Display device and shielding film thereof

Abstract

The present disclosure relates to the technical field of shielding film, and particularly relates to a display device and a shielding film thereof; the shielding film has a non-bonding area and a bonding area, and the bonding area surrounds the non-bonding area; in the bonding area, the shielding film comprises a first insulating film, a first conductive layer, a first metal layer and a conductive bonding layer; on at least one side of the non-bonding area, the bonding area has a stretching sub-area, in the stretching sub-area, the first metal layer has at least two first metal structures which are independently arranged, each first metal structure is arranged along the arrangement direction of the bonding area and the non-bonding area in sequence, and one of the first metal structures is connected with the non-bonding area; the shielding film has a stretched state and a non-stretched state; in the non-stretched state, any two adjacent first metal structures are attached; in the stretched state, any two adjacent first metal structures have a gap therebetween, and part of the first conductive layer is clamped in the gap. The scheme can effectively improve the problems of the shielding film attachment hollow and pressing abnormal sound.

Description

Technical Field

[0001] This disclosure relates to the field of shielding film technology, and more specifically, to a display device and its shielding film. Background Technology

[0002] In related technologies, the shielding film has an adhesive area and a non-adhesive area. The non-adhesive area covers the various electronic components on the drive circuit board, while the adhesive area is used to fix the drive circuit board and the display panel.

[0003] Because of the height difference between the adhesive area and the non-adhesive area on electronic components, the side of the adhesive area closer to the non-adhesive area is subjected to an upward pulling force, which can easily cause the adhesive area to separate from the drive circuit board and also produce abnormal noise.

[0004] It should be noted that the information disclosed in the background section above is only used to enhance the understanding of the background of this disclosure, and therefore may include information that does not constitute prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this disclosure is to overcome the shortcomings of the prior art and provide a display device and its shielding film, which can improve the connection stability between the shielding film and the display panel and effectively improve the problems of hollow adhesion and abnormal noise when pressing the shielding film.

[0006] According to one aspect of this disclosure, a shielding film is provided having a non-adhesive region and an adhesive region, the adhesive region surrounding the non-adhesive region; In the bonding area, the shielding film includes a first insulating film, a first conductive layer, a first metal layer and a conductive adhesive layer stacked sequentially. On at least one side of the non-adhesive region, the adhesive region has a stretching sub-region. In the stretching sub-region, the first metal layer has at least two independently disposed first metal structures. Each of the first metal structures is disposed sequentially along the arrangement direction of the adhesive region and the non-adhesive region, and one of the first metal structures is connected to the non-adhesive region. The shielding film has a stretched state and a non-stretched state; in the non-stretched state, any two adjacent first metal structures are bonded together; in the stretched state, there is a gap between any two adjacent first metal structures, and a portion of the first conductive layer is sandwiched in the gap.

[0007] In one embodiment of this disclosure, the first conductive layer includes a shear-thinning non-Newtonian fluid and a conductive filler, wherein the conductive filler is uniformly distributed in the shear-thinning non-Newtonian fluid.

[0008] In one embodiment of this disclosure, in the non-adhesive area, the shielding film includes a second insulating film, a second conductive layer, and a second metal layer stacked sequentially. The second insulating film is integrally disposed with the first insulating film, the second conductive layer is integrally disposed with the first conductive layer, and the second metal layer is integrally disposed with one of the first metal structures; In the stretched state, the first conductive layer located in the stretched sub-region has a flat region and a protruding region, the protruding region being located between two adjacent first metal structures; in the protruding region, the first conductive layer has a first thickness, and in the flat region, the first conductive layer has a second thickness; the second conductive layer has a third thickness, the second thickness being less than the third thickness, and the first thickness being greater than the third thickness.

[0009] In one embodiment of this disclosure, the first conductive layer includes a conductive adhesive and a conductive filler, wherein the conductive filler is uniformly distributed in the conductive adhesive.

[0010] In one embodiment of this disclosure, in the non-adhesive area, the shielding film includes a second insulating film, a second conductive layer, and a second metal layer stacked sequentially. The second insulating film is integrally disposed with the first insulating film, the second conductive layer is integrally disposed with the first conductive layer, and the second metal layer is integrally disposed with one of the first metal structures; In the non-stretched state, the first conductive layer located in the stretched sub-region has a fourth thickness, and the second conductive layer has a third thickness, wherein the fourth thickness is greater than the third thickness.

[0011] In one embodiment of this disclosure, the conductive filler includes at least one of conductive fibers and conductive particle spheres.

[0012] In one embodiment of this disclosure, in any two adjacent first metal structures, one has a groove and the other has a protrusion adapted to the groove; In the non-stretched state, the protrusion is fully embedded in the groove; in the stretched state, the gap is formed between the protrusion and the groove.

[0013] In one embodiment of this disclosure, each of the first metal structures is annular, and each of the first metal structures is disposed around the non-adhesive area.

