A heat dissipation structure for an underwater equipment electronic pressure hull and a design method thereof

Abstract

The application discloses a heat dissipation structure and design method for an underwater equipment electronic pressure-proof cabin, and belongs to the technical field of underwater detection and underwater operation equipment. The application solves the problems of low heat dissipation efficiency and poor universality of the underwater pressure-proof cabin. Pressure-proof end covers are respectively arranged at two ends of a pressure-proof shell body, the pressure-proof end covers are in sealing connection with the pressure-proof shell body through end cover rubber rings and are fastened through screws, and a flow guide end cover, a first heat dissipation mounting plate and a heat dissipation fan assembly are sequentially arranged in the pressure-proof shell body in an axial direction. Fans of the heat dissipation fan assembly are arranged in an annular shell through fan connecting supports and fan supporting plates, the outflow sides of the fans face the first heat dissipation mounting plate, a flow guide annular groove is arranged on the side of the flow guide end cover facing the fans, and a backflow air duct is formed between the fans and the annular shell. The heat dissipation structure and design method for the underwater equipment electronic pressure-proof cabin can improve the heat exchange efficiency by more than 30% compared with conventional solid heat dissipation blocks, and effectively reduce the hotspot temperature of electronic devices.

Description

Technical Field

[0001] This invention belongs to the technical field of underwater exploration and underwater operation equipment, specifically relating to a heat dissipation structure and design method for an electronic pressure-resistant chamber of underwater equipment. Background Technology

[0002] With the further expansion of the underwater unmanned vehicle market and continuous technological advancements, scenarios in which these vehicles perform long-duration underwater exploration, high-speed data transmission, and high-frequency read / write tasks are becoming increasingly common. These tasks place extremely high demands on the performance of electronic equipment, leading to a significant increase in heat generation from components such as high-frequency circuit boards, high-speed communication modules, and memory within the electronics compartment.

[0003] Existing products are mostly specialized designs, lacking universal and efficient heat dissipation structures. Due to the unique underwater environment, pressure tanks must maintain high sealing to withstand deep-water pressure. However, the tank walls rely solely on low-intensity convection and heat conduction to dissipate heat, while the equipment inside continuously exchanges heat through thermal radiation and convection. When chips generate heat for extended periods, simply relying on the tank walls to conduct heat outwards is insufficient to prevent heat accumulation in the central area. The enclosed cavity effect of thermal radiation leads to a temperature distribution of "hot in the middle, cold at the walls," which in turn affects the stability and lifespan of electronic components.

[0004] Most current products use heat dissipation methods based on the principle of heat diffusion, which uses high thermal conductivity materials to conduct local heat generated by electronic devices to the surface of the pressure-resistant shell, and then uses the convection heat transfer of seawater outside the aircraft to achieve cooling.

[0005] Currently, most mainstream products use a method where metal structural components are tightly fitted to the inner wall of the pressure chamber to create a heat diffusion path from the heat source to the shell. This type of heat dissipation method has significant limitations:

[0006] 1. Pure metal structural components are relatively heavy and large, which increases the overall weight of the aircraft. Additional buoyancy materials need to be configured in the overall design of the aircraft to achieve balance between the center and the center of buoyancy, which occupies the effective payload space.

[0007] 2. Because the pressure chamber is a highly enclosed space, regardless of whether the product adopts a weight-reduction design, during the continuous heat dissipation process, the surface of the heat sink will experience a heat radiation accumulation effect, making it difficult for heat to be effectively transferred outward, resulting in a decrease in heat dissipation efficiency and an increase in the ambient temperature around the electronic board, thereby exacerbating the heat radiation accumulation on the upper surface of the electronic board.

[0008] To improve heat exchange efficiency, some products fill the pressure tank with phase change materials. This design has high heat dissipation efficiency, but its inherent drawback lies in reliability issues in high-pressure deep-water environments. When the phase change material undergoes a phase change, it expands in volume, generating radial internal pressure on the tank walls. This pressure, combined with the external pressure exerted by the seawater, ultimately leads to stress concentration at the phase change material sealing shell, posing a potential threat to structural safety.

[0009] Furthermore, the electronic pressure chamber's function is solely to facilitate signal interaction between electronic equipment and external signals, with only electronic circuit boards housed internally. Therefore, designing a universal, standardized structure has significant engineering value. However, the internal structures of existing electronic chambers are all custom-designed, requiring separate development for each model, from the installation and positioning of the electronic boards to the layout of the heat dissipation structure. In terms of installation methods, either reinforcing ribs and bosses are used as the installation reference surface, or a specially designed structure with mounting slots and limiting blocks is employed. None of these heat dissipation solutions achieve a harmonious balance between lightweight design, universality, and process feasibility.

