Display panel, method for manufacturing display panel, and display device

Abstract

The application relates to a display panel, a preparation method of the display panel and a display device. The display panel comprises an organic substrate layer, a structure function layer, a touch layer and an inorganic protective layer, the organic substrate layer comprises a display area and an edge area; the function structure layer is arranged on one side of the organic substrate layer, and the function structure layer is located in the display area; the touch layer is arranged on the side, away from the organic substrate layer, of the function structure layer; the inorganic protective layer is arranged between the organic substrate layer and the touch layer, the inorganic protective layer is arranged in the same layer as the function structure layer; and the inorganic protective layer is located in the edge area. The inorganic protective layer is arranged on the edge area of the organic substrate layer before plasma treatment, and the surface roughness of the inorganic protective layer, away from the organic substrate layer, is enhanced after the plasma treatment, so that the adhesion between the inorganic protective layer and the touch layer is relatively large, the touch layer is not prone to separation from the inorganic protective layer, and therefore the use performance of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] In flat panel display devices, thin-film transistor liquid crystal displays (TFT-LCDs) are widely used due to their small size, low power consumption, relatively low manufacturing cost, and lack of radiation. Organic electroluminescent displays (OLEDs) offer numerous advantages, including ultra-thinness, all-solid-state operation, active light emission, fast response time, high contrast, no viewing angle limitations, wide operating temperature range, low power consumption, low cost, strong shock resistance, and the ability to achieve flexible displays. They are widely used in people's daily lives and production.

[0003] However, the performance of current display panels needs to be improved. Summary of the Invention

[0004] The purpose of this application is to provide a display panel, a method for manufacturing the display panel, and a display device, with the aim of improving the performance of the display panel.

[0005] To achieve the above objectives, the technical solution adopted in the first aspect of this application is: a display panel, including an organic substrate layer, a functional structure layer, an inorganic protective layer, and a touch layer.

[0006] The organic substrate layer includes a display area and an edge area, the edge area at least partially surrounding the display area; the functional structure layer is disposed on one side of the organic substrate layer and is located in the display area; the touch layer is disposed on the side of the functional structure layer opposite to the organic substrate layer; the inorganic protective layer is disposed between the organic substrate layer and the touch layer, the inorganic protective layer is disposed in the same layer as the functional structure layer; and the inorganic protective layer is located in the edge area.

[0007] Currently, before forming the touch layer, the surface of the inorganic film layer that will come into contact with the touch layer is typically treated with plasma to increase the surface roughness of the inorganic film layer, thereby enhancing the adhesion between the inorganic film layer and the touch layer. However, plasma treatment deteriorates the surface quality of the organic film layer, reducing its adhesion and making it easy for the touch layer to separate from the organic film layer during film formation. In related technologies, the edge areas of the organic substrate layer are exposed before the touch layer is applied. During plasma treatment, the adhesion of the organic substrate layer decreases, making it easy for the touch layer on the organic substrate layer to separate from it. The beneficial effects of the display panel provided in the first aspect embodiment of this application are as follows: by setting an inorganic protective layer in the edge region of the organic substrate layer before plasma treatment, the surface roughness of the inorganic protective layer away from the organic substrate layer is enhanced after plasma treatment, which makes the adhesion between the inorganic protective layer and the touch layer greater, making it difficult for the touch layer to separate from the inorganic protective layer, thereby improving the performance of the display panel.

[0008] In some embodiments, in the distribution direction of the edge region and the display region, the inorganic protective layer and the functional structure layer on the organic substrate layer are spaced apart.

[0009] In some embodiments, the display panel further includes at least one dam disposed in the edge region, the dam being disposed in the same layer as the functional structure layer and the inorganic protective layer, and the dam being located between the functional structure layer and the inorganic protective layer.

[0010] In some embodiments, the dam is spaced apart from the inorganic protective layer in the distribution direction of the edge region and the display region, and / or, the dam is spaced apart from the functional structure layer in the distribution direction of the edge region and the display region.

[0011] In some embodiments, multiple dams are provided, and the multiple dams are spaced apart along the direction from the functional structure layer to the inorganic protective layer.

[0012] In some embodiments, the display panel further includes a planarization layer, at least a portion of which is located between adjacent dams;

[0013] Preferably, the planarization layer covers the dam.

