Display panel and display device

Abstract

The present disclosure provides a display panel and a display device, and relates to the technical field of display. The display panel comprises a display area and a non-display area arranged adjacently, and the non-display area comprises an encapsulation area away from the display area. The display panel comprises: a substrate; a heat dissipation assembly arranged on one side of the substrate, the heat dissipation assembly comprising a plurality of first-type semiconductor blocks and a plurality of second-type semiconductor blocks, the plurality of first-type semiconductor blocks and the plurality of second-type semiconductor blocks being connected in series alternately; wherein the plurality of first-type semiconductor blocks and the plurality of second-type semiconductor blocks are connected through a plurality of electrodes, the plurality of electrodes comprising a heat absorption electrode and a heat emission electrode, the heat absorption electrode being arranged on one side of the non-display area close to the display area, and the heat emission electrode being arranged on one side of the non-display area away from the display area; the orthographic projection of the heat absorption electrode on the substrate at least partially coincides with the intersection of the display area and the non-display area, and the orthographic projection of the heat emission electrode on the substrate at least partially locates in the encapsulation area.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more specifically to a display panel and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) devices utilize organic electroluminescent materials that are highly sensitive to oxygen and water vapor; corrosion from these materials can lead to device failure. Therefore, effective encapsulation technology is crucial for extending device lifespan. Frit encapsulation technology, with its excellent water and oxygen barrier properties and relatively simple process, has become a commonly used encapsulation process for OLED devices. Summary of the Invention

[0003] In view of this, the present disclosure provides a display panel and a display device.

[0004] In a first aspect, one embodiment of this disclosure provides a display panel including adjacent display areas and non-display areas, the non-display area including an encapsulation area away from the display area. The display panel includes: a substrate; and a heat dissipation assembly disposed on one side of the substrate, the heat dissipation assembly including a plurality of first-type semiconductor blocks and a plurality of second-type semiconductor blocks, the plurality of first-type semiconductor blocks and the plurality of second-type semiconductor blocks being alternately connected in series; wherein the plurality of first-type semiconductor blocks and the plurality of second-type semiconductor blocks are connected by a plurality of electrodes, the plurality of electrodes including heat-absorbing electrodes and heat-releasing electrodes, the heat-absorbing electrodes being disposed on the side of the non-display area closer to the display area, and the heat-releasing electrodes being disposed on the side of the non-display area away from the display area; the orthographic projection of the heat-absorbing electrode on the substrate at least partially coincides with the boundary between the display area and the non-display area, and the orthographic projection of the heat-releasing electrode on the substrate at least partially lies in the encapsulation area.

[0005] In conjunction with the first aspect, in some implementations of the first aspect, the shape of the orthogonal projection of the heat-absorbing electrode onto the substrate includes a rectangle, one side of which coincides with the boundary between the display area and the non-display area.

[0006] In conjunction with the first aspect, in some implementations of the first aspect, the non-display area also includes a heat-absorbing region near the display area, wherein the heat-absorbing electrodes are arranged in a Peano curve pattern on the substrate and fill the heat-absorbing region.

[0007] In conjunction with the first aspect, in some implementations of the first aspect, the non-display area also includes a heat-absorbing area close to the display area. The orthogonal projection of the heat-absorbing electrode on the substrate presents a bent structure, which includes multiple alternating long sides and multiple short sides. The multiple long sides are arranged side by side along the length direction of the heat-absorbing area, and the multiple short sides extend along the length direction of the heat-absorbing area. Some of the multiple short sides are located at the boundary between the heat-absorbing area and the display area, and some of the multiple short sides are located at the boundary of the heat-absorbing area away from the display area.

[0008] In conjunction with the first aspect, in some implementations of the first aspect, the non-display area also includes a heat-dissipating region away from the display area, wherein the orthogonal projection of the heat-dissipating electrodes on the substrate is arranged in a Peano curve and fills the heat-dissipating region, and the heat-dissipating region at least partially overlaps with the packaging area.

[0009] In conjunction with the first aspect, in some implementations of the first aspect, the first type of semiconductor block includes a p-type semiconductor and the second type of semiconductor block includes an n-type semiconductor; or, the first type of semiconductor block includes an n-type semiconductor and the second type of semiconductor block includes a p-type semiconductor.

[0010] In conjunction with the first aspect, in some implementations of the first aspect, the materials of the heat-absorbing electrode and the heat-releasing electrode include metallic materials.

[0011] In conjunction with the first aspect, in some implementations of the first aspect, the display panel further includes an array layer disposed on one side of the substrate, and a heat dissipation component disposed on the side of the array layer away from the substrate.

