Display motherboard, display panel, preparation method thereof and display device

Abstract

The application relates to a display mother board, a display panel and a preparation method thereof, and a display device. The display mother board has a plurality of unit areas and a cutting area. The unit area comprises a display area and a non-display area. The non-display area comprises a binding area. The display mother board comprises a substrate, an array circuit layer, a light-emitting functional layer, an encapsulation layer, a touch structure, a test pin, a touch lead wire and a switch circuit. The touch structure is located in the unit area and on the side of the encapsulation layer away from the light-emitting functional layer. The touch structure comprises a touch electrode and a touch trace, the touch electrode is located in the display area, and the touch trace is connected with the touch electrode and extends to the binding area. The test pin is located in the cutting area. The touch lead wire comprises a first lead wire and a second lead wire. The input end of the switch circuit is connected with the touch trace through the first lead wire, and the output end of the switch circuit is connected with the test pin through the second lead wire. The application can effectively prevent the short circuit of a touch channel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display motherboard, a display panel, a method for preparing the same, and a display device. Background Technology

[0002] In the manufacturing process of display panels, a display motherboard is typically prepared first. This motherboard is then laser-cut to form multiple independent display panels. Furthermore, the motherboard usually has touch leads extending from the area containing the display panels to the area where the panels are cut away, facilitating touch functionality testing of each display panel.

[0003] However, when using laser cutting, carbonization of the organic material edges often occurs, which can lead to short circuits between touch leads and consequently short circuits between touch channels of the display panel. Summary of the Invention

[0004] Therefore, it is necessary to provide a display motherboard, display panel, its manufacturing method, and display device that can effectively prevent short circuits in the touch channel, addressing the aforementioned technical problems.

[0005] A display motherboard has multiple unit areas and a cut-off area, the multiple unit areas are spaced apart, the cut-off area is located between the unit areas, each unit area includes a display area and a non-display area, the non-display area surrounds the display area, and the non-display area includes a bonding area; the display motherboard includes:

[0006] Substrate;

[0007] An array circuit layer is located on one side of the substrate;

[0008] A light-emitting functional layer is located on the side of the array circuit layer away from the substrate;

[0009] The encapsulation layer is located on the side of the light-emitting functional layer away from the array circuit layer;

[0010] A touch structure is located within the unit area and on the side of the encapsulation layer away from the light-emitting functional layer. The touch structure includes a touch electrode and touch traces. The touch electrode is located in the display area, and the touch traces connect to the touch electrode and extend to the bonding area.

[0011] The test pin is located in the cut-off area;

[0012] The touch lead includes a first lead and a second lead;

[0013] A switching circuit, wherein the input terminal of the switching circuit is connected to the touch trace via the first lead, and the output terminal of the switching circuit is connected to the test pin via the second lead.

[0014] In one embodiment, the display motherboard further includes:

[0015] First control pin;

[0016] The control line connects the first control pin to the control terminal of the switching circuit.

[0017] In one embodiment, the first control pin is located in the cut-off area.

[0018] A display panel having a display area and a non-display area, the non-display area surrounding the display area and including a bonding area, the display panel comprising:

[0019] Substrate;

[0020] An array circuit layer is located on one side of the substrate;

[0021] A light-emitting functional layer is located on the side of the array circuit layer away from the substrate;

[0022] The encapsulation layer is located on the side of the light-emitting functional layer away from the array circuit layer;

[0023] A touch structure is located on the side of the encapsulation layer away from the light-emitting functional layer, including a touch electrode and touch traces. The touch electrode is located in the display area, and the touch traces are connected to the touch electrode and extend to the bonding area.

[0024] The touch lead includes a first lead and a second lead, the second lead extending to the edge of the non-display area;

[0025] A switching circuit, wherein the input terminal of the switching circuit is connected to the touch trace via the first lead, and the output terminal of the switching circuit is connected to the second lead;

[0026] The circuit board is bonded to the bonding area.

[0027] In one embodiment, the display panel further includes a control line connected to the control terminal of the switching circuit and extending to the edge of the non-display area.

[0028] In one embodiment, the bonding area is provided with a plurality of bonding pins, the circuit board is bonded to the bonding area through the plurality of bonding pins, and the plurality of bonding pins include a second control pin, the control line is also connected to the second control pin;

[0029] Optionally, the circuit board includes a touch and display driver integrated circuit board;

[0030] Optionally, the circuit board may also include a flexible circuit board.

[0031] In one embodiment, the switching circuit and / or the first lead and / or the second lead are located in the array circuit layer;

[0032] Optionally, the array circuit layer includes a first transistor located in the display area, and the switching circuit includes a second transistor, wherein the first transistor and the second transistor are disposed on the same layer.

[0033] In one embodiment, the non-display area includes a first sub-area, which is located on one side of the display area in a first direction and includes the bonding area and the wiring area, with the switching circuit located in the wiring area;

[0034] Optionally, a plurality of the switch circuits are provided on both sides of the binding area in the second direction, and the switch circuits located on the same side of the binding area are arranged sequentially at intervals along the second direction, the second direction intersecting the first direction.

