Electric control device and heating and ventilation equipment

Abstract

The application discloses an electric control device and a heating and ventilation equipment. The electric control device comprises a main box body and a power module. The main box body is provided with a first cavity and a second cavity which are oppositely arranged in the thickness direction of the main box body. The frequency conversion driving module of the power module comprises a filter plate and at least one driving plate. The driving plate is arranged in the first cavity, and the filter plate is arranged in the second cavity. The driving plate comprises a driving substrate and at least one first power component mounted on the driving substrate. The first power component comprises a chip unit, a driving unit and an interface unit. The chip unit and the interface unit are mounted on the first side of the driving substrate, and the driving unit is mounted on the second side of the driving substrate. According to the application, the driving plate and the filter plate are arranged in different cavities, different power modules can be quickly identified and positioned, the interference between the strong and weak electric modules is effectively avoided, and the chip unit, the driving unit and the interface unit are integrally mounted on the same driving substrate, so that the frequency conversion driving module is convenient to disassemble, overhaul and maintain.

Description

Technical Field

[0001] This application relates to the field of electrical control device technology, and in particular to an electrical control device and HVAC equipment. Background Technology

[0002] Heating, ventilation, and air conditioning (HVAC) systems are an important component of building environmental control, encompassing multiple systems such as heating, ventilation, and air conditioning. They are widely used in residential, commercial, and industrial buildings. Their main function is to create a comfortable and healthy living and working environment by regulating parameters such as indoor temperature, humidity, and airflow.

[0003] As a key component of HVAC equipment, the electrical control unit is primarily responsible for controlling and managing the operation of HVAC equipment, especially the outdoor unit. Its main functions include controlling the operation of the compressor and fan, frequency converter control, and communication with other components. In related technologies, the electrical control unit of HVAC equipment contains various power components. Generally, to make the control unit thinner and to allow all functional components to be displayed at the equipment's access panel for easy installation or maintenance, these power components are often laid flat inside the enclosure. However, this arrangement results in a complex and difficult-to-distinguish arrangement of the power components, and unclear wiring, undoubtedly increasing the difficulty of installation and maintenance. Summary of the Invention

[0004] This application provides an electrical control device and HVAC equipment, which can solve the problem of inconvenient disassembly, assembly, and maintenance of power components in electrical control devices.

[0005] In a first aspect, embodiments of this application provide an electronic control device, the electronic control device comprising:

[0006] The main box body has a first cavity and a second cavity. The thickness direction of the main box body is a first direction, and the first cavity and the second cavity are arranged in the first direction.

[0007] A power module includes a frequency converter drive module, the frequency converter drive module includes a filter board and at least one drive board, the drive board is disposed in the first cavity, and the filter board is disposed in the second cavity;

[0008] The driving board includes a driving substrate and at least one first power component mounted on the driving substrate. The first power component includes a chip unit, a driving unit, and an interface unit. The driving substrate has a first side facing the opening of the first cavity and a second side away from the opening of the first cavity. The chip unit and the interface unit are mounted on the first side of the driving substrate, and the driving unit is mounted on the second side of the driving substrate.

[0009] In some embodiments, the filter board includes a filter substrate and at least one second power component mounted on the drive substrate. The filter substrate is parallel to the drive substrate, and the drive substrate and the filter substrate are spaced apart in the first direction. At least a portion of the second power component is disposed on the side of the filter substrate facing away from the second cavity opening.

[0010] In some embodiments, the main housing includes a cold plate body, the first cavity and the second cavity are respectively disposed on opposite sides of the cold plate body, the second power component includes a common mode inductor, and the drive unit and the common mode inductor are respectively attached to the cold plate body.

[0011] In some embodiments, the filter substrate is a circuit board mounted on one side, and all the second power components are disposed on the side of the filter substrate facing away from the opening of the second cavity.

[0012] In some embodiments, the second power component further includes at least one of a varistor, a differential-mode capacitor, and a common-mode capacitor, wherein the varistor, differential-mode capacitor, and common-mode capacitor are spaced apart from the cold plate body.

[0013] In some embodiments, the electronic control device further includes at least one first power connection structure, the cold plate body has at least one first communication port, the first communication port is respectively connected to the first cavity and the second cavity, the first power connection structure passes through the first communication port, and its two ends are respectively electrically connected to the driving substrate and the filter substrate.

[0014] The first power connection structure includes a first insulating base and a first power connection post, wherein the first power connection post is mounted on the first insulating base;

[0015] The first insulating seat passes through the first communication port and is installed on the cold plate body, and its two ends are respectively used to support the driving substrate and the filter substrate;

[0016] The first electrical contact post passes through the first communication port, and its two ends are electrically connected to the driving substrate and the filter substrate, respectively.

[0017] In some embodiments, the two ends of the power-connecting post of the first power-connecting structure are respectively provided with a first connecting hole and a second connecting hole;

[0018] The driving substrate has a first power connection hole, and the first power connection hole and the first connection hole are electrically connected by a connector;

[0019] The filter substrate has a second power contact hole, and the second power contact hole and the second connection hole are electrically connected by a connector.

[0020] In some embodiments, the main housing further includes a first support column and a second support column, wherein the first support column is located in the first cavity and the second support column is located in the second cavity;

[0021] The first support column is used to support the driving base plate, and the driving base plate is detachably mounted on the first support column;

[0022] The second support column is used to support the filter substrate, and the filter substrate is detachably mounted on the second support column.

[0023] In some embodiments, the frequency conversion drive module includes a third power component, which is disposed in the second cavity and attached to the cold plate body;

[0024] The third power component is located outside the filter plate and is spaced apart from the filter plate.

[0025] In some embodiments, the third power component includes at least one reactance;

[0026] The electronic control device further includes at least one second power connection structure. The cold plate body has at least one second communication port, which is connected to the first cavity and the second cavity respectively. The second power connection structure is disposed at the second communication port and installed on the cold plate body, and the second power connection structure is electrically connected to the drive substrate and the reactor respectively.

[0027] In some embodiments, the second power connection structure includes a second insulating base and a second power connection post, wherein the second power connection post is mounted on the second insulating base;

[0028] The second insulating base is installed on the cold plate body, the second electrical terminal is inserted through the second communication port, and its two ends are electrically connected to the driving substrate and the reactor, respectively.

[0029] In some embodiments, the drive unit includes a fan drive module and a compressor drive module, the fan drive module and the compressor drive module being spaced apart along a second direction perpendicular to the thickness direction of the main housing; and / or,

[0030] The chip unit includes a fan drive chip and a compressor drive chip, the fan drive chip and the compressor drive chip being spaced apart along the second direction; and / or

[0031] The interface unit is disposed along the edge of the drive substrate, and the interface unit includes a fan interface and a communication interface.

[0032] In some embodiments, the main housing includes a mounting sidewall, the drive substrate has a first edge and a second edge connected at an angle, and the second edge is disposed toward the mounting sidewall, the drive substrate includes a corner mounting area sandwiched between the first edge and the second edge, and the fan interface and the communication interface are disposed in the corner mounting area;

[0033] The fan interface is located at the first edge, and the communication interface is located at the second edge.

[0034] In some embodiments, the first power component further includes a module power supply mounted in a region of the drive substrate adjacent to the first edge.

[0035] In some embodiments, the main housing includes a mounting sidewall disposed opposite to the driving substrate in a third direction, wherein the first direction, the second direction, and the third direction are mutually perpendicular;

[0036] The main housing includes a fan wiring section and a compressor wiring section, which are spaced apart on the same mounting side wall of the main housing.

[0037] In some embodiments, the wind turbine drive chip and the wind turbine drive module are at least partially overlapped in the first direction and are disposed in the region of the drive substrate near the mounting sidewall;

[0038] The compressor drive chip and the compressor drive module are at least partially overlapped in the first direction and are disposed in the region of the drive substrate near the mounting sidewall.

[0039] In some embodiments, in the third direction, the wind turbine wiring portion is correspondingly provided with the mounting area of ​​the drive substrate on which the wind turbine drive chip and the wind turbine drive module are installed;

[0040] In the third direction, the compressor wiring section is correspondingly arranged with the mounting area of ​​the drive substrate on which the compressor drive chip and the compressor drive module are installed.

[0041] In some embodiments, the electronic control device further includes multiple compressor wires, one end of each compressor wire passing through the inside of the compressor wiring section, and the other end of the compressor wiring is located on the second side of the drive substrate and electrically connected to the compressor drive module.

[0042] In some embodiments, the first power component further includes a thin-film capacitor and an electrolytic capacitor, the thin-film capacitor and the electrolytic capacitor being spaced apart along the second direction and disposed in a region of the drive substrate away from the mounting sidewall.

[0043] In some embodiments, the electronic control device includes two drive boards and two first power connection structures;

[0044] The two drive plates are spaced apart along a second direction perpendicular to the thickness direction;

[0045] The cold plate body is provided with two first communication ports, which are arranged adjacent to each other in the middle of the cold plate body.

[0046] The two first electrical connection structures are respectively provided through the two first communication ports. One end of each of the two first electrical connection structures is electrically connected to the corresponding driving substrate, and the other end is electrically connected to the filter substrate.

[0047] In some embodiments, the two drive boards are arranged symmetrically at the center; and / or,

[0048] The two first electrical connection structures are arranged symmetrically at the center.

[0049] In some embodiments, the main box body includes a first enclosure and a first lid. In the thickness direction of the main box body, the first enclosure protrudes from the cold plate body and is integrally formed with the cold plate body. The first enclosure and the cold plate body enclose a first cavity. The first lid is connected to the first enclosure to seal the opening of the first cavity.

[0050] In some embodiments, the main box body includes a second box cover, and the second box cover and the first box cover are respectively disposed on opposite sides of the cold plate body in the thickness direction of the main box body;

[0051] The second lid is installed on the cold plate body, and the second lid is sealed to the cold plate body and encloses it to form the second cavity; or,

[0052] The main box body also includes a second enclosure plate. In the thickness direction of the main box body, the second enclosure plate protrudes from the cold plate body and is integrally formed with the cold plate body. The cold plate body and the second enclosure plate enclose a second cavity. The second box cover is connected to the second enclosure plate to seal the opening of the second cavity.

[0053] Secondly, this application provides a heating, ventilation, and air conditioning (HVAC) device, including a housing and an electrical control device as described above, wherein the electrical control device is disposed within the housing.

[0054] In some embodiments, the housing is provided with an access port; the electronic control device is located at the access port, wherein the opening of the first cavity is oriented toward the access port.

[0055] Based on the embodiments of this application, the electrical control device and HVAC equipment, by separating the drive board and filter board into cavities, can quickly identify and locate different power modules, and effectively avoid interference between strong and weak current modules. Simultaneously, integrating the chip unit, drive unit, and interface unit onto the same drive substrate facilitates the movement of these structural components of the drive board, thereby simplifying disassembly and maintenance. Furthermore, when the electrical control device is applied to the outdoor unit of the HVAC equipment, the drive board is located on the front side of the cold plate body, with the chip unit, drive unit, and interface unit positioned on opposite sides of the drive substrate. This allows the chip unit and interface unit, which require more frequent maintenance, to be in a more open space, facilitating quick location of maintenance components or installation positions, simplifying troubleshooting procedures, and improving maintenance or installation efficiency. Additionally, based on the different functions of multiple first power components, distributing multiple power components on opposite sides of the drive substrate and utilizing the space on both sides of the drive substrate to install multiple first power components effectively reduces the size of the drive substrate. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] Figure 1 This is a schematic diagram of the main structure of an outdoor unit according to an embodiment of this application;

[0058] Figure 2 This is a front view schematic diagram of the electrical control device exposed in the access port according to an embodiment of this application;

[0059] Figure 3 This is a three-dimensional structural diagram of an electronic control device exposed in an inspection port according to an embodiment of this application;

[0060] Figure 4 This is a three-dimensional structural diagram of an electronic control device according to an embodiment of this application;

[0061] Figure 5 This is a longitudinal sectional view of the main box body according to an embodiment of this application;

[0062] Figure 6 This is a partial exploded structural diagram of an electronic control device according to an embodiment of this application;

[0063] Figure 7 This is an exploded structural diagram of the main housing of one embodiment of this application;

[0064] Figure 8This is a side view of the main box body according to one embodiment of this application;

[0065] Figure 9 This is a three-dimensional structural diagram of a driver board mounted in a heat dissipation cavity according to an embodiment of this application;

[0066] Figure 10 This is a three-dimensional structural diagram of a filter plate mounted on a cold plate body according to an embodiment of this application;

[0067] Figure 11 This is a three-dimensional structural diagram of a chip unit mounted on the second side of a driving substrate according to an embodiment of this application;

[0068] Figure 12 This is a three-dimensional structural diagram of a power element mounted on the first side of a drive substrate according to an embodiment of this application;

[0069] Figure 13 This is a longitudinal cross-sectional view of a single embodiment of the present application, showing that the driving substrate and the filter substrate are respectively spaced apart from the cold plate body.

[0070] Figure 14 An exploded view of the driving substrate and filter substrate relative to the cold plate body in one embodiment of this application;

[0071] Figure 15 This is a schematic cross-sectional view of the first electrical connection structure passing through the cold plate body according to an embodiment of this application.

[0072] Figure 16 This is a three-dimensional structural diagram of the overhead line bridge relative to the first power connection structure according to an embodiment of this application;

[0073] Figure 17 This is a three-dimensional structural schematic diagram of a overhead line bridge according to an embodiment of this application;

[0074] Figure 18 This is a three-dimensional structural diagram of a third enclosure plate having a second wire hole according to an embodiment of this application;

[0075] Figure 19 This is a three-dimensional structural diagram of a first enclosure plate having a first wire hole according to an embodiment of this application;

[0076] Figure 20 This is a three-dimensional structural diagram of a connecting portion having a connecting groove according to an embodiment of this application;

[0077] Figure 21 This is a three-dimensional structural diagram of the main control board corresponding to the optical main control power board in one embodiment of this application;

[0078] Figure 22This is a three-dimensional cross-sectional view of the main box body with the mounting port located between the first edge and the second edge according to one embodiment of this application.

[0079] Figure 23 This is a three-dimensional structural diagram of a power connector according to an embodiment of this application;

[0080] Figure 24 for Figure 16 A magnified view of a portion of point E in the middle;

[0081] Figure 25 This is a three-dimensional structural diagram of a main box body having a first mounting part and a second mounting part according to an embodiment of this application;

[0082] Figure 26 This is a front view schematic diagram of the cold plate body having heat dissipation channels according to an embodiment of this application;

[0083] Figure 27 This is a three-dimensional structural diagram of a heat dissipation enclosure having a first heat dissipation surface and a second heat dissipation surface, according to an embodiment of this application.

[0084] Figure label:

[0085] 1. Electrical control device;

[0086] 10. Main box body; 111. Cold plate body; 1111. Heat dissipation channel; 110a. Liquid inlet section; 110b. Intermediate flow section; 110c. Liquid outlet section; 1101. Flow channel section; 1102. Cold plate substrate; 1103. Boss; 1103a. First boss; 1103b. Second boss; 1104. Guide flange; 112. Heat dissipation enclosure; 112a1. Mounting side wall; 112a2. First heat dissipation surface; 112a2. First heat dissipation surface; 112a. Enclosure body; 112b. Enclosure flange; 112b2. Second mounting... Part; 1121, First enclosure plate; 1121a, First wire passage hole; 1123, Third enclosure plate; 1123a, Second wire passage hole; 1123b, Wire passage opening; 114, Support structure; 1141, First support column; 1142, Second support column; 115, Connecting part; 1151, Connecting groove; 1152, Wire passage groove; 153, Main control seal; 154, First seal; 1113, Mounting port; 1114a, First connecting port; 1114b, Second connecting port; 116, Fan wiring part; 117, Compressor wiring part;

[0087] 120. Box cover; 1201. Main cover; 120a. Cover body; 120b. Cover body flange; 120b2. First mounting part; 1202. Cover plate flange; 102c. Sealing groove; 102d. Sealing mating surface; 121. First box cover; 122. Second box cover; 122a'. Receiving groove; 123. Main control box cover; 124. Central box cover; 1200a. Second seal; 1200b. Third seal; 1200c. Fourth seal;

[0088] 101. Heat dissipation cavity; 1011. First sub-cavity; 1012. Second sub-cavity; 1013. Second cavity; 101a. Variable frequency drive cavity; 101b. Main control cavity;

[0089] 151. Lateral seal; 1511. Sealing body; 1512. Sealing lip;

[0090] 20. Variable frequency drive module; 21. Drive board; 211. Drive substrate; 211a. First support hole; 211b. Second support hole; 211c. First power connection hole; 211d. Second power connection hole; 211e. Third power connection hole; 211f. Edge of first substrate; 211g. Edge of second substrate; 211h. Compressor power connection hole; 212. Chip unit; 2121. Fan drive chip; 2122. Compressor drive chip; 213. Drive unit 2131. Fan drive module; 2132. Compressor drive module; 214. Interface unit; 2141. Fan interface; 2142. Communication interface; 2151. Film capacitor; 2152. Electrolytic capacitor; 216. Module power supply; 22. Filter board; 221. Filter substrate; 222. Common mode inductor; 223. Varistor; 224. Differential mode capacitor; 225. Common mode capacitor; 23. Reactor; 24. Compressor cable; 25. Compressor connector;

[0091] 30. Main control module; 31. Main control board; 311. Main control base plate; 312. Central interface; 313. External communication interface 2142; 32. Main control power board;

[0092] 50. Cable bridge; 51. First bracket; 511. First cable routing channel; 52. Second bracket; 512. Second cable routing channel; 522. Flexible clip;

[0093] 61. Power terminal block; 611. Insulating mounting base; 6111. Insulating body; 6112. Connecting flange; 612. Power conductive post; 613. Terminal block sealing ring;

[0094] 62. Electrical connection structure; 621. First electrical connection structure; 6211. First insulating base; 6212. First electrical connection post; 622. Second electrical connection structure; 6221. Second insulating base; 6222. Second electrical connection post;

[0095] 71. Fan plug;

[0096] X, first direction; Y, second direction; Z, third direction;

[0097] 2. Outdoor unit; 200. Casing; 200a. Inspection port; 300. Air supply fan. Detailed Implementation

[0098] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0099] Heating, ventilation, and air conditioning (HVAC) systems are used to regulate the indoor environment, including functions such as heating, ventilation, and air conditioning. Their main purpose is to provide users with a comfortable and healthy indoor environment by controlling parameters such as temperature, humidity, and airflow. Common HVAC equipment includes air conditioners, radiators, and ventilation systems. These devices are widely used in residential, commercial buildings, and industrial settings.

