Heat dissipation device, motor controller, electric control assembly and vehicle

Abstract

The application provides a heat dissipation device, a motor controller, an electric control assembly and a vehicle. The heat dissipation device comprises a vaporization cavity, a condensation cavity and a cooling member. The vaporization cavity contains a cooling medium, and is suitable for vaporizing the cooling medium to form a gaseous medium. The condensation cavity is in communication with the vaporization cavity, and is suitable for condensing the gaseous medium to form a liquid medium. The cooling member is connected to one side of the condensation cavity away from the vaporization cavity. Thus, the heat generated by the heating element during operation can be conducted to the vaporization cavity, so that the cooling medium in the vaporization cavity is vaporized to absorb heat and form a gaseous medium. The gaseous medium flows into the condensation cavity and is condensed to form a liquid medium. The liquid medium returns to the vaporization cavity for the next vaporization. In this way, the entire cooling process realizes the phase change of the cooling medium from liquid to gas and then from gas to liquid, effectively improving the cooling efficiency of the heat dissipation device, thereby helping to realize the rapid and efficient cooling of the heating element.

Description

[0001] This application claims priority to Chinese Patent Application No. 2025208178754, filed on April 25, 2025, entitled "Heat Dissipation Device, Motor Controller, Electronic Control Assembly and Vehicle", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of cooling technology, and in particular to a heat dissipation device, a motor controller, an electronic control assembly, and a vehicle. Background Technology

[0003] Various heat-generating components in a vehicle's electronic control assembly generate significant heat during operation. Typically, a heat dissipation device is required to cool these components, ensuring they maintain good electrical performance and normal operation.

[0004] In existing technologies, heat dissipation devices typically employ liquid cooling plates, which are connected to the underside of the heat-generating element. The heat generated by the heat-generating element is carried away by the circulating flow of the cooling medium within the liquid cooling plate, thus achieving cooling of the heat-generating element. However, the cooling efficiency of liquid cooling plates is limited, making it difficult to achieve rapid and efficient cooling of the heat-generating element. Summary of the Invention

[0005] In view of this, this application provides a heat dissipation device, a motor controller, an electronic control assembly, and a vehicle to at least solve the problem that the cooling efficiency of heat dissipation devices in the prior art is limited, making it difficult to achieve rapid and efficient cooling of heat-generating components.

[0006] To achieve the above objectives, the technical solution of this application is implemented as follows:

[0007] This application provides a heat dissipation device, including a vaporization chamber, a condensation chamber, and a cooling component;

[0008] The vaporization chamber contains a cooling medium, and the vaporization chamber is adapted to vaporize the cooling medium to form a gaseous medium;

[0009] The condensation chamber is connected to the vaporization chamber, and the condensation chamber is adapted to condense the gaseous medium into a liquid medium.

[0010] The cooling component is connected to the side of the condensation chamber opposite to the vaporization chamber.

[0011] Optionally, it includes a shell, a cover plate, and a bottom plate; the cover plate and the bottom plate are connected to opposite sides of the shell, and a partition is provided inside the shell; the vaporization chamber is formed between the cover plate and the partition, and the condensation chamber is formed between the bottom plate and the partition.

[0012] Optionally, the partition is provided with a first opening and / or a second opening, and the condensation chamber and the vaporization chamber are connected through the first opening and / or the second opening.

[0013] Optionally, the first opening and the second opening are located on opposite sides of the partition.

[0014] Optionally, it also includes a porous body; the porous body is disposed in the vaporization chamber, one side of the porous body is connected to the partition plate, and the opposite side of the porous body is connected to the cover plate.

[0015] Optionally, a condensation column is provided on the side of the base plate near the condensation chamber.

[0016] Optionally, a gap is provided between the condenser column and the partition plate.

[0017] Optionally, along the thickness direction of the partition, the projection of the first opening is located within the projection of the porous body, the end of the condenser column passes through the first opening and is connected to the porous body; an air passage is formed between the outer peripheral surface of the condenser column and the porous body, and the air passage is connected to the first opening.

[0018] Optionally, the outer peripheral surface of the condensation column is provided with a groove extending along its axial direction.

[0019] Optionally, the grooves are spaced apart circumferentially along the condensation column.

[0020] Optionally, it includes a vaporization shell, a condensing plate, a first pipeline, and a second pipeline; the vaporization shell is provided with a vaporization chamber, the condensing plate is provided with a condensation chamber, the condensing plate and the cooling component are stacked and connected to each other; the first pipeline and the second pipeline are located between the condensation chamber and the vaporization chamber, and the condensation chamber is connected to the vaporization chamber through the first pipeline and the second pipeline.

[0021] Optionally, there are multiple vaporization chambers, and each vaporization chamber corresponds to a bridge arm.

[0022] This application also provides a motor controller, which includes a heating element and a heat dissipation device as described in any of the preceding claims, wherein the heating element is connected to the side of the vaporization chamber away from the condensation chamber.

[0023] This application also provides an electronic control assembly, including the heat dissipation device described in any of the foregoing claims, or including the aforementioned motor controller.

[0024] This application also provides a vehicle including the aforementioned motor controller or electronic control assembly.