[0035] A method for manufacturing a display panel, comprising:

[0036] Provide the aforementioned display motherboard;

[0037] Connect the test fixture to the test pins and control the switch circuit to conduct in order to test the touch structure;

[0038] The display motherboard is cut to form multiple display units;

[0039] The circuit board is bound in the bonding area of ​​the display unit;

[0040] The switch circuit is turned off.

[0041] A display device includes a display panel as described above or a display panel prepared according to the method described above.

[0042] In the aforementioned display motherboard, display panel, its manufacturing method, and display device, the touch structure within each unit area of ​​the display motherboard includes touch electrodes and touch traces. The touch traces connect to the touch electrodes and extend to the bonding area. Simultaneously, touch leads are provided, including first leads and second leads, and a switching circuit is provided between the first and second leads. This switching circuit controls the conductivity between the first and second leads, thereby controlling the conductivity between the touch traces and the test pins. Therefore, before cutting the display motherboard, the switching circuit can be turned on, allowing an external test fixture to perform touch function tests on the touch structure within each unit area. After cutting the display motherboard, the switching circuit can be turned off. Even if a short circuit occurs between the second leads of different touch channels during cutting, the switch circuit disconnects the second lead from the first lead, preventing short circuits between touch channels and ensuring the normal touch function of the product is not affected.

[0043] Meanwhile, one end of the first lead is directly connected to the touch trace. Therefore, when testing the touch function of the touch structure using an external test fixture, it is not necessary to bond the circuit board to the bonding area. Thus, when the touch function of a certain unit area is found to be faulty, only that unit area of ​​the display motherboard needs to be scrapped, without wasting the circuit board, thereby effectively saving process costs. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 This is a partial plan view of the display motherboard in one embodiment of this application;

[0046] Figure 2 for Figure 1 A partially enlarged schematic diagram of the display motherboard;

[0047] Figure 3 This is a partially enlarged schematic diagram of the display motherboard in another embodiment;

[0048] Figure 4 This is a schematic diagram illustrating the testing of a display motherboard using a test fixture in one embodiment;

[0049] Figure 5 This is a plan view of a display panel according to one embodiment of this application;

[0050] Figure 6 This is a schematic diagram of the manufacturing process of the display panel in one embodiment of this application.

[0051] Explanation of reference numerals in the attached figures:

[0052] 100 - Touch structure, 110 - Touch electrode, 120 - Touch trace, 200 - Test pin, 300 - Touch lead, 310 - First lead, 320 - Second lead, 400 - Switch circuit, 500 - First control pin, 600 - Control line, 700 - Second control pin, 800 - Circuit board, 900 - Test fixture, 910 - Test device, A1 - Unit area, A11 - Display area, A12 - Non-display area, A12a - First sub-area, A121 - Binding area, A122 - Tracing area, A2 - Cut-off area. Detailed Implementation

[0053] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0055] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0056] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as "on" another layer or substrate, the layer or element may be directly on said other layer or substrate, or there may be intermediate layers. Furthermore, it is understood that when a layer is referred to as "between" two layers, the layer may be the only layer between said two layers, or there may be one or more intermediate layers. Additionally, the same reference numerals always denote the same elements.

[0057] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted as the layer, region, or element being connected not only directly but also through other constituent elements placed therebetween. For example, when a layer, region, element, etc., is described as being connected or electrically connected, the layer, region, element, etc., can not only be directly connected or directly electrically connected, but can also be connected or electrically connected through another layer, region, element, etc., placed therebetween.

[0058] In the following text, although terms such as “first” and “second” may be used to describe various components, these components are not necessarily limited to the terms above. The terms above are only used to distinguish one component from another. It will also be understood that expressions used in the singular form include plural expressions, unless the singular form has a distinctly different meaning in the context.

[0059] When a phrase such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not individual elements within that list. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. As used in the application documents, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0060] In one embodiment, see Figure 1 as well as Figure 2 A display motherboard is provided, which has multiple unit areas A1 and a cut-off area A2. The multiple unit areas A1 are spaced apart, and the cut-off area A2 is located between the unit areas A1.

[0061] After the display motherboard is cut, a display panel can be formed based on each unit area A1, while the cut-off area A2 is cut away. For example, the display panel is an organic light-emitting display panel.

[0062] Unit area A1 includes display area A11 and non-display area A12, therefore the display panel formed by cutting also includes display area A11 and non-display area A12. Non-display area A12 surrounds display area A11, and non-display area A12 includes bonding area A121.

[0063] The shape of unit area A1, the shape of display area A11 within it, and the shape of non-display area A12 can be a regular shape such as a square, or an irregular shape.

[0064] For example, please refer to Figure 2 The display area A11 of unit area A1 can be circular in shape. In this case, a display panel for products such as watches can be formed based on unit area A1.

[0065] Of course, the display area A11 of cell A1 is not necessarily circular. For example, please refer to... Figure 3 The shape of the display area A11 can also be square, etc. In this case, a display panel for products such as mobile phones can be formed based on the unit area A1.

