Miniaturized high-density 5G communication module packaging structure and packaging method

Abstract

The application relates to the field of 5G communication module packaging technology, in particular to a miniaturized high-density 5G communication module packaging structure and a packaging method, which comprises a base provided with positioning holes at four corners and a main chip module installed in the middle of the base, an embedding groove is formed in the middle of the upper end of the base, the main chip module is installed in the middle of the embedding groove, a packaging shell is installed on the inner side of the upper end of the embedding groove, and four auxiliary heat dissipation units are installed on the lower end of the side surface of the packaging shell; the auxiliary heat dissipation unit comprises a heat conduction shell, drive assemblies driven by the internal heat of the 5G communication module are installed on the inner sides of the two ends of the heat conduction shell, one end of the heat conduction shell is arranged in the packaging shell, the other end of the heat conduction shell is exposed to the outside of the packaging shell, and a heat dissipation assembly is installed at the position where the heat conduction shell is exposed to the outside of the packaging shell; the heat dissipation assembly comprises an aluminum heat dissipation shaft. In the application, multi-directional synchronous heat conduction is realized, local hot spots are avoided, the packaging shell adopts an aluminum alloy shell, and the advantages of light weight and excellent heat conductivity are combined.

Description

Technical Field

[0001] This invention relates to a miniaturized, high-density 5G communication module packaging structure and packaging method, belonging to the field of 5G communication module packaging technology. Background Technology

[0002] With the rapid development of 5G communication technology, communication modules are evolving towards miniaturization, high-density integration, and high frequency and speed. The integration of main chip modules is constantly improving, and the power consumption density per unit volume is increasing significantly, leading to a sharp increase in the heat flux density inside the module.

[0003] Traditional 5G communication module packaging structures typically employ passive heat dissipation solutions, such as transferring heat to the surface of the package shell for natural convection heat dissipation by attaching metal heat sinks, thermal pads, or thermal adhesives to the chip surface, or adding a fan to the outside of the module for forced air cooling.

[0004] However, passive heat dissipation solutions rely on static thermal contact, with fixed thermal paths and high thermal resistance. As the thermal medium ages or interface contact deteriorates over time, the heat dissipation efficiency will further decrease. Moreover, heat can only be transferred outward through limited thermal paths, failing to fully utilize the heat dissipation area around the module, resulting in prominent local hot spots. Therefore, there is an urgent need to improve a miniaturized, high-density 5G communication module packaging structure and packaging method to solve the above-mentioned problems. Summary of the Invention

[0005] The purpose of this invention is to provide a miniaturized, high-density 5G communication module packaging structure and packaging method. Without relying on an external power source or significantly increasing the module size, this invention utilizes the heat generated by the module itself to drive the internal heat dissipation mechanism to operate actively, efficiently and dynamically transferring the accumulated heat inside the module to the outside. This solves the problems of internal heat not being able to be dissipated in time under high-density packaging conditions, heat dissipation efficiency decreasing with usage time, and heat dissipation intensity not being able to be adaptively adjusted, ensuring that the main chip module remains within a safe temperature range during long-term high-load operation.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A miniaturized, high-density 5G communication module packaging structure and method includes a base with positioning holes at all four corners and a main chip module installed in the middle of the base. An embedding groove is formed in the middle of the upper end of the base, and the main chip module is installed in the middle of the embedding groove. A packaging shell is installed on the inner side of the upper end of the embedding groove. Four auxiliary heat dissipation units are installed on the lower side of the packaging shell. Each auxiliary heat dissipation unit includes a heat-conducting shell. Driving components that utilize the internal heat of the 5G communication module are installed on the inner sides of both ends of the heat-conducting shell. One end of the heat-conducting shell is located inside the packaging shell, and the other end is exposed on the outer side of the packaging shell. A heat dissipation component is installed at the exposed position on the outer side of the packaging shell. The heat dissipation component includes an aluminum heat dissipation shaft. Multiple heat-conducting and heat-dissipating annular grooves are formed on the outer side of the aluminum heat dissipation shaft. Positioning shafts are fixedly connected to both ends of the aluminum heat dissipation shaft. A micro-toothed ring is fixedly connected to the outer side of the positioning shaft away from the aluminum heat dissipation shaft.

