Display device

Abstract

A display device according to an embodiment of the present application can include a substrate including a display area, a camera hole, and a non-display area between the display area and the camera hole; at least one cutout portion and at least one dam disposed in the non-display area; a plurality of insulating films disposed on the substrate and under a light emitting element, the cutout portion, and the dam; and a crack detection unit disposed between the at least one cutout portion and the camera hole.

Description

[0001] This application is a divisional application of Chinese invention patent application filed on December 13, 2022, with application number 202211601245.0 and title "Display Device". Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2021-0183228, filed on December 20, 2021, which is incorporated herein by reference for all purposes as if it were fully described herein. Technical Field

[0003] This disclosure relates to display devices, and more particularly to display devices in which a camera hole is provided. Background Technology

[0004] In recent years, with the advent of the information age, displays that visually express electrical information signals have been developing rapidly. In response to this trend, various display devices with excellent performance characteristics such as thin profiles, light weight, and low power consumption have been developed.

[0005] Specific examples of such display devices include liquid crystal display (LCD) devices, organic light-emitting diode (OLED) display devices, and quantum dot display devices.

[0006] Display devices may include a display panel and multiple components for providing various functions. For example, in existing display devices, cameras and various optical sensors are located on the periphery of the display panel to perform various functions such as taking pictures, facial recognition, and infrared distance measurement. However, after several generations of iterations, so-called bezel-less or zero-bezel designs have become more common, in which the screen is completely filled with the display area when the user is looking at the display device, making it difficult to place such cameras and optical sensors. To achieve such bezel-less or zero-bezel designs, methods for moving cameras and optical sensors into the display area of ​​the display panel have been researched. As a result of this research, a technology called Hidden-In-Display (HID) has been developed, in which holes can be formed in the display panel, thereby arranging cameras and optical sensors within the holes located in the display panel.

[0007] Although HID was described above to mean that the hole exists in the display area, HiAA (Hole in Active Area) can also be used to mean that the hole exists in the active area.

[0008] With the development of HID or HiAA and the relocation of all cameras and sensors from the existing bezel area to the active area of ​​the display panel, extreme bezel-less or zero-bezel designs are now possible.

[0009] The display area and the active area can be synonymous, used to describe the area in which pixels are driven to emit light. Summary of the Invention

[0010] This specification addresses the aforementioned problems that may arise when designing in-display-area (HID) or in-active-area (HiAA) structures. The aperture for housing a camera or optical sensor can be formed in the display area or the active area. In this case, components required for the display (such as light-emitting elements or driving transistors) may not be located in the aperture area, and the substrate of the display panel may even be removed from the aperture area. When the substrate of the display panel or the light-emitting elements remain in the aperture area, optical interference to the camera or sensor may occur, potentially degrading its functionality.

[0011] As mentioned above, lasers are typically used to perform fine cutting processes to remove the substrate of a display panel. When cutting is performed based on the phenomenon that the substrate of the display panel is melted and destroyed by localized thermal energy received from the laser, a large amount of energy may accumulate in localized areas of the substrate, and cracks may occur in the substrate during or after the cutting process due to the energy accumulated in the substrate.

[0012] Cracks generated in the cut portions of the substrate may extend to peripheral areas due to stresses produced during subsequent processes. Specifically, cracks generated in the cut portions of the substrate may expand or extend toward the display area, and these cracks are particularly likely to propagate readily in the inorganic insulating film disposed near the hole area.

[0013] Cracks that form in the cut portion of the substrate located in the hole area (which can be considered outside the display area) can become a moisture penetration path. The light-emitting elements disposed in the display area have an organic material layer or an organic emitting layer and are therefore susceptible to moisture.

[0014] Specifically, when moisture penetrates the organic material layer of the light-emitting element, the organic material reacts with the moisture, causing pixel shrinkage, resulting in a gradual reduction in the emitting area, or black spots where the pixels completely stop emitting light. If a display panel exhibiting pixel shrinkage or black spots due to moisture penetration through the camera aperture area is used in the finished display device, the finished display device cannot be sold. When defective panels can be picked out before the display device is fully completed and separated during manufacturing, for example, unnecessary processes and parts can be reduced because the module process for completely completing the display device is not required.

[0015] Therefore, after the cutting process in the camera hole area, a process can be performed to check for cracks in the corresponding area. By adding a crack check process, it is possible to reduce costs associated with subsequent processes and avoid product reduction.

[0016] The key point of this disclosure is that, in order to design borderless or zero-bezel display panels, which represent a trend in the development of display devices, holes are formed in the display area for arranging cameras and sensors, and defects in products are also avoided due to these holes.

[0017] In one aspect, embodiments of the present disclosure may provide a display device comprising: a substrate including a display area, a camera aperture, and a non-display area located between the display area and the camera aperture; at least one cut portion and at least one dam disposed in the non-display area; a plurality of insulating films disposed on the substrate and disposed below the light-emitting element, the cut portion, and the dam; and a crack detection unit disposed between the at least one cut portion and the camera aperture.

[0018] In another aspect, embodiments of this disclosure may provide a display device comprising: a substrate including a non-display area disposed between a camera hole and a display area; a touch sensor unit configured to correspond to the display area; a touch crack detection electrode configured to correspond to the non-display area; and a crack detection unit configured to correspond to the non-display area.

[0019] Further details of the embodiments are included in the Detailed Description of the Embodiments and the accompanying drawings.

[0020] In the display device according to the embodiments of this specification, a camera hole may be provided in the display area of ​​the display panel, thereby providing a display device that gives the overall appearance of the display panel a thin or narrow bezel.

[0021] Therefore, users of display devices can use aesthetically pleasing devices in which the front surface of the display device is completely filled with a light-emitting screen, and by using a compact module with narrow bezels that is functionally applied, users can enjoy a better grip and a lighter feel.

[0022] In the display device according to embodiments of this specification, a crack detection structure is formed around the camera hole to detect cracks that may originate from the camera hole, thereby detecting in advance the display panel that has or will be permeated with moisture and oxygen. For example, a crack detection structure mounted on the outer peripheral portion of the display panel can be formed at the top, bottom, left, and right edges of the display area to check for through-cracks that may occur during the manufacturing process. Furthermore, it is necessary to detect through-cracks that even occur near the camera hole within the display area, for the same purpose as the crack detection structure located at the top, bottom, left, and right edges of the display area.

[0023] A preventative structure can be provided near the camera aperture to prevent the spread of moisture or oxygen. This preventative structure can block the movement of moisture and oxygen by severing the connection of the organic common layer (i.e., the light-emitting stack) of the light-emitting elements disposed on the entire surface of the display panel.

[0024] Based on the linearity of the organic material in the organic material deposition process used to form the light-emitting stack, the vertical structure of the preventive structure can be increased to form a long side portion, or the width of the side portion of the preventive structure can be varied. In areas passing through the side portion of the preventive structure but not existing in the deposition direction of the organic material, or in side portions perpendicular to the deposition direction, organic material is either not stacked or inevitably stacked unevenly. Therefore, the material constituting the light-emitting stack cannot be stacked on the side portion of the preventive structure or can be stacked unevenly, thus resulting in structural separation.

