagram shows the film structure of the circuit board assembly at C-C'. Figure 8This is a partially enlarged schematic diagram of a circuit board assembly provided in an embodiment of this application. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0019] Please refer to Figure 1 and Figure 2 , Figure 1 This is a top view of a circuit board assembly. Figure 2 yes Figure 1 The diagram shows the film layer structure of the circuit board assembly at point A-A'. The circuit board assembly 00 may include: a circuit board body 10, a shielding cover 20, a protective colloid 30, and multiple electronic devices 40.

[0020] The circuit board body 10 in the circuit board assembly 00 has a device area 11 on one side.

[0021] Multiple electronic components 40 in the circuit board assembly 00 are electrically connected to the circuit board body 11 within the component area 11. The circuit board body 10 provides precise mounting positions and support for the various electronic components 40, preventing them from falling off or being damaged due to vibration or movement, thus ensuring the stability of the product structure.

[0022] The shielding cover 20 in the circuit board assembly 00 has its edges distributed around the device area 11 and is connected to the circuit board body 10. The shielding cover 20 can cover multiple electronic devices 40 located within the device area 11. In this way, the shielding cover 20 can completely enclose the electromagnetic radiation generated by the electronic devices 40. After the circuit board assembly 00 is assembled in the display device, it can effectively prevent the electromagnetic radiation generated by the electronic devices 40 in the circuit board assembly 00 from causing electromagnetic interference to other electronic devices in the display device. It can also prevent the electronic devices 40 from being squeezed, protecting the electronic devices 40 so that they can work normally.

[0023] The protective colloid 30 in the circuit board assembly 00 fills the interior of the shield 20, and the protective colloid 30 needs to encapsulate the capacitor 41 in the electronic device 40 to prevent moisture from corroding the capacitor 41 and enhance the impact resistance of the capacitor 41.

[0024] Here, the shield 20 in the circuit board assembly 00 may include a top plate 21 and a side plate 22 connected to each other, with the side plate 22 distributed around the outer edge of the top plate 21. The side plate 22 has a dispensing port 22a for the inflow of a protective colloid 30 before curing. Adhesive for forming the protective colloid 30 is applied along the dispensing port 22a, and the injected adhesive diffuses inside the shield 20 through capillary action.

[0025] However, due to the design limitations of the spacing between two adjacent electronic devices 40, the spacing between them is relatively large (for example, 2 mm). Furthermore, according to Zhulin's law, the strength of capillary action is inversely proportional to the equivalent capillary inner diameter. That is, the smaller the channel size, the stronger the capillary driving force. Therefore, the gap (2 mm) between two adjacent electronic devices 40 is greater than the 1 mm required for effective capillary action, resulting in a weak capillary effect. The adhesive can only diffuse near the capacitor 41 close to the dispensing port 22a, and cannot diffuse to the distant capacitor 41 far from the dispensing port 22a.

[0026] To solve the above problems, please refer to... Figure 3 and Figure 4 , Figure 3 This is a top view of a circuit board assembly provided in an embodiment of this application. Figure 4 yes Figure 3 The diagram shows the film structure of the resistor plate assembly at point B-B'. The circuit board assembly 000 may include: a circuit board body 100, a shielding cover 200, a protective colloid 300, and multiple electronic components 400.

[0027] The circuit board body 100 in the circuit board assembly 000 has a device area 110 on one side.

[0028] Multiple electronic components 400 in the circuit board assembly 000 are electrically connected to the circuit board body 100 within the component area 110. The circuit board body 100 provides precise mounting positions and support for the various electronic components 400, preventing them from falling off or being damaged due to vibration or movement, thus ensuring the stability of the product structure.

[0029] The shielding cover 200 in the circuit board assembly 000 has its edges distributed around the device area 110 and connected to the circuit board body 100; the shielding cover 200 covers multiple electronic devices 400. In this way, the shielding cover 200 can completely enclose the electromagnetic radiation generated by the electronic devices 400. After the circuit board assembly 000 is assembled in a display device, it can effectively prevent the electromagnetic radiation generated by the electronic devices 400 in the circuit board assembly 000 from causing electromagnetic interference to other electronic devices in the display device. It also prevents the electronic devices 400 from being squeezed, protecting them so they can function normally. It should be noted that the circuit board body 100 in the circuit board assembly 000 has multiple connection pads on the side with the device area 110. The edge of the shielding cover 200 is connected to the circuit board body 100 through the connection pads.

