A photodetector and chip

Abstract

The application provides an optoelectronic detector and a chip. By preparing a lens on an incident end surface of the optoelectronic detector and setting a reflection structure on the waveguide optoelectronic detector, an incident light beam is converged to the reflection structure through the lens, the reflection structure reflects the incident light beam to a waveguide layer of the optoelectronic detector, and finally transmits to a photosensitive area. The technical scheme disclosed by the application can not only improve the coupling efficiency between the waveguide and the optical fiber, but also increase the system coupling tolerance and simplify the complexity of the external optical device structure. Further, the application forms the reflection structure on the optoelectronic detector through an etching process and a coating process, without the need to increase additional optical devices, thereby reducing the complexity of chip packaging.

Description

Technical Field

[0001] This application relates to the field of integrated optoelectronics, and more specifically, to a photodetector and chip. Background Technology

[0002] With the development of integrated optoelectronic technology, photodetectors, as the core components of optoelectronic systems, play a crucial role in converting optical signals into electrical signals. Their performance directly affects the signal transmission rate and system sensitivity in fields such as optical communication, lidar, and biosensing. As high-speed optical communication systems evolve towards higher speeds, traditional discrete photodetectors, due to their large size and limited response speed, are difficult to integrate with photonic integrated circuits and are gradually failing to meet the demands for high-density integration and low power consumption.

[0003] Waveguide photodetectors achieve highly efficient localized absorption of optical signals by directly integrating the photosensitive region with the optical waveguide, significantly improving the response bandwidth. Furthermore, waveguide photodetectors are more easily compatible with photonic integrated circuits. However, in optical communication networks, the coupling between the waveguide and the optical fiber in waveguide photodetectors still faces significant challenges. Using coupling structures such as lenses and prisms to couple the beam output from the optical fiber into the waveguide not only results in low coupling efficiency but also requires highly complex optical alignment.

[0004] Therefore, how to improve the coupling efficiency of waveguide-type photodetectors is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] This application provides a photodetector and chip that can not only improve the coupling efficiency of the photodetector, but also reduce the complexity of the photodetector and coupling structure, thereby reducing the production and packaging costs of the photodetector and coupling structure.

[0006] In a first aspect, a photodetector is provided. The photodetector includes a lens and a reflector. The lens receives a first light beam incident on the photodetector and converges the first light beam onto the reflector. The reflector reflects the first light beam in a first direction. The first direction includes the direction in which the detection area of ​​the photodetector is located. The reflector is integrated into the photodetector.

[0007] Based on the above scheme, by integrating a reflector onto the photodetector, the received optical signal is transmitted to the detection area. This not only improves the coupling efficiency of the photodetector but also reduces the complexity of the optical path transmission within the photodetector. By reducing the complexity of the photodetector's coupling structure, the production and packaging costs of both the photodetector and the coupling structure are reduced.

[0008] In one alternative implementation, the lens is also integrated into the photodetector.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, a lens is disposed on a first surface of the photodetector. The first surface is located on the side where the first light beam is incident. A reflector is disposed on a second surface of the photodetector, the angle between the second surface and the first surface being less than 90 degrees.

[0010] Based on the above scheme, by placing a lens on the incident side of the light beam and coupling the beam to the reflector, the coupling efficiency of the photodetector in receiving optical signals can be further improved. Furthermore, a reflector with a specific angle is set according to the position of the incident surface of the light beam and the detection area of ​​the photodetector, so that the reflector reflects the received light beam in the direction of the detection area. This application, by integrating a reflector and replacing spatial optical path transmission with waveguide transmission, further increases the coupling efficiency of the photodetector in receiving optical signals, increases the intensity of the optical signal received in the detection area, and further improves the component performance of the photodetector.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the photodetector further includes a mode converter structure. The mode converter structure is used to couple a light beam reflected by a mirror to a light-absorbing layer in the detection region. The light-absorbing layer is used to absorb the light beam and convert the optical signal carried by the beam into an electrical signal.

[0012] Based on the above solution, the photodetector disclosed in this application further includes a mode converter structure. The mode converter structure couples the light beam reflected by the mirror to the light absorption layer of the detection region. This further improves the coupling efficiency of the photodetector in receiving optical signals and further increases the intensity of the optical signal received in the detection region.

