A heat dissipation device, motor controller, electric control assembly and vehicle

Abstract

The embodiment of the application provides a heat dissipation device, a motor controller, an electric control assembly and a vehicle, the heat dissipation device comprises: a phase change member and a cooling member; the cooling member and the phase change member form a cooling channel; the first cooling medium is arranged in the phase change member, and the second cooling medium is arranged in the cooling channel. In this way, the gas-liquid phase change cycle can be formed in the phase change member, and the cooling target component connected to the phase change member can be cooled and cooled. And the second cooling medium in the cooling channel can take away the heat transferred to the phase change member, and further cooling and cooling, improve the heat dissipation effect.

Description

Technical Field

[0001] This application belongs to the field of heat dissipation equipment technology, specifically relating to a heat dissipation device, a motor controller, an electronic control assembly, and a vehicle. Background Technology

[0002] Vehicle electric drive systems typically include power modules. The chips and other heat-generating components within these power modules generate significant heat during operation. Therefore, cooling devices are used to cool and reduce the temperature, which plays a crucial role in maintaining the electrical performance of the power modules.

[0003] In existing technologies, heat dissipation devices typically include a liquid cooling plate and a heat sink, which together form a cooling channel. The side of the heat sink away from the liquid cooling plate is connected to the heat-generating element. A flowing cooling medium is introduced into the cooling channel to remove the heat generated by the heat-generating element. However, the cooling medium in the cooling channel is difficult to remove heat in time, resulting in poor cooling performance of the heat dissipation device. Summary of the Invention

[0004] In view of the above problems, the present invention is proposed to provide a heat dissipation device, motor controller, electronic control assembly and vehicle that overcome or at least partially solve the above problems.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] In a first aspect, embodiments of this application provide a heat dissipation device, which includes: a phase change component and a cooling component;

[0007] The cooling component and the phase change component form a cooling channel;

[0008] The phase change component contains a first cooling medium, and the cooling channel contains a second cooling medium.

[0009] Optionally, the cooling channel is formed by the cooling component and the phase change component enclosing each other.

[0010] Optionally, the first cooling medium flows in the phase change member, and / or the second cooling medium flows in the cooling channel.

[0011] Optionally, the heat dissipation device includes a heat-conducting element disposed within the cooling channel, and the heat-conducting element is respectively connected to the phase change component and the cooling component.

[0012] Optionally, the number of heat-conducting elements may include multiple elements, which are spaced apart.

[0013] Optionally, the heat-conducting element is integrally formed with the phase change component, and / or the heat-conducting element is integrally formed with the cooling component.

[0014] Optionally, the heat-conducting component and the phase change component are integrally formed by cold forging, or the heat-conducting component and the cooling component are integrally formed by cold forging.

[0015] Optionally, the heat-conducting component is welded to the phase change component, or the heat-conducting component is welded to the cooling component.

[0016] Optionally, the heat-conducting component and the phase change component are connected by diffusion welding or brazing, or the heat-conducting component and the cooling component are connected by diffusion welding or brazing.

[0017] Optionally, the heat-conducting element is a plurality of spaced heat-conducting columns.

[0018] Optionally, the phase change component includes a bottom shell, a cover plate, and a capillary structure;

[0019] The bottom shell is connected to the cover plate to form a receiving cavity, the first cooling medium is contained in the receiving cavity, and the capillary structure is disposed in the receiving cavity.

[0020] Optionally, the phase change component includes a support member disposed within the accommodating cavity, and the support member is connected to the bottom shell and the cover plate respectively.

[0021] Optionally, the phase change component is a temperature equalization plate.

[0022] Optionally, the cooling component includes a liquid cooling plate, the liquid cooling plate has a first cavity, and the phase change component is connected to the liquid cooling plate to seal the first cavity.

[0023] Optionally, the cooling component includes a housing of a motor controller, the housing having a second cavity, and the phase change component connected to the housing to seal the second cavity.

[0024] Optionally, the heat dissipation device includes a seal connected between the housing and the phase change component.

[0025] Optionally, the phase change component has multiple independent cavities.

[0026] Optionally, the number of phase change components may include multiple components.

[0027] Optionally, the heat dissipation device includes a water inlet and a water outlet, both of which are connected to the cooling channel;

[0028] The water inlet is connected to one of the phase change component and the cooling component, and the water outlet is connected to one of the phase change component and the cooling component.

[0029] Secondly, embodiments of this application propose a motor controller, which includes the heat dissipation device and the cooling target component of the heat dissipation device.

[0030] Optionally, the cooling target component includes a power module located on the side of the phase change component opposite to the cooling component.

[0031] Optionally, the power module includes a converter bridge circuit, each half-bridge of the converter bridge circuit corresponding to one cavity of the phase change component, or each half-bridge of the converter bridge circuit corresponding to one of the phase change components.

[0032] Thirdly, embodiments of this application propose an electronic control assembly, which includes the motor controller or the heat dissipation device.

[0033] Fourthly, embodiments of this application propose a vehicle, which includes the electronic control assembly, or the motor controller, or the cooling device.

[0034] In this embodiment, the heat dissipation device may specifically include: a phase change component and a cooling component; the cooling component and the phase change component form a cooling channel; a first cooling medium is disposed within the phase change component, and a second cooling medium is disposed within the cooling channel. The phase change component may include a first side and a second side disposed opposite to each other. The first cooling medium cools the first side through phase change, and the second cooling medium cools the second side. When the target component generates heat, the first side of the phase change component vaporizes the first cooling medium to form a gaseous medium, i.e., the first side can be an evaporation end. Then, the vaporized first cooling medium is transferred to the second side of the phase change component. The lower temperature of the second side allows the first cooling medium to condense into a liquid medium. Furthermore, the second cooling medium in the cooling channel can also enhance the condensation effect of the first cooling medium near the second side. Then, the liquid medium flows back to the first side of the phase change component, forming a gas-liquid phase change cycle to cool the target component connected to the phase change component. Furthermore, when heat is transferred from the first side to the second side of the phase change component, the second cooling medium flowing in the cooling channel can carry away the heat from the second side, further cooling the target component on the phase change component, thereby achieving efficient heat conduction and improving the cooling effect of the heat dissipation device.

