Display module, preparation method thereof and display device

Abstract

The application discloses a display module, a preparation method thereof and a display device. The display module has a bending area and a non-bending area located on one side of the bending area, and comprises a display panel. The display panel comprises a first screen body, a bending part and a second screen body. The bending part connects the first screen body and the second screen body. The display panel can be bent at the bending part, so that the first screen body and the second screen body are close to each other, thereby reducing the frame of the display panel and realizing a narrow frame design. The display panel further comprises a substrate, a first signal line on the substrate and an inorganic protective layer. The inorganic protective layer covers at least part of the side surface of the first signal line. The inorganic protective layer protects the side surface of the first signal line, thereby improving the problem that the film layer of the display panel located in the bending area is prone to cracking in the reliability test stage, the side surface of the first signal line located in the bending area is exposed and is prone to corrosion and cracking, and improving the use performance of the display product.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display module, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display module, its manufacturing method, and a display device, aiming to improve the performance of OLED display products.

[0005] A first aspect of this application provides a display module having a bent area and a non-bent area adjacent to the bent area. The display module includes a display panel, which includes a first screen body, a bent portion, and a second screen body. The first screen body and the second screen body are disposed opposite to each other in a first direction. At least a portion of the bent portion is bent and connected between the first screen body and the second screen body. The bent portion is located in the bent area and on the same side of the first screen body and the second screen body in a second direction. The first screen body and the second screen body are located in the non-bent area. The first direction and the second direction intersect. The display panel also includes a substrate and a first signal line and an inorganic protective layer located on one side of the substrate. The first signal line and the inorganic protective layer are located in the bent area. The first signal line has a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface, which are disposed opposite to each other in the thickness direction of the bent portion. The inorganic protective layer covers at least a portion of the side surface of the first signal line.

[0006] According to an embodiment of the first aspect of this application, the first signal line includes a first layer, a second layer, and a third layer sequentially stacked along a direction away from the substrate, wherein the material of the second layer includes a conductive material.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the material of the second layer includes a metallic material.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the material of the first layer includes a conductive material.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the material of the third layer includes a conductive material.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the corrosion resistance of the first layer is greater than that of the second layer, and / or the corrosion resistance of the third layer is greater than that of the second layer.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the side surface includes a first side surface of a first layer, a second side surface of a second layer, and a third side surface of a third layer, with an inorganic protective layer covering the second side surface.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the inorganic protective layer covers the second side and the first side, or the inorganic protective layer covers the second side and the third side, or the inorganic protective layer covers the first side, the second side and the third side.

[0013] According to any of the foregoing embodiments of the first aspect of this application, in the unfolded state of the display module, the orthographic projection of the top surface onto the substrate is located outside the orthographic projection of the inorganic protective layer onto the substrate.

[0014] According to any of the foregoing embodiments of the first aspect of this application, a plurality of first signal lines are arranged at intervals.

[0015] According to any of the foregoing embodiments of the first aspect of this application, a plurality of inorganic protective layers corresponding to a plurality of first signal lines are spaced apart.

[0016] According to any of the foregoing embodiments of the first aspect of this application, a gap region is formed between adjacent first signal lines, and an inorganic protective layer covers the gap region.

[0017] According to any of the foregoing embodiments of the first aspect of this application, a first included angle is formed between the side surface and the bottom surface, the first included angle being 15° to 85°.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a first planarization layer located on one side of the substrate and extending to the bending region; a second planarization layer located on the side of the first planarization layer opposite to the substrate and extending to the bending region; and a first signal line located between the first planarization layer and the second planarization layer.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the material of the first planarization layer includes an organic material.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the material of the second planarization layer includes an organic material.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a third planarization layer located on the side of the second planarization layer opposite to the substrate and extending to the bending region; and a pixel definition layer located on the side of the third planarization layer opposite to the substrate and extending to the bending region.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the substrate includes a first substrate, a second substrate, and a barrier layer located between the first substrate and the second substrate, wherein the first substrate is located on the side of the second substrate opposite to the first signal line, and the first substrate, the barrier layer, and the second substrate extend to the bending region.

[0023] According to any of the foregoing embodiments of the first aspect of this application, the display panel has a display area and a non-display area adjacent to the display area. The display area is located in a non-bending area. The display panel also includes a second signal line and a fan-out line. The fan-out line is connected between the first signal line and the second signal line. The second signal line is used to connect to a driving circuit. The second signal line and the fan-out line are located in the display area.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the display module further includes a driver chip located in the non-display area, and a first signal line is connected between the fan-out line and the driver chip.

[0025] A second aspect of this application provides a method for manufacturing a display module, the display module having a bending region and a non-bending region adjacent to the bending region, the method comprising:

[0026] A first signal line is fabricated on a substrate. The first signal line is located in a bending region and has a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface, which are disposed opposite to each other in the thickness direction of the bending portion.

[0027] An inorganic material layer is prepared on a substrate, and the inorganic material layer is patterned to form an inorganic protective layer. The inorganic protective layer is located in the bending area and covers at least a portion of the side surface of the first signal line.

[0028] A display panel having a first signal line and an inorganic protective layer is bent. The display panel includes a first screen body, a bending portion, and a second screen body. The first screen body and the second screen body are arranged opposite to each other in a first direction. At least a portion of the bending portion is bent and connected between the first screen body and the second screen body. The bending portion is located in the bending area and on the same side of the first screen body and the second screen body in a second direction. The first screen body and the second screen body are located in the non-bending area. The first direction and the second direction intersect.

[0029] An embodiment of the third aspect of this application provides a display device, which includes a display module of any of the above embodiments or a display module prepared by any of the methods for preparing a display module of any embodiment.

