Electronic equipment thermal control structure based on micro-pump circulation

Abstract

The application discloses a kind of electronic equipment thermal control structure based on micro pump circulation, belong to electronic equipment cooling technical field, including micro pump liquid supply heat exchange combination, processing plug-in box cooling structure, array surface 1 cooling structure and array surface 2 cooling structure;Micro pump liquid supply heat exchange combination's liquid supply end is respectively communicated with the liquid inlet end of each cooling structure, and the liquid outlet end of each cooling structure is gathered and communicated with the liquid return end of micro pump liquid supply heat exchange combination, and constitutes parallel cooling branch.The micro pump liquid supply heat exchange combination adopts liquid magnetic suspension micro pump, and is integrally arranged with processing plug-in box cooling structure;Processing plug-in box cooling structure is the combination structure of frame liquid passage and uniform temperature heat dissipation plate, array surface 1 cooling structure is the integrated cold plate structure of multiple branch fluid distribution combined spoiler column, and array surface 2 cooling structure is the tile type superposition shunt cooling structure.The application has compact structure, light weight, and liquid cooling heat dissipation efficiency is high, and utilize environment wind as heat sink, and realize the reasonable distribution of each branch cooling liquid flow by combining flow channel optimization matching design.

Description

Technical Field

[0001] This invention belongs to the field of electronic device cooling technology, and in particular relates to a thermal control structure for electronic devices based on micro-pump circulation. Background Technology

[0002] With increasingly higher heat flux densities and more compact structures, heat dissipation has become a critical issue in the structural design of electronic devices. Traditional air cooling is no longer sufficient to meet the high heat dissipation requirements of electronic devices, necessitating the use of liquid cooling. However, liquid cooling systems are bulky, requiring the integration of cooling sources and other equipment, resulting in significant size and weight.

[0003] This invention addresses the need for simplified liquid cooling systems and efficient heat dissipation by proposing a thermal control structure for electronic devices based on micropump circulation. It employs a liquid-magnetic levitation micropump for liquid supply and heat exchange, powered by a tankless liquid-electromagnetic coupling levitation pump. This pump boasts high power density performance, achieving a head exceeding 40m at a flow rate of 20L / min and a power density exceeding 200kW / m³, while weighing only 1kg, making it small and lightweight. The liquid supply and heat exchange assembly is integrated with the cooling box structure, resulting in a compact design. Electronic components utilize liquid cooling, with ambient air serving as the final heat sink. The system is simple, utilizing airflow at flight speed and in conjunction with a fan assembly to meet airflow requirements, eliminating the need for a dedicated liquid cooling source. Summary of the Invention

[0004] The purpose of this invention is to solve the problems mentioned in the background art and to propose a thermal control structure for electronic devices based on micro-pump circulation. It directly utilizes ambient wind as a heat sink, uses a liquid magnetic levitation micro-pump to form a self-closed liquid circulation, and conducts targeted liquid cooling structure design. It is small in size, light in weight, and has high heat exchange efficiency, meeting the cooling requirements of high heat flux density electronic devices in flight.

[0005] To achieve the objective of this invention, a thermal control structure for an electronic device based on micropump circulation is disclosed, comprising a micropump liquid supply heat exchange assembly, a processing chamber cooling structure, a cooling array 1 structure, and a cooling array 2 structure. The processing chamber cooling structure is a structure combining a frame with liquid flow and a uniform heat dissipation plate. The cooling array 1 structure is a structure combining multi-branch fluid distribution with a turbulence column integrated cold plate. The cooling array 2 structure is a tile-type superimposed split-flow cooling structure. With the micropump liquid supply heat exchange assembly as the center, the processing chamber cooling structure is located below the micropump liquid supply heat exchange assembly, the cooling array 1 structure is located on one side of the micropump liquid supply heat exchange assembly, and the cooling array 2 structure is located on the other side of the micropump liquid supply heat exchange assembly.

[0006] The liquid supply end of the micro-pump liquid supply heat exchange assembly is connected to the liquid inlet ends of the processing box cooling structure, the cooling structure of array 1, and the cooling structure of array 2 through the liquid supply pipeline. The liquid outlet ends of the processing box cooling structure, the cooling structure of array 1, and the cooling structure of array 2 are connected to the liquid return end of the micro-pump liquid supply heat exchange assembly through the liquid return pipeline, forming a fluid circulation loop. The micro-pump liquid supply heat exchange assembly provides coolant for heat dissipation of electronic equipment.

