Heat dissipation control method, storage medium, electronic device, and computer program product

Abstract

The embodiment of the application provides a heat dissipation control method, a storage medium, an electronic device and a computer program product, the method is applied to a liquid cooling system, the liquid cooling system comprises a liquid cooling device and cooling liquid, the liquid cooling device comprises a heat dissipation assembly, and the method comprises the following steps: controlling the cooling liquid entering the liquid cooling device, flowing through the heat dissipation assembly and a liquid cooling server node located in the inner cavity of the liquid cooling device, and flowing out of the liquid cooling device; acquiring a first temperature of a first device and a second temperature of a second device in the liquid cooling server node; and controlling the opening degree of the heat dissipation assembly according to the first temperature or the second temperature, so as to control the flow of the cooling liquid entering the liquid cooling device to the first device and the flow to the second device, thereby meeting the heat dissipation requirements of different power consumption devices, solving the problem that, in the related art, the heat dissipation requirements of high-power consumption devices in the liquid cooling system cannot be effectively responded to, and reducing the PUE index of the liquid cooling system.

Description

Technical Field

[0001] This application relates to the field of communications, and more specifically, to a heat dissipation control method, a storage medium, an electronic device, and a computer program product. Background Technology

[0002] With the rapid development of information technology, the power consumption and heat generation of computing platforms continue to increase, and traditional air cooling methods can no longer fully meet the heat dissipation needs of large data centers. To solve the heat dissipation problem of big data centers, liquid cooling technology has emerged. Liquid cooling technology transfers heat directly from the heat source to the coolant by circulating coolant within the liquid-cooled server nodes. The heat is then transferred from the heat source to external cooling equipment through the circulation of the coolant, achieving efficient heat dissipation. Compared to air cooling, liquid cooling technology has advantages such as high heat dissipation efficiency, large heat dissipation capacity, uniform heat distribution, and strong temperature control capabilities. Therefore, liquid cooling technology has been widely used in data centers.

[0003] Currently, the average flow rate of the coolant inside a single-phase immersion liquid cooling system is low, resulting in insufficient heat transfer coefficient. With the continuous increase of high-power devices, this system cannot meet the heat dissipation requirements. Summary of the Invention

[0004] This application provides a heat dissipation control method, a storage medium, an electronic device, and a computer program product to at least solve the problem in the related art that it is impossible to effectively cope with the heat dissipation requirements of high-power devices in liquid cooling systems.

[0005] According to one embodiment of this application, a heat dissipation control method is provided, applied to a liquid cooling system, the liquid cooling system including a liquid cooling device and a coolant, the liquid cooling device including a heat dissipation component, the method comprising:

[0006] The coolant entering the liquid cooling device is controlled to flow through the heat dissipation assembly and the liquid-cooled server node located inside the liquid cooling device, and to flow out of the liquid cooling device; a first temperature of a first device and a second temperature of a second device in the liquid-cooled server node are obtained; based on the first temperature or the second temperature, the opening degree of the heat dissipation assembly is controlled to control the flow rate of the coolant entering the liquid cooling device to the first device and the flow rate to the second device.

[0007] According to yet another embodiment of this application, a computer-readable storage medium is also provided, wherein a computer program is stored therein, and the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0008] According to yet another embodiment of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0009] According to yet another embodiment of this application, a computer program product is also provided, including a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0010] In this embodiment, by controlling the coolant entering the liquid cooling device, flowing through the heat dissipation components and the liquid-cooled server node located in the inner cavity of the liquid cooling device, and flowing out of the liquid cooling device; obtaining the first temperature of the first device and the second temperature of the second device in the liquid-cooled server node; and controlling the opening degree of the heat dissipation components according to the first temperature or the second temperature, the flow rate of the coolant entering the liquid cooling device to the first device and the flow rate to the second device can be controlled, thereby meeting the heat dissipation requirements of devices with different power consumption, solving the problem in related technologies that cannot effectively cope with the heat dissipation requirements of high-power devices in liquid cooling systems, and reducing the PUE index of the liquid cooling system. Attached Figure Description

[0011] Figure 1 This is a hardware structure block diagram of the computer terminal used in the method embodiments of this application;

[0012] Figure 2 This is a liquid cooling system architecture diagram according to an embodiment of this application;

[0013] Figure 3 This is a flowchart of a heat dissipation control method according to an embodiment of this application;

[0014] Figure 4 This is a structural diagram of a liquid cooling device according to an embodiment of this application;

[0015] Figure 5 This is a structural diagram of another liquid cooling device according to an embodiment of this application;

[0016] Figure 6 This is a structural block diagram of an electronic device according to an embodiment of this application. Detailed Implementation

[0017] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0018] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0019] Currently, in single-phase immersion liquid cooling systems, the tank cavity is filled with an insulating working fluid, and the server nodes (such as IT equipment) to be cooled are completely immersed in it. The average flow rate of the coolant is low, resulting in a low heat flux density, which cannot meet the requirements of high-power chips. Coolants typically use two types: non-conductive fluorocarbon and oil-based. Compared to fluorocarbon coolants, oil-based coolants have higher viscosity, lower volatility, and longer maintenance intervals. Conventional single-phase immersion liquid cooling systems eliminate the need for fans and other heat dissipation enhancements for internal nodes. However, with the increasing number of high heat flux density devices, this approach cannot meet the cooling demands. When the power consumption of some components in the server node changes, the flow rate of the centralized liquid supply system needs to be adjusted. For example, when some components overheat, the flow rate is increased, leading to wasted flow and an increase in the power efficiency (PUE) index.