[0014] In one embodiment of this disclosure, the number of stretching sub-regions is multiple; Each of the stretching sub-regions is arranged along the circumferential direction of the non-bonded region; In the non-stretched state, in each of the stretched sub-regions, two adjacent first metal structures are bonded together; in the stretched state, in each of the stretched sub-regions, a portion of the first conductive layer is sandwiched between two adjacent first metal structures.

[0015] According to another aspect of this disclosure, a display device is provided, comprising: Display panel; A driving circuit board is electrically connected to the display panel and is located on the backlight side of the display panel. The driving circuit board has a device setting area and a grounded exposed copper area located on one side of the device setting area. The aforementioned shielding film is disposed on the side of the driving circuit board away from the display panel; the non-adhesive area covers the device placement area, and the shielding film is adhered to the driving circuit board and the display panel through the adhesive area; the orthographic projection of the stretched sub-area on the display panel and the orthographic projection of the grounded exposed copper area on the display panel at least partially overlap.

[0016] The beneficial effects of this disclosure include: In this disclosure, a stretching sub-region is provided in the adhesive region adjacent to the non-adhesive region. The stretching sub-region is defined to have multiple independent first metal structures, and each first metal structure is defined to be arranged sequentially along the arrangement direction of the adhesive region and the non-adhesive region. Combined with the provision of a first conductive layer, this allows the shielding film to have both a non-stretched state and a stretched state (in the stretched state, the shielding film has a certain amount of redundant movement space). When the shielding film is bonded, the stretching sub-region is subjected to external force and can transition from the non-stretched state to the stretched state. Utilizing the gap between two adjacent first metal structures in the stretched state, the first conductive layer fills the gap, achieving localized stretching of the shielding film. This allows the stretching sub-region to stably connect with the corresponding bonding areas of the driving circuit board, back film layer, flexible circuit board, and display panel, effectively improving the problems of hollow areas and abnormal noises when pressing the shielding film. Furthermore, in the stretched state, part of the first conductive layer is clamped between two adjacent first metal structures, ensuring the continuity of electrical connection while the shielding film remains stretched.

[0017] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0019] Figure 1 This is a schematic diagram of the structure of the display panel and the driving circuit board in one embodiment of the present disclosure.

[0020] Figure 2 This is a schematic diagram of the structure of the shielding film in one embodiment of the present disclosure.

[0021] Figure 3 This is a schematic diagram of the structure of a display device in one embodiment of the present disclosure.

[0022] Figure 4 This is a partial structural schematic diagram of a display device in one embodiment of the present disclosure.

[0023] Figure 5 for Figure 4 A partial structural diagram of the shielding membrane at point A.

[0024] Figure 6 This is a schematic diagram of the structure of the first metal layer of the stretching sub-region before and after stretching in one embodiment of this disclosure.

[0025] Figure 7 This is a schematic diagram of the structure of the first insulating film and the first conductive layer of the stretched sub-region before and after stretching in one embodiment of this disclosure.

[0026] Figure 8 This is a schematic diagram of the structure of the shielding membrane in the stretching sub-region before and after stretching in one embodiment of this disclosure.

[0027] Figure 9 This is a schematic diagram of the structure of the shielding membrane in the stretching sub-region before and after stretching in one embodiment of this disclosure.

[0028] Figure 10 This is a partial structural diagram of the shielding film before stretching in one embodiment of the present disclosure.

[0029] Figure 11 This is a schematic diagram of a partial structure of the shielding film after stretching, according to one embodiment of the present disclosure.

[0030] Figure 12 This is a top view of the first metal layer in a stretched state, according to one embodiment of the present disclosure.

[0031] Figure 13This is a top view of the first metal layer in a stretched state, according to one embodiment of the present disclosure.

[0032] Figure 14 This is a top view of the first metal layer in a stretched state, according to one embodiment of the present disclosure.

[0033] Figure 15 This is a partial structural diagram of the display device in a second embodiment of the present disclosure.

[0034] Figure 16 This is a partial structural schematic diagram of the display device according to a third embodiment of the present disclosure.

[0035] Explanation of reference numerals in the attached figures: SUF, backsheet layer; GB, cover plate layer; BA, adhesive area; NAA, non-adhesive area; PCB, driver circuit board; FPC, flexible circuit board; PNL, display panel; SF, shielding film; EC, electronic components; QJ, device placement area; JY1, first insulating film; DDL1, first conductive layer; FMAL1, first metal layer; CAL, conductive adhesive layer; HH, shear-thinning non-Newtonian fluid; DX, conductive fiber; DL, conductive particle sphere; C1, groove; C2, protrusion; JY2, second insulating film; DDL2, second conductive layer; FMAL2, second metal layer; LS, stretched sub-area; FMS3, third metal structure; H1, first thickness; H2, second thickness; H3, third thickness; H4, fourth thickness; FMS1, first metal structure; GCA, grounded exposed copper area; AL, adhesive structure; XK, suspended area. Detailed Implementation

[0036] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and therefore detailed descriptions of them will be omitted. Furthermore, the drawings are merely illustrative of this disclosure and are not necessarily drawn to scale.