[0010] Therefore, this application proposes a heat dissipation structure and design method for an electronic pressure tank of underwater equipment to solve the above problems. Summary of the Invention

[0011] The purpose of this invention is to solve the problems of low heat dissipation efficiency and poor versatility in existing underwater pressure tanks. A brief overview of the invention is provided below to offer a basic understanding of certain aspects of it. It should be understood that this overview is not an exhaustive summary of the invention. It is not intended to identify key or essential parts of the invention, nor is it intended to limit the scope of the invention.

[0012] The technical solution of the present invention:

[0013] Option 1: A heat dissipation structure for an electronic pressure-resistant chamber of underwater equipment, comprising a pressure-bearing end cover and a pressure-bearing shell, wherein pressure-bearing end covers are respectively installed at both ends of the pressure-bearing shell, and the pressure-bearing end covers are sealed to the pressure-bearing shell through end cover rubber rings and fastened with screws, and a flow guide end cover, a first heat dissipation mounting plate and a heat dissipation fan assembly are sequentially assembled along the axial direction inside the pressure-bearing shell;

[0014] The cooling fan assembly includes a fan support plate, a fan connecting bracket, and a fan. The fan is installed inside the annular housing via the fan connecting bracket and the fan support plate. The air outlet side of the fan faces the first heat dissipation mounting plate. A flow-guiding annular groove is provided on the side of the flow-guiding end cover facing the fan. A return air duct is formed between the fan and the annular housing.

[0015] Furthermore, the first heat dissipation mounting plate includes a PCB mounting plate and heat dissipation fins. The PCB mounting plate is used to mount and fix the circuit board. Multiple heat dissipation fins are arranged on the side of the PCB mounting plate away from the circuit board. The end of each heat dissipation fin is connected to the annular shell. Two sets of PCB mounting plates are arranged symmetrically inside the annular shell.

[0016] Furthermore, the first heat dissipation mounting plate is replaced by two sets of second heat dissipation mounting plates, which are arranged perpendicularly to each other. The second heat dissipation mounting plates have the same structure as the first heat dissipation mounting plate, but the length of the second heat dissipation mounting plate is shorter than that of the first heat dissipation mounting plate.

[0017] Furthermore, one side of the flow guide end cap's flange is tightly fitted to one side of the end cap's rubber ring, the other side of the end cap's rubber ring is tightly fitted to the end face of the pressure-bearing end cap, and the other end of the flow guide end cap is tightly fitted to the axial end face of the annular shell of the first heat dissipation mounting plate. Both ends of the annular shell of the cooling fan assembly are equipped with mating rubber rings. One side of the annular shell of the cooling fan assembly is tightly fitted to the annular shell of the first heat dissipation mounting plate through the mating rubber ring, and the other side of the annular shell of the cooling fan assembly is tightly fitted to the pressure-bearing end cap through the mating rubber ring.

[0018] Furthermore, the mating rubber ring has a variable diameter structure with a consistent inner diameter. The two ends of the mating rubber ring are a large outer diameter section and a small outer diameter section, respectively. The small outer diameter section of one mating rubber ring mates with the annular shell of the first heat dissipation mounting plate, and the outer surface of the small outer diameter section is in close contact with the inner surface of the annular shell. The large outer diameter section of the mating rubber ring is in close contact with one end of the annular shell of the cooling fan assembly. The small outer diameter section of the other mating rubber ring mates with the other end of the annular shell of the cooling fan assembly, and the outer surface of the small outer diameter section is in close contact with the inner surface of the annular shell. The large outer diameter section is in close contact with the end face of the pressure-bearing end cover.

[0019] Furthermore, the fan blade diameter is 2 / 3 of the inner diameter of the pressure-bearing housing, and the fan motor is fixed to the fan support plate via a fan connecting bracket.

[0020] Furthermore, a spring cable clamp is connected between the fan support plate and the annular housing, and a water leakage detector is installed inside the annular housing, with the water leakage detector arranged at the bottom of the fan support plate.

[0021] Furthermore, the outer surface of the annular shell is machined with an assembly positioning groove, and the inner surface of the pressure-bearing shell is correspondingly machined with an assembly positioning boss, and the assembly positioning groove and the assembly positioning boss are connected in a mating manner.

[0022] Furthermore, when the annular outer shell is made of aluminum alloy, a boron nitride thermally conductive silicon film is provided between the annular outer shell and the pressure-bearing shell; when the annular outer shell is made of titanium alloy, a graphene thermally conductive film is provided between the annular outer shell and the pressure-bearing shell.

