A semiconductor lighting device

Abstract

The application discloses a kind of semiconductor lighting devices, including mounting base, the top of the mounting base is equipped with heat dissipation component, the top surface of the heat dissipation component is fitted with LED light emitting component.This semiconductor lighting device carries overall structure by bottom mounting base, increases heat conduction area using hollow heat dissipation base and its internal array heat conduction fin, cooperates with the heat dissipation air duct of inclined through and forms natural convection heat dissipation channel, can quickly export the heat generated by LED light emitting chip work, avoid heat accumulation, inhibit light decay;PCB circuit board is fixed on the top surface of heat dissipation base by heat-conducting adhesive, ensure efficient heat conduction;Light shield is buckled on the outside of heat dissipation base to realize light protection, cooperate with internal honeycomb anti-glare grid to homogenize light, eliminate lighting glare;Through the annular sealing groove on the top surface of heat dissipation base and sealing washer, realize the sealing dustproof waterproof of lampshade connecting place, effectively improve the service life and lighting quality of lamp.

Description

Technical Field

[0001] This invention relates to the field of semiconductor lighting device technology, specifically to a semiconductor lighting device. Background Technology

[0002] Semiconductor LED lighting devices, with their core advantages such as energy saving, environmental protection, small size, fast response speed and long service life, have completely replaced traditional incandescent lamps and fluorescent lamps. They are widely used in various scenarios such as home eye-protection lighting, commercial supermarket lighting, industrial workshop lighting, and outdoor landscape lighting, and are the mainstream application products in the current lighting industry.

[0003] However, existing semiconductor lighting devices still have certain problems in use:

[0004] A semiconductor light-emitting device, as described in application number CN201921260770.4, includes a substrate, a semiconductor light-emitting chip assembly disposed on the substrate, a first dam disposed on the substrate and surrounding the side of the semiconductor light-emitting chip assembly, a light-transmitting layer covering the light-emitting surface of the semiconductor light-emitting chip assembly, and a second dam disposed on the light-transmitting layer and / or the first dam; the semiconductor light-emitting chip assembly includes at least one semiconductor light-emitting chip; the semiconductor light-emitting chip has a first pad and a second pad, and the substrate has a first bonding pad and a second bonding pad; the first pad is electrically connected to the first bonding pad through a metal wire, and the second pad is electrically connected to the second bonding pad; the top of the second dam, away from the substrate, is higher than the metal wire.

[0005] Traditional LED chips generate heat that can only be dissipated naturally through the substrate surface. Heat is easily accumulated inside the device, causing the chip to operate at high temperatures for a long time. This accelerates the aging of the chip phosphor and the wear and tear of circuit components, leading to rapid light decay and brightness reduction. In severe cases, chip burnout and short circuit faults may occur, significantly shortening the overall lifespan of the lamp.

[0006] In view of this, in-depth research was conducted on the above issues, which led to the creation of this case.

[0007] To address the aforementioned issues, innovative designs were developed based on existing semiconductor lighting devices. Summary of the Invention

[0008] The purpose of this invention is to provide a semiconductor lighting device to solve the problem mentioned in the background art that the heat generated by the LED chip during operation can only be naturally diffused through the substrate surface, and the heat is very easy to accumulate inside the device, causing the chip to be in a high-temperature working state for a long time, accelerating the aging of the chip phosphor and the wear of circuit components, causing rapid light decay and brightness reduction, and in severe cases, chip burnout, short circuit faults, and significantly shortening the overall service life of the lamp.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] A semiconductor lighting device includes a mounting base, a heat dissipation component is mounted on the top of the mounting base, an LED light-emitting component is attached to the top surface of the heat dissipation component, an anti-glare light-emitting component is sleeved on the outside of the LED light-emitting component, and a sealing protection component is provided at the connection between the heat dissipation component and the anti-glare light-emitting component.