[0025] Compared with existing technologies, the heat dissipation device, motor controller, electronic control assembly, and vehicle described in this application have the following advantages:

[0026] The heat dissipation device of this application embodiment is connected to the heating element. The heat dissipation device includes a vaporization chamber, a condensation chamber, and a cooling component. When the heating element is working, the heat generated is conducted to the vaporization chamber, causing the cooling medium in the vaporization chamber to vaporize and absorb heat to form a gaseous medium with a relatively high temperature. The condensation chamber is connected to the vaporization chamber, and the cooling component is connected to the outside of the condensation chamber. Under the action of the cooling component, the temperature in the condensation chamber is lower, so the gaseous medium with a relatively high temperature flows into the condensation chamber and condenses, releasing a large amount of heat to form a liquid medium with a relatively low temperature. The liquid medium flows back to the vaporization chamber for the next vaporization. In this way, the entire cooling process realizes the phase change of the cooling medium from liquid to gas and then from gas to liquid, effectively improving the cooling efficiency of the heat dissipation device, thereby helping to achieve rapid and efficient cooling of the heating element.

[0027] The motor controller, electronic control assembly, and vehicle described in this application have the same or similar advantages as the prior art and the aforementioned heat dissipation devices, which will not be elaborated here. Attached Figure Description

[0028] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments and descriptions of this application are used to explain this application and do not constitute an undue limitation of this application. In the drawings:

[0029] Figure 1 This is one of the schematic diagrams of a heat dissipation device in the embodiments of this application;

[0030] Figure 2 This is a schematic diagram of a heat dissipation device with the cover plate removed in an embodiment of this application;

[0031] Figure 3 This is a cross-sectional schematic diagram of a heat dissipation device according to an embodiment of this application;

[0032] Figure 4 This is a schematic diagram of an electronic control housing according to an embodiment of this application;

[0033] Figure 5 This is a second schematic diagram of a heat dissipation device in an embodiment of this application;

[0034] Figure 6 This is a schematic diagram of a condenser plate in an embodiment of this application;

[0035] Figure 7 This is a schematic diagram of a cooling plate in an embodiment of this application.

[0036] Explanation of reference numerals in the attached figures:

[0037] 101-Vaporization chamber, 102-Condensation chamber, 11-Shell, 12-Cover plate, 13-Bottom plate, 131-Condensation column, 14-Partition plate, 141-First opening, 142-Second opening, 2-Heating element, 3-Porous body, 4-Liquid cooling plate, 5-Electrical control shell, 51-Cooling chamber, 52-Sealing ring, 6-Vaporization shell, 61-First pipeline, 62-Second pipeline, 71-Condensation plate, 72-Cooling plate, 721-Second heat-conducting column. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0040] It should be understood that the phrase "some embodiments" throughout the specification means that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of this application. Therefore, "some embodiments" appearing throughout the specification does not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0041] The following detailed description of a heat dissipation device, motor controller, electronic control assembly, and vehicle provided in this application is illustrated with specific embodiments.

[0042] In the field of cooling the heating element 2, existing technologies typically equip the heating element 2 with a liquid cooling plate connected to the lower side of the heating element 2. The liquid cooling plate contains a circulating cooling medium, which carries away the heat generated by the heating element 2 during operation, thus cooling the heating element 2. However, the cooling efficiency of the liquid cooling plate is relatively low, making it difficult to achieve rapid and efficient cooling of the heating element 2.

[0043] This application provides a heat dissipation device. Figure 1 This is one of the schematic diagrams of a heat dissipation device in the embodiments of this application. Figure 2 This is a schematic diagram of a heat dissipation device with the cover plate removed, according to an embodiment of this application. Figure 3 This is a cross-sectional schematic diagram of a heat dissipation device according to an embodiment of this application, with reference to... Figures 1 to 3 The heat dissipation device includes a vaporization chamber 101, a condensation chamber 102, and a cooling component; the vaporization chamber 101 contains a cooling medium and is adapted to vaporize the cooling medium to form a gaseous medium; the condensation chamber 102 is connected to the vaporization chamber 101 and is adapted to condense the gaseous medium to form a liquid medium; the cooling component is connected to the side of the condensation chamber 102 away from the vaporization chamber 101.

[0044] In this embodiment, the side of the vaporization chamber 101 away from the condensation chamber 102 can be connected to the heating element 2. The heating element 2 refers to various electronic components that generate heat during operation, such as power modules, sensors, drive modules, control modules, power supply modules, etc. The heating element 2 can be welded to the surface of the vaporization chamber 101 away from the condensation chamber 102.

[0045] The vaporization chamber 101 contains a cooling medium. During the operation of the heating element 2, the heat generated by the heating element 2 can be conducted into the vaporization chamber 101. The cooling medium in the vaporization chamber 101 absorbs heat and its temperature rises. When the cooling medium reaches its own saturation temperature, it begins to evaporate and vaporize, forming a gaseous medium. This process absorbs a large amount of heat, thus forming a relatively high-temperature gaseous medium, achieving cooling of the heating element 2. The cooling medium can be pure water or other refrigerants; the specific type is not limited in this embodiment. This embodiment uses water as the cooling medium for illustration. Water has a high specific heat capacity and latent heat of vaporization. After evaporation and vaporization, it forms high-temperature water vapor, which is the gaseous medium.

[0046] The condensing chamber 102 is connected to the vaporization chamber 101. The gaseous medium formed by vaporization in the vaporization chamber 101 flows from the connection point between the condensing chamber 102 and the vaporization chamber 101 into the condensing chamber 102. The cooling component is connected to the outside of the condensing chamber 102, specifically to the side of the condensing chamber 102 away from the vaporization chamber 101. The cooling component can transfer heat from the condensing chamber 102 to the external environment or to its own cooling medium, thereby maintaining the condensing chamber 102 at a low temperature. The cooling component can be of various structures such as a cooling pipe, a water-cooled plate, or a cooling fin; the specific type is not limited in this embodiment.

