Fluid flow system

Abstract

The present disclosure relates to a fluid flow system for a fluid having a dual use in a vehicle, the fluid flow system comprising: a heat generating electronic component configured to be attached in heat transferring manner to a fluid flow device; the fluid flow device having an exchange surface in contact with the fluid, wherein the fluid flow device is configured to channel the fluid and transfer heat from the exchange surface to the fluid to produce a heated fluid. The system further comprises a heat sink configured to contain a volume of fluid, to draw the heated fluid from the fluid flow device, and to dissipate heat of the heated fluid in the volume of fluid; wherein the fluid is configured to enable a primary vehicle function independent of absorbing heat from the heat generating electronic component.

Description

Technical Field

[0001] This invention relates to the management of fluid flow, which has a primary function and a secondary function as a cooling fluid for controlling the temperature of electronic components in vehicles, particularly aircraft. The fluid flow can be modulated relative to the electronic components to integrate with existing fluid systems. Background Technology

[0002] Cooling electronic equipment in vehicles, particularly those located in the overhead compartment of aircraft, is crucial for maintaining the performance and reliability of onboard systems. The overhead compartment, typically situated above the passenger cabin, houses a variety of electronic components, including avionics, communication systems, and in-flight entertainment systems. Effective cooling is essential to prevent overheating and reduce the likelihood of malfunctions.

[0003] Heat from electronic components can be removed through ventilation systems or passive convection through the compartments housing the components. Specifically, in the electronics bay of an aircraft, component cooling can rely on passive convection using radiators.

[0004] In aircraft, components in the electronics bay are typically installed in areas without forced cooling, relying solely on passive convection and ambient temperature. As heat loads increase, using only radiators can become disadvantageous. Proportionally increasing radiators according to heat load can increase equipment weight, cost, and size. The effectiveness of radiators can be limited in areas with low natural air convection, as heat dissipation largely depends on the movement of air around the radiator.

[0005] To improve cooling efficiency, active cooling methods, such as fans, can be employed. Fans increase airflow inside and / or around electronic components, thereby improving heat dissipation. However, using fans presents several challenges. Fans may require dust filters to prevent dust buildup on components, as dust can obstruct airflow and reduce cooling efficiency. Additionally, these filters may require regular maintenance to ensure optimal performance, increasing maintenance costs. Furthermore, the application of fans may affect vehicle safety measures. For example, adding fans may necessitate measures to prevent or at least limit the unintentional spread of fumes or toxic gases from malfunctioning equipment. Therefore, adding fans can increase the design complexity of cooling systems used for electronic components in vehicles and increase overall costs and maintenance requirements.

[0006] In liquid cooling solutions commonly used in high-performance computing devices, specialized coolants are used to absorb heat from components and dissipate it. These specialized systems are highly efficient in managing heat, but in turn, can generate significant additional costs and weight. Furthermore, liquid cooling solutions may present additional design challenges in fluid piping layout and providing suitable heat exchangers.

[0007] Cooling electronic components in aircraft presents unique challenges due to the harsh operating environment. Aircraft electronics, or avionics, must operate reliably under a wide range of conditions, including extreme temperatures, high humidity, and / or significant mechanical stress. Similar requirements apply to cooling solutions for these components. Furthermore, compliance with aviation standards and regulations may be an additional requirement. Summary of the Invention

[0008] Therefore, the purpose of this disclosure is to provide a cooling system suitable for vehicles, particularly aircraft, that can transfer heat from electronic equipment and balance efficiency, reliability and compliance requirements.

[0009] This disclosure relates to a fluid flow system for a fluid serving a dual purpose within an aircraft. Electronic components and corresponding mounting devices are configured to thermally engage with the aircraft's primary fluid system, particularly a high-pressure water system, to enable cooling of the electronic components, especially those in the top region. The additional heat can reduce the heating requirements at water reservoirs to prevent freezing.

[0010] According to a first aspect, this disclosure relates to a fluid flow system for a fluid having a dual purpose in a vehicle. The system includes heating electronic components configured to be attached to a fluid flow device in a heat-transferring manner. The system may further include a fluid flow device having an exchange surface in contact with the fluid. The fluid flow device is configured to guide the fluid and transfer heat from the exchange surface to the fluid to produce a heated fluid. Furthermore, the system includes a radiator configured to contain a fluid volume, draw in the heated fluid from the fluid flow device, and / or dissipate the heat of the heated fluid within the fluid volume.

[0011] The proposed system offers several advantages over existing technologies in cooling electronic devices. One of the main benefits is the significant weight reduction achieved through the device's smaller form factor. Effective cooling can handle increased heat loads, thereby enabling higher processing capacity within the device. Furthermore, the use of an existing system, preferably a high-pressure water system (HPWS), further improves efficiency.

[0012] Furthermore, the system facilitates easier installation by utilizing standardized connectors found in existing fluid systems. Electronic components can be designed with standardized heat transfer joints, enabling efficient mounting to corresponding panels, particularly those in the top region of the aircraft. This standardization reduces the number of components and speeds up the installation process.

[0013] The HPWS (Hydraulic Power Supply System) in an aircraft may require a heater to prevent the water in the central tank from freezing during flight. Introducing heat from the electronic components can raise the temperature, thereby helping to prevent freezing inside the HPWS's tank or piping.

[0014] The fluid configuration enables the implementation of primary transportation functions that are independent of heat absorption from heat-generating electronic components.

[0015] The system is designed to control and manage the flow and temperature of fluids within a vehicle. It includes components that facilitate the movement, heating, cooling, and storage of the fluid. The vehicle can be configured for any type of travel: aircraft, spacecraft, motor vehicles, ships, and rail transport.