[0012] In conjunction with the first aspect, in some implementations of the first aspect, there are multiple heat dissipation components, which are connected in parallel.

[0013] Secondly, one embodiment of this disclosure provides a display device including the display panel provided in the first aspect above.

[0014] In the display panel disclosed herein, during the Frit packaging process, the heat dissipation component is powered on. The heat-absorbing electrode, adjacent to the display area, absorbs heat, and the heat is released from a location away from the display area via a heat-releasing electrode. This prevents the heat generated by the laser in the packaging area from affecting the light-emitting device structure in the display area. Thanks to the heat dissipation component, the distance between the display area and the packaging area can be further shortened, reducing the bezel width and achieving a higher screen-to-body ratio. Attached Figure Description

[0015] Figure 1 The image shown is a top view of a display panel provided in an exemplary embodiment of this disclosure.

[0016] Figure 2The diagram shown is a schematic representation of the structure of a display panel provided in an exemplary embodiment of this disclosure.

[0017] Figure 3 The diagram shown is a structural schematic of a heat dissipation assembly provided in an exemplary embodiment of this disclosure.

[0018] Figure 4 The diagram shown is a schematic diagram of the structure of an endothermic electrode provided in an exemplary embodiment of this disclosure.

[0019] Figure 5 The diagram shown is a schematic diagram of the structure of an endothermic electrode provided in another exemplary embodiment of this disclosure.

[0020] Figure 6 The diagram shown is a schematic diagram of the structure of an endothermic electrode provided in another exemplary embodiment of this disclosure.

[0021] Figure 7 The diagram shown is a structural schematic of a display panel provided in another exemplary embodiment of this disclosure.

[0022] Figure label:

[0023] AA, Display area; NA, Non-display area; NA1, Heat absorption area; NA2, Heat dissipation area; EA, Packaging area;

[0024] 100. Substrate;

[0025] 200, Heat dissipation component; 210, Type I semiconductor block; 220, Type II semiconductor block; 230, Electrode; 231, Heat-absorbing electrode; 232, Heat-dissipating electrode;

[0026] 300, Array layer. Detailed Implementation

[0027] The technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0028] In the description of this disclosure, it should be noted that the terms "center", "upper", "lower", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed when in use. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0029] When a component is described as being "on" another component, the component may be placed directly on the other component; alternatively, there may be an intermediate component on which the component is placed, and the intermediate component is placed on the other component. Furthermore, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0030] Organic light-emitting diodes (OLEDs) possess a range of advantages, including an all-solid-state structure, high brightness, wide viewing angle, fast response time, wide operating temperature range, and the ability to achieve flexible displays. However, the organic electroluminescent materials used in OLED devices are particularly sensitive to water vapor and oxygen. To achieve their designed lifespan, OLED devices need to maintain extremely low water and oxygen permeability. Exposure to water vapor or oxygen will cause OLED devices to fail. To effectively block the effects of water and oxygen on OLED devices, researchers have developed various packaging technologies, including Getter & Dispenser packaging, Frit packaging, and TFE packaging.

[0031] Frit encapsulation is a widely used encapsulation technology for display panels, offering excellent water and oxygen barrier properties, effectively extending the lifespan of OLED devices. In the Frit encapsulation process, a glass adhesive (Frit) material is first applied to the encapsulation glass using screen printing or coating. This adhesive, composed of glass powder and solvent, possesses excellent water and oxygen barrier properties. Next, the solvent in the adhesive is evaporated through high-temperature baking, leaving solid glass powder. Then, the encapsulation glass is bonded to the substrate containing the OLED device, and the glass powder is sintered using a laser, causing it to remelt and solidify, thus tightly bonding the upper and lower substrates and achieving a seal. During laser sintering, the glass powder absorbs laser energy, instantly sealing the substrate and cover plate, preventing air ingress.

[0032] However, due to the high heat generated by the laser, a certain distance needs to be maintained between the Frit material and the display area of ​​the display panel to avoid damage to the OLED devices in the display area due to high temperature. This is not conducive to reducing the width of the bezel and achieving a higher screen-to-body ratio.

[0033] To address the above issues, this disclosure provides a display panel including adjacent display areas and non-display areas, the non-display area including an encapsulation area away from the display area. The display panel includes: a substrate; and a heat dissipation assembly disposed on one side of the substrate, the heat dissipation assembly including a plurality of first-type semiconductor blocks and a plurality of second-type semiconductor blocks, the plurality of first-type semiconductor blocks and the plurality of second-type semiconductor blocks being alternately connected in series; wherein the plurality of first-type semiconductor blocks and the plurality of second-type semiconductor blocks are connected by a plurality of electrodes, the plurality of electrodes including heat-absorbing electrodes and heat-releasing electrodes, the heat-absorbing electrodes being disposed on the side of the non-display area closer to the display area, and the heat-releasing electrodes being disposed on the side of the non-display area away from the display area; the orthographic projection of the heat-absorbing electrode on the substrate at least partially coincides with the boundary between the display area and the non-display area, and the orthographic projection of the heat-releasing electrode on the substrate at least partially lies in the encapsulation area, thereby achieving a higher screen-to-body ratio.

