Display panel, method for manufacturing display panel, and display device

CN122995478APending Publication Date: 2026-10-27HEFEI VISIONOX TECH CO LTD
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Patent Information

Application Number
CN202510541376.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-04-25
Publication Date
2026-10-27

AI Technical Summary

Technical Problem

如今折叠屏应用愈加广泛,现有偏光片技术已无法满足折叠需求

Benefits of technology

[0026]在本申请的实施例中,光学阻隔结构包括吸光材料,吸光材料包括钙钛矿材料和有机吸光材料中的至少一种。钙钛矿材料和有机吸光材料具有良好的吸光性能,对可见光波段的吸收系数高,透光率较差,可有效阻隔环境光的入射以及反射光的出射。同时,本申请实施例所选择的吸光材料可以通过蒸镀或者喷墨打印的方式沉积形成光学阻隔结构,减少了工艺制程时间,可以提高产线的产能效率,降低成本。

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Abstract

Embodiments of the present application provide a display panel, a manufacturing method of the display panel and a display device. The display panel comprises a substrate, a light-emitting layer disposed on one side of the substrate, the light-emitting layer comprising a plurality of light-emitting units arranged at intervals, an encapsulation layer disposed on the side of the light-emitting layer away from the substrate, and a filter layer disposed on the side of the encapsulation layer away from the substrate, the filter layer comprising an optical barrier structure, a filter opening enclosed by the optical barrier structure, and a color resistance structure at least partially located in the filter opening. The color resistance structure at least partially overlaps the light-emitting units in the orthographic projection of the substrate. The optical barrier structure comprises a light-absorbing material, and the light-absorbing material comprises at least one of a perovskite material and an organic light-absorbing material. The perovskite material and the organic light-absorbing material can effectively block the incidence of ambient light and the emission of reflected light, and the optical barrier structure can be deposited by evaporation or inkjet printing, thereby reducing the process time, improving the production efficiency, and reducing the cost.
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Description

Technical Field

[0001] This application relates to the field of display device technology, and in particular to a display panel, a method for manufacturing the display panel, and a display device. Background Technology

[0002] With the rapid development of technology, display media has become an important part of people's lives. Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream display media.

[0003] Currently, traditional display panel structures include polarizers to reduce light reflection from metal, thereby improving display performance. However, with the increasing prevalence of foldable screens, existing polarizer technology is no longer sufficient to meet the demands of folding technology. Summary of the Invention

[0004] This application provides a display panel, a method for manufacturing the display panel, and a display device, aiming to achieve a polarizer-free structure at low cost.

[0005] In a first aspect, embodiments of this application provide a display panel, comprising: a substrate; a light-emitting layer disposed on one side of the substrate, the light-emitting layer including a plurality of spaced-apart light-emitting units; an encapsulation layer disposed on the side of the light-emitting layer away from the substrate; and a light-filtering layer disposed on the side of the encapsulation layer away from the substrate, including an optical blocking structure, a light-filtering opening formed by the optical blocking structure, and a color resist structure at least partially located in the light-filtering opening, wherein the orthographic projection of the color resist structure on the substrate and the orthographic projection of the light-emitting units on the substrate at least partially overlap, and the optical blocking structure including a light-absorbing material, the light-absorbing material including at least one of perovskite material and organic light-absorbing material.

[0006] According to an embodiment of the first aspect of this application, the optical blocking structure is made of perovskite material and organic light-absorbing material.

[0007] According to the embodiments of the first aspect of this application, the perovskite material is an all-inorganic perovskite material or an organic-inorganic hybrid perovskite material.

[0008] According to an embodiment of the first aspect of this application, the perovskite material has an ABX3 structure, wherein A includes at least one of methylamine ions, formamidinium ions, and cesium ions; B includes at least one of lead ions and tin ions; and X includes at least one of iodide ions, bromide ions, and chloride ions.

[0009] According to an embodiment of the first aspect of this application, the organic light-absorbing material includes at least one of fullerene-based organic materials, aromatic compounds, polycyclic aromatic olefin derivatives, PBDB-T and its derivatives.

[0010] According to an embodiment of the first aspect of this application, fullerene-based small molecule organic materials include C 60 and C 70 At least one of them.

[0011] According to an embodiment of the first aspect of this application, PBDB-T and its derivatives include at least one of the structures shown in Formulas -1 to -8.

[0012]

[0013]

[0014] According to an embodiment of the first aspect of this application, the thickness d of the optical blocking structure is ≥ 500 nm, and the thickness of the color resist structure is greater than or equal to the thickness of the optical blocking structure.

[0015] According to an embodiment of the first aspect of this application, the thickness d of the optical blocking structure is 1 μm to 5 μm.

[0016] According to an embodiment of the first aspect of this application, the thickness of the color resist structure ranges from 1 μm to 5.5 μm.

[0017] According to an embodiment of the first aspect of this application, the light-emitting unit includes a first color light-emitting unit and a second color light-emitting unit, and the optical blocking structure includes a first optical blocking structure and a second optical blocking structure. The orthographic projection of the first optical blocking structure onto the light-emitting layer is located on both sides of the first color light-emitting unit, and the orthographic projection of the second optical blocking structure onto the light-emitting layer is located on one side of the second color light-emitting unit. The thickness of the first optical blocking structure is the same as or different from the thickness of the second optical blocking structure.

