Light emitting unit and display panel for vehicle
Patent Information
- Application Number
- CN202611153305.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2026-05-07
- Filing Date
- 2026-07-31
- Publication Date
- 2026-10-27
AI Technical Summary
然而,现有的NWs LED模组通常具有过于发散的出光光型,导致正向出光效率较低
[0007]基于上述,在本发明的一实施例的发光单元中,多个反射结构的设置能大幅提升发光单元的正向出光效率。每个发光结构的第一端部和第二端部可经由位在其相邻两侧的两个反射结构分别与位于基板另一侧的两个接合垫电性连接。由于这些反射结构还可同时作为多个发光结构与两个接合垫的电性桥接元件,可大幅降低发光单元的电路设计复杂度,有助于发光单元的微型化。
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Figure CN122995382A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to an optical unit and a display panel, and more particularly to a light-emitting unit and an automotive display panel. Background Technology
[0002] In recent years, nanowire (NW) light-emitting diode (LED) modules have been widely used in the display technology field. However, existing NW LED modules typically have an overly divergent light emission pattern, resulting in low forward light emission efficiency. Furthermore, this overly divergent light emission pattern can easily cause light to propagate to unintended areas. For example, in automotive display panels, excessive light may shine onto the windshield, affecting the driver's visibility and potentially jeopardizing driving safety. Summary of the Invention
[0003] The present invention provides a light-emitting unit with better forward light emission efficiency.
[0004] This invention provides a vehicle display panel with better light emission efficiency in the display direction.
[0005] The light-emitting unit of the present invention includes a substrate, a plurality of conductive pads, a plurality of light-emitting structures, a plurality of reflective structures, a first transparent conductive layer, a second transparent conductive layer, a first bonding pad, and a second bonding pad. The substrate has a first surface and a second surface facing away from each other. A plurality of conductive pads are disposed on the first surface. A plurality of light-emitting structures are disposed on the substrate, each having a first end and a second end facing each other. The plurality of first ends of these light-emitting structures are electrically bonded to the plurality of conductive pads. A plurality of reflective structures are disposed on the first surface. At least one of the plurality of light-emitting structures is disposed between any two adjacent reflective structures. The first transparent conductive layer covers the plurality of reflective structures and electrically connects the plurality of conductive pads and the plurality of reflective structures. The second transparent conductive layer electrically connects the plurality of second ends of the plurality of light-emitting structures. A first bonding pad and a second bonding pad are disposed on the second surface. The first bonding pad penetrates the substrate to electrically connect one of the plurality of reflective structures. The second bonding pad penetrates the substrate to electrically connect the other of the plurality of reflective structures.
[0006] The automotive display panel of the present invention includes a circuit board and a plurality of the aforementioned light-emitting units. The plurality of light-emitting units are electrically bonded to the circuit board. The vehicle body is provided with a windshield. Each light-emitting structure of each light-emitting unit has one of a plurality of reflective structures on the side facing the windshield. The arrangement direction of these reflective structures intersects the windshield, and the extending direction of these reflective structures is parallel to the horizontal direction of the driver's field of vision inside the vehicle.
[0007] Based on the above, in a light-emitting unit according to an embodiment of the present invention, the arrangement of multiple reflective structures can significantly improve the forward light emission efficiency of the light-emitting unit. The first and second ends of each light-emitting structure can be electrically connected to two bonding pads located on the other side of the substrate via two reflective structures located on their adjacent sides. Since these reflective structures can also simultaneously serve as electrical bridging elements between the multiple light-emitting structures and the two bonding pads, the circuit design complexity of the light-emitting unit can be significantly reduced, contributing to the miniaturization of the light-emitting unit. Attached Figure Description
[0008] Figure 1 This is a top view schematic diagram of the light-emitting unit according to the first embodiment of the present invention.
[0009] Figure 2 yes Figure 1 A cross-sectional schematic diagram of the light-emitting unit.
[0010] Figure 3 yes Figure 1 A simplified circuit diagram of the light-emitting unit.
[0011] Figure 4 This is a front view schematic diagram of a vehicle display panel according to an embodiment of the present invention.
[0012] Figure 5 and Figure 6 yes Figure 4 A schematic diagram of a vehicle display panel installed on the vehicle body.
[0013] Figures 7A to 7I yes Figure 2 A cross-sectional schematic diagram of the manufacturing process of the light-emitting unit.
