LED support and packaging structure
Patent Information
- Application Number
- CN202611026343.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-07-10
- Publication Date
- 2026-10-27
AI Technical Summary
[0003]四面发光产品发出的光需要通过光转换层、反射层多次光学转换，光线散射路径更长，若补偿框体、胶层设计不当，容易出现因不同方向出光路径差异而导致混光不均的问题
[0016]本发明的一种LED支架的有益效果如下：通过斜坡结构在不同位置上的高度差异设置，使得在光线传播路径较短的四周方向上，通过较高的斜坡结构阻挡部分LED光线从补偿框体侧面射出；而在光线传播路径较长的角落方向上，通过较矮的斜坡结构减少对LED光线的遮挡，使得补偿框体在传播路径较长的角落方向上能够射出更多光线，提升LED在每个方向的出光均匀性。
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Figure CN122995372A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of LED packaging technology, and in particular to an LED bracket and packaging structure. Background Technology
[0002] Currently, four-sided LED packaging products are widely used in backlight applications. Their main structure is that reflective resin is set on the upper surface of the LED chip's encapsulation resin, so that the light emitted by the LED chip can be emitted from the side of the encapsulation resin, allowing the light to diffuse laterally.
[0003] The light emitted by a four-sided light-emitting product needs to undergo multiple optical conversions through a light conversion layer and a reflective layer, resulting in a longer light scattering path. If the compensation frame and adhesive layer are not designed properly, uneven light mixing can easily occur due to differences in the light emission paths from different directions.
[0004] Therefore, there is an urgent need for an LED bracket to ensure that the illuminance of LED light emitted from different directions of the adhesive layer remains the same, so as to improve the uniformity of light output from each direction of the LED. Summary of the Invention
[0005] In order to overcome the shortcomings of the prior art, the present invention aims to provide an LED bracket and packaging structure, which compensates for the differences in light output paths in different directions by setting the height difference of the ramp structure at different positions, thereby improving the light output uniformity of the LED in each direction.
[0006] This invention is implemented according to the following scheme: An LED bracket is provided, comprising: an electroplated sheet and a molding assembly, the molding assembly comprising a bottom molding body and a compensation frame, the bottom molding body filling between the electroplated sheets and covering a portion of the upper surface of the electroplated sheets, and the compensation frame being disposed on the upper surface of the bottom molding body; The compensation frame includes a ramp structure. The ramp structures around the bottom plastic seal are of the same height, the ramp structures at the four corners of the bottom plastic seal are of the same height, and the ramp structures around the bottom plastic seal are of a greater height than the ramp structures at the four corners of the bottom plastic seal.
[0007] Optionally, the area of the electroplated sheet not covered by the bottom encapsulation includes die bond pads and wire bond pads, wherein the die bond pads are used to fix the LED chip and the wire bond pads are used to connect the LED chip.
[0008] Optionally, the ramp structures located around the bottom encapsulation are equidistant from the center of the compensation frame, the ramp structures located at the four corners of the bottom encapsulation are equidistant from the center of the compensation frame, and the ramp structures located around the bottom encapsulation are equidistant from the center of the compensation frame, which are less than the ramp structures located at the four corners of the bottom encapsulation.
[0009] Optionally, the ramp structure includes a first ramp and a second ramp, wherein the first ramp is located on the outer wall of the compensation frame and the second ramp is located on the inner wall of the compensation frame.
[0010] Optionally, the inclination angle of the second slope is 0° to 60°.
[0011] Optionally, the compensation frame further includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall surrounding the die bond pad. The first sidewall and the second sidewall are opposite to each other and have the same shape. The third sidewall and the fourth sidewall are opposite to each other and have the same shape. The first sidewall is connected to the third sidewall and the fourth sidewall, and the second sidewall is connected to the third sidewall and the fourth sidewall.
[0012] Optionally, the compensation frame further includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall surrounding the die bond pad. The first sidewall and the second sidewall are opposite to each other and have the same shape. The third sidewall and the fourth sidewall are opposite to each other and have the same shape. Light emission gaps are provided between the first sidewall and the third sidewall, between the first sidewall and the fourth sidewall, between the second sidewall and the third sidewall, and between the second sidewall and the fourth sidewall.