[0007] Furthermore, the micro-pump liquid supply heat exchange assembly is connected to the processing box cooling structure, the array 1 cooling structure and the array 2 cooling structure through pipelines respectively, and supplies coolant to each cooling structure in parallel, and recovers the coolant after the cooling structure absorbs heat.

[0008] The cooling structure of the processing module includes a heat dissipation plate and a liquid-cooled module, which are used to conduct heat and liquid cool the electronic components inside the processing module.

[0009] The cooling structure of array 1 includes a water distributor, a component integrated cold plate, a power integrated cold plate, and a comprehensive integrated cold plate, which are used to distribute liquid supply and liquid cooling heat dissipation to different heat-generating parts of array 1.

[0010] The cooling structure of the array 2 includes a primary cold plate, a component liquid-cooled insert cold plate, a secondary cold plate, and a tertiary cold plate, which form a split cooling path in a tile-like stacking manner.

[0011] The flow channels of the cooling structures of the plug-in cooling structure, the cooling structure of array 1, and the cooling structure of array 2 are designed with flow resistance matching so that each parallel branch can obtain a coolant flow rate that matches its heat dissipation requirements.

[0012] Furthermore, the micro-pump liquid supply and heat exchange assembly includes a liquid magnetic levitation micro-pump, an expansion storage tank, and a heat exchanger;

[0013] The outlet of the expansion tank is connected to the inlet of the liquid magnetic levitation micro pump. The outlet of the liquid magnetic levitation micro pump is connected to the cooling structure of the processing box, the cooling structure of surface 1, and the cooling structure of surface 2 through pipe joints. The return ends of the cooling structure of the processing box, the cooling structure of surface 1, and the cooling structure of surface 2 converge and are connected to the inlet of the heat exchanger. The outlet of the heat exchanger is connected to the inlet of the expansion tank.

[0014] Furthermore, the micro-pump liquid supply heat exchange assembly also includes a fan assembly, an environmental control board, a temperature sensor, and pipe joints;

[0015] The fan assembly is positioned at the heat exchanger to provide cooling airflow and cool the coolant flowing through it. A temperature sensor is located on the coolant supply side to detect the supply temperature. The environmental control board is electrically connected to both the temperature sensor and the liquid magnetic levitation micropump, and adjusts the speed of the liquid magnetic levitation micropump based on the supply temperature detected by the temperature sensor. The liquid magnetic levitation micropump drives the coolant to circulate between the micropump supply heat exchange assembly and each cooling structure.

[0016] Furthermore, the micro-pump liquid supply heat exchange assembly and the processing chamber cooling structure are integrated into one design, and the micro-pump liquid supply heat exchange assembly is located on top of the processing chamber cooling structure. The processing chamber cooling structure forms an air duct through which the airflow passes, so as to guide the airflow generated by the fan assembly through the heat exchanger.

[0017] Furthermore, in the cooling structure of the insertion box, the electronic components inside the insertion box are mounted on a heat dissipation plate. The heat dissipation plate is tightly attached to the wall of the slot of the liquid-conducting insertion box by a locking strip, so that the heat generated by the electronic components is conducted to the liquid-conducting insertion box through the heat dissipation plate and transferred to the coolant flowing inside the liquid-conducting insertion box.

[0018] Furthermore, in the cooling structure of the array 1, the component integrated cold plate, the power integrated cold plate and the comprehensive integrated cold plate are installed in parallel on the water distributor. The water distributor distributes fluid to the three types of integrated cold plates, with the component integrated cold plate located in the middle layer, the power integrated cold plate located in the bottom layer, and the comprehensive integrated cold plate located in the top layer.

[0019] The water distributor is connected to the component integrated cold plate, the power integrated cold plate and the integrated cold plate respectively to distribute the coolant, and collects and discharges the coolant after it flows through the component integrated cold plate, the power integrated cold plate and the integrated cold plate.

[0020] Furthermore, the integrated cold plate has an array of diamond-shaped ribs in the high heat flux density area where the corresponding component is installed to enhance heat transfer.

[0021] Furthermore, in the cooling structure of array 2, the primary cold plate is the main frame for supporting electronic equipment and antenna structure and heat dissipation. Inside, there are main channels for liquid inlet and outlet and distribution channels for liquid distribution to component liquid cooling box cold plate, secondary cold plate and tertiary cold plate.

