Display panel, preparation method thereof and display device

Abstract

The application discloses a display panel, a preparation method thereof and a display device. The display panel is divided into a display area and a peripheral area. The preparation method of the display panel comprises the following steps: providing a driving back plate; forming a first electrode layer on one side of the driving back plate; forming a pixel definition layer on the side of the first electrode layer away from the driving back plate; the pixel definition layer comprises a first sub-layer and a second sub-layer arranged in a stack, and the material of the first sub-layer is different from that of the second sub-layer; performing vertical etching on the pixel definition layer to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer; the first pixel openings are located in the display area, and the second pixel openings are located in the peripheral area; and the part of the first sub-layer located in the display area is subjected to lateral etching in a developing mode, so that in the display area, the orthographic projection of the first sub-layer on the driving back plate is located in the orthographic projection of the second sub-layer on the driving back plate. The technical scheme of the application improves the display performance of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] With the rapid development of display technology, display devices are being used more and more widely. Display devices include display panels, which in turn include subpixels. Subpixels may include organic light-emitting diodes (OLEDs) or micro-light-emitting diodes (Micro-LEDs).

[0003] A subpixel may include an anode, a light-emitting layer, and a cathode. A light-adjusting layer may also be disposed between the anode and the light-emitting layer. The display panel includes an isolation structure, which can be used to separate the light-emitting layers of different subpixels. During the etching process to form the isolation structure, the light-adjusting layer or the anode can be easily damaged, affecting the display effect of the display panel and reducing its display performance. Summary of the Invention

[0004] This invention provides a display panel, a method for manufacturing the same, and a display device, to improve the display performance of the display panel.

[0005] According to one aspect of the present invention, a method for manufacturing a display panel is provided, the display panel being divided into a display area and a peripheral area; The method for manufacturing the display panel includes: Provides a drive backplane; A first electrode layer is formed on one side of the drive back plate; A pixel definition layer is formed on the side of the first electrode layer away from the driving backplate; wherein, the pixel definition layer covers the first electrode layer, and the pixel definition layer includes a first sub-layer and a second sub-layer stacked together, the material of the first sub-layer being different from the material of the second sub-layer; The pixel definition layer is vertically etched to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer; wherein, the first pixel openings are located in the display area, the second pixel openings are located in the peripheral area, the first pixel openings expose at least a portion of the first electrode layer of the display area, and the second pixel openings expose at least a portion of the first electrode layer of the peripheral area; The portion of the first sublayer located in the display area is laterally etched using a development method, so that in the display area, the orthographic projection of the first sublayer on the driving backplate is located within the orthographic projection of the second sublayer on the driving backplate.

[0006] Optionally, the step of laterally etching the portion of the first sub-layer located in the display area using a developing method includes: A first photoresist is applied to the pixel definition layer and the first electrode layer; wherein the first photoresist at least covers the pixel definition layer of the display area and the peripheral area, and the first photoresist at least covers the first electrode layer of the display area and the peripheral area; Remove the first photoresist from the display area; The portion of the first sublayer located in the display area is laterally etched using a development method; The first photoresist in the peripheral region is stripped off.

[0007] Optionally, the vertical etching of the pixel definition layer to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer includes: A second photoresist is applied to the surface of the pixel definition layer away from the driving backplane; wherein the second photoresist at least covers the pixel definition layer of the display area and the peripheral area; After exposure and development, the pixel definition layer is vertically etched using a dry etching method to form multiple first pixel openings and multiple second pixel openings in the pixel definition layer. The second photoresist on the pixel definition layer is peeled off.

[0008] Optionally, after exposure and development, the pixel definition layer is vertically etched using a dry etching method, forming multiple first pixel openings and multiple second pixel openings in the pixel definition layer, and further including: Multiple connection openings are formed in the pixel definition layer; wherein the connection openings are located in the peripheral area, the peripheral area is provided with at least one connection pad, and the connection openings expose at least a portion of the connection pad.

[0009] Optionally, the pixel definition layer further includes a third sub-layer located on the side of the first sub-layer closer to the driving backplane; the material of the first sub-layer is different from the material of the third sub-layer; In the display area, the orthographic projection of the first sub-layer on the driving backplate is located within the orthographic projection of the third sub-layer on the driving backplate.

[0010] Optionally, the material of the first sub-layer includes a metallic material, and the material of the third sub-layer includes an inorganic material; The material of the second sublayer includes inorganic materials or metallic materials that are different from the metallic materials of the first sublayer.

[0011] Optionally, the material of the first sublayer includes aluminum; The step of lateral etching of the portion of the first sub-layer located in the display area using a development method includes: The portion of the first sublayer located in the display area is laterally etched using a developer solution; wherein the developer solution includes tetramethylammonium hydroxide.

[0012] Optionally, after forming a first electrode layer on one side of the driving backplate and before forming a pixel definition layer on the side of the first electrode layer away from the driving backplate, the method for fabricating the display panel further includes: A light adjustment layer is formed on the surface of the first electrode layer away from the driving backplate; wherein the light adjustment layer is a transparent layer; The display panel includes at least two sub-pixels with different emitting colors, each sub-pixel including a first electrode located in a first electrode layer; the light adjustment layer includes multiple light adjustment structures, and in the display area, the thickness of the light adjustment structures corresponding to the first electrodes of the sub-pixels with different emitting colors is different.

[0013] Optionally, after forming a light adjustment layer on the surface of the first electrode layer away from the driving backplane and before forming a pixel definition layer on the side of the first electrode layer away from the driving backplane, the method for fabricating the display panel further includes: A first insulating layer is formed on one side of the drive backplate; wherein the first insulating layer is disposed around the first electrode and the connection pad in the first electrode layer, and the first insulating layer is disposed at least partially around the light adjustment structure; After providing the driving backplate and before forming a first electrode layer on one side of the driving backplate, the method for fabricating the display panel further includes: A second insulating layer is formed on the surface of the drive backplate; wherein the first electrode layer is located on the surface of the second insulating layer away from the drive backplate.