[0014] Figure 8A and Figure 8B yes Figure 4 A cross-sectional schematic diagram of the manufacturing process of automotive display panels.
[0015] Figure 9 This is a top view schematic diagram of the light-emitting unit according to the second embodiment of the present invention.
[0016] Figure 10 This is a top view schematic diagram of the light-emitting unit according to the third embodiment of the present invention.
[0017] Figure 11 yes Figure 10 A cross-sectional schematic diagram of the light-emitting unit.
[0018] Figure 12 This is a top view schematic diagram of the light-emitting unit according to the fourth embodiment of the present invention.
[0019] Figure 13 yes Figure 12 A cross-sectional schematic diagram of the light-emitting unit.
[0020] List of reference numerals
[0021] 10: Automotive display panel
[0022] 100, 100A, 100B, 100C: Light-emitting units
[0023] 110, 110A, SUB: Substrate
[0024] 110s1: First surface
[0025] 110s2: Second surface
[0026] 115: Conductor pad
[0027] 120, 120A: Light-emitting structure
[0028] 120s, 130s: Structural surface
[0029] 121~123: First light-emitting structure ~ Third light-emitting structure
[0030] 130, 131~134, 130A, 131A, 132A: Reflective structures
[0031] 140, 140B: First transparent conductive layer
[0032] 141~144, 161~163, 161C, 162C: Conductive patterns
[0033] 150: Light diffusion layer
[0034] 150s: Surface
[0035] 155: Scattering particles
[0036] 160, 160C: Second transparent conductive layer
[0037] 170: Encapsulation layer
[0038] 181, 181A: First bonding pad
[0039] 182, 182A: Second joint pad
[0040] CB: Circuit board
[0041] CR1, CR2: Carrier plates
[0042] DVR: Driving
[0043] ep1: First end
[0044] ep2: Second end
[0045] H1, H2, H3: Height
[0046] HD: Horizontal field of view
[0047] TH1, TH1”: First contact hole
[0048] TH2, TH2”: Second contact hole
[0049] VB: Vehicle body
[0050] W: Width
[0051] WS: Windshield
[0052] X, Y, Z: Direction
[0053] A-A', B-B', C-C': Section lines Detailed Implementation
[0054] In the accompanying drawings, the thicknesses of layers, films, panels, regions, etc., are enlarged for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or intermediate elements may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate elements are present. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" can refer to the presence of other elements between two elements.
[0055] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, and / or parts should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or part from another. Therefore, the “first element,” “component,” “region,” “layer,” or “part” discussed below may be referred to as a second element, component, region, layer, or part without departing from the teachings of this document.
[0056] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” or “substantially” herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, and may not require a single standard deviation to apply to all properties.
[0057] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the relevant technology and the invention, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined herein.
[0058] Figure 1 This is a top view schematic diagram of the light-emitting unit according to the first embodiment of the present invention. Figure 2 yes Figure 1 A cross-sectional schematic diagram of the light-emitting unit. Figure 3 yes Figure 1 A simplified circuit diagram of the light-emitting unit. Figure 4 This is a front view schematic diagram of a vehicle display panel according to an embodiment of the present invention. Figure 5 and Figure 6 yes Figure 4 A schematic diagram of a vehicle display panel installed on the vehicle body. Figures 7A to 7I yes Figure 2 A cross-sectional schematic diagram of the manufacturing process of the light-emitting unit. Figure 8A and Figure 8B yes Figure 4 A cross-sectional schematic diagram of the manufacturing process of automotive display panels. Figure 2 Corresponding to Figure 1 The section line A-A'. For clarity, Figure 1 Only shown Figure 2 Part of the membrane layer.
[0059] Please refer to Figure 1 and Figure 2The light-emitting unit 100 includes a substrate 110, a plurality of conductive pads 115, and a plurality of light-emitting structures 120. The substrate 110 has a first surface 110s1 and a second surface 110s2 facing each other. The substrate 110 is made of materials such as glass, dielectric materials (e.g., TiO2), Al2O3 (i.e., sapphire material), polymers (e.g., polyimide, polymethyl methacrylate, or polyethylene terephthalate), or other suitable substrates. A plurality of conductive pads 115 are disposed on the first surface 110s1 of the substrate 110. A plurality of light-emitting structures 120 are disposed on the substrate 110, each having a first end ep1 and a second end ep2 facing each other. The plurality of first ends ep1 of these light-emitting structures 120 are electrically bonded to the plurality of conductive pads 115.
