High-power server immersion liquid cooling device and control method

Abstract

The application relates to the technical field of server heat dissipation, in particular to a high-power server immersion liquid cooling device and a control method. The device is composed of an immersion cooling cabin body, a cold quantity distribution unit and a three-stage closed-loop control system; the inside of the immersion cooling cabin body is divided into a cold quantity distribution cabin and a server cabin through a partition; the cold quantity distribution unit is integrally configured with a circulating pump, a filter, a heat exchanger and a valve group; the three-stage closed-loop control system specifically comprises an immersion cooling pressure control loop, an immersion cooling temperature control loop and a server independent chip temperature control loop, can be controlled with high reliability and low cost, realizes stable chip temperature, reduces the fault risk caused by the temperature fluctuation of devices and prolongs the service life of chips.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to a high-power server immersion liquid cooling device and control method. Background Technology

[0002] Currently, immersion liquid cooling has broad application prospects in high-efficiency temperature control scenarios in data centers due to its outstanding advantages such as energy saving, low noise, and safe operation. However, with the development of AI computing power, chip power consumption has increased significantly, and existing traditional immersion liquid cooling solutions have exposed significant technical bottlenecks, making it difficult to adapt to the heat dissipation requirements of high-power AI chips, which has become a key pain point restricting its large-scale application. On the one hand, the fluid velocity inside the storage tank of traditional immersion liquid cooling equipment is generally below 0.1m / s, resulting in a low overall heat transfer coefficient. It can only be used to cool low-power chips of 300W and below. However, in AI computing scenarios, chip power generally exceeds 700W, with a heat flux density close to 100W / cm², far exceeding the heat dissipation capacity of traditional immersion liquid cooling. The heat transfer performance limitations caused by the low flow rate cannot meet the high-intensity heat transfer requirements of the new generation of computing centers. On the other hand, the traditional immersion liquid cooling supply architecture cannot achieve independent flow control for a single server. With the dynamic fluctuation of AI computing load, the chip temperature will fluctuate drastically. The temperature difference between full load and light load conditions can reach more than 30°C. Large temperature fluctuations will continuously cause repeated thermal expansion and contraction of electronic components and solder joints, which can easily cause hardware damage and significantly increase the probability of electronic device failure.

[0003] In summary, the technical problems existing in the relevant technologies need to be improved. Summary of the Invention

[0004] The main objective of this application is to propose a high-power server immersion liquid cooling device and control method that can achieve highly reliable and low-cost control, stabilize chip temperature, reduce the risk of failure caused by device temperature fluctuations, and extend chip life.

[0005] To achieve the above objectives, one aspect of this application provides a high-power server immersion liquid cooling device, comprising: The immersion cooling chamber includes a cooling distribution compartment and a server compartment, which are separated by a partition. An overflow channel is provided at the top of the partition. The cooling capacity distribution unit includes a circulating pump, a filter, a heat exchanger, and a valve assembly. The output of the circulating pump includes a top manifold liquid supply branch and a bottom liquid supply branch. The top manifold liquid supply branch is connected to the chip heat sink of each server via a hose. Each server has a built-in electric regulating valve. The heat exchanger is equipped with a primary side cooling water flow regulating valve. The three-level closed-loop control system includes an immersion cooling pressure control loop, an immersion cooling temperature control loop, and a server-independent chip temperature control loop. The immersion cooling pressure control loop includes a pressure sensor, a controller, and a circulating pump, and is used to maintain constant pressure in the immersion cooling chamber. The immersion cooling temperature control loop includes a first temperature sensor, an immersion cooling controller, and a cooling water regulating valve, and is used to maintain constant temperature in the immersion cooling chamber. The server-independent chip temperature control loop includes a server-built-in controller, a chip-integrated second temperature sensor, and an internal electric valve, and is used to adjust the individual coolant flow rate within each server in real time.

[0006] In some embodiments, the circulating pump, the filter, and the valve assembly of the cooling capacity distribution unit are located inside the cooling capacity distribution chamber, and the heat exchanger is located outside the immersion cooling chamber.

[0007] In some embodiments, the immersion cooling pressure control loop is provided with two sets of cooling capacity distribution units, and the method for controlling the two sets of cooling capacity distribution units includes: The controller controls the circulation pumps in the two sets of cooling capacity distribution units to make the circulation pumps in the two sets of cooling capacity distribution units rotate at the same speed. Alternatively, the two controllers can control the circulation pumps in the two sets of cooling capacity distribution units respectively, so that the circulation pumps in the two sets of cooling capacity distribution units can control their respective pipeline liquid supply pressure.

