Display module, display module preparation method and display device

Abstract

The application discloses a display module, a display module preparation method and a display device. The display module comprises a first part, a second part and a third part arranged oppositely at least partially, the first part comprises a light-out surface, the second part is located on a side of the first part away from the light-out surface, the first part comprises a first connecting end close to the third part, and the second part comprises a second connecting end close to the third part. The third part comprises a signal line, the signal line comprises at least one flat part and at least one flexible conductive part connected to one end of the flat part, the flat part extends along a straight line, the flexible conductive part is arranged to be bendable relative to the flat part, the signal line is electrically connected to the first connecting end and the second connecting end respectively, and the bending strength of the material of the flat part is smaller than the bending strength of the flexible conductive part. The service life, performance and reliability of the display module are improved.

Description

Technical Field

[0001] This application belongs to the field of display technology, and in particular relates to a display module, a method for manufacturing a display module, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display module, a method for manufacturing the display module, and a display device. By limiting the bending strength of the material of the straight portion to be less than that of the flexible conductive portion, the flexible conductive portion is bent relative to the straight portion, facilitating electrical connection with the first connection end and the second connection end. Since the material of the flexible conductive portion is flexible, it is easier to bend, thus reducing the bending radius of the signal line and the bezel width of the display module corresponding to the third part, improving the user experience and enhancing the performance of the display module. At the same time, using the flexible conductive portion can also reduce the impact of stress on the signal line during bending, avoiding breakage and other problems, and improving the service life, performance, and reliability of the display module.

[0005] This application provides a display module, comprising: a first portion, a second portion, and a third portion connected to the first portion and the second portion, at least partially disposed opposite to each other. The first portion includes a light-emitting surface, and the second portion is located on the side of the first portion away from the light-emitting surface. The first portion includes a first connection end near the third portion, and the second portion includes a second connection end near the third portion. The third portion includes a signal line, which includes at least one straight portion and at least one flexible conductive portion connected to one end of the straight portion. The straight portion extends in a straight line, and the extension direction of the straight portion intersects the extension direction of the first portion. The flexible conductive portion is bendable relative to the straight portion. The signal line is electrically connected to the first connection end and the second connection end, respectively. The bending strength of the material of the straight portion is less than the bending strength of the flexible conductive portion.

[0006] According to one aspect of this application, the third part includes a plurality of signal lines extending along a first direction and spaced apart along a second direction, the first direction and the second direction intersecting; along the second direction, an insulating material is provided between adjacent flexible conductive portions; preferably, along the second direction, an insulating material is provided between adjacent straight portions and adjacent flexible conductive portions; the insulating material includes at least one of silicone, silicon nitride, silicon oxide, and silicon oxynitride; preferably, the material of the straight portions includes metal.

[0007] According to one aspect of this application, the signal line includes a straight portion and a first flexible conductive portion and a second flexible conductive portion respectively connected to both ends of the straight portion; the first flexible conductive portion is bent relative to the straight portion to be electrically connected to the first connection end, and the second flexible conductive portion is bent relative to the straight portion to be electrically connected to the second connection end; preferably, the lengths of the first flexible conductive portion and the second flexible conductive portion are equal.

[0008] According to one aspect of this application, along the second direction, the width of the flexible conductive portion is greater than or equal to the width of the straight portion.

[0009] According to one aspect of this application, the third part further includes a carrier layer and an encapsulation protective layer; the signal line is disposed on one side of the carrier layer, and the encapsulation protective layer at least covers the flexible conductive portion.

[0010] According to one aspect of this application, the material of the flexible conductive portion includes graphene.

[0011] Another aspect of this application provides a method for manufacturing a display module, comprising the following steps: providing a display panel to be processed, the display panel to be processed comprising at least partially oppositely disposed first portion, second portion, and third portion to be processed connecting the first portion and the second portion, the first portion comprising a first connection end near the third portion to be processed, the second portion comprising a second connection end near the third portion to be processed, the third portion to be processed comprising signal lines to be processed; etching the signal lines to be processed to remove a portion of the signal lines to be processed, forming at least one straight portion, the extension direction of the straight portion intersecting the extension direction of the first portion; forming a flexible conductive portion in the corresponding area of ​​the removed signal lines to be processed, the flexible conductive portion being electrically connected to one end of the straight portion, the flexible conductive portion being bendable relative to the straight portion, the flexible conductive portion and the straight portion forming the signal lines of the third portion, the signal lines being electrically connected to the first connection end and the second connection end respectively, the bending strength of the material of the straight portion being less than the bending strength of the flexible conductive portion.

