Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an isolation structure located on one side of the substrate, the isolation structure surrounding a plurality of isolation openings, a plurality of light emitting devices, the light emitting device comprising a first carrier transport unit, the first carrier transport unit being located in the isolation opening, and at least part of the first carrier transport unit being overlapped with the isolation structure, the plurality of light emitting devices comprising a first light emitting device and a second light emitting device, the thickness of the first carrier transport unit of the first light emitting device being different from the thickness of the first carrier transport unit of the second light emitting device. Since the resistance of the first carrier transport unit in different light emitting devices is different, the thickness of the first carrier transport unit of different light emitting devices is different, which is conducive to improving the electric leakage caused by the overlapping of the first carrier transport unit and the isolation structure, and improving the display quality of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to display panels, their manufacturing methods, and display devices. Background Technology

[0002] A display panel is a device with display functionality. Current display panels, such as those based on Organic Light Emitting Diode (OLED) and Light Emitting Diode (LED) technologies, offer advantages like high image quality, energy efficiency, thinness, and wide applicability, making them the mainstream choice for various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers. In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. The technology of not using fine metal masks is mentioned in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN117979755. CN117998900A, CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A contain information related to the technology of not using fine metal masks, for reference. However, the performance of display panels still needs improvement. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device.

[0004] The first aspect of this application provides a display panel, including:

[0005] substrate;

[0006] An isolation structure is located on one side of the substrate, and the isolation structure encloses multiple isolation openings;

[0007] The light-emitting device includes a first carrier transport unit located in an isolation opening, and at least a portion of the first carrier transport unit overlaps with the isolation structure; the light-emitting device includes a first light-emitting device and a second light-emitting device, wherein the thickness of the first carrier transport unit of the first light-emitting device is different from the thickness of the first carrier transport unit of the second light-emitting device.

[0008] In one embodiment, the first light-emitting device and the second light-emitting device are different colors;

[0009] Preferably, the thickness of the first carrier transport unit of the first light-emitting device is less than the thickness of the first carrier transport unit of the second light-emitting device; the first light-emitting device is a red light-emitting device, and the second light-emitting device is a green light-emitting device.

[0010] In one embodiment, the first carrier transport unit includes a hole transport layer, and the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device.

[0011] Preferably, the thickness of the hole transport layer is less than or equal to

[0012] Preferably, the first carrier transport unit further includes a hole injection layer located on the side of the hole transport layer closer to the substrate;

[0013] The thickness of the hole injection layer of the first light-emitting device is less than or equal to the thickness of the hole injection layer of the second light-emitting device;

[0014] Preferably, the light-emitting device further includes a light-emitting auxiliary layer located on the side of the hole transport layer away from the substrate;

[0015] The thickness of the light-emitting auxiliary layer of the first light-emitting device is less than or equal to the thickness of the light-emitting auxiliary layer of the second light-emitting device;

[0016] Preferably, the thickness of the light-emitting auxiliary layer of the first light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to

[0017] Preferably, the thickness of the light-emitting auxiliary layer of the second light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to

[0018] In one embodiment, the plurality of light-emitting devices further includes a third light-emitting device, wherein the thickness of the first carrier transport unit of the third light-emitting device is different from the thickness of the first carrier transport unit of the first light-emitting device, and is also different from the thickness of the first carrier transport unit of the second light-emitting device.

[0019] Preferably, the color of the third light-emitting device is different from the color of the first light-emitting device and also different from the color of the second light-emitting device;

[0020] Preferably, the thickness of the first carrier transport unit of the first light-emitting device is less than the thickness of the first carrier transport unit of the second light-emitting device, and the thickness of the first carrier transport unit of the second light-emitting device is less than the thickness of the first carrier transport unit of the third light-emitting device.

[0021] Preferably, the first light-emitting device is a red light-emitting device, the second light-emitting device is a green light-emitting device, and the third light-emitting device is a blue light-emitting device.

[0022] In one embodiment, the first carrier transport unit includes a hole transport layer, the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device, and the thickness of the hole transport layer of the second light-emitting device is less than the thickness of the hole transport layer of the third light-emitting device.

[0023] Preferably, the thickness of the hole transport layer is less than or equal to

[0024] Preferably, the first carrier transport unit further includes a hole injection layer located on the side of the hole transport layer closer to the substrate;

[0025] The thickness of the hole injection layer of the first light-emitting device is less than or equal to the thickness of the hole injection layer of the second light-emitting device; the thickness of the hole injection layer of the second light-emitting device is less than or equal to the thickness of the hole injection layer of the third light-emitting device.

[0026] Preferably, the light-emitting device further includes a light-emitting auxiliary layer located on the side of the hole transport layer away from the substrate;

[0027] The thickness of the light-emitting auxiliary layer of the first light-emitting device is less than or equal to the thickness of the light-emitting auxiliary layer of the second light-emitting device; the thickness of the light-emitting auxiliary layer of the second light-emitting device is less than or equal to the thickness of the light-emitting auxiliary layer of the third light-emitting device;

[0028] Preferably, the thickness of the light-emitting auxiliary layer of the first light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to

[0029] Preferably, the thickness of the light-emitting auxiliary layer of the second light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to

[0030] Preferably, the thickness of the light-emitting auxiliary layer of the third light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to

[0031] In one embodiment, the isolation structure includes a first part and a second part stacked together, the first part being located on the side of the second part away from the substrate, and the orthographic projection of the second part on the substrate being within the orthographic projection range of the first part on the substrate.

[0032] Preferably, at least a portion of the first carrier transmission unit overlaps with the second part;

[0033] Preferably, the isolation structure further includes a third part located on the side of the second part closer to the substrate, wherein the orthographic projection of the second part on the substrate is within the orthographic projection range of the third part on the substrate;

[0034] Preferably, at least a portion of the first carrier transmission unit is connected to the third part.

[0035] In one embodiment, the light-emitting device further includes a second carrier transport unit located on the side of the first carrier transport unit away from the substrate, along a direction perpendicular to the plane of the substrate, and the thickness of the second carrier transport unit is greater than the thickness of the first carrier transport unit.

[0036] Preferably, the thickness of the second carrier transport unit of the first light-emitting device is smaller than the thickness of the second carrier transport unit of the second light-emitting device; the first light-emitting device is a red light-emitting device, and the second light-emitting device is a green light-emitting device;

[0037] Preferably, the second carrier transport unit includes an electronic transport unit.

