Multi-angle mounting device for mobile phone mainboard, automatic mounting equipment and mounting method

Abstract

The application discloses a multi-angle mounting device for a mobile phone mainboard, automatic mounting equipment and a mounting method, wherein the multi-angle mounting device comprises a multi-angle rotating module, a visual positioning assembly, a pressure detection piece and a displacement module; the multi-angle rotating module comprises, in sequence along a material taking direction, an XY rotating deviation rectifying piece, a YZ rotating table, an XZ rotating table and a material taking piece; the visual positioning assembly collects positions of the mainboard and a middle frame, and compensates relative position deviation of the mainboard and the middle frame in cooperation with the XY rotating deviation rectifying piece; the pressure detection piece collects real-time assembly stress data; during assembly, the YZ rotating table and the XZ rotating table are respectively inclined to a preset angle, and the displacement module drives the mainboard on the material taking piece to be sequentially buckled to the middle frame at multiple positions. In this way, multi-buckle assembly is completed in steps, and damage of the mainboard caused by stress concentration during synchronous pressing is avoided; the visual positioning assembly is matched to reduce alignment deviation, the pressure detection piece monitors assembly stress, violent assembly damage to the mainboard is prevented, and the multi-buckle assembly precision and production yield of the mainboard and the middle frame are improved as a whole.

Description

Technical Field

[0001] This invention relates to the field of mobile phone assembly equipment technology, and in particular to a multi-angle mounting device, automatic mounting equipment and mounting method for mobile phone motherboards. Background Technology

[0002] Mobile phone motherboard assembly equipment requires a tilt mounting method to assemble the motherboard and the device. Currently, the mainstream mobile phone motherboard mounting equipment in the industry uses a mechanical linkage transmission method to adjust the mounting angle, which can only achieve tilt adjustment in the X and Z directions. That is, the angle is deflected along the plane formed by the X and Z axes. For motherboard installation operations with three-directional latch positions, tilting in a single direction can easily cause uneven stress on the motherboard, resulting in problems such as motherboard lifting, breakage, and low production yield. Summary of the Invention

[0003] The purpose of this invention is to overcome the shortcomings of the prior art and provide a multi-angle mounting device for mobile phone motherboards, which can achieve individual and precise fastening of multiple clip positions, avoiding problems such as motherboard lifting, breakage, and low production yield.

[0004] The objective of this invention is achieved through the following technical solution: A multi-angle mounting device for mobile phone motherboards includes: a multi-angle rotating module, a visual positioning component, a pressure detection component, and a displacement module. The multi-angle rotating module includes an XY rotation correction component, a YZ rotating stage, an XZ rotating stage, and a material picking component, which are sequentially connected in series along the material picking direction. The visual positioning component is used for visual positioning of the motherboard and the mid-frame. The visual positioning component cooperates with the XY rotation correction component to compensate and correct the relative position of the motherboard and the mid-frame. The pressure detection component is disposed on the material picking end of the multi-angle rotating module and is used to collect assembly force data in real time. The displacement module is connected to the multi-angle rotating module and is used to drive the multi-angle rotating module to move and cooperate in the assembly operation of the motherboard and the mid-frame. The material picking component is used to pick up the motherboard. The YZ rotary table and XZ rotary table are tilted to preset angles, and the displacement module is used to insert the motherboard on the material picking component into multiple snap-fit ​​positions of the middle frame in sequence.

[0005] In one embodiment, the XY rotation correction component includes a servo motor and a hollow rotation platform, wherein the servo motor is connected to the hollow rotation platform, and the YZ rotation table is connected to the hollow rotation platform.

[0006] In one embodiment, both the YZ rotary table and the XZ rotary table are angular displacement tables, and the two angular displacement tables are assembled in series along the material picking direction.

[0007] In one embodiment, the material handling component is a vacuum adsorption fixture.

[0008] In one embodiment, a displacement module is also included, which is connected to the multi-angle rotation module. The displacement module is used to drive the multi-angle rotation module to move and cooperate in the assembly operation of the motherboard and the mid-frame.

[0009] In one embodiment, the pressure detection element is a six-dimensional pressure sensor, which is disposed between the XZ rotary table and the material handling element. The multi-angle rotation module is used to collect radial pressure in the XYZ directions and torsional torque in the XY, XZ, and YZ planes.

[0010] In one embodiment, the visual positioning component includes an upper visual positioning camera and a lower visual positioning camera. The upper visual positioning camera is used to collect position data of the mid-frame, and the lower visual positioning camera is used to collect position data of the motherboard.