[0100] Taking HVAC equipment as an example, an air conditioning system can be a multi-split system for buildings, that is, multiple indoor units are connected in parallel with one or more outdoor units to form a refrigerant circuit so that the refrigerant can circulate. Figure 1 , Figure 2 and Figure 3 The diagram shows the outdoor unit 2 of the air conditioning system. The outdoor unit 2 has a casing 200, inside which are housed a compressor, switching valve, outdoor heat exchanger, outdoor expansion valve, and oil separator, etc. These components are connected by refrigerant piping. Additionally, the outdoor unit 2 contains an electronic control device 1 and a blower fan 300.

[0101] The housing 200 is the external structure of the HVAC equipment, protecting internal components, providing a mounting base, and optimizing airflow. The housing 200 can be made of metal or high-strength plastic, possessing good mechanical strength and corrosion resistance. The housing 200 can be rectangular and placed on the roof or ground. The housing 200 isolates internal live components from the outside environment, preventing direct contact with users and reducing the risk of electric shock and other safety accidents. The electrical control device 1 is the core control component of the HVAC equipment. Installed inside the housing 200, it facilitates maintenance and replacement, and also simplifies the installation and layout of the overall HVAC structure. The electrical control device 1 is responsible for the precise control of the HVAC equipment's operation. It contains various control circuits that use electronic components and wiring to control the HVAC equipment's start-up, stop, temperature adjustment, and mode switching.

[0102] The electrical control device 1 and the blower fan 300 are housed within the casing 200. The casing 200 provides protection for the electrical control device 1, preventing dust, moisture, oil, and other external impurities from entering. It also protects the electrical control device 1 from extreme environmental conditions (such as temperature, humidity, and chemical corrosion), ensuring normal operation of the equipment in different environments, extending the service life of the electrical control device 1, preventing accidental contact by users, reducing the risk of electric shock, and improving safety. Furthermore, the casing 200 also acts as a shield, reducing the impact of external electromagnetic interference on the electronic components inside the electrical control device 1, and ensuring the stability and reliability of the control system.

[0103] like Figure 1 , Figure 2 and Figure 3 As shown, in this embodiment, the housing 200 is in the shape of a cuboid, and the electronic control device 1 has a length direction, which is arranged along the height direction (i.e., the vertical direction) of the housing 200. Therefore, the internal structure of the electronic control device 1 has a vertical arrangement. This vertical length arrangement can better meet the overall structural layout requirements of the equipment when the housing 200 has a large height and limited horizontal space, and is also conducive to heat dissipation and maintenance operations.

[0104] It should be noted that the present invention is not limited to the arrangement of the electronic control device 1 along the height direction of the housing 200 in the above embodiments. In other embodiments, the electronic control device 1 may also be arranged along the length direction of the housing 200, or the electronic control device 1 may also be arranged along the width direction of the housing 200. Furthermore, the electronic control device 1 may not be a single form extending along the length direction; it may also vary according to the internal space of the housing 200, for example, it may be formed into an approximate "L" shape, "T" shape, etc.

[0105] In some embodiments, an air duct is formed within the housing 200. This air duct guides air to flow along a predetermined path, preventing disordered airflow within the housing 200 and thus improving heat dissipation efficiency. Specifically, as exemplarily shown in the figure, the air supply fan is located at the top of the housing 200, i.e., at the top of the air duct, and blows air upwards. Furthermore, the electronic control device 1 is located within the air duct, so that the airflow within the air duct can carry away the heat generated by the electronic control device 1, ensuring the heat dissipation effect of the electronic control device 1.

[0106] Please continue reading. Figure 1 , Figure 2 and Figure 3In some embodiments, the housing 200 is provided with an access port 200a. In one configuration, the housing 200 includes a housing body and an access door rotatably connected to the housing body, allowing maintenance personnel to expose the access port 200a by opening the access door. In another configuration, the housing 200 includes a housing body and a front panel connected to the housing body. The front panel is fixedly connected to the housing body by screws, allowing maintenance personnel to separate the front panel from the housing body by removing the screws to expose the access port 200a. This application does not impose specific limitations on the manner in which the access port 200a is exposed.

[0107] like Figure 3 The figure shown is a three-dimensional structural diagram of an embodiment of the present application, in which the electronic control device 1 is located at the access port 200a of the outdoor unit 2. The electronic control device 1 is located at the access port 200a, and maintenance personnel can quickly access the electronic control device 1 without having to enter the casing 200 to operate the electronic control device 1, thereby greatly improving the efficiency of maintenance and repair.

[0108] The electrical control device 1 includes a main housing 11 and at least one power module. The power module is the main body with control circuitry, and at least one power module realizes the control function of the HVAC equipment through various electronic components and circuits, and is used to control the start-up, stop, temperature adjustment, mode switching and other operations of the HVAC equipment.

[0109] like Figure 4 and Figure 5 As shown, the main housing 11 constructs at least one heat dissipation cavity 101 for housing the power module, providing protection for the power components. Figure 6 As shown in the embodiment of this application, the power module includes a frequency converter drive module 20, a main control module 30, and a central module. At least one of the frequency converter drive module 20, the main control module 30, and the central module is disposed in the heat dissipation cavity 101 of the main housing 11.

[0110] The main control module 30 is responsible for the operation management and control of the entire HVAC equipment. It typically integrates multiple functional modules such as microprocessor, memory, signal processing and communication interface. By receiving data, executing algorithm calculations and outputting instructions, it achieves precise control of key components such as compressor, fan, and electronic expansion valve, including functions such as temperature regulation, mode switching and fault diagnosis.

[0111] The variable frequency drive module 20 is mainly used to eliminate high-frequency interference and noise in the power grid, ensure that electrical equipment can work normally without being affected by power fluctuations, and convert DC power into AC power with adjustable frequency, thereby adjusting the operating frequency of the compressor motor to achieve precise control of cooling or heating capacity, achieving the dual goals of energy saving and comfort.

[0112] The central module is mainly responsible for the acquisition, processing and transmission of data from electronic devices such as sensors and electronic valve bodies, and transmits the data to the main control module for further processing.

[0113] In some embodiments, the frequency converter drive module 20, the main control module 30, and the central module are all located in the main housing 11. In this case, the main housing 11 can be configured to include only one independent heat dissipation cavity 101, and the frequency converter drive module 20, the main control module 30, and the central module are located in the same heat dissipation cavity 101.

[0114] In some embodiments, the frequency converter drive module 20, the main control module 30, and the central module are all located in the main housing 11. In this case, the main housing 11 may include multiple independent heat dissipation cavities 101. For example, the main housing 11 may include two independent heat dissipation cavities 101, with two of the frequency converter drive module 20, the main control module 30, and the central module located in one heat dissipation cavity 101, and the remaining one of the frequency converter drive module 20, the main control module 30, and the central module located in the other heat dissipation cavity 101; or, the main housing 11 may include two independent heat dissipation cavities 101, with a portion of the frequency converter drive module 20 and the main control module 30 located together in one heat dissipation cavity 101, and the remaining portion of the frequency converter drive module 20 and the central module located together in the other heat dissipation cavity 101; or, the main housing 11 may include three independent heat dissipation cavities 101, with the frequency converter drive module 20, the main control module 30, and the central module each located in one heat dissipation cavity 101.

[0115] In some embodiments, the frequency converter drive module 20 and the main control module 30 are disposed within the heat dissipation cavity 101 of the main housing 11, and the electronic control device 1 also includes a central housing 12, in which the central module is disposed. Please refer to [further details omitted]. Figure 3 The central housing 12 and the main housing 11 are spaced apart, allowing the central housing 12 to move relative to the main housing 11. In this configuration, the main housing 11 can have only one heat dissipation cavity 101, with the frequency converter drive module 20 and the main control module 30 housed within the same heat dissipation cavity 101. Alternatively, the main housing 11 can have multiple heat dissipation cavities 101, with the frequency converter drive module 20 and the main control module 30 housed separately within these cavities. Multiple structural components of the main control module 30 can be housed entirely within the same heat dissipation cavity 101 or distributed across multiple cavities. Similarly, multiple structural components of the frequency converter drive module 20 can be housed entirely within the same heat dissipation cavity 101 or distributed across multiple cavities. Furthermore, it is permissible for the structural components of the frequency converter drive module 20 and the main control module 30 to be housed within the same heat dissipation cavity 101.

[0116] It should be noted that in the embodiments of this application, the term "structural component" as used throughout the text has no special function or specific meaning, and is only used for convenience of description. For example, the power components, circuit boards, etc. mentioned below are all collectively referred to as "structural components". The "special function" mentioned includes, but is not limited to, conductivity, fastening, heat conduction, electromagnetic shielding, etc.

[0117] As mentioned above, a switching valve is installed inside the casing 200. A switching valve is a valve used to control the flow direction of fluids (such as refrigerant, air, etc.). It switches the flow direction of the fluid by changing the position of the valve core, thereby achieving the switching of different operating modes. Specifically, the switching valve can be a four-way valve. The four-way valve achieves the switching between cooling and heating modes by switching the flow direction of the refrigerant. For example... Figure 3 As shown, when the central housing 60 and the main housing 11 are spaced apart, the central housing 60 can be connected to the switching valve via a bracket. It is understood that various sensors, electronic valves, etc., are installed on the refrigerant piping connected to the switching valve. This application installs the central housing 60 near the switching valve, allowing it to be closer to the sensors and electronic valves in the outdoor unit 2, resulting in shorter wiring and simplifying the overall wiring of the unit.

[0118] In this embodiment, the multiple power components of the electronic control device 1 are divided into three main power modules: the main control module 30, the drive frequency converter module 20, and the central module. These modules are housed in multiple independent cavities. This facilitates the configuration of the housing structure according to the installation requirements of the three power modules, enabling rapid identification of each power module, facilitating internal and external wiring, and allowing for the separation of strong and weak current circuits within the electronic control device. This prevents the three power modules from interfering with each other by sharing the same space. It also allows for the placement of structures requiring maintenance in a relatively open space, facilitating repairs. The central housing is separate from the main housing 11, allowing for easy movement of the central housing relative to the main housing 11. This enables the central module to be installed in a suitable position, placing it close to sensors and electronic valves, shortening the length of the connecting wires between the central module and these components, resulting in shorter wiring and simplified overall wiring.

[0119] like Figure 3As shown, in some examples, the central housing 60 is located behind the main housing 11, away from the access port 200a. Placing the central housing 60 in a relatively concealed position prevents moisture, dust, and other debris from entering the central cavity. This is especially important when the central module has multiple wires connected, as it is difficult to seal the points where these wires enter and exit the central cavity. By placing the central housing 60 away from the access port 200a, it is placed in a more concealed environment, preventing moisture, dust, and other debris from entering the central cavity through these points. The access port 200a can be designed to be relatively large, allowing both the main housing 11 and the central housing 60 to be exposed within the access port 200a for wiring the central module.

[0120] Each power module includes at least one power element. In this embodiment, the power element is an electronic device that generates heat during operation. It is understood that, in addition to the power element, each power module may also include other structural components that do not generate heat, such as circuit boards and fasteners. Therefore, when the main housing 11 contains multiple independent heat dissipation cavities 101, all power elements of the same power module can be installed in the same heat dissipation cavity 101. Alternatively, the power elements of the same power module are not limited to being located in the same heat dissipation cavity 101. For example, when the same power module includes multiple power elements, the multiple power elements of the same power module are located in multiple heat dissipation cavities 101.

[0121] In this embodiment, the three power modules—the frequency converter drive module 20, the main control module 30, and the central module—can all be installed with multiple power components of the same power module located in the same heat dissipation cavity 101 or separately located in multiple heat dissipation cavities 101. Regardless of the allocation of power components in the heat dissipation cavities 101 for each power module, preferably, the three power modules are located in separate cavities. This facilitates the configuration of the housing structure according to the installation requirements of the three power modules and prevents them from sharing the same space and interfering with each other. For example, the frequency converter drive module 20 has high requirements for the sealing level and heat dissipation of its space, the main control module 30 requires a more open space for user wiring, and the central module requires its space to be adjacent to the switching valve for wiring. If any two of the three power modules are integrated and installed in the same space, mutual interference will occur.

[0122] The main housing 11 of the electronic control device 1 contains various power components, requiring a sealed design to prevent moisture contamination and ensure their normal operation. However, these power components generate significant heat during operation, and the confined space hinders heat dissipation, affecting operational stability. The inventors also discovered that for power components with high sealing requirements, the sealing design of their cavities is even more demanding. Furthermore, the housing of the electronic control device 1 needs to have removable sections for maintenance of some power components, further limiting the design of its heat dissipation structure. Therefore, as... Figure 5 and Figure 6 As shown, the main housing 11 includes a bottom plate, which is a cold plate body 111. The cold plate body 111 has a heat dissipation channel 1111 inside, and a heat exchange medium is introduced into the heat dissipation channel 1111. In the thickness direction H of the cold plate body 111, a heat dissipation cavity 101 is located outside the cold plate body 111. Thus, when the power module is located in the heat dissipation cavity 101, the cold plate body 111 can directly receive the heat generated by the power element, or the cold plate body 111 can cool the gas in the heat dissipation cavity 101, thereby dissipating heat from the power element. Based on this, it is convenient to set up the structural components of the main housing 11 and the power module to better take into account the heat dissipation and disassembly requirements of the power module.

[0123] The cold plate body 111 has a first side and a second side arranged opposite to each other along its thickness direction. The power element can be disposed on the first side of the cold plate body 111 or on the second side of the cold plate body 111.

[0124] In this embodiment of the application, at least one heat dissipation cavity 101 includes a primary cavity. Specifically, the main housing 11 also includes at least one heat dissipation enclosure 112. The primary cavity is formed by the cold plate body 111 and the heat dissipation enclosure 112, and at least some power components are disposed in the primary cavity.

[0125] In this embodiment, a box-shaped primary cavity is formed by the cold plate body 111 and the heat dissipation enclosure 112. Both the cold plate body 111 and the heat dissipation enclosure 112 can be used to generate heat, not limited to traditional unidirectional heat dissipation. The main box body 11 is constructed as a box-shaped heat sink, which can receive the heat dissipated by the power components from multiple directions such as the bottom and the circumference, forming multi-directional radiative heat dissipation. The cold plate body 111 and the heat dissipation enclosure 112 work together to maximize the space and direction of radiative heat dissipation. The heat generated by the power components can be quickly diffused to either the cold plate body 111 or the heat dissipation enclosure 112, realizing rapid air cooling in the primary cavity and uniformly reducing the temperature in all parts of the primary cavity. Meanwhile, both the cold plate body 111 and the heat dissipation enclosure 112 are located on the outer layer. The heat dissipation enclosure 111 surrounds the power component. The heat dissipation enclosure is set directly in the thickness direction H of the cold plate body 111 using the assembly space of the power component for heat dissipation. The heat dissipation enclosure 111 and the cold plate body 112 together form a box to accommodate the power component. There is no need to occupy additional installation space, which greatly simplifies the structure of the electronic control device 1 and is more conducive to the miniaturization design of the electronic control device 1.

[0126] When the main box 11 has multiple heat dissipation cavities 101, the arrangement of the multiple heat dissipation cavities 101 can be selected as follows based on the position of the multiple heat dissipation cavities 101 relative to the first side and the second side of the cold plate body 111.

[0127] In some embodiments, the plurality of heat dissipation cavities 101 may be provided only on the first or second side of the cold plate body 111, and the plurality of power components may be disposed in the plurality of heat dissipation cavities 101 located on the same side of the cold plate body 111. Optionally, the plurality of heat dissipation cavities 101 may include a primary cavity, that is, the main housing 11 may include at least one heat dissipation enclosure 112 provided on one side of the cold plate body 111. By combining the heat dissipation enclosure 112, the heat-receiving area is increased in order to meet the heat dissipation requirements. In this case, the other side of the cold plate body 111 may be provided with a plurality of spaced heat dissipation fins to further increase the heat dissipation area and improve the heat dissipation efficiency.

[0128] In some embodiments, multiple heat dissipation cavities 101 may be disposed on opposite sides of the cold plate body 111. That is, a portion of the heat dissipation cavities 101 may be disposed on the first side of the cold plate body 111, and another portion of the heat dissipation cavities 101 may be disposed on the second side of the cold plate body 111. Correspondingly, a portion of the power components may be disposed in the heat dissipation cavities 101 on the first side of the cold plate body 111, and another portion of the power components may be disposed in the heat dissipation cavities 101 on the second side of the cold plate body 111. In other words, multiple power components may be disposed on opposite sides of the cold plate body 111, so that the space on both sides of the cold plate body 111 can be utilized. For example, power components with high heat generation may be disposed in the heat dissipation cavity 101 on one side of the cold plate body 111, and power components with low heat generation may be disposed in the heat dissipation cavity 101 on the other side of the cold plate body 111, to prevent thermal interference between power components with different heat generation in the same space. Alternatively, based on different maintenance needs, power components that need maintenance may be placed in the heat dissipation cavity 101 facing the maintenance port 200a for easy maintenance. Optionally, at least one heat dissipation cavity 101 is a primary cavity, that is, the main housing 11 includes at least one heat dissipation enclosure 112. By distributing multiple power components on opposite sides of the cold plate body 111 and combining the cold plate body 111 and the heat dissipation enclosure 112, the main housing 11 has a more sufficient heat transfer area and efficient heat dissipation. It is no longer limited by the obstruction that the cold plate body 111 is only used on one side for setting power components, which helps to reduce the lateral dimension of the cold plate body 111 and thus reduce the overall lateral dimension of the electronic control device 1.

[0129] When the main housing 11 includes at least one heat dissipation enclosure 112, the arrangement of the heat dissipation cavity 101 can be selected as follows based on the number of heat dissipation enclosures 112.

[0130] In some embodiments, the main housing 11 includes a heat dissipation enclosure 112, and the main housing 11 has only one heat dissipation cavity 101. That is, a heat dissipation enclosure 112 and the cold plate body 111 enclose and form only one primary cavity, and all power modules are located in the same primary cavity.

[0131] In some embodiments, the main housing 11 includes a heat dissipation enclosure 112 and has multiple heat dissipation cavities 101. Specifically, a heat dissipation enclosure 112 and a cold plate body 111 enclose a primary cavity. The main housing 11 also has at least one other type of heat dissipation cavity 101 (e.g., a secondary cavity described later) enclosed by other structures of the main housing 11 (structures other than the heat dissipation enclosure 112). Each heat dissipation cavity 101 contains at least one power element. In this case, the primary cavity and all other types of heat dissipation cavities 101 can be located on the same side of the cold plate body 111; or, the primary cavity and some of the other types of heat dissipation cavities 101 can be located on one side of the cold plate body 111, and the remaining other types of heat dissipation cavities 101 can be located on the other side of the cold plate body 111; or, the primary cavity can be located on one side of the cold plate body 111, and all other types of heat dissipation cavities 101 can be located on the other side of the cold plate body 111.

[0132] In some embodiments, the main housing 11 includes at least two heat dissipation panels 112 to construct various types of primary cavities to meet the diverse installation requirements of multiple power components.