[0014] In some embodiments, the functional structure layer includes an inorganic stack, a TFT array layer, an organic stack, and an encapsulation layer stacked sequentially along a direction away from the organic substrate layer, wherein the inorganic stack is adjacent to the organic substrate layer, and the touch layer is disposed on the side of the encapsulation layer away from the organic substrate layer.

[0015] In some embodiments, the encapsulation layer includes a first inorganic film, an organic film, and a second inorganic film stacked sequentially, wherein the first inorganic film is adjacent to the organic stack, and the touch layer is adjacent to the second inorganic film.

[0016] To achieve the above objectives, the technical solution adopted in the second aspect of this application is: a method for manufacturing a display panel, comprising:

[0017] A functional structure layer and an inorganic protective layer are disposed on the same layer of an organic substrate;

[0018] Plasma treatment is performed on the surfaces of the functional structure layer and the inorganic protective layer that are opposite to the organic substrate layer.

[0019] A touch layer is provided on the side of the functional structure layer and the inorganic protective layer that is away from the organic substrate layer.

[0020] The beneficial effects of the display panel preparation method provided in the second aspect of this application are as follows: an inorganic protective layer is provided in the edge region of the organic substrate before plasma treatment. After plasma treatment, the surface roughness of the inorganic protective layer away from the organic substrate is enhanced, resulting in a greater adhesion between the inorganic protective layer and the touch layer. This makes it difficult for the touch layer to separate from the inorganic protective layer. The touch layer in the display panel prepared by the display panel preparation method provided in the second aspect of this application is not easy to detach, thereby improving the performance of the display panel.

[0021] To achieve the above objectives, the technical solution adopted in the third aspect of this application is: a display device, including the display panel of the first aspect embodiment, or a display panel prepared by the preparation method of the display panel of the second aspect embodiment.

[0022] The beneficial effect of the display device provided in the third aspect embodiment of this application is that the adhesion between the touch layer and the inorganic protective layer in the display device is large, which can improve the performance of the display device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of the display panel in one embodiment of this application;

[0025] Figure 2 yes Figure 1 A top view of the organic substrate layer, functional structure layer, dam, and inorganic protective layer in the display panel shown;

[0026] Figure 3 yes Figure 1 A partial cross-sectional view of the display panel shown along the AA direction;

[0027] Figure 4 This is a partial cross-sectional view along the AA direction of a display panel in another embodiment of this application;

[0028] Figure 5 yes Figure 1 A partial cross-sectional view of the display panel along the BB direction;

[0029] Figure 6 This is a flowchart of a method for manufacturing a display panel according to one embodiment of this application.

[0030] Figure label:

[0031] 1. Display panel; 11. Organic substrate layer; 12. Functional structure layer; 121. Inorganic stack; 122. TFT array layer; 123. Organic stack; 124. Encapsulation layer; 1241. First inorganic film; 1242. Organic film; 1243. Second inorganic film; 13. Inorganic protective layer; 14. Touch layer; 15. Dam; 16. Planarization layer; A1. Display area; A2. Edge area. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0033] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0034] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0035] In this specification, references to "one embodiment," "some embodiments," or simply "embodiment" mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, specific features, structures, or characteristics may be combined in any suitable manner.

[0036] In flat panel display devices, thin-film transistor liquid crystal displays (TFT-LCDs) are widely used due to their small size, low power consumption, relatively low manufacturing cost, and lack of radiation. Organic electroluminescent displays (OLEDs) offer numerous advantages, including ultra-thinness, all-solid-state operation, active light emission, fast response time, high contrast, no viewing angle limitations, wide operating temperature range, low power consumption, low cost, strong shock resistance, and the ability to achieve flexible displays. They are widely used in people's daily lives and production.