[0014] According to another aspect of the present invention, a display panel is provided, the display panel being manufactured by the manufacturing method of the display panel described in any embodiment of the present invention; the display panel is divided into a display area and a peripheral area; The display panel includes: Drive backplane; The first electrode layer is located on one side of the drive backplate; A pixel definition layer is located on the side of the first electrode layer away from the driving backplate. The pixel definition layer includes a first sub-layer and a second sub-layer stacked together. The material of the first sub-layer is different from the material of the second sub-layer. The pixel definition layer includes a plurality of first pixel openings and a plurality of second pixel openings. The first pixel openings are located in the display area, and the second pixel openings are located in the peripheral area. The first pixel openings expose at least a portion of the first electrode layer of the display area, and the second pixel openings expose at least a portion of the first electrode layer of the peripheral area. In the display area, the orthographic projection of the first sub-layer on the driving backplate is located within the orthographic projection of the second sub-layer on the driving backplate.

[0015] According to another aspect of the present invention, a display device is provided, the display device including the display panel described in any embodiment of the present invention.

[0016] The technical solution of this invention, through vertical etching of the pixel definition layer, forms multiple first pixel openings located in the display area and multiple second pixel openings located in the peripheral area. Forming multiple first and second pixel openings in a single etching operation reduces the number of etching steps, the number of photomasks, and the number of processes, thereby lowering costs. Furthermore, since the first and second sub-layers in the pixel definition layer are made of different materials, a development method is used to laterally etch the portion of the first sub-layer located in the display area. This ensures that the orthographic projection of the first sub-layer onto the driving backplane in the display area lies within the orthographic projection of the second sub-layer onto the driving backplane, thus forming an isolation structure. Moreover, using a development method for lateral etching avoids downward bombardment ions that could damage the first electrode layer, preventing changes in luminous brightness caused by damage to the first electrode layer. This avoids the lateral etching affecting the display panel's display effect, thereby improving the display panel's display performance.

[0017] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention; Figures 2-6 yes Figure 1 A schematic diagram of the display panel structure corresponding to each step in the process; Figure 7This is a schematic diagram of the display panel corresponding to step a1; Figure 8 This is a schematic diagram of the display panel corresponding to step a2; Figure 9 This is a schematic diagram of the display panel corresponding to step a3; Figure 10 This is a flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of the display panel corresponding to step b1; Figure 12 and Figure 13 This is a schematic diagram of the display panel corresponding to step b2; Figure 14 This is a flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of another display panel provided in an embodiment of the present invention; Figure 16 This is a schematic diagram of another display panel provided in an embodiment of the present invention; Figure 17 This is a flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention; Figures 18-30 yes Figure 17 A schematic diagram of the display panel structure corresponding to each step in the process; Figure 31 This is a schematic diagram of another display panel provided in an embodiment of the present invention; Figure 32 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0020] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0021] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0022] As mentioned in the background section, existing display panels suffer from poor display performance. The inventors discovered that this problem arises because, in related technologies, during display panel fabrication, an anode and light adjustment layer for sub-pixels are formed on the driving backplane, followed by the formation of a pixel definition layer. Then, a dry etching method is used to vertically etch the pixel definition layer in the non-display area, creating an opening in the non-display area. Finally, a dry etching method is used again to vertically and laterally etch the pixel definition layer in the display area, allowing the portion of the pixel definition layer in the display area to function as an isolation structure.

[0023] During dry etching, the etching equipment ionizes plasma, and the bombarding ions in the plasma bombard the pixel definition layer, achieving etching. Therefore, even during vertical and lateral etching of the pixel definition layer in the display area, downward bombarding ions still exist, potentially causing over-etching of the anode or light adjustment layer. This damages the light adjustment layer, affecting its flatness and consequently impacting the display panel's display performance, resulting in poor display quality.

[0024] To address the aforementioned technical problems, embodiments of the present invention provide a method for manufacturing a display panel. Figure 1 This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Figures 2-6 yes Figure 1 For a structural diagram of the display panel corresponding to each step, please refer to... Figures 2-6 The display panel is divided into a display area AA and a peripheral area NA. The peripheral area NA may at least partially surround the display area AA. The sub-pixels in the display area AA can emit light, i.e., they are luminous sub-pixels, while the virtual sub-pixels in the peripheral area NA do not emit light. Sub-pixels may include organic light-emitting diodes or miniature light-emitting diodes.

[0025] refer to Figure 1 The manufacturing methods for the display panel include: S110 provides a drive backplane.

[0026] Specifically, such as Figure 2 As shown, a driving backplane 101 is provided. The driving backplane 101 includes a pixel circuit, which can be connected to light-emitting devices in the display panel to drive the light-emitting devices to emit light. The pixel circuit may include a driving transistor that generates a driving current. The pixel circuit may also include a data writing transistor and a storage capacitor. The data writing transistor writes a data voltage to the driving transistor, causing the driving transistor to generate a driving current based on the data voltage. The storage capacitor maintains the gate potential of the driving transistor, thereby maintaining the stability of the driving current. The pixel circuit may also include a reset transistor, etc., but this is not limited thereto.

[0027] S120. A first electrode layer is formed on one side of the drive backplate.

[0028] Specifically, such as Figure 3 As shown, a first electrode layer 102 is formed on one side of the driving backplate 101, and the first electrode layer 102 includes a plurality of first electrodes 1021. Sub-pixels located in the display area AA are light-emitting sub-pixels, and sub-pixels located in the peripheral area NA are virtual sub-pixels. The first electrode 1021 located in the display area AA can be the anode of the light-emitting sub-pixel. The first electrode 1021 located in the peripheral area NA can be the anode of the virtual sub-pixel. The first electrode layer 102 may include a single conductive layer or a stack of multiple conductive layers, such as a stack of titanium nitride, aluminum, and titanium nitride, and is not limited thereto.

