Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, a pixel definition layer located on one side of the substrate, the pixel definition layer surrounding a plurality of pixel openings, and a plurality of light emitting devices, each of which comprises a light emitting functional layer, the light emitting functional layer comprising a first carrier transport layer and a light emitting layer located in the pixel opening. In at least part of the light emitting devices, the light emitting layer comprises a first part and a second part connected to each other, the first part is located on the side of the first carrier transport layer away from the substrate, and the second part is located on at least part of the side of the first carrier transport layer. The second part of the light emitting layer can effectively protect at least part of the sidewall of the first carrier transport layer from being damaged, for example, the development solution of the first carrier transport layer used in the light emitting device prepared later erodes the first carrier transport layer of the light emitting device prepared earlier, effectively avoiding pixel defects, and effectively avoiding secondary color mixing.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to display panels, their manufacturing methods, and display devices. Background Technology

[0002] Current display panels, such as quantum dot light-emitting diode (QLED) display panels, use quantum dot materials as the light-emitting core. They possess advantages such as high color purity, high luminous efficiency, good stability and long lifespan, excellent contrast ratio, high brightness levels, energy saving and environmental friendliness, and the ability to emit light uniformly from all directions. They are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers, becoming the mainstream display panel. However, current display panels still cannot fully meet the demands. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device.

[0004] The first aspect of this application provides a display panel, including:

[0005] substrate;

[0006] A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses multiple pixel openings;

[0007] Multiple light-emitting devices, each light-emitting device including a light-emitting functional layer, the light-emitting functional layer including a first carrier transport layer and a light-emitting layer located in a pixel opening; in at least some of the light-emitting devices, the light-emitting layer includes a first part and a second part connected to each other, the first part being located on the side of the first carrier transport layer away from the substrate, and the second part being located on at least a portion of the peripheral side of the first carrier transport layer.

[0008] In one embodiment, the orthogonal projection of the first carrier transport layer onto the substrate is located within the orthogonal projection range of the first part onto the substrate.

[0009] Preferably, the second part covers at least a portion of the sidewalls of the first carrier transport layer;

[0010] Preferably, the second part covers all the sidewalls of the first carrier transport layer;

[0011] Preferably, the first carrier transport layer includes a hole transport layer.

[0012] In one embodiment, the light-emitting functional layer further includes: a first carrier injection layer located on the side of the first carrier transport layer close to the substrate;

[0013] Preferably, the first carrier injection layer is a monolithic structure;

[0014] Preferably, the second part is in contact with the first carrier injection layer;

[0015] Preferably, the light-emitting functional layer further includes: a second carrier transport layer located on the side of the light-emitting layer away from the substrate;

[0016] Preferably, the second carrier transport layer is a monolithic structure;

[0017] Preferably, the light-emitting device further includes: a first electrode layer located between the pixel defining layer and the substrate, wherein at least a portion of the first electrode layer is exposed to the pixel opening;

[0018] Preferably, the light-emitting device further includes: a second electrode layer located on the side of the light-emitting functional layer away from the substrate;

[0019] Preferably, the second electrode layer is a monolithic structure;

[0020] Preferably, the material of the light-emitting layer includes quantum dots;

[0021] Preferably, the polarities of the first carrier transport layer and the first carrier injection layer are orthogonal.

[0022] In one embodiment, the polarities of the first carrier transport layer and the light-emitting layer are orthogonal;

[0023] Preferably, the thickness of the second part in different light-emitting devices is the same or different along the direction perpendicular to the plane of the substrate;

[0024] Preferably, the plurality of light-emitting devices include a first light-emitting device and a third light-emitting device, wherein the light-emitting layer of the first light-emitting device includes a first part and a second part that are interconnected; the orthographic projection of the light-emitting layer of the third light-emitting device on the substrate coincides with the orthographic projection of the first carrier transport layer on the substrate.

[0025] Preferably, the plurality of light-emitting devices further includes a second light-emitting device, wherein the light-emitting layer of the second light-emitting device comprises a first part and a second part that are interconnected.

[0026] A second aspect of this application provides a display panel, comprising:

[0027] substrate;

[0028] A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses multiple pixel openings;

[0029] Multiple light-emitting devices, each light-emitting device including a light-emitting functional layer, the light-emitting functional layer including a first carrier transport layer and a light-emitting layer located in a pixel opening, the first carrier transport layer being located on the side of the light-emitting layer closer to the substrate, at least a portion of the light-emitting layer extending toward the substrate and covering at least a portion of the sidewall of the first carrier transport layer.

[0030] In one embodiment, the light-emitting layer covers the sidewalls of the first carrier transport layer;

[0031] Preferably, the first carrier transport layer includes a hole transport layer;

[0032] The light-emitting functional layer also includes: a first carrier injection layer, located on the side of the first carrier transport layer close to the substrate;

[0033] Preferably, the first carrier injection layer is a monolithic structure;

[0034] Preferably, the polarities of the first carrier transport layer and the first carrier injection layer are orthogonal.

[0035] A third aspect of this application provides a display panel, comprising:

[0036] substrate;

[0037] A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses multiple pixel openings;

[0038] Multiple light-emitting devices, each light-emitting device includes a light-emitting functional layer, the light-emitting functional layer includes a first carrier transport layer and a light-emitting layer located in the pixel opening, the first carrier transport layer being located on the side of the light-emitting layer closer to the substrate;

[0039] At least part of the light-emitting layer is located outside the outer boundary of the first carrier transport layer as projected onto the substrate.

[0040] In one embodiment, the light-emitting layer covers the first carrier transport layer;

[0041] Preferably, the first carrier transport layer includes a hole transport layer;

[0042] Preferably, the light-emitting functional layer further includes: a first carrier injection layer located on the side of the first carrier transport layer close to the substrate;

[0043] Preferably, the first carrier injection layer is a monolithic structure;

[0044] Preferably, the polarities of the first carrier transport layer and the first carrier injection layer are orthogonal.

[0045] The fourth aspect of this application provides a method for manufacturing a display panel, comprising:

[0046] A pixel defining layer is prepared on one side of the substrate, and the pixel defining layer encloses multiple pixel openings;

[0047] Multiple light-emitting devices are fabricated in a pixel aperture. The step of fabricating at least some of the light-emitting devices in the pixel aperture includes: fabricating a first carrier transport material layer on the side of the pixel defining layer away from the substrate; performing a first exposure process on the first carrier transport material layer using a first mask; fabricating a light-emitting material layer on the side of the first carrier transport material layer away from the substrate; performing a second exposure process on the light-emitting material layer using a second mask; and sequentially developing the light-emitting material layer and the first carrier transport material layer to obtain a light-emitting layer and a first carrier transport layer. The light-emitting layer includes a first part and a second part that are interconnected. The first part is located on the side of the first carrier transport layer away from the substrate, and the second part is located on at least a portion of the periphery of the first carrier transport layer.

[0048] In one embodiment, after performing a first exposure process on the first carrier transport material layer using a first mask, a first exposure area is obtained in the first carrier transport material layer.

[0049] After performing a second exposure process on the luminescent material layer using a second mask, a second exposure area is obtained in the luminescent material layer.

[0050] The orthographic projection of the first exposure area on the substrate is within the orthographic projection range of the second exposure area on the substrate;

[0051] Preferably, the distance between the edge of the first exposure area projected onto the substrate and the edge of the second exposure area projected onto the substrate is 2 to 3 μm.

[0052] In one embodiment, performing a second exposure process on the light-emitting material layer using a second mask includes:

[0053] The second mask is placed on the side of the light-emitting material layer away from the substrate;

[0054] The light-emitting material layer is illuminated by a preset light through the second opening of the second mask.