[0133] Optionally, when the main box 11 includes at least two heat dissipation enclosures 112, all heat dissipation enclosures 112 are disposed on the first or second side of the cold plate body 111 in the thickness direction H, and adjacent heat dissipation enclosures 112 on the same side are spaced apart, and each heat dissipation enclosure 112 and the cold plate body 111 enclose a single primary cavity.

[0134] At this time, all power components and all heat dissipation plates 112 can be located on the same side of the cold plate body 111, and the main box 11 has only one type of heat dissipation cavity 101 located on the same side of the cold plate body 111, with all power components distributed in multiple primary cavities.

[0135] Alternatively, all power components and all heat dissipation enclosures 112 can be located on the same side of the cold plate body 111, and in the heat dissipation cavity 101 located on the same side of the cold plate body 111. This includes not only the primary cavity but also other types of heat dissipation cavities 101, with some power components located in the primary cavity and the remaining power components located in other types of heat dissipation cavities 101 besides the primary cavity.

[0136] Alternatively, some power components and all heat dissipation plates 112 can be located on one side of the cold plate body 111, while the remaining power components are located on the other side of the cold plate body 111 and housed in heat dissipation cavities 101 of other types besides the primary cavity. In the heat dissipation cavity 101 located on the same side of the cold plate body 111 as the heat dissipation plates 112, only the primary cavity is included, and all power components on the same side of the cold plate body 111 as the heat dissipation plates 112 are housed within the primary cavity.

[0137] Alternatively, a portion of the power components and all of the heat dissipation enclosures 112 can be located on one side of the cold plate body 111, while the remaining power components are located on the other side of the cold plate body 111 and housed in heat dissipation cavities 101 of other types besides the primary cavity. The heat dissipation cavities 101 located on the same side of the cold plate body 111 as the heat dissipation enclosures 112 include not only the primary cavity but also other types of heat dissipation cavities 101. A portion of the power components on the same side of the cold plate body 111 as the heat dissipation enclosures 112 are housed in the primary cavity, while the remaining power components are housed in other types of heat dissipation cavities 101 besides the primary cavity.

[0138] Optionally, when the main body 11 includes at least two heat dissipation enclosures 112, in the thickness direction H of the cold plate body 111, a portion of the heat dissipation enclosures 112 are disposed on the first side of the cold plate body 111, and another portion of the heat dissipation enclosures 112 are disposed on the second side of the cold plate body 111. When there are multiple heat dissipation enclosures 112 located on the same side of the cold plate body 111, two adjacent heat dissipation enclosures 112 located on the same side of the cold plate body 111 are spaced apart, and each heat dissipation enclosure 112 and the cold plate body 111 enclose an independent primary cavity.

[0139] At this time, the main housing 11 can be configured to have only one type of heat dissipation cavity 101, namely the primary cavity, and multiple power components can be distributed in multiple primary cavities.

[0140] Alternatively, the heat dissipation cavity 101 located on at least one side of the cold plate body 111 may include not only a primary cavity but also other types of heat dissipation cavities 101. For example, one side of the cold plate body 111 may have a primary cavity and other types of heat dissipation cavities 101, while the other side of the cold plate body 111 may only have a primary cavity. As another example, both sides of the cold plate body 111 may have primary cavities and other types of heat dissipation cavities 101, allowing multiple power components to be housed in multiple heat dissipation cavities 101 located on opposite sides of the cold plate body 111. Within the heat dissipation cavities 101 located on the same side of the cold plate body 111, the number of primary cavities may be one or more, and the number of other types of heat dissipation cavities 101 may also be one or more.

[0141] In some embodiments, when the main housing 11 includes at least two heat dissipation enclosures 112, at least two heat dissipation enclosures 112 are respectively disposed on both sides of the cold plate body 111 in the thickness direction H of the cold plate body 111, and each primary cavity may be formed by one or more heat dissipation enclosures 112.

[0142] Optionally, each primary cavity is formed by a heat dissipation enclosure 112 and a cold plate body 111, and the main housing 11 has only this type of primary cavity. For example, when the main housing 11 includes two heat dissipation enclosures 112, the main housing 11 has two primary cavities; when the main housing 11 includes three heat dissipation enclosures 112, the main housing 11 has three primary cavities. The cold plate body 111 has a connecting port connecting at least one of its opposite sides, and each connecting port is provided with an electrical connection structure 62. The electrical connection structure 62 passes through the connecting port, and its two ends are electrically connected to electronic devices located on opposite sides of the cold plate body 111.

[0143] Optionally, in the thickness direction H of the cold plate body 111, the cold plate body 111 has a clearance opening (not shown in the figure) connecting its opposite sides. Each primary cavity is formed by multiple heat dissipation plates 112 surrounding the clearance opening and located on opposite sides of the cold plate body 111 together with the cold plate body 111, and the main box 11 has only this type of primary cavity. The size of the clearance opening is larger than the size of the connecting opening, so that the spaces on both sides of the cold plate body 111 are connected, thereby constructing a larger primary cavity. The connecting opening can be provided with power components, conductive components and other structural components. That is, the clearance opening is no longer similar to the connecting opening used to set up the power connection structure 62. Instead, the clearance opening constructs a relatively large space to provide installation space for one or more structural components.

[0144] Optionally, the main box 11 may have multiple types of primary cavities. That is, the main box 11 may have an independent primary cavity formed by only one heat dissipation plate 112 and the cold plate body 111, or the main box 11 may also have a primary cavity formed by multiple heat dissipation plates 112 and the cold plate body 111. For example, if a cold plate body 111 has multiple heat dissipation enclosures 112 on one side and a heat dissipation enclosure 112 on the other side, then two of the heat dissipation enclosures 112 located on opposite sides of the cold plate body 111 together with the cold plate body 111 form a primary cavity, and the remaining heat dissipation enclosures 112 independently form primary cavities with the cold plate body 111; or, if a cold plate body 111 has multiple heat dissipation enclosures 112 on both sides, some of the heat dissipation enclosures 112 located on opposite sides of the cold plate body 111 form the same primary cavity with the cold plate body 111, and the remaining heat dissipation enclosures 112 located on opposite sides of the cold plate body 111 independently form independent primary cavities with the cold plate body 111.

[0145] In this embodiment, at least one heat dissipation enclosure 112 protrudes from the periphery of the cold plate body 111 to surround the power component. The heat dissipation enclosure 112 and the cold plate body 111 are integrally formed, eliminating the need for separate sealing at the connection point. This reduces the thermal resistance between the cold plate body 111 and the heat dissipation enclosure 112, resulting in high heat transfer efficiency and improved heat dissipation efficiency. Furthermore, the protrusion of the heat dissipation enclosure 112 also prevents moisture accumulation at the connection point, reducing the probability of moisture entering the primary cavity.

[0146] The above describes, by way of example, the formation of the heat dissipation cavity 101 in the main housing 11. The formation of the heat dissipation cavity 101 in this application is not limited to the above embodiments, and the formation methods of the heat dissipation cavity 101 in the above embodiments can be combined to obtain the actual required heat dissipation cavity 101. The frequency converter drive module 20, the main control module 30, and the central module can be disposed in the heat dissipation cavity 101 of the above combined embodiments, and the specific arrangement can be selected according to actual needs.

[0147] In the embodiment where the heat dissipation cavity 101 is located on the opposite side of the cold plate body 111, the electrical connection structure 62 located at the communication port of the cold plate body 111 can each include an insulating base and an electrical connection post. The electrical connection post is installed on the insulating base, which passes through the communication port and is installed on the cold plate body 111. Both ends of the insulating base can be used to support structural components located in the corresponding cavities. Simultaneously, the electrical connection post also passes through the communication port, and both ends of the electrical connection post are electrically connected to electronic devices located in the corresponding cavities. Thus, the electrical connection structure 62 electrically connects the electronic devices located on the opposite side of the cold plate body 111. Within the area enclosed by the same heat dissipation plate 112, the cold plate body 111 can have multiple communication ports, and each communication port can have an electrical connection structure 62. The same electrical connection structure 62 can include one electrical connection post, or it can include multiple spaced electrical connection posts. This application embodiment does not limit the arrangement of the electrical connection structure 62; it can be selected according to actual needs.

[0148] like Figure 4 , 5As shown, in the thickness direction H of the cold plate body 111, the cold plate body 111 includes a first side and a second side facing away from each other. Multiple power components are respectively disposed on the first side and the second side of the cold plate body 111. When the electrical control device 1 is used for the outdoor unit 2 of the HVAC equipment, the first side of the cold plate body 111 is positioned facing the maintenance port 200a of the outdoor unit 2. Power components that require more frequent maintenance and replacement can be disposed on the first side of the cold plate body 111 for easier operation. In this embodiment, the primary cavity formed by the heat dissipation enclosure 112 and the cold plate body 111 is an open cavity with an opening, allowing the power components to enter and exit the primary cavity through the opening. Correspondingly, the main housing 11 also includes at least one cover 120. The cover 120 can be provided at the opening of the primary cavity to seal the opening of the primary cavity, thereby providing protection for the power components located in the primary cavity. At this time, the cover 120 and the heat dissipation plate 112 are sealed in a position away from the cold plate body 111, which facilitates the sealing design and obtains a better sealing effect. It will not hinder the heat transfer between the cold plate body 111 and the heat dissipation plate 112. The cover 120 is installed at the end of the heat dissipation plate 112 away from the cold plate body 111. The cover 120 is in a relatively open position, which facilitates the installation and removal of the cover 120, thereby achieving the requirements of heat dissipation, sealing and easy disassembly and maintenance.

[0149] In some embodiments, the heat dissipation cavity 101 includes a first sub-cavity 1011, which is disposed on the first side of the cold plate body 111. The first sub-cavity 1011 is a primary cavity. Specifically, the heat dissipation enclosure 112 includes a first enclosure 1121, which protrudes from the first side of the cold plate body 111. The first sub-cavity 1011 is formed by the first side of the cold plate body 111 and the first enclosure 1121. The first enclosure 1121 is integrally formed with the cold plate body 111 to efficiently dissipate heat from the power components within the first sub-cavity 1011. The cover 120 of the main housing 11 includes a first cover 121. In the thickness direction H of the cold plate body 111, the first cover 121 is disposed opposite to the first side of the cold plate body 111 and connected to the first enclosure 1121 to seal the first sub-cavity 1011.

[0150] In some embodiments, the main housing 11 includes a plurality of heat dissipation cavities 101, and the plurality of heat dissipation cavities 101 include a second sub-cavity 1012. The second sub-cavity 1012 is disposed on the second side of the cold plate body 111. Among the plurality of heat dissipation cavities 101, a portion of the heat dissipation cavities 101 are primary cavities, and another portion of the heat dissipation cavities 101 are secondary cavities. The secondary cavities are different from the primary cavities. The secondary cavities are closed cavities formed by the housing cover 120 and the cold plate body 111. The second sub-cavity 1012 can be either a primary cavity or a secondary cavity.

[0151] When the second sub-cavity 1012 is a primary cavity, specifically, the heat dissipation enclosure 112 includes a second enclosure (not shown in the figure), which protrudes from the second side of the cold plate body 111. The second sub-cavity 1012 is formed by the second side of the cold plate body 111 and the second enclosure. The second enclosure is integrally formed with the cold plate body 111 to efficiently dissipate heat from the power components inside the second sub-cavity 1012. The cover 120 of the main housing 11 includes a second cover 122. In the thickness direction H of the cold plate body 111, the second cover 122 is disposed opposite to the second side of the cold plate body 111 and connected to the second enclosure to seal the second sub-cavity 1012.

[0152] When the second sub-cavity 1012 is a secondary cavity, optionally, the lid 120 of the main box 11 includes a second lid 122. The second lid 122 is disposed on the second side of the cold plate body 111, and the second lid 122 and the second side of the cold plate body 111 enclose the second sub-cavity 1012. The structure of the second lid 122 here is different from that of the second lid 122 described above. Figure 7 and Figure 8 The second cover 122 here has a receiving groove 122a', and a guide flange 1104 protruding from the cold plate body 111 is formed on the second side of the cold plate body 111. The guide flange 1104 is disposed in the receiving groove 122a' and is sealed to the sub-cover.

[0153] In some embodiments, the main housing 11 includes a plurality of heat dissipation cavities 101, and each heat dissipation cavity 101 includes a second cavity 1013. The second cavity 1013 is disposed on the first side of the cold plate body 111, wherein the second cavity 1013 is a primary cavity. Specifically, the heat dissipation enclosure 112 includes a third enclosure 1123, which protrudes from the first side of the cold plate body 111. The second cavity 1013 is formed by the first side of the cold plate body 111 and the third enclosure 1123. The housing cover 120 includes a main control housing cover 123. In the thickness direction H of the cold plate body 111, the main control housing cover 123 is disposed opposite to the first side of the cold plate body 111, and the main control housing cover 123 is connected to the third enclosure 1123 to close the second cavity 1013.

[0154] In some embodiments, the first sub-cavity 1011 and the second sub-cavity 1012 together form a frequency converter drive cavity 101a, wherein the first sub-cavity 1011 is used to accommodate at least a portion of the structural components of the frequency converter drive module 20, and the second sub-cavity 1012 is used to accommodate at least a portion of the structural components of the frequency converter drive module 20. The second cavity 1013 forms a main control cavity 101b, and the second cavity 1013 is used to accommodate at least a portion of the structural components of the main control module 30.

[0155] In some other embodiments, when the central module is also integrated and installed within the main housing 11, the main housing 11 includes multiple heat dissipation cavities 101, each including a central cavity for accommodating the central module. The central cavity may also be a primary cavity. Specifically, the heat dissipation enclosure 112 includes a central enclosure (not shown in the figure), which protrudes from the first or second side of the cold plate body 111. The central cavity is formed by the cold plate body 111 and the central enclosure. The housing cover 120 includes a central housing cover (not shown in the figure). In the thickness direction H of the cold plate body 111, the central housing cover is positioned opposite to the cold plate body 111 and is connected to the central enclosure to seal the central cavity.

[0156] like Figure 9 , Figure 10 and Figure 11 As shown, the variable frequency drive module 20 includes a filter board 22 and at least one drive board 21. The drive board 21 is located on the first side of the cold plate body 111 and disposed in the first sub-cavity 1011. The filter board 22 is located on the second side of the cold plate body 111 and disposed in the second sub-cavity 1012, and is combined with... Figure 7 The cold plate body 111 has multiple connecting ports including a first connecting port 1114a, and multiple electrical connection structures 62 including a first electrical connection structure 621. Each first connecting port 1114a is provided with a first electrical connection structure 621, and the first electrical connection structure 621 is electrically connected to the filter board 22 and the drive board 21 respectively.

[0157] In some embodiments, the driver board 21 includes a driver substrate 211 and at least one first power component mounted on the driver substrate 211. The first power component includes a chip unit 212, a driver unit 213 and an interface unit 214.

[0158] Optionally, the driving substrate 211 has a first side facing the opening of the first sub-cavity 1011 and a second side away from the opening of the first sub-cavity 1011. The chip unit 212 and the interface unit 214 are mounted on the first side of the driving substrate 211, and the driving unit 213 is mounted on the second side of the driving substrate 211. By separating the drive board 21 and the filter board 21 into separate cavities, different power modules can be quickly identified and located, effectively avoiding interference between strong and weak current modules. Simultaneously, integrating the chip unit 212, drive unit 213, and interface unit 214 onto the same drive substrate facilitates the movement of these components of the drive board 21, thus simplifying disassembly and maintenance. Furthermore, when the electrical control device 1 is applied to the outdoor unit 2 of the HVAC system, the drive board 21 is positioned in front of the cold plate body, with the chip unit 212, drive unit 213, and interface unit 214 located on opposite sides of the drive substrate 211. This allows the chip unit 212 and interface unit 214, which require more frequent maintenance, to be in a more open space, facilitating quick location of maintenance personnel for repair or installation, simplifying troubleshooting procedures, and improving maintenance or installation efficiency. In addition, based on the different functions of the multiple first power components, the multiple power components are disposed on opposite sides of the drive substrate 211. By utilizing the space on both sides of the drive substrate 211 to install the multiple first power components, the size of the drive substrate 211 can be effectively reduced.

[0159] Optionally, the chip unit 212 includes a fan drive chip 2121 and a compressor drive chip 2122. The fan drive chip 2121 is mainly used to be electrically connected to the fan to control the operating state of the fan, and the compressor drive chip 2122 is mainly used to be electrically connected to the compressor to control the operating state of the compressor.

[0160] Optionally, the drive unit 213 includes a fan drive module 2131 and a compressor drive module 2132. The fan drive module 2131 and the compressor drive module 2132 each have frequency conversion functions. The fan drive module 2131 is electrically connected to the fan drive chip 2121 to assist the fan drive chip 2121 in stable operation. The compressor drive module 2132 is electrically connected to the compressor drive chip 2122 to assist the compressor drive chip 2122 in stable operation.

[0161] Optionally, the interface unit 214 includes a fan interface 2141 and a communication interface 2142. The communication interface 2142 is mainly used to electrically connect with the main control module 30 to receive fan control signals and compressor control signals transmitted by the main control module 30. The communication interface 2142 is electrically connected with the fan drive chip 2121 to transmit the fan control signals to the fan drive chip 2121. The fan drive chip 2121 controls the fan drive module 2131 according to the received fan control signals. The fan interface 2141 is electrically connected with the fan plug 71, so the fan drive module 2131 can provide drive electrical signals corresponding to the fan control signals to the fan, thereby driving the fan to run at the corresponding speed. The communication interface 2142 is also electrically connected with the compressor drive chip 2122 to transmit the compressor control signals to the compressor drive chip 2122. The compressor drive chip 2122 controls the compressor drive module 2132 according to the received compressor control signals, thereby realizing the regulation of the compressor's operating status according to the compressor control signals.

[0162] In some embodiments, the first power components of the drive board 21 further include a thin-film capacitor 2151 and an electrolytic capacitor 2152, which are disposed on the side of the drive substrate 211 facing the opening of the first sub-cavity 1011. The thin-film capacitor 2151 helps to store and release charge and provides support for filtering, signal processing, etc., ensuring the stable and efficient operation of the entire system. The electrolytic capacitor 2152 has an energy storage function and is used to stably supply power to the drive unit 213 and the chip unit 212, promoting the effective transmission and processing of signals between the frequency conversion drive module 20 and the main control module 30.

[0163] In some embodiments, the first power component of the drive board 21 further includes a module power supply 216. The module power supply 216 is located on the side of the drive substrate 211 facing the opening of the first sub-cavity 1011. The drive unit 213 on the drive board requires a stable power supply to operate. The module power supply 216 is used to provide appropriate voltage and current to the drive unit 213 so that the drive unit 213 can operate normally and process signals from the main control module, thereby generating accurate drive signals to control the operation of equipment such as compressors and fans.