[0016] Heat-generating electronic components can be electronic devices or parts that generate heat during their operation. Examples include CPUs, power converters, power amplifiers, aircraft-specific control modules, and other electronic devices. Components may require cooling to maintain their functionality, particularly to achieve optimal performance and / or maintain their operational condition. Components may require cooling devices to prevent overheating and achieve a longer lifespan. Components can be complex electronic devices that perform specific tasks related to operating a vehicle, providing vehicle functionality, and / or functions related to vehicle passengers and / or vehicle payload.

[0017] Electronic components may include mechanical, electrical, and / or thermal connections with the vehicle. Mechanical connections may be configured to attach the electronic component to a fluid flow device to lock the electronic component in a fixed position. Electrical connections may be configured to allow the transfer of electrical power and / or electrical signals between the electronic component and other components of the vehicle. Thermal connections may be configured to transfer heat to the surface of the electronic component. Preferably, a thermal connection may be configured to transfer heat to the surface of the electronic component that is connected to the fluid flow device in a heat-transfer manner.

[0018] For example, the surface of the housing can be mechanically connected to a fluid flow device, enabling heat transfer between the electronic components and the fluid flow device, and ultimately between the electronic components and the fluid. The fluid flow device can be a structural part of a vehicle, particularly a vehicle mounting component, such as a bracket or mounting plate. Preferably, the electronic components can be clamped, threaded, or glued to the structural part. This allows for the advantage that the fluid circuit can be fluidly disconnected from the electronic components, and minimizes the risk of leakage.

[0019] Electronic and mechanical connections can be spatially separated from cooling connections.

[0020] Attaching heat to a fluid flow device can be defined as establishing material contact between two elements, i.e., establishing material contact by providing surface-to-surface contact. Any means of increasing the thermal conductivity at the contact surfaces can be applied.

[0021] A fluid flow device can be a conduit or channel that guides the flow of fluid within a system. Fluid flow devices can be configured to integrate into existing fluid delivery systems. Fluid flow devices can be configured to integrate into any existing suitable transportation system or a dedicated cooling system. These systems can include fuel lines, water supply lines, coolant hoses, airflow, and / or hydraulic lines. A fluid flow device can be a fluid capable of transferring heat from its walls to the interior of the fluid flow device. Preferably, the water supply system can be adapted to achieve a constant flow through the fluid flow device. Specifically, a drinking water supply system can be adapted to include a water circulation loop that incorporates the fluid flow device. Existing components, i.e., drinking water reservoirs, can be used to absorb heat transferred from electronic components to the system via the fluid flow device.

[0022] Preferably, the fluid flow device is designed to guide the fluid flow, thereby promoting heat transfer from the conduit wall to the fluid and heating the fluid. This allows thermal energy within the electronic components to be removed.

[0023] Fluid flow devices can be configured to be chemically compatible with the fluid, allowing the fluid flow device to function without affecting the fluid's primary function. Specifically, fluid flow devices can be configured to be corrosion-resistant and degradation-resistant.

[0024] The exchange surface can be configured to guide and, consequently, retain fluid. For example, liquid can be guided through a tubular structure. For this purpose, the fluid flow device can include a fluid conduit, which can be configured as a pipe, tube, or hose. The fluid conduit can be flexible or rigid. Alternatively, when considering gases, the exchange surface can be open. Guiding the fluid can refer to confining the fluid flow within the fluid flow device and / or setting a preferred flow direction depending on the structure of the fluid flow device. Preferably, heat transfer from the fluid flow device to the fluid can be achieved via conductive heat transfer and / or radiative heat transfer.

[0025] Fluids can be any substance that continuously deforms under applied shear stress, i.e., flows, especially any substance that continuously deforms under applied shear stress regardless of the magnitude of the stress. Fluids can encompass liquids and / or gases. Fluids can be compressible, such as air, or nearly incompressible, such as water, hydraulic fluids, oils, and / or fuels. Regarding mixtures, fluids can include aerosols, emulsions, and / or foams.

[0026] Fluids can initially be incorporated into systems, and consequently, vehicles, to perform specific primary functions, such as lubrication, hydraulic actuation, propulsion, and fuel and / or drinking water supply. The fluid retains its primary function without compromising its effectiveness or reliability. Fluids can also be used to absorb and dissipate heat from electronic components, thereby preventing overheating and ensuring optimal performance.

[0027] The fluid can be expandable, allowing the total amount of fluid within the system to change. The fluid can be replenished before it is completely consumed or before the fill level drops below a predetermined threshold. For this purpose, the system can be thermodynamically open. Specifically, heat transferred to the fluid can be removed from the system by removing at least a portion of the fluid. Examples include igniting fuel in an engine or using water for passengers in a vehicle.

[0028] Preferably, the fluid has properties that enable it to effectively absorb and transfer heat, such as high thermal conductivity and specific heat capacity. However, the fluid flow device can be tailored to the thermal requirements of the electronic components and the properties of the available fluid to achieve adequate heat transfer from the electronic components to the fluid.

[0029] The dual use of fluids improves overall system efficiency by reducing the need for a separate cooling system or at least reducing the size of an additional cooling system.

[0030] Fluids can be a major component of the primary function of a vehicle, meaning that fluids may be necessary for performing the primary function of a vehicle. For this purpose, fluids can have the primary purpose of serving as a functional medium for the function of a vehicle, which is particularly independent of the function of fluids as a coolant for heat-generating electronic components.

