Impact resistant solar module

Abstract

The application discloses a solar impact-resistant assembly, comprising the following from bottom to top: a back plate, a tin paste layer, a solar cell layer, a first front encapsulation adhesive film, a second front encapsulation adhesive film and a first front transparent front plate which are sequentially stacked and placed, and are integrally formed into a laminated assembly through a laminating machine; OCA optical adhesive and tempered glass are placed on the laminated assembly, and after vacuumizing and removing bubbles, the OCA optical adhesive and the tempered glass are solidified into the solar impact-resistant assembly. The solar assembly encapsulation structure of the application adopts the OCA optical adhesive and the tempered glass, so that the service life of the solar assembly in a multiple impact environment can be prolonged.

Description

Technical Field

[0001] This invention relates to the field of solar photovoltaic technology, and in particular to an impact-resistant solar module. Background Technology

[0002] China currently has the world's largest installed photovoltaic capacity, and its photovoltaic module production accounts for 70% of the global module production. The development of the photovoltaic industry in my country's domestic and overseas markets will drive the continuous increase in demand for photovoltaic modules, and the market demand for photovoltaic glass will also continue to rise, promoting the high-quality and sustainable development of the photovoltaic glass industry.

[0003] Existing glass photovoltaic modules have weak impact resistance, which seriously affects their lifespan. Solving this problem is a challenge for the photovoltaic industry. Summary of the Invention

[0004] Purpose of the invention: In view of the problems and shortcomings of existing technical solutions, the present invention provides an impact-resistant solar module.

[0005] The specific technical solution is as follows: A solar impact-resistant module includes: a backsheet, a solder paste layer, a solar cell layer, a first front encapsulating film, a second front encapsulating film, and a first front transparent front panel stacked from bottom to top, which are laminated together to form a laminated module; OCA optical adhesive and tempered glass are placed on the laminated module, and after vacuuming and removing air bubbles, it is cured to form a solar impact-resistant module.

[0006] Furthermore, the OCA optical adhesive is an OCA optical adhesive with the light release film removed.

[0007] Furthermore, the backplane is a copper-clad backplane. Further, the copper-clad backplane includes: an OSP double-sided copper-clad FR-4 epoxy resin board.

[0008] Furthermore, the copper-clad backplane can be in the following colors: black, white, or colored.

[0009] Furthermore, the solar cell is an IBC cell.

[0010] Furthermore, the first front encapsulation film and the second front encapsulation film are any one of the following materials: EVA, POE, and EPE.

[0011] Furthermore, the first transparent front panel is made of any one of the following materials: PET or CPC.

[0012] Furthermore, the tempered glass is low-iron ultra-white tempered photovoltaic glass.

[0013] Beneficial effects: The solar module encapsulation structure using OCA optical adhesive and tempered glass can improve the service life of SMT small solar modules in multi-impact environments. Attached Figure Description

[0014] Figure 1 A schematic diagram of a solar impact-resistant module structure in one embodiment of the present invention. Detailed Implementation

[0015] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the scope of the present application to those skilled in the art. Example 1

[0016] like Figure 1 As shown, one embodiment of the present invention provides a solar impact-resistant module, comprising: a backplate 1, a solder paste layer 2, a solar cell layer 3, a first front encapsulating film 4, a second front encapsulating film 5, and a first front transparent front panel 6 stacked sequentially from bottom to top, and integrally formed into a laminated module by lamination; OCA optical adhesive 7 and tempered glass 8 are placed on the laminated module, and after vacuuming and removing air bubbles, it is cured to form a solar impact-resistant module.

[0017] Furthermore, the OCA optical adhesive is an OCA optical adhesive with the light release film removed.

[0018] Furthermore, the backplane is a copper-clad backplane. Further, the copper-clad backplane includes: an OSP double-sided copper-clad FR-4 epoxy resin board.

[0019] Furthermore, the copper-clad backplane can be in the following colors: black, white, or colored.

[0020] Furthermore, the solar cell is an IBC cell.

[0021] Furthermore, the first front encapsulation film and the second front encapsulation film are any one of the following materials: EVA, POE, and EPE.

[0022] The purpose of using a double-layer encapsulation film is to protect the components, prevent delamination, and provide impact resistance.

[0023] The EPE has a three-layer structure of EVA / PET / EVA.

[0024] Furthermore, the first transparent front panel is made of any one of the following materials: PET or CPC.

[0025] Furthermore, the tempered glass is low-iron ultra-white tempered photovoltaic glass.

