A power module

Abstract

The application provides a power module, and belongs to the technical field of electrical equipment, which comprises a radiator assembly, a second ventilation interval is formed between the first front radiator and the first rear radiator and between the second front radiator and the second rear radiator, and a wind guide structure is arranged in the second ventilation interval; the wind guide structure comprises a first wind guide plate and a second wind guide plate, the air outlet side of the first wind guide plate extends to the direction of the root of the teeth of the first rear radiator, the air outlet side of the second wind guide plate extends to the direction of the root of the teeth of the second rear radiator, and a bifurcated flow guide air duct is formed.

Description

Technical Field

[0001] This invention belongs to the field of electrical equipment technology, and more specifically, relates to a power module. Background Technology

[0002] Power modules are installed inside the cabinet of electrical equipment. A power module typically contains multiple sets of different power devices. For power modules that require multiple operating states, the losses of each power device are different under different operating conditions.

[0003] For example, the power modules of an uninterruptible power supply mainly consist of inverter power transistors, rectifier power transistors, battery power transistors, and output power transistors. In mains power mode, the battery power transistors are not working, while the rectifier power transistors and inverter power transistors are continuously working; in battery mode, the battery power transistors and inverter power transistors are continuously working, while the rectifier power transistors are not working; regardless of the state, the output power transistors are always operational.

[0004] In terms of heat dissipation design for power modules, existing technologies often involve independent heat dissipation for each functional power device. This means that the heat dissipation path for each functional power device is independent, resulting in extremely low heat dissipation efficiency for power devices that are not in operation or have low power loss during operation. Moreover, in order to meet the heat dissipation requirements of each power device under all conditions (especially harsh operating conditions), the heat dissipation equipment for each part is often made very large to meet the requirements, leading to high heat dissipation costs. Summary of the Invention

[0005] The purpose of this invention is to provide a power module that addresses the technical problems of low heat dissipation efficiency, large size, and high cost of heat dissipation devices in existing power modules.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is: a power module, characterized in that it includes a heat sink assembly, wherein the heat sink assembly is defined to have a first direction, a second direction, and a third direction, the first direction, the second direction, and the third direction being orthogonal to each other, and the first direction being defined as the ventilation direction, and the third direction being the height direction of the heat sink assembly; the heat sink assembly includes a first heat sink body and a second heat sink body disposed at intervals along the third direction; the first heat sink body includes a first substrate and a first front heat sink body disposed on the first substrate; the second heat sink body includes a second substrate and a second front heat sink portion and a second rear heat sink portion disposed on the second substrate and arranged sequentially along the first direction; the first front heat sink portion and the... A second ventilation gap exists between the first rear heat dissipation section, the second front heat dissipation section, and the second rear heat dissipation section; an air guide structure is provided within the second ventilation gap; the air guide structure includes: a first air guide plate extending along the second direction; the first air guide plate is inclined relative to the first direction, and the air inlet side of the first air guide plate is located on the symmetrical plane of the first front heat dissipation section and the second front heat dissipation section, and the air outlet side of the first air guide plate extends toward the tooth root direction of the first rear heat dissipation section; and a second air guide plate extending along the second direction; the second air guide plate is inclined relative to the first direction, and the air inlet side of the second air guide plate (82) is connected to the air inlet side of the first air guide plate, and the air outlet side of the second air guide plate extends toward the tooth root direction of the second rear heat dissipation section.

[0007] In one possible implementation, the power module includes a first intermittent power transistor group, a second intermittent power transistor group, and a normally open power transistor group, respectively disposed on the heat sink assembly. The heat sink assembly includes a first heat dissipation body and a second heat dissipation body spaced apart along the third direction. The first intermittent power transistor group and the second intermittent power transistor group are respectively disposed on the first heat dissipation body. The normally open power transistor group is disposed on the second heat dissipation body and the first heat dissipation body. The power module has a first operating state and a second operating state. In the first operating state, the first intermittent power transistor group and the normally open power transistor group are in operation, and the second intermittent power transistor group is in a closed state. In the second operating state, the second intermittent power transistor group and the normally open power transistor group are in operation, and the first intermittent power transistor group is in a closed state.

[0008] In one possible implementation, the normally open power transistor group includes a first normally open power transistor group and a second normally open power transistor group; the heat generation of the first normally open power transistor group is less than the heat generation of the second normally open power transistor group. The first normally open power transistor group is disposed on the second heat dissipation body; and in the third direction, the first normally open power transistor group corresponds to the first intermittent power transistor group. The heat generated by the second normally open power transistor group is greater than that generated by the first intermittent power transistor group; the second normally open power transistor group is disposed on the first heat dissipation body, and in the first direction, the second normally open power transistor group is located on the air outlet side of the first intermittent power transistor group.

[0009] In some embodiments, the first heat dissipation body includes a first substrate, and a first front heat dissipation body and a first rear heat dissipation body disposed on the first substrate and arranged sequentially along the first direction; the heat dissipation height of the first front heat dissipation body is smaller than the heat dissipation height of the first rear heat dissipation body. The first intermittent power transistor group, the second intermittent power transistor group, and the second normally open power transistor group are respectively disposed on the first substrate; and in the third direction, the first front heat dissipation body corresponds to the first intermittent power transistor group, and the first rear heat dissipation body corresponds to the second intermittent power transistor group and the second normally open power transistor group.