[0022] The liquid-cooled plug-in cold plate of the module is used to dissipate heat from the plug-in module and has an internal S-shaped flow channel; the secondary cold plate has an internal serpentine flow channel; the liquid-cooled plug-in cold plate of the module and the secondary cold plate are stacked in parallel on the primary cold plate in a tile-like stacking manner; the tertiary cold plate is stacked on the secondary cold plate and its internal flow channel is connected to the primary cold plate.

[0023] The liquid inlet ends of the liquid-cooled insert box cold plate, secondary cold plate, and tertiary cold plate of the component are connected to the liquid distribution channel inside the primary cold plate, and the liquid inlet end of the primary cold plate is connected to the liquid supply end of the micro-pump liquid supply heat exchange combination; the liquid inlet ends of the liquid-cooled insert box cold plate, secondary cold plate, and tertiary cold plate of the component are connected to the liquid return channel inside the primary cold plate, and the liquid outlet end of the primary cold plate is connected to the liquid return end of the micro-pump liquid supply heat exchange combination.

[0024] Compared with existing technologies, the significant advancements of this invention are: 1) Compact structure and light weight. It employs a liquid-magnetic levitation micro-pump supply and heat exchange combination, powered by a tankless liquid-electromagnetic coupling levitation pump, resulting in high power density, small size, and light weight. The integrated piping design integrates the liquid supply and heat exchange combination with the processing sub-box cooling structure, leading to a compact structure; 2) High-efficiency liquid cooling and high heat exchange efficiency. The heat-generating electronic components in the processing sub-box cooling structure, array 1 cooling structure, and array 2 cooling structure utilize liquid cooling, and array-type turbulence fins are used to enhance heat exchange, resulting in high heat exchange efficiency; 3) Utilizing ambient air as a heat sink, simplifying the system. The electronic components use liquid cooling, with ambient air as the final heat sink, simplifying the system. Airflow is utilized using aircraft flight speed, combined with a fan assembly to meet high airflow requirements; 4) Optimized flow channel matching design ensures good uniform flow distribution across all branch cooling structures. Flow resistance matching design comprehensively considers the flow rate-resistance characteristics of each branch cooling structure, achieving high-precision flow distribution.

[0025] To more clearly illustrate the functional characteristics and structural parameters of the present invention, further explanation is provided below in conjunction with the accompanying drawings and specific embodiments. Attached Figure Description

[0026] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings:

[0027] Figure 1 This is a schematic diagram of the thermal control system of an unmanned aerial vehicle (UAV) electronic equipment.

[0028] Figure 2 This is a schematic diagram of a micro-pump liquid supply and heat exchange combination;

[0029] Figure 3 This is a schematic diagram of a micro-pump liquid supply and heat exchange assembly (without frame);

[0030] Figure 4 This is a schematic diagram of a liquid-cooled junction box;

[0031] Figure 5 This is a schematic diagram of the integrated design of the micro-pump liquid supply heat exchange combination and the liquid-cooled plug box;

[0032] Figure 6 This is a schematic diagram of the cooling structure of array 1;

[0033] Figure 7 This is a schematic diagram of a component-integrated cold plate cooling structure;

[0034] Figure 8 This is a schematic diagram of the cooling structure of array 2;

[0035] The attached diagram is labeled as follows: 1-Micro-pump liquid supply heat exchange assembly, 1-1 Liquid magnetic levitation micro-pump, 1-2 Expansion storage tank, 1-3 Heat exchanger, 1-4 Fan assembly, 1-5 Environmental control board, 1-6 Temperature sensor, 1-7 Pipe joint, 2-Processing box cooling structure, 2-1 Heat dissipation plate, 2-2 Liquid-passing box, 3-Array 1 cooling structure, 3-1 Water distributor, 3-2 Component integrated cold plate, 3-3 Power integrated cold plate, 3-4 Integrated cold plate, 4-Array 2 cooling structure, 4-1 Primary cold plate, 4-2 Component liquid-cooled box cold plate, 4-3 Secondary cold plate, 4-4 Tertiary cold plate. Detailed Implementation

