A substrate holding device

Abstract

The application relates to a substrate clamping device, comprising: a rotary chuck for carrying a substrate; a pin assembly comprising at least three pin structures arranged circumferentially on the rotary chuck; at least one of the pin structures is a movable pin and is rotatably arranged on the rotary chuck; a magnetic driving assembly configured to apply a magnetic force to the movable pin to drive the movable pin to move, so that the movable pin cooperates with the remaining pin structures to clamp the substrate; the magnetic driving assembly provides a first magnetic force to the movable pin during the movement of the movable pin, and provides a second magnetic force to the movable pin after the movable pin clamps the substrate, the second magnetic force being greater than the first magnetic force. The application reduces the occurrence of the situation that the substrate is impacted during the clamping of the substrate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a substrate clamping device. Background Technology

[0002] In substrate processing processes such as coating, developing, and cleaning, a rotating chuck is used to fix the substrate and drive it to rotate.

[0003] In existing technologies, a movable pin and a magnet are used to clamp the substrate. However, the position of the lifting magnet controlling the opening and closing of the movable pin is relatively simple, typically with only two fixed positions (upper and lower). This results in the clamping force applied by the movable pin to the substrate remaining essentially constant, making it impossible to flexibly adjust according to different working conditions. To ensure that the substrate is fully and reliably clamped during processing, the magnetic force between the movable pin and the lifting magnet often needs to be set sufficiently large to maintain effective clamping even under conditions such as high speeds. However, excessive magnetic force can cause the movable pin to impact the substrate with a large momentum when switching from the open to the clamped state, potentially causing deformation or even breakage of the substrate. Simultaneously, during the impact, the movable pin experiences severe friction with the substrate edge, easily generating debris that falls onto the substrate surface, causing contamination and affecting the quality of subsequent processes. Furthermore, the movable pin itself is prone to plastic deformation or fatigue damage under repeated large impact loads and clamping reaction forces, significantly shortening its service life. Conversely, if the magnetic force and clamping force are appropriately reduced to take into account the aforementioned hazards, the movable pin will not be able to fully press the substrate. When the rotary chuck is at a high speed, relative movement will occur between the substrate and the movable pin, resulting in slippage, which will seriously affect the positioning accuracy and processing safety of the substrate.

[0004] Therefore, it is necessary to provide a new substrate clamping device to solve the above-mentioned problems existing in the prior art. Summary of the Invention

[0005] The technical problem to be solved by this application is how to provide a substrate clamping device that reduces the occurrence of impact on the substrate during the substrate clamping process.

[0006] To address the aforementioned technical problems, according to embodiments of this application, a substrate clamping device is provided, comprising: a rotary chuck for carrying a substrate; a pin assembly including at least three pin structures circumferentially disposed on the rotary chuck; at least one of the pin structures being a movable pin and rotatably disposed on the rotary chuck; and a magnetic drive assembly configured to apply a magnetic force to the movable pin to drive the movable pin to move, such that the movable pin engages with the remaining pin structures to clamp the substrate; the magnetic drive assembly provides a first magnetic force to the movable pin during its movement, and provides a second magnetic force to the movable pin after the movable pin clamps the substrate, wherein the second magnetic force is greater than the first magnetic force.

[0007] According to an embodiment of this application, the magnetic drive assembly includes a magnetic control component and a drive control module. The magnetic control component is located at the bottom of the movable pin and has a first magnetic pole and a second magnetic pole with opposite polarities. The drive control module is located below the rotary chuck and has a first magnetic region and a second magnetic region with opposite magnetic properties. The first magnetic region and the second magnetic region have the same magnetic properties as the first magnetic pole, and the second magnetic region and the second magnetic pole have the same magnetic properties. The first magnetic region of the drive control module is controlled to correspond with the magnetic control component, so that the first magnetic pole of the magnetic control component is away from the drive control module, and the second magnetic pole is close to the drive control module. The second magnetic region of the drive control module is controlled to correspond with the magnetic control component, so that the first magnetic pole of the magnetic control component is close to the drive control module, and the second magnetic pole is away from the drive control module, thereby driving the rotating shaft to rotate.

[0008] According to an embodiment of this application, the drive control module includes a magnetic ring and a lifting driver; the magnetic ring is movably disposed on the rotating chuck along the axial direction of the rotating chuck, and the magnetic ring has an upper half and a lower half, the upper half forming a first magnetic region and the lower half forming a second magnetic region, so as to drive the rotating shaft to rotate when the magnetic ring moves along the axial direction of the rotating chuck; the lifting driver is disposed on the rotating chuck and connected to the magnetic ring, so as to drive the magnetic ring to move along the axial direction of the rotating chuck.

[0009] According to an embodiment of this application, the thickness of the upper half is greater than the thickness of the magnetic control component; during the movement of the movable pin, the lower half provides a repulsive force to the first magnetic pole, and the upper half provides an attractive force to the first magnetic pole, the repulsive force and the attractive force together form the first magnetic force; after the movable pin clamps the substrate, only the upper half provides an attractive force to the first magnetic pole to form the second magnetic force.