[0060] For example, in this embodiment, the light-emitting structure 120 may include a P-type semiconductor layer (not shown), an N-type semiconductor layer (not shown), and a light-emitting layer (not shown), wherein the light-emitting layer is located between the P-type semiconductor layer and the N-type semiconductor layer. The first end ep1 of the light-emitting structure 120 may be one of the P-type semiconductor layer and the N-type semiconductor layer, and its second end ep2 may be the other of the P-type semiconductor layer and the N-type semiconductor layer, but is not limited thereto. In this embodiment, the orthographic projection of each of the light-emitting structures 120 onto the first surface 110s1 has a width W along any direction parallel to the first surface 110s1 (e.g., direction X), and the width W is less than or equal to 2500 nm. That is, the light-emitting structure 120 in this embodiment may be a nanowire (NWs) light-emitting diode.
[0061] In this embodiment, multiple conductive pads 115 may be arranged along direction X and extend in direction Y. Multiple (e.g., three, but not limited to) light-emitting structures 120 may be bonded to each conductive pad 115. For example, multiple light-emitting structures 120 bonded to the same conductive pad 115 may be arranged at intervals along direction Y, but are not limited thereto. The material of the conductive pads 115 includes, for example, gold, indium, tin, copper, or other metals or alloys containing the aforementioned metals.
[0062] To improve the forward light emission efficiency of the light-emitting unit 100, the light-emitting unit 100 further includes a plurality of reflective structures 130. These reflective structures 130 are disposed on the first surface 110s1 of the substrate 110, and a conductive pad 115 and at least one light-emitting structure 120 are provided between any two adjacent reflective structures 130. In this embodiment, these reflective structures 130 may extend in the Y direction. Therefore, each of the plurality of light-emitting structures 120 bonded to the same conductive pad 115 has two identical reflective structures 130 on opposite sides. The material of the reflective structures 130 includes, for example, aluminum, titanium, silver, or other conductive materials with high reflectivity. More specifically, the reflective structures 130 of the present invention are conductive.
[0063] Each of the plurality of light-emitting structures 120 has a structural surface 120s facing away from the substrate 110, wherein the structural surface 120s has a height H1 relative to the first surface 110s1. Each of the plurality of reflective structures 130 has a structural surface 130s facing away from the substrate 110, wherein the structural surface 130s has a height H2 relative to the first surface 110s1. It should be noted that the height H1 of the structural surface 120s of each light-emitting structure 120 is less than the height H2 of the structural surface 130s of each reflective structure 130. Preferably, the ratio of height H1 to height H2 is less than or equal to 0.75. This ensures a significant improvement in the forward light emission efficiency of the light-emitting unit 100 due to the aforementioned plurality of reflective structures 130.
[0064] Furthermore, the light-emitting unit 100 also includes a first transparent conductive layer 140 and a second transparent conductive layer 160. The first transparent conductive layer 140 covers a plurality of reflective structures 130 and electrically connects a plurality of conductive pads 115 to these reflective structures 130. In this embodiment, the first transparent conductive layer 140 may include conductive patterns 141, 142, 143, and 144. The plurality of reflective structures 130 may include reflective structures 131, 132, 133, and 134 arranged sequentially along direction X. The conductive pattern 141 covers the reflective structure 131. The conductive pattern 142 covers the reflective structure 132 and is electrically connected to a first end ep1 of each light-emitting structure 120 (i.e., the first light-emitting structure) thereon via conductive pads 115 located between the reflective structures 131 and 132.
[0065] Similarly, conductive pattern 143 covers reflective structure 133 and is electrically connected thereto to the first end ep1 of each light-emitting structure 120 (i.e., the second light-emitting structure) via conductive pad 115 located between reflective structure 132 and reflective structure 133. Conductive pattern 144 covers reflective structure 134 and is electrically connected thereto to the first end ep1 of each light-emitting structure 120 (i.e., the third light-emitting structure) via conductive pad 115 located between reflective structure 133 and reflective structure 134.
[0066] On the other hand, the second transparent conductive layer 160 is electrically connected to the first transparent conductive layer 140 and the plurality of second ends ep2 of the plurality of light-emitting structures 120. Specifically, in this embodiment, the second transparent conductive layer 160 may include conductive patterns 161, 162, and 163. Conductive pattern 161 is located between reflective structures 131 and 132 and is electrically connected to conductive pattern 141 and the second ends ep2 of each light-emitting structure 120 (i.e., the first light-emitting structure) located between reflective structures 131 and 132.
