Display panel and display device

Abstract

The application provides a display panel and a display device. The display panel comprises a first substrate, a pixel definition layer, a first electrode layer, a conductive separation layer and a support layer. The first substrate comprises a pixel circuit; the pixel definition layer comprises a plurality of pixel openings; the first electrode layer is located on the side of the pixel definition layer away from the first substrate, and the first electrode layer comprises a first electrode; the conductive separation layer comprises a plurality of first conductive separation structures, the first conductive separation structures are located between two adjacent pixel openings, and the first conductive separation structures are electrically connected to the first electrodes corresponding to the two adjacent pixel openings respectively; and the support layer comprises a plurality of support columns. The minimum distance between the first surface of the support column and the first conductive separation structure in the first direction is greater than zero, the first surface of the support column is the surface of the support column away from the first substrate, and the first direction is the stacking direction of the first substrate and the pixel definition layer. The application is used to improve the appearance quality problem of the display panel caused by cathode indentation.

Description

Technical Field

[0001] This application relates to the field of displays, and more particularly to a display panel and display device. Background Technology

[0002] Currently, for rigid OLED (organic light emitting diode) display panels, the mainstream manufacturing process typically uses FMM (fine metal mask) to deposit R / G / B three-color organic materials, followed by rigid encapsulation.

[0003] In the encapsulation structure of rigid OLED panels, PS (support pillars) are typically used as supports to reinforce the cover glass, enhancing the overall structural strength of the panel. PS are usually evenly distributed between pixels, providing support. In traditional manufacturing processes, the cathode material is typically deposited over the entire surface using vapor deposition, inevitably resulting in the cathode material covering the PS surface. Although the cathode thickness is approximately 150 Å to ensure sufficient transmittance, the mechanical strength of the cathode material is limited due to its semi-transparent metallic thin film. This limited mechanical strength leads to the following problem: after the rigid OLED panel is assembled, gravity causes pressure between the cover glass and the support pillars. In this situation, the cathode film covering the PS surface is highly susceptible to pressure damage, manifesting as peeling, detachment, or lifting of the cathode material. This pressure damage is particularly noticeable when the screen is off, forming visible indentations on the display and severely affecting the appearance quality of the display panel.

[0004] The information disclosed in this section is only for understanding the background of the concept of the present invention, and therefore may contain information that does not form prior art. Summary of the Invention

[0005] In view of this, embodiments of this application provide a display panel and a display device to improve the appearance quality problem of the display panel caused by cathode damage.

[0006] In a first aspect, embodiments of this application provide a display panel, comprising: a first substrate, a pixel definition layer, a first electrode layer, a conductive separation layer, and a support layer. The first substrate includes pixel circuitry; the pixel definition layer is located on one side of the first substrate and includes multiple pixel openings; the first electrode layer is located on the side of the pixel definition layer facing away from the first substrate and includes first electrodes; the conductive separation layer includes multiple first conductive separation structures, each located on the side of the conductive separation layer facing away from the first substrate, and positioned between two adjacent pixel openings, each first conductive separation structure being electrically connected to the first electrodes corresponding to the two adjacent pixel openings; the support layer includes multiple support pillars; the minimum distance between the first surface of each support pillar and the first conductive separation structure in a first direction is greater than zero, the first surface of each support pillar being the surface facing away from the first substrate, and the first direction being the stacking direction of the first substrate and the pixel definition layer.

[0007] In one possible implementation of the first aspect, the conductive separation layer includes a support post opening, and the support post is included within the support post opening.

[0008] In one possible implementation of the first aspect, the support post opening extends through the conductive separation layer.

[0009] In one possible implementation of the first aspect, the maximum height of the support column opening in the first direction is less than the minimum height of the conductive separation layer in the first direction.

[0010] In one possible implementation of the first aspect, the conductive separation layer further includes a second conductive separation structure, which is adjacent to the first conductive separation structure and located on the side of the first conductive separation structure facing the first substrate; a portion of the second conductive separation structure is located on the side of the support pillar away from the first substrate and in contact with the first surface, and a portion of the first conductive separation structure is located on the side of the first surface away from the first substrate.