[0025] Multiple dams are installed near the preventative structure to prevent the organic insulating layer of the encapsulation from overflowing into the camera aperture. These dams prevent contamination of the camera aperture area that might occur if the organic insulating layer overflows into the camera aperture, and also prevent interference with the camera to be installed in the camera aperture area. Furthermore, the multiple dams can absorb at least some of the cracks that might appear in the camera aperture.

[0026] Preventive structures are installed at multiple locations to prevent moisture and oxygen from penetrating through the camera aperture. Each preventive structure is formed in a different shape, such as a positive cone shape and a negative cone shape, to weigh the advantages and disadvantages of each structure, thereby achieving a more superior effect in preventing moisture and oxygen penetration.

[0027] By combining preventative structures, the crack detection structure allows for more effective prevention of moisture penetration and enables the detection of crack initiation and propagation. The crack detection structure is positioned between the preventative structures and adjacent to the camera aperture, thereby enabling early detection of crack propagation.

[0028] The effects of this specification are not limited to those described above. Other effects not described above will be obvious to those skilled in the art from the following description.

[0029] The objectives achieved by this invention, the means to achieve those objectives, and the effects of this invention described above do not define the essential features of the claims; therefore, the scope of the claims is not limited to the disclosure of this invention. Attached Figure Description

[0030] The above and other aspects, features and advantages of this disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0031] Figure 1 This is an illustration showing the front of a display panel according to an embodiment of this specification;

[0032] Figure 2 It shows the display area. Figure 1 An enlarged plan view of region A;

[0033] Figure 3 It shows the edge of the sub-pixel Figure 2 A cross-sectional view of line I-I';

[0034] Figure 4 This is a plan view showing the arrangement of the crack detection unit of the display panel according to an embodiment of this specification;

[0035] Figure 5 It shows the outer part of the camera hole. Figure 4 An enlarged plan view of region B;

[0036] Figure 6 It shows the outer part of the camera hole. Figure 5 Enlarged plan view of region C;

[0037] Figure 7 It shows the area along the camera aperture. Figure 6 The cross-sectional view of line II-II'; and

[0038] Figure 8 This is a cross-sectional view showing the arrangement of a touch screen or the like at the periphery of the camera hole according to an embodiment of this specification. Detailed Implementation

[0039] The advantages and features of this disclosure and the methods of implementing it will become clearer from the embodiments described in detail below with reference to the accompanying drawings. However, this disclosure is not limited to the embodiments described below, but can be implemented in various different forms. The described embodiments are provided only to complete this disclosure and to fully provide the scope of this disclosure to those skilled in the art, and this disclosure will be defined by the appended claims.

[0040] The shapes, dimensions, scales, angles, and quantities disclosed in the accompanying drawings for the purpose of depicting embodiments of this disclosure are merely examples, and therefore this disclosure is not limited to the illustrated details. Similar reference numerals denote similar elements throughout. In the description of this disclosure, detailed descriptions of relevant known functions or configurations will be omitted where it is determined that such detailed descriptions would unnecessarily obscure the essential points of this disclosure. Where "comprising," "having," and "including" are used in this specification, additional terms may be added unless "only" is used. Any reference to the singular may include the plural unless otherwise expressly stated.

[0041] When interpreting a component, it will be interpreted as including a certain range of error, even if there is no explicit description.

[0042] When describing positional relationships, for example, when describing the positional relationship between two parts as "on," "above," "below," or "next to," one or more other parts can be used "immediately following" or "directly."

[0043] When describing temporal relationships, such as describing the time sequence as "after", "following", "next", and "before", discontinuous situations can be included unless "immediately following" or "exactly" is used.

[0044] It should be understood that although this document may use terms such as "first," "second," etc., to describe various components, these components will not be limited by these terms. These terms are only used to distinguish one element or component from another. Therefore, the first component described below may be referred to as the second component without departing from the scope and spirit of this disclosure.

[0045] When describing components in this specification, terms such as “first,” “second,” “A,” “B,” “(a),” and “(b)” may be used. These terms are used only for the purpose of distinguishing one component from another, and the nature, sequence, order, or number of the corresponding elements shall not be limited by these terms. When describing a component as “connected,” “coupled,” or “linked” to another component, it may mean not only that these components are directly “connected,” “coupled,” or “linked,” but also that they are indirectly “connected,” “coupled,” or “linked” through yet another component.

[0046] In this specification, "display device" can include display devices in the narrow sense, such as liquid crystal modules (LCM), organic light-emitting diode (OLED) modules, or quantum dot (QD) modules, which include a display panel and a driver for driving the display panel. Display devices can also include assemblies of electronic devices or assemblies (or assemblies of equipment), such as laptops, televisions, computer monitors, equipment including automotive equipment, or other types of equipment for vehicles, or mobile electronic devices (such as smartphones or electronic touchpads), which are complete products (or end products) including LCMs, OLED modules, or QD modules.

[0047] Therefore, in this specification, the display device may include the display device itself in the narrow sense, such as an LCM, OLED module or QD module, and may also include an assembly, which is an application product or end consumer device including an LCM, OLED module or QD module.

[0048] In some cases, an LCM, OLED, or QD module, including a display panel and drivers, can be referred to as a "narrowly defined display device," and an electronic device that is a final product including an LCM, OLED, or QD module can be referred to as a "package." For example, a narrowly defined display device may include a display panel (such as a liquid crystal display (LCD), OLED, or QD display panel) and a source printed circuit board (PCB) that serves as a controller for driving the display panel. The package may further include a packaged PCB, which is a packaged controller electrically connected to the source PCB to control the entire package.

[0049] As the display panel used in this embodiment, any type of display panel can be used, such as an LCD panel, an OLED display panel, or a QD display panel. However, this disclosure is not limited to a specific display panel that is flexible, including a flexible substrate for an OLED display panel and a rear display support structure located thereunder. The shape or size of the display panel used in the display device according to the embodiments of this specification is not limited.

[0050] More specifically, when the display panel is an OLED display panel, the display panel may include multiple gate lines, multiple data lines, and pixels formed in the intersection areas of the gate lines and data lines. The display panel may include an array of thin-film transistors having elements that selectively apply voltage to each pixel, an OLED layer located on the array, and an encapsulation substrate or encapsulation layer disposed on the array to cover the OLED layer. The encapsulation layer can protect the thin-film transistors and the OLED layer from external influences and can prevent moisture or oxygen from penetrating into the OLED layer. The layers formed on the array include inorganic light-emitting layers, such as nanoscale material layers or QDs (Quantization Diodes).

[0051] In this instruction manual, Figure 1 An exemplary OLED display panel 100 is shown that can be integrated with components within a display device.