[0047] Under the action of the cooling components, the temperature inside the condensation chamber 102 is low. The gaseous medium condenses in the low-temperature condensation chamber 102 to form a liquid medium. This process releases a large amount of heat, resulting in a relatively low-temperature liquid medium. Continuing with the example using water as the cooling medium, the low-temperature water absorbs heat and evaporates to form high-temperature water vapor. This high-temperature water vapor flows into the condensation chamber 102 and condenses to form low-temperature liquid water, which is the liquid medium. The liquid medium formed in the condensation chamber 102 continues to flow back into the vaporization chamber 101 from the connection between the condensation chamber 102 and the vaporization chamber 101 for the next vaporization cycle. This cycle is repeated, achieving efficient cooling of the heat dissipation device.

[0048] The heat dissipation device of this application embodiment includes a vaporization chamber 101, a condensation chamber 102, and a cooling component. The heat generated by the heating element 2 during operation can be conducted into the vaporization chamber 101, causing the cooling medium in the vaporization chamber 101 to vaporize and absorb heat to form a relatively high-temperature gaseous medium. The condensation chamber 102 is connected to the vaporization chamber 101, and the cooling component is connected to the outside of the condensation chamber 102. Under the action of the cooling component, the temperature in the condensation chamber 102 is lower, so the relatively high-temperature gaseous medium flows into the condensation chamber 102 and condenses, releasing a large amount of heat to form a relatively low-temperature liquid medium. The liquid medium flows back into the vaporization chamber 101 for the next vaporization. In this way, the entire cooling process realizes the phase change of the cooling medium from liquid to gas and then from gas to liquid, effectively improving the cooling efficiency of the heat dissipation device, thereby helping to achieve rapid and efficient cooling of the heating element 2.

[0049] Optionally, refer to Figures 1 to 3 In some embodiments of this application, the heat dissipation device includes a housing 11, a cover plate 12, and a bottom plate 13; the cover plate 12 and the bottom plate 13 are connected to opposite sides of the housing 11, and a partition plate 14 is provided inside the housing 11; a vaporization chamber 101 is formed between the cover plate 12 and the partition plate 14, and a condensation chamber 102 is formed between the bottom plate 13 and the partition plate 14.

[0050] In this embodiment, the cover plate 12 and the bottom plate 13 are located on opposite sides of the housing 11 and are respectively connected to the housing 11. The connection between the cover plate 12 and the housing 11 and the connection between the bottom plate 13 and the housing 11 can be achieved by welding, gluing, assembly, etc., as long as the reliability of the connection between them is guaranteed. This embodiment does not limit this. After the cover plate 12 and the bottom plate 13 are respectively connected to the housing 11, they form a closed housing 11. The housing 11 is independent of the cooling components. The vaporization and condensation of the cooling medium are completed within the housing 11.

[0051] The housing 11 contains a partition 14, wherein the partition 14, cover plate 12, and bottom plate 13 can be arranged parallel to each other. A vaporization chamber 101 is formed between the cover plate 12 and the partition 14, and a condensation chamber 102 is formed between the bottom plate 13 and the partition 14. The side of the cover plate 12 facing away from the vaporization chamber 101 is used to connect the heating element 2. A cooling component is connected to the side of the bottom plate 13 facing away from the condensation chamber 102. Under the action of the cooling component, the temperature of the bottom plate 13 is lower, and the cooling component can cool the condensation chamber 102 through the bottom plate 13, so that the condensation chamber 102 is always kept in a lower temperature environment. Therefore, in this embodiment, the vaporization chamber 101 and the condensation chamber 102 are located on opposite sides of the partition 14, which helps to achieve rapid exchange between the gaseous and liquid phase media, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0052] Optionally, refer to Figure 2 In some embodiments of this application, the partition 14 is provided with a first opening 141 and / or a second opening 142. The condensation chamber 102 and the vaporization chamber 101 are connected through the first opening 141 and / or the second opening 142. The first opening 141 is used to allow the gaseous medium formed by vaporization in the vaporization chamber 101 to flow into the condensation chamber 102, and the second opening 142 is used to allow the liquid medium formed by condensation in the condensation chamber 102 to flow back into the vaporization chamber 101. If the first opening 141 and / or the second opening 142 are provided at the edge of the partition 14, then the first opening 141 and / or the second opening 142 are equivalent to the gap between the partition 14 and the inner wall of the housing 11.

[0053] The dimensions of the first opening 141 and the second opening 142 can be set according to the volume of the cooling medium. If the volume of the cooling medium is large, more gaseous and liquid media will be generated, so the dimensions of the first opening 141 and the second opening 142 can be relatively large. If the volume of the cooling medium is small, less gaseous and liquid media will be generated, so the dimensions of the first opening 141 and the second opening 142 can be relatively small.

[0054] The number of first openings 141 and second openings 142 can also be set according to the volume of the cooling medium. If the volume of the cooling medium is large, the number of first openings 141 and second openings 142 can be relatively large; if the volume of the cooling medium is small, the number of first openings 141 and second openings 142 can be relatively small. Furthermore, multiple first openings 141 and second openings 142 can be evenly arranged on the partition 14 to improve the uniformity of the flow of the gaseous and liquid media. In addition, the shape of the first openings 141 and second openings 142 can be any shape such as strip, square, circle, or ellipse, and this embodiment does not impose any restrictions on this.

[0055] Optionally, refer to Figure 2In some embodiments of this application, the first opening 141 and the second opening 142 are provided on opposite sides of the partition 14. The first opening 141 and the second opening 142 can be provided on opposite sides of the partition 14 along its length or width direction. This helps to extend the residence time of the gaseous medium in the condensation chamber 102 and the residence time of the liquid medium in the vaporization chamber 101, thereby facilitating the full condensation of the gaseous medium and the full vaporization of the liquid medium, so as to further improve the cooling efficiency.