[0031] Fluids can serve as a primary consumable medium within a vehicle. As a secondary purpose or function, fluids can be used as a heat exchange medium for heat-generating components. For this purpose, an additional function of fluids can be to absorb heat from electronic components and transfer that heat away from the electronic components, thereby serving as a cooling medium.

[0032] Its main functions may be related to steering, engine cooling, vehicle compartment climate / temperature control and / or pressurization, propulsion, and water supply.

[0033] The fluid can be the primary working fluid, independent of the vehicle's function of cooling electronic components. The primary function can also be cooling. For example, a vehicle may include a dedicated climate system and / or a centralized climate system. For this purpose, fluid flow can be regulated to integrate a fluid flow device into the climate system. The fluid flow device can be integrated with the working fluid loop of the climate system. Alternatively, the fluid flow device can be circulated by a fluid cooled by the climate system.

[0034] A radiator can be a device designed to absorb and dissipate heat, containing a specific volume of fluid. A radiator can be configured to use fluid to manage and distribute heat energy within a vehicle. Preferably, a radiator is a fluid reservoir, wherein the volume of fluid contained by the radiator is substantially larger than the volume of fluid within connecting pipes and / or fluid flow devices. For example, a radiator can be a compartment, fuel tank, or drinking water reservoir.

[0035] Radiators can be configured to dissipate heat into the atmosphere. Specifically, radiators may experience reduced temperatures during operation of vehicles, such as aircraft, at high altitudes.

[0036] Heat can be drawn into a radiator by allowing fluid to flow from a fluid flow device into the radiator. Heat dissipation in the radiator can refer to the mixing of heated fluid discharged from the fluid flow device into a larger fluid volume contained within the radiator.

[0037] For this purpose, the effluent from the fluid flow device can be directed toward the radiator. Therefore, the radiator can be configured to receive heated fluid from the fluid flow device, thereby allowing fluid to enter the radiator for further thermal management.

[0038] A radiator can be configured to distribute the heat contained in a heated fluid throughout its entire fluid volume. This process may involve distributing the fluid within the radiator to maximize heat dissipation. Radiators can also dissipate heat through wall surfaces in contact with structures or the atmosphere at temperatures lower than the fluid temperature within the radiator.

[0039] In another embodiment, the fluid flow device can be configured to generate convective fluid flow through the fluid flow device based on the temperature difference between the exchange surface and the fluid in the fluid flow device. This provides the advantage that passive convection can be generated in the fluid flow device, thereby allowing fluid to move through the fluid flow device.

[0040] In another embodiment, the fluid delivery device may be configured to generate fluid flow and circulate fluid between the fluid flow device and the radiator.

[0041] Preferably, the fluid delivery device can be a pump. The fluid delivery device can be a mechanical device that moves fluid through the system by generating a pressure difference. In this system, the fluid delivery device is responsible for circulating the fluid between the fluid flow device and the radiator.

[0042] Fluid transport devices can be configured to maintain the fluid flow velocity above a predetermined threshold velocity, thereby keeping the fluid in a predetermined phase. The fluid flow velocity can be an average flow velocity or an instantaneous flow velocity. Specifically, the fluid flow rate can be high enough that the fluid neither boils, freezes, nor loses its integrity.

[0043] For this purpose, the system may include a controller, particularly a flow rate controller, a temperature controller, and / or a pressure controller, the controller being configured to monitor fluid characteristics and adjust the fluid delivery device accordingly to maintain the fluid within predetermined parameters.

[0044] Fluid circulation can refer to circulating fluid in a fluid flow loop that includes at least a fluid flow device, a radiator, and a fluid delivery device.

[0045] Fluids can be circulated through the system using existing fluid transport devices and / or additional fluid transport devices. Fluid transport devices can be configured to ensure continuous or intermittent fluid movement and thereby manage heat exchange.

[0046] The fluid delivery device can be configured to maintain the pressure in the pressurized subsection of the fluid circuit. For this purpose, a suitable pressure for distributing water can be maintained. A fluid flow device can be located in the pressurized subsection. Preferably, a radiator is located in the low-pressure section of the fluid circuit. Advantageously, a pressure regulator can be used for adjustment between different pressurized fluid circuit sections.

[0047] In another embodiment, the fluid flow device may include an inlet configured to receive fluid and an outlet configured to discharge fluid. The fluid delivery device may be configured to provide at least a portion of the fluid from outside the vehicle to the inlet, and / or to recirculate at least a portion of the fluid leaving the outlet to the inlet via a radiator.

[0048] This allows for the following advantages: cooled fluid from the atmosphere can be injected into the fluid system to effectively cool electronic components. Furthermore, heat can be removed by discharging heated fluid from the vehicle.

[0049] In one implementation, the system may include a pressure regulator configured to supply a heated fluid at ambient pressure to the radiator.

[0050] The advantage of this is that the fluid reservoir can be exposed to the surrounding atmosphere. A pressure regulator can be positioned between the radiator and the fluid flow device. Alternatively, the pressure regulator can be positioned upstream of the fluid flow device. The advantage of this is that the fluid flow device operates at a reduced pressure, which allows for a reduction in the minimum material specifications for connectors, fittings, etc.

[0051] In another embodiment, the system may include a fluid tap configured to remove a portion of the fluid from the fluid flow system. The fluid delivery device may be configured to apply a pressure to the downstream fluid exceeding the ambient pressure of the fluid flow system, such that, at least at the fluid tap, the fluid is at a predetermined pressure above the ambient pressure.

[0052] Fluid taps can be outlet valves, faucets, air outlets, or fuel injectors. Typically, a fluid tap can be a location and / or device where fluid is acquired, controlled, and / or redirected within the system. Outlet valves can be configured to control the release of fluid from the system. For this purpose, precise regulation of fluid discharge can be achieved. Outlet valves can be configured to manage the flow rate and / or pressure of fluid leaving the system.