[0037] In related technologies, display panels generally comprise multiple layers of stacked films. For example, a display panel includes functional structure layers (including inorganic layers, TFT array layers, organic layers, and encapsulation layers, etc.) stacked on an organic substrate, as well as a touch layer stacked on the functional structure layers. The weakest point in the film adhesion of a display panel is usually between the encapsulation layer and the touch layer. Considering that display panels generally employ thin-film encapsulation (TFE), i.e., an encapsulation structure of inorganic film, organic film, and inorganic film stacked sequentially, the inorganic protective layer is generally Si-N or Si-O, primarily serving to block water and oxygen, preventing water and oxygen from corroding the display panel and causing it to fail. The organic layer acts as a buffer layer, mainly functioning to encapsulate foreign matter, planarize the cover film, and prevent defects from occurring during the inorganic protective layer manufacturing process. Therefore, the film layer in the encapsulation layer that will contact the touch layer is the inorganic layer. To enhance the adhesion between the encapsulation layer and the touch layer, a good solution is to perform plasma treatment on the surface of the encapsulation layer that will come into contact with the touch layer after the encapsulation layer is prepared. Plasma contains a large number of high-energy particles, such as electrons, ions, and free radicals. When the surface of the encapsulation layer that will come into contact with the touch layer is exposed to plasma, these high-energy particles interact with it. On the one hand, they collide with the surface, removing contaminants and cleaning the surface. On the other hand, they trigger chemical reactions on the surface, introducing polar groups such as hydroxyl and carboxyl groups, increasing the chemical activity of the surface. After plasma treatment, the surface of the encapsulation layer that will come into contact with the touch layer is cleaned and polar groups are introduced, which helps improve the adhesion between the surface and the touch layer.

[0038] However, in display panels, the functional structure layer does not cover the edge area of ​​the organic substrate layer. This is because the display panel needs to be electrically connected to external driving circuits, power supplies, and other equipment. The edge portion of the organic substrate layer usually has electrodes, pins, or wiring areas. Through these edge electrical connection structures, driving signals and power supplies can be transmitted to the various pixels and functional modules of the display panel, enabling the normal operation of the display panel. Therefore, the functional structure layer does not cover the edge area of ​​the organic substrate layer. Alternatively, during the manufacturing process of the display panel, the edge area of ​​the organic substrate layer is needed for positioning and alignment to ensure that the functional structure layer can be accurately formed in the specified position. In addition, the edge portion can also serve as a clamping and transfer part during the process, facilitating the handling of the organic substrate layer between different manufacturing equipment. Therefore, the functional structure layer does not cover the edge area of ​​the organic substrate layer. The fact that the functional structure layer does not cover the edge area of ​​the organic substrate layer leaves the edge area of ​​the organic substrate layer exposed. When plasma treatment is applied to the surface of the encapsulation layer that will come into contact with the touch layer, the edge area of ​​the organic substrate layer will also be plasma treated, resulting in a significant decrease in the adhesion of the organic substrate layer surface. There is a risk of peeling between the touch layer and the organic substrate layer at the edge area of ​​the display panel, which makes the performance of the display panel poor. When the touch layer detaches from the display panel, the cavity in which the display panel is made is easily contaminated.

[0039] The reason for this is that, for the inorganic layer (the film layer in the encapsulation layer that will contact the touch layer in this application), moderately high-power and long-term plasma treatment can more effectively remove impurities from the surface of the inorganic layer, while generating more active sites on the surface of the inorganic layer, which is beneficial to enhancing the adhesion of the inorganic layer to other materials. However, for the organic layer (the organic substrate layer in this application), during the aforementioned moderately high-power and long-term plasma treatment, the organic molecular chains on the surface of the organic substrate layer that will contact the touch layer are prone to excessive breakage and degradation. After a large number of molecular chains break, many small molecular fragments will form on the surface of the organic substrate that will come into contact with the touch layer. These fragments are easy to detach from the surface of the organic substrate that will come into contact with the touch layer, making the surface of the organic substrate that will come into contact with the touch layer loose and porous, and destroying the structure. This reduces the effective contact area and chemical bonding ability between the surface of the organic substrate that will come into contact with the touch layer and the touch layer, resulting in decreased adhesion of the surface of the organic substrate that will come into contact with the touch layer. As a result, the touch layer on the edge area of ​​the organic substrate is very easy to separate from the organic substrate, resulting in poor performance of the display panel. When the touch layer detaches from the display panel, the cavity in which the display panel is made is easily contaminated.

[0040] In view of the above problems, this application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to reduce the risk of film separation in the display panel.

[0041] To illustrate the technical solution of this application, the following description is provided in conjunction with specific accompanying drawings and embodiments.

[0042] Please refer to Figure 1 , Figure 2 and Figure 3 This application provides a display panel 1, which includes an organic substrate layer 11, a functional structure layer 12, an inorganic protective layer 13, and a touch layer 14.