[0010] According to an embodiment of this application, the magnetic control component is rectangular in shape and its length extends tangentially to the magnetic ring, so that the magnetic ring attracts the first magnetic pole or the second magnetic pole during movement.

[0011] According to an embodiment of this application, the drive control module includes an electromagnet and a host control unit; there is a gap between the electromagnet and the magnetic control component; the control unit is electrically connected to the electromagnet and is used to adjust the magnitude of the current flowing through the electromagnet to adjust the magnetic force of the electromagnet, and to adjust the direction of the current flowing through the electromagnet to adjust the orientation of the magnetic poles of the electromagnet.

[0012] According to an embodiment of this application, the drive control module includes a support portion and a plurality of magnets; the support portion is movably disposed on the rotating chuck and is used to support the plurality of magnets; wherein, changing the number of magnets adjusts the electromagnetic force of the drive control module; changing the magnetic pole direction of the magnets adjusts the magnetic pole orientation of the drive control module.

[0013] According to an embodiment of this application, the clamping device further includes an adjusting member, which is placed between the magnetic control member and the drive control module and is movably disposed on the rotating chuck to adjust the magnetic force of the drive control module on the magnetic control member during movement.

[0014] According to an embodiment of this application, the movable pin includes a rotating shaft and a clamping member; the rotating shaft is rotatably disposed on the rotating chuck; the clamping member is disposed on the top of the rotating shaft, and the clamping member has a clamping protrusion, the clamping protrusion being eccentrically disposed with respect to the rotating shaft, so as to move closer to or further away from the substrate during the rotation of the rotating shaft; the magnetic control member is disposed on the bottom of the rotating shaft.

[0015] According to an embodiment of this application, the distance between the clamping protrusion and the substrate is smaller than the distance between the magnetic control element and the drive control module.

[0016] By adopting the above technical solution and employing a staged variable magnetic force control method, the movable pin receives the first magnetic force from the magnetic drive component during the clamping process of the substrate. It then smoothly approaches the substrate with lower kinetic energy and speed until it contacts the edge of the substrate. This improves the substrate deformation and breakage caused by violent impacts and eliminates the risk of substrate contamination due to friction-generated debris. This is particularly suitable for manufacturing scenarios with high requirements for cleanliness and surface quality, such as semiconductor wafers. After the movable pin reaches the clamping position, the magnetic drive component switches to a second magnetic force greater than the first magnetic force, giving the movable pin a sufficiently large clamping force to press the substrate firmly. This ensures that there is no relative slippage between the movable pin and the substrate when the rotary chuck is running at high speed, improving the substrate positioning accuracy and process safety. At the same time, by setting opposite magnetic poles in the upper and lower areas of the magnetic ring, the clamping and opening process of the movable pin is achieved by the lifting and lowering motion of a single magnetic ring, avoiding the wear, gap, and contamination problems caused by mechanical transmission. Attached Figure Description

[0017] Figure 1 This is a top view of a clamping device according to an embodiment of the present invention.

[0018] Figure 2 This is a front view of a clamping device according to an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram illustrating the positional relationship between the magnetic ring and the magnetic control component in the initial height range H0 according to an embodiment of the present invention.

[0020] Figure 4 This is a schematic diagram illustrating the positional relationship between the magnetic ring and the magnetic control component in a first preset height range H1 according to an embodiment of the present invention.

[0021] Figure 5 This is a schematic diagram illustrating the positional relationship between the magnetic ring and the magnetic control component in a second preset height range H2, according to an embodiment of the present invention.

[0022] Figure 6 This is a schematic diagram illustrating the positional relationship between the magnetic ring and the magnetic control component in a third preset height range H3 according to an embodiment of the present invention.

[0023] Figure label: 100 Rotary chuck; 200 Base plate; 300 Pin assembly; 310 Movable pin; 311 Rotating shaft; 312 Clamping component; 313 Clamping protrusion; 320 Fixed pin; 400 Magnetic control component; 410 First magnetic pole; 420 Second magnetic pole; 500 Drive control module; 510 Magnetic ring; 511 Upper part; 512 Lower part; 520 Lifting driver; H0 Initial height range; H1 First preset height range; H2 Second preset height range; H3 Third preset height range. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects.

[0025] The following is in conjunction with the appendix Figures 1-6 The specific embodiments of the present invention will be further described in detail below.

[0026] An embodiment of the present invention provides a substrate clamping device for clamping a substrate 200 so as not to affect the rotation process of the substrate 200 after clamping. Specifically, the clamping device includes a rotary chuck 100, a pin assembly 300, and a magnetic drive assembly.

