Aluminum profile heat sink for high-power power supply equipment

Abstract

The application discloses a kind of aluminium profile radiators for high-power power supply equipment, belongs to aluminium profile radiator technical field, including substrate, fin, mounting mechanism, rotating mechanism and hollow air cooling mechanism, mounting mechanism is located on substrate, fin is located on mounting mechanism.The aluminium profile radiator for high-power power supply equipment, through the use of mounting mechanism, realize the independent detachable connection of fin and substrate, when local fin is damaged due to dust, corrosion or ablation, without replacing the entire substrate, only need to pull out the corresponding slide can complete single replacement, greatly reduce maintenance cost and downtime, at the same time, according to the heat dissipation requirement, different height, thickness of fin can be flexibly configured on the same substrate, high fin is arranged in upstream airflow to strengthen air inlet heat exchange, low fin is arranged in downstream airflow to reduce the flow resistance at the end of air duct, so as to realize the on-demand distribution of air volume, make cold air preferentially serve core heat source, significantly improve the overall heat dissipation efficiency.

Description

Technical Field

[0001] This invention belongs to the technical field of aluminum profile heat sinks, specifically an aluminum profile heat sink for high-power power supply equipment. Background Technology

[0002] Aluminum profile radiators, also known as aluminum radiator profiles or sunflower aluminum profiles, are characterized by their beautiful appearance, light weight, good heat dissipation performance, and energy-saving effect. Finished aluminum profile radiators undergo anodizing to enhance the aluminum's corrosion resistance, wear resistance, and aesthetic appeal. Commonly used types of aluminum profile radiators include those for electronics, electrical appliances, and computers; sunflower aluminum profile radiators; and radiator profiles for power semiconductors. Due to their superior performance, aluminum profile radiators are widely used in industries such as machinery, automobiles, wind power generation, construction machinery, air compressors, railway locomotives, and household appliances.

[0003] When high-power power supply equipment is working, its internal power switching devices generate extremely high heat flux density, typically reaching tens or even hundreds of watts per square centimeter. If the heat cannot be dissipated in time, the junction temperature of the device will rise rapidly, directly leading to decreased efficiency, reduced reliability, or even burnout failure. Therefore, as the core component of the power thermal management system, the performance of the heat sink directly determines the power density and service life of the entire machine.

[0004] Currently, the mainstream heat dissipation solution for high-power power supplies in the industry is still mainly aluminum profile extruded fin heat sinks. Its typical structure includes a thermally conductive substrate and several integrally extruded longitudinal fins. This type of heat sink conducts heat to the fins by attaching the bottom surface of the substrate to the power device, and then removes the heat with forced air cooling. After long-term application practice, the existing technology has revealed the following shortcomings: 1. In traditional radiators, the base plate and fins are integrally extruded or welded together. Once the fins become clogged with dust, mechanically damaged, or locally burned, the entire radiator unit is scrapped and needs to be replaced. In addition, the height and thickness of the fins are fixed after extrusion molding, making it impossible to make differentiated configurations according to the different heat load requirements of the upstream and downstream of the actual airflow, and the overall heat dissipation efficiency is difficult to optimize.

[0005] 2. Most existing heat sinks are rigid straight plate structures. When multiple heat sinks are placed side by side, they can only be arranged in parallel. They cannot be bent or cornered according to the location of the components or the outline of the chassis, resulting in low space utilization and insufficient heat dissipation for some components far away from the air source.

[0006] 3. Traditional heat sinks rely solely on the outer surface of the fins for convective heat exchange with the air. The substrate itself only acts as a heat conduction medium and does not participate in active heat dissipation. When multiple high-power devices are mounted side by side on the same substrate, heat will be conducted to each other along the plane of the substrate, forming thermal crosstalk. This causes devices downstream of the airflow to be affected by both the preheated air of the upstream devices and the heat conducted by the substrate, resulting in a significantly higher temperature rise than the upstream devices. This severely restricts the further improvement of the overall power. Summary of the Invention

