Opto-coupler and method of manufacturing the same

Abstract

The application belongs to the field of photoelectric couplers, and discloses a photoelectric coupler and a manufacturing method thereof. The photoelectric coupler comprises a substrate, a light-emitting chip, a conductive column, a light-receiving chip and a light-transmitting isolation piece. The light-emitting chip and the conductive column are arranged on the substrate and are electrically connected with the substrate. The light-receiving chip is mounted on the conductive column and is electrically connected with the conductive column. The light-transmitting isolation piece is arranged between the light-emitting chip and the light-receiving chip and is used for electrical insulation between the light-emitting chip and the light-receiving chip. The light-emitting side surface of the light-emitting chip and the light-receiving side surface of the light-receiving chip are respectively attached to opposite sides of the light-transmitting isolation piece. The photoelectric coupler can simplify the overall manufacturing process of the photoelectric coupler, reduce the production and processing difficulty, and effectively improve the production efficiency.

Description

Technical Field

[0001] This application belongs to the field of optocoupler technology, specifically relating to an optocoupler and its manufacturing method. Background Technology

[0002] An optocoupler is an optoelectronic device that uses light as a medium to transmit electrical signals. Its core advantage lies in its excellent electrical isolation performance for input and output electrical signals, which can effectively suppress circuit interference and improve system safety and stability. Therefore, it is widely used in various electronic devices such as small household appliances, smart wearables, smartphones, industrial devices, and automobiles.

[0003] In the packaging process of optocouplers, electrical isolation between the light-emitting chip and the light-receiving chip is required. In most related technologies, optocoupler products are implemented by laminating multiple boards together, which is a complex process. Summary of the Invention

[0004] The purpose of this application is to provide an optocoupler that simplifies the overall manufacturing process of optocouplers, reduces production difficulty, and effectively improves production efficiency.

[0005] To achieve the above objectives, this application provides an optocoupler, including a substrate, a light-emitting chip, a conductive pillar, a light-receiving chip, and a light-transmitting isolator; the light-emitting chip and the conductive pillar are disposed on the substrate and electrically connected to the substrate; the light-receiving chip is mounted on the conductive pillar and electrically connected to the conductive pillar; the light-transmitting isolator is disposed between the light-emitting chip and the light-receiving chip for electrical insulation between the light-emitting chip and the light-receiving chip, and the light-emitting side of the light-emitting chip and the light-receiving side of the light-receiving chip are respectively attached to opposite sides of the light-transmitting isolator.

[0006] Optionally, multiple conductive pillars are provided, and the conductive pillars are located outside the light-emitting chip.

[0007] Optionally, the light-transmitting isolation component includes a light-transmitting plate, and the plane on which the light-transmitting plate is located, the plane on which the light-emitting chip is located, and the plane on which the light-receiving chip is located are parallel to each other.

[0008] Optionally, the optocoupler further includes a light-transmitting adhesive layer, wherein the light-emitting side of the light-emitting chip and the light-receiving side of the light-receiving chip are respectively bonded to the opposite sides of the light-transmitting isolator through the light-transmitting adhesive layer.

[0009] Optionally, the light-transmitting adhesive layer includes a die-attach film (DAF) or a light-transmitting adhesive.

[0010] Optionally, solder paste is provided at both ends of the conductive post along its length, the substrate is connected to one end of the conductive post through the solder paste, and the light-receiving chip is connected to the other end of the conductive post through the solder paste.

[0011] Optionally, a conductive region is provided on the side of the light-emitting chip facing away from the substrate. The conductive region is located at the edge of the light-emitting chip and is bonded to the substrate.

[0012] Optionally, the optocoupler further includes a molding compound that encapsulates the light-emitting chip, the conductive pillar, the light-receiving chip, and the light-transmitting isolator.

[0013] Based on the above technical solutions, this application also provides a method for manufacturing an optocoupler, the method comprising: bonding a light-emitting chip to one side of a substrate in the thickness direction, wherein the light-emitting side of the light-emitting chip is disposed away from the substrate; bonding a light-transmitting isolator to the side of the light-emitting chip away from the substrate; electrically connecting the light-emitting chip to the substrate; disposing a conductive post on the substrate, wherein the conductive post and the light-emitting chip are located on the same side of the substrate; and connecting a light-receiving chip to the end of the conductive post away from the substrate.