[0027] In some embodiments, the rotary chuck 100 is used to carry the substrate 200. Specifically, the rotary chuck 100 is disposed within the semiconductor cavity of a semiconductor device. The substrate 200 is placed on the rotary chuck 100 and processed within the semiconductor cavity. Simultaneously, the rotary chuck 100 can rotate within the semiconductor cavity about a vertical rotation axis 311. Its top surface forms a flat bearing surface for horizontally placing and carrying the substrate 200. The rotary chuck 100 is connected to an external rotary drive unit (e.g., a servo motor and transmission mechanism) to drive the substrate 200 to rotate stably and uniformly at a preset speed during processes such as coating, developing, or cleaning. The rotation axis 311 of the rotary chuck 100 is approximately coaxial with the center of the substrate 200 to ensure the dynamic balance of the substrate 200 during rotation. This is well known to those skilled in the art and will not be elaborated upon here.

[0028] In some embodiments, the pin assembly 300 includes at least three pin structures circumferentially disposed on the rotary chuck 100; at least one pin structure is a movable pin 310 and rotatably disposed on the rotary chuck 100; specifically, at least three pin structures are evenly distributed along the circumference of the rotary chuck 100, collectively enclosing a clamping area for receiving and positioning the substrate 200. Among the pin structures, at least one is a movable pin 310, and the rest are fixed pins 320. The fixed pins 320 are fixedly mounted on the bearing surface of the rotary chuck 100, and the sidewalls of the fixed pins 320 abut against the edge of the substrate 200 to limit the radial movement of the substrate 200, thereby initially positioning the substrate 200 in the horizontal plane. The movable pin 310 is rotatably disposed on the rotary chuck 100. As the movable pin 310 rotates, its sidewall can abut against the edge of the substrate 200 or separate from the substrate 200. In the initial state, that is, when the movable pin 310 is not engaged with the fixed pin 320 to clamp the substrate 200, the position of the movable pin 310 is defined as the initial position. In the clamping state, that is, when the movable pin 310 engages with the fixed pin 320 to clamp the substrate 200, the position of the movable pin 310 is defined as the clamping position. When the movable pin 310 rotates to the clamping position, the movable pin 310 and the fixed pin 320 engage radially to clamp the substrate 200 circumferentially from multiple directions, thereby fixing the substrate 200 at the center position of the rotary chuck 100.

[0029] In some specific embodiments, at least one movable pin 310 is provided, and at least two fixed pins 320 are provided.

[0030] In some specific embodiments, at least two movable pins 310 are provided, and at least one fixed pin 320 is provided.

[0031] In some specific embodiments, at least three movable pins 310 are provided, and the number of fixed pins 320 is greater than or equal to zero.

[0032] In some embodiments, the magnetic drive assembly is configured to apply a magnetic force to the movable pin 310 to drive the movable pin 310 to move, so that the movable pin 310 engages with the remaining pin structures to clamp the substrate 200; the magnetic drive assembly provides a first magnetic force to the movable pin 310 during the movement of the movable pin 310, and provides a second magnetic force to the movable pin 310 after the movable pin 310 clamps the substrate 200, the second magnetic force being greater than the first magnetic force. Specifically, the magnetic drive assembly is located below the rotary chuck 100 or between the rotary chuck 100 and the substrate 200. The specific location is not limited here, as long as the magnetic drive assembly does not affect the placement of the substrate 200 and can drive the movable pin 310 to rotate. For example, when the magnetic drive assembly is located below the rotary chuck 100, the movable pin 310 passes through the rotary chuck 100 and is rotatably connected to the rotary chuck 100 through a bearing. The magnetic drive assembly drives the movable pin 310 to rotate at the bottom of the rotary chuck 100. When the movable pin 310 is in different positions, the magnetic drive assembly provides different magnitudes of magnetic force to the movable pin 310, which will be detailed later.