[0052] Figure 1 This is a plan view showing a display panel 100 according to an embodiment of this specification. Figure 1 An exemplary OLED display panel 100 is shown that can be integrated with components within a display device. (Reference) Figure 1 In the OLED display panel 100, apertures CH for cameras and sensors can be formed within the display area DA, thereby reducing the bezel area that is a non-display area and maximizing the display area DA. Products designed to maximize the display area DA are aesthetically preferred because they maximize the user's immersion.

[0053] The aperture CH used for cameras and sensors can be, for example, Figure 1 The image shows one hole, but is not limited to this. Holes CH for cameras and sensors can be formed in various ways. For example, one or two holes can be formed within the display area DA. In this case, the camera can be placed in the first hole, and a distance sensor or face recognition sensor and a wide-angle camera can be placed in the second hole.

[0054] Figure 2 Is as Figure 1 An enlarged plan view of a portion of the display area DA of the display panel 100 is shown, and the planar shape of the sub-pixels disposed in the display area DA is also shown.

[0055] exist Figure 2 In the display panel 100, multiple anodes 151 can be disposed in the display area DA, and a dam 154 can fill the area between the anodes 151. The dam 154 can be configured to cover the edges of the anodes 151 and can function to define the emission area of ​​the sub-pixel by allowing only the central area of ​​the anodes 151 to contact the organic light-emitting stack. Spacers 155 can be disposed in a portion of the area where the dam 154 is disposed. The spacers 155 can be configured to have a constant density throughout the display panel 100. The spacers 155 can function as a support mask, so that the mask used for deposition of the organic layer covering or opening each sub-pixel does not directly contact the display panel 100 during the deposition process to form the organic light-emitting stack. Although Figure 2 A planar structure of type PenTile is shown, in which subpixels are arranged according to point shapes; however, this disclosure is not limited thereto, and a planar structure of type real can also be used.

[0056] Figure 3 It shows the edge of the sub-pixel Figure 2 A cross-sectional view of the I-I' line.

[0057] refer to Figure 3 A substrate 101, multiple buffer layers 102, and a lower buffer layer 103 can be provided, and a first transistor 120 can be deposited on the lower buffer layer 103. A lower gate insulating film 104 can be disposed on the first semiconductor layer 123 constituting the first transistor 120, thereby insulating the first semiconductor layer 123 from the first gate electrode 122. A first lower interlayer insulating film 105 and a second lower interlayer insulating film 106 can be sequentially disposed on the first gate electrode 122, and an upper buffer layer 107 can be disposed thereon.

[0058] The multiple buffer layer 102 can delay the diffusion of moisture or oxygen into the substrate 10, and can also improve the performance of silicon nitride (SiN). x ) and silicon dioxide (SiO) x It is formed by performing at least one alternating stacking setup.

[0059] The lower buffer layer 103 protects the first semiconductor layer 123 and functions to block various types of defects introduced from the substrate. The lower buffer layer 103 can be made of a-Si, silicon nitride (SiN), etc. x ) or silicon dioxide (SiO) x It consists of , etc.

[0060] The first semiconductor layer 123 of the first transistor 120 can be formed as a polycrystalline semiconductor layer and can include a channel region, a source region, and a drain region.

[0061] This polycrystalline semiconductor layer can have a higher mobility than amorphous semiconductor layers and oxide semiconductor layers, and therefore can have low power consumption and good reliability. Because of these advantages, this polycrystalline semiconductor layer can be used to drive transistors.

[0062] The first gate electrode 122 can be disposed on the lower gate insulating film 104 and can be configured to overlap with the first semiconductor layer 123.

[0063] The second transistor 130 can be disposed on the upper buffer layer 107, and the light-blocking layer 136 can be disposed below the region corresponding to the second transistor 130. See also Figure 3 The light-blocking layer 136 can be disposed on the first lower interlayer insulating film 105 in the region corresponding to the second transistor 130, and the second semiconductor layer 133 of the second transistor 130 can be disposed on the second lower interlayer insulating film 106 and the upper buffer layer 107, thereby overlapping with the light-blocking layer 136. The upper gate insulating film 137 can be disposed on the second semiconductor layer 133, thereby insulating the second gate electrode 132 from the second semiconductor layer 133, and then the upper interlayer insulating film 108 can be disposed on the second gate electrode 132. The first gate electrode 122 and the second gate electrode 132 can be formed as a single layer or multiple layers composed of at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof, but this disclosure is not limited thereto.

[0064] The first and second lower interlayer insulating films 105 and 106 can be formed as inorganic films with a higher hydrogen particle content compared to the upper interlayer insulating film 108. For example, the first and second lower interlayer insulating films 105 and 106 are made of silicon nitride (SiN). x The silicon nitride is formed by a deposition process using NH3 gas, and the upper interlayer insulating film 108 can be made of silicon oxide (SiO2). xThe first transistor 120 is constructed by means of hydrogen particles contained in the first and second lower interlayer insulating films 105 and 106. These hydrogen particles can diffuse into the polycrystalline semiconductor layer during the hydrogenation process, thereby filling the pores in the polycrystalline semiconductor layer with hydrogen. Accordingly, the polycrystalline semiconductor layer can be stabilized, thereby preventing the characteristics of the first transistor 120 from deteriorating. After the activation and hydrogenation process of the first semiconductor layer 123 of the first transistor 120, the second semiconductor layer 133 of the second transistor 130 can be formed. In this case, the second semiconductor layer 133 can be made of oxide semiconductor. Since the second semiconductor layer 133 is not exposed to the high-temperature atmosphere of the activation and hydrogenation process of the first semiconductor layer 123, damage to the second semiconductor layer 133 can be avoided, thereby improving reliability. After the upper interlayer insulating film 108 is provided, first source contact holes 125S and first drain contact holes 125D corresponding to the source and drain regions of the first transistor can be formed, and second source contact holes 135S and second drain contact holes 135D corresponding to the source and drain regions of the second transistor 130 can be formed, respectively. refer to Figure 3 The first source contact hole 125S and the first drain contact hole 125D can be continuously formed from the upper interlayer insulating film 108 to the lower gate insulating film 104, and the second source contact hole 135S and the second drain contact hole 135D can also be formed in the second transistor 130. The first source electrode 121 and the first drain electrode 124 corresponding to the first transistor 120 and the second source electrode 131 and the second drain electrode 134 corresponding to the second transistor 130 can be formed simultaneously, thereby reducing the number of process steps for forming the source and drain electrodes of each of the first transistor 120 and the second transistor 130.

[0065] The first source electrode 121 and the first drain electrode 124, as well as the second source electrode 131 and the second drain electrode 134, can be formed as a single layer or multiple layers composed of at least one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof, but this disclosure is not limited thereto. The first source electrode 121 and the first drain electrode 124, as well as the second source electrode 131 and the second drain electrode 134, can have a three-layer structure. For example, the first source electrode 121 may include a first layer 121a, a second layer 121b, and a third layer 121c, and the other source electrodes and drain electrodes may have the same structure as the first source electrode 121.