[0164] In some embodiments, the filter board 22 includes a filter substrate 221 and at least one second power component mounted on the drive substrate 211. The second power component of the filter board 22 is a key component for providing stable and clean power to each power module. It is mainly used to eliminate high-frequency interference and noise in the line and ensure that electrical equipment can work normally without being affected by power fluctuations. It is usually composed of passive components such as capacitors, inductors, and resistors. These components work together to reduce electromagnetic interference (EMI), improve power quality, and protect sensitive electronic equipment from damage.

[0165] Optionally, such as Figure 13 As shown, the filter substrate 221 is parallel to the drive substrate 211. In the first direction X, the drive substrate 211 and the filter substrate 221 are spaced apart. Since the second power component generates a large amount of heat during operation, has a high heat dissipation requirement, and is relatively large in size, at least a portion of the second power component of the filter plate 22 is located on the side of the filter substrate 221 facing away from the opening of the second sub-cavity 1012, so as to dissipate heat from the second power component in a timely and efficient manner. When the electronic control device 1 is applied to the outdoor unit 2 of the HVAC equipment, the filter plate 22 is located behind the cold plate body 111, which also facilitates placing the filter plate 22 near the air supply fan 300 of the outdoor unit 2, which is beneficial for further heat dissipation of the second power component of the filter plate 22.

[0166] Optionally, the second power component includes a common-mode inductor 222, which is used to filter out common electromagnetic interference modes in the circuit and suppress itself from emitting electromagnetic interference, so as to prevent it from affecting the normal operation of other electronic devices in the same environment.

[0167] In some embodiments, the filter substrate 221 is a circuit board mounted on one side, and all the second power components of the filter board 22 are located on the side of the filter substrate 221 facing away from the opening of the second sub-cavity 1012, so as to make full use of the space of the filter board 22 facing the cold plate body 111 and reduce the space occupied by the filter board 22 in the thickness direction of the cold plate body 111.

[0168] Optionally, the second power component also includes at least one of a varistor, a differential-mode capacitor, and a common-mode capacitor, which are also disposed on the side of the filter substrate 221 facing away from the opening of the second sub-cavity 1012. These components work together to reduce electromagnetic interference (EMI), improve power quality, and protect sensitive electronic devices from damage.

[0169] In some embodiments, the frequency converter drive module 20 further includes a third power component, which is disposed in the second sub-cavity 1012 and attached to the cold plate body 111, and the third power component is spaced apart from the filter plate 22 so as to flexibly select the installation position of the third power component.

[0170] Optionally, the third power component includes at least one reactance 23, which is used to suppress high-order harmonics in the circuit and protect electronic devices from damage. In this case, as... Figure 7 As shown, the cold plate body 111 has multiple communication ports including second communication ports 1114b, and multiple electrical connection structures 62 include second electrical connection structures 622. Each second communication port 1114b is provided with a second electrical connection structure 622. The second electrical connection structure 622 is electrically connected to the drive substrate 211 and the reactor 23 respectively.

[0171] It is understandable that different power components generate different amounts of heat, and therefore require different heat dissipation. In this application, different heat dissipation designs are implemented for power components with different heat dissipation requirements. Specifically, multiple power components are distinguished according to their power, and may include multiple primary power components and multiple secondary power components. The power of the primary power component is greater than that of the secondary power component. The primary power component is attached to the cold plate body 111, and the secondary power component is spaced apart from the cold plate body 111.

[0172] In some embodiments, the multiple power components of the drive board 21 include a fan drive chip 2121, a compressor drive chip 2122, a fan drive module 2131, a compressor drive module 2132, a fan interface 2141, a communication interface 2142, a film capacitor 2151, an electrolytic capacitor 2152, and a module power supply 216 mounted on the drive substrate 211. Specifically, the multiple primary power components of the drive board 21 include the fan drive module 2131 and the compressor drive module 2132, and the multiple secondary power components of the drive board 21 include the fan drive chip 2121, the compressor drive chip 2122, the fan interface 2141, the communication interface 2142, the film capacitor 2151, the electrolytic capacitor 2152, and the module power supply 216.

[0173] In some embodiments, the power components of the filter board 22 include a common-mode inductor 222 mounted on the filter substrate 221, and at least one of a varistor, a differential-mode capacitor, and a common-mode capacitor mounted on the filter substrate 221. Specifically, the primary power components of the filter board 22 include the common-mode inductor 222, and the secondary power components of the filter board 22 include at least one of a varistor, a differential-mode capacitor, and a common-mode capacitor.

[0174] In this embodiment, a scheme is adopted in which primary power components are attached to the cold plate body 111 and secondary power components are spaced apart from the cold plate body 111. This not only allows the cold plate body 111 itself to have a low temperature and directly absorb the heat from the primary power components attached to it for efficient heat dissipation, but also allows the cold plate body 111 to absorb heat from its surrounding environment, enabling the heat generated by the secondary power components to be efficiently dissipated into the environment. This satisfies the heat dissipation needs of different power components without requiring all power components to be attached to the cold plate body 111. This avoids the condensation problem caused by power components with low heat dissipation requirements being cooled to excessively low temperatures by attaching them to the cold plate body. Furthermore, it allows for the arrangement of different power components, making it easier to place power components that need maintenance in suitable locations for convenient maintenance. It also allows for more efficient use of the space inside the main housing 11, reducing the size of the cold plate body 111 and thus making the overall size of the electronic control device 1 smaller, suitable for installation in relatively small spaces.

[0175] When the primary power element and the secondary power element are inside the primary cavity, in addition to the cold plate body 111 being used for heat dissipation, the heat dissipation enclosure 112 connected to the cold plate body 111 can also dissipate heat. The cold plate body 111 can receive the heat from the heat dissipation enclosure 112. The cold plate body 111 and the heat dissipation enclosure 112, while forming a cavity to accommodate the power element, also form a heat sink as a whole, jointly absorbing the heat inside the primary cavity. The heat dissipation enclosure 112 forms a 360-degree encircling radiative heat dissipation, maximizing the space and direction of radiative heat dissipation, realizing the cooling of the air inside the primary cavity, and uniformly reducing the temperature in all parts of the primary cavity, so that the heat of the secondary power element can also be quickly dissipated even when it is not in contact with the cold plate body 111.

[0176] The electronic control device 1 further includes at least one circuit board, which optionally includes the drive board 211 and the filter board 221 as described above. In some embodiments, primary power components and secondary power components can be mounted on the circuit board. The circuit board is spaced apart from the cold plate body 111 in the thickness direction H of the cold plate body 111, providing support for the corresponding primary and secondary power components to meet their assembly requirements. In other embodiments, the primary and secondary power components can also be independently mounted on at least one of the cold plate body 111, the heat dissipation plate 112, and the cover 120.

[0177] In this embodiment, when the main housing 11 has multiple heat dissipation cavities 101, the mounting positions of the primary power components, secondary power components, and circuit boards within the multiple heat dissipation cavities 101 can be the same or different, and can be selected independently based on installation requirements. The following describes the mounting positions of the primary power components, secondary power components, and circuit boards within a single heat dissipation cavity 101 as an example.

[0178] In some embodiments, at least a portion of the primary power components are mounted on the side of the circuit board facing the cold plate body 111 and are attached to the surface of the cold plate body 111. Optionally, all primary power components located in the same heat dissipation cavity 101 are mounted on the side of the circuit board facing the cold plate body 111. Optionally, a portion of the primary power components located in the same heat dissipation cavity 101 are mounted on the side of the circuit board facing the cold plate body 111, while another portion of the primary power components are mounted on at least one of the cold plate body 111, the heat dissipation enclosure 112, and the cover 120. That is, this portion of the primary power components is not mounted on the circuit board but is mounted on the main housing 11, which provides support for it.

[0179] In some embodiments, at least some of the secondary power components are mounted on at least one circuit board on the side facing the cold plate body 111, and spaced apart from the surface of the cold plate body 111. Optionally, all secondary power components located in the same heat dissipation cavity 101 are mounted on the side of the circuit board facing the cold plate body 111. Optionally, a portion of the secondary power components located in the same heat dissipation cavity 101 are mounted on the side of the circuit board facing the cold plate body 111, supported by the circuit board, while another portion of the secondary power components are mounted on at least one of the cold plate body 111, the heat dissipation enclosure 112, and the cover 120, supported by the main housing 11. Of course, in other embodiments, all secondary power components located in the same heat dissipation cavity 101 may also be mounted on the side of the circuit board facing away from the cold plate body 111.

[0180] Taking the variable frequency drive module 20 as an example, regarding the drive board 21, the primary power components of the drive board 21 include the fan drive module 2131 and the compressor drive module 2132 of the drive unit 213. These primary power components are located on the side of the drive substrate 211 facing the cold plate body 111 and are attached to the surface of the cold plate body 111. The secondary power components of the drive board 21 include the fan interface 2141 and the communication interface 2142 of the interface unit 214, as well as the fan drive chip 2121 and the compressor drive chip 2122 of the chip unit 212, and include a film capacitor 2151 and an electrolytic capacitor 2152. These secondary power components are located on the side of the drive substrate 211 facing away from the cold plate body 111. The arrangement of these power components on the driver board 21 not only meets their respective heat dissipation requirements, but also takes into account the needs of disassembly and maintenance. At the same time, it makes reasonable use of the space on both sides of the driver board 211, making the driver board 21 structure compact and reducing the space occupied by the driver board 21 in the thickness direction of the cold plate body 111.

[0181] Taking the frequency converter drive module 20 as an example, regarding the filter board 22, the primary power components of the filter board 22 include a common-mode inductor 222, which is disposed on the side of the filter substrate 221 facing the cold plate body 111 and is attached to the surface of the cold plate body 111. The secondary power components of the filter board 22 include at least one of a varistor, a differential-mode capacitor, and a common-mode capacitor, which are disposed on the side of the filter substrate 221 facing the cold plate body 111 and are spaced apart from the surface of the cold plate body 111. Distributing these power components of the filter board 22 on the same side of the filter substrate 221 allows for efficient heat dissipation of these power components.

[0182] Taking the frequency converter drive module 20 as an example, regarding the reactor 23, the reactor 23 is also a primary power component. The reactor 23 and the filter plate 22 are located on the second side of the cold plate body 111, and the reactor 23 is attached to the surface of the second side of the cold plate body 111 for efficient heat dissipation. The reactor 23 is located on the outside of the filter substrate 221, and the reactor 23 and the filter substrate 221 are spaced apart to allow for separate assembly and disassembly of the reactor 23 and the filter plate 22, and to flexibly adjust the position of the reactor 23 according to the drive board 21. This prevents the reactor 23 from interfering with the installation of other structural components on the filter substrate 221, and makes the structural components on the second side of the cold plate body 111 compactly arranged.

[0183] In some embodiments, the main housing 11 includes a plurality of support structures 114, which are connected to at least one circuit board. An installation space is formed between the at least one circuit board and the cold plate body 111. The support structures 114 provide support for the circuit board. When a primary power element or a secondary power element is disposed on the side of the circuit board facing the cold plate body 111, the primary power element or the secondary power element is disposed in the installation space between the circuit board and the cold plate body 111, so that the corresponding primary power element is attached to the cold plate body 111 and the corresponding secondary power element is spaced apart from the cold plate body 111.

[0184] like Figure 13 As shown, the support structure 114 protrudes from the surface of the cold plate body 111 to reserve a suitable installation space between the circuit board and the cold plate body 111. At the same time, the support structure 114 can raise the position of the power component relative to the cold plate body 111. Even when the temperature of the cold plate body 111 is low and water vapor condenses on the surface of the cold plate body 111, water vapor can be prevented from accumulating in the gap between the power component and the cold plate body 111, thereby preventing the water vapor condensed on the surface of the cold plate body 111 from affecting the power component.

[0185] In this embodiment, in the thickness direction H of the cold plate body 111, the height of the heat dissipation enclosure 112 is higher than the height of the support structure 114. The circuit board is mounted on the support structure 114. Correspondingly, the height of the heat dissipation enclosure 112 is higher than the mounting height of the circuit board. The heat dissipation enclosure 112 and the cold plate body 111 enclose each other to form a box-shaped structure, and the enclosed primary cavity has a greater depth to accommodate power components, resulting in higher heat dissipation efficiency. Furthermore, the part of the box cover 120 that is sealed to the heat dissipation enclosure 112 is located away from the cold plate body 111. The heat dissipation enclosure 112 can guide the flow of water vapor outside the main box body 11, preventing water vapor outside the main box body 11 from entering the primary cavity along the outer surface of the cold plate body 111 and the heat dissipation enclosure 112, thereby giving the primary cavity a higher sealing level.

[0186] In some embodiments, multiple support structures 114 are respectively disposed in the area enclosed by the heat dissipation plate 112, thereby providing support for the circuit board disposed in the primary cavity. At this time, when the electronic control device 1 also has other power components and circuit boards disposed in other heat dissipation cavities 101 outside the primary cavity, other mounting structures can be used to support these power components and circuit boards. The embodiments of this application do not limit these mounting structures, and any structure in the art that can be used to support these power components and circuit boards is applicable to this application.

[0187] In some embodiments, a portion of the support structure 114 is disposed within the area enclosed by the heat dissipation enclosure 112 to provide support for the power components and circuit boards located in the primary cavity, while another portion of the heat dissipation enclosure 112 is disposed outside the area enclosed by the heat dissipation enclosure 112, for example, within the secondary cavity to provide support for the power components and circuit boards located within the secondary cavity.

[0188] In some embodiments, multiple support structures 114 are disposed on the same side of the cold plate body 111.

[0189] In some embodiments, a plurality of support structures 114 are disposed on opposite sides of the cold plate body 111. Specifically, the plurality of support structures 114 include a first support column 1141 and a second support column 1142. In the thickness direction H of the cold plate body 111, the first support column 1141 and the second support column 1142 are respectively disposed on opposite sides of the cold plate body 111.

[0190] For example, a first support column 1141 protrudes from the first side of the cold plate body 111, and there are multiple first support columns 1141. The driving substrate 211 is detachably mounted on the ends of the multiple first support columns 1141. A second support column 1142 protrudes from the second side of the cold plate body 111, and there are multiple second support columns 1142. The filter substrate 221 is detachably mounted on the ends of the second support columns 1142. At this time, a first enclosure plate 1121 can be provided protruding from the first side of the cold plate body 111, and multiple first support columns 1141 are disposed in the area enclosed by the first enclosure plate 1121. A guide flange 1104 protrudes from the second side of the cold plate body 111, and multiple second support columns 1142 are disposed in the area enclosed by the guide flange 1104.

[0191] It should be noted that in this embodiment, in the thickness direction H of the cold plate body 111, the height of the heat dissipation enclosure 112 is much greater than the height of the guide flange 1104. The guide flange 1104 is only used to extend into the receiving groove 122a' of the second cover 122 to limit and seal the second cover 122. The heat dissipation enclosure 112 is used to enclose the cold plate body 111 to form a box-shaped structure, thereby constructing a primary cavity for accommodating power components. Regarding the specific dimensions of the guide flange 1104 and the heat dissipation enclosure 112, this application embodiment does not limit them. They can be selected according to actual needs. For example, in the thickness direction H of the cold plate body 111, the dimension of the heat dissipation enclosure 112 is H1, the dimension of the guide flange 1104 is H2, and the dimension of the support structure 114 is H3, where H2 < H3 ≤ H1, and 2 ≤ H1 / H2 ≤ 100. For example, H1 / H2 can be 2, 5, 10, 18, 20, 35, 50, 80, 100, or any range of the above two.

[0192] In this embodiment, the support structure 114 facilitates the assembly, disassembly, and alignment of the circuit board. In some embodiments, the circuit board has support holes, and the end of the support structure 114 extends into the support holes. The circuit board is detachably fixed to the support structure 114 using fasteners such as screws and snap-fit ​​structures. For example, as... Figure 14 As shown, the driving substrate 211 has a first support hole 211a. The end of the first support post 1141 is disposed in the first support hole 211a, and the end face of the first support post 1141 provides support for the driving substrate 211 in a direction perpendicular to the surface of the driving substrate 211. Fasteners are installed at the end of the first support post 1141 and abut against the surface of the driving substrate 211 in a direction perpendicular to the surface of the driving substrate 211 to fix the driving substrate 211 to the first support post 1141. The filter substrate 221 has a second support hole 211b. It can be installed in a similar manner to the driving substrate 211. The end of the second support post 1142 is disposed in the second support hole 211b, and fasteners are used to install the filter substrate 221 to the second support post 1142 to facilitate the assembly and disassembly of the filter substrate 221.

[0193] When multiple power components are located on opposite sides of the cold plate body 111, the power components located on opposite sides of the cold plate body 111 are electrically connected through the power connection structure 62. One part of the power connection structure 62 protrudes from the surface of the first side of the cold plate body 111, and the other part protrudes from the surface of the second side of the cold plate body 111. In addition to being electrically connected to the corresponding circuit board and power components, the power connection structure 62 can also work with the support structure 114 to provide support for the circuit board, thereby improving the installation stability of the circuit board.

[0194] In some embodiments, the two ends of the first power connection structure 621 are electrically connected to the driving substrate 211 and the filter substrate 221 located on opposite sides of the cold plate body 111, respectively. Specifically, as shown in the figure... Figure 15 As shown, the first power connection structure 621 includes a first insulating base 6211 and a first power connection post 6212. The first power connection post 6212 is installed on the first insulating base 6211. The first insulating base 6211 passes through the first connecting port 1114a and is installed on the cold plate body 111. The two ends of the first insulating base 6211 are used to support the driving substrate 211 and the filter substrate 221, respectively. The first power connection post 6212 passes through the first connecting port 1114a and its two ends are electrically connected to the driving substrate 211 and the filter substrate 221, respectively.

[0195] Optionally, the first power contact post 6212 of the first power contact structure 621 is provided with a first connecting hole and a second connecting hole at both ends, such as... Figure 14 As shown, the driving substrate 211 has a first power contact hole 211c, which is electrically connected to the first connecting hole via a connector. The filter substrate 221 has a second power contact hole 211d, which is electrically connected to the second connecting hole via a connector. Optionally, the connector may be a metal screw, a metal clip, or the like.

[0196] In some embodiments, the two ends of the second power connection structure 622 are electrically connected to the driving substrate 211 and the reactor 23 located on opposite sides of the cold plate body 111, respectively. Specifically, the second power connection structure 622 includes a second insulating seat 6221 and a second power connection post 6222. The second power connection post 6222 is mounted on the second insulating seat 6221, and the second insulating seat 6221 is mounted on the cold plate body 111. The portion of the second insulating seat 6221 protruding from the first side of the cold plate body 111 is also used to support the driving substrate 211. The second power connection post 6222 passes through the second communication port 1114b, and its two ends are electrically connected to the driving substrate 211 and the reactor 23, respectively.

[0197] Optionally, the second power connection post 6222 of the second power connection structure 622 is provided with a third connection hole and a fourth connection hole at both ends, the drive substrate 211 has a third power connection hole 211e, the third power connection hole 211e and the third connection hole are electrically connected by a connector, and the fourth connection hole is electrically connected to the reactance 23 by a transfer wire, wherein the transfer wire is provided on the second side of the cold plate body 111.