[0008] In some embodiments, the immersion cooling pressure control loop and the immersion cooling temperature control loop are controlled by the same controller; Alternatively, the immersion cooling pressure control loop and the immersion cooling temperature control loop may be controlled by two separate controllers.

[0009] In some embodiments, all control hardware and software of the server independent chip temperature control circuit are integrated inside the chassis of each server, and the sealing requirements of the electric regulating valve are reduced according to the working conditions of the insulating coolant in the server compartment.

[0010] In some embodiments, the bottom liquid supply branch is laid out in close contact with the wall of the immersion cooling chamber, and the pipeline includes a rectangular cross-section square tube structure. The bottom liquid supply branch is provided with several elongated liquid distribution holes, which are partially and selectively blocked according to the server's flow requirements.

[0011] In some embodiments, the filter of the cooling capacity distribution unit is disposed on the inlet side of the circulation pump; The cooling distribution unit dissipates heat at a high flow rate by integrating two parallel circulating pumps.

[0012] To achieve the above objectives, another aspect of the embodiments of this application proposes a high-power server immersion liquid cooling control method, which is applied to the high-power server immersion liquid cooling device. The method includes constant pressure liquid supply regulation, constant temperature liquid supply regulation, and independent flow regulation. The constant pressure fluid supply regulation includes the following steps: The pressure sensor is used to obtain the real-time liquid supply pressure of the pipeline in the immersion cooling chamber, and the pressure feedback value is obtained. The pressure feedback value is compared with the target value of the liquid supply pressure input by the user. When the pressure feedback value is less than the target value of the liquid supply pressure, the controller adjusts the cooling capacity distribution unit to increase the speed of the circulating pump. When the pressure feedback value is greater than the target value of the liquid supply pressure, the controller adjusts the cooling capacity distribution unit to reduce the speed of the circulating pump. When the pressure feedback value is equal to the target value of the liquid supply pressure, a stable liquid supply pressure for the chamber is obtained; The constant temperature liquid supply control includes the following steps: The two real-time liquid supply temperatures of the immersion cooling chamber are obtained by the first temperature sensor, and the average temperature feedback value is obtained by averaging the two real-time liquid supply temperatures. The average temperature feedback value is compared with the target value of the liquid supply temperature input by the user. When the temperature feedback value is less than the target value of the liquid supply temperature, the immersion cooling controller adjusts the opening of the primary cooling water flow regulating valve of the heat exchanger to reduce the flow rate of the cooling water. When the temperature feedback value is greater than the target value of the liquid supply temperature, the immersion cooling controller adjusts the opening of the primary cooling water flow regulating valve of the heat exchanger. When the temperature feedback value is equal to the target value of the supply temperature, a stable constant temperature coolant is obtained; The independent flow control includes the following steps: The target temperature value of the chip is set by the server's built-in controller, and the real-time operating temperature of the chip is obtained by the second temperature sensor built into the chip. The real-time temperature of the chip is compared with the target temperature value of the chip by difference; When the real-time temperature of the chip is lower than the target temperature value of the chip, the opening of the built-in electric regulating valve of the server is reduced by the built-in controller of the server. When the real-time temperature of the chip is greater than the target temperature value of the chip, the opening degree of the built-in electric regulating valve of the server is increased through the built-in controller of the server. When the real-time temperature of the chip equals the target temperature value of the chip, the single-channel coolant supply flow rate required by the real-time load of the chip is obtained.

[0013] In some embodiments, the two real-time liquid supply temperatures in the constant temperature liquid supply control are the values ​​obtained by the first temperature sensors at two locations on the liquid supply pipeline; The target value for the liquid supply temperature is stored in the immersion cooling controller.

[0014] In some embodiments, the independent flow control obtains the real-time operating temperature of the chip after the server is powered on, and controls the opening of the electric valve according to a preset chip temperature target value. Each server independently adjusts the opening of the electric regulating valve, and the flow regulation process of a single server does not affect the coolant supply flow of other servers.

[0015] The embodiments of this application include at least the following beneficial effects: This application provides a high-power server immersion liquid cooling device and control method. In this scheme, the immersion cooling chamber is separated from the server chamber by a partition and an upper overflow channel is set. The flow cross-sectional area is large and the return flow is smooth, which can meet the high flow cooling requirements of high-power chips. The structure is compact and easy to operate and maintain. The cooling distribution unit is set with a top manifold-type liquid supply branch dedicated to the chip heat sink and a bottom liquid supply branch to cool low-power devices in a layered liquid supply mode, realizing precise heat dissipation of hot and cold zones and matching the heat dissipation load of high-power chips. The supporting three-level closed-loop control system realizes precise temperature control throughout the entire range. The immersion cooling pressure control loop ensures that the liquid supply pressure of the chamber is constant, providing a basis for high-flow and stable heat exchange; the immersion cooling temperature control loop maintains a constant temperature output of coolant and avoids interference from liquid supply temperature fluctuations; the server independent chip temperature control loop can independently and dynamically adjust the flow of a single server and a single chip, which is not affected by the load of the whole system and other equipment, effectively suppressing the temperature deviation caused by chip load fluctuations, significantly reducing the range of chip operating temperature fluctuations, and avoiding damage to devices and solder joints due to repeated thermal expansion and contraction. The overall system takes into account high power heat dissipation capacity, operational stability and energy saving effect, and is suitable for the high-efficiency and reliable immersion liquid cooling temperature control requirements of high-power chip computing centers. Attached Figure Description