[0056] If the heat dissipation device is installed vertically in the electronic control assembly along the direction of gravity, the first opening 141 should be located above the second opening 142. Since the density of the high-temperature gaseous medium is relatively low, it is easy to flow upward, and the density of the low-temperature liquid medium is relatively high, it is easy to flow downward. Therefore, this arrangement helps the high-temperature gaseous medium to flow quickly from the first opening 141 into the condensation chamber 102, and the low-temperature liquid medium to flow quickly from the second opening 142 into the vaporization chamber 101.

[0057] Optionally, refer to Figure 2 and Figure 3 In some embodiments of this application, the heat dissipation device further includes a porous body 3; the porous body 3 is disposed in the vaporization chamber 101, one side of the porous body 3 is connected to the partition plate 14, and the other side of the porous body 3 is connected to the cover plate 12.

[0058] In this embodiment, the porous body 3 has a porous structure, which can adsorb the cooling medium in the vaporization chamber 101. The porous body 3 can be a material with a capillary structure, such as sintered metal powder materials or fiber materials. It can also be a metal-based porous material, such as porous copper, porous aluminum, or metal foam. Furthermore, it can be a ceramic-based porous material, such as alumina ceramic or boron nitride ceramic. It can also be a carbon-based porous material, such as activated carbon or graphene. Finally, it can be a polymer-based porous material, such as polyurethane foam or polyimide porous materials. The specific type is not limited in this embodiment.

[0059] The porous body 3 is disposed in the vaporization chamber 101. One side of the porous body 3 is connected to the partition plate 14, and the other side of the porous body 3 is connected to the cover plate 12. For example, if the porous body 3 is a metal-based porous material, the porous body 3 can be welded to the partition plate 14 and the cover plate 12 respectively.

[0060] In this embodiment, the porous body 3 is connected to both the partition plate 14 and the cover plate 12. The side of the cover plate 12 facing away from the vaporization chamber 101 is used to connect the heating element 2. Thus, the heat generated by the heating element 2 during operation can be directly conducted to the porous body 3 through the cover plate 12, causing the temperature of the porous body 3 to rise rapidly. This, in turn, causes the cooling medium adsorbed inside the porous body 3 to rapidly vaporize, forming a gaseous medium. This helps to accelerate the vaporization rate of the cooling medium, thereby further improving cooling efficiency. Furthermore, the connection of the porous body 3 to both the partition plate 14 and the cover plate 12 also helps to improve the installation stability of the porous body 3 within the vaporization chamber 101, thereby improving the overall structural stability of the heat dissipation device.

[0061] Optionally, in some embodiments of this application, the projection of the heating element 2 and the projection of the porous body 3 at least partially overlap along the thickness direction of the cover plate 12. Specifically, the fact that the projection of the heating element 2 and the projection of the porous body 3 at least partially overlap along the thickness direction of the cover plate 12 means that the heating element 2 and the porous body 3 are at least partially correspondingly arranged in the thickness direction of the cover plate 12, and this correspondingly arranged portion can achieve heat conduction at the fastest speed. In some embodiments, the projection of the heating element 2 and the projection of the porous body 3 completely overlap along the thickness direction of the cover plate 12, meaning that the heating element 2 and the porous body 3 are completely correspondingly arranged in the thickness direction of the cover plate 12, thereby maximizing the heat conduction speed.

[0062] Along the thickness direction of the cover plate 12, the projected area of ​​the heating element 2 can be greater than the projected area of ​​the porous body 3, or the projected area of ​​the heating element 2 can be smaller than the projected area of ​​the porous body 3, or the projected area of ​​the heating element 2 can be equal to the projected area of ​​the porous body 3. In any case, by reasonably setting the relative positions of the heating element 2 and the porous body 3, the projection of the heating element 2 and the projection of the porous body 3 can at least partially overlap.

[0063] Alternatively, in some embodiments, the projection of the heating element 2 does not coincide with the projection of the porous body 3 along the thickness direction of the cover plate 12. In this case, it means that the heating element 2 and the porous body 3 are staggered in the thickness direction of the cover plate 12. At this time, the heat generated by the heating element 2 during operation will first be transversely conducted on the cover plate 12, and then longitudinally conducted to the porous body 3.

[0064] Optionally, refer to Figure 3In some embodiments of this application, a condensing column 131 is provided on the side of the base plate 13 near the condensing chamber 102. The number of condensing columns can be one, two, or more. The condensing columns 131 are connected to the base plate 13. Since the side of the base plate 13 facing away from the condensing chamber 102 is connected to the cooling component, both the base plate 13 and the condensing columns 131 are low-temperature components under the action of the cooling component. When the gaseous medium flows within the condensing chamber 102, the gaseous medium can fully contact the outer peripheral surface of the condensing column 131, thereby increasing the contact area between the gaseous medium and the condensing component, which helps to accelerate the condensation rate and efficiency of the gaseous medium. In some embodiments, multiple condensing columns 131 are arranged in an array on the base plate 13 to further improve the condensation rate of the gaseous medium within the condensing chamber 102.

[0065] In some embodiments, the condenser column 131 may extend to connect with the partition 14, which helps to improve the overall structural stability of the heat dissipation device. Alternatively, in other embodiments, there is a gap between the condenser column 131 and the partition 14, meaning that the condenser column 131 and the partition 14 are not connected. With this configuration, the heat conducted from the porous body 3 to the partition 14 will not be conducted to the condenser column 131, thereby helping to prevent the base plate 13 from heating up too quickly.