[0023] Option 2: A heat dissipation structure design method for an electronic pressure-resistant compartment of underwater equipment, wherein the method is used for the heat dissipation structure of an electronic pressure-resistant compartment of underwater equipment as described in Option 1, and includes the following design:

[0024] The flow guide end cap design: The cross-sectional profile of the flow guide annular groove inside the flow guide end cap is parabolic, and the equation of the parabola with the vertex of the parabola as the origin is: The center of the flow guide end cover is provided with a circular boss, the diameter of which matches the diameter of the fan spindle;

[0025] The end cap rubber ring is designed as a dimensional compensation component; when the pressure chamber uses the first heat dissipation mounting plate, the assembly dimensions satisfy the formula:

[0026] ;

[0027] in, The length of the pressure shell. The length of the annular outer shell of the first heat dissipation mounting plate. The length of the annular housing of the cooling fan assembly. The flange length of the flow guide end cap. To accommodate the long section of the large diameter rubber ring, The length of the pressure-bearing end cap inside the pressure chamber. This refers to the length of the end cap rubber ring;

[0028] When the pressure chamber uses a second heat dissipation mounting plate, the assembly dimensions satisfy the formula:

[0029] ;

[0030] in, The length of the pressure shell. The length of the annular outer shell of the second heat dissipation mounting plate. The length of the annular housing of the cooling fan assembly. The flange length of the flow guide end cap. To accommodate the long section of the large diameter rubber ring, The length of the pressure-bearing end cap inside the pressure chamber. This refers to the length of the end cap rubber ring;

[0031] Reference values ​​are given during the design phase, and during actual assembly... Based on the actual measurement structure, through or Make corrections, among which To ensure sufficient clearance, The value range is 1mm to 2mm.

[0032] The present invention has the following beneficial effects:

[0033] 1. The present invention provides a heat dissipation structure for an electronic pressure chamber of underwater equipment. It adopts a passive heat diffusion combined with forced convection heat dissipation mode, which is different from the traditional single heat diffusion heat dissipation method. With the flow guide end cap having a flow guide annular groove, a closed-loop circulating airflow is constructed to suppress eddies and alleviate heat radiation accumulation in the sealed chamber. Compared with conventional solid heat dissipation blocks, the heat exchange efficiency is improved by more than 30%, effectively reducing the hot spot temperature of electronic devices.

[0034] 2. The present invention provides a heat dissipation structure design method for an electronic pressure-resistant cabin of underwater equipment. The entire internal components are axially positioned by relying on dimensional chain tolerances. After the pressure-bearing end cap is locked, the internal components can be pressed and locked. There is no need for a large number of scattered fasteners, simplifying the assembly process and reducing the number of parts inside the cabin. With the help of irregularly shaped rubber rings, it is not easy to skewing or falling off during the assembly process. After the assembly is completed, friction restricts the movement of the components, resulting in high assembly reliability.

[0035] 3. A heat dissipation structure for an electronic pressure-resistant chamber of underwater equipment supports flexible assembly of electronic boards of different sizes. Small-sized circuit boards can be arranged with two sets of second heat dissipation mounting plates arranged vertically and staggered, with heat dissipation fins staggered to reduce airflow obstruction and reduce wind field attenuation. It is equipped with a multi-position positioning groove structure to adjust the installation orientation of gravity and magnetic sensitive components such as gyroscopes, and has strong versatility. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of a heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment;

[0037] Figure 2 This is a schematic diagram of the axial explosion of the pressure chamber using the first heat dissipation mounting plate;

[0038] Figure 3 This is a schematic diagram of an axial explosion of a pressure chamber using a second heat dissipation mounting plate.

[0039] Figure 4 This is a schematic diagram of the cooling fan assembly;

[0040] Figure 5 This is the main view of the cooling fan assembly;

[0041] Figure 6 This is a schematic diagram of the first heat sink mounting plate;

[0042] Figure 7 This is the front view of the first heat dissipation mounting plate;

[0043] Figure 8 It is a cross-sectional comparison diagram of the end cap rubber ring and the mating rubber ring;

[0044] Figure 9 This is a schematic diagram of a pressure-bearing shell;

[0045] Figure 10 This is a diagram showing the overall axial dimensions of the pressure tank.

[0046] Figure 11 This is a diagram showing the axial dimensions of the first heat dissipation mounting plate assembly mode;

[0047] Figure 12 This is a diagram showing the axial dimensions of the second heat dissipation mounting plate assembly mode;

[0048] Figure 13 This is a cross-sectional schematic diagram of the flow guide end cap;

[0049] Figure 14 This is a schematic diagram of the simulation results of the heat flux of the heat sink fins;

[0050] Figure 15 This is a schematic diagram of the simulation results of the heat flux of the heat sink.

