A semiconductor package device and a packaging method

Abstract

The application relates to the technical field of semiconductor chip packaging, and discloses a semiconductor packaging device and a packaging method, wherein a chip assembly is driven to rotate by a centrifugal rotating table, a semi-solid heat-conducting paste in a filling cavity is flattened on the inner wall of a heat-dissipating cover by using centrifugal force, and the angle adjustment of the assembling plate around the hinge is matched, so that the outer flat surface of the heat-conducting paste is parallel to the contact surface of the chip and wraps the contact surface and part of the adjacent side wall, the heat-conducting paste is uniformly distributed in the closed filling cavity in a preset shape, internal bubbles are effectively discharged under the action of the centrifugal force, and the bubble-free state of the heat-conducting paste filling is ensured. The existing packaging process of the heat-dissipating cover and the chip lacks a means for inhibiting the formation of bubbles in the heat-conducting paste, so that bubbles are easily left in the gap, and the packaging quality is affected.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip packaging technology, specifically to a semiconductor packaging apparatus and packaging method. Background Technology

[0002] Existing semiconductor packaging equipment uses a dispensing-capping method to fill the gap between the heat sink and the chip with thermal paste, thereby filling the gap, venting air, and reducing contact thermal resistance. The packaging process is as follows: First, the dispensing mechanism applies thermal paste to the surface of the chip fixed on the worktable according to a set path and amount. Then, the heat sink is pressed onto the substrate, and the pressure is used to deform the thermal paste and fill the gap between the heat sink and the chip.

[0003] However, during the aforementioned encapsulation process, the thermal paste is compressed and deformed within the enclosed environment inside the heatsink cap, with its edges extending freely outwards during this compression. Because air bubbles or cavities easily remain in the gaps after the thermal paste is applied and during contact with the heatsink cap, these bubbles and cavities extend further under compression, encroaching on the gap space and affecting the overall thermal conductivity of the thermal paste. More importantly, because the heatsink cap is in a closed environment during pressing, the generation of bubbles and cavities cannot be directly detected and addressed during the encapsulation process. They can only be identified through ultrasonic scanning after pressing. Once bubbles or cavities are detected, the product faces the dilemma of being scrapped or requiring complex rework. Therefore, the existing encapsulation between the heatsink cap and the chip still has significant shortcomings in terms of bubble control. Summary of the Invention

[0004] The purpose of this invention is to provide a semiconductor packaging device and packaging method, which solves the problem that the existing heat sink and chip packaging process lacks means to suppress the formation of air bubbles in the thermal paste, resulting in air bubbles easily remaining in the gaps and thus affecting the packaging quality.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a semiconductor packaging apparatus, comprising: The paste application mechanism includes a centrifugal turntable and a clamping assembly disposed on the side of the centrifugal turntable. The clamping assembly vertically fixes the chip assembly to the radial outer side of the centrifugal turntable, and the heat dissipation cap of the chip assembly is disposed in a direction away from the centrifugal turntable. The filling cavity inside the heat sink cover is provided with semi-solid thermal paste. When the centrifugal turntable rotates, the thermal paste is spread evenly on the inner wall of the filling cavity by centrifugal force, and the chip assembly is fixed at a preset angle so that the outer surface of the thermal paste is parallel to the contact surface of the chip in the centrifugal state. The outer surface of the thermal paste covers the contact surface of the chip and the part of the side wall adjacent to the contact surface.

[0006] As a further step of the above technical solution: the upper side of the centrifugal turntable is provided with an assembly table for assembling clamping components; The clamping assembly includes an assembly plate and multiple corner pressing cylinders disposed on one side of the assembly plate.

[0007] As a further step of the above technical solution: one side of the assembly plate is rotatably mounted on one side of the assembly table via a hinge, and an arc-shaped toothed plate is fixedly mounted on the side of the assembly plate away from the hinge. The inner side of the assembly table is provided with a control mechanism for controlling the rotation of the assembly plate around the axis. The control mechanism includes a gear that meshes with the arc-shaped toothed plate.