[0066] The storage capacitor 140 can be disposed between the first transistor 120 and the second transistor 130. For example... Figure 3 As shown, the storage capacitor 140 may be formed by overlapping the storage lower electrode 141 and the storage upper electrode 142 and disposing a first lower interlayer insulating film 105 between them.

[0067] The lower storage electrode 141 can be located on the lower gate insulating film 104 and is formed coplanar with the first gate electrode 122, and is made of the same material as the first gate electrode 122. The upper storage electrode 142 can be electrically connected to the pixel circuit via the storage supply line 143. The upper storage electrode 142 can be formed coplanar with the light-blocking layer 136 and is made of the same material as the light-blocking layer 136. The upper storage electrode 142 is exposed through a storage contact hole 144 passing through the second lower interlayer insulating film 106, the upper buffer layer 107, the upper gate insulating film 137, and the upper interlayer insulating film 108, and is connected to the storage supply line 143. Meanwhile, although as Figure 3 The storage upper electrode 142 shown is separated from the light-blocking layer 136, but the storage upper electrode 142 can be connected to the light-blocking layer 136, thus forming integrally with the light-blocking layer 136. The storage supply line 143 can be formed coplanar with the first source electrode 121 and the first drain electrode 124, as well as the second source electrode 131 and the second drain electrode 134, and is made of the same material as the first source electrode 121 and the first drain electrode 124, as well as the second source electrode 131 and the second drain electrode 134. Accordingly, the storage supply line 143 can be formed simultaneously with the first source electrode 121 and the first drain electrode 124, as well as the second source electrode 131 and the second drain electrode 134, using the same masking process.

[0068] A protective film 109 can be formed by depositing an inorganic insulating material, such as SiNx or SiOx, on the entire surface of a substrate 101 on which a first source electrode 121 and a first drain electrode 124, a second source electrode 131 and a second drain electrode 134, and a storage supply line 143 are formed. A first planarization layer 110 can be formed on the substrate 101 on which the protective film 109 is formed. Specifically, the first planarization layer 110 can be formed by applying an organic insulating material (e.g., acrylic resin) to the entire surface of the substrate 101 on which the protective film 109 is formed.

[0069] After the protective film 109 and the first planarization layer 110 are formed, a contact hole exposing the first source electrode 121 or the first drain electrode 124 of the first transistor 120 can be formed by photolithography. A connection electrode 145 made of a material including Mo, Ti, Cu, AlNd, Al, Cr or alloys thereof can be provided in the area of ​​the contact hole exposing the first drain electrode 124.

[0070] A second planarization layer 111 can be provided on the connecting electrode 145, and a contact hole exposing the connecting electrode 145 can be formed in the second planarization layer 111, thereby arranging the light-emitting element 150 connected to the first transistor 120.

[0071] The light-emitting element 150 may include an anode 151 connected to a first drain electrode 124 of a first transistor 120, at least one organic light-emitting stack 152 formed on the anode 151, and a cathode 153 formed on the organic light-emitting stack 152.

[0072] The organic light-emitting stack 152 may include a hole injection layer, a hole transport layer, an emission layer, an electron transport layer, and an electron injection layer. In a tandem structure where multiple emission layers overlap, an additional charge-generating layer may be provided between the emission layers. In some cases, the emission layers may emit light of different colors for each sub-pixel. For example, a red emission layer, a green emission layer, and a blue emission layer may be formed separately for each sub-pixel. However, a common emission layer may be formed for each pixel to emit white light without color differentiation, and a separate filter may be provided for color differentiation. This differentiation may be categorized as red-green-blue (RGB) type (real RGB type) and white OLED (WOLED). Each emission layer may be formed separately, but the injection layer or transport layer may be provided as a common layer and may be equally configured for each sub-pixel.

[0073] The anode 151 can be connected to the connection electrode 145 exposed through a contact hole passing through the second planarization layer 111. The anode 151 can be formed in a multilayer structure including a transparent conductive film and an opaque conductive film with high reflectivity. The transparent conductive film is made of a material with a relatively large work function value, such as indium tin oxide (ITO) or indium zinc oxide (IZO), and the opaque conductive film has a single-layer or multilayer structure including Al, Ag, Cu, Pb, Mo, Ti, or alloys thereof. For example, the anode 151 can be formed in a structure in which the transparent conductive film, the opaque conductive film, and the transparent conductive film are stacked in sequence, or in a structure in which the transparent conductive film and the opaque conductive film are stacked in sequence. The anode 151 can be disposed in the emission region provided by the embankment 154 and on the second planarization layer 111, thereby overlapping with the pixel circuit region in which the first and second transistors 120 and 130 and the storage capacitor 140 are disposed, thereby increasing the area for emitting light.

[0074] An organic light-emitting stack 152 can be formed by stacking a hole transport layer, an organic emission layer, and an electron transport layer on an anode 151 in the listed order or in reverse order. Furthermore, the organic light-emitting stack 152 may further include a charge-generating layer, and may include first and second light-emitting stacks facing each other together with the charge-generating layer interposed therebetween.

[0075] The dam 154 can be formed to expose the anode 151. The dam 154 can be made of an organic material (e.g., photoacrylic) and can include a translucent material, but this disclosure is not limited thereto. The dam 154 can be made of an opaque material to prevent light interference between subpixels.

[0076] The cathode 153 can be formed on the upper surface of the organic light-emitting stack 152, facing the anode 151, wherein the organic light-emitting stack 152 is inserted therebetween. When the cathode 153 is used in a top-emitting organic light-emitting display device, the cathode 153 can be formed by forming a thin transparent conductive film using ITO, IZO or magnesium silver (Mg-Ag).

[0077] An encapsulation layer 170 for protecting the light-emitting element 150 can be formed on the cathode 153. Because the light-emitting element 150 reacts with external moisture or oxygen due to the characteristics of the organic material in the organic light-emitting stack 152, black spots or pixel shrinkage may occur. To avoid black spots or pixel shrinkage, an encapsulation layer 170 can be provided on the cathode 153. The encapsulation layer 170 may include a first inorganic insulating film 171, a foreign matter compensation layer 172, and a second inorganic insulating film 173.

[0078] A touch unit can be disposed on the upper portion of the encapsulation layer 170 formed thereon. The touch unit may include a first touch planarization layer, touch electrodes, and a second touch planarization layer. The first touch planarization layer and the second touch planarization layer may be configured to eliminate the step portion at the point where the touch electrodes are disposed and to allow for good electrical insulation of the touch electrodes.

[0079] Figure 4 This is a conceptual diagram illustrating a crack detection unit 400 according to an embodiment of this specification. (Reference) Figure 4 In the non-display area NA, which is the outer part of the display area AA, the line corresponding to the crack detection unit 400 can start from the crack detection pad 430 and can be set as four (top, bottom, left, and right) side edges surrounding the outer periphery of the display area AA. The crack detection unit 400 can be set near the location of the cut portion of the display panel 100 formed by the laser cutting process. Accordingly, for the lower surface where the cut surface is not formed near the display area AA, the crack detection unit 400 can be set only in a local section near the edge area of ​​the display panel 100.