[0012] According to another aspect of this application, between the steps of etching the signal line to be processed to remove a portion of the signal line to be processed, forming at least one straight portion, wherein the extending direction of the straight portion intersects the extending direction of the first portion, and the steps of forming a flexible conductive portion in the corresponding region of the removed signal line to be processed, wherein the flexible conductive portion is electrically connected to one end of the straight portion, the flexible conductive portion is bendable relative to the straight portion, the flexible conductive portion and the straight portion form the signal line of the third portion, the signal line is electrically connected to the first connection end and the second connection end respectively, and the bending strength of the material of the straight portion is less than the bending strength of the flexible conductive portion, the method further includes: forming an insulating material between adjacent signal lines to be processed along a second direction, wherein the signal lines to be processed extend along a first direction, and the second direction intersects the first direction; preferably, the insulating material includes at least one of silicone, silicon nitride, silicon oxide, and silicon oxynitride.

[0013] According to another aspect of this application, after the step of forming a flexible conductive portion in the corresponding region of the signal line to be removed, the flexible conductive portion being electrically connected to one end of the straight portion, the flexible conductive portion being bendable relative to the straight portion, the flexible conductive portion and the straight portion forming the signal line of the third part, the signal line being electrically connected to the first connection end and the second connection end respectively, and the bending strength of the material of the straight portion being less than the bending strength of the flexible conductive portion, the method further includes: forming an encapsulation protective layer to encapsulate the flexible conductive portion.

[0014] In another aspect, this application provides a display device, including the display module in any of the above embodiments and the display module prepared by the display module preparation method in any of the above embodiments.

[0015] Compared with the prior art, the display module provided in this embodiment of the invention includes a display panel. The first part may include a light-emitting surface for light emission display. A third part is bent relative to the first and second parts to connect the first and second parts respectively. The signal line includes at least one straight part and at least one flexible conductive part connected to one end of the straight part. By limiting the bending strength of the material of the straight part to be less than the bending strength of the flexible conductive part, the flexible conductive part is bent relative to the straight part, which facilitates electrical connection with the first and second connection ends. Since the material of the flexible conductive part is flexible, it is easier to bend. Therefore, the bending radius of the signal line can be reduced, the bezel width of the display module corresponding to the third part can be reduced, the user experience can be improved, and the performance of the display module can be improved. At the same time, the use of the flexible conductive part can also reduce the stress on the signal line during bending, avoid breakage and other problems, and improve the service life, performance and reliability of the display module. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of a display module after bending, according to an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of the structure of a display module provided in one embodiment of the present invention before bending;

[0019] Figure 3 This is a schematic diagram of the structure of a signal line before bending, according to an embodiment of the present invention;

[0020] Figure 4 This is a schematic diagram of the signal line before bending, provided in another embodiment of the present invention;

[0021] Figure 5 This is a flowchart of a display module manufacturing method provided in one embodiment of the present invention;

[0022] Figures 6 to 8 This is a schematic diagram of the structure obtained during the fabrication process of the display module fabrication method provided in this embodiment of the invention.

[0023] In the attached image:

[0024] 1-Display module; 11-First part; 12-Second part; 13-Third part; 2-Insulating material; L-Signal line; L1-Signal line to be processed; W-Flexible conductive part; W1-First flexible conductive part; W2-Second flexible conductive part; P-Straight part; Z1-First support layer; Z2-Second support layer; X-First direction; Y-Second direction. Detailed Implementation

[0025] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0026] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0027] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0028] Various modifications and variations can be made to this application without departing from its spirit or scope, which will be apparent to those skilled in the art. Therefore, this application is intended to cover modifications and variations falling within the scope of the corresponding claims (the claimed technical solutions) and their equivalents. It should be noted that the embodiments provided in this application can be combined with each other without contradiction.

[0029] This application provides a display module, a method for manufacturing the display module, and a display device. The following will describe these in conjunction with the accompanying drawings. Figures 1 to 8 Various embodiments of the display module, the method for manufacturing the display module, and the display device are described.

[0030] Please see Figures 1 to 3This application provides a display module 1, comprising: a first part 11, a second part 12, and a third part 13 connected to the first part 11 and the second part 12, at least partially disposed opposite to each other. The first part 11 includes a light-emitting surface, and the second part 12 is located on the side of the first part 11 away from the light-emitting surface. The first part 11 includes a first connection end near the third part 13, and the second part 12 includes a second connection end near the third part 13. The third part 13 includes a signal line L, which includes at least one straight portion P and at least one flexible conductive portion W connected to one end of the straight portion P. The straight portion P extends in a straight line, and the extension direction of the straight portion P intersects with the extension direction of the first part 11. The flexible conductive portion W is bendable relative to the straight portion P. The signal line L is electrically connected to the first connection end and the second connection end, respectively. The bending strength of the material of the straight portion P is less than the bending strength of the flexible conductive portion W.

