Display panel, preparation method thereof and display device

Abstract

The application discloses a display panel and a preparation method thereof and a display device, and relates to the technical field of display panels. The display panel comprises a substrate, a display function layer on one side of the substrate, a plurality of pixels and a plurality of support columns in the display function layer, wherein the pixels and the support columns are located in a display area, and the support columns are located between the pixels; an encapsulation layer on the side of the display function layer away from the substrate; the encapsulation layer covers at least each pixel and each support column in a direction perpendicular to the light-emitting surface of the display panel; the encapsulation layer comprises an organic encapsulation layer; the organic encapsulation layer overlapping with the support column in the direction perpendicular to the light-emitting surface of the display panel is a first organic encapsulation part; the thickness of the first organic encapsulation part is T0; and 3 microns <= T0 <= 15 microns. The technical scheme of the application is characterized in that the position of the support column in the display function layer is provided with an organic encapsulation layer with sufficient thickness, so as to improve the encapsulation effect of the encapsulation layer and ensure the display effect of the display panel.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display panel, its manufacturing method, and a display device. Background Technology

[0002] With the development of display technology, electronic products with display functions are gradually becoming thinner and lighter and full-screen, which means that flexible display panels are usually used in electronic products with display functions. By bending at least part of the non-display area of ​​the flexible display panel to its back, the overall bezel size can be reduced to meet the requirements of ultra-narrow bezels.

[0003] In existing technologies, display panels typically include a display functional layer and an encapsulation layer covering the display functional layer. The encapsulation layer protects the display functional layer from external moisture and oxygen intrusion, preventing damage to the components within the display functional layer, and also protects it from direct impacts. However, due to the bezel limitations of ultra-narrow bezel display panels, the encapsulation layer cannot meet the required thickness, thus failing to effectively encapsulate the display functional layer and consequently affecting the display panel's display performance and lifespan. Summary of the Invention

[0004] This invention provides a display panel and its manufacturing method, as well as a display device, to improve the encapsulation effect of the encapsulation layer and ensure the display effect and service life of the display panel.

[0005] In a first aspect, the present invention provides a display panel, comprising: a display area and a non-display area surrounding the display area; the display panel further comprising: Substrate; A display functional layer located on one side of the substrate; the display functional layer includes multiple pixels and multiple support pillars; the pixels and the support pillars are all located in the display area, and the support pillars are located between the pixels; An encapsulation layer located on the side of the display functional layer facing away from the substrate; in a direction perpendicular to the light-emitting surface of the display panel, the encapsulation layer at least covers each of the pixels and each of the support pillars; The encapsulation layer includes an organic encapsulation layer; the organic encapsulation layer overlapping the support pillar in the direction perpendicular to the light-emitting surface of the display panel is a first organic encapsulation portion; the thickness of the first organic encapsulation portion is T0; wherein, 3μm≤T0≤15μm.

[0006] In a second aspect, the present invention provides a method for manufacturing a display panel, the display panel comprising a display area and a non-display area surrounding the display area; the method for manufacturing the display panel includes: Provide substrates; A display functional layer is formed on the substrate; the display functional layer includes a plurality of pixels and a plurality of support pillars; the pixels and the support pillars are all located in the display area, and the support pillars are located between the pixels; An encapsulation layer is formed on the side of the display functional layer opposite to the substrate; in a direction perpendicular to the light-emitting surface of the display panel, the encapsulation layer at least covers each of the pixels and each of the support pillars; The encapsulation layer includes an organic encapsulation layer; the organic encapsulation layer overlapping the support column in the direction perpendicular to the light-emitting surface of the display panel is a first organic encapsulation part; the thickness of the first organic encapsulation part is T0; wherein, 3μm≤T0≤15μm.

[0007] Thirdly, the present invention provides a display device, including the display panel of the first aspect.

[0008] The technical solution of this invention, by placing both pixels and support pillars in the display functional layer within the display area, with the support pillars located between the pixels, allows the support pillars to support the corresponding photomasks, forming the corresponding pixel structure. Simultaneously, by placing the support pillars in the display area, they do not occupy space in the non-display area, which helps reduce the size of the non-display area and thus facilitates a narrow bezel in the display panel. Furthermore, by providing an encapsulation layer on the side of the display functional layer facing away from the substrate, the encapsulation layer covers both the pixels and support pillars, providing protection. The thickness T0 of the first organic encapsulation portion of the organic encapsulation layer in the encapsulation layer ranges from 3μm ≤ T0 ≤ 15μm, meaning the first organic encapsulation portion covering the support pillars has sufficient thickness to completely cover the surface of the support pillar facing away from the substrate. This prevents the organic encapsulation layer from being damaged by unevenness on the support pillar surface due to insufficient thickness of the organic encapsulation layer on the side facing away from the substrate, thereby improving the encapsulation effect of the encapsulation layer and ensuring the display effect and lifespan of the display panel. Attached Figure Description

[0009] Figure 1 This is a schematic diagram of a partial film layer structure of a display panel based on related technologies; Figure 2 This is a top view structural diagram of a display panel provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of a partial film layer structure of a display panel provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 7 This is a top view of the structure of a display panel in an unbent state, according to an embodiment of the present invention. Figure 8 This is a schematic diagram of the upward-view structure of a display panel in a bent state according to an embodiment of the present invention; Figure 9 This is a top view of another display panel in an unbent state provided by an embodiment of the present invention; Figure 10 This is a schematic diagram of another display panel in a bent state, viewed from below, provided in an embodiment of the present invention. Figure 11 This is a top view schematic diagram of another display panel provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 13 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 15 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 16 This is a top view structural diagram of another display panel provided in an embodiment of the present invention; Figure 17 This is a schematic diagram of a partial film layer structure of another display panel provided in an embodiment of the present invention; Figure 18 This is a top view structural diagram of another display panel provided in an embodiment of the present invention; Figure 19 This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention; Figure 20 This is a schematic diagram of the manufacturing process of a display panel according to an embodiment of the present invention; Figure 21 This is a schematic flowchart of a method for preparing an organic encapsulation layer according to an embodiment of the present invention; Figure 22 This is a schematic diagram of the fabrication process of an organic encapsulation layer provided in an embodiment of the present invention; Figure 23 This is a schematic flowchart of a method for preparing a second organic encapsulation layer according to an embodiment of the present invention; Figure 24This is a schematic diagram of the fabrication process of a second organic encapsulation layer provided in an embodiment of the present invention; Figure 25 This is a schematic flowchart of another method for preparing a second organic encapsulation layer provided in an embodiment of the present invention; Figure 26 This is a schematic diagram of the fabrication process of another second organic encapsulation layer provided in an embodiment of the present invention; Figure 27 This is a schematic flowchart of a method for preparing a third organic encapsulation layer according to an embodiment of the present invention; Figure 28 This is a schematic diagram of the fabrication process of a third organic encapsulation layer provided in an embodiment of the present invention; Figure 29 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention. Detailed Implementation

[0010] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0011] Figure 1 This is a schematic diagram of a partial film layer structure of a display panel based on related technologies, such as... Figure 1 As shown, in the related technology, the display panel 001 includes a substrate 010, a display functional layer 020 located on one side of the substrate 010, and an encapsulation layer 030 located on the side of the display functional layer 020 facing away from the substrate 010. The display functional layer 020 may include pixels and support pillars 021 located between the pixels. Each pixel may include pixel circuitry and light-emitting elements. Typically, the display functional layer can be formed sequentially using processes such as deposition, coating, and etching to form the pixel circuitry and the support pillars 021 located on the side of the pixel circuitry facing away from the substrate 010, and then the light-emitting elements of the pixels can be formed by vapor deposition. When forming the light-emitting elements, corresponding vapor deposition masks need to be set so that the light-emitting elements can be formed at the appropriate positions, ensuring that the light-emitting elements are arranged in a certain regular pattern so that the corresponding image can be displayed when the display panel 001 is used. The support post 021 is used to support the vapor deposition mask. Since the vapor deposition mask is usually made of mesh metal and the support post 021 is usually made of organic material, the vapor deposition mask will scratch the support post 021 when it comes into contact with the support post 021, resulting in a corresponding uneven structure on the surface of the support post 021.

[0012] After the display functional layer is fabricated, an encapsulation layer 020 is formed. An encapsulation layer 030 protects the pixels and other components within the display functional layer 020 from external moisture and oxygen erosion. The encapsulation layer 030 includes at least an organic encapsulation layer, which can be formed using inkjet printing. The fluidity of the inkjet printing material allows the formed organic encapsulation layer to have a planarizing and leveling effect, ensuring that other inorganic layer structures located on the side of the organic encapsulation layer facing away from the substrate 010 can be formed on a flat surface.

[0013] However, as the display bezel of the display panel 001 decreases, to prevent the organic encapsulation layer from flowing to the edge of the display panel, when preparing the organic encapsulation layer using inkjet printing, the printing position needs to be as far away from the edge of the display panel as possible. That is, the printing position of the inkjet printer will be recessed towards the position away from the edge of the display panel. At this time, due to the influence of the material flow characteristics of inkjet printing, the film thickness of the organic encapsulation layer formed at other positions far from the printing position is relatively thin. For example, the thickness of the organic encapsulation layer on the side of the support pillar 021 facing away from the substrate 010 near the edge of the display area is relatively thin. This means that when there is an uneven structure on the surface of the support pillar 021 facing away from the substrate 010, the organic encapsulation layer cannot completely cover the uneven structure. When other inorganic film layers are formed on the side of the organic encapsulation layer away from the substrate 010, the inorganic film layers are formed with a relatively thin film thickness by deposition. This allows the uneven structures not covered by the organic encapsulation layer to puncture the inorganic film layers. If the inorganic film layer includes the inorganic encapsulation layer of the encapsulation layer, the puncture of the inorganic encapsulation layer will create a water and oxygen transport path, allowing water and oxygen to enter the display functional layer, damaging the devices in the display functional layer, affecting the display effect and lifespan of the display panel, and causing the encapsulation layer to fail. When the inorganic film layer includes touch wiring layers and / or touch electrode layers that implement touch functions, etching processes are usually used to pattern the touch wiring layers and / or touch electrode layers. In this case, the touch wiring layers and / or touch electrode layers will be punctured, resulting in etched breaks in subsequent processes, affecting the accuracy of touch detection.

[0014] To address the aforementioned technical problems, embodiments of the present invention provide a display panel comprising: a display area and a non-display area surrounding the display area; the display panel further comprising: a substrate; a display functional layer located on one side of the substrate; the display functional layer comprising a plurality of pixels and a plurality of support pillars; the pixels and support pillars are both located in the display area, and the support pillars are located between the pixels; an encapsulation layer located on the side of the display functional layer facing away from the substrate; in a direction perpendicular to the light-emitting surface of the display panel, the encapsulation layer at least covers each pixel and each support pillar; the encapsulation layer comprises an organic encapsulation layer; in a direction perpendicular to the light-emitting surface of the display panel, the organic encapsulation layer overlapping with the support pillars is a first organic encapsulation portion; the thickness of the first organic encapsulation portion is T0; wherein, 3μm≤T0≤15μm.

[0015] By employing the above technical solution, both the pixels and support pillars in the display functional layer are located within the display area, with the support pillars situated between the pixels. This allows the support pillars to support the corresponding photomasks, forming the corresponding pixel structure. Simultaneously, by placing the support pillars within the display area, they do not occupy space in the non-display area, thus reducing the size of the non-display area and contributing to a narrower bezel in the display panel. Furthermore, by setting an encapsulation layer on the side of the display functional layer facing away from the substrate, the encapsulation layer covers both the pixels and support pillars, providing protection. The thickness T0 of the first organic encapsulation portion of the organic encapsulation layer in the encapsulation layer ranges from 3μm ≤ T0 ≤ 15μm, ensuring sufficient thickness for the first organic encapsulation portion covering the support pillar. This prevents the unevenness of the support pillar surface from scratching the organic encapsulation layer due to insufficient thickness of the organic encapsulation layer on the side facing away from the substrate, thereby improving the encapsulation effect and ensuring the display panel's display performance and lifespan.

