Photovoltaic module encapsulation method and apparatus

Abstract

The application discloses a photovoltaic module packaging method and device, and relates to the technical field of photovoltaic technology. The application forms a positioning cooperation between the edge of a photovoltaic laminate and a packaging device to jointly define a forming space, and provides an insulating material with fluidity without shielding a main power generation area. Before or during the shaping of the insulating material, physical bubble removal, chemical bubble removal or rheological parameter control are used to make the insulating material in a state without micro-bubbles, and the insulating material is shaped to form an insulating packaging layer covering at least part of the side edge of the laminate. Meanwhile, in the forming process, in-situ replication or post-demoulding processing is used to form surface texture traces on the outer surface of the insulating packaging layer. The application eliminates interface bubbles and virtual interface peeling, significantly improves the breakdown voltage and volume resistivity, greatly improves the shearing peeling strength between the insulating packaging layer and the photovoltaic module and the aluminum plate, and avoids the risk of frame peeling under outdoor strong wind load.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and more specifically to a photovoltaic module packaging method and apparatus. Background Technology

[0002] In the field of photovoltaic module technology, improving photoelectric conversion efficiency and power density is the core development direction. In traditional photovoltaic module design, a large safety distance (usually 1000 m²) must be maintained between the solar cells and the module edge. This is to meet the requirements for electrical insulation and creepage distance. The area within this distance cannot be used to install solar cells, forming an ineffective border area.

[0003] In recent years, reducing creepage distance technology (i.e., narrow edge distance technology) has become an important direction for innovation in the industry. Its technical principle is as follows: Around the perimeter of a photovoltaic laminate formed by laminating cover glass, encapsulating film, solar cells, and backsheet, an insulating material is coated or filled to form a continuous insulating encapsulation layer. This insulating encapsulation layer replaces the original air insulation gap, thereby compressing the distance from the solar cell to the module edge to a minimum while ensuring electrical safety. Even smaller, directly increasing power generation capacity.

[0004] To clearly understand the solutions in existing technologies, the following methods are typically used for comparative analysis:

[0005] 1. A pre-formed insulating tape bonding solution, Chinese Utility Model Patent Authorization Announcement No.: CN224319794U, Applicant: Trina Solar Co., Ltd., Patent Title: "Laminated Unit, Photovoltaic Module and Photovoltaic System": This technology discloses using pre-formed U-shaped insulating tape to wrap the sides of the laminate and extend to the upper and lower surfaces, and then bonding and fixing it with a pressure-sensitive adhesive outer layer. Its inherent drawbacks are: it relies on the mechanical bonding between the solid tape and the laminate, resulting in physical gaps at the microscopic unevenness of the laminate's cut cross-section, making it impossible to actively eliminate microscopic air bubbles at the interface, which easily leads to high-voltage breakdown due to air bubble inclusion; furthermore, it lacks a mold forming and shaping refinement process, failing to meet the requirements of... Ultra-narrow pitch precision packaging.

[0006] 2. A monolithic molding solution, Chinese Invention Patent Announcement No.: CN106129148B, Applicant: Zhuhai Gree Electric Appliances Co., Ltd., Patent Title: "Photovoltaic Modules and Their Packaging Process": This technology discloses a method of monolithic molding by placing a substrate with battery strings in a mold and pouring a methyl methacrylate organic mixture into it. Essentially, it is a weight-reduction solution for the entire panel, replacing tempered glass. The encapsulation layer covers the entire surface of the battery cells, but does not address insulation at narrow edge distances; furthermore, it relies solely on passive venting through grooves on the substrate surface, lacking an active physical debubbling mechanism for edge interfaces.

[0007] 3. Plastic Frame Molding Solution, Chinese Invention Patent Application Publication No.: CN104104321A, Applicant: Hanhan Co., Ltd., Patent Title: "Plastic Frame and Photovoltaic Module with Plastic Frame and its Mold and Module Manufacturing System": This technology discloses molding a plastic frame around the solar panel through mold casting or 3DCNC milling to replace the metal frame. Essentially, it is a replacement solution for load-bearing structural components (frame assembly), not a pure electrical insulation layer, and lacks defoaming design to reduce creepage distance and prevent high-voltage breakdown.

[0008] 4. BIPV Edge Water-Blocking Solution, Chinese Utility Model Patent Authorization Announcement No.: CN217280799U, Applicant: Kaisheng New Energy Technology Co., Ltd., Patent Title: "A BIPV Photovoltaic Module Structure": This technology discloses filling the gaps at the edges of a BIPV double-glass module with butyl waterproof adhesive, and fixing it with pressure blocks. Its purpose is water and moisture blocking rather than electrical insulation. After adhesive injection, it naturally levels and fills the gaps, without precise constraints and finishing of the top, side, and bottom cavities, and without an active venting and defoaming mechanism.

[0009] 5. Injection Molding Integrated Packaging Solution, Chinese Utility Model Patent Authorization Announcement No.: CN222382032U, Applicant: Zhejiang Aiko Solar Energy Technology Co., Ltd., Patent Title: "An Injection Molded Component and Photovoltaic Component": This technology discloses a load-bearing structural component with a frame and mounting bracket formed by injection molding. The component is heavy and designed to replace traditional metal frames. It is not a pure insulating layer, and high-pressure injection molding can easily cause the glass at the edge of the laminate to shatter. Furthermore, it lacks an active de-bubbling design to guide insulation breakdown.