[0011] In one possible implementation of the first aspect, the projection of the first conductive separation structure in the first direction covers the projection of the support column in the first direction.

[0012] In one possible implementation of the first aspect, the support post is located on the side of the first conductive separation structure away from the first substrate, and the projection of the first conductive separation structure in the second direction does not overlap with the projection of the support post in the second direction.

[0013] In one possible implementation of the first aspect, the area of ​​the second surface of the support post is greater than or equal to the area of ​​the first surface, and the second surface of the support post is the surface of the support post facing the first substrate.

[0014] In one possible implementation of the first aspect, the area of ​​the second surface of the support post is smaller than the area of ​​the first surface, and the second surface of the support post is the surface of the support post facing the first substrate.

[0015] In one possible implementation of the first aspect, a second substrate is further included, the second substrate being located on the side of the support post opposite to the first substrate.

[0016] Secondly, embodiments of this application provide a display device, including the display panel provided in the first aspect.

[0017] The display panel provided in this application, by setting the minimum distance between the first surface of the support pillar and the first conductive separation structure in the first direction to be greater than zero, allows the support pillar to completely block the deposition path of the cathode material on the surface of the support pillar while fulfilling its structural support function. This application not only eliminates the appearance defects caused by cathode damage in traditional processes, but also achieves an organic integration of the support structure and display function—significantly improving display uniformity and optical performance without adding an additional light-shielding layer or adjusting the cathode thickness, while maintaining a high PPI pixel density. This solution is particularly suitable for high-resolution rigid OLED products, providing a key structural foundation for the large-scale application of FMM-free technology in the field of rigid packaging, and has significant technological breakthrough and industrial application value. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 A schematic diagram of a display panel provided in an embodiment of this application; Figure 2 An embodiment provided in this application Figure 1 Enlarged view of region A in the middle; Figure 3 This is a top view schematic diagram of a display panel provided in an embodiment of this application; Figure 4 A schematic diagram of a display panel provided in an embodiment of this application; Figure 5A schematic diagram of a display panel provided in an embodiment of this application; Figure 6 A schematic diagram of a display panel provided in an embodiment of this application; Figure 7 A schematic diagram of a display panel provided in an embodiment of this application; Figure 8 A schematic diagram of a display panel provided in an embodiment of this application; Figure 9 This is a schematic diagram of a display device provided in an embodiment of this application.

[0020] Label Explanation 100, Display panel; 101, First substrate; 102, Second substrate; 103, Pixel encapsulation layer; 104, Light-emitting layer; 110, Pixel definition layer; 111, Pixel opening; 120, First electrode layer; 121, First electrode; 130, Conductive separation layer; 131, First conductive separation layer; 1311, First conductive separation structure; 132, Second conductive separation layer; 1321, Second conductive separation structure; 140, Support layer; 141, Support pillar; 150, Second electrode layer; 151, Second electrode; 200, Display device. Detailed Implementation

[0021] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0022] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0023] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0024] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0025] The inventors' research revealed that the main reasons for the susceptibility of the cathode to damage include: 1. The cathode film itself is relatively thin (approximately 150 Å) and is a semi-transparent material with low mechanical strength, making it easily damaged by slight pressure; 2. The contact area between the photosensitive element (PS) and the cathode is relatively large, making the pressure-damaged area obvious and easily identifiable by the human eye. This problem is particularly pronounced in high-resolution products, where the pixel density is high and the spacing between PS is reduced.

[0026] To address the aforementioned problems, this application provides a display panel and display device to solve these issues. The inventive concept of this application can be summarized as follows: a conductive separation layer is provided in the display panel structure. This conductive separation layer includes first conductive separation structures located between adjacent pixel openings, and these first conductive separation structures are electrically connected to first electrodes corresponding to the adjacent pixel openings. The minimum distance in the stacking direction between the first surface of the support pillar (the surface facing away from the first substrate) and the first conductive separation structure located in the conductive separation layer on the side facing away from the first substrate is greater than zero. That is, there is a physical gap between the support pillar and the conductive separation structure, ensuring that the surface of the support pillar does not directly contact the conductive separation structure, thereby preventing cathode material from covering the support pillar. This structural design effectively prevents damage to the cathode film layer above the support pillar due to gravity during panel assembly, significantly improving the appearance and display quality of the product.