[0011] The heat dissipation assembly includes a hollow heat dissipation base fixedly installed on the upper surface of the mounting base. Multiple heat-conducting fins are uniformly fixed on the inner wall of the hollow cavity of the heat dissipation base. Two sets of inclined heat dissipation air channels are symmetrically opened on the outer wall of the heat dissipation base, and the heat dissipation air channels are connected to the hollow cavity of the heat dissipation base.

[0012] The LED light-emitting component includes a PCB circuit board and LED light-emitting chips arrayed and soldered to the top surface of the PCB circuit board, and the bottom surface of the PCB circuit board is attached and fixed to the top surface of the heat dissipation base.

[0013] The anti-glare light-emitting component includes a light-transmitting cover that is fastened to the upper end face of the heat dissipation base, and a honeycomb anti-glare mesh is fixedly embedded in the top of the inner part of the light-transmitting cover;

[0014] The sealing and protection assembly includes an annular sealing groove on the top surface of the heat dissipation base, and a sealing gasket that fits and connects with the sealing groove is adhered to the bottom surface of the light-transmitting cover.

[0015] The above technical solution utilizes a bottom mounting base to support the overall structure. A hollowed-out heat dissipation base and its internal array of heat-conducting fins increase the heat conduction area. Combined with an inclined, through-flow heat dissipation duct, a natural convection heat dissipation channel is formed, quickly dissipating the heat generated by the LED chip, preventing heat accumulation and suppressing light decay. The PCB circuit board is fixed to the top surface of the heat dissipation base with thermally conductive adhesive, ensuring efficient heat conduction. A light-transmitting cover is fastened to the outside of the heat dissipation base for light protection, while an internal honeycomb anti-glare mesh evens out light and eliminates glare. A tight seal between the annular sealing groove on the top surface of the heat dissipation base and a sealing gasket ensures a sealed, dustproof, and waterproof connection at the lamp cover, effectively improving the lamp's lifespan and lighting quality.

[0016] Preferably, the heat dissipation base has a hollow cavity structure inside, and the hollow heat dissipation base and the heat-conducting fins are integrally formed aluminum alloy structures, and the heat-conducting fins are convex arc-shaped structures.

[0017] The above technical solution features a hollow heat dissipation base with an integrated, convex arc-shaped heat-conducting fin. The aluminum alloy material has a high thermal conductivity, and the integrated structure eliminates assembly thermal resistance. The arc-shaped fin increases the contact area with the air inside the cavity, and the hollow cavity, together with the air duct, forms a convection space. This allows for the rapid dispersion of LED heat transferred from the PCB board and full heat exchange with the air, effectively dissipating accumulated heat, reducing chip operating temperature, delaying light decay, and extending the lifespan of the lighting device.

[0018] Preferably, the light-transmitting cover is made of gradient frosted high-transmittance PC diffusion material, and the density of frosted particles in the light-transmitting cover increases sequentially from bottom to top.

[0019] Using the above technical solution, the light-transmitting cover is made of gradient frosted PC material. The low-density frosted bottom reduces light loss and ensures light transmission, while the high-density frosted top softens the initial diffusion of strong light, eliminates direct glare, and achieves an eye-protecting lighting effect.

[0020] Preferably, the honeycomb anti-glare mesh is a regular hexagonal honeycomb structure, and the honeycomb anti-glare mesh and the light-transmitting cover are integrally injection molded.

[0021] Using the above technical solution, the integrally injection-molded regular hexagonal honeycomb anti-glare mesh provides secondary blocking and homogenization of light. The dual optical structure works together to eliminate direct glare, maintaining high light transmittance while ensuring uniform and soft light, thus achieving an eye-protecting lighting effect.

[0022] Preferably, the mounting base has mounting holes at all four corners, and pads are fixed at the four corners of the upper surface of the mounting base. Threaded holes are formed in the middle of the pads. Through holes corresponding to the threaded holes are formed at the four corners of the heat dissipation base, and mounting bolts that are threadedly connected to the threaded holes are passed through the middle of the through holes.