[0008] As a further step of the above technical solution: a limiting plate is provided on one side of the arc-shaped toothed plate. The limiting plate is used to limit the maximum rotation angle of the assembly plate when it rotates away from the assembly table. When the assembly plate is in the maximum rotation angle state, the outer surface of the thermal paste inside the heat dissipation cover is parallel to the contact surface of the chip, and the thermal paste covers the contact surface and the adjacent side wall.

[0009] As a further step of the above technical solution: multiple assembly plates are arranged on the outer circumference of the assembly table, and the chip components clamped by the multiple assembly plates are on the same circumferential path. The control mechanism also includes a gear ring two that is rotated and mounted on the inner side of the assembly table, and a servo motor that controls the rotation of the gear ring two. A gear two that meshes with the gear ring two is coaxially provided at the lower end of the gear.

[0010] As a further step of the above technical solution: a gear ring and a turntable power connector are coaxially provided on the lower side of the centrifugal turntable. The gear ring is connected to an external drive mechanism and is used to drive the centrifugal turntable to rotate. The corner pressing cylinder and the servo motor are electrically connected to an external control system through the turntable power connector.

[0011] As a further step of the above technical solution: the inner wall of the heat dissipation cover is provided with a rectangular enclosure that protrudes towards the chip and covers the chip on the inside. The inner side of the enclosure forms a filling cavity for filling semi-solid thermal paste, and the outer edge of the enclosure extends beyond the contact surface of the chip along the protruding direction.

[0012] As a further step of the above technical solution: the protrusion height of the first side of the enclosure near the hinge is higher than the protrusion height of the second side of the enclosure away from the hinge, and the adjacent sides of the first and second sides have a beveled transition structure.

[0013] As a further step of the above technical solution: the enclosure is an external frame fixedly bonded to the inner wall of the heat sink cover, or an inner rib integrally stamped and formed on the inner wall of the heat sink cover.

[0014] The present invention also provides a semiconductor packaging method, comprising the following steps: S1: The chip assembly is fixed and clamped on the outside of the assembly plate by the corner pressing cylinder, with the heat sink facing outward; S2: Control the assembly plate to rotate toward the assembly table via the control mechanism; S3: Control the centrifugal turntable to rotate at a uniform speed to the preset speed, and wait for the thermal paste inside the enclosure to gather on one side of the guardrail, and for the outer surface of the thermal paste to be flat. S4: Then, the assembly plate is rotated away from the assembly table by the control mechanism until the assembly plate rotates to the maximum angle under the limit plate limit state. During this period, the outer surface of the thermal paste and the chip contact surface change from a cross state to a parallel state, and the thermal paste covers the contact surface and part of the adjacent sidewalls. S5: Control the centrifugal turntable to decelerate and stop rotating uniformly, without damaging the flatness of the thermal paste surface during the deceleration process.

[0015] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are: 1. The chip assembly is rotated by a centrifugal turntable. Centrifugal force is used to spread the semi-solid thermal paste in the filling cavity evenly on the inner wall of the heat sink. At the same time, the angle of the assembly plate around the hinge is adjusted so that the outer surface of the thermal paste is parallel to the chip contact surface and wraps the contact surface and part of the adjacent sidewalls. This makes the thermal paste evenly distributed in a preset shape in the closed filling cavity. The internal air bubbles are effectively discharged under the action of centrifugal force, reducing the probability of air bubble residue in the filling of thermal paste.