[0036] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0037] A thermal control structure for an electronic device based on micropump circulation includes a micropump liquid supply heat exchange assembly 1, a processing chamber cooling structure 2, an array 1 cooling structure 3, and an array 2 cooling structure 4. The processing chamber cooling structure 2 is a structure combining a frame with liquid flow and a uniform heat dissipation plate. The array 1 cooling structure 3 is a structure combining multi-branch fluid distribution with a turbulence column integrated cold plate. The array 2 cooling structure 4 is a tile-type superimposed split-flow cooling structure. With the micropump liquid supply heat exchange assembly 1 as the center, the processing chamber cooling structure 2 is located below the micropump liquid supply heat exchange assembly 1, the array 1 cooling structure 3 is located on one side of the micropump liquid supply heat exchange assembly 1, and the array 2 cooling structure 4 is located on the other side of the micropump liquid supply heat exchange assembly 1.

[0038] The supply end of the micro-pump liquid supply heat exchange assembly 1 is connected to the inlet ends of the processing tank cooling structure 2, the array 1 cooling structure 3, and the array 2 cooling structure 4 via supply pipelines. The outlet ends of the processing tank cooling structure 2, the array 1 cooling structure 3, and the array 2 cooling structure 4 are connected to the return end of the micro-pump liquid supply heat exchange assembly 1 via return pipelines, forming parallel cooling branches. The micro-pump liquid supply heat exchange assembly 1 has liquid supply and heat exchange functions and is the core of the entire UAV electronic equipment thermal control system, used to provide a certain flow rate of low-temperature coolant to each cooling branch.

[0039] Specifically, the micro-pump liquid supply heat exchange assembly 1 is connected to the processing box cooling structure 2, the array 1 cooling structure 3 and the array 2 cooling structure 4 through pipelines, respectively, to supply coolant to each cooling structure in parallel, and to recover the coolant after heat absorption by each cooling structure.

[0040] The cooling structure 2 for the processing module includes a heat dissipation plate 2-1 and a liquid-cooled module 2-2, which are used to conduct heat and liquid cool the electronic components inside the processing module.

[0041] The cooling structure 3 of the array 1 includes a water distributor 3-1, a component integrated cold plate 3-2, a power integrated cold plate 3-3, and a comprehensive integrated cold plate 3-4, which are used to distribute liquid supply and liquid cooling heat dissipation to different heat-generating parts of the array 1.

[0042] The cooling structure 4 of the array 2 includes a primary cold plate 4-1, a component liquid-cooled insert box cold plate 4-2, a secondary cold plate 4-3, and a tertiary cold plate 4-4, which form a split cooling path in a tile-like stacking manner;

[0043] The flow channels of cooling structures 2 (sub-box), 3 (array 1), and 4 (array 2) are designed with flow resistance matching to ensure that each parallel branch receives a coolant flow rate that matches its heat dissipation requirements. The flow resistance matching design can be achieved through simulation optimization of the flow channel design to enable adaptive flow distribution among the parallel branches.

[0044] Specifically, the micro-pump liquid supply and heat exchange assembly 1 includes a liquid magnetic levitation micro-pump 1-1, an expansion storage tank 1-2, and a heat exchanger 1-3;

[0045] The outlet of the expansion tank 1-2 is connected to the inlet of the liquid magnetic levitation micropump 1-1. The outlet of the liquid magnetic levitation micropump 1-1 is connected to the cooling structure 2 of the processing chamber, the cooling structure 3 of the array 1, and the cooling structure 4 of the array 2 via pipe connector 1-7. The return ends of the cooling structures 2 of the processing chamber, the cooling structure 3 of the array 1, and the cooling structure 4 of the array 2 converge and are connected to the inlet of the heat exchanger 1-3. The outlet of the heat exchanger 1-3 is connected to the inlet of the expansion tank 1-2. The expansion tank 1-2 is used to compensate for volume changes in the liquid cooling system, and its internal liquid level is higher than that of the inlet of the liquid magnetic levitation micropump 1-1 to ensure timely liquid replenishment.

[0046] Specifically, the high-temperature coolant that absorbs heat from electronic devices in the processing box cooling structure 2, array 1 cooling structure 3, and array 2 cooling structure 4 flows back to the micro-pump supply heat exchange assembly 1, and is collected and flows into the heat exchanger 1-3. After being cooled by the ambient air, it returns to the expansion storage tank 1-2, and is then pressurized by the liquid magnetic levitation micro-pump 1-1 and delivered in three paths to the processing box cooling structure 2, array 1 cooling structure 3, and array 2 cooling structure 4 for cooling the electronic devices again.