[0020] The current single-phase immersion liquid cooling system presents the following problems regarding power consumption variations and maintainability of internal components in server nodes requiring cooling:

[0021] 1) The TANK has a large internal cavity and a low average flow rate of coolant, resulting in a low heat transfer coefficient, which cannot meet the heat dissipation requirements of high-power chips.

[0022] 2) When the power consumption of different devices in the server node to be cooled changes, it is necessary to increase the flow rate of the centralized liquid supply system and the external cold source, resulting in a high PUE index of the liquid cooling system.

[0023] 3) Single-phase immersion liquid cooling systems typically use oil-based working fluids. These working fluids have high viscosity and low volatility. When the equipment is pulled out of the liquid cooling tank during maintenance, the coolant drains slowly under gravity, which prolongs the preparation time before maintenance, affects maintenance efficiency and system uptime, and results in poor maintainability.

[0024] To address the aforementioned technical problems, this application proposes a heat dissipation control method. The technical concept involves installing a heat dissipation component in a liquid cooling system and monitoring the temperature of different power consumption devices in the server node to be cooled (i.e., the liquid-cooled server node). Based on the temperature of different power consumption devices, the flow rate of coolant entering the liquid cooling system and directed to these devices is adjusted via the heat dissipation component. This satisfies the heat dissipation requirements of different power consumption devices. For example, for high-power devices with high heat dissipation requirements, the opening of the heat dissipation component relative to the high-power device can be increased to increase the flow rate of coolant entering the liquid cooling system and thus meet the high heat dissipation requirements of the high-power device. This solves the problem in related technologies that cannot effectively address the heat dissipation requirements of high-power devices in liquid cooling systems, reducing the PUE (Power Usage Effectiveness) index of the liquid cooling system. Furthermore, when equipment maintenance is required, changing the opening of the heat dissipation component allows the coolant to flow down the equipment surface more quickly, reducing the time required for the coolant to completely drain.

[0025] The methods and embodiments provided in this application can be executed on a mobile terminal, a computer terminal, or a similar computing device. Taking running on a computer terminal as an example, Figure 1 This is a hardware structure block diagram of the computer terminal used in the embodiments of the method of this application. For example... Figure 1 As shown, a computer terminal may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microprocessor MCU or a programmable logic device FPGA, etc.) and a memory 104 for storing data are also shown. The computer terminal may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the computer terminal described above. For example, the computer terminal may also include components that are more complex than those described above. Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0026] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the heat dissipation control method in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thus implementing the aforementioned method. The memory 104 may include high-speed random access memory and non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to a computer terminal via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0027] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider for the computer terminal. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0028] Figure 2 This is a liquid cooling system architecture diagram according to an embodiment of this application. This embodiment of the application can operate in... Figure 2 In the system architecture shown, such as Figure 2As shown, the system architecture may include:

[0029] 100-External cooling towers utilize the principle of heat exchange between water and air to generate steam. The steam evaporates and carries away heat, achieving heat transfer from the liquid cooling system to the air through evaporative heat dissipation, convective heat transfer, and radiative heat transfer.

[0030] 200- Cooling water pump, which provides power to the primary side coolant of the liquid cooling system, can be a single pump or a dual-pump redundant design;

[0031] 300 - Pipeline, used to connect external cooling tower 100, cooling water pump 200, centralized liquid supply system 400 and liquid cooling equipment 600, providing a path for the circulation of coolant in the liquid cooling system; pipeline 300 may include a supply pipeline and a return pipeline, the coolant stored in external cooling tower 100 can be transported from the supply pipeline to liquid cooling equipment 600, and then from liquid cooling equipment 600 to external cooling tower 100 via the return pipeline; wherein, cooling water pump 200 can be installed on pipeline 300, installed on the supply pipeline near the outlet of external cooling tower 100;

[0032] The 400-Centralized liquid supply system can be installed between the external cooling tower 100 and the liquid cooling equipment 600. It is connected to the external cooling tower 100 and the liquid cooling equipment 600 respectively through the pipeline 300, providing the liquid cooling system with coolant of a certain temperature and flow parameters, and can be stably adjusted.

[0033] 500-Liquid-cooled server nodes, i.e. devices to be cooled, can include high-power devices and low-power devices;

[0034] The 600-liquid cooling device has an inner cavity filled with coolant. The liquid-cooled server node 500 can be immersed in the coolant inside the liquid cooling device 600 to provide a heat dissipation space for the liquid-cooled server node 500.

[0035] Various sensors can also be installed on the pipe 300 to monitor the state of the coolant in the pipe:

[0036] 301 - The pressure sensor after the cooling water pump can be installed on the liquid supply line between the cooling water pump 200 and the liquid cooling equipment 600 to monitor the pump outlet pressure. If the liquid cooling system is equipped with a backup cooling water pump for the cooling water pump 200, that is, when there are multiple cooling water pumps 200, a pressure sensor can be installed after each cooling water pump.

[0037] 302 - Primary side liquid supply flow sensor, which can be installed on the liquid supply pipeline between the cooling water pump 200 and the liquid cooling equipment 600 to monitor the primary side liquid supply flow. For example, it can be installed on the liquid supply pipeline between the cooling water pump downstream pressure sensor 301 and the liquid cooling equipment 600.

