Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device. The display panel comprises a substrate, an organic functional layer and an encapsulation layer. The organic functional layer is arranged on the substrate, and the encapsulation layer is arranged on the organic functional layer. The display panel has a hole region and a main display region. The hole region comprises a hole arranged in the hole region and a buffer region at least partially surrounding the hole, and the hole at least penetrates the encapsulation layer and the organic functional layer. The main display region at least partially surrounds the buffer region, and the buffer region separates the hole and the main display region. At least one groove is arranged on the substrate close to one side of the organic functional layer, and the at least one groove is located in the buffer region and is used for prolonging a water-oxygen invasion path in a first direction. The organic functional layer is disconnected at the at least one groove, and a metal layer is arranged at the bottom of the at least one groove and is used for blocking a water-oxygen invasion path in a second direction, and the metal layer has a first thickness. According to the technical scheme of the application, the water-oxygen invasion in the first direction and the second direction can be blocked simultaneously.

Description

Technical Field

[0001] This application relates to the field of display devices, specifically to a display panel and its manufacturing method, and a display device. Background Technology

[0002] Increasing the screen-to-body ratio of display panels to improve visual effects and user experience is a hot research topic in the field of display devices.

[0003] To increase the screen-to-body ratio of a display panel, a hole is usually cut into the panel to house a front-facing camera or sensors. This maximizes the screen-to-body ratio without compromising display quality.

[0004] However, drilling holes in the screen will cause the vapor-deposited layer (e.g., organic functional layer) on the screen interface to be directly exposed to the external environment, making it susceptible to corrosion by water and oxygen and thus failing, forming dark spots. Summary of the Invention

[0005] In view of this, this application provides a display panel and its manufacturing method and display device to reduce and avoid the corrosion of the vapor-deposited layer near the holes by water and oxygen, thereby improving the service life and visual effect of the display panel.

[0006] In a first aspect, embodiments of this application provide a display panel comprising a substrate, an organic functional layer, and an encapsulation layer. The organic functional layer is disposed on the substrate, and the encapsulation layer is disposed on the organic functional layer on a side facing away from the substrate. The display panel has an aperture region and a main display region. The aperture region includes an aperture disposed therein and a buffer zone at least partially surrounding the aperture, the aperture penetrating at least through the encapsulation layer and the organic functional layer. The main display region at least partially surrounds the buffer zone, and the buffer zone isolates the aperture and the main display region. At least one groove is disposed on the side of the substrate near the organic functional layer, the at least one groove being located in the buffer zone and at least partially surrounding the aperture, for extending the water and oxygen intrusion path along a first direction. The organic functional layer is interrupted at the at least one groove, and a metal layer is disposed at the bottom of the at least one groove, the organic functional layer located within the groove being disposed on the side of the metal layer facing away from the substrate. The metal layer is used to block the water and oxygen intrusion path in a second direction, and the metal layer has a first thickness. The first direction is the direction from the buffer zone to the aperture, the second direction is the thickness direction of the display panel, and the first direction is perpendicular to the second direction.

[0007] In conjunction with the first aspect above, in one possible implementation, the first thickness ranges from 20 nm to 500 nm; and / or, at least one groove is formed before the organic functional layer and the encapsulation layer, and the metal layer is formed simultaneously with one of the gate layer, source layer, drain layer, anode layer or M3 electrode layer of the display panel, preferably, the metal layer is formed simultaneously with the anode layer of the display panel.

[0008] In conjunction with the first aspect above, in one possible implementation, the metal layers at the bottom of the at least one groove are disconnected from each other; and / or, the metal layers extend from the bottom of the groove to the groove wall of the groove to a first height, preferably h, and the depth of the groove is d, where h and d satisfy: h / d≥0.05.

[0009] In conjunction with the first aspect above, in one possible implementation, the projection of the top of the groove onto the substrate is smaller than the projection of the bottom of the groove onto the substrate; preferably, the groove is an inverted trapezoidal groove.

[0010] In conjunction with the first aspect above, in one possible implementation, the metal layer is formed by sputtering; and / or, the holes penetrate the substrate, the organic functional layer, and the encapsulation layer.

[0011] In conjunction with the first aspect above, in one possible implementation, a dam is provided on the side of the buffer near the main display area, the dam being disposed between the organic functional layer and the substrate; preferably, at least one groove includes a plurality of grooves spaced apart from each other, each groove being disposed at least partially around the hole, and the dam being located between two grooves of the plurality of grooves adjacent to the main display area.

[0012] In conjunction with the first aspect above, in one possible implementation, the dam comprises multiple membrane layers.

[0013] In conjunction with the first aspect described above, in one possible implementation, the substrate includes a first substrate, a first buffer layer, a second substrate, a second buffer layer, and a barrier layer, wherein the first substrate, the first buffer layer, the second substrate, the second buffer layer, and the barrier layer are sequentially stacked along the direction from the first substrate toward the barrier layer; and / or, the encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer, wherein the first inorganic layer, the organic layer, and the second inorganic layer are sequentially stacked along the direction from the first inorganic layer toward the second inorganic layer, preferably, the first inorganic layer and the second inorganic layer extend to cover the dam and extend to the edge of the hole.