[0018] According to an embodiment of the first aspect of this application, the thickness of the first optical barrier structure is greater than that of the second optical barrier structure.

[0019] According to an embodiment of the first aspect of this application, the first color light-emitting unit is a red light-emitting unit, and the second color light-emitting unit is a blue light-emitting unit or a green light-emitting unit.

[0020] According to an embodiment of the first aspect of this application, at least one first optical barrier structure has opposing first and second surfaces in a direction from the substrate to the encapsulation layer, the first surface being attached to the encapsulation layer and the second surface being recessed toward the first surface.

[0021] According to an embodiment of the first aspect of this application, at least one second optical barrier structure has opposing third and fourth surfaces in a direction from the substrate to the encapsulation layer, the third surface being attached to the encapsulation layer and the fourth surface protruding away from the third surface.

[0022] Secondly, embodiments of this application provide a method for manufacturing a display panel, comprising: forming a light-emitting layer on one side of a substrate, the light-emitting layer including a plurality of spaced light-emitting units; forming an encapsulation layer on the side of the light-emitting layer away from the substrate; preparing an optical barrier structure on the side of the encapsulation layer away from the substrate, the optical barrier structure enclosing a light-filtering opening, the optical barrier structure including a light-absorbing material, the light-absorbing material including at least one of perovskite material and organic light-absorbing material; and preparing a color resist structure on the side of the optical barrier structure away from the encapsulation layer, at least a portion of the color resist structure being located at the light-filtering opening.

[0023] According to an embodiment of the second aspect of this application, the light-absorbing material includes a perovskite material. The step of preparing an optical barrier structure on the side of the encapsulation layer away from the substrate includes: preparing a perovskite precursor solution and depositing the perovskite precursor solution onto the encapsulation layer by inkjet printing to obtain an optical barrier structure; or, obtaining perovskite powder and depositing the perovskite powder onto the encapsulation layer by vapor deposition to obtain an optical barrier structure; preferably, the step of preparing a perovskite precursor solution and depositing the perovskite precursor solution onto the encapsulation layer by inkjet printing to obtain an optical barrier structure further includes: after depositing the perovskite precursor solution onto the encapsulation layer by inkjet printing, subjecting the optical barrier structure to high-temperature annealing to form a dense crystalline layer.

[0024] According to an embodiment of the second aspect of this application, the light-absorbing material includes an organic light-absorbing material, and the step of preparing an optical barrier structure on the side of the encapsulation layer away from the substrate includes: preparing an organic light-absorbing material suspension, and depositing the organic light-absorbing material suspension onto the encapsulation layer by inkjet printing to obtain an optical barrier structure; or, the light-absorbing material includes a fullerene-based organic material, and the step of preparing an optical barrier structure on the side of the encapsulation layer away from the substrate includes: obtaining a fullerene-based organic material, and depositing the fullerene-based organic material powder onto the encapsulation layer by vapor deposition to obtain the optical barrier structure; preferably, after the step of depositing the organic light-absorbing material suspension onto the encapsulation layer by inkjet printing, the step further includes: subjecting the optical barrier structure to high-temperature annealing to form a dense crystalline layer.

[0025] Thirdly, embodiments of this application provide a display device, including the display panel in the first aspect embodiment, or a display panel formed by the manufacturing method of the display panel in the first aspect embodiment.

[0026] In the embodiments of this application, the optical barrier structure includes a light-absorbing material, which includes at least one of perovskite material and organic light-absorbing material. Perovskite and organic light-absorbing materials have excellent light absorption properties, high absorption coefficients in the visible light band, and poor light transmittance, effectively blocking the incident ambient light and the emitted reflected light. Furthermore, the light-absorbing material selected in the embodiments of this application can be deposited to form the optical barrier structure by vapor deposition or inkjet printing, reducing process time, improving production line efficiency, and lowering costs. Attached Figure Description

[0027] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar features.

[0028] Figure 1 This is a schematic diagram of the structure of a display panel provided in an embodiment of this application;

[0029] Figure 2 This is a partial structural diagram of a display panel provided in an embodiment of this application;

[0030] Figure 3 This is a partial structural diagram of another display panel provided in an embodiment of this application;

[0031] Figure 4 This is a partial structural schematic diagram of another display panel provided in an embodiment of this application;

[0032] Figure 5 This is a partial structural schematic diagram of another display panel provided in an embodiment of this application;

[0033] Figure 6 This is a partial structural schematic diagram of another display panel provided in an embodiment of this application;

[0034] Figure 7 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0035] Explanation of reference numerals in the attached figures:

[0036] 100, Substrate; 200, Light-emitting layer; 201, First color light-emitting unit; 202, Second color light-emitting unit; 300, Encapsulation layer; 400, Filter layer; 410, Optical barrier structure; 411, First optical barrier structure; 411a, First surface; 411b, Second surface; 412, Second optical barrier structure; 412a, Third surface; 412b, Fourth surface; 420, Color resist structure; 500, Optical adhesive layer; 600, Cover plate. Detailed Implementation

[0037] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without requiring some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples. In the accompanying drawings and the following description, at least some well-known structures and techniques are not shown to avoid unnecessarily obscuring the application; and, for clarity, the dimensions of some structures may be exaggerated. Furthermore, the features, structures, or characteristics described below can be combined in any suitable manner in one or more embodiments.

