A product transfer structure

Abstract

The application belongs to the technical field of wafer manufacturing, and particularly relates to a product transfer structure which comprises a first suction disc grabbing mechanism, a second suction disc grabbing mechanism, a detection module and a die diffusion mechanism. The stroke range of the second suction disc grabbing mechanism intersects with the stroke range of the first suction disc grabbing mechanism. The die diffusion mechanism is in the stroke range of the second suction disc grabbing mechanism. The detection module is located on one side of the die diffusion mechanism. The die diffusion mechanism is in the stroke range of the second suction disc grabbing mechanism. The stroke range of the second suction disc grabbing mechanism intersects with the detection range of the detection module. The detection module is signal connected with the first suction disc grabbing mechanism. The problems of how to ensure that six surfaces of a die can be detected and how to prevent the die from being adsorbed to a film when the die is grabbed are solved.

Description

Technical Field

[0001] This application belongs to the field of wafer manufacturing technology, specifically a product transfer structure. Background Technology

[0002] During the transfer process, chucks are typically used to grip the grains. However, because the grains are small and placed on a thin film, they easily adhere to the film during gripping. Secondly, after gripping, the side of the grain that was held by the chuck cannot be detected. Summary of the Invention

[0003] The purpose of this application is to address the shortcomings of existing technologies by designing a product transfer structure that combines a first suction cup gripping mechanism with a second suction cup gripping mechanism and a die diffusion mechanism. This design prevents the second suction cup gripping mechanism from picking up the thin film while gripping the die, and the exchange between the first and second suction cup gripping mechanisms ensures that all six sides of the die can be detected. This solves the problems of ensuring that all six sides of the die can be detected and preventing the film from being picked up during die gripping.

[0004] To achieve the above objectives, the following technical solution is adopted: A product transfer structure includes a first suction cup gripping mechanism, a second suction cup gripping mechanism, a detection module, and a die diffusion mechanism. The travel range of the second suction cup gripping mechanism intersects with the travel range of the first suction cup gripping mechanism. The die diffusion mechanism is located within the travel range of the second suction cup gripping mechanism. The detection module is located on one side of the die diffusion mechanism, and the die diffusion mechanism is within the travel range of the second suction cup gripping mechanism. The travel range of the second suction cup gripping mechanism intersects with the detection range of the detection module. The detection module is signal-connected to the first suction cup gripping mechanism.

[0005] Preferably, the grain diffusion mechanism includes a first lifting device, a second lifting device, a worktable, a clamping plate, and an air blowing device. The worktable has a circular hole. The clamping plate is a circular plate. An expanded circular hole concentric with the circular hole is provided on the lower surface of the worktable. The diameter of the expanded circular hole is larger than the diameter of the circular hole and equal to the diameter of the clamping plate. The lower end of the first lifting device is fixed to the worktable by a fixing member. The free end of the piston rod of the first lifting device is fixedly connected to the clamping plate. The clamping plate is located on the lower surface of the worktable. The extension direction is perpendicular to the worktable surface. A rectangular hole is provided in the center of the clamping plate. A second lifting device is provided below the clamping plate through a connecting structure. The second lifting device is fixedly connected to the clamping plate through the connecting structure. The lifting direction of the second lifting device is parallel to the lifting direction of the first lifting device. A top plate is provided at the free end of the piston rod of the second lifting device. The top plate is parallel to the worktable surface. A sealed structure is provided below the clamping plate. The rectangular hole communicates with the sealed structure. The air outlet of the air blowing device communicates with the interior of the sealed structure. The air blowing device is fixedly connected to the sealed structure.

[0006] Preferably, the air blowing device is an air pump.

[0007] Preferably, the sealed structure is a rectangular frame with the opening facing upwards, the open end of the rectangular frame is fixedly connected to the lower surface of the clamping plate, and the open end of the rectangular frame communicates with the rectangular hole.

[0008] Preferably, the second lifting device is disposed on the lower surface of the rectangular frame, and the piston rod of the second lifting device extends into the rectangular frame and is fixedly connected to the top plate.

[0009] Preferably, it also includes a frame, the worktable is disposed on the frame, the second suction cup gripping mechanism and the detection module are both disposed on the worktable, the circular hole is disposed on one side of the second suction cup gripping mechanism, and the circular hole is located between the second suction cup gripping mechanism and the detection module.