[0035] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0036] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0037] Figure 1 This is a schematic diagram of the structure of a heat dissipation device according to an embodiment of this application;

[0038] Figure 2 This is an exploded structural diagram of a heat dissipation device according to an embodiment of this application;

[0039] Figure 3 This is another exploded structural diagram of a heat dissipation device according to an embodiment of this application;

[0040] Figure 4 This is a schematic diagram of the structure of a phase change component of a heat dissipation device according to an embodiment of this application;

[0041] Figure 5 This is a phase change component of a heat dissipation device described in the embodiments of this application. Figure 4 A schematic diagram of the cross-sectional structure;

[0042] Figure 6 This is a cross-sectional structural schematic diagram of the phase change component of a heat dissipation device according to an embodiment of this application;

[0043] Figure 7 This is a schematic diagram of the structure of a cooling component of a heat dissipation device according to an embodiment of this application.

[0044] Reference numerals: 10-Phase change component; 20-Cooling component; 11-First side; 12-Second side; 30-Heat conduction component; 13-Bottom shell; 14-Cover plate; 15-Capillary structure; 16-Support component; 21-Liquid cooling plate; 211-First cavity; 22-Shell; 221-Second cavity; 17-Cavity; 40-Inlet; 50-Outlet. Detailed Implementation

[0045] Embodiments of the present invention will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0046] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this invention, unless otherwise stated, "a plurality of" means two or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0047] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0048] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0049] Reference Figures 1 to 7 The diagram shows a structural schematic of a heat dissipation device according to an embodiment of this application. The heat dissipation device may specifically include: a phase change component 10 and a cooling component 20; the cooling component 20 and the phase change component 10 enclose a cooling channel; a first cooling medium flows inside the phase change component 10, and a second cooling medium flows inside the cooling channel; the phase change component 10 includes a first side 11 and a second side 12 disposed opposite to each other, the first cooling medium cools the first side 11 by phase change, and the second cooling medium is used to cool the second side 12.

[0050] Specifically, in this embodiment, the phase change component 10 contains a first cooling medium. The phase change component 10 includes a first side 11 and a second side 12 disposed opposite to each other. The outer wall of the first side 11 is used to connect to the heating element. When the heating element generates heat, the first side 11 of the phase change component 10 vaporizes the first cooling medium to form a gaseous medium, that is, the first side 11 can be an evaporation end. Then, the vaporized first cooling medium is transferred to the second side 12 of the phase change component 10. The lower temperature of the second side 12 allows the first cooling medium to condense into a liquid medium. Furthermore, the second cooling medium in the cooling channel can also enhance the condensation effect on the first cooling medium near the second side 12. Then, the liquid medium flows back to the first side 11 of the phase change component 10, forming a gas-liquid phase change cycle, which cools the heating element connected to the phase change component 10. Furthermore, when heat is transferred from the first side 11 to the second side 12 of the phase change component 10, the second cooling medium flowing in the cooling channel can carry away the heat from the second side 12, further cooling the heating element on the phase change component 10, thereby achieving efficient heat conduction and improving the cooling effect of the heat dissipation device. When the heating element generates heat, the first side 11 of the phase change component 10 vaporizes the first cooling medium to form a gaseous medium, that is, the first side 11 can be an evaporation end. Then, the vaporized first cooling medium is transferred to the second side 12 of the phase change component 10. The lower temperature of the second side 12 allows the first cooling medium to condense into a liquid medium. In addition, the second cooling medium in the cooling channel can also enhance the condensation effect of the first cooling medium near the second side 12. Then, the liquid medium flows back to the first side 11 of the phase change component 10, forming a gas-liquid phase change cycle, which cools the heating element connected to the phase change component 10. Furthermore, when heat is transferred from the first side 11 of the phase change component 10 to the second side 12, the second cooling medium flowing in the cooling channel can carry away the heat from the second side 12, further cooling the heating element on the phase change component 10, thereby achieving efficient heat conduction and improving the cooling effect of the heat dissipation device.

[0051] In other embodiments of this application, the heat dissipation device may specifically include: a phase change component 10 and a cooling component 20; the cooling component 20 and the phase change component 10 form a cooling channel; a first cooling medium is provided in the phase change component 10, and a second cooling medium is provided in the cooling channel. Specifically, when a heat-generating element, such as a power module, generates heat through its converter bridge circuit, the first cooling medium in the phase change component 10 vaporizes upon heating, absorbing the heat generated by the heat-generating element. Then, the vaporized first cooling medium is transferred towards the cooling channel, where the second cooling medium promptly removes the heat. Furthermore, the vaporized first cooling medium liquefies upon cooling, forming a gas-liquid phase change cycle. The condensation effect is further enhanced by the second cooling medium, causing the condensed and liquefied first cooling medium to flow back and further absorb the heat generated by the heat-generating element. Thus, through the gas-liquid phase change cycle of the first cooling medium in the phase change component 10 and the timely removal of heat by the second cooling medium in the cooling channel, the heat dissipation device achieves efficient heat conduction, greatly improving the cooling effect on the heat-generating element.

[0052] Optionally, in this embodiment, the cooling channel is formed by the cooling member 20 and the phase change member 10 enclosing each other; that is, the cooling channel can be formed solely by the cooling member 20 and the phase change member 10 enclosing each other. For example, a groove can be provided on the cooling member 20, and the phase change member 10 can be closed within the groove opening of the cooling member 20 to form the cooling channel. Alternatively, a groove can be provided on the phase change member 10, and the cooling member 20 can be closed within the groove opening of the phase change member 10 to form the cooling channel. Alternatively, grooves can be provided on both the phase change member 10 and the cooling member 20, and the two can be assembled and aligned to form the cooling channel, etc.

