Robotic hand effector and wafer transport device

Abstract

Embodiments of the present application provide a mechanical hand executor and a wafer transmission device to solve the problem that the wafer may slide relative to the mechanical hand executor; wherein the mechanical hand executor comprises a body and an anti-skid pad; the body is provided with a gas flow channel and a containing hole, a hole wall of the containing hole is provided with a first protruding part, and the first protruding part is provided with a gas hole in communication with the gas flow channel; the anti-skid pad is provided with a first through hole and a second through hole, the first through hole penetrates the anti-skid pad along the thickness direction of the anti-skid pad, and the second through hole penetrates the anti-skid pad from the hole wall of the first through hole in the direction towards the outer circumferential surface of the anti-skid pad; the anti-skid pad is arranged in the containing hole, the first protruding part is inserted in the second through hole, so that the gas flow channel is in communication with the first through hole through the second through hole, and the anti-skid pad is used for carrying the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and in particular to a robotic actuator and a wafer transfer device. Background Technology

[0002] In semiconductor manufacturing processes, wafer transport devices are used to move wafers. For example, a wafer transport device includes a robotic arm and a robotic actuator connected to the robotic arm. The robotic actuator supports the wafer. The robotic arm drives the robotic actuator and the wafer to move, transferring the wafer to a target location. For wafers with a smooth backside, such as back-polished wafers, the wafer may slide relative to the robotic actuator due to the low friction between the wafer and the robotic arm.

[0003] In related technologies, a limiting protrusion is provided at the end of the protrusion of the robotic actuator to prevent the wafer from sliding towards the end of the protrusion. However, this method results in an excessively long robotic actuator with a thicker front end due to the limiting protrusion. Furthermore, in related technologies, multiple sealing rings are used on the robotic actuator to support the wafer and prevent it from sliding relative to the actuator. Since the robotic actuator needs to extend into the high-temperature semiconductor process chamber, the sealing rings used to support the wafer are prone to aging and failure, leading to a significant decrease in their anti-slip performance. Summary of the Invention

[0004] This application provides a robotic actuator and a wafer transfer device to address the problem of wafers potentially sliding relative to the robotic actuator.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application provide a robotic actuator.

[0006] The robotic actuator provided in this application includes: a body and an anti-slip pad; the body has a gas flow channel and a receiving hole, the receiving hole wall has a first protrusion, the first protrusion has a vent communicating with the gas flow channel; the anti-slip pad has a first through hole and a second through hole, the first through hole penetrates the anti-slip pad along the thickness direction of the anti-slip pad, and the second through hole penetrates the anti-slip pad from the hole wall of the first through hole in a direction toward the outer peripheral surface of the anti-slip pad; the anti-slip pad is disposed in the receiving hole, the first protrusion is inserted into the second through hole, so that the gas flow channel communicates with the first through hole through the second through hole, and the anti-slip pad is used to support a wafer.

[0007] Optionally, the body is further provided with an auxiliary mounting hole in the area on the side of the receiving hole. The auxiliary mounting hole communicates with the receiving hole. The diameter of the auxiliary mounting hole is larger than the outer diameter of the anti-slip pad. The anti-slip pad located in the auxiliary mounting hole can pass through the junction area of ​​the auxiliary mounting hole and the receiving hole and be embedded in the receiving hole.

[0008] Optionally, the first protrusion protrudes toward the junction area.

[0009] Optionally, the receiving hole extends through the body along the thickness direction of the body, and the thickness direction of the anti-slip pad is parallel to the thickness direction of the body.

[0010] Optionally, the wall of the receiving hole is provided with a second protrusion, and the outer periphery of the anti-slip pad is provided with a first recess, and the second protrusion is embedded in the first recess.

[0011] Optionally, the top surface of the anti-slip pad is provided with a second recess, and the first perforation penetrates the bottom surface of the second recess.

[0012] Optionally, the body is further provided with a coolant flow channel, which flows through the outer periphery of the anti-slip pad.

[0013] Optionally, the coolant flow channel includes a first surrounding section and a second surrounding section, both of which are arranged around the outer periphery of the anti-slip pad. Along the thickness direction of the body, the second surrounding section and the first surrounding section are spaced apart.

[0014] Optionally, the body includes a base, a third protrusion, and a fourth protrusion connected to each other; the number of anti-slip pads is at least three, and the anti-slip pads are provided on the side of the base, the side of the third protrusion opposite to the base, and the side of the fourth protrusion opposite to the base.