[0198] In this embodiment, the circuit boards located on opposite sides of the cold plate body 111 are electrically connected via the power connection structure 62, which also provides support for the circuit boards. The power connection structure 62 and the support structure 114 further support the circuit boards, facilitating their assembly and disassembly. This allows for the separate compartmentalization of multiple power components in the frequency converter drive module 20, meaning multiple power components are integrated onto the same drive board 21 located on the first side of the cold plate body 111, and also onto the same filter board 22. The filter board 22 and the reactor 23 are located on the second side of the cold plate body 111. Furthermore, this embodiment designs the power components located on the drive board 211 and the filter board 221 to facilitate electrical connections between the multiple power components.

[0199] In some embodiments, please combine with Figure 9 , Figure 11 and Figure 12 The drive unit 213 includes a fan drive module 2131 and a compressor drive module 2132, which are spaced apart along a second direction Y, perpendicular to the thickness direction of the main housing 11. In some other embodiments, the fan drive module 2131 and the compressor drive module 2132 may also be spaced apart along a third direction Z, perpendicular to the thickness direction of the main housing 11.

[0200] In this embodiment of the application, the thickness direction of the main box 11 is the same as the thickness direction H of the cold plate body 111. Optionally, when the electronic control device 1 is applied to the outdoor unit 2 of the HVAC equipment, the thickness direction H of the cold plate body 111 is the front-back direction of the main box 11, the second direction Y is the up-down direction of the main box 11, and the third direction Z is the left-right direction of the main box 11.

[0201] In some embodiments, combined with Figure 9 , Figure 11 and Figure 12 The chip unit 212 includes a fan drive chip 2121 and a compressor drive chip 2122, which are spaced apart along the second direction Y. Figure 12 This description only exemplifies the mounting positions of the fan drive chip 2121 and the compressor drive chip 2122, and does not represent the specific structures of the fan drive chip 2121 and the compressor drive chip 2122. In other embodiments, the fan drive chip 2121 and the compressor drive chip 2122 may also be arranged at Z-intervals along a third direction.

[0202] In some embodiments, the fan drive module 2131 and the compressor drive module 2132 are spaced apart along the second direction Y, and the fan drive chip 2121 and the compressor drive chip 2122 are also spaced apart along the second direction Y. This arrangement facilitates the simplification of the electrical connection lines between the fan drive module 2131 and the fan drive chip 2121, and also facilitates the simplification of the electrical connection lines between the compressor drive chip 2122 and the compressor drive module 2132. Optionally, the fan drive chip 2121 and the fan drive module 2131 are at least partially overlapped in the first direction X. Optionally, the compressor drive chip 2122 and the compressor drive module 2132 are at least partially overlapped in the first direction X.

[0203] To prevent interference with the installation of other power components, the fan drive module 2131, compressor drive module 2132, fan drive chip 2121 and compressor drive chip are positioned in the middle of the corresponding drive substrate 211.

[0204] In some embodiments, please refer to Figure 9 An interface unit 214 is disposed along the edge of the drive substrate 211. The interface unit 214 includes a fan interface 2141 and a communication interface 2142, so that the fan interface 2141 and the communication interface 2142 can be plugged into corresponding connecting wires to achieve electrical connection. Optionally, the insertion direction of the fan interface 2141 is perpendicular to the surface of the drive substrate 211, so that the plug of the connecting wire connected to the fan interface 2141 is inserted into the fan interface 2141 in a direction perpendicular to the surface of the drive substrate 211. Optionally, the insertion direction of the communication interface 2142 is perpendicular to the surface of the drive substrate 211, so that the plug of the connecting wire connected to the communication interface 2142 is inserted into the fan interface 2141 in a direction perpendicular to the surface of the drive substrate 211.

[0205] The main housing 11 includes a mounting sidewall 112a1. Optionally, a portion of the heat dissipation enclosure 112 forms the mounting sidewall 112a1, or a portion of the cover 120 forms the mounting sidewall 112a1. The drive substrate 211 has a first substrate edge 211f and a second substrate edge 211g connected at an angle, with the second substrate edge 211g facing the mounting sidewall 112a1. The drive substrate 211 includes a corner mounting area sandwiched between the first substrate edge 211f and the second substrate edge 211g. The fan interface 2141 and the communication interface 2142 are located in the corner mounting area. This allows the connecting wires to be connected to the corresponding fan interface 2141 and communication interface 2142 with shorter lines, simplifying wiring, facilitating disassembly and assembly, and preventing the connecting wires connected to the fan interface 2141 and communication interface 2142 from interfering with other power components.

[0206] In some embodiments, in the third-party direction Z, the mounting sidewall 112a1 of the main housing 11 is disposed opposite to the drive substrate 211. The main housing 11 includes a fan wiring section 116 and a compressor wiring section 117, which are spaced apart on the same mounting sidewall 112a1 of the main housing 11. The fan wiring section 116 is used for inserting a fan plug 71, and the fan interface 2141 is used for electrical communication with the fan plug 71 inserted into the fan wiring section 116, so as to transmit a fan control signal to the fan of the outdoor unit 2 through the fan plug 71, thereby controlling the operation state of the fan. The compressor wiring section 117 is used for passing the compressor wire 24 through to the drive board, and the compressor drive module 2132 is used for electrical communication with the compressor wire 24, so as to transmit a compressor drive electrical signal to the compressor of the outdoor unit 2, thereby controlling the operation state of the compressor.

[0207] In some embodiments, such as Figure 11 and Figure 12 As shown, the electronic control device 1 also includes multiple compressor wires 24. One end of each compressor wire 24 passes through the inside of the compressor wiring section 117, and the other end of the compressor wiring is located on the side of the drive substrate 211 facing the cold plate body 111 (that is, the second side of the drive substrate 211) and is electrically connected to the compressor drive module 2132, so as to utilize the space between the drive substrate 211 and the cold plate body 111 to arrange multiple compressor wires 24.

[0208] Optionally, the electronic control device 1 further includes multiple compressor terminals 25 corresponding to the multiple compressor wires 24. The drive substrate 211 has multiple compressor terminals 211h corresponding to the multiple compressor terminals 25. Each compressor terminal 211h contains a compressor terminal 25. One end of the compressor terminal 25 is located in the compressor terminal 211h and is electrically connected to the metal wire inside the drive substrate 211. It is also electrically connected to the compressor drive module 2132 through the metal wire inside the drive substrate 211. Alternatively, one end of the compressor terminal 25 extends to the side of the drive substrate 211 facing away from the cold plate body 111 to be directly electrically connected to the compressor drive module 2132. The other end of the compressor terminal 25 extends to the side of the drive base plate 211 facing the cold plate body 111 and is electrically connected to the compressor wire 24. For example, the end of the compressor terminal 25 and the compressor wire 24 are detachably connected by a structural component, or the end of the compressor terminal 25 is welded to the compressor wire 24. During assembly, multiple compressor wires 24 can be installed one-to-one with multiple compressor terminal 25s, and then the multiple compressor wires 24 can be threaded through the compressor wiring section 117 to complete the assembly.

[0209] Optionally, the compressor drive chip 2122 and the compressor drive module 2132 are at least partially overlapped in the first direction X, and are located in the area of ​​the drive substrate 211 near the mounting sidewall 112a1, which facilitates the simplification of the wiring between the compressor drive module 2132, the compressor drive chip 2122 and the compressor line 24, and shortens the thread length.

[0210] Furthermore, in the third-party direction Z, the compressor wiring section 117 is correspondingly set to the mounting area of ​​the compressor drive chip 2122 and the compressor drive module 2132 drive board 211.

[0211] In some embodiments, the electronic control device 1 further includes multiple fan wires 9 (not shown in the figure), which are located on the side of the drive substrate 211 facing away from the cold plate body 111 (that is, the side where the first side of the drive substrate 211 is located). The multiple fan wires are electrically connected to multiple fan interfaces 2141 one by one. When the fan plug 71 is plugged into the fan wiring part 116, the fan plug 71 is electrically connected to the multiple fan wires.

[0212] Optionally, the fan drive chip 2121 and the fan drive module 2131 are at least partially overlapped in the first direction X and are located in the area of ​​the drive substrate 211 near the mounting sidewall 112a1. Similarly, this facilitates the simplification of the wiring between the fan drive module 2131, the fan drive chip 2121 and the fan plug 71, and shortens the thread length.

[0213] Furthermore, in the third-party direction Z, the fan wiring section 116 and the drive board 211 are respectively set in the mounting area where the fan drive chip 2121 and the fan drive module 2131 are installed.

[0214] In some embodiments, the first power component of the drive board 21 further includes a thin-film capacitor 2151 and an electrolytic capacitor 2152. The thin-film capacitor 2151 and the electrolytic capacitor 2152 are spaced apart along the second direction Y and are located in the region of the drive substrate 211 away from the mounting sidewall 112a1, that is, in the region away from the fan drive chip 2121, the fan drive module 2131, the compressor drive chip 2122 and the compressor drive module 2132, so that the various power components of the drive board 21 are in a suitable position and arranged in an orderly manner, preventing the thin-film capacitor 2151 and the electrolytic capacitor 2152 from interfering with the wiring.

[0215] In some embodiments, the fan interface 2141 is disposed corresponding to the edge 211f of the first substrate and is located between the fan drive module 2131 and the mounting sidewall 112a1 along the third direction Z. When the same drive board 21 is provided with multiple fan interfaces 2141, the multiple fan interfaces 2141 are arranged side by side along the third direction Z.

[0216] In some embodiments, the communication interface 2142 is disposed corresponding to the edge 211g of the second substrate. Along the third direction Z, the communication interface 2142 is located between the fan drive module 2131 and the mounting sidewall 112a1. When viewed from a direction perpendicular to the surface of the drive substrate 211, the compressor line 24 can pass under the communication interface 2142. When the same drive board 21 has multiple communication interfaces 2142, the multiple communication interfaces 2142 are arranged side by side along the second direction Y.

[0217] In some embodiments, the first power component of the drive board 21 further includes a module power supply 216, which is mounted in the region of the drive substrate 211 adjacent to the edge 211f of the first substrate. In the third direction Z, the module power supply 216 may be disposed between the fan drive chip 2121 and two capacitors (i.e., film capacitor 2151 and electrolytic capacitor 2152).

[0218] In some embodiments, the frequency converter drive module 20 includes a drive board 21, a filter board 22 and a reactor 23, and the electronic control device 1 includes a first power connection structure 621 and a second power connection structure 622. The drive board 21 is electrically connected to the filter board 22 through the first power connection structure 621, and the drive board 21 is electrically connected to the reactor 23 through the second power connection structure 622.

[0219] In some embodiments, the frequency converter drive module 20 includes two drive boards 21, a filter board 22 and two reactors 23, and the electronic control device 1 includes two first power connection structures 621 and two second power connection structures 622. Each drive board 21 is electrically connected to the filter board 22 through a first power connection structure 621, and each drive board 21 is electrically connected to a reactor 23 through a second power connection structure 622.

[0220] When the frequency converter drive module 20 includes two drive boards 21, the two drive boards 21 are spaced apart along a second direction Y perpendicular to the thickness direction. The cold plate body 111 is provided with two first connecting ports 1114a, and the two first connecting ports 1114a are arranged adjacent to the middle of the cold plate body 111. Two first electrical connection structures 621 pass through the two first connecting ports 1114a respectively. One end of the two first electrical connection structures 621 is electrically connected to its corresponding drive substrate 211, and the other end is electrically connected to the filter substrate 221. This makes it easier for the two drive boards 21 to be concentrated in the same area and electrically connected to the same filter board 22, thereby reducing the size of the filter substrate 221 and thus reducing the volume of the entire filter board 22.

[0221] In some embodiments, the two drive boards 21 are arranged symmetrically at the center. In this case, each power element of the two drive boards 21 is arranged symmetrically at the center. The first power connection structure 621 can be arranged at the edge area of ​​the drive substrate 211. In this way, the two first power connection structures 621 can be concentrated in the central area of ​​the cold plate body 111 for installation.

[0222] In some embodiments, the two first power connection structures 621 are centrally symmetrically arranged and are concentrated in the central region of the cold plate body 111. In this case, the power components of the two drive plates 21 can be centrally symmetrically or axially symmetrically arranged, or the power components of the two drive plates 21 can also be arranged asymmetrically to appropriately adjust the position of the corresponding power components.

[0223] Optionally, the driving substrate 211 further has a third substrate edge, which is disposed opposite to the first substrate edge 211f in the second direction Y. When the two driving plates 21 are disposed side by side along the second direction Y, the third substrate edges of the two driving substrates 211 are close to each other, and the first substrate edges 211f of the two driving substrates 211 are far apart from each other. The first electrical connection structure 621 can be mounted on the driving substrate 211 in the region adjacent to the third substrate edge. In this way, the two first electrical connection structures 621 can be concentrated in the central region of the cold plate body 111 for mounting.

[0224] Optionally, the drive substrate 211 also has a fourth substrate edge, and the fourth substrate edge and the second substrate edge 211g are arranged opposite each other in the third direction Z. Two capacitors (i.e., film capacitor 2151 and electrolytic capacitor 2152) can be mounted on the drive substrate 211 in the area adjacent to the fourth edge. When the two drive boards 21 are centrally symmetrically arranged, the main housing 11 includes two mounting sidewalls 112a1 respectively disposed on opposite sides of the drive boards 21 in the third direction Z. The second substrate edge 211g of one drive substrate 211 is disposed toward one of the mounting sidewalls 112a1, and the second substrate edge 211g of the other drive substrate 211 is disposed toward the other mounting sidewall 112a1. Each mounting sidewall 112a1 is provided with a set of fan wiring portions 116 and compressor wiring portions 117 corresponding to the drive board 21. Furthermore, the two sets of fan wiring portions 116 and compressor wiring portions 117 are also centrally symmetrically arranged. When the two drive plates 21 are arranged symmetrically, the main housing 11 only includes a mounting sidewall 112a1 located on the same side of the two drive plates 21 in the third direction Z. The second substrate edges 211g of the two drive plates 211 are arranged facing the same mounting sidewall 112a1, and the same mounting sidewall 112a1 is provided with two sets of fan wiring portions 116 and compressor wiring portions 117 corresponding to the two drive plates 21.

[0225] In some embodiments, the electrical control module further includes a power connector 61, which is used to connect an external power cord to provide power to the electrical control box. In the second direction Y of the main housing 11, the power connector 61 is located on the side of the first sub-cavity 1011 away from the second cavity 1013, and the power connector 61 is installed on the main housing 11 and electrically connected to the frequency converter drive module 20. The frequency converter drive module 20 is then electrically connected to the main control module 30 of the second cavity 1013, so that external power can be transmitted sequentially to the frequency converter drive module 20 and the main control module 30 through the power connector 61, providing power support for the normal operation of the frequency converter drive module 20 and the main control module 30.

[0226] The main control module 30 includes a main control board 31 and a main control power supply board 32 that are electrically connected. The electronic control device 1 also includes a main control connection line, which includes a main control power supply line. The power supply lines for the power terminal 61 supplying power to the frequency converter drive module 20 and the main control module 30 are as follows: the power terminal 61 is electrically connected to the filter board 22. The filter board 22 receives the power signal from the power terminal 61 and filters the power signal, for example, removing high-frequency noise and suppressing harmonics, before transmitting it to the first power connection structure 621. The first power connection structure 621 is electrically connected to the drive substrate 211, thereby supplying power to the power components on the drive substrate 21. The first power connection structure 621 is also electrically connected to the main control power supply line, which is electrically connected to the main control power supply board 32, thus supplying power to the main control board 31 and the main control power supply board 32 sequentially through the main control power supply line.

[0227] The main control connection line also includes multiple main control signal lines. One end of the main control signal line is connected to the main control board 31, and the other end of the main control signal line is electrically connected to the communication interface 2142 of the drive board 21. Specifically, the multiple main control signal lines include fan signal lines and compressor signal lines, and the communication interface 2142 includes compressor communication interface 2142 and fan communication interface 2142.

[0228] Regarding the connection of the fan signal line, specifically, the fan signal line is electrically connected to the fan communication interface 2142. The main control board 31 transmits fan control signals to the fan communication interface 2142 through the fan signal line. The fan communication interface 2142 is electrically connected to the fan drive chip 2121. The fan drive chip 2121 controls the fan drive module 2131 according to the received fan control signals. The fan interface 2141 is electrically connected to the fan plug 71, so the fan drive module 2131 can provide drive electrical signals corresponding to the fan control signals to the fan, thereby driving the fan to run at the corresponding speed.

[0229] Regarding the connection of the compressor signal line, specifically, the compressor signal line is electrically connected to the compressor communication interface 2142. The main control board 31 transmits compressor control signals to the compressor communication interface 2142 through the compressor signal line. The compressor communication interface 2142 is electrically connected to the compressor drive chip 2122 to transmit the compressor control signals to the compressor drive chip 2122. The compressor drive chip 2122 controls the compressor drive module 2132 according to the received compressor control signals, thereby regulating the operating status of the compressor according to the compressor control signals.

[0230] In some embodiments, the main control board 31 and the main control power board 32 are stacked in the thickness direction H of the cold plate body 111, with the main control power board 32 located on the side of the main control board 31 facing the cold plate body 111. This arrangement facilitates heat dissipation from the main control power board 32 and also facilitates the wiring of the electrical connection lines for signal connection with the main control board 31. When the electrical control device 1 is installed in the outdoor unit 2 of the HVAC system, the thickness direction H of the cold plate body 111 can be the front-rear direction of the main housing 11.

[0231] In some other embodiments, the main control board 31 and the main control power board 32 may also be arranged side by side in the direction perpendicular to the thickness direction of the cold plate body 111. For example, in the direction in which the first enclosure 1121 and the third enclosure 1123 are arranged side by side, that is, when the electrical control device 1 is installed on the outdoor unit 2 of the HVAC equipment, the main control board 31 and the main control power board 32 are arranged side by side in the vertical direction of the main housing 11. Alternatively, in the direction perpendicular to the direction in which the first enclosure 1121 and the third enclosure 1123 are arranged side by side, that is, when the electrical control device 1 is installed on the outdoor unit 2 of the HVAC equipment, the main control board 31 and the main control power board are arranged side by side in the horizontal direction of the main housing 11.

[0232] In some embodiments, such as Figure 16 As shown, the main control connection line is located on the side of the drive substrate 211 facing away from the cold plate body 111. The electrical control device 1 also includes a wire bridge 50, which is disposed inside the first sub-cavity 1011. The wire bridge 50 is used to support and guide the arrangement of the main control connection line. The wire bridge 50 not only provides support for the main control connection line, but also plays a role in protecting and reducing wiring clutter.