[0031] The display module 1 provided in this embodiment of the invention includes a first part 11, a second part 12, and a third part 13. The first part 11 may include a light-emitting surface for light emission display. The third part 13 is bent relative to the first part 11 and the second part 12 to connect the first part 11 and the second part 12 respectively. The signal line L includes at least one straight part P and at least one flexible conductive part W connected to one end of the straight part P. By limiting the bending strength of the material of the straight part P to be less than the bending strength of the flexible conductive part W, the flexible conductive part W is bent relative to the straight part P, which facilitates electrical connection with the first connection end and the second connection end. Since the material of the flexible conductive part W is flexible, it is easier to bend. Therefore, the bending radius of the signal line L can be reduced, the bezel width of the display module 1 with the corresponding third part 13 can be reduced, the user experience can be improved, and the performance of the display module 1 can be improved. At the same time, the use of the flexible conductive part W can also reduce the stress on the signal line L during bending, avoid breakage and other problems, and improve service life, performance and reliability.

[0032] It should be noted that the material of the signal line L in the prior art can include metal. However, considering that the bending stress generated when metal is bent at a small bending radius is large and it is easy to break, this embodiment uses a flexible conductive material for part of the signal line L, that is, it uses a flexible conductive part W for bending, combined with a straight part P extending along a straight line. This can ensure that bending is carried out at a small bending radius, reduce the bezel width, reduce the impact of stress on the signal line L during bending, avoid problems such as breakage, improve service life and reliability, increase screen ratio, and enhance the visual display effect of display module 1.

[0033] In this embodiment, the first part 11 includes a light-emitting surface, and therefore, the first part 11 may include a light-emitting element. The second part 12 is located on the backlight surface of the display module 1 and may include components such as a circuit board and a chip. The third part 13 connects the first part 11 and the second part 12, and therefore, the third part 13 may include film components such as signal lines L that connect the first part 11 and the second part 12.

[0034] Optionally, the display module 1 includes a first support layer Z1 located on the backlight surface of the first part 11 and a second support layer Z2 located on the side of the second part 12 facing the first support layer Z1. A composite adhesive layer may be provided between the first support layer Z1 and the second support layer Z2. The composite adhesive layer may include adhesive, foam, metal heat sink and other film layers.

[0035] Specifically, the circuit board can be an FPC (Flexible Printed Circuit) board. An FPC board is a printed circuit board with polyimide or polyester film as its substrate; it can also be called a flexible circuit board, flexographic circuit board, or soft board. It features high reliability and excellent flexibility. FPC boards are characterized by their light weight, thinness, high wiring density, and good bending ability, capable of withstanding millions of dynamic bends without damaging the conductors.

[0036] Alternatively, the circuit board can also be COF (Chip On Film), which is a chip-on-film packaging technology that fixes integrated circuits (ICs) onto flexible circuit boards. It uses a flexible attached circuit board as a chip carrier to combine the chip with the flexible substrate circuit.

[0037] Bending strength refers to the maximum stress or load a material can withstand when subjected to bending loads. It reflects the material's ability to resist bending failure. The bending strength of the material in the straight section P is less than that of the flexible conductive section W; that is, if the same bending occurs, the flexible conductive section W is less likely to break than the straight section P.

[0038] Please see Figure 4 In some optional embodiments, the third part 13 includes a plurality of signal lines L extending along a first direction X and spaced apart along a second direction Y, wherein the first direction X and the second direction Y intersect; along the second direction Y, an insulating material 2 is provided between adjacent flexible conductive parts W.

[0039] It is understood that, since the third part 13 includes multiple signal lines L, in order to avoid short circuits or mutual interference between adjacent flexible conductive parts W, the present invention provides an insulating material 2 between adjacent flexible conductive parts W along the second direction Y to separate the flexible conductive parts W. At the same time, the insulating material 2 can be prepared before the flexible conductive parts W are prepared to avoid the connection of each flexible conductive part W during the preparation of the flexible conductive parts W.

[0040] Optionally, along the second direction Y, insulating material 2 is provided between adjacent straight portions P and adjacent flexible conductive portions W, that is, insulating material 2 is provided between adjacent signal lines L to avoid mutual interference between adjacent signal lines L.

[0041] Optionally, the insulating material 2 includes at least one of silicone, silicon nitride, silicon oxide, and silicon oxynitride.

[0042] Please see Figure 1 In some optional embodiments, the signal line L includes a straight portion P and a first flexible conductive portion W1 and a second flexible conductive portion W2 connected to both ends of the straight portion P respectively; the first flexible conductive portion W1 is bent relative to the straight portion P to be electrically connected to the first connection end, and the second flexible conductive portion W2 is bent relative to the straight portion P to be electrically connected to the second connection end.