[0038] 303 - Primary side liquid supply temperature sensor, which can be installed on the liquid supply pipeline between the cooling water pump 200 and the liquid cooling equipment 600, for monitoring the primary side liquid supply temperature. For example, it can be installed on the liquid supply pipeline between the primary side liquid supply flow sensor 302 and the liquid cooling equipment 600.

[0039] The 304-primary side return liquid pressure sensor can be installed on the return liquid pipeline near the inlet of the external cooling tower 100 to monitor the primary side return liquid pressure;

[0040] 305 - Primary side return liquid temperature sensor, which can be installed on the return liquid pipeline near the inlet of the external cooling tower 100 to monitor the primary side return liquid temperature. For example, it can be installed on the return liquid pipeline between the primary side return liquid pressure sensor 304 and the liquid cooling equipment 600.

[0041] 306 - Equipment liquid supply pressure sensor, can be installed between the centralized liquid supply system and the liquid cooling equipment 600, on the liquid supply pipeline near the inlet of the liquid cooling equipment 600, to monitor the inlet pressure of the liquid cooling equipment, and can be designed with redundancy;

[0042] 307 - Equipment liquid supply flow sensor, which can be installed on the liquid supply pipeline near the inlet of the liquid cooling equipment 600 between the centralized liquid supply system and the liquid cooling equipment 600, to monitor the inlet flow of the liquid cooling equipment. For example, it can be installed on the liquid supply pipeline between the equipment liquid supply pressure sensor 306 and the liquid cooling equipment 600.

[0043] 308 - Equipment liquid supply temperature sensor, can be set on the liquid supply pipeline near the inlet of the liquid cooling equipment 600 between the centralized liquid supply system and the liquid cooling equipment 600, to monitor the liquid supply temperature of the liquid cooling equipment. Redundancy design is possible. For example, it can be set on the liquid supply pipeline between the equipment liquid supply flow sensor 307 and the liquid cooling equipment 600.

[0044] 309 - Equipment return liquid pressure sensor, which can be installed on the return liquid pipeline between the centralized liquid supply system and the liquid cooling equipment 600, near the outlet of the liquid cooling equipment 600, to monitor the outlet pressure of the liquid cooling equipment. Redundancy design is possible.

[0045] 310 - Equipment return liquid temperature sensor, can be installed on the return liquid pipeline near the outlet of the liquid cooling equipment 600 between the centralized liquid supply system and the liquid cooling equipment 600, to monitor the return liquid temperature of the equipment subsystem. For example, it can be installed on the return liquid pipeline between the equipment return liquid temperature sensor 310 and the liquid cooling equipment 600.

[0046] In this embodiment of the application, the liquid cooling system may also be equipped with a controller / control module / control unit, which can be used to collect data monitored by sensors installed on the pipeline 300. Based on the data monitored by each sensor, the effect or status of the liquid cooling equipment in cooling the liquid cooling server node can be determined so as to control the flow of coolant.

[0047] As an example, a liquid cooling system can be divided into two parts: a liquid cooling section that directly contacts the equipment to be cooled and a primary side cooling section that circulates between the cooling tower and the liquid supply system.

[0048] The coolant in the liquid-cooled part that directly contacts the equipment to be cooled is used for immersion cooling, that is, it directly contacts the heat source of the equipment to be cooled for heat exchange. Fluorinated liquids or oils can be used as the cooling medium (i.e., coolant) for this part to ensure that heat can be effectively absorbed and removed without causing electrical short circuits or corroding IT equipment.

[0049] The coolant in the primary cooling section circulates between the cooling tower, cooling water pump, and liquid supply system to transfer and cool the system. Since the coolant in the primary cooling section does not directly contact the heat dissipation equipment, it can use a lower-cost and more efficient heat transfer medium, such as pure water or ethylene glycol solution.

[0050] This embodiment provides a heat dissipation control method for a computer terminal or system architecture described above, applied to a liquid cooling system. The liquid cooling system includes a liquid cooling device and a coolant, and the liquid cooling device includes a heat dissipation component. Figure 3 This is a flowchart of a heat dissipation control method according to an embodiment of this application, such as... Figure 3 As shown, the process includes the following steps:

[0051] Step S301: Control the coolant entering the liquid cooling device to flow through the heat dissipation component and the liquid-cooled server node located in the inner cavity of the liquid cooling device, and then flow out of the liquid cooling device;

[0052] Step S302: Obtain the first temperature of the first device and the second temperature of the second device in the liquid-cooled server node;

[0053] Step S303: Based on the first temperature or the second temperature, control the opening degree of the heat dissipation component to control the flow rate of the coolant entering the liquid cooling device from the first device and from the second device.

[0054] The embodiments of this application can monitor the first temperature of the first device and the second temperature of the second device in real time, and control and adjust the opening of the heat dissipation component to adjust the flow rate of the coolant entering the liquid cooling equipment to the first device or to the second device.

[0055] As an example, a heat dissipation component can be disposed in a liquid cooling device to regulate the flow rate of coolant entering the liquid cooling device toward the first device or the second device by adjusting its opening degree toward the first device or the second device.

[0056] As an example, a liquid-cooled server node can be a communication device such as a server, router, switch, or BBU, but is not limited to these.