[0016] Figure 1 This is a flowchart of the liquid supply path for a high-power server immersion liquid cooling device with dual cooling capacity distribution units; Figure 2This is a schematic diagram of the immersion cooling chamber of a high-power server immersion liquid cooling device. Figure 3 This is a schematic diagram of the constant pressure liquid supply regulation process; Figure 4 This is a flowchart illustrating the comparison of pressure values ​​for constant pressure fluid supply regulation. Figure 5 This is a schematic diagram of the constant temperature liquid supply control process; Figure 6 This is a flowchart illustrating the comparison of temperature values ​​for constant temperature liquid supply regulation. Figure 7 This is a flowchart illustrating the process of independent flow control; Figure 8 This is a flowchart illustrating the comparison of temperature values ​​under independent flow control. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit it. In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with those of this application; they are merely examples of apparatuses and methods consistent with some aspects of the embodiments of this application as detailed in the appended claims.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0019] The high-power server immersion liquid cooling device is mainly composed of an immersion cooling cabin, a cold energy distribution unit and a three-stage closed-loop control system; the interior of the immersion cooling cabin is divided by a partition plate into a cold energy distribution compartment and a server compartment, and the upper part of the partition plate is provided with an overflow channel for the flow of cooling liquid, so as to realize the circulating overflow of the cooling liquid inside the cabin; the cold energy distribution unit is integrally equipped with a circulating pump, a filter, a heat exchanger and a valve group, the output end of the circulating pump is separately provided with a top manifold-type liquid supply branch and a bottom liquid supply branch, the top manifold-type liquid supply branch is connected to the chip heat sink of each server through a hose to achieve targeted chip heat dissipation, each server is internally provided with an electric regulating valve for independent flow regulation, and the heat exchanger is correspondingly provided with a primary-side cooling water flow regulating valve capable of regulating the cooling water amount; the three-stage closed-loop control system specifically includes an immersion cooling pressure control loop, an immersion cooling temperature control loop and a server independent chip temperature control loop, which can realize layered independent closed-loop control of cabin pressure, cabin temperature and server chip flow, wherein the immersion cooling pressure control loop relies on the cooperation of a pressure sensor, a controller and the circulating pump to complete constant pressure regulation of the immersion cooling cabin, the immersion cooling temperature control loop relies on the cooperation of a first temperature sensor, an immersion cooling controller and the cooling water regulating valve to achieve constant temperature regulation of the immersion cooling cabin, and the server independent chip temperature control loop relies on a server built-in controller, a second temperature sensor arranged on the chip and an electric valve in the case to independently complete real-time and precise regulation of the single-path cooling liquid flow inside each server, so as to adapt to the dynamic heat dissipation demand of high-power servers.

[0020] As shown in Figure 1 and Figure 2 , Figure 1 two sets of cold energy distribution units matching the immersion cooling cabin are correspondingly included. A single set of cold energy distribution unit 110 is internally provided with a heat exchanger 111, a filter 112, a circulating pump 113, and a valve group composed of a check valve 114 and a manual valve 115 in sequence. The heat exchanger is externally connected with a primary-side cooling water flow regulating valve 116 for regulating the heat exchange cold energy. The output of the circulating pump is converged to the main liquid supply pipeline, on which a pressure sensor (P1, P2) and a first temperature sensor (T1, T2) are respectively arranged to collect cooling liquid pressure and temperature signals respectively. The output of the circulating pump is divided into two paths to form a top manifold-type liquid supply branch 121 and a bottom liquid supply branch 123; the top manifold-type liquid supply branch is connected downwards to each server, an electric regulating valve 122 is installed in the case of each server, and the branch is connected to the server chip heat sink through a hose to separately deliver cooling liquid for high-power chips; the bottom liquid supply branch is horizontally arranged at the bottom layer of the loop to supply liquid for other low-power components of the server. The cooling liquid heated after heat exchange of the server flows back to the cold energy distribution unit, and is re-cooled and pressurized through the filter and the heat exchanger to form a complete closed-loop cycle. The dual cold energy distribution units can supply liquid in coordination to match the high-flow heat dissipation demand of multiple high-power servers, and the entire fluid pipeline structure supports the three-stage closed-loop control system to complete independent regulation of constant cabin pressure, constant cabin temperature and single-path flow of the server.