[0015] Secondly, embodiments of this application provide a wafer transfer device.

[0016] The wafer transfer device provided in this application includes: a robotic arm and any one of the robotic arm actuators provided in this application, wherein the robotic arm is connected to the robotic arm actuator.

[0017] Optionally, the wafer transfer device further includes a first valve and a second valve, wherein the gas flow channel is connected to a negative pressure source via the first valve and to a compressed gas source via the second valve.

[0018] The above-described technical solutions adopted in the embodiments of this application can achieve the following beneficial effects: In the embodiments of this application, since the anti-slip pad has a greater sliding friction resistance with the wafer than the body, the body with the anti-slip pad can initially prevent the wafer from sliding relative to the robotic actuator compared to the body without the anti-slip pad.

[0019] Furthermore, in the embodiments of this application, the main body is provided with a first protrusion, the first protrusion is provided with an air hole that communicates with the gas flow channel of the main body, and an anti-slip pad provided in the receiving hole has a second perforation that connects with the air hole of the first protrusion so that the gas flow channel communicates with the first perforation through the second perforation.

[0020] In this way, with the wafer supported on the anti-slip pad, the wafer will block the opening above the first perforation. Furthermore, by drawing air through the gas flow channel, a negative pressure can be created at the first perforation. Based on the principle of negative pressure adsorption, the wafer can be adsorbed onto the anti-slip pad, thereby improving the anti-slip pad's effectiveness in preventing the wafer from sliding relative to the robotic actuator.

[0021] Furthermore, during the gas extraction process through the gas flow channel, ambient gas can flow through the perforations below the first perforation onto the anti-slip mat, thus providing a cooling effect. Since anti-slip mats are generally not heat-resistant, when the robotic actuator extends into the semiconductor process chamber, the high temperature within the chamber may cause the anti-slip mat to carbonize, significantly reducing its anti-slip performance.

[0022] The solution provided in this application embodiment achieves a cooling effect on the anti-slip mat during the gas flow channel extraction process, thus preventing the anti-slip mat from rising to the carbonization temperature and preventing a significant decrease in the anti-slip performance of the anti-slip mat.

[0023] Furthermore, the gas channel can also be connected to a compressed air source. In the event of adhesion between the wafer and the anti-slip pad, air can be supplied to the first perforation of the anti-slip pad through the gas channel to generate a force that makes the wafer "levitate" in the first perforation, so that the wafer can be easily separated from the anti-slip pad when it needs to be removed.

[0024] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of a wafer transfer device equipped with a robotic actuator is provided in an embodiment of this application; Figure 2 for Figure 1 A top view of the wafer transfer device shown in the figure; Figure 3 This is a schematic diagram of a robotic actuator provided in an embodiment of this application; Figure 4 A schematic diagram of a robotic actuator and a wafer provided for an embodiment of this application; Figure 5 This is a schematic diagram of a robotic actuator provided in an embodiment of this application; Figure 6 This is a partial schematic diagram of a robotic actuator provided in an embodiment of this application; Figure 7 A schematic diagram of an anti-slip mat provided in an embodiment of this application; Figure 8 A schematic diagram of an anti-slip mat provided in an embodiment of this application; Figure 9 A cross-sectional view of an anti-slip mat provided in an embodiment of this application; Figure 10 This is a partial schematic diagram of a robotic actuator provided in an embodiment of this application, showing the anti-slip pad located in the auxiliary mounting hole; Figure 11 This is a partial schematic diagram of a robotic actuator provided in an embodiment of this application, showing the anti-slip pad located in the receiving hole; Figure 12 for Figure 11 A partial cross-sectional view of the robotic actuator shown in the image; Figure 13 A schematic diagram illustrating air extraction through a gas flow channel into the first perforation of an anti-slip pad, provided in the embodiment of the application; Figure 14 A schematic diagram illustrating the delivery of compressed gas through a gas flow channel to the first perforation of an anti-slip pad, provided in the embodiment of the application; Figure 15 A schematic diagram of the body of a robotic actuator provided in the embodiments of the application; Figure 16A schematic diagram of an anti-slip pad, a gas flow channel, and a coolant flow channel provided for an embodiment of the application; Figure 17 for Figure 1 A cross-sectional view of the wafer transport device shown in the figure; Figure 18 A schematic diagram of a robotic actuator and an arm gripping module provided for an embodiment of the application; Figure 19 A schematic diagram of an arm gripping module provided for an embodiment of the application; Figure 20 A schematic diagram of an arm gripping module, the body of a robotic actuator, and an anti-slip pad provided for the embodiments of the application; Figure 21 This is a schematic diagram illustrating the principle of a gas supply, gas extraction, and cooling device for a wafer transport apparatus provided in an embodiment of this application.