[0014] Secondly, embodiments of this application provide a display device, which includes the display panel in any of the above embodiments.

[0015] Thirdly, embodiments of this application provide a method for manufacturing a display panel. The display panel has an aperture region and a main display region. The aperture region includes an aperture disposed therein and a buffer zone at least partially surrounding the aperture. The main display region at least partially surrounds the buffer zone, and the buffer zone isolates the aperture and the main display region. The manufacturing method includes: providing a substrate with apertures disposed therein; manufacturing at least one groove on the substrate, the at least one groove being located in the buffer zone for extending a water-oxygen intrusion path along a first direction; manufacturing a metal layer at the bottom of the at least one groove, the metal layer for blocking a water-oxygen intrusion path in a second direction, the metal layer having a first thickness; manufacturing an organic functional layer on the substrate, the organic functional layer being interrupted at the at least one groove; and manufacturing an encapsulation layer on the organic functional layer. Here, the apertures at least penetrate the encapsulation layer and the organic functional layer.

[0016] According to the technical solution of the embodiments of this application, the groove in the buffer zone can block the intrusion of water and oxygen along the first direction, and the metal layer at the bottom of the groove can block the intrusion of water and oxygen along the second direction. While increasing the screen-to-body ratio by embedding devices (e.g., front-facing cameras or sensors) through screen holes, the synergistic effect of the groove and the metal layer simultaneously reduces and prevents the intrusion of water and oxygen in both directions, thereby preventing the organic functional layer of the encapsulation area from being eroded and failing due to water and oxygen, resulting in dark spots. Furthermore, the metal layers at the bottom of the groove are disconnected from each other, preventing them from being easily damaged during electrostatic discharge (ESD) testing, which could compromise their water and oxygen barrier performance. Moreover, the metal layer has a first thickness, which, in conjunction with the groove, better achieves the water and oxygen barrier effect without significantly increasing cost or overall thickness. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the drawings only show some embodiments of this application and should not be considered as a limitation of the scope. It should also be understood that the same or similar reference numerals are used in the drawings to represent the same or similar elements. Furthermore, it should be understood that the drawings are merely schematic, and the dimensions and scale of the elements in the drawings are not necessarily precise.

[0018] Figure 1 This is a schematic diagram of the hole area in a display panel in related technologies.

[0019] Figure 2 This is a schematic diagram of the structure of a display panel according to an embodiment of this application.

[0020] Figure 3 This is a schematic diagram of the structure of another display panel provided according to one embodiment of this application.

[0021] Figure 4This is a schematic diagram of the structure of another display panel provided according to an embodiment of this application.

[0022] Figure 5 This is a schematic diagram of the structure of a buffer provided according to an embodiment of this application.

[0023] Figure 6 This is a schematic diagram of the structure of another buffer provided according to one embodiment of this application.

[0024] Figure 7 This is a schematic diagram of the structure of yet another buffer provided according to an embodiment of this application.

[0025] Figure 8 This is a flowchart of a method for manufacturing a display panel according to an embodiment of this application.

[0026] Figure label: 100, Display panel; 10 / 10' substrate; 101, First substrate; 102, First buffer layer; 103, Second substrate; 104, Second buffer layer; 105, Barrier layer; 12 / 12', Organic functional layer; 13 / 13', Encapsulation layer; 131, First inorganic layer; 132, Organic layer; 133, Second inorganic layer; 14 / 14', Hole area; 141 / 141', Buffer zone; 142 / 142', Hole; 15 / 15', Groove; 151, Groove wall; 151a, First groove wall; 151b, Second groove wall; 152, Groove bottom; 16, Main display area; 17, Metal layer; 18, Dam; 19, Organic adhesive layer. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0028] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0030] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0031] For ease of description, a first direction A and a second direction B are defined herein and illustrated in the accompanying drawings. For example, the first direction A can be the length or width direction of the display panel, and is the direction indicated by the arrow; the second direction B can be the thickness direction of the display panel, and is the direction indicated by the arrow.

[0032] Increasing the screen-to-body ratio of display panels to improve visual effects and user experience is a continuous pursuit in the display device industry.

[0033] To increase the screen-to-body ratio of a display panel, a hole is usually cut into the panel to house a front-facing camera or sensors. This maximizes the screen-to-body ratio without compromising display quality.

[0034] However, drilling holes in the screen will cause the vapor-deposited layer (e.g., organic functional layer) on the screen interface to be directly exposed to the external environment, making it susceptible to corrosion by water and oxygen and thus failing, resulting in dark spots.