[0021] Figure 2 This is a structural diagram of the immersion cooling chamber. The chamber is divided into two cooling distribution chambers on either side and a central server chamber by a partition 290. An overflow channel is provided at the top of the partition, allowing coolant in the server chamber to flow back to the cooling distribution chambers. The large flow cross-section is suitable for high-flow cooling conditions. The cooling distribution chamber integrates all the core components of the cooling distribution unit, including a circulating pump 210, a filter 230, a check valve 240, and a manual valve 250. The heat exchanger 220 is independently located outside the immersion cooling chamber, isolating it from the risk of primary-side water leakage. The circulating pump output connects to a top manifold-type liquid supply branch 260, which extends into multiple server liquid supply hoses 270, each connecting to the heat sink of a server chip. A bottom liquid supply branch 280 is located at the bottom of the chamber. This branch uses a rectangular tube structure that conforms to the chamber wall, with elongated, selectively sealable dispensing holes to accommodate the heat dissipation needs of devices with different power consumption. The cooling distribution unit's pump body, filter components, and valves are all integrated inside the cabin, with only the heat exchanger externally mounted. The compact structure saves server room space, and the insulating coolant environment inside the cabin lowers the valve sealing standards, so minor leaks will not affect server operation.

[0022] In some embodiments, the high-power server immersion liquid cooling device mainly consists of an immersion cooling chamber, a cooling capacity distribution unit, and a three-level closed-loop control system, with the entire structure adopting an integrated chamber design. The immersion cooling chamber is divided into an independent yet interconnected cooling capacity distribution chamber and a server chamber by a partition. An overflow channel is reserved at the top of the partition to achieve natural flow of coolant across a large cross-section. Compared with traditional pipeline transport structures, this significantly increases the cross-sectional area of ​​coolant flow, perfectly adapting to the high-flow cooling conditions required for high-power AI server heat dissipation and ensuring the stability of fluid supply during the heat exchange process of high-power chips.

[0023] The cooling capacity distribution unit of the high-power server immersion liquid cooling system adopts a differentiated integrated layout structure, integrating the circulating pump, filter, and valve assembly including check valves and manual valves into the cooling capacity distribution compartment. Only the heat exchanger is independently arranged on the outside of the immersion cooling compartment. This structure integrates the cooling capacity distribution unit with the immersion cooling compartment, eliminating the traditional arrangement of independent external cooling equipment and external piping, effectively reducing the space occupied in the server room and making the equipment structure more compact. At the same time, the cooling capacity distribution compartment is in an insulating coolant immersion environment, with low requirements for the sealing of the interface of the internal components, allowing for slight coolant leakage. Simple piping connection methods can be used, eliminating the need for a large number of soft sealing gaskets, completely eliminating the problem of sealing material aging and failure, and significantly improving the convenience of equipment maintenance and long-term operational stability. In addition, the filter is fixed on the inlet side of the circulating pump, which can continuously filter the coolant entering the pump body and protect the core pump components. The high-power server immersion liquid cooling system can also adopt a configuration of integrating two parallel circulating pumps into a single cooling capacity distribution unit, effectively increasing the coolant delivery flow rate and meeting the heat dissipation requirements of ultra-high power servers. The external heat exchanger can completely isolate the primary cooling water circuit, effectively shielding the risk of primary side leakage caused by pipe welding defects and long-term corrosion, and completely avoiding equipment short circuit failures caused by cooling water leakage into the server compartment, thus greatly improving the safety of system operation.

[0024] The high-power server immersion liquid cooling system employs a dual-layer liquid supply structure combining a top manifold supply branch and a bottom supply branch to achieve differentiated and precise heat dissipation for the server. The top manifold supply branch connects one-to-one with the heat sinks of each server chip via flexible hoses, specifically delivering coolant continuously to high-power AI chips. Compared to the low flow rate of less than 0.1 m / s inside the server in traditional immersion liquid cooling systems, this structure can create a high local flow rate in the chip heat sink area, significantly improving chip heat exchange efficiency based on the principle of forced convection heat transfer, thus solving the heat dissipation bottleneck of high-power chips. The bottom supply branch is dedicated to cooling low-power electronic components other than chips within the server, achieving full-area heat dissipation coverage for the entire machine. Meanwhile, the bottom liquid supply branch adopts a rectangular cross-section square tube structure that fits the wall of the immersion cooling chamber. Compared with the traditional round tube, it can maximize the saving of internal space of the immersion cooling chamber and further optimize the compactness of the immersion cooling chamber structure. Several elongated liquid distribution holes are opened at the bottom of the bottom liquid supply branch. This not only makes the processing simple and facilitates mass production, but also allows for selective blocking of some liquid distribution holes according to the actual flow requirements of different IT equipment. It can adapt to equipment of different power without changing the overall specifications of the pipeline, significantly improving versatility and equipment economy.