[0055] Preferably, the luminescent material layer is developed using a first developer;

[0056] Preferably, preparing a first carrier transport material layer on the side of the pixel defining layer away from the substrate includes: mixing the first carrier transport material with a first solvent and then coating it on the side of the pixel defining layer away from the substrate to obtain the first carrier transport material layer.

[0057] Preferably, the polarity of the first developer is orthogonal to the polarity of the first carrier transport material;

[0058] Preferably, the preset light includes ultraviolet light;

[0059] Preferably, the first solvent includes at least one of toluene, chlorobenzene, xylene, polyphenylene, and tetrahydronaphthalene;

[0060] Preferably, the first solvent comprises toluene and chlorobenzene, and the volume ratio of toluene to chlorobenzene is (0.5-3):(0.5-3).

[0061] In one embodiment, developing the luminescent material layer with a first developer includes:

[0062] The luminescent material layer was repeatedly immersed in the first developer;

[0063] Preferably, the luminescent material layer is immersed in the first developer for 8 to 12 seconds each time;

[0064] Preferably, the luminescent material layer is immersed in the first developer 3 to 8 times;

[0065] Preferably, the first developer comprises n-octane.

[0066] In one embodiment, after fabricating a pixel defining layer on one side of the substrate and before fabricating a first carrier transport layer in the pixel opening, the fabrication method further includes:

[0067] A first carrier injection layer is prepared on the side of the pixel defining layer away from the substrate, and a portion of the first carrier injection layer is located in the pixel opening;

[0068] Preferably, fabricating a first carrier injection layer on the side of the pixel defining layer facing away from the substrate includes:

[0069] The first carrier injection material is mixed with the third solvent and then coated on the side of the pixel defining layer away from the substrate;

[0070] Preferably, the polarity of the first solvent is orthogonal to the polarity of the first carrier injection material;

[0071] Preferably, a second developer is used to develop the first carrier transport material layer, and the polarity of the second developer is orthogonal to that of the first carrier injection material.

[0072] In one embodiment, performing a first exposure process on the first carrier transport material layer using a first mask includes:

[0073] The first mask is placed on one side of the substrate of the first carrier transport material layer;

[0074] The first carrier transport material layer is illuminated by a preset light through the first opening of the first mask.

[0075] Preferably, the first carrier transport material layer is developed using a second developer, and the developed light-emitting material layer flows and extends toward the substrate.

[0076] Preferably, the preset light includes ultraviolet light.

[0077] In one embodiment, developing the first carrier transport material layer using a second developer includes:

[0078] The first carrier transport material layer was repeatedly immersed in the second developer;

[0079] Preferably, the first carrier transport material layer is immersed in the second developer for 8 to 12 seconds each time;

[0080] Preferably, the first carrier transport material layer is immersed in the second developer 3 to 8 times;

[0081] Preferably, the second developer comprises chlorobenzene.

[0082] In one embodiment, after sequentially developing the luminescent material layer and the first carrier transport material layer, the method further includes:

[0083] The first carrier transport material layer and the luminescent material layer after development are dried.

[0084] Preferably, the drying process includes baking.

[0085] In one embodiment, the plurality of light-emitting devices includes a first light-emitting device and a second light-emitting device, wherein the first light-emitting device is fabricated first and the second light-emitting device is fabricated subsequently; the step of fabricating the plurality of light-emitting devices in the pixel aperture includes:

[0086] A first carrier transport material layer is prepared on the side of the pixel defining layer away from the substrate; a first exposure process is performed on the first carrier transport material layer using a first mask; a light-emitting material layer is prepared on the side of the first carrier transport material layer away from the substrate; a second exposure process is performed on the light-emitting material layer using a second mask; the light-emitting material layer and the first carrier transport material layer are sequentially developed to obtain the light-emitting layer and the first carrier transport layer, thereby obtaining a first light-emitting device;

[0087] A first carrier transport material layer is prepared on the side of the pixel defining layer away from the substrate; a third exposure process is performed on the first carrier transport material layer using a third mask; a light-emitting material layer is prepared on the side of the first carrier transport material layer away from the substrate; a fourth exposure process is performed on the light-emitting material layer using a fourth mask; the light-emitting material layer and the first carrier transport material layer are sequentially developed to obtain a light-emitting layer and a first carrier transport layer, thus obtaining a second light-emitting device. The orthographic projection of the light-emitting layer of the second light-emitting device on the substrate coincides with the orthographic projection of the first carrier transport layer on the substrate.

[0088] The fifth aspect of this application provides a display device, including the aforementioned display panel, or including a display panel prepared by the aforementioned preparation method.

[0089] According to the display panel provided in the embodiments of this application, the second part of the light-emitting layer is located on at least a portion of the periphery of the first carrier transport layer, which can effectively protect at least a portion of the sidewalls of the first carrier transport layer from damage. For example, the developer solution of the first carrier transport layer used in the subsequently prepared light-emitting device can effectively avoid pixel defects and secondary color mixing, resulting in a higher display quality of the display panel. Attached Figure Description

[0090] Figure 1 This is a schematic diagram of the cross-sectional structure of the light-emitting layer and hole transport layer in a display panel in the prior art.

[0091] Figure 2 This is a schematic cross-sectional view of the display panel in one embodiment of this application.

[0092] Figure 3 This is an enlarged structural schematic diagram of the light-emitting layer and the first carrier transport layer in one embodiment of this application.

[0093] Figure 4 This is an enlarged structural schematic diagram of the light-emitting layer and the first carrier transport layer in another embodiment of this application.

[0094] Figure 5 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0095] Figure 6 This is a schematic diagram of the process for manufacturing a display panel in one embodiment of this application.

[0096] Figures 7 to 10 This is a schematic diagram of the manufacturing process of the display panel in one embodiment of this application.

[0097] Figure 11 This is a top view of a first mask and a second mask stacked in one embodiment of this application.

[0098] Figures 12 to 15 This is a schematic diagram of the manufacturing process of the display panel in another embodiment of this application.

[0099] Figures 16 to 17 This is a schematic diagram of the manufacturing process of the display panel in another embodiment of this application.

[0100] Figure 18 This is a schematic diagram of the light-emitting effect of the display panel in Example 1.

[0101] Figure 19 This is a schematic diagram of the light-emitting effect of the display panel in Comparative Example 1. Detailed Implementation

[0102] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0103] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0104] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0105] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0106] Currently, direct photolithography of quantum dot emissive layers involves adding photosensitive materials to the top or within the quantum dot emissive layer. Under illumination, the photosensitive groups cross-link with the quantum dots, breaking the colloidal stability of the quantum dots and achieving patterning. However, due to van der Waals forces between the quantum dot material and the hole transport layer during film formation, residual development remains in other pixel pits after direct photolithography. To address this issue, photosensitive materials are doped into the hole transport layer, reducing its solubility and achieving patterning. However, when fabricating light-emitting devices 300 of different colors, reference... Figure 1 The schematic diagram of the cross-sectional structure of the display panel shown shows that the developing solution and solvent of the hole transport layer (the first carrier transport layer 311 in the figure) of the second light-emitting device 302, which is prepared later, will cause multiple damages to the hole transport layer 31 of the first light-emitting device 301, which is prepared earlier, resulting in pixel defects.

[0107] In view of this, the first aspect of this application provides a display panel, referring to Figure 2 The schematic diagram of the cross-sectional structure of the display panel shown includes: a substrate 100, a pixel defining layer 200, and multiple light-emitting devices 300.