[0053] In addition, the cooling component 20 and the phase change component 10 can be spaced apart, and the side wall structure can be placed between the cooling component 20 and the phase change component 10, so that the cooling component 20, the phase change component 10 and the side wall structure enclose and form a cooling channel. Alternatively, more than four or five structures can be set to enclose and form a cooling channel. The specific formation method of the cooling channel is not limited in the embodiments of this application.

[0054] Optionally, in this embodiment, the first cooling medium flows in the phase change member 10, and / or the second cooling medium flows in the cooling channel. Specifically, the first cooling medium vaporizes upon heating on the first side 11 of the phase change member 10, absorbing heat. Then, the vaporized first cooling medium flows towards the direction where the cooling channel is located on the second side 12 of the phase change member 10, and flows back to one side of the phase change member 10 under the condensation effect of the cooling channel, thus circulating within the phase change member 10. Furthermore, the second cooling medium can be introduced into the inlet of the cooling channel and discharged from the outlet of the cooling channel after absorbing heat, thereby achieving circulation of the second cooling medium within the cooling channel, promptly removing heat and improving heat dissipation efficiency. Alternatively, the second cooling medium can be enclosed within the cooling channel without flowing, improving sealing.

[0055] In the embodiments of this application, the heating element can also be referred to as the cooling target component, that is, the component that generates heat during operation and needs to be cooled. In the embodiments of this application, the heating element and the cooling target component refer to the same object.

[0056] For example, in the embodiments of this application, in addition to the power module, the target component for cooling can also be a sensor, drive module, control module or power supply module, etc., which will generate a lot of heat during operation and need to be dissipated to ensure good electrical performance. The specific type of the target component for cooling is not limited in the embodiments of this application.

[0057] In this embodiment of the application, the phase change component 10 and the cooling component 20 can be welded together, for example, by diffusion welding or brazing, or by laser welding, etc., and can be set according to actual needs. This embodiment of the application does not limit the specific connection method between the phase change component 10 and the cooling component 20.

[0058] For example, in the embodiments of this application, the first cooling medium and the second cooling medium can be deionized water, ethanol or acetone, etc. The types of the first cooling medium and the second cooling medium can be the same or different. The specific types of the first cooling medium and the second cooling medium are not limited in the embodiments of this application.

[0059] Optionally, in this embodiment, the heat dissipation device includes a heat-conducting element 30, which is disposed within the cooling channel and connected to both the phase change component 10 and the cooling component 20. This allows the heat absorbed by the phase change component 10 to be directly transferred to the cooling component 20 via the heat-conducting element 30, improving the speed and efficiency of heat transfer. Furthermore, the increased circumferential surface of the heat-conducting element 30 allows for more thorough contact between the second cooling medium and the heat-conducting element 30, thereby removing more heat and further improving heat dissipation efficiency.

[0060] For example, in the embodiments of this application, the number of heat-conducting elements 30 includes multiple elements, and the multiple heat-conducting elements 30 are arranged at intervals, such as in an array or evenly distributed. The arrangement can be set according to the actual needs based on the heat generation of the target component being cooled. The specific distribution method of the multiple heat-conducting elements 30 is not limited in the embodiments of this application.

[0061] In some optional embodiments of this application, the phase change component 10 can be a heat spreader, and the cooling component 20 can include a liquid cooling plate 21. For example, a groove can be formed in the liquid cooling plate 21 to form a first cavity 211. The heat spreader covers the groove of the liquid cooling plate 21 to seal the first cavity 211. After the two are matched and aligned, they are welded together to form a closed cooling channel. Alternatively, a groove can be formed on the heat spreader to form the first cavity 211, or grooves can be formed on both the liquid cooling plate 21 and the heat spreader to form the first cavity 211. The specific formation method of the first cavity 211 is not limited in the embodiments of this application.

[0062] Optionally, in this embodiment, the heat-conducting component 30 is integrally formed with the phase change component 10, and / or, the heat-conducting component 30 is integrally formed with the cooling component 20. This allows the heat-conducting component 30 and the phase change component 10 to be manufactured simultaneously using the same material, and then welded together with the cooling component 20, resulting in a higher connection strength between the heat-conducting component 30 and the phase change component 10, and reducing material loss and manufacturing processes. Alternatively, the heat-conducting component 30 and the cooling component 20 can also be manufactured simultaneously using the same material, and then welded together with the phase change component 10, resulting in a higher connection strength between the heat-conducting component 30 and the cooling component 20, and reducing material loss and manufacturing processes. Alternatively, the heat-conducting component 30, the phase change component 10, and the cooling component 20 can be integrally formed simultaneously, further improving the connection strength among the three components and reducing material loss and manufacturing processes. The specific forming method of the heat-conducting component 30, the phase change component 10, and the cooling component 20 is not limited in this embodiment.

[0063] Optionally, in this embodiment, the heat-conducting component 30 can be formed integrally with the liquid cooling plate 21 by cold forging. This allows the heat-conducting component 30 and the liquid cooling plate 21 to be made of the same material, eliminating the need for a weld layer. This reduces thermal resistance during subsequent welding with the heat spreader. Furthermore, welding typically requires high temperatures, such as 800°C. The cold forging method used in this application also avoids deformation of the heat-conducting component 30 caused by high-temperature processing, ensuring good structural strength. After forming the liquid cooling plate 21 with the heat-conducting component 30, the heat spreader is then welded to the liquid cooling plate 21, for example, by diffusion welding or brazing. This results in high connection strength, good thermal conductivity, and good sealing between the heat spreader and the liquid cooling plate 21, completing the fabrication of the heat dissipation device.