[0053] In aircraft, outflow valves can be used in the aircraft pressurization system to maintain cabin pressure by controlling the release of air.

[0054] A faucet can be configured to control the outflow of water, preferably from a drinking water system, such as a drinking water system in an aircraft. The system can be configured to regulate fluid pressure and / or flow rate when the faucet is used to achieve continuous flow through a fluid flow device. The faucet can be configured to enable fluid dispensing intervals to enable, stop, and / or regulate the flow of water.

[0055] Air outlets can be configured to distribute air within a space. For this purpose, air outlets can be part of an existing ventilation system, particularly an HVAC (heating, ventilation, and air conditioning) system. Air outlets can be configured to direct flows of conditioned (heated, cooled, and / or ventilated) air into cabinets and / or spaces.

[0056] Fuel injectors can be configured to control the amount and timing of fuel delivery to optimize engine performance and efficiency.

[0057] The corresponding tap point may have specific functions, components, and / or applications that contribute to the efficient operation of the main vehicle's functions, which are an integral part of those functions. The tap point can be functionally adjusted to allow fluid flow through the fluid flow device.

[0058] Removing a portion of the fluid can mean that the fluid cannot be reused in the fluid flow device after removal.

[0059] In another embodiment, the fluid flow device may include a mounting plate. The mounting plate may be configured to releasably attach heat-generating electronic components to the fluid flow device.

[0060] The mounting plate can be configured to facilitate heat transfer from one side to the other, i.e., from the first surface to the second surface. The mounting plate can be made of or comprise a material with high thermal conductivity, such as metal, to effectively conduct heat. The mounting plate can serve as a support and / or plate to which electronic components are attached, on one side, while the other side engages with a fluid flow device to remove heat.

[0061] An exchange surface is the first surface of a mounting plate that comes into contact with fluid from a fluid flow device. This surface is responsible for transferring heat from the mounting plate to the fluid, thereby cooling the attached electronic components.

[0062] Mounting plates can form barriers or shields to prevent direct contact between fluids and electronic components. Mounting plates may include fluid conduits; that is, the mounting plate may be an integral part of a fluid flow device.

[0063] In another embodiment, the mounting plate may include a cutout segment forming an opening in the mounting plate. The fluid flow device may include a conduit segment configured to guide fluid. Heating electronic components may be configured to attach to the conduit segment via the cutout segment.

[0064] The advantages of this are that surface-to-surface heat transfer losses can be minimized. Electronic components can be directly attached to fluid flow devices.

[0065] The exchange surface may be formed by a first surface of the mounting plate. The mounting plate may include a second surface, preferably facing away from the first surface. Heating electronic components may be configured to attach to the second surface. The mounting plate may be configured to conductively transfer heat from the heating electronic components to the fluid.

[0066] In another embodiment, the mounting plate may include a mounting device configured to provide a form-fit connection between the heating electronic component and the mounting plate, preferably providing a predetermined contact pressure between the heating electronic component and the second surface.

[0067] A form-fit connection can be a form-locking connection or a form-closing connection, thereby achieving a mechanical connection between two components, wherein the shapes of the components interlock and block each other along at least one defined linear or rotational direction. The connection may include geometric contact means at the effective surfaces of the components, thereby ensuring a secure attachment, preferably a secure attachment independent of friction or external forces.

[0068] Shape-fit connections ensure that electronic components remain firmly connected, thus preventing separation or movement in a particular direction.

[0069] The predetermined contact pressure can refer to the specific amount of pressure applied between two surfaces to ensure effective contact and thus ensure effective heat transfer.

[0070] By providing both a form-fit connection and a predetermined contact pressure, the mounting plate ensures that electronic components remain firmly attached and effectively cooled, thereby enhancing the reliability and performance of the system.

[0071] According to another embodiment, the heat-generating electronic component may include a side panel having an inner surface and an outer surface, a heat source, and a heat transfer device. The heat transfer device may be configured to conductively transfer heat from the heat source to the inner surface of the side panel. Furthermore, the outer surface of the side panel may face away from the heat source and make thermally conductive contact with a fluid flow device.

[0072] The side panel can be any of a plurality of panels enclosing the electronic component. Preferably, the side panel is the rear panel of the electronic component. For this purpose, the side panel can be located at the rear end of the electronic component and can face the mounting plate. Advantageously, the side panel can be configured to be attached to the mounting plate in a surface contact manner. The side panel can be part of the enclosure of the electronic component.

[0073] This allows for efficient heat transfer from the internal heating components to the side panel. Thermal contact between the outer surface and the fluid flow device can be achieved via a mounting plate. Heat transfer devices may include heat sinks, heat pipes, and / or other solid thermally conductive structures.

[0074] In another embodiment, the outer surface of the side panel can be configured to make full-surface contact with the mounting plate when the heat-generating electronic components are attached to the mounting plate.

[0075] This allows for efficient heat transfer from the side panel to the mounting plate and subsequently to the fluid. Preferably, the outer surface and the mounting plate are planar in their contact area.

[0076] In another embodiment, the fluid flow device may include a heat transfer structure configured to increase the surface area of ​​the exchange surface, absorb heat from the mounting plate, and / or dissipate the absorbed heat to the fluid via the surface area of ​​the exchange surface.

[0077] The heat transfer structure can be a surface structure extending outward from a flat surface, such as a mounting plate. In an example, the heat transfer structure can be a heat sink structure, which includes multiple flow channels that increase the surface area in contact with the fluid. The heat transfer structure can include a body with multiple fins, ridges, and / or other protrusions configured to increase the surface area of ​​the body. This design maximizes contact with the fluid, thereby enhancing heat dissipation.