[0047] Specifically, the micro-pump liquid supply heat exchange assembly 1 also includes a fan assembly 1-4, an environmental control board 1-5, a temperature sensor 1-6, and a pipe connector 1-7;

[0048] Fan assembly 1-4 is positioned at heat exchanger 1-3 to provide cooling airflow to the heat exchanger 1-3, thereby cooling the coolant flowing through it. Temperature sensor 1-6 is located on the coolant supply side to detect the supply temperature. Environmental control board 1-5 is electrically connected to both temperature sensor 1-6 and the liquid magnetic levitation micropump 1-1, adjusting the rotational speed of the liquid magnetic levitation micropump 1-1 based on the supply temperature detected by temperature sensor 1-6. The liquid magnetic levitation micropump 1-1 drives the coolant to circulate between the micropump supply heat exchange assembly 1 and each cooling structure. The liquid magnetic levitation micropump 1-1 uses non-contact bearings and is a grooveless liquid-electromagnetic coupling levitation pump. Heat exchanger 1-3 is preferably a plate-fin gas-liquid heat exchanger.

[0049] Specifically, the micro-pump liquid supply heat exchange assembly 1 and the processing chamber cooling structure 2 are integrated into one unit, with the micro-pump liquid supply heat exchange assembly 1 positioned on top of the processing chamber cooling structure 2. The processing chamber cooling structure 2 forms an air duct through which airflow passes, guiding the airflow generated by the fan assembly 1-4 through the heat exchangers 1-3. This integrated design reduces pipe length and minimizes airflow loss.

[0050] Specifically, in the cooling structure 2 of the insertion box, the electronic components inside the insertion box are mounted on the heat dissipation plate 2-1. The heat dissipation plate 2-1 is tightly attached to the slot wall of the liquid-conducting insertion box 2-2 by a locking strip, so that the heat generated by the electronic components is conducted through the heat dissipation plate 2-1 to the liquid-conducting insertion box 2-2 and transferred to the coolant flowing inside the liquid-conducting insertion box 2-2.

[0051] Specifically, in the cooling structure 3 of the array 1, the component integrated cold plate 3-2, the power integrated cold plate 3-3 and the comprehensive integrated cold plate 3-4 are installed in parallel on the water distributor 3-1. The water distributor 3-1 distributes fluid to the three types of integrated cold plates. The component integrated cold plate 3-2 is located in the middle layer, the power integrated cold plate 3-3 is located in the bottom layer, and the comprehensive integrated cold plate 3-4 is located in the top layer.

[0052] Water distributor 3-1 is connected to component integrated cold plate 3-2, power integrated cold plate 3-3 and integrated cold plate 3-4 respectively and distributes coolant, and collects and discharges the coolant that flows through component integrated cold plate 3-2, power integrated cold plate 3-3 and integrated cold plate 3-4.

[0053] Specifically, the integrated cold plate 3-2 has an array of diamond-shaped ribs in the high heat flux density area where the corresponding component is installed to enhance heat transfer.

[0054] Specifically, in the cooling structure 4 of the array 2, the primary cold plate 4-1 is the main frame for supporting and dissipating heat from electronic equipment and antenna structures. Inside, there are main channels for liquid inlet and outlet and distribution channels for liquid distribution to the component liquid cooling box cold plate 4-2, the secondary cold plate 4-3 and the tertiary cold plate 4-4.

[0055] The liquid-cooled insert box cold plate 4-2 is used for heat dissipation of the insert module, and has an S-shaped flow channel inside; the secondary cold plate 4-3 has a serpentine flow channel inside; the liquid-cooled insert box cold plate 4-2 and the secondary cold plate 4-3 are stacked in parallel on the primary cold plate 4-1 in a tile-like stacking manner; the tertiary cold plate 4-4 is stacked on the secondary cold plate 4-3, and its internal flow channel is connected to the primary cold plate 4-1;

[0056] The liquid inlet ends of the component liquid-cooled insert box cold plate 4-2, secondary cold plate 4-3, and tertiary cold plate 4-4 are connected to the liquid distribution channel inside the primary cold plate 4-1. The liquid inlet end of the primary cold plate 4-1 is connected to the liquid supply end of the micro-pump liquid supply heat exchange assembly 1. The liquid inlet ends of the component liquid-cooled insert box cold plate 4-2, secondary cold plate 4-3, and tertiary cold plate 4-4 are connected to the liquid return channel inside the primary cold plate 4-1. The liquid outlet end of the primary cold plate 4-1 is connected to the liquid return end of the micro-pump liquid supply heat exchange assembly 1.