[0008] Furthermore, the encapsulation shell includes an aluminum alloy shell embedded in the embedding groove. The vertical projection of the aluminum alloy shell is square, and heat dissipation holes for installing auxiliary heat dissipation units are provided on the lower sides of the aluminum alloy shell.

[0009] Furthermore, the heat-conducting shell includes a plate body, one side of which has a heat-conducting fin mounting groove, and the other side of which has a semi-circular groove for mounting heat dissipation components. Positioning grooves are provided at both ends of the semi-circular groove, and multiple heat-conducting blocks are fixedly connected inside the semi-circular groove. Both ends of the plate body have thermal expansion rod mounting grooves, and the end of the thermal expansion rod mounting groove near the positioning groove has multiple external communication holes.

[0010] Furthermore, the positioning groove is connected to the thermal expansion rod mounting groove, the vertical cross-section of the positioning groove is T-shaped, multiple aluminum thermally conductive fins are installed inside the thermally conductive fin mounting groove, and the cross-section of the thermally conductive block is triangular.

[0011] Furthermore, the positioning shaft is rotatably connected to the plate body through a positioning groove, and the cross-section of one side of the heat-conducting and heat-dissipating ring groove is triangular, and the heat-conducting and heat-dissipating ring groove is adapted to the heat-conducting block.

[0012] Furthermore, the driving assembly includes a thermal expansion rod, the thermal expansion rod having multiple heat absorption holes on its outer wall, a moving plate fixedly connected to the moving end of the thermal expansion rod, multiple teeth fixedly connected to the upper end of the moving plate, and a return spring fixedly connected to the end of the moving plate away from the thermal expansion rod.

[0013] Furthermore, a sealing ring is installed at the connection between the thermal expansion rod and the plate. The sealing ring is located at the end of the external communication hole away from the semicircular groove, and the end of the thermal expansion rod away from the semicircular groove does not contact the inner wall of the thermal expansion rod mounting groove.

[0014] Furthermore, the movable plate is disposed at the lower end of the micro gear ring, and the teeth fixed at the upper end of the movable plate mesh with the micro gear ring.

[0015] Furthermore, it includes the following steps:

[0016] Step 1: Provide a base and precisely cut an embedding slot for accommodating the core device at the upper center of the base according to the packaging specifications;

[0017] Step 2: Align and fix the main chip module that has completed functional testing inside the embedded slot in the middle of the base, ensuring that the bottom of the chip fits tightly against the bottom of the slot;

[0018] Step 3: Install the four auxiliary heat dissipation units into the preset mounting positions on the lower side of the package shell, so that one end of the auxiliary heat dissipation unit extends into the inside of the package shell and the other end is exposed on the outside of the package shell, thus completing the integrated pre-assembly of the package shell and the heat dissipation components.

[0019] Step 4: Cover the upper part of the base with the package shell pre-installed with the auxiliary heat dissipation unit, so that the lower edge of the package shell is embedded in the inner side of the embedding groove and fixedly and sealed with the base to form a closed inner cavity to protect the main chip module.

[0020] Step 5: Secure the base to the package shell, ensuring that the upper surface of the main chip module in the inner cavity and the end of the auxiliary heat dissipation unit located inside the package shell form a thermally conductive contact. At the same time, confirm that the heat dissipation terminal of the auxiliary heat dissipation unit exposed on the outside is working properly. Finally, a package module structure integrating sealing protection and efficient heat dissipation is formed, and then tested.

[0021] Furthermore, the testing process is as follows:

[0022] Step 6: Apply the rated working load to the packaged module to generate heat in the main chip module. The heat is transferred to the heat-conducting shell through the heat-conducting fins. At this time, monitor whether the thermal expansion rod efficiently absorbs the heat in the cavity through the heat absorption holes on its outer wall and generates directional expansion displacement along the direction of the thermal expansion rod mounting groove.

[0023] Step 7: Observe whether the teeth fixed at the upper end of the moving plate form a precise mesh with the micro gear ring when the moving end of the thermal expansion rod pushes the moving plate, and drive the micro gear ring to rotate. Verify whether the micro gear ring can drive the aluminum heat dissipation shaft to rotate smoothly in the semi-circular groove through the positioning shaft, and ensure that there is no jamming or interference.