[0010] In some embodiments, the first intermittent power transistor group includes a first front power transistor group and a first rear power transistor group that are spaced apart along the first direction; The heat dissipation height of the first front heat dissipation part is smaller than the heat dissipation height of the first rear heat dissipation part; In the third direction, the first front heat dissipation part corresponds to the first front power transistor group, and the first rear heat dissipation part corresponds to the first rear power transistor group.

[0011] In some embodiments, the first normally open power transistor group includes a second front power transistor group and a second rear power transistor group arranged at intervals along the first direction. The second heat dissipation body includes a second substrate, and the heat dissipation height of the second front heat dissipation part is smaller than the heat dissipation height of the second rear heat dissipation part; In the third direction, the second front power transistor group corresponds to the second front heat sink and the first front heat sink, and the second rear power transistor group corresponds to the second rear heat sink and the first rear heat sink.

[0012] In some embodiments, there is a first ventilation gap between the first front heat dissipation part and the second front heat dissipation part, and the first front heat dissipation part and the second front heat dissipation part are symmetrically arranged; A third ventilation gap exists between the first rear heat dissipation section, the second rear heat dissipation section and the first rear heat dissipation body; an air outlet plate is provided within the third ventilation gap, and a first air outlet is provided on the air outlet plate.

[0013] In some embodiments, the first rear heat dissipation section and the second rear heat dissipation section are symmetrically arranged, and a heat exchange plate is provided between the first rear heat dissipation section and the second rear heat dissipation section.

[0014] In some embodiments, an air guiding structure is provided within the second ventilation gap; the air guiding structure includes: A first air guide plate extends along the second direction; the first air guide plate is inclined relative to the first direction, and the air inlet side of the first air guide plate is located on the plane of symmetry between the first front heat dissipation part and the second front heat dissipation part, while the air outlet side of the first air guide plate extends towards the root of the teeth of the first rear heat dissipation part; and The second air guide plate extends along the second direction; the second air guide plate is inclined relative to the first direction, and the air inlet side of the second air guide plate is connected to the air inlet side of the first air guide plate, and the air outlet side of the second air guide plate extends toward the tooth root direction of the second rear heat dissipation part.

[0015] In some embodiments, a sealing plate is provided at the bottom of the teeth of the first rear heat dissipation body; a second air outlet is provided on the sealing plate; the second air outlet is close to the air outlet side of the first rear heat dissipation body.

[0016] In one possible implementation, the power module further includes: Fan assembly; in the first direction, the fan assembly is located on the air inlet side of the radiator assembly; In the third direction, the two ends of the fan assembly are respectively connected to the air inlet side of the first heat dissipation body and the air inlet side of the second heat dissipation body through baffles.

[0017] The beneficial effects of the power module provided by this invention are as follows: the apex of the two guide plates is at the center of the gap between the front and rear heat dissipation sections, and the left and right plates extend outward at an angle, with their ends reaching the roots of the teeth of the left and right rear heat dissipation sections respectively. The cold air that sneaks in from the middle gap is diverted and sent to the high-temperature heat dissipation areas on both sides, thereby achieving at least the following effects: 1. It gathers the air leaking in the middle and directs it all to the high-temperature tooth roots, improving the heat exchange at the rear end; 2. The split V-shaped structure is adapted to the gap between the double-row heat sinks, making installation convenient; and 3. It can optimize the airflow distribution without modifying the heat sink body. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1A schematic diagram of the power module provided in an embodiment of the present invention. Figure 1 ; Figure 2 A schematic diagram of the power module provided in an embodiment of the present invention. Figure 2 ; Figure 3 for Figure 1 Front view structural diagram; Figure 4 This is a schematic diagram of the heat sink assembly of the power module provided in an embodiment of the present invention.

[0020] In the figure: 1. Heat sink assembly; 11. First heat sink body; 111. First substrate; 112. First front heat sink body; 1121. First front heat sink section; 1122. First rear heat sink section; 113. First rear heat sink body; 12. Second heat sink body; 121. Second substrate; 122. Second front heat sink section; 123. Second rear heat sink section; 13. First ventilation gap; 14. Second ventilation gap; 15. Third ventilation gap; 2. First intermittent power transistor group; 21. First printed circuit board... 1. Circuit board; 22. First front power transistor group; 23. First rear power transistor group; 3. Second intermittent power transistor group; 4. First normally open power transistor group; 41. Second printed circuit board; 42. Second front power transistor group; 43. Second rear power transistor group; 5. Second normally open power transistor group; 6. Heat spreader; 71. Air outlet plate; 711. First air outlet; 72. Sealing plate; 721. Second air outlet; 8. Air guide structure; 81. First air guide plate; 82. Second air guide plate; 9. Fan assembly; 91. Baffle. Detailed Implementation

[0021] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0022] Please refer to the following: Figures 1 to 4 The power module provided by the present invention will now be described. The power module includes a heat sink assembly 1, and a first intermittent power transistor group 2, a second intermittent power transistor group 3, and a normally open power transistor group respectively disposed on the heat sink assembly 1.