[0108] Optionally, the pixel defining layer 200 is located on one side of the substrate 100, and the pixel defining layer 200 surrounds a plurality of pixel openings 210.

[0109] For example, the material of the pixel boundary layer 200 can be a regular material, which will not be elaborated further here.

[0110] Optionally, the light-emitting device 300 includes a light-emitting functional layer 310, which includes a first carrier transport layer 311 and a light-emitting layer 312 located in the pixel opening 210. (Refer to...) Figure 3 The diagram shows a partially enlarged structural view of the light-emitting layer and the first carrier transport layer. In at least part of the light-emitting device 300, the light-emitting layer 312 includes a first part 3121 and a second part 3122 that are connected to each other. The first part 3121 is located on the side of the first carrier transport layer 311 away from the substrate 100, and the second part 3122 is located on at least part of the periphery of the first carrier transport layer 311.

[0111] It should be noted that, in at least some of the light-emitting devices 300, the light-emitting layer 312 includes an interconnected first part 3121 and a second part 3122, meaning that in some of the light-emitting devices 300, the light-emitting layer 312 includes an interconnected first part 3121 and a second part 3122, while in the remaining light-emitting devices 300, the light-emitting layer 312 has a conventional structure; or in all of the light-emitting devices 300, the light-emitting layer 312 includes an interconnected first part 3121 and a second part 3122.

[0112] According to the display panel provided in the embodiments of this application, the second part 3122 of the light-emitting layer 312 is located on at least a portion of the periphery of the first carrier transport layer 311, which can effectively protect at least a portion of the sidewalls of the first carrier transport layer 311 from damage. For example, the developing solution of the first carrier transport layer 311 used in the subsequently prepared light-emitting device 300 can effectively prevent the erosion of the first carrier transport layer 311 of the previously prepared light-emitting device 300 by the developing solution, thus effectively avoiding pixel defects and secondary color mixing, resulting in a higher display quality of the display panel.

[0113] For example, refer to Figure 2The light-emitting device 300 includes a first light-emitting device 301, a second light-emitting device 302, and a third light-emitting device 303. When manufacturing the light-emitting device 300, it can be manufactured sequentially, for example, in the order of the first light-emitting device 301, the second light-emitting device 302, and the third light-emitting device 303. In this case, relative to the second light-emitting device 302 and the third light-emitting device 303, the first light-emitting device 301 is the first light-emitting device manufactured, and the second light-emitting device 302 and the third light-emitting device 303 are light-emitting devices manufactured after the first light-emitting device 301; relative to the third light-emitting device 303, the first light-emitting device 301 is the first light-emitting device manufactured, and the third light-emitting device 303 is the light-emitting device manufactured after the second light-emitting device 302. In the prior art, referring to... Figure 1 In each light-emitting device 300, the width of the first carrier transport layer 311 and the light-emitting layer 312 is the same along the direction parallel to the plane of the substrate 100. That is, the orthographic projection of the first carrier transport layer 311 on the substrate 100 and the orthographic projection of the light-emitting layer 312 on the substrate 100 completely overlap. The solvent and developer of the first carrier transport layer 311 of the light-emitting device 300 prepared later will erode the first carrier transport layer 311 of the light-emitting device 300 prepared earlier, causing the light-emitting layer 312 of the light-emitting device 300 prepared earlier to flow and extend outward, which will lead to pixel defects and / or secondary color mixing, seriously affecting the display effect of the display panel. In the display panel of this application embodiment, the second part 3122 of the light-emitting layer 312 is located at least part of the periphery of the first carrier transport layer 311, which can effectively protect at least part of the sidewalls of the first carrier transport layer 311 from damage. The solvent and developer of the first carrier transport layer 311 of the subsequently prepared light-emitting device 300 have little or no erosive effect on the first carrier transport layer 311 of the previously prepared light-emitting device 300, which can almost eliminate defects such as pixel defects and / or secondary color mixing, thereby improving the display effect of the display panel. Exemplarily, the material of the light-emitting layer 312 includes quantum dots.

[0114] For example, the first carrier transport layer 311 includes a hole transport layer.

[0115] In one embodiment, the orthographic projection of the first carrier transport layer 311 on the substrate 100 is located within the orthographic projection range of the first part 3121 on the substrate 100.

[0116] For example, the second part 3122 covers at least a portion of the sidewalls of the first carrier transport layer 311. Therefore, the light-emitting layer 312 provides excellent protection for the first carrier transport layer 311. For example, refer to... Figure 3The second part 3122 covers all the sidewalls of the first carrier transport layer 311. For example, refer to... Figure 4 The second part 3122 covers part of the sidewall of the first carrier transport layer 311.

[0117] In one embodiment, the polarities of the first carrier transport layer 311 and the light-emitting layer 312 are orthogonal. Therefore, the solvent and developer of the first carrier transport layer 311 have almost no effect on the light-emitting layer 312.

[0118] Optionally, the thickness of the second portion 3122 in different light-emitting devices 300 may be the same or different along a direction perpendicular to the plane of the substrate 100. It is understood that the degree to which the second portion 3122 covers the sidewalls of the first carrier transport layer 311 may be the same or different in different light-emitting devices 300. For example, in one light-emitting device 300, the second portion 3122 completely covers the sidewalls of the first carrier transport layer 311; in another light-emitting device 300, the second portion 3122 partially covers the sidewalls of the first carrier transport layer 311.

[0119] Optionally, the plurality of light-emitting devices 300 include a first light-emitting device 301 and a third light-emitting device 303. The light-emitting layer 312 of the first light-emitting device 301 includes a first portion 3121 and a second portion 3122 that are interconnected. The orthographic projection of the light-emitting layer 312 of the third light-emitting device 303 onto the substrate 100 coincides with the orthographic projection of the first carrier transport layer 311 onto the substrate 100. For example, when fabricating the first light-emitting device 301 and the third light-emitting device 303, the first light-emitting device 301 is fabricated first and the third light-emitting device 303 is fabricated later. In this case, the light-emitting layer 312 in the first light-emitting device 301 can effectively protect the first carrier transport layer 311 from the erosion of the developer during the fabrication of the third light-emitting device 303.

[0120] Optionally, the plurality of light-emitting devices 300 also includes a second light-emitting device 302, wherein the light-emitting layer 312 of the second light-emitting device 302 includes a first part 3121 and a second part 3122 that are interconnected. In this case, the second light-emitting device 302 is prepared before the third light-emitting device 303, and the light-emitting layer 312 in the second light-emitting device 302 can effectively protect the first carrier transport layer 311 from the erosion of the developer during the preparation of the third light-emitting device 303.

[0121] In one embodiment, refer to Figure 5 The schematic cross-sectional view of the display panel shown indicates that the light-emitting functional layer 310 further includes a first carrier injection layer 313, located on the side of the first carrier transport layer 311 closest to the substrate 100. For example, the first carrier injection layer 313 is a single-layer structure. This simplifies the fabrication process.

[0122] For example, the first carrier injection layer 313 includes a hole injection layer.

[0123] For example, in a direction perpendicular to the plane of the substrate 100, the thickness of the second portion 3122 is less than or equal to the thickness of the first carrier transport layer 311. Exemplarily, the thickness of the second portion 3122 is equal to the thickness of the first carrier transport layer 311, and the second portion 3122 contacts the first carrier injection layer 313, thus providing excellent protection of the first carrier transport layer 311 from erosion by the light-emitting layer 312.