[0024] Step 8: During the rotation of the aluminum heat sink shaft, check whether the multiple heat conduction and heat dissipation ring grooves opened on its outer side form a continuous and tight sliding scraping fit with the heat conduction block fixed inside the semi-circular groove. Monitor the temperature rise of the aluminum heat sink shaft surface exposed on the outside of the package shell by infrared thermal imaging to confirm whether the internal heat can be effectively conducted to the external environment through the dynamic rotating contact structure.

[0025] Step 9: After power is cut off or the load is reduced to allow the module to cool down, check whether the reset spring can drive the moving plate and thermal expansion rod to accurately return to the initial position. At the same time, check whether the sealing ring installed on the end of the external connecting hole away from the semi-circular groove maintains airtightness during the reciprocating movement of the thermal expansion rod, in order to prevent condensation or contamination inside the encapsulation shell due to gas exchange.

[0026] Step 10: Place the module in a high and low temperature alternating test chamber and repeat the above thermal drive and reset cycle. Finally, test the operating parameters of the main chip module to ensure that the internal temperature of the package is always maintained within the rated operating threshold under the repeated mechanical action of the auxiliary heat dissipation unit, and that there is no obvious wear on all moving parts. This will determine that the long-term reliability of the packaging process meets the standards.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] 1. This invention utilizes a thermal expansion rod to absorb heat from the inner cavity and generate directional expansion. Through the meshing of teeth with a micro gear ring, linear displacement is converted into rotational motion, driving the aluminum heat dissipation shaft to rotate continuously without the need for an external power source. The triangular heat-conducting ring groove on the aluminum heat dissipation shaft and the triangular heat-conducting block in the semi-circular groove rotate and cooperate to form continuous dynamic scraping contact, constantly updating the heat conduction interface, effectively reducing static contact thermal resistance, significantly improving heat dissipation efficiency, and the reset spring automatically returns to its position after cooling, so that the heat dissipation intensity is adaptively adjusted with temperature changes, perfectly matching the intermittent load characteristics of 5G modules.

[0029] 2. This invention uses an embedded slot in the base to accommodate the main chip module, and auxiliary heat dissipation units are installed at the lower ends of all four sides of the package shell to achieve multi-directional synchronous heat conduction and avoid local hot spots. The package shell is made of aluminum alloy, which combines lightweight and excellent thermal conductivity. The heat dissipation holes provide a precise installation channel for the auxiliary heat dissipation units. Aluminum heat-conducting fins are installed on one side of the heat-conducting shell to improve heat absorption efficiency, and a semi-circular groove is opened on the other side to fix the triangular heat-conducting block. With the help of the T-shaped positioning groove, the heat dissipation components are accurately positioned and rotated stably. The overall structure is compact and fully adapts to the space requirements of high-density integration.

[0030] 3. This invention achieves a tight connection from base prefabrication to encapsulation shell locking, realizing integrated encapsulation and heat dissipation, which is conducive to mass production. The test covers key dimensions such as thermal drive, transmission engagement, dynamic heat conduction, reset sealing and high and low temperature cycle aging. The sealing ring ensures that the inner cavity remains airtight during the reciprocating motion of the thermal expansion rod, preventing condensation and contamination. High and low temperature cycle verification ensures that the temperature remains controllable under repeated mechanical actions and that there is no obvious wear on moving components, ensuring the thermal reliability and service life of the module in long-term operation. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0032] Figure 2 This is a schematic diagram of the installation position structure of the main chip module of the present invention;

[0033] Figure 3 For the present invention Figure 2 Enlarged structural diagram at point D;

[0034] Figure 4 This is a schematic diagram of the packaging shell structure of the present invention;

[0035] Figure 5 This is a schematic diagram of the auxiliary heat dissipation unit structure of the present invention;

[0036] Figure 6 For the present invention Figure 5 Enlarged structural diagram at point A in the middle;

[0037] Figure 7 This is a schematic diagram of the heat-conducting shell structure of the present invention;

[0038] Figure 8 For the present invention Figure 7 Enlarged structural diagram at point B;

[0039] Figure 9 This is a schematic diagram of the heat dissipation component structure of the present invention;

[0040] Figure 10 For the present invention Figure 9 Enlarged structural diagram at point C;

[0041] Figure 11 This is a schematic diagram of the drive component structure of the present invention;

[0042] Figure 12 For the present invention Figure 11 Enlarged structural diagram at point E in the middle.