[0030] The shield 200 in the circuit board assembly 000 has a drainage portion 210 on the side facing the device area 110, and the drainage portion 210 is located between adjacent electronic devices 400 in a direction parallel to the circuit board body 100.

[0031] The protective colloid 300 in the circuit board assembly 000 fills the interior of the shield 200, and a portion of the protective colloid 300 is located between the drainage portion 210 and the electronic device 400.

[0032] In this case, after the uncured adhesive is injected into the shield 200, the drainage section 210 is provided between adjacent electronic components 400. The drainage section 210 divides the originally wide gap between adjacent electronic components 400 into two narrower gaps. That is, the gap between the electronic component 400 and the adjacent drainage section 210 is smaller, which effectively enhances the capillary effect between the electronic component 400 and the adjacent drainage section 210. The adhesive can diffuse better within the shield 200, so that the protective colloid formed after the adhesive cures can encapsulate the periphery of each electronic component 400, prevent moisture from corroding the electronic component 400, and enhance the impact resistance of the electronic component 400.

[0033] In summary, the embodiments of this application provide a circuit board assembly. After the uncured adhesive is injected into the shielding cover, the drainage portion between adjacent electronic components divides the originally wide gap between adjacent electronic components into two narrower gaps. That is, the gap between the electronic component and the adjacent drainage portion is smaller, which effectively enhances the capillary effect between the electronic component and the adjacent drainage portion. The adhesive can diffuse better within the shielding cover, so that the protective colloid formed after the adhesive cures can encapsulate the periphery of each electronic component, prevent moisture from corroding the electronic component, and enhance the impact resistance of the electronic component.

[0034] In the embodiments of this application, please refer to Figure 5 , Figure 5 This is a schematic diagram of the film layer structure of a circuit board assembly provided in an embodiment of this application. The shielding cover 200 in the circuit board assembly 000 may include a top plate 201 and a side plate 202 connected to each other. The side plate 202 is distributed around the outer edge of the top plate 201, and the side plate 202 has a dispensing port 200a for the inflow of protective colloid 300 before curing; the drainage portion 210 is fixedly connected to the side of the top plate 201 facing the circuit board body 100, and the drainage portion 210 and a plurality of electronic devices 400 are all distributed in the area enclosed by the side plate 202. Here, the adhesive used to form the protective colloid 300 is applied along the dispensing port 200a, and the injected adhesive diffuses inside the shielding cover 200 through capillary action.

[0035] In the direction perpendicular to the circuit board body 100, the height of the drainage portion 210 is less than the vertical distance between the top plate 201 and the circuit board body 100, and the vertical distance d1 between the side of the drainage portion 210 away from the top plate 201 and the circuit board body 100 is less than 1 mm. For example, the vertical distance d1 between the side of the drainage portion 210 away from the top plate 201 and the circuit board body 100 is 0.5 mm.

[0036] In this way, the vertical distance between the drainage section 210 and the side facing away from the top plate 201 and the circuit board body 100 is small, which meets the spacing required for effective capillary action. This makes the capillary phenomenon between the drainage section 210 and the side facing away from the top plate 201 and the circuit board body 100 obvious. After the uncured glue is injected into the shielding cover, the glue can diffuse along the gap between the drainage section 210 and the side facing away from the top plate 201 and the circuit board body 100 to a position away from the dispensing port 200a. This allows the glue to diffuse to the electronic device 400 away from the dispensing port 200a, shortening the dispensing time. Furthermore, the protective colloid 300 formed after the glue cures can encapsulate each electronic component 400, preventing moisture from corroding the electronic component 400 and enhancing the impact resistance of the electronic component 400.