[0124] Optionally, the polarities of the first carrier transport layer 311 and the first carrier injection layer 313 are orthogonal. Therefore, during the fabrication of the first carrier transport layer 311, the solvent or developer of the first carrier transport layer 311 will not erode the first carrier injection layer 313, thus improving the fabrication yield of the display panel.

[0125] Optionally, refer to Figure 5 The light-emitting functional layer 310 further includes a second carrier transport layer 314, located on the side of the light-emitting layer 312 facing away from the substrate 100. For example, the second carrier transport layer 314 is a single-layer structure. This simplifies the fabrication process.

[0126] For example, the second carrier transport layer 314 includes an electron transport layer.

[0127] Optionally, refer to Figure 5 The light-emitting device further includes: a first electrode layer 320 located between the pixel defining layer 200 and the substrate 100, at least a portion of the first electrode layer 320 being exposed to the pixel opening 210.

[0128] Optionally, refer to Figure 5 The light-emitting device also includes a second electrode layer 330, located on the side of the light-emitting functional layer 310 away from the substrate 100.

[0129] Optionally, the second electrode layer 330 is a whole-layer structure, which facilitates the realization of a full-surface cathode structure.

[0130] For example, one of the first electrode layer 320 and the second electrode layer 330 is a cathode, and the other of the first electrode layer 320 and the second electrode layer 330 is an anode.

[0131] Exemplarily, substrate 100 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or it may be a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or it may include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0132] A second aspect of this application provides a display panel, as shown in [reference] Figure 2 The display panel includes: a substrate 100, a pixel defining layer 200, and multiple light-emitting devices 300.

[0133] Optionally, the pixel defining layer 200 is located on one side of the substrate 100, and the pixel defining layer 200 surrounds a plurality of pixel openings 210.

[0134] Optionally, the light-emitting device 300 includes a light-emitting functional layer 310, which includes a first carrier transport layer 311 and a light-emitting layer 312 located in the pixel opening 210. The first carrier transport layer 311 is located on the side of the light-emitting layer 312 close to the substrate 100, and at least a portion of the light-emitting layer 312 extends in the direction close to the substrate 100 and covers at least a portion of the sidewall of the first carrier transport layer 311.

[0135] Optionally, the light-emitting layer 312 covers the sidewalls of the first carrier transport layer 311.

[0136] For example, the material of the light-emitting layer 312 includes quantum dots.

[0137] For example, the first carrier transport layer 311 includes a hole transport layer.

[0138] For example, the polarities of the first carrier transport layer 311 and the light-emitting layer 312 are orthogonal. As a result, the solvent and developer of the first carrier transport layer 311 have almost no effect on the light-emitting layer 312.

[0139] In one embodiment, refer to Figure 5 The light-emitting functional layer 310 further includes a first carrier injection layer 313, located on the side of the first carrier transport layer 311 closest to the substrate 100. For example, the first carrier injection layer 313 is a single-layer structure. This simplifies the fabrication process.

[0140] For example, the first carrier injection layer 313 includes a hole injection layer.

[0141] For example, the light-emitting layer 312 is in contact with the first carrier injection layer 313, and the light-emitting layer 312 has an excellent effect in protecting the first carrier transport layer 311 from erosion.

[0142] Optionally, the polarities of the first carrier transport layer 311 and the first carrier injection layer 313 are orthogonal. Therefore, during the fabrication of the first carrier transport layer 311, the solvent or developer of the first carrier transport layer 311 will not erode the first carrier injection layer 313, thus improving the fabrication yield of the display panel.

[0143] It should be noted that the display panel in this embodiment can be combined with the display panel described above in whole or in part, which will not be elaborated further here.

[0144] A third aspect of this application provides a display panel, as shown in [reference]. Figure 2 The display panel includes: a substrate 100, a pixel defining layer 200, and multiple light-emitting devices 300.

[0145] Optionally, the pixel defining layer 200 is located on one side of the substrate 100, and the pixel defining layer 200 surrounds a plurality of pixel openings 210.

[0146] Optionally, the light-emitting device 300 includes a light-emitting functional layer 310, which includes a first carrier transport layer 311 and a light-emitting layer 312 located in the pixel opening 210. The first carrier transport layer 311 is located on the side of the light-emitting layer 312 close to the substrate 100, and at least a portion of the outer boundary of the light-emitting layer 312 projected onto the substrate 100 is located outside the outer boundary of the first carrier transport layer 311 projected onto the substrate 100.

[0147] For example, the light-emitting layer 312 includes a first part 3121 and a second part 3122 that are connected to each other. The first part 3121 is located on the side of the first carrier transport layer 311 away from the substrate 100, and the second part 3122 is located on at least a portion of the periphery of the first carrier transport layer 311.

[0148] For example, the material of the light-emitting layer 312 includes quantum dots.

[0149] For example, the first carrier transport layer 311 includes a hole transport layer.

[0150] For example, the polarities of the first carrier transport layer 311 and the light-emitting layer 312 are orthogonal. As a result, the solvent and developer of the first carrier transport layer 311 have almost no effect on the light-emitting layer 312.

[0151] In one embodiment, refer to Figure 5The light-emitting functional layer 310 further includes a first carrier injection layer 313, located on the side of the first carrier transport layer 311 closest to the substrate 100. For example, the first carrier injection layer 313 is a single-layer structure. This simplifies the fabrication process.

[0152] For example, the first carrier injection layer 313 includes a hole injection layer.

[0153] For example, the light-emitting layer 312 is in contact with the first carrier injection layer 313, and the light-emitting layer 312 has an excellent effect in protecting the first carrier transport layer 311 from erosion.

[0154] Optionally, the polarities of the first carrier transport layer 311 and the first carrier injection layer 313 are orthogonal. Therefore, during the fabrication of the first carrier transport layer 311, the solvent or developer of the first carrier transport layer 311 will not erode the first carrier injection layer 313, thus improving the fabrication yield of the display panel.

[0155] It should be noted that the display panel in this embodiment can be combined with the display panel described above in whole or in part, which will not be elaborated further here.

[0156] The fourth aspect of this application provides a method for manufacturing a display panel, referring to... Figure 6 The diagram shows a process flow chart for manufacturing a display panel, which includes the following steps.

[0157] S100: A pixel defining layer is prepared on one side of the substrate, and the pixel defining layer surrounds a plurality of pixel openings.

[0158] It should be noted that the pixel delimitation layer is the same as described above, and will not be elaborated on further here.

[0159] For example, the method for preparing the pixel defining layer includes, but is not limited to: preparing a pixel defining material layer on one side of a substrate, and opening a plurality of pixel openings in the pixel defining material layer.

[0160] S200: Multiple light-emitting devices are fabricated in the pixel aperture.

[0161] In one embodiment, refer to Figures 7 to 10 The schematic diagram of the display panel fabrication process shown includes the following steps for fabricating at least some light-emitting devices in the pixel opening: The steps include: fabricating a first carrier transport material layer 3110 on the side of the pixel defining layer 200 facing away from the substrate 100; and performing a first exposure process on the first carrier transport material layer 3110 using a first mask 10. (See attached diagram for details.) Figure 7A light-emitting material layer 3120 is prepared on the side of the first carrier transport material layer 3110 facing away from the substrate 100. A second exposure process is performed on the light-emitting material layer 3120 using a second mask 20, as detailed in the following section. Figure 8 The luminescent material layer 3120 and the first carrier transport material layer 3110 are sequentially developed to obtain the first carrier transport layer 311 and the luminescent layer 312, as detailed in the following reference. Figure 9 and Figure 10 It should be noted that, Figures 7 to 10 The pixel delimiting layer 200 is omitted here for the purpose of explaining this application more clearly and should not be construed as a limitation of this application.