[0010] 6. Optimized Frame Sealant Solution, Chinese Utility Model Patent Authorization Announcement No.: CN224305723U, Applicant: Hefei GCL System Integration New Energy Technology Co., Ltd., Patent Title: "A Photovoltaic Frame and Photovoltaic Module": This technology discloses an optimization of the frame sealant distribution through overflow grooves and leveling holes in a frameless design. It only improves the flatness of the adhesive sealant between the frame and the laminate, without changing the distance from the solar cell to the edge, and does not involve active defoaming or edge cavity constraints.

[0011] 7. Continuous adhesive application equipment solution, Chinese Utility Model Patent Authorization Announcement No.: CN222789643U, Applicant: Jiangsu Xinhe New Material Technology Co., Ltd., Patent Title: "An adhesive application device for photovoltaic module processing": This technology discloses the use of a U-shaped scraper, hydraulic guide, and pressure sensor for continuous and uniform adhesive application at the edges. Essentially, it is merely an automated adhesive application device, lacking mold cavity forming constraints and active defoaming mechanisms such as vacuum or vibration.

[0012] In summary, reducing creepage distance technology faces severe challenges in industrial implementation: when fluid materials coat the edges of laminated components, air bubbles are easily trapped due to interlayer gaps and burrs, leading to a sharp drop in breakdown voltage; Under narrow margin constraints, the loss of control over fluid dynamic viscosity and thixotropy can easily lead to severe adhesive overflow contamination of the cover glass or create dead-angle voids. Furthermore, when the smooth outer surface of the insulating encapsulation layer is covered with adhesive for the aluminum frame (aluminum plate) during subsequent installation, the small contact area between the frame adhesive and the insulating layer can easily cause the module to detach from the aluminum plate (frame detachment) under strong outdoor wind loads.

[0013] Therefore, it is necessary to propose a photovoltaic module encapsulation method and apparatus to solve the above problems. Summary of the Invention

[0014] The purpose of this invention is to solve the problem of how to provide an insulating encapsulation layer that is bubble-free, high-precision, and can guide adhesive filling to increase the contact area and prevent frame detachment during subsequent aluminum plate assembly, thus reducing creepage distance at the edge of the photovoltaic module.

[0015] To achieve the above objectives, the present invention specifically adopts the following technical solution:

[0016] A photovoltaic module encapsulation method for forming an insulating encapsulation layer at the edge of a photovoltaic laminate to shorten creepage distance includes the following steps:

[0017] The edge region of the photovoltaic laminate is positioned and matched with the encapsulation device, and together with the edge of the photovoltaic laminate, they define a molding space. The outline of the molding space at least defines the geometric outline of the insulating encapsulation layer on the side of the photovoltaic laminate, and the molding space does not obstruct the main power generation area of ​​the photovoltaic laminate.

[0018] An insulating material with fluidity is supplied or formed within the molding space;

[0019] Before or during the shaping process of the insulating material, the insulating material is placed in a state where air bubbles are eliminated, air bubbles are suppressed, or microscopic air bubbles are absent.

[0020] The insulating material within the molding space is shaped to form an insulating encapsulation layer that attaches to or covers at least a portion of the side edge of the photovoltaic laminate. The insulating encapsulation layer is used to provide electrical insulation to replace air insulation gaps or shorten the creepage distance required for photovoltaic modules.

[0021] Furthermore, the encapsulation method is implemented online or offline after the photovoltaic laminate is laminated, or it is implemented synchronously with the lamination process of the photovoltaic laminate.

[0022] Furthermore, the thickness of the insulating encapsulation layer on the side of the photovoltaic laminate is [missing information]. The insulating encapsulation layer covers the side surface of the photovoltaic laminate and extends to cover the top and / or bottom edges of the photovoltaic laminate, with a coverage width of [missing information - likely a measurement value]. .

[0023] Furthermore, the insulating encapsulation layer presents a symmetrical or asymmetrical U-shaped cross-section covering the top, side, and bottom surfaces, or presents an L-shaped asymmetrical cross-section covering only the side and bottom surfaces.

[0024] Furthermore, the insulating encapsulation layer may be a continuous covering structure around the entire perimeter, a segmented covering structure, or a selective local covering structure implemented only for the corner areas or electric field concentration areas of the photovoltaic laminate.

[0025] Furthermore, the supply or formation of a fluid insulating material within the molding space includes: pressing adhesive into the molding space through an injection channel, pre-coating or spraying an insulating fluid before the encapsulation device is closed, melting and flowing a pre-placed solid insulating thermoplastic material within the molding space, or introducing a microfoaming precursor or active monomer fluid.

[0026] Furthermore, the dynamic viscosity of the fluid insulating material under shear or flow conditions is: The thixotropic index is The thixotropic index is the index of the material in terms of its properties. Viscosity under rotational shear and in The ratio of viscosity under rotational shear.

[0027] Furthermore, before supplying or forming insulating material into the molding space, a surface pretreatment step is performed on the edges of the photovoltaic laminate to improve interfacial wettability and suppress bubble generation; the surface pretreatment is selected from at least one of plasma treatment, flame treatment, laser cleaning, corona treatment, or coating with a wetting promoter.

[0028] Furthermore, the state of eliminating bubbles, suppressing bubbles, or being free of microbubbles is achieved through physical defoaming, chemical defoaming, or a combination thereof; wherein the physical defoaming is selected from at least one of vacuum suction, high-frequency vibration, ultrasonic cavitation, or pressurized exhaust.

[0029] Furthermore, the process parameters for physical defoaming are selected from: the vacuum degree of the vacuum suction is... The frequency of the high-frequency vibration is The frequency of the ultrasonic cavitation is The pressure of the pressurized exhaust is... At least one of them.