[0064] In some other embodiments of this application, optionally, the heat-conducting component 30 can be formed into an integral structure with the heat spreader plate by cold forging. In this way, the heat-conducting component 30 and the heat spreader plate can be made of the same material, without the formation of a weld layer. This reduces the thermal resistance generated during subsequent welding with the liquid cooling plate 21. Welding usually requires high temperatures, and the use of cold forging in this application can also avoid the deformation effect of high-temperature processing on the heat-conducting component 30, thus maintaining good structural strength of the heat-conducting component 30. After forming the heat spreader plate with the heat-conducting component 30, the liquid cooling plate 21 is then welded to the heat spreader plate, such as by diffusion welding or brazing, so that the liquid cooling plate 21 and the heat spreader plate have high connection strength, good thermal conductivity, and good sealing performance, etc., thus completing the fabrication of the heat dissipation device.

[0065] Optionally, the heat dissipation device includes an inlet 40 and an outlet 50, both of which are connected to a cooling channel. The inlet 40 is connected to one of the phase change component 10 and the cooling component 20, and the outlet 50 is connected to the other of the phase change component 10 and the cooling component 20. For example, an inlet 40 can be provided at one end of the liquid cooling plate 21, and an outlet 50 can be provided at the other end of the heat exchange plate. The inlet 40, the outlet 50, and the cooling channel are connected. The second cooling medium is introduced into the cooling channel through the inlet 40 and then output through the outlet 50, thus achieving circulation of the second cooling medium. Alternatively, an inlet 40 can be provided at one end of the heat exchange plate, and an outlet 50 at the other end of the liquid cooling plate 21, etc., which can also achieve circulation of the second cooling medium. This embodiment of the application does not limit this aspect.

[0066] In other embodiments of this application, the inlet 40 is connected to one of the phase change component 10 and the cooling component 20, and the outlet 50 is connected to one of the phase change component 10 and the cooling component 20. That is, in addition to setting the inlet 40 in one of the phase change component 10 and the cooling component 20 and setting the outlet 50 in the other, both the inlet 40 and the outlet 50 can be set in the phase change component 10, or both the inlet 40 and the outlet 50 can be set in the cooling component 20. The specific setting method of the inlet 40 and the outlet 50 is not limited in the embodiments of this application.

[0067] In other optional embodiments of this application, the phase change component 10 can be a heat spreader, and the cooling component 20 can be an electronic control housing 22. For example, a groove can be provided in the electronic control housing 22, and the heat spreader covers the groove of the electronic control housing 22. After the two are assembled and aligned, the perimeter of the electronic control housing 22 is sealed by a sealing element, so that the heat spreader and the electronic control housing 22 are assembled together to form an open cooling channel. Specifically, in the embodiments of this application, the heat spreader and the electronic control housing 22 are not fixedly connected, and the two are assembled to form a cooling channel. Therefore, the cooling channel formed by the heat spreader and the electronic control housing 22 is called an open cooling channel.

[0068] In other optional embodiments of this application, the phase change component 10 can be a heat spreader, and the cooling component 20 can include the housing 22 of the motor controller, such as the electrical control housing 22. Furthermore, the cooling component 20 can also include other structures of the target cooling component, such as an inlet 40 or an outlet 50, etc. In this embodiment, the housing 22 and the electrical control housing 22 refer to the same object. For example, a groove can be provided in the housing 22 to form a second cavity 221. The heat spreader covers the groove of the housing 22, sealing the second cavity 221. After the two are assembled and aligned, a sealing element seals the perimeter of the housing 22, thus forming an open cooling channel after the heat spreader and housing 22 are assembled together. Specifically, in this embodiment, the heat spreader and housing 22 are not fixedly connected; they form a cooling channel through assembly. Therefore, the cooling channel formed by the heat spreader and housing 22 can be called an open cooling channel.

[0069] In this embodiment, the housing 22 of the motor controller is used as part of the cooling component 20. That is, the heat dissipation device and the motor controller share the housing 22. Besides serving as the outer shell of the motor controller, the housing 22 also forms part of the cooling channel in the heat dissipation device to accommodate the second cooling medium. Compared to the aforementioned solutions, this embodiment uses the housing 22 as the cooling component 20, eliminating the need for the liquid cooling plate 21. The phase change component 10 can be directly connected to the housing 22, facilitating an integrated design of the heat dissipation device and the motor controller, reducing the number of components, thereby reducing the overall space occupied by the device, improving space utilization, and lowering production costs.

[0070] For example, in this embodiment, the target component for cooling is a heat-generating component that easily produces heat during operation, such as a power module. Specifically, the power module includes a converter bridge circuit, which generates a significant amount of heat when energized during operation. Furthermore, the target component for cooling can also be a sensor, drive module, control module, or power supply module, etc., which also include operating circuits that generate considerable heat.

[0071] Optionally, in this embodiment, the heat spreader is connected to the housing 22 as a phase change component. A groove can be provided in the housing 22 to form a second cavity 221. The heat spreader is covered by the groove of the housing 22 to seal the second cavity 221 and form a cooling channel. Alternatively, a groove can be provided on the heat spreader to form the second cavity 221, or grooves can be provided on both the housing 22 and the heat spreader to form the second cavity 221, so that the two are assembled and aligned to form a cooling channel. The specific formation method of the second cavity 221 is not limited in this embodiment.

[0072] For example, in this embodiment, the seal between the heat spreader and the housing 22 can be a sealing ring or a sealing strip, etc., to prevent leakage. The material of the seal can be silicone or rubber, etc., and this embodiment does not limit the specific type and material of the seal.

[0073] Optionally, in this embodiment, the heat-conducting component 30 can be cold-forged to form an integral structure with the heat spreader plate. This allows the heat-conducting component 30 and the heat spreader plate to be made of the same material, reducing material loss and increasing the connection strength between them, thus minimizing material waste and manufacturing steps. After forming the heat spreader plate with the heat-conducting component 30, the housing 22 is then assembled with the heat spreader plate to complete the heat dissipation device.