[0162] The light-emitting layer includes a first part and a second part that are connected to each other. The first part is located on the side of the first carrier transport layer away from the substrate, and the second part is located on at least a portion of the periphery of the first carrier transport layer.

[0163] It should be noted that the first carrier transport layer and the light-emitting layer are consistent with the previous description, and will not be elaborated further here.

[0164] Optionally, after performing a first exposure process on the first carrier transport material layer using a first mask, a first exposure area is obtained in the first carrier transport material layer; after performing a second exposure process on the light-emitting material layer using a second mask, a second exposure area is obtained in the light-emitting material layer; the orthographic projection of the first exposure area on the substrate is located within the orthographic projection range of the second exposure area on the substrate.

[0165] Optionally, the first mask plate 10 is provided with a plurality of first openings 11, and the second mask plate 20 is provided with a plurality of second openings 21. If the first mask plate 10 and the second mask plate 20 are stacked on the same side of the substrate 100, the orthographic projection of the first opening 11 on the substrate 100 is located within the orthographic projection range of the second opening 21 on the substrate 100.

[0166] For example, in a direction parallel to the plane of the substrate 100, the width of the first opening 11 is smaller than the width of the second opening 21.

[0167] For example, refer to Figure 11 The diagram shows a top view of the stacked first mask 10 and second mask 20. Both the first opening 11 and the second opening 21 are rectangular. In the first direction x, the width of the first opening 11 is smaller than the width of the second opening 21. In the second direction y, the width of the first opening 11 is smaller than the width of the second opening 21. The first direction x and the second direction y are perpendicular to each other. It should be noted that the shapes of the first opening 11 and the second opening 21 can also be other shapes, such as circles. The shapes of the first opening 11 and the second opening 21 can be the same or different.

[0168] Optionally, the distance between the edge of the first exposure area projected onto the substrate 100 and the edge of the second exposure area projected onto the substrate 100 is 2–3 μm, for example, it can be 2 μm, 2.2 μm, 2.4 μm, 2.5 μm, 2.6 μm, 2.8 μm, or 3 μm. Thus, the resulting light-emitting layer 312 can effectively wrap the sidewalls of the first carrier transport layer 311, and will not cause crosstalk or color mixing with the light-emitting layers 312 of adjacent light-emitting devices 300.

[0169] For example, the light-emitting device 300 includes a first light-emitting device 301, a second light-emitting device 302, and a third light-emitting device 303; when fabricating the light-emitting device 300, it is fabricated sequentially in the order of the first light-emitting device 301, the second light-emitting device 302, and the third light-emitting device 303; the step of sequentially fabricating the first carrier transport layer and the light-emitting layer in the pixel opening includes: fabricating a first carrier transport material layer 3110 of the first light-emitting device 301 on the side of the pixel defining layer 200 facing away from the substrate 100, and performing a first exposure treatment on the first carrier transport material layer 3110 using a first mask 10, specifically referring to... Figure 7 A light-emitting material layer 3120 is prepared on the side of the first carrier transport material layer 3110 facing away from the substrate 100. A second exposure process is performed on the light-emitting material layer 3120 using a second mask 20, as detailed in the following section. Figure 8 The light-emitting material layer 3120 and the first carrier transport material layer 3110 are sequentially developed to obtain the first carrier transport layer 311 and the light-emitting layer 312 of the first light-emitting device 301, as detailed in the following reference. Figure 9 and Figure 10 A first carrier transport material layer 3110 of the second light-emitting device 301 is prepared on the side of the pixel defining layer 200 facing away from the substrate 100. A first exposure process is performed on the first carrier transport material layer 3110 using a first mask 10. A light-emitting material layer 3120 of the second light-emitting device 302 is prepared on the side of the first carrier transport material layer 3110 facing away from the substrate 100. A second exposure process is performed on the light-emitting material layer 3120 using a second mask 20. The light-emitting material layer 3120 and the first carrier transport material layer 3110 of the second light-emitting device 302 are then sequentially developed to obtain the first carrier transport layer 311 and the light-emitting layer 312 of the second light-emitting device 302. (See attached document for details.) Figure 12 and Figure 13 The first carrier transport layer 311 and the light-emitting layer 312 of the third light-emitting device 303 (see details). Figure 14 or Figure 15The preparation steps described above can be referred to, and will not be repeated here. It is understood that since the light-emitting layer 312 covers at least part of the sidewalls of the first carrier transport layer 311, the solvent and developer of the first carrier transport layer 311 of the light-emitting device prepared later will hardly cause damage to the first carrier transport layer 311 of the light-emitting device prepared earlier, so that the light-emitting layer 312 will hardly flow outward and cause secondary color mixing, and at the same time improve the pixel preparation yield.

[0170] For example, refer to Figure 15 When fabricating the third light-emitting device 303, the opening size of the second mask used for exposing the light-emitting material layer can be different from the opening size of the second mask used for fabricating the first light-emitting device 301 and the second light-emitting device 302. Specifically, the opening size of the second mask used for fabricating the first light-emitting device 301 and the second light-emitting device 302 is larger than the opening size of the second mask used for fabricating the third light-emitting device 303. Moreover, when fabricating the third light-emitting device 303, the opening size of the second mask used for exposing the light-emitting material layer is equal to the opening size of the first mask used for the first exposure process of the first carrier transport material layer. In the third light-emitting device 303, the orthographic projection of the light-emitting layer 312 on the substrate 100 coincides with the orthographic projection of the first carrier transport layer 311 on the substrate 100.

[0171] For example, refer to Figure 14 When fabricating the third light-emitting device 303, the opening size of the second mask used for exposing the light-emitting material layer is equal to the opening size of the second mask used for fabricating the first light-emitting device 301 and the second light-emitting device 302. Furthermore, when fabricating the third light-emitting device 303, the opening size of the second mask used for exposing the light-emitting material layer is larger than the opening size of the first mask used for the first exposure process of the first carrier transport material layer. In the third light-emitting device 303, the orthographic projection of the first carrier transport layer 311 onto the substrate 100 is located within the orthographic projection range of the light-emitting layer 312 onto the substrate 100, and the light-emitting layer 312 covers at least a portion of the sidewalls of the first carrier transport layer 311.

[0172] It is understandable that the first light-emitting device can be a red light-emitting device, the second light-emitting device can be a green light-emitting device, and the third light-emitting device can be a blue light-emitting device.

[0173] For example, the light-emitting device includes a first light-emitting device 301 and a third light-emitting device 30; when fabricating the light-emitting device 300, it is fabricated sequentially in the order of the first light-emitting device 301 and the third light-emitting device 30; the step of fabricating multiple light-emitting devices in the pixel opening includes: fabricating a first carrier transport material layer 3110 of the first light-emitting device 301 on the side of the pixel defining layer 200 away from the substrate 100, and performing a first exposure process on the first carrier transport material layer 3110 using a first mask 10; fabricating a light-emitting material layer 3120 on the side of the first carrier transport material layer 3110 away from the substrate 100, and performing a second exposure process on the light-emitting material layer 3120 using a second mask 20; and sequentially developing the light-emitting material layer 3120 and the first carrier transport material layer 3110 to obtain the first carrier transport layer 311 and the light-emitting layer 312 of the first light-emitting device 301, specifically referring to... Figure 16 A first light-emitting device 301 is obtained, with the light-emitting layer 312 partially covering the sidewall of the first carrier transport layer. A first carrier transport material layer 3110 of the first light-emitting device 301 is prepared on the side of the pixel defining layer 200 facing away from the substrate 100, and a third exposure process is performed on the first carrier transport material layer 3110 using a first mask 10. A light-emitting material layer 3120 is prepared on the side of the first carrier transport material layer 3110 facing away from the substrate 100, and a fourth exposure process is performed on the light-emitting material layer 3120 using a second mask 20. The light-emitting material layer 3120 and the first carrier transport material layer 3110 are sequentially developed to obtain the first carrier transport layer 311 and the light-emitting layer 312 of the second light-emitting device 302, thus obtaining a third light-emitting device 30. The orthographic projection of the light-emitting layer 312 of the third light-emitting device 30 onto the substrate 100 coincides with the orthographic projection of the first carrier transport layer 311 onto the substrate 100. (See specific reference...) Figure 17 .

