Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device, and solves the problem of poor protection effect of the exposed sidewall of the wire in the prior art. The display panel comprises a substrate, a first conductive layer, a planar layer, a flat part, a first electrode layer, a protection part, a pixel definition layer, a plurality of light emitting functional parts and a second electrode layer. The first conductive layer is located on one side of the substrate, the first conductive layer comprises a wire, at least part of the exposed sidewall of the wire has a groove, the planar layer is located on the side of the first conductive layer away from the substrate, and the flat part fills the groove of the exposed sidewall of the wire. The first electrode layer is located on the side of the planar layer away from the substrate and comprises a plurality of first electrodes, the protection part covers the flat part, the pixel definition layer is located on the side of the first electrode layer away from the substrate, the pixel definition layer encloses a plurality of pixel openings, the pixel openings expose at least part of the first electrodes, the light emitting functional parts are located in the pixel openings, and the second electrode layer is located on the side of the light emitting functional parts away from the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diode (OLED) and flat panel display devices based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body and wide range of applications, becoming the mainstream of display devices.

[0003] However, the exposed sidewalls of wires in existing display devices are poorly protected. Summary of the Invention

[0004] In view of this, the present application provides a display panel, a method for manufacturing the same, and a display device, which solves the problem of poor protection of the exposed sidewalls of the wires in the prior art.

[0005] This application provides a display panel including a display area and an ear area. The display panel includes a substrate, a first conductive layer, a planarization layer, a planarization portion, a first electrode layer, a protective portion, a pixel definition layer, a plurality of light-emitting functional portions, and a second electrode layer. The first conductive layer is located on one side of the substrate and includes conductive wires located in the ear area. At least a portion of the exposed sidewalls of the conductive wires has grooves. The planarization layer is located on the side of the first conductive layer away from the substrate and is located in the display area. The planarization portion is co-layered with the planarization layer and made of the same material. The planarization portion fills the grooves in the exposed sidewalls of the conductive wires, and the planarization portion is disconnected from the planarization layer. The first electrode layer is located on the side of the planarization layer away from the substrate and includes a plurality of first electrodes. The protective portion is co-layered with the first electrode layer and made of the same material, and covers the planarization portion. The pixel definition layer is located on the side of the first electrode layer away from the substrate and encloses a plurality of pixel openings. The pixel openings expose at least a portion of the first electrodes. The light-emitting functional portions are located within the pixel openings. The second electrode layer is located on the side of the light-emitting functional portions away from the substrate.

[0006] In one embodiment, the surface of the flat portion away from the exposed sidewall of the conductor is an arcuate surface; preferably, the flat portion is in contact with the substrate.

[0007] In one embodiment, in a cross section perpendicular to the substrate, the angle between the tangent of the arcuate surface and the substrate is less than or equal to 45°; preferably, the angle is greater than or equal to 20° and less than or equal to 30°.

[0008] In one embodiment, the flat portion contacts the substrate.

[0009] In one embodiment, the protective portion is in contact with the substrate.

[0010] In one embodiment, the protective part and the first electrode are disconnected.

[0011] In one embodiment, the first conductive layer includes a first sublayer, a second sublayer, and a third sublayer stacked sequentially, wherein the orthographic projection of the second sublayer onto the substrate is within the orthographic projection range of the first sublayer onto the substrate, and the orthographic projection of the second sublayer onto the substrate is within the orthographic projection range of the third sublayer onto the substrate; preferably, the materials of the first and third sublayers include titanium, and the material of the second sublayer includes aluminum.

[0012] A second aspect of this application provides a method for fabricating a display panel, the display panel including a display area and an ear area located on one side of the display area; the fabrication method includes: fabricating a first conductive layer on a substrate, the first conductive layer including conductive wires, the conductive wires being located in the ear area, and at least a portion of the sidewalls of the conductive wires having grooves; fabricating a planar material layer on the side of the first conductive layer away from the substrate; patterning the planar material layer to obtain a planar layer and a planar portion, the planar layer being located on the side of the first conductive layer away from the substrate and located in the display area, the planar portion filling the grooves, and the planar portion and the planar layer being disconnected; fabricating a conductive material layer on the side of the planar layer away from the substrate; patterning the conductive material layer to obtain a first electrode layer and a protective portion, the first electrode layer being located on the side of the planar layer away from the substrate, the first electrode layer including a plurality of first electrodes, and the protective portion covering the planar portion; and sequentially fabricating a pixel definition layer, a light-emitting functional portion, and a second electrode layer on the side of the first electrode layer away from the substrate.