[0038] In one embodiment, the light-emitting device has a second-order nonlinear microcavity structure;

[0039] Preferably, the light-emitting device further includes a first electrode layer, a light-emitting layer, and a second electrode layer. The first electrode layer is located between the substrate and the isolation structure, and at least a portion of the first electrode layer is exposed in the isolation opening. The light-emitting layer and the second electrode layer are located in the isolation opening, and the second electrode layer is located on the side of the light-emitting layer away from the first carrier transport unit, and the second carrier transport layer is located between the light-emitting layer and the second electrode layer.

[0040] The first electrode layer includes a reflective layer, and the distance between the surface of the reflective layer near the second electrode layer and the surface of the second electrode layer away from the first electrode layer is twice the wavelength of the light emitted by the light-emitting device.

[0041] Preferably, the distance between the surface of the first carrier transport unit away from the first electrode layer and the surface of the reflective layer near the second electrode layer is less than or equal to one-quarter of the wavelength of the light emitted by the light-emitting device.

[0042] In one embodiment, along the direction away from the substrate, the first electrode layer includes a stacked first transparent electrode layer, a reflective layer, and a second transparent electrode layer;

[0043] Preferably, the reflective layer comprises metal;

[0044] Preferably, the first transparent electrode layer and the second transparent electrode layer each independently comprise a transparent metal conductive oxide.

[0045] A second aspect of this application provides a display panel, comprising:

[0046] substrate;

[0047] An isolation structure is located on one side of the substrate, and the isolation structure encloses multiple isolation openings;

[0048] Multiple light-emitting devices, each including a hole transport layer, the hole transport layer being located within an isolation opening, and at least a portion of the hole transport layer overlapping with the isolation structure; the thickness of the hole transport layer is less than or equal to

[0049] In one embodiment, the plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, wherein the thickness of the hole transport layer of the first light-emitting device is different from the thickness of the hole transport layer of the second light-emitting device.

[0050] Preferably, the first light-emitting device and the second light-emitting device are different colors;

[0051] Preferably, the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device;

[0052] Preferably, the first light-emitting device is a red light-emitting device, and the second light-emitting device is a green light-emitting device.

[0053] In one embodiment, the plurality of light-emitting devices further includes a third light-emitting device, wherein the thickness of the hole transport layer of the third light-emitting device is different from the thickness of the hole transport layer of the first light-emitting device and also different from the thickness of the hole transport layer of the second light-emitting device.

[0054] Preferably, the color of the third light-emitting device is different from the color of the first light-emitting device and also different from the color of the second light-emitting device;

[0055] Preferably, the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device, and the thickness of the hole transport layer of the second light-emitting device is less than the thickness of the hole transport layer of the third light-emitting device.

[0056] Preferably, the first light-emitting device is a red light-emitting device, the second light-emitting device is a green light-emitting device, and the third light-emitting device is a blue light-emitting device.

[0057] A third aspect of this application provides a method for manufacturing a display panel, comprising:

[0058] A first electrode layer is prepared on one side of the substrate;

[0059] An isolation structure is prepared on the side of the first electrode layer away from the substrate. The isolation structure encloses a plurality of isolation openings, and at least a portion of the first electrode layer is exposed to the isolation openings.

[0060] A first carrier transport unit is fabricated in an isolation opening to obtain a first light-emitting device and a second light-emitting device. The thickness of the first carrier transport unit of the first light-emitting device is different from the thickness of the first carrier transport unit of the second light-emitting device.

[0061] In one embodiment, the step of fabricating a first carrier transport unit in an isolation opening to obtain a first light-emitting device and a second light-emitting device includes:

[0062] A first hole injection material layer, a first hole transport material layer, and a first light-emitting auxiliary material layer are sequentially prepared in the isolation opening;

[0063] The first hole injection material layer, the first hole transport material layer, and the first light-emitting auxiliary material layer are subjected to a first patterning process. The first hole injection material layer, the first hole transport material layer, and the first light-emitting auxiliary material layer in the isolation opening corresponding to the first light-emitting device are retained to obtain the first carrier transport unit of the first light-emitting device.

[0064] A second hole injection material layer, a second hole transport material layer, and a second light-emitting auxiliary material layer are prepared in the isolation opening. The orthogonal projections of the second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer on the substrate cover the orthogonal projection of the isolation opening corresponding to the first light-emitting device on the substrate.

[0065] The second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer are subjected to a second patterning process. The second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer in the isolation opening corresponding to the second light-emitting device are retained to obtain the first carrier transport unit of the second light-emitting device. The thickness of the first hole transport material layer is different from the thickness of the second hole transport material layer.

[0066] Preferably, the first patterning process includes photolithography, and the second patterning process includes photolithography.

[0067] A fourth aspect of this application provides a display device, including the aforementioned display panel, or including a display panel prepared using the aforementioned preparation method.

[0068] According to the embodiment of this application, in the display panel, the thickness of the first carrier transport unit of the first light-emitting device is different from that of the first carrier transport unit of the second light-emitting device. Since the resistance of the first carrier transport unit in different light-emitting devices is different, the different thicknesses of the first carrier transport units in different light-emitting devices are beneficial to improving the lateral leakage caused by the overlap between the first carrier transport unit and the isolation structure, thereby improving the display quality of the display panel. Attached Figure Description

[0069] Figure 1 This is a schematic cross-sectional view of the display panel in one embodiment of this application.

[0070] Figure 2 This is a cross-sectional structural diagram of the isolation structure in one embodiment of this application.

[0071] Figure 3 This is a cross-sectional structural diagram of the isolation structure in another embodiment of this application.

[0072] Figure 4 This is a cross-sectional structural diagram of the isolation structure in another embodiment of this application.

[0073] Figure 5 for Figure 1 The diagram shows a partially enlarged view of the display panel at point A.

[0074] Figure 6 for Figure 1 Another enlarged view of the display panel at point A.

[0075] Figure 7 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0076] Figure 8 for Figure 7 The diagram shows a partially enlarged view of the display panel at point B.

[0077] Figure 9 for Figure 7 Another enlarged view of the display panel at point B.

[0078] Figure 10 for Figure 1 Another enlarged view of the display panel at point A.

[0079] Figure 11 This is a schematic diagram showing the correspondence between the microcavity structure of the light-emitting device and the wavelength of the light emitted by the light-emitting device in one embodiment of this application.

