A heat dissipation device

Abstract

This application provides a heat dissipation device. The heat dissipation device includes: a heat dissipation component and a support component. A heat dissipation body is disposed between two adjacent support structures. An accommodating space is formed between the surface of the support structure and the surface of the heat dissipation body. The shortest dimension of the accommodating space along the target direction is the target length. The heat dissipation device also includes an insert detachably connected to a first support structure. When the insert is disposed within the first support structure, the first support structure undergoes elastic deformation under compression. When the insert is detached from the first support structure, the first support structure returns to its elastic deformation. The heat dissipation body is thermally connected to a heat source. The surface of the first support structure facing the heat dissipation body undergoes elastic deformation, such that the target length of the corresponding accommodating space is a first value, which is the same as the thickness of the heat source along the target direction. When the heat source is removed from the accommodating space, the target length changes to a second value, which is less than the first value.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to a heat dissipation device. Background Technology

[0002] In related technologies, memory modules in electronic devices, such as dual-inline-memory modules (DIMMs), generate heat during operation, requiring cooling devices to dissipate heat and maintain stable operation. However, in current products on the market, the thermal contact between the memory module and the cooling device is not stable enough. The tolerances of the memory module and the cooling device are inconsistent, easily creating dimensional gaps that affect heat dissipation performance. Even if existing solutions use soft materials such as sponges to fill these gaps, the assembly process is still inconvenient. Summary of the Invention

[0003] In view of this, the embodiments of this application aim to provide a heat dissipation device that enables the heat source and the heat dissipation body to be thermally connected in a better way, and the assembly process is simple and convenient.

[0004] This application provides a heat dissipation device, including: The heat dissipation component includes multiple heat dissipation bodies arranged side by side along the target direction; The support component includes multiple support structures arranged in parallel, with the heat dissipation body disposed between two adjacent support structures. An accommodating space is formed between the surface of the support structure and the surface of the heat dissipation body. The accommodating space is used to accommodate a heat source, and the shortest dimension of the accommodating space along the target direction is the target length. Of the two supporting structures located on opposite sides of the heat dissipation body, at least one is a first supporting structure. The heat dissipation device also includes an insert that is detachably connected to the first supporting structure. When the insert is disposed in the first supporting structure, the first supporting structure is subjected to compression and undergoes elastic deformation. When the insert is detached from the first supporting structure, the first supporting structure recovers its elastic deformation. When the heat source is housed in the accommodating space, the heat dissipation body is thermally connected to the heat source. The surface of the first support structure facing the heat dissipation body undergoes elastic deformation and protrudes towards the heat dissipation body, so that the target length of the corresponding accommodating space is a first value, which is the same as the thickness of the heat source along the target direction. When the heat source is removed from the accommodating space, the target length changes to a second value, which is less than the first value.

[0005] In some embodiments, the first support structure is located between two adjacent heat dissipation bodies. When the heat source is housed in the accommodating space, the surfaces on opposite sides of the first support structure undergo elastic deformation toward the corresponding heat dissipation body and protrude toward the corresponding heat dissipation body.

[0006] In some embodiments, of the two support structures disposed on opposite sides of at least part of the heat dissipation body, one is a second support structure, and the surface of the second support structure facing the heat dissipation body is a rigid surface.

[0007] In some embodiments, the heat dissipation device includes a connecting structure rotatably connected to the supporting member, an insert disposed on the connecting structure and detachably connected to the first supporting structure by rotation of the connecting structure, the first supporting structure having a recessed clearance groove, and the insert disposed within the first supporting structure with the opening of the recess facing the connecting structure and the insert located within the recess.

[0008] In some embodiments, the connecting structure has elastic cantilever arms at both ends along the target direction, the elastic cantilever arms and the insert are arranged along the target direction, the support member is located between the two elastic cantilever arms along the target direction, and a portion of the support member is hollowed out relative to the elastic cantilever arms, so that when the accommodating space accommodates the heat source, the free end of the elastic cantilever arm can abut against the heat source.

[0009] In some embodiments, the support member connects two of the connecting structures, which are spaced apart along the extension direction of the heat dissipation body; the two support structures located at both ends of the target direction are located between the elastic cantilever of the two connecting structures along the extension direction of the heat dissipation body.

