A patch type LED lamp bead packaging structure

Abstract

The application discloses a patch type LED lamp bead packaging structure and belongs to the technical field of lamp bead packaging. The patch type LED lamp bead packaging structure comprises an outer shell, the inner wall center of the outer shell is fixedly connected with a mounting frame, and the center of the mounting frame is fixedly connected with a reflecting cup. The bottom of the outer shell is fixedly connected with two metal supports, the two metal supports are positive and negative poles respectively, and the bottom of each of the two metal supports is fixedly connected with a metal pad. The supporting heat dissipation mechanism is designed, the area of contact between the multiple copper pipes and air is large, heat dissipation can be conducted during heat conduction, heat dissipation efficiency is improved, the die bonding seat and the multiple copper pipes have the electric conduction effect, the multiple insulating sleeves are separated through the multiple insulating sleeves, the short circuit of the chip is prevented, and the multiple insulating sleeves have the heat conduction and non-electric conduction effect.

Description

Technical Field

[0001] This invention belongs to the field of LED chip packaging technology, specifically relating to a surface-mount LED chip packaging structure. Background Technology

[0002] The surface-mount LED (SMD) chip packaging structure refers to a miniaturized, leadless packaging form in which the LED light-emitting chip is fixed on a specific substrate using surface mount technology and optically and electrically connected. It is currently the most widely used core light-emitting element in the lighting and display fields. Its typical structure mainly consists of the following parts: Support: Usually made of high thermal conductivity ceramic or copper-based copper-clad laminate, serving as the physical carrier and heat dissipation channel for the chip. Metal pads are located at the bottom for electrical connection of the positive and negative electrodes. Light-emitting chip: The core light-emitting unit, typically a gallium nitride (GaN) based blue or RGB three-color chip, fixed in the reflector cup of the substrate by die bonding adhesive or eutectic bonding. Gold wire: Extremely fine (micrometer-level) metal wires that connect the chip's electrodes to the pads on the substrate, forming a conductive circuit. Encapsulating colloid: Transparent or phosphor-containing silicone / epoxy resin filling the reflector cup. The design of this packaging structure directly determines the size (such as 3528, 5050, 2835, etc.), power, luminous efficacy, and heat dissipation performance of the LED chips, and is the technical basis for realizing high-density mounting and thin and light lighting products.

[0003] The heat generated by existing LED chips is first conducted to the substrate through the die bond layer, then transferred to the metal pads through the substrate, and finally transferred to the PCB board through the pads. The PCB board then diffuses the heat to the entire circuit board through copper foil and thermal vias to dissipate heat from the chip. Because the thermal expansion coefficients of each layer of material are different, the heat must go through multiple layers of transfer: "chip → die bond layer → substrate → solder → PCB copper foil". Under long-term hot and cold cycles, microcracks may be generated, increasing thermal resistance. And since the heat is ultimately dissipated by the PCB board, it is overly dependent on the heat dissipation design of the PCB board. If the PCB board design is unreasonable, the heat dissipation effect of the LED chips will be unsatisfactory, affecting their service life. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a surface-mount LED chip packaging structure.

[0005] The technical solution adopted to solve the above technical problems is: a surface-mount LED lamp bead packaging structure, including a shell, a mounting bracket fixedly connected to the center of the inner wall of the shell, and a reflector cup fixedly connected to the center of the mounting bracket; Two metal brackets are fixedly connected to the bottom of the outer shell. The two metal brackets are positive and negative poles, respectively, and metal solder pads are fixedly connected to the bottom of each of the two metal brackets. A heat dissipation support mechanism is installed at the bottom center of the reflector cup, and an external heat dissipation mechanism is installed at the inner bottom of the outer shell.

[0006] Preferably, the inner wall of the outer casing is provided with multiple barbs at the top, and the outer wall of the outer casing is provided with multiple heat dissipation holes at the bottom.

[0007] Through the above technical solution, after the epoxy resin fills the reflective cup and cures, the cured epoxy resin and multiple barbs become integrated. These barbs can grasp the cured epoxy resin, effectively preventing interface separation, improving the long-term reliability of the shell, enhancing the bonding force, greatly improving the overall sealing performance, and effectively preventing external moisture from seeping into the interior along the interface between the epoxy resin and the shell, protecting the internal core components from corrosion, avoiding failure problems caused by moisture, and the multiple heat dissipation holes can improve airflow, thereby improving the heat dissipation effect of the external heat dissipation mechanism.