[0013] In one embodiment, patterning a planar material layer to obtain a planar layer and a planar portion includes: preparing a photoresist material layer on the planar material layer; exposing the photoresist material layer using a grayscale mask; developing the photoresist material layer to obtain a planar layer and a planar portion; preferably, before exposing the photoresist material layer using a grayscale mask, the preparation method further includes: removing the planar portion using an oxygen etching process.

[0014] A third aspect of this application provides a display device, including the display panel described above, or the display panel obtained by the preparation method described above.

[0015] According to the embodiments of this application, the display panel, its fabrication method, and the display device include a display area and an ear area. The display panel includes a substrate, a first conductive layer, a planarization layer, a planarization portion, a first electrode layer, a protective portion, a pixel definition layer, a plurality of light-emitting functional portions, and a second electrode layer. The first conductive layer is located on one side of the substrate and includes conductive wires. The conductive wires are located in the ear area, and at least a portion of the exposed sidewalls of the conductive wires have grooves. The planarization layer is located on the side of the first conductive layer away from the substrate and is located in the display area. The planarization portion is on the same layer as the planarization layer and made of the same material. The planarization portion fills the grooves of the exposed sidewalls of the conductive wires, and the planarization portion and the planarization layer are disconnected. The first electrode layer is located on the side of the planarization layer away from the substrate and includes a plurality of first electrodes. The protective portion is on the same layer as the first electrode layer and made of the same material. The protective portion covers the planarization portion. The pixel definition layer is located on the side of the first electrode layer away from the substrate and encloses a plurality of pixel openings. The pixel openings expose at least a portion of the first electrodes. The light-emitting functional portions are located within the pixel openings. The second electrode layer is located on the side of the light-emitting functional portions away from the substrate. The above embodiments, by covering the exposed sidewalls of the conductors in the ear area with a protective portion, can protect the exposed sidewalls of the conductors and prevent the acid etching and development processes during subsequent fabrication from affecting them. Furthermore, by providing a flat portion between the conductor and the protective portion, i.e., within the groove of the exposed sidewall of the conductor, the protective portion can be prevented from breaking at the sidewall, improving its protective effect. Furthermore, the flat portion and the flattening layer are of the same layer and material, and the protective portion and the first electrode layer are of the same layer and material, simplifying the display panel fabrication process and saving fabrication time and materials. Attached Figure Description

[0016] Figure 1 This is a top view of the display panel provided in the first embodiment of this application.

[0017] Figure 2 yes Figure 1 The diagram shows a partial cross-sectional structure of the display panel.

[0018] Figure 3 yes Figure 2 The diagram shows a partially enlarged cross-sectional view of the display panel.

[0019] Figure 4 yes Figure 3 The diagram shows a partially enlarged cross-sectional view of the display panel.

[0020] Figure 5 yes Figure 1 The diagram shows a cross-sectional view of the light-emitting device in the display panel.

[0021] Figure 6 This is a cross-sectional structural diagram of the display panel provided in the second embodiment of this application.

[0022] Figure 7 This is a schematic flowchart of the method for manufacturing a display panel provided in an embodiment of this application.

[0023] Figure 8 This is a schematic diagram of the cross-sectional structure of the display module provided in the embodiment of this application.

[0024] Figure 9 This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Detailed Implementation

[0025] Organic light-emitting diode (OLED) displays and flat panel displays based on light-emitting diode (LED) technologies are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide application range, becoming the mainstream display devices. However, the protection of exposed sidewalls of wires in existing display devices is relatively poor.

[0026] In view of the above, the display panel, its manufacturing method, and display device provided in the embodiments of this application include a display area and an ear area. The display panel includes a substrate, a first conductive layer, a planarization layer, a planarization portion, a first electrode layer, a protective portion, a pixel definition layer, a plurality of light-emitting functional portions, and a second electrode layer. The first conductive layer is located on one side of the substrate and includes conductive wires. The conductive wires are located in the ear area, and at least a portion of the exposed sidewalls of the conductive wires have grooves. The planarization layer is located on the side of the first conductive layer away from the substrate and is located in the display area. The planarization portion is on the same layer as the planarization layer and is made of the same material. The planarization portion fills the grooves of the exposed sidewalls of the conductive wires, and the planarization portion and the planarization layer are disconnected. The first electrode layer is located on the side of the planarization layer away from the substrate and includes a plurality of first electrodes. The protective portion is on the same layer as the first electrode layer and is made of the same material. The protective portion covers the planarization portion. The pixel definition layer is located on the side of the first electrode layer away from the substrate and encloses a plurality of pixel openings. The pixel openings expose at least a portion of the first electrodes. The light-emitting functional portions are located within the pixel openings. The second electrode layer is located on the side of the light-emitting functional portions away from the substrate. The above embodiments, by covering the exposed sidewalls of the conductors in the ear area with a protective portion, can protect the exposed sidewalls of the conductors and prevent the acid etching and development processes during subsequent fabrication from affecting them. Furthermore, by providing a flat portion between the conductor and the protective portion, i.e., within the groove of the exposed sidewall of the conductor, the protective portion can be prevented from breaking at the sidewall, improving its protective effect. Furthermore, the flat portion and the flattening layer are of the same layer and material, and the protective portion and the first electrode layer are of the same layer and material, simplifying the display panel fabrication process and saving fabrication time and materials.