[0027] Therefore, through this inventive concept, without changing the properties of the cathode material itself, by simply optimizing the relative positions of the support pillars and the conductive separation layer, excellent display effects can be achieved in high-resolution, FMM-free rigid OLED products while maintaining good structural strength.

[0028] Specifically, in combination Figure 1 and Figure 2 This application provides a display panel 100, including: a first substrate 101, a pixel definition layer 110, a first electrode layer 120, a conductive separation layer 130, a support layer 140, and a second electrode layer 150. The pixel definition layer 110 is located on one side of the first substrate 101, the first electrode layer 120 is located on the side of the pixel definition layer 110 opposite to the first substrate 101, and the conductive separation layer 130 is located on the side of the pixel definition layer 110 opposite to the first substrate 101.

[0029] The first substrate 101 includes a pixel circuit. The pixel circuit is used to drive the light-emitting device to emit light; therefore, the first substrate 101 can be an array substrate.

[0030] The pixel definition layer 110 includes multiple pixel openings 111. Each pixel opening 111 includes a light-emitting layer 104, a first electrode 121, and a pixel encapsulation layer 103. In one possible implementation, the projection of the light-emitting layer 104 in the first direction X does not overlap with the projection of the support pillar 141 in the first direction X. For example, the light-emitting layer 104 includes multiple first structures, and each light-emitting device includes one first structure. The minimum distance between adjacent first structures is greater than zero. In a specific fabrication process, the light-emitting layer can be etched through an etching process to prevent leakage between pixels. In this implementation, the light-emitting layer 104 is a collective term for a hole injection layer, a hole transport layer, an electron blocking layer, an emissive layer (EML), a hole blocking layer, an electron transport layer, and an electron injection layer. Furthermore, the first structure includes a portion of a common organic layer, which includes at least one of the hole injection layer, hole transport layer, electron blocking layer, hole blocking layer, electron transport layer, and electron injection layer.

[0031] The first electrode layer 120 includes a first electrode 121. The projection of the first electrode 121 in a first direction X covers the projection of the pixel opening 111 in the first direction X; the first direction X is the stacking direction of the first substrate 101 and the pixel definition layer 110. The first electrode 121 can be a common electrode, such as a cathode. The second electrode layer 150 includes a second electrode 151. The second electrode 151 is electrically connected to the pixel circuit. The second electrode 151 is located on the side of the first substrate 101 facing the pixel definition layer 110, and the second electrode 151 can be a positive electrode. The pixel circuit transmits a voltage signal to the second electrode 151, creating a voltage difference between the second electrode 151 and the first electrode 121, thereby causing the light-emitting layer 104 to emit light.

[0032] The conductive separation layer 130 includes a plurality of first conductive separation structures 1311. The first conductive separation structures 1311 are located on the side of the conductive separation layer 130 facing away from the first substrate 101. That is, the film layer containing the first conductive separation structure 1311 is a part of the conductive separation layer 130, and the film layer containing the first conductive separation structure 1311 is the film layer of the conductive separation layer 130 that is farthest from the first substrate 101 in the first direction X. For example, the conductive separation layer 130 includes the first conductive separation layer 130, and the first conductive separation structure 1311 is located within the first conductive separation layer 130; in the conductive separation layer 130, and in the first direction X, the first conductive separation layer 130 is farthest from the first electrode plate. The first conductive separation structure 1311 is located between two adjacent pixel openings 111, and the first conductive separation structure 1311 is electrically connected to the first electrode 121 corresponding to the two adjacent pixel openings 111. The first conductive separation structure 1311 enables the first electrodes 121 to be connected to each other, forming a common electrode structure, thereby reducing the complexity of wiring.

[0033] The support layer 140 includes multiple support columns 141. For example... Figure 1 As shown, in one possible implementation, the display panel further includes a second substrate 102, located on the side of the support pillar 141 opposite to the first substrate 101. The support pillar 141 is used to support a mask for depositing a common organic layer or to support the second substrate 102 during the manufacturing process, wherein the second substrate 102 can be a touch substrate, a glass cover, etc. Figure 3 As shown, in one possible implementation, the support pillars 141 are evenly distributed on the display panel 100 to balance the pressure. Along the first direction X, the support pillars 141 do not overlap with the light-emitting device, thereby avoiding the support pillars 141 from obstructing the light emission of the light-emitting device and adversely affecting the light emission efficiency of the display panel 100.