[0030] Furthermore, the chemical defoaming is achieved by adding an antifoaming agent or a chemical getter to the insulating material, or by pre-treating the insulating material with online degassing before it enters the molding space.

[0031] Furthermore, the shaping is selected from at least one of the following: heat curing, cooling solidification, ultraviolet or visible light radiation curing, moisture curing, microwave or radio frequency induction heating curing, electron beam radiation curing, or chemical self-initiated curing.

[0032] Furthermore, the outer surface of the molded insulating encapsulation layer has surface texture marks, which are used to guide the frame adhesive to fill into the surface texture marks when aluminum plates are assembled around the photovoltaic module and frame adhesive is extruded, so as to increase the contact area between the insulating encapsulation layer, the frame adhesive and the aluminum plate and form a physical interlock, preventing the photovoltaic module from detaching from the aluminum plate during operation; the surface texture marks are formed by pre-setting texture cavities on the inner wall of the encapsulation device and replicating them in situ during the molding process of the insulating material, or by post-processing after the insulating material is molded.

[0033] Furthermore, the post-processing technology is selected from at least one of laser micro-engraving, mechanical indentation or grooving, chemical etching or plasma surface reconstruction.

[0034] Furthermore, the surface texture marks are selected from at least one of serrated grooves, trapezoidal grooves, dovetail grooves, barbed grooves, arrayed microporous grooves, or irregular rough surfaces; the depth of the surface texture marks is [missing information]. Pitch is .

[0035] Furthermore, the insulating material is selected from two-component or multi-component co-extruded composite materials; during the co-extrusion process, the high-dielectric inner layer close to the side of the photovoltaic laminate uses a dielectric strength... The insulating material has a high-hardness outer layer. Materials.

[0036] Furthermore, in the corner area of ​​the photovoltaic laminate, the insulating encapsulation layer is formed into a large arc transition structure or has a corrugated stress-relieving expansion joint to absorb the shear stress generated by thermal expansion and contraction.

[0037] A photovoltaic module encapsulation apparatus for implementing the photovoltaic module encapsulation method described in any one of the above claims, comprising: an encapsulation apparatus body selected from a constraint mold, wherein the encapsulation apparatus forms a positioning fit with the edge of a photovoltaic laminate and jointly defines a molding space, the inner contour of the molding space at least defining the geometric contour of the insulating encapsulation layer on the side of the photovoltaic laminate; an injection channel disposed on or in cooperation with the encapsulation apparatus for providing a flowable insulating material to the molding space; an elastic sealing strip disposed on the contact interface between the encapsulation apparatus and the photovoltaic laminate, near the interface, or formed based on the rheological properties of the insulating material for preventing or limiting the overflow of the insulating material into the main power generation area; and an exhaust structure or high-frequency vibrator connected to the molding space or in cooperation with the encapsulation apparatus for venting gas or applying a physical defoaming field during the filling or shaping process.

[0038] Furthermore, the contact surface of the encapsulation device is processed with textured cavities to form surface texture marks for filling with frame adhesive on the outer surface of the insulating encapsulation layer; the textured cavities are selected from at least one of serrated grooves, trapezoidal grooves, dovetail grooves, barbed grooves, or arrayed microporous grooves.

[0039] Furthermore, the constraint mold is a split structure, including a side mold and an upper mold and / or a lower mold; the side mold is connected to the upper mold or the lower mold by a hydraulic lateral translation mechanism, which is used to laterally translate and open the mold after curing or shaping to release the surface texture marks on the outer surface of the insulating encapsulation layer.

[0040] Furthermore, it also includes a pressure-relieving overflow groove located at the edge of the constraining mold.

[0041] Furthermore, the constraint mold is also provided with mechanical limiting posts to limit the final thickness of the insulating encapsulation layer on the side of the photovoltaic laminate. .

[0042] Furthermore, the packaging device integrates a high-frequency vibrator for applying a physical vibration field to the insulating material within the molding space to actively defoam.

[0043] Furthermore, the front end of the packaging device is equipped with a surface pretreatment device, which is selected from at least one of a plasma spray gun, a flame treatment head, a laser cleaning head, or a corona treatment head.

[0044] Furthermore, the packaging device is also provided with a temperature control channel for introducing hot or cold fluid or a built-in electric heating element to achieve temperature-controlled curing or cooling solidification.

[0045] Furthermore, the encapsulation device integrates at least one energy or medium introduction structure selected from ultraviolet light irradiation window, microwave emitter, or moisture introduction airway.

[0046] Furthermore, the packaging device also includes a post-processing station located at the rear end of the packaging device, wherein a laser micro-engraving head is provided on the post-processing station for processing surface texture marks for filling the frame adhesive on the outer surface of the insulating packaging layer after demolding.

[0047] Furthermore, the constraint mold is directly integrated into the vacuum hot pressing chamber of the photovoltaic laminator, and is used to complete the injection and shaping of the edge insulating encapsulation layer while the photovoltaic laminate is being laminated, heated and vacuumed.

[0048] Furthermore, the encapsulation device has dedicated corner cavities in the four corner areas of the photovoltaic laminate, and the inner wall of the corner cavity has continuous corrugated grooves for forming corrugated stress-relieving expansion joints.

[0049] As a supplementary technical solution to this invention, a second process is disclosed: a process of applying adhesive / pre-setting the amount of adhesive followed by pressing and shaping. This invention also discloses a method for edge encapsulation of photovoltaic modules, comprising: pre-setting a fluid insulating material at the edge of the photovoltaic laminate, the pre-setting amount being [amount missing] of the target encapsulation volume. The constraint mold is pressed onto the edge of the photovoltaic laminate containing the insulating material for shaping; air bubbles are eliminated during pressing using mechanical extrusion, negative pressure suction, or a high-frequency vibrator; excess adhesive flows into the pressure-reducing overflow groove provided in the constraint mold, and the mechanical limiting posts control the side thickness to... Post-curing and shaping.