[0016] The above is the core idea of ​​this invention. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention. The technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0017] Figure 2 This is a top view schematic diagram of a display panel provided in an embodiment of the present invention. Figure 3 This is a schematic diagram of a partial film layer structure of a display panel provided in an embodiment of the present invention, for reference. Figure 2 and Figure 3The display panel 100 includes a display area AA and a non-display area NA surrounding the display area AA; the display panel 100 also includes a substrate 10 and a display functional layer 20 located on one side of the substrate 10; the display functional layer 20 includes a plurality of pixels 22 and a plurality of support pillars 21; the pixels 22 and the support pillars 21 are both located in the display area AA, and the support pillars 22 are located between the pixels 21.

[0018] It is understood that the pixels 22 of the display functional layer 20 are located in the display area AA, so that when the pixels 22 emit light, the display area AA can display a corresponding image. Each pixel 22 in the display area AA can have a different emitting color. For example, pixels 22 can include red pixels 2201 (emitting red), green pixels 2202 (emitting green), and blue pixels 2203 (emitting blue). The light emitted by pixels 22 of different emitting colors combines with each other, allowing the display area AA to display a richly colored image. The pixels 22 of different emitting colors can be arranged in a certain pattern, and the specific arrangement can be designed according to actual needs; this embodiment of the invention does not impose specific limitations on this. Simultaneously, the display area AA is also provided with support pillars 21, which are located between the pixels 22. That is, the support pillars 21 can be located in the area between the emitting areas of two adjacent pixels 22. The density of the support pillars 21 in the display area AA, and the relative positional relationship between the support pillars 21 and each pixel 22, can be designed according to actual needs; this embodiment of the invention does not impose specific limitations on this.

[0019] It should be noted that the support pillar 21 and pixel 22 are located in the display area AA, meaning that the non-display area NA does not have support pillar 21 and pixel 22. This allows the non-display area NA to have corresponding driving circuits, signal transmission lines, etc., to provide display control signals to the pixel 22 in the display area AA, controlling the display illumination state of the pixel 22. At the same time, because the non-display area NA does not have support pillar 21, there is no need to reserve a support pillar area in the non-display area NA, which helps to reduce the size of the non-display area NA and facilitates a narrow bezel for the display panel 100.

[0020] It can also be understood that pixel 22 may include pixel circuit P and light-emitting element D. Pixel circuit P is electrically connected to light-emitting element D to drive light-emitting element D to display light emission. At this time, display function layer 20 may include circuit setting layer 201, planarization layer 202, pixel definition layer 203, support pillar setting layer 204, and light-emitting function layer 205. Pixel circuit P may be disposed in circuit setting layer 201. Pixel circuit P may include active devices and / or passive devices. Active devices may include three-terminal or four-terminal devices such as transistors. Passive devices may include two-terminal devices such as resistors, capacitors, and inductors. The specific structure of the pixel circuit can be selected according to actual needs. This embodiment of the invention does not specifically limit this. Taking the structure of a transistor to represent pixel circuit P as an example, circuit setting layer 201 may include a semiconductor layer 2011, a first metal layer 2012, and a second metal layer 2013 disposed with insulating intervals. Semiconductor layer 2011 may include the active layer of the transistor, the first metal layer 2012 may include the gate of the transistor, and the second metal layer 2013 may include the source lead and drain lead of the transistor. Since the pixel circuit P includes multiple device structures, the surface of the circuit setting layer 201 facing away from the substrate 10 has an uneven structure, thus forming a surface step. In this case, a planarization layer 202 can be provided on the side of the circuit setting layer 201 facing away from the substrate 10 to eliminate the surface step of the circuit setting layer 201, allowing the pixel definition layer 203 and the light-emitting functional layer 205 to be formed on a flat surface. A light-emitting element D is disposed on the light-emitting functional layer 205, which may include an anode 2051, a cathode 2053 of the light-emitting element D, and a light-emitting layer 2052 located between the anode 2051 and the cathode 2053. The pixel definition layer 203 may include multiple pixel openings to define the display light-emitting area of ​​the light-emitting element D. The support pillar 21 can be set on the support pillar setting layer 204. Since the light-emitting layer 2052 of the light-emitting functional layer 205 is usually formed by vapor deposition, the support pillar 21 can be used to support the vapor deposition mask so that the light-emitting layer 2052 is formed in each pixel opening.

[0021] Continue to refer to Figure 2 and Figure 3 The display functional layer 20 also has an encapsulation layer 30 on the side facing away from the substrate 10. In the direction Z perpendicular to the light-emitting surface of the display panel 100, the encapsulation layer 30 covers at least each pixel 22 and each support pillar 21. The encapsulation layer 30 can block the intrusion of external moisture and oxygen, protect each pixel 22, and prevent the devices in the pixel 22 from oxidizing and failing, resulting in display black spots, dark spots, etc.

[0022] The encapsulation layer 30 includes an organic encapsulation layer 301; the organic encapsulation layer 301 overlapping with the support post 21 in the direction Z perpendicular to the light-emitting surface of the display panel 100 is a first organic encapsulation part 3001; the thickness of the first organic encapsulation part 3001 is T0; 3μm≤T0≤15μm.

[0023] The organic encapsulation layer 301 is an important film layer of the encapsulation layer 20. It can fill in protrusions, depressions, particles, pinholes, and other defects in the film layer on the side of the organic encapsulation layer 301 close to the substrate 10, so as to ensure that other film layers on the side of the organic encapsulation layer 301 away from the substrate 10 can be formed on a relatively flat surface. For example, the support pillar 21 in the display functional layer 20 is usually used to support the vapor deposition mask when preparing the light-emitting element D in the pixel 22. This causes the support pillar 21 to protrude from the surface of the display functional layer 20 compared to the device structure of the pixel 22. At this time, the organic encapsulation layer 20 needs to fill in the step difference between the support pillar 21 and the device structure of the pixel 22, as well as fill in the protrusions, depressions, particles, pinholes, and other defects caused by the manufacturing process. At this time, in the direction Z perpendicular to the light-emitting surface of the display panel 100, the organic encapsulation layer 301 needs to cover both the support pillar 21 and the pixel 22 to ensure the flatness of the surface of the organic encapsulation layer 301 away from the display functional layer 20.

[0024] The organic encapsulation layer 301 can be formed by inkjet printing. The fluidity of the inkjet-printed organic material is used to fill in protrusions, depressions, particles, pinholes, and other defects in the film layer on the side of the organic encapsulation layer 301 closest to the substrate 10. In this case, by designating the organic encapsulation layer 301 overlapping the support pillar 21 in the direction Z perpendicular to the light-emitting surface of the display panel 100 as the first organic encapsulation portion 3001, and setting the thickness of the first organic encapsulation portion 3001 to a value T0 ranging from 3μm to 15μm, the first organic encapsulation portion 3001 at the location of the protruding support pillar 21 can have sufficient thickness to cover protrusions and depressions on the surface of the support pillar 21 facing away from the substrate 10 caused by the manufacturing process. This prevents the protrusions and depressions on the surface of the support pillar 21 from being uncovered by the organic encapsulation layer 301, thus ensuring the integrity of the subsequent film layer formation. Meanwhile, due to the fluidity characteristics of the organic material during the preparation of the organic encapsulation layer 301, the organic encapsulation layer 301 at the protruding position in the film layer on the side of the organic encapsulation layer 301 close to the substrate 10 can have a thinner thickness, while the organic encapsulation layer 301 at the recessed position in the film layer on the side of the organic encapsulation layer 301 close to the substrate 10 has a thicker thickness. This means that when the thickness of the first organic encapsulation portion 3001 covering the support pillar 21 protruding from the display functional layer 20 is greater than or equal to 3μm, the organic encapsulation layer 301 covering other positions of the display functional layer 20 will also be greater than or equal to 3μm. This results in the organic encapsulation layer 301 covering both the pixel 22 and the support pillar 21 in the display functional layer 20 having a larger thickness, ensuring that the organic encapsulation layer 301 can effectively fill the film layer on the side of the organic encapsulation layer 301 close to the substrate 10, thereby giving the side of the organic encapsulation layer 301 away from the substrate 10 a flat surface. This effectively improves the encapsulation effect of the encapsulation layer 30, which is beneficial to improving the display effect and service life of the display panel 100.

[0025] Understandably, when the thickness T0 of the first organic encapsulation portion 3001 is large, the overall thickness of the organic encapsulation layer 301 is also large. During the fabrication of the organic encapsulation layer 301, more organic material needs to be inkjet printed. This increases the probability that the organic material will flow to the edge of the non-display area NA. Since the organic material in the organic encapsulation layer 301 cannot block moisture and oxygen, when the organic encapsulation layer 301 reaches the edge of the non-display area NA, the continuous organic encapsulation layer 301 from the edge of the non-display area NA to the display area AA will act as a transport path for moisture and oxygen. This causes moisture and oxygen entering the display area AA to erode the devices of the pixel 22, affecting the display effect of the display panel 100. By setting the thickness T0 of the first organic encapsulation portion 3001 to be less than or equal to 15 μm, the amount of inkjet-printed organic material is relatively reduced, preventing the organic material from flowing to the edge of the non-display area NA. This effectively reduces the risk of the organic encapsulation layer 301 forming a moisture and oxygen transport path. Furthermore, by setting the thickness T0 of the first organic encapsulation portion 3001 to be less than or equal to 15 μm, the thickness contributed by the encapsulation layer 30 in the display panel 100 can be reduced, which is beneficial to the thinning of the display panel 100.

[0026] Furthermore, since both the support pillar 21 and the pixel 22 are located within the display area AA, when forming the organic encapsulation layer 301 covering the support pillar 21 and the pixel 22 using inkjet printing, the inkjet printing position can be located above the display area AA. For example, the shortest distance L between the inkjet printing position and the non-display area in the first direction X / Y can be L≥150μm. That is, compared to the edge of the display area AA, the inkjet printing position is recessed towards the center of the display area AA. This further prevents the inkjet-printed organic material from flowing to the edge of the non-display area AA, thereby effectively preventing the organic encapsulation layer 301 from forming a water vapor and oxygen transport path. When the recessed printing position cannot meet the thickness requirement of the first organic encapsulation portion 3001 above the support pillar 21 near the edge of the display area AA, a sufficiently thick first organic encapsulation portion 3001 can be formed by performing multiple inkjet printing processes or by combining inkjet printing with photolithography. Provided that the thickness requirement of the first organic encapsulation part 3001 is met, and that the organic encapsulation layer 301 is prevented from forming a water vapor and oxygen transport path, the specific formation method of the organic encapsulation layer 301 is not limited in the embodiments of the present invention.

[0027] Optionally, based on the above embodiments and in conjunction with reference to... Figure 2 and Figure 4As shown, the display functional layer 20 also includes a barrier structure RW; the barrier structure RW is located in the non-display area NA and is arranged around the display area AA; the distance between the barrier structure RW and the display area AA in the first direction X / Y is D; wherein, 100μm≤D≤200μm; the first direction X / Y is parallel to the arrangement direction of the display area AA and the non-display area NA; the edge of the organic encapsulation layer 301 is located on the side of at least part of the barrier structure RW that is close to the display area AA.

[0028] The barrier structure RW can be a stacked structure of organic and / or inorganic film layers in the display functional layer 20. The barrier structure RW is located in the non-display area NA, that is, the stacked film layers of the display functional layer 20 located in the non-display area NA form a barrier structure RW including at least one protrusion.

[0029] Because the organic encapsulation layer 301 has poor density, it can act as a transport path for water vapor and oxygen. Furthermore, the organic material used to fabricate the organic encapsulation layer 301 typically has a certain degree of fluidity. Therefore, during the fabrication of the organic encapsulation layer 301, a corresponding barrier structure RW needs to be set to prevent the material of the organic encapsulation layer 301 from flowing further towards the edge of the non-display area NA. This ensures that the edge of the organic encapsulation layer 301 is stopped at least partially by the barrier structure RW near the display area AA, preventing the organic encapsulation layer 301 from forming at the edge of the non-display area NA and thus preventing it from acting as a transport channel for water vapor and oxygen into the display area AA, affecting the lifespan of the devices in the display area AA.

[0030] It is understandable that, since the organic encapsulation layer 301 can serve as a transport path for water vapor and oxygen, the encapsulation layer 30, which only includes the organic encapsulation layer 301, cannot effectively block water vapor and oxygen. In this case, the encapsulation layer 30 can also include at least one inorganic encapsulation layer. By utilizing the dense characteristics of the inorganic material in the inorganic encapsulation layer, water vapor and oxygen can be blocked.