[0027] Explanation of reference numerals in the attached figures: 10-Wafer transport device; 100-Robotic actuator; 110-Body; 110a-Base; 110b-Third protrusion; 110c-Fourth protrusion; 111-Gas flow channel; 112-Accommodation hole; 113-First protrusion; 1131-Air hole; 114-Auxiliary mounting hole; 115-Boundary area; 116-Second protrusion; 117-Coolant flow channel; 1171-First circumferential section; 1172-Second circumferential section; 1173-First extension section; 1174-Second extension section; 120 - Anti-slip mat; 121 - First perforation; 122 - Second perforation; 123 - First depression; 124 - Second depression; 200-Wafer; 300 - Robotic arm; 310 - Liquid delivery pipeline; 311 - Sealing ring; 320 - Arm gripping module; 330 - Gas delivery pipeline; 410 - First valve; 420 - Second valve; 430 - Negative pressure source; 440 - Compressed gas source; 450 - Gas mass flow controller; 460 - Cooling medium source. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below in conjunction with specific embodiments and corresponding drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0029] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0030] Furthermore, although the terminology used in this application is selected from commonly known and used terms, some terms mentioned in this application specification may have been selected by the applicant at his or her own discretion, and their detailed meanings are explained in the relevant sections of this description.

[0031] Furthermore, this application is required to be understood not only through the actual terms used, but also through the meaning implied by each term.

[0032] The technical solutions provided by the various embodiments of this application are described in detail below with reference to the accompanying drawings.

[0033] This application provides a robotic actuator. The robotic actuator can be applied to wafer transfer devices. For the convenience of those skilled in the art, Figure 1 and Figure 2 A wafer transfer device 10 equipped with a robotic actuator 100 is shown. It should be noted that... Figure 1 and Figure 2 The wafer transfer device 10 shown is merely an example provided to facilitate understanding of the solution of this application by those skilled in the art. In the embodiments of this application, the wafer transfer device 10 may have other structures, which will not be described in detail here.

[0034] refer to Figures 3 to 16 The robotic actuator 100 provided in this embodiment includes a body 110 and an anti-slip pad 120. The body 110 is a support for supporting the wafer 200. The anti-slip pad 120 is disposed on the body 110, and the wafer 200 is supported on the anti-slip pad 120 to prevent the wafer 200 from sliding relative to the body 110. How the robotic actuator 100 prevents the wafer 200 from sliding relative to the body 110 using the anti-slip pad 120 is explained below.

[0035] refer to Figure 10 and Figure 12 In the embodiments of this application, the body 110 is provided with a gas flow channel 111 and a receiving hole 112. The wall of the receiving hole 112 is provided with a first protrusion 113, and the first protrusion 113 is provided with a vent 1131 communicating with the gas flow channel 111.

[0036] refer to Figure 9 and Figure 12The anti-slip mat 120 is provided with a first perforation 121 and a second perforation 122. The first perforation 121 penetrates the anti-slip mat 120 along the thickness direction, and the second perforation 122 penetrates the anti-slip mat 120 from the hole wall of the first perforation 121 along the direction toward the outer peripheral surface of the anti-slip mat 120.

[0037] refer to Figures 10 to 12 An anti-slip pad 120 is disposed in the receiving hole 112. A first protrusion 113 is inserted into a second through hole 122 so that the gas flow channel 111 communicates with the first through hole 121 through the second through hole 122. The anti-slip pad 120 is used to support the wafer 200.

[0038] In this way, in the embodiments of this application, since the anti-slip pad 120 has a greater sliding friction resistance with the wafer 200 relative to the body 110, the body 110 with the anti-slip pad 120 can play a preliminary role in preventing the wafer 200 from sliding relative to the robotic actuator 100, compared to the body 110 without the anti-slip pad 120.