[0023] Using the above technical solution, mounting holes are opened at the four corners of the mounting base to facilitate the overall fixed installation of the device. The pad supports form an annular air intake gap between the mounting base and the heat sink base. The threaded hole in the middle of the pad cooperates with the through hole of the heat sink base and the mounting bolt to achieve a locking assembly between the two, making disassembly and assembly convenient. At the same time, the reserved gap allows for the supply of cold air to the heat dissipation duct, ensuring continuous natural convection heat dissipation.

[0024] Preferably, the upper end face of the heat dissipation base is fixed with four barbed buckles in an annular shape, and the bottom of the light-transmitting cover is provided with a buckle groove for engaging with the buckles.

[0025] Using the above technical solution, the inverted hook-shaped buckle and the bottom groove of the light-transmitting cover are precisely matched and engaged, realizing the quick and easy assembly and disassembly of the light-transmitting cover and the heat dissipation base. The assembly structure is stable and not easy to loosen. Disassembly and assembly can be completed without auxiliary tools, which facilitates the later maintenance, dust removal and replacement of parts of the lamp. At the same time, the sealing structure ensures the fit of the assembly and ensures the overall sealing and protection performance.

[0026] Preferably, the inclination angle of the heat dissipation duct is 15-30 degrees, the cross-section of the duct is a parallelogram structure, and multiple sets of heat dissipation ducts are arranged vertically.

[0027] Using the above technical solution, the heat dissipation air duct adopts a 15-30 degree tilt angle and a parallelogram cross-section structure, and is arranged in multiple groups at the top and bottom. The tilted structure can effectively prevent rain and guide airflow, and prevent water mist and dust from directly entering the cavity. The parallelogram cross-section increases the ventilation flow area, and the multiple groups of air ducts arranged in a staggered manner at the top and bottom improve the efficiency of air intake and exhaust. Together with the internal hollow cavity, it forms a stable vertical natural convection, accelerates the exhaust of hot air in the cavity, and significantly improves the overall heat dissipation efficiency.

[0028] Compared with the prior art, the beneficial effects of the present invention are: the semiconductor lighting device,

[0029] 1. The overall structure is supported by a bottom mounting base. The hollow heat dissipation base and its internal array of heat-conducting fins increase the heat conduction area. Combined with the inclined and continuous heat dissipation air duct, a natural convection heat dissipation channel is formed, which can quickly dissipate the heat generated by the LED light-emitting chip, avoid heat accumulation, and suppress light decay. The PCB circuit board is fixed to the top surface of the heat dissipation base with thermal adhesive to ensure efficient heat conduction. The light-transmitting cover is fastened to the outside of the heat dissipation base to protect the light output. Combined with the internal honeycomb anti-glare mesh, the light is evenly distributed and the lighting glare is eliminated. The ring-shaped sealing groove on the top surface of the heat dissipation base and the sealing gasket fit tightly to achieve a sealed dustproof and waterproof connection at the lamp cover, which effectively improves the life of the lamp and the lighting quality.

[0030] 2. The hollow heat dissipation base is fitted with an integrated, convex arc-shaped heat-conducting fin. The aluminum alloy material has a high thermal conductivity, and the integrated structure eliminates assembly thermal resistance. The arc-shaped fin increases the contact area with the air inside the cavity, and the hollow cavity, together with the air duct, forms a convection space, which can quickly disperse the heat transferred from the LED by the PCB board and fully exchange heat with the air, efficiently dissipating accumulated heat, reducing the chip operating temperature, delaying light decay, and extending the service life of the lighting device.

[0031] 3. The light-transmitting cover is made of gradient frosted PC material. The low-density frosted bottom reduces light loss and ensures light transmission, while the high-density frosted top softens the initial diffusion of strong light. Combined with the one-piece injection-molded regular hexagonal honeycomb anti-glare mesh, it provides secondary blocking and uniform light. The dual optical structure works together to eliminate direct glare, maintaining high light transmittance while ensuring uniform and soft light output, achieving an eye-protecting lighting effect.