[0010] In some embodiments, the insert includes a connecting portion and two elastic portions, the two elastic portions being connected to the same end of the connecting portion and extending toward a direction close to the connecting structure, and the other end of the connecting portion being connected to the connecting structure; The elastic part and the connecting part are set at an angle. From the connecting structure to the connecting part, the size of the insert along the target direction gradually decreases from being larger than the opening size of the clearance groove to being smaller than the opening size of the clearance groove.

[0011] In some embodiments, the insert includes two deformable portions disposed opposite to each other and connected along the target direction. Each deformable portion has a deformable region, and the deformable regions of the two deformable portions protrude in directions away from each other and are spaced apart along the target direction. The maximum dimension of the insert along the target direction is greater than the opening size of the clearance groove.

[0012] In some embodiments, the support component includes a frame structure, and a plurality of the support structures are arranged along the target direction and are all connected to the same frame structure. The frame structure can limit the distance between two adjacent support structures along the target direction.

[0013] In some embodiments, the heat dissipation device is provided with one or more of the supporting members along the extending direction of the heat dissipation body; The heat dissipation component includes a base and a thermal pad. The heat dissipation body includes a liquid cooling pipe. The interior of the liquid cooling pipe is connected to the base. A cooling medium flows between the base and the liquid cooling pipe. The thermal pad is disposed on opposite sides of the heat dissipation body along the target direction and is used to thermally connect the heat dissipation body to the heat source. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of a heat dissipation device assembled with a heat source according to an embodiment of this application; Figure 2 for Figure 1 Exploded view of the structure; Figure 3 for Figure 1 A schematic diagram of the structure from another perspective; Figure 4 for Figure 1 A structural diagram of the middle structure from another perspective, showing the embedded parts assembled in place; Figure 5 for Figure 4 Cross-sectional view of the middle structure along the PP direction; Figure 6 This is a partial structural schematic diagram of the heat dissipation device in one embodiment of this application; Figure 7 This is a schematic diagram of the structure of the embedded part in one embodiment of this application; Figure 8 This is a schematic diagram of the structure of the embedding in another embodiment of this application.

[0015] Explanation of reference numerals in the attached figures 10. Heat dissipation component; 11. Heat dissipation body; 12. Base; 20. Support component; 21. First support structure; 21a. Clearance groove; 22. Second support structure; 23. Frame structure; 231. Frame; 232. Reinforcing beam; 30. Embedded part; 31. Connecting part; 32. Elastic part; 33. Deformable part; 33a. Deformable area; 40. Connecting structure; 41. Elastic cantilever; 50A. Heat source. Detailed Implementation

[0016] The embodiments of this application will be described in further detail below with reference to the accompanying drawings and examples. The following examples are used to illustrate this application, but should not be used to limit the scope of this application.

[0017] In the description of the embodiments of this application, it should be noted that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0018] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0019] In the embodiments of this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature and the second feature are in direct contact, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0020] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example that is included in at least one embodiment or example of the embodiments of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0021] This application provides a heat dissipation device; please refer to [link / reference]. Figures 1 to 8 The heat dissipation device includes a heat dissipation component 10 and a support component 20. The heat dissipation component 10 includes a plurality of heat dissipation bodies 11 arranged side by side along a target direction, which can be referred to by the double arrows in the attached figure. The aforementioned side by side arrangement means that the plurality of heat dissipation bodies 11 are parallel or approximately parallel to each other. It can be understood that there may be gaps between two adjacent heat dissipation bodies 11.

[0022] Please see Figure 1 and Figure 2 The number of heat dissipation bodies 11 can be two, three, or more. The heat dissipation body 11 can be understood as a structure that can dissipate absorbed heat to the outside. The heat dissipation device in this application embodiment can be applied to a variety of scenarios. For example, in the scenario of electronic devices such as servers, the heat dissipation body 11 is the cooling kit inside the server. The heat dissipation to the outside means dissipating to the outside of the server, or it can also be dissipated to the outside of the server rack.