[0011] A multi-angle automatic mounting device for mobile phone motherboards includes the aforementioned multi-angle mounting apparatus, and further includes... Mainboard tray loading module, mainboard picking module, mainboard transfer positioning platform, middle frame feeding conveyor and defective product unloading device; The motherboard material handling module is located on one side of the motherboard tray loading module. The motherboard transfer positioning platform is located between the motherboard tray loading module and the multi-angle mounting device. The multi-angle mounting device is located between the motherboard transfer positioning platform and the mid-frame feeding conveyor. The defective product unloading device is located at the discharge end of the mid-frame feeding conveyor. The motherboard pallet loading module is used to transport the material pallet to the pallet positioning area, and the motherboard material picking module is used to move the material pallet on the pallet positioning area to the motherboard transfer positioning platform. The middle frame feeding conveyor is provided with a mounting positioning area. When the middle frame feeding conveyor is used to convey the middle frame to the mounting positioning area, the multi-angle mounting device is used to move the motherboard on the motherboard transfer positioning platform to the mounting positioning area and make the motherboard snap into the middle frame at multiple angles. The middle frame feeding conveyor is also used to convey the assembled products to the discharge end, and the defective product unloading device is used to detect the products and unload the defective products.

[0012] In one embodiment, an empty pallet handling mechanism is also included, which is disposed on one side of the pallet positioning area and is used to move empty pallets away from the pallet positioning area.

[0013] In one embodiment, the motherboard tray loading module includes a motherboard tray transfer mechanism and a tray lifting drive. The tray lifting drive is located below the tray positioning area. The motherboard tray transfer mechanism is connected to the tray lifting drive. The motherboard tray transfer mechanism is used to transfer the loading tray to the tray lifting drive. The tray lifting drive is used to lift the loading tray onto the tray positioning area.

[0014] In one embodiment, the motherboard picking module includes a picking robot and a barcode scanning and positioning camera. The barcode scanning and positioning camera is mounted on the picking robot. The barcode scanning and positioning camera is used to scan and position one of the motherboards on the material tray. Then, the picking robot is used to transport the motherboard to the motherboard transfer and positioning platform.

[0015] In one embodiment, the middle frame feeding conveyor includes a feeding belt conveyor and a lifting and positioning component. The lifting and positioning component is located on the mounting positioning area of ​​the feeding belt conveyor and is used to lift and position the middle frame conveyed to the mounting positioning area.

[0016] In one embodiment, the defective product unloading device includes a re-inspection X-axis transfer component, a re-inspection Y-axis moving component, a laser displacement sensor, defective product unloading grippers, and a defective product unloading conveyor. The re-inspection Y-axis moving component is connected to the re-inspection X-axis transfer component. The laser displacement sensor is disposed on the drive end of the re-inspection Y-axis moving component, and the defective product unloading grippers are connected to the re-inspection Y-axis moving component. The defective product unloading conveyor is located on one side of the re-inspection X-axis transfer component. The laser displacement sensor acquires multi-point position data of the motherboard and the mid-frame and performs differential comparison through the movement of the re-inspection X-axis transfer component and the re-inspection Y-axis moving component. Qualified products are unloaded through the mid-frame feeding conveyor, while unqualified products are transported to the defective product unloading conveyor through the defective product unloading grippers in conjunction with the re-inspection X-axis transfer component and the re-inspection Y-axis moving component.

[0017] A method for multi-angle mounting of a mobile phone motherboard, using the aforementioned automatic multi-angle mounting equipment for mobile phone motherboards, includes the following steps: Pallet loading and positioning: The mainboard pallet loading module transports the material-carrying pallet to the pallet positioning area; Motherboard transfer and handling: The motherboard picking module moves the motherboards in the tray positioning area to the motherboard transfer and positioning station; Mid-frame conveying and positioning: The mid-frame feeding conveyor transports the mid-frame to the mounting and positioning area; Multi-angle mounting: The multi-angle mounting device grabs the motherboard on the motherboard transfer and positioning platform, and, in conjunction with data positioning correction and multi-angle attitude adjustment, mounts the motherboard onto the mid-frame at multiple angles. Re-inspection and sorting: The assembled products are conveyed out by the middle frame feeding conveyor, and the defective product unloading device detects the assembly status of the products and sorts out and removes defective products. Compared with the prior art, the present invention has at least the following advantages: 1. The multi-angle mounting device for mobile phone motherboards of the present invention, through an XY rotation correction component, a YZ rotary table, and an XZ rotary table, in conjunction with a displacement module, realizes the adjustment of the XYZ coordinates and the angles in the three directions of XY, XZ, and YZ. It can adapt to the assembly angle requirements of multiple snap-fit ​​positions on the mid-frame. By tilting the YZ rotary table and the XZ rotary table to preset angles, the motherboard picked up by the material is sequentially inserted into multiple snap-fit ​​positions on the mid-frame, realizing multi-snap-fit ​​step-by-step assembly and avoiding the problem of force concentration caused by simultaneous pressing of multiple snap-fits. In addition, a visual positioning component is set to perform visual positioning of the motherboard and the mid-frame, and works in conjunction with the XY rotation correction component. The multi-angle rotating module and the displacement module work together to compensate for and correct the relative position of the motherboard and the middle frame, effectively reducing assembly alignment deviations. At the same time, by setting a pressure detection component at the material picking end of the multi-angle rotating module, the pressure detection component can collect the force data of the entire assembly process in real time, and monitor the force status of the displacement module, XY rotation correction component, YZ rotary table, and XZ rotary table during multi-angle assembly, effectively avoiding damage to the motherboard caused by violent assembly. In this way, the cooperation of the multi-angle rotating module, vision positioning component, pressure detection component, and displacement module can significantly improve the fitting accuracy and production yield of the multi-clamp assembly of the motherboard and the middle frame.