[0023] The radiator assembly 1 is defined to have a first direction, a second direction, and a third direction, which are orthogonal to each other. The first direction is defined as the ventilation direction, and the third direction is defined as the height direction of the radiator assembly 1. The radiator assembly 1 includes a first heat dissipation body 11 and a second heat dissipation body 12 arranged at intervals along the third direction. The first heat dissipation body 11 and the second heat dissipation body 12 each have a plurality of heat dissipation teeth arranged at intervals along the second direction and with their tooth height parallel to the third direction.

[0024] The first intermittent power transistor group 2 and the second intermittent power transistor group 3 are respectively disposed on the first heat sink 11. The normally open power transistor group is disposed on the second heat sink 12 and the first heat sink 11.

[0025] The power module has a first operating state and a second operating state. In the first operating state, the first intermittent power transistor group 2 and the normally open power transistor group are in the running state, and the second intermittent power transistor group 3 is in the off state. In the second operating state, the second intermittent power transistor group 3 and the normally open power transistor group are in the running state, and the first intermittent power transistor group 2 is in the off state.

[0026] It should be noted that the power modules are assembled inside the cabinet, and generally, the power modules are placed horizontally. That is to say, the height direction of the cabinet is also the aforementioned third direction. Since the cabinet is placed on the ground, the aforementioned third direction can be understood as the vertical direction. In other words, the first heat dissipation body 11 and the second heat dissipation body 12 are arranged side by side, and preferably, the first heat dissipation body 11 is located above the second heat dissipation body 12.

[0027] A fan assembly 9 is provided on the air inlet side of the radiator assembly 1. The fan assembly 9 is used to supply cold air to the radiator assembly 1. In order to ensure that all the cold air passes through the radiator assembly 1 and to prevent the cold air from overflowing, the upper and lower ends of the fan assembly 9 are connected to the air inlet side of the first heat dissipation body 11 and the air inlet side of the second heat dissipation body 12 respectively through baffles 91.

[0028] In addition, in the second direction, the two ends of the radiator assembly 1 are respectively provided with baffles. The baffles extend along the third direction and are also used to block the air from overflowing, so as to ensure that the airflow flows from the air inlet side to the air outlet side of the radiator assembly 1.

[0029] It should be noted that the above-mentioned normally open power transistor group is set on the second heat dissipation body 12 and the first heat dissipation body 11, which means that a part of the power devices of the normally open power transistor group are set on the second heat dissipation body 12 and the other part of the power devices are set on the first heat dissipation body 11.

[0030] The cold air passes through the first heat dissipation body 11 and the second heat dissipation body 12 respectively to dissipate heat from different power transistor groups.

[0031] Specifically, when the power module is in the first working state, the first intermittent power transistor group 2 and the normally open power transistor group are in the running state, and the second intermittent power transistor group 3 is in the closed state. The power transistor group in the running state generates heat, while the power transistor group in the closed state does not generate heat. Part of the cold air passes through the first heat dissipation body 11 to dissipate heat from another part of the power devices in the first intermittent power transistor group 2 and the normally open power transistor group. Part of the cold air passes through the second heat dissipation body 12 to dissipate heat from a part of the power devices in the normally open power transistor group.

[0032] When the power module is in the second working state, the second intermittent power transistor group 3 and the normally open power transistor group are in the running state, the first intermittent power transistor group 2 is in the closed state, some cold air passes through the first heat dissipation body 11 to dissipate heat on another part of the power devices of the second intermittent power transistor group 3 and the normally open power transistor group; some cold air passes through the second heat dissipation body 12 to dissipate heat on a part of the power devices of the normally open power transistor group.

[0033] The power module provided by this invention has a first intermittent power transistor group 2 and a second intermittent power transistor group 3 respectively disposed on a first heat dissipation body 11. In a first working state, the second intermittent power transistor group 3 is not working, and the first heat dissipation body 11 dissipates heat from the first intermittent power transistor group 2. In a second state, the first intermittent power transistor group 2 is not working, and the first heat dissipation body 11 dissipates heat from the second intermittent power transistor group 3. The normally open power transistor group is disposed separately on the second heat dissipation body 12 (or some power devices of the normally open power transistor group are disposed separately on the second heat dissipation body 12). Regardless of the working state of the power module, the second heat dissipation body 12 dissipates heat from the normally open power transistor group separately.

[0034] Compared with the prior art, the heat sink assembly 1 of the power module provided by the present invention has two heat dissipation bodies. The first heat dissipation body 11 dissipates heat from the first intermittent power transistor group 2 and the second intermittent power transistor group 3 in different working states, and the second heat dissipation body 12 dissipates heat from the normally open power transistor group. By integrating the above-mentioned power transistor groups on the heat sink assembly 1, the volume and area occupied by the heat sink assembly 1 can be reduced, the heat dissipation efficiency can be improved, and the cost can be reduced.

[0035] In some embodiments, the above-mentioned normally open power transistor group can be adopted as follows: Figure 1 , Figure 2 and Figure 3 The structure shown is described in the following document. Figure 1 , Figure 2 and Figure 3 The normally open power transistor group includes a first normally open power transistor group 4 and a second normally open power transistor group 5.