[0023] Please see Figure 5 The support component 20 includes multiple support structures arranged in parallel. The number of support structures can be two, three, or more. A heat dissipation body 11 is disposed between two adjacent support structures, forming an accommodating space between the surface of the support structure and the surface of the heat dissipation body 11. That is, the two opposite sidewalls of the accommodating space are located on the surface of the support structure and the surface of the heat dissipation body 11, respectively. The support structure can be understood as a structural entity used to apply force to the heat source 50A, making it as thermally conductive as possible to the heat dissipation body 11. The accommodating space is used to accommodate the heat source 50A. Within the accommodating space, the heat source 50A can contact the heat dissipation body 11, thereby dissipating the heat it generates through the heat dissipation body 11. It is understood that in this embodiment, one or more heat dissipation bodies 11 can be disposed between two adjacent support structures. For an embodiment with one heat dissipation body 11, for example... Figure 5 As shown, two accommodating spaces can be formed between two adjacent support structures, thereby arranging two heat sources 50A and making full use of the opposite sides of the heat dissipation body 11 for heat dissipation.

[0024] For example, the heat source 50A can be a DIMM (Dual-Inline-Memory Module). A DIMM is a long, rectangular printed circuit board assembly with gold fingers at one end. The DIMM is inserted vertically into a corresponding slot on the motherboard. See [reference needed] Figure 2 As shown, multiple DIMMs can be arranged parallel to each other and side by side, with gaps between adjacent DIMMs, facilitating heat dissipation and cooling using the heat dissipation device of this application embodiment. It should be understood that the heat dissipation device of this application embodiment is not limited to cooling DIMMs. This technical solution is applicable to any electronic component that is vertically inserted into a motherboard slot, with multiple modules arranged in a parallel array and gaps between the modules. Examples of such electronic components include ATCA service boards in communication chassis, VPX service boards in industrial control chassis, or vertical EDSFF storage modules in enterprise servers.

[0025] For example, multiple support structures can be installed on the motherboard or connected to the heat sink 11 for support and fixation, thereby maintaining a stable relative distance, and no specific limitations are made here.

[0026] Please continue reading. Figure 5 The shortest dimension of the accommodating space along the target direction is the target length L. It can be understood that for a support structure and / or a heat sink 11 with an uneven surface, the target length L refers to the distance between the closest points of the two. However, for a support structure and heat sink 11 with a flat surface, since they are arranged parallel to each other, the distance between any relative points can be the target length L. It can be understood that, provided the target length L is not less than the thickness of the heat source 50A along the target direction, during assembly, the heat source 50A and the heat sink 11 can have a clearance fit or a transition fit, allowing the heat source 50A to enter the accommodating space relatively smoothly.

[0027] It should be noted that the target length L of different accommodating spaces can be the same or different.

[0028] Please see Figure 4 and Figure 6 Of the two support structures located on opposite sides of the heat dissipation body 11, at least one is the first support structure 21. The above situation includes the first support structure 21 being provided on both sides of the heat dissipation body 11, or the first support structure 21 being provided on one side of the heat dissipation body 11 and other support structures being provided on the other side.

[0029] The first heat dissipation device also includes an insert 30 detachably connected to the first support structure 21. The detachable connection described in this specification refers to a connection method that allows for disassembly and reassembly without causing damage, such as plug-in or snap-fit. The number of inserts 30 can be the same as the number of first support structures 21. When the inserts 30 are disposed within the first support structure 21, the first support structure 21 undergoes elastic deformation due to structural interference. When the inserts 30 are detached from the first support structure 21, the first support structure 21 recovers its elastic deformation as the compression effect of the inserts 30 is removed. It can be understood that by selecting whether the inserts 30 are disposed within the first support structure 21, the surface roughness of the first support structure 21 can be affected. For example, when the inserts 30 are disposed within the first support structure 21, at least one side of the first support structure 21 may protrude; after the inserts 30 are detached, this portion can return to a flat surface. Of course, the embedding depth of the inserts 30 can also affect the surface roughness of the first support structure 21.

[0030] For example, the first support structure 21 may be made of materials such as PC / ABS alloy. PC / ABS alloy has relatively stable elastic deformation ability in high temperature environment, taking into account both high temperature resistance and elastic deformation ability, and is suitable for the first support structure 21 of the embodiments of this application.