[0037] Please refer to Figure 3 , Figure 5 and Figure 6 , Figure 6 This is a top view of another circuit board assembly provided in this application embodiment. The circuit board assembly 000 may include a plurality of electronic devices 400, including a main electronic device 410 and a plurality of auxiliary electronic devices 420. The plurality of auxiliary electronic devices 420 are arranged at least at intervals along a first direction x and along a second direction y on the same side of the main electronic device 410; the first direction x intersects the second direction y and are all parallel to the circuit board body 100. For example, the circuit board body 100 in the circuit board assembly 000 may be a flexible circuit board; the main electronic device 410 may be a touch chip; and at least some of the auxiliary electronic devices 420 may be capacitors.

[0038] It should be noted that, in the first direction x, the width of the dispensing orifice 200a is approximately equal to the width of the main electronic component 410. Furthermore, the protective adhesive 300 includes: a base filler adhesive for the bottom of the main electronic component 410 and an encapsulating adhesive for the sub-electronic component 420. Here, the base filler adhesive for the bottom of the main electronic component 410 and the encapsulating adhesive for the sub-electronic component 420 can be of different types.

[0039] In this shielding cover 200, the drainage portions 210 are distributed at least in the second direction y between multiple secondary electronic devices 420 and main electronic devices 410. In this case, after the uncured adhesive is injected into the shielding cover 200, the drainage portions 210 distributed between the multiple secondary electronic devices 420 and main electronic devices 410 divide the originally wide gap between adjacent secondary electronic devices 420 and main electronic devices 410 into two narrower gaps. That is, the gap between the secondary electronic devices 420 and the drainage portions 210, and the gap between the main electronic devices 410 and the drainage portions 210 are both small, which effectively enhances the capillary action between the electronic device 400 and the adjacent drainage portions 210. The adhesive can diffuse better within the shielding cover 200, so that the protective colloid 300 formed after the adhesive cures can encapsulate the periphery of each electronic component 400, prevent moisture from corroding the electronic component 400, and enhance the impact resistance of the electronic component 400.

[0040] Please continue to refer to this. Figure 3 and Figure 6 The drainage portion 210 in the shielding cover 200 may include a first drainage portion 211 and a plurality of second drainage portions 212. The extension direction of the first drainage portion 211 is parallel to the first direction x, and the extension direction of the second drainage portions 212 is parallel to the second direction y. The first drainage portion 211 is distributed in the second direction y between a plurality of auxiliary electronic devices 420 and a main electronic device 410; in the first direction x, the plurality of second drainage portions 212 and the plurality of auxiliary electronic devices 420 are arranged alternately.

[0041] In this situation, after the uncured adhesive is injected into the shielding cover 200, the adhesive that diffuses between the first drainage part 211 and the main electronic device 410 can continue to diffuse away from the dispensing port 200a under the action of capillary action, allowing the adhesive to quickly diffuse to a position away from the dispensing port 200a. Furthermore, the adhesive that diffuses between the first drainage part 211 and the secondary electronic device 420, and between the second drainage part 212 and the secondary electronic device 420, can diffuse around the secondary electronic device 420 under the action of capillary action, resulting in a better effect of adhesive diffusion around the secondary electronic device 420. The protective colloid 300 formed after the adhesive cures can encapsulate each secondary electronic device 420, preventing moisture from corroding the secondary electronic device 420 and enhancing the impact resistance of the secondary electronic device 420.

[0042] It should be noted that the embodiments of this application have multiple implementations to increase the capillary effect on the side of the secondary electronic device 420 away from the main electronic device 410. The embodiments of this application will be illustrated by the following two possible implementations.

[0043] In the first possible implementation, please refer to Figure 6and Figure 7 , Figure 7 yes Figure 6 The diagram shows a schematic of the film structure of the circuit board assembly at C-C'. In the second direction y, the side of the secondary electronic device 420 in the electronic device 400 facing away from the main electronic device 410 has a distance d2 less than 1 mm between it and the inner wall of the adjacently distributed shield 200. For example, the distance d2 between the side of the secondary electronic device 420 facing away from the main electronic device 410 and the inner wall of the adjacently distributed shield 200 is 0.5 mm.