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0029] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0030] In this specification, "electrical connection" includes the situation where components are connected together by elements that have a certain electrical function. There are no particular limitations on what constitutes an "electrical function," as long as it allows for the transmission and reception of electrical signals between the connected components. Examples of "electrical functions" include not only electrodes and wiring, but also switching elements such as transistors, resistors, inductors, capacitors, and other elements with various functions.

[0031] In this specification, the term "same-layer arrangement" refers to a structure formed by two (or more) structures through the same patterning process, and their materials may be the same or different.

[0032] Figure 1 This is a top view of the display panel provided in the first embodiment of this application. Figure 2 yes Figure 1 The diagram shows a cross-sectional structure of the display panel. Figure 1 and Figure 2As shown, the display panel 100 includes a display area 101 and an ear area 102. The display panel 100 includes a substrate 10, a first conductive layer 20, a planarization layer 30, a planarization portion 40, a first electrode layer, a protective portion 60, a pixel definition layer 70, a plurality of light-emitting functional portions 52, and a second electrode layer 53. The first conductive layer 20 is located on one side of the substrate 10 and includes a conductive wire 21. The conductive wire 21 is located in the ear area 102. At least a portion of the exposed sidewall of the conductive wire 21 has a groove 211. The planarization layer 30 is located on the side of the first conductive layer 20 away from the substrate 10 and is located in the display area 101. The planarization portion 40 is on the same layer as the planarization layer 30 and is made of the same material. The planarization portion 40 fills the groove 211 of the exposed sidewall of the conductive wire 21. The planarization portion 40 and the planarization layer 30 are disconnected. The first electrode layer is located on the side of the planarization layer 30 away from the substrate 10. The first electrode layer includes a plurality of first electrodes 51. The protective portion 60 is on the same layer as the first electrode layer and made of the same material. The protective portion 60 covers the planarization portion 40. The pixel definition layer 70 is located on the side of the first electrode layer away from the substrate 10. The pixel definition layer 70 encloses a plurality of pixel openings Q. The pixel openings Q expose at least a portion of the first electrodes 51. The light-emitting functional portion 52 is located within the pixel openings Q. The second electrode layer 53 is located on the side of the light-emitting functional portion 52 away from the substrate 10.

[0033] The display panel provided in this application embodiment includes a display area and an ear area. The display panel includes a substrate, a first conductive layer, a planarization layer, a planarization portion, a first electrode layer, a protective portion, a pixel definition layer, a plurality of light-emitting functional portions, and a second electrode layer. The first conductive layer is located on one side of the substrate and includes conductive wires. The conductive wires are located in the ear area, and at least a portion of the exposed sidewalls of the conductive wires have grooves. The planarization layer is located on the side of the first conductive layer away from the substrate and is located in the display area. The planarization portion is on the same layer as the planarization layer and is made of the same material. The planarization portion fills the grooves on the exposed sidewalls of the conductive wires, and the planarization portion and the planarization layer are disconnected. The first electrode layer is located on the side of the planarization layer away from the substrate and includes a plurality of first electrodes. The protective portion is on the same layer as the first electrode layer and is made of the same material. The protective portion covers the planarization portion. The pixel definition layer is located on the side of the first electrode layer away from the substrate and encloses a plurality of pixel openings. The pixel openings expose at least a portion of the first electrodes. The light-emitting functional portions are located within the pixel openings. The second electrode layer is located on the side of the light-emitting functional portions away from the substrate. The above embodiments, by covering the exposed sidewalls of the conductors in the ear area with a protective portion, can protect the exposed sidewalls of the conductors and prevent the acid etching and development processes during subsequent fabrication from affecting them. Furthermore, by providing a flat portion between the conductor and the protective portion, i.e., within the groove of the exposed sidewall of the conductor, the protective portion can be prevented from breaking at the sidewall, improving its protective effect. Furthermore, the flat portion and the flattening layer are of the same layer and material, and the protective portion and the first electrode layer are of the same layer and material, simplifying the display panel fabrication process and saving fabrication time and materials.