[0037] Although relative terms such as "up" and "down" are used in this specification to describe the relative relationship of one component of an icon to another, these terms are used only for convenience, such as according to the orientation of the examples shown in the accompanying drawings. It is understood that if the device of the icon is flipped upside down, the component described as "up" will become the component described as "down." When a structure is "up" of another structure, it may mean that the structure is integrally formed on the other structure, or that the structure is "directly" mounted on the other structure, or that the structure is "indirectly" mounted on the other structure through another structure.

[0038] The terms “a,” “one,” “the,” and “the” are used to indicate the existence of one or more elements / components / etc.; the terms “including” and “having” are used to indicate an open-ended inclusion and to mean that there may be other elements / components / etc. in addition to the listed elements / components / etc.; the terms “first,” “second,” and “third,” etc., are used only as markers and are not a limitation on the number of objects.

[0039] The shear-thinning non-Newtonian fluids in this disclosure refer to non-Newtonian fluids whose viscosity decreases under certain shear conditions.

[0040] This disclosure provides a display device, see [link to relevant documentation] Figure 1 It includes a display panel PNL and a driver circuit board PCB, wherein the driver circuit board PCB is electrically connected to the display panel PNL and is located on the backlight side of the display panel PNL.

[0041] In one embodiment of this disclosure, the display panel PNL is a flexible display panel. The display panel PNL includes a display area and a peripheral area. At least one side of the peripheral area includes a bending area and a bonding area. The bending area is adjacent to the display area, and the bonding area is located on the side of the bending area away from the display area. After bending, the bonding area is located on the backlight side of the display panel PNL, and a display driver chip is bonded to the bonding area.

[0042] In this embodiment, see Figure 1 The drive circuit board (PCB) is bonded to the bonding area via a flexible printed circuit board (FPC). See also... Figure 4The driver circuit board (PCB) includes a device placement area (QJ) and a grounding exposed copper area (GCA) located on one side of the device placement area (QJ). Within the device placement area (QJ), the driver circuit board (PCB) houses electronic components such as timing controllers and memory, and also includes a connection interface for connecting to a host computer. The grounding exposed copper area (GCA) provides electrical connections, reduces ground loop impedance, improves signal integrity, reduces electromagnetic interference, provides signal loop paths, and optimizes high-frequency performance. Of course, other electronic components (EC) not shown may also be placed on the driver circuit board (PCB).

[0043] In this embodiment, the display panel PNL includes a substrate and a driving layer, a pixel layer, and an encapsulation layer (not shown in the figure) sequentially disposed on the substrate.

[0044] The substrate is generally formed of a flexible and bendable material, such as polyimide (PI). Specifically, the substrate can be composed of two polyimide layers and an inorganic thin film layer in the middle, or it can be a single polyimide layer or multiple polyimide layers. This disclosure does not limit the choice of substrate.

[0045] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 1 and Figure 3 The display device also includes a polarizer layer and a cover layer GB, which are sequentially stacked on the light-emitting side of the display panel PNL. The polarizer eliminates screen reflections, improves contrast, enhances display quality and efficiency, and protects the display panel PNL. The cover layer GB is the outermost layer of the display device and can be transparent glass, protecting the display device and providing scratch resistance.

[0046] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 1 and Figure 3 The display device also includes a back film layer SUF disposed on the backlight side of the display panel PNL, and the driving circuit board PCB is located on the side of the back film layer SUF away from the display panel PNL.

[0047] In this embodiment, see Figure 2 and Figure 3 The display device also includes a shielding film SF, which is located on the side of the driver circuit board (PCB) away from the display panel PNL. The shielding film SF serves two purposes: first, it protects the various electronic components (ECs, such as timing controllers and memory devices) on the driver circuit board (PCB); second, it connects to the exposed copper grounding area (GCA) of the driver circuit board (PCB), providing a grounding path, dissipating electrostatic surges, filtering electromagnetic interference, and also assisting in heat dissipation and fixing the driver circuit board (PCB), thereby improving the operational stability and anti-interference capability of the display device.

[0048] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 3 The orthographic projection of the shielding film SF on the display panel PNL covers the orthographic projection of the driving circuit board PCB on the display panel PNL, and the orthographic projection of the shielding film SF on the display panel PNL is larger than the orthographic projection of the driving circuit board PCB on the display panel PNL. In this way, a stable connection between the driving circuit board PCB and the display panel PNL can be guaranteed.

[0049] In one example, see Figure 3 The orthographic projection of the shielding film SF on the display panel PNL also covers the orthographic projection of the flexible circuit board FPC on the display panel PNL. Furthermore, the orthographic projection of the shielding film SF on the display panel PNL is greater than the sum of the orthographic projections of the driving circuit board PCB on the display panel PNL and the orthographic projections of the flexible circuit board FPC on the display panel PNL. In this way, a stable connection between the driving circuit board PCB and the display panel PNL can be further guaranteed.