[0050] The finished structure obtained by this invention comprises an edge-insulated encapsulation structure prepared by the above method or encapsulation apparatus: the distance from the edge of the photovoltaic cell to the side of the photovoltaic laminate is... The insulating encapsulation layer covers the sides and extends to the top / bottom edges, with a side thickness of [missing information]. The outer surface of the insulating encapsulation layer has surface texture marks. When assembling the aluminum plates around the perimeter, frame adhesive is applied, filling the surface texture marks on the outer surface of the insulating encapsulation layer. This creates a large contact interface and physical interlocking anchoring, increasing the shear peel strength between the photovoltaic module and the aluminum plate. Vertical tensile strength The volume resistivity of the insulating encapsulation layer is The breakdown voltage is .

[0051] The beneficial effects of this invention are as follows:

[0052] 1. By controlling the dynamic viscosity and thixotropic index of the insulating fluid, combined with pre-treatment of the surface and an active defoaming mechanism, micro-bubbles and loose connections are eliminated, resulting in a volume resistivity of [missing value]. Breakdown voltage Water resistance <0.1g / m 2·day.

[0053] 2. By molding or post-processing surface texture marks on the outer surface of the insulating encapsulation layer, the mounting adhesive is guided to fully fill and enlarge the surface texture marks when installing the aluminum plates around the perimeter. This increases the bonding contact area between the insulating encapsulation layer, the mounting adhesive, and the aluminum plates, forming a strong physical interlocking anchor, thereby improving the shear peel strength between the photovoltaic module and the aluminum plate. The above measures effectively prevent the photovoltaic modules from detaching from the aluminum plate during operation and use, while also increasing the shear and peel strength between the insulating encapsulation layer and the photovoltaic module and aluminum plate. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of the molding space 304 defined by the combination of the constraint mold and the edge of the photovoltaic laminate in Embodiment 1 of the present invention, as well as the injection and venting of adhesive.

[0055] Figure 2 This is a partial cross-sectional schematic diagram of the outer surface of the insulating encapsulation layer 200 of different shapes of the present invention having surface texture marks 204 formed thereon;

[0056] Figure 3 This is a schematic diagram illustrating the functions of the glue-applying, pressing and shaping, and pressure-relieving overflow groove 310 and mechanical limiting post 311 in Embodiment 2 of the present invention.

[0057] Figure 4 This is a top view of the corrugated stress-relieving expansion joint 205 formed in the corner region 109 of the photovoltaic laminate in Embodiment 5 of the present invention.

[0058] Figure 5 This is a schematic diagram of synchronous lamination packaging in Embodiment 10 of the present invention, in which the constraint mold is integrated into the vacuum hot pressing cavity 317 of the photovoltaic laminator.

[0059] Figure Labels

[0060] 101. Top surface; 102. Side surface; 103. Bottom surface; 104. Cover glass; 105. Upper encapsulation film; 106. Battery cell; 107. Lower encapsulation film; 108. Backplate; 109. Corner area;

[0061] 200. Insulating encapsulation layer; 201. Side covering portion; 202. Top surface extension portion; 203. Bottom surface extension portion; 204. Surface texture marks; 205. Corrugated stress relief expansion joint;

[0062] 301a. Upper mold; 301b. Lower mold; 301c. Side mold; 302. Elastic sealing strip; 304. Molding space; 305. Injection channel; 306. Venting structure; 307. High-frequency vibrator; 308. Hydraulic lateral translation mechanism; 309. Temperature control channel; 310. Pressure relief overflow groove; 311. Mechanical limit post; 317. Vacuum hot pressing chamber. Detailed Implementation

[0063] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0064] In this invention, the top surface 101 of the photovoltaic laminate typically refers to the outer surface of the cover glass 104, the side surface 102 refers to the cut cross-section of the photovoltaic laminate, and the bottom surface 103 refers to the outer surface of the backplate 108. The photovoltaic laminate is formed by vacuum hot pressing together the cover glass 104, the upper encapsulating film 105, the solar cell 106, the lower encapsulating film 107, and the backplate 108.

[0065] Example 1

[0066] See Figure 1 , Figure 2 A photovoltaic module encapsulation method and apparatus:

[0067] Device Assembly and Mold Positioning: The encapsulation device uses a constraint mold, comprising an upper mold 301a, a lower mold 301b, and a side mold 301c. Fluororubber elastic sealing strips 302 are embedded in the contact surfaces of the upper mold 301a and lower mold 301b with the top surface 101 and bottom surface 103 of the photovoltaic laminate. The side mold 301c is connected to the upper mold 301a via a hydraulic lateral translation mechanism 308. The inner wall of the side mold 301c is machined with a depth of... Pitch is The cavity features an inverted trapezoidal sawtooth pattern. This constraint mold is fitted around the perimeter of the already laminated photovoltaic laminate, with the distance from the edge of the solar cell 106 to the side surface 102 being... The junction between the constraint mold and the photovoltaic laminate is sealed by an elastic sealing strip 302, which together define a closed molding space 304. The molding space 304 covers the edge of the top surface 101. All sides 102 and the edges of the bottom surface 103 It has a symmetrical U-shaped cross-section.