[0016] 2. The thermal paste is spread evenly on the inside of the heat sink under the action of centrifugal force, away from the substrate surface and chip pins, which effectively avoids contact contamination of the substrate circuit and chip pins, thereby improving the packaging quality. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of an existing chip component structure; Figure 2 This is a schematic diagram of the AA cross-sectional structure of the chip assembly of the present invention; Figure 3 This is a schematic diagram of the AA cross-sectional structure of the heat dissipation cover of the present invention; Figure 4 This is a schematic diagram of the plastering mechanism of the present invention; Figure 5 This is a schematic diagram of the plaster application mechanism and control mechanism of the present invention; Figure 6 This is a top view schematic diagram of the plastering mechanism of the present invention; Figure 7 This is a schematic diagram of the front structure of the assembly plate of the present invention; Figure 8 This is a schematic diagram of the back structure of the assembly plate of the present invention; Figure 9 This is a schematic diagram of the assembly plate and assembly table structure of the present invention; Figure 10 This is a schematic diagram of the structure of the first and second baffles of the heat dissipation cover of the present invention; Figure 11 This is a schematic diagram showing the state of the heat dissipation cover of the present invention when the assembly plate is rotated and tilted; Figure 12 This is a schematic diagram of the structure of the heat sink cover and the peripheral frame of the present invention; Figure 13 This is a schematic diagram of the state in which the outer surface of the thermal paste inside the chip assembly tilts due to centrifugal force according to the present invention; Figure 14 This is a schematic diagram illustrating the state of adjusting the fixed angle of the chip assembly according to the present invention.

[0018] In the diagram: 10. Heat sink cover; 102. Chip; 103. Substrate; 11. Enclosure; 111. Edge guard 1; 112. Edge guard 2; 12. Filling cavity; 20. Paste application mechanism; 21. Centrifugal turntable; 211. Gear ring 1; 212. Turntable power connector; 213. Assembly table; 22. Assembly plate; 221. Arc-shaped gear plate; 222. Hinge; 223. Limiting plate; 23. Corner pressing cylinder; 24. Control mechanism; 241. Gear 1; 242. Gear 2; 243. Gear ring 2; 244. Servo motor. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] To further understand the content of this invention, a detailed description of the invention will be provided in conjunction with the accompanying drawings.

[0021] Combination Figure 1 The existing chip assembly includes a substrate 103, a chip 102 soldered to the surface of the substrate 103, and a heat sink 10 covering the chip 102. The upper surface of the chip 102 and the inner surface of the heat sink 10 form a filling cavity 12, which needs to be filled with semi-solid thermal paste to establish a thermally conductive connection between the chip 102 and the heat sink 10.

[0022] Since the heat sink 10 completely encloses the periphery of the chip 102, thermal paste needs to be pre-applied to the surface of the chip 102. The heat sink 10 is then assembled onto the surface of the chip 102, causing the thermal paste to deform under the pressure of the heat sink 10 and fill the filling cavity 12. However, during the deformation process, the deformation shape of the thermal paste is uncontrolled, and the generation of air bubbles is random. To control the deformation state of the thermal paste within the sealed filling cavity 12 and reduce the probability of air bubbles forming when the thermal paste fills the filling cavity 12, the present invention provides the following embodiments, as detailed below: Example 1 Combination Figures 2 to 12 This embodiment provides a semiconductor packaging device, including: The paste-spreading mechanism 20 includes a centrifugal turntable 21 and a clamping assembly disposed on the side of the centrifugal turntable 21. For example... Figures 4 to 6 As shown, the clamping assembly vertically fixes the chip assembly to the outside, and the heat sink 10 of the chip assembly faces away from the centrifugal turntable 21. Combination Figure 3 The filling cavity 12 inside the heat sink 10 contains semi-solid thermal grease. When the centrifugal turntable 21 rotates, the speed is controlled to be ≤2000 rpm and the time ≤3 min. Centrifugal force increases the fluidity of the thermal grease, allowing it to spread evenly on the inner wall of the filling cavity 12. Simultaneously, at this centrifugal speed, the risk of stratification within the thermal grease is low (thermal grease is typically a mixture of a liquid matrix and a solid filler, with the solid filler particle size ranging from 0.5 to 10 mm). Within the μm range, 2000 rpm is far less than the rotational speed required for solid-phase filler to undergo stratification. When air bubbles are present in the thermal paste, they tend to migrate towards the center of rotation under centrifugal and buoyancy effects, thus being expelled from the thermal paste. Simultaneously, the outer surface of the thermal paste (the outer surface refers to the plane facing the chip 102 after the thermal paste is laid inside the filling cavity 12) is parallel to the contact surface of the chip 102 (the contact surface refers to the back of the chip 102, i.e., the surface adjacent to the heat sink 10), and the filling amount of the thermal paste in the filling cavity 12 satisfies the following condition: the outer surface of the thermal paste can cover the contact surface of the chip 102 and the portion of the sidewall adjacent to the chip 102 (the sidewall refers to the upper part of the pins of the chip 102). Thus, inside the closed filling cavity 12, the thermal paste can contact the chip 102 in a preset shape with a low residual rate of internal air bubbles.