[0066] Optionally, in some embodiments of this application, along the thickness direction of the partition 14, the projection of the first opening 141 is located within the projection of the porous body 3, the end of the condenser column 131 passes through the first opening 141 and is connected to the porous body 3; an air passage is formed between the outer peripheral surface of the condenser column 131 and the porous body 3, and the air passage is connected to the first opening 141.

[0067] Specifically, along the thickness direction of the partition 14, the projection of the first opening 141 lies within the projection of the porous body 3, meaning that the positions of the first opening 141 along the thickness direction of the partition 14 correspond to the porous body 3. In some embodiments, there are multiple first openings 141, which are evenly distributed on the partition 14. The number of condensation columns 131 is the same as the number of first openings 141, and the end of each condensation column 131 passes through a first opening 141 and is inserted into the porous body 3.

[0068] The porous body 3 itself has a large number of pores. When the end of the condenser column 131 is inserted into the porous body 3, an air passage is formed between the outer peripheral surface of the condenser column 131 and the porous body 3. The outer peripheral surface of the condenser column 131 refers to the surface of the condenser column 131 arranged around its axial direction. The air passage is connected to the first opening 141 on the partition plate 14 to form a complete airflow channel. Thus, the gaseous medium formed by the heating and vaporization of the porous body 3 will flow directly into the condensation chamber 102 through the air passage and the first opening 141. The gaseous medium comes into contact with the lower temperature condenser column 131 in the condensation chamber 102, or with the bottom plate 13, and condenses to form a liquid medium.

[0069] Alternatively, in conjunction with some of the aforementioned embodiments, the projection of the first opening 141 may not coincide with the projection of the porous body 3, meaning that the first opening 141 and the porous body 3 are offset in the length or width direction of the partition 14. For example, the first opening 141 may be located at the edge of the partition 14.

[0070] Therefore, in this embodiment, a gas channel is directly formed between the condensing column 131 and the porous body 3. The gaseous medium can flow directly into the condensing chamber 102 through this gas channel and the first opening 141, which helps to shorten the time for the gaseous medium to flow into the condensing chamber 102, increase the flow rate of the gaseous medium, and thus improve the condensation rate and heat dissipation efficiency. Since the number of condensing columns 131 is usually large, this arrangement can increase the number of gas channels and increase the area for gaseous medium to flow, thereby facilitating the rapid flow of the gaseous medium from the gas channels and the first opening 141 into the condensing chamber 102 for condensation, further improving heat dissipation efficiency.

[0071] Optionally, in some embodiments of this application, the partition 14 may not be provided inside the shell 11, and the porous body 3 may be directly connected to the cover plate 12, so that the condenser column 131 can be directly inserted into the porous body 3, and a channel for supplying gas phase medium flow is formed between the outer peripheral surface of the condenser column 131 and the porous body 3.

[0072] Optionally, in some embodiments of this application, the outer peripheral surface of the condenser column 131 is provided with a groove extending along its axial direction, and a longitudinal air passage can be formed between the groove and the porous body 3 for the flow of gaseous medium. For example, the condenser column 131 is a column, and the outer peripheral surface of the column is provided with a groove extending along its axial direction. The porous body 3 covers the outer peripheral surface of the end of the condenser column 131, and a longitudinal air passage is formed between the groove and the porous body 3.

[0073] Furthermore, the grooves can be spaced out circumferentially along the condensation column 131 to disperse the flow of the gaseous medium and improve the uniformity of the gaseous medium flow. Alternatively, the grooves can be spaced out evenly circumferentially along the condensation column 131 to further improve the uniformity of the gaseous medium flow.

[0074] In some embodiments of this application, the condenser column 131 is processed into a cylindrical structure, and the porous body 3 covers the outer peripheral surface of the end of the condenser column 131. The surface of the porous body 3 used to connect with the condenser column 131 can be set as an irregular structure. For example, the porous body 3 can be sintered into having multiple cavities arranged along the axial direction of the condenser column 131. A longitudinal air channel is formed between the inner surface of the cavity and the outer peripheral surface of the condenser column 131 to allow the gas phase medium to flow.

[0075] In practical applications, various factors such as the difficulty of the processing technology and the processing cost can be comprehensively considered, and either of the two embodiments mentioned above can be reasonably selected for implementation.

[0076] Optionally, refer to Figure 3 In some embodiments of this application, the cooling component is a liquid cooling plate 4. That is, the cooling component in this embodiment adopts a conventional liquid cooling plate 4. The liquid cooling plate 4 is connected to the side of the base plate 13 away from the condensation cavity 102. The liquid cooling plate 4 has circulating cooling water. The circulating cooling water can remove the temperature on the base plate 13, thereby cooling down the base plate 13 and helping to keep the condensation cavity 102 formed between the base plate 13 and the partition 14 in a lower temperature environment.

[0077] Optionally, refer to Figure 4 This is a schematic diagram of an electronic control housing in an embodiment of this application. In some embodiments of this application, the cooling component is an electronic control housing 5, which has a cooling cavity 51. The electronic control housing 5 is sealed to the base plate 13 to seal the cooling cavity 51. That is, compared with the solutions of the previous embodiments, this embodiment omits the liquid cooling plate 4 and directly reuses the electronic control housing 5 in the electronic control assembly, which is beneficial to improving the effective utilization rate of components in the electronic control assembly.