[0031] For example, the insert 30 can be a structural member capable of elastic deformation, generating elastic force in a compressed state and being embedded in the first support structure 21. Releasing the elastic force causes the first support structure 21 to undergo elastic deformation. The insert 30 can also be a wedge-shaped member. As the embedding depth changes, the degree of structural interference between the insert 30 and the first support structure 21 gradually increases, causing the degree of elastic deformation of the first support structure 21 to change. The insert 30 can also be in other forms, which are not limited here.

[0032] Please see Figure 5With the heat source 50A housed in the accommodating space, the heat sink 11 is thermally connected to the heat source 50A, allowing the heat generated by the heat source 50A to dissipate through the heat sink 11. The surface of the first support structure 21 facing the heat sink 11 undergoes elastic deformation, for example, under the compression of the aforementioned insert 30, and this surface protrudes towards the heat sink 11, i.e., gets closer to the heat sink 11, so that the target length L of the corresponding accommodating space is a first value, which is the same as the thickness of the heat source 50A along the target direction. In this way, the two opposite sidewalls of the accommodating space can stably contact the heat source 50A. In other words, the elastic deformation of the first support structure 21 allows the support structure and the heat sink 11 to sandwich the heat source 50A. Through their interaction, the heat sink 11 can establish a good thermally conductive connection with the heat source 50A, thereby facilitating the dissipation of the heat generated by the heat source 50A through the heat sink 11.

[0033] It should be noted that the elastic deformation of the first support structure 21 is not likely to cause plastic damage to its own structure. Therefore, when the elastic deformation of the first support structure 21 makes the target length L the first value, the surface of the first support structure 21 can be in relatively stable contact with the heat source 50A, and gaps are not likely to be generated between the two.

[0034] It is understandable that when the surface of the first support structure 21 facing the heat dissipation body 11 does not undergo elastic deformation, for example, when the insert 30 mentioned above has not yet been set in the first support structure 21, the target length L is not less than the first value. Therefore, the heat dissipation device in this application embodiment can first assemble the first support structure 21 and then install the insert 30. In the assembly process, a target length L is left to allow the heat source 50A to smoothly enter the accommodating space. The function of the insert 30 is then used to change the target length L to the first value, so that the heat dissipation body 11 can establish a good thermal conductive connection with the heat source 50A.

[0035] In this embodiment, when the heat source 50A is removed from the accommodating space, the target length L changes to a second value, which is less than the first value. That is, if the heat source 50A, which was originally thermally connected to the heat sink 11, is removed, the surface of the first support structure 21 facing the heat sink 11 can continue to deform under the pressure of the insert 30. Therefore, on the one hand, the surface of the first support structure 21 continuously maintains an elastic pre-tightened state, which can apply a stabilizing force to the heat source 50A, making the clamping reliable; on the other hand, the first support structure 21 has an elastic deformation space, relying on its own elastic deformation capability to adapt to heat sources 50A of different sizes and specifications, without needing to replace the first support structure 21, thus improving the versatility of components.

[0036] Therefore, the heat dissipation device provided in this application embodiment utilizes the layout of the support structure and the heat dissipation body 11 to establish a thermally conductive connection with the heat source 50A, thereby cooling it. The insert 30 is detachably connected to the first support structure 21. The first support structure 21 undergoes elastic deformation under the action of the insert 30. During the assembly process, the heat dissipation device leaves a target length L that allows the heat source 50A to smoothly enter the accommodating space. After the insert 30 is assembled, the first support structure 21 can continuously maintain an elastic pre-tightened state, absorbing dimensional tolerances and applying a stable force to the heat source 50A, ensuring reliable clamping. It can also adapt to heat sources 50A of different sizes and specifications based on its own elastic deformation capability, without the need to replace the first support structure 21, thus improving the versatility of components.

[0037] In some embodiments, please refer to Figure 5 The first support structure 21 is located between two adjacent heat dissipation bodies 11, thus defining accommodating spaces on both sides of the first support structure 21. When the heat source 50A is accommodated in the accommodating space, the surfaces on both sides of the first support structure 21 elastically deform towards the corresponding heat dissipation body 11 and protrude towards it. In this embodiment, the layout of the first support structure 21 and the heat dissipation body 11 is fully utilized, allowing forces to be applied to different heat sources 50A from both sides of the first support structure 21, resulting in a more compact structure for the heat dissipation device.