[0044] In this configuration, the distance d2 between the side of the secondary electronic device 420 facing away from the main electronic device 410 and the inner wall of the adjacent shield 200 is small, satisfying the spacing required for effective capillary action. This results in a significant capillary effect between the side of the secondary electronic device 420 facing away from the main electronic device 410 and the inner wall of the adjacent shield 200. After the uncured adhesive is injected into the shield, the adhesive can diffuse along the gap between the secondary electronic device 420 and the inner wall of the adjacent shield 200 to a position far from the dispensing port 200a. This allows the adhesive to diffuse to the secondary electronic device 420 far from the dispensing port 200a. The protective colloid 300 formed after the adhesive cures can encapsulate each secondary electronic device 420, preventing moisture from corroding the secondary electronic device 420 and enhancing its impact resistance.

[0045] In the second possible implementation, such as Figure 3 and Figure 5 As shown, the drainage portion 210 in the shielding cover 200 may further include a third drainage portion 213; the extension direction of the third drainage portion 213 is parallel to the first direction x. The third drainage portion 213 is distributed in the second direction y on the side of the plurality of secondary electronic devices 420 away from the main electronic device 410.

[0046] In this configuration, by providing a third drainage portion 213 between the side of the secondary electronic device 420 facing away from the main electronic device 410 and the inner wall of the adjacent shield 200, the originally wide gap between the adjacent secondary electronic devices 420 and the inner wall of the shield 200 is divided into two narrower gaps. After the uncured adhesive is injected into the shield 200, the adhesive that diffuses between the secondary electronic device 420 and the third drainage portion 213 can quickly spread between the secondary electronic device 420 and the third drainage portion 213. This allows the adhesive to fill around the secondary electronic device 420 with the help of the first drainage portion 211, the second drainage portion 212, and the third drainage portion 213. The protective colloid 300 formed after the adhesive cures can encapsulate the periphery of each secondary electronic device 420, preventing moisture from corroding the secondary electronic device 420 and enhancing the impact resistance of the secondary electronic device 420.

[0047] Furthermore, the adhesive that diffuses between the inner wall of the shield 200 and the third drainage part 213 can spread along the gap between the inner wall of the shield 200 and the third drainage part 213 to a position away from the dispensing port 200a, thereby enabling the adhesive to quickly spread to the secondary electronic device 420 away from the dispensing port 200a. The protective colloid 300 formed after the adhesive cures can encapsulate the periphery of each secondary electronic device 420, preventing moisture from corroding the secondary electronic device 420 and enhancing the impact resistance of the secondary electronic device 420.

[0048] It should be noted that the second drainage portion 212 can be fixedly connected to the first drainage portion 211 and the third drainage portion 213 on both sides in the second direction y, respectively. Alternatively, in other embodiments, the second drainage portion 212 is not connected to the first drainage portion 211 and the third drainage portion 213 on both sides in the second direction y, respectively. The comparison of embodiments in this application is not limited.

[0049] It should be noted that, please refer to Figure 8 , Figure 8 This is a partially enlarged schematic diagram of a circuit board assembly provided in an embodiment of this application. In the second direction y, the third drain portion 213, on the side opposite to the first drain portion 211, has a first gap K1 between itself and the inner wall of the adjacent shield 200, and the width of the first gap K1 is less than 1 mm. Thus, the small width of the first gap K1 satisfies the spacing required for effective capillary action, making the capillary phenomenon between the side of the third drain portion 213 opposite to the first drain portion 211 and the inner wall of the adjacent shield 200 obvious. After uncured adhesive is injected into the shield, the adhesive can diffuse along the first gap K1 to a position away from the dispensing port 200a, thereby allowing the adhesive to diffuse to the secondary electronic device 420 away from the dispensing port 200a. The protective colloid 300 formed after the adhesive cures can encapsulate each secondary electronic device 420, preventing moisture from corroding the secondary electronic device 420 and enhancing the impact resistance of the secondary electronic device 420. For example, the width of the first gap K1 is 0.5 mm.