[0080] Figure 12 This is a schematic cross-sectional view of the first electrode layer in one embodiment of this application.

[0081] Figure 13 This is a schematic cross-sectional view of the display panel in another embodiment of this application.

[0082] Figure 14 This is a schematic diagram of the process for manufacturing a display panel in one embodiment of this application.

[0083] Figure 15 This is a schematic diagram of the fabrication process of the first light-emitting device and the second light-emitting device in one embodiment of this application. Detailed Implementation

[0084] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0085] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0086] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0087] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0088] The inventors of this application discovered that when fabricating light-emitting devices using a non-fine metal mask technique, the hole transport units inevitably overlap with the isolation structure during evaporation deposition, leading to lateral leakage in the light-emitting device. This affects the image quality, power consumption, low-grayscale image quality, and lifespan of the display panel. Furthermore, in different light-emitting devices, hole transport units of the same thickness have different resistances; hole transport units with lower resistance experience more severe lateral leakage, resulting in uneven image display on the panel.

[0089] In view of this, the first aspect of this application provides a display panel, referring to Figure 1 The diagram shows a cross-sectional structure of the display panel, which includes a substrate 100, an isolation structure 200, and multiple light-emitting devices 300.

[0090] Optionally, the isolation structure 200 is located on one side of the substrate 100, and the isolation structure 200 surrounds a plurality of isolation openings 210.

[0091] In one embodiment, refer to Figure 2 and Figure 3 The schematic cross-sectional view of the isolation structure shown illustrates that the isolation structure 200 includes a first part 201 and a second part 202 stacked together. The first part 201 is located on the side of the second part 202 facing away from the substrate 100, and the orthographic projection of the second part 202 onto the substrate 100 lies within the orthographic projection range of the first part 201 onto the substrate 100. For example, the second part 202 can be designed as an independent film layer, meaning there is no physical interface within the second part 202, and all parts are made of the same material, such as aluminum. Alternatively, the second part 202 can be designed as being composed of at least two stacked film layers. For example, the second part 202 can be formed by stacking two conductive film layers, the materials of which can be molybdenum and aluminum, respectively, with the molybdenum conductive film layer located between the substrate 100 and the aluminum conductive film layer. For example, the second part 202 may include a conductive sub-part, or the second part 202 itself may be a conductive structure. The second part 202 overlaps with the first electrode layer 310 of the light-emitting device 300, so that the first electrode layers 310 of adjacent light-emitting devices 300 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the first part 201 can be an organic material, an inorganic material, or a metallic material. If the first part 201 is a metallic material, the material of the second part 202 can be titanium.

[0092] Optionally, at least a portion of the first carrier transmission unit 310 is connected to the second part 202.

[0093] For example, refer to Figure 4 The schematic diagram of the cross-sectional structure of the isolation structure shown illustrates that the isolation structure 200 also includes a third part 203 located on the side of the second part 202 near the substrate 100. The orthographic projection of the second part 202 onto the substrate 100 lies within the orthographic projection range of the third part 203 onto the substrate 100. For example, the second part 202 is a conductive film layer made of aluminum, and the third part 203 is a conductive film layer made of molybdenum. In this case, the cross-section of the isolation structure 200 is I-shaped.

[0094] Optionally, at least a portion of the first carrier transmission unit 310 is connected to the third part 203.

[0095] Optionally, the light-emitting device 300 includes a first carrier transport unit 310, which is located in the isolation opening 210 and at least a portion of the first carrier transport unit 310 overlaps with the isolation structure 200; the plurality of light-emitting devices 300 include a first light-emitting device 301 and a second light-emitting device 302, wherein the thickness of the first carrier transport unit 310 of the first light-emitting device 301 is different from the thickness of the first carrier transport unit 310 of the second light-emitting device 302.

[0096] In the display panel provided according to the embodiments of this application, the thickness of the first carrier transport unit 310 of the first light-emitting device 301 is different from the thickness of the first carrier transport unit 310 of the second light-emitting device 302. Since the resistance of the first carrier transport unit 310 in different light-emitting devices 300 is different, the different thickness of the first carrier transport unit 310 in different light-emitting devices 300 is beneficial to improve the leakage caused by the first carrier transport unit 310 overlapping with the isolation structure 200, and improve the display quality of the display panel.

[0097] In one embodiment, the first light-emitting device 301 and the second light-emitting device 302 are different colors. For example, the first light-emitting device 301 is a red light-emitting device, and the second light-emitting device 302 is a green light-emitting device.

[0098] The inventors of this application discovered that, in the prior art, when the thickness of the first carrier transport unit 310 of different light-emitting devices is the same, the resistance of the first carrier transport unit 310 of the red light-emitting device is less than that of the first carrier transport unit 310 of the green light-emitting device, resulting in a greater lateral leakage current in the red light-emitting device than in the green light-emitting device. In one embodiment of this application, the thickness of the first carrier transport unit 310 of the first light-emitting device 301 is less than that of the first carrier transport unit 310 of the second light-emitting device 302. This reduces the impedance of the first carrier transport unit 310 of the first light-emitting device 301 along the plane perpendicular to the substrate 100, allowing current to flow more easily away from the substrate 100, reducing lateral leakage current in the first carrier transport unit 310 of the first light-emitting device 301, and improving leakage current. In addition, the first carrier transmission unit 310 of the first light-emitting device 301 is thinner, which helps to reduce the degree of overlap between the first carrier transmission unit 310 and the isolation structure 200, thereby reducing the continuity of the first carrier transmission unit 310, increasing the overlap impedance between the first carrier transmission unit 310 and the isolation structure 200, further reducing lateral leakage current, and improving leakage current.

[0099] In one embodiment, refer to Figure 1The first carrier transport unit 310 includes a hole transport layer 311, and the thickness of the hole transport layer 311 of the first light-emitting device 301 is less than the thickness of the hole transport layer 311 of the second light-emitting device 302.

[0100] Optionally, the thickness of the hole transport layer 311 is less than or equal to For example, it can be... or Therefore, the hole transport layer 311 is thinner, making it easier for current in the light-emitting device 300 to flow away from the substrate 100. In the direction parallel to the plane of the substrate 100, the resistance of the hole transport layer 311 is higher, and current transport is less efficient, reducing lateral leakage and improving leakage current. Furthermore, the thinner thickness of the hole transport layer 311 helps reduce the overlap between the hole transport layer 311 and the isolation structure 200, decreasing the continuity of the hole transport layer 311 and increasing the overlap impedance between the hole transport layer 311 and the isolation structure 200, further reducing lateral leakage and improving leakage current.

