Display panel, manufacturing method of display panel, and display device

Abstract

The application relates to the technical field of display, in particular to a display panel, a manufacturing method of the display panel and a display device. The display panel comprises a substrate, a pixel definition layer, a light emitting device layer, a second electrode layer and an encapsulation layer. The substrate comprises a first electrode layer, and the first electrode layer comprises a plurality of first electrodes arranged at intervals. The pixel definition layer is arranged on one side of the substrate in a first direction, and the pixel definition layer comprises pixel openings enclosed by pixel definition parts, and the pixel openings are arranged one by one corresponding to the first electrodes. The light emitting device layer is arranged on the pixel definition layer. The second electrode layer is arranged on a side of the light emitting device layer away from the substrate and covers each light emitting unit. The encapsulation layer is arranged on a side of the second electrode layer away from the substrate, and the encapsulation layer comprises a plurality of encapsulation sublayers arranged in a stacking mode along the first direction. Along the first direction and from the substrate to the side of the pixel definition layer, the refractive index of each encapsulation sublayer presents a decreasing trend layer by layer, so that the use performance of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to improve the performance of the display panel.

[0005] In a first aspect, this application provides a display panel, comprising: a substrate, including a first electrode layer, the first electrode layer including a plurality of spaced-apart first electrodes; a pixel definition layer disposed on one side of the substrate in a first direction, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, the pixel opening being disposed in correspondence with the first electrodes; a light-emitting device layer disposed on the pixel definition layer, the light-emitting device layer including a plurality of light-emitting units, each light-emitting unit being located within one of the pixel openings and stacked with the first electrodes; a second electrode layer disposed on the side of the light-emitting device layer away from the substrate and covering each light-emitting unit; and an encapsulation layer disposed on the side of the second electrode layer away from the substrate, the encapsulation layer including a plurality of encapsulation sub-layers stacked along the first direction and pointing from the substrate to the pixel definition layer along the first direction, the refractive index of each encapsulation sub-layer showing a decreasing trend layer by layer.

[0006] According to any of the foregoing embodiments of the first aspect of this application, the encapsulation layer includes a first inorganic encapsulation sublayer, an organic encapsulation sublayer, and a second inorganic encapsulation sublayer stacked along a first direction, wherein the first inorganic encapsulation sublayer is located between the second electrode layer and the organic encapsulation sublayer, and the organic encapsulation sublayer is located between the first inorganic encapsulation sublayer and the second inorganic encapsulation sublayer.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the second inorganic encapsulation sublayer is configured as multiple layers and distributed along the first direction. The refractive index of the multiple layers of the second inorganic encapsulation sublayer shows a decreasing trend layer by layer, and the refractive index of the second inorganic encapsulation sublayer closer to the organic encapsulation sublayer is greater than the refractive index of the second inorganic encapsulation sublayer farther from the organic encapsulation sublayer.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the second inorganic encapsulation sublayer is configured as 2 to 4 layers.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the second electrode layer is a surface electrode, and the first inorganic encapsulation sublayer, the organic encapsulation sublayer, and the second inorganic encapsulation sublayer are all disposed on the entire surface; or, an isolation structure is provided on the side of the pixel definition layer away from the substrate, the isolation structure encloses to form an isolation opening, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the pixel opening on the substrate at least partially overlap, the second electrode layer includes second electrodes spaced apart at each isolation opening, the first inorganic encapsulation sublayer includes inorganic encapsulation units spaced apart on the side of each second electrode away from the light-emitting device layer, and the organic encapsulation sublayer and the second inorganic encapsulation sublayer are all disposed on the entire surface.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the refractive index of each encapsulation sublayer is greater than or equal to 1.3 and less than or equal to 2.2, and the refractive index of the one closer to the second electrode layer in two adjacent encapsulation sublayers is greater than the refractive index of the other.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the refractive index of the first inorganic encapsulation sublayer is greater than or equal to 1.8 and less than or equal to 2.2.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the refractive index of the organic encapsulation sublayer is greater than or equal to 1.5 and less than or equal to 1.8.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the refractive index of the second inorganic encapsulation sublayer is greater than or equal to 1.3 and less than or equal to 1.6.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the refractive index difference between two adjacent encapsulation sublayers is greater than or equal to 0.1 and less than or equal to 0.5.

[0015] According to any of the foregoing embodiments of the first aspect of this application, along the first direction, the thickness of the encapsulation layer is greater than or equal to 1.0 μm and less than or equal to 2.0 μm.

[0016] According to any of the foregoing embodiments of the first aspect of this application, along the first direction, the thickness of the first inorganic encapsulation sublayer is greater than or equal to 30 nm and less than or equal to 80 nm.

[0017] According to any of the foregoing embodiments of the first aspect of this application, along the first direction, the thickness of the organic encapsulation sublayer is greater than or equal to 200 nm and less than or equal to 600 nm.

[0018] According to any of the foregoing embodiments of the first aspect of this application, along the first direction, the thickness of the second inorganic encapsulation sublayer is greater than or equal to 50 nm and less than or equal to 120 nm.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the materials of the first inorganic encapsulation sublayer and the second inorganic encapsulation sublayer both include at least one of silicon nitride, silicon oxide, aluminum oxide, and lithium fluoride; and / or, the material of the organic encapsulation sublayer includes at least one of polymethyl methacrylate and epoxy resin.

[0020] According to any of the foregoing embodiments of the first aspect of this application, at least one of the encapsulation sublayers is doped with a thermally conductive material; and / or, at least one of the encapsulation sublayers is doped with an ultraviolet absorbing material.

[0021] Secondly, this application provides a method for manufacturing a display panel, comprising:

[0022] A substrate is provided, the substrate including a first electrode layer, the first electrode layer including a plurality of first electrodes disposed at intervals;

[0023] A pixel definition layer, a light-emitting device layer, and a second electrode layer are sequentially formed on the side of the substrate where the first electrode layer is formed.

[0024] An encapsulation layer is formed on the side of the second electrode layer away from the substrate. The encapsulation layer includes a plurality of encapsulation sub-layers stacked along a first direction, with the encapsulation layer pointing from the side of the encapsulation layer closer to the second electrode layer to the side of the encapsulation layer away from the second electrode layer along the first direction. The refractive index of each encapsulation sub-layer decreases layer by layer.