[0013] Optionally, the first sidewall and the third sidewall may have the same shape or different shapes.
[0014] An LED packaging structure is also provided, comprising an LED bracket, an LED chip, a light conversion layer, and a light blocking layer; the LED chip is fixedly disposed on the die bonding pad of the electroplated sheet, and the LED chip is connected to the wire bonding pad of the electroplated sheet through gold wires; the light conversion layer is disposed on the upper surface of the compensation frame and the upper surface of the LED chip, and the light blocking layer is disposed on the upper surface of the light conversion layer.
[0015] Optionally, the thickness of the light blocking layer is less than the thickness of the light conversion layer, and the thickness of the light conversion layer is greater than the thickness of the LED bracket.
[0016] The beneficial effects of the LED bracket of the present invention are as follows: by setting the height difference of the ramp structure at different positions, in the four directions where the light propagation path is shorter, the higher ramp structure blocks part of the LED light from the side of the compensation frame; while in the corner direction where the light propagation path is longer, the lower ramp structure reduces the obstruction of the LED light, so that the compensation frame can emit more light in the corner direction where the propagation path is longer, thereby improving the uniformity of light output of the LED in each direction. Attached Figure Description
[0017] Figure 1 This is a front view of the LED bracket in Embodiment 1; Figure 2 This is a top view of the LED bracket in Embodiment 1; Figure 3 This is a cross-sectional view of the LED bracket on AA' in Embodiment 1; Figure 4 This is a top view of the LED bracket in Example 2; Figure 5 This is a schematic diagram of the LED packaging structure in Example 3. Figure 1 ; Figure 6 This is a schematic diagram of the LED packaging structure in Example 3. Figure 2 .
[0018] Explanation of reference numerals in the attached diagram: 1. Electroplated sheet; 101. Die-bonding pad; 102. Wire bonding pad; 2. Bottom molding compound; 3. Compensation frame; 301. Sloping structure; 3011. First slope; 3012. Second slope; 302. First sidewall; 303. Second sidewall; 304. Third sidewall; 305. Fourth sidewall; 306. Light-emitting gap; 4. LED chip; 5. Light conversion layer; 6. Light blocking layer; 7. Gold wire. Detailed Implementation
[0019] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.
[0020] In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims. In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0021] Example 1 See Figure 1 As shown, an LED bracket of this embodiment includes: an electroplated sheet 1 and a molding assembly. The molding assembly includes a bottom molding body 2 and a compensation frame 3. The bottom molding body 2 fills between the electroplated sheets 1 and covers part of the upper surface of the electroplated sheets 1. The compensation frame 3 is disposed on the upper surface of the bottom molding body 2. The compensation frame 3 includes a ramp structure 301. The ramp structures 301 around the bottom plastic seal 2 have the same height, and the height of the ramp structures 301 around the bottom plastic seal 2 is... Figure 1 The height H1 shown; the ramp structures 301 located at the four corners of the bottom molding compound 2 have the same height, and the height of the ramp structures 301 located at the four corners of the bottom molding compound 2 is... Figure 1 The height H2 shown; the height H1 of the ramp structure 301 located around the bottom encapsulation 2 is greater than the height H2 of the ramp structure 301 located at the four corners of the bottom encapsulation 2.
[0022] In this embodiment, the slope structure 301 is set with different heights at different positions. In the four directions where the light propagation path is shorter, the higher slope structure 301 blocks some of the LED light from the side of the compensation frame 3. In the corner directions where the light propagation path is longer, the lower slope structure 301 reduces the obstruction of the LED light. This allows the compensation frame 3 to emit more light in the corner directions where the propagation path is longer, thus improving the uniformity of light output of the LED in each direction.
[0023] See Figure 2 As shown, in this embodiment, the area of the electroplated sheet 1 not covered by the bottom encapsulation 2 includes die bond pads 101 and wire bond pads 102. The die bond pads 101 are used to fix the LED chip, and the wire bond pads 102 are used to connect the LED chip.
