Chip package heat dissipation device and manufacturing process

Abstract

The application relates to a chip packaging heat dissipation device and a manufacturing process. The chip packaging heat dissipation device comprises a supporting assembly, a condensing assembly and a heat conduction assembly. The supporting assembly comprises a bottom plate, a cover plate, a supporting plate, an input pipe and an output pipe. One side of the bottom plate abuts against a chip. The bottom plate and the cover plate are respectively communicated with two ends of the supporting plate. The bottom plate is provided with a first cavity for containing liquid working medium. The cover plate is provided with a second cavity for containing gaseous working medium. The bottom plate, the cover plate, the input pipe and the output pipe form a containing cavity for containing cooling medium. The condensing assembly comprises a sleeve, a capillary structure and a drainage structure. The sleeve penetrates through the supporting plate. The capillary structure is connected to the inner side wall of the sleeve. The supporting plate, the sleeve and the capillary structure are all multiple. The drainage structure is connected to one side of the bottom plate close to the sleeve. The heat conduction assembly is connected to the cover plate. Under the action of the capillary structure, the chip packaging heat dissipation device realizes the backflow and recycling of the liquid working medium. The drainage structure stores part of the liquid working medium, thereby avoiding dry burning.

Description

Technical Field

[0001] This invention relates to the field of chip packaging heat dissipation technology, and in particular to a chip packaging heat dissipation device and its manufacturing process. Background Technology

[0002] With the booming development of data centers, energy consumption has become a major concern. For example, CN115426862A discloses a server cooling system based on a gravity heat pipe for dissipating heat from server chips. The system includes: an evaporator housed within the server chassis and in thermal contact with the chip, with a first cavity inside; a condenser positioned above the server, with a second cavity inside; and an adiabatic pipe section passing through the chassis and connecting the evaporator and condenser, as well as the first and second cavities. This allows the evaporator, condenser, and adiabatic pipe section to form a gravity heat pipe, containing a working fluid that converts between liquid and gaseous states through heat absorption and release. Heat generated by the chip is transferred via the evaporator to the liquid working fluid in the first cavity. The working fluid absorbs heat and converts to a gaseous state, rising through the adiabatic pipe section to the second cavity of the condenser. The heat from the working fluid is then transferred to the external environment through the condenser, and the working fluid returns to a liquid state and descends back to the first cavity through the adiabatic pipe section. However, the insulated pipe section serves as both the channel for the gaseous working fluid to enter the second cavity and the channel for the liquid working fluid to return to the first cavity. However, the gaseous working fluid hinders the return of the liquid working fluid, causing some of the liquid working fluid to vaporize again before returning to the first cavity, thus weakening the heat dissipation effect and easily leading to dry burning of the evaporator. Summary of the Invention

[0003] Therefore, it is necessary to provide a chip packaging heat dissipation device and manufacturing process to address the above problems.

[0004] A chip packaging heat dissipation device includes a support assembly, a condensation assembly, and a heat-conducting assembly. The support assembly includes a base plate, a cover plate, a support plate, an input pipe, and an output pipe. One side of the base plate is used to abut against the chip. The base plate and the cover plate are respectively connected to both ends of the support plate. The base plate has a first cavity to contain a liquid working fluid, and the cover plate has a second cavity to contain a gaseous working fluid. One end of the base plate and one end of the cover plate are both connected to one end of the input pipe, and the other end of the base plate and the other end of the cover plate are both connected to the chip. One end of the output pipe is connected; the base plate, the cover plate, the input pipe, and the output pipe form a cavity to accommodate the cooling medium; the condensation assembly includes a sleeve, a capillary structure, and a drainage structure, the sleeve passes through the support plate, one end of the sleeve is connected to the base plate, and the other end is connected to the cover plate; the capillary structure is connected to the inner wall of the sleeve; there are multiple support plates, sleeves, and capillary structures; the drainage structure is connected to the side of the base plate near the sleeve; the heat conduction assembly is connected to the cover plate.

[0005] In one embodiment, the support assembly further includes a plurality of fins, and each of the support plates is spaced apart along the axial direction of the base plate; the support plates and the fins are alternately arranged, with one side of the fin abutting against one side of the support plate and the other side of the fin abutting against one side of the adjacent support plate.