[0051] In the diagram: 1-Pressure bearing end cap, 2-End cap rubber ring, 3-Flow guide end cap, 4-Cooling fan assembly, 5-Matching rubber ring, 6-First heat dissipation mounting plate, 7-Second heat dissipation mounting plate, 8-Pressure bearing shell, 9-Annular shell, 10-Fan support plate, 11-Fan connecting bracket, 12-Fan, 13-Assembly positioning groove, 14-PCB mounting plate, 15-Heat dissipation fins, 16-Assembly positioning boss, 17-Spring cable clamp, 18-Leakage detector. Detailed Implementation

[0052] To make the objectives, technical solutions, and advantages of this invention clearer, the invention is described below with reference to specific embodiments shown in the accompanying drawings. However, it should be understood that these descriptions are merely exemplary and not intended to limit the scope of the invention. Furthermore, descriptions of well-known structures and technologies are omitted in the following description to avoid unnecessarily obscuring the concept of the invention.

[0053] The connections mentioned in this invention are divided into fixed connections and detachable connections. Fixed connections (i.e., non-detachable connections) include, but are not limited to, conventional fixed connection methods such as folded connections, riveted connections, adhesive connections, and welded connections. Detachable connections include, but are not limited to, conventional disassembly methods such as threaded connections, snap-fit ​​connections, pin connections, and hinged connections. When a specific connection method is not explicitly defined, it is assumed that at least one existing connection method can always be found to achieve the function, and those skilled in the art can choose according to their needs. For example, a welded connection can be chosen for fixed connections, and a hinged connection can be chosen for detachable connections.

[0054] Example 1, combined with Figures 1-9 , Figure 14 and Figure 15 This embodiment describes a heat dissipation structure for an electronic pressure chamber of underwater equipment, including a pressure-bearing end cover 1 and a pressure-bearing shell 8. The pressure-bearing end cover 1 is installed at both ends of the pressure-bearing shell 8. The pressure-bearing end cover 1 is sealed to the pressure-bearing shell 8 by an end cover rubber ring 2 and fastened with screws. Inside the pressure-bearing shell 8, a flow guide end cover 3, a first heat dissipation mounting plate 6 and a heat dissipation fan assembly 4 are sequentially assembled along the axial direction.

[0055] The cooling fan assembly 4 includes a fan support plate 10, a fan connecting bracket 11, and a fan 12. The fan 12 is installed inside the annular housing 9 through the fan connecting bracket 11 and the fan support plate 10. The air outlet side of the fan 12 faces the first heat dissipation mounting plate 6. The air guide end cover 3 has an air guide annular groove on the side facing the fan 12. A return air duct is formed between the fan 12 and the annular housing 9.

[0056] The pressure end cap 1 is installed at both ends of the pressure housing 8. The end faces of the pressure end cap 1 and the pressure housing 8 are mated together, and an O-ring seal is placed between them. The pressure end cap 1 has multiple mounting through holes arranged circumferentially. The end face of the pressure housing 8 has corresponding threaded holes. Multiple bolts are passed through the pressure end cap 1 and screwed into the threaded holes of the pressure housing 8 to achieve a tight connection between the pressure end cap 1 and the end face of the pressure housing 8, and to press the O-ring seal to complete the seal.

[0057] One side of the flange of the flow guide end cap 3 is tightly fitted with the end cap rubber ring 2, and the other side is tightly fitted with one circumferential end face of the annular shell 9 of the first heat dissipation mounting plate 6. The other side of the end cap rubber ring 2 is tightly fitted with the end face of the pressure bearing end cap 1. A mating rubber ring 5 is provided between the first heat dissipation mounting plate 6 and the cooling fan assembly 4. A mating rubber ring 5 is also provided between the other side of the cooling fan assembly 4 and the pressure bearing end cap 1. The mating rubber ring 5 has a variable diameter structure with the same inner diameter, one side being a small outer diameter section and the other side being a large outer diameter section. The small outer diameter section of one of the mating rubber rings 5 ​​mates with the annular shell 9 of the first heat dissipation mounting plate 6, and the outer surface of the small outer diameter section is tightly fitted with the inner surface of the annular shell 9. The large outer diameter section of the mating rubber ring 5 mates with one end of the annular shell 9 of the cooling fan assembly 4. The smaller outer diameter section of the mating rubber ring 5 fits tightly against the other end of the annular housing 9 of the cooling fan assembly 4. The outer surface of the smaller outer diameter section fits tightly against the inner surface of the annular housing 9, while the larger outer diameter section fits tightly against the end face of the pressure-bearing end cover 1. During assembly, the smaller outer diameter section of the mating rubber ring 5 is nested with the adjacent annular housing 9. The orientation of the nesting is adjusted according to the actual assembly sequence to ensure that the direction of pushing the component into the assembly always corresponds to the larger outer diameter end of the mating rubber ring 5. This effectively prevents the mating rubber ring 5 from shifting, tilting, or falling off during assembly. After assembly and tightening, the contact friction resistance between the metal annular housing 9 and the mating rubber ring 5 further restricts the relative movement of each annular housing 9 component in the axial and radial directions, improving the overall assembly fit and structural stability.

