An integrated vacuum two-phase heat spreader

Abstract

The application discloses an integrated vacuum two-phase radiator, which comprises a heat-conducting cold plate, a middle heat sink and an upper heat sink. The middle heat sink is of a middle-through structure. The heat-conducting cold plate and the upper heat sink seal the middle heat sink to form a five-surface heat dissipation structure with a closed cavity at the bottom and heat conduction on the rest surfaces. A supporting structure is arranged in the closed cavity, and a low-boiling-point working medium is arranged in the closed cavity. The heat-conducting cold plate, the middle heat sink and the upper heat sink are of an integral structure. The application utilizes negative pressure to reduce the boiling point of the low-boiling-point working medium, and the phase change of the low-boiling-point working medium absorbs heat to reduce the temperature of an electronic device chip. The vaporized low-boiling-point working medium transfers heat to the other five surfaces of the radiator except the bottom surface as condensation heat dissipation surfaces. The low-boiling-point working medium completes heat absorption vaporization, steam diffusion, condensation heat release and liquid backflow in the closed cavity.

Description

Technical Field

[0001] This invention relates to the field of phase change heat dissipation module technology, specifically to an integrated vacuum two-phase heat sink. Background Technology

[0002] With the increasing power of chips in electronic devices such as GPU servers, robots, and charging modules, the requirements for the heat dissipation capacity of modular heat sinks are becoming increasingly higher. Traditional heat dissipation structures are usually localized, and the heat dissipation points are relatively dispersed. Especially when facing chips of 1000W or more, traditional VC heat sinks, heat pipes, traditional air cooling, liquid cooling plates, and split thermosiphon systems are becoming increasingly difficult to implement. To address this, we propose an integrated vacuum two-phase heat sink. Summary of the Invention

[0003] To address the shortcomings of existing technologies, this invention provides an integrated vacuum two-phase heat sink, comprising a thermally conductive cold plate, a middle heat sink, and an upper heat sink. The middle heat sink has a through-hole structure. The thermally conductive cold plate and the upper heat sink seal the middle heat sink to form a five-sided heat dissipation structure with a sealed cavity inside, where the bottom conducts heat and the remaining surfaces dissipate heat. A support structure is provided inside the sealed cavity, and a low-boiling-point working fluid is provided inside the sealed cavity. The thermally conductive cold plate, the middle heat sink, and the upper heat sink are an integral structure.

[0004] Preferably, the central heat sink is rectangular, and first heat sinks are provided on all four sides of the central heat sink. The upper heat sink includes a mounting plate and a second heat sink, with the second heat sink disposed on the upper end of the mounting plate.

[0005] Preferably, the outer side of the first heat sink is provided with a recess, the inner side of the recess is equipped with a first fan, the upper end of the mounting plate is equipped with a second fan, and the second heat sink is located around the second fan.

[0006] Preferably, heat-conducting plates are provided on all four inner sides of the central heat sink, and heat-dissipating particles are provided at the lower end of the mounting plate.

[0007] Preferably, the lower end of the mounting plate is provided with a refrigerant charging nozzle for adding low-boiling-point working fluid into the sealed cavity and for evacuating the vacuum, and the lower end of the mounting plate is provided with heat dissipation particles, which are located around the refrigerant charging nozzle.

[0008] Preferably, the lower end of the support structure is fixedly connected to the upper end of the heat-conducting cold plate, the upper end of the support structure is fixedly connected to the lower end of the mounting plate, and the support structure forms a condensate return channel in the sealed cavity.

[0009] Preferably, the upper end of the heat-conducting cold plate is provided with a heat-conducting structure, which is one of the following: a grid groove, a radial groove, an annular groove, a roughening layer, a microporous layer, or a sintered layer.

[0010] Preferably, the low-boiling-point working fluid is a dielectric refrigerant, an electronic fluorinated liquid, a hydrofluoroolefin working fluid, a hydrochlorofluoroolefin working fluid, or a combination thereof.

[0011] The beneficial effects of this invention are reflected in:

[0012] 1. A five-sided heat dissipation structure is formed by a heat-conducting cold plate, a middle heat sink, and an upper heat sink, creating an internal sealed cavity. The bottom is heat-conducting while the other sides dissipate heat. A low-boiling-point working fluid is introduced into the sealed cavity using a refrigerant charging nozzle, and the sealed cavity is evacuated. Evacuating the sealed cavity further lowers the boiling point of the low-boiling-point working fluid. The lower end of the heat-conducting cold plate is attached to the heat source, allowing the heat from the heat source to be quickly conducted to the low-boiling-point working fluid in the sealed cavity through the heat-conducting structure. The low-boiling-point working fluid absorbs heat and evaporates. The heat is then conducted to the first and second heat sinks through the heat-conducting plates and heat dissipation particles on the inside of the middle heat sink for heat dissipation. At the same time, the evaporated low-boiling-point working fluid condenses. The condensed low-boiling-point working fluid flows back to the lower end of the sealed cavity through the heat-conducting plates and the support structure. The support structure supports the mounting plate and withstands cavity deformation caused by negative or positive pressure. Activating the first and second fans accelerates the heat dissipation of the five-sided heat dissipation structure. Attached Figure Description

[0013] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the accompanying drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn to scale.