[0080] The crack detection unit 400 may include multiple lines, and for example, the crack detection unit 400 may be selected from the first source electrode 121, the first gate electrode 122 and the first drain electrode 124 constituting the first transistor 120, or it may be selected from the second source electrode 131, the second gate electrode 132 and the second drain electrode 134 constituting the second transistor 130.

[0081] Although the crack detection unit 400 can be formed as a single line during its formation, it can have multiple line connection structures to avoid or bypass other lines or structures pre-set in the non-display area NA. For example, to avoid high-potential power lines, low-potential power lines, electrostatic discharge (ESD) structures, and gate in-panel (GIP) structures, multiple lines can be provided and contact structures can be formed to move these multiple lines to another layer in the cross-section.

[0082] refer to Figure 4 The crack detection unit 400 can be configured in two rows surrounding the outer periphery of the display panel 100. When the signal input and signal output portions of the crack detection pads 430 for detecting cracks are positioned adjacent to each other, the crack detection unit 400 can start from the crack detection pads 430 and return via adjacent portions of the wiring passing through the right, upper, and left outer periphery portions of the display panel 100, forming a U-shaped bend in the lower left. Lines forming a closed circuit can be configured.

[0083] Arranging the crack detection units 400 in two rows is to extend the length of the wires used in the crack detection units 400 to a certain extent or more, thereby enabling constant adjustment of the resistance generated when a crack is detected.

[0084] Some of the lines in the crack detection unit 400 can be set to extend to the vicinity of the camera hole CH, and thus check whether a crack has been generated in the camera hole CH.

[0085] A method for checking for cracks using a crack detection unit 400 is described below. First, the crack detection pads 430 and crack detection lines constituting the crack detection unit 400 can be positioned at the outer periphery of the display panel 100. Space can be ensured by arranging the crack detection pads 430 as close as possible to the area where the flexible printed circuit board (FPCB) or driver integrated circuit (IC) is located, and the crack detection lines 410 can be positioned at the outermost portion of the non-display area NA of the display panel 100, and positioned as close as possible to the cut surface of the substrate 101.

[0086] In an apparatus performing Automatic Detection (AP) testing as a final test for the display panel 100 or a separate device, a certain level of power can be applied to the crack detection pad 430, thereby comparing the input value with the output value. The degree of resistance caused by the crack detection line can be determined by the difference between the input and output values, and the disconnection of the crack detection line can be checked based on this resistance. For example, when a crack occurs in the outer peripheral portion of the substrate 101 of the display panel 100, some or all of the crack detection lines may become disconnected. When some of the crack detection lines become disconnected, the resistance gradually increases and the output power decreases, and when the crack detection line is completely disconnected, the output power may approach zero. Due to such resistance-related electrical characteristics, it is possible to easily detect whether a crack has occurred in the panel.

[0087] Although an example of a crack detection unit 400 with two rows of closed circuits has been described in the embodiments according to this specification, this disclosure is not limited thereto, and a configuration that provides a crack detection line separately disposed in the camera hole CH and provides a plurality of corresponding crack detection pads 430 may also be included within the scope of this disclosure.

[0088] Figure 5 It corresponds to Figure 1 A magnified plan view of region B of the camera aperture area CHA. (Reference) Figure 5 A camera hole CH for accommodating a large-sized camera can be formed in the central portion, and a camera module can be installed within it. A dam structure 300, a cut-out structure 200, and a crack detection unit 400 can be installed near the circular camera hole CH. The camera hole CH can be formed using a laser during panel completion operations. The non-display area NA can be located between the camera hole CH and the display area AA, and high-potential power lines PL, gate lines SL, etc., can be placed in the non-display area NA.

[0089] refer to Figure 5 The dam structure 300 may include a first dam 301 and a second dam 302, and the cutting structure 200 may include a first cutting portion 201 and a second cutting portion 202. The first cutting portion 201, the crack detection line 410 of the crack detection unit 400, the first dam 301, the second cutting portion 202 and the second dam 302 may be sequentially arranged from the camera hole CH.

[0090] Generally, the dam structure prevents the foreign matter compensation layer 172, which is part of the encapsulation layer at the outer periphery of the display panel 100, from flowing to the end of the outer periphery of the display panel 100, thereby aiming to maintain the adhesive force between the upper substrate and the lower substrate constituting the display panel 100.

[0091] In order to prevent the foreign matter compensation layer 172 of the encapsulation layer 170 protecting the light-emitting element 150 from penetrating or leaking into the camera hole CH, the dam structure 300 near the camera hole CH can also be formed as multiple structures, such as a first dam 301 and a second dam 302.

[0092] Two dams are provided in this specification, but this disclosure is not limited thereto. Additional dams may be installed depending on the arrangement of the space.

[0093] refer to Figure 5 The first cut portion 201 and the second cut portion 202 can be located near the first dam 301 and the second dam 302. The first cut portion 201 and the second cut portion 202 can be configured to protect the light-emitting element 150 in the display area AA from moisture or oxygen that may flow in from the camera hole CH.

[0094] The organic light-emitting stack 152 for the light-emitting element 150 can be deposited on the entire surface of the display panel 100, and can also be uniformly deposited near the camera hole CH. Due to the properties of organic materials, the organic light-emitting stack 152 can have high reactivity and permeability with respect to moisture and oxygen, and thus may transport moisture and oxygen to the light-emitting element 150 in the display area AA. To avoid the transport of moisture and oxygen, the first cut portion 201 and the second cut portion 202 can allow for partial cutting away of the organic light-emitting stack 152. Two cutting structures are provided in this specification, but this disclosure is not limited thereto.

[0095] refer to Figure 5 A crack detection unit 400 can be disposed between the first cut portion 201 and the first dam 301. A camera hole CH can be formed in the substrate 101 of the display panel 100 to accommodate a camera lens. A laser can be used to perform a precise cutting process on the substrate 101 to form the camera hole CH, and in this case, the laser may induce microcracks in the substrate 101. Microcracks generated in the cut surface of the camera hole CH may gradually expand due to accumulated stress during subsequent module processes.

[0096] Such cracks can propagate from the non-display area NA to the adjacent display area AA. Due to the crack's propagation, external oxygen or moisture can reach the light-emitting element 150 in the display area AA through the crack. The organic-material light-emitting element 150 can react with the oxygen or moisture, causing pixel shrinkage or black spots in specific areas, thus resulting in display defects. To prevent crack propagation, a crack detection unit 400 can be installed near the camera aperture CH to prevent crack propagation.

[0097] The crack detection unit 400 can be formed according to a structure in which the portion of the inorganic film in which cracks are prone to propagate is removed, thereby preventing the propagation of cracks generated in the cut surface of the camera hole CH.