[0038] In some embodiments, please participate Figure 6 At least one of the two support structures provided on opposite sides of the heat dissipation body 11 is a second support structure 22, and the surface of the second support structure 22 facing the heat dissipation body 11 is a rigid surface. The above-mentioned rigidity means that the surface of the second support structure 22 facing the heat dissipation body 11 is not easily deformed, and the second support structure 22 has good dimensional stability.

[0039] In this embodiment, different support structures can be provided on opposite sides of different heat dissipation bodies 11. For example, a first support structure 21 and a second support structure 22 can be provided on opposite sides of some heat dissipation bodies 11 respectively; while a first support structure 21 can be provided on both opposite sides of some heat dissipation bodies 11, as shown in the reference. Figure 5 The heat dissipation body 11 is located in the middle.

[0040] In this embodiment, the support structures at both ends of the target direction can be second support structures 22. In this way, the second support structure 22 has a heat dissipation body 11 on only one side, and the corresponding accommodating space is a rigid surface. The change of the target length L can be completed by the first support structure 21 on the other side of the accommodating space, so that the heat source 50A is thermally connected to the heat dissipation body 11. The second support structure 22 is a rigid component, and the structure is simple and stable.

[0041] The second support structure 22 and the first support structure 21 can be made of the same material or different materials.

[0042] In some embodiments, please refer to Figure 6 The heat dissipation device includes a connecting structure 40, which is rotatably connected to the support member 20. An insert 30 is disposed on the connecting structure 40 and detachably connected to the first support structure 21 via rotation of the connecting structure 40. It is understood that the connecting structure 40 has at least two different angular positions relative to the support member 20 during rotation. In one angular position, the insert 30 is disposed within the first support structure 21; in the other angular position, the insert 30 is detached from the first support structure 21. Thus, the insert 30 can be assembled by rotating the connecting structure 40, which is convenient and quick. Furthermore, in this embodiment, the connecting structure 40, the insert 30, and the support member 20 can form a module, facilitating management during assembly.

[0043] Please see Figure 3 and Figure 5 The first support structure 21 has a hollowed-out clearance groove 21a. When the insert 30 is positioned within the first support structure 21, the opening of the clearance groove 21a faces the connecting structure 40, and the insert 30 is located within the clearance groove 21a. This allows the insert 30 to easily enter or exit the clearance groove 21a as the connecting structure 40 rotates, enabling the insert 30 to be detachably connected to the first support structure 21. The clearance groove 21a reduces the wall thickness of the first support structure 21 along the target direction, thus facilitating elastic deformation. Furthermore, since the insert 30 is embedded within the clearance groove 21a and does not directly contact the heat source 50A, it minimizes the risk of the insert 30 scratching the heat source 50A.

[0044] For example, the rotation axis of the connecting structure 40 relative to the supporting member 20 extends along the target direction. In this way, the required movement space of the insert 30 during the rotation of the connecting structure 40 can largely coincide with the clearance groove 21a, which is conducive to the smooth entry of the insert 30 into the clearance groove 21a and facilitates assembly.

[0045] For example, the support structures at both ends in the target direction are second support structures 22, and the connecting structure 40 is rotatably connected to the second support structure 22. The second support structure 22 can be a rigid member, which can provide relatively stable structural support. Alternatively, the connecting structure 40 can be rotatably connected to the opposite ends of the frame structure 23 described below, for example, it can be rotatably connected to the frame 231.

[0046] For example, when the insert 30 is disposed in the first support structure 21, the length of the insert 30 along the extension direction of the relief groove 21a can be 1 / 2 to 2 / 3 of the extension length of the relief groove 21a, including proportional relationships such as 1 / 2, 3 / 5, and 2 / 3. In this way, the relief groove 21a has a large margin of elastic deformation.

[0047] In some embodiments, please refer to Figure 7 The insert 30 includes a connecting portion 31 and two elastic portions 32. The two elastic portions 32 are connected to the same end of the connecting portion 31 and extend toward the connecting structure 40. The other end of the connecting portion 31 is connected to the connecting structure 40. The connecting portion 31 and the elastic portions 32 can be an integral structure or separate structures connected together by welding or other connection methods.