[0057] Example

[0058] This embodiment provides a thermal control structure for electronic devices based on micro-pump circulation, such as... Figure 1 As shown, a micro-pump circulation-based thermal control structure for electronic devices includes: a micro-pump liquid supply and heat exchange assembly, a processing chamber cooling structure, a cooling array 1 structure, and a cooling array 2 structure. The micro-pump liquid supply and heat exchange assembly, with its liquid supply and heat exchange functions, is the core of the entire UAV electronic device thermal control system. It provides a certain flow rate of low-temperature coolant to the processing chamber cooling structure, cooling array 1 structure, and cooling array 2 structure in parallel. The processing chamber cooling structure, cooling array 1 structure, and cooling array 2 structure employ different thermal control structures based on the characteristics of the electronic device. The processing chamber cooling structure combines a frame-type liquid flow with a uniform heat dissipation plate. The cooling array 1 structure uses a multi-branch fluid distribution combined with a baffle column integrated cold plate. The cooling array 2 structure uses a tile-type superimposed flow distribution cooling method. Based on the liquid flow requirements of each cooling structure, flow resistance matching is achieved through simulation optimization of the flow channel design, realizing adaptive flow distribution.

[0059] like Figure 2 , 3As shown, the micropump liquid supply and heat exchange assembly includes: a liquid magnetic levitation micropump, a heat exchanger, an expansion tank, a temperature sensor, an environmental control board, a fan assembly, and pipe fittings. The liquid magnetic levitation micropump uses non-contact bearings and is a grooveless liquid-electromagnetic coupling levitation pump, offering high lifespan and power density performance. One micropump achieved a flow rate of 20 L / min with a head exceeding 40 m and a power density exceeding 200 kW / m³. The heat exchanger is a plate-fin gas-liquid heat exchanger with a compact structure. The expansion tank compensates for volume changes in the liquid cooling system, with the internal liquid level higher than the inlet of the liquid magnetic levitation micropump to ensure timely liquid replenishment. Air from the wall enters the liquid magnetic levitation micropump. The environmental control board monitors the system's liquid supply temperature via the temperature sensor and adjusts the liquid magnetic levitation micropump speed accordingly.

[0060] The micro-pump liquid supply heat exchange process is as follows: the high-temperature liquid that has absorbed heat from the electronic devices in the processing box cooling structure, the array 1 cooling structure, and the array 2 cooling structure returns to the micro-pump liquid supply heat exchange assembly, flows into the heat exchanger, is cooled by the external ambient air and returns to the expansion storage tank, and is then pressurized by the liquid magnetic levitation micro-pump and returned to the processing box cooling structure, the array 1 cooling structure, and the array 2 cooling structure in three paths to cool the electronic devices.

[0061] like Figure 4 As shown, the cooling structure for the insert box includes a vapor chamber and a coolant-filled insert box. The heat source is mounted on the vapor chamber, and the vapor chamber is secured to the insert box slot wall by locking strips. Coolant flows through the insert box, and the heat from the heat source is first conducted to the vapor chamber, then to the insert box, and finally transferred to the coolant inside the insert box.

[0062] like Figure 5 As shown, the micro-pump liquid supply heat exchange assembly is integrated with the processing box cooling structure. The micro-pump liquid supply heat exchange assembly is located on the top of the processing box cooling structure. The integrated design reduces the pipe length, and at the same time, the box structure is used to form an air duct to reduce airflow loss.

[0063] like Figure 6 As shown, the cooling structure of array 1 includes: a water distributor, a component integrated cold plate, a power integrated cold plate, and a comprehensive integrated cold plate.

[0064] like Figure 7 As shown, the integrated cold plate of the component has an array of diamond-shaped ribs in the high heat flux density area of ​​the component installation to enhance heat exchange; the water distributor has the function of separating and collecting liquid in the static pressure chamber; the integrated cold plate of the component, the integrated cold plate of the power supply, and the integrated cold plate of the whole are designed with flow resistance matching.