[0068] Fluid supply and physical defoaming: A two-component addition-type liquid silicone rubber fluid was selected. The dynamic viscosity under the injection shear condition is: The thixotropic index is , viscosity is , viscosity is Fluid is injected through the injection channel 305 at the bottom of the side mold 301c, while simultaneously activating the vacuum pump connected to the venting structure 306 to maintain the molding space 304 at a constant temperature. Vacuum level, and activate the high-frequency exciter 307 integrated on the side mold 301c, vibration frequency. ,amplitude Continuous physical degassing and defoaming .

[0069] Stepped temperature control for shaping and side mold opening: Temperature is controlled by energizing the built-in temperature control channel 309 of the constraint mold, firstly... Insulation Fully wet the colloid and degas it, then raise the temperature to... Keep After heat curing, the hydraulic lateral translation mechanism 308 drives the side mold 301c to move laterally to open the mold, smoothly releasing the surface texture marks 204 on the outer surface. Then the upper mold 301a and the lower mold 301b separate and demold.

[0070] Molding parameters and aluminum plate assembly interlocking test: The thickness of the side covering part 201 of the insulating encapsulation layer 200 is obtained. The coverage width of the top extension 202 and the bottom extension 203 is both The outer surface has regular inverted trapezoidal sawtooth surface texture marks 204. When assembling aluminum plates around the perimeter, mounting adhesive is pressed in, and the mounting adhesive is squeezed and filled into the surface texture marks 204 on the outer surface of the insulating encapsulation layer 200.

[0071] Tests show that the breakdown voltage reaches Volume resistivity is The shear peel strength between the component and the aluminum plate reached Vertical tensile strength reaches Zero air bubbles, completely eliminating the possibility of the product falling off the frame.

[0072] Example 2

[0073] See Figure 3 This embodiment employs a process of applying glue followed by pressing and shaping, along with corresponding equipment:

[0074] Pre-applied adhesive: A triaxial coating machine is used to pre-apply adhesive containing [a specific ingredient] to the edges of the photovoltaic laminate. Non-silicone defoamer thermoplastic polyolefin (PO) melt colloid with dynamic viscosity of thixotropic index The preset glue amount is the target cavity volume. .

[0075] Mold pressing and overflow limiting: A constraint mold with a pressure-reducing overflow groove 310 and a rigid mechanical limiting post 311 is used to... The speed of pressing to the edge of the photovoltaic laminate, the pressing pressure . The colloid is smoothly squeezed into the pressure overflow tank 310, and the mechanical limiting post 311 precisely limits the final thickness of the side 102. .

[0076] Ultrasonic defoaming and barbed groove forming: During the pressing and holding stage, the ultrasonic high-frequency vibrator 307 integrated with the constraint mold is activated to apply pressure. ultrasonic pulse This causes residual microbubbles at the interface to collapse and escape, allowing the colloid to smoothly fill the pre-set barbed cavity of the side mold 301c. Cooling water is circulated through the mold (cooling rate...). Solidification and demolding, forming a deep layer on the outer surface. The surface texture of the barbed groove is 204. After the aluminum plate is assembled with adhesive, the shear peel strength reaches... Breakdown voltage .

[0077] Example 3

[0078] See Figure 4 Four aspects of photovoltaic laminates Corner area 109:

[0079] Special corner molds with continuous corrugated grooves are installed in 109 sets at the four corner areas of the photovoltaic laminate, and the dynamic viscosity is injected. Addition-cure silicone. After heat curing, it forms a corrugated stress-relieving expansion joint 205, with a corrugation depth of... 102mm thickness on the side .exist After 200 cycles of thermal shock, the corner insulation layer showed no cracking or peeling, and the breakdown voltage remained stable at [value missing]. .

[0080] Example 4

[0081] A very narrow constraint mold is used, and the injected dynamic viscosity is at the upper limit. thixotropic index A single-component moisture-curing polyurethane fluid. Application Powerful pressurized exhaust, mechanical limit post 311 controls the final thickness of side 102 to the lower limit value. Introduce relative humidity Curing and demolding in humid air. Breakdown voltage test. Volume resistivity Shear peel strength .

[0082] Example 5

[0083] Using dynamic viscosity as the lower limit thixotropic index Addition-curing silicone. Precision elastic sealing strips 302 are used to pressurize and seal the mold contact surfaces to prevent overflow. Applying [something] within the molding space 304 Vacuum suction and Low-frequency vibration exhaust Heat-cured molding, side thickness 102. , Depth of serrations on the outer surface Pitch The insulating encapsulation layer is 200. Breakdown voltage. Shear peel strength of assembled aluminum plates after adhesive application .

[0084] Example 6

[0085] Surface pretreatment and smoothing: Atmospheric pressure plasma spray guns are used to perform plasma surface cleaning and activation on the side 102 of the photovoltaic laminate, reducing the contact angle to Set the inner wall smoothness roughness. A two-component silicone sealant is injected into a split-type constraint mold, heated and cured, and then demolded to obtain an insulating encapsulation layer 200 with a smooth outer surface.

[0086] Post-processing micro-engraving: The demolded components are sent to the post-processing station, where the laser micro-engraving head wavelength is utilized. Deep engraving on the outer surface of the insulating encapsulation layer 200 Pitch The dovetail groove array surface texture marks are 204. The surrounding aluminum plates are glued and extruded, achieving a shear peel strength of [value missing]. Breakdown voltage .

[0087] Example 7

[0088] See Figure 5 The constraint mold is directly integrated into the vacuum hot pressing chamber 317 of the photovoltaic laminator:

[0089] Stacking assembly: When the cover glass 104, upper encapsulation film 105 / lower encapsulation film 107, battery cell 106 and backplate 108 are stacked, the side mold 301c with temperature control channel 309 and exhaust structure 306 is simultaneously assembled on the edge, and the inner wall of the mold has textured cavity.