[0067] Similarly, conductive pattern 162 is located between reflective structure 132 and reflective structure 133 and electrically connected to conductive pattern 142 and the second end ep2 of each light-emitting structure 120 (i.e., the second light-emitting structure) located between reflective structure 132 and reflective structure 133. Conductive pattern 163 is located between reflective structure 133 and reflective structure 134 and electrically connected to conductive pattern 143 and the second end ep2 of each light-emitting structure 120 (i.e., the third light-emitting structure) located between reflective structure 133 and reflective structure 134.
[0068] Please refer to Figures 1 to 3 Through the configuration relationship of the first transparent conductive layer 140 and the second transparent conductive layer 160, multiple light-emitting structures 120 (e.g., first light-emitting structure 121, second light-emitting structure 122, and third light-emitting structure 123) located in multiple grooves defined by multiple reflective structures can be electrically connected in series (i.e., the first light-emitting structure 121, second light-emitting structure 122, and third light-emitting structure 123 are connected in series with each other). Specifically, multiple light-emitting structures located in the same groove (e.g., multiple first light-emitting structures 121, multiple second light-emitting structures 122, or multiple third light-emitting structures 123) are electrically connected in parallel (i.e., multiple first light-emitting structures 121 in the same groove are connected in parallel with each other, multiple second light-emitting structures 122 in the same groove are connected in parallel with each other, and multiple third light-emitting structures 123 in the same groove are connected in parallel with each other).
[0069] Furthermore, to improve the light emission uniformity of the light-emitting unit 100, the light-emitting unit 100 may also include a light diffusion layer 150 disposed on the first surface 110s1 of the substrate 110 and located between the plurality of reflective structures 130. The light diffusion layer 150 contacts the plurality of light-emitting structures 120, the first transparent conductive layer 140 and the second transparent conductive layer 160, and exposes the second end ep2 of each light-emitting structure 120, wherein the second end ep2 is provided with the aforementioned structural surface 120s. The light diffusion layer 150 may be provided with a plurality of scattering particles 155, wherein the material of the scattering particles 155 includes, for example, titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), polymethyl methacrylate (PMMA) or other suitable high refractive index scattering materials.
[0070] In this embodiment, the surface 150s of the light diffusion layer 150 facing away from the substrate 110 can be aligned with the structural surface 120s of each light-emitting structure 120. That is, the light diffusion layer 150 only exposes the structural surface 120s of each light-emitting structure 120, but is not limited thereto. More specifically, the surface 150s of the light diffusion layer 150 has a height H3 relative to the first surface 110s1, and the height H3 is equal to the height H1 of the structural surface 120s of each light-emitting structure 120. However, in one embodiment, the height H3 of the surface 150s of the light diffusion layer 150 can be less than the height H1 of the structural surface 120s of each light-emitting structure 120. A second transparent conductive layer 160 can be disposed on the surface 150s of the light diffusion layer 150, wherein three conductive patterns 161-163 can extend from the three conductive patterns 141-143 of the first transparent conductive layer 140 to the structural surface 120s of the corresponding light-emitting structure 120, respectively, to achieve an electrical connection with the second end ep2 of the corresponding light-emitting structure 120.
[0071] On the other hand, the light-emitting unit 100 also includes a first bonding pad 181 and a second bonding pad 182 disposed on the second surface 110s2 of the substrate 110. The first bonding pad 181 is electrically connected to one of the plurality of reflective structures 130 (e.g., reflective structure 131) via a first contact hole TH1 (i.e., penetrating the substrate 110) of the substrate 110. The second bonding pad 182 is electrically connected to another of the plurality of reflective structures 130 (e.g., reflective structure 134) via a second contact hole TH2 (i.e., penetrating the substrate 110) of the substrate 110. Therefore, the conductive pattern 141 of the first transparent conductive layer 140 located on one side of the substrate 110 can be electrically connected to the first bonding pad 181 located on the other side of the substrate 110 via the reflective structure 131, and the conductive pattern 144 of the first transparent conductive layer 140 located on one side of the substrate 110 can be electrically connected to the second bonding pad 182 located on the other side of the substrate 110 via the reflective structure 134.