[0006] In one embodiment, the condensation assembly further includes a substrate and a pad, one end of the sleeve is connected to the substrate, and the other end is connected to the pad; the substrate is disposed on the bottom plate to form the first cavity; the pad is disposed on the cover plate to form the second cavity.

[0007] In one embodiment, the condensation assembly further includes a first reinforcing column and a second reinforcing column, wherein there are multiple first reinforcing columns and multiple second reinforcing columns. One end of the first reinforcing column abuts against the substrate and the other end abuts against the bottom plate; one end of the second reinforcing column abuts against the pad and the other end abuts against the cover plate.

[0008] In one embodiment, the condensation assembly further includes a first flow divider and a second flow divider, the first flow divider covering the substrate and the bottom plate; and the second flow divider covering the pad and the cover plate.

[0009] In one embodiment, the drainage structure is provided with multiple grooves.

[0010] In one embodiment, the drainage structure is provided on the side of the cover plate near the sleeve.

[0011] In one embodiment, the thermal conductive component includes a first thermal conductive element, a second thermal conductive element, and a heat dissipation element. One side of the first thermal conductive element abuts against the chip, and the other side abuts against the base plate. One side of the second thermal conductive element abuts against the cover plate, and the other side abuts against the heat dissipation element.

[0012] In one embodiment, the sleeve is provided with a through hole, one end of which is connected to the first cavity and the other end of which is connected to the second cavity. The first cavity, the second cavity, and the plurality of through holes cooperate to form a reflux channel. Before the chip generates heat, the liquid working fluid occupies 20%-80% of the volume of the reflux channel.

[0013] A manufacturing process for a chip package heat dissipation device, based on the above-mentioned chip package heat dissipation device, is as follows:

[0014] Fabrication of the base plate: The grooves are machined into the base plate by etching or machining, and then the flow-guiding structure is formed by sintering metal powder onto the base plate;

[0015] Fabrication of the sleeve: The capillary structure is formed on the inner side of the sleeve by sintering metal powder through etching or machining;

[0016] Semi-finished product forming: The sleeve, support plate, bottom plate, cover plate, input pipe and output pipe are processed by vacuum brazing or reflow welding to form semi-finished products;

[0017] Injecting working medium: After evacuating the first cavity, the liquid working medium is injected into the vacuumed first cavity through a filling device. After the injection is completed, the injection port is sealed.

[0018] The finished product is formed; after injecting the working fluid, the heat-conducting component is then installed on the cover plate to obtain the finished product.

[0019] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0020] The chip packaging heat dissipation device of the present invention contains a cooling medium through a accommodating cavity. One end of the sleeve is connected to the base plate, and the other end is connected to the cover plate. When the chip heats up, some of the liquid working medium vaporizes into a gaseous working medium. The gaseous working medium rises along the sleeve to the second cavity and then diffuses to other sleeves. Under the action of the cooling medium, the gaseous working medium in the other sleeves liquefies into a liquid working medium. Under the action of the capillary structure, the reflux and recycling of the liquid working medium are realized. The reflux of the liquid working medium is increased by the flow-guiding structure, and a portion of the liquid working medium is stored to avoid dry burning. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the assembly structure of a chip package heat dissipation device according to an embodiment of the present invention;

[0022] Figure 2 for Figure 1 The diagram shows the structure of the support component and the condensation component in the chip package heat dissipation device. The input tube and the output tube are not shown.

[0023] Figure 3 for Figure 2 Exploded view;

[0024] Figure 4 for Figure 2 Sectional view along line AA;

[0025] Figure 5 for Figure 4 A magnified view of center circle C;

[0026] Figure 6 for Figure 2 Sectional view along the BB line;

[0027] Figure 7 for Figure 1The diagram shows the principle of the heat dissipation device for the chip package.

[0028] Figure 8 This is a flowchart illustrating the manufacturing process of a chip packaging heat dissipation device according to one embodiment of the invention.