[0043] In the diagram, 1. Base; 2. Encapsulation shell; 21. Aluminum alloy shell; 22. Heat dissipation hole; 3. Auxiliary heat dissipation unit; 31. Thermal conductive shell; 311. Board body; 312. Thermal conductive fin mounting groove; 313. External communication hole; 314. Thermal expansion rod mounting groove; 315. Semicircular groove; 316. Thermal conductive block; 317. Positioning groove; 32. Heat dissipation assembly; 321. Aluminum heat dissipation shaft; 322. Thermal conductive and heat dissipation ring groove; 323. Positioning shaft; 324. Miniature gear ring; 33. Drive assembly; 331. Thermal expansion rod; 332. Heat absorption hole; 333. Moving board; 334. Tooth; 335. Reset spring; 4. Embedded groove; 5. Main chip module. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] like Figures 1-12 As shown, this embodiment provides a miniaturized, high-density 5G communication module packaging structure, including a base 1 with positioning holes at all four corners and a main chip module 5 installed in the middle of the base 1. An embedding groove 4 is formed in the middle of the upper end of the base 1, and the main chip module 5 is installed in the middle of the embedding groove 4. A packaging shell 2 is installed on the inner side of the upper end of the embedding groove 4. Four auxiliary heat dissipation units 3 are installed on the lower side of the packaging shell 2. The auxiliary heat dissipation unit 3 includes a heat-conducting shell 31. Driving components 33, which utilize the internal heat of the 5G communication module, are installed on the inner sides of both ends of the heat-conducting shell 31. One end of the heat-conducting shell 31 is located inside the packaging shell 2, and the other end is exposed on the outside of the packaging shell 2. A heat dissipation component 32 is installed at the exposed position of the heat-conducting shell 31 on the outside of the packaging shell 2. The heat dissipation component 32 includes an aluminum heat dissipation shaft 321. Multiple heat-conducting and heat-dissipating ring grooves 322 are formed on the outer side of the aluminum heat-dissipating shaft 321. Positioning shafts 323 are fixedly connected to both ends of the aluminum heat-dissipating shaft 321. A micro gear ring 324 is fixedly connected to the outer side of the positioning shaft 323 away from the aluminum heat-dissipating shaft 321. The main chip module 5 is accommodated by an embedded groove 4 formed on the upper end of the base 1. Auxiliary heat dissipation units 3 are installed in four directions on the lower side of the package shell 2 to realize the multi-directional synchronous heat dissipation of the internal heat of the module. The auxiliary heat dissipation units 3 use the internal heat of the 5G communication module to drive the heat dissipation component 32 to work. No external power source is required, and heat dissipation is self-driven. Multiple heat-conducting and heat-dissipating ring grooves 322 are formed on the outer side of the aluminum heat-dissipating shaft 321, which significantly increases the heat dissipation area and effectively improves the heat dissipation efficiency per unit volume, thereby meeting the thermal management requirements under miniaturized high-density packaging.

[0046] In one possible embodiment, the encapsulation shell 2 includes an aluminum alloy shell 21 embedded in the embedding groove 4. The vertical projection of the aluminum alloy shell 21 is square. Heat dissipation holes 22 for installing the auxiliary heat dissipation unit 3 are opened on the lower sides of the aluminum alloy shell 21. The encapsulation shell 2 uses an aluminum alloy shell 21 embedded in the embedding groove 4. The aluminum alloy material has both lightweight and excellent thermal conductivity, which helps to quickly conduct the heat in the cavity to the shell surface. The vertical projection of the aluminum alloy shell 21 is square, which matches the shape of the base 1 and facilitates positioning and installation. Heat dissipation holes 22 are opened on the lower sides of the encapsulation shell 2, providing a precise installation channel for the auxiliary heat dissipation unit 3. This not only ensures the structural integrity of the encapsulation shell 2, but also avoids the impact of additional openings on the shell strength, thus improving the overall structural reliability of the module.