[0043] In this embodiment, two flexible conductive parts W can be provided, namely, the first flexible conductive part W1 and the second flexible conductive part W2 are respectively connected to the two ends of the straight part P. The first flexible conductive part W1 and the second flexible conductive part W2 are bent relative to the straight part P, so that the second part 12 is bent to the back of the first part 11. The first flexible conductive part W1 is electrically connected to the first connecting end, so as to realize the electrical connection between the signal line L of the third part 13 and the first connecting end. The second flexible conductive part W2 is electrically connected to the second connecting end, so as to realize the electrical connection between the signal line L of the third part 13 and the second connecting end. The bending is achieved by using the first flexible conductive part W1 and the second flexible conductive part W2, which have better bending strength and are easier to bend, so as to avoid the signal line L from breaking and reduce the width of the frame.

[0044] Optionally, the first flexible conductive part W1 and the second flexible conductive part W2 have the same length, which facilitates uniform manufacturing, reduces costs, and ensures the consistency of the bending stress on the first flexible conductive part W1 and the second flexible conductive part W2.

[0045] In some alternative embodiments, along the second direction Y, the width of the flexible conductive portion W is greater than or equal to the width of the straight portion P.

[0046] It is understandable that when the width of the flexible conductive part W is equal to the width of the straight part P along the second direction Y, that is, the line width of the signal line L is the same everywhere, the risk of interference between adjacent signal lines L is reduced, and the signal lines L are arranged uniformly.

[0047] Alternatively, the width of the flexible conductive part W along the second direction Y can be made greater than the width of the straight part P to further enhance the bending resistance of the flexible conductive part W and avoid problems such as breakage of the flexible conductive part W.

[0048] In some optional embodiments, the third part 13 further includes a carrier layer and an encapsulation protection layer; the signal line L is disposed on one side of the carrier layer, and the encapsulation protection layer at least covers the flexible conductive part W.

[0049] It is understandable that the carrier layer is used to carry the signal line L and to fix and protect the flexible conductive part W. In this embodiment, the encapsulation protective layer can be used to cover and encapsulate the flexible conductive part W to avoid damage to the flexible conductive part W. Of course, the encapsulation protective layer can also cover the entire signal line L. The specific choice can be made according to actual needs and there are no special limitations.

[0050] Optionally, the material of the encapsulation protective layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0051] Optionally, the flexible conductive part W can be made of graphene. Graphene has good flexibility and excellent conductivity, which can meet the requirements of the flexible conductive part W for bending and conductivity. Of course, other materials can also be used for the flexible conductive part W, and it is not limited to the examples mentioned above.

[0052] Please see Figure 5 This invention also provides a method for manufacturing a display module 1, comprising the following steps:

[0053] S110: Provide a display panel to be processed, the display panel to be processed including at least partially oppositely disposed first portion 11, second portion 12, and a third portion 13 to be processed connecting the first portion 11 and the second portion 12, the first portion 11 including a first connection terminal near the third portion 13 to be processed, the second portion 12 including a second connection terminal near the third portion 13 to be processed, and the third portion 13 to be processed including a signal line L1 to be processed, such as... Figure 6 As shown;

[0054] S120: Etch the signal line L1 to be processed to remove part of the signal line L1 to be processed, forming at least one straight part P, the extension direction of the straight part P intersects the extension direction of the first part 11.

[0055] S130: A flexible conductive part W is formed in the corresponding area of ​​the signal line L1 to be removed. The flexible conductive part W is electrically connected to one end of the straight part P. The flexible conductive part W is bendable relative to the straight part P. The flexible conductive part W and the straight part P form the signal line L of the third part 13. The signal line L is electrically connected to the first connection end and the second connection end respectively. The bending strength of the material of the straight part P is less than the bending strength of the flexible conductive part W.

[0056] The method for manufacturing a display module 1 provided in this embodiment of the invention forms a flexible conductive part W in the corresponding area after removing the signal line L1 to be processed. The flexible conductive part W is electrically connected to one end of a straight part P, and the bending strength of the material of the straight part P is limited to be less than the bending strength of the flexible conductive part W. This allows the flexible conductive part W to bend relative to the straight part P, facilitating electrical connection with the first connection end and the second connection end. Since the material of the flexible conductive part W is flexible, it is easier to bend. Therefore, the bending radius of the signal line L can be reduced, the bezel width of the display module 1 with the corresponding third part 13 can be reduced, the user experience can be improved, and the performance of the display module 1 can be enhanced. At the same time, the use of the flexible conductive part W can also reduce the stress on the signal line L during bending, avoid problems such as breakage, and improve service life and reliability.