[0018] 2. The mobile phone motherboard multi-angle automatic mounting equipment of the present invention is equipped with a multi-angle mounting device, and simultaneously equipped with a motherboard tray loading module, a motherboard picking module, a motherboard transfer positioning platform, a mid-frame feeding conveyor, and a defective product unloading device. Each module is arranged in an orderly manner according to the assembly logic. The motherboard tray loading module can transport the loading tray to the tray positioning area. The motherboard picking module can transport the motherboard in the tray positioning area to the motherboard transfer positioning platform. The mid-frame feeding conveyor can transport the mid-frame to the mounting positioning area. The multi-angle mounting device can transport the motherboard on the motherboard transfer positioning platform to the mounting positioning area and complete the multi-angle fastening assembly using XY rotation correction components, YZ rotary table, and XZ rotary table. The defective product unloading device can inspect the assembled products and unload and sort defective products, realizing fully automated operation, effectively shortening the material flow path, and improving production continuity and product assembly qualification rate. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly described below.

[0020] Figure 1 This is a schematic diagram of the structure of a multi-angle automatic mounting device for mobile phone motherboards according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the structure of the motherboard tray loading module, motherboard unloading module, motherboard transfer positioning platform, and lower vision positioning camera in one embodiment of the present invention. Figure 3 This is a schematic diagram of the structure of the mid-frame feeding conveyor, multi-angle mounting device, motherboard transfer positioning platform, and vision positioning component in one embodiment of the present invention. Figure 4 This is a schematic diagram of the structure of a multi-angle mounting device according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the structure of a multi-angle mounting device (top view) according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of a multi-angle mounting device (front view) according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the structure of a multi-angle mounting device (left view) according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the defective product unloading device in one embodiment of the present invention; Detailed Implementation

[0021] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be given below with reference to the accompanying drawings.

[0022] Please see Figures 1-8As shown, a multi-angle automatic mounting device for mobile phone motherboards includes a motherboard tray loading module 100, a motherboard picking module 200, a motherboard transfer and positioning platform 300, a multi-angle mounting device 400, a mid-frame feeding conveyor 500, and a defective product unloading device 600. The motherboard picking module 200 is located on one side of the motherboard tray loading module 100. The motherboard transfer and positioning platform 300 is located between the motherboard tray loading module 100 and the multi-angle mounting device 400, and the multi-angle mounting device 400 is located between the motherboard transfer and positioning platform 300 and the mid-frame feeding conveyor 500. The defective product unloading device 600 is located at the discharge end of the mid-frame feeding conveyor. The material module 100 is used to transport the material tray 110 to the tray positioning area. The motherboard picking module 200 is used to move the material tray 110 from the tray positioning area to the motherboard transfer positioning platform 300. The middle frame feeding conveyor 500 is provided with a mounting positioning area. When the middle frame feeding conveyor 500 is used to transport the middle frame to the mounting positioning area, the multi-angle mounting device 400 is used to move the motherboard from the motherboard transfer positioning platform 300 to the mounting positioning area and make the motherboard snap into the middle frame at multiple angles. The middle frame feeding conveyor 500 is also used to transport the assembled product to the discharge end. The defective product unloading device 600 is used to inspect the product and unload the defective product.

[0023] It should be noted that during the mobile phone motherboard mounting process, the material carrier tray 110 containing multiple motherboards is first manually placed onto the motherboard tray loading module 100. The motherboard tray loading module 100 then moves the material carrier tray 110 to the tray positioning area to await material retrieval. Next, the motherboard retrieval module 200 picks up the motherboards from the material carrier tray 110 and transports them to the motherboard transfer positioning stage 300. The motherboard transfer positioning stage 300 performs transfer positioning on the motherboards, ensuring the stability and uniqueness of the retrieval position for the subsequent multi-angle mounting device 400, thereby improving the accuracy of subsequent mounting and fastening. Simultaneously with motherboard retrieval, the mid-frame is manually or robotically transported to the mid-frame feeding conveyor 500. The mid-frame feeding conveyor 500 then moves the mid-frame to the mounting positioning area, where it is mounted. Positioning is achieved to ensure the accuracy of the mid-frame's location. The multi-angle placement device 400 picks up the motherboard from the motherboard transfer positioning table 300 and moves it above the placement positioning area. The multi-angle placement device 400, in conjunction with the displacement module, adjusts the XYZ coordinates and the angles in the XY, XZ, and YZ directions, sequentially engaging the three clips between the motherboard and the mid-frame to complete assembly. This avoids uneven stress caused by tilting in one direction, thus preventing issues like motherboard warping or breakage that lead to low yield rates. Finally, the assembled product is conveyed to the outlet via the mid-frame feeding conveyor 500. At the outlet, a defective product unloading device 600 performs inspection and sorting. Defective products are picked up and unloaded, while qualified products are conveyed out via the mid-frame feeding conveyor 500. In this way, the entire equipment integrates automatic loading and unloading, picking, positioning, assembly, and assembly re-inspection, achieving fully automated operation, effectively shortening the material flow path, improving placement accuracy, and significantly increasing production efficiency.