[0039] Furthermore, in the embodiments of this application, the body 110 is provided with a first protrusion 113, the first protrusion 113 is provided with an air hole 1131 communicating with the gas flow channel 111 of the body 110, and the anti-slip pad 120 provided in the receiving hole 112 has a second through hole 122 that aligns with the air hole 1131 of the first protrusion 113, so that the gas flow channel 111 communicates with the first through hole 121 through the second through hole 122.

[0040] Thus, with the wafer 200 supported on the anti-slip pad 120, the wafer 200 will block the opening above the first through-hole 121. Furthermore, a negative pressure can be created at the first through-hole 121 by drawing air through the gas flow channel 111. Based on the principle of negative pressure adsorption, the wafer 200 can be adsorbed onto the anti-slip pad 120, thereby improving the effectiveness of the anti-slip pad 120 in preventing the wafer 200 from sliding relative to the robotic actuator 100.

[0041] Furthermore, during the extraction process through the gas flow channel 111, ambient gas can flow through the perforation below the first perforation 121 onto the anti-slip pad 120, thus achieving a cooling effect on the anti-slip pad 120. Since the anti-slip pad 120 is generally not heat-resistant, when the robotic actuator 100 extends into the semiconductor process chamber, the high temperature within the chamber may cause the anti-slip pad 120 to carbonize, significantly reducing its anti-slip performance.

[0042] By adopting the solution provided in this application embodiment, during the process of evacuating air through the gas flow channel 111, the anti-slip pad 120 will be cooled by air. Therefore, the anti-slip pad 120 can be prevented from rising to the carbonization temperature, thus preventing the anti-slip performance of the anti-slip pad 120 from being greatly reduced.

[0043] Furthermore, the gas channel 111 can also be connected to a compressed air source. In the event of adhesion between the wafer 200 and the anti-slip pad 120, air can be supplied to the first perforation 121 of the anti-slip pad 120 through the gas channel 111 to generate a force that makes the wafer 200 "levitate" in the first perforation 121, so that the wafer 200 can be easily separated from the anti-slip pad 120 when it is necessary to remove the wafer 200.

[0044] In some embodiments, the gas flow channel 111 is connected to a negative pressure source via a first valve, and the gas flow channel 111 is also connected to a compressed gas source via a second valve.

[0045] For example, the negative pressure source can be a vacuum generator. With the first valve in the open state and the second valve in the closed state, the negative pressure source can evacuate the first perforation 121 of the anti-slip pad 120 through the gas flow channel 111. It should be noted that "evacuating" here does not mean drawing the first perforation 121 to a vacuum state, but should be understood as evacuating the air from the first perforation 121 of the anti-slip pad 120 through the gas flow channel 111 by the negative pressure source, so that the air pressure on the side of the first perforation 121 facing the wafer 200 is lower than the ambient air pressure. Thus, based on the principle of negative pressure adsorption, the wafer 200 can be adsorbed onto the anti-slip pad 120, thereby improving the effect of the anti-slip pad 120 in preventing the wafer 200 from sliding relative to the robotic actuator 100.

[0046] For example, when the second valve is open and the first valve is closed, the compressed gas source can deliver pressurized gas to the first perforation 121 of the anti-slip pad 120 through the gas flow channel 111. Since the pressure of the gas output by the compressed gas source is greater than the ambient air pressure, a force can be generated that causes the wafer 200 to "levitate".

[0047] refer to Figures 10 to 12 In some embodiments, the body 110 is further provided with an auxiliary mounting hole 114 in the region located to the side of the receiving hole 112. The auxiliary mounting hole 114 communicates with the receiving hole 112. Exemplarily, the auxiliary mounting hole 114 communicates with the receiving hole 112 along the sidewall direction of the receiving hole 112. The diameter of the auxiliary mounting hole 114 is larger than the outer diameter of the anti-slip pad 120. The anti-slip pad 120 located in the auxiliary mounting hole 114 can pass through the junction area 115 of the auxiliary mounting hole 114 and the receiving hole 112 and be embedded in the receiving hole 112.

[0048] Thus, for reference Figure 10 Because the diameter of the auxiliary mounting hole 114 is larger than the outer diameter of the anti-slip pad 120, the anti-slip pad 120 can be easily positioned in the auxiliary mounting hole 114 during installation. Then, by driving the anti-slip pad 120 towards the receiving hole 112, the anti-slip pad 120 can pass through the junction area 115 of the auxiliary mounting hole 114 and the receiving hole 112 and be embedded within the receiving hole 112. This method allows for convenient replacement and maintenance of the anti-slip pad 120.