[0050] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 2 and Figure 3 The shielding film SF has an adhesive area BA and a non-adhesive area NAA. In one example, the adhesive area BA surrounds the non-adhesive area NAA, and the non-adhesive area NAA at least covers the device placement area QJ. It is understood that the orthographic projection of the non-adhesive area NAA onto the display panel PNL overlaps the orthographic projection of the device placement area QJ onto the display panel PNL, and the orthographic projection of the non-adhesive area NAA onto the display panel PNL is larger than the orthographic projection of the device placement area QJ onto the display panel PNL. Thus, when adjusting the position after bonding the shielding film SF, the problem of affecting the stability of the electrical connection between the electronic component EC and the driver circuit board PCB caused by the adhesion between the adhesive area BA and the device placement area QJ can be avoided.

[0051] In this embodiment, the bonding area BA is used to fix the driver circuit board PCB to the display panel PNL, and is bonded to at least a portion of the grounded exposed copper area GCA. It is understood that, in order to achieve a stable connection between the driver circuit board PCB and the display panel PNL, the orthographic projection of the shielding film SF on the display panel PNL at least partially overlaps with the bonding area of ​​the display panel PNL (e.g., the orthographic projection of the bonding area BA of the shielding film SF on the display panel PNL at least partially overlaps with the bonding area of ​​the display panel PNL). In other words, the bonding area BA is connected to the bonding area to ensure the stability of the electrical connection between the driver circuit board PCB and the display panel PNL.

[0052] In this disclosure, the shielding film SF is adhered to the surface of the driver circuit board PCB, and the shielding film SF is electrically connected to the grounded exposed copper area GCA of the driver circuit board PCB. On the one hand, it forms an electromagnetic shielding layer, suppressing electromagnetic radiation from the high-speed transmission lines of the driver circuit board PCB and blocking external electromagnetic interference, ensuring stable transmission of image signals of the display device; on the other hand, it can quickly discharge static electricity to protect the various electronic components EC on the driver circuit board PCB, while providing physical protection for the driver circuit board PCB and its surface electronic components EC, improving the operational reliability of the display device.

[0053] In related technologies, because the various electronic components set within the device placement area have a certain height, there is a height difference between the adhesive area and the non-adhesive area (the height of the shielding film in the non-adhesive area is greater than that in the adhesive area, where height refers to the distance between the shielding film and the driving circuit board). At the boundary between the adhesive area and the non-adhesive area, the shielding film is subjected to an upward pulling force (because the non-adhesive area is higher, at the boundary, the non-adhesive area will generate an upward pulling force for the adhesive area), which can easily cause the adhesive area to partially separate from the driving circuit board (e.g., the adhesive area and the exposed copper grounding area), resulting in a hollow shielding film. When external pressure is applied to this area, the shielding film briefly adheres to the corresponding exposed copper grounding area. After the external force is removed, the conductive adhesive separates from the exposed copper grounding area again, producing a sound (the conductive adhesive layer will make an abnormal noise when it detaches from the driving circuit board), affecting the user experience.

[0054] To address the aforementioned issues, this disclosure optimizes the structure of the shielding film SF, enabling it to have tensile properties in at least a portion of the bonding area BA. When the bonding area BA is subjected to an upward pulling force, the tensile properties of this area can be utilized to allow the shielding film SF to form a certain redundant length. This allows the bonding area BA to be stably bonded to structures such as the drive circuit board PCB at that location, ensuring the operational stability and anti-interference capability of the display device.

[0055] In the first embodiment of this disclosure, see [link to relevant documentation]. Figure 10 and Figure 11 In the bonding area BA, the shielding film SF comprises a first insulating film JY1, a first conductive layer DDL1, a first metal layer FMAL1, and a conductive adhesive layer CAL, stacked sequentially. The first insulating film JY1 can serve as a substrate structure. The first insulating film JY1 and the conductive adhesive layer CAL have a certain elastic modulus. Within the elastic deformation limit, when a tensile force is applied to the first insulating film JY1 and the conductive adhesive layer CAL, and the external force is removed, the first insulating film JY1 and the conductive adhesive layer CAL can return to their initial shape.

[0056] In this embodiment, see Figure 10 and Figure 11The bonding region BA has a stretching sub-region LS. In the stretching sub-region LS, the first metal layer FMAL1 has at least two independently arranged first metal structures FMS1. Each first metal structure FMS1 is arranged sequentially along the arrangement direction of the bonding region BA and the non-bonding region NAA, and one of the first metal structures FMS1 is connected to the non-bonding region NAA (which can be understood as, see...). Figure 4 and Figure 10 (The stretched sub-region LS is positioned close to the non-bonded region NAA). In this structure, the shielding film SF has both a stretched state and a non-stretched state; see [link / reference] Figure 8 and Figure 9 In the non-stretched state, any two adjacent first metal structures FMS1 are bonded together; in the stretched state, there is a gap between any two adjacent first metal structures FMS1, and a portion of the first conductive layer DDL1 is sandwiched in the gap.