[0034] The following description, in conjunction with the accompanying drawings, illustrates the display panel provided in an embodiment of this disclosure.

[0035] Figure 1 The image shown is a top view of a display panel provided in an exemplary embodiment of this disclosure. Figure 1 As shown, the display panel includes an adjacent display area AA and a non-display area NA. The non-display area NA can be located to one side of the display area AA or surrounding the display area AA. The display area AA contains a light-emitting device for displaying an image; this light-emitting device can be an OLED device or other device with display functionality. The non-display area NA further includes a packaging area EA. The packaging area EA is located on the side of the non-display area NA furthest from the display area AA and is spaced apart from the display area AA. For example, the packaging area EA can be located at the outer edge of the non-display area NA furthest from the display area AA.

[0036] The encapsulation area EA is the area where the Frit material is located. During the Frit encapsulation process, the Frit material located in the encapsulation area EA needs to be laser sintered to remelt and solidify it, so as to achieve water and oxygen barrier capabilities similar to glass, thereby encapsulating the light-emitting device located in the display area AA.

[0037] Figure 2 The diagram shown is a structural schematic of a display panel provided in an exemplary embodiment of this disclosure. Figure 2 As shown, the display panel includes a substrate 100 and a heat dissipation component 200, which is disposed on one side of the substrate 100.

[0038] Figure 3 The diagram shown is a structural schematic of a heat dissipation assembly provided in an exemplary embodiment of this disclosure. Figure 3As shown, the heat dissipation assembly 200 includes a plurality of first-type semiconductor blocks 210 and a plurality of second-type semiconductor blocks 220. The plurality of first-type semiconductor blocks 210 and the plurality of second-type semiconductor blocks 220 are alternately connected in series. For example, the plurality of first-type semiconductor blocks 210 and the plurality of second-type semiconductor blocks 220 can be connected in series in the order of first-type semiconductor block 210-second-type semiconductor block 220-first-type semiconductor block 210-second-type semiconductor block 220, or in the order of second-type semiconductor block 220-first-type semiconductor block 210-second-type semiconductor block 220-first-type semiconductor block 210. The number, shape, and arrangement of the first-type semiconductor blocks 210 and the second-type semiconductor blocks 220 can be specifically designed according to the size of the display panel, the size of the non-display area, the distance between the package area EA and the display area AA, etc.

[0039] For example, both the first type semiconductor block 210 and the second type semiconductor block 220 are strip-shaped, and are arranged alternately along a first direction, which is parallel to the junction line between the non-display area NA and the display area AA. A certain interval exists between the first type semiconductor block 210 and the second type semiconductor block 220. The end of the first type semiconductor block 210 and the second type semiconductor block 220 closest to the display area AA is designated as the first end, and the end of the first type semiconductor block 210 and the second type semiconductor block 220 furthest from the display area AA is designated as the second end. The first end of the first type semiconductor block 210 is electrically connected to the first end of the second type semiconductor block 220 immediately to its right, and the second end of the second type semiconductor block 220 is electrically connected to the second end of the first type semiconductor block 210 immediately to its right. In this way, an alternating series connection is achieved between multiple first type semiconductor blocks 210 and multiple second type semiconductor blocks 220.

[0040] It is understood that the first type semiconductor block 210 and the second type semiconductor block 220 can also be configured with other shapes. For example, the shapes of the first type semiconductor block 210 and the second type semiconductor block 220 can include common shapes such as cuboids and cylinders. Alternatively, the first type semiconductor block 210 and the second type semiconductor block 220 can be in the form of arcs, broken lines, etc. Even, a first type semiconductor block 210 can be represented as a series connection of multiple smaller square or spherical first type semiconductor structures. Furthermore, the size and shape of the first type semiconductor block 210 and the second type semiconductor block 220 can be the same or different from each other, as long as there is a gap between the first type semiconductor block 210 and the second type semiconductor block 220 and space is reserved at the ends for setting electrodes. The embodiments of this disclosure do not impose specific limitations on the shape, size, and arrangement of the first type semiconductor block and the second type semiconductor block.