[0072] In other words, besides improving the forward light emission efficiency of the light-emitting unit 100, the reflective structure 130 can also serve as an electrical bridging element between the multiple light-emitting structures 120 and the first bonding pad 181 and the second bonding pad 182, which can significantly reduce the circuit design complexity of the light-emitting unit 100 and contribute to the miniaturization of the light-emitting unit 100. The materials of the first bonding pad 181 and the second bonding pad 182 include, for example, gold, tin, or other metals, or combinations thereof. The light-emitting unit 100 may also include an encapsulation layer 170 covering the multiple reflective structures 130, the light diffusion layer 150, the first transparent conductive layer 140, and the second transparent conductive layer 160. The materials of the encapsulation layer 170 include, for example, silicone, epoxy, silicon nitride (SiNx), silicon oxide (SiOx), aluminum oxide (Al2O3), or other dielectric materials.
[0073] Please refer to Figures 1 to 6 For example, Figure 1 and Figure 2 The light-emitting unit 100 can serve as a display unit of the automotive display panel 10, wherein the automotive display panel 10 includes a circuit board CB and a plurality of light-emitting units 100. These light-emitting units 100 are electrically bonded to the circuit board CB. In this embodiment, the plurality of light-emitting units 100 can be arranged in multiple columns and rows along intersecting (e.g., perpendicular) directions X and Y, but are not limited thereto. The circuit board CB may be provided with a plurality of pads (not shown), a plurality of signal traces (e.g., clock signal lines, scan lines, data lines, and power lines), and pixel circuits, but are not limited thereto.
[0074] The automotive display panel 10 is suitable for mounting on the vehicle body VB, and the vehicle body VB is equipped with a windshield WS. Figure 6 In this embodiment, the vehicle display panel 10 can serve as the vehicle's central control display and is mounted on the dashboard below the windshield WS, but is not limited thereto. For example, the central control display is suitable for allowing the driver DVR or the passenger in the front seat to operate various functions, such as air conditioning settings, vehicle navigation, audio and video playback, or reversing camera display. Currently common central control displays emit light not only near the normal viewing angle but also at a wide angle. This wide-angle emitted light is reflected by the windshield WS and is also received by the driver's eyes (e.g., ...). Figure 5 The light path (indicated by the dashed arrow) forms a reflection on the windshield WS, which not only interferes with the driver's DVR's vision but may also affect driving safety.
[0075] To address the aforementioned problems, the automotive display panel 10 of this embodiment can achieve a light suppression effect in a specific direction through the design of the aforementioned light-emitting unit 100. For example, considering... Figure 6 In order to reduce or suppress the amount of light emitted by the central control display in the direction (e.g., direction X) towards the windshield WS, the arrangement direction (e.g., direction X) of the multiple reflective structures 130 of each light-emitting unit 100 can intersect the windshield WS, and the extension direction of these reflective structures 130 is parallel to the horizontal direction HD of the driver's DVR's field of view inside the vehicle body VB. Alternatively, a reflective structure 130 is adjacent to the side of each light-emitting structure 120 of the light-emitting unit 100 facing the windshield WS, making the large-angle light emission more forward. In this way, not only can the reflection of light on the windshield WS be suppressed, but the forward light emission efficiency of the automotive display panel 10 can also be significantly improved.
[0076] The manufacturing process of the light-emitting unit 100 and the automotive display panel 10 will be described in an exemplary manner below.
[0077] First, multiple light-emitting structures 120 are formed on the substrate SUB, such as... Figure 7A As shown. The substrate SUB is, for example, a sapphire substrate or a gallium nitride (GaN) substrate, but is not limited thereto. Next, multiple light-emitting structures 120 are transferred and bonded to multiple conductive pads 115 on a substrate 110, wherein the substrate 110 is disposed on a carrier plate CR1, as shown. Figure 7B As shown. After the bonding of the multiple light-emitting structures 120 with the multiple conductive pads 115 is completed, the substrate SUB is removed.
[0078] Please refer to Figure 7C Next, a plurality of reflective structures 130 are formed on the first surface 110s1 of the substrate 110. After the reflective structures 130 are fabricated, a first transparent conductive layer 140 is formed to cover the plurality of reflective structures 130 and a portion of each conductive pad 115, such as... Figure 7D As shown. Please refer to... Figure 7E and Figure 7F After forming the first transparent conductive layer 140, a light diffusion layer 150 is formed on the first surface 110s1 of the substrate 110, and a second transparent conductive layer 160 is formed on the light diffusion layer 150.