[0058] The flow-guiding annular groove on the flow-guiding end cap 3 has a parabolic cross-sectional profile. The equation of the parabola with its vertex as the origin is: The diameter of the central circular planar boss is equal to the diameter of the fan blade main shaft of 12. The guide end cover 3 is made of engineering plastic additive manufacturing.

[0059] The maximum diameter of the fan blades of the fan 12 is 2 / 3 of the inner diameter of the pressure shell 8. The rotating motor of the fan 12 is fixed to the fan support plate 10 through the fan connecting bracket 11. The fan support plate 10 is fixedly connected to the annular shell 9.

[0060] The first heat dissipation mounting plate 6 includes a PCB mounting plate 14 and heat dissipation fins 15. The PCB mounting plate 14 is used to mount and fix the circuit board. Multiple heat dissipation fins 15 are arranged on the side of the PCB mounting plate 14 away from the circuit board. The ends of the heat dissipation fins 15 are fixedly connected to the annular shell 9. Two sets of PCB mounting plates 14 are symmetrically arranged inside the annular shell 9.

[0061] An assembly positioning boss 16 is installed on the inner wall of the pressure-bearing housing 8. The annular outer shell 9 of the first heat dissipation mounting plate 6 and the cooling fan assembly 4 are correspondingly machined with assembly positioning grooves 13. The annular outer shell 9 is connected to the pressure-bearing housing 8 through the mating connection between the assembly positioning grooves 13 and the assembly positioning bosses 16. The length of the pressure-bearing housing 8 is equal to the sum of the lengths of the cooling fan assembly 3, the first heat dissipation mounting plate 6, and the mating rubber ring 5. The total axial length of the annular outer shell 9 is calculated and matched using a dimensional chain, ensuring that after the pressure-bearing end cap 1 and the pressure-bearing housing 8 are fastened with screws, the internal components are axially pressed and locked, achieving reliable axial positioning and assembly fixation without the need for additional fasteners.

[0062] This embodiment adopts a composite heat dissipation method that combines passive heat diffusion and active forced convection heat dissipation. The heat diffusion path is that the heat-generating circuit board is fixed on the PCB mounting plate 14 inside the first heat dissipation mounting plate 6. The heat is transferred sequentially through the PCB mounting plate 14 and the heat dissipation fins 15 to the annular outer shell 9 that is close to the inner wall of the pressure chamber, and then to the pressure-bearing shell 8. The heat is diffused to the external seawater by the pressure-bearing shell 8. The heat convection path is the heat dissipation fan assembly 4 installed in the chamber. The airflow generated by the fan 12 blows directly onto the first heat dissipation mounting plate 6. Through the parabolic guide groove on the guide end cover 3, the cavity reserved between the fan 12 and the annular outer shell 9 serves as a return air duct, which together constructs a stable closed-loop circulating flow field and weakens the heat accumulation caused by mutual heat radiation between components.

[0063] For smaller electronic circuit boards, the first heat dissipation mounting plate 6 is replaced with two shorter second heat dissipation mounting plates 7. The first heat dissipation mounting plate 6 and the second heat dissipation mounting plate 7 have the same structure and are connected to other components in the same way. The only difference is that the length of the second heat dissipation mounting plate 7 is shorter than that of the first heat dissipation mounting plate 6. The two second heat dissipation mounting plates 7 are arranged perpendicularly to each other, so that the two sets of heat dissipation fins 15 in the two second heat dissipation mounting plates 7 are arranged vertically and staggeredly. This avoids the heat dissipation fins 15 forming a continuous shielding barrier in the direction of airflow, reduces the obstruction effect of the structure on the circulating air field, reduces the attenuation of the air field intensity, and enhances the forced convection heat dissipation effect.

[0064] Compared to conventional heat sink structures, the overall heat dissipation architecture of this embodiment offers significant advantages in heat exchange performance. For example... Figure 14 and Figure 15 Simulation results of heat flux show that the heat flux of the composite heat dissipation structure is mainly concentrated at 25000 W / m. 2 ~38000W / m 2 Within the specified range; relying solely on the solid heat sink structure for heat conduction, the heat flux is concentrated at 18000 W / m. 2 ~28000W / m 2In this range, the heat dissipation structure of this embodiment improves the heat dissipation effect by more than 30%. For heat dissipation blocks that have undergone weight reduction and opening treatment, their heat conduction and heat exchange capabilities will further decrease, and the gap with the heat dissipation performance of this embodiment will further widen.