[0029] S130. A pixel definition layer is formed on the side of the first electrode layer away from the driving backplane; wherein the pixel definition layer covers the first electrode layer, and the pixel definition layer includes a first sub-layer and a second sub-layer stacked together, and the material of the first sub-layer is different from the material of the second sub-layer.

[0030] Specifically, such as Figure 4 As shown, a pixel definition layer 103 is formed on the side of the first electrode layer 102 away from the driving backplate 101. The pixel definition layer 103 includes a first sub-layer 1031 and a second sub-layer 1032. Along the thickness direction Z of the display panel, the first sub-layer 1031 is located between the second sub-layer 1032 and the driving backplate 101. The material of the first sub-layer 1031 is a metallic material, and the material of the second sub-layer 1032 is an inorganic material or a metallic material different from the metallic material of the first sub-layer 1031. Alternatively, the material of the first sub-layer 1031 may be an inorganic material, and the material of the second sub-layer 1032 may be a metallic material; this is not limited here.

[0031] As can be seen, the pixel definition layer 103 formed in step S130 is a full-length film layer, so the pixel definition layer 103 covers the first electrode layer 102. After the pixel definition layer 103 is etched in the subsequent process, in the final structure of the display panel, the pixel definition layer 103 does not completely cover the first electrode layer 102.

[0032] S140. Vertical etching is performed on the pixel definition layer to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer; wherein, the first pixel openings are located in the display area, the second pixel openings are located in the peripheral area, the first pixel openings expose at least a portion of the first electrode layer in the display area, and the second pixel openings expose at least a portion of the first electrode layer in the peripheral area.

[0033] Specifically, such as Figure 5 As shown, the pixel definition layer 103 is vertically etched to form a plurality of first pixel openings K1 and a plurality of second pixel openings K2 in the pixel definition layer 103. The first pixel openings K1 expose at least a portion of the first electrode 1021 of the display area AA, thereby defining the light-emitting area of ​​the sub-pixel. The second pixel openings K2 expose at least a portion of the first electrode 1021 of the peripheral area NA. Both the pixel definition layer 103 in the display area AA and the pixel definition layer 103 in the peripheral area NA are vertically etched. For example, the same mask can be used to vertically etch both the pixel definition layer 103 in the display area AA and the pixel definition layer 103 in the peripheral area NA, so that a single etching operation can form a plurality of first pixel openings K1 and a plurality of second pixel openings K2. Dry etching can be used to form the first pixel openings K1 and the second pixel openings K2.

[0034] By forming multiple first pixel openings K1 and multiple second pixel openings K2 in a single etching process, the number of etching steps, the number of photomasks, and the number of processes can be reduced, thereby lowering costs. Furthermore, it reduces the use of bombarding ions during dry etching, thus reducing damage to the first electrode layer 102 caused by bombarding ions.

[0035] It should be noted that, Figure 5 The diagram uses a second pixel opening K2 in the outer region NA as an example, but the number of second pixel openings K2 in the outer region NA is not limited.

[0036] S150. The portion of the first sublayer located in the display area is laterally etched using a developing method, so that in the display area, the orthographic projection of the first sublayer on the driving backplane is located within the orthographic projection of the second sublayer on the driving backplane.

[0037] Specifically, such as Figure 6As shown, the portion of the first sub-layer 1031 located in the display area AA is laterally etched using a development method. This ensures that the orthographic projection of the first sub-layer 1031 onto the driving backplate 101 in the display area AA lies within the orthographic projection of the second sub-layer 1032 onto the driving backplate 101. In other words, the area of ​​the orthographic projection of the first sub-layer 1031 onto the driving backplate 101 in the display area AA is smaller than the area of ​​the orthographic projection of the second sub-layer 1032 onto the driving backplate 101, thus forming an isolation structure in the display area AA (the pixel definition layer in the display area AA is an isolation structure). By ensuring that the orthographic projection of the first sub-layer 1031 onto the driving backplate 101 lies within the orthographic projection of the second sub-layer 1032 onto the driving backplate 101, it is easier to isolate subsequent vapor-deposited layers (such as emissive layers).

[0038] The first sub-layer 1031 located in the display area AA is laterally etched using a developing method. Specifically, a developing solution is used to laterally etch the portion of the first sub-layer 1031 located in the display area AA. For example, developing solution can be injected into the first pixel opening K1 located in the display area AA to etch the portion of the first sub-layer 1031 near the first pixel opening K1. The material of the first sub-layer 1031 is different from that of the second sub-layer 1032. The developing solution can be selected based on the material of the first sub-layer 1031 to ensure that etching the first sub-layer 1031 does not damage the second sub-layer 1032, nor does it damage the first electrode 1021.

[0039] Furthermore, using a development method for lateral etching can avoid downward bombardment ions that could damage the first electrode layer 102, thus preventing changes in luminous brightness caused by damage to the first electrode layer 102. This avoids the side etching affecting the display effect of the display panel and improves the display performance of the display panel.

[0040] The technical solution of this embodiment forms multiple first pixel openings in the display area and multiple second pixel openings in the peripheral area by vertically etching the pixel definition layer. Forming multiple first and second pixel openings in a single etching operation reduces the number of etching steps, the number of photomasks, and the number of processes, thereby reducing costs. Furthermore, since the first and second sub-layers in the pixel definition layer are made of different materials, a development method is used to laterally etch the portion of the first sub-layer located in the display area. This ensures that the orthographic projection of the first sub-layer onto the driving backplane in the display area lies within the orthographic projection of the second sub-layer onto the driving backplane, thus forming an isolation structure. The use of a development method for lateral etching avoids downward bombardment ions that could damage the first electrode layer, preventing changes in luminous brightness caused by damage to the first electrode layer. This avoids the lateral etching affecting the display panel's display effect, thereby improving the display panel's performance.