[0101] Optionally, refer to Figure 5 The schematic diagram of the cross-sectional structure of the display panel shown indicates that the first carrier transport unit 310 further includes a hole injection layer 312, located on the side of the hole transport layer 311 close to the substrate 100. The thickness of the hole injection layer 312 of the first light-emitting device 301 is less than or equal to the thickness of the hole injection layer 312 of the second light-emitting device 302.

[0102] Optionally, refer to Figure 6 The schematic diagram of the cross-sectional structure of the display panel shown shows that the light-emitting device 300 also includes a light-emitting auxiliary layer 313, which is located on the side of the hole transport layer 311 away from the substrate 100; the thickness of the light-emitting auxiliary layer 313 of the first light-emitting device 301 is less than or equal to the thickness of the light-emitting auxiliary layer 313 of the second light-emitting device 302.

[0103] For example, the light-emitting auxiliary layer 313 may include a prime layer to improve the contact between the first carrier transport unit 310 and the light-emitting layer 340, thereby facilitating hole injection and improving light emission efficiency.

[0104] For example, the light-emitting auxiliary layer 313 is located between the hole transport layer 311 and the light-emitting layer 340.

[0105] For example, the thickness of the light-emitting auxiliary layer 313 of the first light-emitting device 301 is greater than or equal to the thickness of the light-emitting auxiliary layer 313. and less than or equal to For example, it can be... or Therefore, the light-emitting auxiliary layer 313 of the first light-emitting device 301 is advantageous for transmitting current in the direction perpendicular to the plane of the substrate 100, while the resistance is large and current transmission is difficult in the direction parallel to the plane of the substrate 100, which can effectively avoid lateral leakage current. In addition, the light-emitting auxiliary layer 313 of the first light-emitting device 301 is not easy to overlap with the isolation structure 200. In other words, even if the light-emitting auxiliary layer 313 of the first light-emitting device 301 overlaps with the isolation structure 200, the light-emitting auxiliary layer 313 will break at the overlap point, reducing continuity or the overlap resistance will be high, further reducing the risk of lateral leakage current.

[0106] For example, the thickness of the light-emitting auxiliary layer 313 of the second light-emitting device 302 is greater than or equal to the thickness of the light-emitting auxiliary layer 313. and less than or equal to For example, it can be... or Therefore, the light-emitting auxiliary layer 313 of the second light-emitting device 302 is advantageous for transmitting current in the direction perpendicular to the plane of the substrate 100, while the resistance is large and current transmission is difficult in the direction parallel to the plane of the substrate 100, which can effectively avoid lateral leakage current. In addition, the light-emitting auxiliary layer 313 of the second light-emitting device 302 is not easy to overlap with the isolation structure 200. In other words, even if the light-emitting auxiliary layer 313 of the second light-emitting device 302 overlaps with the isolation structure 200, the light-emitting auxiliary layer 313 will break at the overlap point, reducing continuity or the overlap resistance will be high, further reducing the risk of lateral leakage current.

[0107] In one embodiment, refer to Figure 7 The schematic diagram of the cross-sectional structure of the display panel shown includes multiple light-emitting devices 300, including a third light-emitting device 303. The thickness of the first carrier transport unit 310 of the third light-emitting device 303 is different from the thickness of the first carrier transport unit 310 of the first light-emitting device 301, and also different from the thickness of the first carrier transport unit 310 of the second light-emitting device 302.

[0108] Optionally, the color of the third light-emitting device 303 is different from the color of the first light-emitting device 301 and also different from the color of the second light-emitting device 302. For example, the first light-emitting device 301 is a red light-emitting device, the second light-emitting device 302 is a green light-emitting device, and the third light-emitting device 303 is a blue light-emitting device.

[0109] The inventors of this application discovered that, when the thickness of the first carrier transport unit 310 is the same, the lateral leakage of the red light-emitting device is greater than that of the green light-emitting device, and the lateral leakage of the green light-emitting device is greater than that of the blue light-emitting device. Optionally, the thickness of the first carrier transport unit 310 of the first light-emitting device 301 is less than the thickness of the first carrier transport unit 310 of the second light-emitting device 302, and the thickness of the first carrier transport unit 310 of the second light-emitting device 302 is less than the thickness of the first carrier transport unit 310 of the third light-emitting device 303. This helps to reduce the impedance of the first carrier transport unit 310 of the first light-emitting device 301 and the second light-emitting device 302 along the plane perpendicular to the substrate 100, allowing current to flow more easily away from the substrate 100, reducing the lateral leakage of the first carrier transport unit 310, and improving leakage current. The thickness of the first carrier transmission unit 310 of the first light-emitting device 301, the second light-emitting device 302, and the third light-emitting device 303 is set according to the above rule, so that the first carrier transmission unit 310 of the first light-emitting device 301, the second light-emitting device 302, and the third light-emitting device 303 will hardly have lateral leakage, or even if there is leakage, the degree of leakage of the three is relatively close, so that the display panel has a high display quality.

[0110] In one embodiment, refer to Figure 7 The schematic diagram of the cross-sectional structure of the display panel shown shows that the first carrier transport unit 310 includes a hole transport layer 311. The thickness of the hole transport layer 311 of the first light-emitting device 301 is less than the thickness of the hole transport layer 311 of the second light-emitting device 302; the thickness of the hole transport layer of the second light-emitting device 302 is less than the thickness of the hole transport layer 311 of the third light-emitting device 303.

[0111] Optionally, the thickness of the hole transport layer 311 is less than or equal to For example, it can be... or Therefore, the hole transport layer 311 is thinner, making it easier for current in the light-emitting device 300 to flow away from the substrate 100, reducing lateral leakage current in the hole transport layer 311 and improving leakage current. Furthermore, the thinner thickness of the hole transport layer 311 helps reduce the overlap between the hole transport layer 311 and the isolation structure 200, decreasing the continuity of the hole transport layer 311 and increasing the overlap impedance between the hole transport layer 311 and the isolation structure 200, further reducing lateral leakage current and improving leakage current.