[0036] The heat generated by the first normally open power transistor group 4 is less than that generated by the second normally open power transistor group 5; the first normally open power transistor group 4 is disposed on the second heat dissipation body 12; and in the third direction, the first normally open power transistor group 4 corresponds to the first intermittent power transistor group 2. The heat generated by the first normally open power transistor group 4 is approximately the same as that generated by the first intermittent power transistor group 2.

[0037] The heat output of the second normally open power transistor group 5 is greater than that of the first intermittent power transistor group 2. The second normally open power transistor group 5 is disposed on the first heat dissipation body 11, and in the first direction, the second normally open power transistor group 5 is located on the air outlet side of the first intermittent power transistor group 2. In addition, the second intermittent power transistor group 3 is also located on the air outlet side of the first intermittent power transistor group 2. The heat output of the second intermittent power transistor group 3 is approximately the same as that of the second normally open power transistor group 5.

[0038] Since the heat generated by the first normally open power transistor group 4 is less than that generated by the second normally open power transistor group 5, and the first normally open power transistor group 4 and the second normally open power transistor group 5 are always in operation, the first normally open power transistor group 4 and the second normally open power transistor group 5 are set up separately.

[0039] Furthermore, since the heat generation of the second normally open power transistor group 5 is greater than that of the first intermittent power transistor group 2, the heat generation of the first normally open power transistor group 4 is approximately the same as that of the first intermittent power transistor group 2. If the first normally open power transistor group 4 is placed on the first heat dissipation body 11 and the second normally open power transistor group 5 is placed on the second heat dissipation body 12, since the heat generation of the first intermittent power transistor group 2 is approximately the same as that of the first normally open power transistor group 4, the first intermittent power transistor group 2 and the first normally open power transistor group 4 need to be arranged side by side in the first direction, that is, the first intermittent power transistor group 2 and the first normally open power transistor group 4 are spaced apart along the second direction. This arrangement will increase the width of the heat sink assembly 1. In addition, since the heat generation of the second normally open power transistor group 5 is greater than that of the first intermittent power transistor group 2, the heat dissipation teeth of the second heat dissipation body 12 need to be set higher, which also increases the volume of the heat sink assembly 1. Therefore, in this embodiment, the second normally open power transistor group 5 is placed on the first heat dissipation body 11, and in the first direction, the second normally open power transistor group 5 is located on the air outlet side of the first intermittent power transistor group 2. The first normally open power transistor group 4 is placed on the second heat dissipation body 12, and the first normally open power transistor group 4 corresponds to the first intermittent power transistor group 2 in the third direction.

[0040] When the power module is in the first working state, the cold air passes through the first heat dissipation body 11 and first dissipates heat from the first intermittent power transistor group 2. After the airflow passes through the first intermittent power transistor group 2, the air temperature rises (because the heat generated by the second normally open power transistor group 5 is greater than the heat generated by the first intermittent power transistor group 2, the air temperature at this time is lower than the working temperature of the second normally open power transistor group 5), and continues to pass through the first heat dissipation body 11 to dissipate heat from the second normally open power transistor group 5.

[0041] When the power module is in the second working state, the cold air passes through the first heat dissipation body 11 and at the same time dissipates heat on the second normally open power transistor group 5 and the second intermittent power transistor group 3.

[0042] Since the heat generation of the first normally open power transistor group 4 is roughly the same as that of the first intermittent power transistor group 2, the first normally open power transistor group 4 and the first intermittent power transistor group 2 are aligned in the third direction. This can reduce the overall height of the heat sink assembly 1 and make full use of the first heat sink body 11 and the second normally open power transistor group 5 and the second intermittent power transistor group 3 with large heat generation for effective heat dissipation, thereby improving heat dissipation efficiency.

[0043] In some embodiments, the first heat dissipation body 11 may adopt the following... Figures 1 to 4 The structure shown is described in the following document. Figures 1 to 4 The first heat dissipation body 11 includes a first substrate 111, and a first front heat dissipation body 112 and a first rear heat dissipation body 113 disposed on the first substrate 111 and arranged sequentially along a first direction; the heat dissipation height of the first front heat dissipation body 112 is less than the heat dissipation height of the first rear heat dissipation body 113.

[0044] The first intermittent power transistor group 2, the second intermittent power transistor group 3, and the second normally open power transistor group 5 are respectively disposed on the first substrate 111; and in the third direction, the first front heat dissipation body 112 corresponds to the first intermittent power transistor group 2, and the first rear heat dissipation body 113 corresponds to the second intermittent power transistor group 3 and the second normally open power transistor group 5.

[0045] The first substrate 111 is mainly used to fix the first intermittent power transistor group 2, the second intermittent power transistor group 3, and the second normally open power transistor group 5.

[0046] Since the heat generated by the second normally open power transistor group 5 and the second intermittent power transistor group 3 is greater than that generated by the first intermittent power transistor group 2, that is, the losses of the second normally open power transistor group 5 and the second intermittent power transistor group 3 are the greatest and most concentrated, the heat dissipation height of the heat dissipation teeth of the first rear heat dissipation body 113 corresponding to the second normally open power transistor group 5 and the second intermittent power transistor group 3 is increased to effectively dissipate heat from the second normally open power transistor group 5 and the second intermittent power transistor group 3.