[0041] Multiple first-type semiconductor blocks 210 and multiple second-type semiconductor blocks 220 are connected by multiple electrodes 230. Continuing with the example above, an electrode 230 is provided between the first end of the first-type semiconductor block 210 and the first end of the adjacent second-type semiconductor block 220 on its right. The first end of the electrode 230 is connected to the first end of the first-type semiconductor block 210, and the second end of the electrode 230 is connected to the first end of the second-type semiconductor block 220. Then, for the second-type semiconductor block 220 and the adjacent first-type semiconductor block 210 on its right, another electrode 230 electrically connects the second end of the second-type semiconductor block 220 to the second end of the first-type semiconductor block 210. Thus, electrical connections are achieved between the multiple first-type semiconductor blocks 210, the multiple second-type semiconductor blocks 220, and the multiple electrodes 230.

[0042] The heat dissipation assembly 200 also includes metal traces through which a series structure of a first-type semiconductor block 210, an electrode 230, and a second-type semiconductor block 220 is energized. One end of the series structure is connected to the positive electrode, and the other end is connected to the negative electrode. When current flows through the series structure, a Peltier effect occurs between the series structures, with some of the electrodes 230 absorbing heat from the surrounding area and others releasing heat to the surrounding area.

[0043] Thus, the multiple electrodes 230 are divided into heat-absorbing electrodes and heat-releasing electrodes. The heat-absorbing electrodes are electrodes that absorb heat from the surrounding area, and the heat-releasing electrodes are electrodes that release heat to the surrounding area. The heat-absorbing electrodes are located on the side of the non-display area NA closer to the display area AA, and the heat-releasing electrodes are located on the side of the non-display area NA farther from the display area AA.

[0044] Continue to refer to Figure 3 The non-display area NA is further divided into a heat-absorbing area NA1 and a heat-releasing area NA2. The heat-absorbing area NA1 is tangent to the display area AA, and multiple heat-absorbing electrodes 231 are located in the heat-absorbing area NA1. The orthogonal projection of the heat-absorbing electrodes 231 on the substrate at least partially coincides with the boundary between the display area AA and the non-display area NA.

[0045] The heat dissipation region NA2 is located away from the display region AA and at least partially overlaps with the packaging region EA. Multiple heat dissipation electrodes 232 are located in the heat dissipation region NA2, and the orthographic projection of the heat dissipation electrodes 232 onto the substrate is at least partially located in the packaging region EA.

[0046] The Peltier effect is briefly introduced below. The physical mechanism of the Peltier effect can be explained as follows: when an electric current passes through the interface of two different semiconductor materials, charge carriers (such as electrons or holes) are at different energy levels in the different materials. When they move from a higher energy level to a lower energy level, they release excess heat; conversely, they need to absorb heat from the outside. This cooling technology based on the Peltier effect is called thermoelectric cooling, a solid-state cooling method with no moving parts, no noise, and no refrigerant. Precise temperature control can be achieved by adjusting the current; thermoelectric cooling also features flexible layout, effectively reducing the temperature in critical areas (i.e., between the display area and the packaging area), thereby improving energy efficiency; and since there are no moving parts during thermoelectric cooling, no mechanical noise or vibration is generated during operation, making it suitable for display panels.

[0047] Continue to refer to Figure 3 Adjacent first-type semiconductor blocks 210 and second-type semiconductor blocks 220 form a pair of electrocouple units. Under the action of an applied electric field, the electrocouple units generate electron-hole pairs on one side of the heat-absorbing region NA1, reducing internal energy and lowering the surrounding temperature; on the other side of the heat-releasing region NA2, electron-hole pairs recombine, increasing internal energy and raising the surrounding temperature. In this way, the heat dissipation component transfers heat from the heat-absorbing region NA1 to the heat-releasing region NA2.

[0048] In this embodiment, during the Frit encapsulation process of the display panel, the heat dissipation component is powered on. The heat-absorbing electrode adjacent to the display area absorbs heat, and the heat is released from a location away from the display area through the heat-releasing electrode, thereby preventing the heat generated by the laser in the encapsulation area from affecting the light-emitting device structure in the display area. Thanks to the heat dissipation component, the distance between the display area and the encapsulation area can be further shortened, reducing the bezel width and achieving a higher screen-to-body ratio.

[0049] Because the heat dissipation components are located inside the display panel, they can directly cool the area between the display area and the packaging area. Compared with cooling solutions outside the display panel, the cooling effect is better and the cooling location is more precise.

[0050] Meanwhile, during the encapsulation process, the heat released by the exothermic electrodes located in the encapsulation area can be used to melt the Frit material, thus achieving heat reuse.

[0051] In some embodiments, the first type of semiconductor block includes a p-type semiconductor, and the second type of semiconductor block includes an n-type semiconductor.