[0043] The organic substrate layer 11 includes a display area A1 and an edge area A2, with the edge area A2 at least partially surrounding the display area A1; a functional structure layer 12 is disposed on one side of the organic substrate layer 11 and is located in the display area A1; a touch layer 14 is disposed on the side of the functional structure layer 12 away from the organic substrate layer 11; and an inorganic protective layer 13 is disposed between the organic substrate layer 11 and the touch layer 14, with the inorganic protective layer 13 being disposed in the same layer as the functional structure layer 12 and located in the edge area A2.

[0044] The organic substrate layer 11 is a supporting film layer in the display panel 1, and the material forming the organic substrate layer 11 is an organic material. Optionally, the material forming the organic substrate layer 11 can be PI (Polyimide), PET (Polyethylene Terephthalate), PEN (Polyethylene Naphthalate), COP (Cyclo Olefin Polymer), COC (Cyclo Olefin Copolymer), etc.

[0045] Functional structure layer 12 is the core functional structure layer 12 on display panel 1. Please refer to... Figure 5 The functional structure layer 12 includes an inorganic stacked layer 121, a TFT (Thin-Film Transistor) array layer 122, an organic stacked layer 123, and an encapsulation layer 124, which are sequentially stacked along a direction away from the organic substrate layer 11. The inorganic stacked layer 121 is adjacent to the organic substrate layer 11, and the touch layer 14 is disposed on the side of the encapsulation layer 124 away from the organic substrate layer 11. These layers each perform important functions and work together to achieve image display and stable operation of the display panel 1. (Please refer to...) Figure 5The display panel 1 employs thin-film encapsulation (TFE), meaning the encapsulation layer 124 comprises a first inorganic film 1241, an organic film 1242, and a second inorganic film 1243 stacked sequentially. The first inorganic film 1241 is adjacent to the organic film 123, and the touch layer 14 is adjacent to the second inorganic film 1243. The first and second inorganic films 1241 and 1243 are typically made of materials such as silicon nitride and aluminum oxide, primarily serving to block water and oxygen, preventing water and oxygen from corroding the display panel 1 and causing it to fail. The organic film 1242 is typically made of materials such as PI (polyimide) and EP (epoxy resin). The organic film 1242 acts as a buffer layer, primarily encapsulating foreign objects, flattening the cover film layer, and preventing defects from occurring during the manufacturing process of the second inorganic film 1243. That is, the structure of the encapsulation layer 124 is a stack of inorganic films, organic films, and inorganic films, and the film layer in the encapsulation layer 124 that contacts the touch layer 14 is an inorganic film. Among them, the inorganic stack 121 in the functional structure layer 12 includes silicon oxide material layer and silicon nitride material layer, etc.

[0046] It should be noted that the adjacency of the inorganic stack 121 and the organic substrate layer 11 means that the inorganic stack 121 directly covers the organic substrate layer 11, and the inorganic stack 121 and the organic substrate layer 11 are closely adjacent in the direction from the organic substrate layer 11 to the encapsulation layer 124. The adjacency of the first inorganic film 1241 and the organic stack 123 means that the first inorganic film 1241 directly covers the organic stack 123, and the first inorganic film 1241 and the organic stack 123 are closely adjacent in the direction from the organic substrate layer 11 to the encapsulation layer 124. The adjacency of the touch layer 14 and the second inorganic film 1243 means that the touch layer 14 directly covers the second inorganic film 1243, and the touch layer 14 and the second inorganic film 1243 are closely adjacent in the direction from the organic substrate layer 11 to the touch layer 14.

[0047] The touch layer 14 is a key component of the display panel 1 for enabling touch interaction. Above the functional structure layer 12, touch electrode materials, such as ITO (Indium Tin Oxide), silver nanowires, and graphene, are deposited using methods such as physical vapor deposition, chemical vapor deposition, or sol-gel deposition. Insulating layers, such as silicon nitride, silicon oxide, or organic insulating materials, are then deposited on the touch electrode layer to isolate the touch electrodes from other layers and prevent short circuits.

[0048] In the display panel 1 provided in the first aspect embodiment of this application, an inorganic protective layer 13 is provided in the edge region A2 on the organic substrate layer 11. Before plasma treatment, the inorganic protective layer 13 is provided in the edge region A2 on the organic substrate layer 11. After plasma treatment, the surface roughness of the inorganic protective layer 13 away from the organic substrate layer 11 is enhanced, which makes the adhesion between the inorganic protective layer 13 and the touch layer 14 greater, making it difficult for the touch layer 14 to separate from the inorganic protective layer 13. This can improve the performance of the display panel 1 and reduce the risk of contamination of the cavity in which the display panel is manufactured, thereby improving the performance of the display panel 1.