[0174] It should be noted that, Figures 12 to 17 The pixel delimiting layer 200 is omitted here for the purpose of explaining this application more clearly and should not be construed as a limitation of this application.

[0175] It should be noted that the orthographic projection of the exposed area obtained in the first carrier transport material layer after the third exposure treatment and the exposed area obtained in the light-emitting material layer after the fourth exposure treatment on the substrate coincides.

[0176] In one embodiment, performing a second exposure process on the light-emitting material layer using a second mask includes: placing the second mask on the side of the light-emitting material layer away from the substrate; and irradiating the light-emitting material layer with preset light through a second opening in the second mask.

[0177] For example, the preset light includes ultraviolet light.

[0178] Optionally, the luminescent material layer is developed using a first developer. It is understood that after development, a patterned luminescent layer can be obtained.

[0179] Optionally, preparing a first carrier transport material layer on the side of the pixel defining layer away from the substrate includes: mixing the first carrier transport material with a first solvent and then coating it on the side of the pixel defining layer away from the substrate to obtain the first carrier transport material layer.

[0180] Optionally, the polarity of the first developer is orthogonal to the polarity of the first carrier transport material. Thus, the developer of the light-emitting material layer will hardly erode or damage the first carrier transport material layer, thereby improving the fabrication yield of the first carrier transport layer.

[0181] In one embodiment, the first solvent includes at least one of toluene, chlorobenzene, xylene, polyphenylene, and tetrahydronaphthalene.

[0182] Optionally, the first solvent includes toluene and chlorobenzene, and the volume ratio of toluene to chlorobenzene is (0.5–3):(0.5–3), for example, 0.5:0.5, 1:0.5, 1.5:0.5, 2:0.5, 2.5:0.5, 3:0.5, 0.5:1, 1:0.5, 1.5:1, 2:1, 2.5:1, 3:1, 0.5:1.5, 1:1 The solvent ratios are 0.5, 1.5:1.5, 2:1.5, 2.5:1.5, 3:1.5, 0.5:2, 1:2, 1.5:2, 2:2, 2.5:2, 3:2, 0.5:2.5, 1:2.5, 1.5:2.5, 2:2.5, 2.5:2.5, 3:0.5, 0.5:3, 1:3, 1.5:3, 2:3, 2.5:3, 3:3, etc. Therefore, the first solvent effectively disperses the first carrier transport material and facilitates subsequent exposure and development.

[0183] In one embodiment, developing the luminescent material layer with a first developer includes repeatedly immersing the luminescent material layer in the first developer. It is understood that luminescent material layers not exposed to a preset light source are removed by the first developer, while luminescent material layers exposed to the preset light source are retained.

[0184] Optionally, the luminescent material layer is immersed in the first developer for 8 to 12 seconds each time, for example, 8, 9, 10, 11, or 12 seconds. The luminescent material layer that has not been exposed to the preset light is removed more thoroughly.

[0185] Optionally, the luminescent material layer is immersed in the first developer 3 to 8 times, for example, 3, 4, 5, 6, 7, or 8 times. The luminescent material layer that has not been exposed to the preset light is removed more thoroughly.

[0186] Optionally, the first developer includes n-octane. Thus, the first developer is highly effective at removing the luminescent material layer that has not been exposed to the preset light.

[0187] In one embodiment, performing a first exposure process on the first carrier transport material layer using a first mask includes: placing the first mask on the side of the first carrier transport material layer away from the substrate; and irradiating the first carrier transport material layer with preset light through a first opening in the first mask.

[0188] Optionally, the preset light includes ultraviolet light.

[0189] Optionally, a second developer is used to develop the first carrier transport material layer, and the developed light-emitting material layer flows and extends towards the substrate. It is understood that because the second opening of the second mask is relatively large, the size of the light-emitting layer is also relatively large. During the development process of the light-emitting material layer and the first carrier transport material layer, the larger light-emitting layer gradually flows and extends towards the substrate along the sidewalls of the first carrier transport layer until the light-emitting layer covers the sidewalls of the first carrier transport layer, resulting in excellent protection of the first carrier transport layer.

[0190] Optionally, preparing a light-emitting material layer on the side of the first carrier transport layer away from the substrate includes: mixing a light-emitting material with a second solvent and then coating it on the side of the first carrier transport layer away from the substrate to obtain a light-emitting material layer.

[0191] Optionally, the polarities of the second developer and the second solvent are orthogonal. Therefore, the second developer causes almost no erosion or damage to the luminescent material layer, improving the yield rate of the luminescent layer.

[0192] For example, the second developer is immiscible with the luminescent layer.

[0193] Optionally, the second solvent includes at least one of n-octane, toluene, and propylene glycol methyl ether acetate (PGMEA).

[0194] In one embodiment, developing the first carrier transport material layer with a second developer includes repeatedly immersing the first carrier transport material layer in the second developer. It is understood that the first carrier transport layer irradiated by a preset light source will not be removed by the second developer, while the first carrier transport layer not irradiated by the preset light source will be removed by the second developer.

[0195] Optionally, the first carrier transport material layer is immersed in the second developer for 8 to 12 seconds each time, for example, 8, 9, 10, 11, or 12 seconds. The first carrier transport material layer that is not exposed to the preset light is removed more thoroughly.

[0196] Optionally, the first carrier transport material layer is immersed in the second developer 3 to 8 times, for example, 3, 4, 5, 6, 7, or 8 times. The first carrier transport material layer that has not been irradiated by the preset light is removed more thoroughly.

[0197] Optionally, the second developer includes chlorobenzene. Thus, the second developer is highly effective at removing the first carrier transport material layer that has not been exposed to the preset light.

[0198] In one embodiment, after a pixel defining layer is prepared on one side of the substrate and before a first carrier transport layer is prepared in the pixel opening, the preparation method further includes the following step: preparing a first carrier injection layer on the side of the pixel defining layer away from the substrate, wherein a portion of the first carrier injection layer is located in the pixel opening.

[0199] Optionally, preparing a first carrier injection layer on the side of the pixel defining layer away from the substrate includes: mixing a first carrier injection material with a third solvent to obtain a third solution; and coating the third solution on the side of the pixel defining layer away from the substrate.

[0200] Optionally, the polarity of the third solvent is orthogonal to the polarity of the first carrier injection material. Therefore, during the fabrication of the first carrier transport layer, the first solvent will hardly cause erosion or damage to the first carrier injection layer.

[0201] Optionally, the third solvent includes at least one of ethyl benzoate toluene, xylene, and polystyrene.

[0202] Optionally, the second developer is orthogonal to the polarity of the first carrier injection material. Therefore, during the fabrication of the first carrier transport layer, the first solvent will hardly erode or damage the first carrier injection layer.

[0203] In one embodiment, after sequentially developing the light-emitting material layer and the first carrier transport material layer, the process further includes drying the developed first carrier transport material layer and the light-emitting material layer.