[0052] p-type semiconductors are formed by doping pure semiconductor materials (such as silicon or germanium) with trivalent elements (such as boron, aluminum, gallium, etc.). During the doping process, atoms of the trivalent element replace some of the tetravalent element atoms in the crystal lattice. However, since the trivalent element has one less valence electron than the tetravalent element, it creates "holes" in the crystal lattice. These holes can accept electrons, thereby generating positive charge carriers.

[0053] n-type semiconductors are formed by doping pure semiconductor materials with pentavalent elements (such as phosphorus or arsenic). During the doping process, pentavalent atoms replace some tetravalent atoms in the crystal lattice. However, since pentavalent elements have one more valence electron than tetravalent elements, additional free electrons are generated in the crystal lattice. These free electrons can move freely, thus generating negative charge carriers.

[0054] Under the influence of an applied electric field, a current is generated in the heat dissipation component. For example, continue to refer to... Figure 3 The current flows from the left side of the heat dissipation component along the series structure to the right side of the heat dissipation component. According to the direction of current flow, the current flows from the leftmost p-type semiconductor to the adjacent n-type semiconductor on the right, causing the electrode between the p-type semiconductor and the n-type semiconductor to release heat. At this time, the electrode between the p-type semiconductor and the n-type semiconductor is the heat-releasing electrode. Then, the current flows from the n-type semiconductor to the adjacent p-type semiconductor on the right, causing the electrode between the n-type semiconductor and the p-type semiconductor to absorb heat. At this time, the electrode between the n-type semiconductor and the p-type semiconductor is the heat-absorbing electrode.

[0055] In other embodiments, the first type of semiconductor block includes an n-type semiconductor, and the second type of semiconductor block includes a p-type semiconductor. Exemplarily, continuing to refer to... Figure 3 According to the direction of current flow, the current flows from the leftmost n-type semiconductor to the adjacent p-type semiconductor on the right, causing the electrode between the n-type semiconductor and the p-type semiconductor to absorb heat. At this time, the electrode between the n-type semiconductor and the p-type semiconductor is the heat-absorbing electrode. Then, the current flows from the p-type semiconductor to the adjacent n-type semiconductor on the right, causing the heat-dissipating electrode between the p-type semiconductor and the n-type semiconductor to release heat. At this time, the electrode between the p-type semiconductor and the n-type semiconductor is the heat-dissipating electrode.

[0056] As can be seen from the above introduction, the heat absorption and heat release effects occurring in multiple electrodes of the heat dissipation component change with the change of the current flow direction. Therefore, when designing the structure of the heat dissipation component, it is necessary to consider the current flow direction and the distribution positions of the heat release and heat absorption electrodes.

[0057] The specific structure of the electrode will be described below.

[0058] Continue to refer to Figure 3The shape of the orthographic projection of the heat-absorbing electrode 231 onto the substrate is rectangular, with one side of the rectangle coinciding with the boundary between the display area AA and the non-display area NA. The heat-absorbing electrode 231 is positioned close to the display area AA, precisely achieving localized cooling of the boundary of the display area AA and reducing the complexity of the structure.

[0059] In the above embodiments, the heat-absorbing electrodes are all strip-shaped. However, in a display panel, strip-shaped heat-absorbing electrodes may cause the temperature around the heat-absorbing electrode to be much lower than the temperature further away from the heat-absorbing electrode, resulting in an excessively large local temperature gradient and affecting the overall temperature uniformity of the display panel. To achieve a uniform temperature distribution, the heat-absorbing electrodes can also be configured in other shapes to cover a larger area.

[0060] Figure 4 The diagram shown is a schematic representation of the structure of an endothermic electrode provided in an exemplary embodiment of this disclosure. Figure 4 As shown, in some embodiments, the heat-absorbing electrode 231 has a bent structure when projected onto the substrate. In the heat-absorbing region NA1, the heat-absorbing electrode 231 includes multiple alternating long sides and multiple short sides. The long sides are arranged side-by-side along the length of the heat-absorbing region. A portion of the short sides are located on the side of the heat-absorbing region NA1 closest to the display area AA; these short sides are all located at the boundary between the heat-absorbing region and the display area. Another portion of the short sides are located on the side of the heat-absorbing region NA1 furthest from the display area AA; these short sides are all located at the boundary of the heat-absorbing region NA1 furthest from the display area AA. This arrangement ensures that the heat-absorbing electrodes 231 are uniformly arranged in the heat-absorbing region NA1, improving heat absorption and temperature uniformity.