[0038] In the description of this application, it should be noted that, unless otherwise stated, "a plurality of" means two or more; the terms "upper," "lower," "left," "right," "inner," "outer," etc., indicating orientation or positional relationships are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0039] The directional terms appearing in the following description refer to the directions shown in the figures and are not intended to limit the specific structure of the embodiments of this application. It should also be noted in the description of this application that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] Existing polarizers, due to their poor mechanical properties and low light transmittance, are difficult to use in flexible panels such as foldable panels. Current depolarizer technology, based on traditional resin-based materials and processes, is costly and complex. Preliminary calculations indicate that depolarizer technology requires four additional photomasks compared to traditional module processes. Furthermore, the photolithography process time is increased, significantly reducing production line efficiency.

[0041] In view of the above problems, this application provides a display panel, a method for manufacturing the display panel, and a display device, which achieves a polarizer-free structure at low cost.

[0042] Firstly, please refer to Figure 1This application provides a display panel, including: a substrate 100; a light-emitting layer 200 disposed on one side of the substrate 100, the light-emitting layer 200 including a plurality of spaced light-emitting units; an encapsulation layer 300 disposed on the side of the light-emitting layer 200 away from the substrate 100; and a light-filtering layer 400 disposed on the side of the encapsulation layer 300 away from the substrate 100, including an optical barrier structure, a light-filtering opening formed by the optical barrier structure, and a color resist structure 420 at least partially located in the light-filtering opening. The orthographic projection of the color resist structure 420 on the substrate 100 and the orthographic projection of the light-emitting units on the substrate 100 at least partially overlap. The optical barrier structure includes a light-absorbing material, the light-absorbing material including at least one of perovskite material and organic light-absorbing material.

[0043] In this embodiment, the substrate 100 can provide buffering, protection, or support for the display panel. The substrate 100 can be a flexible substrate, and its material can include one or more of polyimide (PI), polyethylene naphthalate (PEN), or polyethylene terephthalate (PET). The substrate 100 can also be a rigid substrate, such as a glass substrate.

[0044] In some embodiments, the substrate 100 may be a substrate 100 having a certain circuit structure for driving a light-emitting device layer located thereon to emit light for display. Optionally, the substrate 100 may include a substrate and an array substrate, and the array substrate may include a driving circuit.

[0045] The light-emitting layer 200 is disposed on one side of the substrate 100 and includes a plurality of spaced-apart light-emitting units arranged in an array. These light-emitting units are the core components that enable the display panel to emit light and form images. They generate light by being excited by electrical signals. Different light-emitting units can emit different colors of light, such as the three primary colors of red, green and blue. By controlling the light intensity and combination of different light-emitting units, a variety of rich and colorful images can be presented.

[0046] An encapsulation layer 300 is disposed on the side of the light-emitting layer 200 facing away from the substrate 100, and the encapsulation layer 300 protects the light-emitting layer 200. Since the light-emitting units in the light-emitting layer 200 are typically sensitive to environmental factors, such as moisture and oxygen, which may affect their luminous performance and lifespan, the encapsulation layer 300 effectively prevents harmful substances such as moisture and oxygen from entering the light-emitting layer 200, providing a stable working environment for the light-emitting units, extending the lifespan of the light-emitting layer 200, and ensuring the reliability and stability of the display panel.

[0047] The filter layer 400 is disposed on the side of the encapsulation layer 300 facing away from the substrate 100, and it plays a key role in improving the color performance and contrast of the display panel. The filter layer 400 includes an optical blocking structure and a color resist structure 420 at least partially located in the filter opening formed by the optical blocking structure.

[0048] The optical barrier structure includes a light-absorbing material, which may be at least one of perovskite material and organic light-absorbing material. Perovskite and organic light-absorbing materials possess excellent light absorption properties, high absorption coefficients in the visible light band, and poor light transmittance, effectively blocking the incident ambient light and the outgoing reflected light. Furthermore, the light-absorbing material selected in this embodiment can be deposited to form the optical barrier structure via vapor deposition or inkjet printing, reducing process time, improving production line efficiency, and lowering costs.

[0049] The orthographic projection of the color resist structure 420 onto the substrate 100 and the orthographic projection of the light-emitting unit onto the substrate 100 at least partially overlap. The color resist structure 420 can selectively transmit light of specific colors; for example, the red color resist structure 420 only allows red light to pass through, the green color resist structure 420 only allows green light to pass through, and the blue color resist structure 420 only allows blue light to pass through. In this way, in conjunction with the light emitted by the light-emitting unit, precise color control is achieved, thereby improving the color performance of the display panel and making the displayed images more vibrant and realistic.

[0050] In some embodiments, the optical barrier structure is made of perovskite materials and organic light-absorbing materials.

[0051] Perovskite materials exhibit excellent light absorption properties. From a crystal structure perspective, perovskites generally have the chemical formula ABX3 (A is usually an organic cation, B is a metal cation, and X is a halide anion). This structure allows perovskite materials to absorb photons over a wide range of the solar spectrum.

[0052] In some embodiments, the perovskite material is an all-inorganic perovskite material or an organic-inorganic hybrid perovskite material.

[0053] In some embodiments, the perovskite material has an ABX3 structure, where A includes at least one of methylamine ions, formamidinium ions, and cesium ions; B includes at least one of lead ions and tin ions; and X includes at least one of iodide ions, bromide ions, and chloride ions.