[0008] Preferably, the bottom of the inner wall of the reflector cup is provided with a first curved surface, the center of the inner wall of the reflector cup is provided with a second curved surface, and the top of the inner wall of the reflector cup is provided with a third curved surface, wherein the tilt angle of the second curved surface is greater than the tilt angle of the third curved surface.

[0009] The above technical solution involves setting three different curved surfaces inside the reflector cup to precisely control the light emitted from the LED chip at different angles and along different paths. Its core function is to simultaneously achieve high efficiency and high uniformity, and eliminate yellow rings or dark areas in the light spot. The first curved surface reflects large-angle light into medium-angle light, allowing it to pass through the encapsulating colloid and improve luminous efficiency. The second curved surface reflects the medium-angle light in a parabolic or free-form pattern, precisely projecting it onto the central ring area of ​​the target surface to form the main illumination area, thus determining the light spot diameter and central illuminance. The third curved surface disperses the central strong light, uniformly mixing it into the central ring area, eliminating color difference and making the light spot color uniform. The tilt angle of the second curved surface is greater than that of the third curved surface to achieve a secondary optical relay of first focusing the light and then uniformizing it, ensuring that while expanding the illumination area, the central light spot does not exhibit dark centers or bright rings.

[0010] Preferably, the inner wall of the reflective cup has multiple arc-shaped grooves on the third curved surface.

[0011] The above technical solution can force the emitted light in the central area to be guided and mixed uniformly, completely eliminating the yellow ring or blue center phenomenon in the center of the light spot, while smoothly stretching the central energy to the edge, achieving uniform illumination with zero dark areas and improving the lighting effect of LED beads.

[0012] Preferably, two heat dissipation arc plates are fixedly connected to the bottom of the outer shell, the inner wall of the reflector cup is filled with epoxy resin, and the epoxy resin is fused with multiple barbs and covers the top of the heat dissipation support mechanism.

[0013] The above technical solution completely seals the components inside the reflector cup, isolating them from external moisture and dust. This prevents moisture from seeping in and causing electrode corrosion and leakage, while also preventing dust from covering the surface and reducing light output efficiency. Furthermore, the epoxy resin has a certain degree of toughness, which can absorb the thermal expansion and contraction stress generated by the package when the temperature changes, preventing cracking at the interface between the outer shell and the plastic, and greatly improving the protection of the chip.

[0014] Preferably, one of the metal pads has a first protrusion fixedly connected to its bottom, and the other metal pad has two second protrusions fixedly connected to its bottom. In the combined state, the first protrusion is in contact with the corresponding first groove on the PCB board, and the two second protrusions are in contact with the corresponding second groove on the PCB board. Both metal pads are soldered to the PCB board with solder paste.

[0015] With the above technical solution, when mounting the entire package structure on the PCB board, it is necessary to solder the corresponding two metal pads. Since LED beads have unidirectional conductivity, the positive and negative metal pads must be correctly connected when soldering the two metal pads. For example, if the first groove on the PCB board is the positive electrode, then the two second grooves are the negative electrodes. Thus, the metal pad with one first bump is the positive electrode, and the metal pad with two second bumps is the negative electrode. Before soldering, the first bump on one metal pad is aligned with the corresponding first groove on the PCB board, and the two second bumps on the other metal pad are aligned with the corresponding second grooves on the PCB board. This prevents workers from incorrectly placing the two metal pads during the soldering process, improves soldering accuracy, and prevents the two metal pads from sliding during soldering, improving soldering quality and preventing misalignment that could cause a short circuit.

[0016] Preferably, the heat dissipation support mechanism includes a mounting plate fixedly connected to the center of the bottom of the reflector cup. A plurality of through copper tubes are fixedly connected to the bottom of the mounting plate. A die bonder is fixedly connected to the top of the plurality of copper tubes. A chip is fixedly mounted at the center of the top of the die bonder. Gold wires are installed on both sides of the top of the chip. An insulating sleeve is fixedly connected to the bottom of the plurality of copper tubes. A base is fixedly connected to the bottom of the plurality of insulating sleeves.