[0014] Optionally, multiple sets of the light-emitting chip and the light-receiving chip are correspondingly arranged on the substrate, and the multiple sets of the light-emitting chip and the light-receiving chip are arranged in an array on the substrate; after connecting the light-receiving chip to the end of the conductive post away from the substrate, the method further includes: providing a molding compound on the substrate so that the molding compound encapsulates the light-emitting chip, the conductive post, the light-receiving chip and the light-transmitting isolator; cutting along the thickness direction of the substrate between each set of the light-emitting chip and the light-receiving chip to form an optocoupler unit.

[0015] Compared with the prior art, this application has the following beneficial effects: The optocoupler of this application includes a substrate, a light-emitting chip, a conductive pillar, a light-receiving chip, and a light-transmitting isolator. The light-emitting chip and the conductive pillar are both disposed on the substrate and electrically connected to the substrate to achieve circuit conduction at the circuit input end. The light-receiving chip is mounted on the conductive pillar, and the conductive pillar enables electrical connection between the light-receiving chip and the substrate, forming a circuit output path. By disposing of the light-emitting chip and the light-receiving chip between them, the light-transmitting isolator is used for electrical insulation between the light-emitting chip and the light-receiving chip. At the same time, the light-emitting side of the light-emitting chip and the light-receiving side of the light-receiving chip are respectively attached to opposite sides of the light-transmitting isolator, forming a face-to-face optical signal transmission structure.

[0016] Compared to traditional multi-board lamination isolation methods, this application employs a method where a transparent isolator is directly sandwiched between the light-emitting chip and the light-receiving chip. This eliminates the need for complex processes such as multi-layer board alignment and lamination, significantly simplifying the overall packaging process of the optocoupler, reducing manufacturing difficulty, and effectively improving production efficiency and product yield. The transparent isolator, bonded to the light-emitting and light-receiving chips, can specifically block the communication between input and output electrical signals, avoiding gaps and misalignment issues between layers of multi-layer boards, thus preventing leakage, electrical crosstalk, and isolation failure defects, and significantly improving the electrical safety and anti-interference capability of the optocoupler. Furthermore, this application eliminates the need for multi-layer insulating board stacking, significantly reducing the overall structural thickness and volume, thereby facilitating a reduction in product size. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a cross-sectional schematic diagram of an optocoupler provided in an embodiment of this application; Figure 2 This is a schematic diagram of the optocoupler fabrication method provided in the embodiments of this application; Figure 3 A cross-sectional schematic diagram showing the connection between the light-emitting chip and the substrate of the optocoupler provided in the embodiment of this application; Figure 4 A cross-sectional schematic diagram showing the connection between the light-transmitting isolator and the light-emitting chip in an embodiment of this application; Figure 5 A cross-sectional schematic diagram showing the electrical connection between the light-emitting chip and the substrate of the optocoupler provided in the embodiments of this application; Figure 6 A cross-sectional schematic diagram of solder paste applied on a substrate according to an embodiment of this application; Figure 7 A cross-sectional schematic diagram showing the connection between the conductive post and the substrate of the optocoupler provided in the embodiment of this application; Figure 8 A cross-sectional schematic diagram of solder paste applied to conductive pillars provided in an embodiment of this application; Figure 9 A cross-sectional schematic diagram showing the connection between the light-receiving chip and the conductive post of the optocoupler provided in the embodiment of this application; Figure 10 This is a top view of the optocoupler before cutting, as provided in an embodiment of this application.

[0019] Explanation of reference numerals in the attached drawings: 10, substrate; 11, pin; 20, light-emitting chip; 21, light-emitting side; 211, conductive area; 212, light-emitting area; 22, solder wire; 23, chip adhesive; 30, conductive pillar; 31, solder paste; 40, light-receiving chip; 41, light-receiving side; 411, light-sensing area; 50, light-transmitting isolator; 51, light-transmitting plate; 60, light-transmitting adhesive layer; 70, molding compound. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] like Figure 1 As shown, this application embodiment provides an optocoupler, including a substrate 10, a light-emitting chip 20, a conductive post 30, a light-receiving chip 40, and a light-transmitting isolator 50; the light-emitting chip 20 and the conductive post 30 are disposed on the substrate 10 and electrically connected to the substrate 10; the light-receiving chip 40 is mounted on the conductive post 30 and electrically connected to the conductive post 30; the light-transmitting isolator 50 is disposed between the light-emitting chip 20 and the light-receiving chip 40 for electrical insulation isolation between the light-emitting chip 20 and the light-receiving chip 40, and the light-emitting side 21 of the light-emitting chip 20 and the light-receiving side 41 of the light-receiving chip 40 are respectively attached to the opposite sides of the light-transmitting isolator 50.