[0048] The elastic part 32 and the connecting part 31 are arranged at an angle. From the connecting structure 40 to the connecting part 31, the size of the insert 30 along the target direction gradually decreases from being larger than the opening size of the clearance groove 21a to being smaller than the opening size of the clearance groove 21a. That is, the cross-sectional shape of the insert 30 is approximately wedge-shaped. Based on the characteristic that the elastic part 32 is cantilevered to the connecting part 31, the elastic part 32 can undergo elastic deformation. It is compressed during the process of the insert 30 entering the clearance groove 21a, storing elastic deformation energy, thereby fully compressing the first support structure 21. As the depth of the insert 30 entering the clearance groove 21a gradually increases, the force exerted by the insert 30 on the first support structure 21 gradually increases.

[0049] In some embodiments, please refer to Figure 8 The insert 30 includes two deformable portions 33, which are arranged opposite to each other and connected along the target direction. The two deformable portions 33 can be two different parts of an integral structure or assembled from two separate structures. Each deformable portion 33 has a deformable region 33a, which protrudes outwards from each other and is spaced apart along the target direction. The maximum dimension of the insert 30 along the target direction is larger than the opening size of the clearance groove 21a. In other words, the cross-sectional shape of the insert 30 is approximately spindle-shaped. Based on the outward protrusion of the two deformable portions 33, they can undergo elastic deformation and be compressed during the insertion of the insert 30 into the clearance groove 21a, storing elastic deformation energy and thus fully compressing the first support structure 21. Of course, the insert 30 can also have other structural forms, which will not be described in detail here.

[0050] In some embodiments, please refer to Figure 5 and Figure 6The connecting structure 40 has elastic cantilever 41 at both ends along the target direction. The elastic cantilever 41 is an elastic structure with a fixed end and a free end. The end of the elastic cantilever 41 that is suspended is the free end, and the opposite end is the fixed end. It can be understood that the elastic cantilever 41 can rotate with the rotation of the connecting structure 40.

[0051] The elastic cantilever 41 and the insert 30 are arranged along the target direction, and the support member 20 is located between the two elastic cantilever 41 along the target direction. A portion of the support member 20 is hollowed out relative to the elastic cantilever 41. For example, the second support structure 22 can be partially hollowed out to avoid the elastic cantilever 41, so that when the heat source 50A is housed in the accommodating space, the free end of the elastic cantilever 41 can abut against the heat source 50A. In this way, in the heat dissipation device, the elastic cantilever 41 can also be used to apply force to the heat source 50A, so that it can be thermally connected to the heat dissipation body 11 as much as possible.

[0052] For example, when the insert 30 is detached from the first support structure 21, the free end of the elastic cantilever 41 is suspended (i.e., not in contact with the heat source 50A). The support structures at both ends in the target direction can be the second support structure 22. The minimum distance from the free end of the elastic cantilever 41 to the heat sink 11 is not less than the minimum distance from the second support structure 22 to the heat sink 11. In this way, the elastic cantilever 41 is assembled together with the insert 30 during the assembly process, which is convenient to operate. For the accommodating spaces of the first support structure 21 and the second support structure 22 on the two opposite sidewalls, the heat source 50A can be additionally subjected to the force applied by the elastic cantilever 41, thus achieving better thermal conductivity connection with the heat sink 11.

[0053] In some embodiments, please refer to Figure 3 and Figure 4 The supporting component 20 connects two connecting structures 40, which are spaced apart along the extension direction of the heat dissipation body 11. It should be noted that the two connecting structures 40 can be arranged symmetrically (see reference). Figure 4 Alternatively, the arrangement can be asymmetrical. In this embodiment, the two support structures located at both ends of the target direction are situated between the elastic cantilever 41 of the two connecting structures 40 along the extension direction of the heat dissipation body 11. Thus, within the entire length of the heat dissipation body 11 covered by the support member 20, multiple parts of the heat source 50A can be subjected to force and thermally connected to the heat dissipation body 11 relatively uniformly.