[0041] Based on the above technical solution, the following describes the specific method of lateral etching of the portion of the first sublayer located in the display area using a development method, but this is not intended to limit this application.

[0042] Optionally, the portion of the first sublayer located in the display area is laterally etched using a development method, including: Step a1: Apply a first photoresist to the pixel definition layer and the first electrode layer; wherein the first photoresist covers at least the pixel definition layer of the display area and the peripheral area, and the first photoresist covers at least the first electrode layer of the display area and the peripheral area.

[0043] Specifically, Figure 7 This is a schematic diagram of the display panel corresponding to step a1, for reference. Figure 7 A first photoresist 201 is coated on the pixel definition layer 103 and the first electrode layer 102. The first photoresist 201 can be a positive photoresist. The first photoresist 201 at least covers the pixel definition layer 103 of the display area AA and the peripheral area NA, and at least covers the first electrode layer 102 of the display area AA and the peripheral area NA. For example, the first photoresist 201 can be coated across the entire pixel definition layer 103 and the first electrode layer 102.

[0044] Step a2: Remove the first photoresist in the display area.

[0045] Specifically, Figure 8 This is a schematic diagram of the display panel corresponding to step a2, for reference. Figure 8 After exposing and developing the first photoresist 201 of the display area AA, the first photoresist 201 of the display area AA is removed, while the first photoresist 201 of the peripheral area NA is retained. During exposure, yellow light can be used to irradiate the first photoresist 201 of the display area AA.

[0046] Step a3: Laterally etch the portion of the first sublayer located in the display area using a development method.

[0047] Specifically, Figure 9 This is a schematic diagram of the display panel corresponding to step a3, for reference. Figure 9 The portion of the first sub-layer 1031 located in the display area AA is laterally etched using a developing method, that is, the display area is developed twice. For example, developing solution can be injected into the first pixel opening K1 located in the display area AA to etch the portion of the first sub-layer 1031 near the first pixel opening K1, so that the orthographic projection of the second sub-layer 1032 on the driving backplate 101 in the display area AA covers the orthographic projection of the first sub-layer 1031 on the driving backplate 101.

[0048] Step a4: Remove the first photoresist from the outer region.

[0049] Specifically, the first photoresist 201 in the peripheral region NA is stripped to form... Figure 6 The structure of the display panel is shown.

[0050] The following describes the manufacturing method of the display panel in conjunction with steps a1 to a4. Figure 10 This is a flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention, see reference. Figure 10 The manufacturing methods for the display panel include: S210 provides a drive backplane.

[0051] S220, A first electrode layer is formed on one side of the drive backplate.

[0052] S230. A pixel definition layer is formed on the side of the first electrode layer away from the driving backplane; wherein the pixel definition layer covers the first electrode layer, and the pixel definition layer includes a first sub-layer and a second sub-layer stacked together, and the material of the first sub-layer is different from the material of the second sub-layer.

[0053] S240. Vertical etching is performed on the pixel definition layer to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer; wherein, the first pixel openings are located in the display area, the second pixel openings are located in the peripheral area, the first pixel openings expose at least a portion of the first electrode layer in the display area, and the second pixel openings expose at least a portion of the first electrode layer in the peripheral area.

[0054] S250. Apply a first photoresist to the pixel definition layer and the first electrode layer; wherein the first photoresist covers at least the pixel definition layer of the display area and the peripheral area, and the first photoresist covers at least the first electrode layer of the display area and the peripheral area.

[0055] S260, Remove the first photoresist from the display area.

[0056] S270. Laterally etch the portion of the first sublayer located in the display area using a developing method; so that in the display area, the orthographic projection of the second sublayer on the driving backplane covers the orthographic projection of the first sublayer on the driving backplane.

[0057] S280, the first photoresist stripped from the outer perimeter area.

[0058] Based on the above technical solutions, the following describes a method of vertically etching the pixel definition layer to form multiple first pixel openings and multiple second pixel openings in the pixel definition layer, but this is not intended to limit the scope of this application.

[0059] Optionally, the pixel definition layer is vertically etched to form multiple first pixel openings and multiple second pixel openings in the pixel definition layer, including: Step b1: Apply a second photoresist to the pixel definition layer on the surface away from the driving backplane; wherein the second photoresist covers at least the pixel definition layer of the display area and the peripheral area.

[0060] Specifically, Figure 11 This is a structural diagram of the display panel corresponding to step b1, as shown below. Figure 11 As shown, a second photoresist 202 is coated on the surface of the pixel definition layer 103 away from the driving backplane 101. The second photoresist 202 can be a positive photoresist. The second photoresist 202 at least covers the pixel definition layer 103 of the display area AA and the peripheral area NA, for example, by coating the entire surface of the pixel definition layer 103 away from the driving backplane 101.

[0061] Step b2: After exposure and development, the pixel definition layer is vertically etched using a dry etching method to form multiple first pixel openings and multiple second pixel openings in the pixel definition layer.

[0062] Specifically, Figure 12 and Figure 13 This is a schematic diagram of the display panel structure corresponding to step b2. First, exposure and development are performed to remove the second photoresist at the locations where the first pixel opening K1 and the second pixel opening K2 need to be formed, thus forming... Figure 12 The structure of the display panel is shown. During exposure, the same mask can be used for illumination, reducing the number of masks required. Then, the pixel definition layer 103 is vertically etched using a dry etching method to form a structure as shown. Figure 13 The diagram shows multiple first pixel openings K1 and multiple second pixel openings K2.

[0063] Step b3: Remove the second photoresist from the pixel definition layer.

[0064] Specifically, the second photoresist 202 on the pixel definition layer 103 is peeled off to form Figure 5 The structure of the display panel is shown.