[0031] In one optional embodiment, reference is made to... Figure 3 and Figure 4 The encapsulation layer 30 also includes a first inorganic encapsulation layer 302 and a second inorganic encapsulation layer 303; the first inorganic encapsulation layer 302 is located on the side of the organic encapsulation layer 301 close to the substrate 10, and the second inorganic encapsulation layer 303 is located on the side of the organic encapsulation layer 301 away from the substrate 10.

[0032] The first inorganic material of the first inorganic encapsulation layer 302 and the second inorganic material of the second inorganic encapsulation layer 303 may be the same or different. For example, the first inorganic material of the first inorganic encapsulation layer 302 and / or the second inorganic material of the second inorganic encapsulation layer 303 may include, but are not limited to, at least one of silicon nitride, silicon oxide, and silicon oxynitride. By providing the first inorganic encapsulation layer 302 on the side of the organic encapsulation layer 301 close to the substrate 10, the first inorganic encapsulation layer 302 can be closely attached to the surface of the display functional layer 20 to fill the minor defects on the surface of the display functional layer 20. The first inorganic encapsulation layer 302 has high density, thereby providing a certain degree of barrier effect against water vapor and oxygen entering from the side of the organic encapsulation layer 301 away from the substrate 10. Meanwhile, by providing a second inorganic encapsulation layer 303 on the side of the organic encapsulation layer 301 away from the substrate 10, and in the direction Z perpendicular to the light-emitting surface of the display panel 100, the second inorganic encapsulation layer 303 can cover the organic encapsulation layer 301, thereby forming a dense moisture and oxygen barrier film layer on the side of the organic encapsulation layer 301 away from the substrate 10, preventing moisture and oxygen from entering the display functional layer 20 and damaging the devices in the display functional layer 20.

[0033] Meanwhile, since the first inorganic encapsulation layer 302 and the second inorganic encapsulation layer 303 are typically formed by deposition, both have relatively thin thicknesses and can only fill minor defects. When the surface of the display functional layer 20 facing away from the substrate 10 has high protrusions and / or deep depressions, such as the step difference formed between the support pillar 21 and the pixel 22, or deep scratches and high protrusions caused by the vapor deposition mask on the surface of the support pillar 21, the first inorganic encapsulation layer 302 cannot be used to fill these defects, and it is easy for the first inorganic encapsulation layer 302 to break or be damaged, making it impossible for the first inorganic encapsulation layer 302 to form a complete film structure. At this time, by setting the organic encapsulation layer 301 located on the side of the first inorganic encapsulation layer 302 away from the substrate 10 to have sufficient thickness, the organic encapsulation layer 301 can cover and fill the protrusions and depressions that the first inorganic encapsulation layer 302 cannot fill, ensuring that the side of the organic encapsulation layer 301 away from the substrate 10 has a relatively flat surface, so that the second inorganic encapsulation layer 303 can be formed on a relatively flat surface, preventing protrusions and / or depressions from damaging the integrity of the second inorganic encapsulation layer 303, ensuring that the second inorganic encapsulation layer 303 can effectively block water vapor and oxygen, thereby improving the display effect and service life of the display panel.

[0034] It is understood that, since both the first inorganic encapsulation layer 302 and the second inorganic encapsulation layer 303 have the function of blocking water vapor and oxygen, it is possible for a portion of the first inorganic encapsulation layer 302 and / or the second inorganic encapsulation layer 303 to be located on the side of the barrier structure RW away from the display area AA. The specific design can be made according to actual needs, and the embodiments of the present invention do not impose specific limitations on this.

[0035] Based on the above embodiments, optionally, refer to Figure 5 The display panel 100 may further include a touch function layer 40, which may include patterned touch electrodes 401 and touch traces (not shown in the figure). The touch electrodes 401 can detect the touch position, enabling the display panel 100 to have touch functionality. The touch function layer 40 may be located on the side of the encapsulation layer 30 facing away from the substrate 10. When the organic encapsulation layer 301 in the encapsulation layer 30 has sufficient thickness to fill the depressions or protrusions of the display function layer 20, so that the side of the organic encapsulation layer 301 facing away from the substrate 10 has a relatively flat surface, the touch function layer 40 can be formed on this relatively flat surface, ensuring the integrity of the touch function layer 40. This prevents touch trace breakage and / or touch electrode 401 damage during the patterning of the touch electrodes 401 and touch traces in the touch function layer 40, thereby ensuring the accuracy of touch detection.

[0036] Continue to refer to Figures 3 to 5 The substrate 10 may include a rigid substrate or a flexible substrate. The rigid substrate may be made of glass, and the flexible substrate may be made of materials including but not limited to polyimide. When the substrate 10 includes a flexible substrate, the substrate 10 has the characteristics of being bendable, foldable, and rollable, so that the display panel 100 including the substrate 10 can also have the characteristics of being bendable, foldable, and rollable. In this case, at least a portion of the non-display area NA of the display panel 100 can be bent to the side away from the light-emitting surface of the display panel 100, thereby reducing the size of the non-display area NA on the light-emitting surface side, which is beneficial for the narrow bezel of the display panel 100.

[0037] In an alternative embodiment, such as Figure 6 As shown, the non-display area NA includes a first flat area NA1, at least one bent area NA3, and at least one second flat area NA2; the first flat area NA1 is connected to the second flat area NA2 through the bent area NA3; the second flat area NA2 is opposite to the first flat area NA1 along the second direction Z; the second direction Z is perpendicular to the light-emitting surface of the display panel 100.

[0038] The first flat area NA1 can connect the bending area NA3 and the display area AA. The second flat area NA2 can be located on the side of the first flat area NA1 away from the light-emitting surface of the display panel 100. At least one second flat area NA2 includes a bonding area for setting the driver chip and / or circuit board and other devices 40. The bonding area can be provided with corresponding bonding pads so that after the driver chip and / or circuit board and other devices 40 are set in the bonding area, the driver chip and / or flexible circuit board and other devices 40 can provide display control signals to the pixels located in the display area AA through the bonding pads and the signal lines set in the second flat area NA2, bending area NA3 and first flat area NA1 in sequence, so as to control the display light emission state of the pixels in the display area AA. Thus, by placing the device for controlling the display emission of pixels in the display area AA in the second flat area NA2, and bending the second flat area NA2 away from the light-emitting surface of the display panel 100, a smaller size of the non-display area NA is visible from the light-emitting surface of the display panel 100, which is beneficial to the narrow bezel and high screen ratio of the display panel 100.

[0039] It is understood that the non-display area NA includes at least one bent area NA3 and at least one second straight area NA2. That is, the non-display area NA may include one or more bent areas NA3 and one or more second straight areas NA2, and the number of bent areas NA3 may be the same as the number of second straight areas NA3. The number of bent areas NA3 and the number of second straight areas NA3 in the non-display area NA can be designed according to actual needs, and the embodiments of the present invention do not specifically limit this.

[0040] In an alternative embodiment, reference is made to... Figures 6 to 8 The non-display area NA may include a first non-display area NAA, a second non-display area NAB, and a third non-display area NAC; the first non-display area NAA is arranged along the third direction Y with the display area AA; the second non-display area NAB and the third non-display area NAC are located on opposite sides of the display area AA along the fourth direction X; the third direction Y intersects with the fourth direction X.

[0041] The first straight area NA1 includes a first straight area NAA1, a second straight area NAB1, and a third straight area NAC1; the second straight area NA2 includes a first straight area NAA2, a second straight area NAB2, and a third straight area NAC2; the bent area NA3 includes a first bent area NAA3, a second bent area NAB3, and a third bent area NAC3; the first non-display area NAA includes a first straight area NAA1, a first bent area NAA2, and a first second straight area NAA3; the first straight area NAA1 is connected to the first second straight area NAA2 through the first bent area NAA3, and the first straight area NAA1 and the first second straight area NAA2 are along... The second non-display area NAB includes a second first straight area NAB1, a second bent area NAB3, and a second second straight area NAB2; the second first straight area NAB1 is connected to the second second straight area NAB2 through the second bent area NAB3, and the second first straight area NAB1 and the second second straight area NAB2 are opposite each other along the second direction Z; the third non-display area NAC includes a third first straight area NAC1, a third bent area NAC3, and a third second straight area NAC2; the third first straight area NAC1 is connected to the third second straight area NAC2 through the third bent area NAC3, and the third first straight area NAC1 and the third second straight area NAC2 are opposite each other along the second direction Z.

[0042] When the non-display area NA includes a first non-display area NAA, a second non-display area NAB, and a third non-display area NAC, these three areas can be distributed on different sides of the display area NA, allowing them to be used to house different devices. For example, the first non-display area NAA can have a first bonding pad located in the first / second flat area NAA2. This first bonding pad can be used to bond the first circuit board 41, receiving data signals and power signals transmitted from the first circuit board 41, and providing these signals to the pixels in the display area AA to control the pixel's display brightness. Similarly, the second non-display area NAB can have a second bonding pad located in the second / second flat area NAB2, and this second bonding pad can be used to bond the second circuit board 42. The first circuit board 41 receives clock signals and power signals transmitted from the second circuit board 42, and controls the corresponding driving circuit to provide gate driving signals to the pixels according to the received signals, thereby controlling the display light-emitting state of the pixels. A third bonding pad can be provided in the third non-display area NAC, and the third bonding pad can be located in the third second flat area NAC2. The third bonding pad can be used to bond the third circuit board 43 to receive clock signals and power signals transmitted from the third circuit board 42, and control the corresponding driving circuit to provide gate driving signals to the pixels according to the received signals, thereby controlling the display light-emitting state of the pixels. The second circuit board 42 and the third circuit board 43 can be electrically connected to the first circuit board 41 through connectors, etc. The first circuit board 41 can also be electrically connected to the system motherboard. In this case, the driving chip can be set on the first circuit board 41, or the driving chip and the first circuit board 41 can be respectively set in different areas of the first and second flat areas NAC2, so that the first circuit board 41 receives the display control signals provided by the system motherboard and provides these display control signals to the driving chip, the second circuit board 42, and the third circuit board 43 respectively, so that the display control signals can be provided to the pixels through each device, enabling the pixels to accurately display light emission. In this way, by combining the signals transmitted from the first circuit board 41, the second circuit board 42 and the third circuit board 43, the pixels can be controlled to display and emit light accordingly.

[0043] Meanwhile, the first circuit board 41 can be bent along with the first and second flat areas NAA2 to the side away from the light-emitting surface of the display panel 100, the second circuit board 42 can be bent along with the second and second flat areas NAB2 to the side away from the light-emitting surface of the display panel 100, and the third circuit board 43 can be bent along with the third and second flat areas NAC2 to the side away from the light-emitting surface of the display panel 100, so as to reduce the area ratio of the non-display area NA in the light-emitting side of the display panel 100 and relatively increase the proportion of the display area AA in the light-emitting side of the display panel 100, so that the display panel 100 has a narrower bezel size and improves the display effect of the display panel 100.

[0044] Furthermore, the non-display area NA may also include a fourth non-display area NAD, which, along with the first non-display area NAA, can be located on opposite sides of the display area AA along a third direction Y. The fourth non-display area NAD may only include the fourth first flat area NAD1, and may not have corresponding bonding pads, allowing it to have a smaller width and eliminating the need to bend to the side of the display panel 100 away from its light-emitting surface. In this case, the display panel 100 is a three-sided bent, extremely narrow bezel display panel. Simultaneously, on the light-emitting side of the display panel 100, the display area AA is surrounded by non-display areas, ensuring a narrow bezel size on the light-emitting side of the display panel 100 while maintaining the uniformity of the overall bezel of the display panel 100.

[0045] In another alternative embodiment, refer to Figure 6 , Figure 9 and Figure 10 The non-display area NA includes a first non-display area NAA, a second non-display area NAB, a third non-display area NAC, and a fourth non-display area NAD; the first non-display area NAA and the fourth non-display area NAD are located on opposite sides of the display area AA along the third direction Y; the second non-display area NAB and the third non-display area NAC are located on opposite sides of the display area AA along the fourth direction X; the third direction Y intersects with the fourth direction X.