[0066] Lines may be installed in the non-display area A12 outside the display area A11.

[0067] Meanwhile, the display motherboard includes a substrate (not shown), an array circuit layer (not shown), a light-emitting functional layer (not shown), an encapsulation layer (not shown), a touch structure 100, test pins 200, touch leads 300, and a switching circuit 400. The array circuit layer is located on one side of the substrate. The light-emitting functional layer is located on the side of the array circuit layer away from the substrate. The encapsulation layer is located on the side of the light-emitting functional layer away from the array circuit layer. The touch structure 100 is located within the cell area A1 and is located on the side of the encapsulation layer away from the light-emitting functional layer.

[0068] The substrate can be either a flexible substrate or a rigid substrate.

[0069] The array circuit layer may specifically include a pixel circuit layer and a circuit connection layer. The pixel circuit layer may include multiple pixel circuits arranged in the A11 array of the display area. The pixel circuits may include, but are not limited to, 7T1C or 8T1C circuits. The circuit connection layer may include multiple layers of traces to facilitate the upward routing of signals from the pixel circuits to the light-emitting functional layer.

[0070] The light-emitting functional layer can include light-emitting devices of various colors, such as red, green, and blue light-emitting devices. Each light-emitting device can be configured to correspond one-to-one with a pixel circuit, and the corresponding pixel circuits can be connected via traces in the circuit connection layer.

[0071] For example, a light-emitting device may include an anode, an organic light-emitting material layer, and a cathode.

[0072] Multiple anodes can be spaced apart on the array circuit layer. A pixel definition layer with pixel openings can be formed on the anodes. The pixel openings can expose the anodes. An organic light-emitting material layer of the corresponding color can be formed within the pixel opening. The organic light-emitting material layer can contain multiple organic layers. Each light-emitting device can have its own independent cathode. Alternatively, during the fabrication of the display motherboard, after forming the organic light-emitting material layers of each color, the cathode can be deposited across the entire surface, allowing all light-emitting devices to share a common cathode.

[0073] The encapsulation layer may cover the light-emitting functional layer. Exemplarily, the encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer covers the light-emitting functional layer, the organic encapsulation layer covers the first inorganic encapsulation layer, and the surface of the organic encapsulation layer away from the first inorganic encapsulation layer may be relatively flat. The second inorganic encapsulation layer covers this flat surface of the organic encapsulation layer.

[0074] Please see Figure 2 The touch structure 100 is located on the encapsulation layer and includes touch electrodes 110 and touch traces 120.

[0075] For example, the touch structure 100 may include a plurality of self-contained touch units. In this case, the touch structure 100 may include a single-layer touch electrode 110 and touch traces 120.

[0076] For example, the touch structure 100 may also include multiple inter-capacitive touch units. In this case, the touch structure 100 may include a dual-layer touch electrode 110 and touch traces 120.

[0077] Touch electrodes 110 are located in display area A11, thereby enabling touch control of display area A11. Each unit area A1 may include multiple touch electrodes 110. When the touch structure 100 includes multiple self-capacitive touch units, each touch unit may include one touch electrode 110. When the touch structure 100 includes multiple mutual-capacitive touch units, each touch unit may include a pair of touch electrodes 110.

[0078] Touch traces 120 connect to touch electrodes 110. Each touch unit and its connected touch traces 120 can form a touch channel.

[0079] Simultaneously, the touch traces 120 within each unit area A1 extend from the display area A11 to the bonding area A121. The bonding area A121 can be used to bond the circuit board 800. After cutting the display motherboard to form multiple independent display panels in each unit area A1, the bonding area A121 of the circuit board 800 can be used for bonding. After bonding the circuit board 800, the circuit board 800 can connect to the touch traces 120 extending to the bonding area A121, thereby electrically connecting to the touch structure 100.

[0080] Test pin 200 is located in cut-off area A2. Exemplarily, bonding area A121 is located on one side of display area A11 in the first direction. Test pin 200 may be located within the cut-off area A2 of bonding area A121, away from display area A11 in the first direction.

[0081] Please see Figure 4The touch lead 300 is used to connect the touch trace 120 and the test pin 200, so that the external test fixture 900 can perform touch function testing on the touch structure 100 in each unit area A1 before cutting the display motherboard. For example, the test fixture 900 may include a test device 910, which can test the touch function.

[0082] The touch lead 300 includes a first lead 310 and a second lead 320.

[0083] The input terminal of the switch circuit 400 is connected to the touch trace 120 via the first lead 310, and the output terminal of the switch circuit 400 is connected to the test pin 200 via the second lead 320. That is, the two ends of the first lead 310 are connected to the switch circuit 400 and the touch trace 120, respectively, and the two ends of the second lead 320 are connected to the switch circuit 400 and the test pin 200, respectively. In this case, the switch circuit 400 is positioned between the first lead 310 and the second lead 320.

[0084] For example, the switching circuit 400 may include a MOSFET. In this case, one of the source and drain of the MOSFET may be connected to the first lead 310, and the other may be connected to the second lead 320.