[0065] Example 2, combined with Figures 1-9 This embodiment describes a heat dissipation structure for an electronic pressure chamber in underwater equipment. Considering the inevitable salt spray infiltration in seawater environments, and to address the issue of electrolytic corrosion, an insulating thermally conductive film is used between all annular outer shells 9 and the pressure-bearing shell 8. The material of the insulating thermally conductive film is determined by the material of the annular outer shell 9. If the annular outer shell 9 is made of aluminum alloy, a boron nitride thermally conductive silicon film is selected. This film has high thermal conductivity and extremely low electrical conductivity, effectively isolating the aluminum material of the annular outer shell 9 from the outer alloy of the pressure-bearing shell 8, thus preventing an electrolytic circuit. Combined with the anodizing treatment of the aluminum material, this avoids electrolytic corrosion of the aluminum and oxidation corrosion of the titanium alloy. If the annular outer shell 9 is made of titanium alloy, a graphene thermally conductive film is selected. Graphene has excellent planar thermal conductivity, allowing for rapid and uniform heat conduction to the entire annular outer shell 9 and the inner wall of the pressure-bearing shell 8, thereby increasing heat conduction efficiency. Simultaneously, the smooth surface of the insulating thermally conductive film facilitates alignment and fixation during assembly.

[0066] The cooling fan assembly 4 is also equipped with a water leakage detector 18. The two side plates of the water leakage detector 18 are fastened to the fan support plate 10 by screws, which is used to detect water leakage in the pressure chamber.

[0067] Spring cable clamps 17 are provided on both sides of the fan support plate 10 of the cooling fan assembly 4. The rotating shaft of the spring cable clamp 17 is fixedly installed on the fan support plate 10. Springs are arranged on both sides of the clamp plate. One end of the spring is connected to the clamp plate and the other end is fixed to both ends of the rotating shaft to clamp and fix the electronic board cables and watertight connectors. The elastic clamping force generated by the spring cable clamp 17 constrains the cable harness in the compartment and prevents the cables from shaking when the equipment is running.

[0068] The PCB mounting plate 14 has threaded holes at its four corners for mounting and fixing the hexagonal pillars of the multi-layer electronic board, thus realizing the layered and overhead installation of the multi-layer electronic board.

[0069] Example 3, combined with Figures 1-15 This embodiment describes a heat dissipation structure design method for an electronic pressure tank of underwater equipment, including the following design:

[0070] Design of the flow guide end cap 3: The cross-sectional profile of the flow guide annular groove inside the flow guide end cap 3 is parabolic, and the equation of the parabola with the vertex of the parabola as the origin is: The center of the flow guide end cover 3 is provided with a circular boss, the diameter of which matches the diameter of the fan 12 main shaft;

[0071] The end cap rubber ring 2 is designed as a size compensation component; when the pressure chamber uses the first heat dissipation mounting plate 6, the assembly dimensions satisfy the formula:

[0072] ;

[0073] in, The length of the pressure-bearing shell is 8. The length of the annular outer shell 9 of the first heat dissipation mounting plate 6 is given. The length of the annular housing 9 of the cooling fan assembly 4 is... The flange length of the flow guide end cap 3, To accommodate the long section of the large diameter segment of rubber ring 5 The length of the pressure-bearing end cap 1 within the pressure chamber. The length of the end cap rubber ring 2;

[0074] When the pressure chamber uses the second heat dissipation mounting plate 7, the assembly dimensions satisfy the formula:

[0075] ;

[0076] in, The length of the pressure-bearing shell is 8. The length of the annular outer shell 9 of the second heat dissipation mounting plate 7. The length of the annular housing 9 of the cooling fan assembly 4 is... The flange length of the flow guide end cap 3, To accommodate the long section of the large diameter segment of rubber ring 5 The length of the pressure-bearing end cap 1 within the pressure chamber. The length of the end cap rubber ring 2;

[0077] Reference values ​​are given during the design phase, and during actual assembly... Based on the actual measurement structure, through or Make corrections, among which To ensure sufficient clearance, The value range is 1mm to 2mm.

[0078] The annular outer shell 9 of the first heat dissipation mounting plate 6 is attached to the inner wall of the pressure-bearing shell 8, which expands the effective heat dissipation area and improves the passive heat dissipation efficiency through heat diffusion. The circuit board is fixed on the PCB mounting plate 14 of the first heat dissipation mounting plate 6 or the second heat dissipation mounting plate 7. Heat is conducted through the PCB mounting plate 14 to several heat dissipation fins 15 on the side away from the circuit board, and then through the ends of the heat dissipation fins 15 to the annular outer shell 9. Finally, it is conducted outward through the pressure-resistant shell in the form of heat diffusion through the thermally conductive diaphragm and the pressure-bearing shell 8, thus completing the passive heat dissipation path.

[0079] To address the issues of lack of natural convection heat exchange conditions inside the pressure chamber, and the potential for localized heat retention, excessively high hot spot temperatures, and uneven heat distribution due to spatial thermal radiation heat exchange between electronic circuit boards and heat dissipation fins 15, the cooling fan assembly 4 directs airflow towards the first heat dissipation mounting plate 6 or the second heat dissipation mounting plate 7. This constructs an active convection heat exchange channel within the sealed chamber using forced airflow, effectively reducing the heat superposition effect caused by mutual thermal radiation between components and accelerating the transfer of heat from the surface of each heat-generating component to the flowing air inside the chamber.