[0074] For example, in this embodiment, the heat-conducting element 30 can be multiple spaced heat-conducting pillars to increase the heat dissipation area. These pillars can be arranged in an array or uniformly according to actual heat dissipation needs. Preferably, the diameter of the heat-conducting pillar is 1.5 mm, and the spacing between two adjacent pillars is 1 mm. Alternatively, the diameter of the heat-conducting pillar can be any value between 0 and 5 mm, such as 1 mm, 1.3 mm, or 1.6 mm, etc., and this embodiment does not limit this. Similarly, the spacing between two adjacent heat-conducting pillars can be any value between 0 and 3 mm, such as 0.8 mm, 0.9 mm, or 1.5 mm, etc., and this embodiment also does not limit this.

[0075] In the embodiments of this application, for example, the heat-conducting pillar can be a cylinder, a cuboid pillar, a hexagonal pillar, an octagonal pillar, or other irregular shapes, etc. The specific shape type of the heat-conducting pillar is not limited in the embodiments of this application.

[0076] Optionally, in one or more embodiments of this application, the cooling target component, such as an embedded power module, can be directly soldered to the upper surface of the heat spreader. For example, a solder layer may be provided between the heat spreader and the embedded module, and the heat spreader and the embedded module are soldered together by methods such as soldering or sintering. For example, in embodiments of this application, the heat spreader may be made of oxygen-free copper, and the soldering surfaces of the heat spreader and the embedded module may be made of bare copper, silver-plated, nickel-plated, etc., to achieve a soldered connection between the heat spreader and the embedded module.

[0077] In one or more embodiments of this application, such as Figure 6 As shown, the internal structure of the vapor chamber can also be divided into multiple independent cavities 17, such as two, three, or four. In practical applications, the vapor chamber is usually placed vertically along its length. Therefore, under the influence of gravity, the structure near the bottom absorbs and contains more of the first cooling medium, resulting in less space for the gas formed by phase change to escape, which is not conducive to thermal circulation within the vapor chamber. Therefore, dividing the vapor chamber into multiple cavities 17 can make the heat dissipation effect on the converter bridge circuit of the target component more consistent in the upper, middle, and lower positions along the length direction (i.e., the direction of gravity), further improving the heat dissipation effect.

[0078] For example, in this embodiment, multiple grooves are provided on the bottom shell 13 of the heat spreader, or multiple partition plates are provided in one groove of the bottom shell 13 to divide the bottom shell 13 into multiple independent spaces, and the cover plate 14 is connected to the bottom shell 13 to form multiple independent cavities 17, etc. For example, the number of cover plates 14 can be multiple, and multiple cover plates 14 respectively cover multiple cavities 17 to seal them. In addition, the number of cover plates 14 can be set to one, and a large cover plate 14 can cover multiple cavities 17 to seal them. This embodiment does not limit this.

[0079] In this embodiment, the power module of the motor controller includes a converter bridge circuit, which may specifically include three half-bridges: a U-phase half-bridge, a V-phase half-bridge, and a W-phase half-bridge. For example, the heat spreader may be provided with three independent cavities 17, which may correspond to the U, V, and W half-bridges respectively, thereby providing targeted heat dissipation and cooling for each half-bridge and improving the heat dissipation effect.

[0080] In some alternative embodiments of this application, the number of heat exchangers may be multiple, with each heat exchanger connected to the liquid cooling plate 21 or the housing 22, and each phase change component 10 corresponding to one half-bridge. Similarly, three heat exchangers may correspond to the U-phase half-bridge, V-phase half-bridge, and W-phase half-bridge, respectively, and each heat exchanger can specifically cool down each half-bridge to improve the heat dissipation effect.

[0081] For example, in this embodiment of the application, the phase change component 10 may specifically include a bottom shell 13, a cover plate 14, and a capillary structure 15. The bottom shell 13 is connected to the cover plate 14 to form a receiving cavity. The side of the bottom shell 13 away from the cover plate 14 is the first side 11, and the side of the cover plate 14 away from the bottom shell 13 is the second side 12. The first cooling medium is contained in the receiving cavity, and the capillary structure 15 is disposed within the receiving cavity. The receiving cavity can be in a vacuum state, providing a closed space so that the first cooling medium can circulate within the receiving cavity. The capillary structure 15 provides the driving force for the first cooling medium to flow back to the first side 11 when the second side 12 is condensed liquid. When the first cooling medium evaporates from the first side 11 to the second side 12 after being heated, the first cooling medium after condensation on the second side 12 is flowed back to the evaporation zone of the first side 11 through capillary action, forming a circulating cooling.

[0082] In this embodiment, the phase change component 10 may include a bottom shell 13, a cover plate 14, and a capillary structure 15. The bottom shell 13 is connected to the cover plate 14 to form a receiving cavity, the first cooling medium is contained in the receiving cavity, and the capillary structure 15 is disposed within the receiving cavity. For example, the bottom shell 13 and the cover plate 14 may be configured to enclose the receiving cavity together. For instance, a groove may be provided in the bottom shell 13, and the cover plate 14 may be closed on the groove of the bottom shell 13 to enclose the receiving cavity; or a groove may be provided in the cover plate 14, and the bottom shell 13 may be closed on the groove of the cover plate 14 to enclose the receiving cavity; or grooves may be provided on both the bottom shell 13 and the cover plate 14, and the two may be assembled and aligned to enclose the receiving cavity. In addition, the bottom shell 13 and the cover plate 14 can be spaced apart, and the side plate can be connected between the bottom shell 13 and the cover plate 14. The bottom shell 13, the cover plate 14 and the side plate can be used to enclose and form a cavity. Alternatively, four or five more structures can be used to enclose and form a cavity. The specific formation method of the cavity is not limited in the embodiments of this application.

[0083] Optionally, in this embodiment, the phase change component 10 includes a support member 16, which is disposed within the accommodating cavity and is connected to the bottom shell 13 and the cover plate 14 respectively. The support member 16 resists the indentation caused by vacuum negative pressure and the deformation caused by thermal expansion, ensuring the structural stability of the accommodating cavity formed by the bottom shell 13 and the cover plate 14.