[0078] The electrical control housing 5 has a cooling chamber 51 inside, and also has a liquid inlet and a liquid outlet, which are connected to the cooling chamber 51. The cooling chamber 51 contains circulating cooling water. The electrical control housing 5 is sealed to the base plate 13. For example, a sealing ring 52 made of rubber or similar material is provided around the periphery of the electrical control housing 5, which seals the cooling chamber 51 and prevents leakage of cooling water. In this embodiment, the circulating flow of cooling water in the cooling chamber 51 removes heat from the base plate 13, achieving cooling and reducing the temperature of the base plate 13. This helps maintain the condensation chamber 102 formed between the base plate 13 and the partition plate 14 at a lower temperature.

[0079] Furthermore, in some embodiments of this application, a first heat-conducting column is provided on the side of the base plate 13 near the cooling cavity 51 of the electronic control housing 5, and the first heat-conducting column is inserted into the cooling cavity 51. When the cooling component is the electronic control housing 5, the electronic control housing 5 is sealed to the base plate 13, and the side of the base plate 13 away from the condensing cavity 102 corresponds to the cooling cavity 51. Under normal circumstances, the amount of cooling water in the cooling cavity 51 will not fill the entire cooling cavity 51, resulting in the side of the base plate 13 away from the condensing cavity 102 being able to transfer heat only through the air, which leads to poor heat transfer effect. Therefore, in this embodiment, a first heat-conducting column is provided on the side of the base plate 13 near the cooling cavity 51 of the electronic control housing 5. The first heat-conducting column is inserted into the cooling cavity 51, and the first heat-conducting column will extend into the cooling water, so that the heat on the base plate 13 can be quickly conducted to the cooling water through the first heat-conducting column, realizing rapid and efficient cooling of the base plate 13.

[0080] It should be noted that the cooling water in the above embodiments can be pure water or other refrigerants, and the specific type is not limited in this embodiment.

[0081] Optionally, Figure 5 This is a second schematic diagram of a heat dissipation device in an embodiment of this application. Figure 6 This is a schematic diagram of a condenser plate in an embodiment of this application, see reference. Figure 5 and Figure 6 In some embodiments of this application, the heat dissipation device includes a vaporization shell 6, a condensing plate 71, a first pipe 61, and a second pipe 62; a vaporization chamber 101 is formed inside the vaporization shell 6, and a condensing chamber 102 is provided inside the condensing plate 71. The condensing plate 71 and the cooling components are stacked and connected to each other; the first pipe 61 and the second pipe 62 are provided between the condensing chamber 102 and the vaporization chamber 101, and the condensing chamber 102 is connected to the vaporization chamber 101 through the first pipe 61 and the second pipe 62.

[0082] In this embodiment, a vaporization chamber 101 is formed inside the vaporization shell 6, and the heating element 2 is disposed on the outside of the vaporization shell 6, that is, the outside of the vaporization shell 6 is used to connect the heating element 2. The cooling component adopts a cooling plate 72, and the condensing plate 71 and the cooling plate 72 are stacked and connected to each other. The connection between the condensing plate 71 and the cooling plate 72 can also be achieved by welding, adhesive bonding, assembly connection, etc., and this embodiment does not limit this.

[0083] The condensation chamber 102 is located inside the condensation plate 71. That is, compared with the solution of the previous embodiment, the bottom plate 13 is omitted in this embodiment. The condensation plate 71 and the cooling plate 72 are stacked and connected to each other. This arrangement is conducive to realizing the integrated design of each component in the heat dissipation device, reducing the number of components, thereby reducing the space occupied by the device and controlling the production cost of the device.

[0084] In addition, the condensing chamber 102 is located inside the condensing plate 71, the vaporization chamber 101 is located between the vaporization shells 6, and the first pipe 61 and the second pipe 62 are located between the condensing chamber 102 and the vaporization chamber 101. The condensing chamber 102 is connected to the vaporization chamber 101 through the first pipe 61 and the second pipe 62. The gaseous medium formed by vaporization in the vaporization chamber 101 is transported to the condensing chamber 102 through the first pipe 61. Under the cooling effect of the cooling plate 72, the gaseous medium in the condensing chamber 102 gradually condenses into a liquid medium during the flow process. The liquid medium flows back to the vaporization chamber 101 through the second pipe 62. Compared to the solutions in the previous embodiments, this embodiment designs the vaporization chamber 101 and the condensation chamber 102 as independent structures, which are connected by the first pipe 61 and the second pipe 62. This arrangement allows for a certain distance between the positions of the vaporization chamber 101 and the condensation chamber 102, that is, the vaporization chamber 101 and the condensation chamber 102 can be flexibly arranged, thereby helping to improve the flexibility of the heat dissipation device layout and broaden its applicable scenarios.

[0085] Optionally, in some embodiments of this application, the condensation chamber 102 can be a hollow channel provided in the condensation plate 71. One end of the hollow channel is connected to the first pipe 61 and the other end is connected to the second pipe 62. The hollow channel can be arranged in an "S" shape in the condensation plate 71 or in a tree-like distributed arrangement to ensure that the gaseous medium can flow smoothly through the first pipe 61 into the condensation chamber 102 and the liquid medium can flow smoothly back into the vaporization chamber 101 through the second pipe 62.