[0022] Through the above technical solution, the optocoupler of this application includes a substrate 10, a light-emitting chip 20, a conductive post 30, a light-receiving chip 40, and a light-transmitting isolator 50. The light-emitting chip 20 and the conductive post 30 are both disposed on the substrate 10 and electrically connected to the substrate 10 to realize the circuit conduction at the circuit input end. The light-receiving chip 40 is mounted on the conductive post 30, and the conductive post 30 realizes the electrical connection between the light-receiving chip 40 and the substrate 10, forming a circuit output path. By disposing of the light-emitting chip 20 and the light-receiving chip 40, the light-transmitting isolator 50 is used for electrical insulation isolation between the light-emitting chip 20 and the light-receiving chip 40. At the same time, the light-emitting side 21 of the light-emitting chip 20 and the light-receiving side 41 of the light-receiving chip 40 are respectively attached to the opposite sides of the light-transmitting isolator 50 to form a face-to-face optical signal transmission structure.

[0023] Compared to traditional multi-plate lamination isolation methods, this application employs a light-transmitting isolator 50 directly sandwiched between the light-emitting chip 20 and the light-receiving chip 40. This eliminates the need for complex processes such as multi-layer board alignment and lamination, significantly simplifying the overall packaging process of the optocoupler, reducing manufacturing difficulty, and effectively improving production efficiency and product yield. The light-transmitting isolator 50, bonded to the light-emitting chip 20 and the light-receiving chip 40, can specifically block the communication between input and output electrical signals, avoiding gaps and misalignment issues between multi-layer boards, eliminating leakage, electrical crosstalk, and isolation failure defects, and significantly improving the electrical safety and anti-interference capability of the optocoupler. Furthermore, this application eliminates the need for multi-layer insulating board stacking, significantly reducing the overall structural thickness and volume, thus facilitating a reduction in product size.

[0024] Additionally, refer to Figure 1 As shown, the light-transmitting isolator 50 of this application is attached to the light-emitting chip 20 and the light-receiving chip 40 on opposite sides respectively, without gaps. The light signal transmission path is short, which effectively reduces the problems of light signal attenuation and scattering, ensures the accuracy and stability of light signal transmission, and improves the signal transmission performance of the optocoupler.

[0025] like Figure 1 As shown, in an optional embodiment of this application, multiple conductive pillars 30 can be configured, and the conductive pillars 30 are located outside the light-emitting chip 20. With this configuration, multiple conductive pillars 30 can form a stable support without affecting the coupling between the light-emitting chip 20 and the light-receiving chip 40.

[0026] The conductive post 30 can be set to two or more, and this application does not impose specific restrictions on it.

[0027] In one example configuration, the conductive pillars 30 may be located on opposite sides of the light-emitting chip 20 to provide stable support for the light-receiving chip 40 from opposite sides.

[0028] In another example, the conductive pillar 30 may also be arranged around the light-emitting chip 20 to provide stable support for the light-receiving chip 40 from a circumferential direction.

[0029] like Figure 1As shown, in an optional embodiment of this application, the light-transmitting isolator 50 may include a light-transmitting plate 51, the plane of the light-transmitting plate 51, the plane of the light-emitting chip 20, and the plane of the light-receiving chip 40 being parallel to each other. In the above technical solution, the light-transmitting plate 51 allows light signals to pass through and be transmitted. The parallelism of the plane of the light-transmitting plate 51, the plane of the light-emitting chip 20, and the plane of the light-receiving chip 40 enables precise alignment of the light-emitting side 21 of the light-emitting chip 20 and the light-receiving side 41 of the light-receiving chip 40, ensuring that the light emitted by the light-emitting chip 20 penetrates the light-transmitting isolator 50 perpendicularly and is uniformly projected onto the light-receiving surface of the light-receiving chip 40. Simultaneously, by making the plane of the light-transmitting plate 51, the plane of the light-emitting chip 20, and the plane of the light-receiving chip 40 parallel, the light-emitting chip 20, the light-transmitting plate 51, and the light-receiving chip 40 are stably attached, with uniform force distribution, improving the structural stability and service life of the product.