[0014] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0015] Figure 2 Cross-sectional view of the present invention Figure 1 ;

[0016] Figure 3 This is a partial structural diagram of the present invention. Figure 1 ;

[0017] Figure 4 This is a partial structural diagram of the present invention. Figure 2 ;

[0018] Figure 5 Cross-sectional view of the present invention Figure 2 .

[0019] In the attached diagram, 1 is a heat-conducting cold plate; 2 is a middle heat sink; 21 is a first heat sink; 22 is a first fan; 23 is a heat-conducting plate; 24 is a supporting structure; 25 is a heat-conducting structure; 3 is an upper heat sink; 31 is a mounting plate; 32 is a second heat sink; 33 is a second fan; 34 is a refrigerant charging nozzle; and 35 is heat dissipation particles. Detailed Implementation

[0020] The embodiments of the technical solution of the present invention will now be described in detail with reference to the accompanying drawings. These embodiments are merely illustrative of the technical solution of the present invention and are therefore intended to limit the scope of protection of the present invention.

[0021] It should be noted that, unless otherwise stated, the technical or scientific terms used in this application should have the ordinary meaning as understood by one of ordinary skill in the art to which this invention pertains.

[0022] like Figure 1-4 As shown, an integrated vacuum two-phase heat sink includes a heat-conducting cold plate 1, a middle heat sink 2, and an upper heat sink 3. The middle heat sink 2 has a through-hole structure. The heat-conducting cold plate 1 and the upper heat sink 3 seal the middle heat sink 2 to form a five-sided heat dissipation structure with a sealed cavity inside, where the bottom conducts heat and the other sides dissipate heat. A support structure 24 is provided inside the sealed cavity, and a low-boiling-point working fluid is provided inside the sealed cavity. The heat-conducting cold plate 1, the middle heat sink 2, and the upper heat sink 3 are an integral structure.

[0023] In this embodiment, the central heat sink 2 is rectangular, and the four sides of the central heat sink 2 are provided with first heat sinks 21. The upper heat sink 3 includes a mounting plate 31 and a second heat sink 32, with the second heat sink 32 disposed on the upper end of the mounting plate 31.

[0024] Specifically, by using the first heat sink 21 and the second heat sink 32 to form a five-sided heat dissipation structure, heat dissipation can be carried out more effectively.

[0025] In this embodiment, a recess is provided on the outer side of the first heat sink 21, a first fan 22 is installed on the inner side of the recess, a second fan 33 is installed on the upper end of the mounting plate 31, and the second heat sink 32 is located around the second fan 33.

[0026] Specifically, by utilizing the first fan 22 and the second fan 33, the heat dissipation of the five-sided heat dissipation structure can be accelerated, further improving the heat dissipation efficiency.

[0027] In this embodiment, heat-conducting plates 23 are provided on all four inner sides of the central heat sink 2, and heat dissipation particles 35 are provided at the lower end of the mounting plate 31.

[0028] Specifically, the heat-conducting sheet 23 and heat dissipation particles 35 can better conduct heat to the five-sided heat dissipation structure for heat dissipation.

[0029] In this embodiment, a refrigerant charging nozzle 34 for adding low-boiling-point working fluid into the sealed cavity and for evacuating the vacuum is installed at the lower end of the mounting plate 31. Heat dissipation particles 35 are installed at the lower end of the mounting plate 31, and the heat dissipation particles 35 are located around the refrigerant charging nozzle 34.

[0030] Specifically, the refrigerant nozzle 34 can be used to add low-boiling-point working fluid to the inside of the sealed cavity and to evacuate the sealed cavity to further reduce the boiling point of the low-boiling-point working fluid. The heat dissipation particles 35 can be used to accelerate the condensation of the evaporated low-boiling-point working fluid and to carry out heat conduction.

[0031] In this embodiment, the lower end of the support structure 24 is fixedly connected to the upper end of the heat-conducting cold plate 1, and the upper end of the support structure 24 is in contact with the lower end of the mounting plate 31. The support structure 24 forms a condensate return channel in the sealed cavity.

[0032] Specifically, the support structure 24 can withstand cavity deformation caused by negative or positive pressure and facilitates the return of condensate.