[0007] The purpose of this invention is to achieve independent and detachable connection between the fins and the substrate through the use of an installation mechanism. When a local fin is damaged due to dust accumulation, corrosion, or burning, it is not necessary to replace the entire substrate; only the corresponding slide bar needs to be pulled out to complete the single-piece replacement, significantly reducing maintenance costs and downtime. Simultaneously, fins of different heights and thicknesses can be flexibly configured on the same substrate according to heat dissipation requirements. High fins are arranged upstream to enhance heat exchange at the air inlet, while low fins are arranged downstream to reduce flow resistance at the end of the air duct, thereby achieving on-demand airflow distribution. This prioritizes cool air for the core heat source, significantly improving overall heat dissipation efficiency. Furthermore, the arc-shaped transition strip changes the traditional right-angle root connection method, absorbing the displacement difference caused by the thermal expansion of the fins through elastic bending deformation, effectively dispersing stress, preventing root cracking, and extending the fatigue life of the radiator. Through the use of a rotating mechanism, a rotating shaft is set on one side of the substrate, and a docking groove is opened on the other side, with a limiting ring in the docking groove, enabling modular and rapid splicing of multiple radiator units. The assembled unit can flexibly adapt to the internal space of the power supply equipment, improving the radiator's adaptability to compact and irregularly shaped chassis. At the same time, the limiting ring provides precise axial stop to prevent excessive insertion or accidental dislodgement, ensuring the structural stability and positional accuracy after splicing. Meanwhile, the adjacent substrates form a bending groove through the cooperation of the rotating shaft and the mating groove, which can change the bending angle as needed. The gap between the two allows airflow, increasing the scouring effect on the sidewall of the substrate and further improving the heat dissipation capacity. Through the use of the hollow air-cooling mechanism, a three-dimensional heat dissipation path with axial flow is realized, upgrading the traditional single mode of heat dissipation relying only on the surface of the fins to a dual-channel heat dissipation of the surface and the interior. The cooling airflow directly enters the interior of the substrate and removes the heat accumulation in the planar direction, reducing the overall temperature rise of the substrate. At the same time, the spiral turbulence groove generates strong turbulence by breaking the laminar flow boundary layer of the fluid, improving the convective heat transfer coefficient of the inner wall of the channel, allowing the limited internal space to exert a heat transfer capacity far exceeding that of the light tube channel. Furthermore, the hollow channel forms a physical thermal barrier inside the substrate, effectively suppressing the crosstalk of heat conducted between multiple power devices through the substrate, making each heat source tend to work independently, avoiding the spread of local overheating to adjacent areas, and significantly enhancing the overall thermal management reliability.

[0008] The technical solution adopted in this invention is as follows: An aluminum profile heat sink for high-power power supply equipment includes a base plate, fins, a mounting mechanism, a rotating mechanism, and a hollow air-cooling mechanism. The mounting mechanism is disposed on the base plate, the fins are disposed on the mounting mechanism, the rotating mechanism is disposed on the base plate, and the hollow air-cooling mechanism is disposed on the rotating mechanism. The installation mechanism includes a limiting component, a replacement component, and an arc-shaped transition strip. The replacement mechanism is disposed on the base plate, the limiting component is disposed on the replacement component, and the limiting component is connected to the base plate. There are two arc-shaped transition strips, which are respectively fixedly connected to the bottom sides of the fin, and both arc-shaped transition strips are connected to the replacement component. The rotating mechanism includes a rotating shaft and a mating groove. The rotating shaft is fixedly connected to one side of the outer surface of the substrate, and the mating groove is opened on the other side of the outer surface of the substrate. The hollow air-cooling mechanism includes a hollow channel and a baffle component. The hollow channel is opened inside the rotating shaft, and the baffle component is located inside the hollow channel.

[0009] The replacement component includes a mounting groove and a mounting slide bar. The mounting groove is opened on the top of the substrate, the mounting slide bar is movably inserted into the mounting groove, the fin is fixedly connected to the top of the mounting slide bar, and the arc-shaped transition strip is fixedly connected to the mounting slide bar.

[0010] The limiting component includes a connecting assembly and a fixing plate. The fixing plate is installed at one end of the base plate, and the connecting assembly is located on the mounting slide and connected to the fixing plate.

[0011] The connecting component includes a positioning stud and a positioning screw groove. The positioning stud is fixedly connected to one end of the mounting slide bar, and the positioning screw groove is formed on one side of the outer surface of the fixing plate. The positioning stud is threaded into the positioning screw groove.

[0012] The turbulence-disrupting component is a spiral turbulence-disrupting groove, which is formed inside a hollow channel.

[0013] The gap between each two substrates forms a curved groove.

[0014] One end of the docking groove is fixedly connected to a limit ring.

[0015] The substrate has multiple snap-fit ​​pieces fixedly connected to one side of its outer surface, and the outer surface of the fixing plate has multiple snap-fit ​​grooves, with each snap-fit ​​piece snapped into each snap-fit ​​groove.