[0030] In this application, the light-transmitting plate 51 can be made of transparent epoxy resin or optical glass. Both transparent epoxy resin and optical glass have excellent visible light transmittance and electrical insulation properties, which can stably achieve electrical isolation between the light-emitting chip 20 and the light-receiving chip 40 without blocking the transmission of light signals.

[0031] In optional embodiments of this application, such as Figure 1 As shown, the optocoupler may further include a light-transmitting adhesive layer 60. The light-emitting side 21 of the light-emitting chip 20 and the light-receiving side 41 of the light-receiving chip 40 are respectively bonded to the opposite sides of the light-transmitting isolator 50 through the light-transmitting adhesive layer 60. The light-transmitting adhesive layer 60 achieves a tight fit and fixation between the light-transmitting isolator 50 and the light-emitting chip 20 and the light-receiving chip 40, eliminating assembly gaps and avoiding light scattering and air refraction loss caused by gaps, further reducing optical signal attenuation; moreover, the adhesive fixing method has a stable structure, which can effectively prevent the light-emitting chip 20, the light-receiving chip 40 and the light-transmitting isolator 50 from shifting or falling off during subsequent packaging and use, improving the overall structural robustness and reliability.

[0032] In addition, the light-transmitting adhesive layer 60 has both adhesive and insulating properties, which can further enhance the electrical isolation performance between the light-emitting chip 20 and the light-receiving chip 40 and improve the electrical safety of the product.

[0033] In an optional embodiment of this application, the light-transmitting adhesive layer 60 may include a chip adhesive film or a light-transmitting adhesive. Both the chip adhesive film and the light-transmitting adhesive have the characteristics of high light transmittance, high insulation and strong adhesion. While ensuring firm adhesion and electrical isolation, they will not block or absorb the light signal, thus ensuring smooth light path.

[0034] In optional embodiments of this application, such as Figure 1As shown, solder paste 31 is provided at both ends of the conductive post 30 along its length. The substrate 10 is connected to one end of the conductive post 30 through the solder paste 31, and the light-receiving chip 40 is connected to the other end of the conductive post 30 through the solder paste 31. The solder paste 31 has a mature soldering process and excellent conductivity, which can achieve low-resistance conduction between the conductive post 30, the substrate 10, and the light-receiving chip 40, ensuring smooth electrical signal transmission, reducing circuit loss, and improving the electrical transmission performance of the product.

[0035] In optional embodiments of this application, such as Figure 1 and Figure 5 As shown, a conductive region 211 is provided on the side of the light-emitting chip 20 facing away from the substrate 10. The conductive region 211 is located at the edge of the light-emitting chip 20 and is bonded to the substrate 10. Positioning the conductive region 211 at the edge of the light-emitting chip 20 avoids obstructing the light path and affecting the light emission effect, ensuring the light emission efficiency and uniformity of the light-emitting chip 20. The bonding connection method offers high connection precision, small size, and high integration, requiring no additional assembly space, while also providing strong bonding stability. Figure 5 As shown, the conductive area 211 can be bonded to the substrate 10 using welding wire 22.

[0036] In optional embodiments of this application, such as Figure 1 As shown, the optocoupler may also include a molding compound 70, which encapsulates the light-emitting chip 20, the conductive pillar 30, the light-receiving chip 40, and the light-transmitting isolator 50. The molding compound 70 provides all-around protection for the light-emitting chip 20, the conductive pillar 30, the light-receiving chip 40, and the light-transmitting isolator 50, effectively isolating them from external dust, moisture, oil, and impurities, while also achieving overall insulation protection for the product. In addition, the molding compound 70 can solidify the internal structure, limiting the displacement and deformation of each component and improving the overall structural strength of the product.

[0037] Based on the above technical solutions, this application also provides a method for manufacturing an optocoupler, such as... Figure 2 As shown, the method includes: S100, the light-emitting chip 20 is bonded to one side of the substrate 10 in the thickness direction, wherein the light-emitting side 21 of the light-emitting chip 20 is disposed away from the substrate 10.