[0046] The first flat area NA1 includes a first flat area NAA1, a second flat area NAB1, and a third flat area NAC1; the second flat area NA2 includes a first flat area NAA2, a second flat area NAB2, and a third flat area NAC2; the bent area NA3 includes a first bent area NAA3, a second bent area NAB3, and a third bent area NAC3; the first non-display area NAA includes a first flat area NAA1, a first bent area NAA2, and a first second flat area NAA3; the first flat area NAA1 is connected to the first second flat area NAA2 through the first bent area NAA3, and the first flat area NAA1 and the first second flat area NAA2 are opposite each other along the second direction Z; the second non-display area NAB includes a second flat area NAB1, a second bent area NAB3, and a second flat area NAB2; the second flat area NAA1... The straight area NAB1 is connected to the second straight area NAB2 via the second bent area NAB3, and the second straight area NAB1 and the second straight area NAB2 are opposite each other along the second direction Z; the third non-display area NAC includes the third straight area NAC1, the third bent area NAC3 and the third straight area NAC2; the third straight area NAC1 is connected to the third straight area NAC2 via the third bent area NAC3, and the third straight area NAC1 and the third straight area NAC2 are opposite each other along the second direction Z; the fourth non-display area NAD includes the fourth straight area NAD1, the fourth bent area NAD3 and the fourth straight area NAD2; the fourth straight area NAD1 is connected to the fourth straight area NAD2 via the fourth bent area NAD3, and the fourth straight area NAD1 and the fourth straight area NAD2 are opposite each other along the second direction Z.

[0047] The devices and bending methods set in the first non-display area NAA, the second non-display area NAB, and the third non-display area NAC can be referred to the description above and will not be repeated here. Here, only the devices and bending methods set in the fourth non-display area NAD, which have different setting methods in the above embodiments, are illustrated by example.

[0048] For example, a fourth bonding pad can be provided in the fourth non-display area NAD, and the fourth bonding pad can be located in the fourth second flat area NAD2. The fourth bonding pad can be used to bond the fourth circuit board 44 to receive signals transmitted by the fourth circuit board 44, and provide the received signals to the pixels in the display area AA to control the pixel display and light emission. The signals transmitted by the fourth circuit board 44 can be the same as at least part of the signals transmitted by the first circuit board 41. The fourth circuit board 44 can be directly electrically connected to the first circuit board 41, or the fourth circuit board 44 can be electrically connected to the first circuit board 41 through the second circuit board 42 and / or the third circuit board 43. The specific design can be customized according to actual needs, and this embodiment of the invention does not impose specific limitations on this. Simultaneously, the fourth circuit board 44 and the fourth bonding pad can be bent along the fourth second flat area ND4 to the side away from the light-emitting surface of the display panel 100, making the display panel a four-sided bent display panel, meeting the requirement of a narrow bezel for the display panel 100 and improving the display effect of the display panel 100.

[0049] It is understood that the above description only exemplifies display panels with three-sided and four-sided bends. In the embodiments of the present invention, the specific bending method of the display panel can be designed according to actual needs, and the embodiments of the present invention do not impose specific limitations on this. For ease of description, unless otherwise specified, the embodiments of the present invention all use a display panel with three-sided bends as an example to illustrate the technical solutions of the embodiments of the present invention.

[0050] In an optional embodiment, the reference continues... Figures 6 to 8 When the display functional layer 20 also includes a barrier structure RW, the barrier structure RW can be located in the first flat area NA1, that is, the barrier structure RW can be located on the side of the bending area NA3 near the display area AA. In this case, the barrier structure RW can be used to block the organic encapsulation layer 301 from extending into the bending area NA3, that is, the organic encapsulation layer 301 terminates at the side of the barrier structure RW away from the bending area NA3, preventing the organic encapsulation layer 301 from extending into the bending area NA3 and forming a moisture and oxygen transmission path from the edge of the display panel to the display area AA after bending in the bending area NA3. Thus, by setting the barrier structure RW in the first flat area NA1, while ensuring a small bezel size on the light-emitting side of the display panel 100, the moisture and oxygen transmission path can be effectively blocked, thereby improving the display effect and lifespan of the display panel 100.

[0051] Understandably, because the barrier structure RW is located in the first flat area NA1, there is a small distance between the barrier structure RW and the display area AA. When forming the organic encapsulation layer 301 using inkjet printing, to prevent the organic material from crossing the barrier structure RW, the inkjet printing positions can be set as far away from the barrier structure RW as possible. In this case, the distance L between the preset position closest to the barrier structure RW and the non-display area NA can be set to L≥150μm, meaning there is a considerable distance between each inkjet printing position and the barrier structure RW. Because the film thickness gradually decreases as the inkjet-printed organic material flows, when it flows to the non-display area NA near the display area AA on the side of the barrier structure RW, a thinner organic encapsulation layer 301 can be formed, ensuring that the organic encapsulation layer 301 cannot cross the barrier structure RW and guaranteeing the encapsulation effect. Furthermore, when the distance between the preset position closest to the baffle structure RW in each inkjet printing position and the non-display area NA is large, resulting in a large distance between the position of the support pillar 21 located in the display area AA near the non-display area NA and the inkjet printing position, a single inkjet print may not be able to cover the support pillar 21 located in the display area AA near the non-display area NA. This results in a thinner organic encapsulation layer 301 on the side of the support pillar 21 facing away from the substrate 10. In this case, multiple inkjet prints can be used to allow the organic material to flow multiple times until the organic encapsulation layer 301 on the side of the support pillar 21 located in the display area AA near the non-display area NA facing away from the substrate 10 has sufficient thickness. Alternatively, after a single inkjet print, an organic material layer can be added to the side of the support pillar 21 located in the display area AA near the non-display area NA facing away from the substrate 10 using photolithography or other processes, so that the organic encapsulation layer 301 composed of the added organic material layer and the inkjet-printed organic material layer has sufficient thickness.

[0052] In an alternative embodiment, such as Figure 11 and Figure 12 As shown, the organic encapsulation layer 301 includes a first organic encapsulation layer 3011 and a second organic encapsulation layer 3012 stacked together; in the direction Z perpendicular to the light-emitting surface of the display panel 100, the first organic encapsulation layer 3011 covers each pixel 22 and at least a portion of the support pillars 21; the support pillars 21 include a first type of support pillar 211 and a second type of support pillar 212 located on the side of the first type of support pillar 211 closer to the non-display area NA; in the direction Z perpendicular to the light-emitting surface of the display panel 100, the second organic encapsulation layer 3012 covers at least a portion of the second type of support pillar 212.

[0053] In this embodiment, the first organic material of the first organic encapsulation layer 3011 and the second organic material of the second organic encapsulation layer 3012 can be the same or different, allowing the fabrication methods of the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 to be the same or different, and can be designed according to actual needs. In one exemplary embodiment, both the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 can be formed by inkjet printing, in which case the first organic material of the first organic encapsulation layer 3011 and the second organic material of the second organic encapsulation layer 3012 can be the same. In another exemplary embodiment, the first organic encapsulation layer 3011 can be formed by inkjet printing, and the second organic encapsulation layer 3012 can be formed by photolithography or other processes, in which case the first organic material of the first organic encapsulation layer 3011 and the second organic material of the second organic encapsulation layer 3012 can be different.

[0054] The first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 are stacked, meaning that the first organic encapsulation layer 3011 can be located on the side of the second organic encapsulation layer 3012 that is away from the substrate 10, or the second organic encapsulation layer 3012 can be located on the side of the first organic encapsulation layer 3011 that is away from the substrate 10. When the first organic encapsulation layer is located on the side of the second organic encapsulation layer 3012 that is away from the substrate 10, the second organic encapsulation layer 3012 can be formed at a specific position based on experience, and then the first organic encapsulation layer 3011 can be formed by inkjet printing, so that the sum of the thickness of the first organic encapsulation layer 3011 and the thickness of the second organic encapsulation layer 3012 meets the thickness requirement of the organic encapsulation layer 301. When the second organic encapsulation layer 3012 is located on the side of the first organic encapsulation layer 3011 away from the substrate 10, after the first organic encapsulation layer 3011 is formed by inkjet printing, the thickness of the first organic encapsulation layer 3011 or the surface flatness is detected. Based on the thickness or surface flatness of the first organic encapsulation layer 3011, the second organic encapsulation layer 3012 is added at the position where the thickness of the first encapsulation layer 3011 is thinner or the flatness is poor. This ensures that the organic encapsulation layer 301 at each position has sufficient thickness and surface flatness, and accurately controls the overall thickness of the organic encapsulation layer 301, which is beneficial to the thinning of the display panel 100.

[0055] Understandably, because the second type of support pillar 212 is located on the side of the first type of support pillar 211 closer to the non-display area NA, the second type of support pillar 212 is closer to the edge of the display area AA. When forming the first organic encapsulation layer 3011 by inkjet printing, in order to prevent the first organic encapsulation layer 3011 from crossing the barrier structure RW, the printing positions for inkjet printing of the first organic encapsulation layer 3011 are all far away from the edge of the display area AA. When the distance between the location of the second type of support pillar 212 and the printing position of the organic material of the inkjet-printed first organic encapsulation layer 3011 in the first direction X / Y is large, the organic material flowing to the second type of support pillar 212 of the first organic encapsulation layer 3011 has a thinner thickness, so that the first organic encapsulation layer 3011 on the side of the second type of support pillar 212 away from the substrate 10 has a thinner thickness. At this time, in the direction Z perpendicular to the light-emitting surface of the display panel 100, by setting the second organic encapsulation layer 3012 to cover at least part of the second type of support pillar 212, the second organic encapsulation layer 3012 can supplement the thickness of the organic encapsulation layer 301 on the side of the second type of support pillar 212 away from the substrate 10, ensuring that the side of the second type of support pillar 212 away from the substrate 10 has a sufficiently thick organic encapsulation layer 301, and ensuring the encapsulation effect of the encapsulation layer 30.

[0056] Taking the second organic encapsulation layer 3012 located on the side of the first organic encapsulation layer 3011 away from the substrate 10 as an example, when the second organic encapsulation layer 3012 is also formed by inkjet printing, for the position of the first organic encapsulation layer 3011 with a relatively thin thickness, the second organic material of the second organic encapsulation layer 3012 can be inkjet printed again, so that the second organic encapsulation layer 3012 is formed on the side of the first organic encapsulation layer 3011 away from the substrate 10, so that the second organic material of the second organic encapsulation layer 3012 can continue to accumulate on the basis of the first organic material of the first organic encapsulation layer 3011, so as to increase the overall thickness of the organic encapsulation layer 301 on the side of the second type of support pillar 212 away from the substrate 10. When the second organic encapsulation layer 3012 is formed through patterning processes such as photolithography, a complete second organic material layer can be formed. After exposing the second organic material layer with an exposure mask, it is developed using a developer. The second organic material layer at the thinner positions of the first organic encapsulation layer 3011 is retained, while the second organic material layer at the thicker positions of the first organic encapsulation layer 3011 is removed, thus achieving patterning of the second organic material layer. The retained second organic material layer is the second organic encapsulation layer 3012. At this time, the overall thickness of the organic encapsulation layer 301 on the side of the second type of support pillar 212 facing away from the substrate 10 can also be increased. In this way, by making the organic encapsulation layer 301 include the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 stacked together, the second organic encapsulation layer 3012 can supplement the thickness of the first organic encapsulation layer 3011, so that the organic encapsulation layer 301 at each position has a large thickness, thereby improving the overall encapsulation effect of the encapsulation layer 30, which is beneficial to the display effect and service life of the display panel 100.

[0057] Based on the above embodiments, optionally, refer to the following: Figure 11 and Figure 12 In the direction Z perpendicular to the light-emitting surface of the display panel 100, the thickness T2 of the second organic encapsulation layer 3012 overlapping with the second type of support pillar 212 ranges from 2μm≤T2≤3μm.

[0058] When the thickness of the second organic encapsulation layer 3012 is relatively thin, the thickness of the organic encapsulation layer 301 on the side of the second type of support pillar 212 away from the substrate 10 may be insufficient. This could result in the organic encapsulation layer 301 failing to fill in scratches or other uneven structures on the surface of the second type of support pillar 212 away from the substrate 10, causing these scratches or uneven structures to pierce the inorganic film layer such as the second inorganic encapsulation layer 303, thus affecting the encapsulation effect. The second organic encapsulation layer 3012... When the thickness is relatively large, the stacked thickness of the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 is relatively large, which is not conducive to the thinning of the display panel 100. At the same time, the overall organic encapsulation layer 301 on the side of the second type of support pillar 212 away from the substrate 10 may form a protrusion, so that there is a step difference between the organic encapsulation layer 301 at the location of the second type of support pillar 212 and the organic encapsulation layer 301 at other locations around it, which is not conducive to the surface flatness of the organic encapsulation layer 301 on the side away from the substrate 10.