[0078] In another embodiment, the mounting plate includes a plurality of mounting devices configured to attach a plurality of heat-generating electronic components to the mounting plate.

[0079] This offers the following advantages: the mounting plate can serve as a centralized support for easy installation and simultaneous cooling. Preferably, the mounting plate can be configured to dissipate heat from multiple electronic components throughout its entire body. Thus, a centrally attached single fluid flow device can remove heat emitted from multiple electronic components. Additionally, the mounting plate can be configured to concentrate heat at predetermined contact points with the fluid. Advantageously, a system with standardized form factors can be established for mounting components to the mounting plate. For example, the mounting plate can comprise a grid of standardized mounting points, the grid being configured to allow attachment of electronic components of various sizes.

[0080] In another advantageous embodiment, the system may include a heat pump. The heat pump may be disposed between the heat-generating electronic component and the fluid flow device. The heat pump may be configured to actively transfer heat from the heat-generating electronic component to the fluid flow device.

[0081] A heat pump can be a thermoelectric cooler, such as a Peltier element. A heat pump can provide precise temperature control of electronic components. By adjusting the current, the amount of heat transferred can be finely adjusted, thereby achieving stable and accurate temperature regulation. For this purpose, the temperature of the electronic components can be disconnected from the temperature of the fluid. In particular, the temperature of the electronic components, and correspondingly the temperature of the heat transfer devices within the electronic components, can be lower than the fluid temperature. Furthermore, the heat pump can be configured to operate in reverse, allowing it to also be used to heat electronic components, thus providing versatility in thermal management. Preferably, the temperature of the electronic components can be regulated to fall within a predetermined temperature range relative to the ambient temperature of the electronic components to reduce the risk of condensation.

[0082] The heat pump can be positioned between the electronic components and the mounting plate. Alternatively, the heat pump can be positioned between the mounting plate and the heat transfer structure. The mounting plate may include two separate plates, with the heat pump positioned between the two separate plates. This allows the heat transfer capability of the heat pump to be distributed over a larger surface area.

[0083] Heat pumps can be configured to provide localized cooling at the mounting surfaces of electronic components and mounting plates.

[0084] In another embodiment, the system may include multiple fluid reservoirs. The fluid reservoirs may be interconnected, spaced apart, and / or pressurized. A pump may be configured to supply heated fluid to at least one of the multiple reservoirs.

[0085] Fluid storage devices may include, for example, separate water tanks, each configured to supply water to a fluid tap, such as a fluid tap in an aircraft lavatory. Pressurization can refer to maintaining the fluid pressure within a range compatible with water supplied via taps or other water distribution facilities.

[0086] In addition to radiators, fluid reservoirs may also be present. For this purpose, fluid reservoirs can be located at different locations on the vehicle, preferably near the fluid tap point.

[0087] Fluid reservoirs can be located in non-pressurized and / or non-temperature-controlled areas. By supplying heated fluid to reservoirs in non-temperature-controlled areas, fluid freezing can be prevented, particularly during operation (e.g., when the aircraft is at high altitudes). Preferably, the system can use excess heat from electronic components to heat the fluid, thereby reducing the need for additional heating devices or making additional heating unnecessary.

[0088] In another embodiment, the fluid may be drinking water. The system may include a temperature controller configured to raise the temperature of the fluid volume within the radiator to a temperature above a predetermined temperature threshold, particularly above the freezing point of the fluid, by controlling the flow of the fluid within the system, particularly the flow of heated fluid, based on environmental parameters.

[0089] A predetermined temperature threshold can be the lower optimal temperature limit of a fluid. For example, the optimal operating temperature of a fluid in terms of its ability to function as a working fluid in primary transportation applications. Environmental parameters, such as ambient temperature and / or ambient pressure, can determine the actual value of the lower optimal temperature limit.

[0090] The system can be configured to control heat output to achieve sufficient heat transfer from electronic components to the fluid. For example, a temperature controller can be configured to control the execution of functions of electronic components that generate excess heat. Thus, the temperature controller can be configured to control the fluid temperature. A heat pump can be configured to cool the electronic components below a desired target temperature, i.e., provide excess cooling to provide additional heat to the liquid. Therefore, if the fluid reaches a critical temperature within the radiator and / or fluid reservoir that could cause the fluid to freeze, additional heat can be generated to bring the fluid temperature above the critical temperature.

[0091] Advantageously, controlling the flow of fluid within the system can include controlling the fluid flow rate. For this purpose, a temperature controller can be configured to regulate the fluid delivery device to control the flow rate through the fluid flow device. Alternatively or additionally, controlling the flow can include directing the heated fluid within the system, preferably such that the heat input to the radiator can be increased, particularly maximizing the heat input to the radiator. For example, based on the fluid temperature in each fluid reservoir, the temperature controller can be configured to regulate the amount of heated fluid flowing to each fluid reservoir and corresponding radiator. Thus, the fluid temperature can be controlled below a predetermined temperature limit, particularly at fluid junctions.

[0092] In one embodiment, the fluid reservoir may be a fuel reservoir.

[0093] In another embodiment, the fluid may be air. The radiator may be a vehicle compartment. The temperature control device may be configured to control the temperature inside the vehicle compartment at least in part by controlling the discharge rate of the fluid, particularly heated fluid, preferably entering the vehicle compartment via a fluid tap. For this purpose, the fluid tap may be a ventilation opening, such as an adjustable airflow opening.