[0030] According to an embodiment of this application, the display module has a bending area and a non-bending area located on one side of the bending area. The display module includes a display panel. The display panel includes a first screen body, a bending portion, and a second screen body. The bending portion connects the first screen body and the second screen body. The display panel can be bent at the bending portion, causing the first screen body and the second screen body to move closer to each other, thereby reducing the bezel of the display panel and achieving a narrow bezel design. The display panel also includes a substrate, a first signal line located on the substrate, and an inorganic protective layer. The inorganic protective layer covers at least a portion of the sides of the first signal line, providing protection to the sides of the first signal line. This improves the problem that the film layer in the bending area of ​​the display panel is prone to cracking during reliability testing, resulting in exposed sides of the first signal line in the bending area, which are easily corroded and prone to cracking, thus improving the performance of the display product. Attached Figure Description

[0031] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0032] Figure 1 This is a partial cross-sectional view of a display module provided in the first aspect embodiment of this application;

[0033] Figure 2 This is a partial cross-sectional view of a display panel provided in the first aspect embodiment of this application;

[0034] Figure 3 This is a partial cross-sectional view of a display panel provided in another embodiment;

[0035] Figure 4 This is a partial cross-sectional view of a display panel provided in yet another embodiment;

[0036] Figure 5 This is a partial cross-sectional view of a display panel provided in another embodiment;

[0037] Figure 6 This is a partial cross-sectional view of a display panel provided in another embodiment;

[0038] Figure 7 This is a partial cross-sectional view of a display panel provided in another embodiment;

[0039] Figure 8 This is a partial cross-sectional view of a display panel provided in another embodiment;

[0040] Figure 9 This is a partial cross-sectional view of a display panel provided in another embodiment;

[0041] Figure 10This is a partial cross-sectional view of a display panel provided in another embodiment;

[0042] Figure 11 This is a partial cross-sectional view of a display panel provided in another embodiment;

[0043] Figure 12 This is a partial top view schematic diagram of a display panel provided in the first aspect embodiment of this application;

[0044] Figure 13 This is a flowchart of a method for manufacturing a display module according to the first aspect of this application;

[0045] Figures 14 to 16 This is a process diagram of the fabrication of a display module provided in the first aspect of this application.

[0046] Explanation of reference numerals in the attached figures:

[0047] 10. Display module; 11. Non-bending area; 12. Bending area; AA, Display area; NA, Non-display area;

[0048] 100. Display panel; 110. First screen; 120. Second screen; 130. Bending section;

[0049] 200, Substrate; 210, First substrate; 220, Barrier layer; 230, Second substrate;

[0050] 300, First signal line; 301, First layer; 302, Second layer; 303, Third layer; 310, Side surface; 311, First side surface; 312, Second side surface; 313, Third side surface; 320, Top surface; 330, Bottom surface; 340, Gap area; 350, Second signal line; 360, Fan-out line;

[0051] 400 Inorganic protective layer; 410 First inorganic layer; 420 Second inorganic layer; 430 Third buffer layer; 440 Interface transition layer;

[0052] 500, First planarization layer;

[0053] 600, Second planarization layer;

[0054] 700, Third planarization layer;

[0055] 800, Pixel Definition Layer;

[0056] 900, driver chip;

[0057] α, the first included angle;

[0058] X, the first direction; Y, the second direction. Detailed Implementation

[0059] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0060] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0061] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0062] Flexible organic light-emitting diode (OLED) displays, characterized by active light emission, wide viewing angles, broad color gamut, high brightness, fast response time, and low power consumption, are gradually becoming the mainstream in the market. Furthermore, due to their flexible and foldable structure, they can be used to fabricate various forms of electronic devices. For example, they can be used in foldable screen phones, allowing for the storage of large screens through folding, thus meeting users' demands for large screens and portability.

[0063] With the development of display technology, display panels are being used more and more widely, and the requirements for narrow bezels are becoming increasingly stringent. To achieve a narrow bezel effect, the non-display area of ​​the flexible screen is typically bent to the back of the display panel, using the smallest possible bending radius.

[0064] In flexible panel module packaging technology, to make fuller use of space and increase screen-to-body ratio, the chip and screen are bent to the back of the phone panel, thus achieving a narrow bezel. Related technologies typically employ FI (Fanout in Active Area) technology in the display panel to achieve narrow or ultra-narrow bezels while maintaining display performance. The core of FI technology is to add a layer of metal traces to the display panel to solve the problem of difficult fanout trace layout in the bezel area of ​​the display panel under narrow and ultra-narrow bezel conditions. When some of the fanout traces in the bezel area are placed in the display area, a smaller bending radius can be achieved when bending the display panel in the bezel area, further reducing the bezel width of the display panel.

[0065] In the screen bending process, when the bending radius is small, it is inevitable that the internal stress of the screen will increase in the bending area, leading to cracking and failure of the internal film layer, exposure of metal traces, and susceptibility to corrosion during reliability testing. Therefore, avoiding corrosion of exposed metal traces is an important design consideration.

[0066] When the bending radius decreases, the stress does not increase linearly. Instead, when the bending radius is below a certain threshold, the stress increases much faster than linearly. However, the trend towards thinner and lighter mobile phone panels is to address screen failure issues while reducing the bending radius.

[0067] Therefore, in order to solve the screen failure problem, this application provides a display module, its manufacturing method, and a display device. The following will describe various embodiments of the display module, its manufacturing method, and the display device with reference to the accompanying drawings. The display module can be an Organic Light Emitting Diode (OLED) display module.

[0068] Please see Figure 1 and Figure 2 , Figure 1 This is a partial cross-sectional view of a display module provided in the first aspect embodiment of this application; Figure 2 This is a partial cross-sectional view of a display panel provided in the first aspect of this application.

[0069] like Figure 1 and Figure 2As shown, a first aspect embodiment of this application provides a display module 10. The display module 10 has a bending region 12 and a non-bending region 11 adjacent to the bending region 12. The display module 10 includes a display panel 100, which includes a first screen 110, a bending portion 130, and a second screen 120. The first screen 110 and the second screen 120 are disposed opposite to each other in a first direction X. At least a portion of the bending portion 130 is bent and connected between the first screen 110 and the second screen 120. The bending portion 130 is located in the bending region 12 and is located in a second direction Y of the first screen 110 and the second screen 120. On the same side, the first screen 110 and the second screen 120 are located in the non-bending area 11, and the first direction X and the second direction Y intersect; the display panel 100 also includes a substrate 200 and a first signal line 300 and an inorganic protective layer 400 located on one side of the substrate 200. The first signal line 300 and the inorganic protective layer 400 are located in the bending area 12. The first signal line 300 has a top surface 320, a bottom surface 330 and a side surface 310 connected between the top surface 320 and the bottom surface 330, which are disposed opposite each other in the thickness direction of the bending portion 130. The inorganic protective layer 400 covers at least a portion of the side surface 310 of the first signal line 300.