[0034] It should be understood that the ear area refers to the switching area between the positive power supply (ELVDD) and the ground wire (VSS) in the display panel 100, which is usually located in the bezel area of ​​the display panel 100.

[0035] Optionally, in one embodiment, the substrate 10 can be a substrate, which may include, but is not limited to, any one of conductive silicon (Si) substrates, silicon oxide (SiOx) substrates, aluminum oxide (Al2O3) substrates (i.e., sapphire substrates), silicon carbide (SiC) substrates, and gallium nitride (GaN) substrates. Furthermore, the substrate can also be a flexible substrate, for example, a flexible substrate made of polyimide (PI).

[0036] Optionally, in one embodiment, a support layer, a gate insulating layer, an interlayer insulating layer, etc. may be included between the substrate 10 and the first conductive layer 20. The support layer can provide mechanical support, thermal stability, or electrical isolation, and the gate insulating layer and the interlayer insulating layer can play an isolation role between the metal layers.

[0037] Optionally, in one embodiment, a thin-film transistor may be included between the substrate 10 and the first conductive layer 20, the thin-film transistor being able to control the switching state of the pixel unit via a pad switch.

[0038] Figure 3 yes Figure 2 The diagram shows a partially enlarged cross-sectional view of the display panel. Figure 3 As shown, in one embodiment, the first conductive layer 20 includes a first sublayer 201, a second sublayer 202 and a third sublayer 203 stacked sequentially. The orthographic projection of the second sublayer 202 on the substrate 10 is within the orthographic projection range of the first sublayer 201 on the substrate 10, and the orthographic projection of the second sublayer 202 on the substrate 10 is within the orthographic projection range of the third sublayer 203 on the substrate 10.

[0039] Optionally, in one embodiment, the materials of the first sublayer 201 and the third sublayer 203 include titanium.

[0040] Optionally, in one embodiment, the material of the second sublayer 202 includes aluminum.

[0041] Optionally, in one embodiment, the material of the planarization layer 30 may include organic materials, such as polyimide, acrylic resin, epoxy resin, etc. The planarization layer 30 has a good planarization effect and can fill the uneven parts of the film surface of the display panel 100, thereby improving the display effect of the display panel 100.

[0042] Optionally, in one embodiment, the material of the flat portion 40 may include organic materials, such as polyimide, acrylic resin, epoxy resin, etc.

[0043] Figure 4 yes Figure 3 The diagram shows a partially enlarged cross-sectional view of the display panel. Figure 4 As shown, in one embodiment, the surface of the flat portion 40 facing away from the exposed sidewall of the conductor 21 is an arc-shaped surface.

[0044] Optionally, in one embodiment, on a cross section perpendicular to the substrate 10, the angle α between the tangent L of the arcuate surface and the substrate 10 is less than or equal to 45°. For example, the angle α between the tangent L of the arcuate surface and the substrate 10 can be 1 degree, 10 degrees, 15 degrees, 25 degrees, 35 degrees, 40 degrees, 45 degrees, etc.

[0045] Preferably, in one embodiment, on a cross section perpendicular to the substrate 10, the angle α between the tangent L of the arcuate surface and the substrate 10 is greater than or equal to 20° and less than or equal to 30°. For example, the angle α between the tangent L of the arcuate surface and the substrate 10 can be 20 degrees, 22 degrees, 24 degrees, 25 degrees, 26 degrees, 28 degrees, 30 degrees, etc.

[0046] Optionally, in one embodiment, the flat portion 40 contacts the substrate 10.

[0047] Optionally, in one embodiment, the display panel 100 further includes a light-emitting device 50, which may be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 50 may be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, a white light-emitting device W, etc.

