RGB lamp bead and processing method thereof

Abstract

The application provides an RGB lamp bead and a processing method thereof, and relates to the technical field of RGB lamp beads, and comprises a substrate, a chip, the chip comprises a red light-emitting wafer, a green light-emitting wafer and a blue light-emitting wafer, and the red light-emitting wafer, the green light-emitting wafer and the blue light-emitting wafer are all fixed on the substrate; wherein a heat insulating body is arranged at the side position of the red light-emitting wafer in the substrate, so as to hinder the heat generated by the red light-emitting wafer from being transmitted to the green light-emitting wafer and / or the blue light-emitting wafer; the heat generated by the red light-emitting wafer is prevented from being transmitted to the green light-emitting wafer and the blue light-emitting wafer, the problem of chroma drift, luminance and efficiency attenuation of the RGB lamp bead caused by heat conduction is avoided, meanwhile, since the heat insulating body is arranged in the substrate, the structure of the substrate surface is not changed, the arrangement of the three chips is not affected, and a blocking protrusion is not formed around the three chips, so that light blocking is avoided.

Description

Technical Field

[0001] This invention relates to the field of RGB LED technology, and more specifically, to an RGB LED and its processing method. Background Technology

[0002] RGB LEDs are LEDs that emit red, green, and blue light. By controlling the brightness ratio of these three colors, almost any color of light can be mixed.

[0003] RGB LED chips typically consist of a substrate, chips (red, green, and blue LEDs), and a lens. When RGB LEDs are working, the red, green, and blue LEDs generate different amounts of heat (red generates the most heat, followed by green, and then blue). Since all three LEDs are integrated on the substrate, thermal crosstalk can occur between them. For example, if the red LED generates more heat, the crosstalk can cause the green and blue LEDs to also heat up, leading to color distortion, brightness reduction, and efficiency degradation in the RGB LEDs. Summary of the Invention

[0004] The present invention aims to solve the problems of chromaticity drift, brightness and efficiency degradation of RGB LED beads caused by thermal crosstalk between red, green and blue light-emitting chips.

[0005] To address the above problems, the present invention provides an RGB LED bead, comprising: substrate; The chip includes a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip, all of which are fixed on a substrate. The substrate contains a heat insulation material located on the side of the red light-emitting chip to prevent the heat generated by the red light-emitting chip from being transferred to the green light-emitting chip and / or the blue light-emitting chip.

[0006] The RGB LED bead provided by this invention has, but is not limited to, the following beneficial effects compared to existing technologies: In this embodiment, by placing a heat insulation material on the substrate carrying the three chips, heat transfer from the red light-emitting chip to the green and blue light-emitting chips is prevented. Specifically, the heat insulation material is placed on the side of the substrate near the green and blue light-emitting chips to block the heat generated by the red light-emitting chip from being transferred to the green and blue light-emitting chips. This avoids the problems of color drift, brightness and efficiency degradation of the RGB LEDs caused by heat transfer. At the same time, since the heat insulation material is placed inside the substrate, it does not change the structure of the substrate surface, does not affect the placement of the three chips, and does not form a barrier protrusion around the three chips, thus avoiding light blocking.

[0007] Furthermore, the substrate includes a heat dissipation layer, an insulating layer, and a conductive layer arranged sequentially along the thickness direction, with the heat insulation body located inside the insulating layer.

[0008] Furthermore, the red light-emitting chip, green light-emitting chip, and blue light-emitting chip are arranged in two rows on the substrate, wherein the red light-emitting chip is in one row alone, and the green light-emitting chip and blue light-emitting chip are in the other row; A heat insulation body is provided between the two rows inside the insulating layer. The heat insulation body is inclined and is positioned along the direction from the row containing the red light-emitting chip to the row containing the green and blue light-emitting chips. The heat insulation body is inclined from the side closer to the conductive layer to the side closer to the heat dissipation layer.

[0009] Furthermore, the red light-emitting chip, the green light-emitting chip, and the blue light-emitting chip are arranged in the same row on the substrate, and the green light-emitting chip or the blue light-emitting chip is located in the middle position; A heat insulation body is provided inside the insulating layer on the side of the red light-emitting chip that is close to the green light-emitting chip or the blue light-emitting chip. The heat insulation body is inclined and extends from the red light-emitting chip toward the adjacent green light-emitting chip or the blue light-emitting chip. The heat insulation body is inclined from the side that is close to the conductive layer toward the side that is close to the heat dissipation layer.

[0010] Furthermore, the red, green, and blue light-emitting chips are arranged in the same row on the substrate, with the blue light-emitting chip positioned between the red and green light-emitting chips.