[0070] According to an embodiment of this application, the display module 10 has a bending area 12 and a non-bending area 11 located on one side of the bending area 12. The display module 10 includes a display panel 100. The display panel 100 includes a first screen body 110, a bending portion 130, and a second screen body 120. The bending portion 130 connects the first screen body 110 and the second screen body 120. The display panel 100 can be bent at the bending portion 130, so that the first screen body 110 and the second screen body 120 are close to each other, thereby reducing the bezel of the display panel 100 and realizing a narrow bezel design. The display panel 100 also includes a substrate 200, a first signal line 300 located on the substrate 200, and an inorganic protective layer 400. The inorganic protective layer 400 covers at least a portion of the side surface 310 of the first signal line 300 and provides protection to the side surface 310 of the first signal line 300. This improves the problem that the film layer of the display panel 100 located in the bending area 12 is prone to cracking during the reliability testing stage, resulting in the side surface 310 of the first signal line 300 located in the bending area 12 being exposed and easily corroded, thus causing cracks. This improves the performance of the display product.

[0071] Especially in the display panel 100 using FIAA technology, the display panel 100 has a smaller bending radius, and the film layers on both the top and bottom sides of the first signal line 300 are prone to cracking due to greater stress, resulting in the exposure of the side 310 of the first signal line 300. This makes it more susceptible to water and oxygen corrosion during reliability testing. Therefore, using an inorganic protective layer 400 to cover and protect the side 310 of the first signal line 300 can effectively solve the above problems.

[0072] Optionally, the inorganic protective layer 400 may be made of inorganic materials, such as silicon oxide, silicon nitride, etc.

[0073] Optionally, the first signal line 300 extends from the first screen 110 along the bending direction of the bend 130 to the second screen 120, thereby realizing the transmission of electrical signals between the first screen 110 and the second screen 120.

[0074] Optionally, an inorganic protective layer 400 is provided on both sides 310 of the first signal line 300.

[0075] Optionally, the display panel 100 is a flexible display panel 100.

[0076] Optionally, the elastic modulus of the bending portion 130 is less than that of the first screen body 110 and the second screen body 120, so that the display panel 100 can be bent at the bending portion 130, so that the first screen body 110 and the second screen body 120 are brought closer to each other, thereby reducing the bezel of the display panel 100 and realizing a narrow bezel design.

[0077] The modulus of elasticity can be considered an indicator of how easily a material undergoes elastic deformation. The higher the value, the greater the stress required to induce a certain elastic deformation, meaning the material is more stiff and, under a given stress, undergoes less elastic deformation. The modulus of elasticity refers to the stress required for a material to produce a unit elastic deformation under external force. It reflects a material's ability to resist elastic deformation, equivalent to the stiffness of a common spring.

[0078] Please see Figures 3 to 5 , Figure 3 This is a partial cross-sectional view of a display panel provided in another embodiment; Figure 4 This is a partial cross-sectional view of a display panel provided in yet another embodiment; Figure 5 This is a partial cross-sectional view of a display panel provided in another embodiment.

[0079] like Figures 3 to 5 As shown, in some optional embodiments, the first signal line 300 includes a first layer 301, a second layer 302 and a third layer 303 stacked sequentially in a direction away from the substrate 200, wherein the material of the second layer 302 includes a conductive material.

[0080] In these optional embodiments, the second layer 302 of conductive material enables the electrical signal transmission function of the first signal line 300. Optionally, the material of the second layer 302 includes metallic materials, such as aluminum (Al) and copper (Cu), which have good electrical conductivity.

[0081] Optionally, the material of the first layer 301 may include a conductive material to further improve the electrical signal transmission capability of the first signal line 300. Optionally, the material of the first layer 301 may include a metallic material, such as titanium (Ti) or molybdenum (Mo), which have good corrosion resistance. Optionally, the material of the first layer 301 may also include indium tin oxide (ITO) or indium zinc oxide (IZO).

[0082] Optionally, the third layer 303 may be made of a conductive material to further improve the electrical signal transmission capability of the first signal line 300. Optionally, the third layer 303 may be made of a metallic material, such as titanium, molybdenum, or other metals with good corrosion resistance. Optionally, the third layer 303 may also be made of indium tin oxide (ITO), indium zinc oxide (IZO), etc.

[0083] Optionally, the materials of the first layer 301, the second layer 302, and the third layer 303 are titanium, aluminum, titanium, or titanium, aluminum, molybdenum, or molybdenum, aluminum, molybdenum, etc.

[0084] In some alternative embodiments, the first layer 301 has greater corrosion resistance than the second layer 302, and / or the third layer 303 has greater corrosion resistance than the second layer 302.

[0085] In these alternative embodiments, the second layer 302 (e.g., Al) serves as a conductive core layer, exhibiting excellent conductivity but relatively weak corrosion resistance. By using more corrosion-resistant materials (e.g., Ti, Mo) in the first layer 301 and the third layer 303, an additional physical barrier can be formed when the side 310 of the first signal line 300 is not completely covered by the inorganic protective layer 400, directly blocking corrosive media such as water and oxygen from eroding the Al layer. The inorganic protective layer 400 in the bending region 12 may have microcracks or uneven coverage during the process. The outer highly corrosion-resistant material (first layer 301 and third layer 303) can delay the penetration of corrosive media to the second layer 302 (Al), reducing the risk of metal corrosion due to localized failure of the inorganic protective layer 400. Under bending stress, the first signal line 300 may be exposed due to film cracking. The corrosion-resistant outer layer material and the inorganic protective layer 400 form a dual protection mechanism: the inorganic protective layer 400 protects the side surface 310, and the outer layer material protects the top surface 320 and the bottom surface 330, which significantly reduces the expansion of cracks caused by corrosion and ensures the stability of signal transmission.

[0086] like Figure 3 As shown, in some optional embodiments, side 310 includes a first side 311 of a first layer 301, a second side 312 of a second layer 302, and a third side 313 of a third layer 303, with an inorganic protective layer 400 covering the second side 312.