[0054] For example, along the extending direction of the heat sink 11, the total length of the support member 20 can be approximately equal to the total length of a single heat source 50A, or the total length of the support member 20 can be greater than the total length of a single heat source 50A. In both cases, the heat source 50A can be thermally connected to the heat sink 11 more uniformly, reducing the occurrence of uneven heat dissipation and cooling.

[0055] In some embodiments, please refer to Figure 6 The support component 20 includes a frame structure 23, with multiple support structures arranged along the target direction and all connected to the same frame structure 23. The frame structure 23 can limit the distance between two adjacent support structures along the target direction. The frame structure 23 and the support structures can be an integral structure, or multiple support structures can be installed on one side of the frame structure 23. In this embodiment, the support structures do not need to rely on the motherboard structure for fixation, nor does the heat sink 11 need to provide connection support. Instead, the frame structure 23 is used to interlock multiple support structures, allowing two adjacent support structures to be clamped onto the heat sink 11 and the heat source 50A, simplifying the assembly operation.

[0056] For example, the frame structure 23 includes a frame 231 and a reinforcing beam 232, see [link to relevant documentation]. Figure 2 and Figure 6 The first support structure 21 is connected to a set of opposite sides of the frame 231 at both ends along the extension direction of the heat dissipation body 11. The two second support structures 22 located at both ends of the target direction are connected to another set of opposite sides of the frame 231. The reinforcing beam 232 extends along the target direction and connects the frame 231 and the first support structure 21. The reinforcing beam 232 can improve the strength of the frame structure 23.

[0057] In this embodiment, the heat dissipation body 11 can be a heat spreader (e.g., a solid copper substrate) that conducts heat and cools through air convection. Alternatively, the heat dissipation body 11 can be a liquid cooling pipe. For example, in some embodiments, the heat dissipation device has one or more support members 20 along the extension direction of the heat dissipation body 11. The number of support members 20 can be designed according to the length of the heat dissipation body 11. When the heat dissipation body 11 is long, multiple support members 20 can be designed so that the multiple heat sources 50A arranged along the extension direction of the heat dissipation body 11 can be well thermally connected to the heat dissipation body 11.

[0058] The heat dissipation component 10 includes a base 12 and a thermally conductive pad. The heat dissipation body 11 includes a liquid cooling pipe, the interior of which is connected to the base 12. A cooling medium flows between the base 12 and the liquid cooling pipe. The thermally conductive pad is disposed on opposite sides of the heat dissipation body 11 along the target direction to thermally connect the heat dissipation body 11 to the heat source 50A. The thermally conductive pad can fill the gap between the heat dissipation body 11 and the heat source 50A, improving the thermal conductivity of the thermal connection. In this embodiment, the heat dissipation device is liquid-cooled, which has high heat dissipation efficiency. The heat dissipation device can ensure good contact between the heat source 50A and the heat dissipation body 11, making the heat dissipation effect stable.

[0059] The heat dissipation device provided in this embodiment utilizes the layout of the support structure and the heat dissipation body 11 to establish a thermally conductive connection with the heat source 50A, thereby cooling it. Both opposite sides of the heat dissipation body 11 can be used for heat dissipation, resulting in high utilization. The insert 30 is detachably connected to the first support structure 21. The first support structure 21 undergoes elastic deformation under the action of the insert 30. During the assembly process, the heat dissipation device allows for a target length L that enables the heat source 50A to smoothly enter the accommodating space. After the insert 30 is assembled, the first support structure 21 can maintain its elastic pre-tightened state, absorbing dimensional tolerances and applying a stable force to the heat source 50A, ensuring reliable clamping. Furthermore, it can adapt to heat sources 50A of different sizes and specifications based on its own elastic deformation capability, eliminating the need to replace the first support structure 21 and improving component versatility. The design of the connecting structure 40 facilitates assembly operations and further enhances the reliability of the thermally conductive connection between the heat source 50A and the heat dissipation body 11.

[0060] The various embodiments / implementations provided in this application can be combined with each other without creating contradictions.