[0035] In related technologies, refer to Figure 1 The display panel may include a substrate 10', an organic functional layer 12' disposed on the substrate 10', and an encapsulation layer 13' disposed on the organic functional layer 12'. To avoid dark spots caused by hole drilling, multiple grooves 15' can be provided in the buffer zone 141' surrounding the hole 142' on the substrate 10', so that the organic functional layer 12' is interrupted at the grooves 15', thereby extending the time for water and oxygen to invade the encapsulation layer 13' from the hole area 14' (which may include the hole 142' and the buffer zone 141') of the display panel through the organic functional layer 12' along the first direction A, thereby mitigating water and oxygen erosion.

[0036] However, the inventors discovered that the substrate, such as a polyimide (PI) substrate, has limited water and oxygen barrier capabilities. Under high temperature and high humidity conditions, water and oxygen can easily invade from the bottom of the groove along the second direction B, causing the barrier function of the groove to fail. This results in the organic functional layer being eroded by water and oxygen and failing, forming dark spots.

[0037] To address the aforementioned technical problems, embodiments of this application provide a display panel, a method for manufacturing the same, and a display device.

[0038] The display panel of this application includes a substrate, an organic functional layer, and an encapsulation layer. The organic functional layer is disposed on the side of the substrate facing away from the substrate, and the encapsulation layer is disposed on the organic functional layer. The display panel has a hole area and a main display area. The hole area includes a hole disposed in the hole area and a buffer zone at least partially surrounding the hole, the hole penetrating at least through the encapsulation layer and the organic functional layer. The main display area at least partially surrounds the buffer zone, and the buffer zone isolates the hole and the main display area. At least one groove is disposed on the side of the substrate near the organic functional layer, the at least one groove being located in the buffer zone and at least partially surrounding the hole, for extending the water and oxygen intrusion path along a first direction. The organic functional layer is interrupted at at least one groove, and a metal layer is disposed at the bottom of the at least one groove, the organic functional layer located in the groove being disposed on the side of the metal layer facing away from the substrate. The metal layer is used to block the water and oxygen intrusion path in a second direction, and the metal layer has a first thickness. The first direction is the direction from the buffer zone to the hole, the second direction is the thickness direction of the display panel, and the first direction is perpendicular to the second direction.

[0039] In this way, the groove in the buffer zone can block the intrusion of water and oxygen along the first direction, and the metal layer at the bottom of the groove can block the intrusion of water and oxygen along the second direction. Therefore, while increasing the screen-to-body ratio by setting devices (e.g., front-facing cameras or sensors) through holes in the screen, the synergistic effect of the groove and the metal layer can simultaneously reduce and avoid the intrusion of water and oxygen in both directions, thereby preventing the organic functional layer of the encapsulation area from being eroded and failing due to water and oxygen, thus preventing the formation of dark spots.

[0040] Furthermore, the metal layers at the bottom of the grooves are disconnected from each other, preventing them from being easily damaged during electrostatic discharge (ESD) testing and thus compromising their water and oxygen barrier properties. Moreover, the metal layers have a primary thickness, which, in conjunction with the grooves, better achieves the water and oxygen barrier effect without significantly increasing cost or overall thickness.

[0041] Below, in conjunction with Figures 2 to 8 The present application provides an exemplary description of the display panel, its manufacturing method, and the display device provided in the embodiments of this application.

[0042] Exemplary display panel

[0043] refer to Figures 2 to 4In a first aspect, embodiments of this application provide a display panel 100. The display panel 100 may include a substrate 10, an organic functional layer 12, and an encapsulation layer 13. The organic functional layer 12 may be disposed on the substrate 10, and the encapsulation layer 13 may be disposed on the side of the organic functional layer 12 facing away from the substrate 10. The display panel 100 may have an aperture region 14 and a main display region 16. The aperture region 14 may include an aperture 142 disposed in the aperture region 14 and a buffer zone 141 at least partially surrounding the aperture 142. The aperture 142 may penetrate at least through the encapsulation layer 13 and the organic functional layer 12. The main display region 16 at least partially surrounds the buffer zone 141, and the buffer zone 141 isolates the aperture 142 and the main display region 16. At least one groove 15 is disposed on the side of the substrate 10 near the organic functional layer 12. The at least one groove 15 is located in the buffer zone 141 and at least partially surrounds the aperture 142, for extending the water and oxygen intrusion path along a first direction A. The organic functional layer 12 is interrupted at at least one recess 15, and a metal layer 17 is disposed at the bottom of at least one recess 15. The organic functional layer 12 located within the recess 15 is disposed on the side of the metal layer 17 facing away from the substrate 10. The metal layer 17 is used to block the water and oxygen intrusion path in the second direction B, and the metal layer 17 has a first thickness. The first direction A is the direction from the buffer zone 141 to the hole 142, the second direction B is the thickness direction of the display panel 100, and the first direction A is perpendicular to the second direction B.

[0044] For example, the organic functional layer 12 may include a hole injection layer, a hole transport layer, a light emission layer, an electron transport layer, and an electron injection layer, etc.