[0011] Furthermore, the insulating layer is also provided with a plurality of reinforcements, and the angle between the reinforcements and the insulating layer is greater than 0° and less than 90°.

[0012] Furthermore, both the insulation and the reinforcement are made of glass fiber braid.

[0013] Furthermore, it also includes a lens, which is integrally fixed on the substrate and covers the outside of the chip.

[0014] This invention also provides a method for processing RGB LED beads, comprising the following steps: Step 1: Substrate fabrication; Step 2, die bonding and encapsulation.

[0015] Furthermore, substrate fabrication includes: An insulating layer is formed on the heat dissipation layer. Before the insulating layer is cured, a heat insulation body and a reinforcing body are arranged in the insulating layer. Then the insulating layer is cured, and finally a conductive layer is formed on the insulating layer. Die-bonding packaging includes: Red, green, and blue light-emitting wafers are deposited onto the substrate, and then a lens is integrally formed on the substrate using encapsulating adhesive and molding process.

[0016] Since the technological improvements and beneficial effects of the processing method for RGB LED beads are at least the same as those for RGB LED beads, the processing method for RGB LED beads will not be elaborated here. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the RGB LED bead structure of this application; Figure 2 A schematic diagram of a triangular arrangement of chips; Figure 3 A schematic diagram of the thermal insulation structure when the chips are arranged in a triangular pattern. Figure 4 A schematic diagram of a structure in which chips are arranged in the same row. Figure 5 A schematic diagram of the thermal insulation structure when the chips are arranged in the same row; Figure 6 A schematic diagram of the reinforcement structure.

[0018] Explanation of reference numerals in the attached figures: 1. Substrate; 11. Heat dissipation layer; 12. Insulating layer; 13. Conductive layer; 121. Heat insulation; 122. Reinforcing material; 2. Chip; 21. Red light-emitting chip; 22. Green light-emitting chip; 23. Blue light-emitting chip; 3. Lens. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this application clearer, specific embodiments of this application are described clearly and completely below with reference to the accompanying drawings. It should be understood that the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments described in this application without creative effort will fall within the scope of protection of this application.

[0020] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used in the specification of this application is for the purpose of describing specific embodiments only and is not intended to limit this application; the terms "comprising," "including," "having," "containing," "comprise," etc., in the specification, claims, and accompanying drawings of this application are open-ended terms. They indicate that a method comprises one or more steps, or an apparatus comprises one or more elements, but do not exclude the inclusion of other steps or elements. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this application are used to distinguish different objects, not to describe a specific order or hierarchy. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0021] In the description of this application, it should be understood that the terms "upper", "lower", "left", "right", "front", "rear", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "attachment" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0023] In this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this application, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0024] See Figures 1 to 5 An RGB LED bead according to an embodiment of the present invention includes: substrate1; Chip 2 includes a red light-emitting chip 21, a green light-emitting chip 22, and a blue light-emitting chip 23, all of which are fixed on substrate 1. The substrate 1 has a heat insulation body 121 disposed inside the red light-emitting chip 21 on the side to prevent the heat generated by the red light-emitting chip 21 from being transferred to the green light-emitting chip 22 and / or the blue light-emitting chip 23.

[0025] As with existing technologies, among the three chips 2 of an RGB LED bead, the red light-emitting chip 21 generates the most heat, and the difference in heat generation between it and the other two chips 2 is significant. Although the green light-emitting chip 22 generates slightly more heat than the blue light-emitting chip 23, the difference is not large. In this embodiment, by arranging a heat insulation body 121 on the substrate 1 that carries the three chips 2, heat transfer from the red light-emitting chip 21 to the green and blue light-emitting chips 22 and 23 is prevented. Specifically, the heat insulation body 121 is arranged on the side of the red light-emitting chip 21 near the green and blue light-emitting chips 22 and 23, blocking the heat generated by the red light-emitting chip 21 from being transferred to the green and blue light-emitting chips 23. This avoids the problems of color drift, brightness and efficiency degradation of the RGB LED bead caused by heat transfer. At the same time, since the heat insulation body 121 is arranged inside the substrate 1, it does not change the surface structure of the substrate 1, does not affect the arrangement of the three chips 2, and does not form a barrier protrusion around the three chips 2, thus avoiding light blocking.