[0054] All-inorganic perovskite materials possess a typical ABX3 crystal structure (A is an alkali metal cation, B is a metal cation, and X is a halide ion). This structure endows them with a suitable bandgap, the width of which can be adjusted by changing the elemental composition. For example, the CsPbX3 (X = Cl, Br, I) series of all-inorganic perovskite materials can cover a wide bandgap range, from the ultraviolet to the visible light region.

[0055] Organic-inorganic hybrid perovskite materials generally have an ABX3 structure, where the A-site contains an organic cation (such as methylammonium CH3NH3). + Formamidin HC(NH2)2 + (etc.), the B site is a metal cation (such as Pb) 2+ The X-position is a halide ion (such as I). - ,Br - Cl - The introduction of organic cations can modulate the crystal structure and electronic structure of materials.

[0056] There is an interaction between organic and inorganic components, which can alter the band structure of a material, enabling it to generate a suitable band gap in the visible light range and thus absorb visible light. Factors such as the size, shape, and chemical properties of organic cations affect the band gap of a material, and these organic cations can achieve fine-tuning of the material's light absorption properties.

[0057] In some embodiments, the organic light-absorbing material includes at least one of fullerene-based organic materials, aromatic compounds, polycyclic aromatic olefin derivatives, PBDB-T and its derivatives.

[0058] In some embodiments, fullerene organic materials include C 60 and C 70 At least one of them.

[0059] Fullerenes are hollow molecules composed of carbon atoms, exhibiting a high degree of structural symmetry. Fullerene molecules contain delocalized π electrons, which can move freely within the conjugated system of the molecule. When visible light shines on a fullerene material, the energy of the photon can be absorbed by these π electrons, causing them to transition from the ground state to an excited state, thus achieving the absorption of visible light.

[0060] Fullerene organic materials can be deposited to form optical barrier structures through vapor deposition or inkjet printing, which reduces process time and can improve production line efficiency.

[0061] Fullerene-based organic materials can broaden the absorption range of visible light. By chemically modifying fullerenes, such as through covalent bonding with other organic groups, the band gap of the material can be adjusted. This allows the material to absorb visible light of different wavelengths, thus enabling the utilization of light energy over a wider spectral range.

[0062] For example, combining fullerenes with organic chromophores such as porphyrins enables the composite material to absorb visible light over a wider wavelength range. Porphyrins themselves have a specific absorption wavelength range, and when combined with fullerenes, energy transfer and electronic interactions occur between the two, resulting in a broadened absorption spectrum that can cover more visible light bands, with a certain degree of absorption from blue light to red light.

[0063] For example, aromatic compounds and polycyclic aromatic olefin derivatives include the organic optoelectronic material IDIC (2,2'-((2Z,2'Z)-((4,4,9,9-tetra(p-hexylphenyl)-4,9-dihydro-S-indolodithiophene-2,7-diyl)bis(methylmethylene))-bis-(3-oxo-2,3-dihydro-1H-indene-2,1-dimethylene)) dimalonitrile, CAS No. 1883441-92-6). Its derivatives, ITIC (2,2'-((6,6,12,12-tetra(4-hexylphenyl)-6,12-dihydrodithiophene(2,3-d:2',3'-d')-s-indolodithiophene-2,8-diyl)bis(methylmethylene(3-oxo-1H-indene-2,1(3H)-dimethylene)))dimalonitrile 2, CAS No. 1664293-06-4) and its derivatives or other organic optoelectronic materials.

[0064] In some embodiments, PBDB-T and its derivatives include at least one of the structures shown in Formulas -1 to -8.

[0065]

[0066]

[0067] PBDB-T is a polymer donor material, its full name being poly(4,8-bis(5-(2-ethylhexyl)thiophen-2-yl)benzo[1,2-b:4,5-b']dithiophene-2,6-diyl-alt-(4-(2-ethylhexyl)-3-fluorothiophene[3,4-b]thiophene-2-carboxylate-2,6-diyl)).

[0068] PBDB-T possesses a wide absorption spectrum due to the presence of conjugated thiophene and benzodithiophene units in its molecular structure, enabling it to effectively absorb light in the visible region. The conjugated structure increases the degree of electronic delocalization, thereby reducing the energy required for electronic transitions. For example, its absorption spectrum ranges from approximately 400 nm to around 700 nm, covering most of the visible light spectrum, which is beneficial for improving the efficiency of sunlight utilization.

[0069] By chemically modifying PBDB-T to obtain derivatives, the absorption spectrum range can be adjusted. For example, introducing different side-chain groups or changing the chemical structure of the main chain can alter the energy level distribution of the molecule. Introducing electron-withdrawing groups into the molecular structure may cause a red shift in the absorption spectrum, i.e., a shift towards longer wavelengths, thus further broadening the absorption range and better absorbing the longer wavelengths of visible light, such as red light. Conversely, introducing electron-donating groups may produce a blue shift, shifting the absorption spectrum towards shorter wavelengths, thereby allowing for targeted absorption modulation within a specific wavelength range of visible light.

[0070] By altering the side-chain structure, PBDB-T derivatives can be obtained by changing the length, shape, or chemical composition of the side chains. This allows for the regulation of the material's solubility, crystallinity, and intermolecular interactions, thereby optimizing its optoelectronic and processing properties. For example, introducing long-chain alkyl side chains can improve the material's solubility and film-forming properties, which is beneficial for solution-based device fabrication.