[0057] By implementing the above steps, heat dissipation components are installed in the liquid cooling equipment, and the temperatures of different power consumption devices in the liquid-cooled server nodes are monitored. Based on the temperatures of these devices, the flow rate of coolant entering the liquid cooling equipment and directed to each device is adjusted via the heat dissipation components. This satisfies the heat dissipation requirements of different power consumption devices. For example, for high-power devices with high heat dissipation demands, the opening of the heat dissipation components can be increased to increase the flow rate of coolant entering the liquid cooling equipment and directed to these devices, thus meeting their high heat dissipation requirements. This solves the problem in related technologies that cannot effectively address the heat dissipation needs of high-power devices in liquid cooling systems, and reduces the PUE (Power Usage Effectiveness) index of the liquid cooling system.

[0058] In one exemplary embodiment, the heat dissipation component is a flow guiding structure used to adjust the flow rate of the coolant entering the liquid cooling device towards the first device or towards the second device; the coolant entering the liquid cooling device flows sequentially through the heat dissipation component and the liquid-cooled server node.

[0059] As an example, the flow guiding structure can be selected according to the liquid-cooled server node and the type of coolant. It can be a metal flow guiding structure or a non-metal flow guiding structure. This application embodiment does not impose any restrictions here.

[0060] As an example, the current-conducting structure can be made of temperature-sensitive deformable metal or electrically driven, and the angle of the current-conducting structure can be adjusted according to the temperature of the power-consuming device to meet the heat dissipation requirements of the power-consuming device.

[0061] In one exemplary embodiment, controlling the opening degree of the heat dissipation component based on the first temperature or the second temperature includes:

[0062] If the first temperature is determined to be higher than a preset first temperature threshold, the heat dissipation component is controlled to increase the opening degree to the first device, so as to increase the proportion of the coolant flow to the first device; wherein, the power consumption of the first device is higher than the power consumption of the second device.

[0063] In one exemplary embodiment, it further includes:

[0064] If the first temperature is determined to be higher than the first temperature threshold and the second temperature is not higher than the preset second temperature threshold, the opening degree of the heat dissipation component to the first device is controlled to remain unchanged.

[0065] In one exemplary embodiment, it further includes:

[0066] If the first temperature is determined to be higher than the first temperature threshold and the second temperature is higher than the preset second temperature threshold, the opening degree of the heat dissipation component to the first device is kept unchanged, and the flow rate of the coolant entering the liquid cooling device is increased.

[0067] In one exemplary embodiment, it further includes:

[0068] If the first temperature is determined to be no higher than the first temperature threshold and the second temperature is higher than the preset second temperature threshold, the heat dissipation component is controlled to increase the opening degree to the second device, so as to increase the proportion of the coolant flow to the second device.

[0069] In one exemplary embodiment, after controlling the opening degree of the heat dissipation component to the first device to remain unchanged and controlling the increase of the flow rate of the coolant entering the liquid cooling device, the method further includes:

[0070] The current liquid level of the coolant in the inner cavity of the liquid cooling device is obtained; it is determined that the first temperature is not higher than the first temperature threshold, the second temperature is higher than the second temperature threshold, and the liquid level is not lower than a preset liquid level threshold; the flow rate of the coolant entering the liquid cooling device is controlled to reduce the liquid level to be lower than the preset liquid level threshold, and the proportion of the coolant flow to the second device is increased.

[0071] In one exemplary embodiment, the liquid cooling system further includes a cooling tower and piping, the cooling tower being connected to the liquid cooling device via the piping; a cooling water pump is installed on the piping; the method further includes:

[0072] The liquid level is determined to be not lower than a preset liquid level threshold; the first temperature is determined to be higher than the first temperature threshold, or the second temperature is determined to be higher than a preset second temperature threshold; the flow rate, supply temperature, and return temperature of the coolant in the first pipeline are obtained; based on the flow rate, supply temperature, and return temperature of the coolant in the pipeline, the fan speed and cooling water pump speed inside the cooling tower are controlled and adjusted.

[0073] In one exemplary embodiment, it further includes:

[0074] Obtain the current liquid level of the coolant in the inner cavity of the liquid cooling device; determine that a shutdown signal from the server node has been received, the first temperature is not higher than the first temperature threshold, the second temperature is not higher than a preset second temperature threshold, and the liquid level is not higher than a preset liquid level height threshold, and control the opening of the heat dissipation component to the second device to be reduced to the minimum.

[0075] In one exemplary embodiment, the number of heat dissipation components is two, and they are symmetrically arranged on both sides of the first device.

[0076] For example, Figure 4 The liquid cooling device 600 is a structural diagram according to an embodiment of this application. When the heat dissipation component is a flow guiding structure, the specific structure of the liquid cooling device 600 can be as follows: Figure 4 As shown:

[0077] 601a - Liquid cooling equipment internal cavity temperature sensor, used to monitor the temperature of the coolant inside the cavity, can be designed with redundancy;

[0078] 602a - Liquid level sensor for internal cavity of liquid cooling equipment, used to monitor the liquid level height of coolant in the cavity, with redundancy design possible;

[0079] 603a - Liquid cooling equipment internal cavity flow distribution plate, used for coolant flow distribution;

[0080] The 604a-flow guiding structure can be placed upstream of high-power devices to increase the local coolant flow rate and improve the system's heat transfer performance. The included angle of the flow guiding structure is variable.