[0025] The high-power server immersion liquid cooling system features a three-level closed-loop control system with flexible dual-mode adjustment capabilities, adaptable to various engineering deployment needs. The immersion cooling pressure control loop is equipped with two sets of cooling capacity distribution units, supporting two control modes. One mode allows for synchronous control of the circulating pumps in both cooling capacity distribution units at the same speed via a single controller, achieving unified and stable liquid supply with simple control logic, few required sensors, and convenient engineering implementation. The other mode allows for independent control via dual controllers, adjusting the speed of the corresponding circulating pumps separately to achieve independent and precise control of the liquid supply pressure in both pipelines. Furthermore, the immersion cooling pressure control loop and the immersion cooling temperature control loop support both integrated and separate control configurations. They can share a single controller for coordinated temperature and pressure control, or be configured with two independent controllers for decoupled temperature and pressure parameter control, adapting to various complex computing power conditions.

[0026] The server's independent chip temperature control loop adopts a fully integrated decoupled design, with all control hardware and software integrated inside the server chassis. Utilizing the operating conditions of the insulating coolant within the chassis, it effectively reduces the sealing accuracy and durability requirements of the server's built-in electric regulating valve. Compared to traditional cold-plate liquid cooling systems, which use conductive water refrigerant, have high valve sealing requirements, and suffer from poor economic efficiency and feasibility in dynamic flow regulation, high-power server immersion liquid cooling systems significantly reduce equipment manufacturing and maintenance costs. Simultaneously, each server can collect temperature data in real time through its own chip's built-in temperature sensor, independently adjusting the opening of the electric regulating valve using the server's built-in controller. This allows for individual matching of the real-time heat dissipation flow of a single server chip without interference, completely resolving the problem of significant chip temperature fluctuations with load in traditional liquid cooling systems and ensuring long-term stable operation of high-power chips.

[0027] To achieve the above objectives, another aspect of this application proposes a high-power server immersion liquid cooling control method. The entire system achieves precise, stable, and adaptive heat dissipation control of the high-power server immersion liquid cooling device by sequentially executing three-level closed-loop control logic: constant pressure liquid supply regulation, constant temperature liquid supply regulation, and independent flow regulation. During the constant pressure liquid supply regulation process, the liquid supply pressure of the immersion cooling chamber pipeline is first collected in real time by a pressure sensor to obtain a pressure feedback value. This pressure feedback value is compared with the user-preset target liquid supply pressure value. When the pressure feedback value is lower than the target pressure, the controller controls the cooling capacity distribution unit to increase the speed of the circulating pump to increase the liquid supply pressure. When the pressure feedback value is higher than the target pressure, the controller controls the cooling capacity distribution unit to decrease the speed of the circulating pump to decrease the liquid supply pressure. When the pressure feedback value matches the target liquid supply pressure value, the system forms and maintains a stable chamber liquid supply pressure, providing constant and reliable fluid transport power for the entire liquid cooling system.

[0028] During the constant temperature liquid supply control process, the real-time liquid supply temperature of the two pipelines of the immersion cooling chamber is collected by the first temperature sensor. The average value of the two temperature data is calculated to obtain the average temperature feedback value. The average temperature feedback value is compared with the user-preset target value of the liquid supply temperature. When the average temperature feedback value is lower than the target value of the liquid supply temperature, the immersion cooling controller adjusts the heat exchanger to reduce the opening of the primary side cooling water flow regulating valve, thereby reducing the heat exchange cooling intensity of the system. When the average temperature feedback value is higher than the target value of the liquid supply temperature, the immersion cooling controller increases the opening of the primary side cooling water flow regulating valve, thereby increasing the cooling capacity of the heat exchanger. Finally, when the average temperature feedback value is consistent with the target temperature, a coolant with a constant temperature is output, ensuring a stable and consistent liquid supply temperature in the chamber.