[0065] The following describes the manufacturing method of the display panel in conjunction with steps b1 to b3. Figure 14 This is a flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention. Optionally, refer to... Figure 14 The manufacturing methods for the display panel include: S310 provides a drive backplane.

[0066] S320, A first electrode layer is formed on one side of the drive backplate.

[0067] S330. A pixel definition layer is formed on the side of the first electrode layer away from the driving backplane; wherein the pixel definition layer covers the first electrode layer, and the pixel definition layer includes a first sub-layer and a second sub-layer stacked together, and the material of the first sub-layer is different from the material of the second sub-layer.

[0068] S340, A second photoresist is applied to the surface of the pixel definition layer away from the driving backplane; wherein the second photoresist covers at least the pixel definition layer of the display area and the peripheral area.

[0069] S350. After exposure and development, the pixel definition layer is vertically etched using a dry etching method to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer; wherein, the first pixel openings are located in the display area, the second pixel openings are located in the peripheral area, the first pixel openings expose at least a portion of the first electrode layer in the display area, and the second pixel openings expose at least a portion of the first electrode layer in the peripheral area.

[0070] S360, strip the second photoresist from the pixel definition layer.

[0071] S370. A first photoresist is applied to the pixel definition layer and the first electrode layer; wherein the first photoresist covers at least the pixel definition layer of the display area and the peripheral area, and the first photoresist covers at least the first electrode layer of the display area and the peripheral area.

[0072] S380, Remove the first photoresist from the display area.

[0073] S390. Laterally etch the portion of the first sublayer located in the display area using a developing method; so that in the display area, the orthographic projection of the second sublayer on the driving backplane covers the orthographic projection of the first sublayer on the driving backplane.

[0074] S391, the first photoresist stripped from the outer perimeter area.

[0075] Based on the above technical solution, optionally, after exposure and development, a dry etching method is used to vertically etch the pixel definition layer, forming multiple first pixel openings and multiple second pixel openings in the pixel definition layer. The display panel fabrication method also includes: Multiple connection openings are formed in the pixel definition layer; wherein the connection openings are located in the peripheral area, the peripheral area is provided with at least one connection pad, and the connection openings expose at least a portion of the connection pad.

[0076] in, Figure 15 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention, such as... Figure 15As shown, the connection pads can be pads for bonding test lines to the driver chip in the display panel, or pads for bonding other traces to the driver chip. The connection pads can include a first connection pad 1041 and a second connection pad 1042. The first connection pad 1041 is the pad for bonding the test lines of the display panel to the driver chip in the display panel, and the second connection pad 1042 is the pad for bonding other traces (such as power lines or reset lines) to the driver chip.

[0077] Specifically, by forming multiple connecting openings K3 simultaneously with forming the first pixel opening K1 and the second pixel opening K2, the number of photomasks can be reduced, the manufacturing process can be shortened, and costs can be reduced.

[0078] Based on the above technical solutions, Figure 16 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention. Optionally, refer to... Figure 16 The pixel definition layer 103 also includes a third sublayer 1033 located on the side of the first sublayer 1031 near the driving backplane 101; the material of the first sublayer 1031 is different from the material of the third sublayer 1033. In the display area AA, the orthographic projection of the first sub-layer 1031 on the drive backplane 101 is located within the orthographic projection of the third sub-layer 1033 on the drive backplane 101.

[0079] Specifically, the material of the first sub-layer 1031 is different from that of the third sub-layer 1033. When the first sub-layer 1031 is laterally etched in the display area AA, the third sub-layer 1033 is not etched. This ensures that in the display area AA, the orthographic projection of the first sub-layer 1031 on the driving backplate 101 is located within the orthographic projection of the third sub-layer 1033 on the driving backplate 101. In this way, an "I"-shaped isolation structure is formed, which facilitates the isolation of subsequent vapor-deposited film layers (such as light-emitting layers).

[0080] Optionally, the material of the first sublayer 1031 includes a metallic material, and the material of the third sublayer 1033 includes an inorganic material; The material of the second sublayer 1032 includes inorganic materials or metallic materials that are different from the metallic materials of the first sublayer 1031.

[0081] This facilitates the lateral etching of the first sublayer 1031 using a developer. Furthermore, when the first sublayer 1031 is laterally etched using a developer, the second sublayer 1032 and the third sublayer 1033 will not be etched. This ensures that in the display area AA, the orthographic projection of the first sublayer 1031 on the driving backplate 101 lies within the orthographic projection of the second sublayer 1032 on the driving backplate 101, and the orthographic projection of the first sublayer 1031 on the driving backplate 101 lies within the orthographic projection of the third sublayer 1033 on the driving backplate 101. Additionally, the third sublayer 1033 provides protection, preventing damage to the first electrode layer 102 during the lateral etching of the first sublayer 1031.

[0082] Optionally, the material of the first sublayer 1031 includes aluminum. Then the material of the second sublayer 1032 may include other metallic materials besides aluminum, or the material of the second sublayer 1032 may include inorganic materials.

[0083] Optionally, the portion of the first sublayer located in the display area is laterally etched using a development method, including: The portion of the first sublayer located in the display area is laterally etched using a developer solution; wherein the developer solution includes tetramethylammonium hydroxide.

[0084] Specifically, tetramethylammonium hydroxide, being an alkaline solution, laterally etches aluminum materials, achieving lateral etching of the portion of the first sub-layer 1031 located in the display area AA, i.e., lateral etching of the first sub-layer 1031 in the display area AA. Furthermore, tetramethylammonium hydroxide is virtually non-corrosive to inorganic materials such as silicon nitride and silicon oxide, allowing the second sub-layer 1032 and the third sub-layer 1033 to be made of inorganic materials that are not easily corroded by tetramethylammonium hydroxide (e.g., silicon nitride or silicon oxide). This ensures that in the display area AA, the orthographic projection of the first sub-layer 1031 onto the driving backplate 101 lies within the orthographic projection of the second sub-layer 1032 onto the driving backplate 101, and the orthographic projection of the first sub-layer 1031 onto the driving backplate 101 lies within the orthographic projection of the third sub-layer 1033 onto the driving backplate 101, thus forming an isolation structure that facilitates the isolation of subsequent vapor-deposited layers (e.g., light-emitting layers).