[0079] After the fabrication of the second transparent conductive layer 160 is completed, an encapsulation layer 170 is formed to cover the light diffusion layer 150, the first transparent conductive layer 140, and the second transparent conductive layer 160, as follows. Figure 7G As shown. Next, all the film layers formed on the substrate 110, along with the substrate 110, are transferred to another carrier plate CR2, so that the surface of the encapsulation layer 170 facing away from the substrate 110 is connected to the carrier plate CR2, and the carrier plate CR1 is removed from one side of the second surface 110s2 of the substrate 110, as shown. Figure 7H As shown. Please refer to... Figure 7I After removing the carrier plate CR1, a first contact hole TH1 and a second contact hole TH2 are formed through the substrate 110, and a first bonding pad 181 and a second bonding pad 182 are formed on the second surface 110s2 of the substrate 110, wherein the first bonding pad 181 is electrically connected to the reflective structure 131 via the first contact hole TH1, and the second bonding pad 182 is electrically connected to the reflective structure 134 via the second contact hole TH2.
[0080] This completes the process. Figure 2 Fabrication of the light-emitting unit 100.
[0081] Please refer to Figure 8A After fabricating multiple light-emitting units 100 according to the above process, the multiple light-emitting units 100 on the carrier plate CR2 are transferred and electrically bonded to the circuit board CB. After the bonding of these light-emitting units 100 to the circuit board CB is completed, the carrier plate CR2 is removed, as shown below. Figure 8B As shown. This completes the process. Figure 4 Manufacturing of the vehicle display panel 10.
[0082] Other embodiments will be listed below to illustrate this disclosure in detail, wherein the same components will be labeled with the same symbols, and the description of the same technical content will be omitted. For the omitted parts, please refer to the foregoing embodiments, and they will not be repeated below.
[0083] Figure 9 This is a top view schematic diagram of the light-emitting unit according to the second embodiment of the present invention. Please refer to... Figure 9 In this embodiment, the light-emitting unit 100A and Figure 1 The difference between the light-emitting units 100 lies in the different configurations of the light-emitting structures. Specifically, in the light-emitting unit 100A of this embodiment, there is one light-emitting structure 120A located between any two adjacent reflective structures 130, and the extending direction of the light-emitting structure 120A is parallel to the extending direction of each reflective structure 130 (e.g., direction Y). In this embodiment, the width W of the orthographic projection of each light-emitting structure 120A on the first surface 110s1 along the arrangement direction (e.g., direction X) of the plurality of light-emitting structures 120A is less than or equal to 2500 nm.
[0084] Figure 10 This is a top view schematic diagram of the light-emitting unit according to the third embodiment of the present invention. Figure 11 yes Figure 10 A cross-sectional schematic diagram of the light-emitting unit. Figure 11 Corresponding to Figure 10 The section line B-B'. For clarity, Figure 10 Only shown Figure 11 Part of the membrane layer.
[0085] Please refer to Figure 10 and Figure 11 In this embodiment, the light-emitting unit 100B and Figure 1 The difference between the light-emitting unit 100 and the light-emitting unit 100 is that the configuration relationship between the bonding pad and the reflective structure is different. Specifically, in the light-emitting unit 100B of this embodiment, a plurality of reflective structures 130A are simultaneously superimposed on the first bonding pad 181 and the second bonding pad 182 on the normal direction (e.g., direction Z) of the first surface 110s1 of the substrate 110A.
[0086] In this embodiment, the light-emitting unit 100B has two reflective structures 130A, such as reflective structure 131A and reflective structure 132A. These two reflective structures 131A and 132A are arranged along the Y direction and extend in the X direction. That is, in this embodiment, the two reflective structures 131A and 132A are arranged along the short side of the substrate 110A, and... Figure 1The multiple reflective structures 130 are arranged differently along the long side of the substrate 110. Correspondingly, all the light-emitting structures 120 of the light-emitting unit 100B are arranged at intervals on the same conductive pad 115 along the long side (i.e., direction X) of the substrate 110A.
[0087] In this embodiment, the first contact hole TH1” of the substrate 110A is used to electrically connect the first bonding pad 181A and the reflective structure 131A, while the second contact hole TH2” of the substrate 110A is used to electrically connect the second bonding pad 182A and the reflective structure 132A. It is particularly noteworthy that the first contact hole TH1” of the substrate 110A is misaligned with the second contact hole TH2, whether along the long side direction (e.g., direction X) or the short side direction (e.g., direction Y) of the substrate 110A.