[0026] Beneficial effects: The solar module encapsulation structure using OCA optical adhesive and tempered glass can improve the service life of SMT small solar modules in multi-impact environments. Example 2

[0027] This embodiment provides a method for preparing a solar module, including the following steps: S1: Place the first copper-clad backplane into the soldering machine to pre-apply solder paste to the pads, forming the first copper-clad backplane with solder paste. S2: Place the solar cell into a special mold, and then place the special mold into a visual patch machine. The special mold is a special mold with a serial number. S3: Place the first copper-clad backplane with solder paste into the vision placement machine; S4: The vision placement machine uses machine vision positioning to remove the solar cells from the special mold according to the sequence number of the special mold, and places them sequentially on the pads of the first copper-clad backplane with solder paste. S5: Place the first copper-clad backplate with solder paste containing the solar cells into a segmented constant temperature furnace for reflow soldering to complete the solar cell circuit connection. S6: Lay the first copper-clad backplane with solder paste on the workbench, which has already been connected to the solar cell circuits; S7: Cut the first front sealing film, the second front sealing film, and the first front transparent front panel to the preset size; S8: The first front encapsulating film, the second front encapsulating film, and the first front transparent front panel are sequentially laid on the solar cell with completed circuit connection according to the stacked structure to form the module to be laminated. S9: Place the components to be laminated into a laminator for lamination to form a solar module; S10: Laser cutting of solar modules to remove scraps.

[0028] Furthermore, after S10, the following is also included: S11: Cut the OCA optical adhesive (Optically Clear Adhesive) and tempered glass to the preset size; S12: Remove the light release film from the OCA optical adhesive and place it on the first transparent front panel of the solar module, then quickly press and adhere it using a roller; S13: Remove the OCA optical adhesive and release film, place the tempered glass on the OCA optical adhesive and press it together to form a glass solar module; S14: Vacuum the glass solar module and then put it into a high-pressure degassing machine to remove air bubbles; S15: Use UV lamps to fully cure the OCA optical adhesive, forming a cured glass solar module.

[0029] Furthermore, the first black copper-clad backplane comprises: OSP double-sided copper-clad FR-4 epoxy resin board.

[0030] Furthermore, the solar cell is an IBC (Interdigitated Back Contact) cell.

[0031] Furthermore, the first front encapsulation film and the second front encapsulation film are any one of the following materials: EVA, POE, and EPE.

[0032] The EPE has a three-layer structure of EVA / PET / EVA.

[0033] The purpose of using a double-layer encapsulation film is to protect the components, prevent delamination, and provide impact resistance.

[0034] Furthermore, the first transparent front panel is made of any one of the following materials: PET or CPC.

[0035] Furthermore, the tempered glass is low-iron ultra-white tempered photovoltaic glass.

[0036] Preferably, the first copper-clad backplane can be black, or it can be white, red, orange, yellow, green, blue, indigo, violet or other colors.

[0037] Beneficial effects: This application uses an OCA optical adhesive and tempered glass solar module encapsulation process, which can improve the service life of SMT small solar modules in multi-impact environments.

[0038] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A solar energy shock-resistant module, characterized in that, The process involves stacking a backplate, solder paste layer, solar cell layer, first front encapsulation film, second front encapsulation film, and first front transparent front panel from bottom to top, and then laminating them together to form a laminated module. OCA optical adhesive and tempered glass are placed on the laminated module, and after vacuuming and removing air bubbles, it is cured to form a solar impact-resistant module.

2. The solar impact-resistant module according to claim 1, characterized in that, The OCA optical adhesive is an OCA optical adhesive with the light release film removed.

3. The solar impact-resistant module according to claim 1, characterized in that, The backplate is a copper-clad backplate.

4. The solar impact-resistant module according to claim 3, characterized in that, The copper-clad backplane includes: OSP double-sided copper-clad FR-4 epoxy resin board.

5. The solar impact-resistant module according to claim 3, characterized in that, The copper-clad backplane can be black, white, or colored.

6. The solar impact-resistant module according to claim 1, characterized in that, The solar cell is an IBC cell.

7. The solar impact-resistant module according to claim 1, characterized in that, The first front encapsulation film and the second front encapsulation film are any one of the following materials: EVA, POE, and EPE.

8. The solar impact-resistant module according to claim 1, characterized in that, The first front transparent panel is made of any one of the following materials: PET or CPC.

9. The solar impact-resistant module according to claim 1, characterized in that, The tempered glass is low-iron ultra-white tempered photovoltaic glass.

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