[0034] Wherein, the minimum distance between the first surface 1411 of the support post 141 and the first conductive separation structure 1311 in the first direction X is greater than zero, and the first surface 1411 of the support post 141 is the surface of the support post 141 that faces away from the first substrate 101. For example, with the light-emitting surface of the display panel 100 as the top surface as the viewing angle, the first surface 1411 of the support post 141 can be the top surface.

[0035] The minimum distance in the stacking direction between the first surface 1411 of the support pillar 141 and the first conductive separation structure 1311 located in the conductive separation layer 130 and on the side opposite to the first substrate 101 is greater than zero. That is, there is a physical gap between the support pillar 141 and the conductive separation structure, ensuring that the surface of the support pillar 141 does not directly contact the conductive separation structure, thereby preventing the cathode material from directly covering the support pillar 141. This structural design effectively prevents the cathode film layer above the support pillar 141 from being damaged by gravity during the panel assembly process, significantly improving the appearance and display quality of the product.

[0036] The display panel provided in this embodiment has a minimum distance greater than zero between the first surface of the support pillar and the first conductive separation structure in the stacking direction. This prevents the cathode material from adhering to the surface of the support pillar during the evaporation process, fundamentally eliminating the physical conditions that cause pressure damage. Furthermore, the minimum distance greater than zero between the first surface of the support pillar and the first conductive separation structure in the stacking direction not only solves the appearance defect problem in the screen-off state but also significantly improves the long-term reliability of the panel.

[0037] In this embodiment, repeated damage to the cathode material on the support column surface is avoided, effectively preventing the risk of electrical failure and extending product lifespan. Furthermore, this structural design is fully compatible with FMM-free processes, requiring no modification to existing vapor deposition equipment, significantly lowering the barrier to technology adoption.

[0038] Furthermore, the technical solution described in this embodiment, while ensuring the strength of the support column structure, maximizes the aperture ratio of the display area, offering significant advantages for high-resolution rigid OLED products. At high pixel densities, traditional PS designs result in more noticeable pressure marks, while this solution, through precise spatial control, ensures excellent display uniformity even at high resolutions, providing a reliable technical guarantee for the mass production of high-end display products.

[0039] like Figure 4 As shown, in one possible implementation, the conductive separation layer 130 includes a support post opening, and the support post opening includes a support post 141. For example, along the first direction X, the height of the support post 141 is greater than the height of the support post opening, so the projection of the first surface 1411 in the first direction X does not overlap with the projection of the first conductive separation structure 1311 in the first direction X.

[0040] In this implementation, an opening is made in the conductive separation layer 130 to accommodate the support pillar 141, which prevents the conductive separation layer 130 from covering the support pillar 141. When the support pillar 141 supports the touch substrate or the glass cover, it will not squeeze the conductive separation layer 130, thus fundamentally preventing the common electrode from breaking due to the pressure of the touch substrate or the glass cover on the first conductive separation structure 1311.

[0041] Meanwhile, the conductive separation layer 130 includes a support pillar opening, and the support pillar 141 is contained within the support pillar opening. This design allows the support pillar 141 to be precisely positioned inside the conductive separation layer 130, ensuring the structural stability of the support pillar 141. Therefore, this design simplifies the manufacturing process and ensures that cathode material cannot adhere to the surface of the support pillar 141, further optimizing display quality.

[0042] like Figure 1 As shown, in one possible implementation, the opening of the support pillar penetrates the conductive separation layer 130. This penetration increases the contact area between the support pillar 141 and the opening, thereby improving the stability of the support pillar 141. Simultaneously, the penetration of the opening through the conductive separation layer 130 means that the support pillar 141 can completely pass through it; that is, the support pillar 141 only contacts the conductive separation layer 130 on its sidewall, and there is no contact between the support pillar 141 and the conductive separation structure in the first direction X. This through-type structure completely isolates the contact path between the cathode material and the support pillar 141, fundamentally eliminating the risk of cathode damage, and is particularly suitable for high-resolution rigid OLED products.