[0047] It should be noted that, since the first intermittent power transistor group 2 is spaced apart from the second normally open power transistor group 5 and the second intermittent power transistor group 3, in order to reduce the overall weight of the heat sink assembly 1 and optimize the structure of the heat sink assembly 1, the first front heat sink body 112 and the first rear heat sink body 113 are spaced apart, and there are no heat sink teeth between them.

[0048] In some embodiments, the first intermittent power transistor group 2 and the first front heat dissipation body 112 may be adopted as follows: Figure 1 , Figure 3 and Figure 4 The structure shown is described in the following document. Figure 1 , Figure 3 and Figure 4 The first intermittent power transistor group 2 includes a first front power transistor group 22 and a first rear power transistor group 23 spaced apart along a first direction; the first front heat dissipation body 112 includes a first front heat dissipation part 1121 and a first rear heat dissipation part 1122 spaced apart along a first direction; the heat dissipation height of the first front heat dissipation part 1121 is less than the heat dissipation height of the first rear heat dissipation part 1122; wherein, in a third direction, the first front heat dissipation part 1121 corresponds to the first front power transistor group 22, and the first rear heat dissipation part 1122 corresponds to the first rear power transistor group 23.

[0049] Since the first front power transistor group 22 and the first rear power transistor group 23 are spaced apart and there are no other power devices between them, in order to reduce the weight of the first front heat dissipation body 112, the first front heat dissipation body 112 is divided into a first front heat dissipation part 1121 and a first rear heat dissipation part 1122 spaced apart. The two parts are designed without toothed plates, which can reduce the overall weight of the heat sink assembly 1 and reduce wind resistance.

[0050] In addition, since the temperature rises after the air passes through the first front heat dissipation section 1121, the height of the heat dissipation teeth of the first rear heat dissipation section 1122 is increased accordingly, which can increase the heat dissipation efficiency of the first rear heat dissipation section 1122.

[0051] In some embodiments, the first normally open power transistor group 4 and the second heat sink 12 can be adopted as follows: Figures 1 to 4 The structure shown is described in the following document. Figures 1 to 4 The first normally open power transistor group 4 includes a second front power transistor group 42 and a second rear power transistor group 43 arranged at intervals along a first direction; the second heat dissipation body 12 includes a second substrate 121, and a second front heat dissipation part 122 and a second rear heat dissipation part 123 arranged sequentially along the first direction on the second substrate 121; the heat dissipation height of the second front heat dissipation part 122 is less than the heat dissipation height of the second rear heat dissipation part 123; wherein, in the third direction, the second front power transistor group 42 corresponds to the second front heat dissipation part 122 and the first front heat dissipation part 1121, and the second rear power transistor group 43 corresponds to the second rear heat dissipation part 123 and the first rear heat dissipation part 1122.

[0052] The second substrate 121 is mainly used to fix the first normally open power transistor group 4. Since the second front power transistor group 42 and the second rear power transistor group 43 are arranged at intervals and there are no other power devices between them, in order to reduce the weight of the second heat dissipation body 12, the second heat dissipation body 12 is divided into a second front heat dissipation part 122 and a second rear heat dissipation part 123 arranged at intervals. The toothless design between the two can reduce the overall weight of the heat sink assembly 1 and reduce the wind resistance.

[0053] In addition, since the temperature rises after the air passes through the second front heat dissipation section 122, the height of the heat dissipation teeth of the second rear heat dissipation section 123 is increased accordingly, which can increase the heat dissipation efficiency of the second rear heat dissipation section 123.

[0054] In some embodiments, the first heat dissipation body 11 and the second heat dissipation body 12 may be adopted as follows: Figures 1 to 4 The structure shown is described in the following document. Figures 1 to 4 There is a first ventilation gap 13 between the first front heat dissipation part 1121 and the second front heat dissipation part 122, and the first front heat dissipation part 1121 and the second front heat dissipation part 122 are arranged symmetrically.

[0055] A second ventilation gap 14 exists between the first front heat dissipation section 1121 and the first rear heat dissipation section 1122, and between the second front heat dissipation section 122 and the second rear heat dissipation section 123; an air guide structure 8 is provided within the second ventilation gap 14.

[0056] There is a third ventilation gap 15 between the first rear heat dissipation part 1122, the second rear heat dissipation part 123 and the first rear heat dissipation body 113; an air outlet plate 71 is provided in the third ventilation gap 15, and a first air outlet 711 is provided on the air outlet plate 71.

[0057] The first front heat dissipation section 1121 and the second front heat dissipation section 122 are spaced apart along a third direction, with a first ventilation gap 13 between them. The cold air delivered by the fan assembly 9 passes partly through the first front heat dissipation section 1121, partly through the second front heat dissipation section 122, and partly directly through the first ventilation gap 13 and the second ventilation gap 14 to the first rear heat dissipation section 1122 and the second rear heat dissipation section 123. That is to say, the first rear heat dissipation section 1122 and the second rear heat dissipation section 123 can also receive initial cold air.