[0025] According to any of the foregoing embodiments of the second aspect of this application, an encapsulation layer is formed on the side of the second electrode layer away from the substrate. The encapsulation layer includes a plurality of encapsulation sub-layers stacked along a first direction, extending from the side of the encapsulation layer closest to the second electrode layer to the side of the encapsulation layer furthest from the second electrode layer along the first direction. The refractive index of each encapsulation sub-layer decreases progressively, including:

[0026] At least one of silicon nitride and aluminum oxide is deposited on the side of the second electrode layer away from the substrate by atomic layer deposition or chemical vapor deposition to form the first inorganic encapsulation sublayer.

[0027] An organic encapsulation sublayer is formed by inkjet printing at least one of polymethyl methacrylate and epoxy resin on the side of the first inorganic encapsulation sublayer opposite to the second electrode layer.

[0028] At least one of silicon oxide and lithium fluoride is deposited on the side of the organic encapsulation sublayer opposite to the first inorganic encapsulation sublayer by chemical vapor deposition to form a second inorganic encapsulation sublayer.

[0029] The refractive index of the first inorganic encapsulation sublayer, the organic encapsulation sublayer, and the second inorganic encapsulation sublayer decreases layer by layer.

[0030] Thirdly, this application provides a display device including a display panel of any of the foregoing embodiments of the first aspect, or the display device including a display panel of any of the foregoing embodiments of the second aspect.

[0031] The display panel, its manufacturing method, and its display device provided in this application include a substrate, a pixel definition layer, a light-emitting device layer, a second electrode layer, and an encapsulation layer. The substrate includes a first electrode layer comprising a plurality of spaced-apart first electrodes. The pixel definition layer includes pixel defining portions and pixel openings formed by the pixel defining portions. The light-emitting device layer includes a plurality of light-emitting units, each emitting light of a different or the same color, and each light-emitting unit is located within one of the pixel openings and stacked with the first electrode layer. A second electrode layer is disposed on the side of the light-emitting device layer facing away from the substrate, and the first and second electrode layers can interact to drive the light-emitting units to emit light. The encapsulation layer is disposed on the side of the second electrode layer away from the substrate. The encapsulation layer includes multiple encapsulation sub-layers stacked along a first direction and pointing from the substrate to the pixel definition layer. The refractive index of each encapsulation sub-layer decreases layer by layer. With this configuration, when the light emitted by the light-emitting unit enters the encapsulation layer, the light can be refracted at a gentler angle between the encapsulation sub-layers, reducing the probability of reflection due to excessive refraction angle, thereby reducing optical loss and allowing more light to penetrate the encapsulation layer, thereby improving light extraction efficiency and enhancing the performance of the display panel. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0034] Figure 2 for Figure 1 Enlarged view of part A in the middle Figure 1 ;

[0035] Figure 3 for Figure 1 Enlarged view of part A in the middle Figure 2 ;

[0036] Figure 4 A flowchart illustrating the method for manufacturing a display panel provided in this application embodiment. Figure 1 ;

[0037] Figure 5A flowchart illustrating the method for manufacturing a display panel provided in this application embodiment. Figure 2 .

[0038] Explanation of reference numerals in the attached figures:

[0039] 100 - Substrate; 110 - First electrode layer; 111 - First electrode;

[0040] 200 - Pixel definition layer; 210 - Pixel limiting section; 220 - Pixel opening;

[0041] 300 - Light-emitting device layer; 310 - Light-emitting unit;

[0042] 400 - Second electrode layer;

[0043] 500 - Encapsulation layer; 510 - Encapsulation sublayer; 511 - First inorganic encapsulation sublayer; 512 - Organic encapsulation sublayer; 513 - Second inorganic encapsulation sublayer;

[0044] X - First direction.

[0045] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0046] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the preferred embodiments of this application will be described in more detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0047] It should be noted that in the description of the embodiments of this application, the terms "upper", "lower", "inner", "outer" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description, and are not intended to indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application.

[0048] Furthermore, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0049] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0050] In related technologies, to improve the lifespan of flexible OLED devices, a flexible thin-film encapsulation (TFE) process is typically used to deposit multiple encapsulation layers on the OLED light-emitting layer to encapsulate the OLED device. However, the light emitted by the OLED light-emitting layer reflects back and forth at the interfaces of the multiple encapsulation layers, causing optical losses and resulting in low light extraction efficiency, thus affecting the performance of the display panel.

[0051] In view of the above, the display panel, the method for manufacturing the display panel, and the display device provided in this application include a substrate, a pixel definition layer, a light-emitting device layer, a second electrode layer, and an encapsulation layer. The substrate includes a first electrode layer, which includes a plurality of spaced-apart first electrodes. The pixel definition layer includes pixel defining portions and pixel openings formed by the pixel defining portions. The light-emitting device layer includes a plurality of light-emitting units, each of which emits light of different or the same color. Each light-emitting unit is located within one of the pixel openings and is stacked with the first electrode layer. A second electrode layer is disposed on the side of the light-emitting device layer facing away from the substrate. The first electrode layer and the second electrode layer can interact to drive the light-emitting units to emit light. The encapsulation layer is disposed on the side of the second electrode layer away from the substrate. The encapsulation layer includes multiple encapsulation sub-layers stacked along a first direction and pointing from the substrate to the pixel definition layer. The refractive index of each encapsulation sub-layer decreases layer by layer. With this configuration, when the light emitted by the light-emitting unit enters the encapsulation layer, the light can be refracted at a gentler angle between the encapsulation sub-layers, reducing the probability of reflection due to excessive refraction angle, thereby reducing optical loss and allowing more light to penetrate the encapsulation layer, thereby improving light extraction efficiency and enhancing the performance of the display panel.

[0052] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0053] See Figures 1 to 3 This application provides a display panel, including a substrate 100, a pixel definition layer 200, a light-emitting device layer 300, a second electrode layer 400, and an encapsulation layer 500. The substrate 100 includes a first electrode layer 110, which includes a plurality of spaced-apart first electrodes 111. The pixel definition layer 200 is disposed on one side of the substrate 100 in a first direction X, and includes a pixel defining portion 210 and a pixel opening 220 formed by the pixel defining portion 210. The pixel opening 220 corresponds one-to-one with the first electrodes 111. The light-emitting device layer 300 is disposed on the pixel definition layer 200, and includes a plurality of light-emitting units 310. Each light-emitting unit 310 is located within one of the pixel openings 220 and is stacked with the first electrodes 111. The second electrode layer 400 is disposed on the side of the light-emitting device layer 300 facing away from the substrate 100 and covers each light-emitting unit 310. The encapsulation layer 500 is disposed on the side of the second electrode layer 400 away from the substrate 100. The encapsulation layer 500 includes a plurality of encapsulation sub-layers 510 stacked along the first direction X, pointing from the substrate 100 to the pixel definition layer along the first direction X. The refractive index of each encapsulation sub-layer 510 decreases layer by layer.