[0017] Through the above technical solution, some of the heat generated when the chip is working is transferred to multiple copper tubes through the die bonder, and then to the chassis through multiple insulating sleeves. Since the chassis is soldered to the PCB board, the heat is transferred to the PCB board, which then dissipates the heat through copper foil and thermal vias. Because the die bonder and multiple copper tubes are conductive, the multiple insulating sleeves prevent short circuits in the chip, thus making the multiple insulating sleeves thermally conductive but non-conductive.

[0018] Preferably, the die bonder and the chip are located below the first curved surface, and the chassis is soldered to the PCB board using solder paste.

[0019] Through the above technical solution, the light emitted by the chip is first reflected on the first curved surface, and finally reflected through the second and third curved surfaces, thereby improving the light efficiency.

[0020] Preferably, the other ends of the two gold wires are fixedly connected to the corresponding metal brackets.

[0021] With the above technical solution, when the LED bead is working, the positive current on the PCB board flows into the metal pad with a first bump, then through the connected metal bracket, and through the connected gold wire, and then into the chip. The chip works and emits light, so that the current flows through another gold wire into another metal bracket, then into the metal pad with two second bumps, and finally into the negative electrode of the PCB board, thus realizing the entire working process.

[0022] Preferably, the external heat dissipation mechanism includes two arc-shaped copper plates fixedly connected to the outer wall of the housing, a heat-conducting plate fixedly connected to the top of each of the two metal brackets, multiple heat dissipation plates fixedly connected to the bottom of each of the two heat-conducting plates, multiple heat-conducting pipes fixedly connected between each of the two arc-shaped copper plates and the corresponding heat-conducting plates, and the two heat dissipation arc plates respectively protecting the corresponding heat dissipation plates.

[0023] Through the above technical solution, another portion of the heat generated during chip operation flows through multiple copper pipes to the bottom of the reflector cup, then to two metal supports, and finally to two heat-conducting plates. Ultimately, it is dissipated through multiple heat sinks. Simultaneously, the heat-conducting plates transfer a portion of the heat to the curved copper plate through multiple heat pipes, where the absorbed heat is dissipated. Since the two curved copper plates are located on the outer wall of the casing, they are constantly in contact with cold air, thus efficiently cooling the heat generated by the chip. The dual cooling method, with multiple heat sinks in contact with cold air, significantly improves the chip's heat dissipation effect. When the PCB design is unreasonable and the heat dissipation effect through the supporting heat dissipation mechanism is unsatisfactory, heat dissipation is achieved through an external heat dissipation mechanism, eliminating the need to replace the entire LED chip packaging structure and extending its lifespan.

[0024] The beneficial effects of this invention are as follows: (1) The present invention designs a heat dissipation support mechanism, and the large contact area between multiple copper tubes and air enables them to dissipate heat during the heat conduction process, thereby improving heat dissipation efficiency. Since the die bond and multiple copper tubes have conductive effects, multiple insulating sleeves are used to isolate the chip and prevent short circuits, so that the multiple insulating sleeves have thermally conductive but non-conductive effects. (2) This invention designs an external heat dissipation mechanism to dissipate the absorbed heat through an arc-shaped copper plate. Since the two arc-shaped copper plates are located on the outer wall of the shell, they are in constant contact with cold air, thereby efficiently cooling the heat generated by the chip. At the same time, multiple heat dissipation plates are in contact with cold air to cool the absorbed heat. The dual cooling method greatly improves the heat dissipation effect of the chip. When the PCB board design is unreasonable and the heat dissipation effect of the supporting heat dissipation mechanism is not ideal, the heat dissipation is carried out through the external heat dissipation mechanism. There is no need to replace the entire LED bead packaging structure, thus improving its service life. (3) The present invention designs two metal pads. Before welding, the first protrusion on one metal pad is attached to the corresponding first groove on the PCB board, and the two second protrusions on the other metal pad are attached to the corresponding second groove on the PCB board. This prevents the workers from misplacing the two metal pads during the welding process, improves the welding accuracy, and prevents the two metal pads from sliding during welding, thus improving the welding quality and preventing short circuits caused by misalignment. Attached Figure Description

[0025] Figure 1 This is the overall front view of the present invention; Figure 2 This is a first-view view of the present invention; Figure 3 This is a second-view view of the present invention; Figure 4 This is an overall sectional view of the present invention; Figure 5 This is an overall top view of the invention; Figure 6 This is a cross-sectional view of the reflector cup of the present invention; Figure 7 This is a schematic diagram of the supporting heat dissipation mechanism of the present invention; Figure 8 This is a schematic diagram of the external heat dissipation mechanism of the present invention; Figure 9 for Figure 4 A magnified view of a section at point A in the middle; Figure 10 This is a schematic diagram of the mounting structure of the present invention on a PCB board; Figure 11 This is a partial structural diagram of the PCB board of the present invention.