[0038] like Figure 3 As shown, the substrate 10 has pins 11, which allow the light-emitting chip 20 to be bonded to the side of the substrate 10 away from the pins 11, ensuring that the light-emitting side 21 of the light-emitting chip 20 faces upwards away from the substrate 10. Please refer to [reference needed]. Figure 1 The light-emitting chip 20 can be bonded to the substrate 10 using chip adhesive 23.

[0039] S200, the light-transmitting insulating component 50 is bonded to the side of the light-emitting chip 20 away from the substrate 10.

[0040] like Figure 4 As shown, the light-transmitting isolator 50 is bonded to the side of the light-emitting chip 20 facing away from the substrate 10, that is, the light-transmitting isolator 50 is bonded and fixed on the upper side of the light-emitting chip 20. Please refer to [reference needed]. Figure 1 The light-emitting chip 20 has a light-emitting area 212, and the light-transmitting insulating element 50 completely covers the light-emitting area 212.

[0041] S300, Electrically connect the light-emitting chip 20 to the substrate 10.

[0042] like Figure 5 As shown, the light-emitting chip 20 can be bonded to the substrate 10 using welding wire 22, thereby realizing the electrical connection between the light-emitting chip 20 and the substrate 10 and achieving circuit conduction.

[0043] S400. The conductive post 30 is disposed on the substrate 10, wherein the conductive post 30 and the light-emitting chip 20 are located on the same side of the substrate 10.

[0044] like Figure 6 As shown, solder paste 31 can be applied to the substrate 10 first, and then surface mount technology (SMT) can be used to install the substrate according to the solder paste 31. Figure 7 As shown, one end of the conductive post 30 is fixedly connected to the substrate 10.

[0045] S500, connect the light-receiving chip 40 to the end of the conductive post 30 away from the substrate 10.

[0046] like Figure 8 As shown, solder paste 31 can be applied to the other end of the conductive post 30 using a stencil printing process, and then flip-chip equipment can be used to... Figure 9 The other end of the conductive post 30 is connected to the light-receiving chip 40, which means that the light-receiving chip 40 is connected and fixed to the top of the conductive post 30; please refer to... Figure 1 The light-receiving chip 40 has a light-sensing area 411 corresponding to the light-emitting area 212. Similarly, the light-transmitting isolation element 50 completely covers the light-sensing area 411 to ensure the optical signal transmission performance.

[0047] In summary, the above manufacturing method adopts a progressive process of first fixing the light-emitting chip 20, then assembling the light-transmitting isolator 50, and finally connecting the circuit and the light-receiving chip 40. This process can achieve precise alignment and quality inspection at each step, promptly identify defects such as assembly deviations and poor adhesion, and significantly improve product yield and assembly accuracy. Moreover, this manufacturing process does not require complex processes such as multi-layer board stacking, alignment, pressing, and curing, which greatly simplifies the production steps, reduces the difficulty of the process and the requirements for production equipment, and effectively reduces production energy consumption and processing costs.

[0048] Please refer to Figure 1 and Figure 9 When connecting the light-collecting chip 40 to the end of the conductive post 30 away from the substrate 10, the light-collecting chip 40 can be connected to the light-transmitting insulating member 50 through the light-transmitting adhesive layer 60 at the same time.

[0049] To ensure a seamless connection, refer to Figure 1 and Figure 9 This allows the sum of the heights of the conductive pillar 30 and the solder paste 31 at both ends of the conductive pillar 30 to be equal to the sum of the heights of the light-emitting chip 20, the chip adhesive 23, the light-transmitting isolator 50, and the light-transmitting adhesive layer 60.

[0050] In this application, the conductive post 30 can be made of copper or copper alloy. Copper and copper alloy have excellent electrical conductivity, high mechanical strength, and are not easily deformed, and can stably bear the supporting load and circuit conduction function of the light receiving chip 40.

[0051] In an optional embodiment of this application, multiple sets of light-emitting chips 20 and light-receiving chips 40 are correspondingly arranged on the substrate 10, and multiple sets of light-emitting chips 20 and light-receiving chips 40 are arranged in an array on the substrate 10. After connecting the light-receiving chip 40 to the end of the conductive post 30 away from the substrate 10, the method may further include: providing a molding compound 70 on the substrate 10 so that the molding compound 70 encapsulates the light-emitting chip 20, the conductive post 30, the light-receiving chip 40 and the light-transmitting isolator 50; cutting along the thickness direction of the substrate 10 between each set of light-emitting chips 20 and light-receiving chips 40 to form an optocoupler unit.