[0054] The substrate 100, serving as the basic support structure of the display panel, can be made of insulating substrates such as glass or flexible organic materials. The substrate 100 may include a first electrode layer 110, which can be composed of multiple spaced-apart first electrodes 111. The first electrodes 111 are arrayed on the surface of the substrate 100, and the spacing between adjacent first electrodes 111 forms an insulating region to achieve electrical isolation between the light-emitting units 310, ensuring that each light-emitting unit 310 can emit light independently. Optionally, the first electrodes 111 can be made of transparent conductive materials or metal electrode materials.

[0055] The pixel definition layer 200 is disposed on one side of the substrate 100 and can be formed by coating, photolithography, or other processes using organic or inorganic insulating materials. The pixel definition layer 200 may include a pixel defining portion 210 and a pixel opening 220 enclosed by the pixel defining portion 210. The pixel defining portion 210 serves to isolate adjacent light-emitting units 310, reducing the probability of crosstalk between adjacent light-emitting units 310 affecting the display effect.

[0056] It is understood that the light-emitting device layer 300 may include multiple light-emitting units 310, each light-emitting unit 310 being located in one of the pixel openings 220 and stacked with the first electrode 111. The light-emitting unit 310 may include a multilayer film structure such as a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, and an electron injection layer. The light-emitting layer may be made of organic light-emitting materials (such as red, green, and blue primary color materials). The light-emitting unit 310 forms an electric field through the first electrode 111 and the second electrode layer 400, driving the light-emitting material to emit light.

[0057] The second electrode layer 400 and the first electrode layer 110 together form a path for the driving current. The second electrode layer 400 can uniformly cover the entire display panel and ensure good contact with the light-emitting device layer 300. That is, the second electrode layer 400 can be a surface electrode to ensure that the current can be uniformly distributed to each light-emitting unit 310, reducing the driving voltage and improving the uniformity of light emission. One of the first electrode layer 110 and the second electrode layer 400 is an anode and the other is a cathode. For example, the first electrode layer 110 can be an anode and the second electrode layer 400 can be a cathode, so that the first electrode layer 110 and the second electrode layer 400 can interact to drive the light-emitting unit 310 to emit light.

[0058] It should be noted that the encapsulation layer 500 is disposed on the side of the second electrode layer 400 facing away from the substrate 100. The encapsulation layer 500 is used for environmental protection and optical performance optimization. That is, the encapsulation layer 500 can effectively block moisture and oxygen, alleviate the impact of external stress on the display panel, and ensure the structural stability of the display panel. The encapsulation layer 500 is composed of multiple encapsulation sub-layers 510 stacked along the first direction X, pointing from the substrate 100 to the pixel definition layer. The refractive index of each encapsulation sub-layer 510 decreases layer by layer, forming a gradient refractive index structure. Based on the principle of geometric optics, when light exits from the second electrode layer 400 and enters the encapsulation layer 500, it is refracted at the interface of adjacent encapsulation sub-layers 510. Since the refractive index decreases layer by layer, the refraction angle of the light gradually changes, which can improve the total internal reflection phenomenon caused by excessive incident angle, thereby allowing more light to penetrate the encapsulation layer 500 and improving the light extraction efficiency of the display panel.

[0059] If the encapsulation layer 500 is a single encapsulation layer 500 or a disordered stack of encapsulation sub-layers 510, it is difficult to form a refractive index gradient, and total internal reflection is likely to occur at the interface between the encapsulation layer 500 and the external medium. When light exits from the second electrode layer 400 and enters the encapsulation layer 500, due to the large difference in refractive index between the single-material encapsulation layer 500 and the external air, or the disordered refractive index setting between the encapsulation sub-layers 510, according to Snell's law, if the angle of incidence of light at the interface exceeds a critical value, most of the light will be reflected back into the display panel and cannot effectively penetrate the encapsulation layer 500. Total internal reflection not only causes a large loss of light, resulting in a decrease in the brightness of the display panel, but the reflected light will also be reflected multiple times inside the display panel, causing optical distortion problems such as glare and ghosting, thereby affecting the clarity and contrast of the displayed image.

[0060] Optionally, in some embodiments, the encapsulation layer 500 may include a plurality of inorganic encapsulation sub-layers 510 stacked along a first direction X, pointing from the substrate 100 to one side of the pixel definition layer along the first direction X, and the refractive index of each inorganic encapsulation sub-layer 510 decreases layer by layer. Specifically, a gradient structure can be formed by the refractive index difference of the inorganic materials themselves.

[0061] See Figure 2 and Figure 3 In some embodiments, the encapsulation layer 500 includes a first inorganic encapsulation sublayer 511, an organic encapsulation sublayer 512, and a second inorganic encapsulation sublayer 513 stacked along a first direction X. The first inorganic encapsulation sublayer 511 is located between the second electrode layer 400 and the organic encapsulation sublayer 512, and the organic encapsulation sublayer 512 is located between the first inorganic encapsulation sublayer 511 and the second inorganic encapsulation sublayer 513.

[0062] The first inorganic encapsulation sub-layer 511 is disposed on the side of the second electrode layer 400 facing away from the substrate 100, effectively preventing external corrosive gases such as moisture and oxygen from intruding into the display panel, reducing the probability of performance degradation due to contact with moisture or oxygen. The organic encapsulation sub-layer 512 is sandwiched between the first inorganic encapsulation sub-layer 511 and the second inorganic encapsulation sub-layer 513, absorbing external mechanical stress (such as compression, bending, etc.) and mitigating damage to the display panel caused by external impacts. In addition, the organic encapsulation sub-layer 512 can also planarize and cover or encapsulate tiny particles on the surface of the substrate 100. The second inorganic encapsulation sub-layer 513, as the outermost layer of the encapsulation layer 500, can be made of the same or different material as the first inorganic encapsulation sub-layer 511, as long as the refractive index decreases layer by layer along the first direction X from the substrate 100 to the pixel definition layer.