[0033] In some embodiments, the magnetic drive assembly includes a magnetic control element 400 and a drive control module 500; the magnetic control element 400 is disposed at the bottom of the movable pin 310, and has a first magnetic pole 410 and a second magnetic pole 420, the polarities of the first magnetic pole 410 and the second magnetic pole 420 being opposite; the drive control module 500 is disposed on the rotary chuck 100, and has a first magnetic region and a second magnetic region, the first magnetic region and the second magnetic region having opposite magnetic properties, the first magnetic region having the same magnetic properties as the first magnetic pole 410, and the second magnetic region having the same magnetic properties as the first magnetic pole 410. The magnetic properties of the first magnetic region and the second magnetic pole 420 are the same. The first magnetic region of the control drive module 500 corresponds to the magnetic control component 400, so that the first magnetic pole 410 of the magnetic control component 400 is away from the drive control module 500, and the second magnetic pole 420 is close to the drive control module 500. The second magnetic region of the control drive module 500 corresponds to the magnetic control component 400, so that the first magnetic pole 410 of the magnetic control component 400 is close to the drive control module 500, and the second magnetic pole 420 is close to the drive control module 500, thereby driving the rotating shaft 311 to rotate. Specifically, the drive control module 500 is installed inside the semiconductor cavity and positioned below the rotating chuck 100, that is, the drive control module 500 is located below the rotating chuck 100 and is radially aligned with the movable pin 310. The first and second magnetic regions of the drive control module 500 are distributed vertically along the axial direction, corresponding to different magnetic force application areas. In this embodiment, both the first magnetic region and the first magnetic pole 410 are N poles, and both the second magnetic region and the second magnetic pole 420 are S poles. When the first magnetic region of the drive control module 500 is axially opposite to the magnetic control component 400, that is, when the first magnetic region is opposite to the first magnetic pole 410, a repulsive force is generated because they have the same magnetism. This repulsive force acts on the first magnetic pole 410 of the magnetic control component 400, and at the same time forms an attractive force on the second magnetic pole 420, causing the first magnetic pole 410 to move away from the drive control module 500 and the second magnetic pole 420 to move closer to the drive control module 500. This drives the movable pin 310 to rotate in the direction that moves the first magnetic pole 410 away from the drive control module 500, thereby driving the clamping mechanism on the movable pin 310 to rotate. The protrusion 313 swings towards the substrate 200 until it abuts against the edge of the substrate 200 and engages with the fixing pin 320 to clamp the substrate 200. When the second magnetic region of the drive control module 500 is opposite to the magnetic control component 400, since they have the same magnetism, they also generate a repulsive force. However, this repulsive force acts on the second magnetic pole 420 of the magnetic control component 400, causing the first magnetic pole 410 to move closer to the drive control module 500 and the second magnetic pole 420 to move closer to the drive control module 500, causing the rotating shaft 311 to rotate in the opposite direction, thereby driving the clamping protrusion 313 away from the substrate 200. More specifically, the magnetic control component 400 can be installed by bonding, snap-fitting, or bolting, etc. The specific connection method will be described later.

[0034] In some embodiments, in order for the movable pin 310 to abut against the edge of the substrate 200 during rotation, the movable pin 310 includes a rotating shaft 311 and a clamping member 312. The rotating shaft 311 is rotatably disposed on the rotary chuck 100. Specifically, the rotary chuck 100 has a mounting hole that extends through the rotary chuck 100 along its axial direction. The rotating shaft 311 is disposed in the mounting hole and is rotatably connected to the rotary chuck 100 through two sets of upper and lower bearings. The inner ring of the bearing is interference-fitted with the rotating shaft 311, and the outer ring is interference-fitted with the mounting hole on the rotary chuck 100, thereby ensuring rotational accuracy while preventing process liquid from entering. The clamping member 312 is disposed on the top of the rotating shaft 311. Its arrangement can be by bonding, snap-fitting, or integral molding. In this embodiment, it is preferred that the two are connected by integral molding. The clamping member 312 has a clamping protrusion 313. Specifically, the clamping member 312 includes a clamping connecting portion and a clamping protrusion 313. The clamping connecting portion is cylindrical and fixedly disposed on the top of the rotating shaft 311 and coaxially arranged with the rotating shaft 311. The diameter of the clamping connecting portion is larger than the diameter of the rotating shaft 311. The clamping protrusion 313... The clamping protrusion 313 is integrally formed on the end face of the clamping connection portion away from the rotating shaft 311, and there is a gap between the axis of the clamping protrusion 313 and the axis of the clamping connection portion, so that the clamping protrusion 313 is eccentrically arranged with respect to the rotating shaft 311. This allows it to move closer to or away from the substrate 200 during the rotation of the rotating shaft 311. When the rotating shaft 311 rotates, the movement trajectory of the clamping protrusion 313 is an arc. The radial component of this arc allows the clamping protrusion 313 to move closer to or away from the center of the substrate 200, thereby achieving clamping or releasing of the periphery of the substrate 200. The magnetic control component 400 is located at the bottom of the rotating shaft 311. Specifically, the magnetic control component 400 is set at the bottom of the rotating shaft 311 by a snap-fit ​​method, and the magnetic control component 400 can rotate around the axis of the rotating shaft 311, thereby driving the rotating shaft 311 to rotate.

[0035] In some specific embodiments, the gap between the clamping protrusion 313 and the substrate 200 is smaller than the gap between the magnetic control component 400 and the drive control module 500. Specifically, when the movable pin 310 is in the initial position, a first gap is maintained between the clamping protrusion 313 and the periphery of the substrate 200, and a second gap is maintained between the magnetic control component 400 and the drive control module 500. The first gap is smaller than the second gap, so that there is sufficient magnetic action distance and adjustment range between the magnetic control component 400 and the drive control module 500. At the same time, it ensures that the clamping protrusion 313 can contact and press the substrate 200 within a small rotation angle, thereby shortening the clamping stroke and improving the response speed.