[0087] In these alternative embodiments, the second layer 302 (e.g., Al) serves as the conductive core layer of the first signal line 300, exhibiting weak corrosion resistance and a high risk of direct exposure. By selectively covering the second side 312 with the inorganic protective layer 400, the protection of the Al layer can be specifically enhanced, preventing direct corrosion caused by water and oxygen penetration or bending stress. The first layer 301 and the third layer 303 (e.g., Ti / Mo) themselves possess high corrosion resistance, and their sides 310 (first side 311 and third side 313) do not require additional coverage to resist corrosion. The combination of the inorganic protective layer 400 and the highly corrosion-resistant material forms a dual barrier of "outer corrosion-resistant material + middle inorganic protection," significantly reducing the corrosion risk at the multilayer interface. Forming the inorganic protective layer 400 only on the second side 312 reduces photolithography and etching steps, avoids over-processing of the first layer 301 and the third side 313, lowers process costs and improves yield, while ensuring precise protection of critical areas. When bent, the second side 312, being located in the conductive core layer, experiences more significant stress concentration, making it more prone to cracking. The inorganic protective layer 400, through physical isolation and stress buffering, reduces the possibility of crack propagation to the second layer 302 (Al), ensuring the stability of the first signal line 300 during dynamic bending.

[0088] like Figures 3 to 5 As shown, in some optional embodiments, the inorganic protective layer 400 covers the second side 312 and the first side 311, or the inorganic protective layer 400 covers the second side 312 and the third side 313, or the inorganic protective layer 400 covers the first side 311, the second side 312 and the third side 313.

[0089] In these alternative embodiments, the inorganic protective layer 400 covers the second side 312 and the first side 311. Although the first layer 301 (e.g., Ti / Mo) has high corrosion resistance, its interface with the second layer 302 (Al) may develop microcracks under bending stress. Covering the first side 311 and the second side 312 with the inorganic protective layer 400 can prevent water and oxygen from penetrating to the Al layer through the interface between the first layer 301 and the second layer 302, while also strengthening the direct protection of the second side 312. The inorganic protective layer 400 covers the second side 312 and the third side 313. The interface between the third layer 303 (e.g., Ti / Mo) and the second layer 302 (Al) is also at risk of corrosion. Covering the third side 313 and the second side 312 can block water and oxygen from penetrating from the bottom, which is particularly suitable for scenarios where stress is concentrated at the bottom of the bending area 12. An inorganic protective layer 400 covers the first side 311, the second side 312, and the third side 313. Based on the stress distribution characteristics of the bending region 12 (e.g., tensile or compressive side), the first or third side 313 can be flexibly covered to specifically enhance the protection of the corresponding area, avoiding insufficient or excessive protection. The high corrosion resistance of the first layer 301 and the third layer 303 reduces the need for covering their sides 310, but the coverage still improves interface stability, especially in high humidity or corrosive environments. Through precise control of photolithography and etching processes, partial coverage of multiple sides 310 can be achieved, avoiding the impact of full wrapping on the conductivity of the signal lines.

[0090] In some alternative embodiments, when the display module 10 is in the unfolded state, the orthographic projection of the top surface 320 onto the substrate 200 is outside the orthographic projection of the inorganic protective layer 400 onto the substrate 200.

[0091] In these alternative embodiments, the top surface 320 (such as the Ti / Mo of the third layer 303) itself has high corrosion resistance and does not require the inorganic protective layer 400 to cover it. By limiting the inorganic protective layer 400 to only cover the side surface 310 (especially the Al side surface 310 of the second layer 302), over-protection of the top surface 320 can be avoided, reducing material waste and process complexity. The third layer 303 (top surface 320) of the first signal line 300 uses a highly corrosion-resistant material (such as Ti / Mo), and its own corrosion resistance is sufficient to cope with environmental exposure in the deployed state. The inorganic protective layer 400 focuses on protecting the weak areas of the side surface 310 (such as the Al layer), forming a division of labor mode of "self-protection of the top surface 320 material + inorganic protection of the side surface 310", improving the overall protection efficiency. If the top surface 320 is covered with the inorganic protective layer 400, stress concentration at the interface may occur due to the difference in material rigidity when bending. The absence of an inorganic layer on the top surface 320 reduces stress mismatch between multilayer structures, lowering the risk of cracking or delamination during bending. The discontinuous spacing of the inorganic protective layers 400 on both sides of the first signal line 300 reduces mutual interference between them, improving the reliability of each inorganic protective layer 400. Furthermore, the exposed top surface 320 of the first signal line 300 allows for bridging connections with other signal lines, facilitating signal transmission across multilayer traces. Eliminating the need for deposition and etching of the inorganic protective layer 400 on the top surface 320 reduces photolithography, etching, and mask alignment steps, lowering production costs and improving yield. It also avoids the impact of an excessively thick top surface 320 cover layer on the conductivity of the signal lines.

[0092] In some alternative embodiments, a plurality of first signal lines 300 are arranged at intervals.

[0093] In these optional embodiments, by reasonably setting the spacing between multiple first signal lines 300, the parasitic capacitance and electromagnetic coupling effects between adjacent signal lines can be reduced, crosstalk in high-frequency signal transmission can be reduced, and the signal integrity and display stability of the display module 10 can be improved. The spacing design can disperse bending stress and avoid excessive stress concentration in a single area, thereby reducing the risk of stress-induced crack propagation in the inorganic protective layer 400 or metal layer (such as Al of the second layer 302). The spacing design provides sufficient operating space for deposition and etching processes, ensuring that the inorganic protective layer 400 can uniformly cover the side surface 310 of each first signal line 300 (especially the second side surface 312 of the second layer 302), avoiding incomplete coverage or uneven thickness of the inorganic protective layer 400 due to overly dense first signal lines 300.

[0094] like Figures 2 to 5 As shown, in some optional embodiments, multiple inorganic protective layers 400 corresponding to multiple first signal lines 300 are spaced apart. The inorganic protective layer 400 corresponding to the first signal line 300 refers to the inorganic protective layer 400 that is in contact with the first signal line 300.

[0095] In these optional embodiments, the spaced arrangement of the inorganic protective layers 400 avoids rigid superposition caused by continuous coverage, reduces the stress difference between the inorganic layer and the organic film layer during bending, and reduces the risk of interface cracking. The spaced design allows the inorganic protective layers 400 to have local deformation space during bending, disperses stress and inhibits crack propagation, reduces the mutual influence between the inorganic protective layers 400, and improves the protective performance of each inorganic protective layer 400.