[0026] Reference numerals: 1. Outer shell; 11. Barb; 12. Heat dissipation hole; 13. Mounting bracket; 14. Reflector cup; 141. Second curved surface; 142. Third curved surface; 143. Arc groove; 15. First curved surface; 16. Heat dissipation arc plate; 17. Epoxy resin; 2. Metal bracket; 3. Metal pad; 31. First protrusion; 32. Second protrusion; 4. Supporting heat dissipation mechanism; 401. Mounting plate; 402. Copper pipe; 403. Die bond holder; 404. Chip; 405. Gold wire; 406. Insulating sleeve; 407. Chassis; 5. External heat dissipation mechanism; 501. Arc copper plate; 502. Heat-conducting plate; 503. Heat sink; 504. Heat-conducting pipe; 6. PCB board; 61. First groove; 62. Second groove. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0028] like Figures 1-9As shown, this embodiment of a surface-mount LED chip packaging structure includes a housing 1. A mounting bracket 13 is fixedly connected to the center of the inner wall of the housing 1, and a reflector cup 14 is fixedly connected to the center of the mounting bracket 13. Multiple barbs 11 are provided at the top of the inner wall of the housing 1, and multiple heat dissipation holes 12 are provided at the bottom of the outer wall of the housing 1. When epoxy resin 17 fills the reflector cup 14 and cures, the cured epoxy resin 17 fuses with the multiple barbs 11. These barbs 11 can hold the cured epoxy resin 17, effectively preventing interface separation, improving the long-term reliability with the housing 1, enhancing the bonding force, and greatly improving the overall sealing performance. Simultaneously, it effectively prevents external moisture from seeping into the interior along the interface between the epoxy resin 17 and the housing 1, protecting the internal core components from corrosion and avoiding failure due to moisture. The multiple heat dissipation holes 12 can improve airflow, thereby improving the heat dissipation effect on the external heat dissipation mechanism 5. A first curved surface 15 is provided at the bottom of the inner wall of the reflector cup 14, and a second curved surface 141 is provided at the center of the inner wall of the reflector cup 14. The inner wall of the reflector cup 14 has a third curved surface 142 at its top. The tilt angle of the second curved surface 141 is greater than that of the third curved surface 142. The three different curved surfaces within the reflector cup 14 are designed for precise, collaborative control of light emitted from the LED chip 404 at different angles and along different paths. Their core function is to simultaneously achieve high efficiency and high uniformity, and to eliminate yellow rings or dark areas in the light spot. The first curved surface 15 reflects large-angle light into medium-angle light, allowing it to pass through the encapsulating colloid and exit, thus improving luminous efficiency. The second... The curved surface 141 reflects the mid-angle light in a parabolic or free-form manner, which is then precisely projected onto the central ring area of ​​the target surface, forming the main illumination area and thus determining the spot diameter and central illuminance. The third curved surface 142 disperses the central strong light and evenly mixes it into the central ring area, thereby eliminating chromatic aberration and making the spot color uniform. The tilt angle of the second curved surface 141 is greater than that of the third curved surface 142, in order to achieve a secondary optical relay of first focusing the light and then uniformizing it, ensuring that while expanding the illumination area, the central spot does not exhibit a dark center or bright ring phenomenon.