[0063] When light rays exit from the second electrode layer 400 and enter the first inorganic encapsulation sublayer 511, they are refracted at the interface between the first inorganic encapsulation sublayer 511 and the organic encapsulation sublayer 512. Since the refractive index of the organic encapsulation sublayer 512 is lower than that of the first inorganic encapsulation sublayer 511, the angle of refraction of the light rays is increased compared to the angle of incidence. However, the increase is controlled by the decreasing refractive index layer by layer, which can reduce the probability of total internal reflection. Then, the light rays enter the second inorganic encapsulation sublayer 513. Because the refractive index of the second inorganic encapsulation sublayer 513 is further reduced, the angle of refraction increases gradually again. Thus, the reflection loss of light rays at the interlayer interface can be effectively reduced.

[0064] In some embodiments, the second inorganic encapsulation sublayer 513 is configured as multiple layers and distributed along the first direction X. The refractive index of the multiple layers of the second inorganic encapsulation sublayer 513 shows a decreasing trend layer by layer. The refractive index of the second inorganic encapsulation sublayer 513 closer to the organic encapsulation sublayer 512 is greater than the refractive index of the second inorganic encapsulation sublayer 513 farther away from the organic encapsulation sublayer 512.

[0065] On the one hand, when light enters the multilayer second inorganic encapsulation sublayer 513 from the organic encapsulation sublayer 512, the refractive index of each second inorganic encapsulation sublayer 513 gradually decreases. When light is refracted between adjacent second inorganic encapsulation sublayers 513, the refraction angle gradually increases, thereby reducing the total internal reflection phenomenon caused by the sudden change in the interface refractive index, allowing more light to penetrate the encapsulation layer 500 and improving the light output efficiency.

[0066] On the other hand, the multilayer second inorganic encapsulation sublayer 513, through the high density and chemical stability of the inorganic material, plays a multiple role in blocking water vapor and oxygen. Each second inorganic encapsulation sublayer 513 can effectively block the penetration of external corrosive gases, and the multilayer stacking further enhances the barrier performance, while improving the impact resistance and bending resistance of the encapsulation layer 500.

[0067] In some embodiments, the second inorganic encapsulation sublayer 513 is configured as 2 to 4 layers.

[0068] It should be noted that the second inorganic encapsulation sublayer 513 can be set to 2 to 4 layers, including 2 and 4 layers. This setting can smooth the refraction path of light, reduce the refractive index change of each encapsulation sublayer 510, and make the light emitted uniformly in a direction closer to the critical angle, thereby improving the light emission efficiency while reducing scattering loss.

[0069] If the second inorganic encapsulation sublayer 513 is set to fewer than two layers (e.g., one layer), light is prone to total internal reflection at the interface between the organic encapsulation sublayer 512 and the second inorganic encapsulation sublayer 513 due to the large difference in refractive index, resulting in reduced light extraction efficiency. If the second inorganic encapsulation sublayer 513 is set to more than four layers, it will increase the difficulty of material selection and the complexity of the manufacturing process, while also leading to increased production costs.

[0070] In some embodiments, the second electrode layer 400 is a surface electrode, and the first inorganic encapsulation sublayer 511, the organic encapsulation sublayer 512, and the second inorganic encapsulation sublayer 513 are all disposed on the entire surface. That is, the second electrode layer 400 can be disposed on the side of the light-emitting device layer 300 facing away from the substrate 100.

[0071] In other embodiments, the pixel definition layer 200 has an isolation structure on the side facing away from the substrate 100. The isolation structure encloses an isolation opening, and the orthographic projection of the isolation opening onto the substrate 100 and the orthographic projection of the pixel opening 220 onto the substrate at least partially overlap. The second electrode layer 400 includes second electrodes spaced apart at each isolation opening. The first inorganic encapsulation sublayer 511 includes inorganic encapsulation units spaced apart on the side of each second electrode facing away from the light-emitting device layer 300. The organic encapsulation sublayer 512 and the second inorganic encapsulation sublayer 513 are both full-surface structures. Thus, the second electrodes can be spaced apart, thereby reducing the probability of lateral leakage between adjacent light-emitting units 310, enabling individual control of each light-emitting unit 310, and optimizing optical performance.

[0072] The orthographic projection of the pixel opening 220 onto the substrate 100 can be located within the orthographic projection of the isolation opening onto the substrate 100.

[0073] In some embodiments, the refractive index of each encapsulation sublayer 510 is greater than or equal to 1.3 and less than or equal to 2.2, and the refractive index of the one closer to the second electrode layer 400 in two adjacent encapsulation sublayers 510 is greater than the refractive index of the other.

[0074] Understandably, if the refractive index is set to less than 1.3, the light-binding ability of the encapsulation sublayer 510 is weakened, which may cause the light to lose direction during propagation within the encapsulation layer 500, making effective refraction guidance difficult. If the refractive index is set to greater than 2.2, the refractive index difference between adjacent encapsulation sublayers 510 is too large, and total internal reflection is likely to occur at the interlayer interface, resulting in light loss. Therefore, setting the refractive index of the encapsulation sublayer 510 within the range of 1.3 to 2.2 ensures that the refraction angle of the light changes smoothly between the encapsulation sublayers 510. By controlling the refractive index range, it is possible to ensure that the light penetrates the encapsulation layer 500 along a reasonable path, improving light extraction efficiency, while also considering process feasibility and cost control.

[0075] In some embodiments, the refractive index of the first inorganic encapsulation sublayer 511 is greater than or equal to 1.8 and less than or equal to 2.2.

[0076] Optionally, the refractive index of the first inorganic encapsulation sub-layer 511 can be set in the range of 1.8 to 2.2, such as 1.8, 1.95, 2, 2.1, etc., so that the refractive index of the first inorganic encapsulation sub-layer 511 matches the refractive index of the second electrode layer 400, reducing the reflection loss of light at the interface between the first inorganic encapsulation sub-layer 511 and the second electrode layer 400, optimizing the light propagation path, enabling light to smoothly enter the encapsulation layer 500, and improving the light emission efficiency of the display panel.