[0085] In this embodiment, within each unit area A1 of the display motherboard, the touch structure 100 includes a touch electrode 110 and a touch trace 120. The touch trace 120 connects to the touch electrode 110 and extends to the bonding area A121. Simultaneously, a touch lead 300 is provided, including a first lead 310 and a second lead 320, and a switch circuit 400 is provided between the first lead 310 and the second lead 320. This switch circuit 400 can control the conduction between the first lead 310 and the second lead 320, thereby controlling the conduction between the touch trace 120 and the test pin 200. Therefore, before cutting the display motherboard, the switch circuit 400 can be turned on, allowing the external test fixture 900 to perform touch function testing on the touch structure 100 within each unit area A1. After cutting the display motherboard, the switch circuit 400 can be turned off. At this time, even if a short circuit occurs between the second leads 320 of different touch channels during cutting, the second lead 320 and the first lead 310 are disconnected through the switch circuit 400, so that a short circuit will not occur between the touch channels and the normal touch function of the product will not be affected.

[0086] Meanwhile, in this embodiment, one end of the first lead 310 is directly connected to the touch trace 120. Therefore, when the touch structure 100 is tested for touch function using an external test fixture 900, it is not necessary to bond the circuit board 800 to the bonding area A121. Therefore, when the touch function of the touch structure 100 in a certain unit area A1 is found to be faulty, only that unit area A1 of the display motherboard needs to be scrapped, without wasting the circuit board 800, thereby effectively saving process costs.

[0087] In one embodiment, see Figure 2 or Figure 3 The display motherboard also includes a first control pin 500 and a control line 600. The control line 600 connects the first control pin 500 to the control terminal of the switch circuit 400.

[0088] For example, the control line 600 may include a main line, a first connecting line connected to the main line, and a plurality of second connecting lines. The first connecting line may be connected at one end to the main line and at the other end to a first control pin 500. Each second connecting line may be configured such that one end is connected to the main line and the other end is connected to a control terminal of a switching circuit 400.

[0089] Of course, the specific form of the control line 600 is not limited to this, as long as it can connect to the first control pin 500 and the control terminals of each switch circuit 400.

[0090] At this time, when testing the touch function of the touch structure 100 of each display area A11 before cutting the display motherboard, the control signal of the control terminal of the switch circuit 400 can be applied to the same first control pin 500, which can effectively simplify the circuit.

[0091] For example, please refer to Figure 4 The control signal of the control terminal of the switching circuit 400 can be applied to the first control pin 500 through an external test fixture 900.

[0092] For example, the first control pin 500 is located in the cut-off area A2. This facilitates connection between the test fixture 900 and the first control pin 500.

[0093] Optionally, the first control pin 500 and the test pin 200 corresponding to the same unit area A1 can be located on the same side of the unit area A1. In this case, it is convenient for the test fixture 900 to connect the first control pin 500 and the test pin 200 at the same time.

[0094] Of course, the first control pin 500 and the test pin 200 corresponding to the same unit area A1 can be located on different sides of the unit area A1, which can be set according to actual needs.

[0095] In one embodiment, the bonding area A121 has a plurality of bonding pins. The circuit board 800 is bonded to the bonding area A121 via the plurality of bonding pins. Exemplarily, the pins on the circuit board 800 can be soldered to the corresponding bonding pins to bond the circuit board 800 to the bonding area A121.

[0096] Please see Figure 2 as well as Figure 5 Multiple bonding pins include a second control pin 700. Control line 600 is also connected to the second control pin 700. At this point, after bonding circuit board 800 to bonding area A121, control signals can be sent from circuit board 800 to the control terminal of switch circuit 400 to turn off each switch circuit 400.

[0097] For example, circuit board 800 includes a Touch and Display Driver Integrated Circuit Board (TDDIC). The TDDIC integrates touch control functions and display driver functions into a single chip, thereby reducing the device's internal space footprint, power consumption, and cost.

[0098] For example, circuit board 800 may also include a flexible circuit board (FPC). The flexible circuit board can provide signals to the TDDIC to control the TDDIC.

[0099] The control signal for turning off the control switch circuit 400 can be provided by TDDIC or by FPC.

[0100] Of course, in other embodiments, the switching control of the switching circuit 400 can also be implemented in other ways. For example, a corresponding control circuit can be provided in the array circuit layer to control the conduction and / or shutdown of the switching circuit 400.

[0101] In one embodiment, the switching circuit 400 and / or the first lead 310 and / or the second lead 320 and / or the test pin 200 are located in the array circuit layer.

[0102] At this time, during the fabrication of the display motherboard, the switch circuit 400 and / or the first lead 310 and / or the second lead 320 and / or the test pin 200 can be fabricated while the pixel circuit layer and / or circuit connection layer are fabricated, thereby improving process efficiency and reducing product thickness.

[0103] For example, the array circuit layer includes a first transistor located in the display area A11. The switching circuit 400 includes a second transistor. The first transistor and the second transistor are disposed on the same layer.