[0094] The fluid storage device can be a passenger cabin, preferably a passenger cabin of an aircraft.

[0095] Fluid flow junctions can be air outlets or air vents. Fluid flow devices can be configured for passive convection to enable heat dissipation within the vehicle compartment. Fluid flow devices can be integrated as heat sources into the vehicle's climate system.

[0096] In another embodiment, the system may include a fluid extractor configured to extract fluid from a vehicle compartment and provide the extracted fluid to a fluid flow device.

[0097] The vehicle compartment can form a radiator to hold a large amount of fluid. The fluid extractor can be a ventilation device or a pump. The fluid extractor can use the pressure difference between the fluid pressure in the vehicle compartment and the fluid flow device to direct fluid toward the fluid flow device. The fluid extractor can be configured to create a pressure reduction at the fluid flow device. Attached Figure Description

[0098] The subject matter will be described below in conjunction with the following figures, in which the same reference numerals denote the same elements, and in the figures:

[0099] Figure 1 This is a schematic perspective view of electronic components attached to a fluid flow device according to an embodiment;

[0100] Figure 2 This is a schematic side view of the electronic component according to the embodiment;

[0101] Figure 3 This is a schematic perspective view of an electronic component attached to a mounting plate and a fluid flow device attached to the opposite side of the mounting plate, according to an embodiment.

[0102] Figure 4 This is a schematic front view of the electronic components, fluid flow devices, and mounting plates attached to each other according to an embodiment.

[0103] Figure 5 This is a schematic front view of the electronic components, fluid flow devices, and mounting plates attached to each other according to an embodiment.

[0104] Figure 6 This is a schematic side view of the electronic components, fluid flow device, and mounting plate attached to each other according to an embodiment; and

[0105] Figure 7 This is a schematic diagram of a fluid flow system according to an embodiment. Detailed Implementation

[0106] The following detailed description is exemplary in nature only and is not intended to limit the invention or its uses. Furthermore, it is not intended to be bound by any theories presented in the foregoing background or the following detailed description.

[0107] The representations and illustrations in the accompanying drawings are schematic and not drawn to scale. The same reference numerals denote the same elements.

[0108] Figure 1A schematic perspective view of an electronic component 101 attached to a fluid flow device 102 according to an embodiment of the present disclosure is depicted. The fluid flow device 102 may be a separate cooling block mounted to the electronic component 101. Furthermore, the electronic component may include a connector panel 104 for mechanically and / or electronically contacting the electronic component 101. The connector panel 104 and the fluid flow device 102 may be disposed on the same side panel 105 of the electronic component 101. The electronic component 101 may be generally box-shaped, and the fluid flow device 102 may be attached to the front and correspondingly rear sides of the electronic component. The electronic component may be slot-shaped to allow for the formation of a stack, such as a row, column, or grid, of multiple electronic components 101. Corresponding fluid flow devices 102 of multiple electronic components 101 may face the same direction. The fluid flow device 102 may be connected to a heat sink 206. The heat sink 206 may include a large amount of fluid. For this purpose, the heat sink 206 may be an air-filled compartment. Alternatively, radiator 206 may be a tank containing liquid that can circulate through fluid flow device 102 to absorb heat.

[0109] Figure 2 A schematic side view of an electronic component 101 according to an embodiment of the present disclosure is depicted. The heat-generating electronic component 101 includes a side panel 105 having an inner surface 106 and an outer surface 107. The electronic component 101 also includes a heat source 108. The heat source can be any type of electronic device and / or a specific component connected to a heat transfer device 109. The heat transfer device is configured to conductively transfer heat from the heat source 108 to the inner surface 106 of the side panel 105. The outer surface 107 of the side panel 105 faces away from the heat source 108 and makes thermally conductive contact with a fluid flow device 102. Alternatively, the heat transfer device 109 may include a contact plate for the fluid flow device 102, allowing the fluid flow device 102 to be directly mounted to the heat transfer device. For example, the heat transfer device 109 may be a metal structure and / or a heat pipe directly connecting the heat source 108 to the fluid flow device 102. Preferably, there are no other surface-to-surface contacts at the side panel 105. The fluid flow device 102 can be configured to be directly attached to the inflow fluid line and the outflow fluid line. Multiple fluid flow devices can be connected in series or in parallel.

[0110] Figure 3 A schematic perspective view is shown of an electronic component 101 attached to a mounting plate 110 according to the present disclosure and a fluid flow device 102 attached to the opposite side of the mounting plate 110.

[0111] Electronic component 101 can be mounted to mounting plate 110 using the surface with the largest surface area. This increases the heat transfer capability between electronic component 101 and mounting plate 110. The connector panel may include a plurality of individual connectors 104-1, 104-2. Preferably, mounting plate 110 extends beyond the boundary of the surface where electronic component 101 contacts mounting plate 110. Thus, mounting plate can form a barrier between electronic component 101 and fluid flow device 102. Preferably, fluid flow device 102 can also be attached to mounting plate 110 at the outer surface of fluid flow device 102 with the largest surface area to increase the heat transfer capability between fluid flow device 102 and mounting plate 110. Mounting plate 110 may have a considerable thickness to allow for secure mounting of electronic component 101 and fluid flow device 102. Mounting plate 110 may be configured to fluidly isolate electronic component 101 from fluid, and correspondingly from fluid flow device 102.

[0112] Mounting plate 110 may be a structural component of a vehicle, configured to bear loads and / or provide mounting structures for multiple components.