[0077] If the refractive index of the first inorganic encapsulation sublayer 511 is set to less than 1.8, such as 1.3 or 1.5, the refractive index difference between the first inorganic encapsulation sublayer 511 and the second electrode layer 400 will be large, and light will easily be reflected at the interface. If the refractive index of the first inorganic encapsulation sublayer 511 is set to greater than 2.2, such as 2.4 or 2.6, the refractive index difference between the first inorganic encapsulation sublayer 511 and the organic encapsulation sublayer 512 will be too large, causing the angle of light to change drastically during interlayer refraction between the first inorganic encapsulation sublayer 511 and the organic encapsulation sublayer 512, increasing the risk of total internal reflection.

[0078] In some embodiments, the refractive index of the organic encapsulation sublayer 512 is greater than or equal to 1.5 and less than or equal to 1.8.

[0079] It should be noted that if the refractive index of the organic encapsulation sublayer 512 is set to less than 1.5, the refractive index difference between it and the adjacent second inorganic encapsulation sublayer 513 will be too small, making it difficult to form an effective gradient to guide the light. If the refractive index of the organic encapsulation sublayer 512 is set to greater than 1.8, the refractive index difference between it and the first inorganic encapsulation sublayer 511 will be too small, making it difficult to fully adjust the light propagation angle and easily causing the light to be reflected back into the display panel.

[0080] Therefore, the refractive index of the organic encapsulation sublayer 512 can be set between 1.5 and 1.8, such as 1.5, 1.65, 1.7, etc., so that the organic encapsulation sublayer 512 can form a reasonable refractive index gradient with the first inorganic encapsulation sublayer 511 and the second inorganic encapsulation sublayer 513 on both sides, ensuring that light is stably refracted between layers and reducing the probability of total internal reflection loss due to abrupt changes in refractive index.

[0081] In some embodiments, the refractive index of the second inorganic encapsulation sublayer 513 is greater than or equal to 1.3 and less than or equal to 1.6.

[0082] Optionally, the refractive index of the second inorganic encapsulation sublayer 513 can be limited to the range of 1.3 to 1.6, such as 1.35, 1.5, 1.55, etc. This allows the second inorganic encapsulation sublayer 513 to form a reasonable refractive index gradient difference with the organic encapsulation sublayer 512, so that when light passes through the encapsulation layer 500, it can undergo gradual refraction at the interface, gradually adjusting the exit angle and reducing the probability of total internal reflection.

[0083] It should be noted that if the refractive index of the second inorganic encapsulation sublayer 513 is limited to less than 1.3, the refractive index difference between the second inorganic encapsulation sublayer 513 and the organic encapsulation sublayer 512 will be too large, causing severe refraction of light at the interface and increasing light scattering loss. If the refractive index of the second inorganic encapsulation sublayer 513 is limited to greater than 1.6, since the refractive index of air is close to 1, the refractive index difference between the second inorganic encapsulation sublayer 513 and air will be too large, causing a large amount of light to exceed the critical angle of total internal reflection due to an excessively large incident angle, thus resulting in reflection at the interface. The reflected light is difficult to penetrate the encapsulation layer 500 and is repeatedly reflected inside the display panel, causing light loss. As a result, not only is the light emission efficiency of the display panel reduced, affecting screen brightness and display effect, but the multiple reflections of light inside may also cause glare, ghosting, and other problems, further degrading the display quality.

[0084] In some embodiments, the refractive index difference between two adjacent encapsulation sublayers 510 is greater than or equal to 0.1 and less than or equal to 0.5.

[0085] It should be noted that if the refractive index difference between two adjacent encapsulation sub-layers 510 is less than 0.1, the refractive indices of the adjacent encapsulation sub-layers 510 are nearly identical. The change in light direction during propagation between the encapsulation sub-layers 510 is minimal, making it difficult to construct an effective gradient refraction path, thus affecting light extraction efficiency. If the refractive index difference between two adjacent encapsulation sub-layers 510 is greater than 0.5, the refractive index difference between the adjacent encapsulation sub-layers 510 is too large, resulting in a significant abrupt change in the refraction angle of light at the interface. This can easily lead to light scattering or total internal reflection, affecting the brightness and display quality of the display panel.

[0086] Therefore, the refractive index difference between two adjacent encapsulation sublayers 510 can be limited to 0.1 to 0.5. This setting ensures that light is moderately refracted at the interface of the encapsulation sublayers 510, thereby guiding the light to penetrate the encapsulation layer 500 and effectively improving the light loss caused by total internal reflection.

[0087] In practical implementation, the total transmittance formula for light passing through a G-gradient refractive index meson can be used for simulation verification. The total transmittance formula can be:

[0088]

[0089] Where n0 is the refractive index of the light-emitting device layer 300, G is the number of layers in the encapsulation sub-layer 510, and n1, ... n j Let n be the refractive index of each encapsulation sublayer 510. G+1 The refractive index of air.

[0090] See Figure 1 In some embodiments, the thickness of the encapsulation layer 500 along the first direction X is greater than or equal to 1.0 μm and less than or equal to 2.0 μm.

[0091] The thickness of the encapsulation layer 500 is H. The thickness of the encapsulation layer 500 along the first direction X can be set to 1.0μm to 2.0μm, which can ensure that each encapsulation sub-layer 510 is stacked in an orderly manner to form a stable gradient refractive index structure, so that light can be fully refracted between layers to improve light output efficiency. It can also have sufficient material thickness to block external water vapor, oxygen and other corrosive substances.

[0092] If the thickness of the encapsulation layer 500 is less than 1.0 μm, it is difficult to ensure the uniformity and density of each encapsulation sub-layer 510, which may lead to problems such as film defects and insufficient interlayer bonding, resulting in a decrease in the moisture barrier and mechanical protection performance of the encapsulation layer 500. If the thickness of the encapsulation layer 500 is greater than 2.0 μm, it will increase the overall thickness of the display panel, which is not conducive to the thinning of display products. It may also cause the light to travel a longer path within the encapsulation layer 500, resulting in increased reflection and scattering losses, reduced light extraction efficiency, and increased material costs and manufacturing difficulty.

[0093] Furthermore, since the human eye is most sensitive to a wavelength of 555nm, by controlling the combination of the total thickness of the encapsulation layer 500 and the thickness of its sub-encapsulation layer 510, a specific phase difference can be formed after light is reflected at the interfaces of each layer. When the reflected light interferes with each other, some of the light rays cancel each other out due to their opposite phases, thereby reducing the reflection loss in the 555nm band and adjacent spectra, thus improving the light transmittance and color performance of the display panel.