[0085] Based on the above technical solutions, the display panel may also include a light adjustment layer. The following description of the preparation method of the display panel is in conjunction with the light adjustment layer, but it is not intended to limit this application.

[0086] Figure 17 This is a flowchart of another method for manufacturing a display panel provided in an embodiment of the present invention. Figures 18-30 yes Figure 17 A schematic diagram of the display panel structure corresponding to each step in the process.

[0087] Optionally, refer to Figure 17The manufacturing methods for the display panel include: S410 provides a drive backplane.

[0088] S420. A second insulating layer is formed on the surface of the drive backplate.

[0089] Specifically, such as Figure 18 As shown, a second insulating layer 105 is formed on the surface of the drive backplate 101. The second insulating layer 105 can be an inorganic insulating layer or an organic insulating layer, and is not limited here.

[0090] S430. A first electrode layer is formed on one side of the drive backplate; wherein the first electrode layer is located on the surface of the second insulating layer away from the drive backplate.

[0091] Specifically, such as Figure 19 As shown, a first electrode layer 102 is formed on one side of the drive backplate 101, that is, the first electrode layer 102 is formed on the surface of the second insulating layer 105 away from the drive backplate 101. The first electrode layer 102 may include a plurality of first electrodes 1021, and may also include a first connection pad 1041 and a second connection pad 1042.

[0092] S440. A light adjustment layer is formed on the surface of the first electrode layer away from the driving backplane; wherein the light adjustment layer is a transparent layer; wherein the display panel includes at least two sub-pixels with different emitting colors, the sub-pixels include a first electrode, the first electrode is located in the first electrode layer; the light adjustment layer includes multiple light adjustment structures, and in the display area, the thickness of the light adjustment structure corresponding to the first electrode of the sub-pixel with different emitting colors is different.

[0093] The material of the light adjustment layer may include indium tin oxide (ITO), but is not limited thereto.

[0094] Specifically, such as Figure 20As shown, a light adjustment layer 106 is formed on the surface of the first electrode layer 102 away from the driving backplate 101. The light adjustment layer 106 includes multiple light adjustment structures 1061. The light adjustment structures 1061, together with surrounding reflective structures (such as the first electrode 1021 at the bottom), constitute a miniature "optical resonant cavity." This microcavity allows light of a specific wavelength to be enhanced through resonance, while suppressing other wavelengths. Different colors of light have different wavelengths, therefore, microcavities of different lengths are needed to achieve optimal resonance. Therefore, in the display area AA, the thickness of the light adjustment structures 1061 corresponding to the first electrode 1021 of sub-pixels of different emitting colors is different, thereby better improving light emission efficiency and brightness. For example, if the display panel includes sub-pixels of a first emitting color, a second emitting color, and a third emitting color, the thickness of the light adjustment structure 1061 corresponding to the first electrode 1021a of the first emitting color sub-pixel is greater than the thickness of the light adjustment structure 1061 corresponding to the first electrode 1021b of the second emitting color sub-pixel. The thickness of the light adjustment structure 1061 corresponding to the first electrode 1021c of the second emitting color sub-pixel is also greater. For example, the sub-pixel of the first emitting color is a red sub-pixel, the sub-pixel of the second emitting color is a green sub-pixel, and the sub-pixel of the third emitting color is a blue sub-pixel.

[0095] In the peripheral region NA, the thickness of the light adjustment structure 1061 corresponding to different electrodes or pads is the same.

[0096] S450, A first insulating layer is formed on one side of the drive backplane; wherein the first insulating layer is disposed around the first electrode and the connecting pad in the first electrode layer, and the first insulating layer is disposed at least partially around the light adjustment structure.

[0097] Specifically, such as Figure 21 As shown, a first insulating layer 107 is formed on one side of the drive backplane 101. The material of the first insulating layer 107 can be an organic material, such as tetraethyl orthosilicate (TEOS), which is not limited here. The first insulating layer 107 is disposed around the first electrode 1021 and the connection pad in the first electrode layer 102, which can achieve the effect of protecting the first electrode 1021 and the connection pad. The first insulating layer 107 is disposed at least partially around the light adjustment structure 1061, which can ensure that the thickness of the first insulating layer 107 is relatively high, and ensure that the first insulating layer 107 is disposed around the first electrode 1021 and the connection pad in the first electrode layer 102.

[0098] S460. A pixel definition layer is formed on the side of the first electrode layer away from the driving backplane; wherein the pixel definition layer covers the first electrode layer; the pixel definition layer includes a first sub-layer and a second sub-layer stacked together, the material of the first sub-layer being different from the material of the second sub-layer; the pixel definition layer also includes a third sub-layer located on the side of the first sub-layer closer to the driving backplane; the material of the first sub-layer being different from the material of the third sub-layer.

[0099] Specifically, such as Figure 22 As shown, a pixel definition layer 103 is formed on the side of the first electrode layer 102 away from the driving backplate 101. A portion of the pixel definition layer 103 is located on the surface of the first insulating layer 107 away from the driving backplate 101, and another portion of the pixel definition layer 103 is located on the surface of the light adjustment layer 106 away from the driving backplate 101.

[0100] S470, A second photoresist is applied to the surface of the pixel definition layer away from the driving backplane; wherein the second photoresist covers at least the pixel definition layer of the display area and the peripheral area.