[0045] The hole injection layer can be made of organic small molecule materials, conductive polymers, inorganic materials, and composite materials.

[0046] Here, organic small molecule materials can include triarylamine compounds, such as N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-biphenyl-4,4'-diamine (TPD) and N,N'-diphenyl-N,N'-bis(1-naphthyl)-1,1'-biphenyl-4,4'-diamine (NPB), etc. These materials have high hole mobility and good thermal stability, which can effectively improve hole injection efficiency. Alternatively, organic small molecule materials can include spirofluorene compounds, such as spirodifluorene derivatives, whose molecular structures have good rigidity and stability, enabling the formation of high-quality thin films and contributing to improved device performance and lifetime. Or, organic small molecule materials can include compounds containing specific functional groups, such as compounds containing electron-withdrawing groups such as cyano, fluorine, and carbonyl groups. These functional groups can enhance the reduction potential of the material and improve hole injection efficiency.

[0047] Conductive polymers can be polythiophene and its derivatives, such as poly(3,4-ethylenedioxythiophene) (PEDOT). These materials have good conductivity and film-forming properties, and can be prepared into films by methods such as spin coating, making them suitable for the production of large-area display panels. Alternatively, conductive polymers can be polyaniline and its derivatives, which have high hole mobility and good environmental stability.

[0048] Inorganic materials can be oxides, such as molybdenum oxide (MoO3) and vanadium oxide (V2O5). These materials have high work functions, enabling them to form good energy level matching with anode materials (such as ITO) and promoting hole injection. In some examples, inorganic materials can be nitrides, such as titanium nitride (TiN), which has good electrical conductivity and chemical stability and can be used to prepare high-performance hole injection layers.

[0049] Composite materials can be doped composite materials, for example, by doping the aforementioned small organic molecules or conductive polymers with inorganic materials (such as metal oxides). For instance, doping triarylamine compounds with molybdenum oxide can combine the advantages of both, improving the performance of the hole injection layer. In some examples, composite materials can be multilayer structures, for example, by first depositing a thin insulating layer (such as SiO2, LiF, etc.) on the anode surface, and then fabricating the hole injection layer on top of it. This structure can optimize the interface energy levels, lower the energy barrier for hole injection, and improve the efficiency and stability of the device.

[0050] The electron transport layer can be an organic small molecule material, such as the triazole compound 2-(4-biphenyl)-5-(4-tert-butylphenyl)-1,3,4-oxadiazole (PBD), a classic electron transport material with high electron mobility and good thermal stability; 3-(4-biphenyl)-4-phenyl-5-(4-tert-butylphenyl)-1,2,4-triazole (TAZ), similar to PBD, but with higher thermal stability and better film-forming properties. Alternatively, the electron transport layer can be a polymer, such as polyfluorene polymers, like poly(9,9-dioctylfluorene-co-benzoxazine) (PFO-BZ), whose copolymer structure design improves the material's electron transport capability and thermal stability. Alternatively, the electron transport layer can be a metal complex, such as the aluminum complex tris(8-hydroxyquinoline)aluminum (Alq3), one of the most commonly used electron transport materials, possessing excellent electron transport capabilities and film-forming properties; or the platinum complex bis(2-phenylpyridine)platinum (Pt(ppy)2), which exhibits high electron mobility and good thermal stability. Still another option is to use inorganic materials, such as metal oxides like zinc oxide (ZnO) and titanium oxide (TiO2), or metal nitrides like gallium nitride (GaN).

[0051] It is understood that the above are merely examples, and the hole injection layer and electron transport layer are not limited to the materials mentioned above.

[0052] The materials of the remaining membrane layers of the organic functional layer 12 can be selected according to conventional settings in the art, and will not be described in detail here.

[0053] Exemplarily, the substrate 10 can be a rigid substrate 10, such as glass, which has high strength. In some examples, the substrate 10 can also be a flexible substrate 10, such as a polymer resin. The polymer resin may include polyacrylate, polycarbonate, polyphenylene sulfide, polyarylate, polyetherimide, polyimide (PI), polystyrene, polyethylene terephthalate, poly(p-xylene), polyethersulfone, cellulose acetate propionate, or polyethylene naphthalate, etc., which can be selected by those skilled in the art according to the needs of specific application scenarios, and this application does not impose any restrictions on this.

[0054] It is understood that the hole 142 can be a through hole or a blind hole. Preferably, the hole 142 is a through hole, that is, the hole 142 penetrates the substrate 10, the organic functional layer 12, and the encapsulation layer 13. When the hole 142 is a blind hole, the substrate 10 and the film layer located at the bottom of the blind hole need to have good light transmittance to ensure the light transmission effect.

[0055] It can also be understood that buffer 141 at least partially surrounds hole 142, meaning that buffer 141 partially surrounds hole 142 (e.g., Figure 2 and Figure 3 In the case where the hole 142 is close to or partially located at the edge of the display device, the display area partially surrounds the buffer zone 141; or, the buffer zone 141 surrounds the hole 142 (see reference). Figure 4 As shown), the display area surrounds buffer 141 accordingly.