[0061] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heat dissipation device, comprising: The heat dissipation component includes multiple heat dissipation bodies arranged side by side along the target direction; The support component includes multiple support structures arranged in parallel, with the heat dissipation body disposed between two adjacent support structures. An accommodating space is formed between the surface of the support structure and the surface of the heat dissipation body. The accommodating space is used to accommodate a heat source, and the shortest dimension of the accommodating space along the target direction is the target length. Of the two supporting structures located on opposite sides of the heat dissipation body, at least one is a first supporting structure. The heat dissipation device also includes an insert that is detachably connected to the first supporting structure. When the insert is disposed in the first supporting structure, the first supporting structure is subjected to compression and undergoes elastic deformation. When the insert is detached from the first supporting structure, the first supporting structure recovers its elastic deformation. When the heat source is housed in the accommodating space, the heat dissipation body is thermally connected to the heat source. The surface of the first support structure facing the heat dissipation body undergoes elastic deformation and protrudes towards the heat dissipation body, so that the target length of the corresponding accommodating space is a first value, which is the same as the thickness of the heat source along the target direction. When the heat source is removed from the accommodating space, the target length changes to a second value, which is less than the first value.

2. The heat dissipation device according to claim 1, wherein the first support structure is located between two adjacent heat dissipation bodies, and in the state where the heat source is accommodated in the accommodating space, the surfaces on both sides of the first support structure undergo elastic deformation toward the corresponding heat dissipation body and protrude toward the corresponding heat dissipation body.

3. In the heat dissipation device according to claim 1, of the two support structures provided on opposite sides of at least part of the heat dissipation body, one is a second support structure, and the surface of the second support structure facing the heat dissipation body is a rigid surface.

4. The heat dissipation device according to any one of claims 1-3, wherein the heat dissipation device includes a connecting structure, the connecting structure is rotatably connected to the supporting member, the insert is disposed in the connecting structure and is detachably connected to the first supporting structure by rotation of the connecting structure, the first supporting structure has a recessed clearance groove formed inside, and when the insert is disposed in the first supporting structure, the opening of the clearance groove faces the connecting structure, and the insert is located in the clearance groove.

5. The heat dissipation device according to claim 4, wherein the connecting structure has elastic cantilever arms at both ends along the target direction, the elastic cantilever arms and the insert are arranged along the target direction, the supporting member is located between the two elastic cantilever arms along the target direction, and a portion of the supporting member relative to the elastic cantilever arms is hollowed out, so that the free end of the elastic cantilever arms can abut against the heat source when the accommodating space accommodates the heat source.

6. The heat dissipation device according to claim 5, wherein the supporting member connects two of the connecting structures, and the two connecting structures are spaced apart along the extension direction of the heat dissipation body; the two supporting structures located at both ends of the target direction are located between the elastic cantilever of the two connecting structures along the extension direction of the heat dissipation body.

7. The heat dissipation device according to claim 4, wherein the insert includes a connecting portion and two elastic portions, the two elastic portions are connected to the same end of the connecting portion and extend toward the connecting structure, and the other end of the connecting portion is connected to the connecting structure; The elastic part and the connecting part are set at an angle. From the connecting structure to the connecting part, the size of the insert along the target direction gradually decreases from being larger than the opening size of the clearance groove to being smaller than the opening size of the clearance groove.

8. The heat dissipation device according to claim 4, wherein the insert comprises two deformable portions, the two deformable portions are arranged opposite to each other and connected along the target direction, the deformable portions have deformable regions, the deformable regions of the two deformable portions protrude in directions away from each other and are spaced apart along the target direction, and the maximum dimension of the insert along the target direction is greater than the opening dimension of the clearance groove.

9. The heat dissipation device according to any one of claims 1-3, wherein the supporting component includes a frame structure, a plurality of the supporting structures are arranged along the target direction and are all connected to the same frame structure, and the frame structure is capable of limiting the distance between two adjacent supporting structures along the target direction.

10. The heat dissipation device according to any one of claims 1-3, wherein the heat dissipation device is provided with one or more of the supporting members along the extending direction of the heat dissipation body; The heat dissipation component includes a base and a thermal pad. The heat dissipation body includes a liquid cooling pipe. The interior of the liquid cooling pipe is connected to the base. A cooling medium flows between the base and the liquid cooling pipe. The thermal pad is disposed on opposite sides of the heat dissipation body along the target direction and is used to thermally connect the heat dissipation body to the heat source.

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