[0029] The meanings of the numbers in the attached diagram are as follows:

[0030] 100. Chip packaging heat dissipation device;

[0031] 10. Support assembly; 11. Base plate; 110. First cavity; 12. Cover plate; 120. Second cavity; 13. Support plate; 130. Slot; 14. Input pipe; 15. Output pipe; 150. Receiving cavity; 16. Fin;

[0032] 20. Condensation assembly; 21. Sleeve; 211. Through hole; 212. First cylindrical section; 213. Second cylindrical section; 22. Capillary structure; 23. Drainage structure; 230. Groove; 24. Substrate; 25. Pad; 26. First diverter plate; 27. Second diverter plate; 28. First reinforcing post; 29. ​​Second reinforcing post; 30. Thermal conductive assembly; 31. First thermal conductive component; 32. Second thermal conductive component; 33. Heat dissipation component; 90. Chip. Detailed Implementation

[0033] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0034] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0035] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0036] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0037] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0038] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0039] Please refer to Figures 1 to 7A chip packaging heat dissipation device 100 according to one embodiment of the invention includes a support assembly 10, a condensation assembly 20, and a heat-conducting assembly 30. The support assembly 10 includes a base plate 11, a cover plate 12, a support plate 13, an input pipe 14, and an output pipe 15. One side of the base plate 11 is used to abut against the chip 90. The base plate 11 and the cover plate 12 are respectively connected to both ends of the support plate 13. The base plate 11 has a first cavity 110 to contain liquid working fluid, and the cover plate 12 has a second cavity 120 to contain gaseous working fluid. One end of the base plate 11 and one end of the cover plate 12 are both connected to one end of the input pipe 14, and the other end of the base plate 11 is connected to the other end of the cover plate 12. The output pipe 15 is connected to one end of the bottom plate 11, the cover plate 12, the input pipe 14, and the output pipe 15 to form a cavity 150 to contain the cooling medium; the condensation assembly 20 includes a sleeve 21, a capillary structure 22, and a drainage structure 23. The sleeve 21 passes through the support plate 13, with one end of the sleeve 21 connected to the bottom plate 11 and the other end connected to the cover plate 12; the capillary structure 22 is connected to the inner wall of the sleeve 21; there are multiple support plates 13, sleeves 21, and capillary structures 22; the drainage structure 23 is connected to the side of the bottom plate 11 near the sleeve 21; the heat conduction assembly 30 is connected to the cover plate 12. In this embodiment, the chip packaging heat dissipation device 100 contains a cooling medium through a accommodating cavity 150. One end of the sleeve 21 is connected to the base plate 11, and the other end is connected to the cover plate 12. When the chip 90 heats up, some of the liquid working medium vaporizes into a gaseous working medium. The gaseous working medium rises along the sleeve 21 to the second cavity 120 and then diffuses to other sleeves 21. Under the action of the cooling medium, the gaseous working medium in other sleeves 21 liquefies into a liquid working medium. Under the action of the capillary structure 22, the reflux and recycling of the liquid working medium are realized. The reflux of the liquid working medium is increased by the flow-guiding structure 23, and a portion of the liquid working medium is stored to avoid dry burning.

[0040] like Figures 1 to 3 As shown, in this embodiment, the support assembly 10 includes a base plate 11, a cover plate 12, a support plate 13, an input pipe 14, and an output pipe 15. One side of the base plate 11 is used to abut against the chip 90. The base plate 11 and the cover plate 12 are respectively connected to the two ends of the support plate 13. The base plate 11 has a first cavity 110 to contain liquid working fluid, and the cover plate 12 has a second cavity 120 to contain gaseous working fluid. Optionally, the base plate 11 has an injection port (not shown) for injecting liquid working fluid. There are multiple support plates 13, and each support plate 13 is spaced apart along the axial direction of the base plate 11. The support plate 13 has multiple slots 130. Further, the working fluid is one of deionized water, liquid ammonia, acetone, difluoromethane, tetrafluoroethane, or chlorofluorocarbons.

[0041] In one embodiment, one end of the base plate 11 and one end of the cover plate 12 are both connected to one end of the input pipe 14, and the other end of the base plate 11 and the other end of the cover plate 12 are both connected to one end of the output pipe 15; the base plate 11, cover plate 12, input pipe 14, and output pipe 15 form a receiving cavity 150 to accommodate the cooling medium; the outer side of the support plate 13 contacts the cooling medium, optionally, the cooling medium is coolant or cold air; in one embodiment, the cooling medium is in a flowing state to facilitate heat exchange. Figure 5 As shown, the support assembly 10 further includes multiple fins 16. The support plate 13 and the fins 16 are alternately arranged. One side of the fin 16 abuts against one side of the support plate 13, and the other side of the fin 16 abuts against one side of the adjacent support plate 13. Optionally, the fins 16 are formed by multiple "bow"-shaped fins connected end to end, increasing the heat dissipation area and accelerating heat dissipation.