[0029] like Figures 1-9As shown, the inner wall of the reflector cup 14 has multiple arc-shaped grooves 143 on the surface of the third curved surface 142, which can force the emitted light in the central area to be guided and uniformly mixed, completely eliminating the yellow ring or blue center phenomenon in the center of the light spot. At the same time, the central energy is smoothly stretched to the edge, realizing uniform illumination with zero dark areas and improving the lighting effect of the LED beads. Two heat dissipation arc plates 16 are fixedly connected to the bottom of the outer shell 1. The inner wall of the reflector cup 14 is filled with epoxy resin 17, and the epoxy resin 17 is fused with multiple barbs 11 and covers the top of the heat dissipation support mechanism 4, completely sealing the internal parts of the reflector cup 14, isolating external moisture and dust, thereby preventing moisture from seeping in and causing electrode corrosion and leakage, while preventing dust from covering and reducing light output efficiency. In addition, the epoxy resin 17 has a certain toughness and can absorb the thermal expansion and contraction stress generated by the package when the temperature changes, preventing the interface between the outer shell 1 and the plastic from cracking, greatly improving the protection of the chip 404.

[0030] like Figures 1-11 As shown, two metal brackets 2 are fixedly connected to the bottom of the outer casing 1. The two metal brackets 2 are the positive and negative terminals, respectively. Metal pads 3 are fixedly connected to the bottom of each metal bracket 2. One metal pad 3 has a first protrusion 31 fixedly connected to its bottom, and the other metal pad 3 has two second protrusions 32 fixedly connected to its bottom. In the combined state, the first protrusion 31 is attached to the corresponding first groove 61 on the PCB board 6, and the two second protrusions 32 are attached to the corresponding second grooves 62 on the PCB board 6. Both metal pads 3 are soldered to the PCB board 6 using solder paste. When mounting the entire package structure onto the PCB board 6, the corresponding two metal pads 3 need to be soldered. Since LED beads have unidirectional conductivity, the soldering of the two metal pads... When soldering, the positive and negative metal pads 3 need to be connected correctly. For example, if the first groove 61 on the PCB board 6 is the positive electrode, then the two second grooves 62 are the negative electrodes. Thus, the metal pad 3 with one first bump 31 is the positive electrode, and the metal pad 3 with two second bumps 32 is the negative electrode. Before soldering, the first bump 31 on one of the metal pads 3 is attached to the corresponding first groove 61 on the PCB board 6, and the two second bumps 32 on the other metal pad 3 are attached to the corresponding second grooves 62 on the PCB board 6. This prevents the workers from incorrectly placing the two metal pads 3 during the soldering process, improves the soldering accuracy, and prevents the two metal pads 3 from sliding during soldering, thus improving the soldering quality and preventing short circuits caused by misalignment.

[0031] like Figures 1-7As shown, a heat dissipation support mechanism 4 is installed at the center of the bottom of the reflector cup 14. The heat dissipation support mechanism 4 includes a mounting plate 401 fixedly connected to the center of the bottom of the reflector cup 14. Multiple through copper tubes 402 are fixedly connected to the bottom of the mounting plate 401. A die bonder 403 is fixedly connected to the top of the multiple copper tubes 402. A chip 404 is fixedly installed at the center of the top of the die bonder 403. Gold wires 405 are installed on both sides of the top of the chip 404. Insulating sleeves 406 are fixedly connected to the bottom ends of the multiple copper tubes 402. A base 407 is fixedly connected to the bottom of the sleeve 406. During operation, some of the heat generated by the chip 404 is transferred to multiple copper pipes 402 via the die bonder 403, and then to the base 407 via multiple insulating sleeves 406. Since the base 407 is soldered to the PCB board 6, it transfers heat to the PCB board 6, allowing the PCB board 6 to dissipate heat through copper foil and thermal holes. Simultaneously, the large contact area between the multiple copper pipes 402 and the air enables them to dissipate heat effectively during conduction, improving heat dissipation efficiency. The die holder 403 and multiple copper tubes 402 are conductive. Multiple insulating sleeves 406 provide insulation to prevent short circuits in the chip 404, making the insulating sleeves 406 thermally conductive but non-conductive. The die holder 403 and chip 404 are located below the first curved surface 15. The chassis 407 is soldered to the PCB board 6 using solder paste. Light emitted from the chip 404 is first reflected on the first curved surface 15, and then reflected again by the second curved surface 141 and the third curved surface 142, improving light efficiency. The other ends of the two gold wires 405... Each LED bead is fixedly connected to its corresponding metal bracket 2. When the LED bead is working, the positive current on the PCB board 6 flows into the metal pad 3 with a first bump 31, then through the connected metal bracket 2, and through the connected gold wire 405, and then into the chip 404. The chip 404 works and emits light, causing the current to flow through another gold wire 405 into another metal bracket 2, and then into the metal pad 3 with two second bumps 32, and finally into the negative electrode of the PCB board 6, thus completing the entire working process.