[0090] Integrated molding: During the vacuum heating stage of the laminator, the temperature... vacuum degree The thermoplastic polyolefin (PO) melt is simultaneously injected through the injection channel 305, with a dynamic viscosity of... The laminator utilizes its own vacuum and heating to simultaneously defoam, melt, and set the colloid. After demolding, the side surface is 102mm thick. Breakdown voltage After the aluminum plates around the perimeter are glued, the shear peel strength reaches [value missing]. .

[0091] Example 8

[0092] Using dynamic viscosity thixotropic index The material is a two-component polyurethane. A constrained mold is used, and surface pretreatment involves corona treatment. Physical defoaming is achieved using frequency... Ultrasonic cavitation and pressure The pressurized exhaust assembly. An insulating encapsulation layer 200 with an array of microporous groove surface textures 204 on the molded outer surface, and a side thickness of 102. Top / bottom cover width Test breakdown voltage Volume resistivity The shear peel strength of the aluminum plate after extrusion assembly of the components reaches [value missing]. .

[0093] Example 9

[0094] See Figure 1 , Figure 2 A photovoltaic module encapsulation method and apparatus, based on Example 1, with the main change being: the supplied fluid insulating material is a single-component hot-melt butyl rubber insulating adhesive, which has fluidity after heating and melting, replacing the two-component addition-type liquid silicone rubber, and the fluid supply temperature and shaping process are adjusted.

[0095] Using the constraint mold from Example 1, it is fitted onto the edge of the completed photovoltaic laminate to define a closed molding space 304. A one-component hot-melt butyl rubber insulating adhesive is prepared. The butyl rubber is heated to 130°C to melt. The dynamic viscosity of the molten butyl rubber at 130°C is 15,000 mPa⋅s, and the thixotropic index is 3.5.

[0096] Molten butyl rubber is injected into the molding space 304 at a pressure of 0.4 MPa through the heated injection channel 305 and injection pressure system. Simultaneously, following Example 1, vacuum suction and high-frequency vibration are activated for physical defoaming, increasing the physical defoaming time to 60 seconds.

[0097] The molding and demolding process employs cooling and solidification: After injection, heating of the mold is stopped, and cooling water is introduced through the temperature control channel 309 to cool the mold to approximately 25°C at a cooling rate of 20°C / min until it is completely solidified. After complete solidification, the serrated lines on the side mold are first removed using a hydraulic lateral translation mechanism, and then the upper and lower molds are separated for demolding.

[0098] The insulating encapsulation layer 200 has a side covering portion 201 thickness of 3.0 mm, and the top extension portion 202 and bottom extension portion 203 both have a covering width of 3.0 mm. Regular serrated surface texture marks 204 are left on the outer surface. Test results show a breakdown voltage of 20.0 kV / mm and a volume resistivity of 3.5 × 10⁻⁶. 15 Ω⋅cm, water resistance rate <0.05g / m 2 The shear peel strength to the aluminum plate is 4.0 MPa, the vertical pull-out strength is 3.1 MPa, and the interface bubble size is <0.1 mm, completely preventing frame detachment. As a new type of insulating coating material, the single-component hot-melt butyl insulating adhesive has excellent water-blocking and moisture-proof properties. Combined with the serrated texture on the outer surface, it significantly enhances the frame detachment resistance.

[0099] Comparative Example 1

[0100] An open-type hand-brush coating process without mold constraints is used to coat the edges of photovoltaic laminates with liquid silicone, achieving a dynamic viscosity of [missing information]. The thixotropic index is only Vacuum / vibration-free defoaming, natural leveling and curing. Smooth outer surface without texture or marks.

[0101] Comparative Example 2

[0102] Using ultra-low viscosity fluid, the dynamic viscosity is only thixotropic index Furthermore, the mold is not constrained by the elastic sealing strip 302, and the material is directly injected into the edge of the photovoltaic laminate.

[0103] Comparative Example 3

[0104] The mold injection and defoaming process of Example 1 is adopted, but the inner wall of the mold is completely smooth. After demolding, no post-processing such as laser micro-engraving is performed, and the outer surface of the insulating encapsulation layer 200 with a smooth surface is directly obtained.

[0105] Summary table comparing the overall performance of each embodiment and comparative example

[0106] Group Insulating fluid dynamic viscosity ( ) Thixotropic index Surface texture / groove marks Breakdown voltage Volume resistivity Aluminum plate frame shear peel strength Glue overflow / bubble defects and risk of frame detachment Example 1 3,500 3.0 Inverted trapezoidal sawtooth groove 22.0 2.5 4.2 Zero glue overflow, zero microbubbles, and extremely strong resistance to frame detachment. Example 2 1,200 2.8 barbed groove 19.5 1.8 3.8 Precise positioning, overflow tank suction, zero air bubbles Example 3 4,500 3.1 Corner Corrugated Expansion Joint 21.5 2.2 4.1 No cracking or peeling after 200 cycles of hot and cold cycling. Example 4 50,000 4.0 Microscopic morphological traces 16.0 1.1 3.5 Thin molding without dead angles or voids Example 5 500 2.5 Serrated groove 21.0 2.1 4.0 Precision sealing prevents thin glue from overflowing. Example 6 2,000 2.6 Laser micro-engraving dovetail groove 23.5 2.8 4.3 The interface is highly wetted, and post-processing marks are precise. Example 7 1,500 2.7 Serrated groove 21.0 2.0 4.1 The processes are highly integrated, resulting in extremely high production efficiency. Example 8 25,000 3.5 Array of micropores 25.0 3.2 4.4 With moderate parameters, it exhibits excellent overall electrical and mechanical properties. Example 9 15000 3.5 Inverted trapezoidal sawtooth groove 20.0 3.5 4.0 Excellent water resistance, zero microbubbles, strong grip to prevent frame slippage Comparative Example 1 3,500 1.2 Smooth and without texture 8.5 3.0 1.2 Sagging, numerous microbubbles, high-pressure breakdown Comparative Example 2 200 1.1 Smooth and without texture 9.0 4.5 1.0 Excess adhesive stains the A-side cover glass Comparative Example 3 3,500 3.0 Smooth surface 22.0 2.5 1.1 It has good electrical performance, but the aluminum plate frame is prone to detachment when pulled.