[0204] Optionally, the drying process includes baking.

[0205] The fifth aspect of this application provides a display device, including the aforementioned display panel, or including a display panel prepared by the aforementioned preparation method.

[0206] It should be noted that, in addition to the aforementioned display panel, the display device may also include structures that conventional display devices should have, such as driver chips and touch panels, which will not be elaborated on further here.

[0207] It is understood that the display device can be a flexible display device or a rigid display device; the display device can be used for color display or for black and white display; the display device can be used for static display or for dynamic display.

[0208] It is understood that the types of display devices include, but are not limited to, laptops, tablets, mobile phones, virtual reality display devices, wearable devices, etc.

[0209] The present application will be further described below with reference to specific embodiments. It should be noted that the following embodiments are only used to explain the present application and should not be construed as limiting the present application.

[0210] Example 1

[0211] The method for manufacturing a display panel includes the following steps:

[0212] 1. A first electrode layer is fabricated on one side of the substrate.

[0213] 2. A pixel defining material layer is formed on the same side of the substrate and the first electrode layer, and a plurality of pixel openings are formed in the pixel defining material layer, wherein the first electrode layer is at least partially exposed in the pixel openings.

[0214] 3. Prepare a hole injection layer in the pixel opening.

[0215] 4. A hole transport material layer is sequentially coated on the side of the hole injection layer away from the substrate. The solvent for forming the hole transport material layer includes toluene and chlorobenzene in a volume ratio of (0.5-3):(0.5-3). The hole transport material layer is subjected to a first exposure treatment using a first mask.

[0216] 5. A red quantum dot luminescent material layer is prepared on the side of the hole transport material layer facing away from the substrate. A second mask is used to perform a second exposure process on the red quantum dot luminescent material layer. The orthographic projection of the first opening of the first mask on the substrate is located within the orthographic projection range of the second opening of the second mask on the substrate. The distance between the edge of the orthographic projection of the first opening of the first mask on the substrate and the edge of the orthographic projection of the second opening of the second mask on the substrate is 2 to 3 μm.

[0217] 6. Develop the red quantum dot luminescent material layer with n-octane, repeating the development process 3 to 8 times, immersing the layer in n-octane for 8 to 12 seconds each time, to obtain the luminescent layer.

[0218] 7. The hole transport material layer is developed using chlorobenzene, and the development is repeated 3 to 8 times, with each time the material is immersed in chlorobenzene for 8 to 12 seconds, to obtain the hole transport layer.

[0219] 8. An electron transport layer and a second electrode layer are sequentially fabricated on the side of the red quantum dot light-emitting layer facing away from the substrate, and then encapsulated to obtain a display panel.

[0220] The luminous effect of the display panel in this embodiment can be referred to Figure 18 .

[0221] Comparative Example 1

[0222] The method for manufacturing a display panel includes the following steps:

[0223] 1. A first electrode layer is fabricated on one side of the substrate.

[0224] 2. A pixel defining material layer is formed on the same side of the substrate and the first electrode layer, and a plurality of pixel openings are formed in the pixel defining material layer, wherein the first electrode layer is at least partially exposed in the pixel openings.

[0225] 3. Prepare a hole injection layer in the pixel opening.

[0226] 4. A hole transport material layer is sequentially coated on the side of the hole injection layer away from the substrate. The solvent for forming the hole transport material layer includes toluene and chlorobenzene in a volume ratio of (0.5-3):(0.5-3). The hole transport material layer is subjected to a first exposure treatment using a first mask.

[0227] 5. A red quantum dot luminescent material layer is prepared on the side of the hole transport material layer facing away from the substrate, and a second mask is used to perform a second exposure process on the red quantum dot luminescent material layer; the orthographic projection of the first opening of the first mask on the substrate is completely coincident with the orthographic projection of the second opening of the second mask on the substrate.

[0228] 6. Develop the red quantum dot luminescent material layer with n-octane, repeating the development process 3 to 8 times, immersing the layer in n-octane for 8 to 12 seconds each time, to obtain the luminescent layer.

[0229] 7. The hole transport material layer is developed using chlorobenzene, and the development is repeated 3 to 8 times, with each time the material is immersed in chlorobenzene for 8 to 12 seconds, to obtain the hole transport layer.

[0230] 8. An electron transport layer and a second electrode layer are sequentially fabricated on the side of the red quantum dot light-emitting layer facing away from the substrate, and then encapsulated to obtain a display panel.

[0231] The luminous effect of the display panel in this comparison can be referenced. Figure 19 .

[0232] Comparing Example 1 and Comparative Example 1, it is found that the display panel of the present application embodiment has high pixel integrity, almost no color mixing phenomenon, and almost no radial display unevenness.

[0233] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0234] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, include: substrate; A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses a plurality of pixel openings; Multiple light-emitting devices, each light-emitting device including a light-emitting functional layer, the light-emitting functional layer including a first carrier transport layer and a light-emitting layer located in the pixel opening; In at least a portion of the light-emitting device, the light-emitting layer includes a first portion and a second portion connected to each other, the first portion being located on the side of the first carrier transport layer away from the substrate, and the second portion being located on at least a portion of the peripheral side of the first carrier transport layer.

2. The display panel according to claim 1, characterized in that, The orthographic projection of the first carrier transport layer on the substrate is located within the orthographic projection range of the first part on the substrate; Preferably, the second part covers at least a portion of the sidewalls of the first carrier transport layer; Preferably, the second part covers all the sidewalls of the first carrier transport layer; Preferably, the first carrier transport layer includes a hole transport layer.

3. The display panel according to claim 1, characterized in that, The light-emitting functional layer further includes: a first carrier injection layer, located on the side of the first carrier transport layer close to the substrate; Preferably, the first carrier injection layer is a monolithic structure; Preferably, the second part is in contact with the first carrier injection layer; Preferably, the light-emitting functional layer further includes: a second carrier transport layer located on the side of the light-emitting layer opposite to the substrate; Preferably, the second carrier transport layer is a monolithic structure; Preferably, the light-emitting device further includes: a first electrode layer located between the pixel defining layer and the substrate, wherein at least a portion of the first electrode layer is exposed to the pixel opening; Preferably, the light-emitting device further includes: a second electrode layer located on the side of the light-emitting functional layer opposite to the substrate; Preferably, the second electrode layer is a monolithic structure; Preferably, the material of the light-emitting layer includes quantum dots; Preferably, the polarities of the first carrier transport layer and the first carrier injection layer are orthogonal.

4. The display panel according to claim 1, characterized in that, The polarities of the first carrier transport layer and the light-emitting layer are orthogonal. Preferably, the thickness of the second part in different light-emitting devices is the same or different along a direction perpendicular to the plane of the substrate; Preferably, the plurality of light-emitting devices include a first light-emitting device and a third light-emitting device, wherein the light-emitting layer of the first light-emitting device includes a first portion and a second portion that are connected to each other; the orthographic projection of the light-emitting layer of the third light-emitting device on the substrate coincides with the orthographic projection of the first carrier transport layer on the substrate; Preferably, the plurality of light-emitting devices further includes a second light-emitting device, wherein the light-emitting layer of the second light-emitting device includes the first part and the second part connected to each other.

5. A display panel, characterized in that, include: substrate; A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses a plurality of pixel openings; A plurality of light-emitting devices, each light-emitting device including a light-emitting functional layer, the light-emitting functional layer including a first carrier transport layer and a light-emitting layer located in the pixel opening, the first carrier transport layer being located on the side of the light-emitting layer closer to the substrate, at least a portion of the light-emitting layer extending toward the substrate and covering at least a portion of the sidewall of the first carrier transport layer.