[0029] During independent flow control, the target chip temperature is preset at the factory before the server is powered on. The chip's operating temperature is collected in real time by the chip's built-in second temperature sensor. The real-time chip temperature is compared with the preset target chip temperature value. When the real-time chip temperature is too low, the server's built-in controller reduces the opening of the electric valve in the chassis, reducing the single-channel coolant supply flow. When the real-time chip temperature is too high, the server's built-in controller increases the opening of the electric valve, increasing the coolant supply flow to the chip's heat sink. When the real-time chip temperature stably matches the target temperature, a precise single-channel coolant supply flow is output to adapt to the chip's real-time load conditions. Finally, through a three-level coordinated control method of constant pressure in the chamber, constant temperature in the chamber, and dynamic adjustment of the independent flow of a single chip, the high-power server AI chip achieves a high-precision, low-fluctuation immersion liquid cooling temperature control effect under all operating conditions.

[0030] In some embodiments, such as Figure 3 and Figure 4 As shown, the closed-loop control logic and complete execution process of constant pressure liquid supply regulation are fully demonstrated. After the control system completes power-on initialization, the operator pre-inputs the target value of the liquid supply pressure and stores it in the immersion cooling controller. Then, the entire liquid cooling system is started and put into operation. During operation, it will be continuously affected by various disturbances such as changes in load resistance and the addition or shutdown of server loads. The liquid supply pressure in the pipeline will fluctuate in real time. The pressure sensors arranged in the liquid supply pipeline will continuously collect the real-time pressure values ​​of the two pipelines. , The system generates a pressure feedback value and sends it back to the immersion cooling controller, which automatically calculates the average value of the two pressure readings. + The average pressure feedback value is calculated and compared with the preset liquid supply pressure target value. This difference is used as the basis for determining the speed of the circulating pump.

[0031] When the average pressure of the two lines is less than the target value of the liquid supply pressure, the immersion cooling controller sends an acceleration command to the circulation pump of the cooling capacity distribution unit to increase the coolant delivery flow rate by increasing the pump speed and raising the liquid supply pressure of the pipeline. When the average pressure of the two lines is greater than the target value of the liquid supply pressure, the controller sends a deceleration command to reduce the circulation pump speed to reduce the coolant output and lower the liquid supply pressure of the pipeline. The closed-loop regulation action of collecting, comparing, and adjusting speed is continuously completed until the average pressure is consistent with the target value of the liquid supply pressure, and finally a stable and constant liquid supply pressure is obtained in the chamber. This provides stable fluid delivery power for the top and bottom dual liquid supply branches, ensuring that the heat sink area of ​​the high-power server chip continues to maintain a high flow rate heat exchange condition.

[0032] In some embodiments, such as Figure 5 and Figure 6 As shown, after the control system is powered on, the user presets the target value of the coolant supply temperature and stores it in the immersion cooling controller. After the parameter configuration is completed, the system starts running. During operation, it will be continuously affected by disturbances such as changes in server load heat power and the addition or shutdown of computing power loads by human intervention, causing the coolant temperature to deviate accordingly. The first temperature sensor arranged in the coolant supply pipeline collects the coolant supply temperature of the two pipelines in real time. , The system generates a temperature feedback value and sends it back to the immersion cooling controller. The immersion cooling controller calculates the average value of the two temperature values ​​to obtain the average temperature feedback value. It then compares this average value with the preset target value of the liquid supply temperature to determine the opening of the primary cooling water flow regulating valve.

[0033] When the average feedback value obtained from the two temperature calculations is less than the target value of the supply liquid temperature, the immersion cooling controller outputs a control command to reduce the opening of the primary side cooling water flow regulating valve, thereby reducing the flow rate of the primary side cooling water inside the heat exchanger, weakening the heat exchange and cooling capacity, and raising the coolant temperature. When the average feedback value from the two temperature calculations is greater than the target value of the supply liquid temperature, the immersion cooling controller outputs a command to increase the opening of the primary side cooling water flow regulating valve, increasing the cooling water volume of the heat exchanger, strengthening the output of heat exchange cooling capacity, and lowering the coolant temperature. The closed-loop operation of temperature acquisition, average value calculation, and opening adjustment is executed cyclically until the average temperature feedback value is consistent with the target value of the supply liquid temperature. Finally, a coolant with a constant temperature is output and delivered to the top and bottom supply branches to provide a stable cooling medium for the server.

[0034] In some embodiments, such as Figure 7 and Figure 8As shown, before the server is powered on, the target chip temperature value is preset at the factory to complete the initialization of control parameters. During the operation of the server, it will be continuously affected by disturbances such as changes in chip load, fluctuations in liquid supply temperature in the chamber, and fluctuations in liquid supply pressure in the chamber. The real-time chip temperature will deviate. The second temperature sensor built into the chip continuously collects the real-time operating temperature of the chip and sends the real-time chip temperature as a feedback signal back to the built-in controller of the server. The built-in controller of the server compares the difference between the collected real-time chip temperature and the preset target chip temperature value, and uses this as the basis for adjusting the opening of the built-in electric regulating valve of the server. The entire control loop is integrated into the server chassis and operates independently.