[0056] In this document, the main display area 16 refers to the display area located outside the hole area 14. The hole area 14 may or may not have a display function, and this application does not impose any restrictions on this.

[0057] In this way, the groove 15 in the buffer zone 141 can block the intrusion of water and oxygen along the first direction A, and the metal layer 17 at the bottom of the groove 15 can block the intrusion of water and oxygen along the second direction B. This allows for increased screen-to-body ratio by embedding devices (e.g., front-facing cameras or sensors) through screen holes, while simultaneously mitigating and preventing the intrusion of water and oxygen in both directions through the synergistic effect of the groove 15 and the metal layer 17. This prevents the organic functional layer 12 in the encapsulation area from being eroded and failing due to water and oxygen, thus avoiding the formation of dark spots. Furthermore, the metal layers 17 at the bottom of the groove 15 are disconnected from each other, preventing them from being easily damaged during electrostatic discharge (ESD) testing and compromising their water and oxygen barrier performance. Moreover, the metal layer 17 has a first thickness, achieving a better water and oxygen barrier effect in conjunction with the groove 15 without significantly increasing cost or overall thickness.

[0058] The thickness of the metal layer 17 (i.e., the first thickness) can be from 20nm to 500nm, such as 30nm, 50nm, 80nm, 100nm, 150nm, 200nm, 250nm, 300nm, 350nm, 400nm, or 450nm. Controlling the thickness of the metal layer 17 within this range avoids situations where the thickness is too small, resulting in limited energy barrier against water and oxygen, or the thickness is too large, leading to excessive cost.

[0059] It is understood that those skilled in the art can choose the material of the metal layer 17 according to the needs of specific application scenarios, and this application does not impose any restrictions on this.

[0060] The metal layer 17 can be prepared by methods such as deposition or sputtering. Preferably, the metal layer 17 is formed by sputtering. This eliminates the need for a mask or etching, and allows for flexible selection of the formation location of the metal layer 17 as needed.

[0061] At least one recess 15 may be formed before the organic functional layer 12 and the encapsulation layer 13. Thus, the metal layer 17 can be formed simultaneously with one of the gate layer, source layer, drain layer, anode layer, or M3 electrode layer of the display panel 100; that is, the metal layer 17 is formed concurrently with the formation of the gate layer, source layer, drain layer, anode layer, or M3 electrode layer of the display panel 100. Excess metal layer 17 located at other locations in the via region 14 can be removed as needed by etching or other methods. Preferably, the metal layer 17 is formed simultaneously with the anode layer of the display panel 100.

[0062] In one example, at least one metal layer 17 at the bottom of the groove 15 is disconnected from each other to avoid being easily damaged during electrostatic discharge (ESD) testing, which would compromise the water-blocking and oxygen-resistant properties.

[0063] In one example, the metal layer 17 may extend from the bottom (bottom 152) of the groove 15 towards the groove wall 151 of the groove 15 by a first height. The groove wall 151 may include a first groove wall 151a and a second groove wall 151b. The metal layer 17 may extend the first height only along the second groove wall 151b (the groove wall 151 on the side closer to the hole 142), or it may extend the first height along both the first groove wall 151a and the second groove wall 151b simultaneously. Of course, the extension height of the metal layer 17 on the first groove wall 151a and the second groove wall 151b may also be different; for example, the extension height on the second groove wall 151b may be greater than the extension height on the first groove wall 151a.

[0064] In this way, the metal layer 17 on the tank wall 151 can better block the intrusion of water and oxygen in the first direction A.

[0065] Preferably, the first height is h, and the depth of the groove 15 is d, where h and d satisfy: 0.05 ≤ h / d ≤ 0.2 (e.g., 0.06, 0.7, 0.08, 0.1, 0.12, 0.15, 0.17, or 0.19). This avoids h being too high, causing the metal layer 17 to connect with other membrane layers, such as the metal layer 17 in the organic functional layer 12, resulting in damage to the interconnected metal layers 17 during ESD testing, and also saves costs. Alternatively, if h is too low, the ability to block water and oxygen is limited.

[0066] refer to Figure 6 The projection of the top of the groove 15 onto the substrate 10 is smaller than the projection of the bottom of the groove 15 onto the substrate 10, which facilitates the isolation of the organic functional layer 12 at the groove 15. Preferably, the groove 15 is an inverted trapezoidal groove 15, which can block the intrusion of water and oxygen in the first direction A to a greater extent.

[0067] It should be noted that those skilled in the art can set the depth, width and distance between grooves 15 according to the needs of specific application scenarios, and this application does not impose any restrictions on this.

[0068] It is understood that the groove wall 151 of the groove 15 can also be set to other shapes, such as arc or wave. Those skilled in the art can set it according to the needs of specific application scenarios, and this application does not limit it.