[0036] In some embodiments, the drive control module 500 includes a magnetic ring 510 and a lifting driver 520. The magnetic ring 510 is an annular permanent magnet coaxially arranged with the rotary chuck 100. The magnetic ring 510 is movably disposed on the rotary chuck 100 along the axial direction. Specifically, the lifting driver 520 is disposed on the rotary chuck 100 and connected to the magnetic ring 510 to drive the magnetic ring 510 to move along the axial direction of the rotary chuck 100. The lifting driver 520 can be a linear motor, a ball screw mechanism, a cam mechanism, or an electric cylinder, etc. Here, the lifting driver 520 is used as an electric cylinder as an example. The lifting driver 520 is fixed to the bottom of the semiconductor chamber or the bottom of the rotary chuck 100 by bolts. Multiple lifting drivers 520 are provided and distributed circumferentially along the magnetic ring 510. The piston rod of the lifting driver 520 is connected to the magnetic ring 510 to drive the magnetic ring 510 to rise or fall along the axial direction of the rotary chuck 100 when the lifting driver 520 is started. The magnetic ring 510 has an upper half 511 and a lower half 512. The upper half 511 forms a first magnetic region, and the lower half 512 forms a second magnetic region. When the magnetic ring 510 moves axially along the rotary chuck 100, it drives the rotating shaft 311 to rotate. Specifically, the upper half 511 of the magnetic ring 510 is the N pole, and the lower half 512 is the S pole. During the axial movement of the magnetic ring 510 along the rotary chuck 100, when the upper half 511 of the magnetic ring 510 interacts with the magnetic control component 400... When the magnetic ring 510 is in contact with the first magnetic pole 410, it provides a repulsive force and an attractive force to the second magnetic pole 420, so as to drive the rotating shaft 311 to rotate and make the clamping protrusion 313 abut against the edge of the substrate 200 to clamp the substrate 200; when the lower half 512 of the magnetic ring 510 is opposite to the magnetic control member 400, the magnetic ring 510 provides an attractive force and a repulsive force to the first magnetic pole 410 and the second magnetic pole 420, so as to drive the rotation to rotate and make the clamping protrusion 313 move away from the substrate 200.

[0037] In some embodiments, the magnetic control element 400 is rectangular in shape, and its length extends tangentially to the magnetic ring 510, so that the magnetic ring 510 attracts the first magnetic pole 410 or the second magnetic pole 420 during movement. Specifically, to facilitate the control of the rotation of the magnetic control element 400, the magnetic control element 400 is configured as a flattened rectangular permanent magnet, whose length extends tangentially to the magnetic ring 510 and whose width points radially toward the magnetic ring 510. This arrangement allows the two magnetic poles (first magnetic pole 410 and second magnetic pole 420) of the magnetic control component 400 to sequentially form effective working areas with different magnetic regions of the magnetic ring 510 during the axial movement of the magnetic ring 510. The rectangular structure increases the effective working area of ​​the magnetic poles, making the magnetic force change more stable and avoiding sudden changes in magnetic force and vibration of the rotating shaft 311 caused by the small area of ​​the magnetic poles. This ensures the smooth movement of the movable pin 310 during rotation. In addition, the length of the magnetic control component 400 extends tangentially along the magnetic ring 510, which ensures that the magnetic ring 510 can drive the magnetic control component 400 to rotate. This improves the problem that the repulsive force provided by the magnetic ring 510 to the control component due to the radial extension of the length of the magnetic control component 400 along the magnetic ring 510 cannot drive the magnetic control component 400 to rotate.

[0038] In some embodiments, the thickness of the upper portion 511 is greater than the thickness of the magnetic control member 400. During the movement of the movable pin 310, the lower portion 512 provides a repulsive force to the first magnetic pole 410, and the upper portion 511 provides an attractive force to the first magnetic pole 410. The repulsive and attractive forces together form a first magnetic force. After the movable pin 310 clamps the substrate 200, only the upper portion 511 provides an attractive force to the first magnetic pole 410 to form a second magnetic force. Specifically, since the axial thickness of the upper portion 511 of the magnetic ring 510 is greater than the thickness of the magnetic control member 400, during the descent of the magnetic ring 510 (corresponding to the upper portion 511 and part of the lower portion 512 of the magnetic control member 400 along the radial direction of the rotating chuck 100), the upper portion 511 of the magnetic ring 510 partially overlaps with the magnetic control member 400 in the axial direction, while the lower portion 512 of the magnetic ring 510 partially overlaps with the magnetic control member 400 in the axial direction and still has a residual effect on the magnetic control member 400. At this point, the first magnetic region and the second magnetic pole 420 of the magnetic control member 400 form an attractive force due to opposite poles attracting each other, while the second magnetic region and the first magnetic pole 410 of the magnetic control member 400 form a repulsive force due to like poles repelling each other. The attractive and repulsive forces combine on the magnetic control member 400 to form a smaller magnetic force, namely the first magnetic force. This first magnetic force generates a small driving torque on the rotating shaft 311, causing the movable pin 310 to rotate at a low angular velocity toward the direction closer to the clamping position, and the clamping protrusion 313 at its end contacts the edge of the substrate 200 in a gentle manner. As the magnetic ring 510 continues to descend, until the magnetic control member 400 corresponds only to the upper half 511 along the radial direction of the rotating chuck 100, the lower half 512 of the magnetic ring 510 has moved away from the magnetic control member 400, and the repulsive force of the second magnetic region on the magnetic control member 400 is greatly reduced. At this point, the upper half 511 mainly generates a strong attractive force due to opposite poles attracting the corresponding magnetic pole of the magnetic control member 400, and this attractive force is the second magnetic force. Since the axial air gap between the magnetic ring 510 and the magnetic control component 400 is at its minimum at this time, the second magnetic force is greater than the first magnetic force, thereby locking the movable pin 310 in the clamping position, so that the clamping protrusion 313 presses the substrate 200 with sufficient positive pressure.