[0112] Optionally, refer to Figure 8The schematic cross-sectional view of the display panel shown indicates that the first carrier transport unit 310 further includes a hole injection layer 312 located on the side of the hole transport layer 311 closest to the substrate 100. The thickness of the hole injection layer 312 of the first light-emitting device 301 is less than or equal to the thickness of the hole injection layer 312 of the second light-emitting device 302; the thickness of the hole injection layer 312 of the second light-emitting device 302 is less than or equal to the thickness of the hole injection layer 312 of the third light-emitting device 303.

[0113] Optionally, refer to Figure 9 The schematic diagram of the cross-sectional structure of the display panel shown shows that the light-emitting device 300 also includes a light-emitting auxiliary layer 313, which is located on the side of the hole transport layer 311 away from the substrate 100; the thickness of the light-emitting auxiliary layer 313 of the first light-emitting device 301 is less than or equal to the thickness of the light-emitting auxiliary layer 313 of the second light-emitting device 302; the thickness of the light-emitting auxiliary layer 313 of the second light-emitting device 302 is less than or equal to the thickness of the light-emitting auxiliary layer 313 of the third light-emitting device 303.

[0114] For example, the thickness of the light-emitting auxiliary layer 313 of the third light-emitting device 303 is greater than or equal to the thickness of the light-emitting auxiliary layer 313. and less than or equal to For example, it can be... or Therefore, the light-emitting auxiliary layer 313 of the third light-emitting device 303 is advantageous for transmitting current in the direction perpendicular to the plane of the substrate 100, while the resistance is large and current transmission is not easy in the direction parallel to the plane of the substrate 100, which can effectively avoid lateral leakage current. In addition, the light-emitting auxiliary layer 313 of the third light-emitting device 303 is not easy to overlap with the isolation structure 200. In other words, even if the light-emitting auxiliary layer 313 of the third light-emitting device 303 overlaps with the isolation structure 200, the light-emitting auxiliary layer 313 will break at the overlap point, reducing continuity or the overlap resistance will be high, further reducing the risk of lateral leakage current.

[0115] In one embodiment, refer to Figure 10 The schematic diagram of the cross-sectional structure of the display panel shown indicates that the light-emitting device 300 also includes a second carrier transport unit 320, located on the side of the first carrier transport unit 310 away from the substrate 100. Along a direction perpendicular to the plane of the substrate 100, the thickness of the second carrier transport unit 320 is greater than the thickness of the first carrier transport unit 310. This facilitates the acquisition of a multi-order nonlinear microcavity structure.

[0116] Optionally, the thickness of the second carrier transport unit 320 of the first light-emitting device 301 is less than the thickness of the second carrier transport unit 320 of the second light-emitting device 302; the first light-emitting device 301 is a red light-emitting device, and the second light-emitting device 302 is a green light-emitting device. Since different light-emitting devices 300 emit light with different wavelengths, the thickness of the second carrier transport unit 320 of different light-emitting devices 300 needs to be matched with the thickness of the first carrier transport unit 310 to obtain a multi-order nonlinear microcavity structure and improve the efficiency of the display panel.

[0117] Optionally, the second carrier transport unit 320 includes an electron transport unit. Exemplarily, along a direction away from the substrate 100, the electron transport unit includes stacked hole blocking layers, electron transport layers, and electron injection layers, etc.

[0118] In one embodiment, refer to Figure 11 The light-emitting device 300 has a second-order nonlinear microcavity structure. Figure 11 In the diagram, the wavy line represents the wave of light emitted by the light-emitting device 300, and the length of the wavy line represents the wavelengths of the two light rays. It can be understood that the essence of the microcavity effect is light interference. When the wavelength satisfies the resonance formula L = mλ / 2ncosθ for a second-order nonlinear microcavity structure, the standing wave condition is met, and the light can be enhanced by microcavity interference. In the formula L = mλ / 2ncosθ, L represents the actual physical length of the microcavity; m represents the resonance order, controlling the density of resonant modes; λ represents the vacuum wavelength, determining the target resonant frequency; n represents the refractive index of the medium, correcting for the speed of light and optical path; and θ represents the incident angle, a key parameter for geometrically correcting the optical path difference.

[0119] Optionally, the light-emitting device 300 further includes a first electrode layer 330, a light-emitting layer 340, and a second electrode layer 350. The first electrode layer 330 is located between the substrate 100 and the isolation structure 200, and at least a portion of the first electrode layer 330 is exposed in the isolation opening 210. The light-emitting layer 340 and the second electrode layer 350 are located in the isolation opening 210, and the second electrode layer 350 is located on the side of the light-emitting layer 340 away from the first carrier transport unit 310. The second carrier transport layer 320 is located between the light-emitting layer 340 and the second electrode layer 350.

[0120] For example, the first electrode layer 330 is the anode and the second electrode layer 350 is the cathode.

[0121] For example, the first electrode layer 330 includes a reflective layer 331, and the distance between the surface of the reflective layer 331 near the second electrode layer 350 and the surface of the second electrode layer 350 away from the first electrode layer 330 is twice the wavelength of the light emitted by the light-emitting device 300. Thus, the light-emitting device 300 has a second-order nonlinear microcavity structure.

[0122] Optionally, the distance between the surface of the first carrier transport unit 310 away from the first electrode layer 330 and the surface of the reflective layer 331 near the second electrode layer 350 is less than or equal to one-quarter of the wavelength of the light emitted by the light-emitting device 300. Therefore, the first carrier transport unit 310 is thinner, which helps to alleviate lateral leakage current in the light-emitting device 300 and facilitates obtaining a light-emitting device 300 with a second-order nonlinear microcavity structure.

[0123] In one embodiment, refer to Figure 12 The schematic diagram of the cross-sectional structure of the first electrode layer shown shows that, along the direction away from the substrate 100, the first electrode layer 330 includes a first transparent electrode layer 332, a reflective layer 331, and a second transparent electrode layer 333 stacked together.

[0124] Optionally, the reflective layer 331 may comprise a metal; for example, silver.

[0125] Optionally, the first transparent electrode layer 332 and the second transparent electrode layer 333 each independently include a transparent metal conductive oxide, such as tin oxide.

[0126] Optionally, the display panel further includes a pixel defining layer 400 located between the isolation structure 200 and the substrate 100. The pixel defining layer 400 surrounds a plurality of pixel openings 410. The orthographic projection of the pixel openings 410 on the substrate 100 is within the orthographic projection range of the isolation openings 210 on the substrate 100. The first electrode layer 330 is at least partially exposed in the pixel openings 410.