[0049] refer to Figure 10 In some embodiments, the first protrusion 113 protrudes toward the junction region 115. Thus, referring to... Figures 10 to 12 The anti-slip pad 120, which is located in the auxiliary mounting hole 114, moves toward the receiving hole 112. After being embedded in the receiving hole 112, the first protrusion 113 can be inserted into the second through hole 122 of the anti-slip pad 120, so that the gas flow channel 111 can be connected to the first through hole 121 more easily through the second through hole 122.

[0050] refer to Figures 9 to 12 In some embodiments, the receiving hole 112 extends through the body 110 along its thickness direction, and the anti-slip pad 120 is parallel to the thickness direction of the body 110. This prevents the body 110 from obstructing the first through hole 121. Of course, in other embodiments, for example, a through hole can be formed in the body 110 at a position opposite to the first through hole 121 to prevent the body 110 from obstructing the first through hole 121. It should be noted that other methods can also be used in other embodiments to prevent the body 110 from obstructing the first through hole 121, which will not be listed here.

[0051] refer to Figures 7 to 12 In some embodiments, the wall of the receiving hole 112 is provided with a second protrusion 116, and the outer periphery of the anti-slip pad 120 is provided with a first recess 123, with the second protrusion 116 embedded in the first recess 123. In this way, the second protrusion 116 can be used to support the anti-slip pad 120, thereby improving the load-bearing capacity of the anti-slip pad 120.

[0052] For example, in other embodiments, a support is provided below the receiving hole 112, on which the anti-slip pad 120 can be supported. In addition, a through hole is provided at the part of the support opposite to the first through hole 121 of the anti-slip pad 120, so that the anti-slip pad 120 can be supported by the support, and the through hole of the support can make the lower opening of the first through hole 121 communicate with the outside.

[0053] refer to Figures 12 to 14In some embodiments, the top surface of the anti-slip pad 120 is provided with a second recess 124, and the first perforation 121 penetrates the bottom surface of the second recess 124. Thus, by providing the second recess 124 on the top surface of the anti-slip pad 120, the interaction area between the gas at the first perforation 121 and the wafer 200 can be increased. For example, during the process of evacuating the first perforation 121, the negative pressure area below the wafer 200 is larger, resulting in a better negative pressure adsorption effect. During the process of supplying compressed gas to the first perforation 121, the interaction area of ​​the pressurized gas below the wafer 200 is larger, resulting in a better lifting effect on the wafer 200.

[0054] refer to Figure 15 and Figure 16 In some embodiments, the body 110 is further provided with a coolant channel 117, which passes through the outer periphery of the anti-slip pad 120. In this way, by delivering a cooling medium to the coolant channel 117, the anti-slip pad 120 can be cooled down by the cooling medium, thereby better preventing the anti-slip pad 120 from rising to the carbonization temperature, and thus further extending the service life of the anti-slip pad 120.

[0055] refer to Figure 16 In some embodiments, the coolant flow channel 117 includes a first surrounding section 1171 and a second surrounding section 1172. Both the first surrounding section 1171 and the second surrounding section 1172 are disposed around the outer periphery of the anti-slip pad 120. Along the thickness direction of the body 110, the second surrounding section 1172 and the first surrounding section 1171 are spaced apart. This allows the portion of the coolant flow channel 117 surrounding the outer periphery of the anti-slip pad 120 to be three-dimensionally distributed, thereby improving the cooling effect on the anti-slip pad 120.

[0056] refer to Figure 16 and Figure 17 In some embodiments, the coolant flow channel 117 further includes a first extension 1173 and a second extension 1174. One of the first extension 1173 and the second extension 1174 forms a supply flow channel, and the other forms a return flow channel. The first extension 1173 and the second extension 1174 are spaced apart. The orthographic projection of the gas flow channel 111 onto the bottom surface of the body 110 lies between the orthographic projections of the first extension 1173 and the second extension 1174 onto the bottom surface of the body 110.

[0057] In this way, the cooling medium in the coolant flow channel 117 can be used to cool the portion of the body 110 located between the first extension 1173 and the second extension 1174. Furthermore, since the gas flow channel 111 is located between the first extension 1173 and the second extension 1174, the cooling medium can be used to cool the gas within the gas flow channel 111. This prevents the high-temperature gas within the gas flow channel 111 from being drawn into the vacuum source and damaging it.