[0039] The following is combined with Figures 2 to 5 The phased variable magnetic force control process of the clamping device in this embodiment is described in detail. When the movable pin 310 is in the initial position, it corresponds to the initial height range H0. When the movable pin 310 moves from the initial position to the clamping position, it corresponds to the first preset height range H1. When the movable pin 310 is in the clamping position, it corresponds to the second preset height range H2. When the movable pin 310 moves from the clamping position to the initial position, it corresponds to the third preset height range H3.

[0040] At the initial height range H0, i.e., when the substrate 200 needs to be placed or released, the movable pin 310 is in its initial position. At this time, the lifting driver 520 raises the magnetic ring 510 to its highest or higher position, i.e., the initial height range H0. In this position, the lower half 512 of the magnetic ring 510 is horizontally opposite to the magnetic control member 400. The lower half 512 generates an opposite magnetic attraction force with the first magnetic pole 410 of the magnetic control member 400, and simultaneously generates an like magnetic repulsion force with the second magnetic pole 420 of the magnetic control member 400. Under this magnetic force balance, the magnetic control member 400 is subjected to a torque that keeps the movable pin 310 in its initial position, thereby ensuring that a sufficient release gap is maintained between the clamping protrusion 313 and the edge of the substrate 200, facilitating the robot arm to horizontally place or remove the substrate 200.

[0041] At the first preset height range H1, i.e., after the substrate 200 is placed in position, the driving magnetic ring 510 begins to descend from the initial height range H0. When the magnetic ring 510 descends to the first preset height range H1, the axial position of the magnetic ring 510 changes, and its upper half 511 begins to enter the magnetic control member 400 radially opposite. At this time, an attraction force of opposite poles is formed between the first magnetic region and the second magnetic pole 420 of the magnetic control member 400, which becomes the main source of torque for the drive shaft 311 to rotate toward the clamping position; at the same time, although the effect of the lower half 512 of the magnetic ring 510 on the magnetic control member 400 is weakened, it has not completely left the range of action, and it still exerts a certain repulsive force of like poles on the first magnetic pole 410 of the magnetic control member 400. Since the axial air gap between the first magnetic region and the magnetic control member 400 is relatively large, and the residual repulsive force of the second magnetic region partially cancels out the attraction force of the first magnetic region, the range of magnetic force in this range is initially set to the smaller first magnetic force. Driven by the first magnetic force, the rotating shaft 311 rotates slowly with low angular acceleration and linear velocity, causing the clamping protrusion 313 to smoothly approach the edge of the substrate 200 until it makes light contact with the edge of the substrate 200. Since the movable pin 310 has low kinetic energy throughout the approach process, there will be no violent impact between the clamping protrusion 313 and the substrate 200, thereby avoiding the risk of deformation or breakage of the substrate 200 due to impact, and also eliminating the hidden danger of generating particulate debris due to friction and contaminating the surface of the substrate 200.

[0042] At the second preset height range H2, i.e., after the clamping protrusion 313 contacts the edge of the substrate 200, a sensor (e.g., a photoelectric sensor, Hall sensor, or microswitch mounted near the rotary chuck 100 or the movable pin 310) detects that the movable pin 310 has reached the preset clamping position. The driving magnetic ring 510 further descends from the first preset height range H1 to the second preset height range H2. In this height range, the lower half 512 of the magnetic ring 510 is far away from the magnetic control member 400, and its repulsive force on the magnetic control member 400 is attenuated to a negligible level; while the axial air gap between the upper half 511 of the magnetic ring 510 and the magnetic control member 400 reaches its minimum, and the opposite attraction between the upper half 511 and the corresponding magnetic poles of the magnetic control member 400 reaches its maximum, thereby generating a second magnetic force much greater than the first magnetic force. Under the action of this second magnetic force, the movable pin 310 obtains a sufficiently large clamping torque, so that the clamping protrusion 313 fixes the substrate 200 with a preset positive pressure. At this time, the substrate 200 is held in the center of the rotary chuck 100 by multiple fixed pins 320 and movable pins 310. Even if the rotary chuck 100 rotates at high speed in subsequent processes, there will be no relative slippage between the substrate 200 and the movable pins 310, thus ensuring the positioning accuracy and process safety of the substrate 200.