[0024] In this embodiment, the slope structure 301 located around the bottom encapsulation 2 is equidistant from the center of the compensation frame 3, and the distance between the slope structure 301 located around the bottom encapsulation 2 and the center of the compensation frame 3 is [missing information]. Figure 2 The distance R0 is the horizontal distance between the center of the compensation frame 3 and the ramp structure 301; the ramp structures 301 located at the four corners of the bottom plastic seal 2 are equidistant from the center of the compensation frame 3, and the distance between the ramp structures 301 located at the four corners of the bottom plastic seal 2 and the center of the compensation frame 3 is... Figure 2 The distance Rz is the distance between the center of the compensation frame 3 and the ramp structure 301 in the diagonal direction. The distance R0 between the ramp structure 301 located around the bottom plastic seal 2 and the center of the compensation frame 3 is less than the distance Rz between the ramp structure 301 located at the four corners of the bottom plastic seal 2 and the center of the compensation frame 3.
[0025] See Figure 3 As shown, in this embodiment, the ramp structure 301 includes a first ramp 3011 and a second ramp 3012. The first ramp 3011 is located on the outer wall of the compensation frame 3, and the second ramp 3012 is located on the inner wall of the compensation frame 3. The inclination angle of the second ramp 3012 is 0°~60°. Figure 3 The angle θ in the middle.
[0026] See Figure 1 As shown in this embodiment, the height H1 of the ramp structure 301 located around the bottom encapsulation 2 and the height H2 of the ramp structure 301 located at the four corners of the bottom encapsulation 2 decrease linearly, making the first ramp 3011 a flat surface rather than an uneven surface; and in this embodiment, the height of the ramp structure 301 at different positions on the bottom encapsulation 2 is determined by the distance between the ramp structure 301 and the center of the compensation frame 3, see [reference]. Figure 2 As shown, the distance Rz between the ramp structure 301 and the center of the compensation frame 3 is the farthest in the diagonal direction, and the height H2 of the ramp structure 301 is the shortest at this time; that is, in this embodiment, the farther the distance between the ramp structure 301 and the center of the compensation frame 3, the shorter the height of the ramp structure 301, so that in the diagonal direction where the light propagation path is longer, the obstruction of LED light is reduced by the shorter ramp structure 301, so that the compensation frame 3 can emit more light in the diagonal direction where the propagation path is longer, thereby improving the light emission uniformity of the LED in each direction.
[0027] In this embodiment, the compensation frame 3 further includes a first sidewall 302, a second sidewall 303, a third sidewall 304, and a fourth sidewall 305 surrounding the die-bonding pad 101. The first sidewall 302 and the second sidewall 303 are opposite each other and have the same shape, and the third sidewall 304 and the fourth sidewall 305 are opposite each other and have the same shape. The first sidewall 302 is connected to the third sidewall 304 and the fourth sidewall 305, and the second sidewall 303 is also connected to the third sidewall 304 and the fourth sidewall 305. Through the connection relationship between the four sidewalls, a unified sidewall whole is formed, which is the compensation frame 3. The first sidewall 302 and the third sidewall 304 may have the same shape or different shapes. Figure 2 The LED bracket shown has the same shape for the first sidewall 302 and the third sidewall 304.
[0028] In this embodiment, the first ramp 3011 is located on the outer wall surface of the first sidewall 302, the second sidewall 303, the third sidewall 304, and the fourth sidewall 305, and the second ramp 3012 is located on the inner wall surface of the first sidewall 302, the second sidewall 303, the third sidewall 304, and the fourth sidewall 305. The inner wall surfaces of the first sidewall 302, the second sidewall 303, the third sidewall 304, and the fourth sidewall 305 are all highly reflective surfaces.
[0029] Example 2 See Figure 4 As shown, the difference between the LED bracket in this embodiment and Embodiment 1 is only that light-emitting gaps 306 are provided between the first sidewall 302 and the third sidewall 304, between the first sidewall 302 and the fourth sidewall 305, between the second sidewall 303 and the third sidewall 304, and between the second sidewall 303 and the fourth sidewall 305. There is no connection between the four sidewalls. Figure 4 The LED bracket shown has different shapes for the first sidewall 302 and the third sidewall 305. In this embodiment, the light-emitting gap 306 allows the LED chip to emit light without obstruction from the center of the compensation frame 3 and the sidewall furthest away, reducing the obstruction of light in the corner direction by the sidewall. This allows the compensation frame 3 to emit more light in the diagonal direction with a longer propagation path, improving the light emission uniformity of the LED in each direction.