[0024] Please see Figure 2As shown, in one embodiment, the mobile phone motherboard multi-angle automatic mounting equipment also includes an empty pallet transport mechanism 700. The empty pallet transport mechanism 700 is disposed on one side of the pallet positioning area and is used to move empty pallets away from the pallet positioning area. After the material-carrying pallet 110 on the pallet positioning area is depleted, the pallet needs to be removed in a timely manner to replace the material-carrying pallet 110. By adding the empty pallet transport mechanism 700, the empty pallets can be automatically moved away from the pallet positioning area without manual shutdown to clean the empty pallets. This effectively avoids the accumulation of empty pallets interfering with the operation of the motherboard pallet loading module 100, and significantly improves production efficiency. Specifically, the empty pallet handling mechanism 700 includes a mounting frame 710, two sets of oppositely arranged linear cylinders, a cylinder lifting drive structure 720, and an adsorption frame 730. The adsorption frame 730 is equipped with a suction nozzle. Both ends of the mounting frame 710 are connected to the drive ends of the two sets of linear cylinders, respectively. The cylinder lifting drive structure 720 is mounted on the mounting frame 710 and connected to the adsorption frame 730. The operation of the adsorption frame 730 in handling empty pallets is realized through the linear motor and the cylinder lifting drive structure 720.

[0025] Please see Figure 2 As shown, in one embodiment, the motherboard tray loading module 100 includes a motherboard tray transfer mechanism 110 and a tray lifting drive 120. The tray lifting drive 120 is located below the tray positioning area. The motherboard tray transfer mechanism 110 is connected to the tray lifting drive 120. The motherboard tray transfer mechanism 110 is used to transfer the loading tray 110 to the tray lifting drive 120, and the tray lifting drive 120 is used to lift the loading tray 110 onto the tray positioning area. The loading tray 110 is placed into the motherboard tray transfer mechanism 110 manually or by a robotic arm, and then lifted to the tray positioning area by the tray lifting drive 120. The motherboard tray transfer mechanism 110 includes a transfer frame driven by a linear motor. The tray is placed on the transfer frame and moved by the transfer frame. The tray lifting drive 120 can be a linear motor module, a servo motor ball screw linear drive structure, a linear cylinder, etc.

[0026] Please see Figure 2As shown, in one embodiment, the motherboard picking module 200 includes a picking robot 210 and a barcode scanning and positioning camera 220. The barcode scanning and positioning camera 220 is mounted on the picking robot 210. The barcode scanning and positioning camera 220 is used to scan and position one of the motherboards on the material tray 110. Then, the picking robot 210 is used to transport the motherboard to the motherboard transfer and positioning stage 300. The barcode scanning and positioning camera 220 can complete the barcode scanning and positioning of the motherboard on the material tray 110, accurately compensate for the tray placement deviation, and then the picking robot 210 transports the accurately positioned motherboard to the motherboard transfer and positioning stage 300. This effectively avoids problems such as picking offset, motherboard damage, and picking failure, improves the success rate of motherboard picking and transfer positioning accuracy, and provides a precise motherboard positioning reference for the subsequent multi-angle precise fastening assembly of the XY rotation correction component 411, YZ rotary table 412, and XZ rotary table 413. In this embodiment, the picking robot 210 can be an existing three-axis robot, which will not be described in detail here.

[0027] Please see Figure 3 As shown, in one embodiment, the middle frame feeding and conveying device 500 includes a feeding belt conveyor 510 and a lifting and positioning component 520. The lifting and positioning component 520 is located on the mounting positioning area of ​​the feeding belt conveyor 510 and is used to lift and position the middle frame conveyed to the mounting positioning area. The feeding belt conveyor 510 realizes continuous automatic feeding of the middle frame. After the middle frame is conveyed to the correct position, the lifting and positioning component 520 independently lifts and locks the middle frame. This separates the conveying function from the positioning function, ensuring that the middle frame has no displacement or shaking during the mounting process, completely avoiding the assembly offset problem caused by the flexible belt support. In this embodiment, two sets of lifting and positioning components 520 are provided, which are arranged opposite to each other to lift and position the middle frame together. Specifically, the lifting and positioning component 520 includes a supporting lifting plate 521, a clamping positioning plate 522, a clamping drive component, and a lifting cylinder 523. The supporting lifting plate 521 has a clearance space to avoid the installation of the belt. The clamping positioning plate 522 is arranged perpendicularly to the supporting lifting plate 521. The lifting cylinder 523 is connected to the supporting lifting plate 521. The clamping drive component is connected to the supporting lifting plate 521. When the middle frame is located at the supporting lifting plate 521, the clamping drive component drives the clamping positioning plates 522 on both sides to clamp and position the middle frame. Then, the lifting cylinder 523 lifts the middle frame to ensure the accuracy of the middle frame position and avoid the middle frame from shifting during the assembly process, which would affect the subsequent fastening operation of the main board.