[0096] Please see Figure 6 , Figure 6 This is a partial cross-sectional view of a display panel provided in another embodiment.

[0097] like Figure 6 As shown, in some optional embodiments, a gap region 340 is formed between adjacent first signal lines 300, and an inorganic protective layer 400 covers the gap region 340.

[0098] In these optional embodiments, if the gap region 340 is not protected, it is prone to water and oxygen permeation channels due to cracking of the organic film layer during bending, leading to corrosion of the side 310 or interface of the adjacent first signal line 300. After the inorganic protective layer 400 covers the gap region 340, it can completely block the intrusion of corrosive media, especially preventing the exposure of the side 310 of the second layer 302 (such as Al), significantly improving the overall corrosion resistance of the bending area 12. After the inorganic protective layer 400 fills the gap region 340, it forms a continuous rigid structure with the side 310 covering layer of the adjacent first signal line 300, which can disperse bending stress, reduce crack propagation caused by stress concentration in the organic film layer, and inhibit metal fatigue or fracture of the first signal line 300 caused by stress deformation. Inorganic materials (such as silicon nitride and silicon dioxide) have high insulation properties, and covering the gap region 340 can prevent short circuits or leakage caused by insufficient spacing between adjacent first signal lines 300 in high-density wiring, ensuring the stability of high-frequency signal transmission.

[0099] Please see Figure 7 , Figure 7 This is a partial cross-sectional view of a display panel provided in another embodiment.

[0100] like Figure 7 As shown, in some optional embodiments, a first included angle α is formed between the side surface 310 and the bottom surface 330, and the first included angle α is 15° to 85°. For example, the first included angle α is 15°, 25°, 55°, 85°, etc.

[0101] In these optional embodiments, the design of the first included angle α disperses stress concentration points during bending by adjusting the inclination of the side surface 310. Smaller angles (e.g., the first included angle α is 15°–30°) create a smooth transition, reducing local stress peaks and decreasing the risk of cracking in the inorganic protective layer 400 and the metal layer (e.g., Al in the second layer 302); larger angles (e.g., the first included angle α is 60°–85°) enhance structural rigidity, preventing excessive deformation of the bending area 12 that could lead to signal line breakage. Inclined side surfaces 310 (e.g., the first included angle α is 45°–75°) facilitate uniform adhesion of the inorganic protective layer 400 during the deposition process, avoiding insufficient edge coverage or breakage caused by steep angles. Simultaneously, gentler angles (e.g., the first included angle α is 15°–30°) reduce etching residue, ensuring a tight bond between the inorganic protective layer 400 and the side surface 310, enhancing corrosion protection. By controlling the inclination of the side surface 310, the likelihood of water and oxygen retention on the side surface 310 or penetration along the interface can be reduced. For example, a medium angle (such as the first included angle α being 30° to 60°) can both prevent the accumulation of corrosive media on gentle sidewalls and prevent rapid penetration caused by defects in the inorganic protective layer on steep sidewalls, thus comprehensively improving corrosion resistance.

[0102] Please see Figure 1 and Figure 8 , Figure 8 This is a partial cross-sectional view of a display panel provided in another embodiment.

[0103] like Figure 1 and Figure 8 As shown, in some optional embodiments, the display panel 100 further includes: a first planarization layer 500 located on one side of the substrate 200 and extending to the bending region 12; a second planarization layer 600 located on the side of the first planarization layer 500 away from the substrate 200 and extending to the bending region 12; and a first signal line 300 located between the first planarization layer 500 and the second planarization layer 600.

[0104] In these optional embodiments, the first planarization layer 500 and the second planarization layer 600 are used to achieve film planarization and have a certain encapsulation effect, which is beneficial for the subsequent film preparation. When the first signal line 300 is located between the first planarization layer 500 and the second planarization layer 600, the display panel 100 has a smaller bending radius. The first planarization layer 500 and the second planarization layer 600 on both the upper and lower sides of the first signal line 300 are prone to cracking due to greater stress, resulting in the exposure of the side 310 of the first signal line 300, which makes it more susceptible to water and oxygen corrosion during reliability testing. Therefore, using an inorganic protective layer 400 to cover and protect the side 310 of the first signal line 300 can effectively solve the above problems.

[0105] Optionally, the material of the first planarization layer 500 may include an organic material, which has good flowability and is easy to planarize.

[0106] Optionally, the material of the second planarization layer 600 may include organic materials, which have good flowability and are easy to planarize.

[0107] In some optional embodiments, the display panel 100 further includes: a third planarization layer 700 located on the side of the second planarization layer 600 away from the substrate 200 and extending to the bending region 12; and a pixel definition layer 800 located on the side of the third planarization layer 700 away from the substrate 200 and extending to the bending region 12.

[0108] In these optional embodiments, the third planarization layer 700 is used to achieve film planarization and has a certain encapsulation effect, which is beneficial for the preparation of subsequent film layers (such as pixel definition layer 800).

[0109] Optionally, the pixel definition layer 800 includes a pixel defining portion and a plurality of pixel openings enclosed by the pixel defining portion, with light-emitting units disposed within the pixel openings. The pixel defining portion defines the light-emitting area of ​​the display panel 100, and the light-emitting units disposed within the pixel openings achieve light-emitting display.

[0110] Optionally, the material of the third planarization layer 700 may include organic materials, which have good flowability and are easy to planarize.

[0111] Optionally, the material of the pixel definition layer 800 may include organic or inorganic materials.

[0112] Optionally, a support column (SPC) is provided on the side of the pixel definition layer 800 facing away from the substrate 200 to support the upper film layer.

[0113] In some alternative embodiments, the substrate 200 includes a first substrate 210, a second substrate 230 and a barrier layer 220 located between the first substrate 210 and the second substrate 230, the first substrate 210 being located on the side of the second substrate 230 opposite to the first signal line 300, and the first substrate 210, the barrier layer 220 and the second substrate 230 extending to the bending region 12.