[0049] In the display panel 1 provided in the first aspect embodiment of this application, the inorganic protective layer 13 includes at least one of a silicon oxide material layer and a silicon nitride material layer.

[0050] It should be noted that the inorganic protective layer 13 can be disposed together with at least one inorganic film layer of the inorganic stack 121 in the functional structure layer 12. That is, in the step of depositing the inorganic stack 121 on the display area A1 of the organic substrate layer 11 by methods such as physical vapor deposition, chemical vapor deposition, or sol-gel, inorganic materials are deposited together in the edge area A2 of the organic substrate layer 11 and the display area A1. During deposition, by setting a mask, at least one inorganic film layer and the inorganic protective layer 13 in the inorganic stack 121 are formed at intervals. Alternatively, after deposition, the inorganic stack 121 and the inorganic protective layer 13 are formed at intervals by an etching process. Figure 4 and Figure 5 As shown, the inorganic stack 121 includes two inorganic film layers, and the inorganic protective layer 13 is formed together with the second inorganic film layer in the inorganic stack 121.

[0051] Please refer to Figure 2 and Figure 3 In some embodiments, the inorganic protective layer 13 and the functional structure layer 12 are spaced apart in the distribution direction of the edge region A2 and the display region A1.

[0052] It should be noted that both the edge region A2 and the display region A1 are located on the organic substrate layer 11, and the edge region A2 and the display region A1 are distributed in at least one direction parallel to the organic substrate layer 11. For example, in some embodiments, the edge region A2 surrounds the periphery of the display region A1, and the distribution direction of the edge region A2 and the display region A1 refers to the direction extending from the center of the organic substrate layer 11 towards the edge of the organic substrate layer 11, or the direction extending from the edge of the organic substrate layer 11 towards the center of the organic substrate layer 11. Furthermore, in some embodiments, the edge region A2 is arranged side-by-side on one side of the display region A1, and the distribution direction of the edge region A2 and the display region A1 refers to the direction pointing from the edge region A2 to the display region A1, or the direction pointing from the display region A1 to the edge region A2.

[0053] It should be noted that the edges of the display panel 1 need to be cut (in this embodiment, part of the touch layer 14, part of the inorganic protective layer 13 and part of the organic substrate layer 11 on the edge region A2 of the organic substrate layer 11 will be removed) so that the display panel 1 meets the size and shape requirements of the product, ensuring that it can be accurately installed in the corresponding device and perfectly cooperate with other components, which facilitates subsequent processing and assembly.

[0054] During the cutting process, the inorganic protective layer 13 on the edge region A2 of the organic substrate layer 11 is prone to cracking due to internal stress. By spacing the inorganic protective layer 13 and the functional structure layer 12, the inorganic protective layer 13 and the inorganic stack 121 in the functional structure layer 12 are spaced apart, which can prevent the cracks on the inorganic protective layer 13 from extending to the functional structure layer 12. This can prevent the structure of the functional structure layer 12 from being damaged during cutting, and thus will not affect the stable operation of the functional structure layer 12, thereby reducing the risk of failure of the functional structure layer 12.

[0055] Please refer to Figure 2 and Figure 3 In some embodiments, the display panel 1 further includes a dam 15 disposed on the edge region A2. The dam 15 is disposed in the same layer as the functional structure layer 12 and the inorganic protective layer 13, and the dam 15 is located between the functional structure layer 12 and the inorganic protective layer 13.

[0056] Stress is generated during the cutting process. In the above embodiment, the dam 15 can serve as a stress buffer area to disperse the stress generated during the cutting process and prevent stress from concentrating on the functional structure layer 12 on the display panel 1, thereby reducing the possibility of cracks in the functional structure layer 12 and thus reducing the risk of damage to the functional structure layer 12 during the cutting process.

[0057] For preferred options, please refer to [the following]. Figure 3The trapezoidal structure of the dam 15 results in a lower center of gravity. When the dam 15 is subjected to external forces, such as vibrations or pressure during the cutting process, it can better maintain its balance and is less prone to tipping over or deforming. The trapezoidal dam 15 can provide more stable support for the display panel 1, helping to protect the integrity and stability of the functional structural layer 12 in the display panel 1. Furthermore, because the trapezoidal shape allows pressure to be gradually transmitted and dispersed along the inclined side, it avoids pressure concentration at a certain point or area. Therefore, the trapezoidal dam 15 can also disperse the stress generated during the cutting process over a larger area, reducing the possibility of excessive local pressure. This reduces the risk of cracks, breakage, or other damage to the dam 15 and the functional structural layer 12 in the display panel 1 due to excessive pressure.