[0233] like Figure 16 and Figure 17As shown, the cable bridge 50 has a first cable routing channel 511 and a second cable routing channel 512 that are relatively independently configured. These independently configured channels effectively separate different types of main control connection cables. This makes the arrangement of the main control connection cables within the control box more neat and orderly, reducing wiring clutter and improving the overall cleanliness of the control box. Furthermore, the design of the first cable routing channel 511 and the second cable routing channel 512 reduces the number of cable routing holes required on the control box, thereby lowering the manufacturing cost.

[0234] The main control connection includes a main control power supply line and a main control signal line. The main control power supply line typically carries a large current and is classified as high-voltage, while the main control signal line typically carries a smaller current and is classified as low-voltage. Specifically, the portion of the main control power supply line located within the first sub-cavity 1011 is arranged in the first wiring channel 511, and the portion of the main control signal line located within the first sub-cavity 1011 is arranged in the second wiring channel 512. This separation of high-voltage and low-voltage signals effectively reduces electromagnetic interference from high-voltage signals to low-voltage signals, improving the stability and reliability of signal transmission. This separation helps reduce electromagnetic interference and improves the electromagnetic compatibility of the control box, enabling stable operation in various electromagnetic environments. Furthermore, the separate first wiring channel 511 and second wiring channel 512 facilitate maintenance or cable replacement, allowing for individual handling of the power supply or signal line without affecting the other. The independent first wiring channel 511 and second wiring channel 512 also simplify maintenance and repair of the power supply and signal lines, reducing difficulties caused by cross-connections.

[0235] In some embodiments, the cable bridge 50 includes a first bracket 51 and a second bracket 52. The first bracket 51 has a first cable routing channel 511 for arranging the main control power supply line. The first bracket 51 can reduce the main control power supply line from deviating from the preset wiring path due to vibration or other external forces. The first bracket 51 is located in the middle of the first sub-cavity 1011, spans the side of the drive plate 21 facing away from the cold plate body 111, and extends from the position of the corresponding power connection structure 62 on the drive plate 21 toward the second cavity 1013, ensuring that the path of the power supply line is clear and fixed, making the arrangement of the power supply line in the control box more neat and orderly, and improving the cleanliness of the inside of the control box.

[0236] The second bracket 52 has the aforementioned second wiring channel 512 formed inside, which is used to arrange the main control signal line. The second bracket 52 can reduce the main control signal line from deviating from the preset wiring path due to vibration or other external forces. The second bracket 52 extends along the gap between the edge of the drive plate 21 and the first enclosure plate 1121 and the gap between the two drive plates 21, and one end of the second bracket 52 extends towards the second cavity 1013 to guide the main control signal line led out from the second cavity 1013 into the second sub-cavity 1012, ensuring that the path of the main control signal line is clear and fixed, reducing interference between the main control signal line and other components, reducing the problem of messy wiring, and improving the cleanliness of the inside of the electrical control box.

[0237] The first bracket 51 and the second bracket 52 can be made of insulating materials, such as ABS plastic or rubber, to ensure electrical safety.

[0238] In some embodiments, the first bracket 51 is connected to the second bracket 52. Specifically, the end of the first bracket 51 facing away from the second cavity 1013 is connected to the end of the second bracket 52 facing away from the second cavity 1013, making the entire cable bridge 50 structure more stable and reducing loosening caused by vibration or other external forces. The first bracket 51 and the second bracket 52 can be integrally formed, reducing assembly difficulty. Integral forming reduces the number of connection points between the first bracket 51 and the second bracket 52, thereby reducing potential points of failure and the risk of loosening due to vibration or other external forces.

[0239] The second bracket 52 is also provided with elastic buckles 522 for engaging with the drive plate 21. Specifically, the second bracket 52 includes a wiring section and multiple elastic buckles 522 connected to the wiring section. The wiring section extends along the gap between the edge of the drive plate 21 and the heat dissipation plate 112, as well as the gap between the two drive plates 21, and has a second wiring channel 512. The multiple elastic buckles 522 are arranged at intervals along the extension direction of the wiring section. The elastic buckles 522 are connected to the side of the wiring section away from the opening of the first sub-cavity 1011 and extend towards the drive plate 21. Through the engagement of the elastic buckles 522 with the drive plate 21, the second bracket 52 can be provided with stable support, and the installation and removal of the second bracket 52 can be completed quickly. The portion of the wiring section located between the two drive plates 21 is provided with elastic buckles 522 on both sides facing the two drive plates 21. The elastic buckles 522 can provide a stable connection force to ensure that the drive plate 21 will not loosen due to vibration or other external forces during operation.

[0240] The second bracket 52 also includes a wire clamping part 523, which is connected to the wiring part and spaced apart from the bottom wall of the second wiring channel 512. Understandably, the signal line is disposed between the wire clamping part 523 and the bottom wall of the second wiring channel 512. The main function of the wire clamping part 523 is to fix the main control signal line, ensure that the main control signal line is stably arranged in the second wiring channel 512, and prevent the main control signal line from loosening due to vibration or other external forces during operation.

[0241] In some embodiments, combined with Figure 18 , Figure 19 and Figure 20 The first enclosure 1121 and the third enclosure 1123 are spaced apart. The first enclosure 1121 has a first wire hole 1121a communicating with the first sub-cavity 1011, and the third enclosure 1123 has a second wire hole 1123a communicating with the second cavity 1013. The main box 11 also includes a connecting part 115, which has a connecting groove 1151. The connecting part 115 is connected to the first enclosure 1121 and the third enclosure 1123 respectively, and the connecting groove 1151 is connected to the first wire hole 1121a and the second wire hole 1123a respectively. The main control signal line and the main control power line, which are electrically connected to the main control module 30 and the frequency conversion drive module 20 respectively, pass through the connecting groove 1151 and extend into the first sub-cavity 1011 and the second sub-cavity 1012 respectively to be electrically connected to the corresponding main control module 30 and frequency conversion drive module 20.

[0242] In some embodiments, the connecting groove 1151 of the connecting portion 115 is an open groove, and the opening of the connecting groove 1151 is formed on the surface of the second side of the cold plate body 111. The electronic control device 1 may also include a first sealing member 154, which enters and exits the connecting groove 1151 from the opening of the connecting groove 1151. When the first sealing member 154 is disposed in the connecting groove 1151, the first sealing member 154 seals the first wire hole 1121a and the second wire hole 1123a respectively. The first sealing member 154 is provided with a wire passage connecting the first sub-cavity 1011 and the second sub-cavity 1012, and the main control connection line passes through the wire passage. The connecting portion 115 may protrude from the surface of the first side of the cold plate body 111, and the depth of the connecting groove 1151 is increased by utilizing the space between the first enclosure plate 1121 and the third enclosure plate 1123. The connecting portion 115 is integrally disposed with the first enclosure plate 1121 and the second enclosure plate respectively.

[0243] In some embodiments, the electronic control device 1 further includes a central communication line, which is electrically connected to the main control board 31 and the central module respectively, for transmitting signals between the main control board 31 and the central module. Specifically, as shown... Figure 21As shown, the main control board 31 includes a main control base plate 311 and a fourth power component disposed on the main control base plate 311. The fourth power component includes at least one central interface 312. The central communication line is connected to the central module, and the central communication line extends into the second cavity 1013 through the area between the first enclosure plate 1121 and the third enclosure plate 1123, and is electrically connected to the central interface 312 on the main control board 31 to realize data exchange and control signal transmission, so that the central communication line is centrally managed, which facilitates wiring and maintenance.

[0244] In some embodiments, a wire groove 1152 is formed between the main control cavity 101b and the frequency conversion drive cavity 101a. The wire groove 1152 extends through the opposite sides of the main housing 11 along its extension direction (the third direction Z of the main housing 11), and the central communication line enters and exits the second cavity 1013 through the wire groove 1152.

[0245] Optionally, the third enclosure 1123 is spaced apart from the first enclosure 1121, and a wire passage groove 1152 is formed between the third enclosure 1123 and the first enclosure 1121. The third enclosure 1123 is provided with a wire passage opening 1123b that communicates with the second cavity 1013. The wire passage opening 1123b communicates with the wire passage groove 1152. The central communication line passes through the wire passage opening 1123b and the wire passage groove 1152 in sequence and is electrically connected to the central module.

[0246] In some embodiments, the fourth power component of the main control board 31 may further include an external communication interface 313, which is used to connect to an external communication line. The external communication line is electrically connected to an external device to realize signal transmission between the external device and the main control board 31. The external communication line may also enter and exit the second cavity 1013 through the cable opening 1123b, facilitating centralized management of the external communication line and the central communication line, and ensuring smooth cable routing.

[0247] In some embodiments, the electronic control device 1 further includes a main control seal 153, which is disposed at the wire passage opening 1123b and installed on the third enclosure 1123, and abuts against the central housing cover to seal the wire passage opening 1123b and prevent moisture, dust, and other debris from entering the second cavity 1013. The main control seal 153 is made of an elastic material, such as rubber or silicone, and can adapt to central communication lines and external communication lines of different thicknesses to achieve a good sealing effect.

[0248] In some embodiments, when the electronic control device 1 is applied to the outdoor unit 2 of the HVAC equipment, the first sub-cavity 1011 is located below the second cavity 1013, that is, the third enclosure 1123 is located above the first enclosure 1121. At this time, the wire passage opening 1123b is located at the lower part of the third enclosure 1123, reducing the probability of water vapor and dust entering the second cavity 1013 through the wire passage opening 1123b.

[0249] In some embodiments, in the thickness direction of the main housing 11, the cable tray 1152 and the connecting portion 115 are stacked. The connecting portion 115 has an opening on the side opposite to the cable tray 1152. The first sealing member 154 enters and exits the cable tray 1152 through the opening to seal the first cable hole 1121a, the second cable hole 1123a, and the cable tray 1152. When the electrical control device 1 is applied to the outdoor unit 2 of the HVAC equipment, the cable opening 1123b can be located on the front side of the connecting portion 115 to facilitate the installation and removal of the central communication cable and the external communication cable.

[0250] When the electrical control device 1 is applied to the outdoor unit 2 of the HVAC equipment, the power terminal block 61 can be set at the bottom of the main box 11, while the main control module 30 is located above. This allows the main control connection line of the frequency converter drive module 20, which is used to electrically connect to the main control module 30, to enter and exit the first sub-cavity 1011 from the top, while the part of the frequency converter drive module 20 used to electrically connect to the power terminal block 61 is located at the bottom. This top-bottom separation layout ensures that the high-voltage wiring of the power terminal block 61 will not cause signal interference to the main control module 30 located above, and the communication signal of the main control module 30 can remain stable. This ensures the normal operation of the control and communication functions of the entire electrical control box, improves the reliability and stability of the system, and makes the power connection operation more convenient. When wiring the power terminal block 61 and the main control module 30, the operator can more clearly identify and distinguish the two types of lines, preventing the two lines from being mixed up, reducing the possibility of wiring errors, improving wiring efficiency, and also facilitating subsequent maintenance and repair work.

[0251] In some embodiments, the power terminal block 61 is positioned facing the access port 200a of the outdoor unit 2, making it more convenient for maintenance personnel to perform wiring or maintenance operations. Maintenance personnel can directly access the power terminal block 61 from the access port 200a without having to reach into the electrical control box or turn away from the access port 200a, thereby reducing the difficulty and time of operation.

[0252] It should be noted that the side of the main box 11 with the power terminal 61 is defined as the front side of the control box, while the side away from the power terminal 61 is defined as the rear side of the control box. The control box can be vertically hung in the casing 200 of the outdoor unit 2 by a mounting plate on the back; or, a connecting bracket extending in the vertical direction along the main box 11 is provided in the casing 200, and the connecting bracket is connected to the connecting bracket by screws.

[0253] In some embodiments, the cold plate body 111 is provided with a mounting port 1113 communicating with the second sub-cavity 1012. The power connector 61 is installed at the mounting port 1113. In the second direction Y of the main box 11, the mounting port 1113 is located on the side of the first sub-cavity 1011 away from the second cavity 1013, making full use of the space of the main box 11 in the second direction Y, making the overall structure of the electrical control box more compact and saving space, which is particularly suitable for application scenarios with high space requirements. It also achieves electrical isolation between the power connector 61 and the drive board 21, reducing the risk of electrical short circuits. The power connector 61 is partially exposed on the side of the cold plate body 111 facing away from the second sub-cavity 1012, making the connection and disconnection of the power cord more convenient. Maintenance personnel can easily access the power connector 61 from the outside without disassembling the entire electrical control box, improving maintenance efficiency.

[0254] Furthermore, in the thickness direction H of the cold plate body 111, the first sub-cavity 1011 and the second sub-cavity 1012 are staggered, that is, the first sub-cavity 1011 and the second sub-cavity 1012 only partially overlap. The mounting port 1113 is set corresponding to the part of the second sub-cavity 1012 that does not overlap with the first sub-cavity 1011, and the mounting port 1113 penetrates the cold plate body 111 in the thickness direction H. The power connector 61 is located at the mounting port 1113, and part of the power connector 61 extends into the second sub-cavity 1012 and is electrically connected to the filter board 22, so that after the external power line is connected, the power signal is first filtered by the filter board 22, for example, to remove high-frequency noise and suppress harmonics, before being transmitted to the drive board 21 and the main control module 30. This layout reduces the wiring length of the power line in the control box and avoids interference of the power signal during transmission. The power terminal block 61 can provide a stable power input. By centrally managing the power cord through the power terminal block 61, the connection of the power cord is more standardized, reducing the messy situation of the power cord and improving the cleanliness of the inside of the electrical control box.

[0255] like Figure 22 As shown, when the projections of the first sub-cavity 1011 and the second sub-cavity 1012 along the thickness direction of the main box 11 overlap, in the second direction Y of the main box 11, the first sub-cavity 1011 has a first edge away from the second cavity 1013, and the second sub-cavity 1012 has a second edge away from the second cavity 1013, and the second edge is further away from the second cavity 1013 than the first edge. The mounting port 1113 is located between the first edge and the second edge, so that the mounting port 1113 directly penetrates the cold plate body 111 along the thickness direction of the main box 11, so that one end of the mounting hole communicates with the second sub-cavity 1012, and the other end of the mounting hole communicates with the outside of the main box 11.

[0256] In some embodiments, the electronic control device 1 further includes a terminal block sealing ring 613. The terminal block sealing ring 613 is disposed on the side of the cold plate body 111 facing the second sub-cavity 1012 and is arranged around the mounting opening 1113. The power terminal block 61 has a sealing groove, and a portion of the terminal block sealing ring 613 is embedded in the sealing groove and seals against the bottom wall of the limiting groove, effectively preventing liquids (such as water) and dust from entering the second sub-cavity 1012 and protecting the electronic components in the second sub-cavity 1012 from contamination and damage.

[0257] like Figure 23 As shown, the power terminal block 61 includes an insulating mounting base 611 and a power conductive post 612. The insulating mounting base 611 is connected to the cold plate body 111 and seals the mounting opening 1113. The main function of the insulating mounting base 611 is to provide electrical insulation to prevent accidental current flow between different conductive parts, thereby ensuring the safety and reliability of the power terminal block 61. The power conductive post 612 passes through the insulating mounting base 611, that is, the insulating mounting base 611 also plays the role of supporting and fixing the power conductive post 612, ensuring the stable installation of the power conductive post 612.

[0258] The power conductive post 612 extends along the thickness direction H of the cold plate body 111. One end of the power conductive post 612 extends into the second sub-cavity 1012 and connects to the filter plate 22. The power conductive post 612 is used to realize the electrical connection between the power line and the internal circuit of the control box (such as the filter plate 22). Specifically, the filter plate 22 has a third connection hole, and the side of the power conductive post 612 facing the filter plate 22 has a fourth connection hole. The third connection hole and the fourth connection hole are electrically connected by a connector, which can be a bolt, nut, washer, or other conductive connector. The other end of the power conductive post 612 is exposed on the surface of the second sub-cavity 1012 away from the insulating mounting base 611, which facilitates the connection of the external power line.

[0259] The insulating mounting base 611 can be made of polycarbonate (PC) material, which has good insulation properties and mechanical strength. The power conductive post 612 can be made of copper alloy material, which has good conductivity.

[0260] In some embodiments, the insulating mounting base 611 includes an insulating body 6111 and a connecting flange 6112 protruding from the outer wall of the insulating body 6111. A terminal block sealing ring 613 is fitted around the outer periphery of the insulating body 6111. The insulating body 6111 is the main body of the insulating mounting base 6111, mainly used to provide electrical insulation, prevent accidental current flow between different conductive parts, and ensure the safety and reliability of the power terminal block 61. The insulating body 6111 partially extends into the second sub-cavity 1012, and the power conductive post 612 passes through the insulating body 6111. The cold plate body 111 has a limiting groove surrounding the mounting opening 1113 on one side of the second sub-cavity 1012. The connecting flange 6112 is embedded in the limiting groove, i.e., the limiting groove is used to accommodate the connecting flange 6112 of the insulating base. The connecting flange 6112 achieves a stable connection between the insulating base and the heat dissipation structure. This design not only enhances the stability of the structure but also improves the reliability of installation through the embedded connection method.

[0261] In this embodiment of the application, in addition to sealing the openings such as the wiring opening 1123b and the mounting port 1113 that connect the main box 11 to the outside, it is also necessary to seal each heat dissipation cavity 101 so that the power module is in a relatively enclosed space.

[0262] In some embodiments, the four types of covers 120—the first cover 121, the second cover 122, the main control cover 123, and the central control cover—can each be independently and sealed to the heat dissipation enclosure 112 via a plug-in connection. Optionally, such as... Figure 24 As shown, the cover 120, which is sealed to the heat dissipation enclosure 112 by an insertion method, includes a main cover 1201, a cover flange 1202, and a transverse seal 151. The main cover 1201 and the cold plate body 111 are stacked together along the thickness direction H of the cold plate body 111. The main cover 1201 is connected to the end of the heat dissipation enclosure 112 away from the cold plate body 111. The cover flange 1202 is located on the main cover 1201, and both the cover flange 1202 and the transverse seal 151 are located within the space enclosed by the heat dissipation enclosure 112. The heat dissipation enclosure 112 has an inner peripheral wall surface. The transverse seal 151 contacts the wall surface of the cover flange 1202 and the inner peripheral wall surface of the heat dissipation enclosure 112 respectively to seal the gap between the cover flange 1202 and the heat dissipation enclosure 112.

[0263] When the first cover 121 is inserted into the first enclosure 1121, the first cover 121 includes a first main cover, a first cover flange, and a second sealing element 1200a; when the second cover 122 is inserted into the second enclosure, the second cover 122 includes a second main cover, a second cover flange, and a third sealing element 1200b; when the third cover 120 is inserted into the third enclosure 1123, the third cover 120 includes a third main cover, a third cover flange, and a fourth sealing element 1200c. The first, second, and third main covers can all be the main cover 1201 as described above; the first, second, and third cover flanges can all be the cover flange 1202 as described above; and the second, third, and fourth sealing elements 1200a, 1200b, and 1200c can be the transverse sealing element 151 as described above.