[0086] Optionally, refer to Figure 7 In some embodiments of this application, a second heat-conducting column 721 is provided within the cooling plate 72. The end of the second heat-conducting column 721 is connected to the condensing plate 71. For example, the second heat-conducting column 721 can be welded to the surface of the condensing plate 71 near the cooling plate 72. Multiple second heat-conducting columns 721 can be arranged in an array within the cooling plate 72. When the cooling medium flows within the cooling plate 72, the cooling medium contacts the outer peripheral surface of the second heat-conducting column 721, thereby increasing the contact area of ​​the cooling medium. This arrangement helps to quickly conduct heat from the condensing plate 71 through the second heat-conducting column 721 into the cooling medium, where it is carried away by the circulating cooling medium, thus achieving faster and more efficient cooling of the condensing plate 71. Furthermore, the connection between the second heat-conducting column 721 and the condensing plate 71 also helps to improve the overall structural stability of the heat dissipation device.

[0087] Optionally, in some embodiments of this application, the number of vaporization chambers 101 is multiple, and each vaporization chamber 101 corresponds to one bridge arm. The number of vaporization chambers 101 being multiple means that the number of vaporization chambers 101 can be two, three, or more; the specific number is not limited in this embodiment.

[0088] For example, the electronic control assembly includes three bridge arms: U, V, and W. When the electronic control assembly is vertically installed inside the vehicle, the cooling medium tends to concentrate in the lower part of the vehicle under the influence of gravity. This may result in a situation where the cooling efficiency of the lower part of the vehicle is higher and the cooling efficiency of the upper part of the vehicle is lower, leading to differences in the cooling effect of the three bridge arms: U, V, and W. In this embodiment, three vaporization chambers 101 are provided, each corresponding to one of the three bridge arms: U, V, and W. This allows for targeted cooling of each bridge arm, helping to improve the problem of differences in the cooling effect of the three bridge arms: U, V, and W.

[0089] The number of heat dissipation devices can be one, and one heat dissipation device includes three independent vaporization chambers 101. The number of heat dissipation devices can be three, and each heat dissipation device includes an independent vaporization chamber 101.

[0090] In addition, when the heating element 2 is encapsulated in a circuit board or plastic housing 11 but the distribution is uneven, if a whole heat dissipation device is used, the size of the heat dissipation device needs to be large in order to meet the heat dissipation under each heating element 2. Based on this, in some embodiments of this application, multiple independent heat dissipation devices can be made, with each heat dissipation device corresponding to the area where the heating element 2 is located. This can effectively reduce the size of the heat dissipation device and facilitate its installation. At the same time, no heat dissipation device is set under the area where the heating element 2 is not set, thereby avoiding resource waste.

[0091] In summary, this application provides a heat dissipation device, including a vaporization chamber 101, a condensation chamber 102, and a cooling component; the vaporization chamber 101 contains a cooling medium and is adapted to vaporize the cooling medium to form a gaseous medium; the cooling component is connected to the side of the condensation chamber 102 away from the vaporization chamber 101, the condensation chamber 102 is connected to the vaporization chamber 101, and the condensation chamber 102 is adapted to condense the gaseous medium to form a liquid medium; a heating element 2 is connected to the side of the vaporization chamber 101 away from the condensation chamber 102.

[0092] In some embodiments, the heat dissipation device further includes a housing 11, a cover plate 12, and a bottom plate 13; the cover plate 12 and the bottom plate 13 are connected to opposite sides of the housing 11, and a partition plate 14 is provided inside the housing 11; a vaporization chamber 101 is formed between the cover plate 12 and the partition plate 14, and a condensation chamber 102 is formed between the bottom plate 13 and the partition plate 14; wherein, the heating element 2 is connected to the side of the cover plate 12 away from the vaporization chamber 101, and the cooling component is connected to the side of the bottom plate 13 away from the condensation chamber 102; the partition plate 14 is provided with a first opening 141 and / or a second opening 142, and the condensation chamber 102 and the vaporization chamber 101 are connected through the first opening 141 and / or the second opening 142.

[0093] In some embodiments, the first opening 141 and the second opening 142 are located on opposite sides of the partition 14.

[0094] In some embodiments, the heat dissipation device further includes a porous body 3; the porous body 3 is disposed in the vaporization chamber 101, one side of the porous body 3 is connected to the partition plate 14, and the other side of the porous body 3 is connected to the cover plate 12.

[0095] In some embodiments, a condensation column 131 is provided on the side of the base plate 13 near the condensation chamber 102.

[0096] In some embodiments, a gap is provided between the condenser column 131 and the partition plate 14.

[0097] In some embodiments, along the thickness direction of the partition 14, the projection of the first opening 141 is located within the projection of the porous body 3, and the end of the condensing column 131 passes through the first opening 141 and is connected to the porous body 3; an air passage is formed between the outer peripheral surface of the condensing column 131 and the porous body 3, and the air passage is connected to the first opening 141.

[0098] In some embodiments, the condenser column 131 is a cylindrical structure; or, the condenser column 131 is a column, and the outer peripheral surface of the column is provided with grooves spaced apart along its circumference.

[0099] In some embodiments, the cooling component is an electronic control housing 5, which has a cooling cavity 51 inside. The electronic control housing 5 is sealed to the base plate 13 to seal the cooling cavity 51.

[0100] In some embodiments, a heat-conducting column is provided on the side of the base plate 13 near the cooling cavity 51, and the first heat-conducting column is inserted into the cooling cavity 51.

[0101] In some embodiments, the heat dissipation device includes a vaporization shell 6, a condensing plate 71, a first pipe 61, and a second pipe 62; the vaporization shell 6 is provided with a vaporization chamber 101, and the heating element 2 is connected to the side of the vaporization shell 6 away from the condensing chamber 102; the condensing plate 71 is provided with a condensing chamber 102, and the condensing plate 71 and the cooling component are stacked and connected to each other; the first pipe 61 and the second pipe 62 are provided between the condensing chamber 102 and the vaporization chamber 101, and the condensing chamber 102 is connected to the vaporization chamber 101 through the first pipe 61 and the second pipe 62.