[0032] like Figures 1-8As shown, an external heat dissipation mechanism 5 is installed at the bottom of the inner casing 1. The external heat dissipation mechanism 5 includes two arc-shaped copper plates 501 fixedly connected to the outer wall of the casing 1. A heat-conducting plate 502 is fixedly connected to the top of each of the two metal brackets 2. Multiple heat dissipation plates 503 are fixedly connected to the bottom of each of the two heat-conducting plates 502. Multiple heat-conducting pipes 504 are fixedly connected between each of the two arc-shaped copper plates 501 and the corresponding heat-conducting plate 502. Two heat dissipation arc plates 16 protect the corresponding heat dissipation plates 503. Another part of the heat generated when the chip 404 is working flows to the bottom of the reflector cup 14 through the multiple copper pipes 402, then flows to the two metal brackets 2, and then to the two heat-conducting plates 502. Finally, it is dissipated through multiple heat dissipation pipes 503. The hot plate 503 dissipates heat, while the heat-conducting plate 502 transfers some of the heat to the arc-shaped copper plate 501 through multiple heat pipes 504. The arc-shaped copper plate 501 dissipates the absorbed heat. Since the two arc-shaped copper plates 501 are located on the outer wall of the outer casing 1, they are in constant contact with the cold air, thus efficiently cooling the heat generated by the chip 404. At the same time, the multiple heat sinks 503 are in contact with the cold air, cooling the absorbed heat. This dual cooling method greatly improves the heat dissipation effect of the chip 404. When the PCB board 6 is poorly designed and the heat dissipation effect through the supporting heat dissipation mechanism 4 is not ideal, heat dissipation is achieved through the external heat dissipation mechanism 5, without the need to replace the entire LED bead packaging structure, thus improving its service life.

[0033] The working principle of this embodiment is as follows: When installing the entire LED lamp bead packaging structure, the first bump 31 on one of the metal pads 3 is attached to the corresponding first groove 61 on the PCB board 6, and the two second bumps 32 on the other metal pad 3 are attached to the corresponding second groove 62 on the PCB board 6. This prevents the workers from incorrectly placing the two metal pads 3 during the soldering process. The two metal pads 3 are soldered to the PCB board 6 by the soldering equipment, so that the metal pad 3 with one first bump 31 is the positive electrode, and the metal pad 3 with two second bumps 32 is the negative electrode.

[0034] When the PCB board 6 is powered on, the positive current flows into the metal pad 3 with a first bump 31, then through the connected metal support 2, and through the connected gold wire 405, and then into the chip 404. The chip 404 works and emits light, so that the current flows through another gold wire 405 into another metal support 2, and then into the metal pad 3 with two second bumps 32, and finally into the negative terminal of the PCB board 6, thus completing the entire working process.

[0035] Meanwhile, some of the heat generated when chip 404 is working is transferred to multiple copper tubes 402 through die bond 403, and then to chassis 407 through multiple insulating sleeves 406. Since chassis 407 is soldered to PCB board 6, the heat is transferred to PCB board 6, which then dissipates the heat through copper foil and thermal vias. Since die bond 403 and multiple copper tubes 402 are conductive, they are isolated by multiple insulating sleeves 406 to prevent short circuit of chip 404.

[0036] Another portion of the heat generated when chip 404 is working flows to the bottom of reflector cup 14 through multiple copper pipes 402, then to two metal supports 2, and then to two heat-conducting plates 502. Finally, it is dissipated through multiple heat sinks 503. At the same time, the heat-conducting plates 502 transfer a portion of the heat to the arc-shaped copper plate 501 through multiple heat-conducting pipes 504. The arc-shaped copper plate 501 dissipates the absorbed heat. Since the two arc-shaped copper plates 501 are located on the outer wall of the outer casing 1, they are in constant contact with cold air, thus efficiently cooling the heat generated by chip 404. Meanwhile, the multiple heat sinks 503 are in contact with cold air, cooling the absorbed heat. This dual cooling method allows for heat dissipation through external heat sinks 5 when the PCB board 6 is poorly designed and the heat dissipation effect through the supporting heat dissipation mechanism 4 is not ideal, without the need to replace the entire LED bead packaging structure.