6. The display panel according to claim 5, characterized in that, The light-emitting layer covers the sidewall of the first carrier transport layer; Preferably, the first carrier transport layer includes a hole transport layer; The light-emitting functional layer further includes: a first carrier injection layer, located on the side of the first carrier transport layer close to the substrate; Preferably, the first carrier injection layer is a monolithic structure; Preferably, the polarities of the first carrier transport layer and the first carrier injection layer are orthogonal.

7. A display panel, characterized in that, include: substrate; A pixel defining layer is located on one side of the substrate, and the pixel defining layer encloses a plurality of pixel openings; Multiple light-emitting devices, each light-emitting device including a light-emitting functional layer, the light-emitting functional layer including a first carrier transport layer and a light-emitting layer located in the pixel opening, the first carrier transport layer being located on the side of the light-emitting layer closer to the substrate; At least a portion of the light-emitting layer is located outside the outer boundary of the first carrier transport layer as projected onto the substrate.

8. The display panel according to claim 7, characterized in that, The light-emitting layer covers the first carrier transport layer; Preferably, the first carrier transport layer includes a hole transport layer; Preferably, the light-emitting functional layer further includes: a first carrier injection layer located on the side of the first carrier transport layer close to the substrate; Preferably, the first carrier injection layer is a monolithic structure; Preferably, the polarities of the first carrier transport layer and the first carrier injection layer are orthogonal.

9. A method for manufacturing a display panel, characterized in that, include: A pixel defining layer is prepared on one side of the substrate, the pixel defining layer enclosing a plurality of pixel openings; Multiple light-emitting devices are fabricated in the pixel opening, wherein the step of fabricating at least some of the light-emitting devices in the pixel opening includes: fabricating a first carrier transport material layer on the side of the pixel defining layer opposite to the substrate; performing a first exposure process on the first carrier transport material layer using a first mask; fabricating a light-emitting material layer on the side of the first carrier transport material layer opposite to the substrate; performing a second exposure process on the light-emitting material layer using a second mask; and sequentially performing a development process on the light-emitting material layer and the first carrier transport material layer to obtain a light-emitting layer and a first carrier transport layer, wherein the light-emitting layer includes a first part and a second part connected to each other, the first part being located on the side of the first carrier transport layer opposite to the substrate, and the second part being located on at least a portion of the periphery of the first carrier transport layer.

10. The preparation method according to claim 9, characterized in that, After performing a first exposure process on the first carrier transport material layer using a first mask, a first exposure area is obtained in the first carrier transport material layer; After performing a second exposure process on the light-emitting material layer using a second mask, a second exposure area is obtained in the light-emitting material layer; The orthographic projection of the first exposure area on the substrate is located within the orthographic projection range of the second exposure area on the substrate; Preferably, the distance between the edge of the first exposure area projected onto the substrate and the edge of the second exposure area projected onto the substrate is 2 to 3 μm.

11. The preparation method according to claim 9, characterized in that, The second exposure process of the light-emitting material layer using a second mask includes: The second mask is placed on the side of the light-emitting material layer that is away from the substrate; The light-emitting material layer is illuminated by a preset light through the second opening of the second mask. Preferably, the luminescent material layer is developed using a first developer; Preferably, preparing a first carrier transport material layer on the side of the pixel defining layer opposite to the substrate includes: mixing a first carrier transport material with a first solvent and then coating it on the side of the pixel defining layer opposite to the substrate to obtain the first carrier transport material layer. Preferably, the polarity of the first developer is orthogonal to the polarity of the first carrier transport material; Preferably, the preset light includes ultraviolet light; Preferably, the first solvent includes at least one of toluene, chlorobenzene, xylene, polyphenylene, and tetrahydronaphthalene; Preferably, the first solvent comprises toluene and chlorobenzene, and the volume ratio of toluene to chlorobenzene is (0.5-3):(0.5-3).

12. The preparation method according to claim 11, characterized in that, The development process of the luminescent material layer using a first developer includes: The luminescent material layer was repeatedly immersed in the first developer; Preferably, the luminescent material layer is immersed in the first developer for 8 to 12 seconds each time; Preferably, the luminescent material layer is immersed in the first developer 3 to 8 times; Preferably, the first developer comprises n-octane.

13. The preparation method according to claim 11, characterized in that, After fabricating a pixel defining layer on one side of the substrate and before fabricating a first carrier transport layer in the pixel opening, the fabrication method further includes: A first carrier injection layer is formed on the side of the pixel defining layer opposite to the substrate, and a portion of the first carrier injection layer is located in the pixel opening; Preferably, fabricating a first carrier injection layer on the side of the pixel defining layer opposite to the substrate includes: The first carrier injection material is mixed with the third solvent and then coated on the side of the pixel defining layer away from the substrate; Preferably, the polarity of the first solvent is orthogonal to the polarity of the first carrier injection material; Preferably, the first carrier transport material layer is developed using a second developer, wherein the polarity of the second developer is orthogonal to that of the first carrier injection material.

14. The preparation method according to claim 9, characterized in that, The first exposure process of the first carrier transport material layer using a first mask includes: The first mask is placed on one side of the substrate of the first carrier transport material layer; The first carrier transport material layer is illuminated by a preset light through the first opening of the first mask. Preferably, the first carrier transport material layer is developed using a second developer, and the developed light-emitting material layer flows and extends toward the substrate. Preferably, the preset light includes ultraviolet light.

15. The preparation method according to claim 14, characterized in that, The development process of the first carrier transport material layer using a second developer includes: The first charge carrier transport material layer was repeatedly immersed in the second developer; Preferably, the first carrier transport material layer is immersed in the second developer for 8 to 12 seconds each time; Preferably, the first carrier transport material layer is immersed in the second developer 3 to 8 times; Preferably, the second developer comprises chlorobenzene.

16. The preparation method according to claim 9, characterized in that, After sequentially developing the luminescent material layer and the first carrier transport material layer, the process further includes: The first carrier transport material layer and the light-emitting material layer that have undergone the development process are dried. Preferably, the drying process includes a baking process.

17. The preparation method according to claim 9, characterized in that, The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, wherein the first light-emitting device is prepared first and the second light-emitting device is prepared later; The step of fabricating multiple light-emitting devices in the pixel opening includes: A first carrier transport material layer is prepared on the side of the pixel defining layer opposite to the substrate; a first exposure process is performed on the first carrier transport material layer using a first mask; a light-emitting material layer is prepared on the side of the first carrier transport material layer opposite to the substrate; a second exposure process is performed on the light-emitting material layer using a second mask; the light-emitting material layer and the first carrier transport material layer are sequentially developed to obtain the light-emitting layer and the first carrier transport layer, thereby obtaining the first light-emitting device; A first carrier transport material layer is prepared on the side of the pixel defining layer opposite to the substrate; a third exposure process is performed on the first carrier transport material layer using a third mask; a light-emitting material layer is prepared on the side of the first carrier transport material layer opposite to the substrate; a fourth exposure process is performed on the light-emitting material layer using a fourth mask; the light-emitting material layer and the first carrier transport material layer are sequentially developed to obtain the light-emitting layer and the first carrier transport layer, thereby obtaining the second light-emitting device, wherein the orthographic projection of the light-emitting layer of the second light-emitting device on the substrate coincides with the orthographic projection of the first carrier transport layer on the substrate.

18. A display device, characterized in that, It includes the display panel according to any one of claims 1 to 8, or the display panel prepared by the preparation method according to any one of claims 9 to 17.

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