[0061] Figure 5 The diagram shown is a schematic representation of the structure of a heat-absorbing electrode provided in another exemplary embodiment of this disclosure. Figure 5 As shown, in some other embodiments, the heat-absorbing electrodes 231 are arranged in a Peano curve pattern on the substrate and fill the heat-absorbing region NA1.

[0062] Specifically, the Peano curves are constructed recursively, starting with a straight line segment, then replacing this segment with a generator curve, and so on. The density of the Peano curves is controlled by the number of recursions, thereby limiting the density and fabrication difficulty of the endothermic electrode 231.

[0063] The heat absorption region NA1 is divided into multiple square regions. In each square region, heat absorption electrodes 231 arranged in a Peano curve shape are evenly distributed to increase the coverage area of ​​the heat absorption electrodes 231, thereby improving the heat absorption efficiency, helping to distribute the heat absorption effect more evenly, and improving temperature uniformity.

[0064] In addition to the Peano curves mentioned above, other methods such as... Figure 6The E-curve and Hilbert curve shown are examples of this.

[0065] Similarly, the structure of the exothermic electrode can refer to the structure of the absorbent electrode in the above embodiments. (Continue to refer to...) Figure 3 The shape of the orthographic projection of the heat-dissipating electrode 232 onto the substrate includes a rectangle. The heat-dissipating region NA2 partially overlaps with the packaging region EA, and the heat-dissipating electrode 232 is disposed in the overlapping portion of the heat-dissipating region NA2 and the packaging region EA. Alternatively, the heat-dissipating region NA2 is located within the packaging region EA, and the heat-dissipating electrode 232 is disposed inside the heat-dissipating region NA2.

[0066] Continue to refer to Figure 5 The orthographic projection of the exothermic electrode on the substrate and Figure 5 Similar to the heat-absorbing electrode 231 in the middle, it is arranged in a Peano curve and fills the heat-releasing region, which at least partially overlaps with the encapsulation region.

[0067] The heat release region NA2 is divided into multiple square regions. In each square region, heat release electrodes 232 arranged in a Peano curve shape are evenly distributed to increase the coverage area of ​​the heat release electrodes 232, thereby improving the heat release efficiency, helping to distribute the heat release effect more evenly, reducing local overheating, and improving temperature uniformity.

[0068] The heat dissipation area NA2 partially overlaps with the packaging area EA, and the heat dissipation electrode 232 uniformly fills the heat dissipation area NA2 so that a portion of the heat dissipation electrode 232 is located in the packaging area EA. During the operation of the heat dissipation assembly, part of the heat released by the heat dissipation electrode 232 is used in the packaging process, and the remaining heat is dissipated to the environment from a position away from the display area AA.

[0069] Alternatively, the heat-dissipating region NA2 is located within the packaging region EA, and the heat-dissipating electrode 232 uniformly fills the heat-dissipating region NA2 and is completely located within the heat-dissipating region NA2. The heat released by the heat-dissipating electrode 232 is reused in the packaging process.

[0070] It is understood that the structures of the heat-generating and heat-absorbing electrodes described above can be the same or different from each other. For example, the heat-generating electrodes are arranged in a Peano curve pattern, while the heat-absorbing electrodes are strip-shaped, increasing heat dissipation uniformity while precisely cooling the edge areas of the display area. Alternatively, both the heat-generating and heat-absorbing electrodes can be arranged in a Peano curve pattern to ensure uniform in-plane heat dissipation. Or, both the heat-generating and heat-absorbing electrodes can be strip-shaped to reduce the width of the heat dissipation component, further compressing the bezel width.

[0071] In addition, heat dissipation structures such as graphene heat sinks can be set on the heat-absorbing and heat-releasing electrodes to further increase the heat dissipation area, improve the uniformity of in-plane heat dissipation, and enable heat to be conducted more quickly from the vicinity of the display area to the packaging area or the outside of the display panel, reducing the accumulation of heat inside the display panel.

[0072] The above embodiments describe in detail the arrangement of the heat dissipation components.

[0073] In some embodiments, multiple heat dissipation components may be provided simultaneously, and the multiple heat dissipation components are connected in parallel. Each heat dissipation component includes a first type semiconductor block and a second type semiconductor block connected in series, as well as a heat-absorbing electrode and a heat-releasing electrode located between the first type semiconductor block and the second type semiconductor block.

[0074] Multiple heat dissipation components are located within the non-display area and are arranged around the display area. The heat-absorbing electrodes of the multiple heat dissipation components are located on the side of the non-display area closer to the display area, while the heat-dissipating electrodes of the multiple heat dissipation components are located on the side of the non-display area farther from the display area.