[0037] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention.

Claims

1. A surface-mount LED chip packaging structure, comprising a housing (1), characterized in that: A mounting bracket (13) is fixedly connected to the center of the inner wall of the outer shell (1), and a reflector cup (14) is fixedly connected to the center of the mounting bracket (13). The bottom of the outer shell (1) is fixedly connected to two metal brackets (2), which are positive and negative poles respectively, and the bottom of each metal bracket (2) is fixedly connected to a metal pad (3). The bottom center of the reflector cup (14) is equipped with a heat dissipation support mechanism (4), and the bottom of the outer shell (1) is equipped with an external heat dissipation mechanism (5).

2. The surface-mount LED chip packaging structure according to claim 1, characterized in that, The inner wall of the outer shell (1) is provided with multiple barbs (11) at the top, and the outer wall of the outer shell (1) is provided with multiple heat dissipation holes (12) at the bottom.

3. The surface-mount LED chip packaging structure according to claim 1, characterized in that, The inner wall of the reflector cup (14) has a first curved surface (15) at the bottom, a second curved surface (141) at the center of the inner wall, and a third curved surface (142) at the top of the inner wall. The tilt angle of the second curved surface (141) is greater than that of the third curved surface (142).

4. The surface-mount LED chip packaging structure according to claim 3, characterized in that, The inner wall of the reflective cup (14) has multiple arc-shaped grooves (143) on the surface of the third curved surface (142).

5. The surface-mount LED chip packaging structure according to claim 2, characterized in that, The bottom of the outer shell (1) is fixedly connected to two heat dissipation arc plates (16), the inner wall of the reflector cup (14) is filled with epoxy resin (17), and the epoxy resin (17) is fused with multiple barbs (11) and covers the top of the heat dissipation support mechanism (4).

6. The surface-mount LED chip packaging structure according to claim 1, characterized in that, One of the metal pads (3) has a first protrusion (31) fixedly connected to its bottom, and the other metal pad (3) has two second protrusions (32) fixedly connected to its bottom. In the combined state, the first protrusion (31) is attached to the corresponding first groove (61) on the PCB board (6), and the two second protrusions (32) are attached to the corresponding second groove (62) on the PCB board (6). Both metal pads (3) are soldered to the PCB board (6) with solder paste.

7. The surface-mount LED chip packaging structure according to claim 3, characterized in that, The heat dissipation support mechanism (4) includes a mounting plate (401) fixedly connected to the center of the bottom of the reflector cup (14). A plurality of through copper tubes (402) are fixedly connected to the bottom of the mounting plate (401). A die bonder (403) is fixedly connected to the top of the plurality of copper tubes (402). A chip (404) is fixedly installed at the center of the top of the die bonder (403). Gold wires (405) are installed on both sides of the top of the chip (404). An insulating sleeve (406) is fixedly connected to the bottom of the plurality of copper tubes (402). A chassis (407) is fixedly connected to the bottom of the plurality of insulating sleeves (406).

8. The surface-mount LED chip packaging structure according to claim 7, characterized in that, The die bond (403) and the chip (404) are located below the first curved surface (15), and the chassis (407) is soldered to the PCB board (6) by solder paste.

9. The surface-mount LED chip packaging structure according to claim 7, characterized in that, The other ends of the two gold wires (405) are respectively fixedly connected to the corresponding metal brackets (2).

10. A surface-mount LED chip packaging structure according to claim 5, characterized in that, The external heat dissipation mechanism (5) includes two arc-shaped copper plates (501) fixedly connected to the outer wall of the outer shell (1), a heat-conducting plate (502) fixedly connected to the top of each of the two metal brackets (2), a plurality of heat dissipation plates (503) fixedly connected to the bottom of each of the two heat-conducting plates (502), a plurality of heat-conducting pipes (504) fixedly connected between each of the two arc-shaped copper plates (501) and the corresponding heat-conducting plate (502), and the two heat dissipation arc plates (16) respectively protect the corresponding heat dissipation plates (503).

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