[0113] Mounting plate 110 may include a cutout segment 115 forming an opening in the mounting plate 110. Fluid flow device 102 may include a conduit segment 114 configured to guide fluid, allowing heat to be continuously transported away from the fluid flow device 102. Heating electronic component 101 may be configured to be directly attached to the conduit segment 114 via the cutout segment 115.

[0114] Figure 4 A schematic front view of an electronic component 101, a fluid flow device 102, and a mounting plate 110 attached to each other according to an embodiment of the present disclosure is shown.

[0115] Mounting plate 110 includes a second surface 112 facing away from the first surface 111. Heating electronic component 101 is configured to attach to the second surface 112.

[0116] Providing fluid flow lines and corresponding inlets and outlets to the fluid flow device can rely on existing fluid lines according to the primary purpose of the fluid. For this purpose, the fluid flow device 102 can be inlined into the existing lines. The fluid flow device 102 can be configured to maintain the original fluid flow direction relative to the vehicle. Alternatively, when inlets and outlets are provided on the same side of the fluid flow device, the fluid flow direction relative to the vehicle can be reversed. Generally, any geometry of the fluid flow device 102 can be implemented to minimize changes to the primary fluid system.

[0117] Mounting plate 110 can be configured to disconnect the mounting orientation of electronic component 101 from the mounting orientation of fluid flow device 102. Therefore, electronic component 101 can rotate on the surface of mounting plate 110 to optimize electrical and / or mechanical connections. Advantageously, regardless of the orientation of electronic component 101, the surfaces of electronic component 101 configured for heat exchange with mounting plate 110, and correspondingly fluid flow device 102, remain in contact with mounting plate 110.

[0118] The first surface 111 can be configured to accommodate multiple fluid flow devices 102. The second surface 112 can be configured to accommodate multiple electronic components 101.

[0119] Figure 5 A schematic front view of an electronic component 101, a fluid flow device 102, and a mounting plate 110 attached to each other according to another embodiment of the present disclosure is shown. The fluid flow device 102 includes a heat transfer structure 113 configured to increase the surface area of ​​an exchange surface 103, absorb heat from the mounting plate 110, and dissipate the absorbed heat to the fluid via the surface area of ​​the exchange surface 103.

[0120] The heat transfer structure 113 can be configured to increase the surface roughness of the exchange surface 103. Alternatively or additionally, the heat transfer structure 113 can be a finned structure having fins oriented along the flow direction of the fluid. Each fin can increase the surface area in contact with the fluid, thereby increasing the heat transfer capacity of the fluid flow device 102. The exchange surface is marked with a light gray outline within the fluid flow device 102 to indicate the increased surface area. The heat transfer structure 113 can be incorporated into and / or disposed in a fluid conduit, or corresponding fluid conduit. The heat transfer structure 113 can be directly attached to the mounting plate 110. The heat transfer structure can be optimized for heat transfer based on specific parameters of the fluid, such as density, viscosity, and the temperature difference between the heat transfer structure and the fluid.

[0121] Figure 6 A schematic side view of an electronic component 101, a fluid flow device 102, and a mounting plate 110 attached to each other according to an embodiment of the present disclosure is shown. In this embodiment, a heat transfer structure 113 may be directly mounted to the electronic component 101. The heat transfer structure may include heat pipes configured to transfer heat from the electronic component 101 to the exchange surface 103. The fluid flow device 102 may include an inlet 116 configured to receive fluid and an outlet 117 configured to discharge fluid.

[0122] The fluid flow device 102 may have a tubular structure. Preferably, a plurality of heat transfer structures 113 may be embedded in the fluid flow device 102, particularly at the location where the electronic components 101 are mounted. The heat transfer structures 113 may be configured to attach the pipe section of the fluid flow device 102 to the mounting plate 110. The fluid flow device 102 may include pipe sections compatible with existing main fluid conduits in a vehicle. Heat transfer with the fluid can then be achieved by connecting the heat transfer structures 113 to the fluid flow in the pipe section. Advantageously, the pipe section may be an original pipe section used to transfer fluid according to the primary purpose of the fluid. Thermal connection of the electronic components 101 to the fluid can be achieved by incorporating the heat transfer structures 113 into the existing pipe section. Existing pipes can be re-laid with minimal effort to allow for integration into the fluid flow device, and correspondingly, to be integrated with the heat transfer structures 113.

[0123] Figure 7 A schematic diagram of a system 100 according to the invention is shown. Cooling of the electronic components 101-1 to 101-6 can be achieved via liquid cooling from an aircraft-based drinking water system. The cabin section 201 of the aircraft may include multiple compartments or stations configured to distribute drinking water. For example, the aircraft may include multiple galleys 202-1, 202-2 and / or lavatories 203-1, 203-2, 203-3. These stations may include at least one fluid tap 204-1 to 204-10. Additionally, each lavatory, and correspondingly each galley, may include fluid reservoirs 205-1 to 205-5. Each reservoir 205 may be supplied by a water supply system. The system may be configured to circulate water intermittently or continuously. Preferably, circulation is achieved between at least corresponding fluid flow devices 102-1 to 102-6 attached to the corresponding electronic components and radiators, particularly the drinking water tank 206.

[0124] System 100 may include pump 207-1 and preferably a second pump 207-2. The system may include multiple pumps, each configured to supply fluid to a predetermined section of the vehicle. For example, the first pump 207-1 may supply fluid to a fluid loop at the front section of the aircraft, and the second pump 207-2 may supply fluid to a fluid loop at the rear section of the aircraft. For this purpose, the fluid flow may be divided into multiple separate loops. Each fluid flow device 102 may be connected in parallel and has a separate inlet and a separate outlet. Return flow from each outlet may be directed toward the radiator 206.