[0075] Multiple heat dissipation components can be arranged on the same layer. By designing the shape and arrangement of the heat-absorbing electrodes in these components, the heat-absorbing electrodes can be made to avoid each other, thereby increasing the density of the heat-absorbing electrodes, improving the cooling effect, and enhancing the temperature uniformity around the heat-absorbing electrodes. Similarly, by designing the shape and arrangement of the heat-dissipating electrodes in these components, the heat-dissipating electrodes can evenly release heat to locations away from the display area, thereby improving the heat dissipation effect and heat dissipation uniformity.

[0076] Alternatively, multiple heat dissipation components can be arranged on different layers, with the heat-absorbing electrodes of the multiple heat dissipation components stacked and all located on the side of the non-display area closer to the display area. For example, the multiple heat dissipation components include a first heat dissipation component and a second heat dissipation component. The first heat dissipation component is disposed on one side of the substrate, and the second heat dissipation component is disposed on the side of the first heat dissipation component opposite to the substrate. The first heat dissipation component includes multiple first heat-absorbing electrodes, and the arrangement of the multiple first heat-absorbing electrodes can be referred to... Figure 3 That is, there is a gap between adjacent first heat-absorbing electrodes. The second heat dissipation assembly includes multiple second heat-absorbing electrodes, which are also spaced apart, and the orthographic projection of the second heat-absorbing electrode on the substrate is located between the orthographic projections of two adjacent first heat-absorbing electrodes on the substrate. The orthographic projections of the first and second heat-absorbing electrodes on the substrate are alternately adjacent, and the pattern formed by the orthographic projections at least partially coincides with the boundary between the display area and the non-display area to improve the cooling effect. The heat-dissipating electrodes in the multiple heat dissipation assemblies are arranged in a similar manner to improve the heat dissipation effect and heat dissipation uniformity.

[0077] In some embodiments, the heat-absorbing electrode and the heat-releasing electrode are made of metallic materials. Exemplarily, the heat-absorbing electrode is made of at least one of zinc, molybdenum, copper, titanium, aluminum, iron, tin, tungsten, and nickel, and the heat-releasing electrode is made of at least one of zinc, molybdenum, copper, titanium, aluminum, iron, tin, tungsten, and nickel. These metallic materials have good electrical conductivity, which can effectively reduce resistance and energy loss. Furthermore, the high thermal conductivity of metallic materials facilitates rapid heat conduction, improving heat absorption efficiency. In addition, metallic materials have high mechanical strength, enabling them to withstand certain mechanical stresses and ensuring the reliability of the heat dissipation component.

[0078] Figure 7 The diagram shown is a structural schematic of a display panel provided in another exemplary embodiment of this disclosure. Figure 7 As shown, the display panel also includes an array layer 300. The array layer 300 is disposed on one side of the substrate 100, and the heat dissipation component 200 is disposed on the side of the array layer 300 away from the substrate 100.

[0079] The heat dissipation component 200 is arranged adjacent to the array layer 300, which allows for convenient power supply to the heat dissipation component 200 through the array layer 300, reducing the complexity of the wiring between film layers and making the film layer structure of the display panel more compact. In addition, the heat dissipation component 200 can protect the sensitive components in the array layer, preventing them from aging or being damaged by high temperatures.

[0080] In addition to the films described above, the display panel may also include a first flexible layer, a first barrier layer, a second flexible layer, and a second barrier layer stacked on the substrate. The first and second flexible layers are typically made of PI material, possessing high modulus, high strength, and resistance to high and low temperatures, providing a high-strength, low-weight flexible support structure for the display panel. The first and second barrier layers reduce the permeability of water vapor and oxygen, preventing water and oxygen from entering the interior of the display panel, thereby improving the reliability of the display panel.

[0081] A light-emitting layer can also be placed above the array layer. In OLED display panels, the light-emitting layer is made of organic electroluminescent materials, which are particularly sensitive to oxygen and water vapor.

[0082] A protective layer can be further disposed above the light-emitting layer to protect the underlying light-emitting layer from environmental factors such as moisture, oxygen, dust, and chemicals. The protective layer may include a first inorganic protective layer, an organic protective layer, and a second inorganic protective layer stacked together. The first and second inorganic protective layers have high density and can prevent external water vapor, oxygen, etc., from penetrating the underlying film layer. The organic protective layer has a large thickness and can flatten the film surface of the display panel to facilitate the placement of structures such as touch function structures, optical films, and cover plates on the display side of the display panel.

[0083] In addition to the film layers described above, other film layers may be provided on the display panel, and this disclosure does not impose specific restrictions on this.

[0084] Based on the same inventive concept, this disclosure also provides a display device, including the display panel provided in the above embodiments of this disclosure. It should be understood that the principle of solving the problem in the display device embodiments is similar to that in the above-described display panel embodiments. Therefore, the implementation of this embodiment can refer to the implementation of the above-described display panel embodiments, and repeated details will not be described again.