[0023] It is worth mentioning that: First, the thermal paste can cover multiple directions on the upper area of ​​chip 102, thereby increasing the thermal contact surface between the chip and the heat sink and further improving the uniform thermal conductivity of the thermal paste.

[0024] Second, the thermal paste is spread evenly on the inside of the heat sink 10 under the action of centrifugal force, away from the surface of the substrate 103 and the pin portion of the chip 102, thereby avoiding contact contamination of the circuit on the surface of the substrate 103 and the pins of the chip 102.

[0025] It is important to note that: (combination) Figure 13 and Figure 14As the thermal paste rotates centrifugally within the filling cavity 12, it will migrate in the opposite direction of rotation due to its own fluid inertia, causing its outer surface (shaded part facing the axis) to tilt. Therefore, the clamping angle of the chip assembly can be adjusted accordingly to control the outer surface of the thermal paste to be parallel to the contact surface of the chip 102 during centrifugal rotation.

[0026] Specifically, in combination Figures 4 to 7 The centrifugal turntable 21 has an assembly table 213 on its upper side for assembling clamping components; The clamping assembly includes an assembly plate 22 and multiple corner-pressing cylinders 23 disposed on one side of the assembly plate 22, which clamp the chip assembly in a fixed manner. The assembly plate 22 is assembled at a preset angle on one side of the assembly table 213 so that the outer surface of the thermal paste can be parallel to the contact surface of the chip 102 when the thermal paste is centrifugally rotated.

[0027] Based on Embodiment 1, the present invention further proposes a more preferred Embodiment 2.

[0028] Combination Figures 5 to 9 One side of the assembly plate 22 is rotatably mounted to one side of the assembly table 213 via the hinge 222. An arc-shaped toothed plate 221 is fixedly mounted on the side of the assembly plate 22 away from the hinge 222. The center of the arc-shaped toothed plate 221 is coaxial with the axis of rotation of the hinge 222.

[0029] An assembly platform 213 has an inner side equipped with a control mechanism 24 for controlling the rotation of the assembly plate 22 around an axis. The control mechanism 24 includes a gear 241 that meshes with an arc-shaped toothed plate 221. The control mechanism 24 drives the gear 241 to rotate, which in turn causes the assembly plate 22 to rotate on one side of the assembly platform 213. Changing the setting angle of the chip assembly on one side of the assembly platform 213 can change the relative position between the outer surface of the thermal paste and the chip 102, thereby realizing the adjustment of the angle of the chip assembly in the centrifugal rotation state.