[0047] In one possible embodiment, the heat-conducting shell 31 includes a plate 311. A heat-conducting fin mounting groove 312 is formed on one side of the plate 311, and a semi-circular groove 315 for mounting a heat dissipation assembly 32 is formed on the other side of the plate 311. Positioning grooves 317 are formed at both ends of the semi-circular groove 315. Multiple heat-conducting blocks 316 are fixedly connected inside the semi-circular groove 315. Thermal expansion rod mounting grooves 314 are formed at both ends of the plate 311. Multiple external communication holes 313 are formed at the end of the thermal expansion rod mounting groove 314 near the positioning groove 317. The positioning groove 317 communicates with the thermal expansion rod mounting groove 314. The vertical cross-section of the positioning groove 317 is T-shaped. Multiple aluminum heat-conducting fins are installed inside the heat-conducting fin mounting groove 312. The heat-conducting blocks 316 have a triangular cross-section. The heat-conducting shell 31 passes through the plate. A heat-conducting fin mounting groove 312 is opened on one side to install aluminum heat-conducting fins, which greatly improves the heat collection efficiency inside. A semi-circular groove 315 is opened on the other side to install the heat dissipation component 32. Multiple heat-conducting blocks 316 with triangular cross sections are fixed inside, realizing a compact layout of the internal heat absorption surface and the external heat dissipation surface. T-shaped positioning grooves 317 are opened at both ends of the semi-circular groove 315 and are connected to the thermal expansion rod mounting groove 314, providing precise limit and support for the rotation of the positioning shaft 323, ensuring the concentricity and stability of the heat dissipation component 32 when rotating. The setting of the external connection hole 313 enables the thermal expansion rod 331 to sense the temperature change of the internal cavity and form a sensitive thermal drive response. The overall structure is compact and highly integrated, which fully meets the requirements of 5G communication module for internal space utilization.

[0048] In one possible embodiment, the positioning shaft 323 is rotatably connected to the plate 311 via the positioning groove 317. The heat-conducting and heat-dissipating ring groove 322 has a triangular cross-section on one side and is adapted to the heat-conducting block 316. The positioning shaft 323 is rotatably connected to the plate 311 via the positioning groove 317, ensuring that the rotation axis of the aluminum heat dissipation shaft 321 is fixed during long-term operation, avoiding mechanical failure caused by offset or sway. The heat-conducting and heat-dissipating ring groove 322 has a triangular cross-section on one side and is adapted to the heat-conducting block 316, which also has a triangular cross-section. The two form continuous sliding contact during the rotation of the aluminum heat dissipation shaft 321, which not only ensures the efficient transfer of heat from the heat-conducting block 316 to the aluminum heat dissipation shaft 321, but also continuously updates the contact interface through scraping action, preventing the accumulation of static thermal resistance and significantly improving the dynamic heat dissipation efficiency.

[0049] In one possible embodiment, the drive assembly 33 includes a thermal expansion rod 331. The thermal expansion rod 331 has multiple heat absorption holes 332 on its outer wall. A movable plate 333 is fixedly connected to the movable end of the thermal expansion rod 331. Multiple teeth 334 are fixedly connected to the upper end of the movable plate 333. A return spring 335 is fixedly connected to the end of the movable plate 333 away from the thermal expansion rod 331. A sealing ring is installed at the connection between the thermal expansion rod 331 and the plate 311. The sealing ring is located at the end of the external communication hole 313 away from the semi-circular groove 315. The end of the thermal expansion rod 331 away from the semi-circular groove 315 does not contact the inner wall of the thermal expansion rod mounting groove 314. The movable plate 333 is located at the lower end of the micro gear ring 324, and the teeth 334 fixed at the upper end of the movable plate 333 mesh with the micro gear ring 324. The drive assembly 33 uses the thermal expansion rod 331 as the core drive. The moving component has multiple heat-absorbing holes 332 on its outer wall to increase the heat absorption area, which can quickly absorb heat from the inner cavity and generate expansion. The upper fixed teeth 334 of the moving plate 333 mesh with the micro gear ring 324, which accurately converts the linear expansion displacement of the thermal expansion rod 331 into the rotational motion of the micro gear ring 324, thereby driving the aluminum heat dissipation shaft 321 to rotate. This achieves a seamless connection between heat self-sensing and heat dissipation self-driving. The return spring 335 automatically pulls the moving plate 333 back to its original position after the module cools down, so that the heat dissipation component 32 has reversible working capability and adapts to the intermittent high load working characteristics of the communication module. The sealing ring is set at the end of the external communication hole 313 away from the semi-circular groove 315. It maintains airtightness during the reciprocating movement of the thermal expansion rod 331, effectively preventing condensation or contamination in the inner cavity of the encapsulation shell 2 due to gas exchange, and taking into account both high heat dissipation efficiency and high sealing reliability.