[0010] Preferably, the second suction cup gripping mechanism includes an X linear motion mechanism, a Y linear motion mechanism, a servo motor, a telescopic rod, and a suction cup assembly. The execution end of the X linear motion mechanism is fixedly connected to the Y linear motion mechanism, and the execution end of the Y linear motion mechanism is fixedly equipped with the servo motor. The output shaft of the servo motor is parallel to the direction in which the X linear motion mechanism drives the Y linear motion mechanism. The telescopic rod is fixedly equipped on the output shaft of the servo motor, and the piston rod of the telescopic rod is perpendicular to the output shaft of the servo motor. The suction cup assembly is equipped on the output shaft of the servo motor.

[0011] Preferably, both the X-linear movement mechanism and the Y-linear movement mechanism are lead screw mechanisms.

[0012] Preferably, the detection module is an industrial camera.

[0013] Compared with the prior art, the beneficial effects of the technical solution of this application are: This application employs a combination of a first suction cup gripping mechanism and a second suction cup gripping mechanism, along with a grain diffusion mechanism, to design a product transfer structure. This structure prevents the second suction cup gripping mechanism from picking up the thin film while gripping the grain. Furthermore, the exchange between the first and second suction cup gripping mechanisms ensures that all six sides of the grain can be detected, thus solving the problems of ensuring that all six sides of the grain can be detected and preventing the film from adsorbing during grain gripping. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 This is a partial schematic diagram of this application; Figure 3 This is a cross-sectional view of the layout of this application.

[0015] Among them, 1. First lifting device; 2. Second lifting device; 3. Worktable; 4. Clamping plate; 5. Blowing device; 6. Circular hole; 7. Expanded circular hole; 8. Rectangular hole; 9. Top plate; 10. Connecting structure; 11. Rectangular frame; 12. Frame; 13. X linear movement mechanism; 14. Y linear movement mechanism; 15. Servo motor; 16. Telescopic rod; 17. Suction cup assembly; 18. Industrial camera; 19. First suction cup gripping mechanism. Detailed Implementation

[0016] Reference Figure 1-3 A product transfer structure includes a first suction cup gripping mechanism 19, a second suction cup gripping mechanism, a detection module, and a die diffusion mechanism. The travel range of the second suction cup gripping mechanism intersects with the travel range of the first suction cup gripping mechanism 19. The die diffusion mechanism is located within the travel range of the second suction cup gripping mechanism. The detection module is located on one side of the die diffusion mechanism and is located within the travel range of the second suction cup gripping mechanism. The travel range of the second suction cup gripping mechanism intersects with the detection range of the detection module. The detection module is signal-connected to the first suction cup gripping mechanism 19.

[0017] In this embodiment, during operation, the feeding mechanism (not shown in the figure) places the wafer filled with wafers onto the die diffusion mechanism. The die diffusion mechanism expands the wafer, separating the dies to a preset gap. Then, the suction cups on the second suction cup grasping mechanism pick up the dies and move them to the detection module for detection. At this time, the dies picked up by the second suction cup grasping mechanism can be detected on five sides, except for the side picked up by the second suction cup grasping mechanism. Then, the second suction cup grasping mechanism moves the dies to the first suction cup grasping mechanism 19, and the first suction cup grasping mechanism 19 picks up the dies from the second suction cup grasping mechanism. At this time, the first suction cup grasping mechanism 19 picks up the side of the die facing away from the second suction cup grasping mechanism (which has already been detected), thus freeing up the side originally picked up by the second suction cup grasping mechanism for detection by the detection module.