[0057] In this disclosure, the adhesive region BA has a stretching sub-region LS on the side adjacent to the non-adhesive region NAA, and the stretching sub-region LS is defined to have multiple independent first metal structures FMS1 (here, "independent" means that there is no fixed connection relationship between the various first metal structures FMS1, so that the relative positions between the various first metal structures FMS1 can be changed), and the various first metal structures FMS1 are defined to be arranged sequentially along the arrangement direction of the adhesive region BA and the non-adhesive region NAA. With the setting of the first conductive layer DDL1, the shielding film SF has a non-stretched state and a stretched state (in the stretched state, the shielding film SF has a certain redundant space for movement). During the bonding of the shielding film SF, the stretching sub-region LS is subjected to external force, allowing it to transition from a non-stretched state to a stretched state. Utilizing the gap between adjacent first metal structures FMS1 in the stretched state, the first conductive layer DDL1 fills the gap, achieving localized stretching of the shielding film SF. This ensures a stable connection between the stretching sub-region LS and the bonding areas of the corresponding drive circuit board PCB, back film layer SUF, flexible circuit board FPC, and display panel PNL, effectively improving the issues of blistering and abnormal noise during SF bonding. Furthermore, in the stretched state, a portion of the first conductive layer DDL1 is held between adjacent first metal structures FMS1, maintaining the continuity of electrical connections while the shielding film SF remains stretched.

[0058] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 8 and Figure 9 In the stretching sub-region LS, the number of first metal structures FMS1 can be two, three, four, five, etc. It is understood that the number of first metal structures FMS1 can be set according to requirements, and this disclosure does not limit it.

[0059] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 10 and Figure 11 In the non-adhesive region NAA, the shielding film SF includes a second insulating film JY2, a second conductive layer DDL2, and a second metal layer FMAL2, which are sequentially stacked. In one example, the first insulating film JY1 and the second insulating film JY2 are made of different materials and are connected; the second conductive layer DDL2 is made of different materials and the first conductive layer DDL1 is connected; the second metal layer FMAL2 is made of different materials and is connected to the first metal layer FMAL1. In another example, the first insulating film JY1 and the second insulating film JY2 are made of the same material and are integrally formed; the second conductive layer DDL2 is made of the same material and is integrally formed; and the second metal layer FMAL2 is made of the same material and is integrally formed. This reduces the difficulty and cost of manufacturing the shielding film SF.

[0060] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 10 and Figure 11 The first metal structure FMS1, which is closest to the non-adhesive region NAA, is integrally connected with the second metal layer FMAL2.

[0061] In one embodiment of this disclosure, the first metal structure FMS1 and the second metal layer FMAL2 can be made of materials such as aluminum and copper. In this way, the first metal structure FMS1 has a certain degree of flexibility, which is conducive to realizing the transformation from a non-stretched state to a stretched state.

[0062] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 4 and Figure 12 The stretched sub-region LS and the grounded exposed copper region GCA at least partially overlap. This ensures a stable connection between the shielding film SF and the grounded exposed copper region GCA. It can be understood that the partial overlap of A and B means that the orthographic projection of A onto C and the orthographic projection of B onto C partially coincide.

[0063] In one example, the stretched sub-region LS overlaps with the ground exposed copper region GCA.

[0064] In another example, the stretched sub-region LS completely covers the ground exposed copper region GCA. It is understood that the orthographic projection of the ground exposed copper region GCA onto the display panel PNL lies within the orthographic projection of the stretched sub-region LS onto the display panel PNL. This ensures complete adhesion between the ground exposed copper region GCA and the shielding film SF, guaranteeing the stability of the electrical connection between the ground exposed copper region GCA and the shielding film SF.

[0065] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 6The two adjacent first metal structures FMS1 form an interlocking structure. This serves two purposes: first, it restricts the stretching direction of the shielding film SF, preventing bonding instability caused by stretching displacement, or introducing other external forces that affect the bonding stability into the bonding area BA; second, it creates a gap between the interlocking structures, which helps control the flow range of the first conductive layer DDL1 and ensures the continuity of the electrical connection of the shielding film SF.

[0066] In this embodiment, see Figure 6 In the two adjacent first metal structures FMS1, one has a groove C1 and the other has a protrusion C2 that matches the groove C1. In the non-stretched state, the protrusion C2 is completely embedded in the groove C1. In the stretched state, the two adjacent first metal structures FMS1 can be partially separated under the action of external force to form a gap that accommodates the first conductive layer DDL1 (a gap is formed between the protrusion C2 and the groove C1). Part of the first conductive layer DDL1 fills the gap and is held by the two adjacent first metal structures FMS1 to ensure the continuity of the electrical connection of the shielding film SF.

[0067] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 5 The first conductive layer DDL1 comprises a shear-thinning non-Newtonian fluid HH and a conductive filler, with the conductive filler uniformly distributed within the shear-thinning non-Newtonian fluid HH. In this disclosure, the first conductive layer DDL1 uses the shear-thinning non-Newtonian fluid HH as its base. When subjected to external force, its viscosity decreases and its fluidity increases, allowing the first conductive layer DDL1 to flow into and fill the gap. This ensures that the shielding film SF is under tension while maintaining the conductive continuity of the first metal layer FMAL1, without affecting the overall electromagnetic shielding effect of the shielding film SF.