[0050] like Figures 1-12 As shown in the figure, the principle of the packaging method for a miniaturized high-density 5G communication module packaging structure provided in this embodiment is as follows: It includes the following steps:

[0051] Step 1: Provide a base 1, and precisely open an embedding slot 4 at the upper middle position of the base 1 to accommodate the core device according to the packaging specifications;

[0052] Step 2: Align and fix the main chip module 5, which has completed functional testing, inside the embedded slot 4 in the middle of the base 1, ensuring that the bottom of the chip fits tightly against the bottom of the slot;

[0053] Step 3: Install the four auxiliary heat dissipation units 3 into the preset mounting positions on the lower side of the packaging shell 2 respectively, so that one end of the auxiliary heat dissipation unit 3 extends into the inside of the packaging shell 2 and the other end is exposed on the outside of the packaging shell 2, thus completing the integrated pre-assembly of the packaging shell 2 and the heat dissipation components.

[0054] Step 4: Cover the upper end of the base 1 with the package shell 2 pre-installed with the auxiliary heat dissipation unit 3, so that the lower edge of the package shell 2 is embedded in the inner side of the embedding groove 4 and fixedly and sealed with the base 1 to form a closed inner cavity to protect the main chip module 5.

[0055] Step 5: Complete the locking and fixing of the base 1 and the package shell 2, so that the upper surface of the main chip module 5 in the inner cavity and the end of the auxiliary heat dissipation unit 3 located inside the package shell 2 form a thermally conductive contact. At the same time, confirm that the heat dissipation terminal of the auxiliary heat dissipation unit 3 exposed on the outside is working properly. Finally, a package module structure integrating sealing protection and efficient heat dissipation is formed, and testing is carried out.

[0056] The test process is as follows: Step 6: Apply the rated working load to the packaged module to generate heat in the main chip module 5. The heat is transferred to the heat-conducting shell 31 through the heat-conducting fins. At this time, monitor whether the thermal expansion rod 331 efficiently absorbs the heat in the cavity through the heat absorption hole 332 on its outer wall and generates directional expansion displacement along the direction of the thermal expansion rod mounting groove 314.

[0057] Step 7: Observe whether the teeth 334 fixed at the upper end of the moving plate 333 form a precise mesh with the micro gear ring 324 when the moving end of the thermal expansion rod 331 pushes the moving plate 333 to move, and drive the micro gear ring 324 to rotate. Verify whether the micro gear ring 324 can drive the aluminum heat dissipation shaft 321 to rotate smoothly in the semi-circular groove 315 through the positioning shaft 323, and ensure that there is no jamming or interference.

[0058] Step 8: During the rotation of the aluminum heat sink shaft 321, check whether the multiple heat conduction and heat dissipation ring grooves 322 opened on its outer side form a continuous and tight sliding scraping fit with the heat conduction block 316 fixed inside the semi-circular groove 315. Monitor the temperature rise of the aluminum heat sink shaft 321 exposed on the outside of the package shell 2 by infrared thermal imaging to confirm whether the internal heat can be effectively conducted to the external environment through the dynamic rotating contact structure.

[0059] Step 9: After power is cut off or the load is reduced to allow the module to cool down, check whether the reset spring 335 can drive the moving plate 333 and the thermal expansion rod 331 to accurately return to the initial position. At the same time, check whether the sealing ring installed on the end of the external communication hole 313 away from the semi-circular groove 315 maintains airtightness during the reciprocating movement of the thermal expansion rod 331, in order to prevent condensation or contamination inside the encapsulation shell 2 due to gas exchange.

[0060] Step 10: Place the module in a high and low temperature alternating test chamber and repeat the above thermal drive and reset cycle. Finally, test the operating parameters of the main chip module 5 to ensure that the internal temperature of the package shell 2 is always maintained within the rated operating threshold under the repeated mechanical action of the auxiliary heat dissipation unit 3, and that there is no obvious wear on all moving parts. This will determine that the long-term reliability of the packaging process meets the standard.