[0028] Please see Figure 1 , Figures 4-7As shown, a multi-angle mounting device 400 for mobile phone motherboards includes: a multi-angle rotation module 410, a visual positioning component 420, a pressure detection component 430, and a displacement module 440. The multi-angle rotation module 410 includes an XY rotation correction component 411, a YZ rotation stage 412, an XZ rotation stage 413, and a material picking component 414. The XY rotation correction component 411, the YZ rotation stage 412, the XZ rotation stage 413, and the material picking component 414 are assembled in series along the material picking direction. The visual positioning component 420 is used for visual positioning of the motherboard and the middle frame. The visual positioning component 420 cooperates with the XY rotation correction component 411 to compensate and correct the relative position of the motherboard and the middle frame. The pressure detection component 430 is set on the material-picking end of the multi-angle rotation module 410 and is used to collect assembly force data in real time. The displacement module 440 is connected to the multi-angle rotation module 410 and is used to drive the multi-angle rotation module 410 to move and cooperate in the assembly operation of the motherboard and the middle frame. The material-picking component 414 is used for picking up the motherboard. The YZ rotary table 412 and the XZ rotary table 413 are tilted to preset angles, and the displacement module 440 cooperates to insert the motherboard on the material-picking component 414 into multiple snap-fit ​​positions on the middle frame.

[0029] It should be noted that you should refer to [link / reference]. Figure 5 As shown, the main board and the middle frame are first visually positioned by the visual positioning component 420, and then cooperate with the XY rotation correction component 411 to complete the relative position compensation and correction between the main board and the middle frame, so that the fastening part of the main board corresponds to the snap-fit ​​position of the middle frame, effectively eliminating the assembly alignment deviation, and achieving a comprehensive fastening accuracy of ±0.05mm. This step realizes the position adjustment in the XY direction. Please see Figure 6 and Figure 7 The above, Figure 6 The YZ rotary table 412 rotates. Figure 7During the step-by-step fastening operation, the XZ rotary table 413 rotates while the YZ rotary table 412 and XZ rotary table 413 tilt at certain angles (adjusted according to the main board and mid-frame structure to avoid interference points). In the first step, the main board is inserted into latch position A (1) in the YZ direction. After the YZ rotary table 412 resets, it is inserted into latch position B (2) in the XZ direction. The XZ rotary table 413 then resets and simultaneously fastens latch position C (3). This step-by-step fastening avoids uneven stress on the main board caused by simultaneously inserting multiple latch points (uneven positions), preventing breakage. Throughout the process, the independent orientation adjustment of the rotary tables in different dimensions, combined with the displacement module, sequentially adapts and fits the multiple latch positions on the mid-frame, resolving issues such as uneven stress during simultaneous pressing of multiple latches, localized loose fastening, and localized hard pressing. The problem is that the displacement module 440 is connected to the multi-angle rotation module 410, which can drive the XY rotation correction component 411, YZ rotary table 412, XZ rotary table 413 and material picking component 414 to move as a whole, and accurately cooperate to complete the full assembly operation of the motherboard and the middle frame. In this embodiment, the displacement module 440 includes a lifting drive component 441, a horizontal drive component 442 and a vertical drive component 443. The horizontal drive component is connected to the vertical drive component, the lifting drive component is connected to the horizontal drive component, and the multi-angle rotation module 410 is connected to the lifting drive component. The lifting drive component and the horizontal drive component realize the linear movement of the multi-angle rotation module 410 in the lifting, horizontal and vertical directions to complete the material picking and assembly operation of the motherboard. In this embodiment, the lifting drive component and the horizontal drive component can be linear motor modules or other existing drive structures that can realize linear movement, and there is no limitation. In addition, by setting the vision positioning component 420, the position of the motherboard can be adjusted according to the position data collected by the vision positioning component 420 to ensure the accuracy of the subsequent assembly position. By setting a pressure detection component 430 at the material picking end of the multi-angle rotating module 410, the pressure detection component 430 can collect the force data of the entire assembly process in real time, and monitor the force status of the XY rotation correction component 411, YZ rotary table 412, and XZ rotary table 413 during the multi-angle assembly process in real time. This effectively avoids damage to the motherboard caused by violent assembly and significantly improves the fitting accuracy and production yield of the motherboard and the multi-snap assembly of the middle frame.