[0013] It should be noted that the speckle converter structure and the detection area are located in the first direction of the reflector.

[0014] In one specific implementation, the mode spot converter structure includes a tapered waveguide.

[0015] In conjunction with the first aspect, in some implementations of the first aspect, the speckle converter structure is disposed on the first surface, adjacent to the lens.

[0016] Based on the above scheme, the modulus converter structure and lens are both integrated on the first surface of the photodetector, used to couple the first beam reflected by the mirror to the light absorption layer of the detection region via evanescent wave coupling. The first surface includes the waveguide layer of the photodetector. When the modulus converter structure and lens are set on the waveguide layer, the limitations on the size of the modulus converter structure and lens are reduced, further reducing the complexity of the photodetector structure design and lowering the production and packaging costs of the photodetector.

[0017] In conjunction with the first aspect, in some implementations of the first aspect, the mode converter structure is disposed on the third surface of the photodetector. The third surface is opposite to the first surface.

[0018] Based on the above scheme, the mode converter structure is disposed on the back side of the beam incident direction. The first surface includes a substrate layer, and the third surface includes a waveguide layer. Since the mode converter structure and the lens are disposed on two different surfaces, the size limitations of the mode converter structure and the lens are further reduced, the structural design flexibility of the photodetector is improved, and the applicable scenarios are expanded.

[0019] In conjunction with the first aspect, in some implementations of the first aspect, the first surface is the surface of the photodetector cap layer, the surface of the substrate layer, or the surface of the waveguide layer.

[0020] Based on the above scheme, the lens is disposed on the first surface of the photodetector, which is the surface on the side where the signal light is incident. By incorporating the lens, the photodetector can receive light signals incident from the surface of the cap layer, substrate layer, or waveguide layer, thereby improving the flexibility of the photodetector's application scenarios.

[0021] It should be noted that lenses can be set on different surfaces of the photodetector to receive the incident light beam. This application does not specify the number of lenses set on the photodetector.

[0022] In conjunction with the first aspect, in some implementations of the first aspect, the second surface is a surface formed after etching the waveguide layer of the photodetector.

[0023] Based on the above scheme, a second surface is formed by etching, and a reflector is fabricated on the second surface using processes such as coating. By fabricating the reflector through optical etching and coating processes, the reflector structure is integrated onto the photodetector, further reducing the production and packaging costs of the photodetector and its coupling structure.

[0024] In conjunction with the first aspect, in some implementations of the first aspect, the lens is a positive lens. Lenses include hemispherical lens structures, aspherical lens structures, cylindrical lens structures, superlenses, or microlens arrays.

[0025] Based on the above scheme, a positive lens is used to focus the light beam incident on the photodetector onto the reflector. This further increases the coupling efficiency of the photodetector to the incident light beam, and correspondingly improves the signal strength received and output by the photodetector, thereby further enhancing the parameter performance of the photodetector.

[0026] It should be noted that this application does not specifically limit the structure of the positive lens, and may include one or more of the above structures to achieve the focusing of the incident light beam.

[0027] In conjunction with the first aspect, in some implementations of the first aspect, the photodetector is a waveguide photodetector.

[0028] Based on the above scheme, by integrating lenses and mirrors into the waveguide photodetector, the optical loss of the beam during transmission in the spatial optical path is reduced, and the coupling efficiency of the incident signal is further improved.

[0029] Secondly, a method for fabricating a photodetector is provided. This method is used to fabricate the photodetector described in the first aspect or any possible implementation thereof.

[0030] Thirdly, an optical module is provided. The optical module includes an optical receiving component. The optical receiving component is used to receive optical signals and convert the optical signals into electrical signals. The optical receiving component includes a photodetector as described in the first aspect or any possible implementation thereof.

[0031] In conjunction with the third aspect, in some implementations of the third aspect, the optical module also includes an optical transmitting component. The optical transmitting component is used to transmit optical signals.

[0032] Fourthly, an optical communication system is provided. This optical communication system includes an electronic device and an optical module as described in the third aspect or any possible implementation thereof. The electronic device is connected to the optical module.