[0058] Understandably, in order to further improve the cooling effect of the cooling medium on the gas in the gas flow channel 111, when the first extension section 1173 is a liquid supply channel and the second extension section 1174 is a return channel, the orthographic projection of the gas flow channel 111 on the bottom surface of the body 110 can be located between the orthographic projections of the first extension section 1173 and the second extension section 1174 on the bottom surface of the body 110, and closer to the position of the orthographic projection of the first extension section 1173 on the bottom surface of the body 110.

[0059] refer to Figure 3 In some embodiments, the body 110 includes a base 110a, a third protrusion 110b, and a fourth protrusion 110c connected to each other. The number of anti-slip pads 120 is at least three. Anti-slip pads 120 are provided on the sides of the base 110a, the third protrusion 110b, and the fourth protrusion 110c that are opposite to the base 110a. In other words, the base 110a is provided with at least one anti-slip pad 120, the side of the third protrusion 110b opposite to the base 110a is provided with at least one anti-slip pad 120, and the side of the fourth protrusion 110c opposite to the base 110a is provided with at least one anti-slip pad 120. Thus, by providing multiple anti-slip pads 120, the effect of preventing the wafer 200 from sliding relative to the robotic actuator 100 can be further improved.

[0060] Of course, in other embodiments, for example, only one or two anti-slip pads 120 may be provided. For example, several ordinary pads may be provided in conjunction, so that the wafer 200 is supported on the anti-slip pads 120 and the pads.

[0061] For example, the anti-slip mat 120 may be made of a material such as perfluororubber that has high temperature resistance, a high coefficient of friction on the material surface, and resistance to plasma and special gas corrosion.

[0062] This application provides a wafer transport device. (See reference...) Figure 1 , Figure 2 , Figures 17 to 21 The wafer transfer device 10 provided in this application embodiment includes: a robot arm 300 and any of the robot arm actuators 100 provided in this application embodiment. The robot arm 300 is connected to the robot arm actuator 100.

[0063] In some embodiments, the wafer transfer device 10 further includes a first valve 410 and a second valve 420. A gas flow channel 111 is connected to a negative pressure source 430 via the first valve 410, and to a compressed air source 440 via the second valve 420. Exemplarily, the negative pressure source 430 is a vacuum generator. The compressed air source 440 is used to output compressed dry air (CDA).

[0064] For example, when the first valve 410 is open and the second valve 420 is closed, the negative pressure source 430 can evacuate the first perforation 121 of the anti-slip pad 120 through the gas flow channel 111, so that the air pressure on the side of the first perforation 121 facing the wafer 200 is lower than the ambient air pressure. Thus, based on the principle of negative pressure adsorption, the wafer 200 can be adsorbed onto the anti-slip pad 120, thereby improving the effect of the anti-slip pad 120 in preventing the wafer 200 from sliding relative to the robotic actuator 100.

[0065] For example, with the second valve 420 in the open state and the first valve 410 in the closed state, the compressed air source 440 can deliver pressurized gas to the first perforation 121 of the anti-slip pad 120 through the gas flow channel 111. Since the pressure of the gas output from the compressed air source 440 is greater than the ambient air pressure, a force can be generated that causes the wafer 200 to "levitate," allowing the wafer 200 to be smoothly separated from the anti-slip pad 120 when it needs to be removed.

[0066] In some embodiments, the wafer transfer device 10 further includes a gas mass flow controller (MFC) 450. The gas mass flow controller 450 is used to accurately measure and control the gas mass flow rate. Thus, when the second valve 420 is open and the first valve 410 is closed, the gas mass flow controller 450 can precisely control the gas flow rate delivered to the first via 121 to prevent the wafer 200 from being "blown away." It should be noted that the specific range of the gas flow rate delivered to the first via 121 can be determined experimentally, and will not be elaborated here.

[0067] In some embodiments, the coolant flow channel 117 is connected to the cooling medium source 460 via a liquid delivery line 310. For example, there are two liquid delivery lines 310, one for supplying the cooling medium and the other for cooling medium return.