[0058] Furthermore, in the above embodiment, the dam 15 can form a physical barrier in the display panel 1. If cracks appear in the inorganic protective layer 13 of the display panel 1 during or after cutting, the dam 15 can prevent these cracks from extending into the functional structural layer 12.

[0059] It should be noted that during cutting, the cutting tool or laser may generate some tiny debris or heat. The dam 15 can prevent these debris and heat from eroding the functional structure layer 12, reduce the risk of damage to the internal functional structure layer 12 of the display panel 1 during the cutting process, and ensure the stable operation of the functional structure layer 12.

[0060] Furthermore, the functional structure layer 12 inside the display panel 1 is highly sensitive to impurities and moisture. The dam 15 acts as a physical barrier, preventing external dust, impurities, and moisture from entering the functional structure layer 12, which helps improve the stability and reliability of the display panel 1 and extend its service life.

[0061] For preferred options, please refer to [the provided text]. Figure 2 and Figure 3 In the distribution direction of display area A1 and edge area A2, the dam 15 and inorganic protective layer 13 are arranged at intervals.

[0062] The above settings can enhance the effect of the dam 15 in preventing cracks from spreading to the functional structural layer 12.

[0063] For preferred options, please refer to [the provided text]. Figure 2 and Figure 3 In the distribution direction of edge area A2 and display area A1, dam 15 and functional structure layer 12 are set at intervals.

[0064] The above settings can enhance the effect of the dam 15 in preventing cracks from spreading to the functional structural layer 12.

[0065] Please refer to Figure 3In some embodiments, multiple dams 15 are provided, and the multiple dams 15 are spaced apart along the direction from the functional structure layer 12 to the inorganic protective layer 13.

[0066] Through the above configuration, the multiple spaced dams 15 can further prevent cracks from extending into the functional structure layer 12, and the multiple spaced dams 15 can further enhance the stress buffering effect, reducing the risk of cracks, breakage or other damage to the functional structure layer 12 in the display panel 1 due to excessive pressure.

[0067] The dam 15 includes at least one of a silicon oxide material layer and a silicon nitride material layer.

[0068] In some embodiments, the dam 15 can be disposed together with the inorganic stack 121 in the functional structure layer 12. That is, in the step of depositing the inorganic stack 121 on the display area A1 of the organic substrate layer 11 by physical vapor deposition, chemical vapor deposition or sol-gel method, inorganic material is deposited together in the edge area A2 of the organic substrate layer 11 and the display area A1. During deposition, a mask is set to form the inorganic stack 121, the dam 15 and the inorganic protective layer 13 spaced apart. Alternatively, after deposition, the inorganic stack 121, the dam 15 and the inorganic protective layer 13 spaced apart are formed by etching process.

[0069] Please refer to Figure 3 and Figure 4 In some embodiments, the display panel 1 further includes a planarization layer 16, at least a portion of which is located between adjacent embankments 15.

[0070] Depend on Figure 4 As can be seen, the multiple dams 15 are spaced apart, resulting in an uneven structure at the dams 15. Subsequent process steps, such as setting the touch layer 14, require a very flat surface to ensure the uniformity of the touch layer 14. The planarization layer 16 can fill the space between adjacent dams 15 to provide a smooth, flat surface, providing a good foundation for subsequent processes and helping to improve the performance and reliability of the display panel 1.

[0071] Preferably, the planarization layer 16 fills between adjacent dams 15, and in the direction from the organic substrate layer 11 to the touch layer 14, the planarization layer 16 is flush with the dams 15, so that the surface of the planarization layer 16 away from the organic substrate layer 11 is flush with the surface of the dams 15 away from the organic substrate layer 11, to ensure the uniformity of the touch layer 14.

[0072] refer to Figure 3Preferably, a portion of the planarization layer 16 is filled between adjacent dams 15, and another portion is located on the side of the dam 15 away from the organic substrate layer 11, so that the planarization layer 16 away from the surface of the organic substrate layer 11 is used to support the touch layer 14, thereby ensuring the uniformity of the touch layer 14.