[0080] To ensure a continuous and unobstructed thermal circulation flow within the pressure chamber and reduce airflow obstruction and eddy current losses, a guide end cap 3 is installed on the side opposite to the cooling fan assembly 4. Its internal guide groove features a parabolic contour, with the contour curve conforming to the flow channel characteristics of airflow rotation, guiding the airflow to a smooth direction and reducing flow separation, eddies, and pressure losses during the airflow turning process. Simultaneously, the cavity formed between the fan support plate 10 and the annular outer shell 9 serves as an independent return air duct, creating a complete airflow circulation path. Through a design that matches the external dimensions and output airflow parameters of the cooling fan assembly, a continuous, orderly, and stable closed-loop circulation flow field is formed within the pressure chamber, further improving the heat exchange uniformity and heat dissipation efficiency of the active cooling system.

[0081] The annular outer shell 9 serves a dual function of heat diffusion and conduction, as well as structural reinforcement. From a pressure-bearing mechanical perspective, the annular outer shell 9, continuously and tightly fitted to the inner wall of the pressure chamber, can be mechanically equivalent to locally thickening the effective wall thickness of the pressure-bearing shell 8. The fan support plate 10 is equivalent to an embedded circumferential reinforcing rib inside the pressure chamber, applying continuous circumferential constraint to the cylindrical pressure-bearing shell along the circumferential direction, limiting the circumferential expansion deformation of the chamber wall under pressure. Simultaneously, the heat dissipation fins 15 and the PCB heat sink 14 are interconnected and combined to form a rigid support frame, constituting a plate-type rigid load-bearing structure capable of withstanding planar orthogonal pressure, collaboratively sharing the load when the chamber is subjected to external hydrostatic pressure. The vertically arranged two-section second heat dissipation mounting plate 7, in conjunction with the internal heat dissipation fins 15, achieves omnidirectional elastic constraint, avoiding stress concentration. The entire set of internal rigid components are coupled together, jointly constraining the radial contraction deformation of the pressure-bearing shell, thereby improving the cylindrical shell's resistance to instability and the overall structural load-bearing margin.

[0082] The outer diameter of the flanges of the end cap rubber ring 2 and the flow guide end cap 3 is the same as the inner diameter of the pressure tank 8. When assembled and tightened, the end cap rubber ring fits tightly against the inner wall of the pressure tank 8 and cooperates with the sealing structure at the pressure end cap position to form a double sealing structure, thereby improving the watertight reliability of the pressure tank.

[0083] This embodiment is merely an exemplary illustration of the present invention and does not limit its scope of protection. Those skilled in the art can make partial changes to it, as long as they do not exceed the spirit and essence of the present invention, they are all within the scope of protection of the present invention.

Claims

1. A heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment, characterized in that: It includes a pressure-bearing end cap (1) and a pressure-bearing housing (8). The pressure-bearing end cap (1) is installed at both ends of the pressure-bearing housing (8). The pressure-bearing end cap (1) is sealed to the pressure-bearing housing (8) through the end cap rubber ring (2) and fastened with screws. The pressure-bearing housing (8) is equipped with a flow guide end cap (3), a first heat dissipation mounting plate (6) and a heat dissipation fan assembly (4) in sequence along the axial direction. The cooling fan assembly (4) includes a fan support plate (10), a fan connecting bracket (11) and a fan (12). The fan (12) is installed in the annular shell (9) through the fan connecting bracket (11) and the fan support plate (10). The air outlet side of the fan (12) faces the first heat dissipation mounting plate (6). The flow guide end cover (3) has a flow guide annular groove on the side facing the fan (12). A return air channel is formed between the fan (12) and the annular shell (9).

2. The heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment according to claim 1, characterized in that: The first heat dissipation mounting plate (6) includes a PCB mounting plate (14) and heat dissipation fins (15). The PCB mounting plate (14) is used to mount and fix the circuit board. Multiple heat dissipation fins (15) are arranged on the side of the PCB mounting plate (14) away from the circuit board. The end of each heat dissipation fin (15) is connected to the annular shell (9). Two sets of PCB mounting plates (14) are arranged inside the annular shell (9). The two sets of PCB mounting plates (14) are symmetrically arranged inside the annular shell (9).

3. A heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment according to claim 2, characterized in that: The first heat dissipation mounting plate (6) is replaced by two sets of second heat dissipation mounting plates (7). The two sets of second heat dissipation mounting plates (7) are arranged perpendicularly to each other. The second heat dissipation mounting plates (7) have the same structure as the first heat dissipation mounting plate (6), and the length of the second heat dissipation mounting plate (7) is less than that of the first heat dissipation mounting plate.