[0043] At the third preset height range H3, i.e., when the process is complete and the substrate 200 needs to be released, the driving magnetic ring 510 begins to rise from the second preset height range H2. As the magnetic ring 510 rises, the upper half 511 of the magnetic ring 510 gradually moves away from the magnetic control member 400, and its attractive force on the magnetic control member 400 weakens accordingly; at the same time, the lower half 512 of the magnetic ring 510 is radially aligned with the magnetic control member 400 again. When the magnetic ring 510 rises to the third preset height range H3, the force exerted by the lower half 512 on the magnetic control member 400 is greater than the force exerted by the upper half 511 on the magnetic control member 400. At this time, a repulsive force of like poles is generated between the lower half 512 and the second magnetic pole 420 of the magnetic control member 400. This repulsive force generates a torque on the rotating shaft 311 opposite to the clamping direction, driving the movable pin 310 to rotate toward the initial position, causing the clamping protrusion 313 to gradually move away from the edge of the substrate 200.

[0044] In some other embodiments, the drive control module 500 includes an electromagnet and a host control unit; there is a gap between the electromagnet and the magnetic control component 400; the control unit is electrically connected to the electromagnet and is used to adjust the magnitude of the current flowing through the electromagnet to adjust the magnetic force of the electromagnet, and to adjust the direction of the current flowing through the electromagnet to adjust the orientation of the magnetic poles of the electromagnet. Specifically, an electromagnet is fixedly installed at the bottom of the rotating chuck 100 at a position radially opposite to the magnetic control component 400, and a preset axial air gap is maintained between the iron core of the electromagnet and the magnetic control component 400. The control unit is electrically connected to the electromagnet's coil via a power amplifier. By outputting currents of different amplitudes to the coil, the strength of the magnetic field generated by the electromagnet is changed. When a smaller current is output, the electromagnet generates a smaller magnetic field, corresponding to a smaller magnetic force, for the approach phase of the movable pin 310. When a larger current is output, the electromagnet generates a stronger magnetic field, corresponding to a larger magnetic force, for the clamping and holding phase of the movable pin 310. The specific current value here is set according to actual usage and is not limited here. For example, the smaller current is 1-5A, and the larger current is 10-20A. In addition, by changing the direction of the current flowing through the coil, the electromagnet can switch between the N and S poles of the magnetic control component 400, thereby realizing the conversion of attraction and repulsion on the same electromagnet, so as to facilitate the clamping and opening process of the movable pin 310.

[0045] In some embodiments, the drive control module 500 includes a support portion and multiple magnets; the support portion is movably mounted on the rotary chuck 100 and is used to support the multiple magnets; wherein, changing the number of magnets adjusts the electromagnetic force of the drive control module 500; changing the magnetic pole direction of the magnets adjusts the magnetic pole orientation of the drive control module 500. Specifically, the support portion is a slide or turntable that can move radially or circumferentially along the rotary chuck 100, and multiple magnets are mounted on the support portion in an array. During use, depending on the required magnetic force, the support portion is moved by a motor or cylinder, causing different numbers of magnets to enter the working position opposite to the axial direction of the magnetic control member 400. When the movable pin 310 approaches the substrate 200, only a small number of magnets are opposite to the magnetic control member 400, generating a small first magnetic force; when the movable pin 310 clamps the substrate 200, all or most of the magnets are opposite to the magnetic control member 400, generating a larger second magnetic force, for example, using 3-5 magnets to generate the first magnetic force and using 10-15 magnets to generate the second magnetic force. By adjusting the orientation of each magnet on the bearing part, the magnet that enters the working position can generate the required attraction or repulsion force on the magnetic control component 400, thereby facilitating the clamping and opening process of the movable pin 310.

[0046] In some embodiments, the clamping device further includes an adjusting member positioned between the magnetic control member 400 and the drive control module 500, and movably disposed on the rotary chuck 100 to adjust the magnetic force exerted by the drive control module 500 on the magnetic control member 400 during movement. Specifically, the adjusting member is a flat plate or wedge-shaped plate made of a high-permeability material (e.g., electrical pure iron or silicon steel sheet), movably mounted on the bottom of the rotary chuck 100 via a linear guide rail, and located in the magnetic circuit between the magnetic control member 400 and the drive control module 500. The magnetic force exerted by the drive control module 500 on the magnetic control component 400 is controlled by adjusting the movable adjusting element. When the adjusting element is fully engaged between the magnetic control component 400 and the drive control module 500, the magnetic field lines emitted by the drive control module 500 are short-circuited or shielded by the adjusting element, resulting in the minimum effective magnetic force acting on the magnetic control component 400 through the air gap. When the adjusting element is fully disengaged, the magnetic field lines pass completely through the air gap, and the magnetic force on the magnetic control component 400 is at its maximum. When the adjusting element is partially engaged, the effective magnetic force is between the maximum and minimum. By continuously adjusting the engagement depth of the adjusting element, the magnetic force acting on the movable pin 310 can be steplessly adjusted, thereby providing the required clamping force at different process stages.