[0071] Introducing specific functional groups, such as fluorine atoms and cyano groups, into the polymer backbone or side chains can alter the material's energy level structure, absorption spectrum, and charge transport properties. For example, introducing fluorine atoms may enhance the orderliness of the molecular arrangement and the π-π packing strength, which is beneficial for improving mobility. At the same time, it may interfere with the electrostatic potential distribution on the backbone, increasing energy disorder and thus improving the Seebeck coefficient.

[0072] PBDB-T and its derivatives typically exhibit absorption peaks with a concentration as high as 10 near their absorption peaks. 5 cm -1 The absorption coefficient is on the order of magnitude higher. This means that PBDB-T and its derivatives can effectively absorb large amounts of light in relatively thin films.

[0073] In some embodiments, the thickness d of the optical barrier structure is ≥ 500 nm, and the thickness of the color resist structure 420 is greater than or equal to the thickness of the optical barrier structure.

[0074] When the thickness of the optical barrier structure exceeds 500 nm, the path of light propagation within the material becomes longer. A sufficiently thick optical barrier structure may absorb a wider range of wavelengths due to multiple internal reflections and refractions. A thicker optical barrier structure can selectively absorb different wavelengths of light by adjusting its internal structure and composition, thereby achieving a more precise filtering effect. By controlling the thickness and composition of the light-absorbing material, unwanted colors of light can be precisely absorbed, improving the accuracy of displayed colors. In the embodiments of this application, the light absorption capacity of the light-absorbing material is positively correlated with the film thickness; that is, the thicker the film, the lower the transmittance. When the thickness of the two materials mentioned above is 500 nm, the transmittance in the visible light band is ≤5%.

[0075] In some embodiments, please continue reading Figure 1 The thickness d of the optical barrier structure is preferably 1μm to 5μm. When the thickness d of the optical barrier structure is within the above range, the absorption rate of the visible light band is greater than 95%, and it is relatively easy to achieve by vapor deposition process, which can more accurately control the growth rate and quality of the thin film.

[0076] At the same time, this thickness range helps control production costs. Compared to thicker optical barrier structures, it requires less material. A suitable thickness can reduce raw material costs and production time while ensuring product quality, thereby improving production efficiency.

[0077] For example, the thickness d of the optical barrier structure is 1μm, 2μm, 3μm, 4μm, 5μm, etc.

[0078] In some embodiments, the thickness of the color resist structure 420 ranges from 1 μm to 5.5 μm.

[0079] The thickness of the color resist structure 420 within the above-mentioned range can effectively reduce reflected and scattered light, enabling the display to still present clear and vivid images in strong light environments and reducing the interference of ambient light reflection on image quality.

[0080] For example, the thickness d of the optical barrier structure is 1μm, 2μm, 3μm, 4μm, 5μm, etc.

[0081] The optical performance of the color resist structure 420 is closely related to its thickness. A thicker color resist structure 420 can better control the interference and diffraction of light, allowing light to undergo multiple reflections and refractions as it propagates, thus more accurately selecting the desired color light.

[0082] In some embodiments, the light-emitting unit includes a first color light-emitting unit 201 and a second color light-emitting unit 202, and the optical blocking structure includes a first optical blocking structure 411 and a second optical blocking structure 412. The orthographic projection of the first optical blocking structure 411 onto the light-emitting layer 200 is located on both sides of the first color light-emitting unit 201, and the orthographic projection of the second optical blocking structure 412 onto the light-emitting layer 200 is located on one side of the second color light-emitting unit 202. The thickness of the first optical blocking structure 411 may be the same as or different from the thickness of the second optical blocking structure.

[0083] For example, please refer to Figure 2 The thickness of the first optical barrier structure 411 is equal to that of the second optical barrier structure 412. Achieving the same thickness for the optical barrier structures is relatively easy using a vapor deposition process, allowing for more precise control of the film growth rate and quality.

[0084] In some embodiments, please refer to Figure 3 The light-emitting unit includes a first color light-emitting unit 201 and a second color light-emitting unit 202. The optical blocking structure includes a first optical blocking structure 411 and a second optical blocking structure 412. The orthographic projection of the first optical blocking structure 411 onto the light-emitting layer 200 is located on both sides of the first color light-emitting unit 201. The orthographic projection of the second optical blocking structure 412 onto the light-emitting layer 200 is located on one side of the second color light-emitting unit 202. The thickness of the first optical blocking structure 411 is greater than that of the second optical blocking structure 412.

[0085] Optionally, the first color light-emitting unit 201 is a red light-emitting unit, and the second color light-emitting unit 202 is a blue light-emitting unit or a green light-emitting unit.

[0086] In this embodiment, the thickness of the optical barrier structure can be used to adjust the wide-viewing angle display effect of the display panel. When the wide-viewing angle color is biased towards the color of the first color light-emitting unit 201, the thickness of the first optical barrier structure 411, whose orthogonal projection on the light-emitting layer 200 is located on both sides of the first color light-emitting unit 201, can be appropriately increased to reduce the amount of the first color emitted from the wide-viewing angle.