[0107] Based on the above embodiments and comparative data, the technical effects and advantages of the present invention are summarized as follows:

[0108] Comparing Examples 1-9 with Comparative Example 1, it can be seen that when the dynamic viscosity of the insulating fluid is controlled at... thixotropic index With the combined effects of pre-treatment of the surface and active debubbling using a physical field, microscopic bubbles within and at the interface of the insulating encapsulation layer 200 are eliminated. The breakdown voltage is reduced from that of Comparative Example 1. Leapfrog improvement to Volume resistivity reaches This solves the problem of breakdown in narrow-pitch packaging.

[0109] Comparing Example 1 and Comparative Example 3, it can be seen that forming or post-processing a deep layer on the outer surface of the insulating encapsulation layer 200... Pitch The surface texture marks 204, when aluminum plates are installed around the perimeter and frame adhesive is pressed in, the frame adhesive can... The filling and compaction of these surface textures 204 creates a large contact interface and physical anchoring hook structure. The shear peel strength between the photovoltaic module and the aluminum plate is compared to that of Comparative Example 3. Upgraded to Vertical tensile strength This completely solves the problem of photovoltaic modules detaching from the frame under long-term outdoor wind loads.

[0110] This invention effectively avoids contamination of the cover glass 104 by low-viscosity fluid overflow through the synergistic effect of thixotropy and adhesive resistance. Simultaneously, this invention supports online / offline encapsulation and integrated synchronous encapsulation with the lamination process, relaxing the cycle time constraints of industrial production lines.

[0111] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Equivalent structural changes made to the claims should also be included within the scope of protection of the present invention.

Claims

1. A photovoltaic module encapsulation method, characterized in that, Includes the following steps: The edge region of the photovoltaic laminate is positioned and matched with the encapsulation device, and together with the edge of the photovoltaic laminate, they define a molding space. The outline of the molding space at least defines the geometric outline of the insulating encapsulation layer on the side of the photovoltaic laminate, and the molding space does not obstruct the main power generation area of ​​the photovoltaic laminate. An insulating material with fluidity is supplied or formed within the molding space; Before or during the shaping process of the insulating material, the insulating material is placed in a state where air bubbles are eliminated, air bubbles are suppressed, or there are no microscopic air bubbles; the insulating material in the forming space is shaped to form an insulating encapsulation layer that adheres to or covers at least a portion of the side edge of the photovoltaic laminate.

2. The photovoltaic module encapsulation method according to claim 1, characterized in that, The encapsulation method can be implemented online or offline after the photovoltaic laminate is laminated, or it can be implemented synchronously with the lamination process of the photovoltaic laminate.

3. The photovoltaic module encapsulation method according to claim 1, characterized in that, The thickness of the insulating encapsulation layer on the side of the photovoltaic laminate is The insulating encapsulation layer covers the side surface of the photovoltaic laminate and extends to cover the top and / or bottom edges of the photovoltaic laminate, with a coverage width of [missing information - likely a measurement value]. .

4. The photovoltaic module encapsulation method according to claim 3, characterized in that, The insulating encapsulation layer has a symmetrical or asymmetrical U-shaped cross-section covering the top, sides and bottom, or an L-shaped asymmetrical cross-section covering only the sides and bottom.

5. The photovoltaic module encapsulation method according to claim 1, characterized in that, The insulating encapsulation layer can be a continuous all-around covering structure, a segmented covering structure, or a selective local covering structure implemented only for the corner areas or electric field concentration areas of the photovoltaic laminate.

6. The photovoltaic module encapsulation method according to claim 1, characterized in that, Supplying or forming a fluid insulating material within the molding space includes: pressing adhesive into the molding space through an injection channel, pre-coating or spraying an insulating fluid before the encapsulation device is closed, melting and flowing a pre-placed solid insulating thermoplastic material within the molding space, or introducing a microfoaming precursor or active monomer fluid.

7. The photovoltaic module encapsulation method according to claim 1, characterized in that, The dynamic viscosity of the fluid insulating material under shear or flow conditions is: The thixotropic index is The thixotropic index is the index of the material in terms of its properties. Viscosity under rotational shear and in The ratio of viscosity under rotational shear.

8. The photovoltaic module encapsulation method according to claim 1, characterized in that, Before supplying or forming insulating material into the molding space, the method further includes a surface pretreatment step on the edges of the photovoltaic laminate; the surface pretreatment is selected from at least one of plasma treatment, flame treatment, laser cleaning, corona treatment, or coating with a wetting accelerator.

9. The photovoltaic module encapsulation method according to claim 1, characterized in that, The state of eliminating bubbles, suppressing bubbles, or eliminating microbubbles is achieved through physical defoaming, chemical defoaming, or a combination thereof; wherein the physical defoaming is selected from at least one of vacuum suction, high-frequency vibration, ultrasonic cavitation, or pressurized exhaust.