[0061] From base prefabrication, chip mounting, heat dissipation unit pre-assembly, and package shell assembly to final locking and fixing, each step is closely connected, realizing the integrated design of the packaging structure and heat dissipation system. The testing process covers five dimensions: thermal expansion drive verification, mechanical transmission engagement verification, dynamic thermal conductivity contact verification, automatic reset and sealing verification, and high and low temperature cycle aging verification, comprehensively covering the key performance indicators of the packaging structure under actual working conditions. Through systematic testing, it is ensured that the thermal drive heat dissipation mechanism can work stably throughout the entire life cycle of the module, effectively guaranteeing the thermal reliability and long service life of the 5G communication module under high-density, high-power operating conditions, and providing a reliable quality control means for the mass production of miniaturized 5G communication modules.

[0062] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0063] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A miniaturized, high-density 5G communication module packaging structure, comprising a base (1) with positioning holes at all four corners and a main chip module (5) mounted in the middle of the base (1), characterized in that: An embedding groove (4) is provided in the middle of the upper end of the base (1). A main chip module (5) is installed in the middle of the embedding groove (4). A packaging shell (2) is installed on the inner side of the upper end of the embedding groove (4). Four auxiliary heat dissipation units (3) are installed on the lower side of the packaging shell (2). The auxiliary heat dissipation unit (3) includes a heat-conducting shell (31). Both ends of the heat-conducting shell (31) are equipped with driving components (33) that utilize the heat inside the 5G communication module. One end of the heat-conducting shell (31) is located inside the encapsulation shell (2), and the other end of the heat-conducting shell (31) is exposed outside the encapsulation shell (2). A heat dissipation component (32) is installed at the position where the heat-conducting shell (31) is exposed outside the encapsulation shell (2). The heat dissipation assembly (32) includes an aluminum heat dissipation shaft (321). Multiple heat-conducting and heat dissipation ring grooves (322) are provided on the outer side of the aluminum heat dissipation shaft (321). Positioning shafts (323) are fixedly connected to both ends of the aluminum heat dissipation shaft (321). A miniature gear ring (324) is fixedly connected to the outer side of the end of the positioning shaft (323) away from the aluminum heat dissipation shaft (321).

2. The miniaturized, high-density 5G communication module packaging structure according to claim 1, characterized in that: The encapsulation shell (2) includes an aluminum alloy shell (21) embedded in the embedding groove (4). The vertical projection of the aluminum alloy shell (21) is square. The lower sides of the aluminum alloy shell (21) are provided with heat dissipation holes (22) for installing auxiliary heat dissipation units (3).

3. The miniaturized, high-density 5G communication module packaging structure according to claim 1, characterized in that: The heat-conducting shell (31) includes a plate (311). A heat-conducting fin mounting groove (312) is provided on one side of the plate (311). A semi-circular groove (315) for installing a heat dissipation component (32) is provided on the other side of the plate (311). Positioning grooves (317) are provided at both ends of the semi-circular groove (315). Multiple heat-conducting blocks (316) are fixedly connected inside the semi-circular groove (315). A thermal expansion rod mounting groove (314) is provided at both ends of the plate (311). Multiple external communication holes (313) are provided at the end of the thermal expansion rod mounting groove (314) near the positioning groove (317).

4. The miniaturized, high-density 5G communication module packaging structure according to claim 3, characterized in that: The positioning groove (317) is connected to the thermal expansion rod mounting groove (314). The vertical cross-section of the positioning groove (317) is T-shaped. Multiple aluminum thermal fins are installed inside the thermal fin mounting groove (312). The cross-section of the thermal block (316) is triangular.

5. The miniaturized, high-density 5G communication module packaging structure according to claim 1, characterized in that: The positioning shaft (323) is rotatably connected to the plate (311) through the positioning groove (317). The heat-conducting and heat-dissipating ring groove (322) has a triangular cross section on one side, and the heat-conducting and heat-dissipating ring groove (322) is compatible with the heat-conducting block (316).

6. The miniaturized, high-density 5G communication module packaging structure according to claim 1, characterized in that: The drive assembly (33) includes a thermal expansion rod (331), the thermal expansion rod (331) has a plurality of heat absorption holes (332) on its outer wall, a moving plate (333) is fixedly connected to the moving end of the thermal expansion rod (331), a plurality of teeth (334) are fixedly connected to the upper end of the moving plate (333), and a return spring (335) is fixedly connected to the end of the moving plate (333) away from the thermal expansion rod (331).

7. The miniaturized, high-density 5G communication module packaging structure according to claim 6, characterized in that: A sealing ring is installed at the connection between the thermal expansion rod (331) and the plate (311). The sealing ring is located at the end of the external communication hole (313) away from the semicircular groove (315). The end of the thermal expansion rod (331) located away from the semicircular groove (315) does not contact the inner wall of the thermal expansion rod mounting groove (314).