[0127] Optionally, refer to Figure 13 The display panel also includes an encapsulation layer 500, which includes a first encapsulation layer 510. The first encapsulation layer 510 includes a plurality of encapsulation portions 511. The orthographic projection of the encapsulation portions 511 on the substrate 100 covers the orthographic projection of the isolation opening 210 on the substrate 100, and a portion of the encapsulation portions 511 fills the isolation opening 210.

[0128] Exemplarily, substrate 100 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or it may be a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or it may include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0129] A second aspect of this application provides a display panel, as shown in [reference]. Figure 1 The display panel includes: a substrate 100, an isolation structure 200, and multiple light-emitting devices 300.

[0130] Optionally, the isolation structure 200 is located on one side of the substrate 100, and the isolation structure 200 surrounds a plurality of isolation openings 210.

[0131] Optionally, the light-emitting device 300 includes a hole transport layer 311 located in the isolation opening 210, and at least a portion of the hole transport layer 311 overlaps with the isolation structure 200; the thickness of the hole transport layer 311 is less than or equal to For example, it can be... or Therefore, the hole transport layer 311 is thinner, making it easier for current in the light-emitting device 300 to flow away from the substrate 100, reducing lateral leakage current in the hole transport layer 311 and improving leakage current. Furthermore, the thinner thickness of the hole transport layer 311 helps reduce the overlap between the hole transport layer 311 and the isolation structure 200, decreasing the continuity of the hole transport layer 311 and increasing the overlap impedance between the hole transport layer 311 and the isolation structure 200, further reducing lateral leakage current and improving leakage current.

[0132] In one embodiment, the plurality of light-emitting devices 300 include a first light-emitting device 301 and a second light-emitting device 302, wherein the thickness of the hole transport layer 311 of the first light-emitting device 301 is different from the thickness of the hole transport layer 311 of the second light-emitting device 302.

[0133] Optionally, the first light-emitting device 301 and the second light-emitting device 302 may be of different colors. For example, the first light-emitting device 301 may be a red light-emitting device, and the second light-emitting device 302 may be a green light-emitting device.

[0134] The inventors of this application discovered that, with the same hole transport layer 311 thickness, the lateral leakage of the red light-emitting device is greater than that of the green light-emitting device. Optionally, the thickness of the hole transport layer 311 of the first light-emitting device 301 is less than the thickness of the hole transport layer 311 of the second light-emitting device 302. This helps to reduce the impedance of the hole transport layer 311 of the first light-emitting device 301 along the plane perpendicular to the substrate 100, allowing current to flow more easily away from the substrate 100, reducing lateral leakage of the hole transport layer 311, and improving leakage current. In addition, the thinner hole transport layer 311 of the first light-emitting device 301 helps to reduce the overlap between the hole transport layer 311 and the isolation structure 200, reducing the continuity of the hole transport layer 311, increasing the overlap impedance between the hole transport layer 311 and the isolation structure 200, further reducing lateral leakage current, and improving leakage current.

[0135] In one embodiment, the plurality of light-emitting devices 300 further includes a third light-emitting device 303, the thickness of the hole transport layer 311 of the third light-emitting device 303 being different from the thickness of the hole transport layer 311 of the first light-emitting device 301 and different from the thickness of the hole transport layer 311 of the second light-emitting device 303.

[0136] Optionally, the color of the third light-emitting device 303 is different from the color of the first light-emitting device 301 and also different from the color of the second light-emitting device 302. For example, the first light-emitting device 301 is a red light-emitting device, the second light-emitting device 302 is a green light-emitting device, and the third light-emitting device 303 is a blue light-emitting device.

[0137] Optionally, the thickness of the hole transport layer 311 of the first light-emitting device 301 is less than the thickness of the hole transport layer 311 of the second light-emitting device 302, and the thickness of the hole transport layer 311 of the second light-emitting device 302 is less than the thickness of the hole transport layer 311 of the third light-emitting device 303.

[0138] It is understood that the display panel in this embodiment may also include the second carrier transport layer, light-emitting layer, etc., as described above, which will not be elaborated further here.

[0139] It should be noted that the display panel in this embodiment can be combined with the display panel described above in whole or in part, which will not be elaborated further here.

[0140] The third aspect of this application provides a method for manufacturing a display panel, referring to... Figure 14 The diagram shows a process flow chart for manufacturing a display panel, which includes the following steps.

[0141] S100: A first electrode layer is prepared on one side of the substrate.

[0142] It should be noted that the substrate and the first electrode layer are the same as described above, and will not be repeated here.

[0143] S200: An isolation structure is prepared on the side of the first electrode layer away from the substrate. The isolation structure encloses a plurality of isolation openings, and at least a portion of the first electrode layer is exposed to the isolation openings.

[0144] It should be noted that the isolation structure is consistent with the previous description, and will not be elaborated further here.

[0145] S300: A first carrier transport unit is prepared in an isolation opening to obtain a first light-emitting device and a second light-emitting device. The thickness of the first carrier transport unit of the first light-emitting device is different from the thickness of the first carrier transport unit of the second light-emitting device.

[0146] In one embodiment, refer to Figure 15 The steps of preparing a first carrier transport unit in an isolation opening to obtain a first light-emitting device and a second light-emitting device include the following steps.

[0147] S310: The first hole injection material layer, the first hole transport material layer, and the first light-emitting auxiliary material layer are sequentially prepared in the isolation opening.

[0148] S320: Perform a first patterning process on the first hole injection material layer, the first hole transport material layer, and the first light-emitting auxiliary material layer, and retain the first hole injection material layer, the first hole transport material layer, and the first light-emitting auxiliary material layer in the isolation opening corresponding to the first light-emitting device to obtain the first carrier transport unit of the first light-emitting device.

[0149] It is understandable that after the first patterning process of the first hole injection material layer, the hole injection layer of the first light-emitting device is obtained; after the first patterning process of the first hole transport material layer, the hole transport layer of the first light-emitting device is obtained; and after the first patterning process of the first light-emitting auxiliary material layer, the light-emitting auxiliary layer of the first light-emitting device is obtained.

[0150] S330: A second hole injection material layer, a second hole transport material layer, and a second light-emitting auxiliary material layer are prepared in the isolation opening. The orthogonal projections of the second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer on the substrate cover the orthogonal projection of the isolation opening corresponding to the first light-emitting device on the substrate.