[0094] In some embodiments, see Figure 2 and Figure 3 Along the first direction X, the thickness of the first inorganic encapsulation sublayer 511 is greater than or equal to 30nm and less than or equal to 80nm.

[0095] In specific implementation, the thickness of the first inorganic encapsulation sub-layer 511 is h1. The thickness of the first inorganic encapsulation sub-layer 511 along the first direction X can be set to 30nm to 80nm. This setting can ensure that the first inorganic encapsulation sub-layer 511 has sufficient density to effectively block the intrusion of external water vapor and oxygen. It can also make the first inorganic encapsulation sub-layer 511 well adapted to the second electrode layer 400 and the organic encapsulation sub-layer 512 to form a reasonable refractive index gradient and optimize the light refraction path.

[0096] If the thickness of the first inorganic encapsulation sublayer 511 along the first direction X is set to less than 30 nm, it is easy to cause insufficient barrier performance of the first inorganic encapsulation sublayer 511. If the thickness of the first inorganic encapsulation sublayer 511 along the first direction X is set to greater than 80 nm, it will increase interlayer stress, affect the structural stability of the encapsulation layer 500, and also easily lead to increased light reflection loss and reduced light extraction efficiency.

[0097] In some embodiments, along the first direction X, the thickness of the organic encapsulation sublayer 512 is greater than or equal to 200 nm and less than or equal to 600 nm.

[0098] It should be noted that the thickness of the organic encapsulation layer 500 is h2. If the thickness of the organic encapsulation sublayer 512 is set to less than 200nm, the buffering performance will be insufficient, making it difficult to withstand external pressure. If the thickness of the organic encapsulation sublayer 512 is set to greater than 600nm, the overall thickness of the encapsulation layer 500 will increase, affecting the thinning of the display panel. Furthermore, excessive thickness may cause optical distortion, affecting the refractive index gradient balance and reducing light extraction efficiency and display quality.

[0099] Therefore, the thickness of the organic encapsulation sublayer 512 along the first direction X can be limited to 200nm to 600nm, so that the organic encapsulation sublayer 512 has good flexibility, effectively absorbs external stress, and at the same time assists light to be gently refracted between the layers of the encapsulation layer 500.

[0100] In some embodiments, along the first direction X, the thickness of the second inorganic encapsulation sublayer 513 is greater than or equal to 50 nm and less than or equal to 120 nm.

[0101] In a specific implementation, the thickness of the second inorganic encapsulation sublayer 513 is h3. The thickness of the second inorganic encapsulation sublayer 513 along the first direction X can be limited to 50nm to 120nm, so that the second inorganic encapsulation sublayer 513 has sufficient density and forms a reasonable refractive index gradient difference with the organic encapsulation sublayer 512, ensuring that light undergoes appropriate refraction between layers, reducing reflection loss and improving light extraction efficiency.

[0102] If the thickness of the second inorganic encapsulation sublayer 513 is less than 50nm, the barrier effect will decrease. If the thickness of the second inorganic encapsulation sublayer 513 is greater than 120nm, the overall thickness of the encapsulation layer 500 will increase, and the reflection and scattering of light within the layer will intensify, affecting the brightness and clarity of the display panel, and increasing manufacturing costs and process difficulty.

[0103] In some embodiments, the materials of the first inorganic encapsulation sublayer 511 and the second inorganic encapsulation sublayer 513 both include at least one of silicon nitride, silicon oxide, aluminum oxide, and lithium fluoride. In other embodiments, the material of the organic encapsulation sublayer 512 includes at least one of polymethyl methacrylate and epoxy resin.

[0104] Silicon nitride, silicon oxide, aluminum oxide, and lithium fluoride possess excellent chemical stability and a dense structure, effectively preventing the intrusion of corrosive substances such as moisture and oxygen, thus protecting the light-emitting device layer 300, the first electrode layer 110, and the second electrode layer 400 within the display panel. Silicon nitride exhibits good hardness and wear resistance, enhancing the mechanical strength of the encapsulation layer 500. Silicon oxide is chemically stable and provides excellent insulation. Alumina's high barrier properties significantly improve the environmental protection capabilities of the encapsulation layer 500.

[0105] In a specific implementation, if the first inorganic encapsulation sublayer 511 or the second inorganic encapsulation sublayer 513 includes at least two of silicon nitride, silicon oxide, aluminum oxide and lithium fluoride, for example, the second inorganic encapsulation sublayer 513 includes silicon oxide and lithium fluoride, then when forming the second inorganic encapsulation sublayer 513, silicon oxide and lithium fluoride can be deposited layer by layer, that is, one of silicon oxide and lithium fluoride is deposited first, and then the other is deposited.

[0106] In other embodiments, the organic encapsulation sublayer 512 may be made of at least one of polymethyl methacrylate (PMMA) and epoxy resin. PMMA has good optical transparency and flexibility, and can absorb external mechanical stress, preventing the encapsulation layer 500 from cracking due to external forces such as compression and bending. Epoxy resin has good adhesion and chemical corrosion resistance, and can be tightly bonded to the first inorganic encapsulation sublayer 511 and the second inorganic encapsulation sublayer 513.

[0107] By working together, the first inorganic encapsulation sublayer 511, the organic encapsulation sublayer 512, and the second inorganic encapsulation sublayer 513 can form a gradient refractive index structure, thereby reducing reflection loss and improving the light emission efficiency of the display panel.

[0108] In some embodiments, at least one of the encapsulation sublayers 510 is doped with a thermally conductive material. In other embodiments, at least one of the encapsulation sublayers 510 is doped with a UV-absorbing material.

[0109] Optionally, at least one of the encapsulation sub-layers 510 may be doped with a thermally conductive material to improve the heat dissipation performance of the display panel. During operation, the internal light-emitting device layer 300 of the display panel generates heat. If this heat cannot be dissipated in time, it will accelerate material aging and reduce display performance and lifespan. By doping the encapsulation sub-layers 510 with materials of high thermal conductivity, such as metal oxides or graphene, heat can be conducted to the outside of the display panel, effectively reducing the operating temperature of the display panel.

[0110] In other embodiments, an ultraviolet-absorbing material, such as an organic ultraviolet absorber or inorganic nanoparticles, can be disposed in the encapsulation sublayer 510 to effectively inhibit ultraviolet damage to the display panel, extend the service life of the display panel, and avoid problems such as color shift and brightness decay caused by material aging, thus ensuring the stability and color accuracy of the displayed image. Furthermore, the ultraviolet-absorbing material can absorb ultraviolet rays, thus protecting the eyes.