[0050] It should also be noted that, such as Figure 8As shown, in the second direction y, there is a second gap K2 between the first drainage portion 211 and the main electronic device 410, and the width of the second gap K2 is less than 1 mm. This small width of the second gap K2 satisfies the spacing required for effective capillary action, making the capillary phenomenon between the first drainage portion 211 and the main electronic device 410 more pronounced. After the uncured adhesive is injected into the shielding cover, the adhesive can diffuse along the second gap K2 to the auxiliary electronic device 420 away from the dispensing port 200a. The protective colloid 300 formed after the adhesive cures can encapsulate each auxiliary electronic device 420, preventing moisture from corroding the auxiliary electronic device 420 and enhancing its impact resistance. For example, the width of the second gap K2 is 0.5 mm.

[0051] And / or, in the first direction x, there is a third gap K3 between any adjacent second drain portions 212 and auxiliary electronic devices 420, and the third gap K3 is less than 1 mm. Thus, the width of the third gap K3 is small, satisfying the spacing required for effective capillary action, making the capillary phenomenon between the second drain portions 212 and auxiliary electronic devices 420 obvious. After the uncured adhesive is injected into the shielding cover, the adhesive can diffuse along the third gap K3. The protective colloid 300 formed after the adhesive cures can encapsulate the periphery of each auxiliary electronic device 420, preventing moisture from corroding the auxiliary electronic device 420 and enhancing the impact resistance of the auxiliary electronic device 420. For example, the width of the third gap K3 is 0.5 mm.

[0052] And / or, in the second direction y, a fourth gap K4 exists between the first drainage portion 211 and the secondary electronic device 420, and the fourth gap K4 is less than 1 mm. Thus, the width of the fourth gap K4 is small, satisfying the spacing required for effective capillary action, making the capillary phenomenon between the first drainage portion 211 and the secondary electronic device 420 significant. After uncured adhesive is injected into the shielding cover, the adhesive can diffuse along the fourth gap K4. The protective colloid 300 formed after the adhesive cures can encapsulate the periphery of each secondary electronic device 420, preventing moisture corrosion of the secondary electronic device 420 and enhancing the impact resistance of the secondary electronic device 420. For example, the width of the fourth gap K4 is 0.5 mm.

[0053] And / or, when the drainage portion 210 includes a third drainage portion 213, a fifth gap K5 exists between the third drainage portion 213 and the sub-electronic device 420 in the second direction y, and the fifth gap K5 is less than 1 mm. Thus, the width of the fifth gap K5 is small, satisfying the spacing required for effective capillary action, making the capillary phenomenon between the third drainage portion 213 and the sub-electronic device 420 significant. After uncured adhesive is injected into the shielding cover, the adhesive can diffuse along the fifth gap K5. The protective colloid 300 formed after the adhesive cures can encapsulate the periphery of each sub-electronic device 420, preventing moisture corrosion of the sub-electronic device 420 and enhancing the impact resistance of the sub-electronic device 420. For example, the width of the fifth gap K5 is 0.5 mm.

[0054] It should be noted that the widths of the first gap K1, the second gap K2, the third gap K3, the fourth gap K4, and the fifth gap K5 can be equal. That is, the central axis of the gap between two adjacent electronic devices 400 coincides with the central axis of the drainage portion 210 located between the adjacent electronic devices 400. In this embodiment, the drainage portion 210 and the shielding cover 200 are integrally stamped. This ensures the structural integrity of the shielding cover 200 and effectively prevents damage to its sealing properties, thus avoiding a decrease in electromagnetic shielding effectiveness. The shielding cover 200 can completely enclose the electromagnetic radiation generated by the electronic device 400 within it.

[0055] In summary, the embodiments of this application provide a circuit board assembly. After the uncured adhesive is injected into the shielding cover, the drainage portion between adjacent electronic components divides the originally wide gap between adjacent electronic components into two narrower gaps. That is, the gap between the electronic component and the adjacent drainage portion is smaller, which effectively enhances the capillary effect between the electronic component and the adjacent drainage portion. The adhesive can diffuse better within the shielding cover, so that the protective colloid formed after the adhesive cures can encapsulate the periphery of each electronic component, prevent moisture from corroding the electronic component, and enhance the impact resistance of the electronic component.

[0056] This application also provides a display module, including: a display panel, and a circuit board assembly electrically connected to the display panel, wherein the circuit board assembly is any of the circuit board assemblies described above. The display module can be any product or component with display functionality, such as electronic paper, mobile phones, tablet computers, televisions, monitors, laptops, digital photo frames, or navigators.