[0030] Example 3 See Figure 5-6 As shown, an LED packaging structure of this embodiment includes an LED bracket, an LED chip 4, a light conversion layer 5, and a light blocking layer 6, as described in Embodiment 1 or Embodiment 2. The LED chip 4 is fixedly disposed on the die bonding pad 101 of the electroplated sheet 1, and the LED chip 4 is connected to the bonding pad 102 of the electroplated sheet 1 through gold wires 7. The light conversion layer 5 is disposed on the upper surface of the compensation frame 3 and the upper surface of the LED chip 4, and the light blocking layer 6 is disposed on the upper surface of the light conversion layer 5.
[0031] In this embodiment, the thickness of the light blocking layer 6 is less than the thickness of the light conversion layer 5, and its thickness can be similar to that of the LED bracket, which is sufficient to block the light; the thickness of the light conversion layer 5 is greater than the thickness of the LED bracket, so that the LED chip 4 can emit light better from the side; the LED chip 4 is a front-mounted chip or a vertical chip.
[0032] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. An LED bracket, characterized in that, include: An electroplated sheet and a molding assembly, the molding assembly including a bottom molding body and a compensation frame, the bottom molding body filling between the electroplated sheets and covering a portion of the upper surface of the electroplated sheets, the compensation frame being disposed on the upper surface of the bottom molding body; The compensation frame includes a ramp structure. The ramp structures around the bottom plastic seal are of the same height, the ramp structures at the four corners of the bottom plastic seal are of the same height, and the ramp structures around the bottom plastic seal are of a greater height than the ramp structures at the four corners of the bottom plastic seal.
2. The LED bracket according to claim 1, characterized in that, The area of the electroplated sheet not covered by the bottom encapsulation includes die bond pads and wire bond pads. The die bond pads are used to fix the LED chip, and the wire bond pads are used to connect the LED chip.
3. An LED bracket according to claim 2, characterized in that, The ramp structures located around the bottom encapsulation are equidistant from the center of the compensation frame. The ramp structures located at the four corners of the bottom encapsulation are equidistant from the center of the compensation frame. The ramp structures located around the bottom encapsulation are equidistant from the center of the compensation frame, while the ramp structures located at the four corners of the bottom encapsulation are equidistant from the center of the compensation frame.
4. An LED bracket according to claim 2, characterized in that, The ramp structure includes a first ramp and a second ramp, the first ramp being located on the outer wall of the compensation frame and the second ramp being located on the inner wall of the compensation frame.
5. An LED bracket according to claim 4, characterized in that, The inclination angle of the second slope is 0° to 60°.
6. An LED bracket according to claim 2, characterized in that, The compensation frame further includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall surrounding the die bond pad. The first sidewall and the second sidewall are opposite to each other and have the same shape. The third sidewall and the fourth sidewall are opposite to each other and have the same shape. The first sidewall is connected to the third sidewall and the fourth sidewall, and the second sidewall is connected to the third sidewall and the fourth sidewall.
7. An LED bracket according to claim 2, characterized in that, The compensation frame further includes a first sidewall, a second sidewall, a third sidewall, and a fourth sidewall surrounding the die bond pad. The first sidewall and the second sidewall are opposite to each other and have the same shape. The third sidewall and the fourth sidewall are opposite to each other and have the same shape. Light emission gaps are provided between the first sidewall and the third sidewall, between the first sidewall and the fourth sidewall, between the second sidewall and the third sidewall, and between the second sidewall and the fourth sidewall.
8. An LED bracket according to claim 6 or 7, characterized in that, The first sidewall and the third sidewall may have the same shape or different shapes.
9. An LED packaging structure, characterized in that, The invention includes an LED bracket, an LED chip, a light conversion layer, and a light blocking layer as described in any one of claims 2-8; the LED chip is fixedly disposed on the die bonding pad of the electroplated sheet, and the LED chip is connected to the wire bonding pad of the electroplated sheet through gold wires; the light conversion layer is disposed on the upper surface of the compensation frame and the upper surface of the LED chip, and the light blocking layer is disposed on the upper surface of the light conversion layer.
10. An LED packaging structure according to claim 9, characterized in that, The thickness of the light blocking layer is less than the thickness of the light conversion layer, and the thickness of the light conversion layer is greater than the thickness of the LED bracket.