[0085] In embodiments of this disclosure, the display device may include electronic devices such as mobile phones, tablets, televisions, laptops, and monitors, as well as smart wearable devices with display functions such as smartwatches and health monitoring devices. This disclosure does not impose specific limitations on the specific form of the display device.

[0086] Since the principle of solving the problem in the display device embodiment is similar to that in the above-described display panel embodiment, the implementation of the display device embodiment can refer to the implementation of the above-described display panel embodiment, and repeated details will not be described again.

[0087] In the display device of this embodiment, during the Frit encapsulation process of the display panel, the heat dissipation component of the display panel is energized. The heat-absorbing electrode adjacent to the display area absorbs heat, and the heat is released from a location away from the display area via a heat-releasing electrode. This prevents the heat generated by the laser in the encapsulation area from affecting the light-emitting device structure in the display area. Due to the heat dissipation component, the distance between the display area and the encapsulation area can be further shortened, reducing the bezel width and enabling the display device to achieve a higher screen-to-body ratio.

[0088] Furthermore, since the heat dissipation components of the display panel are located inside the display panel, they can directly cool the area between the display area and the packaging area. Compared with the solution of cooling outside the display panel, the cooling effect is better and the cooling location is more precise.

[0089] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.

[0090] The block diagrams of devices, apparatuses, and devices involved in this disclosure are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, and devices can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0091] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this disclosure. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of this disclosure. Therefore, this disclosure is not intended to be limited to the aspects shown herein, but rather to be carried out within the widest scope consistent with the principles and novel features disclosed herein.

[0092] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this disclosure to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, It includes adjacent display areas and non-display areas, wherein the non-display area includes an encapsulation area that is far from the display area; The display panel includes: Substrate; A heat dissipation assembly is disposed on one side of the substrate. The heat dissipation assembly includes a plurality of first-type semiconductor blocks and a plurality of second-type semiconductor blocks, which are alternately connected in series. The plurality of first-type semiconductor blocks and the plurality of second-type semiconductor blocks are connected by a plurality of electrodes, the plurality of electrodes including heat-absorbing electrodes and heat-releasing electrodes, the heat-absorbing electrodes being disposed on the side of the non-display area closer to the display area, and the heat-releasing electrodes being disposed on the side of the non-display area away from the display area; The orthogonal projection of the heat-absorbing electrode on the substrate at least partially coincides with the boundary between the display area and the non-display area, and the orthogonal projection of the heat-releasing electrode on the substrate at least partially lies in the encapsulation area.

2. The display panel according to claim 1, characterized in that, The shape of the orthographic projection of the heat-absorbing electrode on the substrate includes a rectangle, one side of which coincides with the boundary between the display area and the non-display area.

3. The display panel according to claim 1, characterized in that, The non-display area also includes a heat-absorbing region near the display area, wherein the heat-absorbing electrodes are arranged in a Peano curve pattern on the substrate and fill the heat-absorbing region.

4. The display panel according to claim 1, characterized in that, The non-display area also includes a heat-absorbing region near the display area. The orthogonal projection of the heat-absorbing electrode on the substrate presents a bent structure, which includes multiple alternating long sides and multiple short sides. The multiple long sides are arranged side by side along the length direction of the heat-absorbing region, and the multiple short sides extend along the length direction of the heat-absorbing region. Some of the multiple short sides are located at the boundary between the heat-absorbing region and the display area, and some of the multiple short sides are located at the boundary of the heat-absorbing region away from the display area.

5. The display panel according to any one of claims 1 to 4, characterized in that, The non-display area also includes a heat-dissipating region away from the display area. The heat-dissipating electrodes are arranged in a Peano curve pattern on the substrate and fill the heat-dissipating region. The heat-dissipating region at least partially overlaps with the packaging area.

6. The display panel according to claim 1, characterized in that, The first type of semiconductor block includes p-type semiconductors, and the second type of semiconductor block includes n-type semiconductors; or The first type of semiconductor block includes n-type semiconductors, and the second type of semiconductor block includes p-type semiconductors.

7. The display panel according to claim 1, characterized in that, The materials of the heat-absorbing electrode and the heat-releasing electrode include metallic materials.

8. The display panel according to claim 1, characterized in that, It also includes an array layer disposed on one side of the substrate, and the heat dissipation component is disposed on the side of the array layer away from the substrate.

9. The display panel according to claim 1, characterized in that, The number of heat dissipation components is multiple, and the multiple heat dissipation components are connected in parallel.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 1 to 9.

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