[0081] 605a - High-power devices (i.e., first-class devices), such as CPUs;

[0082] 606a - Low-to-medium power consumption devices (i.e., secondary devices), such as memory and other devices;

[0083] 607a - Heat sink (not shown in the figure) can be placed near high-power devices to dissipate heat from them; the heat sink can be a copper heat pipe heat sink or a VC composite heat sink, serving as a device to enhance heat exchange.

[0084] 608a - Temperature sensor for low-to-medium power devices, used to monitor the temperature (i.e., the second temperature) of low-to-medium power devices;

[0085] 609a - High-power device area temperature sensor, used to monitor the temperature of high-power devices (i.e., the first temperature).

[0086] As an example, the flow guide structure can be positioned upstream of high-power devices, meaning that the coolant will first encounter the flow guide structure when entering the liquid cooling system's cavity. The flow guide structure can alter the flow direction and velocity of the coolant, concentrating it in the area of ​​high-power devices and improving heat dissipation efficiency by increasing the local flow velocity or flow rate percentage. For instance, when the angle of the flow guide structure is adjusted to 0°, the coolant is guided to directly impact the heat sink of the high-power device, thus creating an actively enhanced heat dissipation effect. When the angle of the flow guide structure is adjusted to 90°, it reduces obstruction to coolant flow, accelerates the drying process of the oil-based working fluid, and facilitates maintenance operations.

[0087] As an example, the adjustable range of the included angle of the flow guiding structure can be set according to the actual situation. For example, the adjustable range can be 0° to 90° or 0° to 180°, etc. This application embodiment does not impose any limitations.

[0088] As an example, the correspondence between the angle of the current guiding structure and the temperature of high-power devices and medium- and low-power devices can be preset. Based on the monitored temperatures of high-power devices and medium- and low-power devices and the preset correspondence, the angle of the current guiding structure that needs to be adjusted can be determined to achieve fine adjustment. Alternatively, the angle of the current guiding structure can be adjusted directly based on the monitored temperatures of high-power devices and medium- and low-power devices.

[0089] As an example, when the temperature of the high-power device monitored by the high-power device area temperature sensor 609 is higher than a preset first temperature threshold, the angle of the flow guiding structure can be adjusted. For example, the angle of the flow guiding structure can be adjusted to 0° to increase the proportion of flow to the high-power device.

[0090] by Figure 4 Taking an example, the heat dissipation control process of this application embodiment will be further explained:

[0091] The heat dissipation control process in this application embodiment may include a flow-guided enhanced heat dissipation process, an energy-saving optimization process, and a maintenance optimization process.

[0092] The process of enhancing heat dissipation through airflow can include the following steps:

[0093] In step S401a, the liquid cooling equipment 600 is filled with coolant, the liquid cooling server node 500 is installed normally, and the coolant is evenly distributed to each liquid cooling server node 604a through the flow equalization plate 603a in the inner cavity of the liquid cooling equipment 600 for circulating heat dissipation.

[0094] In step S402a, the liquid cooling system can monitor the temperature (i.e., the first temperature) collected by the high-power device temperature sensor 609a in real time. When the temperature collected by the high-power device temperature sensor 609a is detected to be higher than the preset temperature threshold T1 (i.e. the first temperature threshold), the system controls the flow guiding structure 604a to maintain an angle of 0° so that the coolant flows through the high-power device preferentially, thereby improving the heat dissipation capacity of the high-power device area.

[0095] As an example, the liquid cooling system can also monitor in real time the liquid supply temperature collected by the equipment liquid supply temperature sensor 308, the equipment inlet flow rate collected by the equipment liquid supply flow sensor 307, the coolant temperature inside the cavity collected by the liquid cooling equipment cavity temperature sensor 601a, and the coolant level inside the cavity collected by the liquid cooling equipment cavity level sensor 602a.

[0096] By monitoring the inlet flow rate of the equipment in real time, the system can adjust the supply of coolant according to the thermal load changes of different power consumption devices, ensuring that high power consumption devices receive sufficient coolant flow rate while avoiding waste of resources.

[0097] Monitoring the temperature of the coolant entering the liquid-cooled server node (i.e., the supply temperature collected by the device supply temperature sensor 308) and the temperature of the coolant inside the liquid-cooled device (i.e., the temperature of the coolant inside the cavity collected by the liquid-cooled device cavity temperature sensor 601a) can ensure that the coolant operates within the optimal temperature range, neither overheating nor cooling, thus avoiding damage to the devices on the liquid-cooled server node or increased energy consumption.

[0098] The data feedback from the 602a liquid level sensor inside the liquid cooling equipment can help the system replenish coolant in a timely manner, preventing system overheating or malfunctions caused by insufficient liquid level.

[0099] In step S403a, based on the temperature monitored by the high-power device area temperature sensor 609a (i.e., the first temperature) and / or the temperature monitored by the medium-low power device area temperature sensor 608a (i.e., the second temperature), when the first temperature is higher than the first temperature threshold T1 and the second temperature is not higher than the second temperature threshold T2, the current guiding structure 604a is controlled to remain at 0°.