[0087] Taking a red light-emitting unit 201 as the first color light-emitting unit and a blue or green light-emitting unit 202 as the second color light-emitting unit, the orthographic projection of the first optical blocking structure 411 onto the light-emitting layer 200 is located on both sides of the first color light-emitting unit 201. The orthographic projection of the second optical blocking structure 412 onto the light-emitting layer 200 is located on one side of the second color light-emitting unit 202. The orthographic projection on the other side of the second color light-emitting unit 202 is the orthographic projection of the first optical blocking structure 411 onto the light-emitting layer 200. The thickness of the first optical blocking structure 411 is greater than the thickness of the second optical blocking structure 412. In actual display processes, when the viewing angle increases, the amount of red light emitted may become excessive, thus affecting the overall display effect, such as causing color distortion and decreased contrast. By setting the first optical blocking structure 411 on both sides of the red light-emitting unit, the propagation of red light at a large viewing angle can be blocked to a certain extent, thereby reducing the amount of the first color emitted at a large viewing angle.

[0088] When there is a possibility of excessive green or blue light emission, the thickness of the second optical barrier structure 412, whose orthogonal projection of the light-emitting layer 200 is located on both sides of the green or blue light-emitting unit, can be appropriately increased to reduce the emission of green or blue light over a wide viewing angle.

[0089] In some embodiments, please continue reading Figure 2 and Figure 3 The surface of the optical barrier structure in the direction from the substrate 100 to the encapsulation layer 300 can be planar. The optical barrier structure is flat, which is beneficial for obtaining a uniform layer thickness during the coating process. This morphology has good opacity and does not interfere with the emitted red, green, and blue light in a wide viewing angle. When a certain color is biased at a wide viewing angle, the thickness of the optical barrier structure adjacent to the light-emitting unit of that color can be appropriately increased to reduce the emission of that color at a wide viewing angle.

[0090] Please see Figures 4 to 6 In this embodiment, the two surfaces of the optical barrier structure in the direction from the substrate 100 to the encapsulation layer 300 may not be parallel. For example, the optical barrier structure may have a concave or convex surface. The concave or convex surface can reflect a portion of ambient light. When ambient light shines on the optical barrier structure, the concave surface acts like a concave mirror. When light comes into contact with the concave surface, it is reflected according to the law of reflection. The incident angles of light rays at different positions on the concave surface are different. After reflection, these reflected rays converge or diverge in a specific direction, effectively reflecting a portion of the ambient light and changing its original propagation path.

[0091] Convex structures, when exposed to ambient light, behave like convex mirrors. Light rays strike the convex surface and are reflected. Due to the geometric characteristics of the convex surface, the reflected light rays are dispersed in all directions, effectively reflecting a portion of the ambient light and blocking its direct propagation to some extent. Whether concave or convex, the reflective properties of both structures play a crucial role in optical applications, providing effective means for light control and adjustment.

[0092] In some embodiments, please refer to Figure 4 and Figure 6 At least one first optical barrier structure 411 has a first surface 411a and a second surface 411b opposite each other in the direction from the substrate to the encapsulation layer, the first surface 411a being attached to the encapsulation layer and the second surface 411b being recessed toward the first surface 411a.

[0093] The first optical barrier structure 411 has a first surface 411a attached to the encapsulation layer 300 in the direction from the substrate 100 to the encapsulation layer 300, and a second surface 411b recessed toward the first surface 411a. That is, the first optical barrier structure 411 has a concave structure, which can effectively reflect a portion of the ambient light and change its original propagation path.

[0094] The first optical blocking structure 411 with a concave structure can be one or more.

[0095] The concave structure is also beneficial for adjusting color shift issues at large viewing angles. For example, when the display panel is reddish at large viewing angles, a first optical barrier structure 411 with a concave structure can be applied around the red light-emitting unit to improve the color shift.

[0096] In some embodiments, please refer to Figure 5 and Figure 6 At least one second optical barrier structure 412 has a third surface 412a and a fourth surface 412b opposite each other in the direction from the substrate 100 to the encapsulation layer 300, the third surface 412a being attached to the encapsulation layer 300 and the fourth surface 412b being raised away from the third surface 412a.

[0097] The second optical barrier structure 412 has a third surface 412a attached to the encapsulation layer 300 in the direction from the substrate 100 to the encapsulation layer 300, and a fourth surface 412b protruding away from the third surface 412a. That is, the second optical barrier structure 412 has a convex structure, which can effectively reflect a portion of the ambient light and change its original propagation path.

[0098] The convex structure is also beneficial for adjusting the color shift problem at a wide viewing angle. For example, when the display panel is reddish at a wide viewing angle, a second optical barrier structure 412 with a convex structure can be applied around other color light-emitting units, such as green light-emitting units or blue light-emitting units, to improve the color shift.

[0099] The second optical barrier structure 412 with a convex surface can be one or more.

[0100] Optionally, please refer to Figure 1 The display panel in this embodiment may also have other functional layers, such as an optical adhesive layer 500 located on the side of the filter layer away from the substrate, and a cover plate 600 located on the side of the optical adhesive layer 500 away from the substrate, which will not be described in detail here.

[0101] Secondly, embodiments of this application provide a method for manufacturing a display panel, which can be referred to in conjunction with the above. Figures 1 to 7 As shown, it includes:

[0102] Step S01: A light-emitting layer 200 is formed on one side of the substrate 100. The light-emitting layer 200 includes a plurality of light-emitting units arranged at intervals.