[0057] In step S110, the signal line L1 to be processed refers to the signal line L that has not yet formed the flexible conductive part W, and only includes the conductive material used to form the straight part P.

[0058] In this embodiment, the first part 11 includes a light-emitting surface, and therefore, the first part 11 may include a light-emitting element. After the third part 13 is bent, the second part 12 may be bent to the backlight surface of the display module 1. The second part 12 may include components such as a circuit board and a chip. The third part 13 connects the first part 11 and the second part 12, and therefore, the third part 13 may include film components such as signal lines L that connect the first part 11 and the second part 12.

[0059] Specifically, the circuit board can be an FPC (Flexible Printed Circuit) board. An FPC board is a printed circuit board with polyimide or polyester film as its substrate; it can also be called a flexible circuit board, flexographic circuit board, or soft board. It features high reliability and excellent flexibility. FPC boards are characterized by their light weight, thinness, high wiring density, and good bending ability, capable of withstanding millions of dynamic bends without damaging the conductors.

[0060] In step S120, a suitable etching process, such as dry etching or wet etching, can be adopted according to the material of the signal line L1 to be processed. The difference between dry etching and wet etching lies in the fact that wet etching uses a solvent or solution for etching. Wet etching is a purely chemical reaction process, which refers to using the chemical reaction between the solution and the pre-etched material to remove the part not covered by the masking film material to achieve the etching purpose. Its advantages are good selectivity, good repeatability, high production efficiency, simple equipment, and low cost. Dry etching has many types, including photo-evaporation, vapor phase etching, and plasma etching. The advantages of dry etching are: good anisotropy, high selectivity, good controllability, flexibility, and repeatability, safe operation on fine lines, easy automation, no chemical waste liquid, no pollution introduced during the process, and high cleanliness.

[0061] In this step, a portion of the signal line L1 to be processed needs to be removed to make room for the flexible conductive part W to be formed later.

[0062] In step S130, one or more flexible conductive sections W can be formed according to actual needs. Optionally, the material of the flexible conductive section W includes graphene. Graphene has good flexibility and excellent conductivity, which can meet the requirements of the flexible conductive section W for bending and conductivity. Of course, other materials can also be used for the flexible conductive section W, and it is not limited to the above examples.

[0063] For example, the signal line L includes a straight portion P and a first flexible conductive portion W1 and a second flexible conductive portion W2 connected to both ends of the straight portion P respectively; the first flexible conductive portion W1 is bent relative to the straight portion P to be electrically connected to the first connection end, and the second flexible conductive portion W2 is bent relative to the straight portion P to be electrically connected to the second connection end.

[0064] In this embodiment, two flexible conductive parts W can be provided, namely, the first flexible conductive part W1 and the second flexible conductive part W2 are respectively connected to the two ends of the straight part P. The first flexible conductive part W1 and the second flexible conductive part W2 are bent relative to the straight part P, so that the second part 12 is bent to the back of the first part 11. The first flexible conductive part W1 is electrically connected to the first connecting end, so as to realize the electrical connection between the signal line L of the third part 13 and the first connecting end. The second flexible conductive part W2 is electrically connected to the second connecting end, so as to realize the electrical connection between the signal line L of the third part 13 and the second connecting end. The bending is achieved by using the first flexible conductive part W1 and the second flexible conductive part W2, which have better bending strength and are easier to bend, so as to avoid the signal line L from breaking and reduce the width of the frame.

[0065] Optionally, the first flexible conductive part W1 and the second flexible conductive part W2 have the same length, which facilitates uniform manufacturing, reduces costs, and ensures the consistency of the bending stress on the first flexible conductive part W1 and the second flexible conductive part W2.

[0066] In some optional embodiments, between the steps of etching the signal line L1 to be processed to remove a portion of the signal line L1 to be processed, forming at least one straight portion P, the extension direction of the straight portion P intersecting the extension direction of the first portion 11, and forming a flexible conductive portion W in the corresponding region of the removed signal line L1, the flexible conductive portion W being electrically connected to one end of the straight portion P, the flexible conductive portion W being bendable relative to the straight portion P, the flexible conductive portion W and the straight portion P forming a signal line L of the third portion 13, the signal line L being electrically connected to the first connection end and the second connection end respectively, and the bending strength of the material of the straight portion P being less than the bending strength of the flexible conductive portion W, the method further includes:

[0067] An insulating material 2 is formed between adjacent signal lines L1 to be processed along the second direction Y. The signal lines L1 to be processed extend along the first direction X, and the second direction Y intersects with the first direction X.

[0068] It is understood that, since the third part 13 includes multiple signal lines L, in order to avoid short circuits or mutual interference between adjacent flexible conductive parts W, the present invention provides an insulating material 2 between adjacent flexible conductive parts W along the second direction Y to separate the flexible conductive parts W. At the same time, the insulating material 2 can be prepared before the flexible conductive parts W are prepared to avoid the connection of each flexible conductive part W during the preparation of the flexible conductive parts W.