[0100] In step S404a, based on the temperature monitored by the high-power device area temperature sensor 609a (i.e., the first temperature) and / or the temperature monitored by the medium-low power device area temperature sensor 608a (i.e., the second temperature), when the first temperature is higher than the first temperature threshold T1 and the second temperature is higher than the second temperature threshold T2, the included angle of the flow guiding structure 604a is kept constant at 0°, and the system liquid supply flow rate is increased.

[0101] In step S405a, based on the temperature monitored by the high-power device area temperature sensor 609a (i.e., the first temperature) and / or the temperature monitored by the medium-low power device area temperature sensor 608a (i.e., the second temperature), when the first temperature is not higher than the first temperature threshold T1 and the second temperature is higher than the second temperature threshold T2, the angle of the flow guiding structure 604a can be controlled and adjusted, such as increasing the angle of the flow guiding structure 604a, to increase the proportion of coolant flow to the medium-low power devices and reduce the temperature of the medium-low power devices.

[0102] As an example, based on the product type of different devices to be cooled, the number of current guiding structures 604a can be set to be the same as the number of low-power devices 606a, and symmetrically arranged on both sides of high-power devices with an initial included angle of 0°.

[0103] Through steps S401a to S405a, by setting a variable-angle flow guide structure upstream of the high-power device, the coolant can flow through the high-power device area in a concentrated manner, thereby increasing the flow rate of the coolant around the heat dissipation module of the high-power device and thus improving the heat exchange capacity of the liquid cooling system. Compared with the solution without a flow guide structure, the temperature of the high-power device is reduced more significantly.

[0104] The energy-saving optimization process may include the following steps:

[0105] In step S401 b, the liquid cooling system monitors in real time the primary side liquid supply flow rate collected by the primary side liquid supply flow rate sensor 302, the primary side liquid supply temperature collected by the primary side liquid supply temperature sensor 303, the primary side return liquid temperature collected by the primary side return liquid temperature sensor 305, the liquid cooling equipment inlet pressure collected by the equipment liquid supply pressure sensor 306, the liquid cooling equipment outlet pressure collected by the equipment return liquid pressure sensor 309, the liquid cooling equipment cavity temperature collected by the liquid cooling equipment cavity temperature sensor 601a, the liquid cooling equipment cavity level sensor 602a, the medium and low power consumption device temperature (i.e., the second temperature) collected by the medium and low power consumption device area temperature sensor 608a, the high power consumption device temperature (i.e., the first temperature) collected by the high power consumption device area temperature sensor 609a, and the liquid cooling equipment inlet flow rate collected by the equipment liquid supply flow rate sensor 307.

[0106] As an example, the liquid cooling system can determine whether to start each device / component / equipment in the liquid cooling system based on the pressure data collected by the cooling water pump downstream pressure sensor 301, the primary side return liquid pressure sensor, the equipment supply liquid pressure sensor 306, the equipment return liquid pressure sensor 309, the temperature data collected by the primary side supply liquid temperature sensor 303, the primary side return liquid temperature sensor 305, the equipment supply liquid temperature sensor 308, and the equipment return liquid temperature sensor 310.

[0107] In step S402b, the liquid cooling system can determine the temperature based on the first temperature fed back by the temperature sensor 609a for the high-power device area and the second temperature fed back by the temperature sensor 608a for the medium- and low-power device areas. If the opening of the flow guiding structure 604a to the high-power device is adjusted to the maximum (e.g., the angle of the flow guiding structure is 0°) and the first temperature is still higher than the first temperature threshold T1, or if the opening of the flow guiding structure 604a to the low-power device is adjusted to the maximum (e.g., the angle of the flow guiding structure is 90°) and the second temperature is still higher than the second temperature threshold T2, then the flow rate of the coolant input to the liquid cooling equipment can be increased by adjusting the centralized liquid supply system 100 to prioritize meeting the system's heat dissipation needs.

[0108] In step S403b, if, after adjusting the centralized liquid supply system 100, the liquid level height of the coolant in the cavity collected by the liquid level sensor 602a is higher than or has reached or is not lower than the preset liquid level height threshold, the second temperature exceeds the second temperature threshold T2, and the first temperature is not higher than the first temperature threshold T1, then the angle of the flow guiding structure 604a can be controlled and adjusted, such as increasing the angle of the flow guiding structure 604a and reducing the flow output of the centralized liquid supply system 400, so that the liquid level height of the coolant in the cavity is not higher than or lower than the preset liquid level height threshold, thereby achieving the goal of energy saving.

[0109] In step S404b, if the liquid level height of the coolant in the cavity collected by the liquid level sensor 602a of the liquid cooling equipment cavity has reached or exceeded or not fallen below the preset liquid level height threshold after the flow rate adjustment of the liquid supply system 400, and the first temperature is higher than the first temperature threshold T1, or the second temperature is higher than the second temperature threshold T2, then the adjustment can be further made by increasing the fan speed and / or the cooling water pump speed in the external cooling tower 100.

[0110] As an example, the fan speed and / or cooling water pump speed inside the external cooling tower 100 can be adjusted based on the primary side supply flow rate collected by the primary side supply flow rate sensor 302, the primary side supply temperature collected by the primary side supply temperature sensor 303, and the primary side return temperature collected by the primary side return temperature sensor 305, thereby optimizing the PUE index.