[0084] For example, in this embodiment, the phase change component 10 can be a heat spreader, also known as a superconducting heat plate, which is a heat dissipation technology that transfers heat through liquid-vapor phase change. Specifically, the heat spreader may include a bottom shell 13, a cover plate 14, a capillary structure 15, and support columns; the bottom shell 13 is connected to the cover plate 14 to form a receiving cavity, in which the first cooling medium is contained, and the capillary structure 15 is disposed within the receiving cavity. The support columns are disposed within the receiving cavity and connected to the bottom shell 13 and the cover plate 14 respectively.

[0085] For example, in this embodiment, the bottom shell 13 and the cover plate 14 can be made of a high thermal conductivity material such as copper, so that the heat spreader has good thermal conductivity. The bottom shell 13 is connected to the cover plate 14 to form a cavity. The cavity is in a vacuum state, providing a closed space, so that the first cooling medium can circulate in the cavity to achieve heat transfer.

[0086] In this embodiment, the capillary structure 15 can be a metal mesh, microgrooves, fiber filaments, or a sintered metal powder core, or a combination of these structures, such as copper powder sintering, copper mesh sintering, or a grooved capillary structure 15. The support pillars can be made of copper pillars or other high-strength materials to resist the indentation caused by vacuum negative pressure and the deformation caused by thermal expansion, ensuring the structural stability of the accommodating cavity formed by the bottom shell 13 and the cover plate 14.

[0087] In summary, the heat dissipation device described in the embodiments of this application may include at least the following advantages:

[0088] In this embodiment, the heat dissipation device may specifically include: a phase change component and a cooling component; the cooling component and the phase change component enclose a cooling channel; a first cooling medium flows within the phase change component, and a second cooling medium flows within the cooling channel. The phase change component may include a first side and a second side disposed opposite to each other. The first cooling medium cools the first side through phase change, and the second cooling medium cools the second side. When the target component generates heat, the first side of the phase change component vaporizes the first cooling medium to form a gaseous medium, i.e., the first side can be an evaporation end. Then, the vaporized first cooling medium is transferred to the second side of the phase change component. The lower temperature of the second side allows the first cooling medium to condense into a liquid medium. Furthermore, the second cooling medium in the cooling channel can also enhance the condensation effect of the first cooling medium near the second side. Then, the liquid medium flows back to the first side of the phase change component, forming a gas-liquid phase change cycle to cool the target component connected to the phase change component. Furthermore, when heat is transferred from the first side to the second side of the phase change component, the second cooling medium flowing in the cooling channel can carry away the heat from the second side, further cooling the target component on the phase change component, thereby achieving efficient heat conduction and improving the cooling effect of the heat dissipation device.

[0089] This application embodiment also provides a motor controller, which includes a cooling target component and the aforementioned heat dissipation device. The cooling target component is welded to the phase change component 10 of the heat dissipation device. For example, the cooling target component can be an embedded module, which can be directly welded to the phase change component 10, such as the upper surface of a heat spreader.

[0090] For example, in this embodiment of the application, a solder layer may be provided between the phase change component 10 and the embedded module, and the phase change component 10 and the embedded module may be welded together by means of soldering or sintering. For example, in this embodiment of the application, the phase change component 10 may be made of oxygen-free copper, and the welding surface between the phase change component 10 and the embedded module may be made of bare copper, silver-plated, nickel-plated, etc., so as to achieve a welded connection between the phase change component 10 and the embedded module.

[0091] Optionally, in this embodiment, the cooling target component includes a power module located on the side of the phase change component 10 away from the cooling component 20, that is, the power module is connected to the first side 11 of the phase change component 10, so that the heat generated by the power module can be directly transferred to the phase change component 10 for heat dissipation.

[0092] In this embodiment, optionally, the power module includes a converter bridge circuit, where each half-bridge of the converter bridge circuit corresponds to a cavity 17 of the phase change component 10, or each half-bridge of the converter bridge circuit corresponds to one phase change component 10. As mentioned above, in embodiments where the phase change component 10 has multiple cavities 17, each half-bridge of the converter bridge circuit can correspond one-to-one with multiple cavities 17 of the phase change component 10, allowing for targeted heat dissipation and cooling of each half-bridge to improve heat dissipation efficiency. In embodiments where there are multiple phase change components 10, each half-bridge of the converter bridge circuit corresponds one-to-one with multiple phase change components 10, allowing for targeted heat dissipation and cooling of each half-bridge to improve heat dissipation efficiency.

[0093] The motor controller described in this application embodiment may include at least the following advantages:

[0094] In this embodiment, the motor controller includes a cooling target component and a heat dissipation device, with the cooling target component welded to a phase change component of the heat dissipation device. Specifically, the heat dissipation device may include a phase change component and a cooling component; the cooling component and the phase change component enclose a cooling channel; a first cooling medium flows within the phase change component, and a second cooling medium flows within the cooling channel. The phase change component may include a first side and a second side disposed opposite to each other. The first cooling medium cools the first side through phase change, and the second cooling medium cools the second side. When the cooling target component generates heat, the first side of the phase change component vaporizes the first cooling medium to form a gaseous medium, i.e., the first side can be an evaporation end. The vaporized first cooling medium is then transferred to the second side of the phase change component. The lower temperature of the second side allows the first cooling medium to condense into a liquid medium. Furthermore, the second cooling medium within the cooling channel can enhance the condensation of the first cooling medium near the second side. The liquid medium then flows back to the first side of the phase change component, forming a gas-liquid phase change cycle to cool the cooling target component connected to the phase change component. Furthermore, when heat is transferred from the first side to the second side of the phase change component, the second cooling medium flowing in the cooling channel can carry away the heat from the second side, further cooling the target component on the phase change component, thereby achieving efficient heat conduction and improving the cooling effect of the heat dissipation device.