[0101] Specifically, such as Figure 23 As shown, a second photoresist 202 is coated on the surface of the pixel definition layer 103 away from the driving backplane 101. The second photoresist 202 can be a positive photoresist. The second photoresist 202 covers at least the pixel definition layer 103 of the display area AA and the peripheral area NA. For example, the second photoresist 202 is coated on the entire surface of the pixel definition layer 103 away from the driving backplane 101.

[0102] S480. After exposure and development, the pixel definition layer is vertically etched using a dry etching method to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer; and a plurality of connection openings are formed in the pixel definition layer; wherein, the first pixel openings are located in the display area, the second pixel openings are located in the peripheral area, the first pixel openings expose at least a portion of the first electrode layer of the display area, and the second pixel openings expose at least a portion of the first electrode layer of the peripheral area; the connection openings are located in the peripheral area, and the peripheral area is provided with at least one connection pad, and the connection openings expose at least a portion of the connection pad.

[0103] Specifically, such as Figure 24 As shown, after exposure and development, the second photoresist above the first pixel opening of the display area AA is removed, and the second photoresist above the second pixel opening and the connecting opening of the peripheral area NA is removed.

[0104] like Figure 25 As shown, after vertical etching of the pixel definition layer 103 using dry etching, a first pixel opening K1, a second pixel opening K2, and a connection opening K3 are formed.

[0105] S490, strip the second photoresist from the pixel definition layer.

[0106] Specifically, such as Figure 26 As shown, the second photoresist on the pixel definition layer 103 is stripped.

[0107] S491. A first photoresist is applied to the entire pixel definition layer and the first electrode layer; wherein the first photoresist covers at least the pixel definition layer of the display area and the peripheral area, and the first photoresist covers at least the first electrode layer of the display area and the peripheral area.

[0108] Specifically, such as Figure 27 As shown, a first photoresist 201 is coated on the pixel definition layer 103 and the first electrode layer 102, covering the pixel definition layer 103 and the first electrode layer 102 of the display area AA and the peripheral area NA. For example, the first photoresist 201 is coated on the entire pixel definition layer 103 and the first electrode layer 102.

[0109] S492, Remove the first photoresist in the display area.

[0110] Specifically, such as Figure 28 As shown, the photoresist in the display area AA is irradiated and developed to remove the first photoresist in the display area AA.

[0111] S493. The portion of the first sublayer located in the display area is laterally etched using a developing method; so that the orthographic projection of the second sublayer on the driving backplane in the display area covers the orthographic projection of the first sublayer on the driving backplane.

[0112] Specifically, such as Figure 29 As shown, the portion of the first sublayer 1031 located in the display area AA is laterally etched using a development method, such that in the display area AA, the orthographic projection of the second sublayer 1032 on the driving backplate 101 covers the orthographic projection of the first sublayer 1031 on the driving backplate 101, and the orthographic projection of the third sublayer 1033 on the driving backplate 101 covers the orthographic projection of the first sublayer 1031 on the driving backplate 101.

[0113] By using a development method for lateral etching, downward bombardment ions can be avoided from damaging the first electrode layer 102 and the light adjustment layer 106. Damage to the first electrode layer 102 can also prevent changes in luminous brightness, thereby avoiding the impact of lateral etching on the display panel's display effect and thus improving the display panel's display performance.

[0114] S494, the first photoresist stripped from the outer perimeter area.

[0115] Specifically, such as Figure 30 As shown, the first photoresist is stripped from the peripheral region NA.

[0116] Furthermore, after stripping the first photoresist in the peripheral region NA, a light-emitting layer and a second electrode layer can be deposited. The second electrode layer may include the cathode of the sub-pixel. The light-emitting layer can be deposited only in the first pixel opening K1 of the display region AA, or it can be deposited in both the first pixel opening K1 of the display region AA and the second pixel opening K2 of the peripheral region NA; this is not limited here. Then, at least one encapsulation layer is formed to encapsulate the sub-pixel. Next, a planarization layer is formed, and then a filter is fabricated. Finally, a microlens array is fabricated to facilitate collimation and focusing of light, thereby improving the display effect.

[0117] Optionally, Figure 31 This is a schematic diagram of another display panel structure provided in an embodiment of the present invention, for reference. Figure 31 The second insulating layer 105 may have multiple vias V1, which may be filled with conductive material. The first electrode layer 102 may be connected to the drive backplate 101 through the vias.

[0118] This invention also provides a display panel, which is prepared by the method for preparing a display panel according to any embodiment of this invention. (See reference) Figure 6 The display panel is divided into a display area AA and a peripheral area NA; The display panel includes a driving backplane 101, a first electrode layer 102, and a pixel definition layer 103; The first electrode layer 102 is located on one side of the drive backplate 101; The pixel definition layer 103 is located on the side of the first electrode layer 102 away from the driving backplate 101. The pixel definition layer 103 includes a first sub-layer 1031 and a second sub-layer 1032 stacked together. The material of the first sub-layer 1031 is different from the material of the second sub-layer 1032. The pixel definition layer 103 includes a plurality of first pixel openings K1 and a plurality of second pixel openings K2. The first pixel openings K1 are located in the display area AA, and the second pixel openings K2 are located in the peripheral area NA. The first pixel openings K1 expose at least a portion of the first electrode layer 102 in the display area AA, and the second pixel openings K2 expose at least a portion of the first electrode layer 102 in the peripheral area NA. In the display area AA, the orthographic projection of the second sub-layer 1032 and the first sub-layer 1031 on the drive backplane 101 is located within the orthographic projection of the second sub-layer 1032 on the drive backplane 101.

[0119] The display panel can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, AR (Augmented Reality) display device, VR (Virtual Reality) display device, MR (Mixed Reality) display device, etc. The display panel in this embodiment can be manufactured by the display panel manufacturing method provided in any embodiment of the present invention. Therefore, the display panel in this embodiment has the same beneficial effects as the display panel manufacturing method provided in any embodiment of the present invention, and will not be described again here.