[0068] refer to Figure 18In some embodiments, the robotic arm 300 includes an arm gripping module 320. The robotic arm actuator 100 is connected to the arm gripping module 320. A liquid delivery line 310 passes through the arm gripping module 320. A coolant channel 117 passes through the robotic arm actuator 100. When the robotic arm actuator 100 is connected to the arm gripping module 320, the liquid delivery line 310 is aligned with the coolant channel 117. Figure 20 For example, a sealing ring 311 is provided between the liquid delivery pipe 310 and the coolant flow channel 117. In this way, the sealing effect between the liquid delivery pipe 310 and the coolant flow channel 117 can be improved by providing the sealing ring 311.

[0069] refer to Figure 5 and Figure 21 In some embodiments, the gas channel 111 is connected to the first valve 410 and the second valve 420 via the gas delivery pipeline 330. When the wafer transfer device 10 also includes a gas mass flow controller 450, the gas channel 111 is connected to the negative pressure source 430 via the gas delivery pipeline 330 and the first valve 410. The gas channel 111 is also connected to the compressed gas source 440 via the gas delivery pipeline 330, the gas mass flow controller 450, the second valve 420.

[0070] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0071] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the embodiments of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A robotic actuator, characterized in that, include: Body (110) and anti-slip pad (120); The body (110) is provided with a gas flow channel (111) and a receiving hole (112). The hole wall of the receiving hole (112) is provided with a first protrusion (113), and the first protrusion (113) is provided with a vent (1131) communicating with the gas flow channel (111). The anti-slip mat (120) is provided with a first perforation (121) and a second perforation (122). The first perforation (121) penetrates the anti-slip mat (120) along the thickness direction of the anti-slip mat (120), and the second perforation (122) penetrates the anti-slip mat (120) from the hole wall of the first perforation (121) along the direction toward the outer peripheral surface of the anti-slip mat (120). The anti-slip pad (120) is disposed in the receiving hole (112), and the first protrusion (113) is inserted into the second through hole (122) so that the gas flow channel (111) communicates with the first through hole (121) through the second through hole (122); The anti-slip pad (120) is used to support the wafer (200).

2. The robotic actuator according to claim 1, characterized in that, The main body (110) is also provided with an auxiliary mounting hole (114) in the area on the side of the receiving hole (112). The auxiliary mounting hole (114) is connected to the receiving hole (112). The diameter of the auxiliary mounting hole (114) is larger than the outer diameter of the anti-slip pad (120). The anti-slip pad (120) located in the auxiliary mounting hole (114) can pass through the junction area (115) of the auxiliary mounting hole (114) and the receiving hole (112) and be embedded in the receiving hole (112).

3. The robotic actuator according to claim 2, characterized in that, The first protrusion (113) protrudes toward the junction area (115).

4. The robotic actuator according to claim 1, characterized in that, The receiving hole (112) penetrates the body (110) along the thickness direction of the body (110), and the thickness direction of the anti-slip pad (120) is parallel to the thickness direction of the body (110).

5. The robotic actuator according to claim 1, characterized in that, The wall of the receiving hole (112) is provided with a second protrusion (116), and the outer periphery of the anti-slip pad (120) is provided with a first recess (123), and the second protrusion (116) is embedded in the first recess (123).

6. The robotic actuator according to claim 1, characterized in that, The top surface of the anti-slip pad (120) is provided with a second recess (124), and the first perforation (121) penetrates the bottom surface of the second recess (124).

7. The robotic actuator according to claim 1, characterized in that, The body (110) is also provided with a coolant flow channel (117), which passes through the outer periphery of the anti-slip pad (120).

8. The robotic actuator according to claim 7, characterized in that, The coolant flow channel (117) includes a first surrounding section (1171) and a second surrounding section (1172). The first surrounding section (1171) and the second surrounding section (1172) are both arranged around the outer periphery of the anti-slip pad (120). Along the thickness direction of the body (110), the second surrounding section (1172) and the first surrounding section (1171) are distributed at intervals.

9. The robotic actuator according to any one of claims 1 to 8, characterized in that, The body (110) includes a base (110a), a third protrusion (110b), and a fourth protrusion (110c) connected to each other; the number of anti-slip pads (120) is at least three, and the anti-slip pads (120) are provided on the side of the base (110a), the side of the third protrusion (110b) away from the base (110a), and the side of the fourth protrusion (110c) away from the base (110a).

10. A wafer transport device, characterized in that, include: The robotic arm (300) and the robotic arm actuator according to any one of claims 1 to 9, wherein the robotic arm (300) is connected to the robotic arm actuator.

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