[0042] like Figures 2 to 7 As shown, the condensation assembly 20 includes a sleeve 21, a capillary structure 22, and a drainage structure 23. The sleeve 21 passes through the support plate 13, with one end connected to the base plate 11 and the other end connected to the cover plate 12. Optionally, the slot 130 is used to accommodate the sleeve 21. In one embodiment, the sleeve 21 has a through hole 211, with one end connected to the first cavity 110 and the other end connected to the second cavity 120. The first cavity 110, the second cavity 120, and the multiple through holes 211 cooperate to form a reflux channel. Optionally, the sleeve 21 includes a first cylindrical portion 212 and a second cylindrical portion 213. Before the chip 90 generates heat, the first cavity 110 contains a liquid working fluid, or both the through hole 211 and the first cavity 110 contain liquid working fluid. Furthermore, before the chip 90 generates heat, the liquid working fluid occupies 20%-80% of the volume of the reflux channel. The liquid working fluid cannot completely fill the reflux channel; space should be left for evaporation. In one embodiment, the liquid working fluid occupies 30% of the volume of the reflux channel.

[0043] like Figure 5As shown, the capillary structure 22 is connected to the inner wall of the sleeve 21; there are multiple sleeves 21 and capillary structures 22; in one embodiment, the capillary structure 22 is a porous structure formed by sintering metal powder on the sleeve 21; the bottom plate 11, cover plate 12, support plate 13, fins 16 and sleeve 21 are all made of metal. In one embodiment, the flow-guiding structure 23 is connected to the side of the bottom plate 11 near the sleeve 21, which increases the reflux of liquid working fluid and stores part of the liquid working fluid to avoid dry burning due to untimely reflux of liquid working fluid; optionally, the flow-guiding structure 23 is provided with multiple grooves 230 to store liquid working fluid and also to guide it; further, the grooves 230 are arranged in a longitudinal and transverse manner; even further, the cover plate 12 is provided with the flow-guiding structure 23 on the side near the sleeve 21 to increase the reflux of liquid working fluid. In one embodiment, the drainage structure 23 is similar in structure to the capillary structure 22, and will not be described in detail below.

[0044] like Figure 3 and Figure 5 As shown, the condensation assembly 20 further includes a substrate 24 and a pad 25. One end of the sleeve 21 is connected to the substrate 24, and the other end is connected to the pad 25. The substrate 24 covers the bottom plate 11 to form the first cavity 110; the pad 25 covers the cover plate 12 to form the second cavity 120. Optionally, one end of the first cylindrical portion 212 is mounted on the substrate 24, and the other end is inserted into the slot 130; one end of the second cylindrical portion 213 is mounted on the pad 25, and the other end is inserted into the slot 130. In one embodiment, the condensation assembly 20 further includes a first diverter plate 26 and a second diverter plate 27. The first diverter plate 26 covers the substrate 24 and the bottom plate 11; the second diverter plate 27 covers the pad plate 25 and the cover plate 12, and the sleeve 21 passes through the first diverter plate 26 and the second diverter plate 27. Optionally, the first cylindrical portion 212 passes through the first diverter plate 26, and the second cylindrical portion 213 passes through the second diverter plate 27.

[0045] like Figure 3 and Figure 6 As shown, the condensation assembly 20 also includes a first reinforcing column 28 and a second reinforcing column 29. There are multiple first reinforcing columns 28 and second reinforcing columns 29. One end of the first reinforcing column 28 abuts against the substrate 24 and the other end abuts against the base plate 11. One end of the second reinforcing column 29 abuts against the pad 25 and the other end abuts against the cover plate 12. When the chip 90 heats up, the working fluid will undergo a phase change, resulting in huge internal pressure and easy deformation. The first reinforcing column 28 and the second reinforcing column 29 strengthen the structure and prevent deformation of the base plate 11 and the substrate 24, and the cover plate 12 and the pad 25.