[0098] The first cut portion 201, the first dam 301, the second cut portion 202, and the second dam 302 can all be arranged in a closed loop shape around the camera aperture CH. This is to prevent oxygen and moisture from penetrating at a certain distance along the cut surface of the camera aperture CH, and to prevent the foreign matter compensation layer 172 of the encapsulation layer 170 from overflowing into the camera aperture CH.

[0099] However, the crack detection unit 400 can have a circular arrangement around the camera hole CH, but it does not have a closed-loop shape. Since the input and output of the detection signal from the crack detection pad 430 require a segment, the crack detection unit 400 includes a connecting line 420 that passes through the first cut portion 201, the first dam 301, the second cut portion 202, and the second dam 302 in a direction from its lower portion toward the non-display area NA. Due to the arrangement of the connecting line 420, the crack detection unit 400 does not have a closed-loop structure within the camera hole CH.

[0100] Although the light-emitting elements 150 and pixel circuits in the area corresponding to the camera aperture region CHA are removed, the light-emitting elements 150 and pixel circuits arranged on the upper, lower, left, and right sides of the camera aperture region CHA should still be electrically connected. For this purpose, in the non-display area NA close to the camera aperture region CHA, high-potential power lines PL, gate lines SL, etc., can be configured to bypass the camera aperture region CHA, thus receiving both vertical and horizontal connections.

[0101] Figure 6 yes Figure 5 A magnified plan view of region C in the camera aperture region CHA. (Reference) Figure 6 The first cutting portion 201 can be disposed between the first dam 301 and the camera hole CH, and the second cutting portion 202 can be disposed between the first dam 301 and the second dam 302.

[0102] The first cutting portion 201 may include a first structure 211, a second structure 212, a third structure 213, a fourth structure 214, a fifth structure 215, a sixth structure 216, a seventh structure 217, an eighth structure 218, and a ninth structure 219. The second cutting portion 202 may include a tenth structure 221, an eleventh structure 222, a twelfth structure 223, and a thirteenth structure 224.

[0103] although Figure 6The first cut section 201 has nine structures and the second cut section 202 has four structures, but this disclosure is not limited to this and various numbers of cut sections can be provided.

[0104] refer to Figure 6 A crack detection unit 400 can be formed in the region of the structure in which the first cutting portion 201 is provided. For example, the crack detection unit 400 can be provided between the fifth structure 215 and the sixth structure 216. The crack detection unit 400 can be provided between the fifth structure 215 and the sixth structure 216 not far from the cutting surface of the camera hole CH, thereby detecting cracks that may be generated at the cutting surface from the beginning when the crack does not propagate toward the first dam 310.

[0105] refer to Figure 6 The crack detection unit 400 may include a crack detection line 410 and a connecting line 420 located near the camera aperture CH. The crack detection line 410 may have a circular planar shape along the camera aperture CH, but there may be disconnected connection portions in local sections of the camera aperture. The crack detection line 410 may be electrically connected to the connecting line 420 at the corresponding disconnected connection portions.

[0106] The connecting line 420 can extend to the non-display area NA, thereby connecting to the crack detection pad 430.

[0107] Figure 7 It shows along Figure 6 A cross-sectional view of the section obtained from line II-II'. (Reference) Figure 7 It can be confirmed that a substrate 101 having a display panel 100 is provided, and a plurality of inorganic films are disposed on the substrate 101. As such a plurality of inorganic films, for example, a multiple buffer layer 102, a lower buffer layer 103 and a lower gate insulating film 104 may be provided, and a first lower interlayer insulating film 105, a second lower interlayer insulating film 106 and an upper buffer layer 107 may be disposed sequentially.

[0108] The first planarization layer 110 and the second planarization layer 111 can be disposed on the plurality of inorganic films, and the embankment 154 and the spacer 155 can be disposed sequentially. The organic light-emitting stack 152 can be disposed on the entire surface, thereby being disposed on the embankment 154 and the spacer 155.

[0109] Regarding the cut surface along line II-II', it can be seen that the camera hole CH approaches point II' and the display area AA approaches point II. Regarding the cut surface along line II-II', in order to cut off the moisture permeation path of the organic light-emitting stack 152 on the cut surface that may become the channel hole CH, the first cut portion 201 can be formed in a two-stage structure consisting of an upper structure portion and a lower structure portion. Specifically, the upper structure portion can be configured such that its cross-section has a trapezoidal shape with a positive conical shape, and the lower structure portion can be configured such that its side surfaces have a positive conical shape or a rectangular shape with an almost vertically constant height.

[0110] Because of the difference in width or area between the lower surface of the upper structural portion and the upper surface of the lower structural portion (which is the point where the upper and lower structural portions meet each other), an undercut structure may be formed on the lower surface of the upper structural portion. The lower structural portion may include a second lower interlayer insulating film 106 and an upper buffer layer 107, and the upper structural portion may include a first planarization layer 110 and a second planarization layer 111.

[0111] The upper structure portion can be made of organic material to form an undercut structure. The organic light-emitting stack 152 can be deposited onto the entire surface of the display panel 100 during deposition using linearity, but the organic light-emitting stack 152 can be cut because the organic light-emitting stack 152 cannot be formed onto the lower surface of the upper structure portion of the cut portion, due to the undercut shape of the upper structure portion of the cut portion.

[0112] The first cut portion 201 and the second cut portion 202 may include multiple structures, thereby preventing oxygen and moisture from permeating through the organic light-emitting stack 152. Although the first cut portion 201 is described to have more structures than the second cut portion 202, this disclosure is not limited thereto and various variations can be applied.

[0113] refer to Figure 7 It shows a first dam 301 and a second dam 302, which are formed within the partition space between the first cut portion 201 and the second cut portion 202, and within the second cut portion 202, respectively, thereby forming a wall. Although Figure 7 Although not shown, the foreign matter compensation layer 172 of the encapsulation layer 170 can fill the space between the first dam 301 and the second dam 302. The first dam 301 and the second dam 302 are designed to prevent the foreign matter compensation layer 172 of the encapsulation layer 170 from overflowing into the camera aperture CH and contaminating the camera aperture CH.

[0114] A crack detection unit 400 is disposed between the fifth structure 215 and the sixth structure 216 of the first cut portion 201, thereby detecting cracks that may be generated in the cut surface of the camera hole CH. The crack detection unit 400 can be formed by forming connecting lines 420 on multiple buffer layers 102, lower buffer layers 103 and lower gate insulating films 104 among multiple inorganic films disposed on the substrate 101 of the display panel 100, forming a first lower interlayer insulating film 105 and a second lower interlayer insulating film 106 on the connecting lines 420, and arranging crack detection lines 410 in the space where local areas have been removed.

[0115] Generally, a laser can be used to perforate the substrate 101 to form a camera hole CH. The laser can irradiate along the shape of the camera hole CH in a circular or elliptical shape, and all areas on the substrate except the substrate 101 can be removed by laser irradiation.