[0016] It also includes a fixing mechanism, which is provided in two sets. The two sets of fixing mechanisms are respectively provided on the fixing plate and the base plate. Each set of fixing mechanisms includes a base component and a mounting hole. The base component is provided on the fixing plate, and the mounting hole is provided on the base component.

[0017] The base component is a positioning plate, which is fixedly connected to the fixing plate, and the mounting hole is formed on the positioning plate.

[0018] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: (1) In this invention, the fins and the substrate are independently detachable by using the installation mechanism. When a local fin is damaged by dust accumulation, corrosion or burning, it is not necessary to replace the entire substrate. Only the corresponding slide bar needs to be pulled out to complete the replacement of a single part, which greatly reduces maintenance costs and downtime. At the same time, fins of different heights and thicknesses can be flexibly configured on the same substrate according to heat dissipation requirements. High fins are arranged upstream of the airflow to enhance the heat exchange at the air inlet, and low fins are arranged downstream to reduce the flow resistance at the end of the air duct, thereby realizing the distribution of air volume as needed, so that the cold air can serve the core heat source first, significantly improving the overall heat dissipation efficiency. In addition, the arc transition bar changes the traditional right-angle root connection method. It absorbs the displacement difference caused by the thermal expansion of the fins through elastic bending deformation, effectively disperses stress, prevents root cracking, and extends the fatigue life of the radiator.

[0019] (2) In this invention, by using a rotating mechanism, a rotating shaft is set on one side of the substrate and a docking groove is opened on the other side. With the help of the limiting ring in the docking groove, modular rapid splicing between multiple heat sink units can be realized. The whole can be flexibly changed according to the internal space of the power supply equipment, which improves the heat sink's adaptability to compact and irregular chassis. At the same time, the limiting ring provides precise axial stop to prevent excessive insertion or accidental dislodgement, ensuring the structural stability and positional accuracy after splicing. Meanwhile, the adjacent substrates form a bending groove through the cooperation of the rotating shaft and the docking groove, which can change the bending angle as needed. The gap between the two allows air to flow, increases the scouring effect on the side wall of the substrate, and further improves the heat dissipation capacity.

[0020] (3) In this invention, the use of hollow air-cooling mechanism realizes a three-dimensional heat dissipation path for internal flow, upgrading the traditional single mode of heat dissipation relying only on the surface of fins to a dual-channel heat dissipation of surface and interior. The cooling airflow directly enters the interior of the substrate and carries away the heat accumulation in the planar direction, reducing the overall temperature rise of the substrate. At the same time, the spiral turbulence groove generates strong turbulence by destroying the fluid laminar boundary layer, improving the convective heat transfer coefficient of the inner wall of the channel, so that the limited internal space can exert a heat transfer capacity far exceeding that of the light tube channel. Furthermore, the hollow channel forms a physical thermal barrier inside the substrate, effectively suppressing the crosstalk of heat conducted through the substrate between multiple power devices, making each heat source tend to work independently, avoiding the spread of local overheating to the adjacent area, and significantly enhancing the overall thermal management reliability. Attached Figure Description

[0021] Figure 1 This is a perspective view of the present invention; Figure 2 This is a first-view exploded view of the present invention; Figure 3 This is a second-view exploded view of the present invention; Figure 4 This is a perspective view of the fins of the present invention; Figure 5 This is a cross-sectional view of the substrate portion of the present invention; Figure 6 This is a perspective view of the substrate of the present invention; Figure 7 This is a perspective view of the fixing plate of the present invention; Figure 8 For the present invention Figure 1 A magnified view of A in the middle.

[0022] The markings in the diagram are: 1. Base plate; 2. Rotating shaft; 3. Arc-shaped transition strip; 4. Fin; 5. Spiral turbulence groove; 6. Fixing plate; 7. Hollow channel; 8. Bending groove; 9. Mounting slide; 10. Docking groove; 11. Snap-fit ​​piece; 12. Limiting ring; 13. Positioning stud; 14. Mounting slide; 15. Positioning screw groove; 16. Snap-fit ​​groove; 17. Positioning plate; 18. Mounting hole. Detailed Implementation