[0068] In this disclosure, through the cooperation of the first conductive layer DDL1 and each of the first metal structures FMS1 with specific structures, during the bonding process of the shielding film SF, the shear-thinning non-Newtonian fluid HH in the first conductive layer DDL1 becomes thinner and its fluidity increases. The two adjacent first metal structures FMS1 are subjected to tensile external force to form a gap (at this time, the first insulating film is in a stretched state). The thinned shear-thinning non-Newtonian fluid HH carries the conductive filler and fills the gap. The shielding film SF is locally stretched at the height difference position of the electronic components, which can effectively improve the problems of hollow bonding and abnormal noise when pressing the shielding film SF. Furthermore, the conductive filler in the shielding film SF and the conductive adhesive layer CAL form a complete connection, so it will not affect the overall electromagnetic shielding effect of the shielding film SF (does not damage the electromagnetic shielding effect).

[0069] In one embodiment of this disclosure, both the first insulating film JY1 and the conductive adhesive layer CAL of the shielding film SF have a certain elastic deformation space. Therefore, the entire shielding film SF can be stretched in the horizontal direction, and the stretching distance depends on the size of the protrusions and grooves. The number of first metal structures FMS1 can be set to 2 to 5 sets, and the horizontal stretchable length of the shielding film SF can be 1 to 2.5 mm. Of course, the number of first metal structures FMS1 and the stretching length can be determined according to actual needs, and this disclosure does not limit them.

[0070] The shielding film SF in this disclosure, after being stretched along the film material direction, has a certain amount of redundant movement space, which reduces the pulling effect on the conductive adhesive layer CAL caused by the height difference of electronic components, and reduces the phenomenon of direct detachment and separation between the conductive adhesive layer CAL and the ground exposed copper area GCA of the drive circuit board PCB, thereby improving the adhesion of the shielding film SF and the abnormal noise when pressing.

[0071] In this embodiment, see Figure 5 The conductive filler includes at least one of conductive fibers DX and conductive particle spheres DL. For example, the conductive filler is conductive fiber DX, which is uniformly distributed in a shear-thinning non-Newtonian fluid HH. As another example, the conductive filler is conductive particle spheres DL, which are uniformly distributed in a shear-thinning non-Newtonian fluid HH. As yet another example, the conductive filler includes conductive fibers DX and conductive particle spheres DL, which are uniformly distributed in a shear-thinning non-Newtonian fluid HH.

[0072] In this embodiment, see Figure 11 In the stretched state, the first conductive layer DDL1 located in the stretched sub-region LS has a flat region and a protruding region, with the protruding region located between two adjacent first metal structures FMS1; in the protruding region, the first conductive layer DDL1 has a first thickness H1, and in the flat region, the first conductive layer DDL1 has a second thickness H2; the second conductive layer DDL2 has a third thickness H3, and in the stretched state, the second thickness H2 is less than the third thickness H3, and the first thickness H1 is greater than the third thickness H3. In the stretched state, the fluidity of the first conductive layer DDL1 increases, and part of the first conductive layer DDL1 fills the gap between two adjacent first metal structures FMS1, so that the first conductive layer DDL1 in the stretched sub-region LS forms a flat area and a protruding area (the flat area refers to the area between the first metal structure FMS1 and the first insulating film JY1, and the protruding area refers to the area between two first metal structures FMS1). Since part of the first conductive layer DDL1 fills the gap between two adjacent first metal structures FMS1 to form a protruding area, the thickness of the flat area is less than the thickness of the remaining area of ​​the entire shielding film SF (the area other than the stretched sub-region LS, such as the non-adhesive area NAA).

[0073] In this embodiment, a method for preparing a first type of shielding film is provided, comprising: A first conductive layer DDL1 is coated on a first insulating film JY1, and a first metal layer FMAL1 and a conductive adhesive layer CAL are sequentially disposed on the first conductive layer DDL1. The first conductive layer DDL1 comprises a shear-thinning non-Newtonian fluid and a conductive filler.

[0074] In another embodiment of this disclosure, see Figure 10 The first conductive layer DDL1 includes conductive adhesive and conductive filler, with the conductive filler uniformly distributed in the conductive adhesive. In this embodiment, the first conductive layer DDL1 uses conductive adhesive as a base. When subjected to external force, the shielding film SF is in a stretched state, and part of the conductive adhesive can carry the conductive filler to fill the gap between two adjacent first metal structures FMS1, thereby achieving the continuity of the electrical connection of the first conductive layer DDL1.

[0075] In this embodiment, if the first conductive layer DDL1 includes conductive adhesive, then the elastic properties of the first insulating layer need to be better than in an embodiment where the first conductive layer DDL1 includes a shear-thinning non-Newtonian fluid.

[0076] In this embodiment, the conductive filler includes at least one of conductive fibers DX and conductive particle spheres DL. For example, the conductive filler is conductive fiber DX, which is uniformly distributed in the conductive adhesive. As another example, the conductive filler is conductive particle spheres DL, which are uniformly distributed in the conductive adhesive. Yet another example, the conductive filler includes conductive fibers DX and conductive particle spheres DL, which are uniformly distributed in the conductive adhesive.