[0030] Please see Figure 7As shown, in one embodiment, the XY rotational correction component 411 includes a servo motor 411a and a hollow rotary platform 411b. The servo motor 411a is connected to the hollow rotary platform 411b, and the YZ rotary table 412 is connected to the hollow rotary platform 411b. The servo motor 411a and the hollow rotary platform 411b are interconnected to achieve power output, which can accurately complete the XY direction angle correction, with high angle control accuracy and stable power transmission. The YZ rotary table 412 is directly connected and assembled with the hollow rotary platform 411b, with high structural integration and extremely small transmission gap. This ensures that the rotational correction action of the XY rotational correction component 411 and the multi-angle tilting action of the YZ rotary table 412 and XZ rotary table 413 maintain high synchronization and coaxiality, avoiding assembly deviations caused by multi-stage transmission structures and effectively improving the overall stability of the machine's mounting alignment. The hollow rotary platform 411b is prior art, and its specific structure will not be described in detail here.

[0031] In one embodiment, both the YZ rotary table 412 and the XZ rotary table 413 are angular displacement tables, and the two angular displacement tables are assembled in series along the material handling direction. This series assembly allows the YZ rotary table 412 to independently adjust its YZ plane angle, and the XZ rotary table 413 to independently adjust its XZ plane angle. The attitude adjustments of the two sets of rotary tables do not interfere with each other, enabling flexible adaptation to the specific assembly angle requirements of the buckles at different positions on the middle frame. In this embodiment, existing electric angular displacement tables can be used; their specific structure is not described in detail here.

[0032] In one embodiment, the material handling component 414 is a vacuum adsorption fixture. Using vacuum adsorption avoids damage to the motherboard and effectively protects the motherboard surface and onboard components.

[0033] In one embodiment, the pressure detection element 430 is a six-dimensional pressure sensor, which is disposed between the XZ rotary table 413 and the material picking element 414. The multi-angle rotation module 410 is used to collect radial pressure in the XYZ directions and torsional torque in the XY, XZ and YZ planes.

[0034] It should be noted that the six-dimensional pressure sensor is arranged between the XZ rotary table 413 and the material handling component 414, close to the force-bearing end of the motherboard assembly. The force data collected is real and real-time, with no transmission loss. This six-dimensional pressure sensor can work with the multi-angle assembly actions of the XY rotary correction component 411, the YZ rotary table 412, and the XZ rotary table 413 to simultaneously collect the radial pressure (displacement module) in the XYZ direction and the torsional torque in the XY, XZ, and YZ planes (multi-angle rotation module). It comprehensively covers the abnormal pressure and torque conditions during the multi-angle mounting process, accurately identifies assembly hazards such as hard clamping, angle misalignment, and uneven force, and eliminates defects such as motherboard cracking, clamp deformation, and assembly misalignment from the force monitoring level.

[0035] Please see Figure 3 and Figure 4 As shown, in one embodiment, the visual positioning component 420 includes an upper visual positioning camera 421 and a lower visual positioning camera 422. The upper visual positioning camera 421 is used to collect position data of the mid-frame, and the lower visual positioning camera 422 is used to collect position data of the motherboard. The lower vision positioning camera 422 is connected between the multi-angle rotation module 410 and the motherboard transfer positioning stage 300. The pick-up component 414 picks up the motherboard and passes it through the lower vision positioning camera 422, which collects the motherboard position data. The upper vision positioning camera 421 is installed on the other side of the multi-angle rotation module 410 and moves with the displacement module 440. The upper vision positioning camera 421 synchronously collects the position data of the upper and middle frames of the mounting positioning area. Then, by comparing the motherboard position data and the middle frame position data, the corresponding component actions are activated to perform correction and compensation operations on the motherboard position. For example, the XY rotation correction component 411 or / and the displacement module 440 are activated. This can solve the problem of large deviation of the single vision positioning reference and greatly improve the multi-angle mounting alignment accuracy of the XY rotation correction component 411, YZ rotary stage 412, and XZ rotary stage 413 in coordinated assembly.

[0036] Please see Figure 8 As shown, in one embodiment, the defective product unloading device 600 includes a re-inspection X-axis transfer component 610, a re-inspection Y-axis moving component 620, a laser displacement sensor 630, a defective product unloading gripper 640, and a defective product unloading conveyor 650. The re-inspection Y-axis moving component 620 is connected to the re-inspection X-axis transfer component 610. The laser displacement sensor 630 is disposed on the drive end of the re-inspection Y-axis moving component 620, and the defective product unloading gripper 640 is connected to the re-inspection Y-axis moving component 620. On one side of the conveying device 650 and the re-inspection X-axis transfer component 610, the laser displacement sensor 630 acquires multi-point position data of the motherboard and the middle frame through the movement of the re-inspection X-axis transfer component 610 and the re-inspection Y-axis moving component 620, and performs differential comparison. Qualified products are conveyed and unloaded through the middle frame feeding conveyor 500, while unqualified products are transported to the unqualified product unloading conveyor 650 by the defective product unloading gripper 640 in conjunction with the re-inspection X-axis transfer component 610 and the re-inspection Y-axis moving component 620.