[0032] 4. The inverted hook-shaped buckle precisely matches and engages with the bottom groove of the light-transmitting cover, enabling quick and easy assembly and disassembly of the light-transmitting cover and the heat dissipation base. The assembly structure is stable and not easy to loosen. Disassembly and assembly can be completed without auxiliary tools, which facilitates the later maintenance, dust removal and replacement of parts. At the same time, the sealing structure ensures the fit of the assembly and guarantees the overall sealing and protection performance. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the external structure of the main body of the present invention;

[0034] Figure 2 This is a schematic diagram of the heat dissipation component structure of the present invention;

[0035] Figure 3 This is a schematic diagram of the mounting base structure of the present invention;

[0036] Figure 4 This is a schematic diagram of the connection structure between the PCB circuit board and the heat sink base of the present invention;

[0037] Figure 5 This is a schematic diagram of the light-transmitting cover structure of the present invention.

[0038] In the diagram: 1. Mounting base; 2. Mounting hole; 3. Foot; 4. Threaded hole; 5. Heat sink base; 6. Through hole; 7. Mounting bolt; 8. Heat-conducting fins; 9. Heat dissipation duct; 10. PCB circuit board; 11. LED light-emitting chip; 12. Clip; 13. Sealing groove; 14. Light-transmitting cover; 15. Clip groove; 16. Sealing gasket; 17. Honeycomb anti-glare mesh. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] Example 1

[0041] Please see Figures 1-4 The present invention provides a technical solution:

[0042] A semiconductor lighting device includes a mounting base 1, with a heat dissipation assembly mounted on its top. The heat dissipation assembly includes a hollow heat dissipation base 5 fixedly mounted on the upper surface of the mounting base 1. Multiple heat-conducting fins 8 are uniformly fixed to the inner wall of the hollow cavity of the heat dissipation base 5. Two sets of inclined heat dissipation channels 9 are symmetrically formed on the outer wall of the heat dissipation base 5, and the heat dissipation channels 9 are connected to the hollow cavity of the heat dissipation base 5. The interior of the heat dissipation base 5 has a hollow cavity structure, and the hollow heat dissipation base 5 and the heat-conducting fins 8 are integrally formed aluminum alloy structures, with the heat-conducting fins 8 having an inwardly convex arc-shaped structure. Mounting holes 2 are formed at each of the four corners of the mounting base 1. Pads 3 are fixed to the four corners of the upper surface of the mounting base 1, with threaded holes 4 in the center of each pad 3. Through holes 6 corresponding to the threaded holes 4 are formed at the four corners of the heat dissipation base 5, and mounting bolts 7, threadedly connected to the threaded holes 4, pass through the center of each through hole 6. The inclination angle of the heat dissipation duct 9 is 15 degrees to 30 degrees, and the cross-section of the duct is a parallelogram structure, with multiple sets of heat dissipation ducts arranged vertically.

[0043] This semiconductor lighting device uses a mounting base 1 as the overall supporting body. The mounting holes 2 at the four corners of the mounting base 1 are used to fix the device in place. The pads 3 at the four corners of the upper surface of the mounting base 1 are threaded together with the mounting bolts 7 that pass through the through holes 6 at the four corners of the heat dissipation base 5 through the threaded holes 4 in the middle of their own bodies. This allows the hollow heat dissipation base 5 to be stably mounted above the mounting base 1, and a ventilation gap is formed between the two. The hollow heat dissipation base 5 adopts a hollow cavity structure and is made of aluminum alloy with the heat-conducting fins 8 with the inner convex arc structure. It has high thermal conductivity and no assembly thermal resistance. The arc heat-conducting fins 8 effectively increase the air heat exchange area. Together with the heat dissipation air duct 9 that is inclined on the outer wall of the heat dissipation base 5 and connected to the hollow cavity, a natural convection heat dissipation channel is formed from bottom to top. It can quickly remove the working heat of the LED, effectively reduce the working temperature of the device, suppress light decay, and improve the overall heat dissipation performance and service life of the lamp.