[0102] In some embodiments, there are multiple vaporization chambers 101, and each vaporization chamber 101 corresponds to a bridge arm.

[0103] This application also provides a motor controller, which includes a heating element 2 and a heat dissipation device as described in any of the foregoing embodiments. The heating element 2 is connected to the side of the vaporization chamber 101 in the heat dissipation device that faces away from the condensation chamber 102. For example, the heating element 2 can be a power module, which can be directly soldered onto the vaporization chamber 101.

[0104] During the cooling process of the heat dissipation device, the relatively high-temperature gaseous medium flows into the condensation chamber 102 and condenses to form a relatively low-temperature liquid medium. The liquid medium flows back into the vaporization chamber 101 for the next vaporization. In this way, the entire cooling process realizes the phase change of the cooling medium from liquid to gas and then from gas to liquid, which effectively improves the cooling efficiency of the heat dissipation device. This helps to achieve rapid and efficient cooling of the heat-generating element 2, helps to maintain the reliability of the electronic control assembly, and extends the service life of the motor controller.

[0105] This application also provides an electronic control assembly, which includes the heat dissipation device described in any of the foregoing embodiments, or includes the aforementioned motor controller.

[0106] During the cooling process of the heat dissipation device, the relatively high-temperature gaseous medium flows into the condensation chamber 102 and condenses to form a relatively low-temperature liquid medium. The liquid medium flows back into the vaporization chamber 101 for the next vaporization. In this way, the entire cooling process realizes the phase change of the cooling medium from liquid to gas and then from gas to liquid, which effectively improves the cooling efficiency of the heat dissipation device. This helps to achieve rapid and efficient cooling of the heat-generating element 2, helps to maintain the reliability of the electronic control assembly, and extends the service life of the electronic control assembly.

[0107] This application also provides a vehicle, which includes the aforementioned motor controller or electronic control assembly. The vehicle may include pure electric vehicles, hybrid vehicles, range-extended vehicles, gasoline vehicles, etc., and this application does not limit the specific type of vehicle. The vehicle type may also include small cars, mid-size cars, sedans, trucks, trailers, CDVs (Car Derived Vans), MPVs (Multi-Purpose Vehicles), SUVs (Sport Utility Vehicles), etc., and this application does not limit the specific type of vehicle.

[0108] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0109] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A heat dissipation device, characterized in that, Includes vaporization chamber, condensation chamber, and cooling components; The vaporization chamber contains a cooling medium, and the vaporization chamber is adapted to vaporize the cooling medium to form a gaseous medium; The condensation chamber is connected to the vaporization chamber, and the condensation chamber is adapted to condense the gaseous medium into a liquid medium. The cooling component is connected to the side of the condensation chamber opposite to the vaporization chamber.

2. The heat dissipation device according to claim 1, characterized in that, Includes the shell, cover plate, and base plate; The cover plate and the bottom plate are connected to opposite sides of the housing, and a partition is provided inside the housing; The vaporization chamber is formed between the cover plate and the partition plate, and the condensation chamber is formed between the bottom plate and the partition plate.

3. The heat dissipation device according to claim 2, characterized in that, The partition is provided with a first opening and / or a second opening, and the condensation chamber and the vaporization chamber are connected through the first opening and / or the second opening.

4. The heat dissipation device according to claim 3, characterized in that, The first opening and the second opening are located on opposite sides of the partition.

5. The heat dissipation device according to claim 3, characterized in that, It also includes porous materials; The porous body is disposed in the vaporization chamber, one side of the porous body is connected to the partition plate, and the opposite side of the porous body is connected to the cover plate.

6. The heat dissipation device according to claim 5, characterized in that, A condensation column is provided on the side of the base plate near the condensation chamber.

7. The heat dissipation device according to claim 6, characterized in that, A gap is provided between the condenser column and the partition plate.

8. The heat dissipation device according to claim 6, characterized in that, Along the thickness direction of the partition, the projection of the first opening is located within the projection of the porous body, and the end of the condensation column passes through the first opening and is connected to the porous body. An air passage is formed between the outer peripheral surface of the condensation column and the porous body, and the air passage is connected to the first opening.

9. The heat dissipation device according to claim 8, characterized in that, The outer circumferential surface of the condensation column is provided with a groove extending along its axial direction.

10. The heat dissipation device according to claim 9, characterized in that, The grooves are spaced apart circumferentially along the condensation column.

11. The heat dissipation device according to claim 1, characterized in that, Includes vaporization shell, condenser plate, first pipeline and second pipeline; The vaporization shell is provided with the vaporization chamber, the condensation plate is provided with the condensation chamber, and the condensation plate and the cooling component are stacked and connected to each other; The first pipe and the second pipe are located between the condensation chamber and the vaporization chamber, and the condensation chamber is connected to the vaporization chamber through the first pipe and the second pipe.

12. The heat dissipation device according to any one of claims 1-11, characterized in that, There are multiple vaporization chambers, and each vaporization chamber corresponds to a bridge arm.

13. A motor controller, characterized in that, The motor controller includes a heating element and a heat dissipation device as described in any one of claims 1-11, wherein the heating element is connected to the side of the vaporization chamber opposite to the condensation chamber.

14. An electronic control assembly, characterized in that, It includes the heat dissipation device according to any one of claims 1-12, or the motor controller according to claim 13.

15. A vehicle, characterized in that, It includes the motor controller of claim 13, or the electronic control assembly of claim 14.

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