[0069] Optionally, along the second direction Y, insulating material 2 is provided between adjacent straight portions P and adjacent flexible conductive portions W, that is, insulating material 2 is provided between adjacent signal lines L to avoid mutual interference between adjacent signal lines L.

[0070] Optionally, the insulating material 2 includes at least one of silicone, silicon nitride, silicon oxide, and silicon oxynitride.

[0071] In some optional embodiments, after forming a flexible conductive portion W in the corresponding region of the signal line L1 to be removed, electrically connecting one end of the flexible conductive portion W and the straight portion P, the flexible conductive portion W is bendable relative to the straight portion P, the flexible conductive portion W and the straight portion P form a signal line L of the third part 13, the signal line L is electrically connected to the first connection end and the second connection end respectively, and the bending strength of the material of the straight portion P is less than the bending strength of the flexible conductive portion W, the method further includes: forming an encapsulation protective layer to encapsulate the flexible conductive portion W.

[0072] In this embodiment, a protective encapsulation layer can be used to cover and encapsulate the flexible conductive part W to prevent damage to the flexible conductive part W. Of course, the protective encapsulation layer can also cover the entire signal line L. The specific choice can be made according to actual needs and there are no special limitations.

[0073] Optionally, the material of the encapsulation protective layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride.

[0074] Optionally, the first part 11 provided in the embodiments of the present invention may include a substrate, a light-emitting functional layer, and other film layers.

[0075] Optionally, the substrate may include a substrate and an array layer, the array layer including a driving circuit. For example, the array layer may include a first conductive layer, a second conductive layer, and a third conductive layer disposed on one side of the substrate and stacked thereon. An insulating layer is disposed between adjacent conductive film layers. Exemplarily, the pixel driving circuit disposed on the array layer includes a transistor and a storage capacitor. The transistor includes an active layer, a gate, a source, and a drain. The materials of the source and gate may include one or more combinations of molybdenum, titanium, aluminum, copper, etc. The gate of the transistor is typically used to receive a control signal, causing the transistor to turn on or off under the control of the control signal. One of the source and drain of the thin-film transistor is connected to the light-emitting unit to control the normal light emission of the light-emitting unit.

[0076] The substrate can be a rigid substrate, such as a glass substrate, or a flexible substrate, made of materials such as polyimide, polystyrene, polyethylene terephthalate, poly(p-xylene), polyethersulfone, or polyethylene naphthalate. The substrate is mainly used to support the devices mounted on it.

[0077] The storage capacitor includes a first plate and a second plate. As an example, the gate and the first plate may be located on a first conductive layer, the second plate may be located on a second conductive layer, and the source and drain may be located on a third conductive layer.

[0078] Optionally, the display panel may also include a light-emitting functional layer and an encapsulation layer disposed on the side of the array layer away from the substrate, wherein at least one film layer in the light-emitting functional layer and the encapsulation layer may be formed using IJP (Inkjet printing) technology.

[0079] Inkjet printing is a non-contact, micron-level printing process that can be achieved by directly jetting nanoscale solutions onto flexible or rigid substrates. Specifically, inkjet printing involves dissolving OLED materials in a solvent to form a solution, which is then ejected from a printhead in extremely small volumes (picoliters). Each tiny ink droplet is precisely printed onto the pixel electrode, and after drying, it forms the film layer of the device.

[0080] Optionally, the light-emitting functional layer includes a first electrode layer, a light-emitting layer, and a second electrode layer stacked along the direction away from the substrate.

[0081] Optionally, the light-emitting layer includes one or more of the following: an electron injection layer, an electron transport layer, a light-emitting material layer, a hole blocking layer, an electron blocking layer, a hole transport layer, and a hole injection layer. The specific selection depends on the type of light-emitting layer and is not particularly limited. The electron injection layer, electron transport layer, and hole blocking layer can be disposed between the second electrode layer and the light-emitting material layer. The electron blocking layer, hole transport layer, and hole injection layer can be disposed between the first electrode layer and the light-emitting material layer.

[0082] The material of the first electrode layer is generally a material with a high work function to improve hole injection efficiency. It can be gold (Au), platinum (Pt), titanium (Ti), silver (Ag), indium tin oxide (ITO), zinc tin oxide (IZO), or a transparent conductive polymer (such as polyaniline). For example, the first electrode layer can be made of an ITO-Ag-ITO composite material, without any particular limitation.