[0111] For example, after the flow rate is adjusted by the liquid supply system 400, the liquid level in the liquid cooling equipment cavity, as collected by the liquid level sensor 602a, has reached or exceeded a preset liquid level threshold. If the first temperature is higher than the first temperature threshold T1, or the second temperature is higher than the second temperature threshold T2, further adjustment can be made by increasing the fan speed and / or the cooling water pump speed in the external cooling tower 100. Compared to the prior art, which directly increases the fan speed and / or the cooling water pump speed in the external cooling tower 100 when increasing heat dissipation, this embodiment first adjusts the flow through the guide structure 604a and then adjusts it through the external cooling tower 100, which greatly reduces energy consumption and lowers the PUE index of the liquid cooling system.

[0112] In step S405b, when the first temperature is not higher than the first temperature threshold T1 and the second temperature is not higher than the second temperature threshold T2, the fan speed and / or cooling water pump speed inside the external cooling tower 100 can be reduced, thereby achieving energy saving and reducing the PUE index of the liquid cooling system.

[0113] By using the steps S401b to S405b described above, different heat dissipation methods can be implemented for devices with different power consumption while reducing the PUE energy-saving index.

[0114] The maintenance and optimization process may include the following steps:

[0115] In step S401c, the liquid cooling system can monitor in real time the liquid level height of the coolant in the cavity collected by the liquid level sensor 602a, the temperature of the low-power device area collected by the low-power device area temperature sensor 608a (i.e., the second temperature), and the temperature of the high-power device area collected by the high-power device area temperature sensor 609a (i.e., the first temperature).

[0116] In step S402c, when the first temperature is lower than the first preset temperature threshold T1, the second temperature is lower than the second preset temperature threshold T2, and the liquid level height of the coolant in the cavity collected by the internal liquid level sensor 602a is lower than the preset liquid level height threshold, when a system shutdown signal is received, that is, when maintenance of various power consumption devices is required, the coolant in the liquid cooling device 600 can be drained by controlling and adjusting the angle of the flow guiding structure 604a.

[0117] In step S403c, the included angle of the flow guiding structure 604a can be adjusted to 90° to quickly drain the coolant in the high-power device area when each power-consuming device is removed from the inner cavity of the liquid cooling device 600.

[0118] Through the above steps S401c to S403c, when each power consumption device needs maintenance, the drying time can be shortened and the maintenance efficiency improved by adjusting the angle of the guide structure during the process of removing each power consumption device from the inner cavity of the liquid cooling equipment.

[0119] The heat dissipation component in this application embodiment can also be a cold plate device to enhance the heat exchange effect.

[0120] In one exemplary embodiment, the heat dissipation component is a cold plate device, which is attached to the first device; a first stream of coolant entering the liquid cooling device flows through the outside of the cold plate device and the liquid-cooled server node, and a second stream of coolant entering the liquid cooling device flows through the internal channels of the cold plate device.

[0121] As an example, the cold plate device in this application embodiment can be a pump-driven cold plate device.

[0122] In one exemplary embodiment, controlling the opening degree of the heat dissipation component based on the first temperature or the second temperature includes:

[0123] Based on the first temperature or the second temperature, the valve opening of the cold plate device is controlled to control the flow rate of the second stream of coolant through the internal flow channel of the cold plate device.

[0124] For example, Figure 5 This is a structural diagram of another liquid cooling device according to an embodiment of this application. Figure 5 The heat dissipation component of the liquid cooling device 600 is a cold plate device 605b, such as Figure 5 As shown, the liquid cooling device 600 may include:

[0125] 601b - Liquid cooling equipment cavity temperature sensor, used to monitor the temperature of the coolant inside the cavity, can be designed with redundancy;

[0126] 602b - Liquid level sensor for internal cavity of liquid cooling equipment, used to monitor the liquid level height of coolant in the cavity, with redundancy design possible;

[0127] The 603b / 607b liquid separator can be selected and designed based on the number of devices and data such as working pressure and flow rate.

[0128] 500-Liquid-cooled server nodes;

[0129] The 604b-cold plate device, in addition to the coolant flowing into the inner cavity of the liquid cooling equipment, has an additional coolant flow path through the internal channel of the cold plate device. The cold plate device can be installed in close contact with high power consumption devices, and the heat is carried away by the coolant. The specifications of the cold plate are determined according to the power consumption of the high power consumption device, the position of the heat sink, the head and flow rate of the turbulence pump.

[0130] Among them, high-power devices and medium-to-low-power devices were not included. Figure 5 As shown in the image.

[0131] 605b - High-power device temperature sensor, used to monitor the temperature of high-power devices (i.e., the first temperature); a low-power device temperature sensor for monitoring the temperature of medium- and low-power devices (i.e., the second temperature) is not included. Figure 5 As shown in the image;

[0132] The 606b-branch electric valve can determine the opening size of the branch electric valve based on the monitored temperature of high-power devices, so as to regulate the flow rate of coolant injected into the cold plate by adjusting the opening size of the branch electric valve.

[0133] For example, the load rate of low- and medium-power devices can also be considered simultaneously to control the opening size of the branch electric valve.

[0134] The 608b-branch interface can be a threaded interface, flange, barbed interface, etc., and can be used to evenly distribute the turbulent flow according to the number of equipment and the flow rate.

[0135] The 609b turbulence pump can be used to deliver coolant to each cold plate.