[0035] When the chip's real-time temperature is lower than the target temperature value, the server's built-in controller issues a control command to reduce the opening of the server's built-in electric regulating valve, thereby reducing the single-channel supply flow of coolant to the chip's heat sink and decreasing the cooling capacity. When the chip's real-time temperature is higher than the target temperature value, the server's built-in controller issues a control command to increase the opening of the server's built-in electric regulating valve, thereby increasing the coolant supply flow to the chip's heat sink and enhancing the chip's heat dissipation capacity. The system continuously cycles through closed-loop operations of chip temperature acquisition, temperature difference comparison, and regulating valve opening adjustment until the chip's real-time temperature matches the target temperature value. Finally, it outputs a precise single-channel coolant supply flow rate that matches the chip's real-time load requirements, stabilizing the chip's operating temperature and eliminating significant temperature fluctuations caused by various disturbances.

[0036] In some embodiments, the three-level closed-loop control system achieves constant pressure liquid supply regulation through an immersion cooling pressure control loop, constant temperature liquid supply regulation through an immersion cooling temperature control loop, and independent flow regulation through a server-independent chip temperature control loop. The server-independent chip temperature control loop forms an independent closed loop based on the server's built-in controller, the chip's built-in second temperature sensor, and the electric valve within the chassis. Regulation is achieved using the server chassis's built-in computing hardware and software, requiring no external control equipment. The entire control loop hardware and software are integrated within a single server chassis, resulting in a high degree of decoupling and facilitating large-scale deployment in engineering scenarios. Simultaneously, the electric regulating valve within the chassis is located inside the immersion cooling chamber, where insulating coolant flows. Even if the valve experiences minor issues... Leakage will not interfere with the overall cooling operation, significantly reducing the design requirements for the sealing accuracy and durability of the electric regulating valve. Compared with the traditional cold plate liquid cooling solution that uses conductive water source refrigerant, there is no need to configure a high-level sealing structure for the regulating valve. The feasibility of engineering implementation and the overall economic efficiency of the equipment are significantly improved. Combined with constant pressure liquid supply control to provide a stable fluid delivery pressure and constant temperature liquid supply control to provide a consistent output temperature of the coolant, the independent flow control can adaptively match the single-channel coolant supply flow according to the real-time load of the chip, completely eliminating the large temperature fluctuations of the chip caused by load fluctuations and supply temperature and pressure disturbances, maintaining a constant chip operating temperature throughout, and adjusting the flow as needed to achieve the optimal energy-saving effect of the system.

[0037] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0038] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0039] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0040] Those skilled in the art will understand that all or some of the steps in the methods disclosed above, as well as the functional modules / units in the systems and devices, can be implemented as software, firmware, hardware, or suitable combinations thereof.

[0041] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0042] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0043] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0044] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0045] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0046] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A high-power server immersion liquid cooling device, characterized in that, include: The immersion cooling chamber includes a cooling distribution compartment and a server compartment, which are separated by a partition. An overflow channel is provided at the top of the partition. The cooling capacity distribution unit includes a circulating pump, a filter, a heat exchanger, and a valve assembly. The output of the circulating pump includes a top manifold liquid supply branch and a bottom liquid supply branch. The top manifold liquid supply branch is connected to the chip heat sink of each server via a hose. Each server has a built-in electric regulating valve. The heat exchanger is equipped with a primary side cooling water flow regulating valve. The three-level closed-loop control system includes an immersion cooling pressure control loop, an immersion cooling temperature control loop, and a server-independent chip temperature control loop. The immersion cooling pressure control loop includes a pressure sensor, a controller, and a circulating pump, and is used to maintain constant pressure in the immersion cooling chamber. The immersion cooling temperature control loop includes a first temperature sensor, an immersion cooling controller, and a cooling water regulating valve, and is used to maintain constant temperature in the immersion cooling chamber. The server-independent chip temperature control loop includes a server-built-in controller, a chip-integrated second temperature sensor, and an internal electric valve, and is used to adjust the individual coolant flow rate within each server in real time.

2. The high-power server immersion liquid cooling device according to claim 1, characterized in that, The circulating pump, the filter, and the valve group of the cooling capacity distribution unit are located inside the cooling capacity distribution chamber, while the heat exchanger is located outside the immersion cooling chamber.