[0104] Specifically, the array circuit layer may include pixel circuits located in the display area A11. The pixel circuits may include a first transistor and a storage capacitor. The switching circuit 400 includes a second transistor. The first transistor and the second transistor are disposed on the same layer, that is, the gates of the first transistor and the second transistor are disposed on the same layer, the semiconductor layers of the first transistor and the second transistor are disposed on the same layer, and the gate dielectric layers of the first transistor and the second transistor are disposed on the same layer.

[0105] For example, both the first transistor and the second transistor are silicon-based thin-film transistors.

[0106] For example, both the first transistor and the second transistor are MOS transistors.

[0107] For example, when the display motherboard also includes a first control pin 500 and a control line 600, the first control pin 500 and the control line 600 may also be located in the array circuit layer.

[0108] In one embodiment, see Figure 2 Each unit area A1 has a non-display area A12, which includes a first sub-area A12a. The first sub-area A12a is located on one side of the display area A11 in the first direction D1. The first sub-area A12a includes a bonding area A121 and a routing area A122. The switching circuit 400 is located in the routing area A122. That is, the switching circuit 400 is only located in the routing area A122 and not in the bonding area A121. In other words, the switching circuit 400 is located outside the bonding area A121, thereby preventing the switching circuit 400 from interfering with the circuit board 800 and other components bonded to the bonding area A121.

[0109] For example, multiple switch circuits 400 are provided on both sides of the bonding area A121 in the second direction D2, and the switch circuits 400 located on the same side of the bonding area A121 are arranged sequentially at intervals along the second direction D2. The second direction intersects the first direction. For example, the second direction is perpendicular to the first direction.

[0110] At this point, it is convenient to divide the touch traces 120 connecting each touch electrode 110 into two groups along the second direction D2. Each group of touch traces 120 can be connected to the corresponding side of the switch circuit 400, which facilitates the routing and makes the line impedance on each touch channel more uniform.

[0111] Of course, in some embodiments, the orthographic projection of the switching circuit 400 on the substrate may overlap with the orthographic projection of the bonding region A121 on the substrate. Alternatively, the orthographic projection of the switching circuit 400 on the substrate may be located within the orthographic projection of the bonding region A121 on the substrate.

[0112] Alternatively, in some embodiments, the switching circuit 400, etc., may not be located in the array circuit layer. For example, the switching circuit 400, etc., may also be fabricated separately, such as separately after the touch structure 100 is formed, or separately before the touch structure 100 is formed. This application does not impose any limitations on this, and the specific configuration can be determined according to actual needs.

[0113] In one embodiment, see Figure 6 A method for manufacturing a display panel is provided, comprising:

[0114] Step S10: Provide the display motherboard;

[0115] Step S20: Connect the test fixture 900 to the test pin 200 and control the switch circuit 400 to conduct in order to test the touch structure 100.

[0116] Step S30: Cut the display motherboard to form multiple display units;

[0117] Step S40: Bond the circuit board 800 in the bonding area A121 of the display unit;

[0118] In step S50, the control switch circuit 400 is disconnected.

[0119] In step S10, please refer to Figure 1 The display motherboard can be the display motherboard in any of the above embodiments.

[0120] The display motherboard can have multiple unit areas A1 and cut-off areas A2. The multiple unit areas A1 are spaced apart. The cut-off areas A2 are located between the unit areas A1. Each unit area A1 includes a display area A11 and a non-display area A12. The non-display area A12 surrounds the display area A11 and includes a bonding area A121. The display motherboard includes a substrate, an array circuit layer, a light-emitting functional layer, an encapsulation layer, a touch structure 100, test pins 200, touch leads 300, and a switching circuit 400. The array circuit layer is located on one side of the substrate. The light-emitting functional layer is located on the side of the array circuit layer away from the substrate. The encapsulation layer is located on the side of the light-emitting functional layer away from the array circuit layer. The touch structure 100 is located within the unit area A1 and on the side of the encapsulation layer away from the light-emitting functional layer.

[0121] Please see Figure 2The touch structure 100 includes a touch electrode 110 and a touch trace 120. The touch electrode 110 is located in the display area A11. The touch trace 120 connects to the touch electrode 110 and extends to the bonding area A121. The test pin 200 is located in the cut-off area A2. The touch lead 300 includes a first lead 310 and a second lead 320. The input terminal of the switch circuit 400 is connected to the touch trace 120 through the first lead 310, and the output terminal of the switch circuit 400 is connected to the test pin 200 through the second lead 320.

[0122] In step S20, please refer to Figure 4 The test fixture 900 is a fixture located outside the display motherboard.

[0123] After connecting the test fixture 900 to the test pin 200, test signals can be transmitted between the two.

[0124] After the control switch circuit 400 is turned on, the first lead 310 and the second lead 320 of the touch lead 300 are connected. At this time, a path is formed between the test fixture 900, the test pin 200, the second lead 320, the switch circuit 400, the first lead 310, the touch trace 120, and the touch electrode 110, thereby enabling the transmission of test signals for each touch channel and allowing touch function testing of each touch channel.