[0151] S340: Perform a second patterning process on the second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer, and retain the second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer in the isolation opening corresponding to the second light-emitting device to obtain the first carrier transport unit of the second light-emitting device.

[0152] The thickness of the first hole transport material layer is different from the thickness of the second hole transport material layer.

[0153] It is understandable that after the second patterning process of the second hole injection material layer, the hole injection layer of the second light-emitting device is obtained; after the second patterning process of the second hole transport material layer, the hole transport layer of the second light-emitting device is obtained; and after the second patterning process of the second light-emitting auxiliary material layer, the light-emitting auxiliary layer of the second light-emitting device is obtained.

[0154] For example, the first patterning process includes photolithography, and the second patterning process includes photolithography.

[0155] For example, the display panel further includes a first encapsulation layer, which includes multiple encapsulation portions, as described above, and will not be repeated here. The steps of fabricating a first carrier transport unit in an isolation opening to obtain a first light-emitting device and a second light-emitting device include: sequentially fabricating a first hole injection material layer, a first hole transport material layer, a first light-emitting auxiliary material layer, and an encapsulation material layer in the isolation opening; performing a first patterning process on the first hole injection material layer, the first hole transport material layer, the first light-emitting auxiliary material layer, and the encapsulation material layer, retaining the first hole injection material layer, the first hole transport material layer, the first light-emitting auxiliary material layer, and the encapsulation material layer in the isolation opening corresponding to the first light-emitting device, thereby obtaining the first carrier transport unit and the encapsulation portion of the first light-emitting device; and fabricating a second hole injection unit in the isolation opening. The second hole injection material layer, the second hole transport material layer, the second light-emitting auxiliary material layer, and the encapsulation material layer are included. The orthographic projection of the second hole injection material layer, the second hole transport material layer, the second light-emitting auxiliary material layer, and the encapsulation material layer on the substrate covers the orthographic projection of the isolation opening corresponding to the first light-emitting device on the substrate. The second hole injection material layer, the second hole transport material layer, the second light-emitting auxiliary material layer, and the encapsulation material layer are subjected to a second patterning process, and the second hole injection material layer, the second hole transport material layer, the second light-emitting auxiliary material layer, and the encapsulation material layer in the isolation opening corresponding to the second light-emitting device are retained to obtain the first carrier transport unit and the encapsulation part of the second light-emitting device.

[0156] It is understandable that when the light-emitting device includes a third light-emitting device or more light-emitting devices, the above-mentioned preparation process can be repeated to prepare more light-emitting devices, which will not be elaborated further here.

[0157] A fourth aspect of this application provides a display device, including the aforementioned display panel, or including a display panel prepared by the aforementioned preparation method.

[0158] It is understandable that, in addition to the display panel described above, a display device may also include the structures that a conventional display device should have, such as a touch panel, a housing, a driver chip, or a power supply, which will not be elaborated on further here.

[0159] It is understood that display devices may include, but are not limited to, OLED display devices. Types of display devices include, but are not limited to, computers, tablets, wearable devices, etc.

[0160] It is understandable that the display device can be used for color display or for monochrome display. The display device can be a flexible display device, etc.

[0161] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0162] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, include: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; Multiple light-emitting devices, each light-emitting device including a first carrier transport unit, the first carrier transport unit being located in the isolation opening, and at least a portion of the first carrier transport unit overlapping with the isolation structure; The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, wherein the thickness of the first carrier transport unit of the first light-emitting device is different from the thickness of the first carrier transport unit of the second light-emitting device.

2. The display panel according to claim 1, characterized in that, The first light-emitting device and the second light-emitting device are different colors; Preferably, the thickness of the first carrier transport unit of the first light-emitting device is less than the thickness of the first carrier transport unit of the second light-emitting device; the first light-emitting device is a red light-emitting device, and the second light-emitting device is a green light-emitting device.

3. The display panel according to claim 2, characterized in that, The first carrier transport unit includes a hole transport layer, and the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device. Preferably, the thickness of the hole transport layer is less than or equal to Preferably, the first carrier transport unit further includes a hole injection layer located on the side of the hole transport layer closer to the substrate; The thickness of the hole injection layer of the first light-emitting device is less than or equal to the thickness of the hole injection layer of the second light-emitting device; Preferably, the light-emitting device further includes a light-emitting auxiliary layer located on the side of the hole transport layer opposite to the substrate; The thickness of the light-emitting auxiliary layer of the first light-emitting device is less than or equal to the thickness of the light-emitting auxiliary layer of the second light-emitting device; Preferably, the thickness of the light-emitting auxiliary layer of the first light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to Preferably, the thickness of the light-emitting auxiliary layer of the second light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to 4. The display panel according to claim 1, characterized in that, The plurality of light-emitting devices further include a third light-emitting device, wherein the thickness of the first carrier transport unit of the third light-emitting device is different from the thickness of the first carrier transport unit of the first light-emitting device, and is also different from the thickness of the first carrier transport unit of the second light-emitting device. Preferably, the color of the third light-emitting device is different from the color of the first light-emitting device and also different from the color of the second light-emitting device; Preferably, the thickness of the first carrier transport unit of the first light-emitting device is less than the thickness of the first carrier transport unit of the second light-emitting device, and the thickness of the first carrier transport unit of the second light-emitting device is less than the thickness of the first carrier transport unit of the third light-emitting device. Preferably, the first light-emitting device is a red light-emitting device, the second light-emitting device is a green light-emitting device, and the third light-emitting device is a blue light-emitting device.