[0058] The first front heat dissipation section 1121 and the second front heat dissipation section 122 are arranged at intervals along the third direction, so that three sets of air paths can be formed on the air intake side of the heat sink assembly 1, ensuring that the first rear heat dissipation section 1122 and the second rear heat dissipation section 123 also have cold air passing through, breaking the thermal cascading, thereby improving the heat dissipation efficiency of the first rear heat dissipation section 1122 and the second rear heat dissipation section 123.

[0059] An air outlet plate 71 is provided within the third ventilation gap 15. The air outlet plate 71 has a first air outlet 711, which allows the hot air passing through the root of the teeth of the second heat dissipation body 12 to be discharged from the first air outlet 711 in advance. This can prevent thermal cascading and reduce wind resistance.

[0060] Specifically, the air outlet plate 71 is inclined relative to the first direction, one end of the air outlet plate 71 is connected to the air outlet end face of the second substrate 121, and the other end of the air outlet plate 71 is connected to the air inlet side of the first rear heat dissipation body 113.

[0061] In some embodiments, the first rear heat dissipation section 1122 and the second rear heat dissipation section 123 are symmetrically arranged, and a heat exchange plate 6 is provided between the first rear heat dissipation section 1122 and the second rear heat dissipation section 123, such as... Figure 2 , Figure 3 and Figure 4 As shown.

[0062] Since the heat dissipation height of the first rear heat dissipation section 1122 is greater than that of the first front heat dissipation section 1121, and the heat dissipation height of the second rear heat dissipation section 123 is greater than that of the second front heat dissipation section 122, that is, the tooth height of the heat dissipation teeth of the first rear heat dissipation section 1122 and the second rear heat dissipation section 123 is relatively large, adding a heat spreader 6 between the two can conduct heat between the second rear heat dissipation section 123 and the first rear heat dissipation section 1122, thereby improving the temperature uniformity between the first front heat dissipation body 112 and the second rear heat dissipation section 123.

[0063] When the power module is in the second operating state, the first intermittent power transistor group 2 is not working and does not generate heat. Some of the cold air passes through the first front heat dissipation section 1121 and the first rear heat dissipation section 1122 in sequence, and the air temperature rises slowly or almost not at all. Some of the cold air passes through the second front heat dissipation section 122 and the second rear heat dissipation section 123 in sequence, carrying away the heat from the first normally open power transistor group 4, and the air temperature rises. The temperature of the first rear heat dissipation section 1122 is low, and the heat from the second rear heat dissipation section 123 can be absorbed by the heat spreader 6. In other words, when the power module is in the second operating state, the first rear heat dissipation section 1122 and the second rear heat dissipation section 123 can simultaneously absorb the heat from the first normally open power transistor group 4, thereby improving the heat dissipation efficiency of the entire heat sink assembly 1.

[0064] In some embodiments, the second ventilation gap 14 may employ, for example... Figure 2 , Figure 3 and Figure 4 The structure shown is described in the following document. Figure 2 , Figure 3 and Figure 4 An air guide structure 8 is provided within the second ventilation gap 14. The air guide structure 8 is used to guide the cold air passing through the first ventilation gap 13 into the root of the teeth of the first rear heat dissipation part 1122 and the second rear heat dissipation part 123.

[0065] Specifically, the air guiding structure 8 includes a first air guiding plate 81 and a second air guiding plate 82. The first air guiding plate 81 extends along a second direction. The first air guiding plate 81 is inclined relative to the first direction, and the air inlet side of the first air guiding plate 81 is located on the plane of symmetry between the first front heat dissipation part 1121 and the second front heat dissipation part 122. The air outlet side of the first air guiding plate 81 extends toward the tooth root direction of the first rear heat dissipation part 1122. The second air guiding plate 82 extends along the second direction. The second air guiding plate 82 is inclined relative to the first direction, and the air inlet side of the second air guiding plate 82 is connected to the air inlet side of the first air guiding plate 81. The air outlet side of the second air guiding plate 82 extends toward the tooth root direction of the second rear heat dissipation part 123.

[0066] The first air guide plate 81 can guide the cold air to the root of the teeth of the first rear heat dissipation section 1122, and the second air guide plate 82 can guide the cold air to the root of the teeth of the second rear heat dissipation section 123. Since the temperature rises faster at the root of the teeth, the greater the temperature difference at the root of the teeth, the higher the heat dissipation effect.

[0067] Specifically, to facilitate assembly of the air guide structure 8, the air guide structure 8 is designed as a square tube structure, with one side wall of the square tube structure serving as a first air guide plate 81 and the other side wall serving as a second air guide plate 82. The two ends of the square tube structure are respectively fixed to the two end partitions of the radiator assembly 1.

[0068] Preferably, the angle between the surface of the first guide plate 81 and the surface of the second guide plate 82 is greater than or equal to 90°. If the angle between the surface of the first guide plate 81 and the surface of the second guide plate 82 is less than 90°, the cold air passing through the guide structure 8 will generate a wake vortex. Making the angle between the surface of the first guide plate 81 and the surface of the second guide plate 82 greater than or equal to 90° can reduce the wake vortex formed by the low-pressure air at the rear of the guide structure 8.