[0077] In this embodiment, see Figure 10 In the non-stretched state, the first conductive layer DDL1 located in the stretched sub-region LS has a fourth thickness H4, and the second conductive layer DDL2 has a third thickness H3. The fourth thickness H4 is greater than the third thickness H3.

[0078] In this embodiment, the present disclosure also provides a method for preparing a shielding film SF, the method comprising: The first insulating film JY1 is pre-stretched within the elastic modulus range so that the first insulating film JY1 is in a pre-stretched state. See Figure 7 A first conductive layer DDL1 is coated on the first insulating film JY1; Remove the tensile force (slowly release the first insulating film JY1), so that the first insulating film JY1 is in a relaxed state. After the first conductive layer DDL1 gathers together, its thickness increases (the first conductive layer shrinks and is squeezed, and its thickness increases while its volume remains unchanged and its length decreases). The first conductive layer DDL1 includes conductive adhesive and conductive filler. A first metal layer FMAL1 and a conductive adhesive layer CAL are sequentially disposed on the first conductive layer DDL1.

[0079] In this disclosure, when the shielding film SF prepared by the above preparation method is laminated, the shielding film SF is subjected to force, and the first insulating film JY1 in the relaxed state is slightly stretched. The force of the rebound contraction in this state is much smaller than the force of the rebound contraction of the first insulating film JY1 after stretching without pre-stretching. At the same time, the first conductive layer DDL1 in the contracted and squeezed state unfolds and fills the gap formed between the two first metal structures FMS1.

[0080] The shielding film SF prepared by the method disclosed herein can be stretched in the film material direction (e.g., stretched by 1.5-3.5 mm). After the shielding film SF is stretched, it has a smaller shrinkage elastic resistance and a larger stretching space in the film material direction, which further effectively improves the problems of hollow bonding and abnormal noise when pressing the shielding film SF.

[0081] In this disclosure, a first insulating film JY1 in a pre-stretched state is used instead of the first insulating film JY1 in an unstretched state. A first conductive layer DDL1 is prepared on the first insulating film JY1 in the pre-stretched state. After the pre-stretching force is released, the first insulating film JY1 returns to the unstretched state, and the first conductive layer DDL1 shrinks and stacks. When the shielding film SF is in a stretched state, the first conductive layer DDL1 can fill the space between two adjacent first metal structures FMS1. The shielding film SF is locally stretched at the height difference position of the electronic components, which can effectively improve the problems of hollow adhesion and abnormal noise when pressing the shielding film SF, and can ensure the continuity of electrical connection. It also allows the shielding film SF to stretch and elongate more freely, providing more redundant activity space for the stretching of the shielding film.

[0082] In one embodiment of this disclosure, see [link to relevant documentation]. Figure 12 The bonding area BA may have a stretching sub-area LS only on one side of the non-bonding area NAA. In the remaining area of ​​the bonding area BA, the first metal layer FMAL1 has a third metal structure FMS3, which is integrally formed with the first metal structure FMS1 located nearby.

[0083] In one embodiment of this disclosure, the entire bonding region BA can be a stretching sub-region LS.

[0084] In one example, see Figure 13 Each first metal structure FMS1 is a ring structure, and each first metal structure FMS1 is arranged around the non-adhesive region NAA. In this example, when in a stretched state, a portion of the first conductive layer DDL1 is located between adjacent first metal structures FMS1. Thus, the first conductive layer DDL1 can be used as a support to resist the retraction force of the first metal structures FMS1, so that each first metal structure FMS1 is always in a stretched state.

[0085] In another example, see Figure 14 The structure comprises multiple stretchable sub-regions LS, each arranged along the circumferential direction of the non-adhesive region NAA. In the non-stretched state, two adjacent first metal structures FMS1 in each stretchable sub-region LS are bonded together. In the stretched state, a portion of the first conductive layer DDL1 is sandwiched between two adjacent first metal structures FMS1 in each stretchable sub-region LS. This structure, by independently setting adjacent stretchable sub-regions LS, ensures that their movements do not interfere with each other, reducing the retraction force of the first metal structures FMS1 and making it easier to maintain the stretched state of the shielding film SF.

[0086] By using the shielding film of this disclosure, since the shielding film SF has been stretched during the bonding process, it can absorb the pulling effect between the adhesive area BA and the non-adhesive area NAA of the shielding film SF caused by the height difference of electronic components, reduce the separation of the conductive adhesive layer CAL and the exposed copper grounding area (reduce the separation of the adhesive area from the corresponding exposed copper grounding area, driving circuit board, display panel, back film layer, etc.), thereby improving the problems of hollow bonding and abnormal noise when pressing the shielding film.