[0083] The material of the second electrode layer can be one of the following metals: silver (Ag), aluminum (Al), lithium (Li), magnesium (Mg), ytterbium (Yb), calcium (Ca), or indium (In). It can also be an alloy of the aforementioned metals, such as magnesium-silver alloy (Mg / Ag) or lithium-aluminum alloy (Li / Al). This embodiment does not limit the material in this regard.

[0084] Optionally, the encapsulation layer includes a first encapsulation layer, the material of which includes an inorganic material. Specifically, the inorganic material can be silicon nitride, silicon oxide, or silicon oxynitride, and can be formed using a CVD (Chemical Vapor Deposition) process.

[0085] Chemical vapor deposition (CVD) refers to the process of introducing vapors of gaseous or liquid reactants containing elements constituting the thin film, along with other gases required for the reaction, into a reaction chamber to generate a thin film through a chemical reaction on the substrate surface.

[0086] The films formed by chemical vapor deposition are dense and uniform, with strong adhesion between the film and the substrate. The film composition is easy to control, the deposition rate is fast, and the film quality is very stable.

[0087] Optionally, the encapsulation layer also includes a second encapsulation layer located on the side of the first encapsulation layer opposite to the substrate. The material of the second encapsulation layer includes an organic material. The organic material can be made of resin or polymeric organic material, and can be formed using IJP (Inkjet printing) technology.

[0088] Optionally, the encapsulation layer may also include a third encapsulation layer located on the side of the second encapsulation layer away from the substrate. The material of the third encapsulation layer includes inorganic materials. Adding an inorganic encapsulation layer outside the organic encapsulation layer can further improve the encapsulation effect of the encapsulation layer. In this embodiment, the material of the third encapsulation layer may be the same as or different from the material of the first encapsulation layer, and there is no special limitation.

[0089] Optionally, the materials of the first encapsulation layer and the third encapsulation layer are the same, so that the first encapsulation layer and the third encapsulation layer can be manufactured using the same equipment, which can simplify the manufacturing process of the display panel.

[0090] Optionally, the display panel further includes a pixel definition layer disposed on one side of the substrate, the pixel definition layer having pixel openings; the first electrode layer is at least partially disposed within the pixel openings.

[0091] In this embodiment, a pixel definition layer is disposed on the substrate including a pixel opening, and a light-emitting functional layer can be disposed within the pixel opening to realize the light-emitting display of the display panel.

[0092] Optionally, multiple pixel openings are spaced apart, and each pixel opening contains a light-emitting functional layer.

[0093] Optionally, a planarization layer may be included between the substrate and the pixel definition layer. The planarization layer may be made of hexamethyl dimethyl ether, epoxy resin, or polyimide, or other materials. This embodiment does not limit the application of this material.

[0094] Optionally, the display module 1 may also include a polarizer, a transparent adhesive layer, and other film layers disposed on the side of the light-emitting functional layer facing away from the substrate.

[0095] A polarizer, also known as a beam polarizer, is a key component that controls the polarization direction of a specific light beam. Polarizers are made from various composite materials, primarily including PVA film, TAC film, protective film, release film, and pressure-sensitive adhesive. Among these, the PVA film is the core material, responsible for polarization. It achieves its polarization function by forming ordered arrangements of iodine molecules through stretching and dyeing processes. The TAC film accounts for the highest cost, approximately 50%, while the PVA film accounts for about 12%.

[0096] The transparent adhesive layer can be made of OCA (Optically Clear Adhesive). OCA adhesive uses optical acrylic glue as a base material, and then a release film is laminated on the top and bottom layers to obtain a double-sided adhesive tape without a substrate. OCA adhesive layers have uniform thickness, high flatness, high adhesion, and strong bonding strength after lamination. Of course, other materials can also be used for the transparent adhesive layer, such as double-sided tape.

[0097] This invention also provides a display device, including the display module 1 in the above embodiments and the display module 1 prepared by the preparation method of the display module 1 in the above embodiments.

[0098] The display device provided in this embodiment of the invention has the technical effects of the display module 1 in any of the above embodiments. The explanations of the same or corresponding structures and terms as in the above embodiments will not be repeated here.

[0099] The display module 1 provided in this embodiment of the invention can be an organic light-emitting diode (OLED) display module 1, a quantum dot light-emitting diode (QLED) or a micro flat panel display module 1 (Micro-OLED or Micro-LED), etc.

[0100] The display module 1 in this application embodiment includes, but is not limited to, devices with display functions such as mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, and control consoles.

[0101] The above are merely specific embodiments of this application. Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, modules, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here. It should be understood that the protection scope of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the protection scope of this application.

[0102] It should also be noted that the exemplary embodiments mentioned in this application describe methods or systems based on a series of steps or apparatus. However, this application is not limited to the order of the above steps; that is, the steps can be performed in the order mentioned in the embodiments, or in a different order, or several steps can be performed simultaneously.