[0114] In these optional embodiments, a barrier layer 220 is disposed between the first substrate 210 and the second substrate 230. Within the display area AA, the barrier layer 220 can prevent impurities from entering the active layer, ensuring that the active layer has good electron mobility. The barrier layer 220 (e.g., inorganic materials such as silicon dioxide and silicon nitride) is located between the two substrates and can effectively prevent water and oxygen from penetrating through the substrates to the bending region 12, preventing the first signal line 300 (especially the Al of the second layer 302) from experiencing performance degradation due to environmental corrosion. The first substrate 210 and the second substrate 230 extend into the bending region 12, forming a continuous support structure, avoiding microcracks caused by interlayer separation during bending, and maintaining the integrity of the barrier layer 220.

[0115] Please see Figure 9 , Figure 9 This is a partial cross-sectional view of a display panel provided in another embodiment.

[0116] like Figure 9 As shown, optionally, the inorganic protective layer 400 includes a first inorganic layer 410 and a second inorganic layer 420. The second inorganic layer 420 is located on the side of the first inorganic layer 410 facing away from the substrate 200. The materials of the first inorganic layer 410 and the second inorganic layer 420 are different. For example, the material of the first inorganic layer 410 may include silicon nitride, while the material of the second inorganic layer 420 may include silicon dioxide or aluminum oxide. The first inorganic layer 410 directly covers the side 310 of the first signal line 300, has high density, and blocks water and oxygen penetration. The second inorganic layer 420 covers the surface of the first inorganic layer 410, providing additional chemical stability and inhibiting electrochemical corrosion.

[0117] Optionally, the inorganic protective layer 400 includes a first inorganic layer 410 and a third buffer layer 430. The third buffer layer 430 is located on the side of the first inorganic layer 410 away from the substrate 200. The elastic modulus of the third buffer layer 430 is smaller than that of the first inorganic layer 410. For example, the material of the third buffer layer 430 includes silicon dioxide. It is located between the inorganic first inorganic layer 410 and the organic second planarization layer 600, and the bending stress is relieved through gradient modulus design.

[0118] Please see Figure 10 , Figure 10 This is a partial cross-sectional view of a display panel provided in another embodiment.

[0119] like Figure 10As shown, optionally, the inorganic protective layer 400 includes a first inorganic layer 410, a second inorganic layer 420, and a third buffer layer 430, wherein the elastic modulus of the third buffer layer 430 is less than that of the second inorganic layer 420. The first inorganic layer 410 directly covers the side 310 of the first signal line 300, has high density, and blocks water and oxygen penetration. The second inorganic layer 420 covers the surface of the first inorganic layer 410, providing additional chemical stability and inhibiting electrochemical corrosion. Located between the inorganic second inorganic layer 420 and the organic second planarization layer 600, a gradient modulus design alleviates bending stress.

[0120] Please see Figure 11 , Figure 11 This is a partial cross-sectional view of a display panel provided in another embodiment.

[0121] like Figure 11 As shown, optionally, the inorganic protective layer 400 includes an interface transition layer 440 located between the first inorganic layer 410 and the first signal line 300 and the first inorganic layer 410. The material of the interface transition layer 440 includes metal oxides, such as titanium dioxide, aluminum oxide, etc. This improves the chemical bonding strength between the inorganic first inorganic layer 410 and the side surface 310 of the metallic first signal line 300, suppressing interface peeling. Optionally, the thickness of the interface transition layer 440 is less than that of the first inorganic layer 410. The interface transition layer 440 fills micro-defects on the metal surface, improving the adhesion of the inorganic protective layer 400. The dense oxide layer further blocks water and oxygen from contacting the metal surface.

[0122] Please see Figure 1 , Figure 8 and Figure 12 , Figure 12 This is a partial top view of a display panel provided in the first aspect of this application.

[0123] like Figure 1 , Figure 8 and Figure 12 As shown, in some optional embodiments, the display panel 100 has a display area AA and a non-display area NA adjacent to the display area AA. The display area AA is located in the non-bending area 11. The display panel 100 also includes a second signal line 350 and a fan-out line 360. The fan-out line 360 ​​is connected between the first signal line 300 and the second signal line 350. The second signal line 350 is used to connect to the driving circuit. The second signal line 350 and the fan-out line 360 ​​are located in the display area AA.

[0124] In these alternative embodiments, by integrating the fanout line 360 ​​and the second signal line 350 into the display area AA (FIAA technology), the wiring requirements for the non-display area NA (bezel area) are reduced, thereby significantly compressing the bezel width and meeting users' demands for a high screen-to-body ratio. The distribution of the fanout line 360 ​​in the display area AA needs to be adapted to the high-density pixel arrangement. By optimizing the line width, spacing, and materials (such as a low-resistance metal layer), stable wiring can be achieved within a limited space, avoiding the risk of short circuits or open circuits.

[0125] Optionally, the display area AA is located within the non-bending area 11. Optionally, the non-bending area 11 where the first screen 110 is located is the display area AA.

[0126] Optionally, the second signal line 350 includes a data signal line connected to the driving circuit to provide data signals to the driving circuit and control the light emission of the light-emitting unit.

[0127] In some optional embodiments, the display module 10 also includes a driver chip 900 (Integrated Circuit, IC) located in the non-display area NA, with the first signal line 300 connected between the fan-out line 360 ​​and the driver chip 900.

[0128] In these alternative embodiments, the driver chip 900 is integrated at the edge of the non-display area NA, and the first signal line 300 passes through the bending area 12 and the non-bending area 11 with the shortest path, avoiding complex wiring design, freeing up more space for ultra-narrow bezel layout (such as FIAA technology), and reducing the risk of crosstalk caused by signal line crossing.

[0129] Optionally, the driver chip 900 is located in the non-bending area 11 and is bonded to the second screen 120 on the side of the second screen 120 opposite to the first screen 110.

[0130] Optionally, the display panel 100 includes a first metal layer, a second metal layer, a third metal layer, a fourth metal layer, and a fifth metal layer. For example, the first metal layer is used to set the gate of the driving circuit, the second metal layer is used to set the capacitor plate, the third metal layer is used to set the source and drain of the driving circuit, and the fourth and fifth metal layers are used to set power supply voltage signal lines, data signal lines, etc.