[0057] It should be noted that the display panel provided in this application can be an OLED display panel, or it can be a QLED display panel that uses quantum dot light-emitting diodes (QLED) to achieve the display function, or it can be a QD-OLED display panel that uses quantum dot organic light-emitting diodes (QD-OLED) to achieve the display function. This application does not impose any limitations on this.

[0058] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0059] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0060] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A circuit board assembly, characterized in that, include: The circuit board body, shielding cover, protective colloid, and multiple electronic components; One side of the circuit board body has a device area; The plurality of electronic devices are electrically connected to the circuit board body within the device area; The edges of the shield are distributed around the device area and connected to the circuit board body; the shield covers the plurality of electronic devices; the shield has a drainage portion on the side facing the device area, and the drainage portion is located between adjacent electronic devices in a direction parallel to the circuit board body; The protective colloid fills the interior of the shield, and a portion of the protective colloid is located between the drainage portion and the electronic device.

2. The circuit board assembly according to claim 1, characterized in that, The plurality of electronic devices include: a main electronic device and a plurality of auxiliary electronic devices; the plurality of auxiliary electronic devices are arranged at least at intervals along a first direction and arranged on the same side of the main electronic device along a second direction; the first direction and the second direction intersect and are both parallel to the circuit board body; The drainage portion is distributed at least in the second direction between the plurality of secondary electronic devices and the main electronic device.

3. The circuit board assembly according to claim 2, characterized in that, The drainage section includes: a first drainage section and a plurality of second drainage sections; the first drainage section is distributed between the plurality of auxiliary electronic devices and the main electronic device in the second direction; in the first direction, the plurality of second drainage sections and the plurality of auxiliary electronic devices are arranged alternately.

4. The circuit board assembly according to claim 3, characterized in that, In the second direction, the side of the secondary electronic device facing away from the primary electronic device is less than 1 mm away from the inner wall of the adjacent shield.

5. The circuit board assembly according to claim 3, characterized in that, The drainage section further includes a third drainage section; the third drainage section is distributed in the second direction on the side of the plurality of secondary electronic devices opposite to the main electronic device; The second drainage portion is fixedly connected to the first drainage portion and the third drainage portion on both sides in the second direction, respectively.

6. The circuit board assembly according to claim 5, characterized in that, In the second direction, the third drainage portion is located on the side opposite to the first drainage portion, and has a first gap between it and the inner wall of the adjacent shield, and the width of the first gap is less than 1 mm.

7. The circuit board assembly according to any one of claims 3-6, characterized in that, In the second direction, there is a second gap between the first drainage portion and the main electronic device, and the width of the second gap is less than 1 mm; And / or, in the first direction, there is a third gap between any adjacent second drain portions and the auxiliary electronic device, and the third gap is less than 1 mm; And / or, in the second direction, there is a fourth gap between the first drainage portion and the auxiliary electronic device, and the fourth gap is less than 1 mm; And / or, in the case where the drainage portion includes a third drainage portion, in the second direction, there is a fifth gap between the third drainage portion and the sub-electronic device, and the fifth gap is less than 1 mm.

8. The circuit board assembly according to any one of claims 2-6, characterized in that, The circuit board body is a flexible circuit board; the main electronic device is a touch chip; at least some of the multiple auxiliary electronic devices are capacitors.

9. The circuit board assembly according to any one of claims 1-6, characterized in that, The shielding cover includes: a top plate and a side plate connected to each other; the side plate is distributed around the outer edge of the top plate, and the side plate has a dispensing port for the protective colloid to flow in before curing; the drainage part is fixedly connected to the side of the top plate facing the circuit board body, and the drainage part and the plurality of electronic devices are all distributed in the area enclosed by the side plate; In the direction perpendicular to the circuit board body, the height of the drainage portion is less than the vertical distance between the top plate and the circuit board body, and the vertical distance between the side of the drainage portion away from the top plate and the circuit board body is less than 1 mm.

10. A display module, characterized in that, include: The display panel and the circuit board assembly electrically connected to the display panel, wherein the circuit board assembly is the circuit board assembly according to any one of claims 1-9.

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