[0030] Furthermore, combined Figures 9 to 11 First, control one end of the assembly plate 22 to rotate closer to the assembly table 213. At this time, the outer surface of the thermal grease in the filling cavity 12 is as follows: Figure 11As shown by the dashed line, the outer surface of the thermal paste intersects with the contact surface of the chip 102. During centrifugal rotation, air bubbles inside the thermal paste tend to migrate towards the center of rotation under the influence of centrifugal force and buoyancy. By making the outer surface of the thermal paste intersect with the contact surface of the chip 102, an inclined venting path is formed between the contact surface of the chip 102 and the thermal paste, thereby reducing the possibility of air bubbles being trapped in the interface area between the contact surface of the chip 102 and the thermal paste. Subsequently, the angle of the assembly plate 22 is gradually adjusted so that the thermal paste gradually covers the contact surface of the chip 102, thereby reducing the possibility of air bubbles being trapped in the contact area. Specifically, one end of the assembly plate 22 is slowly restored to a preset position away from the assembly table 213, and the intersection line of the outer surface of the thermal paste and the contact surface of the chip 102 gradually moves to one side, so that the thermal paste gradually fills the contact from one side of the chip 102 to the other side, ultimately forming a... Figure 10 The state shown further reduces the probability of air bubbles remaining at the interface between the thermal paste and the contact surface.

[0031] Furthermore, combined Figure 8 and Figure 9 A limiting plate 223 is provided on one side of the arc-shaped toothed plate 221. The limiting plate 223 is used to limit the maximum rotation angle of the assembly plate 22 when it rotates away from the assembly table 213. When the assembly plate 22 is in this maximum rotation angle state, the outer surface of the thermal paste inside the heat sink cover 10 is parallel to the contact surface of the chip 102, and the thermal paste covers the contact surface and part of the adjacent sidewalls.

[0032] Furthermore, multiple assembly plates 22 are arranged circumferentially on the outer side of the assembly table 213. The chip components clamped by the multiple assembly plates 22 are located on the same circumferential path, thereby enabling simultaneous operation on multiple chip components and improving work efficiency. The control mechanism 24 also includes a gear ring 243 rotatably mounted on the inner side of the assembly table 213, and a servo motor 244 controlling the rotation of the gear ring 243. The lower end of the gear 1 241 is coaxially provided with a gear 242 that meshes with the gear ring 243. The gear ring 243 synchronously drives multiple gears 242, which facilitates the synchronous control of the rotation of multiple assembly plates 22.

[0033] Furthermore, a gear ring 211 and a turntable power connector 212 (which is one of a conductive slip ring, a slip ring, or a rotary connector) are coaxially arranged on the lower side of the centrifugal turntable 21. The gear ring 211 is connected to an external drive mechanism to drive the centrifugal turntable 21 to rotate. The corner pressing cylinder 23 and the servo motor 244 are electrically connected to an external control system through the turntable power connector 212. The control system includes an electrical control cabinet for controlling the corner pressing cylinder 23 and multiple servo motors 244 to operate in the above-described manner.

[0034] Regarding the corner pressing cylinder 23 that clamps the chip assembly, its working principle is explained as follows: The cylinder body of the angle-down cylinder 23 is fixed to the back of the assembly plate 22 by bolts. The axis of its piston rod is perpendicular to the surface of the assembly plate 22. The end of the piston rod is connected to a clamping block through an angle mechanism. The piston rod first extends axially and the angle mechanism drives the clamping block to rotate around the axis of the piston rod by a certain angle (usually 90°), so that the clamping block rotates laterally on the assembly plate 22, which facilitates the placement of the chip assembly in the clamping position on the side of the assembly plate 22. Then, after the chip assembly is placed, the piston rod is controlled to retract, which drives the clamping block to rotate downward and press the chip assembly against one side of the assembly plate 22. The clamping surface of the clamping block is clamped around the periphery of the heat sink 10, thereby fixing the chip assembly to the side of the assembly plate 22.

[0035] Based on Embodiment 1 and Embodiment 2, the present invention further proposes Embodiment 3, which provides a heat dissipation cover 10 with even better performance.