[0136] As an example, the flow rate of coolant through the internal channels of the cold plate device can be controlled by adjusting the opening degree of the branch electric valve 606b of the cold plate device based on the first temperature collected by the high-power device temperature sensor 605b. For instance, if the first temperature is higher than a first temperature threshold T1, the opening degree of the branch electric valve 606b can be increased to increase the flow rate of coolant through the internal channels of the cold plate device, thus achieving centralized and rapid heat dissipation for the high-power device.

[0137] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0138] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0139] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0140] Figure 6 This is a structural block diagram of an electronic device according to an embodiment of this application, such as... Figure 6 As shown, embodiments of this application also provide an electronic device 70, including a memory 701 and a processor 702, wherein the memory 701 stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0141] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0142] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0143] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0144] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0145] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation control method, characterized in that, Applied to a liquid cooling system, the liquid cooling system including a liquid cooling device and a coolant, the liquid cooling device including a heat dissipation component, the method includes: The coolant entering the liquid cooling device is controlled to flow through the heat dissipation components and the liquid-cooled server node located inside the liquid cooling device, and then flows out of the liquid cooling device; Obtain the first temperature of the first device and the second temperature of the second device in the liquid-cooled server node; Based on the first temperature or the second temperature, the opening degree of the heat dissipation component is controlled to control the flow rate of the coolant entering the liquid cooling device from the first device and from the second device.

2. The method according to claim 1, characterized in that, The heat dissipation component is a flow guiding structure used to adjust the flow rate of the coolant entering the liquid cooling device towards the first device or towards the second device. The coolant entering the liquid cooling equipment flows sequentially through the heat dissipation components and the liquid-cooled server node.

3. The method according to claim 2, characterized in that, Controlling the opening degree of the heat dissipation component based on the first temperature or the second temperature includes: If the first temperature is determined to be higher than a preset first temperature threshold, the heat dissipation component is controlled to increase the opening degree to the first device, so as to increase the proportion of the coolant flow to the first device; wherein, the power consumption of the first device is higher than the power consumption of the second device.

4. The method according to claim 3, characterized in that, Also includes: If the first temperature is determined to be higher than the first temperature threshold and the second temperature is not higher than the preset second temperature threshold, the opening degree of the heat dissipation component to the first device is controlled to remain unchanged.

5. The method according to claim 3, characterized in that, Also includes: If the first temperature is determined to be higher than the first temperature threshold and the second temperature is higher than the preset second temperature threshold, the opening degree of the heat dissipation component to the first device is kept unchanged, and the flow rate of the coolant entering the liquid cooling device is increased.

6. The method according to claim 3, characterized in that, Also includes: If the first temperature is determined to be no higher than the first temperature threshold and the second temperature is higher than the preset second temperature threshold, the heat dissipation component is controlled to increase the opening degree to the second device, so as to increase the proportion of the coolant flow to the second device.

7. The method according to claim 5, characterized in that, After controlling the opening degree of the heat dissipation component to the first device to remain constant, and controlling the increase of the flow rate of the coolant entering the liquid cooling device, the method further includes: Obtain the current liquid level of the coolant in the inner cavity of the liquid cooling device; It is determined that the first temperature is not higher than the first temperature threshold, the second temperature is higher than the second temperature threshold, and the liquid level is not lower than the preset liquid level height threshold. Control the flow rate of the coolant into the liquid cooling device to reduce the liquid level height to below the preset liquid level height threshold, and increase the proportion of the coolant flow to the second device.

8. The method according to claim 7, characterized in that, The liquid cooling system further includes a cooling tower and pipelines, the cooling tower being connected to the liquid cooling equipment via the pipelines; a cooling water pump is installed on the pipelines; the method further includes: The liquid level is determined to be no lower than a preset liquid level height threshold. If the first temperature is determined to be higher than the first temperature threshold, or the second temperature is determined to be higher than the preset second temperature threshold, the flow rate, supply temperature and return temperature of the coolant in the first pipeline are obtained. The speed of the fan inside the cooling tower and the speed of the cooling water pump are controlled and adjusted according to the flow rate of the coolant in the pipeline, the supply temperature, and the return temperature.

9. The method according to claim 3, characterized in that, Also includes: Obtain the current liquid level of the coolant in the inner cavity of the liquid cooling device; If a shutdown signal is received from the server node, the first temperature is not higher than the first temperature threshold, the second temperature is not higher than the preset second temperature threshold, and the liquid level is not higher than the preset liquid level height threshold, the opening of the heat dissipation component to the second device is controlled to be reduced to the minimum.

10. The method according to any one of claims 3-9, characterized in that, The number of heat dissipation components is two, and they are symmetrically arranged on both sides of the first device.

11. The method according to claim 1, characterized in that, The heat dissipation component is a cold plate device, which is attached to the first device; the first stream of coolant entering the liquid cooling equipment flows through the outside of the cold plate device and the liquid-cooled server node, and the second stream of coolant entering the liquid cooling equipment flows through the internal channels of the cold plate device.

12. The method according to claim 11, characterized in that, Controlling the opening degree of the heat dissipation component based on the first temperature or the second temperature includes: Based on the first temperature or the second temperature, the valve opening of the cold plate device is controlled to control the flow rate of the second stream of coolant through the internal flow channel of the cold plate device.

13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program, wherein the computer program, when executed by a processor, implements the steps of the method described in any one of claims 1 to 12.

14. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the method described in any one of claims 1 to 12.

15. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method described in any one of claims 1 to 12.

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