[0069] In some embodiments, the first rear heat dissipation body 113 described above can be adopted as follows: Figure 2 and Figure 4 The structure shown is described in the following document. Figure 2 and Figure 4 A sealing plate 72 is provided at the bottom of the teeth of the first rear heat dissipation body 113; a second air outlet 721 is provided on the sealing plate 72; the second air outlet 721 is close to the air outlet side of the first rear heat dissipation body 113.

[0070] The sealing plate 72 is used to block the first rear heat dissipation body 113, so as to prevent the airflow from flowing directly away from the bottom of the teeth of the first rear heat dissipation body 113 and thus prevent hot air from passing through the rear of the first rear heat dissipation body 113.

[0071] A second air outlet 721 is provided on the air outlet side of the sealing plate 72. In addition, an air outlet is also formed on the air outlet side of the first rear heat dissipation body 113. That is to say, two sets of air outlets are provided on the first rear heat dissipation body 113, and the air outlets of the two sets of air outlets are different, so that hot air can be discharged from the two air outlets to reduce wind resistance and prevent thermal cascading.

[0072] The power module provided in this embodiment has two operating states. In the first operating state, the first intermittent power transistor group 2 is in operation, while the second intermittent power transistor group 3 is not in operation. The fan assembly 9 delivers cold air to the radiator assembly 1. Part of the cold air passes through the first front heat dissipation section 1121, and part of the cold air passes through the second front heat dissipation section 122 to dissipate heat from the first front power transistor group 22 and the second front power transistor group 42; part of the cold air passes through the first ventilation gap 13 and flows through the air guide structure 8 to the root of the teeth of the first rear heat dissipation section 1122 and the root of the teeth of the second rear heat dissipation section 123; the cold air merges with the air passing through the first front heat dissipation section 1121 and the second front heat dissipation section 122, which can reduce the temperature of the air entering the first rear heat dissipation section 1122 and the second rear heat dissipation section 123, and the airflow passes through the first rear heat dissipation section 1122 and the second rear heat dissipation section 123 to dissipate heat from the first rear power transistor group 23 and the second rear power transistor group 43; the hot air passing through the root of the teeth of the second rear heat dissipation section 123 is discharged from the first air outlet 711 from the radiator assembly 1. The hot air passing through the first rear heat dissipation section 1122 enters the first rear heat dissipation body 113 again through the third ventilation gap 15, dissipates heat for the second normally open power tube group 5, and is finally discharged from the second air outlet 721 and the air outlet on the air outlet side of the first rear heat dissipation body 113.

[0073] In the second operating state, the first intermittent power transistor group 2 is not working, while the second intermittent power transistor group 3 is operating. The fan assembly 9 delivers cool air to the radiator assembly 1. Part of the cool air passes through the second front heat dissipation section 122 to dissipate heat from the second front power transistor group 42; part of the cool air passes through the first front heat dissipation section 1121; and part of the cool air passes through the first ventilation gap 13 and flows through the air guide structure 8 to the root of the teeth of the first rear heat dissipation section 1122 and the root of the teeth of the second rear heat dissipation section 123. The temperature of the first rear heat dissipation section 1122 is low, and the heat from the second rear heat dissipation section 123 can be absorbed by the heat spreader plate 6 to simultaneously dissipate heat from the second rear power transistor group 43. The hot air passing through the root of the teeth of the second rear heat dissipation section 123 is discharged from the radiator assembly 1 through the first air outlet 711. The cold air passing through the first rear heat dissipation section 1122 enters the first rear heat dissipation body 113 through the third ventilation gap 15, dissipates heat on the second normally open power transistor group 5 and the second intermittent power transistor group 3, and is finally discharged from the second air outlet 721 and the air outlet on the air outlet side of the first rear heat dissipation body 113.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A power module, characterized in that, The radiator assembly (1) is defined to have a first direction, a second direction and a third direction, the first direction, the second direction and the third direction are orthogonal to each other, and the first direction is defined as the ventilation direction, and the third direction is the height direction of the radiator assembly (1); the radiator assembly (1) includes a first heat dissipation body (11) and a second heat dissipation body (12) arranged at intervals along the third direction. The first heat dissipation body (11) includes a first substrate (111) and a first front heat dissipation body (112) disposed on the first substrate (111). The first front heat dissipation body (112) includes a first front heat dissipation part (1121) and a first rear heat dissipation part (1122) arranged at intervals along the first direction. The second heat dissipation body (12) includes a second substrate (121), and a second front heat dissipation part (122) and a second rear heat dissipation part (123) disposed on the second substrate (121) and arranged sequentially along the first direction. A second ventilation gap (14) exists between the first front heat dissipation part (1121) and the first rear heat dissipation part (1122), and between the second front heat dissipation part (122) and the second rear heat dissipation part (123). An air guide structure (8) is provided within the second ventilation gap (14); the air guide structure (8) includes: A first air guide plate (81) extends along the second direction; the first air guide plate (81) is inclined relative to the first direction, and the air inlet side of the first air guide plate (81) is located on the plane of symmetry between the first front heat dissipation part (1121) and the second front heat dissipation part (122), and the air outlet side of the first air guide plate (81) extends toward the root of the teeth of the first rear heat dissipation part (1122); and The second air guide plate (82) extends along the second direction; the second air guide plate (82) is inclined relative to the first direction, and the air inlet side of the second air guide plate (82) is connected to the air inlet side of the first air guide plate (81), and the air outlet side of the second air guide plate (82) extends toward the tooth root direction of the second rear heat dissipation part (123).