[0065] like Figure 8 As shown, the cooling structure of array 2 includes: a primary cooling plate, a liquid-cooled module box, a secondary cooling plate, and a tertiary cooling plate. Each part is a tile-type stacked split-flow cooling structure, which is compact.

[0066] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0067] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A thermal control structure for electronic devices based on micro-pump circulation, characterized in that, It includes a micro-pump liquid supply heat exchange assembly (1), a processing chamber cooling structure (2), a front surface 1 cooling structure (3), and a front surface 2 cooling structure (4); the processing chamber cooling structure (2) is a structure combining a frame liquid flow and a uniform heat dissipation plate, the front surface 1 cooling structure (3) is a structure combining multi-branch fluid distribution with a turbulence column integrated cold plate, and the front surface 2 cooling structure (4) is a tile-type superimposed split cooling structure; with the micro-pump liquid supply heat exchange assembly (1) as the center, the processing chamber cooling structure (2) is set below the micro-pump liquid supply heat exchange assembly (1), the front surface 1 cooling structure (3) is set on one side of the micro-pump liquid supply heat exchange assembly (1), and the front surface 2 cooling structure (4) is set on the other side of the micro-pump liquid supply heat exchange assembly (1); The liquid supply end of the micro-pump liquid supply heat exchange assembly (1) is connected to the liquid inlet end of the processing box cooling structure (2), the array 1 cooling structure (3) and the array 2 cooling structure (4) respectively through the liquid supply pipeline. The liquid outlet end of the processing box cooling structure (2), the array 1 cooling structure (3) and the array 2 cooling structure (4) is connected to the liquid return end of the micro-pump liquid supply heat exchange assembly (1) through the return pipeline to form a fluid circulation loop. The micro-pump liquid supply heat exchange assembly (1) provides coolant for heat dissipation of electronic equipment.

2. The thermal control structure for electronic devices based on micro-pump circulation according to claim 1, characterized in that, The micro-pump liquid supply heat exchange assembly (1) is connected to the processing box cooling structure (2), the array 1 cooling structure (3) and the array 2 cooling structure (4) respectively through pipelines, and supplies coolant to each cooling structure in parallel, and recovers the coolant after the cooling structure absorbs heat. The cooling structure (2) of the processing box includes a heat dissipation plate (2-1) and a liquid-cooled box (2-2) for conducting heat and liquid cooling of electronic components inside the processing box; The cooling structure (3) of the array 1 includes a water distributor (3-1), a component integrated cold plate (3-2), a power integrated cold plate (3-3), and a comprehensive integrated cold plate (3-4), which are used to distribute liquid supply and liquid cooling heat dissipation to different heat-generating parts of the array 1. The cooling structure (4) of the array 2 includes a primary cold plate (4-1), a component liquid-cooled insert cold plate (4-2), a secondary cold plate (4-3), and a tertiary cold plate (4-4), which form a split cooling path in a tile-like stacking manner; The flow channels of the processing box cooling structure (2), the array 1 cooling structure (3) and the array 2 cooling structure (4) are designed with flow resistance matching so that each parallel branch can obtain a coolant flow rate that matches its heat dissipation requirements.

3. The thermal control structure for electronic devices based on micro-pump circulation according to claim 1, characterized in that, The micropump liquid supply and heat exchange assembly (1) includes a liquid magnetic levitation micropump (1-1), an expansion storage tank (1-2), and a heat exchanger (1-3). The outlet of the expansion storage tank (1-2) is connected to the inlet of the liquid magnetic levitation micro pump (1-1). The outlet of the liquid magnetic levitation micro pump (1-1) is connected to the processing box cooling structure (2), the array 1 cooling structure (3) and the array 2 cooling structure (4) respectively through the pipe joint (1-7). The return ends of the processing box cooling structure (2), the array 1 cooling structure (3) and the array 2 cooling structure (4) are connected to the inlet of the heat exchanger (1-3). The outlet of the heat exchanger (1-3) is connected to the inlet of the expansion storage tank (1-2).