[0059] Specifically, by setting the thickness T2 of the second organic encapsulation layer 3012 overlapping with the second type of support pillar 212 to be greater than or equal to 2 μm, the second organic encapsulation layer 3012 can supplement the thickness of the first organic encapsulation layer 3011, so that the total thickness of the stacked first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 meets the coverage requirements of scratches and other uneven structures on the surface of the second type of support pillar 212 away from the substrate 10. At the same time, by setting the thickness T2 of the second organic encapsulation layer 3012 overlapping with the second type of support pillar 212 to be less than or equal to 3 μm, after supplementing the second organic encapsulation layer 3012 on the side of the second type of support pillar 212 away from the substrate 10, the organic encapsulation layer 301 on the side of the second type of support pillar 212 away from the substrate 10 can still maintain a small total thickness, preventing the organic encapsulation layer 301 on the side of the second type of support pillar 212 away from the substrate 10 from being obviously convex, thereby ensuring the flatness of the surface of the organic encapsulation layer 301 on the side of the organic encapsulation layer 301 away from the substrate 10. Thus, by setting the thickness T2 of the second organic encapsulation layer 3012 overlapping with the second type of support pillar 212 to satisfy 2μm≤T2≤3μm, the flatness of the surface of the organic encapsulation layer 301 facing away from the substrate 10 can be ensured, thereby improving the encapsulation effect of the encapsulation layer 30.

[0060] Optional, such as Figure 13As shown, the first organic encapsulation layer 3011 includes a first portion 3011A and a second portion 3011B; in the direction Z perpendicular to the light-emitting surface of the display panel 100, the first portion 3011A overlaps with the first type of support pillar 211, and the second portion 3011B overlaps with the second type of support pillar 212; in the direction Z perpendicular to the light-emitting surface of the display panel 100, the thickness of the first portion 3011A is T11, and the thickness of the second portion 3011B is T12; wherein, T11≥T12.

[0061] Understandably, when forming the first organic encapsulation layer 3011 using inkjet printing, the inkjet printing positions can be set based on the coverage area of ​​the first organic material ejected by the inkjet printer nozzle. This allows the flow range of the first organic material printed at two adjacent printing positions to overlap, ensuring the continuity and flatness of the formed first organic encapsulation layer 3011. In this case, when inkjet printing positions are set around each location in the display area AA, which is far from the non-display area NA, the first organic material printed at each of the surrounding printing positions can flow to that location, allowing a thicker first organic encapsulation layer 3011 to accumulate there. However, when a printing position is set on one side of each location in the display area AA, which is close to the non-display area NA, only the organic material printed at the printing position on that side can accumulate at that location, resulting in a thinner first organic encapsulation layer 3011 at that location.

[0062] Since the second type of support pillar 212 is located on the side of the first type of support pillar 211 closer to the non-display area NA, when each printing position of the inkjet printing is located on the side of the second type of support pillar 212 away from the non-display area NA, the position of the second type of support pillar 212 can only accumulate the first organic material printed at the printing position on the side away from the non-display area NA, so that the second part 3011B of the first organic encapsulation layer 3011 on the side of the second type of support pillar 212 away from the substrate 10 has a thinner thickness; while the position of the first type of support pillar 211 can accumulate the first organic material at each printing position around it, and the distance between the position of the first type of support pillar 211 and the printing position is closer, so that the first part 3011A of the first organic encapsulation layer 3011 on the side of the first type of support pillar 211 away from the substrate 10 has a thicker thickness. At this time, a second organic encapsulation layer 3012 can be added to the side of the second type of support pillar 211 facing away from the substrate 10, while no second organic encapsulation layer 3012 needs to be added to the side of the first type of support pillar 211 facing away from the substrate 10. This makes the overall thickness of the organic encapsulation layer 301 on the side of the second type of support pillar 212 facing away from the substrate 10 consistent with the overall thickness of the organic encapsulation layer 301 on the side of the first type of support pillar 211 facing away from the substrate 10. This helps to improve the flatness of the surface of the organic encapsulation layer 301 facing away from the substrate 10, and thus helps to improve the encapsulation effect of the encapsulation layer 30.

[0063] Based on the above embodiments, optionally, refer to the following: Figure 13 In the direction Z perpendicular to the light-emitting surface of the display panel 100, the stack thickness of the second part 3011B and the second organic encapsulation layer 3012 is T20; wherein, T20≤T11.

[0064] Specifically, by setting T20≤T11, after adding the second organic encapsulation layer 3012 to the side of the second type of support pillar 212 facing away from the substrate 10, the overall thickness of the organic encapsulation layer 301 on this side remains relatively small. This prevents the organic encapsulation layer 301 on the side of the second type of support pillar 212 facing away from the substrate 10 from becoming too thick after adding the second organic encapsulation layer 3012, thus avoiding a large step difference between it and the organic encapsulation layers 301 in other surrounding locations. This setting helps improve the flatness of the surface of the organic encapsulation layer 301 facing away from the substrate 10, thereby improving the encapsulation effect of the encapsulation layer 30.

[0065] Optional, such as Figure 14As shown, the organic encapsulation layer 301 also includes a third organic encapsulation layer 3013 located on the side of the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 away from the substrate 10; in the direction Z perpendicular to the light-emitting surface of the display panel 100, the third organic encapsulation layer 3013 overlaps with at least a portion of the second organic encapsulation layer 3012.

[0066] The third organic material of the third organic encapsulation layer 3013 may be the same as or different from the first organic material of the first organic encapsulation layer 3011 and / or the second organic material of the second organic encapsulation layer 3012. Furthermore, the fabrication process of the third organic encapsulation layer 3013 may be the same as or different from the fabrication processes of the first organic encapsulation layer 3011 and / or the second organic encapsulation layer 3012. The specific process can be designed according to actual needs, and this embodiment of the invention does not impose specific limitations on it. In one exemplary embodiment, the first organic encapsulation layer 3011, the second organic encapsulation layer 3012, and the third organic encapsulation layer 3013 can all be formed by inkjet printing. In another exemplary embodiment, the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 can be formed by inkjet printing, and the third organic encapsulation layer 3013 can be formed by photolithography.

[0067] Specifically, by providing a third organic encapsulation layer 3013 on the side of the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 away from the substrate 10, the third organic encapsulation layer 3013 can further supplement the thickness of the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012, so that the organic encapsulation layer 301 has sufficient thickness to fill the uneven structure at various positions, and the surface of the organic encapsulation layer 301 away from the substrate 10 has a high degree of flatness, which is beneficial to improving the encapsulation effect of the encapsulation layer 30, and thus beneficial to improving the display effect and service life of the display panel.

[0068] In other alternative embodiments, such as Figure 15 As shown, the organic encapsulation layer 301 may also include only the first organic encapsulation layer 3011 and the third organic encapsulation layer 3012 stacked together. Under the premise of ensuring the overall thickness and surface flatness of the organic encapsulation layer 30, the specific structure of the organic encapsulation layer 301 is not limited in the embodiments of the present invention.

[0069] In an alternative embodiment, reference is made to... Figure 11The display area AA includes a first display area AA1 and a second display area AA2 located on the side of the first display area AA1 closer to the non-display area NA; in the arrangement direction of the first display area AA1, the second display area AA2 and the non-display area NA, the width of the second display area AA2 is d; wherein, 200μm≤d≤400μm; a first type of support column 211 is located in the first display area AA1, and a second type of support column 212 is located in the second display area AA2.

[0070] It is understood that the second display area AA2 is located between the first display area AA1 and the non-display area NA, and the second display area AA2 can connect the first display area AA1 and the non-display area AA, making the first display area AA1, the second display area AA2, and the non-display area NA a continuous region. In this case, by setting a first type of support pillar 211 in the first display area AA1 and a second type of support pillar 212 in the second display area AA2, the second type of support pillar 212 can exist near the edge of the non-display area NA, and the first type of support pillar 211 can exist near the center of the display area AA. This ensures that when the first type of support pillar 211 and the second type of support pillar 212 simultaneously support the vapor deposition mask, all positions of the vapor deposition mask can be supported. Therefore, when forming the light-emitting elements of the pixel 22 using the vapor deposition mask, it is beneficial to the accuracy of the formation position of the light-emitting elements of the pixel 22, thereby improving the display effect of the display panel 100.

[0071] The width d of the second display area AA2 is in the range of 200μm≤d≤400μm. When the first organic encapsulation layer 3011 and / or the second organic encapsulation layer 3012 are formed by inkjet printing, the distance between the inkjet printing position and the non-display area NA in the arrangement direction of the first display area AA1, the second display area AA2 and the non-display area NA can be greater than or equal to d. This ensures that the inkjet printing position is far away from the non-display area NA, reducing the amount of organic material flowing to the non-display area NA. This allows the non-display area NA to have a thinner organic encapsulation layer 301, thus preventing the organic encapsulation layer 301 from crossing the barrier structure RW and reaching the edge of the display panel 100. At the same time, by supplementing the second organic encapsulation layer 3012 on at least one side of the second type of support pillar 212 away from the substrate 10 in the second display area AA2, the side of the second type of support pillar 212 away from the substrate 10 has sufficient organic encapsulation layer 301 thickness, which is beneficial to improving the encapsulation effect and the display effect and service life of the display panel.

[0072] In another alternative embodiment, refer to Figure 16 and Figure 17As shown, when the display area AA includes a first display area AA1 and a second display area AA2 located on the side of the first display area AA1 closer to the non-display area NA, and the width d of the second display area AA2 in the arrangement direction of the first display area AA1, the second display area AA2 and the non-display area NA satisfies 200μm≤d≤400μm, the first type of support column 211 and the second type of support column 212 can both be located in the first display area AA1, and the second display area AA2 is not provided with support column 22.

[0073] In this configuration, both the first type of support pillar 211 and the second type of support pillar 212 are located in the first display area AA1, meaning all support pillars 21 are located in the first display area AA1, while the second display area AA2 does not have any support pillars 22. Furthermore, the width d of the second display area AA2 ranges from 200μm to 400μm. When inkjet printing is used to form the first organic encapsulation layer 3011 and / or the second organic encapsulation layer 3012, the distance between the inkjet printing position and the non-display area NA in the arrangement direction of the first display area AA1, the second display area AA2, and the non-display area NA can be greater than or equal to d. This ensures that the inkjet printing positions are all far from the non-display area NA, reducing the amount of organic material flowing to the non-display area NA and allowing the non-display area NA to have a thinner organic encapsulation layer 301, thereby preventing the organic encapsulation layer 301 from exceeding the barrier. The structure RW reaches the edge of the display panel 100; at the same time, by setting both the first type of support pillar 211 and the second type of support pillar 212 in the first display area AA1, the distance between the location of the first type of support pillar 211 and the second type of support pillar 212 and the printing position is relatively short. This allows the organic material flowing to the first type of support pillar 211 and the second type of support pillar 212 to accumulate a large thickness. This ensures that the side of the first type of support pillar 211 and the second type of support pillar 212 away from the substrate 10 has a sufficient thickness of organic encapsulation layer 301, which is beneficial to improving the encapsulation effect, as well as improving the display effect and service life of the display panel.

[0074] In another alternative embodiment, reference continues... Figure 16 and Figure 17When the display area AA includes a first display area AA1 and a second display area AA2 located on the side of the first display area AA1 close to the non-display area NA, and the width d of the second display area AA2 in the arrangement direction of the first display area AA1, the second display area AA2 and the non-display area NA satisfies 200μm≤d≤400μm, if all the support pillars 21 are located in the first display area AA1, and the vertical projection of the inkjet printing position on the light-emitting surface of the display panel 100 is located in the first display area AA1, the organic encapsulation layer 301 can be formed by inkjet printing only once. This can also ensure that the organic encapsulation layer 301 on the side of each support pillar 21 away from the substrate 10 has sufficient thickness. This is beneficial to simplifying the preparation method of the organic encapsulation layer 301, simplifying the process of the display panel 100, improving the production efficiency of the display panel 100, and reducing the production cost.