[0043] like Figure 4As shown, in one possible implementation, the maximum height of the support column opening in the first direction X is less than the minimum height of the conductive separation layer 130 in the first direction X.

[0044] In this implementation, the maximum height of the support column opening in the first direction X is less than the minimum height of the conductive separation layer 130 in the first direction X, meaning that the support column opening does not completely penetrate the conductive separation layer 130. This partial penetration ensures sufficient mechanical strength for the conductive separation layer 130 around the support column opening while maintaining its overall integrity. Therefore, this structural design satisfies the support function requirements, avoids the accumulation of cathode material on the surface of the support column 141, and reduces the resistance of the conductive separation layer 130, achieving multiple optimizations in structural strength, display quality, and power consumption reduction.

[0045] like Figure 5 As shown, in one possible implementation, the conductive separation layer 130 further includes a second conductive separation structure 1321. The second conductive separation structure 1321 is adjacent to the first conductive separation structure 1311 and located on the side of the first conductive separation structure 1311 facing the first substrate 101, and the second conductive separation structure 1321 is electrically connected to the first electrode 121. For example, the conductive separation layer 130 includes a second conductive separation layer 130, which is located on the side of the first conductive separation layer 130 facing the first substrate 101, and the second conductive separation structure 1321 is located on the second conductive separation layer 130. The second conductive separation structure 1321 is partially located on the side of the support post 141 away from the first substrate 101 and contacts the first surface 1411, while the first conductive separation structure 1311 is partially located on the side of the first surface 1411 away from the first substrate 101.

[0046] For example, the projection of the first conductive separation structure 1311 in the first direction X covers the projection of the support column 141 in the first direction X, and the projection of the second conductive separation structure 1321 in the first direction X covers the projection of the support column 141 in the first direction X. Alternatively, the first conductive separation structure 1311 and the second conductive separation structure 1321 may both be a full-surface structure between adjacent pixel openings 111. The fact that the projection of the first conductive separation structure 1311 in the first direction X covers the projection of the support column 141 in the first direction X, or that the first conductive separation structure 1311 is a full-surface structure between adjacent pixel openings 111, means that the support column 141 is completely surrounded by the first conductive separation structure 1311 in the vertical direction. This fully enclosed design ensures the continuity of electrical connections and prevents the conductive separation layer 130 from completely adhering to the first surface 1411, thereby greatly reducing the risk of pressure damage, and is particularly suitable for high-resolution display panels 100.

[0047] In this implementation, the first conductive separation structure 1311 is isolated from the first surface 1411 of the support pillar 141 by the second conductive separation structure 1321, preventing the first conductive separation structure 1311 from accumulating and being squeezed on the first surface 1411 of the support pillar 141. Moreover, the use of a full-surface structure between the first conductive separation structure 1311 and the second conductive separation structure 1321 between the pixel opening 111 helps to reduce the total impedance of the conductive separation layer 130, thereby saving power consumption.

[0048] Meanwhile, the first conductive separation structure 1311 and the second conductive separation structure 1321 form a double-layer conductive separation structure that wraps around the support column 141. This wrapping structure of the support column 141 not only ensures the continuity of electrical connection, but also reduces the complete coverage of the cathode material on the first surface 1411 of the support column 141 through physical isolation, while enhancing the structural stability of the support column 141 and effectively solving the problem of indentation in the screen-off state.

[0049] like Figure 2 As shown, in one possible implementation, the second conductive separation structure 1321 and the first conductive separation structure 1311 are staggered at the pixel opening 111 to increase the contact area between the first electrode 121 and the conductive separation layer 130, preventing peeling or breakage between the first electrode 121 and the conductive separation layer 130. For example, along the arrangement direction of the pixel opening 111, the length of the second conductive separation structure 1321 is less than the length of the first separation structure, thereby forming a concave-convex structure with a shorter lower section and a longer upper section. This concave-convex structure can increase the contact area between the first electrode 121 and the conductive separation layer 130.