[0103] Step S02: An encapsulation layer 300 is formed on the side of the light-emitting layer 200 facing away from the substrate 100;

[0104] Step S03: An optical barrier structure is prepared on the side of the encapsulation layer 300 away from the substrate 100. The optical barrier structure forms a light-filtering opening. The optical barrier structure includes a light-absorbing material, which includes at least one of perovskite material and organic light-absorbing material.

[0105] Step S04: Prepare a color resist structure 420 on the side of the optical barrier structure opposite to the encapsulation layer 300, with at least a portion of the color resist structure 420 located at the filter opening.

[0106] In this embodiment, the optical barrier structure includes a light-absorbing material, which is at least one of perovskite material and organic light-absorbing material. Perovskite and organic light-absorbing materials have excellent light absorption properties, high absorption coefficients in the visible light band, and poor light transmittance, effectively blocking the incident ambient light and the emitted reflected light. Furthermore, the light-absorbing material selected in this embodiment can be deposited to form the optical barrier structure via vapor deposition or inkjet printing, reducing process time and improving production line efficiency.

[0107] In some embodiments, the light-absorbing material includes perovskite material. The step of preparing an optical barrier structure on the side of the encapsulation layer 300 opposite to the substrate 100 includes: preparing a perovskite precursor solution and depositing the perovskite precursor solution onto the encapsulation layer 300 by inkjet printing to obtain an optical barrier structure; or, obtaining perovskite powder and depositing the perovskite powder onto the encapsulation layer 300 by vapor deposition to obtain an optical barrier structure. Preferably, the step of preparing a perovskite precursor solution and depositing the perovskite precursor solution onto the encapsulation layer 300 by inkjet printing to obtain an optical barrier structure further includes: after depositing the perovskite precursor solution onto the encapsulation layer 300 by inkjet printing, subjecting the optical barrier structure to high-temperature annealing to form a dense crystalline layer.

[0108] Perovskite materials can be deposited in different ways. When inkjet printing is used, a perovskite precursor solution is first prepared and deposited on the light-emitting layer 200 in the spacer region of the corresponding light-emitting unit by inkjet printing. When vapor deposition is used, perovskite powder is obtained and deposited on the encapsulation layer 300 by vapor deposition.

[0109] After inkjet printing deposition, the microstructure of the material may be relatively loose. High-temperature annealing of the optical barrier structure to form a dense crystalline layer can effectively reduce internal porosity and defects. This dense crystalline layer improves the optical properties of the optical barrier structure, such as its refractive index. The annealed crystalline layer allows light transmission and reflection to better meet design requirements, improving display contrast and brightness uniformity. Without this dense structure, light may undergo disordered refraction and reflection within the uneven material, leading to blurry images or glare.

[0110] The optical barrier structure formed by perovskite material through vapor deposition has a dense structure, which reduces the scattering and absorption of light when it propagates within it.

[0111] In some embodiments, the light-absorbing material includes an organic light-absorbing material. The step of preparing an optical barrier structure on the side of the encapsulation layer 300 away from the substrate 100 includes: preparing an organic light-absorbing material suspension and depositing the organic light-absorbing material suspension on the encapsulation layer 300 by inkjet printing to obtain the optical barrier structure matrix.

[0112] Alternatively, the light-absorbing material may include fullerene-based organic materials, and the step of fabricating the optical barrier structure on the side of the encapsulation layer 300 opposite to the substrate 100 includes:

[0113] Fullerene organic materials are obtained, and fullerene organic material powder is deposited on the encapsulation layer 300 by vapor deposition to obtain an optical barrier structure.

[0114] Preferably, after the step of depositing the organic light-absorbing material suspension onto the encapsulation layer 300 by inkjet printing, the method further includes: high-temperature annealing of the optical barrier structure matrix to form a dense crystalline layer, thereby obtaining the optical barrier structure.

[0115] Similarly, when light-absorbing materials include organic light-absorbing materials, their microstructure may be relatively loose after inkjet printing deposition. High-temperature annealing of the optical barrier structure to form a dense crystalline layer can effectively reduce internal porosity and defects. This dense crystalline layer improves the optical properties of the optical barrier structure, such as its refractive index. During crystallization, the material's crystal structure becomes more regular, reducing scattering and absorption of light as it propagates. Without this dense structure, light may undergo disordered refraction and reflection within the uneven material, leading to blurred images or glare.

[0116] Fullerene organic materials can also be deposited by vapor deposition. Fullerene organic material powder is deposited on the encapsulation layer 300 by vapor deposition to obtain an optical barrier structure. The optical barrier structure formed by vapor deposition has a dense structure, which reduces the scattering and absorption of light when it propagates in it.

[0117] Thirdly, embodiments of this application provide a display device, including the display panel in the first aspect embodiment, or a display panel formed by the manufacturing method of the display panel in the first aspect embodiment.

[0118] Since the display device provided in the third aspect of this application includes the display panel of any of the first and second aspects described above, the display device provided in the third aspect of this application has the beneficial effects of the display panel of any of the first and second aspects described above, which will not be repeated here.

[0119] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0120] Although this application has been described with reference to preferred embodiments, various modifications can be made thereto and components can be replaced with equivalents without departing from the scope of this application. In particular, the technical features mentioned in the various embodiments can be combined in any manner, provided there is no structural conflict. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display panel, characterized in that, include: substrate; A light-emitting layer is disposed on one side of the substrate, and the light-emitting layer includes a plurality of spaced light-emitting units; An encapsulation layer is disposed on the side of the light-emitting layer opposite to the substrate. A filter layer is disposed on the side of the encapsulation layer opposite to the substrate. The filter layer includes an optical barrier structure, a filter opening formed by the optical barrier structure, and a color resist structure at least partially located in the filter opening. The orthographic projection of the color resist structure on the substrate and the orthographic projection of the light-emitting unit on the substrate at least partially overlap. The optical barrier structure includes a light-absorbing material, which includes at least one of perovskite material and organic light-absorbing material.