[0075] Correspondingly, when all support pillars 21 are located in the first display area AA1, the second display area AA2 may not have support pillars 21. In this case, the second display area AA2 may only have pixels 22. Compared to the support pillars 21, the position of the pixels 22 is a recessed position. Due to the fluidity of the organic material of the organic encapsulation layer 301, it is not necessary for a large amount of organic material to flow to the second display area AA2 to meet the coverage requirements of the organic encapsulation layer 301 for the pixels 22 in the second display area AA2. This allows the surface of the organic encapsulation layer 301 facing away from the substrate 10 to have high flatness, which is beneficial to improving the encapsulation effect, as well as the display effect and service life of the display panel.

[0076] In an alternative embodiment, reference continues. Figure 16 and Figure 17 When the surface of the support column 21 facing away from the substrate 10 is the first surface 20A, and the surface of the display functional layer 20 in the second display area AA2 facing away from the substrate 10 is the second surface 20B, in the direction Z perpendicular to the light-emitting surface of the display panel 100, the distance between the first surface 20A and the substrate 10 is the first height H1, and the distance between the second surface 20B and the substrate 10 is the second height H2, and the first height H1 is greater than the second height H2.

[0077] Since the support pillar 21 is used to support the vapor deposition mask for preparing the light-emitting element D of the pixel 22, the area where the support pillar 21 is located is a raised structure compared to the area where the light-emitting element D of the pixel 22 is set. This results in a larger first height H1 between the first surface 20A of the support pillar 21 away from the substrate 10 and the substrate 10, while the second surface 20B of the second display area AA2 has a smaller first height H1. This allows the second display area AA2 to be without the support pillar 21. In other words, in the arrangement direction of the first display area AA1, the second display area AA2, and the non-display area NA, the distance between the support pillar 21 and the non-display area NA is at least greater than or equal to the width of the second display area AA2. In other words, the support pillar 21 can be recessed. This ensures that when the inkjet printing position is located on the side of the second display area AA2 away from the non-display area NA, the side of each support pillar 21 away from the substrate 10 has a sufficiently thick organic encapsulation layer 301, ensuring the encapsulation effect of the encapsulation layer 30. This, in turn, helps to improve the display effect and lifespan of the display panel.

[0078] Optional, continue to refer to Figure 16 When all support pillars 21 are located in the first display area AA1, and no support pillars 21 are provided in the second display area AA2, the second display area AA2 can be arranged around the first display area AA1. That is, no support pillars 21 are provided in the second display area AA2 surrounding the first display area AA1, so that the distance between each support pillar 21 and the non-display area NA can be greater than or equal to the width of the second display area AA2. When forming the organic encapsulation layer using inkjet printing, it can be ensured that the surface of each support pillar 21 facing away from the substrate has a thicker organic encapsulation layer, thereby improving the encapsulation effect of the display panel 100, which in turn helps to improve the display effect and service life of the display panel.

[0079] In another alternative embodiment, such as Figure 18 As shown, the first display area AA1 may include a central area AA1A and a corner area AA1B; the second display area AA2 is located on the side of the central area AA1A closer to the non-display area AA1B, and the corner area AA1B is located between two adjacent second display areas AA2; the shortest distance between the support column 21A in the central area AA1A and the non-display area NA is d1, and the shortest distance between the support column 21B in the corner area AA1B and the non-display area NA is d2; where d1 ≥ d2. Thus, by retaining a support column 21B at the corner area AA1B that is closer to the non-display area NA, the support columns 21A in the central area AA1A and 21B in the corner area AA1B jointly support the vapor deposition mask, ensuring that the vapor deposition mask has a flat, unfolded state. This ensures the positional accuracy of the light-emitting elements formed by vapor deposition through the vapor deposition mask, thereby improving the display effect of the display panel 100.

[0080] It is understood that the above description is merely an example of the distribution of the support pillars in the display area. Provided that the organic encapsulation layer on the side of each support pillar away from the substrate has sufficient thickness, the present invention does not limit the distribution of the support pillars in the display area.

[0081] Based on the same inventive concept, this embodiment of the invention also provides a method for preparing a display panel, which is used to prepare the display panel provided in this embodiment of the invention, so that the display panel prepared by this method has a higher display effect and a longer service life.

[0082] Figure 19 This is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. Figure 20 This is a schematic diagram of the manufacturing process of a display panel according to an embodiment of the present invention, for reference. Figure 19 and Figure 20 The method for manufacturing a display panel provided in this embodiment of the invention includes: S110, Provides a substrate.

[0083] The substrate 10 can be a rigid substrate, in which case a substrate of the required size can be obtained by cutting a larger rigid substrate; the substrate 10 can also be a flexible substrate, in which case flexible materials such as polyimide can be coated on the rigid substrate and cured to form a flexible substrate.

[0084] S120. A display functional layer is formed on the substrate.

[0085] The display functional layer 20 includes multiple pixels 22 and multiple support pillars 21; both the pixels 22 and the support pillars 21 are located in the display area AA, and the support pillars 21 are located between the pixels 22.

[0086] Specifically, when the display functional layer 20 may include a circuit setting layer 201, a planarization layer 202, a pixel definition layer 203, a support pillar setting layer 204, and a light-emitting functional layer 205, the pixel circuit P of the pixel 22 can be formed in the circuit setting layer 201 through processes such as deposition, etching, and coating; an organic-inorganic planarization layer and an organic planarization layer of the planarization layer 202 are formed on the side of the circuit setting layer 201 facing away from the substrate 10, so that the inorganic planarization layer fills small defects and the organic planarization layer fills the uneven structure of the circuit setting layer 201; an anode layer of the light-emitting functional layer 205 is formed on the side of the planarization layer 202 facing away from the substrate 10, and the anode layer is patterned to form the anode 2051 of the light-emitting element D, and the anode of the light-emitting element D can be electrically connected to the pixel circuit P through a via penetrating the planarization layer 202; on the side of the planarization layer 202 facing away from the substrate 10, an organic-inorganic planarization layer and an organic planarization layer are formed, so that the inorganic planarization layer fills small defects and the organic planarization layer fills the uneven structure of the circuit setting layer 201; an organic-inorganic planarization layer and an organic planarization layer of the planarization layer 202 facing away from the substrate 10 ... anode layer of the light-emitting functional layer 205 is formed on the side of the planarization layer 202 facing away from the substrate 10, and the a A pixel definition layer 203 is formed on one side of the substrate 10. By patterning the pixel definition layer 203, a pixel opening is formed that exposes the anode 2051 of the light-emitting element D. A support pillar 21 is provided on the side of the pixel definition layer 203 away from the substrate 10. The position of the support pillar 21 does not overlap with the pixel opening. After forming the support pillar 21, a vapor deposition mask is placed on the side of the support pillar 21 away from the substrate 10, so that the support pillar 21 supports the vapor deposition mask. The light-emitting layer 2052 of the light-emitting element D is vapor deposited on the side of the vapor deposition mask away from the substrate 10, so that the light-emitting layer 2052 is formed in the pixel opening. After removing the vapor deposition mask, a cathode layer covering the support pillar 21, the pixel definition layer 203 and the light-emitting layer 2052 is formed by a deposition process. The cathode layer includes the cathode 2053 of the light-emitting element D. After the cathode of the light-emitting element D is formed, the display functional layer 20 is fabricated.

[0087] It is understood that the support pillars 21 and pixels 22 in the display functional layer 20 are both located in the display area AA, so that the support pillars 21 are not set in the non-display area NA. This eliminates the need to reserve a support pillar setting area in the non-display area NA, which helps to reduce the size of the non-display area NA and thus facilitates the narrow bezel of the display panel 100. Given that the support pillars 21 and pixels 22 are both located in the display area AA, this embodiment of the invention does not specifically limit the distribution of the support pillars 21 and pixels 22 in the display area AA.

[0088] In an alternative embodiment, reference is made to... Figure 16 or Figure 18When the display area AA includes a first display area AA1 and a second display area AA2 located on the side of the first display area AA1 close to the non-display area NA, and the width d of the second display area AA2 in the arrangement direction of the first display area AA1, the second display area AA2 and the non-display area NA satisfies 200μm≤d≤400μm, the support column 21 can be formed only in the first display area AA1, and the support column 21 can be not provided in the second display area AA2. That is, the support column 21 can be set inward relative to the edge of the display area AA.

[0089] In another alternative embodiment, such as Figure 18 As shown, the first display area AA1 includes a middle area AA1A and a corner area AA1B; the second display area AA2 is located on the side of the middle area AA1A closer to the non-display area NA; the corner area AA1B is located between two adjacent second display areas AA2; the shortest distance between the support pillar 21A formed in the middle area AA1A and the non-display area NA is d1, and the shortest distance between the support pillar 21B formed in the corner area AA1B and the non-display area NA is d2; where d1≥d2. In this case, compared to the edge of the display area AA, the support pillar 21A formed in the middle area AA1A can be recessed, while the support pillar 21B formed in the corner area AA1B can be closer to the edge of the display area AA, thereby improving the support capacity of the support pillar 21 for the vapor deposition mask, ensuring the flatness of the vapor deposition mask, and improving the accuracy of the formation position of the light-emitting layer 2052 of the light-emitting element D.

[0090] In another alternative implementation, refer to Figure 11 When the display area AA includes the first display area AA1 and the second display area AA2 located on the side of the first display area AA1 near the non-display area NA, the support column 21 can be formed simultaneously in the first display area AA1 and the second display area AA2. That is, there can be a support column 21 near the edge of the display area AA to ensure the flatness of the support of the vapor deposition mask.

[0091] It is understandable that, since the support post 21 is used to support the vapor deposition mask, and the same layer of the vapor deposition mask is made of a relatively hard metal material, the vapor deposition mask may scratch the support post 21 when it is placed or removed, so that scratches, protrusions, etc. may exist on the side of the support post 21 away from the substrate 10.

[0092] S130. An encapsulation layer is formed on the side of the display functional layer that is away from the substrate.

[0093] In the direction Z perpendicular to the light-emitting surface of the display panel 100, the encapsulation layer 30 covers at least each pixel 22 and each support post 21; the encapsulation layer 30 includes an organic encapsulation layer 301; in the direction Z perpendicular to the plane of the substrate 10, the organic encapsulation layer 301 overlapping with the support post 21 is a first organic encapsulation portion 3001; the thickness of the first organic encapsulation portion 3001 is T0; wherein, 3μm≤T0≤15μm.

[0094] Specifically, the encapsulation layer 30 includes at least an organic encapsulation layer 301, which can be formed by processes such as inkjet printing, coating, and photolithography. The organic material of the organic encapsulation layer 301 typically has a certain degree of fluidity, allowing the organic material to accumulate through one or more processes on the side of the support pillar 21 facing away from the substrate 10 during the formation of the organic encapsulation layer 301, thereby forming the organic encapsulation layer 301. This ensures that the thickness T0 of the first organic encapsulation portion 3001 of the organic encapsulation layer 301 on the side of the support pillar 21 facing away from the substrate 10 satisfies 3μm≤T0≤15μm, thus guaranteeing that the first organic encapsulation portion 3001 can fill in scratches, protrusions, etc., on the surface of the organic encapsulation layer 301 facing away from the substrate 10, ensuring high flatness on this side.

[0095] It is understood that since the organic encapsulation layer can be formed through one or more processes, the organic encapsulation layer may include one or more layers of structure, which can be determined according to the actual formation method. The embodiments of the present invention do not specifically limit this. For ease of description and simplification of the figures, the following figures all simplify the structure of the display functional layer. The specific structure and preparation method of the display functional layer can be referred to the description above, and will not be repeated here.

[0096] In an alternative embodiment, such as Figure 11 or Figure 16 As shown, when the support column 21 includes a first type of support column 211 and a second type of support column 212 located on the side of the first type of support column 211 closer to the non-display area NA, Figure 21 This is a schematic flowchart of a method for preparing an organic encapsulation layer according to an embodiment of the present invention. Figure 22 This is a schematic diagram of the fabrication process of an organic encapsulation layer provided in an embodiment of the present invention. (Refer to...) Figure 21 and Figure 22 An encapsulation layer is formed on the side of the display function facing away from the substrate, including: S131. First organic material is inkjet printed at each preset position on the side of the display functional layer away from the substrate, so that the first organic material flows to the position of each pixel and each support pillar.

[0097] The preset position is vertically projected onto the substrate 10 and located in the AA display area; the shortest distance between each preset position and the non-display area NA in the first direction X / Y is L; where L≥150μm.