[0023] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0024] Example 1, refer to Figure 1 - Figure 8A high-power power supply equipment aluminum profile heat sink includes a base plate 1, fins 4, a mounting mechanism, a rotating mechanism, and a hollow air-cooling mechanism. The mounting mechanism is disposed on the base plate 1, the fins 4 are disposed on the mounting mechanism, the rotating mechanism is disposed on the base plate 1, and the hollow air-cooling mechanism is disposed on the rotating mechanism. The installation mechanism includes a limiting component, a replacement component, and an arc-shaped transition strip 3. The replacement mechanism is located on the base plate 1, the limiting component is located on the replacement component, and the limiting component is connected to the base plate 1. There are two arc-shaped transition strips 3, which are respectively fixedly connected to the bottom sides of the fin 4, and both arc-shaped transition strips 3 are connected to the replacement component. The rotating mechanism includes a rotating shaft 2 and a docking groove 10. The rotating shaft 2 is fixedly connected to one side of the outer surface of the substrate 1, and the docking groove 10 is opened on the other side of the outer surface of the substrate 1. The hollow air-cooling mechanism includes a hollow channel 7 and a turbulence-disrupting component. The hollow channel 7 is opened inside the rotating shaft 2, and the turbulence-disrupting component is located inside the hollow channel 7.

[0025] In this implementation scheme: the substrate 1 is the basic support component of the entire heat sink, directly attached to the power device, responsible for rapidly absorbing and conducting heat. Its bottom surface is usually a precision-machined flat surface to reduce contact thermal resistance. The fins 4 are the main providers of convective heat dissipation area. By increasing the contact area with the air, the heat transmitted from the substrate 1 is quickly dissipated into the environment. The arc-shaped transition strip 3 connects the bottom of the fins 4 to the mounting component, changing the traditional right-angle or acute-angle root connection of the fins 4. When the fins 4 expand along the length direction due to heat, the arc-shaped transition strip 3 can absorb the relative displacement difference between the mounting component and the fins 4 through slight elastic bending deformation, dispersing the originally concentrated stress to the arc-shaped transition strip 3, preventing root cracking, effectively reducing stress concentration, and extending the fatigue life of the heat sink. The rotating shaft 2 and the docking groove 10 cooperate to realize modular splicing. By inserting the rotating shaft 2 on one substrate 1 into the docking groove 10 on another substrate 1, multiple substrates 1 can be interconnected. Furthermore, the assembled whole can produce a certain degree of curvature bending to achieve flexible layout. At the same time, when a certain area of ​​the fins 4 is damaged or burned, When corrosion occurs, only the damaged fin 4 needs to be replaced; the substrate 1 and the remaining fins 4 can continue to be used. Alternatively, fins 4 of different thicknesses and heights can be used at the same heat dissipation location. Higher fins 4 can be used upstream of the airflow near the inlet, while lower fins 4 can be used downstream of the airflow away from the core heat source, achieving an asymmetrical structure. This allows the cool air to prioritize serving the largest heat source at the lowest temperature. The lower-height fins downstream artificially reduce the flow resistance at the end of the air duct, guiding more cooling airflow to the upstream area where the heat source is concentrated, achieving on-demand airflow distribution. (Hollow duct...) Channel 7 serves as the flow path for cooling air, forming a thermal tunnel within the substrate 1. During operation, a portion of the cooling airflow is introduced into these hollow channels 7, creating forced convection cooling within the substrate 1. This achieves three-dimensional heat dissipation through axial flow, overcoming the limitations of traditional heat dissipation relying solely on the surface of the fins 4. The heat accumulation in the planar direction of the substrate 1 is directly carried away by the internal airflow. Simultaneously, the hollow channels 7 form a thermal barrier within the substrate 1, effectively suppressing crosstalk between multiple power devices through the substrate 1, making the heat sources of each device relatively independent, and reducing the overall temperature rise.

[0026] Specifically: The replacement components include mounting groove 9 and mounting slide 14. Mounting groove 9 is opened on the top of substrate 1. Mounting slide 14 is movably inserted into mounting groove 9. Fin 4 is fixedly connected to the top of mounting slide 14. Arc-shaped transition strip 3 is fixedly connected to mounting slide 14.

[0027] In this embodiment, the fin 4 is not directly fixed to the substrate 1, but is fixed to the mounting slide 14. The mounting slide 14 is then inserted into the mounting groove 9 at the top of the substrate 1. When the fin 4 is damaged due to dust accumulation or physical damage, it is not necessary to replace the entire substrate 1. Only the fin 4 at the corresponding position needs to be pulled out for replacement, which greatly reduces the maintenance cost. The arc-shaped transition strip 3 is connected to the mounting slide 14 to ensure the stability between the fin 4 and the mounting slide 14.