[0047] While embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of the invention as set forth in the claims. Furthermore, the invention described herein may have other embodiments and can be implemented or carried out in various ways.

Claims

1. A substrate clamping device, characterized in that, include: A rotary chuck is used to carry the substrate; The pin assembly includes at least three pin structures circumferentially disposed on the rotary chuck; At least one of the pin structures is a movable pin and is rotatably disposed on the rotary chuck; A magnetic drive assembly is configured to apply a magnetic force to the movable pin to drive the movable pin to move, such that the movable pin engages with the remaining pin structures to clamp the substrate; the magnetic drive assembly provides a first magnetic force to the movable pin during the movement of the movable pin, and provides a second magnetic force to the movable pin after the movable pin clamps the substrate, the second magnetic force being greater than the first magnetic force.

2. The clamping device according to claim 1, characterized in that, The magnetic drive assembly includes a magnetic control component and a drive control module; The magnetic control component is located at the bottom of the movable pin, and the magnetic control component has a first magnetic pole and a second magnetic pole, the polarities of the first magnetic pole and the second magnetic pole being opposite; The drive control module is located below the rotary chuck, and the drive control module has a first magnetic region and a second magnetic region. The first magnetic region and the second magnetic region have opposite magnetic properties. The first magnetic region has the same magnetic properties as the first magnetic pole, and the second magnetic region has the same magnetic properties as the second magnetic pole. Specifically, the first magnetic region of the drive control module is controlled to correspond with the magnetic control component, so that the first magnetic pole of the magnetic control component is away from the drive control module and the second magnetic pole is close to the drive control module; the second magnetic region of the drive control module is controlled to correspond with the magnetic control component, so that the first magnetic pole of the magnetic control component is close to the drive control module and the second magnetic pole is away from the drive control module, thereby driving the rotating shaft to rotate.

3. The clamping device according to claim 2, characterized in that, The drive control module includes a magnetic ring and a lifting driver; The magnetic ring is movably disposed on the rotating chuck along the axial direction of the rotating chuck, and the magnetic ring has an upper half and a lower half. The upper half forms the first magnetic region, and the lower half forms the second magnetic region, so as to drive the rotating shaft to rotate when the magnetic ring moves along the axial direction of the rotating chuck. The lifting driver is located on the rotating chuck and connected to the magnetic ring to drive the magnetic ring to move along the axial direction of the rotating chuck.

4. The clamping device according to claim 3, characterized in that, The thickness of the upper part is greater than the thickness of the magnetic control component; During the movement of the movable pin, the lower half provides a repulsive force to the first magnetic pole, and the upper half provides an attractive force to the first magnetic pole. The repulsive force and the attractive force together form the first magnetic force. After the movable pin clamps the substrate, only the upper half of the substrate provides an attractive force to the first magnetic pole to form the second magnetic force.

5. The clamping device according to claim 3, characterized in that, The magnetic control component is rectangular in shape and extends tangentially along the magnetic ring, so that the magnetic ring attracts the first magnetic pole or the second magnetic pole during movement.

6. The clamping device according to claim 2, characterized in that, The drive control module includes an electromagnet and a host control unit; There is a gap between the electromagnet and the magnetic control component; The control unit is electrically connected to the electromagnet and is used to adjust the magnitude of the current flowing through the electromagnet to adjust the magnetic force of the electromagnet, and to adjust the direction of the current flowing through the electromagnet to adjust the orientation of the magnetic poles of the electromagnet.

7. The clamping device according to claim 2, characterized in that, The drive control module includes a load-bearing part and multiple magnets; The supporting portion is movably disposed on the rotary chuck and is used to support a plurality of the magnets; Specifically, the number of magnets is changed to adjust the electromagnetic force of the drive control module; the magnetic pole direction of the magnets is changed to adjust the magnetic pole orientation of the drive control module.

8. The clamping device according to claim 6 or 7, characterized in that, It also includes an adjustment component, which is placed between the magnetic control component and the drive control module and is movably disposed on the rotating chuck to adjust the magnetic force of the drive control module on the magnetic control component during movement.

9. The clamping device according to claim 2, characterized in that, The movable pin includes a pivot and a clamping element; The rotating shaft is rotatably mounted on the rotating chuck; The clamping member is located on the top of the rotating shaft, and the clamping member has a clamping protrusion. The clamping protrusion is eccentrically arranged with respect to the rotating shaft so as to move closer to or further away from the substrate during the rotation of the rotating shaft. The magnetic control component is located at the bottom of the rotating shaft.

10. The clamping device according to claim 9, characterized in that, The gap between the clamping protrusion and the substrate is smaller than the gap between the magnetic control component and the drive control module.

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