[0264] The transverse seal 151 includes a sealing body 1511 and a sealing lip 1512. The sealing body 1511 is installed on the cover flange 1202, and the sealing lip 1512 is located on the side of the sealing body 1511 facing the inner peripheral wall of the heat dissipation enclosure 112, and the sealing lip 1512 abuts against the inner peripheral wall of the heat dissipation enclosure 112.

[0265] The cover 120 is inserted into the heat dissipation enclosure 112 by moving relative to the heat dissipation enclosure 112 in an insertion direction parallel to the thickness direction H of the cold plate body 111. The cover flange 1202 and the transverse seal 151 are both located within the space enclosed by the heat dissipation enclosure 112. In the direction perpendicular to the thickness direction H of the cold plate body 111, the force exerted by the cover flange 1202 and the heat dissipation enclosure 112 on the transverse seal 151 is uniform. The transverse seal 151 does not need to be sandwiched between the main cover 1201 and the heat dissipation enclosure 112 in the thickness direction H of the cold plate body 111. This can prevent the problem of poor sealing caused by uneven force acting on the transverse seal 151, and enable the transverse seal 151 to maintain its sealing stability for a long time. Furthermore, even if there is a gap between the outer main cover 1201 and the heat dissipation plate 112, the inner transverse seal 151 can effectively seal the gap between the cover flange 1202 and the heat dissipation plate 112, thereby enabling the box cover 120 of this embodiment to achieve both easy disassembly and good sealing when installed on the box structure.

[0266] like Figure 24As shown, the sealing body 1511 has a first sealing side facing the inner peripheral wall of the heat dissipation enclosure 112. The sealing lip 1512 protrudes from the first sealing side. During the process of inserting the cover 120 into the heat dissipation enclosure 112, there is a gap between the sealing body 1511 and the inner peripheral wall of the heat dissipation enclosure 112, and the sealing lip 1512 abuts against the inner peripheral wall of the heat dissipation enclosure 112. After the cover 120 is inserted into the heat dissipation enclosure 112, the sealing lip 1512 and the inner peripheral wall of the heat dissipation enclosure 112 have a higher degree of fit, and the sealing lip 1512 can abut against the inner peripheral wall of the heat dissipation enclosure 112 more stably.

[0267] The sealing lip 1512 is angled to the first sealing side of the sealing body 1511. Optionally, the thickness of the sealing lip 1512 remains constant or gradually decreases from the sealing body 1511 toward the inner peripheral wall of the heat dissipation enclosure 112. The thickness of the sealing lip 1512 changes regularly, and the top of the sealing lip 1512 is prone to regular deformation to better abut against the inner peripheral wall of the heat dissipation enclosure 112. The sealing lip 1512 and the sealing body 1511 have good connection stability. Optionally, the top of the sealing lip 1512 is arc-shaped. When the sealing lip 1512 deforms and abuts against the inner peripheral wall of the heat dissipation enclosure 112, the area corresponding to the arc-shaped top surface of the sealing lip 1512 can abut against the inner peripheral wall of the heat dissipation enclosure 112 according to the degree of deformation, resulting in a high degree of fit and a better sealing effect.

[0268] In some embodiments, the sealing lip 1512 is inclined from the sealing body 1511 toward the side where the main cover 1201 is located. This facilitates the smooth deformation of the sealing lip 1512 under the action of the heat dissipation plate 112 during the insertion of the cover 120 into the heat dissipation plate 112. This prevents different degrees of deformation in different areas of the sealing lip 1512 around its circumference, which could lead to poor sealing. In this case, the sealing lip 1512 and the first sealing side of the sealing body 1511 are set at an acute angle. In addition, when the sealing lip 1512 abuts against the inner peripheral wall of the heat dissipation plate 112, the inclined sealing lip 1512 can also play a guiding role, guiding water vapor to the part where the sealing lip 1512 connects with the sealing body 1511, and preventing water vapor from flowing to the abutment point between the sealing lip 1512 and the heat dissipation plate 112.

[0269] In some embodiments, the main cover 1201 includes a cover body 120a and a cover flange 120b disposed around the outer periphery of the cover body 120a. A cover flange 1202 is disposed on the cover body 120a, and the surface of the cover flange 120b includes a first sealing contact surface. The heat dissipation enclosure 112 includes an enclosure body 112a, which has a first end and a second end. The first end is connected to the cold plate body 111, and the cover flange 1202 of the cover 120 is disposed within the space enclosed by the enclosure body 112a. The enclosure 112 also includes an enclosure flange 112b, which is flanged to the second end of the enclosure body 112a. The enclosure flange 112b is disposed along the outer periphery of the second end of the enclosure body 112a. The surface of the enclosure flange 112b includes a second sealing contact surface. The enclosure flange 112b and the cover flange 120b are stacked in the thickness direction H of the cold plate body 111. The first sealing contact surface and the second sealing contact surface are in contact to prevent moisture from entering the gap between the enclosure flange 112b and the cover flange 120b. Optionally, the first sealing contact surface and the second sealing contact surface are planes perpendicular to the thickness direction of the cold plate body 111.

[0270] In some embodiments, the cover flange 1202 has a sealing groove 102c, at least a portion of the sealing body 1511 is disposed within the sealing groove 102c, and the surface of the sealing body 1511 is in contact with the wall of the sealing groove 102c. The wall of the sealing groove 102c provides support for multiple walls of the sealing body 1511, preventing the sealing body 1511 from being moved by the sealing lip 1512, thereby maintaining good sealing stability of the sealing body 1511. Further, the sealing groove 102c extends to the first sealing abutment surface, and the surface of the sealing body 1511 is in contact with the first sealing abutment surface.

[0271] In some embodiments, the cover flange 120b is mounted on the surrounding flange 112b, and when the cover flange 120b is mounted on the surrounding flange 112b, the position of the entire cover 120 relative to the surrounding plate 112 is fixed. Optionally, as... Figure 25 As shown, the cover flange 120b has at least one first mounting portion 120b2, and the surrounding plate flange 112b has at least one second mounting portion 112b2. Each first mounting portion 120b2 and the corresponding second mounting portion 112b2 are correspondingly provided and fixedly installed. Each first mounting portion 120b2 and the corresponding second mounting portion 112b2 can be fixedly installed by screw fastening, snap-fitting, or other methods. This application embodiment does not limit the method of fixing the first mounting portion 120b2 and the second mounting portion 112b2. Any structure in the art that enables the cover 120 to be installed on the surrounding plate 112 is applicable to this application.

[0272] In this embodiment, the lid 120 and the surrounding plate 112 are assembled by insertion in a direction parallel to the thickness direction of the cold plate body 111. The sealing lip 1512 of the transverse sealing member 151 abuts against the inner peripheral wall of the surrounding plate body 112a in a direction perpendicular to the thickness direction of the cold plate body 111. The transverse sealing member 151 seals the gap between the cover flange 1202 and the surrounding plate body 112a, so that the abutment stability between the cover flange 1202, the surrounding plate body 112a and the transverse sealing member 151 is good. Therefore, a smaller number of first mounting parts 120b2 and second mounting parts 112b2 can be provided. It is only necessary to fix the cover flange 120b to the surrounding plate flange 112b to facilitate the assembly and disassembly of the lid 120 and the surrounding plate 112.

[0273] In some embodiments, the cover flange 120b has a first mounting portion 120b2, and the surrounding plate flange 112b has a second mounting portion 112b2. The first mounting portion 120b2 and the second mounting portion 112b2 are fixedly installed, and the cover 120 is fixedly installed on the surrounding plate 112 by setting the cover 120 and the surrounding plate 112 to be inserted into each other. For example, the depth of the cover flange 1202 inserted into the surrounding plate 112 is adjusted, and the surrounding plate body 112a is set to include two side walls arranged at an angle to prevent the cover 120 from rotating relative to the surrounding plate 112 about the central axis parallel to the thickness direction of the cold plate body 111. The cover 120 is fixedly installed on the surrounding plate 112 by fixing the first mounting portion 120b2 and the second mounting portion 112b2.

[0274] In some embodiments, the cover flange 120b has a plurality of first mounting portions 120b2, and the surrounding flange 112b has a plurality of second mounting portions 112b2. The surrounding flange 112b and the cover flange 120b may have a plurality of spaced regions, and at least one set of first mounting portions 120b2 and second mounting portions 112b2 may be provided in each region.

[0275] In some embodiments, the flange 112b of the enclosure and the flange 120b of the cover have two regions spaced apart in a direction perpendicular to the thickness direction of the cold plate body 111. At least one set of first mounting portions 120b2 and second mounting portions 112b2 are provided in each region. Multiple first mounting portions 120b2 and multiple second mounting portions 112b2 are respectively provided on the flanges 120b and the flange 112b of the cover 120a on opposite sides in a direction perpendicular to the first direction X. Optionally, the two spaced-apart regions are arranged opposite each other in the second direction Y. Specifically, in the second direction Y, a portion of the first mounting portions 120b2 and a portion of the second mounting portions 112b2 are provided on the flanges 120b and the flange 112b of the cover 120a on one side, and another portion of the first mounting portions 120b2 and another portion of the second mounting portions 112b2 are provided on the flanges 120b and the flange 112b of the cover 120a on the other side. Optionally, the two spaced areas are arranged opposite each other in the third direction Z. Specifically, in the third direction Z, a portion of the first mounting part 120b2 and a portion of the second mounting part 112b2 are provided on the cover flange 120b and the surrounding flange 112b on one side of the cover 120a, and another portion of the first mounting part 120b2 and the other portion of the second mounting part 112b2 are provided on the cover flange 120b and the surrounding flange 112b on the other side of the cover 120a.

[0276] In some embodiments, when the heat dissipation cavity 101 is formed by the enclosure of the cover 120 and the cold plate body 111, the cover 120 and the cold plate body 111 can also be sealed by a plug-in connection. For example, the second cover 122 includes a sub-cover and a third sealing member 1200b. The sub-cover has a receiving groove 122a'. The second side of the cold plate body 111 is provided with a guide flange 1104, which is disposed in the receiving groove 122a'. The third sealing member 1200b seals the bottom plate and the cold plate body 111. The gap between the sub-lids, wherein the structure of the guide flange 1104 is the same as that of the cover flange 1202, and the third sealing member 1200b can also be a transverse sealing member 151. The guide flange 1104 and the third sealing member 1200b extend together into the receiving groove 122a' of the sub-lid body 120a to be inserted into the sub-lid body 120a, and the third sealing member 1200b abuts against the wall of the receiving groove 122a', thereby achieving a sealed connection between the cold plate body 111 and the sub-lid body 120a. The above is only an illustrative description. The embodiments of this application do not limit the sealing method between the cold plate body 111 and the lid 120. Any method that can achieve a sealed connection in the art is applicable to this application.

[0277] In some other embodiments, the five types of covers 120, namely the first cover 121, the second cover 122, the central cover, the central cover, and the sub-cover, can be independently sealed to the heat dissipation enclosure 112 by potting glue.

[0278] Regarding the potting and sealing scheme, the four types of covers 120—first cover 121, second cover 122, main control cover 123, and central cover—can use the same potting scheme with their respective heat dissipation enclosures 112. Taking the first cover 121 and the first enclosure 1121 as examples, the potting and sealing schemes of these covers 120 with the heat dissipation enclosure 112 are described. Optionally, in the thickness direction H of the cold plate body 111, the cover flange of the first cover 121 and the enclosure flange 112b of the first enclosure 1121 are stacked, and at least one of the cover flange of the first cover 121 and the enclosure flange 112b of the first enclosure 1121 is provided with a potting groove, which is filled with sealant to seal the gap between the cover flange and the enclosure flange 112b.

[0279] Regarding the encapsulation sealing scheme for the sub-box cover, at least one of the surfaces of the second side of the cold plate body 111 and the surface of the sub-box cover facing the cold plate body 111 can be provided with an encapsulation groove in the thickness direction of the main box cover 120. The encapsulation groove is filled with sealant, and the gap between the surface of the second side of the cold plate body 111 and the sub-box cover is sealed by the sealant.

[0280] In this embodiment, the power components of the frequency converter drive module 20 generate relatively large amounts of heat during operation, the cavity containing the frequency converter drive module 20 requires a high level of airtightness, and the drive board 21 of the frequency converter drive module 20 may require maintenance. To address this, the drive board 21 of the frequency converter drive module 20 is positioned on the first side of the cold plate body 111, and the filter board 22 of the frequency converter drive module 20 is positioned on the second side of the cold plate body 111. Furthermore, a heat dissipation channel 1111 is formed inside the cold plate body 111, with at least a portion of the heat dissipation channel 1111 corresponding to the first enclosure plate 1. With the area enclosed by 121, a heat exchange medium is introduced into the heat dissipation channel 1111, and both sides of the cold plate body 111 can be used to receive heat. In the case that a heat dissipation enclosure 112 is also provided on at least one side of the main box body 11, the heat generated by the frequency converter drive module 20 can be dissipated efficiently, preventing the heat generated by the frequency converter drive module 20 from accumulating in the corresponding heat dissipation cavity 101. At the same time, it is also convenient to provide a high level of sealing for the cavity where the frequency converter drive module 20 is located, and to facilitate the disassembly, assembly and maintenance of the frequency converter drive module 20.

[0281] In some embodiments, the heat dissipation channel 1111 is only provided in the area defined by the first enclosure 1121, that is, the heat dissipation channel 1111 is only provided in the area of ​​the cold plate body 111 corresponding to the frequency conversion drive cavity 101a, while the area of ​​the cold plate body 111 corresponding to the main control cavity 101b is not provided with the heat dissipation channel 1111. Since the heat generation of the main control module 30 is lower than that of the frequency conversion drive module 20, in this embodiment, the heat dissipation of the main control module 30 is achieved through heat exchange of the heat exchanger flowing in the heat dissipation channel 1111 and the radiative heat dissipation of the cold plate body 111. Specifically, the heat dissipation channel 1111 transfers cold energy to the area of ​​the cold plate body 111 corresponding to the main control cavity 101b to radiate heat dissipation of the main control module 30. Moreover, the radiative heat dissipation method of the cold plate body 111 can, to a certain extent, avoid condensation on the surface of the main control module 2.

[0282] like Figure 26 As shown, the heat dissipation channel 1111 includes an inlet section 110a, an intermediate section 110b, and an outlet section 110c connected in sequence. The heat exchange medium enters the heat dissipation channel 1111 from the inlet section 110a, flows through the intermediate section 110b, and then flows out from the outlet section 110c, thereby carrying away the heat entering the cold plate body 111. The intermediate section 110b is the part of the heat dissipation channel 1111 mainly used to receive heat. Viewed from the thickness direction H of the cold plate body 111, at least a portion of the intermediate section 110b of the heat dissipation channel 1111 flows under at least a portion of the power components, so that the heat exchange medium in the heat dissipation channel 1111 can efficiently carry away the heat from the power components. When the intermediate flow section 110b is set in the area corresponding to the primary cavity, the liquid inlet section 110a and the liquid outlet section 110c are located outside the area enclosed by the heat dissipation plate 112 and at the edge of the cold plate body 111 so that the heat exchange medium can enter and exit the cold plate body 111.

[0283] In some embodiments, when viewed from the thickness direction H of the cold plate body 111, the middle flow section 110b of the heat dissipation channel 1111 is completely arranged corresponding to the area enclosed by the first enclosure plate 1121, and the middle flow section 110b of the heat dissipation channel 1111 is spaced apart from the third enclosure plate 1123. The liquid inlet section 110a and the liquid outlet section 110c are arranged corresponding to the outer periphery of the first enclosure plate 1121, so that the heat exchange medium enters and exits the middle flow section 110b below the first enclosure plate 1121. In some other embodiments, a portion of the intermediate flow section 110b of the heat dissipation channel 1111 corresponds to the area enclosed by the first enclosure plate 1121, and another portion corresponds to the area enclosed by the third enclosure plate 1123. The liquid inlet section 110a corresponds to the outer periphery of the third enclosure plate 1123, and the liquid outlet section 110c corresponds to the outer periphery of the first enclosure plate 1121. This allows the heat exchange medium to flow from the low-temperature region to the high-temperature region after entering the liquid inlet section 110a, thereby effectively dissipating heat.

[0284] The cold plate body 111 includes heat dissipation channels 1111, which are formed inside the cold plate body 111. Along the thickness direction H of the cold plate body 111, the heat dissipation channels 1111 are spaced apart from the support structure 114, the first connecting port 1114a, and the second connecting port 1114b, respectively, to facilitate the formation of the support structure 114, the first connecting port 1114a, the second connecting port 1114b, and the heat dissipation channels 1111. Furthermore, while avoiding these structures, the heat dissipation structure can be bent to increase the length of the heat dissipation channels 1111. In addition, viewed from the thickness direction H of the cold plate body 111, the heat dissipation channels 1111 undergo at least one reversal when flowing under the corresponding power element to increase the length of the heat dissipation channels 1111. Optionally, the greater the heat generated by the power element during operation, the more times the heat dissipation channels 1111 can be bent at the corresponding power element to meet the heat dissipation requirements of the high-heat-generating power element.

[0285] In some embodiments, the cold plate body 111 includes a cold plate substrate 1102 and a flow channel portion 1101. In the thickness direction H of the cold plate body 111, the flow channel portion 1101 protrudes relative to the cold plate substrate 1102 toward at least one side of the cold plate substrate 1102 to form a heat dissipation flow channel 1111 inside the flow channel portion 1101, forming a heat dissipation flow channel 1111 with a large flow area. The cross-sectional area of ​​the heat dissipation flow channel 1111 along the flow direction of the heat exchange medium in the heat dissipation flow channel 1111 is the flow area of ​​the heat dissipation flow channel 1111. The shape of the cross-section of the heat dissipation flow channel 1111 is not limited in the embodiments of this application, and can be selected according to actual needs. For example, the cross-sectional shape of the heat dissipation flow channel 1111 is circular, elliptical, etc.

[0286] In some embodiments, the flow channel portion 1101 protrudes from both sides of the cold plate substrate 1102 relative to the cold plate substrate 1102, so that the flow channel portion 1101 has a larger outer surface area, which helps to increase heat dissipation efficiency.

[0287] In some embodiments, the flow channel portion 1101 protrudes toward one side of the cold plate substrate 1102 relative to the cold plate substrate 1102. For example, the flow channel portion 1101 protrudes toward a first side of the cold plate body 111 relative to the cold plate substrate 1102, or the flow channel portion 1101 protrudes toward a second side of the cold plate body 111 relative to the cold plate substrate 1102.