3. The high-power server immersion liquid cooling device according to claim 1, characterized in that, The immersion cooling pressure control loop is equipped with two sets of cooling capacity distribution units, and the method for controlling the two sets of cooling capacity distribution units includes: The controller controls the circulation pumps in the two sets of cooling capacity distribution units to make the circulation pumps in the two sets of cooling capacity distribution units rotate at the same speed. Alternatively, the two controllers can control the circulation pumps in the two sets of cooling capacity distribution units respectively, so that the circulation pumps in the two sets of cooling capacity distribution units can control their respective pipeline liquid supply pressure.

4. The high-power server immersion liquid cooling device according to claim 1, characterized in that, The immersion cooling pressure control loop and the immersion cooling temperature control loop are controlled by the same controller; Alternatively, the immersion cooling pressure control loop and the immersion cooling temperature control loop may be controlled by two separate controllers.

5. The high-power server immersion liquid cooling device according to claim 1, characterized in that, All control hardware and software of the independent chip temperature control circuit of the server are integrated inside the chassis of each server, and the sealing requirements of the electric regulating valve are reduced according to the working conditions of the insulating coolant in the server compartment.

6. The high-power server immersion liquid cooling device according to claim 1, characterized in that, The bottom liquid supply branch is laid out in close contact with the wall of the immersion cooling chamber, and the pipeline includes a rectangular cross-section square tube structure. The bottom liquid supply branch is provided with several elongated liquid distribution holes, which are partially and selectively blocked according to the server's flow requirements.

7. The high-power server immersion liquid cooling device according to claim 1, characterized in that, The filter of the cooling capacity distribution unit is located on the inlet side of the circulating pump; The cooling distribution unit dissipates heat at a high flow rate by integrating two parallel circulating pumps.

8. A method for controlling immersion liquid cooling of a high-power server, characterized in that, The high-power server immersion liquid cooling control method is applied to the high-power server immersion liquid cooling device according to any one of claims 1-7, and the method includes constant pressure liquid supply regulation, constant temperature liquid supply regulation and independent flow regulation. The constant pressure fluid supply regulation includes the following steps: The pressure sensor is used to obtain the real-time liquid supply pressure of the pipeline in the immersion cooling chamber, and the pressure feedback value is obtained. The pressure feedback value is compared with the target value of the liquid supply pressure input by the user. When the pressure feedback value is less than the target value of the liquid supply pressure, the controller adjusts the cooling capacity distribution unit to increase the speed of the circulating pump. When the pressure feedback value is greater than the target value of the liquid supply pressure, the controller adjusts the cooling capacity distribution unit to reduce the speed of the circulating pump. When the pressure feedback value is equal to the target value of the liquid supply pressure, a stable liquid supply pressure for the chamber is obtained; The constant temperature liquid supply control includes the following steps: The two real-time liquid supply temperatures of the immersion cooling chamber are obtained by the first temperature sensor, and the average temperature feedback value is obtained by averaging the two real-time liquid supply temperatures. The average temperature feedback value is compared with the target value of the liquid supply temperature input by the user. When the temperature feedback value is less than the target value of the liquid supply temperature, the immersion cooling controller adjusts the opening of the primary cooling water flow regulating valve of the heat exchanger to reduce the flow rate of the cooling water. When the temperature feedback value is greater than the target value of the liquid supply temperature, the immersion cooling controller adjusts the opening of the primary cooling water flow regulating valve of the heat exchanger. When the temperature feedback value is equal to the target value of the supply temperature, a stable constant temperature coolant is obtained; The independent flow control includes the following steps: The target temperature value of the chip is set by the server's built-in controller, and the real-time operating temperature of the chip is obtained by the second temperature sensor built into the chip. The real-time temperature of the chip is compared with the target temperature value of the chip by difference; When the real-time temperature of the chip is lower than the target temperature value of the chip, the opening of the built-in electric regulating valve of the server is reduced by the built-in controller of the server. When the real-time temperature of the chip is greater than the target temperature value of the chip, the opening degree of the built-in electric regulating valve of the server is increased through the built-in controller of the server. When the real-time temperature of the chip equals the target temperature value of the chip, the single-channel coolant supply flow rate required by the real-time load of the chip is obtained.

9. The method according to claim 8, characterized in that, In the constant temperature liquid supply control, the two real-time liquid supply temperatures are the values ​​obtained by the first temperature sensors at two locations on the liquid supply pipeline. The target value for the liquid supply temperature is stored in the immersion cooling controller.

10. The method according to claim 8, characterized in that, The independent flow control obtains the real-time operating temperature of the chip after the server is powered on, and controls the opening of the electric valve according to the preset chip temperature target value. Each server independently adjusts the opening of the electric regulating valve, and the flow regulation process of a single server does not affect the coolant supply flow of other servers.

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