[0098] Specifically, when preparing the first organic encapsulation layer 3011 using inkjet printing, the printing position of the first organic material can be set accordingly, and the determined printing position can be converted into a preset position after alignment with the display panel. By obtaining the position of the alignment mark in the display panel to be prepared, the inkjet printing nozzle M is moved to the preset position according to the position of the alignment mark, and the first organic material is sprayed at the preset position, so that the first organic material is sprayed onto the display area of ​​the display panel to be prepared, and the first organic material sprayed on the display area will flow to the surrounding area, so that the organic material flows to the positions of each pixel 22 and each support post 21.

[0099] Understandably, when printing the first organic material using inkjet printing, the preset printing positions can be set as far away from the non-display area NA as possible. Specifically, the shortest distance between the preset positions and the non-display area NA in the first X / Y direction can be greater than or equal to 150 μm. This prevents excessive flow of the first organic material into the non-display area NA, which could then cross the barrier structure RW and form a path for water vapor and oxygen transport. Simultaneously, since the support pillars 21 and pixels 22 are both located within the display area AA, the shortest distance between the preset printing positions and the non-display area NA in the first X / Y direction can also be greater than or equal to 150 μm. This allows organic material to flow to the locations of each pixel 22 and each support pillar 21.

[0100] S132. The first organic material is cured to form a first organic encapsulation layer covering each pixel and at least part of the support pillars.

[0101] Specifically, after inkjet printing of the first organic material is completed, the first organic material can be cured by light, causing it to solidify into a non-flowing solid. Because the support pillars 21 are protruding structures, when a small amount of the first organic material flows to the location of some support pillars 21, it cannot cover that portion of the support pillars 21. This portion of the support pillars 21 could be, for example, a second type of support pillar 212 closer to the non-display area NA, so that the cured first organic material only covers each pixel 22 and a portion of the support pillars 21; or, when a sufficient amount of the first organic material flows to the location of each support pillar 21, it can cover each support pillar 21. Thus, the first organic encapsulation layer 3011 formed after curing the first organic material can cover each pixel 22 and at least a portion of the support pillars 21.

[0102] S133, A second organic encapsulation layer is formed on the side of the first organic encapsulation layer away from the substrate, covering at least a portion of the second type of support pillar.

[0103] The first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 together constitute the organic encapsulation layer 301.

[0104] Specifically, after forming the first organic encapsulation layer 3011 using inkjet printing, the thickness of the first organic encapsulation layer 3011 at some locations of the second type of support pillar 212 may be too small to completely cover the second type of support pillar 212. In this case, a second organic encapsulation layer 3012 can be formed on the side of the first organic encapsulation layer 3011 away from the substrate 10 at the location of the second type of support pillar 212. This allows the second organic encapsulation layer 3012 to supplement the thickness of the first organic encapsulation layer 3011 at the location of the second type of support pillar 212, so that the side of the second type of support pillar 21 away from the substrate 10 has a sufficiently thick organic encapsulation layer 301.

[0105] Correspondingly, a second organic encapsulation layer 3012 may also be formed on the side of the first type of support pillar 211 away from the substrate 10 to supplement the thickness of the first organic encapsulation layer 3011 at the location of the first type of support pillar 211; or, when the first type of support pillar 211 has a sufficiently thick first organic encapsulation layer 3011 on the side away from the substrate 10, the second organic encapsulation layer 3012 may be provided only on the side of the second type of support pillar 212 away from the substrate 10, and the second organic encapsulation layer 3012 may not be provided on the side of the first type of support pillar 211 away from the substrate 10.

[0106] The forming process of the second organic encapsulation layer 3012 may be the same as or different from the forming process of the first organic encapsulation layer 3011. The specific process can be designed according to actual needs, and the embodiments of the present invention do not impose specific limitations on this.

[0107] In an alternative embodiment, Figure 23 This is a schematic flowchart of a method for preparing a second organic encapsulation layer according to an embodiment of the present invention. Figure 24 This is a schematic diagram of the fabrication process of a second organic encapsulation layer provided in an embodiment of the present invention. (Refer to...) Figure 23 and Figure 24 A second organic encapsulation layer is formed on the side of the first organic encapsulation layer opposite to the substrate, covering at least a portion of the second type of support pillars, including: S13311 forms a second organic material layer on the side of the first organic encapsulation layer away from the substrate.

[0108] Specifically, a second organic material layer 3012A is formed by coating a second organic material on the side of the first organic encapsulation layer 3011 away from the substrate 10, thereby simultaneously covering each pixel, each first type of support pillar 211 and each second type of support pillar 212.

[0109] S13312. Pattern the second organic material layer to form a second organic encapsulation layer covering at least a portion of the second type of support pillar.

[0110] The patterning process for the second organic encapsulation layer includes, but is not limited to, photolithography. For example, when the second organic material layer is a positive photoresist, an exposure mask with a perforated structure can be used, allowing light to pass through the exposure mask and irradiate the second organic material layer, exposing a portion of the second organic material layer. This exposed portion of the second organic material layer decomposes, and macromolecules break down. After exposure, the second organic material layer is developed to remove the exposed portion, retaining the portion hidden by the exposure mask, thus achieving patterning of the second organic material layer. The retained second organic material layer is the second organic encapsulation layer. The formed second organic encapsulation layer covers at least a portion of the second type of support pillars, allowing a thicker organic encapsulation layer to be disposed on the side of the second type of support pillars facing away from the substrate 10.

[0111] In another alternative embodiment, Figure 25 This is a schematic flowchart of another method for preparing a second organic encapsulation layer provided in an embodiment of the present invention. Figure 26 This is a schematic diagram of the fabrication process of another second organic encapsulation layer provided in an embodiment of the present invention, with reference to... Figure 25 and Figure 26 A second organic encapsulation layer is formed on the side of the first organic encapsulation layer opposite to the substrate, covering at least a portion of the second type of support pillars, including: S13321. Inkjet print a second organic material at a secondary printing position on the side of the first organic encapsulation layer away from the substrate, so that the second organic material covers at least part of the location of the second type of support pillar.

[0112] The vertical projection of the secondary printing position onto the substrate is located in the display area; the shortest distance between the secondary printing position and the non-display area in the first direction X / Y is L; 150μm≤L≤200μm.

[0113] It is understood that the number of secondary printing positions can be less than the number of preset positions when preparing the first organic encapsulation layer 3011 by inkjet printing. That is, the secondary printing positions can be close to the area where the second type of support pillar 212 is located, and the secondary printing positions can overlap or not overlap with the preset positions when preparing the first organic encapsulation layer 3011 by inkjet printing. The specific design can be made according to actual needs, and the embodiments of the present invention do not make specific limitations in this regard.

[0114] Specifically, the inkjet printer nozzle can be moved to the secondary printing position, and a second organic material can be sprayed at the secondary printing position. The second organic material is sprayed onto the corresponding position of the display panel, and the second organic material sprayed onto the corresponding position of the display panel will flow to the surrounding area, so that the second organic material flows to the position where at least part of the second type of support column 212 is located.

[0115] S13322. The second organic material is cured to form a second organic encapsulation layer covering at least a portion of the second type of support pillar.

[0116] Specifically, after inkjet printing of the second organic material is completed, the second organic material can be irradiated with ultraviolet light to solidify it into a non-flowing solid. Since the second type of support pillar 212 is closer to the non-display area NA, the thickness of the first organic encapsulation layer 3011 formed at the location of the second type of support pillar 212 is reduced. At this time, the second organic material flowing to at least part of the location of the second type of support pillar 212 can accumulate on the side of the first organic encapsulation layer 3011 away from the substrate 10, so as to ensure that there is a sufficiently thick organic encapsulation layer 301 at the location of the second type of support pillar 212.

[0117] Based on the above embodiments, optionally, after forming the second organic encapsulation layer, a third organic encapsulation layer can be formed on the side of the first and second organic encapsulation layers away from the substrate, overlapping with at least a portion of the second organic encapsulation layer. Thus, when both the first and second organic encapsulation layers are formed using inkjet printing, the fluidity of the inkjet-printed organic material makes it impossible to precisely control the thickness of the formed first and second organic encapsulation layers. In this case, a third organic encapsulation layer can be formed again on the side of the first and second organic encapsulation layers away from the substrate to fill the step difference on the surface of the first and / or second organic encapsulation layers away from the substrate.

[0118] The preparation process of the third organic encapsulation layer can be the same as that of the first and second organic encapsulation layers, that is, the third organic encapsulation layer can also be formed by inkjet printing. Alternatively, the preparation process of the third organic encapsulation layer can be different from that of the first and second organic encapsulation layers. The specific process can be designed according to actual needs, and the embodiments of the present invention do not impose specific limitations on this.

[0119] In an alternative embodiment, Figure 27 This is a schematic flowchart of a method for preparing a third organic encapsulation layer according to an embodiment of the present invention. Figure 28 This is a schematic diagram of the fabrication process of a third organic encapsulation layer provided in an embodiment of the present invention. (Refer to...) Figure 27 and Figure 28 A third organic encapsulation layer, overlapping at least a portion of the second organic encapsulation layer, is formed on the side of the first and second organic encapsulation layers opposite to the substrate, comprising: S134. A third organic material layer is formed on the side of the first organic encapsulation layer and the second organic encapsulation layer that is away from the substrate.

[0120] Specifically, a third organic material layer 3013A is formed by coating the first organic encapsulation layer 3011 and the second organic encapsulation layer 3012 on the side facing away from the substrate 10, thereby forming a third organic material layer 3013A that simultaneously covers each pixel, each first type of support pillar 211 and each second type of support pillar 212. S135. Pattern the third organic material layer to form a third organic encapsulation layer that overlaps with at least a portion of the second organic encapsulation layer.

[0121] The patterning process for the third organic encapsulation layer includes, but is not limited to, photolithography. For example, when the third organic material layer is a positive photoresist, an exposure mask with a perforated structure can be used, allowing light to pass through the exposure mask and irradiate the third organic material layer, exposing a portion of the third organic material layer. This portion of the third organic material layer exposed to light decomposes, and macromolecules break down. After exposure, the third organic material layer is also developed to remove the portion exposed to light, retaining the portion of the third organic material layer that was blocked by the exposure mask, thus achieving patterning of the third organic material layer. The retained third organic material layer is the third organic encapsulation layer. The formed third organic encapsulation layer overlaps with at least a portion of the second organic encapsulation layer, enabling the third organic encapsulation layer to at least supplement the thickness of the organic encapsulation layer at the location of at least a portion of the second organic encapsulation layer, ensuring that each location has a relatively thick organic encapsulation layer, and maintaining the flatness of the surface of the organic encapsulation layer facing away from the substrate at each location.

[0122] Based on the above embodiments, the encapsulation layer 30 may further include a first inorganic encapsulation layer 302 and a second inorganic encapsulation layer 303. The first inorganic encapsulation layer 302 may be formed by deposition before the organic encapsulation layer 301 is formed, and the second inorganic encapsulation layer 303 may be formed by deposition after the organic encapsulation layer 302 is formed. The specific formation methods of the first inorganic encapsulation layer 302 and the second inorganic encapsulation layer 303 can be designed according to actual needs, and the embodiments of the present invention do not specifically limit them.

[0123] Based on the same inventive concept, embodiments of the present invention also provide a display device, which includes the display panel provided in any embodiment of the present invention. Therefore, this display device possesses the technical features of the display panel provided in the embodiments of the present invention and can achieve the beneficial effects of the display panel provided in the embodiments of the present invention. Similarities can be found in the above description of the display panel provided in the embodiments of the present invention, and will not be repeated here.

[0124] For example, Figure 29 This is a schematic diagram of the structure of a display device provided in an embodiment of the present invention, such as... Figure 29 As shown, the display device 200 includes the display panel 100 provided in this embodiment of the invention. The display device 200 provided in this embodiment of the invention can be any electronic product with display function, including but not limited to the following categories: mobile phones, televisions, laptops, desktop monitors, tablet computers, digital cameras, smart bracelets, smart glasses, in-vehicle displays, medical devices, industrial control equipment, touch interactive terminals, etc., and this embodiment of the invention does not make any special limitations on these categories.

[0125] Note that the above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and may include many other equivalent embodiments without departing from the concept of the present invention, the scope of which is determined by the scope of the appended claims.