[0033] In this embodiment, a heat-conducting structure 25 is provided on the upper end of the heat-conducting cold plate 1. The heat-conducting structure 25 is one of the following: a grid groove, a radial groove, an annular groove, a roughening layer, a microporous layer, or a sintered layer.

[0034] Specifically, the heat-conducting structure 25 can quickly transfer the heat from the heat source absorbed by the heat-conducting cold plate 1 to the low-boiling-point working fluid.

[0035] In this embodiment, the low-boiling-point working fluid is a dielectric refrigerant, an electronic fluorinated liquid, a hydrofluoroolefin working fluid, a hydrochlorofluoroolefin working fluid, or a combination thereof.

[0036] It should be noted that, in use, this invention forms a five-sided heat dissipation structure with a sealed cavity inside, formed by a heat-conducting cold plate 1, a middle heat sink 2, and an upper heat sink 3. The bottom is heat-conducting while the other sides dissipate heat. A low-boiling-point working fluid is then introduced into the sealed cavity using a refrigerant charging nozzle 34, and the cavity is evacuated. The lower end of the heat-conducting cold plate 1 is then placed against the heat source, allowing the heat from the heat source to be rapidly conducted to the low-boiling-point working fluid within the sealed cavity via the heat-conducting structure 25. The low-boiling-point working fluid absorbs the heat and evaporates, dissipating through the middle heat sink. The heat-conducting plate 23 and heat dissipation particles 35 on the inner side of the heat body 2 conduct heat to the first heat sink 21 and the second heat sink 32 for heat dissipation, while causing the evaporated low-boiling-point working fluid to condense. The support structure 24 can support the mounting plate 31 and withstand the cavity deformation caused by negative or positive pressure. The condensed low-boiling-point working fluid flows back to the lower end of the sealed cavity through the heat-conducting plate 23 and the support structure 24. Starting the first fan 22 and the second fan 33 can accelerate the heat dissipation effect of the five-sided heat dissipation structure.

[0037] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention, and they should all be covered within the scope of the claims and specification of the present invention.

Claims

1. An integrated vacuum two-phase heat sink, comprising a thermally conductive cold plate (1), a middle heat sink (2), and an upper heat sink (3), characterized in that: The middle heat sink (2) has a through structure. The heat-conducting cold plate (1) and the upper heat sink (3) seal the middle heat sink (2) to form a five-sided heat dissipation structure with a closed cavity inside, heat conduction at the bottom and heat dissipation on the other side. A support structure (24) is provided in the closed cavity. A low-boiling-point working fluid is provided in the closed cavity. The heat-conducting cold plate (1), the middle heat sink (2), and the upper heat sink (3) are an integral structure.

2. The integrated vacuum two-phase radiator according to claim 1, characterized in that: The central heat sink (2) is rectangular, and the four sides of the central heat sink (2) are provided with first heat sinks (21). The upper heat sink (3) includes a mounting plate (31) and a second heat sink (32), and the second heat sink (32) is located at the upper end of the mounting plate (31).

3. The integrated vacuum two-phase radiator according to claim 2, characterized in that: The outer side of the first heat sink (21) is provided with a recess, and the inner side of the recess is provided with a first fan (22). The upper end of the mounting plate (31) is provided with a second fan (33), and the second heat sink (32) is located around the second fan (33).

4. The integrated vacuum two-phase radiator according to claim 3, characterized in that: The inner four sides of the central heat sink (2) are provided with heat-conducting plates (23), and the lower end of the mounting plate (31) is provided with heat dissipation particles (35).

5. The integrated vacuum two-phase radiator according to claim 4, characterized in that: The lower end of the mounting plate (31) is provided with a refrigerant nozzle (34) for adding low-boiling-point working fluid into the sealed cavity and for evacuating the vacuum. The heat dissipation particles (35) are located around the refrigerant nozzle (34).

6. The integrated vacuum two-phase radiator according to claim 1, characterized in that: The lower end of the support structure (24) is fixedly connected to the upper end of the heat-conducting cold plate (1), and the upper end of the support structure (24) is fixedly connected to the lower end of the mounting plate (31). The support structure (24) forms a condensate return channel in the sealed cavity.

7. The integrated vacuum two-phase radiator according to claim 1, characterized in that: The upper end of the heat-conducting cold plate (1) is provided with a heat-conducting structure (25), which is one of the following: grid groove, radial groove, annular groove, roughened layer, microporous layer or sintered layer.

8. The integrated vacuum two-phase radiator according to claim 1, characterized in that: The low-boiling-point working fluid is a dielectric refrigerant, an electronic fluorinated liquid, a hydrofluoroolefin working fluid, a hydrochlorofluoroolefin working fluid, or a combination thereof.

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