[0048] Figure 5 yes Figure 1 The diagram shows a cross-sectional view of the light-emitting device in the display panel. Figure 5As shown, in one embodiment, the light-emitting device 50 includes a first electrode 51 and a second electrode layer 53 stacked together, and at least one light-emitting functional part 52 located between the first electrode 51 and the second electrode layer 53. The second electrode layer 53 is located on the side of the first electrode layer and the pixel definition layer 70 facing away from the substrate 10. The first electrode layer may be an anode, and the second electrode layer 53 may be a cathode. The at least one light-emitting functional part 52 includes a light-emitting layer 521, and may further include at least one of a hole injection layer 522, a hole transport layer 523, and an electron blocking layer 524 located between the first electrode 51 and the light-emitting layer 521, and at least one of an electron injection layer 524, an electron transport layer 526, and a hole blocking layer 527 located between the second electrode layer 53 and the light-emitting layer 521.

[0049] Please refer to it again. Figure 3 Optionally, in one embodiment, the protective portion 60 contacts the substrate 10.

[0050] Optionally, in one embodiment, the protection part 60 and the first electrode 51 are disconnected.

[0051] Optionally, in one embodiment, the surface of the protective part 60 facing away from the exposed sidewall of the conductor 21 is an arc-shaped surface.

[0052] Optionally, in one embodiment, the pixel definition layer 70 can be a light-transmitting material to allow light from the light-emitting device 50 to pass through the pixel definition layer 70 more effectively. Optionally, the pixel definition layer 70 can be an opaque material, which can improve the light absorption of the pixel definition layer 70, reduce the reflectivity of the display panel, further reduce optical crosstalk between adjacent light-emitting devices 50, and improve the display effect of the display panel 100.

[0053] Optionally, in one embodiment, the pixel definition layer 70 is made of an inorganic material.

[0054] Figure 6 This is a schematic cross-sectional view of the display panel provided in the second embodiment of this application. (See attached diagram.) Figure 6 As shown, in one embodiment, the display panel 100 further includes a thin film encapsulation layer 80. The thin film encapsulation layer 80 is located on the side of the second electrode layer 53 away from the substrate 10. The thin film encapsulation layer 80 is used to encapsulate the light-emitting device 50, which can isolate water and oxygen, reduce the probability of failure of the light-emitting device 50 and the underlying layer structure due to impurities such as water and oxygen entering the light-emitting device 50, and ensure that the manufacturing process of the display panel 100 does not affect the lifespan and reliability of the OLED device.

[0055] Optionally, in one embodiment, the thin-film encapsulation layer 80 includes a first encapsulation layer 81, a second encapsulation layer 82, and a third encapsulation layer 83 sequentially stacked on the side of the second electrode layer 53 facing away from the substrate 10.

[0056] Optionally, in one embodiment, the first encapsulation layer 81 and the third encapsulation layer 83 are inorganic encapsulation layers. For example, the material of the inorganic encapsulation layer is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation layer can be a single layer, multiple layers, composite layers, etc.

[0057] Optionally, in one embodiment, the second encapsulation layer 82 is an organic encapsulation layer. Exemplarily, the organic encapsulation layer is made of fiber materials, resin materials, or materials used in multilayer boards, etc. The organic encapsulation layer can be a single layer, multiple layers, composite layers, etc.

[0058] The display panel provided in this application embodiment includes a display area and an ear area. The display panel includes a substrate, a first conductive layer, a planarization layer, a planarization portion, a first electrode layer, a protective portion, a pixel definition layer, a plurality of light-emitting functional portions, and a second electrode layer. The first conductive layer is located on one side of the substrate and includes conductive wires. The conductive wires are located in the ear area, and at least a portion of the exposed sidewalls of the conductive wires have grooves. The planarization layer is located on the side of the first conductive layer away from the substrate and is located in the display area. The planarization portion is on the same layer as the planarization layer and is made of the same material. The planarization portion fills the grooves on the exposed sidewalls of the conductive wires, and the planarization portion and the planarization layer are disconnected. The first electrode layer is located on the side of the planarization layer away from the substrate and includes a plurality of first electrodes. The protective portion is on the same layer as the first electrode layer and is made of the same material. The protective portion covers the planarization portion. The pixel definition layer is located on the side of the first electrode layer away from the substrate and encloses a plurality of pixel openings. The pixel openings expose at least a portion of the first electrodes. The light-emitting functional portions are located within the pixel openings. The second electrode layer is located on the side of the light-emitting functional portions away from the substrate. The above embodiments, by covering the exposed sidewalls of the conductors in the ear area with a protective portion, can protect the exposed sidewalls of the conductors and prevent the acid etching and development processes during subsequent fabrication from affecting them. Furthermore, by providing a flat portion between the conductor and the protective portion, i.e., within the groove of the exposed sidewall of the conductor, the protective portion can be prevented from breaking at the sidewall, improving its protective effect. Furthermore, the flat portion and the flattening layer are of the same layer and material, and the protective portion and the first electrode layer are of the same layer and material, simplifying the display panel fabrication process and saving fabrication time and materials.