[0028] Specifically: The limiting component includes a connecting assembly and a fixing plate 6. The fixing plate 6 is installed at one end of the base plate 1, and the connecting assembly is located on the mounting slide 14 and is connected to the fixing plate 6.

[0029] In this embodiment: the fixing plate 6 is a sealing part at the end of the base plate 1. It cooperates with the connecting component to lock the mounting slide 14 in the mounting slide groove 9 to prevent it from moving laterally under vibration, ensuring that the position of the fin 4 is constant and avoiding collision with other components in the chassis.

[0030] Specifically: The connecting component includes a positioning stud 13 and a positioning screw groove 15. The positioning stud 13 is fixedly connected to one end of the mounting slide bar 14, and the positioning screw groove 15 is opened on one side of the outer surface of the fixing plate 6. The positioning stud 13 is threaded into the positioning screw groove 15.

[0031] In this embodiment: after the mounting slide 14 is inserted into place, the positioning screw groove 15 on the fixing plate 6 corresponds to the positioning stud 13 at the end of the mounting slide 14. Compared with the snap-fit, the threaded connection provides a reliable axial locking force and can be repeatedly disassembled and reassembled without failure.

[0032] Specifically: the turbulence-disrupting component is a spiral turbulence-disrupting groove 5, which is located inside the hollow channel 7.

[0033] In this embodiment, the spiral turbulence groove 5 increases the surface area of ​​the inner wall of the hollow channel 7 and disturbs the airflow, destroys the laminar boundary layer of the fluid, generates turbulence, and significantly improves the convective heat transfer coefficient in the channel.

[0034] Specifically: a curved groove 8 is formed between every two substrates 1.

[0035] In this embodiment: when multiple substrates 1 are assembled side by side, curved grooves 8 are naturally formed on the sides of adjacent substrates 1. In conjunction with the rotating shaft 2 and the docking groove 10, the assembled whole can produce a certain degree of curvature. At the same time, the curved grooves 8 prevent the sidewalls of two adjacent substrates 1 from being tightly fitted, providing space for airflow, increasing the scouring effect on the sidewalls of the substrates, and further improving the heat dissipation capacity.

[0036] Specifically: a limit ring 12 is fixedly connected to one end of the docking groove 10.

[0037] In this embodiment: when the rotating shaft 2 is inserted into the docking groove 10, the limiting ring 12 provides a physical stop to prevent the rotating shaft 2 from coming out of the docking groove 10.

[0038] Specifically: a plurality of snap-fit ​​pieces 11 are fixedly connected to one side of the outer surface of the substrate 1, and a plurality of snap-fit ​​grooves 16 are opened on the outer surface of the fixing plate 6, and each snap-fit ​​piece 11 is snapped into each snap-fit ​​groove 16.

[0039] In this embodiment: after the fixing plate 6 is rotated into position, the snap-fit ​​11 engages with the snap-fit ​​groove 16 to prevent the fixing plate 6 from rotating in the opposite direction during use.

[0040] Specifically, it also includes a fixing mechanism, which has two sets. The two sets of fixing mechanisms are respectively set on the fixing plate 6 and the base plate 1. Each set of fixing mechanisms includes a base component and a mounting hole 18. The base component is set on the fixing plate 6, and the mounting hole 18 is set on the base component.

[0041] In this embodiment: the fixing mechanism is the final interface connecting the entire heat sink to the power supply equipment chassis or PCB board. Two sets are arranged at both ends to form a double-support fixing, which will not cause resonance or warping. The mounting hole 18 is a standard hole diameter, which facilitates connection.

[0042] Specifically: the base component is a positioning plate 17, which is fixedly connected to the fixing plate 6, and the mounting hole 18 is opened on the positioning plate 17.

[0043] In this embodiment: the fixing plate 6 serves as the supporting base for the positioning plate 17. The positioning plate 17 is used to position the mounting holes 18, thereby achieving stable installation and use of the radiator as a whole in the usage position.