[0131] Optionally, the first signal line 300 is set in the same layer as the fourth metal layer, which simplifies the fabrication process.

[0132] Optionally, the first planarization layer 500 is located between the third metal layer and the fourth metal layer.

[0133] Optionally, the second planarization layer 600 is located between the fourth metal layer and the fifth metal layer.

[0134] Optionally, the third planarization layer 700 is located between the fifth metal layer and the pixel definition layer 800.

[0135] Optionally, the first metal layer is located within the display area AA and does not extend into the bending area 12. Optionally, the second metal layer is located within the display area AA and does not extend into the bending area 12. Optionally, the third metal layer is located within the display area AA and does not extend into the bending area 12. Optionally, the fifth metal layer is located within the display area AA and does not extend into the bending area 12. Reducing the metal traces within the bending area 12 allows the bending portion 130 of the bending area 12 to bend to a smaller radius, thereby reducing the bezel width of the display module 10.

[0136] Optionally, the display module 10 further includes a first support film and a second support film. The first support film is located on the side of the first screen 110 facing the second screen 120, and the second support film is located on the side of the second screen 120 facing the first screen 110, thereby supporting the first screen 110 and the second screen 120.

[0137] Optionally, the display module 10 also includes a shim block disposed between the first and second support films. By precisely controlling the spacing between the first and second support films, the shim block optimizes the neutral layer position in the bending area 12, reducing tensile / compressive stress on the screen's metal traces or film layers. The shim block further disperses interlayer shear forces, suppressing the risk of delamination. Selectively distributed in critical areas (such as the junction of the bending area 12 and the non-bending area 11, and chip packaging sites) can specifically enhance local compressive strength, preventing the first and second support films from collapsing or deforming due to external pressure or repeated bending, ensuring the long-term reliability of the display module 10. The shim block uses low-density materials (such as foamed polymers or hollow microspheres) or a hollow structure design, providing support while reducing weight increase, ensuring the overall thickness of the display module 10 meets the requirements for thinness and lightness.

[0138] Optionally, the material of the raised block includes a wave-absorbing material, enabling it to function as an electromagnetic shield. Optional materials also include polyethylene terephthalate (PET) and polyimide (PI).

[0139] Optionally, the display module 10 further includes a composite film layer located between the first support film and the second support film. Optionally, the composite film layer is located between the first support film and the shim block. Optionally, the composite film layer includes an SCF (SuperClean Foam) component, which includes an adhesive layer, a buffer layer, and a metal layer sequentially stacked along a first direction X. The adhesive layer is used to bond the buffer layer and the first support film of the display panel 100. The buffer layer enhances the impact resistance of the display module 10. The metal layer further increases the strength and toughness of the display module 10, increasing its drop resistance and further enhancing the protective effect of the composite film layer on the display panel 100.

[0140] The buffer layer is made of materials that are elastic, lightweight, flexible, and ultra-thin, such as foam. The metal layer is made of a highly ductile metal, such as copper foil.

[0141] Optionally, the display module 10 further includes a protective layer disposed on the bending portion 130, and the protective layer and the first support film are disposed on opposite sides of the display panel 100. The protective layer provides protection to the bending portion 130. For example, metal traces are provided within the bending portion 130, and the protective layer provides protection to the metal traces, thereby improving the service life of the display module 10.

[0142] Optionally, the display module 10 also includes a polarizer, which is disposed on the side of the display panel 100 away from the first support film. The polarizer can filter natural light and reduce the amount of reflected light, thereby improving the display effect of the display module 10.

[0143] Optionally, the display module 10 also includes a cover plate, which is adhered to the side of the polarizer facing away from the display panel 100. The cover plate can provide protection for components such as the polarizer and the display panel 100, thereby improving the service life of the display module 10.

[0144] The cover plate can be a flat cover plate that covers the first screen body 110. Alternatively, the cover plate can include a flat portion and a curved portion, with the flat portion covering the screen body and the curved portion covering at least a portion of the bent portion 130.

[0145] The structural design in this embodiment can be applied to other display modules 10. The specific choice can be made according to the actual situation, and this application does not impose any specific restrictions on it.

[0146] Please see Figures 13 to 16 See also Figures 1 to 12 , Figure 13 This is a flowchart of a method for manufacturing a display module according to the first aspect of this application; Figures 14 to 16 This is a process diagram of the fabrication of a display module provided in the first aspect of this application.

[0147] like Figures 1 to 16 As shown, an embodiment of the second aspect of this application provides a method for manufacturing a display module 10, the display module 10 having a bending region 12 and a non-bending region 11 adjacent to the bending region 12, the method comprising:

[0148] Step S01: A first signal line 300 is fabricated on the substrate 200. The first signal line 300 is located in the bending region 12 and has a top surface 320, a bottom surface 330 and a side surface 310 connected between the top surface 320 and the bottom surface 330, which are disposed opposite each other in the thickness direction of the bending portion 130.

[0149] Step S02: An inorganic material layer is prepared on the substrate 200, and the inorganic material layer is patterned to form an inorganic protective layer 400. The inorganic protective layer 400 is located in the bending region 12 and covers at least a portion of the side surface 310 of the first signal line 300.

[0150] Step S03: The display panel 100 having a first signal line 300 and an inorganic protective layer 400 is bent. The display panel 100 includes a first screen 110, a bent portion 130 and a second screen 120. The first screen 110 and the second screen 120 are arranged opposite each other in the first direction X. At least a portion of the bent portion 130 is bent and connected between the first screen 110 and the second screen 120. The bent portion 130 is located in the bending area 12 and on the same side of the first screen 110 and the second screen 120 in the second direction Y. The first screen 110 and the second screen 120 are located in the non-bending area 11. The first direction X and the second direction Y intersect.

[0151] According to the manufacturing method of the display module 10 in the embodiments of this application, the display module 10 has a bending area 12 and a non-bending area 11 located on one side of the bending area 12. The display module 10 includes a display panel 100. The display panel 100 includes a first screen body 110, a bending portion 130 and a second screen body 120. The bending portion 130 connects the first screen body 110 and the second screen body 120. The display panel 100 can be bent at the bending portion 130, so that the first screen body 110 and the second screen body 120 are close to each other, thereby reducing the bezel of the display panel 100 and realizing a narrow bezel design. The display panel 100 also includes a substrate 200, a first signal line 300 located on the substrate 200, and an inorganic protective layer 400. The inorganic protective layer 400 covers at least a portion of the side surface 310 of the first signal line 300 and provides protection to the side surface 310 of the first signal line 300. This improves the problem that the film layer of the display panel 100 located in the bending area 12 is prone to cracking during the reliability testing stage, resulting in the side surface 310 of the first signal line 300 located in the bending area 12 being exposed and easily corroded, thus causing cracks. This improves the performance of the display product.