[0018] In a preferred embodiment, the grain diffusion mechanism includes a first lifting device 1, a second lifting device 2, a worktable 2, a clamping plate 4, and an air blowing device 5. The worktable 2 has a circular hole 6. The clamping plate 4 is a circular plate. An expanded circular hole 7, concentric with the circular hole 6, is provided on the lower surface of the worktable 2. The diameter of the expanded circular hole 7 is larger than the diameter of the circular hole 6 and equal to the diameter of the clamping plate 4. The lower end of the first lifting device 1 is fixedly mounted to the worktable 3 by a fixing member. The free end of the piston rod of the first lifting device 1 is fixedly connected to the clamping plate 4. The clamping plate 4 is located on the lower surface of the worktable 3. The extension and retraction direction of device 1 is perpendicular to the worktable surface 3. A rectangular hole 8 is provided in the center of the clamping plate 4. A second lifting device 2 is provided below the clamping plate 4 through a connecting structure 10. The second lifting device 2 is fixedly connected to the clamping plate 4 through the connecting structure 10. The lifting direction of the second lifting device 2 is parallel to the lifting direction of the first lifting device 1. A top plate 9 is provided at the free end of the piston rod of the second lifting device 2. The top plate 9 is parallel to the worktable surface 3. A sealed structure is provided below the clamping plate 4. The rectangular hole 8 communicates with the sealed structure. The air outlet of the air blowing device 5 communicates with the interior of the sealed structure. The air blowing device 5 is fixedly connected to the sealed structure.

[0019] After this setup, the wafer loaded with wafers is placed on the clamping plate 4. The first lifting device 1 rises, so that the clamping plate 4 engages with the expanded circular hole 7 to hold the wafer. Then, the blowing device 5 blows into the sealed structure, causing the wafer to bulge and expand, thereby creating a gap between two adjacent wafers on the wafer. Then, the second lifting device 2 rises, causing the top plate 9 to lift the wafer, making it easier for the second suction cup gripping mechanism to grip the wafer.

[0020] As a preferred embodiment, the air blowing device 5 is an air pump.

[0021] As a preferred embodiment, the airtight structure is a rectangular frame 11 with its opening facing upwards. The open end of the rectangular frame 11 is fixedly connected to the lower surface of the clamping plate 4, and the open end of the rectangular frame 11 communicates with the rectangular hole 8. With this configuration, the top plate 9 is located inside the rectangular frame 11, and the movement of the top plate 9 within the rectangular frame 11 will not affect the airtightness of the rectangular frame 11.

[0022] As a preferred embodiment, the second lifting device 2 is disposed on the lower surface of the rectangular frame 11, and the piston rod of the second lifting device 2 extends into the rectangular frame 11 and is fixedly connected to the top plate 9. This arrangement ensures that the second lifting device 2 does not affect the airtightness of the rectangular frame 11. In practice, both the second lifting device 2 and the first lifting device 1 employ cylinders.

[0023] As a preferred embodiment, the system also includes a frame 12, on which the worktable 3 is mounted. The second suction cup gripping mechanism and the detection module are both mounted on the worktable 3. A circular hole 6 is located on one side of the second suction cup gripping mechanism, between the second suction cup gripping mechanism and the detection module. By mounting the frame 12, all components are integrated onto the frame 12, facilitating movement and changes in the work environment.

[0024] As a preferred embodiment, the second suction cup gripping mechanism includes an X-line moving mechanism 13, a Y-line moving mechanism 14, a servo motor 15, a telescopic rod 16, and a suction cup assembly 17. The execution end of the X-line moving mechanism 13 is fixedly connected to the Y-line moving mechanism 14, and the execution end of the Y-line moving mechanism 14 is fixedly mounted on the servo motor 15. The output shaft of the servo motor 15 is parallel to the direction in which the X-line moving mechanism 13 drives the Y-line moving mechanism 14. The telescopic rod 16 is fixedly mounted on the output shaft of the servo motor 15, and the piston rod of the telescopic rod 16 is perpendicular to the output shaft of the servo motor 15. The suction cup assembly 17 is mounted on the output shaft of the servo motor 15. With this configuration, the X-line moving mechanism 13, the Y-line moving mechanism 14, the servo motor 15, the telescopic rod 16, and the suction cup assembly 17 function as a robotic arm to grip the die to a preset spatial position. The X-line moving mechanism 13 and the Y-line moving mechanism 14 employ rodless cylinders or lead screw mechanisms, which are existing technologies.

[0025] As a preferred embodiment, both the X linear motion mechanism 13 and the Y linear motion mechanism 14 are lead screw mechanisms.

[0026] As a preferred embodiment, the detection module is an industrial camera 18. Using an industrial camera 18 allows for the detection of surface defects in the grains.