[0050] In order to improve the light emission efficiency of the display panel 100, in one possible implementation, the first conductive separation layer 130 is made of a transparent conductive material, for example, the first conductive separation layer 130 is made of ITO.

[0051] like Figure 6 As shown, in one possible implementation, the support post 141 is located on the side of the first conductive separation structure 1311 facing away from the first substrate 101, and the projection of the first conductive separation structure 1311 in the second direction Y does not overlap with the projection of the support post 141 in the second direction Y. The second direction Y is perpendicular to the first direction X, for example, the second direction Y is the arrangement direction of the support post 141, or the second direction Y is a direction parallel to the plane where the first substrate 101 is located.

[0052] In this implementation, the support pillar 141 is completely stacked with the surface of the first conductive separation structure 1311 facing away from the first substrate 101, avoiding direct contact between the first conductive separation structure 1311 and the first surface 1411 of the support pillar 141. This prevents the first conductive separation structure 1311 from being pressed by the support pillar 141 and the touch substrate or cover plate located on the side of the support pillar 141 facing away from the first substrate 101, which is supported by the support pillar 141. The fact that the first conductive separation structure 1311 is not located between the first surface 1411 of the support pillar 141 and the touch substrate (or cover plate) effectively prevents the first conductive separation structure 1311 from being crushed or broken.

[0053] In one possible implementation, the first conductive structure is a full-surface structure between adjacent pixel openings 111, and / or, the second conductive structure is a full-surface structure between adjacent pixel openings 111.

[0054] In one possible implementation, the area of ​​the second surface 1412 of the support post 141 is greater than or equal to the area of ​​the first surface 1411, and the second surface 1412 of the support post 141 is the surface of the support post 141 facing the first substrate 101.

[0055] In this implementation, such as Figure 7 As shown, when the area of ​​the second surface 1412 is equal to the area of ​​the first surface 1411, it means that the support column 141 is rectangular. The upper and lower surfaces of the rectangular support column 141 are subjected to uniform force, which can evenly bear the pressure of the touch substrate or cover plate. This helps to avoid tilting or displacement caused by uneven force during the board assembly process, thereby further reducing the risk of cathode pressure damage and extending the product's service life.

[0056] In this implementation, such as Figure 1 As shown, when the area of ​​the second surface 1412 is larger than the area of ​​the first surface 1411, it means that the support column 141 has a conical structure, which helps to improve the stability of the support column 141. Furthermore, the area of ​​the second surface 1412 being larger than the first surface 1411 means that the pressure on the second surface 1412 is less than the pressure on the first surface 1411, which helps to reduce the risk of damage to the first electrode 121 and improves the product's service life.

[0057] In one possible implementation, the shape of the first surface 1411 is similar to the shape of the second surface 1412. For example, the shape of the first surface 1411 is circular, elliptical, polygonal, etc. The polygon is a triangle, quadrilateral, or hexagonal, etc.

[0058] like Figure 8As shown, in one possible implementation, the area of ​​the second surface 1412 of the support post 141 is smaller than the area of ​​the first surface 1411, and the second surface 1412 of the support post 141 is the surface of the support post 141 facing the first substrate 101.

[0059] In this implementation, the area of ​​the second surface 1412 of the support post 141 is smaller than the area of ​​the first surface 1411, meaning that the support post 141 has an inverted conical structure. This inverted conical structure allows the bottom of the support post 141 to be narrower than its top. In the specific implementation process, the support post 141 can be first attached to the touch substrate (or cover plate) and then the boards can be assembled. Since the support post 141 is first set on the touch substrate (or cover plate), the first conductive separation structure 1311 and the second conductive separation structure 1321 can form a full-surface structure between adjacent pixel openings 111. The full-surface structure of the first conductive separation structure 1311 and the second conductive separation structure 1321 has a larger force-bearing area, thereby evenly distributing the pressure from the support post 141, thus helping to avoid contact between the top of the support post 141 and the cathode material, effectively solving the appearance quality problem in the screen-off state. In addition, since the process involves first setting the support post 141 on the touch substrate (or cover plate) and then bonding the plates together, there are no conductive structures on the support post 141, thus avoiding visual problems caused by obvious indentations. At the same time, the support post 141 can also play a good supporting role.