4. A heat dissipation structure for an electronic pressure-resistant chamber of underwater equipment according to claim 3, characterized in that: The flange side of the flow guide end cap (3) is tightly fitted to the end cap rubber ring (2) side, the other side of the end cap rubber ring (2) is tightly fitted to the end face of the pressure bearing end cap (1), and the other end of the flow guide end cap (3) is tightly fitted to the axial end face of the annular shell (9) of the first heat dissipation mounting plate (6). Both ends of the annular shell (9) of the cooling fan assembly (4) are fitted with mating rubber rings (5). One side of the annular shell (9) of the cooling fan assembly (4) is tightly fitted to the annular shell (9) of the first heat dissipation mounting plate (6) through the mating rubber ring (5), and the other side of the annular shell (9) of the cooling fan assembly (4) is tightly fitted to the pressure bearing end cap (1) through the mating rubber ring (5).

5. A heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment according to claim 4, characterized in that: The mating rubber ring (5) is a variable diameter structure. The inner diameter of the mating rubber ring (5) is the same. The two ends of the mating rubber ring (5) are a large outer diameter section and a small outer diameter section, respectively. The small outer diameter section of one of the mating rubber rings (5) mates with the annular shell (9) of the first heat dissipation mounting plate (6). The outer surface of the small outer diameter section is tightly fitted with the inner surface of the annular shell (9). The large outer diameter section of the mating rubber ring (5) is tightly fitted with one end of the annular shell (9) of the heat dissipation fan assembly (4). The small outer diameter section of the other mating rubber ring (5) mates with the other end of the annular shell (9) of the heat dissipation fan assembly (4). The outer surface of the small outer diameter section is tightly fitted with the inner surface of the annular shell (9). The large outer diameter section is tightly fitted with the end face of the pressure-bearing end cover (1).

6. A heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment according to claim 5, characterized in that: The diameter of the fan blades of the fan (12) is 2 / 3 of the inner diameter of the pressure shell (8), and the motor of the fan (12) is fixed on the fan support plate (10) through the fan connecting bracket (11).

7. A heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment according to claim 6, characterized in that: A spring cable clamp (17) is connected between the fan support plate (10) and the annular shell (9). A water leakage detector (18) is installed inside the annular shell (9) and is located at the bottom of the fan support plate (10).

8. A heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment according to claim 7, characterized in that: The outer surface of the annular shell (9) is machined with an assembly positioning groove (13), and the inner surface of the pressure-bearing shell (8) is correspondingly machined with an assembly positioning boss (16). The assembly positioning groove (13) and the assembly positioning boss (16) are connected in a cooperative manner.

9. A heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment according to claim 8, characterized in that: When the material of the annular shell (9) is aluminum alloy, there is a boron nitride thermally conductive silicon film between the annular shell (9) and the pressure-bearing shell (8). When the material of the annular shell (9) is titanium alloy, there is a graphene thermally conductive film between the annular shell (9) and the pressure-bearing shell (8).

10. A method for designing a heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment, the method being used to design the heat dissipation structure for an electronic pressure-resistant compartment of underwater equipment as described in claim 9, characterized in that, Includes the following designs: Design of the flow guide end cap (3): The cross-sectional profile of the flow guide annular groove inside the flow guide end cap (3) is parabolic, and the equation of the parabola with the vertex of the parabola as the origin is: The center of the flow guide end cover (3) is provided with a circular boss, the diameter of which matches the diameter of the fan (12) main shaft; Size design of end cap rubber ring (2): The end cap rubber ring (2) is set as a size compensation part; when the pressure chamber uses the first heat dissipation mounting plate (6), the assembly size satisfies the formula: ； in, The length of the pressure-bearing shell (8) The length of the annular outer shell (9) of the first heat dissipation mounting plate (6) is given. The length of the annular housing (9) of the cooling fan assembly (4) is given. The flange length of the guide end cap (3) is... To accommodate the large diameter section length of the rubber ring (5), The length of the pressure-bearing end cap (1) inside the pressure chamber. The length of the end cap rubber ring (2); When the pressure chamber uses the second heat dissipation mounting plate (7), the assembly dimensions satisfy the formula: ； in, The length of the pressure-bearing shell (8) The length of the annular outer shell (9) of the second heat dissipation mounting plate (7) is given. The length of the annular housing (9) of the cooling fan assembly (4) is given. The flange length of the guide end cap (3) is... To accommodate the large diameter section length of the rubber ring (5), The length of the pressure-bearing end cap (1) inside the pressure chamber. The length of the end cap rubber ring (2); Reference values ​​are given during the design phase, and during actual assembly... Based on the actual measurement structure, through or Make corrections, among which To ensure sufficient clearance, The value range is 1mm to 2mm.

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