[0152] Optionally, before step S01, the method further includes:

[0153] A first planarization layer 500 is prepared on the substrate 200.

[0154] In these optional embodiments, the first signal line 300 is fabricated after the first planarization layer 500 achieves film planarization, which is beneficial for the fabrication of the first signal line 300.

[0155] Optionally, after step S02, the method further includes:

[0156] A second planarization layer 600 is prepared on the side of the inorganic protective layer 400 that is away from the substrate 200.

[0157] A third aspect of the present invention also provides a display device, including a display module 10 of any of the first aspects described above or a display module 10 prepared by the preparation method of the display module 10 of any of the second aspects described above. Since the display device provided by the second aspect of the present invention includes a display module 10 of any of the first aspects described above or a display module 10 prepared by the preparation method of the display module 10 of any of the second aspects described above, the display device provided by the second aspect of the present invention has the beneficial effects of the display module 10 of any of the first aspects described above or the preparation method of the display module 10 of any of the second aspects described above, which will not be elaborated further here.

[0158] The display devices in the embodiments of the present invention include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0159] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display module, characterized in that, The display module has a bent area and a non-bent area adjacent to the bent area, and the display module includes: The display panel includes a first screen, a bent portion, and a second screen. The first screen and the second screen are disposed opposite each other in a first direction. At least a portion of the bent portion is bent and connected between the first screen and the second screen. The bent portion is located in the bent area and on the same side of the first screen and the second screen in a second direction. The first screen and the second screen are located in the non-bent area. The first direction and the second direction intersect. The display panel further includes a substrate and a first signal line and an inorganic protective layer located on one side of the substrate. The first signal line and the inorganic protective layer are located within the bending area. The first signal line has a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface, which are disposed opposite each other in the thickness direction of the bending portion. The inorganic protective layer covers at least a portion of the side surface of the first signal line.

2. The display module according to claim 1, characterized in that, The first signal line includes a first layer, a second layer, and a third layer stacked sequentially in a direction away from the substrate, wherein the material of the second layer includes a conductive material; Preferably, the material of the second layer includes a metallic material; Preferably, the material of the first layer includes a conductive material; Preferably, the material of the third layer includes a conductive material; Preferably, the corrosion resistance of the first layer is greater than that of the second layer, and / or the corrosion resistance of the third layer is greater than that of the second layer.

3. The display module according to claim 2, characterized in that, The side surface includes a first side surface of the first layer, a second side surface of the second layer, and a third side surface of the third layer, and the inorganic protective layer covers the second side surface. Preferably, the inorganic protective layer covers the second side and the first side, or the inorganic protective layer covers the second side and the third side, or the inorganic protective layer covers the first side, the second side and the third side.

4. The display module according to claim 1, characterized in that, In the unfolded state of the display module, the orthographic projection of the top surface onto the substrate is outside the orthographic projection of the inorganic protective layer onto the substrate.

5. The display module according to claim 1, characterized in that, Multiple first signal lines are arranged at intervals; Preferably, the inorganic protective layers corresponding to the plurality of first signal lines are spaced apart; Preferably, a gap region is formed between adjacent first signal lines, and the inorganic protective layer covers the gap region.

6. The display module according to claim 1, characterized in that, There is a first included angle between the side surface and the bottom surface, the first included angle being 15° to 85°.

7. The display module according to claim 1, characterized in that, The display panel also includes: A first planarization layer is located on one side of the substrate and extends to the bending area; The second planarization layer is located on the side of the first planarization layer away from the substrate and extends to the bending region, and the first signal line is located between the first planarization layer and the second planarization layer. Preferably, the material of the first planarization layer includes an organic material; Preferably, the material of the second planarization layer includes an organic material; Preferably, the display panel further includes: The third planarization layer is located on the side of the second planarization layer away from the substrate and extends to the bending area; A pixel definition layer is located on the side of the third planarization layer opposite to the substrate and extends to the bending area; Preferably, the substrate includes a first substrate, a second substrate, and a barrier layer located between the first substrate and the second substrate, wherein the first substrate is located on the side of the second substrate opposite to the first signal line, and the first substrate, the barrier layer, and the second substrate extend to the bending region.

8. The display module according to claim 1, characterized in that, The display panel has a display area and a non-display area adjacent to the display area. The display area is located in the non-bending area. The display panel also includes a second signal line and a fan-out line. The fan-out line is connected between the first signal line and the second signal line. The second signal line is used to connect to the driving circuit. The second signal line and the fan-out line are located in the display area. Preferably, the display module further includes a driver chip located in the non-display area, and the first signal line is connected between the fan-out line and the driver chip.

9. A method for manufacturing a display module, characterized in that, The display module has a bent area and a non-bent area adjacent to the bent area, and the method includes: A first signal line is fabricated on a substrate. The first signal line is located within the bending region and has a top surface, a bottom surface, and a side surface connected between the top surface and the bottom surface, which are disposed opposite to each other in the thickness direction of the bending portion. An inorganic material layer is prepared on the substrate, and the inorganic material layer is patterned to form an inorganic protective layer. The inorganic protective layer is located in the bending area and covers at least a portion of the side surface of the first signal line. A display panel having the first signal line and the inorganic protective layer is bent. The display panel includes a first screen body, a bent portion, and a second screen body. The first screen body and the second screen body are arranged opposite each other in a first direction. At least a portion of the bent portion is bent and connected between the first screen body and the second screen body. The bent portion is located in the bending area and on the same side of the first screen body and the second screen body in a second direction. The first screen body and the second screen body are located in the non-bending area. The first direction and the second direction intersect.

10. A display device, characterized in that, The display module includes the display module according to any one of claims 1-8 or the display module prepared by the method of preparing the display module according to claim 9.

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