[0033] Fifthly, a chip is provided. The chip includes a photodetector. The photodetector is a photodetector as described in the first aspect or any possible implementation of the first aspect.

[0034] The beneficial effects of the solutions in aspects two through five above can be found in the detailed description of aspect one, and will not be repeated here for the sake of brevity. Attached Figure Description

[0035] Figure 1 A schematic diagram of a lens-coupled waveguide photodetector is shown.

[0036] Figure 2 This is a schematic diagram of the structure of a photodetector provided in an embodiment of this application.

[0037] Figure 3 This is a schematic diagram of the optical path of a beam incident photodetector provided in an embodiment of this application.

[0038] Figure 4 This is a schematic diagram of another photodetector provided in an embodiment of this application.

[0039] Figure 5This is a schematic diagram of the optical path of another beam incident photodetector provided in an embodiment of this application.

[0040] Figure 6 This is an optical module provided in the embodiments of this application.

[0041] Figure 7 This is another optical module provided in the embodiments of this application.

[0042] Figure 8 This is an optical communication system provided in the embodiments of this application. Detailed Implementation

[0043] The technical solutions of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort should fall within the scope of protection of this application.

[0044] Before introducing the embodiments of this application, the following points should be made first.

[0045] In this application, the terms "exemplary," "for example," etc., are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as an "example" in this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of the term "example" is intended to present concepts in a concrete manner. In the embodiments of this application, "of," "corresponding, relevant," and "corresponding" may sometimes be used interchangeably, and it should be noted that their intended meanings are consistent unless their distinction is emphasized.

[0046] The business scenarios described in the embodiments of this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided in the embodiments of this application. As those skilled in the art will know, with the evolution of network architecture and the emergence of new business scenarios, the technical solutions provided in the embodiments of this application are also applicable to similar technical problems.

[0047] References such as "in some possible implementations" as used in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in some possible implementations" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including, but not limited to," unless otherwise specifically emphasized.

[0048] In this application, "at least one" or "at least one item" refers to one or more items, and "more than one" refers to two or more items. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A alone, A and B simultaneously, and B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can mean: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0049] In this application, "#1", "#2", etc., are used merely for descriptive convenience to distinguish objects and are not intended to limit the scope of the embodiments of this application. They are not used to describe the order or sequence of features. It should be understood that such described objects can be interchanged where appropriate to describe solutions other than those in the embodiments of this application.

[0050] With the development and evolution of optical communication systems, higher requirements have been placed on the response speed and bandwidth of photodetectors. Waveguide photodetectors, due to their high response speed, are more suitable for the development of high-speed optical communication systems. However, due to size mismatch, coupling between single-mode waveguides and optical fibers is relatively difficult. Currently, most optical waveguide coupling methods use direct lens alignment coupling, which requires external optical devices for optical path deflection, resulting in high cost and poor coupling efficiency.

[0051] Figure 1 A schematic diagram of a lens-coupled waveguide photodetector is shown.

[0052] Lens 1 and lens 2 are used to couple the light beam emitted from the single-mode fiber into the waveguide of the waveguide-type photodetector, and then transmit it to the photosensitive area through the waveguide.

[0053] It should be understood that the optical path positions and structures of lens 1 and lens 2 are only schematic drawings, and this application does not impose any special limitations on them.

[0054] The structure shown in the figure focuses the light beam onto the chip waveguide end face via a spatial optical path, achieving optical coupling. However, due to the waveguide sidewalls not being completely clean and collimated, significant coupling loss occurs. Furthermore, strict collimation is required between the lens and the waveguide, resulting in high complexity and cost of optical path calibration, increasing system complexity and cost, and leading to poor overall system stability.

[0055] In some implementations, to further improve coupling efficiency, the beam emitted from the single-mode fiber can be coupled to the waveguide of a waveguide-type photodetector via a prism coupler, utilizing the light scattering properties of the prism to achieve energy transfer. By adjusting the prism angle or material, the coupling efficiency can be optimized for a specific wavelength.