[0125] For example, a control signal can be sent to the first control pin 500 via the test fixture 900, thereby controlling the conduction of the switching circuit 400. The first control pin 500 and the test pin 200 can both be located in the cut-off area A2.

[0126] In step S30, there may be a cutting line between the unit area A1 and the cut-out area A12 of the display motherboard. The display motherboard can be cut along the cutting line to cut off each unit area A1 to form a display unit.

[0127] For example, the display motherboard can be cut along the cutting line by laser cutting to form multiple independent display units.

[0128] For example, after step S20 detects a malfunction in unit area A1, unit area A1 can be directly discarded. In this case, step S30 does not need to cut unit area A1.

[0129] In step S40, please refer to Figure 5 The circuit board 800 can be bound in the binding area A121 of each cut-out display unit. At this time, the circuit board 800 can be connected to the touch trace 120, thereby making the circuit board 800 electrically connected to the touch trace 120.

[0130] For example, the bonding area A121 is provided with a plurality of bonding pins, and the circuit board 800 is bonded to the bonding area A121 through the plurality of bonding pins.

[0131] In step S50, after the control switch circuit 400 is turned off, the connection between the second lead 320 and the first lead 310 can be disconnected and no longer conduction is required.

[0132] For example, the multiple bonding pins of the bonding area A121 include a second control pin 700. At this time, a control signal can be sent to the second control pin 700 through the circuit board 800 to disconnect the switch circuit 400.

[0133] For example, the circuit board 800 includes a TDDIC and / or an FPC, which can send control signals to the second control pin 700 to turn off the switch circuit 400.

[0134] In this embodiment, during the fabrication of the display panel, before cutting the display motherboard, the switch circuit 400 can be turned on, allowing the external test fixture 900 to perform touch function tests on the touch structures 100 within each unit area A1. Simultaneously, after cutting the display motherboard, the switch circuit 400 can be turned off. At this time, even if a short circuit occurs between the second leads 320 of different touch channels during cutting, the second lead 320 is disconnected from the first lead 310 via the switch circuit 400, thus preventing short circuits between touch channels and ensuring the normal touch function of the product.

[0135] Meanwhile, in this embodiment, one end of the first lead 310 of the display motherboard is directly connected to the touch trace 120. Based on this, the touch function of the touch structure 100 is tested using an external test fixture 900 before cutting the display motherboard. After cutting the display motherboard, the circuit board 800 is bonded in the bonding area A121. Therefore, when the touch function of the touch structure 100 in a certain unit area A1 is found to be faulty, only that unit area A1 of the display motherboard needs to be scrapped, without wasting the circuit board 800, thus effectively saving process costs.

[0136] It should be understood that although the steps in the flowcharts of the accompanying drawings are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some of the steps in the accompanying drawings may include multiple steps or stages, which are not necessarily completed at the same time, but may be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but may be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0137] Based on the same inventive concept, embodiments of this application also provide a display panel.

[0138] In one embodiment, see Figure 5 The display panel has a display area A11 and a non-display area A12, the non-display area A12 surrounds the display area A11, and the non-display area A12 includes a binding area A121.

[0139] The shape of the display area A11 and the non-display area A12 can be a regular shape such as a square, or an irregular shape.

[0140] For example, the display area A11 can be circular. In this case, the display panel can be the display panel of a product such as a watch. Of course, the shape of the display area A11 does not have to be circular. For example, the shape of the display area A11 can also be square, etc. In this case, the display panel can be the display panel of a product such as a mobile phone.

[0141] Lines may be installed in the non-display area A12.

[0142] The display panel includes a substrate, an array circuit layer, a light-emitting functional layer, an encapsulation layer, a touch structure 100, touch leads 300, a switching circuit 400, and a circuit board 800. The array circuit layer is located on one side of the substrate. The light-emitting functional layer is located on the side of the array circuit layer away from the substrate. The encapsulation layer is located on the side of the light-emitting functional layer away from the array circuit layer. The touch structure 100 is located on the side of the encapsulation layer away from the light-emitting functional layer.

[0143] The substrate can be either a flexible substrate or a rigid substrate.

[0144] The array circuit layer may specifically include a pixel circuit layer and a circuit connection layer. The pixel circuit layer may include multiple pixel circuits arranged in the A11 array of the display area. The pixel circuits may include, but are not limited to, 7T1C or 8T1C circuits. The circuit connection layer may include multiple layers of traces to facilitate the upward routing of signals from the pixel circuits to the light-emitting functional layer.

[0145] The light-emitting functional layer can include light-emitting devices of various colors, such as red, green, and blue light-emitting devices. Each light-emitting device can be configured to correspond one-to-one with a pixel circuit, and the corresponding pixel circuits can be connected via traces in the circuit connection layer.

[0146] For example, a light-emitting device may include an anode, an organic light-emitting material layer, and a cathode.