[0111] Based on the above embodiments, see Figure 4 This application provides a method for manufacturing a display panel, including:

[0112] S101: A substrate 100 is provided, the substrate 100 includes a first electrode layer 110, the first electrode layer 110 includes a plurality of first electrodes 111 disposed at intervals.

[0113] In practice, a conductive metal thin film can be deposited on the surface of the substrate 100 using physical vapor deposition, a mask pattern can be formed on the thin film using photolithography, and finally the excess part can be removed by etching to form multiple spaced first electrodes 111.

[0114] S102: A pixel definition layer 200, a light-emitting device layer 300, and a second electrode layer 400 are sequentially formed on the side of the substrate 100 where the first electrode layer 110 is formed.

[0115] The light-emitting device layer 300 may include a light-emitting unit 310.

[0116] It is understandable that a pixel definition layer 200 can be formed on the surface of the first electrode layer 110 through processes such as spin coating and photolithography. The pixel definition layer 200, by forming a pixel limiting part 210 and a pixel opening 220, plays the role of isolating and accommodating different light-emitting units 310.

[0117] Then, light-emitting material can be deposited in the pixel opening 220 of the pixel definition layer 200 by vapor deposition to form a light-emitting device layer 300. Afterwards, a second electrode layer 400 is formed on the surface of the light-emitting device layer 300 by vacuum vapor deposition or sputtering. The second electrode layer 400 cooperates with the first electrode layer 110 to form an electric field that drives the light-emitting device layer 300 to emit light.

[0118] S103: An encapsulation layer 500 is formed on the side of the second electrode layer 400 away from the substrate 100. The encapsulation layer 500 includes a plurality of encapsulation sub-layers 510 stacked along the first direction X, pointing from the side of the encapsulation layer 500 close to the second electrode layer 400 to the side of the encapsulation layer 500 away from the second electrode layer 400 along the first direction X. The refractive index of each encapsulation sub-layer 510 decreases layer by layer.

[0119] In practice, each encapsulation sublayer 510 can be formed sequentially through processes such as physical vapor deposition, chemical vapor deposition, or spin coating.

[0120] Along the first direction X, from the side of the encapsulation layer 500 closest to the second electrode layer 400 to the side furthest from the second electrode layer 400, the refractive index of each encapsulation sub-layer 510 decreases layer by layer. This orderly change in the refractive index of each encapsulation sub-layer 510 allows for continuous and appropriate refraction of light as it propagates between layers, effectively reducing reflection loss and improving the light extraction efficiency of the display panel. Furthermore, the synergistic effect of the encapsulation sub-layers 510 with different materials and refractive indices can block corrosive substances such as external moisture and oxygen, and also buffer mechanical stress.

[0121] In some embodiments, see Figure 5 Step S103 may include:

[0122] S1031: At least one of silicon nitride and aluminum oxide is deposited on the side of the second electrode layer 400 away from the substrate 100 by atomic layer deposition or chemical vapor deposition to form the first inorganic packaging sublayer 511.

[0123] Optionally, when using atomic layer deposition (ALD), a dense silicon nitride or aluminum oxide film is formed by alternating self-limiting chemical reactions of gaseous precursors on the surface of the second electrode layer 400, ensuring the high barrier performance of the first inorganic encapsulation sublayer 511 against water vapor and oxygen, while also achieving a tight bond with the second electrode layer 400. Alternatively, chemical vapor deposition (CVD) involves a chemical reaction of gaseous reactants in a high-temperature or plasma environment to deposit an inorganic material film on the surface of the second electrode layer 400, thereby forming the first inorganic encapsulation sublayer 511.

[0124] S1032: An organic encapsulation sublayer 512 is formed by inkjet printing at least one of polymethyl methacrylate and epoxy resin on the side of the first inorganic encapsulation sublayer 511 opposite to the second electrode layer 400.

[0125] During inkjet printing, at least one of polymethyl methacrylate and epoxy resin can be mixed into a suitable printing solution to ensure stable droplet ejection and accurate deposition during the printing process. During printing, the printhead sprays the prepared solution onto the surface of the first inorganic encapsulation sublayer 511 according to a preset pattern and path to form the organic encapsulation sublayer 512.

[0126] S1033: At least one of silicon oxide and lithium fluoride is deposited on the side of the organic encapsulation sublayer 512 away from the first inorganic encapsulation sublayer 511 by chemical vapor deposition process to form the second inorganic encapsulation sublayer 513.

[0127] The refractive indices of the first inorganic encapsulation sublayer 511, the organic encapsulation sublayer 512, and the second inorganic encapsulation sublayer 513 decrease layer by layer.

[0128] The principle of chemical vapor deposition is to utilize gaseous reactants to undergo a chemical reaction in a high-temperature or plasma environment to generate solid deposition products. In step S1033, silicon oxide can be used as the target material. By controlling parameters such as the flow rate, temperature, and pressure of the reaction gas, the reaction products are uniformly deposited on the surface of the organic encapsulation sublayer 512, gradually forming the second inorganic encapsulation sublayer 513.

[0129] The refractive index of the encapsulation sublayer 510 made of silicon nitride or aluminum oxide is generally greater than that of the encapsulation sublayer 510 made of silicon oxide or lithium fluoride. Thus, by using different materials, the refractive index of the first inorganic encapsulation sublayer 511 is made greater than that of the second inorganic encapsulation sublayer 513.

[0130] In some embodiments, when depositing one of the encapsulation sublayers 510, the encapsulation sublayer 510 can be formed by multiple depositions so that one encapsulation sublayer 510 includes multiple encapsulation sublayers. It is understood that by adjusting the deposition thickness of the encapsulation sublayers, the refractive index transition between adjacent encapsulation sublayers 510 can be made smoother, the light refraction path between adjacent encapsulation sublayers 510 can be optimized, thereby improving the light extraction efficiency.

[0131] Based on the above embodiments, this application provides a display device including the display panel of any of the above embodiments.

[0132] The specific details of the display panel have been described in detail in the above embodiments and will not be repeated here. The display device may include devices with display functions such as mobile phones, computers, tablets, and televisions, and this application does not limit them.