[0056] However, the gap between the prism coupler and the waveguide, as well as the incident angle, have more stringent requirements, with lower tolerance for angular deviations and tolerances. Therefore, because the gap between the prism and the waveguide and the position of the incident beam need to be precisely adjusted, the overall system coupling calibration is complex and difficult, increasing the system's complexity and cost, and the overall system stability remains poor.

[0057] In some implementations, to further improve the stability of the overall coupling system, a grating coupling structure can be integrated onto the waveguide-type photodetector. The grating coupling structure includes a grating layer, a waveguide layer, and a substrate layer. The waveguide layer of the grating coupling structure is connected to the waveguide layer of the photodetector. A beam emitted from a single-mode fiber is incident on the grating layer, coupled to the waveguide layer through the grating structure, and then transmitted through the waveguide layer of the grating coupler to the waveguide layer of the photodetector, ultimately reaching the photosensitive area of ​​the photodetector.

[0058] However, some energy of the incident beam is lost in the substrate, resulting in significant coupling insertion loss and low overall optical coupling efficiency. Furthermore, grating couplers are complex, require sophisticated manufacturing processes, and are costly.

[0059] In summary, the technical solution disclosed in this application involves fabricating a positive lens on the incident end face of a waveguide-type photodetector and setting a reflective structure on the waveguide-type photodetector. This allows the incident light beam to be converged to the reflective structure through the positive lens, and the reflective structure reflects the incident light beam to the waveguide layer of the photodetector, ultimately transmitting it to the photosensitive area. This not only improves the coupling efficiency between the waveguide and the optical fiber but also increases the system coupling tolerance and simplifies the complexity of external optical device structures. This application, through its integrated design, gives the photodetector good overall structural stability and reduces coupling difficulty. Furthermore, this application forms the reflective structure on the photodetector using etching and coating processes, eliminating the need for additional optical devices, reducing chip packaging complexity, and lowering costs. Furthermore, by fabricating a positive lens on the incident end face, the incident light beam is converged to the reflective structure, reducing the complexity requirements for optical path calibration and resulting in high overall system coupling efficiency.

[0060] Figure 2 This is a schematic diagram of the structure of a photodetector provided in an embodiment of this application.

[0061] In the technical solution disclosed in this application, the photodetector includes a substrate layer 201, a buffer layer 202, a transition layer 203, a photosensitive layer 204, and a cap layer 205. A lens 210 is disposed on the incident end face of the waveguide. The lens 210 is used to focus the incident light beam onto the reflector 220. This application utilizes the focusing effect of the lens to increase the coupling tolerance of the incident light and reduce the coupling difficulty between the optical fiber and the photodetector. An inclined end face with a certain angle is formed by etching technology, and the reflector 220 is formed on the end face by a coating process. The reflector 220 is used to reflect the light beam focused by the lens 210, coupling the incident light beam into the waveguide structure, so that the light beam is transmitted to the detection area.

[0062] By way of example and not limitation, substrate 201 includes an indium phosphide (InP) substrate. A buffer layer 202 is deposited on the semiconductor substrate using metal-organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE). A transition layer 203 is then grown on the buffer layer 202 using MOCVD or MBE, and a photosensitive layer 204 is further grown on the transition layer 203 using MOCVD or MBE. The photosensitive layer 204 also serves as the core layer of the waveguide. A cap layer 205 is then grown on the photosensitive layer 204 using MOCVD or MBE. The cap layer 205 serves as the contact layer of the photodetector.

[0063] In one specific implementation, the thickness of the buffer layer 202 is about 0.2-2 μm, the thickness of the transition layer 203 is about 0.05-0.5 μm, the thickness of the photosensitive layer 204 is about 0.1-2 μm, and the thickness of the cap layer 205 is about 0.05-1 μm. This application does not impose any special limitation on the deposition thickness of each layer.

[0064] In one specific implementation, the end face of the waveguide is etched using a bevel etching technique to form a tilted surface with a specific angle. A reflective film is then deposited on the tilted surface using optical coating technology to form a reflector 220.

[0065] As an example and not a limitation, the tilt angle of reflector 220 is 45° ± 5°.

[0066] In one specific implementation, the etched waveguide layer includes a buffer layer 202, a transition layer 203, a photosensitive layer 204, and a cap layer 205 to form the slope of the reflector 220.