2. The display panel according to claim 1, characterized in that, The optical barrier structure is made of perovskite materials and organic light-absorbing materials. Optionally, the perovskite material is an all-inorganic perovskite material or an organic-inorganic hybrid perovskite material; Optionally, the perovskite material has an ABX3 structure, where A includes at least one of methylamine ions, formamidinium ions, and cesium ions; B includes at least one of lead ions and tin ions; and X includes at least one of iodide ions, bromide ions, and chloride ions. Optionally, the organic light-absorbing material includes at least one of fullerene organic materials, aromatic compounds, polycyclic aromatic olefin derivatives, PBDB-T and its derivatives; Optionally, the fullerene-based organic material includes C 60 and C 70 At least one of them; Optionally, the PBDB-T and its derivatives include at least one of the structures shown in Formulas -1 to -8.

3. The display panel according to claim 1, characterized in that, The thickness d of the optical barrier structure is ≥ 500 nm, and the thickness of the color resist structure is greater than or equal to the thickness of the optical barrier structure. Optionally, the thickness d of the optical barrier structure is taken as 1 μm to 5 μm; Optionally, the thickness of the color resist structure ranges from 1 μm to 5.5 μm.

4. The display panel according to claim 1, characterized in that, The light-emitting unit includes a first color light-emitting unit and a second color light-emitting unit. The optical blocking structure includes a first optical blocking structure and a second optical blocking structure. The orthographic projection of the first optical blocking structure onto the light-emitting layer is located on both sides of the first color light-emitting unit. The orthographic projection of the second optical blocking structure onto the light-emitting layer is located on one side of the second color light-emitting unit. The thickness of the first optical blocking structure may be the same as or different from the thickness of the second optical blocking structure. Optionally, the thickness of the first optical barrier structure is greater than that of the second optical barrier structure; Optionally, the first color light-emitting unit is a red light-emitting unit, and the second color light-emitting unit is a blue light-emitting unit or a green light-emitting unit.

5. The display panel according to any one of claims 4, characterized in that, At least one of the first optical barrier structures has opposing first and second surfaces in a direction from the substrate to the encapsulation layer, the first surface being attached to the encapsulation layer and the second surface being recessed toward the first surface.

6. The display panel according to claim 4 or 5, characterized in that, At least one of the second optical barrier structures has opposing third and fourth surfaces in a direction from the substrate to the encapsulation layer, the third surface being attached to the encapsulation layer and the fourth surface protruding away from the third surface.

7. A method for manufacturing a display panel, characterized in that, include: A light-emitting layer is formed on one side of a substrate, the light-emitting layer comprising a plurality of spaced light-emitting units; An encapsulation layer is formed on the side of the light-emitting layer opposite to the substrate; An optical barrier structure is prepared on the side of the encapsulation layer away from the substrate. The optical barrier structure encloses and forms a light-filtering opening. The optical barrier structure includes a light-absorbing material, which includes at least one of perovskite material and organic light-absorbing material. A color resist structure is prepared on the side of the optical barrier structure away from the encapsulation layer, with at least a portion of the color resist structure located at the filter opening.

8. The manufacturing method according to claim 7, characterized in that, The light-absorbing material includes perovskite material, and the step of fabricating an optical barrier structure on the side of the encapsulation layer away from the substrate includes: A perovskite precursor solution is prepared, and the perovskite precursor solution is deposited on the encapsulation layer by inkjet printing to obtain the optical barrier structure. Alternatively, perovskite powder can be obtained and deposited onto the encapsulation layer by vapor deposition to obtain the optical barrier structure. Preferably, the step of preparing a perovskite precursor solution and depositing the perovskite precursor solution onto the encapsulation layer by inkjet printing to obtain the optical barrier structure further includes: after depositing the perovskite precursor solution onto the encapsulation layer by inkjet printing, subjecting the optical barrier structure to high-temperature annealing to form a dense crystalline layer.

9. The manufacturing method according to claim 7, characterized in that, The light-absorbing material includes an organic light-absorbing material, and the step of preparing an optical barrier structure on the side of the encapsulation layer away from the substrate includes: An organic light-absorbing material suspension was prepared, and the organic light-absorbing material suspension was deposited on the encapsulation layer by inkjet printing to obtain an optical barrier structure. Alternatively, the light-absorbing material includes fullerene-based organic materials, and the step of preparing the optical barrier structure on the side of the encapsulation layer opposite to the substrate includes: A fullerene-based organic material is obtained, and the fullerene-based organic material powder is deposited on the encapsulation layer by vapor deposition to obtain the optical barrier structure. Preferably, after the step of depositing the organic light-absorbing material suspension onto the encapsulation layer by inkjet printing, the method further includes: performing high-temperature annealing on the optical barrier structure to form a dense crystalline layer.

10. A display device, characterized in that, The display panel includes the display panel according to any one of claims 1-6, or the display panel formed by the manufacturing method of the display panel according to any one of claims 7-9.