[0036] Specifically, refer to Figure 2 , Figure 3 , Figure 10 and Figure 12 The inner wall of the heat sink 10 is provided with a rectangular enclosure 11 that protrudes towards the chip 102 and covers the chip 102 on the inside. The inner side of the enclosure 11 forms a filling cavity 12 for filling semi-solid thermal paste. The enclosure 11 can save the amount of thermal paste used, and the outer edge of the enclosure 11 extends beyond the contact surface of the chip 102 along the protruding direction, ensuring that the thermal paste inside the enclosure 11 can completely cover the contact surface of the chip 102.

[0037] Combination Figure 10 The first edge 111 of the enclosure 11, which protrudes higher than the second edge 112 on the side away from the hinge 222, is positioned at an angle. The two adjacent edges of the enclosure 111 and the second edge 112 are beveled. In the second embodiment, the thermal paste gathered on one side is blocked by the first edge 111, preventing it from overflowing the enclosure 11 and flowing to the outside, thus avoiding insufficient thermal paste retention inside the enclosure 11 and preventing complete coverage of the contact surface of the chip 102.

[0038] Furthermore, such as Figure 12 As shown, the enclosure 11 includes an external frame that is fixedly adhered to the inner wall of the heat sink 10. The existing pre-fabricated heat sink 10 can be applied to the paste application mechanism 20 of this invention through simple secondary processing; or, as... Figure 2 As shown, the enclosure 11 is an inner rib integrally stamped with the heat dissipation cover 10, and is formed in one piece during the stamping process along with the heat dissipation cover 10.

[0039] The present invention also provides a semiconductor packaging method, comprising the following steps: S1: The chip assembly is fixedly clamped to the outside of the assembly plate 22 by the corner pressing cylinder 23, and the heat sink 10 faces outward. S2: Control the assembly plate 22 to rotate toward the assembly table 213 via the control mechanism 24; S3: Control the centrifugal turntable 21 to rotate at a uniform speed until the preset speed is reached, and wait for the thermal paste inside the enclosure 11 to gather on one side of the edge 111, and the outer surface of the thermal paste to be in a flat state. S4: Then, the assembly plate 22 is rotated away from the assembly table 213 by the control mechanism 24 until the assembly plate 22 reaches the maximum rotation angle under the limit of the limit plate 223; during this period, the contact surface between the outer surface of the thermal paste and the chip 102 changes from a cross state to a parallel state, and the thermal paste covers the contact surface and part of the adjacent sidewalls. S5: Control the centrifugal turntable 21 to decelerate uniformly until it stops rotating, without damaging the flatness of the thermal paste surface during the deceleration process.

[0040] Furthermore, for chip components found to have air bubbles after ultrasonic scanning (SAT) inspection, the above-mentioned encapsulation method can be applied to the chip components before the thermal paste has been heated and cured, so that the air bubbles can be removed without opening the heat sink cover 10, thereby simplifying the rework process.

[0041] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A semiconductor packaging device, characterized in that, include: The paste application mechanism (20) includes a centrifugal turntable (21) and a clamping assembly disposed on the side of the centrifugal turntable (21). The clamping assembly vertically fixes the chip assembly to the radial outer side of the centrifugal turntable, and the heat dissipation cover (10) of the chip assembly is disposed in a direction away from the centrifugal turntable (21). The heat dissipation cover (10) has a semi-solid thermal paste in the filling cavity (12) inside. When the centrifugal turntable (21) rotates, the thermal paste is spread flat on the inner wall of the filling cavity (12) by centrifugal force. The chip assembly is fixed at a preset angle so that the outer surface of the thermal paste is parallel to the contact surface of the chip (102) in the centrifugal state. The outer surface of the thermal paste covers the contact surface of the chip (102) and the part of the side wall adjacent to the contact surface.

2. The semiconductor packaging device according to claim 1, characterized in that: The centrifugal turntable (21) is provided with an assembly table (213) on its upper side for assembling clamping components. The clamping assembly includes an assembly plate (22) and a plurality of corner pressing cylinders (23) disposed on one side of the assembly plate (22).