[0067] In this implementation, the light beam coupled from lens 210 to reflector 220 will not enter substrate layer 201 through reflector 220, but will be directly coupled to photosensitive layer 204, which further improves the coupling efficiency of photodetector.

[0068] It should be noted that, in addition to etching, other processes such as photolithography or a combination of multiple processes can also be used. This application does not impose any special limitations on the preparation process.

[0069] In one specific implementation, the photodetector formed by etching using the above method is also called a strip waveguide detector, with a size of approximately 5*10μm.

[0070] In one specific implementation, a lens 210 is fabricated on the incident end face of the etched strip waveguide detector. The lens 210 is used to focus the incident light beam onto the reflector 220.

[0071] In one specific implementation, lens 210 includes a positive lens. It can be fabricated by processes such as photolithography, etching, or epoxy resin coating; this application does not impose any special limitations on the fabrication process.

[0072] By way of example and not limitation, the structure of lens 210 includes a cylindrical structure with a height of about 3 μm, and the cylindrical structure also includes a hemispherical structure with a radius of about 2 μm.

[0073] Based on this, this application sequentially epitaxially grows a buffer layer, a transition layer, a photosensitive layer, and a cap layer on a semiconductor substrate, and then etches and optically deposits these grown layers to form a strip waveguide and a reflector. By placing a lens on one side of the waveguide's incident end face, the light beam emitted from the optical fiber is focused onto the reflector. The focusing effect of the lens increases the coupling yield of the incident light and reduces the coupling complexity between the optical fiber and the detector. The reflector deflects the incident light focused by the lens and couples it into the waveguide structure of the photodetector, transmitting it to the detection area. The entire photodetector can complete the coupling of the incident light beam without additional optical structures, improving the overall coupling efficiency. Furthermore, by integrating the reflector structure and lens structure into the photodetector structure, this application further simplifies the complexity of the external optical components of the photodetector and improves the overall device integration of the photodetector.

[0074] The following is through Figure 3 The optical path of the beam incident on the photodetector is described.

[0075] Figure 3 This is a schematic diagram of the optical path of a beam incident photodetector provided in an embodiment of this application.

[0076] The light beam emitted from the optical fiber passes through lens 210. Lens 210 is used to converge the incident light beam and transmit it to reflector 220. Reflector 220 is used to reflect the incident light beam to photosensitive layer 204. The incident light beam is transmitted to the detection area through the waveguide in photosensitive layer 204. The detection area of ​​the photodetector is used to convert the optical signal carried by the incident light beam into an electrical signal.

[0077] In a specific implementation, such as Figure 3 As shown in (a), lens 210 is fabricated on the surface of cap 205, and optical fiber is incident on lens 210 from one side of cap 205. Lens 210 is used to focus the incident light beam in the optical fiber onto mirror 220.

[0078] In another specific implementation, such as Figure 3 As shown in (b), lens 210 is fabricated on the back side of substrate 201, and optical fiber is incident on lens 210 from one side of substrate 201. Lens 210 is used to focus the incident light beam in the optical fiber onto mirror 220.

[0079] It should be noted that the surface of lens 210 is related to the incident direction of the optical fiber. Adjusting the incident surface of lens 210 also requires adjusting the direction of the inclined surface of the etched mirror 220 accordingly.

[0080] It should be noted that, as Figure 3As shown in (b), the lens 210 is fabricated on one side of the substrate layer 201. The photodetector structure formed by etching is also called the positive platform structure, which is not specifically limited in this application.

[0081] Based on this, the photodetector provided in this application has a high tolerance for the direction of the incident beam and does not require additional optical components for optical path alignment. The overall optical path complexity is low, and the tolerance for adjusting and aligning the optical path is high. The adjustment process is time-saving and labor-saving, reducing labor and time costs. The overall photodetector is simple to adjust, highly stable, and has high compatibility with the source and direction of the incident beam.

[0082] To further improve the overall coupling efficiency of the photodetector and reduce the coupling difficulty between the fiber and the waveguide, the technical solution disclosed in this application further adds a spot size converter (SSC) structure to the proposed photodetector.

[0083] Figure 4 This is a schematic diagram of another photodetector provided in an embodiment of this application.