[0288] Optionally, when the first side of the cold plate body 111 is provided with the fan drive module 2131 and the compressor drive module 2132 of the frequency converter drive module 20, and the second side of the cold plate body 111 is provided with the common mode inductor 222 and the reactor 23 of the frequency converter drive module 20, the size and weight of the fan drive module 2131 and the compressor drive module 2132 are relatively small, while the size of the common mode inductor 222 and the reactor 23 are relatively large and generate more heat. The flow channel portion 1101 protrudes from the first side of the cold plate body 111 relative to the cold plate substrate 1102, and the size of the first side of the cold plate body 111 that is not covered by the power components is relatively larger, which facilitates increasing the outer surface area of ​​the flow channel portion 1101. The surface of the second side of the cold plate body 111 is flat, so that the surface of the second side of the cold plate body 111 has a better fit with the common mode inductor 222 and the reactor 23, respectively, improving the heat transfer rate and providing more stable support for the common mode inductor 222 and the reactor 23.

[0289] In some embodiments, a boss 1103 is formed on the flow channel portion 1101 of the cold plate body 111. A heat-conducting surface is formed on the surface of the boss 1103. A primary power element is attached to the heat-conducting surface, and the shape of the heat-conducting surface is adapted to the surface of the primary power element, so that the primary power element and the heat-conducting surface have good fit and improve heat transfer efficiency. In the thickness direction H of the cold plate body 111, the height of the boss 1103 is greater than or equal to the height of the other portion of the flow channel portion 1101 where no boss 1103 is provided, so as to maintain the integrity of the shape of the heat dissipation flow channel 1111 below the boss 1103 and allow the heat exchange medium to flow smoothly in the heat dissipation flow channel 1111. In addition, the height of the boss 1103 can be adjusted according to the height of the primary power element relative to the cold plate base, and the boss 1103 provides support for the primary power element, thereby improving the installation stability of the primary power element. Optionally, when the flow channel portion 1101 protrudes towards the first side of the cold plate body 111 relative to the cold plate substrate 1102, the flow channel portion 1101 may be provided with a plurality of protrusions 1103, the plurality of protrusions 1103 including a first protrusion 1103a and a second protrusion 1103b, the first protrusion 1103a being provided corresponding to the fan drive module 2131, and the second protrusion 1103b being provided corresponding to the compressor drive module 2132.

[0290] In some embodiments, the electronic control device 1 further includes a thermally conductive layer filled between the primary power element and the surface of the cold plate body 111. The primary power element is bonded to the surface of the cold plate body 111 through the thermally conductive layer to improve heat transfer efficiency. Optionally, the thermally conductive layer is a thermally conductive adhesive layer or a thermally conductive coating layer. Optionally, the fan drive module 2131, the compressor drive module 2132, the common mode inductor 222, and the reactance 23 are bonded to the surface of the cold plate body 111 through thermally conductive adhesive layers or thermally conductive coating layers, respectively. This application does not limit the material of the thermally conductive adhesive layer; any material that can be used as a thermally conductive adhesive layer in the art is applicable to this application.

[0291] In some embodiments, a heat dissipation channel 1111 is directly formed inside the flow channel portion 1101 of the cold plate body 111. The cold plate substrate 1102 and the flow channel portion 1101 are integrally die-cast, and the heat dissipation channel 1111 is formed inside the flow channel portion 1101 during the die-casting process. Alternatively, the cold plate substrate 1102 and the flow channel portion 1101 can also be integrally stamped, and the flow channel portion 1101 with the heat dissipation channel 1111 is formed by stamping.

[0292] In some embodiments, the cold plate body 111 further includes a flow channel tube, and a heat dissipation flow channel 1111 is formed inside the flow channel section 1101. The cold plate body 111 may include two substrates, with the flow channel tube sandwiched between them. The two substrates are formed into the flow channel section 1101 and the cold plate substrate 1102 by die casting.

[0293] When the cold plate body 111 and the heat dissipation enclosure 112 are integrally formed, specifically the cold plate substrate 1102 and the heat dissipation enclosure 112 are integrally formed. The heat dissipation enclosure 112 and the cold plate substrate 1102 can be integrally die-cast. For example, all of the multiple heat dissipation enclosures 112 are provided on one side of the cold plate body 111, and each heat dissipation enclosure 112 is integrally die-cast with the cold plate substrate 1102. Alternatively, the multiple heat dissipation enclosures 112 are provided on both sides of the cold plate body 111, and each heat dissipation enclosure 112 is integrally die-cast with the cold plate substrate 1102.

[0294] In some embodiments, the first enclosure 1121, the second enclosure and the third enclosure 1123 of the main box 11 can each be a cold plate independently, each having a heat dissipation effect, combined with the cold plate body 111 to improve the heat dissipation efficiency of the main box 11.

[0295] In this embodiment, both the cold plate body 111 and the heat dissipation enclosure 112 are metal structural components, resulting in a high heat transfer rate between them. The materials of the cold plate body 111 and the heat dissipation enclosure 112 can be the same or different. Regarding the materials of the cold plate body 111 and the heat dissipation enclosure 112, any material in the art capable of heat dissipation and supporting multiple power modules is applicable. For example, the materials of the cold plate body 111 and the heat dissipation enclosure 112 can be independently selected from aluminum, aluminum alloy, or copper, etc.

[0296] In some embodiments, the heat dissipation enclosure 112 may include only the enclosure body 112a and the enclosure flange 112b. The enclosure body 112a is connected to the cold plate body 111, and the enclosure flange 112b is connected to the end of the enclosure body 112a away from the cold plate body 111 and surrounds the periphery of the enclosure body 112a. The enclosure body 112a is inserted and fitted with the cover 120 to achieve a seal, and the cover 120 is fixedly installed on the enclosure flange 112b.

[0297] In some other embodiments, in addition to the main body 112a and the flange 112b, the heat dissipation enclosure 112 may also include a plurality of auxiliary heat dissipation fins. The plurality of auxiliary heat dissipation fins are connected to the outer surface of the main body 112a and are heat dissipation arranged with the main body 112a to improve heat dissipation efficiency.

[0298] In some other embodiments, in addition to the main body 112a and the flange 112b, the heat dissipation enclosure 112 may also include at least one auxiliary heat dissipation pipe (not shown in the figure). A heat exchange medium is introduced into the auxiliary heat dissipation pipe. The auxiliary heat dissipation pipe is installed on the outer or inner surface of the main body 112a. Each auxiliary heat dissipation pipe is bent and reversed at least once to increase its length, thereby increasing the heat dissipation efficiency of the entire heat dissipation enclosure 112.

[0299] In this embodiment, the outer contour shape of the heat dissipation enclosure 112 can be selected according to the arrangement of the power components. Taking the first enclosure 1121 as an example, the outer contour of the driving substrate 211 of the driving board 21 is approximately square. If there is one driving board 21, the outer contour shape of the first enclosure 1121 can be square, rounded square, etc. If there are two driving boards 21 and they are arranged at intervals on the same plane, the first enclosure 1121 surrounds all the driving boards 21, and the outer contour shape of the first enclosure 1121 can be rectangular, rounded rectangle, etc. When there are two driving boards 21, and the two driving boards 21 have different lengths and are arranged side by side in the width direction, the two driving boards 21 are spliced ​​to form an L-shaped contour. The first enclosure 1121 surrounds all the driving boards 21, and the outer contour shape of the first enclosure 1121 can be L-shaped to save the material usage of the first enclosure 1121 and reduce the space occupied by the first enclosure 1121.

[0300] The heat dissipation enclosure 112 acts as an outer layer to block moisture, and it has a certain height. Moisture outside the main housing 11 can flow along the outer surface of the heat dissipation enclosure 112. The shape of the outer surface of the heat dissipation enclosure 112 can be adjusted to guide the flow of moisture outside the main housing 11. In some embodiments, the outer peripheral wall of the heat dissipation enclosure 112 includes a first heat dissipation surface and a second heat dissipation surface. The first and second heat dissipation surfaces are arranged opposite each other in a direction perpendicular to the thickness direction of the cold plate body 111. When the electrical control device 1 is installed in the HVAC equipment, the first heat dissipation surface is located above the second heat dissipation surface. At least a portion of the first heat dissipation surface is an inclined plane relative to the horizontal plane. Guided by the first heat dissipation surface, moisture outside the main housing 11 can be guided to flow below the heat dissipation enclosure 112, preventing moisture accumulation and entry into the primary cavity.

[0301] In some embodiments, such as Figure 27 As shown, the outer peripheral wall of the enclosure body 112a includes a first heat dissipation surface and a second heat dissipation surface, and under the obstruction of the enclosure flange 112b, it can more effectively prevent water vapor outside the main box 11 from flowing into the primary cavity along the outer surface of the heat dissipation enclosure 112.

[0302] Optionally, the main body 112a of the enclosure includes a first heat dissipation wall, a second heat dissipation wall, and two heat dissipation sidewalls. The outer surface of the first heat dissipation wall is a first heat dissipation surface, and the outer surface of the second heat dissipation wall is a second heat dissipation surface. The two heat dissipation sidewalls are disposed between the first and second heat dissipation walls and are spaced apart. Any two adjacent heat dissipation walls are arranged at an included angle. The cover 120 is inserted into the space enclosed by the first, second, and two heat dissipation sidewalls. When the main body 11 has one mounting sidewall 112a1, one of the two heat dissipation sidewalls forms the mounting sidewall 112a1. When the main body 11 has two mounting sidewalls 112a1, the two heat dissipation sidewalls respectively form two mounting sidewalls 112a1.

[0303] Optionally, the inner and outer surfaces of the first heat dissipation wall are designed to be similar in shape, and the part of the cover 120 that is inserted into the heat dissipation enclosure 112 is similar in shape to the inner peripheral wall of the heat dissipation enclosure 112. This allows for a foolproof design of the cover 120, improving the installation stability of the cover 120 and the assembly efficiency of the cover 120.

[0304] For example, the outer peripheral walls of the first enclosure 1121, the second enclosure, and the third enclosure 1123 of the main box 11 can all be walls with a first heat dissipation surface and a second heat dissipation surface. When the main box 11 has both the first enclosure 1121 and the third enclosure 1123, and both the first enclosure 1121 and the third enclosure 1123 are located on the first side of the cold plate body 111, the first heat dissipation surface of the first enclosure 1121 faces the third enclosure 1123, and the first heat dissipation surface of the third enclosure 1123 faces away from the first enclosure 1121. When the electrical control device 1 is applied to the outdoor unit 2 of the HVAC equipment, the third enclosure 1123 is located above the first enclosure 1121. The first heat dissipation surfaces of both the first enclosure 1121 and the third enclosure 1123 can guide the water vapor outside the main box 11 to flow downwards, and can provide a foolproof design for the corresponding first box cover 121 and central box cover, facilitating assembly.

[0305] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0306] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. An electronic control device, characterized in that, The electronic control device includes: The main box body has a first cavity and a second cavity. The thickness direction of the main box body is a first direction, and the first cavity and the second cavity are arranged in the first direction. A power module includes a frequency converter drive module, the frequency converter drive module includes a filter board and at least one drive board, the drive board is disposed in the first cavity, and the filter board is disposed in the second cavity; The driving board includes a driving substrate and at least one first power component mounted on the driving substrate. The first power component includes a chip unit, a driving unit, and an interface unit. The driving substrate has a first side facing the opening of the first cavity and a second side away from the opening of the first cavity. The chip unit and the interface unit are mounted on the first side of the driving substrate, and the driving unit is mounted on the second side of the driving substrate.

2. The electronic control device according to claim 1, characterized in that, The filter board includes a filter substrate and at least one second power component mounted on the drive substrate. The filter substrate is parallel to the drive substrate. In the first direction, the drive substrate and the filter substrate are spaced apart. At least a portion of the second power component is located on the side of the filter substrate facing away from the second cavity opening.

3. The electronic control device according to claim 2, characterized in that, The main housing includes a cold plate body, the first cavity and the second cavity are respectively disposed on opposite sides of the cold plate body, the second power component includes a common mode inductor, and the drive unit and the common mode inductor are respectively attached to the cold plate body.

4. The electronic control device according to claim 3, characterized in that, The filter substrate is a circuit board mounted on one side, and all the second power components are located on the side of the filter substrate facing away from the opening of the second cavity.

5. The electronic control device according to claim 4, characterized in that, The second power component further includes at least one of a varistor, a differential-mode capacitor, and a common-mode capacitor, wherein the varistor, differential-mode capacitor, and common-mode capacitor are spaced apart from the cold plate body.

6. The electronic control device according to any one of claims 3-5, characterized in that, The electronic control device further includes at least one first power connection structure. The cold plate body has at least one first communication port, which is connected to the first cavity and the second cavity respectively. The first power connection structure passes through the first communication port and is electrically connected to the driving substrate and the filter substrate at both ends respectively.

7. The electronic control device according to claim 6, characterized in that, The first power connection structure includes a first insulating base and a first power connection post, wherein the first power connection post is mounted on the first insulating base; The first insulating seat passes through the first communication port and is installed on the cold plate body, and its two ends are respectively used to support the driving substrate and the filter substrate; The first electrical contact post passes through the first communication port, and its two ends are electrically connected to the driving substrate and the filter substrate, respectively.

8. The electronic control device according to claim 7, characterized in that, The first power connection structure has a first connection hole and a second connection hole respectively provided at both ends of the power connection post; The driving substrate has a first power connection hole, and the first power connection hole and the first connection hole are electrically connected by a connector; The filter substrate has a second power contact hole, and the second power contact hole and the second connection hole are electrically connected by a connector.

9. The electronic control device according to claim 8, characterized in that, The main box body also includes a first support column and a second support column, with the first support column located in the first cavity and the second support column located in the second cavity; The first support column is used to support the driving base plate, and the driving base plate is detachably mounted on the first support column; The second support column is used to support the filter substrate, and the filter substrate is detachably mounted on the second support column.

10. The electronic control device according to claim 3, characterized in that, The variable frequency drive module includes a third power component, which is disposed in the second cavity and attached to the cold plate body; The third power component is located outside the filter plate and is spaced apart from the filter plate.

11. The electronic control device according to claim 10, characterized in that, The third power component includes at least one reactance; The electronic control device further includes at least one second power connection structure. The cold plate body has at least one second communication port, which is connected to the first cavity and the second cavity respectively. The second power connection structure is disposed at the second communication port and installed on the cold plate body, and the second power connection structure is electrically connected to the drive substrate and the reactor respectively.

12. The electronic control device according to claim 11, characterized in that, The second electrical connection structure includes a second insulating base and a second electrical connection post, wherein the second electrical connection post is mounted on the second insulating base; The second insulating base is installed on the cold plate body, the second electrical terminal is inserted through the second communication port, and its two ends are electrically connected to the driving substrate and the reactor, respectively.

13. The electronic control device according to claim 1, characterized in that, The drive unit includes a fan drive module and a compressor drive module, the fan drive module and the compressor drive module being spaced apart along a second direction perpendicular to the thickness direction of the main housing; and / or, The chip unit includes a fan drive chip and a compressor drive chip, the fan drive chip and the compressor drive chip being spaced apart along the second direction; and / or The interface unit is disposed along the edge of the drive substrate, and the interface unit includes a fan interface and a communication interface.

14. The electronic control device according to claim 13, characterized in that, The main housing includes a mounting sidewall, the drive substrate has a first substrate edge and a second substrate edge connected at an angle, and the second substrate edge is disposed toward the mounting sidewall, the drive substrate includes a corner mounting area sandwiched between the first substrate edge and the second substrate edge, and the fan interface and the communication interface are disposed in the corner mounting area; The fan interface is located at the edge of the first substrate, and the communication interface is located at the edge of the second substrate.

15. The electronic control device according to claim 14, characterized in that, The first power component further includes a module power supply, which is mounted on the driving substrate in a region adjacent to the edge of the first substrate.

16. The electronic control device according to claim 13, characterized in that, The main housing includes a mounting sidewall disposed opposite to the driving substrate in a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other; The main housing includes a fan wiring section and a compressor wiring section, which are spaced apart on the same mounting side wall of the main housing.

17. The electronic control device according to claim 16, characterized in that, In the third direction, the fan wiring section is correspondingly arranged with the mounting area of ​​the drive substrate on which the fan drive chip and the fan drive module are installed; In the third direction, the compressor wiring section is correspondingly arranged with the mounting area of ​​the drive substrate on which the compressor drive chip and the compressor drive module are installed.

18. The electronic control device according to claim 17, characterized in that, The wind turbine drive chip and the wind turbine drive module are at least partially overlapped in the first direction and are disposed in the region of the drive substrate near the mounting sidewall; The compressor drive chip and the compressor drive module are at least partially overlapped in the first direction and are disposed in the region of the drive substrate near the mounting sidewall.

19. The electronic control device according to claim 18, characterized in that, The electronic control device also includes multiple compressor wires, one end of each compressor wire passing through the inside of the compressor wiring section, and the other end of the compressor wiring is located on the second side of the drive base plate and electrically connected to the compressor drive module.

20. The electronic control device according to claim 17, characterized in that, The first power component further includes a thin-film capacitor and an electrolytic capacitor, which are spaced apart along the second direction and disposed in the region of the drive substrate away from the mounting sidewall.

21. The electronic control device according to claim 6, characterized in that, The electronic control device includes two drive boards and two first power connection structures; The two drive plates are spaced apart along a second direction perpendicular to the thickness direction; The cold plate body is provided with two first communication ports, which are arranged adjacent to each other in the middle of the cold plate body. The two first electrical connection structures are respectively provided through the two first communication ports. One end of each of the two first electrical connection structures is electrically connected to the corresponding driving substrate, and the other end is electrically connected to the filter substrate.

22. The electronic control device according to claim 21, characterized in that, The two drive boards are arranged symmetrically at the center; and / or, The two first electrical connection structures are arranged symmetrically at the center.

23. The electronic control device according to any one of claims 3-22, characterized in that, The main box body includes a first surrounding panel and a first box lid. In the thickness direction of the main box body, the first surrounding panel protrudes from the cold plate body and is integrally formed with the cold plate body. The first enclosure and the cold plate body together form a first cavity, and the first box cover is connected to the first enclosure to seal the opening of the first cavity.

24. The electronic control device according to claim 23, characterized in that, The main box body includes a second box cover, and the second box cover and the first box cover are respectively disposed on opposite sides of the cold plate body in the thickness direction of the main box body; The second lid is installed on the cold plate body, and the second lid is sealed to the cold plate body and encloses it to form the second cavity; or, The main box body also includes a second enclosure plate. In the thickness direction of the main box body, the second enclosure plate protrudes from the cold plate body and is integrally formed with the cold plate body. The cold plate body and the second enclosure plate enclose a second cavity. The second box cover is connected to the second enclosure plate to seal the opening of the second cavity.

25. A heating, ventilation, and air conditioning (HVAC) device, characterized in that, It includes a housing and an electronic control device as described in any one of claims 1 to 24, wherein the electronic control device is disposed within the housing.

26. The HVAC equipment as described in claim 25, characterized in that, The housing is provided with an inspection port; the electronic control device is located at the inspection port, wherein the opening of the first cavity faces the inspection port.

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