[0026] In the prior art, in order to reduce the impact of heat transfer, the red light-emitting chip 21 is generally placed further away from the other two chips 2, while the green light-emitting chip 22 and the blue light-emitting chip 23 are placed closer together. The placement of the red light-emitting chip 21 further away undoubtedly affects the overall layout of the RGB LED bead, making the RGB LED bead larger overall. In this embodiment, by placing the heat insulation body 121, the heat generated by the red light-emitting chip 21 is reduced from being transferred to the green light-emitting chip 22 and the blue light-emitting chip 23. At the same time, the red light-emitting chip 21 can be placed closer to the other two chips 2, thereby achieving a smaller size design for the RGB LED bead.

[0027] Furthermore, referring to Figures 2 to 6 The substrate 1 includes a heat dissipation layer 11, an insulating layer 12 and a conductive layer 13 arranged sequentially along the thickness direction, and the heat insulation body 121 is located inside the insulating layer 12.

[0028] Similar to existing technologies, substrate 1 includes a heat dissipation layer 11, an insulating layer 12, and a conductive layer 13. The heat dissipation layer 11 is either a copper or aluminum layer, the insulating layer 12 is a BT resin insulating layer, and the conductive layer 13 is a copper conductive layer. The conductive layers 13 corresponding to the three chips 2 on substrate 1 are independent of each other. The heat generated by chip 2 is first transferred to its corresponding conductive layer 13, and then through the insulating layer 12 to the heat dissipation layer 11. During heat transfer, the heat generated by the three chips 2 forms a heat transfer effect between the insulating layer 12 and the heat dissipation layer 11. However, at the heat dissipation layer 11, the heat is quickly dissipated outwards, minimizing the impact of the heat transfer effect. The heat dissipation layer 11 is made of copper. It is difficult to arrange other structures inside the aluminum metal heat dissipation layer 11. At the insulating layer 12, the heat generated by the red light-emitting chip 21 is directly transferred to the green light-emitting chip 22 and the blue light-emitting chip 23 inside the insulating layer 12, resulting in a large heat transfer effect. In this embodiment, the heat insulation body 121 is specifically arranged inside the insulating layer 12, rather than inside the entire substrate 1. On the one hand, it has a better blocking effect on the heat transfer from the red light-emitting chip 21 to the green light-emitting chip 22 and the blue light-emitting chip 23, reducing the heat transfer effect. On the other hand, it avoids the problem of difficulty in arranging the heat dissipation layer 11 as a copper heat dissipation layer 11 or an aluminum heat dissipation layer 11 when the heat insulation body 121 is arranged throughout the substrate 1.

[0029] Furthermore, referring to Figure 2 and Figure 3 Red light-emitting chip 21, green light-emitting chip 22 and blue light-emitting chip 23 are arranged in two rows on substrate 1, wherein red light-emitting chip 21 is in one row alone, and green light-emitting chip 22 and blue light-emitting chip 23 are in the other row; A heat insulation body 121 is provided inside the insulating layer 12 between the two rows. The heat insulation body 121 is inclined and is inclined from the side closer to the conductive layer 13 to the side closer to the heat dissipation layer 11 along the direction from the red light-emitting chip 21 in the row to the green light-emitting chip 22 and the blue light-emitting chip 23 in the row.

[0030] In the prior art, three chips 2 are arranged in a triangular pattern or in the same row on the substrate 1. In this embodiment, when the three chips 2 are arranged in a triangular pattern, the red light-emitting chip 21 is grouped into a separate row, and the connection between the green light-emitting chip 22 and the blue light-emitting chip 23 is grouped into another row. A heat insulation body 121 is arranged on the side of the row where the red light-emitting chip 21 is close to the green light-emitting chip 22 and the blue light-emitting chip 23. This can effectively block the heat from the red light-emitting chip 21 from being transferred to the green light-emitting chip 22 and the blue light-emitting chip 23. Of course, in order to ensure the effect of blocking heat transfer, the width of the heat insulation body 121 is larger than the width of the red light-emitting chip 21 in the design.

[0031] Meanwhile, the heat insulation body 121 is arranged at an angle between the two rows of chips 2. Specifically, the end of the heat insulation body 121 closer to the red light-emitting chip 2 is closer to the conductive layer 13, and the side of the heat insulation body 121 closer to the green light-emitting chip 22 and the blue light-emitting chip 23 is closer to the heat dissipation layer 11. With this design, while the heat insulation body 121 blocks the heat generated by the red light-emitting chip 21 from being transferred to the green light-emitting chip 22 and the blue light-emitting chip 23, the heat dissipation path of the red light-emitting chip 21 from the conductive layer 13 to the heat dissipation layer 11 becomes larger and larger, which can ensure the heat dissipation effect of the red light-emitting chip 21. The corresponding heat dissipation paths of the green light-emitting chip 22 and the blue light-emitting chip 23 become smaller and smaller. Through this optimization of the heat dissipation path for different heat amounts, the heat dissipation effect of the red light-emitting chip 21 with larger heat generation is better, which helps to maintain the heat consistency of the three chips 2 and ensure the stability of light emission.