[0052] Traditional processes mostly involve individual packaging, which is cumbersome and has extremely low production efficiency, making it impossible to meet the demands of large-scale markets. Figure 10 As shown, this application arranges multiple sets of light-emitting chips 20 and light-receiving chips 40 in an array on a single substrate 10, realizing the synchronous integration of multiple sets of optocouplers. This allows for the simultaneous assembly, bonding, and encapsulation of multiple sets of light-emitting chips 20 and light-receiving chips 40 on a single substrate 10, eliminating the need for individual processing. This significantly increases the output per production run, greatly improves production efficiency, and reduces production time and cost per unit. Furthermore, the array-based unified assembly and encapsulation process ensures high consistency in assembly accuracy, structural parameters, and protective effects across all products, effectively solving the problems of large parameter differences and poor product consistency in traditional single-unit production, and significantly improving overall product quality and standardization.

[0053] It should be understood that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims.

Claims

1. An optocoupler, characterized in that, The device includes a substrate, a light-emitting chip, a conductive pillar, a light-receiving chip, and a light-transmitting isolator. The light-emitting chip and the conductive pillar are disposed on the substrate and electrically connected to the substrate. The light-receiving chip is mounted on the conductive pillar and electrically connected to the conductive pillar. The light-transmitting isolator is disposed between the light-emitting chip and the light-receiving chip for electrical insulation between the two chips. The light-emitting side of the light-emitting chip and the light-receiving side of the light-receiving chip are respectively attached to opposite sides of the light-transmitting isolator.

2. The optocoupler according to claim 1, characterized in that, The conductive pillars are configured as multiple pillars, and the conductive pillars are located outside the light-emitting chip.

3. The optocoupler according to claim 1, characterized in that, The light-transmitting isolation component includes a light-transmitting plate, and the plane on which the light-transmitting plate is located, the plane on which the light-emitting chip is located, and the plane on which the light-receiving chip is located are parallel to each other.

4. The optocoupler according to any one of claims 1 to 3, characterized in that, The optocoupler further includes a light-transmitting adhesive layer, wherein the light-emitting side of the light-emitting chip and the light-receiving side of the light-receiving chip are respectively bonded to the opposite sides of the light-transmitting insulating component through the light-transmitting adhesive layer.

5. The optocoupler according to claim 4, characterized in that, The light-transmitting adhesive layer includes a chip adhesive film or a light-transmitting adhesive.

6. The optocoupler according to any one of claims 1 to 3, characterized in that, Solder paste is provided at both ends of the conductive post along its length. The substrate is connected to one end of the conductive post through the solder paste, and the light-receiving chip is connected to the other end of the conductive post through the solder paste.

7. The optocoupler according to any one of claims 1 to 3, characterized in that, A conductive region is provided on the side of the light-emitting chip away from the substrate. The conductive region is located at the edge of the light-emitting chip and is bonded to the substrate.

8. The optocoupler according to any one of claims 1 to 3, characterized in that, The optocoupler also includes a molding compound that encapsulates the light-emitting chip, the conductive pillar, the light-receiving chip, and the light-transmitting isolator.

9. A method for fabricating an optocoupler, characterized in that, The method includes: The light-emitting chip is bonded to one side of the substrate in the thickness direction, wherein the light-emitting side of the light-emitting chip is disposed away from the substrate; The light-transmitting insulating component is bonded to the side of the light-emitting chip that is away from the substrate; The light-emitting chip is electrically connected to the substrate; Conductive pillars are disposed on the substrate, wherein the conductive pillars and the light-emitting chip are located on the same side of the substrate; The light-collecting chip is connected to the end of the conductive post that is away from the substrate.

10. The method for manufacturing an optocoupler according to claim 9, characterized in that, The light-emitting chip and the light-receiving chip are respectively arranged in multiple sets on the substrate, and the multiple sets of light-emitting chips and light-receiving chips are arranged in an array on the substrate; After connecting the light-receiving chip to the end of the conductive post away from the substrate, the method further includes: A molding compound is disposed on the substrate so that the molding compound encapsulates the light-emitting chip, the conductive pillar, the light-receiving chip, and the light-transmitting insulating component; Cut along the thickness direction of the substrate between each group of light-emitting chips and light-receiving chips to form an optocoupler unit.

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