[0044] Example 2

[0045] Please see Figure 1 , Figure 4 , Figure 5 The present invention provides a technical solution:

[0046] An LED light-emitting component is mounted on the top surface of the heat dissipation assembly, and an anti-glare light-emitting component is fitted around the outside of the LED light-emitting component. A sealing and protective component is provided at the connection between the heat dissipation assembly and the anti-glare light-emitting component. The LED light-emitting component includes a PCB circuit board 10 and LED light-emitting chips 11 arrayed and soldered to the top surface of the PCB circuit board 10, and the bottom surface of the PCB circuit board 10 is attached and fixed to the top surface of the heat dissipation base 5. The anti-glare light-emitting component includes a light-transmitting cover 14 fastened to the upper end surface of the heat dissipation base 5, and a honeycomb anti-glare mesh 17 is fixedly embedded in the top of the inner part of the light-transmitting cover 14. The sealing and protective component includes an annular sealing groove 13 opened on the top surface of the heat dissipation base 5, and a sealing gasket 16 is bonded to the bottom surface of the light-transmitting cover 14 and fitted and connected to the sealing groove 13. The light-transmitting cover 14 is made of gradient frosted high-transmittance PC diffusion material, and the density of frosted particles in the light-transmitting cover 14 increases sequentially from bottom to top. The honeycomb anti-glare mesh 17 is a regular hexagonal honeycomb structure, and the honeycomb anti-glare mesh 17 and the light-transmitting cover 14 are integrally injection molded. The upper surface of the heat dissipation base 5 is uniformly fixed with four barbed buckles 12 in a ring shape, and the bottom of the light-transmitting cover 14 is provided with a buckle groove 15 that engages with the buckles 12.

[0047] In this semiconductor lighting device, the bottom surface of the PCB circuit board 10 of the LED light-emitting component is fixed to the top surface of the hollow heat dissipation base 5 with thermally conductive adhesive. The heat generated by the LED light-emitting chips 11 arrayed and soldered to the top surface of the PCB circuit board 10 can be directly conducted to the heat dissipation component for rapid dissipation. The light-transmitting cover 14 is connected to the bottom of the heat dissipation base 5 by means of the evenly arranged barbed buckles 12 on the upper surface of the heat dissipation base 5 and the buckle groove 15, which can be fastened together to achieve quick assembly and disassembly. The light-transmitting cover 14 is made of a gradient frosted high-transmittance PC diffusion material with a progressively increasing frosted particle density from bottom to top. The integrated hexagonal honeycomb anti-glare mesh 17 can diffuse and block light in layers, eliminating glare caused by direct strong light and improving the uniformity and softness of the emitted light. At the same time, the sealing gasket 16 bonded to the bottom surface of the light-transmitting cover 14 is embedded in the annular sealing groove 13 on the top surface of the heat sink base 5 and fits tightly. This forms a sealed protective structure at the connection between the heat sink base 5 and the light-transmitting cover 14, preventing external moisture and dust from entering the interior of the light-transmitting cover 14, protecting the PCB circuit board 10 and the LED light-emitting chip 11, and ensuring the long-term stable operation of the device.

[0048] Working principle:

[0049] This invention relies on a mounting base 1 with mounting holes 2 as the overall supporting component. The four corner feet 3 at the upper end of the mounting base 1 are locked and fixed to the hollow heat dissipation base 5 through threaded holes 4, through holes 6, and mounting bolts 7. The feet 3 elevate the hollow heat dissipation base 5 to form a bottom ventilation gap. The hollow heat dissipation base 5, made of integrally molded aluminum alloy, is hollow inside and has multiple inwardly convex arc-shaped heat-conducting fins 8. Combined with the externally inclined heat dissipation air duct 9 that connects to the hollow cavity, it forms a natural convection heat dissipation path. The bottom surface of the PCB circuit board 10 is attached to the top surface of the hollow heat dissipation base 5. The heat generated by the LED light-emitting chips 11 arrayed and soldered on it can be quickly transferred to the hollow heat dissipation base 5 and the heat-conducting fins 8, via... Air convection dissipates in a timely manner. The hook-shaped buckles 12 evenly arranged on the upper end of the hollow heat dissipation base 5 engage with the bottom buckle groove 15 of the light-transmitting cover 14 to achieve quick assembly and disassembly of the light-transmitting cover 14. The light-transmitting cover 14 is made of high-transmittance PC diffusion material with increasing frosted particle density from bottom to top. It is combined with an integrally injection-molded regular hexagonal honeycomb anti-glare mesh 17 to weaken glare by doubly diffusing light. The sealing gasket 16 bonded to the bottom surface of the light-transmitting cover 14 is embedded in the annular sealing groove 13 on the top surface of the hollow heat dissipation base 5 and fits tightly to prevent external dust and moisture from entering the interior of the light-transmitting cover 14. It forms protection for the PCB circuit board 10 and the LED light-emitting chip 11, realizing the integrated operation of efficient heat dissipation, soft light emission and sealing protection.