[0095] This application embodiment also provides an electronic control assembly, which includes the motor controller or the heat dissipation device.

[0096] In this embodiment, the electronic control assembly includes the motor controller, or the heat dissipation device. The motor controller includes a cooling target component and the heat dissipation device, with the cooling target component welded to the phase change component of the heat dissipation device. Specifically, the heat dissipation device may include a phase change component and a cooling component; the cooling component and the phase change component enclose a cooling channel; a first cooling medium flows within the phase change component, and a second cooling medium flows within the cooling channel. The phase change component may include a first side and a second side disposed opposite to each other. The first cooling medium cools the first side through phase change, and the second cooling medium cools the second side. When the cooling target component generates heat, the first side of the phase change component vaporizes the first cooling medium to form a gaseous medium, i.e., the first side can be an evaporation end. The vaporized first cooling medium is then transferred to the second side of the phase change component. The lower temperature of the second side allows the first cooling medium to condense into a liquid medium. Furthermore, the second cooling medium within the cooling channel can enhance the condensation of the first cooling medium near the second side. Then, the liquid medium flows back to the first side of the phase change component, forming a gas-liquid phase change cycle to cool the target component connected to the phase change component. Furthermore, as heat is transferred from the first side of the phase change component to the second side, the second cooling medium flowing within the cooling channel can carry away the heat from the second side, further cooling the target component on the phase change component, thereby achieving efficient heat conduction and improving the cooling effect of the heat dissipation device.

[0097] This application also provides a vehicle, which includes the electronic control assembly, or the motor controller, or the cooling device.

[0098] For example, in the embodiments of this application, the vehicle may include pure electric vehicles, hybrid vehicles, range-extended vehicles, fuel vehicles, etc. The type of vehicle may also include small cars, medium-sized cars, sedans, trucks, trailers, CDVs (Car Derived Vans), MPVs (multi-Purpose Vehicles), SUVs (Sport Utility Vehicles), etc. The specific type of vehicle is not limited in the embodiments of this application.

[0099] The vehicle described in this application embodiment may include at least the following advantages:

[0100] In this embodiment, the vehicle includes the electronic control assembly, or the motor controller, or the heat dissipation device. The electronic control assembly includes the motor controller, or the heat dissipation device. The motor controller includes a cooling target component and the heat dissipation device, and the cooling target component is welded to the phase change component of the heat dissipation device. The heat dissipation device may specifically include: a phase change component and a cooling component; the cooling component and the phase change component enclose a cooling channel; a first cooling medium flows within the phase change component, and a second cooling medium flows within the cooling channel. The phase change component may include a first side and a second side disposed opposite to each other. The first cooling medium cools the first side through phase change, and the second cooling medium cools the second side. When the cooling target component generates heat, the first side of the phase change component vaporizes the first cooling medium to form a gaseous medium, i.e., the first side can be an evaporation end. Then, the vaporized first cooling medium is transferred to the second side of the phase change component. The lower temperature of the second side allows the first cooling medium to condense into a liquid medium. Furthermore, the second cooling medium in the cooling channel can also enhance the condensation effect of the first cooling medium near the second side. Then, the liquid medium flows back to the first side of the phase change component, forming a gas-liquid phase change cycle to cool the target component connected to the phase change component. Furthermore, as heat is transferred from the first side of the phase change component to the second side, the second cooling medium flowing within the cooling channel can carry away the heat from the second side, further cooling the target component on the phase change component, thereby achieving efficient heat conduction and improving the cooling effect of the heat dissipation device.

[0101] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0102] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

[0103] Postscript:

[0104] This application provides a heat dissipation device, which includes a phase change component 10 and a cooling component 20;

[0105] The cooling component 20 and the phase change component 10 enclose each other to form a cooling channel;

[0106] The phase change component 10 is provided with a first flowing cooling medium, and the cooling channel is provided with a second flowing cooling medium.

[0107] The phase change component 10 includes a first side 11 and a second side 12 disposed opposite to each other. A first cooling medium cools the first side 11 by phase change, and a second cooling medium is used to cool the second side 12.

[0108] Optionally, the heat dissipation device includes a heat-conducting element 30, which is disposed in the cooling channel and is connected to the phase change component 10 and the cooling component 20 respectively.

[0109] Optionally, the number of heat-conducting elements 30 may include multiple elements, and the multiple heat-conducting elements 30 may be spaced apart.

[0110] Optionally, the heat-conducting component 30 and the phase change component 10 are integrally formed by cold forging, or the heat-conducting component 30 and the cooling component 20 are integrally formed by cold forging, in order to reduce thermal resistance and prevent deformation of the heat-conducting component 30.

[0111] Optionally, the heat-conducting component 30 and the phase change component 10 are connected by diffusion welding or brazing, or the heat-conducting component 30 and the cooling component 20 are connected by diffusion welding or brazing.

[0112] Optionally, the end of the heat-conducting component 30 away from the cooling component 20 is welded to the phase change component 10;

[0113] And / or, the end of the heat-conducting component 30 away from the phase change component 10 is welded to the cooling component 20.

[0114] Optionally, the heat-conducting element 30 consists of multiple spaced heat-conducting columns.

[0115] Optionally, the phase change component 10 includes a bottom shell 13, a cover plate 14, and a capillary structure 15;

[0116] The bottom shell 13 is connected to the cover plate 14 to form a receiving cavity. The side of the bottom shell 13 away from the cover plate 14 is the first side 11, and the side of the cover plate 14 away from the bottom shell 13 is the second side 12. The first cooling medium is contained in the receiving cavity, and the capillary structure 15 is disposed in the receiving cavity.

[0117] Optionally, the phase change component 10 includes a support member 16, which is disposed in the accommodating cavity and is connected to the bottom shell 13 and the cover plate 14 respectively.

[0118] Optionally, the phase change component 10 is a heat exchanger.