[0133] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A display panel, characterized in that, include: The substrate includes a first electrode layer, the first electrode layer including a plurality of first electrodes disposed at intervals; A pixel definition layer is disposed on one side of the substrate in a first direction. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion. The pixel opening is disposed in a one-to-one correspondence with the first electrode. A light-emitting device layer is disposed on the pixel definition layer. The light-emitting device layer includes a plurality of light-emitting units, each of which is located in one of the pixel openings and is stacked with the first electrode. The second electrode layer is disposed on the side of the light-emitting device layer away from the substrate and covers each of the light-emitting units; An encapsulation layer is disposed on the side of the second electrode layer away from the substrate. The encapsulation layer includes a plurality of encapsulation sub-layers stacked along the first direction and pointing from the substrate to the pixel definition layer along the first direction. The refractive index of each encapsulation sub-layer decreases layer by layer.

2. The display panel according to claim 1, characterized in that, The encapsulation layer includes a first inorganic encapsulation sublayer, an organic encapsulation sublayer, and a second inorganic encapsulation sublayer stacked along the first direction. The first inorganic encapsulation sublayer is located between the second electrode layer and the organic encapsulation sublayer, and the organic encapsulation sublayer is located between the first inorganic encapsulation sublayer and the second inorganic encapsulation sublayer. Preferably, the second inorganic encapsulation sublayer is configured as multiple layers and distributed along the first direction, and the refractive index of the multiple layers of the second inorganic encapsulation sublayer decreases layer by layer, with the refractive index of the second inorganic encapsulation sublayer closer to the organic encapsulation sublayer being greater than the refractive index of the second inorganic encapsulation sublayer farther from the organic encapsulation sublayer; Preferably, the second inorganic encapsulation sublayer is configured with 2 to 4 layers; Preferably, the second electrode layer is a surface electrode, and the first inorganic encapsulation sublayer, the organic encapsulation sublayer, and the second inorganic encapsulation sublayer are all disposed on the entire surface; Alternatively, the pixel definition layer has an isolation structure on the side facing away from the substrate, the isolation structure encloses and forms an isolation opening, the orthographic projection of the isolation opening on the substrate and the orthographic projection of the pixel opening on the substrate at least partially overlap, the second electrode layer includes second electrodes spaced apart at each of the isolation openings, the first inorganic encapsulation sublayer includes inorganic encapsulation units spaced apart on the side of each of the second electrodes facing away from the light-emitting device layer, and both the organic encapsulation sublayer and the second inorganic encapsulation sublayer are provided on the entire surface.

3. The display panel according to claim 2, characterized in that, The refractive index of each of the encapsulation sublayers is greater than or equal to 1.3 and less than or equal to 2.2, and the refractive index of the one closer to the second electrode layer in two adjacent encapsulation sublayers is greater than the refractive index of the other. Preferably, the refractive index of the first inorganic encapsulation sublayer is greater than or equal to 1.8 and less than or equal to 2.2; Preferably, the refractive index of the organic encapsulation sublayer is greater than or equal to 1.5 and less than or equal to 1.8; Preferably, the refractive index of the second inorganic encapsulation sublayer is greater than or equal to 1.3 and less than or equal to 1.

6.

4. The display panel according to claim 3, characterized in that, The refractive index difference between two adjacent encapsulation sublayers is greater than or equal to 0.1 and less than or equal to 0.

5.

5. The display panel according to claim 2, characterized in that, Along the first direction, the thickness of the encapsulation layer is greater than or equal to 1.0 μm and less than or equal to 2.0 μm; Preferably, along the first direction, the thickness of the first inorganic encapsulation sublayer is greater than or equal to 30 nm and less than or equal to 80 nm; Preferably, along the first direction, the thickness of the organic encapsulation sublayer is greater than or equal to 200 nm and less than or equal to 600 nm; Preferably, along the first direction, the thickness of the second inorganic encapsulation sublayer is greater than or equal to 50 nm and less than or equal to 120 nm.

6. The display panel according to claim 2, characterized in that, The materials of the first inorganic encapsulation sublayer and the second inorganic encapsulation sublayer both include at least one of silicon nitride, silicon oxide, aluminum oxide, and lithium fluoride; And / or, the material of the organic encapsulation sublayer includes at least one of polymethyl methacrylate and epoxy resin.

7. The display panel according to any one of claims 1 to 6, characterized in that, At least one of the encapsulation sublayers is doped with a thermally conductive material; And / or, at least one of the said encapsulation sublayers is doped with a UV-absorbing material.

8. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, the substrate including a first electrode layer, the first electrode layer including a plurality of first electrodes disposed at intervals; A pixel definition layer, a light-emitting device layer, and a second electrode layer are sequentially formed on the side of the substrate where the first electrode layer is formed; An encapsulation layer is formed on the side of the second electrode layer away from the substrate. The encapsulation layer includes a plurality of encapsulation sub-layers stacked along a first direction, pointing from the side of the encapsulation layer closest to the second electrode layer to the side of the encapsulation layer away from the second electrode layer along the first direction. The refractive index of each encapsulation sub-layer decreases layer by layer.

9. The manufacturing method according to claim 8, characterized in that, An encapsulation layer is formed on the side of the second electrode layer facing away from the substrate. The encapsulation layer includes a plurality of encapsulation sub-layers stacked along a first direction, extending from the side of the encapsulation layer closest to the second electrode layer to the side of the encapsulation layer furthest from the second electrode layer. The refractive index of each encapsulation sub-layer decreases progressively, including: At least one of silicon nitride and aluminum oxide is deposited on the side of the second electrode layer away from the substrate by atomic layer deposition or chemical vapor deposition to form a first inorganic encapsulation sublayer. An organic encapsulation sublayer is formed by inkjet printing at least one of polymethyl methacrylate and epoxy resin on the side of the first inorganic encapsulation sublayer opposite to the second electrode layer. At least one of silicon oxide and lithium fluoride is deposited on the side of the organic encapsulation sublayer opposite to the first inorganic encapsulation sublayer by chemical vapor deposition to form a second inorganic encapsulation sublayer. The refractive index of the first inorganic encapsulation sublayer, the organic encapsulation sublayer, and the second inorganic encapsulation sublayer decreases layer by layer.

10. A display device, characterized in that, The display device includes a display panel as described in any one of claims 1 to 7, or the display device includes a display panel formed according to claim 8 or 9.

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