[0050] The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0051] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lighting device, comprising a mounting base (1), characterized in that: The top of the mounting base (1) is equipped with a heat dissipation component, and an LED light-emitting component is attached to the top surface of the heat dissipation component. An anti-glare light-emitting component is sleeved on the outside of the LED light-emitting component, and a sealing protection component is provided at the connection between the heat dissipation component and the anti-glare light-emitting component. The heat dissipation assembly includes a hollow heat dissipation base (5) fixedly installed on the upper surface of the mounting base (1). Multiple heat-conducting fins (8) are uniformly fixed on the inner wall of the hollow cavity of the heat dissipation base (5). Two sets of inclined heat dissipation air channels (9) are symmetrically opened on the outer wall of the heat dissipation base (5), and the heat dissipation air channels (9) are connected to the hollow cavity of the heat dissipation base (5). The LED light-emitting component includes a PCB circuit board (10) and LED light-emitting chips (11) arrayed and soldered on the top surface of the PCB circuit board (10), and the bottom surface of the PCB circuit board (10) is attached and fixed to the top surface of the heat dissipation base (5). The anti-glare light-emitting component includes a light-transmitting cover (14) that is fastened to the upper end of the heat dissipation base (5), and a honeycomb anti-glare mesh (17) is fixedly embedded in the top of the inner part of the light-transmitting cover (14). The sealing and protection assembly includes an annular sealing groove (13) on the top surface of the heat dissipation base (5), and a sealing gasket (16) that fits and connects with the sealing groove (13) is bonded to the bottom surface of the light-transmitting cover (14).

2. The semiconductor lighting device according to claim 1, characterized in that: The heat dissipation base (5) has a hollow cavity structure inside, and the hollow heat dissipation base (5) and the heat-conducting fins (8) are integrally formed aluminum alloy structures, and the heat-conducting fins (8) are convex arc structures.

3. A semiconductor lighting device according to claim 1, characterized in that: The light-transmitting cover (14) is made of gradient frosted high-transmittance PC diffusion material, and the density of frosted particles in the light-transmitting cover (14) increases sequentially from bottom to top.

4. A semiconductor lighting device according to claim 1, characterized in that: The honeycomb anti-glare mesh (17) is a regular hexagonal honeycomb structure, and the honeycomb anti-glare mesh (17) and the light-transmitting cover (14) are integrally injection molded.

5. A semiconductor lighting device according to claim 1, characterized in that: The mounting base (1) has mounting holes (2) at all four corners. The mounting base (1) has pads (3) fixed at the four corners of its upper surface. The pads (3) have threaded holes (4) in the middle. The heat dissipation base (5) has through holes (6) at its four corners corresponding to the threaded holes (4). The through holes (6) have mounting bolts (7) threadedly connected to the threaded holes (4) in the middle.

6. A semiconductor lighting device according to claim 1, characterized in that: The upper surface of the heat dissipation base (5) is annularly and evenly fixed with four barbed buckles (12), and the bottom of the light-transmitting cover (14) is provided with a buckle groove (15) for engaging with the buckles (12).

7. A semiconductor lighting device according to claim 1, characterized in that: The inclination angle of the heat dissipation duct (9) is 15 degrees to 30 degrees, and the duct cross-section is a parallelogram structure, and multiple heat dissipation ducts are arranged vertically.

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