[0037] It should be noted that the X-axis transfer component 610 and the Y-axis moving component 620 are linked to drive the laser displacement sensor 630 to complete the multi-point position data acquisition and comparison of the motherboard and the middle frame. This non-contact detection method avoids secondary damage to the product and accurately detects the snap-fit ​​status of the XY rotation correction component 411, YZ rotary table 412, and XZ rotary table 413 after multi-angle assembly. The equipment can automatically distinguish between qualified and defective products. The defective product unloading gripper 640 transports the defective products to the defective product unloading conveyor 650, realizing fully automatic online re-inspection and sorting after assembly without manual re-inspection, which greatly improves detection efficiency and sorting accuracy. In this embodiment, the re-inspection Y-axis moving component 620 and the re-inspection X-axis transfer component 610 are both linear motor modules, and the defective product unloading conveyor 650 is a belt conveyor.

[0038] A method for multi-angle mounting of a mobile phone motherboard, using the aforementioned automatic multi-angle mounting equipment for mobile phone motherboards, includes the following steps: S100 Pallet Loading and Positioning: The mainboard pallet loading module 100 transports the loading pallet 110 to the pallet positioning area; S200 motherboard transfer and handling: The motherboard picking module 200 moves the motherboard in the pallet positioning area to the motherboard transfer and positioning platform 300; S300 Mid-frame Conveying and Positioning: The mid-frame feeding conveyor 500 conveys the mid-frame to the mounting and positioning area; S400 Multi-Angle Mounting: The multi-angle mounting device 400 grips the motherboard on the motherboard transfer positioning stage 300, and, with the help of data positioning correction and multi-angle attitude adjustment, mounts the motherboard onto the mid-frame at multiple angles. Specifically, the vision positioning component 420 first collects the position data of the motherboard and the mid-frame, and, with the help of the XY rotation correction component 411, completes the relative position compensation and correction between the motherboard and the mid-frame to eliminate alignment deviations. Then, the material picking component 414 of the multi-angle mounting device 400 grips the motherboard on the motherboard transfer positioning stage 300, and the displacement module 440 moves the entire structure to the assembly position. The Y-axis rotation is controlled individually in sequence. The Z-rotary stage 412 and XZ-rotary stage 413 are tilted to their respective preset angles. By using the independent tilting motion of the two sets of rotary stages, the motherboard is inserted into and fastened to multiple snap-fit ​​positions of the middle frame in stages, completing the multi-position snap-fit ​​step-by-step assembly. During the entire assembly process, the pressure detection component 430 collects the assembly force data in real time, monitors the pressure and torque status during the fastening process, and promptly identifies abnormal assembly conditions. This avoids motherboard damage, snap-fit ​​deformation, and assembly misalignment caused by forceful pressing. By relying on multi-dimensional independent angle adjustment to adapt to the multi-snap-fit ​​assembly requirements, the multi-angle mounting accuracy and assembly stability of the motherboard and the middle frame are effectively improved.

[0039] S500 Re-inspection and Sorting: The assembled products are conveyed out by the middle frame feeding conveyor 500, and the defective product unloading device 600 detects the assembly status of the products and sorts out and removes defective products.

[0040] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A multi-angle mounting device for mobile phone motherboards, characterized in that, include: A multi-angle rotating module, comprising an XY rotation correction component, a YZ rotary table, an XZ rotary table, and a material picking component, wherein the XY rotation correction component, the YZ rotary table, the XZ rotary table, and the material picking component are assembled in series along the material picking direction; A visual positioning component is used to perform visual positioning operations on the motherboard and the mid-frame. The visual positioning component cooperates with the XY rotation correction component to compensate and correct the relative position of the motherboard and the mid-frame. A pressure detection element is disposed on the material-taking end of the multi-angle rotating module, and the pressure detection element is used to collect assembly force data in real time. A displacement module is connected to the multi-angle rotation module. The displacement module is used to drive the multi-angle rotation module to move and cooperate in the assembly operation of the motherboard and the middle frame. The material picking component is used to pick up the motherboard. The YZ rotary table and XZ rotary table are tilted to preset angles, and the displacement module sequentially inserts the motherboard on the material picking component into multiple snap-fit ​​positions of the middle frame.

2. The multi-angle mounting device for mobile phone motherboards according to claim 1, characterized in that, The XY rotation correction component includes a servo motor and a hollow rotation platform. The servo motor is connected to the hollow rotation platform, and the YZ rotation table is connected to the hollow rotation platform.

3. The multi-angle mounting device for mobile phone motherboards according to claim 1, characterized in that, Both the YZ rotary table and the XZ rotary table are angular displacement tables, and the two angular displacement tables are assembled in series along the material picking direction.

4. The multi-angle mounting device for mobile phone motherboards according to claim 1, characterized in that, The material handling component is a vacuum adsorption fixture.

5. The multi-angle mounting device for mobile phone motherboards according to claim 4, characterized in that, The pressure detection device is a six-dimensional pressure sensor, which is disposed between the XZ rotary table and the material handling device. The multi-angle rotation module is used to collect radial pressure in the XYZ directions and torsional torque in the XY, XZ, and YZ planes.