Claims

1. A product transfer structure, characterized in that, The device includes a first suction cup gripping mechanism (19), a second suction cup gripping mechanism, a detection module, and a die diffusion mechanism. The travel range of the second suction cup gripping mechanism intersects with the travel range of the first suction cup gripping mechanism (1). The die diffusion mechanism is within the travel range of the second suction cup gripping mechanism. The detection module is located on one side of the die diffusion mechanism. The die diffusion mechanism is within the travel range of the second suction cup gripping mechanism. The travel range of the second suction cup gripping mechanism intersects with the detection range of the detection module. The detection module is signal-connected to the first suction cup gripping mechanism (19).

2. The product transfer structure according to claim 1, characterized in that: The grain diffusion mechanism includes a first lifting device (1), a second lifting device (2), a worktable (2), a clamping plate (4), and an air blowing device (5). The worktable (2) has a circular hole (6), and the clamping plate (4) is a circular plate. An extended circular hole (7) concentric with the circular hole (6) is provided on the lower surface of the worktable (2). The diameter of the extended circular hole (7) is larger than the diameter of the circular hole (6), and the diameter of the extended circular hole (7) is equal to the diameter of the clamping plate (4). The lower end of the first lifting device (1) is fixedly set to the worktable (3) by a fastener. The free end of the piston rod of the first lifting device (1) is fixedly connected to the clamping plate (4). The clamping plate (4) is located on the lower surface of the worktable (3). The extension direction of the clamping plate (4) is perpendicular to the worktable surface (3). A rectangular hole (8) is provided in the center of the clamping plate (4). A second lifting device (2) is provided below the clamping plate (4) through a connecting structure (10). The second lifting device (2) is fixedly connected to the clamping plate (4) through the connecting structure (10). The lifting direction of the second lifting device (2) is parallel to the lifting direction of the first lifting device (1). A top plate (9) is provided at the free end of the piston rod of the second lifting device (2). The top plate (9) is parallel to the worktable surface (3). A sealed structure is provided below the clamping plate (4). The rectangular hole (8) is connected to the sealed structure. The air outlet of the air blowing device (5) is connected to the interior of the sealed structure. The air blowing device (5) is fixedly connected to the sealed structure.

3. The product transfer structure according to claim 2, characterized in that: The air blowing device (5) is an air pump.

4. The product transfer structure according to claim 3, characterized in that: The sealed structure is a rectangular frame (11) with the opening facing upward. The opening end of the rectangular frame (11) is fixedly connected to the lower surface of the clamping plate (4), and the opening end of the rectangular frame (11) is connected to the rectangular hole (8).

5. A product transfer structure according to claim 4, characterized in that: The second lifting device (2) is located on the lower surface of the rectangular frame (11), and the piston rod of the second lifting device (2) extends into the rectangular frame (11) and is fixedly connected to the top plate (9).

6. A product transfer structure according to claim 5, characterized in that: It also includes a frame (12), the worktable (3) is provided on the frame (12), the second suction cup gripping mechanism and the detection module are both provided on the worktable (3), the circular hole (6) is provided on one side of the second suction cup gripping mechanism, and the circular hole (6) is located between the second suction cup gripping mechanism and the detection module.

7. The product transfer structure according to claim 1, characterized in that: The second suction cup gripping mechanism includes an X linear motion mechanism (13), a Y linear motion mechanism (14), a servo motor (15), a telescopic rod (16), and a suction cup assembly (17). The execution end of the X linear motion mechanism (13) is fixedly connected to the Y linear motion mechanism (14). The execution end of the Y linear motion mechanism (14) is fixedly provided with the servo motor (15). The output shaft of the servo motor (15) is parallel to the direction in which the X linear motion mechanism (13) drives the Y linear motion mechanism (14). The telescopic rod (16) is fixedly provided on the output shaft of the servo motor (15). The piston rod of the telescopic rod (16) is perpendicular to the output shaft of the servo motor (15). The suction cup assembly (17) is provided on the output shaft of the servo motor (15).

8. A product transfer structure according to claim 7, characterized in that: Both the X linear motion mechanism (13) and the Y linear motion mechanism (14) are lead screw mechanisms.

9. A product transfer structure according to claim 1, characterized in that: The detection module is an industrial camera (18).

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