[0119] Optionally, the cooling component 20 is a liquid cooling plate 21, which has a first cavity 211. The phase change component 10 is connected to the liquid cooling plate 21 to seal the first cavity 211, forming a closed cooling channel.

[0120] Optionally, the cooling component 20 is an electronic control housing 22, which has a second cavity 221. The phase change component 10 is connected to the electronic control housing 22 to seal the second cavity 221, and the electronic control housing 22 forms an open cooling channel.

[0121] Optionally, the heat dissipation device includes a seal connected between the electronic control housing 22 and the phase change component 10.

[0122] Optionally, the phase change component 10 is provided with multiple independent cavities 17, and each cavity 17 is used to correspond to a half bridge.

[0123] Optionally, the number of phase change components 10 includes multiple phase change components 10, which are respectively connected to the cooling component 20, and one phase change component 10 is used to correspond to one half bridge.

[0124] Optionally, the heat dissipation device includes an inlet 40 and an outlet 50, with the inlet 40 connected to one of the phase change component 10 and the cooling component 20, and the outlet 50 connected to the other of the phase change component 10 and the cooling component 20.

[0125] The water inlet 40, cooling channel and water outlet 50 are connected.

[0126] This application also proposes a motor controller, which includes a heating element and a heat dissipation device, wherein the heating element is welded to the phase change component 10 of the heat dissipation device.

[0127] This application also proposes an electronic control assembly, which includes a motor controller or a heat dissipation device.

[0128] This application also proposes a vehicle, which includes an electronic control assembly, or a motor controller, or a cooling device.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes: a phase change component (10) and a cooling component (20); The cooling component (20) and the phase change component (10) form a cooling channel; The phase change component (10) is provided with a first cooling medium, and the cooling channel is provided with a second cooling medium.

2. The heat dissipation device according to claim 1, characterized in that, The cooling channel is formed by the cooling component (20) and the phase change component (10).

3. The heat dissipation device according to claim 1 or 2, characterized in that, The first cooling medium flows in the phase change member (10), and / or the second cooling medium flows in the cooling channel.

4. The heat dissipation device according to any one of claims 1-3, characterized in that, The heat dissipation device includes a heat-conducting element (30), which is disposed in the cooling channel and is connected to the phase change component (10) and the cooling component (20) respectively.

5. The heat dissipation device according to claim 4, characterized in that, The number of the heat-conducting elements (30) includes a plurality of them, and the plurality of heat-conducting elements (30) are arranged at intervals.

6. The heat dissipation device according to claim 4 or 5, characterized in that, The heat-conducting component (30) is integrally formed with the phase change component (10), and / or the heat-conducting component (30) is integrally formed with the cooling component (20).

7. The heat dissipation device according to claim 6, characterized in that, The heat-conducting component (30) and the phase change component (10) are integrally formed by cold forging, and the heat-conducting component (30) and the cooling component (20) are integrally formed by cold forging.

8. The heat dissipation device according to any one of claims 4-7, characterized in that, The heat-conducting component (30) is welded to the phase change component (10), or the heat-conducting component (30) is welded to the cooling component (20).

9. The heat dissipation device according to claim 8, characterized in that, The heat-conducting component (30) is connected to the phase change component (10) by diffusion welding or brazing, or the heat-conducting component (30) is connected to the cooling component (20) by diffusion welding or brazing.

10. The heat dissipation device according to any one of claims 4-9, characterized in that, The heat-conducting component (30) consists of multiple spaced heat-conducting columns.

11. The heat dissipation device according to any one of claims 1-10, characterized in that, The phase change component (10) includes a bottom shell (13), a cover plate (14), and a capillary structure (15); The bottom shell (13) is connected to the cover plate (14) to form a receiving cavity, the first cooling medium is contained in the receiving cavity, and the capillary structure (15) is disposed in the receiving cavity.

12. The heat dissipation device according to any one of claims 1-11, characterized in that, The phase change component (10) is a temperature equalization plate.

13. The heat dissipation device according to any one of claims 1-12, characterized in that, The cooling component (20) includes a liquid cooling plate (21), the liquid cooling plate (21) is provided with a first cavity (211), and the phase change component (10) is connected to the liquid cooling plate (21) to seal the first cavity (211).

14. The heat dissipation device according to any one of claims 1-12, characterized in that, The cooling component (20) includes a housing (22) of a motor controller, the housing (22) having a second cavity (221), and the phase change component (10) connected to the housing (22) to enclose the second cavity (221).

15. The heat dissipation device according to claim 14, characterized in that, The heat dissipation device includes a seal that is connected between the housing (22) and the phase change member (10).

16. The heat dissipation device according to any one of claims 1-15, characterized in that, The phase change component (10) has multiple independent cavities (17).

17. The heat dissipation device according to any one of claims 1-15, characterized in that, The number of phase change components (10) is multiple.

18. The heat dissipation device according to any one of claims 1-17, characterized in that, The heat dissipation device includes an inlet (40) and an outlet (50), both of which are connected to the cooling channel; The inlet (40) is connected to one of the phase change component (10) and the cooling component (20), and the outlet (50) is connected to one of the phase change component (10) and the cooling component (20).

19. A motor controller, characterized in that, The motor controller includes the heat dissipation device as described in any one of claims 1-18 and the cooling target component of the heat dissipation device.

20. The motor controller according to claim 19, characterized in that, The cooling target component includes a power module located on the side of the phase change component (10) away from the cooling component (20).

21. The motor controller according to claim 20, characterized in that, The power module includes a converter bridge circuit, each half-bridge of which corresponds to a cavity (17) of the phase change component (10), or each half-bridge of the converter bridge circuit corresponds to one of the phase change components (10).

22. An electronic control assembly, characterized in that, The electronic control assembly includes the motor controller according to any one of claims 19-21, or the heat dissipation device according to any one of claims 1-16.

23. A vehicle, characterized in that, The vehicle includes the electronic control assembly of claim 22, or the motor controller of any one of claims 19-21, or the cooling device of any one of claims 1-18.

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