[0116] There may be a difference between the actual camera aperture CH and the laser irradiation area. For example, the laser irradiation area in the camera aperture CH may be an area approximately 100 μm inside the camera aperture CH. Only when there is a difference between the laser irradiation area and the camera aperture CH will the insulating layer of the camera aperture CH not be damaged during laser irradiation.

[0117] Picosecond or femtosecond lasers can be used as lasers, but this disclosure is not limited thereto. A laser uses light that is generated and emitted by amplifying light produced when energy is applied to a specific material. This laser has the same properties as radio waves and possesses monochromatic light characteristics and directionality, thus making it suitable for communication, medical, and industrial purposes.

[0118] When using a laser, patterns can be formed on desired areas or specific areas can be easily removed. Lasers are used to create or remove patterns using energy, and when laser energy is radiated onto an object, thermal energy melts the object to form the pattern. As the laser irradiation time increases, a thermal effect may occur, where heat is transferred to the vicinity of the patterned area. Due to this thermal effect, heat may accumulate around the laser-irradiated area of ​​the object, and even areas surrounding the set pattern may be scorched or deformed by this heat.

[0119] Due to these properties of lasers, when the area irradiated by the laser overlaps with or is adjacent to the insulating film, the thermal energy of the laser can also cause deformation of the insulating film. This deformation can lead to cracks, which may propagate through the insulating film, causing delamination and potentially allowing moisture and oxygen to penetrate. For example, to prevent deformation or delamination of insulating films such as the multiple buffer layer 102, lower buffer layer 103, first lower interlaminar insulating film 105, second lower interlaminar insulating film 106, upper buffer layer 107, and upper interlaminar insulating film 108, all of these insulating layers can be removed at a distance of approximately 100 μm from the laser irradiation location.

[0120] When all insulating layers are removed, the substrate 101 and the side surfaces of the insulating layers can be exposed, but the first inorganic insulating film 171 and the second inorganic insulating film 173 of the encapsulation layer 170 can cover the side surfaces.

[0121] Cracks generated when using laser-cut substrate 101 tend to propagate easily through inorganic films. While moisture and oxygen are transported through reaction with organic light-emitting stack 152, cracks can easily propagate through non-flexible, hard inorganic films. Crack detection unit 400 can be designed based on these crack propagation characteristics.

[0122] The exposed area of ​​the substrate 101 can be formed by removing the multiple buffer layer 102, lower buffer layer 103, lower gate insulating film 104, first lower interlayer insulating film 105 and second lower interlayer insulating film 106 from the multiple inorganic films disposed on the substrate 101. Then, a first planarization layer 110 or a second planarization layer 111 can be disposed to cover the exposed area of ​​the substrate and the side exposed portions of the multiple inorganic films.

[0123] When using laser cutting of the substrate 101, stress concentration may occur in the uppermost first lower interlayer insulating film 105 or second lower interlayer insulating film 106 among the plurality of inorganic films. Therefore, the crack detection line 410 of the crack detection line 400 is provided at the location where a portion of the first lower interlayer insulating film 105 or the second lower interlayer insulating film 106 has been removed, thereby providing a sensitive response to crack propagation.

[0124] The crack detection line 410 of the crack detection unit 400 can be made of the same material as the second gate electrode 132 using the same process as the second gate electrode 132, and the connecting line 420 can be made of the same material as the first gate electrode 122 using the same process as the first gate electrode 122.

[0125] The crack detection line 410 may be made of the same material as the first gate electrode 122 or the second gate electrode 132, and may thus be formed as a single layer or multiple layers of at least one selected from molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof, but this disclosure is not limited thereto.

[0126] The crack detection line 410 can have a line width of approximately 5 μm to 6 μm and can be disposed between the structures of the first cut portion 201. The line width of the crack detection line 410 can be selected taking into account the structure of the first cut portion 201 and the crack detection sensitivity. The structure of the first cut portion 201 can have a width of approximately 10 μm, and the design width of the crack detection line 410 is preferably smaller than the design width of the structure of the first cut portion 201 to avoid the penetration of moisture and oxygen. A wider line width of the crack detection line 410 has the advantage of reducing resistance. However, considering the overall design of the crack detection line 410 disposed on the display panel 100, a wide line width may be unnecessary. The crack detection line 410 can also be disposed between the structures of the second cut portion 202, but it is preferable to dispose of it as much as possible within the first cut portion 201 for initial detection of whether a crack has occurred.

[0127] Figure 8 This illustrates an embodiment of the invention that incorporates a touch sensor unit 180 that can be added to the display panel 100. Figure 6 A cross-sectional view of the cut surface along line II-II'. (Reference) Figure 8 , Figure 7 The crack detection unit 400 shown can be disposed on the substrate 101 of the display panel 100, and can be like... Figure 7 The cut-off section, first dam 301, second dam 302, etc. are set up as shown.

[0128] The encapsulation layer 170 can be disposed on the cut portion and the dam, and a touch buffer layer 181, a first touch electrode 182, a touch interlayer insulating film 183, and a second touch electrode 184 can be sequentially disposed on the encapsulation layer 170.

[0129] A first pack 174 can be thickly applied to the encapsulation layer 170 in the area near the camera hole CH, in the area where the first cut portion 201 or the second cut portion 202 is set. A touch buffer layer 181 and a touch interlayer insulating film 183 can be configured to extend onto and overlap the first pack 174. A touch sensor crack detection electrode 185, made of the same material as the second touch electrode 184, can be applied to the touch buffer layer 181 and the touch interlayer insulating film 183 overlapping the first pack 174.

[0130] The second sealant 175 can be disposed on the touch sensor crack detection electrode 185, thereby making the display panel 100 planar. The touch sensor crack detection electrode 185 can be configured to detect cracks that may occur near the substrate 101, which is the lower layer of the display panel, and cracks that may occur near the touch sensor unit 180, which is the upper layer of the display panel 100, thereby pre-selecting defects.

[0131] Although an embodiment of the display device according to this specification has been described based on the fact that the substrate corresponding to the camera hole CH has been removed by laser, this disclosure is not limited thereto, and parts of the substrate may be removed or only portions of the substrate may be removed.

[0132] The display devices according to embodiments of this specification may include LCD, field emission display (FED), OLED display devices, and QD display devices.

[0133] The display device according to the embodiments of this specification may include a complete set of electronic devices / equipment or a complete set of devices (or complete sets of equipment), such as a laptop computer, a television, a computer monitor, an equipment display device including an automotive display device or another type of device for a vehicle or a mobile electronic device / equipment (such as a smartphone or electronic board), which is a complete product (or final product) including an LCM or OLED module, etc.

[0134] The display device according to the embodiments described above can be briefly described again as follows.

[0135] A display device according to an embodiment of this specification may include: a substrate comprising a display area, a camera aperture, and a non-display area; at least one cutout portion and at least one dam disposed in the non-display area; a plurality of insulating films disposed on the substrate and below the light-emitting element, the cutout portion, and the dam; and a crack detection unit disposed between the at least one cutout portion and the camera aperture. Here, the non-display area described above may be located between the display area and the camera aperture.