Claims

1. A display panel, characterized in that, include: The display area and the non-display area surrounding the display area; The display panel also includes: Substrate; A display functional layer located on one side of the substrate; the display functional layer includes multiple pixels and multiple support pillars; the pixels and the support pillars are all located in the display area, and the support pillars are located between the pixels; An encapsulation layer located on the side of the display functional layer facing away from the substrate; in a direction perpendicular to the light-emitting surface of the display panel, the encapsulation layer at least covers each of the pixels and each of the support pillars; The encapsulation layer includes an organic encapsulation layer; the organic encapsulation layer overlapping the support pillar in the direction perpendicular to the light-emitting surface of the display panel is a first organic encapsulation portion; the thickness of the first organic encapsulation portion is T0; wherein, 3μm≤T0≤15μm.

2. The display panel according to claim 1, characterized in that, The display area includes a first display area and a second display area located on the side of the first display area closer to the non-display area; the support column is located in the first display area; In the arrangement direction of the first display area, the second display area, and the non-display area, the width of the second display area is d; wherein, 200μm≤d≤400μm.

3. The display panel according to claim 2, characterized in that, The surface of the support column facing away from the substrate is the first surface, and the surface of the display functional layer located in the second display area facing away from the substrate is the second surface. In a direction perpendicular to the light-emitting surface of the display panel, the distance between the first surface and the substrate is a first height, and the distance between the second surface and the substrate is a second height; the first height is greater than the second height.

4. The display panel according to claim 2, characterized in that, In the arrangement direction of the first display area, the second display area, and the non-display area, the distance between the support column and the non-display area is L0; where L0≥d.

5. The display panel according to claim 2, characterized in that, The second display area does not have the aforementioned support pillar.

6. The display panel according to claim 2, characterized in that, The second display area is positioned around the first display area.

7. The display panel according to claim 2, characterized in that, The first display area includes a central area and corner areas; the second display area is located on the side of the central area closer to the non-display area; the corner areas are located between two adjacent second display areas; The shortest distance between the support column located in the middle area and the non-display area is d1, and the shortest distance between the support column located in the corner area and the non-display area is d2; wherein, d1≥d2.

8. The display panel according to claim 1, characterized in that, The organic encapsulation layer includes a first organic encapsulation layer and a second organic encapsulation layer stacked together. In a direction perpendicular to the light-emitting surface of the display panel, the first organic encapsulation layer covers each of the pixels and at least a portion of the support pillars; The support pillars include a first type of support pillar and a second type of support pillar located on the side of the first type of support pillar closer to the non-display area; in a direction perpendicular to the light-emitting surface of the display panel, the second organic encapsulation layer covers at least a portion of the second type of support pillars.

9. The display panel according to claim 8, characterized in that, The display area includes a first display area and a second display area located on the side of the first display area closer to the non-display area; in the arrangement direction of the first display area, the second display area and the non-display area, the width of the second display area is d; wherein, 200μm≤d≤400μm; The first type of support column is located in the first display area, and the second type of support column is located in the second display area.

10. The display panel according to claim 8, characterized in that, The display area includes a first display area and a second display area located on the side of the first display area closer to the non-display area; in the arrangement direction of the first display area, the second display area and the non-display area, the width of the second display area is d; wherein, 200μm≤d≤400μm; Both the first type of support column and the second type of support column are located in the first display area, while the second display area does not have the support column.

11. The display panel according to claim 8, characterized in that, In the direction perpendicular to the light-emitting surface of the display panel, the thickness T2 of the second organic encapsulation layer overlapping with the second type of support pillar has a range of 2μm≤T2≤3μm.

12. The display panel according to claim 8, characterized in that, The first organic encapsulation layer includes a first portion and a second portion; In the direction perpendicular to the light-emitting surface of the display panel, the first part overlaps with the first type of support column, and the second part overlaps with the second type of support column; In the direction perpendicular to the light-emitting surface of the display panel, the thickness of the first part is T11, and the thickness of the second part is T12; wherein, T11≥T12.

13. The display panel according to claim 12, characterized in that, In the direction perpendicular to the light-emitting surface of the display panel, the stack thickness of the second portion and the second organic encapsulation layer is T20; wherein, T20≤T11.

14. The display panel according to claim 8, characterized in that, The second organic encapsulation layer is located on the side of the first organic encapsulation layer that is away from the substrate.

15. The display panel according to claim 8, characterized in that, The organic encapsulation layer further includes a third organic encapsulation layer located on the side of the first organic encapsulation layer and the second organic encapsulation layer facing away from the substrate. In a direction perpendicular to the light-emitting surface of the display panel, the third organic encapsulation layer overlaps with at least a portion of the second organic encapsulation layer.

16. The display panel according to claim 1, characterized in that, The display functional layer further includes a barrier structure; the barrier structure is located in the non-display area and is arranged around the display area; the distance between the barrier structure and the display area in a first direction is D; wherein, 100μm≤D≤200μm; the first direction is parallel to the arrangement direction of the display area and the non-display area; The edge of the organic encapsulation layer is located on at least part of the barrier structure on the side closest to the display area.

17. The display panel according to claim 16, characterized in that, The non-display area includes a first flat area, at least one bent area, and at least one second flat area; the first flat area is connected to the second flat area through the bent area; the second flat area is opposite to the first flat area along a second direction; the second direction is perpendicular to the light-emitting surface of the display panel; the barrier structure is located in the first flat area.

18. The display panel according to claim 17, characterized in that, The non-display area includes a first non-display area, a second non-display area, and a third non-display area; the first non-display area is arranged along a third direction with the display area; the second and third non-display areas are located on opposite sides of the display area along a fourth direction; the third direction intersects with the fourth direction; The first straight region includes a first first straight region, a second first straight region, and a third first straight region; the second straight region includes a first second straight region, a second second straight region, and a third second straight region; the bending region includes a first bending region, a second bending region, and a third bending region; The first non-display area includes the first first flat area, the first bent area, and the first second flat area; the first first flat area is connected to the first second flat area through the first bent area, and the first first flat area and the first second flat area are opposite to each other along the second direction; The second non-display area includes the second first flat area, the second bent area, and the second second flat area; the second first flat area is connected to the second second flat area through the second bent area, and the second first flat area and the second second flat area are opposite to each other along the second direction; The third non-display area includes the third first flat area, the third bent area, and the third second flat area; the third first flat area is connected to the third second flat area through the third bent area, and the third first flat area and the third second flat area are opposite each other along the second direction.

19. The display panel according to claim 17, characterized in that, The non-display area includes a first non-display area, a second non-display area, a third non-display area, and a fourth non-display area; the first non-display area and the fourth non-display area are located on opposite sides of the display area along a third direction; the second non-display area and the third non-display area are located on opposite sides of the display area along a fourth direction; the third direction intersects with the fourth direction; The first straight area includes a first first straight area, a second first straight area, a third first straight area, and a fourth first straight area; the second straight area includes a first second straight area, a second second straight area, a third second straight area, and a fourth second straight area; the bending area includes a first bending area, a second bending area, a third bending area, and a fourth bending area; The first non-display area includes the first first flat area, the first bent area, and the first second flat area; the first first flat area is connected to the first second flat area through the first bent area, and the first first flat area and the first second flat area are opposite to each other along the second direction; The second non-display area includes the second first flat area, the second bent area, and the second second flat area; the second first flat area is connected to the second second flat area through the second bent area, and the second first flat area and the second second flat area are opposite to each other along the second direction; The third non-display area includes the third first flat area, the third bent area, and the third second flat area; the third first flat area is connected to the third second flat area through the third bent area, and the third first flat area and the third second flat area are opposite to each other along the second direction; The fourth non-display area includes the fourth first flat area, the fourth bent area, and the fourth second flat area; the fourth first flat area is connected to the fourth second flat area through the fourth bent area, and the fourth first flat area and the fourth second flat area are opposite each other along the second direction.

20. The display panel according to claim 1, characterized in that, The encapsulation layer further includes a first inorganic encapsulation layer and a second inorganic encapsulation layer; The first inorganic encapsulation layer is located on the side of the organic encapsulation layer closer to the substrate, and the second inorganic encapsulation layer is located on the side of the organic encapsulation layer away from the substrate.

21. A method for manufacturing a display panel, characterized in that, The display panel includes a display area and a non-display area surrounding the display area; the method for manufacturing the display panel includes: Provide substrates; A display functional layer is formed on the substrate; the display functional layer includes a plurality of pixels and a plurality of support pillars; the pixels and the support pillars are all located in the display area, and the support pillars are located between the pixels; An encapsulation layer is formed on the side of the display functional layer opposite to the substrate; in a direction perpendicular to the light-emitting surface of the display panel, the encapsulation layer at least covers each of the pixels and each of the support pillars; The encapsulation layer includes an organic encapsulation layer; the organic encapsulation layer overlapping the support pillar in the direction perpendicular to the light-emitting surface of the display panel is a first organic encapsulation portion; the thickness of the first organic encapsulation portion is T0; wherein, 3μm≤T0≤15μm.

22. The method for manufacturing a display panel according to claim 21, characterized in that, The display area includes a first display area and a second display area located on the side of the first display area closer to the non-display area; in the arrangement direction of the first display area, the second display area and the non-display area, the width of the second display area is d; wherein, 200μm≤d≤400μm; The support column is formed in the first display area.

23. The method for manufacturing a display panel according to claim 22, characterized in that, The first display area includes a central area and corner areas; the second display area is located on the side of the central area closer to the non-display area; the corner areas are located between two adjacent second display areas; The shortest distance between the support column formed in the middle area and the non-display area is d1, and the shortest distance between the support column formed in the corner area and the non-display area is d2; wherein, d1≥d2.

24. The method for manufacturing a display panel according to claim 21, characterized in that, The support column includes a first type of support column and a second type of support column located on the side of the first type of support column closer to the non-display area; An encapsulation layer is formed on the side of the display functional layer opposite to the substrate, comprising: A first organic material is inkjet-printed at each preset position on the side of the display functional layer away from the substrate, so that the first organic material flows to the positions of each pixel and each support pillar; the vertical projection of the preset position on the substrate is located in the display area; the shortest distance between each preset position and the non-display area in the first direction is L; wherein, L≥150μm; The first organic material is cured to form a first organic encapsulation layer covering each of the pixels and at least a portion of the support pillars; A second organic encapsulation layer is formed on the side of the first organic encapsulation layer opposite to the substrate, covering at least a portion of the second type of support pillar; wherein the first organic encapsulation layer and the second organic encapsulation layer together constitute the organic encapsulation layer.

25. The method for manufacturing a display panel according to claim 24, characterized in that, A second organic encapsulation layer is formed on the side of the first organic encapsulation layer opposite to the substrate, covering at least a portion of the second type of support pillars, including: A second organic material is inkjet-printed at a secondary printing position on the side of the first organic encapsulation layer away from the substrate, so that the second organic material covers at least part of the location of the second type of support pillar; the vertical projection of the secondary printing position on the substrate is located in the display area; the shortest distance between the secondary printing position and the non-display area in the first direction is L; wherein, 150μm≤L≤200μm; The second organic material is cured to form a second organic encapsulation layer covering at least a portion of the second type of support pillar.

26. The method for manufacturing a display panel according to claim 25, characterized in that, An encapsulation layer is formed on the side of the display functional layer opposite to the substrate, and the encapsulation layer further includes: A third organic encapsulation layer is formed on the side of the first organic encapsulation layer and the second organic encapsulation layer away from the substrate, overlapping at least a portion of the second organic encapsulation layer.

27. The method for manufacturing a display panel according to claim 25, characterized in that, A third organic encapsulation layer, overlapping at least a portion of the second organic encapsulation layer, is formed on the side of the first and second organic encapsulation layers opposite to the substrate, comprising: A third organic material layer is formed on the side of the first organic encapsulation layer and the second organic encapsulation layer that is away from the substrate. The third organic material layer is patterned to form a third organic encapsulation layer that overlaps with at least a portion of the second organic encapsulation layer.

28. The method for manufacturing a display panel according to claim 24, characterized in that, A second organic encapsulation layer is formed on the side of the first organic encapsulation layer opposite to the substrate, covering at least a portion of the second type of support pillars, including: A second organic material layer is formed on the side of the first organic encapsulation layer that is away from the substrate. The second organic material layer is patterned to form a second organic encapsulation layer covering at least a portion of the second type of support pillars.

29. A display device, characterized in that, include: The display panel according to any one of claims 1-20.

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