[0044] In use, select the number of substrates 1 according to the area of ​​the application location, and connect multiple substrates 1 in parallel. Insert the rotating shaft 2 on one side of one substrate 1 into the mating groove 10 on the other side of another substrate 1 until the end of the rotating shaft 2 touches the limiting ring 12 to complete axial positioning. Select the corresponding fin height and thickness according to the application location requirements, and install the fins 4 in the corresponding substrate 1 according to the design. During installation, push the mounting slide 14 with the corresponding fins 4 horizontally along the mounting groove 9 on the top of the substrate 1. Fasten the fixing plate 6 to the end of the substrate 1, align the positioning stud 13 with the positioning screw groove 15 on the fixing plate 6, tighten the threads, and then tighten the slide. Axial locking is achieved, and simultaneously, the snap-fit ​​tabs 11 on the side of the substrate 1 are pressed into the snap-fit ​​grooves 16 on the fixing plate 6 to prevent the fixing plate 6 from turning over and loosening during use. The assembled heat sink is placed into the power supply equipment chassis, and the positioning plates 17 on the fixing plate 6 and the positioning plates 17 on the substrate 1 are aligned with the chassis holes. Screws are passed through the mounting holes 18 and tightened to complete the overall fixation. During use, the substrate 1 absorbs heat and transfers it to the fins 4, which cooperate with the external cooling air duct to complete heat dissipation. At the same time, a group of cold air flows through the hollow channel 7, which, in conjunction with the internal spiral turbulence grooves 5, generates turbulence to enhance heat transfer, directly carrying away the heat inside the substrate 1 and achieving three-dimensional heat dissipation.

[0045] The control method of this invention is to control the device by manually starting and stopping the switch. The wiring diagram of the power element and the supply of power are common knowledge in the field. Since this invention is mainly used to protect mechanical devices, the control method and wiring layout will not be explained in detail.

[0046] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A high-power power supply equipment aluminum profile heat sink, comprising a base plate (1), fins (4), a mounting mechanism, a rotating mechanism, and a hollow air-cooling mechanism, wherein the mounting mechanism is disposed on the base plate (1), the fins (4) are disposed on the mounting mechanism, the rotating mechanism is disposed on the base plate (1), and the hollow air-cooling mechanism is disposed on the rotating mechanism, characterized in that: The installation mechanism includes a limiting component, a replacement component, and an arc-shaped transition strip (3). The replacement mechanism is located on the substrate (1), the limiting component is located on the replacement component, and the limiting component is connected to the substrate (1). There are two arc-shaped transition strips (3). The two arc-shaped transition strips (3) are respectively fixedly connected to the bottom sides of the fin (4), and both arc-shaped transition strips (3) are connected to the replacement component. The rotating mechanism includes a rotating shaft (2) and a docking groove (10). The rotating shaft (2) is fixedly connected to one side of the outer surface of the substrate (1), and the docking groove (10) is opened on the other side of the outer surface of the substrate (1). The hollow air-cooling mechanism includes a hollow channel (7) and a turbulence-disrupting component. The hollow channel (7) is opened inside the rotating shaft (2), and the turbulence-disrupting component is located inside the hollow channel (7).

2. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: The replacement component includes a mounting groove (9) and a mounting strip (14). The mounting groove (9) is opened on the top of the substrate (1). The mounting strip (14) is movably inserted into the mounting groove (9). The fin (4) is fixedly connected to the top of the mounting strip (14). The arc-shaped transition strip (3) is fixedly connected to the mounting strip (14).

3. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: The limiting component includes a connecting component and a fixing plate (6). The fixing plate (6) is installed on one end of the base plate (1). The connecting component is located on the mounting slide (14) and is connected to the fixing plate (6).

4. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: The connecting assembly includes a positioning stud (13) and a positioning groove (15). The positioning stud (13) is fixedly connected to one end of the mounting slide (14), and the positioning groove (15) is opened on one side of the outer surface of the fixing plate (6). The positioning stud (13) is threaded into the positioning groove (15).

5. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: The turbulence-disrupting component is a spiral turbulence-disrupting groove (5), which is located inside the hollow channel (7).

6. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: A curved groove (8) is formed between each pair of said substrates (1).

7. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: A limiting ring (12) is fixedly connected to one end of the docking groove (10).

8. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: A plurality of snap-fit ​​pieces (11) are fixedly connected to one side of the outer surface of the substrate (1), and a plurality of snap-fit ​​grooves (16) are opened on the outer surface of the fixing plate (6), and each snap-fit ​​piece (11) is snap-fitted into each snap-fit ​​groove (16).

9. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: It also includes a fixing mechanism, which is provided in two sets. The two sets of fixing mechanisms are respectively provided on the fixing plate (6) and the base plate (1). Each set of fixing mechanisms includes a base component and a mounting hole (18). The base component is provided on the fixing plate (6), and the mounting hole (18) is provided on the base component.

10. The aluminum profile heat sink for high-power power supply equipment as described in claim 1, characterized in that: The base component is a positioning plate (17), which is fixedly connected to the fixing plate (6), and the mounting hole (18) is opened on the positioning plate (17).

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