[0087] In the second embodiment of this disclosure, see [link to relevant documentation]. Figure 15 Instead of optimizing the film layer structure of the shielding film SF, an adhesive structure AL is added. This adhesive structure AL can bond adhesive and is located in the suspended area XK of the shielding film SF. The conductive adhesive layer CAL of the shielding film SF extends to the suspended area XK. The adhesive structure AL connects the drive circuit board PCB and the conductive adhesive layer CAL. In this way, the bonding between the adhesive structure AL and the conductive adhesive layer CAL can enhance the adhesion between the shielding film and the drive circuit board, thereby reducing the problems of hollow adhesion and abnormal noise when pressing the shielding film.

[0088] In this embodiment, the adhesive structure AL can be arranged around the device setting area QJ, which can uniformly improve the adhesive performance and further reduce the problems of hollow bonding of the shielding film and abnormal noise when pressed.

[0089] In this embodiment, the adhesive structure AL can be bonded to some electronic components.

[0090] In this third embodiment, the first and second embodiments can be used in combination: See Figure 16 Based on the first embodiment, an adhesive structure AL is added to the suspended area, and the range of the conductive adhesive layer CAL is extended so that the adhesive structure AL can be bonded to the conductive adhesive layer CAL, thereby improving the adhesion of the shielding film.

[0091] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A shielding film, characterized in that, It has a non-adhesive area and an adhesive area, wherein the adhesive area surrounds the non-adhesive area; In the bonding area, the shielding film includes a first insulating film, a first conductive layer, a first metal layer and a conductive adhesive layer stacked sequentially. On at least one side of the non-adhesive region, the adhesive region has a stretching sub-region. In the stretching sub-region, the first metal layer has at least two independently disposed first metal structures. Each of the first metal structures is disposed sequentially along the arrangement direction of the adhesive region and the non-adhesive region, and one of the first metal structures is connected to the non-adhesive region. The shielding film has a stretched state and a non-stretched state; in the non-stretched state, any two adjacent first metal structures are bonded together; in the stretched state, there is a gap between any two adjacent first metal structures, and a portion of the first conductive layer is sandwiched in the gap.

2. The shielding film according to claim 1, characterized in that, The first conductive layer comprises a shear-thinning non-Newtonian fluid and a conductive filler, wherein the conductive filler is uniformly distributed in the shear-thinning non-Newtonian fluid.

3. The shielding film according to claim 2, characterized in that, In the non-adhesive area, the shielding film includes a second insulating film, a second conductive layer, and a second metal layer stacked sequentially. The second insulating film is integrally disposed with the first insulating film, the second conductive layer is integrally disposed with the first conductive layer, and the second metal layer is integrally disposed with one of the first metal structures; In the stretched state, the first conductive layer located in the stretched sub-region has a flat region and a protruding region, the protruding region being located between two adjacent first metal structures; in the protruding region, the first conductive layer has a first thickness, and in the flat region, the first conductive layer has a second thickness; the second conductive layer has a third thickness, the second thickness being less than the third thickness, and the first thickness being greater than the third thickness.

4. The shielding film according to claim 1, characterized in that, The first conductive layer includes a conductive adhesive and a conductive filler, wherein the conductive filler is uniformly distributed in the conductive adhesive.

5. The shielding film according to claim 4, characterized in that, In the non-adhesive area, the shielding film includes a second insulating film, a second conductive layer, and a second metal layer stacked sequentially. The second insulating film is integrally disposed with the first insulating film, the second conductive layer is integrally disposed with the first conductive layer, and the second metal layer is integrally disposed with one of the first metal structures; In the non-stretched state, the first conductive layer located in the stretched sub-region has a fourth thickness, and the second conductive layer has a third thickness, wherein the fourth thickness is greater than the third thickness.

6. The shielding film according to any one of claims 2-5, characterized in that, The conductive filler includes at least one of conductive fibers and conductive particle spheres.

7. The shielding film according to claim 6, characterized in that, In any two adjacent first metal structures, one has a groove and the other has a protrusion adapted to the groove; In the non-stretched state, the protrusion is fully embedded in the groove; in the stretched state, the gap is formed between the protrusion and the groove.

8. The shielding film according to claim 7, characterized in that, Each of the first metal structures is annular, and each of the first metal structures is arranged around the non-adhesive area.

9. The shielding film according to claim 7, characterized in that, The number of stretching sub-regions is multiple; Each of the stretching sub-regions is arranged along the circumferential direction of the non-bonded region; In the non-stretched state, in each of the stretched sub-regions, two adjacent first metal structures are bonded together; in the stretched state, in each of the stretched sub-regions, a portion of the first conductive layer is sandwiched between two adjacent first metal structures.

10. A display device, characterized in that, include: Display panel; A driving circuit board is electrically connected to the display panel and is located on the backlight side of the display panel. The driving circuit board has a device setting area and a grounded exposed copper area located on one side of the device setting area. The shielding film according to any one of claims 1-9 is disposed on the side of the driving circuit board away from the display panel; the non-adhesive area covers the device placement area, and the shielding film is adhered to the driving circuit board and the display panel through the adhesive area, wherein the orthographic projection of the stretching sub-area on the display panel at least partially overlaps with the orthographic projection of the grounded exposed copper area on the display panel.

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