[0069] refer to Figure 7 In one embodiment, a dam 18 may be provided on the side of the buffer 141 near the main display area 16, and the dam 18 is disposed between the organic functional layer 12 and the substrate 10.

[0070] For example, dam 18 may include multiple membrane layers. It is understood that dam 18 may also be a single layer, and those skilled in the art can set it according to the needs of specific application scenarios, and this application does not impose any restrictions on this.

[0071] The material, thickness, and forming method of Dam 18 are standard features in this field and will not be described in detail here.

[0072] In this way, dam 18 can improve the barrier capacity against water and oxygen along the first direction A.

[0073] Continue to refer to Figures 5 to 7 At least one recess 15 may include a plurality of recesses 15 spaced apart from each other, each recess 15 being disposed at least partially surrounding the hole 142, and a dam 18 may be located between two recesses 15 adjacent to the main display area 16 in the plurality of recesses 15.

[0074] Continue to refer to Figure 7 The substrate 10 may include a first substrate 101, a first buffer layer 102, a second substrate 103, a second buffer layer 104, and a barrier layer 105. The first substrate 101, the first buffer layer 102, the second substrate 103, the second buffer layer 104, and the barrier layer 105 are stacked sequentially along the direction from the first substrate 101 toward the barrier layer 105.

[0075] The encapsulation layer 13 may include a first inorganic layer 131, an organic layer 132, and a second inorganic layer 133, which are sequentially stacked along the direction from the first inorganic layer 131 toward the second inorganic layer 133. The organic layer 132 can firmly bond the first inorganic layer 131 and the second inorganic layer 133 together, effectively preventing water and oxygen intrusion. In addition, the organic layer 132 also has the function of buffering impact stress and mechanical stress generated during external bending.

[0076] Preferably, the first inorganic layer 131 and the second inorganic layer 133 extend to cover the dam 18 and extend to the edge of the hole.

[0077] For example, the first buffer layer 102 and the second buffer layer 104 can be made of silicon oxide, silicon nitride, or composite films thereof. The buffer layers can prevent impurities in the substrate from diffusing to other film layers. In addition, the buffer layer 104 can also buffer and reduce interlayer stress, provide mechanical support, and improve the stability of the structure.

[0078] For example, the material of the barrier layer 105 may include one or more of silicon oxide (SiO2), aluminum oxide (Al2O3), aluminum nitride (AlN), and silicon nitride (Si3N4). Those skilled in the art can choose the appropriate material according to the specific application requirements, and this application does not impose any limitations on this. The barrier layer 105 can prevent water and oxygen from penetrating into the organic functional layer 12. Simultaneously, the barrier layer 105 can provide a certain mechanical strength to ensure the structural stability of the substrate 10 under stress and prevent impurity diffusion.

[0079] The barrier layer 105 can be prepared by methods such as chemical vapor deposition (CVD) and physical vapor deposition (PVD). Those skilled in the art can choose the preparation process according to the needs of specific application scenarios, and this application does not impose any restrictions on it.

[0080] Next, refer to Figure 7 The display panel 100 may also include an organic adhesive layer 19, which is disposed on the encapsulation layer 13 for bonding with other structures of the display panel 100 and can also serve to buffer impacts and stress.

[0081] Below, in conjunction with Figures 2 to 7 The present application will now describe in detail a display panel 100 provided in an exemplary embodiment.

[0082] refer to Figures 2 to 7 The display panel 100 includes a substrate 10, an organic functional layer 12, and an encapsulation layer 13. The organic functional layer 12 is disposed on the substrate 10, and the encapsulation layer 13 is disposed on the side of the organic functional layer 12 facing away from the substrate 10. The display panel 100 has an aperture region 14 and a main display region 16. The aperture region 14 includes an aperture 142 disposed in the aperture region 14 and a buffer zone 141 at least partially surrounding the aperture 142 (e.g., the buffer zone 141 surrounds the aperture 142). The aperture 142 penetrates at least through the encapsulation layer 13 and the organic functional layer 12 (e.g., the aperture 142 penetrates through the encapsulation layer 13, the organic functional layer 12, and the substrate 10). The main display region 16 at least partially surrounds the buffer zone 141 (e.g., the main display region 16 surrounds the buffer zone 141), and the buffer zone 141 isolates the aperture 142 and the main display region 16. A plurality of grooves 15 are provided on the substrate 10 near the organic functional layer 12. The grooves 15 are located in the buffer zone 141 and spaced apart from each other. Each groove 15 is at least partially surrounding the hole 142 (e.g., the groove 15 surrounds the hole 142) to extend the water and oxygen intrusion path along the first direction A. The organic functional layer 12 is interrupted at the grooves 15. A metal layer 17 is provided at the bottom of the grooves 15. The organic functional layer 12 located in the grooves 15 is located on the side of the metal layer 17 facing away from the substrate 10. The metal layer 17 is used to block the water and oxygen intrusion path in the second direction B. The metal layer 17 has a first thickness. The first direction A is the direction from the buffer zone 141 to the hole 142, and the second direction B is the thickness direction of the display panel 100. The first direction A is perpendicular to the second direction B.