[0084] In the technical solution disclosed in this application, the photodetector includes a waveguide layer 401, a buffer layer 402, a transition layer 403, a photosensitive layer 404, and a cap layer 405. A lens 410 is disposed on the incident end face of the waveguide. The lens 410 is used to focus the incident light beam onto a reflector 420. An inclined end face with a certain angle is formed on the waveguide layer 401 by etching technology, and the reflector 420 is formed on the end face by a coating process. The reflector 420 is used to reflect the light beam focused by the lens 410, coupling the incident light beam into the waveguide structure, so that the light beam is transmitted to the detection area.

[0085] It should be noted that the photodetector in this embodiment may also include a substrate layer 400, located below the waveguide layer 401.

[0086] By way of example and not limitation, the substrate layer includes an InP substrate. On the semiconductor substrate layer 400, a waveguide layer 401, a buffer layer 402, a transition layer 403, a photosensitive layer 404, and a cap layer 405 are sequentially fabricated using MOCVD or MBE techniques. The specific fabrication process is similar to that described in the above embodiments and will not be repeated here.

[0087] In one specific implementation, the cap layer 405, photosensitive layer 404, transition layer 403 and buffer layer 402 are etched using etching technology to form a tapered waveguide structure for mode switching.

[0088] As an example and not a limitation, the length of the tapered waveguide structure is 10-200 μm.

[0089] In one specific implementation, the end face of the waveguide is etched using a bevel etching technique to form a tilted surface with a specific angle. A reflective film is then deposited on the tilted surface using optical coating technology to form a reflector 420.

[0090] As an example and not a limitation, the tilt angle of reflector 420 is 45° ± 5°.

[0091] In one specific implementation, the etched waveguide includes a waveguide layer 401 to form the bevel of the reflector 420.

[0092] In this implementation, the light beam coupled from lens 410 to reflector 420 is first coupled to waveguide layer 401, and then coupled to the detection region via evanescent wave. Mode switching solves the mode field mismatch problem between the waveguide and the optical fiber, further reducing the coupling difficulty between the optical fiber and the waveguide, and further improving the signal coupling efficiency.

[0093] In one specific implementation, a lens 410 is fabricated on one side of the formed tapered waveguide structure on the incident end face of the waveguide detector. The lens 410 is used to focus the incident light beam onto the reflector 420.

[0094] In one specific implementation, lens 410 includes a positive lens. It can be fabricated by processes such as photolithography, etching, or epoxy resin coating; this application does not impose any special limitations on the fabrication process.

[0095] By way of example and not limitation, the structure of lens 410 includes a cylindrical structure with a height of about 10 μm, and the cylindrical structure also includes a hemispherical structure with a radius of about 5 μm.

[0096] Based on this, compared to the photodetector structure in the above implementation, this embodiment adds an SSC structure, which further improves the overall coupling efficiency through mode switching. Furthermore, since the etching forms a tapered waveguide structure, a lens is placed on one side of the tapered waveguide structure. This increases the spatial position of the lens and improves the flexibility of lens fabrication. It also allows for a larger lens size, enabling better coupling of the beam emitted from the optical fiber into the waveguide.

[0097] The following is through Figure 5 The optical path of the beam incident on the photodetector is described.

[0098] Figure 5 This is a schematic diagram of the optical path of another beam incident photodetector provided in an embodiment of this application.

[0099] The light beam emitted from the optical fiber passes through lens 410. Lens 410 is used to converge the incident light beam and transmit it to mirror 420. Mirror 420 is used to reflect the incident light beam to the mode converter structure. In the mode converter structure, the incident light beam is transmitted to the detection region in the photosensitive layer 404 through evanescent wave coupling. The detection region of the photodetector is used to convert the optical signal carried by the incident light beam into an electrical signal.

[0100] It should be noted that this application does not impose any special limitations on the mode conversion between the buffer layer 404, the transition layer 403, the photosensitive layer 404 and the cap layer 405 in the mode converter structure.

[0101] In a specific implementation, such as Figure 5 As shown in (a), lens 410 is fabricated on the surface of waveguide layer 401, on the same side as the tapered waveguide structure formed after etching. An optical fiber enters lens 410 from one side of the tapered waveguide. Lens 410 is used to focus the incident light beam in the optical fiber onto mirror 420.