10. The photovoltaic module encapsulation method according to claim 9, characterized in that, The process parameters for physical defoaming are selected from: the vacuum degree of the vacuum suction is... The frequency of the high-frequency vibration is The frequency of the ultrasonic cavitation is The pressure of the pressurized exhaust is... At least one of them.

11. The photovoltaic module encapsulation method according to claim 9, characterized in that, The chemical defoaming is achieved by adding an antifoaming agent or a chemical getter to the insulating material, or by pre-treating the insulating material online before it enters the molding space.

12. The photovoltaic module encapsulation method according to claim 1, characterized in that, The curing process is selected from at least one of the following: heat curing, cooling solidification, ultraviolet or visible light radiation curing, moisture curing, microwave or radio frequency induction heating curing, electron beam radiation curing, or chemical self-initiated curing.

13. The photovoltaic module encapsulation method according to claim 1, characterized in that, The outer surface of the molded insulating encapsulation layer has surface texture marks; the surface texture marks are formed by pre-setting texture cavities in the inner wall of the encapsulation device and replicating them in situ during the molding process of the insulating material, or by post-processing after the insulating material is molded.

14. The photovoltaic module encapsulation method according to claim 13, characterized in that, The post-processing technology is selected from at least one of laser micro-engraving, mechanical indentation or grooving, chemical etching or plasma surface reconstruction.

15. The photovoltaic module encapsulation method according to claim 13, characterized in that, The surface texture marks are selected from at least one of the following: serrated grooves, trapezoidal grooves, dovetail grooves, barbed grooves, arrayed microporous grooves, or irregular rough surfaces; the depth of the surface texture marks is... Pitch is .

16. The photovoltaic module encapsulation method according to claim 13, characterized in that, The insulating material is selected from two-component or multi-component co-extruded composite materials; during the co-extrusion process, the high-dielectric inner layer close to the side of the photovoltaic laminate uses dielectric strength... The insulating material has a high-hardness outer layer. Materials.

17. The photovoltaic module encapsulation method according to claim 1, characterized in that, In the corner area of ​​the photovoltaic laminate, the insulating encapsulation layer is formed into a large arc transition structure or has a corrugated stress-relieving expansion joint to absorb the shear stress generated by thermal expansion and contraction.

18. A photovoltaic module encapsulation apparatus for implementing the photovoltaic module encapsulation method according to any one of claims 1-17, characterized in that, include: The encapsulation device body is selected from the constraint mold. The encapsulation device forms a positioning fit with the edge of the photovoltaic laminate and jointly defines a molding space. The inner cavity contour of the molding space at least defines the geometric contour of the insulating encapsulation layer on the side of the photovoltaic laminate. The dispensing channel, located on or in conjunction with the encapsulation device, is used to provide a flowable insulating material to the molding space. An elastic sealing strip is disposed on the contact interface between the encapsulation device and the photovoltaic laminate, near the interface, or formed based on the rheological properties of the insulating material, to prevent or limit the overflow of the insulating material into the main power generation area. An exhaust structure or high-frequency vibrator, connected to the molding space or in conjunction with the packaging device, is used to exhaust gas or apply a physical defoaming field during the filling or shaping process.

19. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The contact surface of the encapsulation device is machined with textured cavities to form surface texture marks for filling with frame adhesive on the outer surface of the insulating encapsulation layer.

20. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The front end of the packaging device is equipped with a surface pretreatment device.

21. The photovoltaic module encapsulation apparatus according to claim 19, characterized in that, The texture cavity is selected from at least one of serrated groove, trapezoidal groove, dovetail groove, barbed groove or array of micropore grooves.

22. The photovoltaic module encapsulation apparatus according to claim 21, characterized in that, The constraint mold is a split structure, including a side mold (301c) and an upper mold (301a) and / or a lower mold (301b); the side mold (301c) is connected to the upper mold (301a) or the lower mold (301b) by a hydraulic lateral translation mechanism, which is used to laterally translate and open the mold after curing or shaping to release the surface texture marks on the outer surface of the insulating encapsulation layer.

23. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, It also includes a pressure relief overflow groove located at the edge of the constraint mold.

24. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The constraint mold is also equipped with mechanical limiting posts to limit the final thickness of the insulating encapsulation layer on the side of the photovoltaic laminate. .

25. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The packaging device integrates a high-frequency vibrator, which is used to apply a physical vibration field to the insulating material in the molding space to actively remove bubbles.

26. The photovoltaic module encapsulation apparatus according to claim 20, characterized in that, The surface pretreatment device is selected from at least one of plasma spray gun, flame treatment head, laser cleaning head or corona treatment head.

27. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The packaging device is also equipped with a temperature control channel for introducing hot or cold fluids or built-in electric heating elements to achieve temperature-controlled curing or cooling solidification.

28. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The encapsulation device integrates at least one energy or medium introduction structure selected from ultraviolet light irradiation window, microwave transmitter or moisture introduction airway.

29. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The packaging device also includes a post-processing station located at the rear end of the packaging device. The post-processing station is equipped with a laser micro-engraving head, which is used to process and form surface texture marks for filling the frame adhesive on the outer surface of the insulating packaging layer after demolding.

30. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The constraint mold is directly integrated into the vacuum hot pressing chamber of the photovoltaic laminator, and is used to inject and shape the edge insulating encapsulation layer while the photovoltaic laminate is being laminated, heated and vacuumed.

31. The photovoltaic module encapsulation apparatus according to claim 18, characterized in that, The encapsulation device has dedicated corner cavities in the four corner areas of the photovoltaic laminate. The inner wall of the corner cavity has continuous corrugated grooves for forming corrugated stress-relieving expansion joints.

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