[0125] Each of the fluid reservoirs 205-1 to 205-5 can be used as a buffer for supplying fluid via the respective fluid taps 204-1 to 204-10.

[0126] System 100 may include a fluid filter 208 located upstream of pump 207. The system may also include a cross-supply module 209 configured to equalize the flow among multiple fluid loops supplied by the respective pumps. Fluid flow conduits may be integrated into the floor section 210 of the aircraft. The filling passage of water tank 206, and consequently the filling passage of the entire fluid system, may be achieved via an external service panel at the aircraft's outer shell 211. Preferably, the fluid system may be a high-pressure water system found in commercial aircraft. High-pressure water hoses may be used for connection to components of system 100.

Claims

1. A fluid flow system (100) for a fluid having a dual purpose in a vehicle, the fluid flow system (100) comprising: A heat-generating electronic component (101) is configured to be attached to a fluid flow device (102) in a manner that transfers heat. The fluid flow device (102) has an exchange surface (103) in contact with the fluid, wherein the fluid flow device (102) is configured such that: Guide the fluid; and Heat is transferred from the exchange surface (103) to the fluid to produce a heated fluid; Radiator (206), said radiator (206) is configured as follows: Capacity for fluid volume; The heated fluid is drawn in from the fluid flow device (102); and The heat of the heated fluid is dissipated in the fluid volume; The fluid is configured to enable the primary vehicle function, which is independent of absorbing heat from the heat-generating electronic component (101).

2. The fluid flow system (100) according to any one of the preceding claims. in, The fluid flow device (102) is configured to generate a convective fluid flow through the fluid flow device (102) based on the temperature difference between the exchange surface (103) and the fluid in the fluid flow device (102).

3. The fluid flow system (100) according to any one of the preceding claims. Includes a fluid delivery device (207) configured to generate fluid flow and circulate the fluid between the fluid flow device (102) and the radiator (206).

4. The fluid flow system (100) according to claim 3. in, The fluid flow device (102) includes an inlet configured to receive fluid and an outlet configured to discharge the fluid, and The fluid transport device (207) is configured as follows: At least a portion of the fluid is supplied from outside the vehicle to the inlet, and At least a portion of the fluid leaving the outlet is recirculated to the inlet via the radiator (206).

5. The fluid flow system (100) according to any one of claims 3 to 4. Includes a fluid tap (204) configured to remove a portion of the fluid from the fluid flow system (100). in, The fluid delivery device (207) is configured to apply a pressure to the downstream fluid that exceeds the ambient pressure of the fluid flow system (100), such that at least at the fluid tap point (204), the fluid is at a predetermined pressure higher than the ambient pressure.

6. The fluid flow system (100) according to any one of the preceding claims. in, The fluid flow device (102) includes a mounting plate (110) configured to releasably attach the heating electronic component (101) to the fluid flow device (102).

7. The fluid flow system (100) according to claim 6. in, The mounting plate (110) includes a cutout section (115) that forms an opening in the mounting plate (110); The fluid flow device (102) includes a conduit section (114) configured to guide the fluid; and The heating electronic component (101) is configured to be attached to the conduit segment (114) via the cut section (115).

8. The fluid flow system (100) according to any one of claims 6 to 7. in, The exchange surface (103) is formed by the first surface (111) of the mounting plate (110). The mounting plate (110) includes a second surface (112) that is opposite to the first surface (111). The heating electronic component (101) is configured to be attached to the second surface (112), and The mounting plate (110) is configured to conductively transfer heat from the heat-generating electronic component (101) to the fluid.

9. The fluid flow system (100) according to any one of claims 6 to 8. in, The mounting plate (110) includes a mounting device configured to provide a form-fit connection between the heating electronic component (101) and the mounting plate (110) to provide a predetermined contact pressure between the heating electronic component (101) and the second surface (112).

10. The fluid flow system (100) according to any one of the preceding claims. in, The heating electronic component (101) includes: Side panel (105), the side panel (105) having an inner surface (106) and an outer surface (107); Heat source (108); and Heat transfer device (109). The heat transfer device (109) is configured as follows: Heat is conductively transferred from the heat source (108) to the inner surface (106) of the side panel, and The outer surface (107) of the side panel (105) is away from the heat source (108) and makes thermal contact with the fluid flow device (102).

11. The fluid flow system (100) according to any one of claims 6 to 9 and claim 10. in, The outer surface (107) of the side panel (105) is configured as follows: When the heating electronic component (101) is attached to the mounting plate (110), it makes full surface contact with the mounting plate (110).

12. The fluid flow system (100) according to claim 6. in, The fluid flow device (102) includes a heat transfer structure (113), which is configured such that: Increase the surface area of ​​the exchange surface (103), Absorbs heat from the mounting plate (110), and The absorbed heat is dissipated into the fluid via the surface region of the exchange surface (103).

13. The fluid flow system (100) according to any one of the preceding claims. Includes a heat pump disposed between the heating electronic component (101) and the fluid flow device (102), in, The heat pump is configured as follows: Heat is actively transferred from the heating electronic component (101) to the fluid flow device (102).

14. The fluid flow system (100) according to any one of the preceding claims. in, The fluid flow system (100) includes a temperature control device configured to increase the temperature of the fluid volume within the radiator (206) to a temperature above a predetermined temperature threshold by controlling the flow of the fluid within the fluid flow system (100).

15. The fluid flow system (100) according to any one of claims 1 to 13. in, The fluid is air. The radiator (206) is a vehicle compartment, and The fluid flow system (100) further includes a temperature control device configured to control the temperature inside the vehicle compartment at least in part by controlling the discharge rate of the fluid into the vehicle compartment.

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