[0102] In another specific implementation, such as Figure 5 As shown in (b), lens 410 is fabricated on the back side of waveguide layer 401, on the opposite side of the etched tapered waveguide structure. An optical fiber is incident on lens 410 from the side opposite to the tapered waveguide. Lens 410 is used to focus the incident light beam from the optical fiber onto mirror 420.

[0103] It should be noted that when a substrate layer 400 is included below the waveguide layer 401, the lens 410 is fabricated on one side of the substrate layer 400, on a different side from the tapered waveguide structure formed after etching. Optical fiber enters the lens 410 from the side opposite to the substrate layer 400. The lens 410 is used to focus the incident light beam from the optical fiber onto the reflector 420.

[0104] Based on this, the photodetector provided in this application further improves the overall coupling efficiency through a mode-spot conversion structure. Furthermore, the tapered waveguide structure increases the area for lens placement, reduces fabrication complexity, and allows for larger lens sizes, further enhancing the focusing effect on the beam emitted from the optical fiber.

[0105] It should be noted that this implementation also includes the beneficial technical effects of the aforementioned implementation, which will not be elaborated here for the sake of brevity.

[0106] Figure 6 This is an optical module provided in the embodiments of this application.

[0107] The optical module includes a light source 1010, an optical chip 1020, and a signal generation chip 1030. Here, "optical module" can specifically refer to an optical transmission module.

[0108] The light source 1010 is used to input a light beam into the optical chip 1020. The signal generation chip 1030 is used to input an electrical signal into the optical chip 1020. The electrical signal is used to modulate the light beam input into the optical chip 1020 to generate an optical signal carrying information. The signal generation chip 1030 may specifically integrate a digital signal processing (DSP) module, a digital-to-analog conversion (DAC) module, etc., depending on the actual situation.

[0109] In one specific implementation, the light source 1010 and the optical chip 1020 are separate components. The light source 1010 can specifically refer to coherent light.

[0110] In another specific implementation, the light source 1010 is integrated into the optical chip 1020, and the light source 1010 can be in the form of a laser chip.

[0111] It should be noted that an optical transmitting component can also be added to one side of the output end of the optical chip 1020. The optical transmitting component includes a lens module, used to couple the optical signal output from the optical module to a subsequent light source element. For example, the optical transmitting component is used to couple the optical signal output from the optical module into an optical fiber or into an optical waveguide.

[0112] Figure 7 This is another optical module provided in the embodiments of this application.

[0113] The optical module includes an optical chip 1060 and a signal processing chip 1050. The optical chip 1060 integrates a photodetector module 1040. Here, "optical module" can specifically refer to an optical receiving module.

[0114] The photoelectric detection module 1040 converts the received optical signal into an electrical signal. The signal processing chip 1050 processes the electrical signal to obtain the information carried in the optical signal. The signal processing chip 1050 may specifically integrate an analog-to-digital conversion module (ADC), a DSP module, etc., depending on the actual situation.

[0115] It should be noted that an optical receiving component can be added to one side of the receiving end of the optical chip 1060. The optical receiving component includes a lens module, which is used to couple the received optical signal into the optical module, further improving the coupling efficiency of the optical signal to the photodetector module 1040.

[0116] It should be noted that the lens module included in the optical receiving component may include the lens integrated on the photoelectric detection module 1040, or other lens modules, and this application does not make any special limitations on this.

[0117] It should be noted that the photoelectric detection module 1040 can also be set up independently and not integrated with the optical chip 1060. This application does not impose any special restrictions on this.

[0118] It should be noted that the photoelectric detection module 1040 may include the structure of any photoelectric detector in the above embodiments, or be used to implement the function of any photoelectric detector in the above embodiments.

[0119] In addition, such as Figure 7 The optical module shown can be used with Figure 6 The optical modules are combined to obtain an optical transceiver module.

[0120] It should be noted that optical chip 1020 and optical chip 1060 can be the same optical chip or different optical chips, and this application does not make any special restrictions on this.

[0121] Figure 8 This is an optical communication system provided in the embodiments of this application.