[0059] This application also provides a method for manufacturing a display panel. Figure 7 This is a schematic flowchart illustrating the method for manufacturing a display panel according to an embodiment of this application. Figure 7 As shown, this fabrication method is applicable to fabricating the aforementioned display panel 100. The display panel 100 includes a display area 101 and an ear area 102 located on one side of the display area. The fabrication method includes:

[0060] Step S100: Prepare a first conductive layer on the substrate.

[0061] The first conductive layer 20 includes a wire 21 located in the ear region 102, and at least a portion of the exposed sidewall of the wire 21 has a groove 211.

[0062] Optionally, in one embodiment, the substrate 10 can be a substrate, which may include, but is not limited to, any one of conductive silicon (Si) substrates, silicon oxide (SiOx) substrates, aluminum oxide (Al2O3) substrates (i.e., sapphire substrates), silicon carbide (SiC) substrates, and gallium nitride (GaN) substrates. Furthermore, the substrate can also be a flexible substrate, for example, a flexible substrate made of polyimide (PI).

[0063] Optionally, in one embodiment, the first conductive layer 20 includes a first sublayer 201, a second sublayer 202, and a third sublayer 203 stacked sequentially. The orthographic projection of the second sublayer 202 on the substrate 10 is within the orthographic projection range of the first sublayer 201 on the substrate 10, and the orthographic projection of the second sublayer 202 on the substrate 10 is within the orthographic projection range of the third sublayer 203 on the substrate 10.

[0064] Optionally, in one embodiment, the materials of the first sublayer 201 and the third sublayer 203 include titanium.

[0065] Optionally, in one embodiment, the material of the second sublayer 202 includes aluminum.

[0066] Step S200: Prepare a flat material layer on the side of the first conductive layer away from the substrate.

[0067] Optionally, in one embodiment, the planarization material layer can be an organic material, such as polyimide, acrylic resin, epoxy resin, etc.

[0068] Step S300: The flat material layer is patterned to obtain a flat layer and a flat section.

[0069] Optionally, in one embodiment, the planarization layer 30 is located on the side of the first conductive layer 20 away from the substrate 10 and is located in the display area 101. The planarization portion 40 is on the same layer as the planarization layer 30 and is made of the same material. The planarization portion 40 fills the groove 211 of the exposed sidewall of the conductor 21. The planarization portion 40 and the planarization layer 30 are disconnected.

[0070] Optionally, in one embodiment, patterning the planar material layer to obtain the planar layer 30 and the planar portion 40 includes: preparing a photoresist material layer on the planar material layer, exposing the photoresist material layer using a grayscale mask, and developing the photoresist material layer to obtain the planar layer 30 and the planar portion 40.

[0071] Optionally, in one embodiment, the flat portion 40 may be removed to simplify the structure of the display panel 100.

[0072] Specifically, in one embodiment, before exposing the photoresist layer using a grayscale mask, the preparation method further includes removing the planar portion 40 using an oxygen etching process.

[0073] Optionally, in one embodiment, the surface of the flat portion 40 facing away from the sidewall of the conductor 21 is an arc-shaped surface.

[0074] Optionally, in one embodiment, on a cross section perpendicular to the substrate 10, the angle α between the tangent L of the arcuate surface and the substrate 10 is less than or equal to 45°. For example, the angle α between the tangent L of the arcuate surface and the substrate 10 can be 1 degree, 10 degrees, 15 degrees, 25 degrees, 35 degrees, 40 degrees, 45 degrees, etc.

[0075] Preferably, in one embodiment, on a cross section perpendicular to the substrate 10, the angle α between the tangent L of the arcuate surface and the substrate 10 is greater than or equal to 20° and less than or equal to 30°. For example, the angle α between the tangent L of the arcuate surface and the substrate 10 can be 20 degrees, 22 degrees, 24 degrees, 25 degrees, 26 degrees, 28 degrees, 30 degrees, etc.

[0076] Step S400: Prepare a conductive material layer on the side of the planarization layer away from the substrate.

[0077] Step S500: The conductive material layer is patterned to obtain the first electrode layer and the protective part.

[0078] Optionally, in one embodiment, the first electrode layer includes a plurality of first electrodes 51, which are spaced apart.

[0079] Optionally, in one embodiment, the protective portion 60 covers the flat portion 40.