[0120] This invention also provides a display device. Figure 32 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, for reference. Figure 32 The display device 20 includes the display panel 21 provided in any embodiment of the present invention. Therefore, the display device 20 of this embodiment has the same beneficial effects as the display panel 21 provided in any embodiment of the present invention, and will not be described again here.

[0121] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0122] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for manufacturing a display panel, characterized in that, The display panel is divided into a display area and a peripheral area; The method for manufacturing the display panel includes: Provides a drive backplane; A first electrode layer is formed on one side of the drive back plate; A pixel definition layer is formed on the side of the first electrode layer away from the driving backplate; wherein, the pixel definition layer covers the first electrode layer, and the pixel definition layer includes a first sub-layer and a second sub-layer stacked together, the material of the first sub-layer being different from the material of the second sub-layer; The pixel definition layer is vertically etched to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer; wherein, the first pixel openings are located in the display area, the second pixel openings are located in the peripheral area, the first pixel openings expose at least a portion of the first electrode layer of the display area, and the second pixel openings expose at least a portion of the first electrode layer of the peripheral area; The portion of the first sublayer located in the display area is laterally etched using a development method, so that in the display area, the orthographic projection of the first sublayer on the driving backplate is located within the orthographic projection of the second sublayer on the driving backplate.

2. The method according to claim 1, characterized in that, The step of lateral etching of the portion of the first sub-layer located in the display area using a development method includes: A first photoresist is applied to the pixel definition layer and the first electrode layer; wherein the first photoresist at least covers the pixel definition layer of the display area and the peripheral area, and the first photoresist at least covers the first electrode layer of the display area and the peripheral area; Remove the first photoresist from the display area; The portion of the first sublayer located in the display area is laterally etched using a development method; The first photoresist in the peripheral region is stripped off.

3. The method according to claim 1, characterized in that, The vertical etching of the pixel definition layer to form a plurality of first pixel openings and a plurality of second pixel openings in the pixel definition layer includes: A second photoresist is applied to the surface of the pixel definition layer away from the driving backplane; wherein the second photoresist at least covers the pixel definition layer of the display area and the peripheral area; After exposure and development, the pixel definition layer is vertically etched using a dry etching method to form multiple first pixel openings and multiple second pixel openings in the pixel definition layer. The second photoresist on the pixel definition layer is peeled off.

4. The method according to claim 3, characterized in that, After exposure and development, the pixel definition layer is vertically etched using a dry etching method, forming multiple first pixel openings and multiple second pixel openings in the pixel definition layer, and also including: Multiple connection openings are formed in the pixel definition layer; wherein the connection openings are located in the peripheral area, the peripheral area is provided with at least one connection pad, and the connection openings expose at least a portion of the connection pad.

5. The method according to claim 1, characterized in that, The pixel definition layer further includes a third sublayer located on the side of the first sublayer closer to the driving backplane; the material of the first sublayer is different from the material of the third sublayer; In the display area, the orthographic projection of the first sub-layer on the driving backplate is located within the orthographic projection of the third sub-layer on the driving backplate.

6. The method according to claim 5, characterized in that, The material of the first sublayer includes metallic materials, and the material of the third sublayer includes inorganic materials; The material of the second sublayer includes inorganic materials or metallic materials that are different from the metallic materials of the first sublayer.

7. The method according to claim 6, characterized in that, The material of the first sublayer includes aluminum; The step of lateral etching of the portion of the first sub-layer located in the display area using a development method includes: The portion of the first sublayer located in the display area is laterally etched using a developer solution; wherein the developer solution includes tetramethylammonium hydroxide.

8. The method according to claim 1, characterized in that, After forming a first electrode layer on one side of the driving backplane, and before forming a pixel definition layer on the side of the first electrode layer away from the driving backplane, the method further includes: A light adjustment layer is formed on the surface of the first electrode layer away from the driving backplate; wherein the light adjustment layer is a transparent layer; The display panel includes at least two sub-pixels with different emitting colors, each sub-pixel including a first electrode located in a first electrode layer; the light adjustment layer includes multiple light adjustment structures, and in the display area, the thickness of the light adjustment structures corresponding to the first electrodes of the sub-pixels with different emitting colors is different.

9. The method according to claim 8, characterized in that, After forming an optical adjustment layer on the surface of the first electrode layer away from the driving backplane, and before forming a pixel definition layer on the side of the first electrode layer away from the driving backplane, the method further includes: A first insulating layer is formed on one side of the drive backplate; wherein the first insulating layer is disposed around the first electrode and the connection pad in the first electrode layer, and the first insulating layer is disposed at least partially around the light adjustment structure; After providing the drive backplane and before forming a first electrode layer on one side of the drive backplane, the method further includes: A second insulating layer is formed on the surface of the drive backplate; wherein the first electrode layer is located on the surface of the second insulating layer away from the drive backplate.

10. A display panel, characterized in that, The display panel is manufactured by the method for manufacturing a display panel according to any one of claims 1-9; the display panel is divided into a display area and a peripheral area; The display panel includes: Drive backplane; The first electrode layer is located on one side of the drive backplate; A pixel definition layer is located on the side of the first electrode layer away from the driving backplate. The pixel definition layer includes a first sub-layer and a second sub-layer stacked together. The material of the first sub-layer is different from the material of the second sub-layer. The pixel definition layer includes a plurality of first pixel openings and a plurality of second pixel openings. The first pixel openings are located in the display area, and the second pixel openings are located in the peripheral area. The first pixel openings expose at least a portion of the first electrode layer of the display area, and the second pixel openings expose at least a portion of the first electrode layer of the peripheral area. In the display area, the orthographic projection of the first sub-layer on the driving backplate is located within the orthographic projection of the second sub-layer on the driving backplate.

11. A display device, characterized in that, Includes the display panel as described in claim 10.

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