[0122] like Figure 8 As shown, an optical system may include optoelectronic devices and such as Figure 6 and / or Figure 7 The optical module shown is an optical electronic device 1110, which can be any of an optical switch, fiber optic router, or fiber optic network card. The optical electronic device 1110 is connected to the optical module 1120.

[0123] Optoelectronic devices can include multiple ports, each corresponding to an optical transmission channel. These ports are connected to optical modules, enabling multi-channel, high-speed optical signal transmission. Optical switches can be used to exchange data between multiple optical transmission channels. Fiber optic routers can convert optical signals into data signals and perform data signal forwarding and routing. Fiber optic network interface cards (NICs) can be used in Ethernet networks to connect computers to optical fibers.

[0124] It should be noted that, Figures 1 to 8 These illustrations are merely illustrative diagrams to facilitate understanding of the embodiments of this application and do not constitute a particular limitation on this application.

[0125] This application also provides a method for fabricating a photodetector, which is used to fabricate the aforementioned photodetector.

[0126] This application also provides an optical module, which includes the above-described photodetector.

[0127] This application also provides an optical module, which includes an optical receiving component for receiving optical signals. The optical module converts the optical signals into electrical signals, and the optical receiving component includes the aforementioned photodetector.

[0128] This application also provides a chip that includes a photodetector. The photodetector can be any of the photodetectors described above.

[0129] This application also provides a communication device, including: a receiver including the above-mentioned photodetector; and / or a transmitter including the above-mentioned photodetector.

[0130] This application embodiment also provides a communication device, including: a transceiver for receiving or transmitting signals, the transceiver including the aforementioned photodetector, the photodetector being used to convert optical signals in the signals into electrical signals; and a processor for performing signal processing on the signals.

[0131] This application also provides an optical communication system, including an electronic device and the aforementioned optical module. The electronic device is connected to the optical module.

[0132] Skilled professionals may use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0133] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0134] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0135] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0136] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0137] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0138] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A photodetector, characterized in that, include: A lens is used to receive a first beam of light incident on the photodetector and to converge the first beam of light onto a reflector of the photodetector; The reflector is used to reflect the first light beam to a first direction, the first direction including the direction of the detection area of ​​the photodetector; The reflector is integrated into the photodetector.

2. The photodetector according to claim 1, characterized in that, The lens is disposed on the first surface of the photodetector, and the first surface is located on the side where the first light beam is incident; The reflector is disposed on the second surface of the photodetector, and the angle between the second surface and the first surface is less than 90 degrees.

3. The photodetector according to claim 1 or 2, characterized in that, Also includes: A speckle converter structure is used to couple the light beam reflected by the reflector to the light absorption layer in the detection area. The light absorption layer is used to absorb the light beam and convert the optical signal carried by the light beam into an electrical signal.

4. The photodetector according to claim 3, characterized in that, The speckle converter structure is disposed on the first surface and adjacent to the lens.

5. The photodetector according to claim 3, characterized in that, The speckle converter structure is disposed on the third surface of the photodetector, and the third surface is opposite to the first surface.

6. The photodetector according to any one of claims 2 to 5, characterized in that, The first surface is the surface of the photodetector cap layer, the surface of the substrate layer, or the surface of the waveguide layer.

7. The photodetector according to any one of claims 2 to 5, characterized in that, The second surface is the surface formed after etching the waveguide layer of the photodetector.

8. The photodetector according to any one of claims 1 to 7, characterized in that, The lens is a positive lens, and the lens includes a hemispherical lens structure, an aspherical lens structure, a cylindrical lens structure, a superlens, or a microlens array.

9. The photodetector according to any one of claims 1 to 8, characterized in that, The photodetector is a waveguide photodetector.

10. An optical module, characterized in that, Including the photodetector as described in any one of claims 1 to 9.

11. The optical module according to claim 10, characterized in that, It also includes an optical transmission component for transmitting optical signals.

12. An optical communication system, characterized in that, It includes an electronic device and an optical module as described in claim 10 or 11, wherein the electronic device is connected to the optical module.

13. A chip, characterized in that, The chip includes a photodetector, which is the photodetector according to any one of claims 1 to 9.

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