[0032] Furthermore, referring to Figure 4 and Figure 5 Red light-emitting chip 21, green light-emitting chip 22 and blue light-emitting chip 23 are arranged in the same row on substrate 1, with green light-emitting chip 22 or blue light-emitting chip 23 in the middle position; A heat insulation body 121 is provided inside the insulating layer 12 on the side of the red light-emitting chip 21 that is close to the green light-emitting chip 22 or the blue light-emitting chip 23. The heat insulation body 121 is inclined and gradually tilts from the side close to the conductive layer 13 to the side close to the heat dissipation layer 11 along the direction from the red light-emitting chip 21 to the adjacent green light-emitting chip 22 or blue light-emitting chip 23.

[0033] In this embodiment, when the three chips 2 are arranged in the same row, the red light-emitting chip 21 is not in the middle. In this way, by placing a heat insulation body 121 between the red light-emitting chip 21 and the chip 2 in the middle, the heat of the red light-emitting chip 21 can be blocked from being transferred to the green light-emitting chip 22 and the blue light-emitting chip 23.

[0034] Of course, the green light-emitting chip 22 or the blue light-emitting chip 23 being in the middle position means that the green light-emitting chip 22 or the blue light-emitting chip 23 is located between the other two chips 2, rather than being restricted to the exact middle position.

[0035] Of course, the heat insulation element 121 here is also arranged at an angle to optimize the heat dissipation path. The specific principle has been described and will not be repeated here.

[0036] Furthermore, referring to Figure 4 and Figure 5 Red light-emitting chip 21, green light-emitting chip 22 and blue light-emitting chip 23 are arranged in the same row on substrate 1, with blue light-emitting chip 23 located between red light-emitting chip 21 and green light-emitting chip 22.

[0037] As with existing technologies, the blue light-emitting chip 23 has the lowest heat generation and a correspondingly lower temperature, allowing it to withstand more heat. When the three chips 2 are arranged in the same row, the blue light-emitting chip 23 is placed between the red light-emitting chip 21 and the blue light-emitting chip 23. While the heat insulation body 121 reduces heat transfer, the slight heat transfer is within the tolerance range of the blue light-emitting chip 23, and the temperature uniformity of the three chips 2 is higher, ensuring the stability of light emission.

[0038] Furthermore, referring to Figure 6 The insulation layer 12 is also provided with multiple reinforcements 122, and the angle between the reinforcements 122 and the insulation layer 12 is greater than 0° and less than 90°; the heat insulation body 121 and the reinforcements 122 are both glass fiber braided parts.

[0039] As with existing technologies, in order to improve the structural strength of the substrate 1, a glass fiber reinforcing layer is often added to the insulating layer 12. However, glass fiber has poor thermal conductivity, which blocks the heat generated by the chip 2 from the conductive layer 13 to the heat dissipation layer 11. In this embodiment, a reinforcement 122 is arranged inside the insulating layer 12. The reinforcement 122 is not parallel to the insulating layer 12, so that the heat-conducting particles inside the insulating layer 12 are continuous in the heat conduction path, reducing the obstruction to heat transfer. The angle between the reinforcement 122 and the insulating layer 12 is preferably 45~60°.

[0040] Of course, the reinforcement 122 may not be placed at the bottom of the three chips 2, or the angle between the reinforcement 122 and the insulating layer 12 at the bottom of the three chips 2 may be close to 90°, reducing the obstruction to the transfer of heat generated by the chips 2 to the heat dissipation layer 11. In addition, the angle between each reinforcement 122 and the insulating layer 12 may be inconsistent to improve the reinforcement effect of the insulating layer 12 in each direction.

[0041] The reinforcement 122 and the insulation 121 are both glass fiber braided components of the same structure. They are distinguished as reinforcement 122 and insulation 121 because they have different functions. When laying them, they can be laid together inside the insulation layer 12.

[0042] Furthermore, referring to Figure 1 The RGB LED also includes a lens 3, which is integrally fixed on the substrate 1 and covers the outside of the chip 2.

[0043] In this implementation, the lens 3 is integrally formed on the substrate 1, and the chip packaging and lens 3 forming are completed in one process, eliminating the later lens 3 assembly step, shortening the production cycle and greatly improving production efficiency.

[0044] A method for manufacturing RGB LED beads includes the following steps: Step 1: Fabrication of substrate 1; Step 2, die bonding and encapsulation.