[0083] In use, the groove 15 in the buffer zone 141 can block the intrusion of water and oxygen along the first direction A, and the metal layer 17 at the bottom of the groove 15 can block the intrusion of water and oxygen along the second direction B. Thus, while increasing the screen-to-body ratio by placing devices (e.g., front-facing cameras or sensors) through holes in the screen, the synergistic effect of the groove 15 and the metal layer 17 simultaneously reduces and prevents the intrusion of water and oxygen in both directions, thereby preventing the organic functional layer 12 in the encapsulation area from being eroded and failing due to water and oxygen, resulting in dark spots. Furthermore, the metal layers 17 at the bottom of the groove 15 are disconnected from each other, preventing them from being easily damaged during electrostatic discharge (ESD) testing, which could compromise their water and oxygen barrier performance. Moreover, the metal layer 17 has a first thickness, which, in conjunction with the groove 17, better achieves the water and oxygen barrier effect without significantly increasing cost or overall thickness.

[0084] The display panel 100 also includes an organic adhesive layer 19 disposed above the encapsulation layer 13.

[0085] Multiple recesses 15 are formed before the organic functional layer 12 and the encapsulation layer 13, and the recesses 15 are inverted trapezoidal recesses 15. The metal layer 17 and the anode layer of the display panel 100 are formed simultaneously by sputtering. The thickness of the metal layer 17 is 20nm to 500nm.

[0086] The metal layers 17 at the bottom of the multiple grooves 15 are disconnected from each other.

[0087] The metal layer 17 extends from the bottom of the groove 15 to the groove wall 151 of the groove 15 by a first height h. The depth of the groove 15 is d, and h and d satisfy: 0.05≤h / d≤0.2.

[0088] A dam 18 is provided on the side of the buffer zone 141 near the main display area 16. The dam 18 is disposed between the organic functional layer 12 and the substrate 10 and is located between two recesses 15 adjacent to the main display area 16 in a plurality of recesses 15. The dam 18 comprises a plurality of film layers.

[0089] The substrate 10 includes a first substrate 101, a first buffer layer 102, a second substrate 103, a second buffer layer 104, and a barrier layer 105, which are sequentially stacked along the direction from the first substrate 101 toward the barrier layer 105. The encapsulation layer 13 includes a first inorganic layer 131, an organic layer 132, and a second inorganic layer 133. These layers are sequentially stacked along the direction from the first inorganic layer 131 toward the second inorganic layer 133. The first inorganic layer 131 and the second inorganic layer 133 extend to cover the dam 18 and extend to the edge of the hole 142.

[0090] The display panel 100 provided in this application embodiment can be applied to mobile phones or any electronic product with display function. Such electronic products include, but are not limited to, televisions, laptops, desktop monitors, tablets, digital cameras, smart bracelets, smart glasses, automotive displays, medical devices, industrial control equipment, and touch interactive terminals, etc., and this application embodiment does not impose any special limitations on them.

[0091] Exemplary display device

[0092] Secondly, embodiments of this application provide a display device, which includes the display panel 100 described above.

[0093] The display device correspondingly possesses the same technical effects as the display panel 100, which will not be elaborated here.

[0094] Exemplary method for manufacturing a display panel

[0095] Thirdly, embodiments of this application provide a method for manufacturing a display panel 100, the display panel 100 having an aperture region 14 and a main display region 16. The aperture region 14 includes an aperture 142 disposed in the aperture region 14 and a buffer zone 141 at least partially surrounding the aperture. The main display region 16 at least partially surrounds the buffer zone 141, and the buffer zone 141 isolates the aperture 142 and the main display region 16. (See reference...) Figure 8 The preparation method includes:

[0096] S101: A substrate 10 is provided, and a hole 142 is provided on the substrate 10.

[0097] S102: At least one groove 15 is prepared on the substrate 10, the at least one groove 15 being located in the buffer zone 141 for extending the water and oxygen intrusion path along the first direction A.

[0098] S103: A metal layer 17 is prepared on the bottom 152 of at least one groove 15, the metal layer 17 being used to block the water and oxygen intrusion path in the second direction B, the metal layer 17 having a first thickness.

[0099] S104: An organic functional layer 12 is prepared on the substrate 10, the organic functional layer 12 being broken at at least one groove 15.

[0100] S105: Prepare an encapsulation layer 13 on the organic functional layer 12.

[0101] Here, the hole 142 penetrates at least through the encapsulation layer 13 and the organic functional layer 12. It is understood that the hole 142 can also be removed by processing methods, such as cutting or etching, after the metal layer 17, the organic functional layer 12 and the encapsulation layer 13 are fabricated.

[0102] The structural description of organic functional layer 12 can be found above and will not be repeated here.