[0088] Since the light-emitting structure 120 can be a nanowire light-emitting diode, the two reflective structures 130A located on both sides of it may have a sub-micron level spacing. Through the staggered design of the first contact hole TH1” and the second contact hole TH2”, the first bonding pad 181A and the second bonding pad 182A can be disposed on the second surface 110s2 of the substrate 110A with a larger (e.g., micron level) spacing, which helps to improve the production yield of the light-emitting unit 100B.
[0089] Figure 12 This is a top view schematic diagram of the light-emitting unit according to the fourth embodiment of the present invention. Figure 13 yes Figure 12 A cross-sectional schematic diagram of the light-emitting unit. Figure 13 Corresponding to Figure 12 The cross section C-C'. For clarity, Figure 12 Only shown Figure 13 Part of the membrane layer.
[0090] Please refer to Figure 12 and Figure 13 In this embodiment, the light-emitting unit 100C and Figure 1 The difference between the light-emitting units 100 lies in the number and arrangement of the light-emitting structures on each conductive pad. Specifically, in the light-emitting unit 100C of this embodiment, the number of light-emitting structures 120 bonded to each conductive pad 115 is, for example, six, and these six light-emitting structures 120 are arranged on the conductive pad 115 along the X and Y directions, respectively. That is, the six light-emitting structures 120 bonded to the same conductive pad 115 can be arranged in an array. Since the six first ends ep1 of these six light-emitting structures 120 are electrically connected to the same conductive pad 115, and their six second ends ep2 are electrically connected to the same conductive pattern 161C or conductive pattern 162C of the second transparent conductive layer 160C, the six light-emitting structures 120 on the same conductive pad 115 are electrically connected in parallel.
[0091] It should be noted that, Figure 9 The light-emitting unit 100A, Figure 10 The light-emitting unit 100B and Figure 12 The 100C light-emitting unit can be used to replace Figure 4 The light-emitting unit 100 of the CRRC display panel 10 only needs to have multiple reflective structures arranged parallel to the direction of the light emission to be suppressed. For example, in Figure 4 On the circuit board CB, Figure 9 and Figure 12 The arrangement direction of the multiple reflective structures 130 can be similar to that of Figure 1 The arrangement direction of the multiple reflective structures 130, but Figure 10 The arrangement direction of multiple reflective structures 130A should be relative to Figure 1 The arrangement of multiple reflective structures is rotated 90 degrees (i.e. Figure 10 The direction Y in the middle must be parallel to Figure 4 (Direction X in the middle).
[0092] In summary, in the light-emitting unit of one embodiment of the present invention, the arrangement of multiple reflective structures can significantly improve the forward light emission efficiency of the light-emitting unit. The first and second ends of each light-emitting structure can be electrically connected to two bonding pads located on the other side of the substrate via two reflective structures located on their adjacent sides. Since these reflective structures can also simultaneously serve as electrical bridging elements between the multiple light-emitting structures and the two bonding pads, the circuit design complexity of the light-emitting unit can be significantly reduced, contributing to the miniaturization of the light-emitting unit.
Claims
1. A light-emitting unit, comprising: A substrate having a first surface and a second surface facing away from each other; Multiple conductive pads are disposed on the first surface; Multiple light-emitting structures are disposed on the substrate, each having a first end and a second end opposite to each other, wherein the multiple first ends of the multiple light-emitting structures are electrically connected to the multiple conductive pads; Multiple reflective structures are disposed on the first surface, wherein at least one of the multiple light-emitting structures is disposed between any two adjacent reflective structures. A first transparent conductive layer covers the plurality of reflective structures and electrically connects the plurality of conductive pads and the plurality of reflective structures; A second transparent conductive layer electrically connects the multiple second ends of the plurality of light-emitting structures; as well as A first bonding pad and a second bonding pad are disposed on the second surface, wherein the first bonding pad penetrates the substrate to electrically connect one of the plurality of reflective structures, and the second bonding pad penetrates the substrate to electrically connect the other of the plurality of reflective structures.
2. The light-emitting unit as claimed in claim 1, wherein each of the light-emitting structures has a first structural surface facing away from the substrate, the first structural surface having a first height relative to the first surface, and each of the reflective structures has a second structural surface facing away from the substrate, the second structural surface having a second height relative to the first surface, and the first height being less than the second height.
3. The light-emitting unit as claimed in claim 2, wherein the ratio of the first height to the second height is less than or equal to 0.