[0046] like Figure 1 and Figure 7 As shown, the heat-conducting component 30 is connected to the cover plate 12. The heat-conducting component 30 includes a first heat-conducting element 31, a second heat-conducting element 32, and a heat-dissipating element 33. One side of the first heat-conducting element 31 abuts against the chip 90, and the other side abuts against the base plate 11. One side of the second heat-conducting element 32 abuts against the cover plate 12, and the other side abuts against the heat-dissipating element 33. Heat dissipation is achieved on the cover plate 12 through the heat-dissipating element 33, increasing the heat dissipation area and enhancing the heat dissipation effect.

[0047] When chip 90 operates, the heat generated by chip 90 forms a heat source area. The heat source causes the liquid working fluid to vaporize, forming a gaseous working fluid. The gaseous working fluid rises along the sleeve 21 corresponding to the heat source area to the second cavity 120, and then diffuses to other sleeves 21. Under the action of the cooling medium, the gaseous working fluid in the other sleeves 21 liquefies, forming a liquid working fluid. Then, under the action of the capillary structure 22, condensation and reflux are achieved. Moreover, the gaseous working fluid diffuses heat to other locations. Some of the heat is transferred from the cover plate 12 to the heat sink 33, and some heat is transferred through the sleeves 21 to the support plate 13, and then to the fins 16. Under the action of the cooling medium, rapid heat exchange is achieved. The cooling medium is continuously supplied through the input pipe 14 and continuously output through the output pipe 15 after heat exchange, accelerating the heat exchange. The heat on the cover plate 12 is dissipated through the heat sink 33, enhancing the heat dissipation effect. The chip package heat dissipation device 100 absorbs heat through vaporization, and then, under the action of the cooling medium and capillary structure 22, achieves heat exchange while condensing and refluxing, realizing rapid heat dissipation and recycling of liquid working fluid; the flow-guiding structure 23 increases the reflux of liquid working fluid and stores part of the liquid working fluid to avoid dry burning due to untimely reflux of liquid working fluid.

[0048] like Figure 8 As shown, a manufacturing process for a chip package heat dissipation device, based on the aforementioned chip package heat dissipation device 100, is as follows:

[0049] Fabrication of base plate 11: A channel is formed on the base plate 11 by etching or machining, and a flow-guiding structure 23 is formed on the base plate 11 by sintering metal powder; Optionally, a channel is formed on the cover plate 12 by etching or machining, and a flow-guiding structure 23 is formed on the cover plate 12 by sintering metal powder.

[0050] Fabrication of sleeve 21: Capillary structure 22 is formed on the inner side of sleeve 21 by sintering metal powder through etching or machining;

[0051] Semi-finished product forming: The sleeve 21, support plate 13, base plate 11, cover plate 12, input pipe 14 and output pipe 15 are processed by vacuum brazing or reflow welding to form semi-finished products; Optionally, the fins 16, base plate 24, pad plate 25, first diverter plate 26, second diverter plate 27, first reinforcing column 28 and second reinforcing column 29 are processed by vacuum brazing or reflow welding to form semi-finished products; Further, the first diverter plate 26 and the second diverter plate 27 are formed by etching or machining, the fins 16 are formed by stamping or toothing, the support plate 13 is formed by extrusion or harmonica plate, and the first reinforcing column 28 and the second reinforcing column 29 are formed by stamping.

[0052] Injecting working medium: After evacuating the first chamber 110, the liquid working medium is injected into the vacuum first chamber 110 through the filling equipment. After the injection is completed, the injection port is sealed.

[0053] The finished product is formed; after injecting the working fluid, the heat-conducting component 30 is installed on the cover plate 12 to obtain the finished product; optionally, the first heat-conducting component 31 is installed on the base plate 11, the second heat-conducting component 32 is installed on the cover plate 12, and the heat dissipation component 33 is installed on the side of the second heat-conducting component 32 away from the cover plate 12.

[0054] The chip packaging heat dissipation device 100 of the present invention contains a cooling medium through a accommodating cavity 150. One end of the sleeve 21 is connected to the base plate 11, and the other end is connected to the cover plate 12. When the chip 90 heats up, some of the liquid working medium vaporizes into a gaseous working medium. The gaseous working medium rises along the sleeve 21 to the second cavity 120, and then diffuses to other sleeves 21. Under the action of the cooling medium, the gaseous working medium in other sleeves 21 liquefies into a liquid working medium. Under the action of the capillary structure 22, the reflux and recycling of the liquid working medium are realized. The reflux of the liquid working medium is increased by the flow-guiding structure 23, and a portion of the liquid working medium is stored to avoid dry burning.