5. The display panel according to claim 4, characterized in that, The first carrier transport unit includes a hole transport layer, and the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device; the thickness of the hole transport layer of the second light-emitting device is less than the thickness of the hole transport layer of the third light-emitting device. Preferably, the thickness of the hole transport layer is less than or equal to Preferably, the first carrier transport unit further includes a hole injection layer located on the side of the hole transport layer closer to the substrate; The thickness of the hole injection layer of the first light-emitting device is less than or equal to the thickness of the hole injection layer of the second light-emitting device; the thickness of the hole injection layer of the second light-emitting device is less than or equal to the thickness of the hole injection layer of the third light-emitting device; Preferably, the light-emitting device further includes a light-emitting auxiliary layer located on the side of the hole transport layer opposite to the substrate; The thickness of the light-emitting auxiliary layer of the first light-emitting device is less than or equal to the thickness of the light-emitting auxiliary layer of the second light-emitting device; the thickness of the light-emitting auxiliary layer of the second light-emitting device is less than or equal to the thickness of the light-emitting auxiliary layer of the third light-emitting device; Preferably, the thickness of the light-emitting auxiliary layer of the first light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to Preferably, the thickness of the light-emitting auxiliary layer of the second light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to Preferably, the thickness of the light-emitting auxiliary layer of the third light-emitting device is greater than or equal to the thickness of the light-emitting auxiliary layer. and less than or equal to 6. The display panel according to claim 1, characterized in that, The isolation structure includes a first part and a second part stacked together, the first part being located on the side of the second part away from the substrate, and the orthographic projection of the second part on the substrate being within the orthographic projection range of the first part on the substrate; Preferably, at least a portion of the first charge carrier transmission unit overlaps with the second part; Preferably, the isolation structure further includes a third part located on the side of the second part closer to the substrate, wherein the orthographic projection of the second part on the substrate is within the orthographic projection range of the third part on the substrate; Preferably, at least a portion of the first carrier transmission unit is connected to the third part.

7. The display panel according to claim 1, characterized in that, The light-emitting device further includes a second carrier transport unit located on the side of the first carrier transport unit away from the substrate, along a direction perpendicular to the plane of the substrate, and the thickness of the second carrier transport unit is greater than the thickness of the first carrier transport unit. Preferably, the thickness of the second carrier transport unit of the first light-emitting device is less than the thickness of the second carrier transport unit of the second light-emitting device; the first light-emitting device is a red light-emitting device, and the second light-emitting device is a green light-emitting device; Preferably, the second charge carrier transport unit includes an electronic transport unit.

8. The display panel according to claim 7, characterized in that, The light-emitting device has a second-order nonlinear microcavity structure; Preferably, the light-emitting device further includes a first electrode layer, a light-emitting layer, and a second electrode layer, wherein the first electrode layer is located between the substrate and the isolation structure, and at least a portion of the first electrode layer is exposed in the isolation opening; The light-emitting layer and the second electrode layer are located in the isolation opening, and the second electrode layer is located on the side of the light-emitting layer away from the first carrier transport unit, and the second carrier transport layer is located between the light-emitting layer and the second electrode layer; The first electrode layer includes a reflective layer, and the distance between the surface of the reflective layer near the second electrode layer and the surface of the second electrode layer away from the first electrode layer is twice the wavelength of the light emitted by the light-emitting device; Preferably, the distance between the surface of the first carrier transport unit away from the first electrode layer and the surface of the reflective layer near the second electrode layer is less than or equal to one-quarter of the wavelength of the light emitted by the light-emitting device.

9. The display panel according to claim 8, characterized in that, Along a direction away from the substrate, the first electrode layer includes a stacked first transparent electrode layer, the reflective layer, and a second transparent electrode layer; Preferably, the reflective layer comprises metal; Preferably, the first transparent electrode layer and the second transparent electrode layer each independently comprise a transparent metal conductive oxide.

10. A display panel, characterized in that, include: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; A plurality of light-emitting devices, each light-emitting device including a hole transport layer, the hole transport layer being located within the isolation opening, and at least a portion of the hole transport layer overlapping the isolation structure; the thickness of the hole transport layer is less than or equal to 11. The display panel according to claim 10, characterized in that, The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device, wherein the thickness of the hole transport layer of the first light-emitting device is different from the thickness of the hole transport layer of the second light-emitting device; Preferably, the first light-emitting device and the second light-emitting device are of different colors; Preferably, the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device; Preferably, the first light-emitting device is a red light-emitting device, and the second light-emitting device is a green light-emitting device.

12. The display panel according to claim 11, characterized in that, The plurality of light-emitting devices further include a third light-emitting device, wherein the thickness of the hole transport layer of the third light-emitting device is different from the thickness of the hole transport layer of the first light-emitting device and also different from the thickness of the hole transport layer of the second light-emitting device; Preferably, the color of the third light-emitting device is different from the color of the first light-emitting device and also different from the color of the second light-emitting device; Preferably, the thickness of the hole transport layer of the first light-emitting device is less than the thickness of the hole transport layer of the second light-emitting device, and the thickness of the hole transport layer of the second light-emitting device is less than the thickness of the hole transport layer of the third light-emitting device. Preferably, the first light-emitting device is a red light-emitting device, the second light-emitting device is a green light-emitting device, and the third light-emitting device is a blue light-emitting device.

13. A method for manufacturing a display panel, characterized in that, include: A first electrode layer is prepared on one side of the substrate; An isolation structure is prepared on the side of the first electrode layer away from the substrate, the isolation structure enclosing a plurality of isolation openings, at least a portion of the first electrode layer being exposed to the isolation openings; A first carrier transport unit is fabricated in the isolation opening to obtain a first light-emitting device and a second light-emitting device. The thickness of the first carrier transport unit of the first light-emitting device is different from the thickness of the first carrier transport unit of the second light-emitting device.

14. The preparation method according to claim 13, characterized in that, The step of fabricating the first carrier transport unit in the isolation opening to obtain the first light-emitting device and the second light-emitting device includes: A first hole injection material layer, a first hole transport material layer, and a first light-emitting auxiliary material layer are sequentially prepared in the isolation opening; The first hole injection material layer, the first hole transport material layer, and the first light-emitting auxiliary material layer are subjected to a first patterning process, and the first hole injection material layer, the first hole transport material layer, and the first light-emitting auxiliary material layer in the isolation opening corresponding to the first light-emitting device are retained to obtain the first carrier transport unit of the first light-emitting device. A second hole injection material layer, a second hole transport material layer, and a second light-emitting auxiliary material layer are prepared in the isolation opening. The orthogonal projections of the second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer on the substrate cover the orthogonal projection of the isolation opening corresponding to the first light-emitting device on the substrate. The second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer are subjected to a second patterning process. The second hole injection material layer, the second hole transport material layer, and the second light-emitting auxiliary material layer in the isolation opening corresponding to the second light-emitting device are retained to obtain the first carrier transport unit of the second light-emitting device. The thickness of the first hole transport material layer is different from the thickness of the second hole transport material layer. Preferably, the first patterning process includes photolithography, and the second patterning process includes photolithography.

15. A display device, characterized in that, It includes the display panel as described in any one of claims 1 to 12, or it includes the display panel prepared using the preparation method described in claim 13 or 14.

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