3. A semiconductor packaging device according to claim 2, characterized in that: The assembly plate (22) is rotatably mounted on one side of the assembly table (213) via a hinge (222), and an arc-shaped toothed plate (221) is fixedly mounted on the side of the assembly plate (22) away from the hinge (222). The inner side of the assembly table (213) is provided with a control mechanism (24) for controlling the assembly plate (22) to rotate around the axis. The control mechanism (24) includes a gear (241) that meshes with the arc-shaped toothed plate (221).

4. A semiconductor packaging device according to claim 3, characterized in that: The arc-shaped toothed plate (221) is provided with a limiting plate (223) on one side. The limiting plate (223) is used to limit the maximum rotation angle of the assembly plate (22) when it rotates away from the assembly table (213). When the assembly plate (22) is in the maximum rotation angle state, the outer surface of the thermal paste inside the heat dissipation cover (10) is parallel to the contact surface of the chip (102), and the thermal paste covers the contact surface and the adjacent side wall.

5. A semiconductor packaging device according to claim 3, characterized in that: Multiple assembly plates (22) are arranged on the outer circumference of the assembly table (213), and the chip components clamped by the multiple assembly plates (22) are on the same circumferential path. The control mechanism (24) also includes a gear ring two (243) that is rotatably mounted on the inner side of the assembly table (213), and a servo motor (244) that controls the rotation of the gear ring two (243). The lower end of the gear one (241) is coaxially provided with a gear two (242) that meshes with the gear ring two (243).

6. A semiconductor packaging apparatus according to claim 5, characterized in that: The centrifugal turntable (21) is coaxially provided with a gear ring (211) and a turntable power connector (212) on its lower side. The gear ring (211) is connected to an external drive mechanism to drive the centrifugal turntable (21) to rotate. The corner pressing cylinder (23) and the servo motor (244) are electrically connected to an external control system through the turntable power connector (212).

7. A semiconductor packaging device according to claim 3, characterized in that: The inner wall of the heat sink (10) is provided with a rectangular enclosure (11) that protrudes toward the chip (102) and covers the chip (102) on the inside. The inner side of the enclosure (11) forms a filling cavity (12) filled with semi-solid thermal paste. The outer edge of the enclosure (11) extends beyond the contact surface of the chip (102) along the protruding direction.

8. A semiconductor packaging device according to claim 7, characterized in that: The protrusion height of the first side (111) of the enclosure (11) near the hinge (222) is higher than that of the second side (112) away from the hinge (222). The adjacent sides of the first side (111) and the second side (112) have a slanted transition structure.

9. A semiconductor packaging apparatus according to claim 7, characterized in that: The enclosure (11) is an external frame that is fixedly bonded to the inner wall of the heat dissipation cover (10), or an inner rib that is integrally stamped and formed on the inner wall of the heat dissipation cover (10).

10. A semiconductor packaging method, characterized in that, Includes the following steps: S1: The chip assembly is fixedly clamped on the outside of the assembly plate (22) by the corner pressing cylinder (23), and the heat sink (10) faces outward; S2: Control the assembly plate (22) to rotate toward the assembly table (213) via the control mechanism (24); S3: Control the centrifugal turntable (21) to rotate at a uniform speed to the preset speed, and wait for the thermal paste inside the enclosure (11) to gather on one side of the guardrail (111), and the outer surface of the thermal paste to be flat. S4: Then, control the assembly plate (22) to rotate away from the assembly table (213) through the control mechanism (24) until the assembly plate (22) rotates to the maximum angle under the limit state of the limit plate (223). During this period, the contact surface of the thermal paste and the chip (102) changes from a cross state to a parallel state, and the thermal paste covers the contact surface and part of the adjacent sidewalls. S5: Control the centrifugal turntable (21) to decelerate and rotate until it stops, without damaging the planar state of the thermal paste surface during the deceleration process.

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