[0073] refer to Figure 3 Preferably, the planarization layer 16 is located between the dam 15 and the inorganic protective layer 13.

[0074] refer to Figure 3 Preferably, the planarization layer 16 is located between the dam 15 and the functional structure layer 12.

[0075] Please refer to Figure 6 The second aspect of this application provides a method for manufacturing a display panel, comprising:

[0076] S100: A functional structure layer 12 and an inorganic protective layer 13 are disposed on the organic substrate layer 11 in the same layer.

[0077] S200: Plasma treatment is performed on the surfaces of the functional structure layer 12 and the inorganic protective layer 13 that are away from the organic substrate layer 11.

[0078] S300: A touch layer 14 is provided on the side of the functional structure layer 12 and the inorganic protective layer 13 that is away from the organic substrate layer 11.

[0079] Before plasma treatment, an inorganic protective layer 13 is provided in the edge region A2 on the organic substrate layer 11. After plasma treatment, the surface roughness of the inorganic protective layer 13 away from the organic substrate layer 11 is enhanced, resulting in a greater adhesion between the inorganic protective layer 13 and the touch layer 14. This makes it difficult for the touch layer 14 to separate from the inorganic protective layer 13. The touch layer 14 in the display panel 1 prepared by the display panel preparation method provided in the second aspect embodiment of this application is not easy to detach, thereby improving the performance of the display panel 1 and reducing the risk of contamination of the cavity in which the display panel 1 is manufactured.

[0080] A third aspect of this application provides a display device, including the display panel 1 of the first aspect embodiment described above, or the display panel 1 prepared by the method of preparing the display panel of the second aspect embodiment described above.

[0081] The strong adhesion between the touch layer 14 and the inorganic protective layer 13 in the display device can improve the performance of the display device.

[0082] The above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: An organic substrate layer includes a display area and an edge area, wherein the edge area at least partially surrounds the display area; A functional structure layer is disposed on one side of the organic substrate layer, and the functional structure layer is located in the display area; A touch layer is disposed on the side of the functional structure layer opposite to the organic substrate layer; An inorganic protective layer is disposed between the organic substrate layer and the touch layer. The inorganic protective layer is disposed in the same layer as the functional structure layer and is located in the edge region.

2. The display panel according to claim 1, characterized in that, In the distribution direction of the edge region and the display region, the inorganic protective layer and the functional structure layer are spaced apart.

3. The display panel according to claim 2, characterized in that, The display panel also includes at least one dam disposed in the edge region, wherein the dam is disposed in the same layer as the functional structure layer and the inorganic protective layer, and the dam is located between the functional structure layer and the inorganic protective layer.

4. The display panel according to claim 3, characterized in that, In the distribution direction of the edge region and the display region, the dam is spaced apart from the inorganic protective layer, and / or, in the distribution direction of the edge region and the display region, the dam is spaced apart from the functional structure layer.

5. The display panel according to claim 3, characterized in that, The dam is provided in multiple locations, and the multiple dams are spaced apart along the direction from the functional structure layer to the inorganic protective layer.

6. The display panel according to claim 5, characterized in that, The display panel also includes a planarization layer, at least a portion of which is located between adjacent dams; Preferably, the planarization layer covers the dam.

7. The display panel according to any one of claims 1 to 6, characterized in that, The functional structure layer includes an inorganic stack, a TFT array layer, an organic stack, and an encapsulation layer stacked sequentially along a direction away from the organic substrate layer. The inorganic stack is adjacent to the organic substrate layer, and the touch layer is disposed on the side of the encapsulation layer away from the organic substrate layer.

8. The display panel according to claim 7, characterized in that, The encapsulation layer includes a first inorganic film, an organic film, and a second inorganic film stacked sequentially, wherein the first inorganic film is adjacent to the organic film, and the touch layer is adjacent to the second inorganic film.

9. A method for manufacturing a display panel, characterized in that, include: A functional structure layer and an inorganic protective layer are disposed on the same layer of an organic substrate; Plasma treatment is performed on the surfaces of the functional structure layer and the inorganic protective layer that are opposite to the organic substrate layer. A touch layer is provided on the side of the functional structure layer and the inorganic protective layer that is away from the organic substrate layer.

10. A display device, characterized in that, The display panel includes any one of claims 1 to 8, or a display panel prepared by the method for preparing the display panel according to claim 9.

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