75.
4. The light-emitting unit as described in claim 2, further comprising: A light diffusion layer is disposed on the first surface and located between the plurality of reflective structures, wherein the light diffusion layer contacts the plurality of light-emitting structures, the first transparent conductive layer, the second transparent conductive layer and the plurality of conductive pads, and exposes the second end of each of the light-emitting structures. The second transparent conductive layer extends on a surface of the light diffusion layer opposite to the substrate and electrically connects the first transparent conductive layer and the second end of each of the light-emitting structures.
5. The light-emitting unit of claim 4, wherein the surface of the light-diffusing layer has a third height relative to the first surface, and the third height is less than or equal to the first height of the first structural surface of each of the light-emitting structures.
6. The light-emitting unit of claim 1, wherein the plurality of light-emitting structures are arranged along a first direction, the plurality of reflective structures extend in the first direction, the plurality of reflective structures are arranged along a second direction intersecting the first direction, the first bonding pad and the second bonding pad are arranged along the first direction and each overlaps the plurality of reflective structures in the normal direction of the first surface.
7. The light-emitting unit as claimed in claim 6, wherein the substrate is provided with a first contact hole and a second contact hole, the first bonding pad is electrically connected to one of the plurality of reflective structures via the first contact hole, the second bonding pad is electrically connected to the other of the plurality of reflective structures via the second contact hole, and the first contact hole is offset from the second contact hole along the first direction and the second direction.
8. The light-emitting unit as claimed in claim 1, wherein the plurality of light-emitting structures includes a first light-emitting structure and a second light-emitting structure, the plurality of reflective structures includes a first reflective structure, a second reflective structure and a third reflective structure, the first light-emitting structure is located between the first reflective structure and the second reflective structure, the second light-emitting structure is located between the second reflective structure and the third reflective structure, the first transparent conductive layer includes a first conductive pattern, a second conductive pattern and a third conductive pattern, the first conductive pattern covers the first reflective structure, the second conductive pattern covers the second reflective structure and is electrically connected to the first end of the first light-emitting structure, the third conductive pattern covers the third reflective structure and is electrically connected to the first end of the second light-emitting structure, the second transparent conductive layer includes a fourth conductive pattern and a fifth conductive pattern, the fourth conductive pattern is located between the first reflective structure and the second reflective structure and is electrically connected to the first conductive pattern and the second end of the first light-emitting structure, the fifth conductive pattern is located between the second reflective structure and the third reflective structure and is electrically connected to the second conductive pattern and the second end of the second light-emitting structure.
9. The light-emitting unit as claimed in claim 8, wherein the extending directions of the first light-emitting structure and the second light-emitting structure are parallel to the extending directions of the first reflective structure, the second reflective structure and the third reflective structure.
10. The light-emitting unit as claimed in claim 8, wherein a plurality of first light-emitting structures are provided between the first reflective structure and the second reflective structure, a plurality of second light-emitting structures are provided between the second reflective structure and the third reflective structure, the plurality of first light-emitting structures are arranged along the extending direction of the first reflective structure, and the plurality of second light-emitting structures are arranged along the extending direction of the second reflective structure.
11. The light-emitting unit as claimed in claim 10, further comprising: A light diffusion layer is disposed on the first surface and fills the space between the plurality of reflective structures and the plurality of light-emitting structures.
12. The light-emitting unit of claim 1, wherein the orthographic projection of each of the light-emitting structures on the first surface has a width along any direction parallel to the first surface, and the width is less than or equal to 2500 nm.
13. The light-emitting unit of claim 1, wherein the extension direction of each of the light-emitting structures is parallel to the extension direction of the plurality of reflective structures, and the orthographic projection of each of the light-emitting structures on the first surface has a width along the arrangement direction of the plurality of light-emitting structures, and the width is less than or equal to 2500 nm.
14. A vehicle display panel, suitable for mounting on a vehicle body, the vehicle display panel comprising: A circuit board; as well as A plurality of light-emitting units as described in claim 1 are electrically bonded to the circuit board, wherein the vehicle body is provided with a windshield, and each of the light-emitting structures of each of the light-emitting units is provided with one of the plurality of reflective structures on the side facing the windshield, the arrangement direction of the plurality of reflective structures intersects the windshield, and the extension direction of the plurality of reflective structures is parallel to a horizontal direction of the driver's field of vision inside the vehicle body.