[0045] Furthermore, the fabrication of substrate 1 includes: An insulating layer 12 is formed on the heat dissipation layer 11. Before the insulating layer 12 is cured, a heat insulation body 121 and a reinforcement body 122 are arranged in the insulating layer 12. Then the insulating layer 12 is cured, and finally a conductive layer 13 is formed on the insulating layer 12. Die-bonding packaging includes: Red light-emitting wafer 21, green light-emitting wafer 22 and blue light-emitting wafer 23 are respectively bonded on substrate 1, and then lens 3 is integrally formed on substrate 1 using encapsulant and molding process.

[0046] While the present invention has been disclosed above, its scope of protection is not limited thereto. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all such changes and modifications will fall within the scope of protection of the present invention.

Claims

1. An RGB LED bead, characterized in that, include: substrate(1); Chip (2), the chip (2) includes a red light-emitting chip (21), a green light-emitting chip (22) and a blue light-emitting chip (23), the red light-emitting chip (21), the green light-emitting chip (22) and the blue light-emitting chip (23) are all fixed on the substrate (1); The substrate (1) has a heat insulation body (121) disposed inside the side of the red light-emitting chip (21) to prevent the heat generated by the red light-emitting chip (21) from being transferred to the green light-emitting chip (22) and / or the blue light-emitting chip (23).

2. The RGB LED bead according to claim 1, characterized in that, The substrate (1) includes a heat dissipation layer (11), an insulating layer (12) and a conductive layer (13) arranged sequentially along the thickness direction, and the heat insulation body (121) is located inside the insulating layer (12).

3. An RGB LED bead according to claim 2, characterized in that, The red light-emitting chip (21), green light-emitting chip (22) and blue light-emitting chip (23) are arranged in two rows on the substrate (1), wherein the red light-emitting chip (21) is in one row alone, and the green light-emitting chip (22) and blue light-emitting chip (23) are in the other row; The insulating layer (12) has a heat insulation body (121) between two rows inside. The heat insulation body (121) is inclined and is arranged in the direction from the row where the red light-emitting chip (21) is located to the row where the green light-emitting chip (22) and the blue light-emitting chip (23) are located. The heat insulation body (121) is gradually inclined from the side closer to the conductive layer (13) to the side closer to the heat dissipation layer (11).

4. An RGB LED bead according to claim 2, characterized in that, The red light-emitting chip (21), green light-emitting chip (22) and blue light-emitting chip (23) are arranged in the same row on the substrate (1), and the green light-emitting chip (22) or the blue light-emitting chip (23) is located in the middle position; Inside the insulating layer (12), a heat insulation body (121) is provided on the side of the red light-emitting chip (21) near the green light-emitting chip (22) or the blue light-emitting chip (23). The heat insulation body (121) is inclined and is inclined from the side near the conductive layer (13) to the side near the heat dissipation layer (11) along the direction of the red light-emitting chip (21) toward the adjacent green light-emitting chip (22) or blue light-emitting chip (23).

5. An RGB LED bead according to claim 4, characterized in that, The red light-emitting chip (21), green light-emitting chip (22) and blue light-emitting chip (23) are arranged in the same row on the substrate (1), with the blue light-emitting chip (23) located between the red light-emitting chip (21) and the green light-emitting chip (22).

6. An RGB LED bead according to any one of claims 2 to 5, characterized in that, The insulating layer (12) is further provided with a plurality of reinforcements (122), and the included angle between the reinforcements (122) and the insulating layer (12) is greater than 0° and less than 90°.

7. An RGB LED bead according to claim 6, characterized in that, Both the insulation (121) and the reinforcement (122) are glass fiber braided components.

8. An RGB LED bead according to claim 1, characterized in that, It also includes a lens (3), which is integrally fixed on the substrate (1) and covers the outside of the chip (2).

9. A method for processing RGB LED beads, characterized in that, Includes the following steps: Step 1, substrate (1) fabrication; Step 2, die bonding and encapsulation.

10. The processing method of the RGB LED bead according to claim 9, characterized in that, The fabrication of substrate (1) includes: An insulating layer (12) is formed on the heat dissipation layer (11), wherein, before the insulating layer (12) is cured, a heat insulation body (121) and a reinforcement body (122) are arranged in the insulating layer (12), then the insulating layer (12) is cured, and finally a conductive layer (13) is formed on the insulating layer (12). Die-bonding packaging includes: Red light-emitting wafer (21), green light-emitting wafer (22) and blue light-emitting wafer (23) are die-bonded on substrate (1) respectively. Then, lens (3) is integrally formed on substrate (1) using encapsulant and molding process.

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