4. The thermal control structure for electronic devices based on micro-pump circulation according to claim 3, characterized in that, The micro-pump liquid supply heat exchange assembly (1) also includes a fan assembly (1-4), an environmental control board (1-5), a temperature sensor (1-6), and a pipe connector (1-7). The fan assembly (1-4) is correspondingly disposed at the heat exchanger (1-3) to provide cooling airflow to the heat exchanger (1-3) to cool the coolant flowing through the heat exchanger (1-3); the temperature sensor (1-6) is disposed on the coolant supply side to detect the supply temperature; the environmental control board (1-5) is electrically connected to the temperature sensor (1-6) and the liquid magnetic levitation micropump (1-1) respectively, and is used to adjust the rotation speed of the liquid magnetic levitation micropump (1-1) according to the supply temperature detected by the temperature sensor (1-6); the liquid magnetic levitation micropump (1-1) is used to drive the coolant to circulate between the micropump supply heat exchange assembly (1) and each cooling structure.

5. The thermal control structure for an electronic device based on micro-pump circulation according to claim 4, characterized in that, The micro-pump liquid supply heat exchange assembly (1) and the processing box cooling structure (2) are integrated into one design, and the micro-pump liquid supply heat exchange assembly (1) is located on the top of the processing box cooling structure (2). The processing box cooling structure (2) forms a duct for airflow to guide the airflow generated by the fan assembly (1-4) through the heat exchanger (1-3).

6. The thermal control structure for electronic devices based on micro-pump circulation according to claim 2, characterized in that, In the cooling structure (2) of the processing box, the electronic devices inside the box are mounted on the heat dissipation plate (2-1). The heat dissipation plate (2-1) is attached to the slot wall of the liquid-flowing box (2-2) by a locking strip, so that the heat generated by the electronic devices is conducted through the heat dissipation plate (2-1) to the liquid-flowing box (2-2) and transferred to the coolant flowing in the liquid-flowing box (2-2).

7. The thermal control structure for an electronic device based on micro-pump circulation according to claim 2, characterized in that, In the cooling structure (3) of the array 1, the component integrated cold plate (3-2), the power integrated cold plate (3-3) and the comprehensive integrated cold plate (3-4) are installed in parallel on the water distributor (3-1). The water distributor (3-1) distributes fluid to the three types of integrated cold plates. The component integrated cold plate (3-2) is located in the middle layer, the power integrated cold plate (3-3) is located in the bottom layer, and the comprehensive integrated cold plate (3-4) is located in the top layer. The water distributor (3-1) is connected to the component integrated cold plate (3-2), the power integrated cold plate (3-3), and the integrated cold plate (3-4) respectively, and distributes the coolant. It also collects and discharges the coolant that has flowed through the component integrated cold plate (3-2), the power integrated cold plate (3-3), and the integrated cold plate (3-4).

8. The thermal control structure for an electronic device based on micro-pump circulation according to claim 7, characterized in that, The integrated cold plate (3-2) of the component has an array of diamond-shaped ribs in the high heat flux density area where the corresponding component is installed, so as to enhance heat transfer.

9. The thermal control structure for an electronic device based on micro-pump circulation according to claim 2, characterized in that, In the array 2 cooling structure (4), the first-stage cold plate (4-1) is the main frame for supporting electronic equipment and antenna structure and heat dissipation. The interior is the main channel for liquid inlet and outlet and the distribution channel, which is used for liquid distribution of component liquid cooling box cold plate (4-2), second-stage cold plate (4-3) and third-stage cold plate (4-4); The component liquid-cooled insert box cold plate (4-2) is used for heat dissipation of the insert module, and its interior has an S-shaped flow channel; the secondary cold plate (4-3) has a serpentine flow channel; the component liquid-cooled insert box cold plate (4-2) and the secondary cold plate (4-3) are stacked in parallel on the primary cold plate (4-1) in a tile-like stacking manner; the tertiary cold plate (4-4) is stacked on the secondary cold plate (4-3), and its internal flow channel is connected to the primary cold plate (4-1); The liquid inlet ends of the component liquid-cooled insert box cold plate (4-2), secondary cold plate (4-3), and tertiary cold plate (4-4) are connected to the liquid distribution channel inside the primary cold plate (4-1), and the liquid inlet end of the primary cold plate (4-1) is connected to the liquid supply end of the micro-pump liquid supply heat exchange assembly (1); the liquid inlet ends of the component liquid-cooled insert box cold plate (4-2), secondary cold plate (4-3), and tertiary cold plate (4-4) are connected to the liquid return channel inside the primary cold plate (4-1), and the liquid outlet end of the primary cold plate (4-1) is connected to the liquid return end of the micro-pump liquid supply heat exchange assembly (1).

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