[0103] It should be noted that the preparation methods of the encapsulation layer 13 and the organic functional layer 12 can refer to the conventional settings in the art, and will not be described in detail here.

[0104] It should be noted that, for clarity, the complete structure of the display panel 100 and display device described above is not described. To achieve their necessary functions, those skilled in the art can configure other structures according to specific application scenarios, and the embodiments of this application do not impose such limitations. Similarly, for clarity, the complete manufacturing process and technology of the display panel 100 are not described. To realize the manufacturing of the display panel 100, those skilled in the art can select manufacturing processes and technologies according to specific application scenarios, and the embodiments of this application do not impose such limitations.

[0105] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0106] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, a connection can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows communication between the components; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0107] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0108] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications or equivalent substitutions made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized in that, include: substrate; An organic functional layer is disposed on the substrate; An encapsulation layer is disposed on the side of the organic functional layer opposite to the substrate; in The display panel has a hole area and a main display area. The hole area includes a hole disposed in the hole area and a buffer zone at least partially surrounding the hole. The hole penetrates at least the encapsulation layer and the organic functional layer. The main display area at least partially surrounds the buffer zone. The buffer zone isolates the hole and the main display area. At least one groove is disposed on the side of the substrate near the organic functional layer. The at least one groove is located in the buffer zone and at least partially surrounds the hole, for extending the water and oxygen intrusion path along a first direction. The organic functional layer is interrupted at the at least one groove. A metal layer is disposed at the bottom of the at least one groove. The organic functional layer located in the groove is disposed on the side of the metal layer opposite to the substrate. The metal layer is used to block the water and oxygen intrusion path in a second direction, and the metal layer has a first thickness. in The first direction is the direction from the buffer to the hole, the second direction is the thickness direction of the display panel, and the first direction is perpendicular to the second direction.

2. The display panel according to claim 1, characterized in that, The first thickness ranges from 20 nm to 500 nm; and / or The at least one groove is formed before the organic functional layer and the encapsulation layer. The metal layer is formed simultaneously with one of the gate layer, source layer, drain layer, anode layer or M3 electrode layer of the display panel. Preferably, the metal layer is formed simultaneously with the anode layer of the display panel.

3. The display panel according to claim 1, characterized in that, The metal layers at the bottom of at least one groove are disconnected from each other; and / or, The metal layer extends from the bottom of the groove to the groove wall at a first height h, preferably. The depth of the groove is d, and h and d satisfy: 0.05≤h / d≤0.

2.

4. The display panel according to claim 1, characterized in that, The projection of the top of the groove onto the substrate is smaller than the projection of the bottom of the groove onto the substrate; preferably, the groove is an inverted trapezoidal groove.

5. The display panel according to claim 1, characterized in that, The metal layer is formed by sputtering; and / or The hole penetrates the substrate, the organic functional layer, and the encapsulation layer.

6. The display panel according to any one of claims 1 to 5, characterized in that, A dam is provided on the side of the buffer zone near the main display area, and the dam is disposed between the organic functional layer and the substrate; preferably, The at least one groove includes a plurality of grooves spaced apart from each other, each groove being disposed at least partially around the hole, and the dam being located between two grooves adjacent to the main display area in the plurality of grooves.

7. The display panel according to claim 6, characterized in that, The dam comprises multiple membrane layers.

8. The display panel according to claim 6, characterized in that, The substrate includes: A first substrate, a first buffer layer, a second substrate, a second buffer layer, and a barrier layer, wherein the first substrate, the first buffer layer, the second substrate, the second buffer layer, and the barrier layer are sequentially stacked along the direction from the first substrate toward the barrier layer; and / or The encapsulation layer includes a first inorganic layer, an organic layer, and a second inorganic layer. The first inorganic layer, the organic layer, and the second inorganic layer are stacked sequentially along the direction from the first inorganic layer toward the second inorganic layer. Preferably, the first inorganic layer and the second inorganic layer extend to cover the dam and extend to the edge of the hole.

9. A display device, characterized in that, Includes a display panel according to any one of claims 1 to 8.

10. A method for manufacturing a display panel, characterized in that, The display panel has a hole area and a main display area. The hole area includes a hole disposed therein and a buffer zone at least partially surrounding the hole. The main display area at least partially surrounds the buffer zone, and the buffer zone isolates the hole and the main display area. The fabrication method includes: A substrate is provided, wherein the hole is provided on the substrate; At least one groove is formed on the substrate, the at least one groove being located in the buffer zone, for extending the water and oxygen intrusion path along the first direction; A metal layer is prepared at the bottom of the at least one groove, the metal layer being used to block water and oxygen intrusion paths in the second direction, the metal layer having a first thickness; An organic functional layer is fabricated on the substrate, the organic functional layer being interrupted at at least one groove; and An encapsulation layer is fabricated on the organic functional layer; wherein, The hole penetrates at least through the encapsulation layer and the organic functional layer.

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