[0147] Multiple anodes can be spaced apart on the array circuit layer. A pixel definition layer with pixel openings can be formed on the anodes. The pixel openings can expose the anodes. An organic light-emitting material layer of the corresponding color can be formed within the pixel openings. The organic light-emitting material layer can contain multiple organic layers. Each light-emitting device can have its own independent cathode, or all light-emitting devices can share a common cathode.

[0148] The encapsulation layer may cover the light-emitting functional layer. Exemplarily, the encapsulation layer may include a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer. The first inorganic encapsulation layer covers the light-emitting functional layer, the organic encapsulation layer covers the first inorganic encapsulation layer, and the surface of the organic encapsulation layer away from the first inorganic encapsulation layer may be relatively flat. The second inorganic encapsulation layer covers this flat surface of the organic encapsulation layer.

[0149] The touch structure 100 is located on the encapsulation layer and includes touch electrodes 110 and touch traces 120.

[0150] For example, the touch structure 100 may include a plurality of self-contained touch units. In this case, the touch structure 100 may include a single-layer touch electrode 110 and touch traces 120.

[0151] For example, the touch structure 100 may also include multiple inter-capacitive touch units. In this case, the touch structure 100 may include a dual-layer touch electrode 110 and touch traces 120.

[0152] Touch electrodes 110 are located in display area A11, thereby enabling touch control of display area A11. The display panel may include multiple touch electrodes 110. When the touch structure 100 includes multiple self-capacitive touch units, each touch unit may include one touch electrode 110. When the touch structure 100 includes multiple mutual-capacitive touch units, each touch unit may include a pair of touch electrodes 110.

[0153] Touch traces 120 connect to touch electrodes 110. Each touch unit and its connected touch traces 120 can form a touch channel.

[0154] Touch trace 120 extends from display area A11 to bonding area A121. Circuit board 800 is bonded in bonding area A121. Circuit board 800 can connect to touch trace 120 extending to bonding area A121, thereby electrically connecting to touch structure 100.

[0155] The touch lead 300 includes a first lead 310 and a second lead 320. The second lead 320 extends to the edge of the non-display area A12. It can be understood that the second lead 320 on the display motherboard extends from the unit area A1 to the cut-off area A2, so after the display motherboard is cut, the second lead 320 extends to the edge of the non-display area A12.

[0156] The input terminal of the switching circuit 400 is connected to the control trace 120 via the first lead 310. The output terminal of the switching circuit 400 is connected to the second lead 320.

[0157] In this embodiment, the display panel can be disconnected by controlling the switch circuit 400, so that even if a short circuit occurs between the second leads 320 of different touch channels, the touch channels will not be short-circuited, and the normal touch function of the product will not be affected. Furthermore, one end of the first lead 310 is directly connected to the touch trace 120. Therefore, during the manufacturing process of the display panel, if the touch function of the touch structure 100 in a certain unit area A1 is found to be faulty before cutting the display motherboard, only that unit area A1 of the display motherboard needs to be scrapped, without wasting the circuit board 800, thus effectively saving process costs.

[0158] In one embodiment, the display panel further includes a control line 600, which is connected to the control terminal of the switch circuit 400 and extends to the edge of the non-display area A12.

[0159] It is understandable that the control line 600 on the display motherboard can extend from the unit area A1 to the cut-off area A2. Therefore, after the display motherboard is cut, the control line 600 extends to the edge of the non-display area A12.

[0160] In one embodiment, the bonding area A121 has a plurality of bonding pins. The circuit board 800 is bonded to the bonding area A121 via the plurality of bonding pins. The plurality of bonding pins includes a second control pin 700. The control line 600 is also connected to the second control pin 700, so that a control signal can be provided through the second touch pin of the circuit board 800 bonded to the bonding area A121 to disconnect the switch circuit 400.

[0161] For example, the circuit board 800 includes a Touch and Display Driver Integrated Circuit Board (TDDIC).

[0162] For example, circuit board 800 also includes flexible circuit board (FPC).

[0163] Control signals can be provided to the second control pin 700 via TDDIC and / or FPC.

[0164] In one embodiment, the switching circuit 400 and / or the first lead 310 and / or the second lead 320 are located in the array circuit layer.

[0165] For example, the array circuit layer includes a first transistor located in the display area A11, and the switching circuit 400 includes a second transistor. The first transistor and the second transistor are disposed on the same layer.

[0166] For example, the gate of the first transistor and the gate of the second transistor are disposed in the same layer, the semiconductor layer of the first transistor and the semiconductor layer of the second transistor are disposed in the same layer, and the gate dielectric layer of the first transistor and the gate dielectric layer of the second transistor are disposed in the same layer.

[0167] For example, both the first transistor and the second transistor are silicon-based thin-film transistors.

[0168] For example, both the first transistor and the second transistor are MOS transistors.

[0169] In one embodiment, the non-display area A12 includes a first sub-area A12a. The first sub-area A12a is located on one side of the display area A11 in the first direction D1. It also includes a bonding area A121 and a wiring area A122, with the switch circuit 400 located in the wiring area A122.