[0136] In the display device according to embodiments of this specification, the crack detection unit may include crack detection lines and connecting lines. Here, the crack detection unit is also referred to as a crack detection structure.

[0137] In the display device according to the embodiments of this specification, the plurality of insulating films may include a gate insulating film, a first interlayer insulating film, and a second interlayer insulating film, etc.

[0138] In a display device according to an embodiment of this specification, a crack detection line may be disposed in a region where a portion of the first interlayer insulating film or the second interlayer insulating film has been removed. For example, the first interlayer insulating film or the second interlayer insulating film includes at least one opening, and at least one crack detection line may be disposed in the at least one opening of the first interlayer insulating film or the second interlayer insulating film.

[0139] In the display device according to embodiments of this specification, the connecting line may be disposed between the gate insulating film and the first interlayer insulating film. Here, the connecting line may also be referred to as a connecting electrode or a connecting pattern.

[0140] In the display device according to embodiments of this specification, the crack detection line may have a circular planar shape, except for certain local sections. For example, the crack detection line may have a circular planar shape along the camera aperture, but there may be disconnected connections in certain local sections. The crack detection line may be electrically connected to a connecting line at the corresponding disconnected connection. For example, the shape of the crack detection line may be determined according to the shape of the camera aperture, and when the shape of the camera aperture is circular, elliptical, or polygonal (e.g., quadrilateral, hexagonal, or octagonal), the shape of the crack detection line may also be circular, elliptical, or polygonal (e.g., quadrilateral, hexagonal, or octagonal).

[0141] In the display device according to embodiments of this specification, the connecting line may be in electrical contact with the crack detection line and may be configured to overlap with the at least one cut portion or the at least one dam.

[0142] In a display device according to an embodiment of this specification, the connecting line may extend perpendicular to the crack detection line, the at least one cut portion, and the at least one dam.

[0143] A display device according to an embodiment of this specification may include: a substrate including a non-display area disposed between a camera hole and a display area; a touch sensor unit configured to correspond to the display area; a touch crack detection electrode configured to correspond to the non-display area; and a crack detection unit configured to correspond to the non-display area. Here, the touch crack detection electrode is also referred to as a touch sensor crack detection electrode.

[0144] In a display device according to an embodiment of this specification, a crack detection unit may include crack detection lines and connecting lines.

[0145] In the display device according to embodiments of this specification, the crack detection line and the touch crack detection electrode may not overlap each other, and the connecting line and the touch crack detection electrode may be configured to overlap each other.

[0146] The display device according to embodiments of this specification may further include one or more cut portions and at least one dam disposed in a non-display area, and a crack detection line may be disposed between the one or more cut portions.

[0147] In a display device according to an embodiment of this specification, the connecting line may be disposed below the one or more cut portions and the at least one dam, thereby overlapping with the one or more cut portions and the at least one dam. Here, the connecting line may also be referred to as a connecting electrode or a connecting pattern.

[0148] The display device according to embodiments of this specification may further include an encapsulation layer located between the connecting line and the touch crack detection electrode. Here, the encapsulation layer may include a first encapsulation.

[0149] In a display device according to an embodiment of this specification, the non-display area may further include a crack detection pad electrically connected to the connection line.

[0150] The features, structures, and effects described above in the examples of this application are included in at least one example of this application, but this disclosure is not limited to only one example. Furthermore, those skilled in the art to which this application pertains can implement the features, structures, and effects described in at least one example of this application through combinations or modifications of other examples. Therefore, the content associated with such combinations and modifications should be construed as falling within the scope of this application.

[0151] It will be apparent to those skilled in the art that this application is not limited to the embodiments and drawings described above, and that various substitutions, modifications, and variations can be made without departing from the spirit or scope of this application. Therefore, the scope of this application is defined by the claims described below, and this application should be construed as covering all modifications or variations arising from the meaning and scope of the appended claims and their equivalents.

Claims

1. A display device, comprising: The substrate includes a display area, a camera hole, and a non-display area located between the display area and the camera hole; A first thin-film transistor and a second thin-film transistor are provided for each pixel in the display area; A light-emitting element disposed on the first thin-film transistor and the second thin-film transistor; A first lower interlayer insulating film and a second lower interlayer insulating film are disposed between the first gate electrode of the first thin-film transistor and the second thin-film transistor; as well as The crack detection unit is located in the non-display area. The first lower interlayer insulating film and the second lower interlayer insulating film extend into the non-display area, and the crack detection unit includes a crack detection line disposed in a region where at least one of the first lower interlayer insulating film and the second lower interlayer insulating film has been removed.

2. The display device according to claim 1, wherein, The crack detection unit further includes a connecting line disposed between the gate insulating film of the first thin-film transistor and the first lower interlayer insulating film.

3. The display device according to claim 2, wherein, The connecting line is electrically connected to the crack detection line, and the crack detection line has a circular planar shape along the camera hole, except for a local section of the circular planar shape.

4. The display device according to claim 2, further comprising: An encapsulation layer disposed on the light-emitting element; A touch buffer layer, a first touch electrode, an interlayer insulating film, and a second touch electrode are disposed on the encapsulation layer; as well as A first sealant disposed on the encapsulation layer in the non-display area and overlapping with at least one dam disposed in the non-display area. The connecting line is disposed below the first touch electrode and overlaps with the first touch electrode.

5. The display device according to claim 4, further comprising: Touch sensor crack detection electrode disposed on the encapsulation layer in the non-display area.

6. The display device according to claim 5, wherein, The touch sensor crack detection electrode is made of the same material as the second touch electrode.

7. The display device according to claim 5, wherein, The touch sensor crack detection electrode is disposed on the first sealant in the non-display area.

8. The display device according to claim 5, further comprising: The second sealant is disposed on the crack detection electrode of the touch sensor.

9. The display device according to claim 2, further comprising: The crack detection pads are electrically connected to the connection lines.

10. The display device according to claim 1, wherein, The crack detection line is positioned between the structures of the first cut portion in the non-display area.

11. The display device according to claim 10, wherein, Each structure of the first cut portion includes an upper structural portion and a lower structural portion, wherein the upper structural portion has a positive conical shape that forms an undercut structure.

12. The display device according to claim 1, further comprising: At least one dam is set in the non-display area.

13. The display device according to claim 12, further comprising: An encapsulation layer disposed on the light-emitting element and extending into the non-display area, the encapsulation layer comprising a first inorganic insulating film, a foreign matter compensation layer, and a second inorganic insulating film.

14. The display device according to claim 13, wherein, The at least one dam includes a first dam and a second dam arranged in a closed loop shape around the camera aperture, and is configured to prevent the foreign matter compensation layer from overflowing into the camera aperture.

15. The display device according to claim 1, wherein, The crack detection line is made of the same material as the first gate electrode or the second gate electrode of the second thin-film transistor.

16. The display device according to claim 1, wherein, The crack detection line has a linewidth of 5 μm to 6 μm and is set to be a cut surface adjacent to the camera hole.

Images