[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0056] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A chip package heat dissipation device, characterized in that, The device includes a support assembly, a condensation assembly, and a heat-conducting assembly. The support assembly includes a base plate, a cover plate, a support plate, an input pipe, and an output pipe. One side of the base plate is used to abut against the chip. The base plate and the cover plate are respectively connected to both ends of the support plate. The base plate has a first cavity to contain liquid working fluid, and the cover plate has a second cavity to contain gaseous working fluid. One end of the base plate and one end of the cover plate are both connected to one end of the input pipe, and the other end of the base plate and the other end of the cover plate are both connected to one end of the output pipe. The base plate, the cover plate, the input pipe, and the output pipe form a accommodating cavity to contain the cooling medium. The condensation assembly includes a sleeve, a capillary structure, and a drainage structure. The sleeve passes through the support plate, with one end connected to the base plate and the other end connected to the cover plate. The capillary structure is connected to the inner wall of the sleeve. There are multiple support plates, sleeves, and capillary structures. The drainage structure is connected to the side of the base plate near the sleeve. The heat-conducting assembly is connected to the cover plate.

2. The chip packaging heat dissipation device according to claim 1, characterized in that, The support assembly further includes multiple fins, and each support plate is spaced apart along the axial direction of the base plate; the support plates and the fins are alternately arranged, with one side of the fin abutting against one side of the support plate and the other side of the fin abutting against one side of the adjacent support plate.

3. The chip packaging heat dissipation device according to claim 1, characterized in that, The condensation assembly further includes a substrate and a pad, one end of the sleeve is connected to the substrate, and the other end is connected to the pad; the substrate is disposed on the bottom plate to form the first cavity; the pad is disposed on the cover plate to form the second cavity.

4. The chip packaging heat dissipation device according to claim 3, characterized in that, The condensation assembly further includes a first reinforcing column and a second reinforcing column, and there are multiple first reinforcing columns and multiple second reinforcing columns. One end of the first reinforcing column abuts against the substrate and the other end abuts against the bottom plate; one end of the second reinforcing column abuts against the pad and the other end abuts against the cover plate.

5. The chip packaging heat dissipation device according to claim 3, characterized in that, The condensation assembly further includes a first flow divider plate and a second flow divider plate, wherein the first flow divider plate covers the substrate and the bottom plate; and the second flow divider plate covers the pad and the cover plate.

6. The chip packaging heat dissipation device according to claim 1, characterized in that, The drainage structure has multiple grooves.

7. The chip packaging heat dissipation device according to claim 1, characterized in that, The drainage structure is provided on the side of the cover plate near the sleeve.

8. The chip packaging heat dissipation device according to claim 1, characterized in that, The thermal conductive component includes a first thermal conductive element, a second thermal conductive element, and a heat dissipation element. One side of the first thermal conductive element abuts against the chip, and the other side abuts against the base plate. One side of the second thermal conductive element abuts against the cover plate, and the other side abuts against the heat dissipation element.

9. The chip packaging heat dissipation device according to claim 1, characterized in that, The sleeve is provided with a through hole, one end of which is connected to the first cavity and the other end of which is connected to the second cavity. The first cavity, the second cavity, and the multiple through holes cooperate to form a reflux channel. Before the chip generates heat, the liquid working fluid occupies 20%-80% of the volume of the reflux channel.

10. A manufacturing process for a chip package heat dissipation device, characterized in that, The manufacturing process of the chip packaging heat dissipation device according to claim 1 is as follows: Fabrication of the base plate: The grooves are machined into the base plate by etching or machining, and then the flow-guiding structure is formed by sintering metal powder onto the base plate; Fabrication of the sleeve: The capillary structure is formed on the inner side of the sleeve by sintering metal powder through etching or machining; Semi-finished product forming: The sleeve, support plate, bottom plate, cover plate, input pipe and output pipe are processed by vacuum brazing or reflow welding to form semi-finished products; Injecting working medium: After evacuating the first cavity, the liquid working medium is injected into the vacuumed first cavity through a filling device. After the injection is completed, the injection port is sealed. Finished product forming; After injecting the working fluid, the heat-conducting component is then installed on the cover plate to obtain the finished product.

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