[0170] For example, multiple switch circuits 400 are provided on both sides of the bonding area A121 in the second direction D2, and the switch circuits 400 located on the same side of the bonding area A121 are arranged sequentially at intervals along the second direction D2. The second direction D2 intersects the first direction D1. For example, the second direction D2 is perpendicular to the first direction D1.

[0171] At this point, it is convenient to divide the touch traces 120 connecting each touch electrode 110 into two groups along the second direction D2. Each group of touch traces 120 can be connected to the corresponding side of the switch circuit 400, which facilitates the routing and makes the line impedance on each touch channel more uniform.

[0172] Of course, in some embodiments, the orthographic projection of the switching circuit 400 on the substrate may overlap with the orthographic projection of the bonding region A121 on the substrate. Alternatively, the orthographic projection of the switching circuit 400 on the substrate may be located within the orthographic projection of the bonding region A121 on the substrate.

[0173] Alternatively, in some embodiments, the switching circuit 400 may not be located in the array circuit layer. For example, the switching circuit 400 may be fabricated separately, such as after the touch structure 100 is formed, or before the touch structure 100 is formed. This application does not impose any limitations on this, and the specific configuration can be determined according to actual needs.

[0174] Based on the same inventive concept, this application also provides a display device (not shown), which includes the display panel 100 in the above embodiments.

[0175] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0176] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0177] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0178] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display motherboard, characterized in that, The display motherboard has multiple unit areas and a cut-off area, the multiple unit areas are spaced apart, the cut-off area is located between the unit areas, each unit area includes a display area and a non-display area, the non-display area surrounds the display area, and the non-display area includes a bonding area; the display motherboard includes: Substrate; An array circuit layer is located on one side of the substrate; A light-emitting functional layer is located on the side of the array circuit layer away from the substrate; The encapsulation layer is located on the side of the light-emitting functional layer away from the array circuit layer; A touch structure is located within the unit area and on the side of the encapsulation layer away from the light-emitting functional layer. The touch structure includes a touch electrode and touch traces. The touch electrode is located in the display area, and the touch traces connect to the touch electrode and extend to the bonding area. The test pin is located in the cut-off area; The touch lead includes a first lead and a second lead; A switching circuit, wherein the input terminal of the switching circuit is connected to the touch trace via the first lead, and the output terminal of the switching circuit is connected to the test pin via the second lead.

2. The display motherboard according to claim 1, characterized in that, The display motherboard also includes: First control pin; The control line connects the first control pin to the control terminal of the switching circuit.

3. The display motherboard according to claim 2, characterized in that, The first control pin is located in the cut-off area.

4. A display panel, characterized in that, The display panel has a display area and a non-display area, the non-display area surrounding the display area, and the non-display area including a bonding area; the display panel includes: Substrate; An array circuit layer is located on one side of the substrate; A light-emitting functional layer is located on the side of the array circuit layer away from the substrate; The encapsulation layer is located on the side of the light-emitting functional layer away from the array circuit layer; A touch structure is located on the side of the encapsulation layer away from the light-emitting functional layer, including a touch electrode and touch traces. The touch electrode is located in the display area, and the touch traces are connected to the touch electrode and extend to the bonding area. The touch lead includes a first lead and a second lead, the second lead extending to the edge of the non-display area; A switching circuit, wherein the input terminal of the switching circuit is connected to the touch trace via the first lead, and the output terminal of the switching circuit is connected to the second lead; The circuit board is bonded to the bonding area.

5. The display panel according to claim 4, characterized in that, The display panel also includes a control line, which is connected to the control terminal of the switching circuit and extends to the edge of the non-display area.

6. The display panel according to claim 5, characterized in that, The bonding area is provided with multiple bonding pins, and the circuit board is bonded to the bonding area through the multiple bonding pins. The multiple bonding pins include a second control pin, and the control line is also connected to the second control pin. Optionally, the circuit board includes a touch and display driver integrated circuit board; Optionally, the circuit board may also include a flexible circuit board.

7. The display panel according to claim 4, characterized in that, The switching circuit and / or the first lead and / or the second lead are located in the array circuit layer; Optionally, the array circuit layer includes a first transistor located in the display area, and the switching circuit includes a second transistor, wherein the first transistor and the second transistor are disposed on the same layer.

8. The display panel according to claim 4, characterized in that, The non-display area includes a first sub-area, which is located on one side of the display area in a first direction and includes the bonding area and the wiring area, with the switching circuit located in the wiring area; Optionally, a plurality of the switch circuits are provided on both sides of the binding area in the second direction, and the switch circuits located on the same side of the binding area are arranged sequentially at intervals along the second direction, the second direction intersecting the first direction.

9. A method for manufacturing a display panel, characterized in that, include: Provide a display motherboard as described in any one of claims 1-3; Connect the test fixture to the test pins and control the switch circuit to conduct in order to test the touch structure; The display motherboard is cut to form multiple display units; The circuit board is bound in the bonding area of ​​the display unit; The switch circuit is turned off.

10. A display device comprising a display panel as described in any one of claims 4-8 or a display panel prepared according to the method of claim 9.

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