Claims

1. A display module, characterized in that, include: The first part, the second part, and the third part are at least partially disposed opposite to each other. The first part includes a light-emitting surface, the second part is located on the side of the first part away from the light-emitting surface, the first part includes a first connection end near the third part, and the second part includes a second connection end near the third part. The third part includes a signal line, which includes at least one straight portion and at least one flexible conductive portion connected to one end of the straight portion. The straight portion extends in a straight line and its extension direction intersects with the extension direction of the first part. The flexible conductive portion is bendable relative to the straight portion. The signal line is electrically connected to the first connection end and the second connection end, respectively. The bending strength of the material of the straight portion is less than the bending strength of the flexible conductive portion.

2. The display module according to claim 1, characterized in that, The third part includes multiple signal lines extending along a first direction and spaced apart along a second direction, wherein the first direction and the second direction intersect. Along the second direction, an insulating material is provided between adjacent flexible conductive parts; Preferably, along the second direction, insulating material is provided between adjacent straight portions and adjacent flexible conductive portions; The insulating material includes at least one of silicone, silicon nitride, silicon oxide, and silicon oxynitride. Preferably, the material of the straight portion includes metal.

3. The display module according to claim 1, characterized in that, The signal line includes a straight section and a first flexible conductive section and a second flexible conductive section respectively connected to both ends of the straight section; The first flexible conductive portion is bent relative to the straight portion to be electrically connected to the first connecting end, and the second flexible conductive portion is bent relative to the straight portion to be electrically connected to the second connecting end; Preferably, the lengths of the first flexible conductive portion and the second flexible conductive portion are equal.

4. The display module according to claim 2, characterized in that, Along the second direction, the width of the flexible conductive portion is greater than or equal to the width of the straight portion.

5. The display module according to claim 1, characterized in that, The third part also includes a carrier layer and an encapsulation protection layer; The signal line is located on one side of the carrier layer, and the encapsulation protective layer at least covers the flexible conductive part.

6. The display module according to claim 1, characterized in that, The flexible conductive part is made of graphene.

7. A method for manufacturing a display module, characterized in that, Includes the following steps: A display panel to be processed is provided, the display panel to be processed includes at least a first part, a second part and a third part to be processed connected to the first part and the second part, the first part includes a first connection terminal near the third part to be processed, the second part includes a second connection terminal near the third part to be processed, and the third part to be processed includes a signal line to be processed. The signal line to be processed is etched to remove part of the signal line to be processed, forming at least one straight portion, wherein the extension direction of the straight portion intersects the extension direction of the first portion; A flexible conductive portion is formed in the corresponding area of ​​the signal line to be removed. The flexible conductive portion is electrically connected to one end of the straight portion. The flexible conductive portion is bendable relative to the straight portion. The flexible conductive portion and the straight portion form the signal line of the third part. The signal line is electrically connected to the first connection end and the second connection end respectively. The bending strength of the material of the straight portion is less than the bending strength of the flexible conductive portion.

8. The method for manufacturing a display module according to claim 7, characterized in that, Between the steps of etching the signal line to be processed to remove a portion of the signal line to be processed, forming at least one straight portion, wherein the extending direction of the straight portion intersects the extending direction of the first portion, and forming a flexible conductive portion in the corresponding region of the removed signal line to be processed, wherein one end of the flexible conductive portion is electrically connected to one end of the straight portion, wherein the flexible conductive portion is bendable relative to the straight portion, wherein the flexible conductive portion and the straight portion form the signal line of the third portion, wherein the signal line is electrically connected to the first connection end and the second connection end respectively, and wherein the bending strength of the material of the straight portion is less than the bending strength of the flexible conductive portion, the method further includes: An insulating material is formed between adjacent signal lines to be processed along a second direction, the signal lines to be processed extending along a first direction, the second direction intersecting the first direction; Preferably, the insulating material includes at least one of silicone, silicon nitride, silicon oxide, and silicon oxynitride.

9. The method for manufacturing a display module according to claim 7, characterized in that, After the step of forming a flexible conductive portion in the corresponding area of ​​the signal line to be removed, electrically connecting one end of the flexible conductive portion and one end of the straight portion, the flexible conductive portion being bendable relative to the straight portion, the flexible conductive portion and the straight portion forming the signal line of the third part, the signal line being electrically connected to the first connection end and the second connection end respectively, and the bending strength of the material of the straight portion being less than the bending strength of the flexible conductive portion, the method further includes: An encapsulation protective layer is formed to encapsulate the flexible conductive part.

10. A display device, characterized in that, The display module includes the display module according to any one of claims 1 to 6 and the display module prepared by the method according to any one of claims 7 to 9.

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