[0080] Optionally, in one embodiment, the protection part 60 and the first electrode 51 are disconnected.

[0081] Optionally, in one embodiment, the surface of the protective part 60 facing away from the sidewall of the conductor 21 is an arc-shaped surface.

[0082] Step S600: Sequentially fabricate a pixel definition layer, a light-emitting functional part, and a second electrode layer on the side of the first electrode layer away from the substrate.

[0083] Optionally, in one embodiment, the pixel definition layer 70 encloses a plurality of pixel openings Q, the pixel openings Q exposing at least a portion of the first electrode 51, and the light-emitting functional part 52 is located within the pixel openings Q.

[0084] Optionally, in one embodiment, the pixel definition layer 70 can be a light-transmitting material to allow light from the light-emitting device 50 to pass through the pixel definition layer 70 more effectively. Optionally, the pixel definition layer 70 can be an opaque material, which can improve the light absorption of the pixel definition layer 70, reduce the reflectivity of the display panel, further reduce optical crosstalk between adjacent light-emitting devices 50, and improve the display effect of the display panel 100.

[0085] Optionally, in one embodiment, the pixel definition layer 70 is made of an inorganic material.

[0086] One embodiment of this application also provides a display module. Figure 8 This is a schematic cross-sectional view of the display module provided in an embodiment of this application. Figure 8 As shown, the display module 200 includes the display panel 100 provided in the above embodiments, or the display panel 100 obtained according to the preparation method provided in the above embodiments.

[0087] Optionally, in one embodiment, the display module 200 further includes a cover plate 210 located on the side of the thin film encapsulation layer 80 away from the substrate 10. The cover plate 210 is the outermost protective component of the display module 200 and is typically made of transparent or translucent material. The cover plate 210 is used to protect the display panel 100 inside the display module 200 from physical damage, dust or moisture, while also providing touch functionality.

[0088] Specifically, the cover plate 210 can provide physical protection for the display panel 100, preventing damage to the display panel 100 from scratches, impacts, etc.

[0089] Specifically, the cover plate 210 has high transmittance, ensuring the display effect of the display module 200.

[0090] Optionally, in one embodiment, the cover plate 210 may be a glass cover plate.

[0091] Optionally, in one embodiment, the display module 200 further includes an optical adhesive layer 220 located between the display panel 100 and the cover plate 210 to bond the display panel 100 and the cover plate 210 together.

[0092] It should be understood that the specific type of optical adhesive layer 220 is not shown in the embodiments of this application. For example, optical adhesive layer 220 can be a solid optical adhesive, which can be pre-formed into a film, is easy to bond, and is suitable for mass production; or optical adhesive layer 220 can be a liquid optical adhesive, which is suitable for complex structures such as curved screens; or optical adhesive layer 220 can be an anti-blue light optical adhesive, which contains blue light absorbers and can reduce harmful blue light.

[0093] Optionally, in one embodiment, the display module 200 further includes a touch metal layer 230, which is located between the display panel 100 and the optical adhesive layer 220. The touch metal layer 230 can sense the user's touch operation and convert the sensed touch operation into an electrical signal, which is then transmitted to the driving circuit of the display panel 100. Optionally, the touch metal layer 230 can be a single-layer structure. Optionally, the touch metal layer 230 can be a multi-layer structure.

[0094] The display module 200 provided according to any embodiment of this application and the display panel 100 provided in the embodiments of this application belong to the same inventive concept and have corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of the display module 200 can be found in the embodiments of the display panel 100, and will not be repeated here.

[0095] One embodiment of this application also provides a display device. Figure 9 This is a schematic diagram of the structure of the display device provided in the embodiments of this application. Figure 9 As shown, the display device 300 includes the display panel 100 provided in the above embodiments, or the display panel 100 obtained according to the manufacturing method provided in the above embodiments, or the display module 200 provided in the above embodiments. The display device 300 is a product with image display function. For example, the display device 300 can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0096] In addition, the display device 300 can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device 300 also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0097] The display device 300 provided according to any embodiment of this application and the display panel 100 provided in the embodiments of this application belong to the same inventive concept and have corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of the display device 300 can be found in the embodiments of the display panel 100, and will not be repeated here.

[0098] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0099] The block diagrams of devices, apparatuses, devices, and systems involved in this application are merely illustrative examples and are not intended to require or imply that they must be connected, arranged, or configured in the manner shown in the block diagrams. As those skilled in the art will recognize, these devices, apparatuses, devices, and systems can be connected, arranged, and configured in any manner. Words such as “comprising,” “including,” “having,” etc., are open-ended terms meaning “including but not limited to,” and are used interchangeably with them. The terms “or” and “and” as used herein refer to the terms “and / or,” and are used interchangeably with them unless the context clearly indicates otherwise. The term “such as” as used herein refers to the phrase “such as but not limited to,” and is used interchangeably with it.