8. The miniaturized, high-density 5G communication module packaging structure according to claim 6, characterized in that: The movable plate (333) is disposed at the lower end of the micro gear ring (324), and the teeth (334) fixed at the upper end of the movable plate (333) mesh with the micro gear ring (324).

9. A packaging method for a miniaturized, high-density 5G communication module packaging structure, characterized in that: Includes the following steps: Step 1: Provide a base (1), and precisely open an embedding slot (4) for accommodating the core device at the middle position of the upper end of the base (1) according to the packaging specifications. Step 2: Align and fix the main chip module (5) that has completed the functional test inside the embedded slot (4) in the middle of the base (1), ensuring that the bottom of the chip fits tightly with the bottom of the slot; Step 3: Install the four auxiliary heat dissipation units (3) into the preset mounting positions on the lower side of the packaging shell (2) respectively, so that one end of the auxiliary heat dissipation unit (3) extends into the inside of the packaging shell (2) and the other end is exposed on the outside of the packaging shell (2), thus completing the integrated pre-installation of the packaging shell (2) and the heat dissipation components. Step 4: Cover the upper end of the base (1) with the pre-installed auxiliary heat dissipation unit (3) of the package shell (2), so that the lower edge of the package shell (2) is embedded in the inner side of the embedding groove (4) and fixedly and sealed with the base (1) to form a closed inner cavity to protect the main chip module (5). Step 5: Complete the locking and fixing of the base (1) and the package shell (2), so that the upper surface of the main chip module (5) in the inner cavity and the end of the auxiliary heat dissipation unit (3) located inside the package shell (2) form a thermally conductive contact. At the same time, confirm that the heat dissipation terminal of the auxiliary heat dissipation unit (3) exposed on the outside is working properly, and finally form a package module structure that integrates sealing protection and efficient heat dissipation, and conduct testing.

10. The packaging method for a miniaturized, high-density 5G communication module packaging structure according to claim 9, characterized in that: The testing process is as follows: Step 6: Apply the rated working load to the packaged module to generate heat in the main chip module (5). The heat is transferred to the heat-conducting shell (31) through the heat-conducting fins. At this time, monitor whether the thermal expansion rod (331) efficiently absorbs the heat in the cavity through the heat absorption hole (332) on its outer wall and generates directional expansion displacement along the direction of the thermal expansion rod mounting groove (314). Step 7: Observe whether the teeth (334) fixed on the upper end of the moving plate (333) and the micro gear ring (324) are precisely engaged when the moving end of the thermal expansion rod (331) pushes the moving plate (333) to move, and whether the micro gear ring (324) is driven to rotate. Verify whether the micro gear ring (324) can drive the aluminum heat dissipation shaft (321) to rotate smoothly in the semi-circular groove (315) through the positioning shaft (323) to ensure that there is no jamming or interference. Step 8: During the rotation of the aluminum heat sink shaft (321), check whether the multiple heat-conducting and heat-dissipating ring grooves (322) opened on its outer side form a continuous and tight sliding scraping fit with the heat-conducting block (316) fixed inside the semi-circular groove (315). Monitor the surface temperature rise of the aluminum heat sink shaft (321) exposed on the outside of the package shell (2) by infrared thermal imaging to confirm whether the internal heat can be effectively conducted to the external environment through the dynamic rotating contact structure. Step 9: After power is cut off or the load is reduced to allow the module to cool down, check whether the reset spring (335) can drive the moving plate (333) and the thermal expansion rod (331) to return to the initial position accurately. At the same time, check whether the sealing ring installed at the end of the external communication hole (313) away from the semi-circular groove (315) maintains airtightness during the reciprocating movement of the thermal expansion rod (331) to prevent condensation or contamination inside the encapsulation shell (2) due to gas exchange. Step 10: Place the module in a high and low temperature alternating test chamber and repeat the above thermal drive and reset cycle. Finally, test the operating parameters of the main chip module (5) to ensure that the internal temperature of the package shell (2) is always maintained within the rated working threshold under the repeated mechanical action of the auxiliary heat dissipation unit (3), and that all moving components have no obvious wear. The long-term reliability of the packaging process is then determined to be up to standard.

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