[0060] like Figure 9 As shown, this application embodiment also provides a display device 200, including the display panel 100 provided in any of the foregoing embodiments.

[0061] The display device provided in this embodiment can be a display terminal, such as a mobile phone, computer, monitor, television, smart wearable, advertising display screen, vehicle display, etc.

[0062] The display device provided in this embodiment possesses excellent display quality, especially in that it does not exhibit noticeable indentations when the screen is off, significantly enhancing the user experience and product competitiveness. This display device can be widely used in terminal devices such as smartphones, tablets, and monitors, and has broad market application prospects.

[0063] The embodiments of this application also need to be explained as follows: (1) The accompanying drawings corresponding to the embodiments of this application only involve the structures involved in the embodiments of this application. Other structures can be referred to the general design.

[0064] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of this application, i.e., these drawings are not drawn to actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "above" or "below" another element, the element may be "directly" located "above" or "below" the other element or there may be intermediate elements.

[0065] (3) Where there is no conflict, the embodiments of this application and the features in the embodiments can be combined with each other to obtain new embodiments. The new embodiments still fall within the scope of disclosure of the embodiments of this application, and the new embodiments can provide a basis for the protection scope that this application wants to achieve.

[0066] (4) For the same or similar parts between the various embodiments or implementations in this specification, please refer to each other. In particular, for the device embodiments and terminal embodiments, since they are basically similar to the method embodiments or implementations, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiments.

[0067] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed herein should be included within the protection scope of the embodiments of this application.

Claims

1. A display panel, characterized in that, include: The first substrate includes pixel circuitry; A pixel definition layer is located on one side of the first substrate, and the pixel definition layer includes a plurality of pixel openings; A first electrode layer is located on the side of the pixel definition layer opposite to the first substrate, and the first electrode layer includes a first electrode; A conductive separation layer includes a plurality of first conductive separation structures. The first conductive separation structures are located on the side of the conductive separation layer away from the first substrate. The first conductive separation structures are located between two adjacent pixel openings. The first conductive separation structures are electrically connected to the first electrodes corresponding to the two adjacent pixel openings, respectively. The support layer includes multiple support columns; Wherein, the minimum distance between the first surface of the support post and the first conductive separation structure in the first direction is greater than zero, the first surface of the support post is the surface of the support post facing away from the first substrate, and the first direction is the stacking direction of the first substrate and the pixel definition layer.

2. The display panel according to claim 1, characterized in that, The conductive separation layer includes a support column opening, and the support column is included within the support column opening.

3. The display panel according to claim 2, characterized in that, The opening of the support column penetrates the conductive separation layer.

4. The display panel according to claim 2, characterized in that, The maximum height of the support column opening in the first direction is less than the minimum height of the conductive separation layer in the first direction.

5. The display panel according to claim 1, characterized in that, The conductive separation layer further includes a second conductive separation structure, which is adjacent to the first conductive separation structure and located on the side of the first conductive separation structure facing the first substrate; a portion of the second conductive separation structure is located on the side of the support column away from the first substrate and in contact with the first surface, and a portion of the first conductive separation structure is located on the side of the first surface away from the first substrate.

6. The display panel according to claim 5, characterized in that, The projection of the first conductive separation structure in the first direction covers the projection of the support column in the first direction.

7. The display panel according to claim 1, characterized in that, The support column is located on the side of the first conductive separation structure away from the first substrate, and the projection of the first conductive separation structure in the second direction does not overlap with the projection of the support column in the second direction.

8. The display panel according to claim 1, characterized in that, The area of ​​the second surface of the support column is greater than or equal to the area of ​​the first surface, and the second surface of the support column is the surface of the support column facing the first substrate.

9. The display panel according to claim 1, characterized in that, The area of ​​the second surface of the support column is smaller than the area of ​​the first surface, and the second surface of the support column is the surface of the support column facing the first substrate.

10. The display panel according to claim 1, characterized in that, It also includes a second substrate, which is located on the side of the support column opposite to the first substrate.

11. A display device, characterized in that, Includes the display panel as described in any one of claims 1-10.

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