6. The multi-angle mounting device for mobile phone motherboards according to claim 1, characterized in that, The visual positioning component includes an upper visual positioning camera and a lower visual positioning camera. The upper visual positioning camera is used to collect position data of the mid-frame, and the lower visual positioning camera is used to collect position data of the motherboard.

7. A multi-angle automatic mounting device for mobile phone motherboards, characterized in that, Including the multi-angle mounting device according to any one of claims 1-6, and further comprising Mainboard tray loading module, mainboard picking module, mainboard transfer positioning platform, middle frame feeding conveyor and defective product unloading device; The motherboard material handling module is located on one side of the motherboard tray loading module. The motherboard transfer positioning platform is located between the motherboard tray loading module and the multi-angle mounting device. The multi-angle mounting device is located between the motherboard transfer positioning platform and the mid-frame feeding conveyor. The defective product unloading device is located at the discharge end of the mid-frame feeding conveyor. The motherboard pallet loading module is used to transport the material pallet to the pallet positioning area, and the motherboard material picking module is used to move the material pallet on the pallet positioning area to the motherboard transfer positioning platform. The middle frame feeding conveyor is provided with a mounting positioning area. When the middle frame feeding conveyor is used to convey the middle frame to the mounting positioning area, the multi-angle mounting device is used to move the motherboard on the motherboard transfer positioning platform to the mounting positioning area and make the motherboard snap into the middle frame at multiple angles. The middle frame feeding conveyor is also used to convey the assembled products to the discharge end, and the defective product unloading device is used to detect the products and unload the defective products.

8. The automatic multi-angle mounting equipment for mobile phone motherboards according to claim 7, characterized in that, It also includes an empty pallet handling mechanism, which is located on one side of the pallet positioning area and is used to move empty pallets away from the pallet positioning area.

9. The mobile phone motherboard multi-angle automatic mounting equipment according to claim 7, characterized in that, The motherboard tray loading module includes a motherboard tray transfer mechanism and a tray lifting drive. The tray lifting drive is located below the tray positioning area. The motherboard tray transfer mechanism is connected to the tray lifting drive. The motherboard tray transfer mechanism is used to transfer the loading tray to the tray lifting drive. The tray lifting drive is used to lift the loading tray onto the tray positioning area.

10. The automatic multi-angle mounting equipment for mobile phone motherboards as described in claim 7, characterized in that, The motherboard material handling module includes a material handling robot and a barcode scanning and positioning camera. The barcode scanning and positioning camera is installed on the material handling robot. The barcode scanning and positioning camera is used to scan and position one of the motherboards on the material tray. Then, the material handling robot is used to transport the motherboard to the motherboard transfer and positioning platform.

11. The automatic multi-angle mounting equipment for mobile phone motherboards according to claim 7, characterized in that, The middle frame feeding and conveying device includes a feeding belt conveyor and a lifting and positioning component. The lifting and positioning component is located on the mounting positioning area of ​​the feeding belt conveyor and is used to lift and position the middle frame conveyed to the mounting positioning area.

12. The automatic multi-angle mounting equipment for mobile phone motherboards according to claim 7, characterized in that, The defective product unloading device includes a re-inspection X-axis transfer component, a re-inspection Y-axis moving component, a laser displacement sensor, defective product unloading grippers, and a defective product unloading conveyor. The re-inspection Y-axis moving component is connected to the re-inspection X-axis transfer component. The laser displacement sensor is disposed on the drive end of the re-inspection Y-axis moving component, and the defective product unloading grippers are connected to the re-inspection Y-axis moving component. The defective product unloading conveyor is located on one side of the re-inspection X-axis transfer component. The laser displacement sensor acquires multi-point position data of the motherboard and the middle frame and performs differential comparison through the movement of the re-inspection X-axis transfer component and the re-inspection Y-axis moving component. Qualified products are unloaded through the middle frame feeding conveyor, while unqualified products are transported to the defective product unloading conveyor through the defective product unloading grippers in conjunction with the re-inspection X-axis transfer component and the re-inspection Y-axis moving component.

13. A method for multi-angle mounting of a mobile phone motherboard, characterized in that, The mobile phone motherboard multi-angle automatic mounting equipment according to any one of claims 7-12 includes the following steps: Pallet loading and positioning: The mainboard pallet loading module transports the material-carrying pallet to the pallet positioning area; Motherboard transfer and handling: The motherboard picking module moves the motherboards in the tray positioning area to the motherboard transfer and positioning station; Mid-frame conveying and positioning: The mid-frame feeding conveyor transports the mid-frame to the mounting and positioning area; Multi-angle mounting: The multi-angle mounting device grabs the motherboard on the motherboard transfer and positioning platform, and, in conjunction with data positioning correction and multi-angle attitude adjustment, mounts the motherboard onto the mid-frame at multiple angles. Re-inspection and sorting: The assembled products are conveyed out by the middle frame feeding conveyor, and the defective product unloading device detects the assembly status of the products and sorts out and removes defective products.

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