2. The power module as described in claim 1, characterized in that, It also includes a first intermittent power transistor group (2), a second intermittent power transistor group (3), and a normally open power transistor group respectively disposed on the heat sink assembly (1); the heat sink assembly (1) includes a first heat sink body (11) and a second heat sink body (12) disposed at intervals along the third direction; the first intermittent power transistor group (2) and the second intermittent power transistor group (3) are respectively disposed on the first heat sink body (11); the normally open power transistor group is disposed on the second heat sink body (12) and the first heat sink body (11); wherein, the power module has a first working state and a second working state, in the first working state, the first intermittent power transistor group (2) and the normally open power transistor group are in the running state, and the second intermittent power transistor group (3) is in the closed state; in the second working state, the second intermittent power transistor group (3) and the normally open power transistor group are in the running state, and the first intermittent power transistor group (2) is in the closed state.

3. The power module as described in claim 2, characterized in that, The normally open power transistor group includes a first normally open power transistor group (4) and a second normally open power transistor group (5); the heat generation of the first normally open power transistor group (4) is less than the heat generation of the second normally open power transistor group (5); The first normally open power transistor group (4) is disposed on the second heat dissipation body (12); and in the third direction, the first normally open power transistor group (4) corresponds to the first intermittent power transistor group (2); The heat generated by the second normally open power transistor group (5) is greater than that generated by the first intermittent power transistor group (2); the second normally open power transistor group (5) is disposed on the first heat dissipation body (11), and in the first direction, the second normally open power transistor group (5) is located on the air outlet side of the first intermittent power transistor group (2).

4. The power module as described in claim 3, characterized in that, The first heat dissipation body (11) further includes a first rear heat dissipation body (113) disposed on the first substrate (111) and arranged sequentially with the first front heat dissipation body (112) along the first direction; the heat dissipation height of the first front heat dissipation body (112) is smaller than the heat dissipation height of the first rear heat dissipation body (113); The first intermittent power transistor group (2), the second intermittent power transistor group (3) and the second normally open power transistor group (5) are respectively disposed on the first substrate (111); and in the third direction, the first front heat dissipation body (112) corresponds to the first intermittent power transistor group (2), and the first rear heat dissipation body (113) corresponds to the second intermittent power transistor group (3) and the second normally open power transistor group (5).

5. The power module as described in claim 4, characterized in that, The first intermittent power transistor group (2) includes a first front power transistor group (22) and a first rear power transistor group (23) arranged at intervals along the first direction. The heat dissipation height of the first front heat dissipation part (1121) is smaller than the heat dissipation height of the first rear heat dissipation part (1122); In the third direction, the first front heat dissipation part (1121) corresponds to the first front power transistor group (22), and the first rear heat dissipation part (1122) corresponds to the first rear power transistor group (23).

6. The power module as described in claim 5, characterized in that, The first normally open power transistor group (4) includes a second front power transistor group (42) and a second rear power transistor group (43) arranged at intervals along the first direction. The heat dissipation height of the second front heat dissipation section (122) is smaller than the heat dissipation height of the second rear heat dissipation section (123); In the third direction, the second front power transistor group (42) corresponds to the second front heat dissipation part (122) and the first front heat dissipation part (1121), and the second rear power transistor group (43) corresponds to the second rear heat dissipation part (123) and the first rear heat dissipation part (1122).

7. The power module as described in claim 6, characterized in that, There is a first ventilation gap (13) between the first front heat dissipation part (1121) and the second front heat dissipation part (122), and the first front heat dissipation part (1121) and the second front heat dissipation part (122) are arranged symmetrically; A third ventilation gap (15) exists between the first rear heat dissipation part (1122), the second rear heat dissipation part (123) and the first rear heat dissipation body (113); an air outlet plate (71) is provided in the third ventilation gap (15), and a first air outlet (711) is provided on the air outlet plate (71).

8. The power module as described in claim 6, characterized in that, The first rear heat dissipation section (1122) and the second rear heat dissipation section (123) are symmetrically arranged, and a heat exchange plate (6) is provided between the first rear heat dissipation section (1122) and the second rear heat dissipation section (123).

9. The power module as described in claim 7, characterized in that, The first rear heat dissipation body (113) has a sealing plate (72) at the tooth bottom; the sealing plate (72) has a second air outlet (721); the second air outlet (721) is close to the air outlet side of the first rear heat dissipation body (113).

10. The power module as described in claim 2, characterized in that, The power module also includes: Fan assembly (9); In the first direction, the fan assembly (9) is located on the air inlet side of the radiator assembly (1); In the third direction, the two ends of the fan assembly (9) are respectively connected to the air inlet side of the first heat dissipation body (11) and the air inlet side of the second heat dissipation body (12) through baffles (91).

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