[0100] It should also be noted that in the apparatus, equipment, and methods of this application, the components or steps can be disassembled and / or recombined. These disassemblies and / or recombinations should be considered as equivalent solutions of this application.

[0101] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use this application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein can be applied to other aspects without departing from the scope of this application. Therefore, this application is not intended to be limited to the aspects shown herein, but rather to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0102] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

[0103] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A display panel, characterized in that, The display panel includes a display area and an ear area located on one side of the display area; the display panel includes: substrate; A first conductive layer is located on one side of the substrate. The first conductive layer includes a wire located in the ear region. At least a portion of the exposed sidewall of the wire has a groove. A planarization layer is located on the side of the first conductive layer opposite to the substrate and in the display area; A flat portion, which is in the same layer and made of the same material as the flat layer, fills the groove on the exposed sidewall of the conductor, and the flat portion is disconnected from the flat layer; A first electrode layer is located on the side of the planarization layer opposite to the substrate, and the first electrode layer includes a plurality of first electrodes; A protective portion, which is on the same layer as the first electrode layer and made of the same material, covers the flat portion; A pixel definition layer is located on the side of the first electrode layer opposite to the substrate. The pixel definition layer encloses a plurality of pixel openings, and the pixel openings expose at least a portion of the first electrode. Multiple light-emitting functional units, the light-emitting functional units being located within the pixel opening; and The second electrode layer is located on the side of the light-emitting functional part that is away from the substrate.

2. The display panel according to claim 1, characterized in that, The surface of the exposed sidewall of the flat portion that is away from the conductor is an arc-shaped surface; Preferably, the flat portion is in contact with the substrate.

3. The display panel according to claim 2, characterized in that, In a cross section perpendicular to the substrate, the angle between the tangent of the arcuate surface and the substrate is less than or equal to 45°. Preferably, the included angle is greater than or equal to 20° and less than or equal to 30°.

4. The display panel according to claim 1, characterized in that, The flat portion is in contact with the substrate.

5. The display panel according to claim 4, characterized in that, The protective part is in contact with the substrate.

6. The display panel according to claim 1, characterized in that, The protective part is disconnected from the first electrode.

7. The display panel according to claim 1, characterized in that, The first conductive layer includes a first sublayer, a second sublayer and a third sublayer stacked sequentially. The orthographic projection of the second sublayer on the substrate is located within the orthographic projection range of the first sublayer on the substrate, and the orthographic projection of the second sublayer on the substrate is located within the orthographic projection range of the third sublayer on the substrate. Preferably, the materials of the first sublayer and the third sublayer include titanium, and the material of the second sublayer includes aluminum.

8. A method for manufacturing a display panel, characterized in that, The display panel includes a display area and an ear area located on one side of the display area; the manufacturing method includes: A first conductive layer is prepared on a substrate, the first conductive layer including a wire located in the ear region, and at least a portion of the sidewall of the wire having a groove; A flat material layer is prepared on the side of the first conductive layer away from the substrate; The planar material layer is patterned to obtain a planar layer and a planar portion. The planar layer is located on the side of the first conductive layer away from the substrate and in the display area. The planar portion fills the groove. The planar portion and the planar layer are disconnected. A conductive material layer is prepared on the side of the planarization layer opposite to the substrate. The conductive material layer is patterned to obtain a first electrode layer and a protective portion. The first electrode layer is located on the side of the planarization layer away from the substrate. The first electrode layer includes a plurality of first electrodes. The protective portion covers the planarization portion. A pixel definition layer, a light-emitting functional part, and a second electrode layer are sequentially fabricated on the side of the first electrode layer away from the substrate.

9. The preparation method according to claim 8, characterized in that, The step of patterning the flat material layer to obtain a flat layer and a flat portion includes: A photoresist layer is prepared on the flat material layer; The photoresist material layer is exposed using a grayscale mask. The photoresist material layer is developed to obtain the planarization layer and the planarization portion; Preferably, before exposing the photoresist material layer using a grayscale mask, the preparation method further includes: The flat portion is removed using an oxygen etching process.

10. A display device, characterized in that, The display panel includes any one of claims 1-8, or the display panel obtained by the preparation method according to claim 9.

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